Chip mounting equipment and method for production and processing of computer mainboard

Abstract

The invention relates to the technical field of mainboard surface mounting equipment, and particularly discloses surface mounting equipment and method for computer mainboard production and processing.The surface mounting equipment comprises an auxiliary mechanism arranged at the bottom of a steel mesh and located on the inner side of a conveying part, the auxiliary mechanism comprises a shell, and an abutting assembly is arranged at the upper end of the interior of the shell and comprises a water bag; the two ends of the water bag are connected end to end and are designed in a sealed mode, the water bag can be tightly attached to the bottom of the main board, and therefore the main board is heated or cooled, liquid can conveniently flow in the water bag in a circulating mode through the abutting assembly, the main board can be conveniently heated and cooled from the bottom of the main board, the residual amount of soldering tin on the surface of the steel mesh is reduced, and the service life of the main board is prolonged. The influence on the subsequent mounting effect due to reduction of the soldering tin amount is avoided, the mobility of the soldering tin is reduced, the soldering tin amount at the center of the welding spot is reduced due to soldering tin streaming at the adjacent welding spots, the influence on the stability of the subsequent mounting is avoided, and the actual mounting use is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mainboard patching equipment, in particular to a patching equipment and method for computer mainboard production and processing. BACKGROUND

[0002] Computer mainboard patching belongs to the part of integrated circuit manufacturing, and specifically belongs to the application category of surface mount technology (SMT). SMT is to directly mount pinless or short lead components (such as resistors, capacitors, chips, etc.) on the surface of the circuit board, and to complete welding through reflow soldering or immersion soldering. This process belongs to the assembly link of integrated circuit manufacturing, and the chips and components (such as CPU, memory, etc.) on the computer mainboard are usually mounted by SMT technology. This process can achieve high-precision assembly while reducing parasitic parameters and production costs, meeting the assembly needs of integrated circuit manufacturing.

[0003] Publication No. CN120239186A discloses a patching equipment for computer mainboard production, which proposes the problem in the background art that the area to be mounted on the mainboard is easily contaminated by debris during processing, and the bottom of the heat sink is usually coated by dispensing process. When the heat sink is installed on the mainboard, the adhesive distribution is uneven during subsequent adhesion, affecting the stability of the heat sink on the mainboard.

[0004] In summary, the existing technology has the following problems:

[0005] When the computer mainboard is patched, the solder is extruded to the surface of the mainboard by a steel mesh, and the mesh position of the steel mesh is the part where the electronic components are mounted on the mainboard, so that the electronic components can be fixed on the mainboard by soldering in the subsequent process. However, due to the dense distribution of electronic components on the surface of the mainboard, the adjacent solder is prone to adhesion when the solder is coated by the steel mesh, resulting in relatively less solder at the center of the soldering point. Moreover, part of the solder is easily attached to the surface of the steel mesh during the process of the mainboard moving away from the steel mesh, thereby affecting the stability of the subsequent patching. There are certain deficiencies. To solve the above problems, a patching equipment and method for computer mainboard production and processing are proposed. SUMMARY

[0006] To achieve the above purpose, the present application realizes the following technical scheme: a patching equipment for computer mainboard production and processing, comprising a steel mesh, a solder scraping part arranged on the top of the steel mesh, and a conveying part arranged on the bottom of the steel mesh for conveying the mainboard, further comprising an auxiliary mechanism arranged on the bottom of the steel mesh and inside the conveying part, the auxiliary mechanism comprising:

[0007] a housing movably arranged on the bottom of the steel mesh, the top and bottom of the housing are designed in an open manner, and the inner upper end of the housing is provided with an abutting assembly, the abutting assembly comprising:

[0008] The water bag is connected head to tail at two ends and is in a sealed design, and the water bag can be tightly attached to the bottom of the mainboard to heat or cool the mainboard, and the outer side of the shell is provided with an adjusting assembly for adjusting the contact surface of the water bag and the mainboard, and the adjusting assembly comprises:

[0009] The hinge frame is movably arranged on the outer side of the shell, and the inner side of the hinge frame is hingedly connected with the first plate body and the second plate body symmetrically arranged with the center point of the hinge frame, and the top of the first plate body and the second plate body is respectively rotatably provided with the first rod body and the second rod body;

[0010] The third rod body is fixedly arranged on the side of the hinge frame close to each other, the third rod body, the second rod body and the first rod body are arranged in an inverted triangular shape, and are all located on the inner side of the water bag, so as to limit the top of the water bag to be horizontal, thereby being attached to the bottom of the mainboard.

[0011] Further, the abutting assembly further comprises:

[0012] The partition plate is fixedly arranged on the inner side wall of the water bag and is symmetrically arranged with the center point of the water bag, so as to separate the inside of the water bag into the first cavity and the second cavity which are relatively sealed, the outer side of the shell is provided with a conveying assembly to make the water circulate in the first cavity and the conveying assembly, the inside of the second cavity is provided with an inner support assembly for supporting the inside of the water bag, and the inner side bottom of the water bag is fixedly connected with the third rod body.

[0013] Further, the adjusting assembly further comprises:

[0014] The first through slot is arranged on the front and back of the shell, and the first rod body and the second rod body are both sleeved in the first through slot;

[0015] The second through slot is arranged on the front and back of the shell and is arranged perpendicularly to the first through slot, and the third rod body is sleeved in the second through slot.

[0016] Further, the adjusting assembly further comprises:

[0017] The connecting piece is slidably arranged on the inner side wall of the shell, two ends of the connecting piece are fixedly connected with the hinge frames on the front and back of the shell respectively, and the other two ends of the connecting piece are provided with a first transmission mechanism;

[0018] The first servo motor is fixedly arranged on the outer wall of the shell to drive the connecting piece to rise and fall through the first transmission mechanism, so as to drive the third rod body to rise and fall to adjust the contact area of the top of the water bag and the mainboard.

[0019] Further, the conveying assembly comprises:

[0020] The pump body is fixedly arranged outside the shell, a first pipe body extending into the first cavity is fixedly arranged at the water inlet end of the pump body, a second pipe body and a third pipe body are fixedly arranged at the side wall of the first pipe body and communicate with the first pipe body;

[0021] The fourth pipe body is fixedly arranged at the water outlet end of the pump body and extends into the first cavity, the fourth pipe body and the third pipe body are respectively arranged at two sides of the water bag, a fifth pipe body and a sixth pipe body are fixedly arranged at the side wall of the fourth pipe body, the fifth pipe body, the sixth pipe body, the third pipe body, the second pipe body, the side wall of the one end of the first pipe body close to the second pipe body and the side wall of the one end of the fourth pipe body close to the fifth pipe body are all provided with valve bodies, and a heater and a refrigerator are arranged at the outer wall of the fourth pipe body to heat or cool the liquid.

[0022] Further, the inner support assembly comprises:

[0023] The support bars are fixedly arranged at the inner side wall of the first cavity, the first support bars are slidably arranged at the sides close to each other, and the first support bars are located close to the first rod body and the second rod body, the side walls of the first support bars are all fixedly sleeved with air bags, and the outer walls of the air bags are designed in a concave-convex manner.

[0024] The elastic ropes are fixedly arranged at the sides of the first support bars close to each other, so that the two first support bars have a tendency to move close to each other.

[0025] Further, the inner support assembly further comprises:

[0026] The second support bars are rotatably arranged at the side walls of the hinge frame and extend into the second cavity, the side walls of the second support bars are both provided with reverse assemblies at both ends, and the sides of the support bars away from each other are respectively fixedly provided with the first rope body and the second rope body, so that the two first support bars move close to or away from each other through the reverse assemblies;

[0027] The second servo motor is fixedly arranged at the side wall of the hinge frame and fixedly connected with the end of the second support bar through a shaft coupling.

[0028] Further, the reverse assembly comprises:

[0029] The first sleeve is fixedly sleeved at the side wall of the second support bar;

[0030] The second sleeve is rotatably arranged at the side wall of the second support bar, the second sleeve and the first sleeve are both located in the second cavity, the inner walls of the ends of the second sleeve and the first sleeve close to each other are respectively fixedly sleeved with the second gear ring and the first gear ring, the first gear and the second gear are rotatably arranged at the sides of the baffle close to each other, the first gear and the second gear are respectively engaged with the inner walls of the first gear ring and the second gear ring, and the first gear and the second gear are engaged, so that the first sleeve and the second sleeve rotate in opposite directions when the second support bar rotates, and the outer walls of the first sleeve and the second sleeve are respectively fixedly connected with the first rope body and the second rope body.

[0031] Further, the bottom of the shell is fixedly provided with a base, the top of the base is provided with a lifting assembly for adjusting the height of the shell, and the lifting assembly comprises:

[0032] A lifting seat is fixedly arranged at the top of the base and located at the two sides of the shell, and the side close to each other of the lifting seat is in sliding connection with the shell;

[0033] A third servo motor is fixedly arranged at the top of the base, and the output shaft of the third servo motor is provided with a second transmission mechanism, so that the third servo motor drives the shell to lift through the second transmission mechanism;

[0034] A limiting plate is fixedly arranged at the top of the base and located at the corner of the shell, and the limiting plate is designed in an L shape.

[0035] The application also provides a use method of the patching equipment for computer mainboard production and processing, adopts the patching equipment for computer mainboard production and processing, and comprises the following steps:

[0036] S1: conveying the mainboard needing patching to the bottom of the steel mesh through the conveying part, so as to arrange the solder tin on the top of the steel mesh along the mesh hole of the steel mesh to the top of the mainboard through the tin scraping part;

[0037] S2: after the solder tin is scraped to the top of the mainboard, the mainboard is cooled and heated in sequence through the auxiliary mechanism, so that the solder tin is stably attached to the top of the mainboard, and the subsequent patching is not affected.

[0038] The application provides a patching equipment and method for computer mainboard production and processing.

[0039] 1: the abutting assembly of the application facilitates the circulation of liquid in the water bag, thereby facilitating the heating and cooling of the mainboard from the bottom of the mainboard, reducing the residual amount of solder tin on the surface of the steel mesh, avoiding the influence of the subsequent patching effect due to the reduction of the amount of solder tin, and reducing the fluidity of the solder tin, reducing the solder tin flow at the adjacent solder points, thereby reducing the amount of solder tin at the center of the solder points, avoiding the influence of the stability of the subsequent patching, and facilitating the actual patching use.

[0040] 2: the water bag is arranged to facilitate the adhesion with the bottom of the mainboard, thereby facilitating the cooling and heating of the mainboard, avoiding the uneven cooling and heating due to the non-contact with the solder tin position, thereby avoiding the influence of the stability of the solder tin adhesion.

[0041] 3、The present application avoids the water bag from being blocked at the first rod body and the second rod body due to bending, ensures the stability of liquid flow, thereby ensuring the stability of heating and cooling of the mainboard, and avoids the water bag from being lifted due to the unsmooth flow between the first rod body and the second rod body, so that the top center of the water bag is bulged, thereby avoiding affecting the adhesion effect of the water bag and the mainboard, and avoiding affecting the actual use.

[0042] 4、The present application adjusts the distance between the first rod body and the second rod body through the adjusting assembly, thereby adjusting the surface area of the water bag between the first rod body and the second rod body, so as to be suitable for different sizes of mainboard, improve the application range, and through the inner support assembly, the position of the water bag is adjusted according to the adjustment amount of the adjusting assembly, which is convenient for actual use.

[0043] 5、The present application arranges the first rod body, the second rod body and the third rod body, so as to facilitate the contact of the top of the water bag with the mainboard, and facilitate the adjustment of the contact area of the top of the water bag with the mainboard by adjusting the positions of the first rod body, the second rod body and the third rod body, which is convenient for actual use.

[0044] 6、The present application winds the first rope body and the second rope body through the reverse assembly, avoids the traditional fixing of the first rope body and the second rope body on the two sides of the same sleeve, and avoids the condition that the winding lengths of the two sides of the rope body are not the same, thereby facilitating the improvement of the accuracy of the position adjustment of the air bag, and facilitating the actual use BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 It is the overall structure schematic diagram of the present application;

[0046] Figure 2 It is the structure schematic diagram of the conveying part, the tin scraping part, the steel mesh and the auxiliary mechanism of the present application;

[0047] Figure 3 It is the front structure schematic diagram of the auxiliary mechanism of the present application;

[0048] Figure 4 It is the back structure schematic diagram of the auxiliary mechanism of the present application;

[0049] Figure 5 It is the left structure schematic diagram of the longitudinal section of the shell of the present application;

[0050] Figure 6 It is the right structure schematic diagram of the longitudinal section of the shell of the present application;

[0051] Figure 7 It is the structure schematic diagram of the abutting assembly and the adjusting assembly of the present application;

[0052] Figure 8 It is the structure schematic diagram of the adjusting assembly of the present application;

[0053] Figure 9 It is a first servo motor and first transmission mechanism structure schematic view of the application;

[0054] Figure 10 It is a hinge frame, first transmission mechanism and connecting piece structure schematic view of the application;

[0055] Figure 11 It is a abutment assembly and inner support assembly structure schematic view of the application;

[0056] Figure 12 It is a water bag longitudinal section structure schematic view of the application;

[0057] Figure 13 It is a elastic rope, air bag and first support rod structure schematic view of the application;

[0058] Figure 14 It is a support strip longitudinal section structure schematic view of the application;

[0059] Figure 15 It is a second support rod structure schematic view of the application;

[0060] Figure 16 It is a first sleeve, second sleeve, first gear ring and second gear ring transverse section structure schematic view of the application; Figure 15

[0061] Figure 17 It is a conveying assembly left side structure schematic view of the application;

[0062] Figure 18 It is a conveying assembly right side structure schematic view of the application.

[0063] Figure 19 It is a conveying assembly right side structure schematic view of the application.

[0064] The above-mentioned figure mark involved in the drawing: 1, conveying part; 2, tin scraping part; 3, steel mesh; 4, auxiliary mechanism;

[0065] 41, shell; 42, conveying assembly; 43, adjusting assembly; 44, abutment assembly; 45, inner support assembly; 46, lifting assembly;

[0066] 421, second pipe body; 422, third pipe body; 423, sixth pipe body; 424, fifth pipe body; 425, pump body; 426, heater; 427, fourth pipe body; 428, first pipe body; 429, refrigerator;

[0067] ​431, hinged frame; 432, first transmission mechanism; 433, second plate body; 434, second rod body; 435, first plate body; 436, connecting piece; 437, first rod body; 438, first through slot; 439, second through slot; 4391, first servo motor; 4392, third rod body;

[0068] 441, water bag; 442, partition; 443, first cavity; 444, second cavity;

[0069] 451, second servo motor; 452, second support rod; 453, reverse assembly; 454, first rope body; 455, second rope body; 456, support strip; 457, elastic rope; 458, first support rod; 459, air bag;

[0070] 4531, second sleeve; 4532, first ring gear; 4533, first sleeve; 4534, second ring gear; 4535, first gear; 4536, second gear;

[0071] 461, limiting plate; 462, lifting seat; 463, second transmission mechanism; 464, third servo motor. DETAILED DESCRIPTION

[0072] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0073] Embodiment one: please refer to Figure 1 and Figure 2 A patching device for computer mainboard production and processing, comprising a steel mesh 3, a tin scraping part 2 arranged on the top of the steel mesh 3, and a conveying part 1 arranged at the bottom of the steel mesh 3 and used for conveying the mainboard, the conveying part 1 is used to drive the computer mainboard which needs to be patched to move, so that the computer mainboard moves to the bottom of the steel mesh 3 and is attached to the designated mesh hole of the steel mesh 3, so as to scrape the tin on the top of the steel mesh 3 to the top of the computer mainboard by the tin scraping part 2, then the computer mainboard is driven by the conveying part 1 to move downward and to the next station, which is prior art and will not be described here. The auxiliary mechanism 4 is arranged at the bottom of the steel mesh 3 and inside the conveying part 1.

[0074] Please refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 11 The auxiliary mechanism 4 comprises:

[0075] The shell 41 is movably arranged at the bottom of the steel mesh 3, the top and bottom of the shell 41 are designed as open, the upper end of the inside of the shell 41 is provided with an abutting assembly 44, the abutting assembly 44 comprises:

[0076] The water bag 441 is connected head to tail at both ends and designed as sealed, the water bag 441 can be tightly attached to the bottom of the main plate to heat or cool the main plate, the outside of the shell 41 is provided with an adjusting assembly 43 for adjusting the contact surface of the water bag 441 and the main plate, the adjusting assembly 43 comprises:

[0077] The hinged frame 431 is movably arranged at the outside of the shell 41, the inside of the hinged frame 431 is hingedly connected with the first plate body 435 and the second plate body 433 which are symmetrically arranged at the center point of the hinged frame 431, the top of the first plate body 435 and the second plate body 433 is respectively rotationally provided with the first rod body 437 and the second rod body 434;

[0078] The third rod body 4392 is fixedly arranged at the side of the hinged frame 431 which is close to each other, the third rod body 4392, the second rod body 434 and the first rod body 437 are arranged in an inverted triangular shape and are all located at the inside of the water bag 441 to limit the top of the water bag 441 to be horizontal to be attached to the bottom of the main plate.

[0079] The abutting assembly 44 further comprises:

[0080] The partition plate 442 is fixedly arranged at the inner side wall of the water bag 441 and is symmetrically arranged at the center point of the water bag 441 to separate the inside of the water bag 441 into the first cavity 443 and the second cavity 444 which are relatively sealed, the outside of the shell 41 is provided with a conveying assembly 42 to make the water circulate in the first cavity 443 and the conveying assembly 42, the inside of the second cavity 444 is provided with an inner support assembly 45 which supports the water bag 441 from the inside, and the inside bottom of the water bag 441 is fixedly connected with the third rod body 4392.

[0081] In specific implementation, by separating the inner part of the abutting assembly 44 into two closed first cavity 443 and second cavity 444, cooperating with the conveying assembly 42, the liquid can flow in the water bag 441, facilitating the heating and cooling of the mainboard from the bottom of the mainboard. After the solder is scraped to the top of the mainboard, the liquid with lower temperature is conveyed into the water bag 441 by the conveying assembly 42, and the mainboard is cooled by the contact between the water bag 441 and the mainboard, so that the solder is stably attached to the top of the mainboard. When the mainboard is away from the steel mesh 3, the amount of solder residue on the surface of the steel mesh 3 is reduced, the effect of subsequent patching is avoided, the fluidity of the solder is reduced, the solder stringing at adjacent solder joints is reduced, the amount of solder at the center of the solder joint is reduced, the stability of subsequent patching is avoided, and the actual patching is facilitated.

[0082] By providing the water bag 441, the bottom of the mainboard is fitted, the mainboard is cooled and heated, the cooling and heating are not uniform due to the non-contact with the solder position, and the stability of the solder attachment is avoided.

[0083] By supporting the water bag 441 from the inside of the water bag 441 from the position close to the first rod body 437 and the second rod body 434 by the inner support assembly 45, the water flow is prevented from being blocked due to bending at the first rod body 437 and the second rod body 434, the stability of the liquid flow is ensured, the stability of the heating and cooling of the mainboard is ensured, and the fluid is prevented from being blocked between the first rod body 437 and the second rod body 434 to support the water bag 441, so that the top center of the water bag 441 is bulged, the fitting effect of the water bag 441 with the mainboard is avoided, and the actual use is avoided.

[0084] By adjusting the distance between the first rod body 437 and the second rod body 434 by the adjusting assembly 43, the surface area of the water bag 441 between the first rod body 437 and the second rod body 434 is adjusted, so as to be suitable for different sizes of mainboard, improve the application range, and adjust the position of the water bag 441 by the inner support assembly 45 according to the adjustment amount of the adjusting assembly 43, so as to be convenient for actual use.

[0085] Please refer to Figure 18 and Figure 19 , the conveying assembly 42 comprises:

[0086] The pump body 425 is fixedly arranged on the outside of the shell 41, the water inlet end of the pump body 425 is fixedly provided with a first pipe body 428 extending into the first cavity 443, the side wall of the first pipe body 428 is fixedly provided with a second pipe body 421 and a third pipe body 422, and the first pipe body 428 is in communication with the second pipe body 421 and the third pipe body 422;

[0087] The fourth pipe body 427 is fixedly arranged at the water outlet end of the pump body 425 and extends into the first cavity 443. The fourth pipe body 427 is arranged at two sides of the water bag 441 respectively. The side wall of the fourth pipe body 427 is fixedly arranged with a fifth pipe body 424 and a sixth pipe body 423. The fifth pipe body 424, the sixth pipe body 423, the third pipe body 422, the second pipe body 421, the side wall of the one end of the first pipe body 428 close to the second pipe body 421 and the side wall of the one end of the fourth pipe body 427 close to the fifth pipe body 424 are all arranged with valve bodies. The outer wall of the fourth pipe body 427 is arranged with a heater 426 and a refrigerator 429 to heat or cool the liquid.

[0088] In the specific implementation, the valve bodies on the outer walls of the second pipe body 421, the first pipe body 428 and the fourth pipe body 427 are opened. The second pipe body 421 is externally connected with the refrigerant pipeline. The pump body 425 is started. The water inlet end of the pump body 425 makes the refrigerant enter the pump body 425 through the second pipeline and the first pipe body 428 and enter the first cavity 443 through the pump body 425 and the fourth pipeline, so as to flow in the water bag 441 along the first cavity 443, thereby cooling the mainboard after being attached to the mainboard. Then, the refrigerant enters the first pipeline along the other side of the water bag 441. When the specified amount of refrigerant is input into the water bag 441, the valve body on the outer wall of the second pipeline is closed, so that the refrigerant circulates in the first pipeline, the pump body 425, the fourth pipeline and the water bag 441, thereby cooling the mainboard. When the cooling is completed, the valve on the outer wall of the fifth pipeline is opened, and the valve body on the outer wall of the second pipeline is closed. Under the action of the pump body 425, the refrigerant is discharged into the fifth pipeline through the pump body 425, and then the refrigerant is discharged. Then, the valve body on the outer wall of the fifth pipeline is closed, and the valve bodies on the outer walls of the third pipeline and the fourth pipeline are opened. According to the above steps, the third pipeline is externally connected with the heat medium pipeline, so that the heat medium circulates and flows, thereby being heated.

[0089] The refrigerator 429 and the heater 426 facilitate refrigeration and heating by the refrigerant and the heat medium respectively in the circulation process, thereby improving the use effect.

[0090] The first pipe body 428 and the fourth pipe body 427 can be designed as hoses and have a length reserved for lifting with the water bag 441, so that the normal liquid conveying can be ensured when the contact area between the top of the water bag 441 and the mainboard is adjusted by the adjusting assembly 43.

[0091] Please refer to Figure 5 and Figure 6 , the bottom of the shell 41 is fixedly arranged with a base. The top of the base is provided with a lifting assembly 46 for adjusting the height of the shell 41. The lifting assembly 46 comprises:

[0092] The lifting seats 462 are fixedly arranged at the top of the base and located at two sides of the shell 41. The sides close to each other of the lifting seats 462 are slidably connected with the shell 41.

[0093] The third servo motor 464 is fixedly mounted on the top of the base. The output shaft of the third servo motor 464 is equipped with a second transmission mechanism 463 so that the third servo motor 464 drives the outer casing 41 to rise and fall through the second transmission mechanism 463.

[0094] The limiting plate 461 is fixedly mounted on the top of the base and located at the end corner of the outer shell 41. The limiting plate 461 has an L-shaped design.

[0095] In practical implementation, the height of the outer shell 41 can be easily adjusted by the lifting component 46, thereby adjusting the height of the water bag 441 to accommodate motherboards of different sizes and to move synchronously with the motherboard away from the steel mesh 3, thus facilitating actual heating and cooling without affecting the normal transport of the motherboard.

[0096] The second transmission mechanism 463 includes a first slide groove, a first slider, a threaded rod, and a first transmission gear. The first slide groove is located on one side of the lifting seat 462 that are close to each other. The first slider is placed inside the first slide groove. The first slider is fixedly connected to the outer shell 41. The threaded rod is rotatably connected to the lifting seat 462 and threadedly connected to the first slider. The first transmission gear is fixedly sleeved on the ends of the two threaded rods and is connected by chain transmission. One of the threaded rods is connected to the output shaft of the third servo motor 464 through a bevel gear to change the transmission direction, so that the third servo motor 464 is horizontally mounted on the top of the base and can drive one of the threaded rods to rotate. The threaded rod drives the other threaded rod to rotate synchronously through the chain and the first transmission gear, thereby driving the outer shell 41 to rise and fall along the first slide groove, thereby adjusting the height of the outer shell 41.

[0097] Example 2: Please refer to Figure 7 , Figure 8 , Figure 9 and Figure 10 The difference between this embodiment and Embodiment 1 is that the adjustment component 43 further includes:

[0098] The first through groove 438 is formed on the front and back of the outer casing 41, and the first rod 437 and the second rod 434 are both fitted into the first through groove 438.

[0099] The second through groove 439 is opened on the front and back of the outer casing 41 and is arranged perpendicularly to the first through groove 438. The third rod 4392 is sleeved in the second through groove 439.

[0100] The adjustment component 43 further includes:

[0101] The connecting piece 436 is slidably arranged on the inner side wall of the shell 41, two ends of the connecting piece 436 are fixedly connected with the hinge frame 431 arranged on the front and back of the shell 41 respectively, and the other two ends of the connecting piece 436 are provided with the first transmission mechanism 432;

[0102] The first servo motor 4391 is fixedly arranged on the outer wall of the shell 41, and drives the connecting piece 436 to ascend and descend through the first transmission mechanism 432, so as to drive the third rod body 4392 to ascend and descend, thereby adjusting the contact area between the top of the water bag 441 and the mainboard.

[0103] In the specific implementation, the first rod body 437, the second rod body 434 and the third rod body 4392 are arranged in an inverted triangular shape, so as to limit the water bag 441 in an inverted triangular shape, thereby facilitating the top of the water bag 441 to be attached to the bottom of the mainboard, and the first rod body 437 and the second rod body 434 are hingedly connected with the hinge frame 431 through the first plate body 435 and the second plate body 433, the first rod body 437 is fixedly connected with the hinge frame 431, and the bottom of the water bag 441 is fixedly connected with the third rod body 4392, so that when the hinge frame 431 moves upward, the bottom of the first plate body 435 and the second plate body 433 is pushed to move upward, thereby driving the top of the first plate body 435 and the second plate body 433 to move away from each other, so as to adjust the position of the water bag 441 under the limitation of the first through groove 438, thereby adjusting the contact area between the top of the water bag 441 and the mainboard, and the water bag 441 is suitable for mainboards of different sizes, the top of the water bag 441 is facilitated to be in contact with the mainboard through the arrangement of the first rod body 437, the second rod body 434 and the third rod body 4392, and the contact area between the top of the water bag 441 and the mainboard is facilitated to be adjusted by adjusting the positions of the first rod body 437, the second rod body 434 and the third rod body 4392, thereby facilitating the actual use.

[0104] The first transmission mechanism 432 comprises a second transmission gear, a third transmission gear, a fourth transmission gear, a first rotating shaft, a second rotating shaft and a gear slot, the gear slot is arranged on the other two ends of the connecting piece 436, the two first rotating shafts are rotatably arranged on the side walls of the shell 41, the second transmission gear is fixedly sleeved on the side wall of the one end of the first rotating shaft located in the shell 41, and the second transmission gear is engaged with the gear slot, the third transmission gear is fixedly sleeved on the other end of each of the two first rotating shafts located outside the shell 41, the second rotating shaft is rotatably arranged on the outer wall of the shell 41, the fourth transmission gears are fixedly sleeved on the side walls of the second rotating shaft, one of the fourth transmission gears is engaged with one of the third transmission gears, and the other fourth transmission gear is in transmission connection with the other third transmission gear through a chain, Figure 10The first servo motor 4391 is connected with the first shafts, and the second transmission gear is connected with the third shafts. When the first servo motor 4391 drives one of the first shafts to rotate, the other first shaft rotates in the opposite direction, thereby driving the connecting piece 436 to rise or fall through the second transmission gear and the gear slot, so as to adjust the height of the hinged frame 431 and the third shaft 4392, thereby adjusting the contact surface of the top of the water bag 441 and the main plate.

[0105] The first shafts, the second shafts and the third shafts are limited by the first through slot 438 and the second through slot 439, thereby improving the stability of the movement.

[0106] Embodiment three: please refer to Figure 11 、 Figure 12 、 Figure 13 and Figure 14 The difference between the technical scheme of the embodiment and the embodiment one is that the inner support assembly 45 comprises:

[0107] The support bars 456 are fixed on the inner side walls of the first cavities 443. The side of the support bars 456 close to each other is slidably provided with the first support rods 458, and the first support rods 458 are located close to the first shafts 437 and the second shafts 434. The side walls of the first support rods 458 are fixedly sleeved with the air bags 459, and the outer walls of the air bags 459 are designed in a concave-convex shape.

[0108] The elastic ropes 457 are fixed on the side of the first support rods 458 close to each other, so that the two first support rods 458 have a tendency to move close to each other.

[0109] The inner support assembly 45 further comprises:

[0110] The second support rods 452 are rotatably arranged on the side walls of the hinged frames 431 and extend into the second cavities 444. The side walls of the second support rods 452 are provided with the reverse assemblies 453 at both ends. The side of the support rods away from each other is fixedly provided with the first rope bodies 454 and the second rope bodies 455, so that the two first support rods 458 are moved close to or away from each other through the reverse assemblies 453.

[0111] The second servo motor 451 is fixedly connected with the end of the second support rod 452 through the shaft coupling.

[0112] In practical implementation, an airbag 459 with an uneven outer surface is placed near the first rod 437 and the second rod 434 of the water bag 441, and supports the water bag 441 from the inside. This prevents the water bag 441 from sticking together at the bend, which would affect the flow of liquid. It also prevents excessive water pressure inside the water bag 441 located between the first rod 437 and the second rod 434, which would cause the top and middle of the water bag 441 to bulge. This ensures the fit between the water bag 441 and the main board, avoids affecting the actual cooling and heating use, and does not affect the flow of water inside the water bag 441.

[0113] To accommodate motherboards of different sizes, when the limiting positions of the first rod 437 and the second rod 434 on the water bag 441 change, the second servo motor 451 is activated. The second servo motor 451 drives the second support rod 452 to rotate. The second support rod 452, through the reverse component 453, drives the first rope 454 and the second rope 455 to wind around each other, so that the first support rod 458 overcomes the elastic force of the elastic rope 457 and moves away from each other, thereby allowing the second support rod 452 to move within the support bar 456 to adjust the position of the airbag 459, thus facilitating the support of the water bag 441 in different positions.

[0114] The support bar 456 is made of a soft material, which makes it easy to limit the first support rod 458 while also limiting the first support rod 458.

[0115] The elastic rope 457 facilitates the traction of the two first support rods 458, causing them to tend to move closer to each other. This ensures that the first support rods 458 return to their original position when the second support rod 452 is unwound, making it convenient for practical use.

[0116] Please see Figure 15 , Figure 16 and Figure 17 The reverse component 453 includes:

[0117] The first sleeve 4533 is fixedly sleeved on the side wall of the second support rod 452;

[0118] The second sleeve 4531 is arranged on the side wall of the second supporting rod 452, the second sleeve 4531 and the first sleeve 4533 are located in the second cavity 444, the inner walls of the ends of the second sleeve 4531 and the first sleeve 4533 are fixedly sleeved with the second gear ring 4534 and the first gear ring 4532 respectively, the first gear 4535 and the second gear 4536 are arranged on the side of the partition plate 442, the inner walls of the first gear 4535 and the second gear 4536 are engaged with the first gear ring 4532 and the second gear ring 4534 respectively, and the first gear 4535 and the second gear 4536 are engaged, so that when the second supporting rod 452 rotates, the first sleeve 4533 and the second sleeve 4531 rotate in opposite directions, and the outer walls of the first sleeve 4533 and the second sleeve 4531 are fixedly connected with the first rope body 454 and the second rope body 455 respectively.

[0119] In specific implementation, when the second supporting rod 452 rotates, the first sleeve 4533 is driven to rotate, the first sleeve 4533 drives the first gear ring 4532 and the first gear 4535 to rotate, and since the first gear 4535 and the second gear 4536 are engaged, when the first gear 4535 synchronously drives the second gear 4536 to rotate, the rotating direction of the second gear 4536 is changed, so that when the second gear 4536 drives the second gear ring 4534 and the second sleeve 4531 to rotate, the second sleeve 4531 rotates in the opposite direction of the first sleeve 4533, thereby facilitating the winding of the first rope body 454 and the second rope body 455, avoiding the condition that the lengths of the rope bodies wound on the two sides of the traditional sleeve are different, thereby facilitating the improvement of the accuracy of the position adjustment of the air bag 459, and facilitating the actual use.

[0120] The application also provides a using method of the patching equipment for computer mainboard production and processing.

[0121] S1: conveying the mainboard to be patched to the bottom of the steel mesh 3 through the conveying part 1, so as to arrange the solder on the top of the steel mesh 3 along the mesh holes of the steel mesh 3 to the top of the mainboard through the tin scraping part 2;

[0122] S2: after the solder is scraped to the top of the main plate, the main plate is cooled and heated in sequence by the auxiliary mechanism 4, so that the solder is stably attached to the top of the main plate, and does not affect the subsequent patch use, in the specific operation, the liquid is conveyed into the first cavity 443 by the conveying assembly 42, so that the liquid circulates and flows in the first cavity 443 and the conveying assembly 42, thereby cooling the main plate after the top of the water bag 441 is attached to the bottom of the main plate, so that the solder is stably attached to the main plate after the solder flows to the top of the main plate, and the amount of residual solder on the steel mesh 3 is reduced after the main plate is away from the steel mesh 3, thereby improving the stability of the subsequent patch, after the main plate is away from the steel mesh 3, the shell 41 and the water bag 441 are away from the steel mesh 3, that is, the main plate can be heated, thereby restoring the state of the solder for subsequent patch use, after heating is completed, the shell 41 and the water bag 441 continue to move downward by the lifting assembly 46, thereby moving away from the main plate, so as to move the main plate to the next working station by the conveying part 1, thereby performing subsequent processing.

[0123] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

[0124] It should be noted that in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "includes", "contains" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0125] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip mounting device for computer motherboard manufacturing, comprising a stencil, a solder scraping section disposed at the top of the stencil, and a conveying section disposed at the bottom of the stencil for conveying the motherboard, characterized in that, It also includes an auxiliary mechanism located at the bottom of the steel mesh and inside the conveying section. The auxiliary mechanism includes: The outer casing is movably mounted at the bottom of the steel mesh. Both the top and bottom of the casing are open. An abutment component is located at the upper interior of the casing. The abutment component includes: The water bag, with its two ends connected end-to-end and sealed, allows it to adhere tightly to the bottom of the motherboard, thus heating or cooling the motherboard. An adjustment mechanism is located on the outer side of the casing to adjust the contact surface between the water bag and the motherboard. This adjustment mechanism includes: A hinge frame is movably disposed on the outside of the housing. The inner side of the hinge frame is hinged with a first plate and a second plate arranged symmetrically with respect to the center point of the hinge frame. The top of the first plate and the second plate are respectively rotatably provided with a first rod and a second rod. The third rod is fixed on one side of the hinge frame that are close to each other. The third rod, the second rod, and the first rod are arranged in an inverted triangle shape and are all located inside the water bag to limit the top of the water bag to a horizontal position so that it fits against the bottom of the main board.

2. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 1, characterized in that, The abutment component also includes: A partition is fixedly installed on the inner wall of the water bag and arranged symmetrically with respect to the center point of the water bag to divide the interior of the water bag into a relatively sealed first cavity and a second cavity. A conveying component is provided on the outer side of the outer shell to allow water to circulate within the first cavity and the conveying component. An inner support component is provided inside the second cavity to support the water bag from the inside. The bottom inner side of the water bag is fixedly connected to a third rod.

3. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 1, characterized in that, The adjustment component further includes: The first through groove is formed on the front and back of the outer casing, and the first rod and the second rod are both fitted into the first through groove; The second through slot is formed on the front and back of the outer casing and is arranged perpendicular to the first through slot. The third rod is sleeved in the second through slot.

4. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 2, characterized in that, The adjustment component further includes: The connector is slidably disposed on the inner side wall of the housing. Two ends of the connector are fixedly connected to the hinge frames located on the front and back of the housing, respectively. The other two ends of the connector are provided with a first transmission mechanism. The first servo motor is fixed to the outer wall of the housing, so as to drive the connecting piece to rise and fall through the first transmission mechanism, thereby driving the third rod to rise and fall, so as to adjust the contact area between the top of the water bag and the main board.

5. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 2, characterized in that, The conveying assembly includes: The pump body is fixedly installed on the outside of the outer shell. The water inlet end of the pump body is fixedly provided with a first pipe extending into the first cavity. The side wall of the first pipe is fixedly provided with a second pipe and a third pipe, which are connected to the first pipe. The fourth tube is fixedly installed at the drain end of the pump body and extends into the first cavity. The fourth tube and the third tube are located on both sides of the water bag. The side wall of the fourth tube is fixedly provided with the fifth tube and the sixth tube. The fifth tube, the sixth tube, the third tube, the second tube, the side wall of the first tube near the second tube, and the side wall of the fourth tube near the fifth tube are all provided with valve bodies. The outer wall of the fourth tube is provided with a heater and a cooler to heat or cool the liquid.

6. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 2, characterized in that, The internal support component includes: The support bar is fixedly installed on the inner wall of the first cavity. The first support rod is slidably provided on the side of the support bar that is close to each other. The first support rod is located close to the first rod body and the second rod body. The side wall of the first support rod is fixedly fitted with an air bladder, and the outer wall of the air bladder has a concave-convex design. An elastic rope is fixed to one side of the first support rods that are close to each other, so that the two first support rods tend to move closer to each other.

7. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 6, characterized in that, The internal support component also includes: The second support rod is rotatably mounted on the side wall of the hinge frame and extends into the second cavity. Both ends of the side wall of the second support rod are provided with a reversing component. The first rope and the second rope are respectively fixed on the side of the support rods that are far apart from each other, so that the two first support rods can be brought closer to each other or far apart from each other through the reversing component. The second servo motor is fixedly mounted on the side wall of the hinge frame and is fixedly connected to the end of the second support rod via a coupling.

8. The chip mounting equipment for computer motherboard manufacturing and processing according to claim 7, characterized in that, The reverse component includes: The first sleeve is fixedly sleeved on the side wall of the second support rod; The second sleeve is rotatably mounted on the side wall of the second support rod. Both the second sleeve and the first sleeve are located within the second cavity. The inner walls of the two sleeves, which are close to each other, are respectively fixedly fitted with a second gear ring and a first gear ring. The partition plates, which are close to each other, are rotatably equipped with a first gear and a second gear. The first gear and the second gear mesh with the inner walls of the first gear ring and the second gear ring, respectively. The meshing of the first gear and the second gear is such that when the second support rod rotates, the first sleeve and the second sleeve rotate in opposite directions. The outer walls of the first sleeve and the second sleeve are respectively fixedly connected to the first rope and the second rope.

9. A chip mounting device for computer motherboard manufacturing and processing according to claim 1, characterized in that, The bottom of the outer casing is fixedly provided with a base, and the top of the base is provided with a lifting assembly for adjusting the height of the outer casing. The lifting assembly includes: The lifting seats are fixedly mounted on the top of the base and located on both sides of the outer casing. The side of the lifting seats that is close to each other is slidably connected to the outer casing. The third servo motor is fixedly mounted on the top of the base. The output shaft of the third servo motor is equipped with a second transmission mechanism so that the third servo motor drives the outer casing to rise and fall through the second transmission mechanism. The limiting plate is fixedly installed on the top of the base and located at the end corner of the outer shell. The limiting plate has an L-shaped design.

10. A method of using a surface mount equipment for computer motherboard manufacturing, characterized in that, Using the chip mounting equipment for manufacturing computer motherboards according to any one of claims 1-9, the method includes the following steps: S1: The motherboard that needs to be surface-mounted is conveyed to the bottom of the stencil by the conveying unit, so that the solder on the top of the stencil is discharged to the top of the motherboard by the solder scraping unit along the mesh of the stencil; S2: After the solder is scraped to the top of the motherboard, the motherboard is cooled and heated by an auxiliary mechanism to ensure that the solder adheres stably to the top of the motherboard without affecting subsequent surface mount technology.

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