Screen body structure for improving Bonding precision

Abstract

The invention relates to the technical field of LCD / OLED / micro display, in particular to a screen body structure capable of improving Bonding precision, which comprises a circuit unit and a panel Panel, a bump pad is arranged on the side, opposite to the panel Panel, of the circuit unit, a panel pad is arranged on the side, opposite to the circuit unit, of the panel Panel, automatic correction force is formed between the panel pad and the bump pad, and the circuit unit is connected with the panel Panel. The circuit unit is used for transmitting a display signal to each pixel point of the panel Panel through the bump pad and the panel pad in sequence; according to the technical scheme provided by the invention, the defect that the Bonding precision is difficult to effectively improve in the prior art can be effectively overcome.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LCD / OLED / micro display technology, and particularly relates to a screen structure for improving Bonding precision. BACKGROUND

[0002] At present, the Bonding process is included in the LCD / OLED / micro display technology module process in the industry. The Bonding process is a core manufacturing technology in the fields of semiconductor, display panel and microelectronic packaging, which refers to the process of tightly connecting materials such as integrated circuits IC / flexible circuit boards FPC and screen bodies through mechanical pressure, temperature, ultrasonic energy or chemical action to form a conductive path, realize structure fixation or function integration. The Bonding process precision will determine the performance of semiconductor, display panel and other products, and is the core prerequisite for product reliability and yield, which directly affects the whole chain quality from chip function to terminal device experience.

[0003] In actual production process, as the resolution requirement of LCD / OLED / micro display technology is higher and higher, the highest resolution of mobile phone screen is 4K, and the resolution is as high as 3840*2160 pixels, and the Bonding design of the screen body is narrower and narrower, and the Bonding design width has reached total pitch 27μm (13μm pad+14μm gap). Therefore, the Bonding precision requirement of LCD / OLED / micro display technology is higher and higher, and it is more and more important to effectively improve the Bonding precision. SUMMARY

[0004] (I) Technical problems to be solved

[0005] In view of the above-mentioned defects existing in the prior art, the present application provides a screen structure for improving Bonding precision, which can effectively overcome the defect that the Bonding precision cannot be effectively improved in the prior art.

[0006] (II) Technical scheme

[0007] In order to achieve the above-mentioned purposes, the present application is realized by the following technical scheme:

[0008] A screen structure for improving Bonding precision, comprising a circuit unit and a panel, the opposite side of the circuit unit and the panel is provided with a bump pad, the opposite side of the panel and the circuit unit is provided with a panel pad which forms an automatic correction force with the bump pad, the circuit unit transmits display signals to each pixel point of the panel in turn through the bump pad and the panel pad.

[0009] Preferably, the bump pad is a contact point for electrical connection between the circuit unit and the panel, and the panel pad cooperates with the bump pad to transmit display signals to each pixel point of the panel.

[0010] Preferably, the bump pad and the panel pad are designed in a concave-convex matching manner, the front end of the bump pad is provided with a convex part, the side surface of the bump pad is provided with a chamfer for eliminating concentrated stress at the edge, and the panel pad is provided with a receiving groove matched with the convex part, so as to inhibit relative sliding between the circuit unit and the panel and correct the relative position between the circuit unit and the panel.

[0011] Preferably, anisotropic conductive adhesive ACF is arranged between the bump pad and the panel pad, and the bump pad and the panel pad are hot-pressed and bound together by a pressure head, so that a good conductive path is formed under the action of the anisotropic conductive adhesive ACF.

[0012] Preferably, the pressure head hot-presses and binds the bump pad and the panel pad through a pressure head base backup, and the pressure head base backup is used to provide support during hot-pressing and binding, so as to prevent the panel from being deformed or damaged under the action of pressure.

[0013] Preferably, the circuit unit is a control core of the panel, used for processing and transmitting display signals, controlling arrangement of liquid crystal molecules and display content, and realizing image display function.

[0014] Preferably, the circuit unit includes an integrated circuit IC or a flexible circuit board FPC.

[0015] (Three) beneficial effects

[0016] Compared with the prior art, the screen body structure for improving Bonding precision provided by the present application optimizes the design of the Bonding pad, expands the adjustable space of deviation by combining with the principle of mechanics, improves the design, effectively improves the precision of the Bonding process, improves the precision stability, improves the product yield, reduces the production cost, and improves the Bonding precision, which is conducive to improving the resolution of the screen body and greatly improving the market competitiveness of the product. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only need to be some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0018] Figure 1 The structural schematic diagram of the present application;

[0019] Figure 2 The schematic diagram of the present application in which the pressure head is used to heat and press the bump pad and the panel pad;

[0020] Figure 3 The schematic diagram of the combination of the existing circuit unit and the panel. DETAILED DESCRIPTION

[0021] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only need to be some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0022] The specific structure of the screen body structure provided by the present application for improving the Bonding precision (as shown in Figure 1 The specific structure includes:

[0023] The circuit unit and the panel, the opposite side of the circuit unit and the panel is provided with the bump pad, the opposite side of the panel and the circuit unit is provided with the panel pad which forms the automatic correction force with the bump pad, the circuit unit transmits the display signal to each pixel point of the panel through the bump pad and the panel pad in turn.

[0024] The circuit unit is the control core of the panel, which is used for processing and transmitting the display signal, controlling the arrangement of liquid crystal molecules and the display content, and realizing the image display function.

[0025] The circuit unit includes the integrated circuit IC or the flexible circuit board FPC.

[0026] Bump pad is the contact point for electrical connection between the circuit unit and the panel. The panel pad cooperates with the bump pad to transmit display signals to each pixel point of the panel.

[0027] As shown in Figure 1 , the bump pad and the panel pad adopt a concave-convex matching design. The front end of the bump pad is provided with a protruding part, and the side surface of the bump pad is provided with a chamfer for eliminating the concentrated stress at the edge. The panel pad is provided with a receiving groove matched with the protruding part to inhibit the relative sliding between the circuit unit and the panel and correct the relative position between the circuit unit and the panel.

[0028] Anisotropic conductive adhesive ACF is arranged between the bump pad and the panel pad. Figure 1 The bump pad and the panel pad are hot-pressed and bound together by the pressure applied by the pressure head. As shown in Figure 2 , the hot-pressing and binding are realized under certain pressure, temperature and time conditions. A good conductive path is formed under the action of the anisotropic conductive adhesive ACF.

[0029] As shown in Figure 2 , the pressure head hot-presses and binds the bump pad and the panel pad through the pressure head base backup. The pressure head base backup is used to provide support during the hot-pressing and binding process to prevent the panel from being deformed or damaged under the action of pressure.

[0030] Figure 3 The figure shows the combination of the existing circuit unit and the panel. The bump pad and the panel pad adopt a flat design. During the pressing process of the pressure head, relative sliding occurs in the X direction, which leads to the decrease of the bonding precision.

[0031] Figure 2It is a schematic view of the heat pressure binding of the bump pad and the panel pad by the pressure head in the present application, wherein the bump pad and the panel pad are designed by the concave-convex cooperation, and the bump pad and the panel pad are automatically corrected to the center position of the panel pad by the pressure between the contact side surfaces when the pressure head is pressed down, the relative sliding between the circuit unit and the panel is inhibited during the pressing process of the pressure head, the relative position between the circuit unit and the panel is corrected, and thus the Bonding precision and the product yield are effectively improved.

[0032] In the technical scheme of the present application, the Bonding pad design is optimized, the offset adjustable space is expanded according to the mechanical principle, the design is improved, the precision of the Bonding process is effectively improved, the precision stability is improved, the product yield is improved, the production cost is reduced, the Bonding precision is improved, the screen resolution is improved, and the market competitiveness of the product is greatly improved.

[0033] The above examples are only used to illustrate the technical solutions of the present application, but not limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by the equivalent ones; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A screen structure for improving bonding accuracy, characterized in that: The device includes a circuit unit and a panel. The circuit unit and the panel are provided with bump pads on the opposite side of the panel. The panel is provided with a panel pad that forms an automatic correction force with the bump pad on the opposite side of the circuit unit. The circuit unit transmits display signals to each pixel of the panel through the bump pad and the panel pad in sequence.

2. The screen structure for improving bonding accuracy according to claim 1, characterized in that: The bump pad is the contact point for electrical connection between the circuit unit and the panel. The panel pad and the bump pad work together to transmit display signals to each pixel of the panel.

3. The screen structure for improving bonding accuracy according to claim 2, characterized in that: The bump pad and the panel pad adopt a concave-convex fit design. The front end of the bump pad is provided with a protrusion, and the side of the bump pad is provided with a chamfer to eliminate stress concentration at the edge. The panel pad is provided with a receiving groove that mates with the protrusion to suppress relative sliding between the circuit unit and the panel and to correct the relative position between the circuit unit and the panel.

4. The screen structure for improving bonding accuracy according to claim 3, characterized in that: An anisotropic conductive adhesive (ACF) is provided between the bump pad and the panel pad. The bump pad and the panel pad are thermally bonded together by applying pressure with a pressure head, forming a good conductive path under the action of the anisotropic conductive adhesive (ACF).

5. The screen structure for improving bonding accuracy according to claim 4, characterized in that: The pressure head uses a pressure head base to thermally bond the bump pad to the panel pad. The pressure head base base provides support during the thermal bonding process to prevent the panel from deforming or being damaged under pressure.

6. The screen structure for improving bonding accuracy according to claim 1, characterized in that: The circuit unit is the control core of the panel, used to process and transmit display signals, control the arrangement of liquid crystal molecules and display content, and realize the image display function. The circuit unit includes integrated circuits (ICs) or flexible printed circuit boards (FPCs).

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