Heat conduction pad and preparation method and application thereof

Abstract

The invention discloses a heat-conducting pad and a preparation method and application thereof. The heat conduction pad comprises a plurality of heat conduction strips, each heat conduction strip comprises at least one carrier wire and a heat conduction structure crossed with the carrier wire, the extension direction of the heat conduction structure and the thickness direction of the heat conduction pad are crossed, and the crossing angle is smaller than 90 degrees; the distance between at least part of the heat conduction structure and the surface of the heat conduction pad is-30 [mu] m to + 100 [mu] m. The carrier wires and the heat conduction structures are arranged in a crossed mode to form the heat conduction strips, then the heat conduction strips form the heat conduction pad, the complex process of the heat conduction pad with the good heat conduction performance in the thickness direction is converted into the heat conduction strips with the heat conduction performance in the thickness direction, and the manufacturing process can be greatly simplified; and the heat conduction efficiency and rebound resilience of the heat conduction pad in the thickness direction are ensured. Moreover, at least part of the heat-conducting structure is located on the surface of the heat-conducting pad or close to the surface, so that heat on the surface of the heat-conducting pad can be timely transmitted to the heat-conducting structure and transmitted outwards in the thickness direction.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a thermal pad, its preparation method, and its application. Background Technology

[0002] Thermal interface materials (TIMs) are a crucial component of modern electronic device heat dissipation solutions. With the miniaturization, high integration, and high power consumption trends of electronic components, the heat flux density per unit area of ​​electronic devices is gradually increasing, making heat dissipation a more prominent issue. Thermal pads, as a widely used interface thermally conductive material, are often used to fill the tiny gaps formed by surface roughness between electronic devices and heat dissipation devices, thereby reducing interfacial thermal resistance and improving device heat dissipation efficiency. Specific applications include IC packaging, chip heat dissipation modules, optoelectronic devices, and heat dissipation interfaces for various electronic devices.

[0003] Existing thermal pad solutions tend to cause heat to accumulate at the interface between the object to be cooled and the thermal pad, and their vertical thermal conductivity along the thickness direction is insufficient.

[0004] In view of this, it is necessary to improve the existing thermal pads and their preparation methods. Summary of the Invention

[0005] The purpose of this invention is to provide a thermal pad, its preparation method, and its application, in order to solve the problem of insufficient vertical thermal conductivity of thermal pads in the prior art, especially the problem of difficulty in achieving high thermal conductivity in the thickness direction in electronic device heat dissipation scenarios.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: A thermal pad includes a plurality of thermally conductive strips, each thermally conductive strip including at least one carrier filament and a thermally conductive structure located on at least a portion of the surface of the carrier filament. The extending direction of the thermally conductive structure intersects the thickness direction of the thermal pad, with an intersection angle of less than 90°. The distance from at least a portion of the thermally conductive structure to the surface of the thermal pad is between -30 μm and +100 μm.

[0007] In some embodiments, the carrier filament is a thermally conductive adhesive filament, which bonds several thermally conductive strips together.

[0008] In some embodiments, the carrier filament further comprises at least one support filament located within the thermally conductive adhesive filament, and / or the support filament located on the surface of the thermally conductive adhesive filament; and / or, a layer of the thermally conductive adhesive filament within a predetermined thickness from the surface inward comprises a thermally conductive resin, or a layer of the thermally conductive adhesive filament within a predetermined thickness from the surface inward comprises a thermally conductive resin and a thermally conductive filler; wherein the thermally conductive resin is one or more of silicone resin, acrylic resin, and polyurethane resin; and the thermally conductive filler is one or more of aluminum oxide, boron nitride, silicon carbide, silver powder, copper powder, aluminum powder, chopped polymer fiber, and chopped carbon fiber.

[0009] In some embodiments, the heat-conducting structure is a heat-conducting wire, and the angle between the extension direction of the heat-conducting wire and the extension direction of the carrier wire is 5° to 90°.

[0010] In some embodiments, the heat-conducting wire is laid on the surface of the carrier wire, or the heat-conducting wire is wound together with the carrier wire; and / or, the heat-conducting wire is one or more of metal wire, carbon fiber wire, composite heat-conducting fiber wire, or composite wire with a heat-conducting layer on the surface, and the heat-conducting layer is one or more of carbon nanotubes, graphene, boron nitride, or silver nanowires; and / or, the diameter of the heat-conducting wire is not greater than the diameter of the carrier wire; and / or, the ratio of the diameter of the heat-conducting wire to the diameter of the carrier wire is 0.01-1; and / or, the diameter of the heat-conducting wire is 1μm-100μm; and / or, the cross-sectional shape of the heat-conducting wire is a regular shape or an irregular shape, and the regular shape is a circle or a polygon.

[0011] In some embodiments, the carrier filament is a thermally conductive coating applied to the surface of the carrier filament, and the angle between the extension direction of the thermally conductive coating and the extension direction of the carrier filament is 5° to 90°.

[0012] In some embodiments, the thermally conductive coating connects the two surfaces of the carrier filament toward the thermally conductive pad in the thickness direction; or, the thermally conductive coating is applied to the entire surface of the carrier filament; and / or, the thermally conductive coating is one or more of carbon nanotubes, graphene, boron nitride, or silver nanowires; and / or, the thickness of the thermally conductive coating is 1 μm-100 μm.

[0013] A method for preparing a thermally conductive pad includes the following steps: forming thermally conductive strips by intersecting at least a portion of carrier filaments with at least a portion of thermally conductive structures, wherein the carrier filaments are thermally conductive adhesive filaments; arranging a plurality of the thermally conductive strips in an array and combining the plurality of thermally conductive strips into one piece to form a thermally conductive pad, wherein the thermal conduction direction of the thermally conductive structure intersects with the thickness direction of the thermally conductive pad, and the intersection angle is less than 90°; and the distance from at least a portion of the thermally conductive structure to the surface of the thermally conductive pad is -30μm to +100μm.

[0014] In some embodiments, the carrier filament is a thermally conductive adhesive filament; upon heating, the thermally conductive adhesive filament melts and bonds several thermally conductive strips together; and / or, the thermally conductive strip is formed by at least one of the following methods: the thermally conductive structure is a thermally conductive wire, and the carrier filament and the thermally conductive wire are wound together to form the thermally conductive strip; or, the thermally conductive structure is a thermally conductive wire, and several carrier filaments extending in a first direction are spaced apart in a second direction, the thermally conductive wire is laid on the surface of several carrier filaments, and the thermally conductive wire is cut between adjacent carrier filaments to form the thermally conductive strip; or, a thermally conductive coating is coated on the surface of the carrier filament, the thermally conductive coating constituting the thermally conductive structure, and the thermally conductive coating is applied in the circumferential direction of the carrier filament; or, a thermally conductive coating is coated on the entire surface of the carrier filament in the circumferential direction, the thermally conductive coating constituting the thermally conductive structure.

[0015] Application of any of the above-described thermal pads in IC packaging, chip heat dissipation modules, optoelectronic devices, and electronic devices.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The thermal pad of the present invention includes a plurality of thermally conductive strips, each thermally conductive strip including at least one carrier filament and a thermally conductive structure intersecting the carrier filament. The extension direction of the thermally conductive structure intersects the thickness direction of the thermal pad, with an intersection angle of less than 90°. On the one hand, the thermal pad is directly formed from the thermally conductive strips, and the object to be cooled directly contacts the thermally conductive strips, allowing heat to be directly transferred to the thermally conductive strips, reducing thermal resistance and improving heat dissipation performance. On the other hand, the present invention uses the intersecting arrangement of the carrier filaments and the thermally conductive structure to form the thermally conductive strips, and then uses the thermally conductive strips to form the thermal pad. This transforms the complex process of a thermally conductive pad with good thermal conductivity in the thickness direction into a thermally conductive strip with thermal conductivity in the thickness direction, greatly simplifying the manufacturing process and ensuring the thermal conductivity efficiency and resilience of the thermal pad in the thickness direction. Furthermore, by having at least a portion of the thermally conductive structure at a distance of -30μm to +100μm from the surface of the thermal pad, a portion of the thermally conductive structure is located on the surface of the thermal pad, or the thermally conductive structure is located within the thermal pad but at a distance of no more than 30μm from the surface of the thermal pad. This ensures that the heat on the surface of the thermal pad is transferred to the thermally conductive structure in a timely manner and then transferred outward along the thickness direction.

[0017] The thermal pad of the present invention has a simple structure, convenient manufacturing process, and is easy to achieve thinness. It has excellent compressibility and high resilience, and is suitable for the application requirements of high-performance heat dissipation interfaces in various IC packages, chip heat dissipation modules, electronic devices and optoelectronic devices. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a heat-conducting strip in one embodiment of the present invention.

[0019] Figure 2 for Figure 1A schematic diagram of the cross-section of the heat-conducting strip after radial cutting.

[0020] Figure 3 for Figure 1 A schematic diagram of the structure of the thermal pad formed by the thermal strips in the diagram.

[0021] Figure 4 This is a schematic diagram of the structure of a heat-conducting strip in one embodiment of the present invention.

[0022] Figure 5 for Figure 4 A schematic diagram of the cross-section of the heat-conducting strip after it has been cut perpendicular to the extension direction.

[0023] Figure 6 for Figure 4 A schematic diagram of the structure of the thermal pad formed by the thermal strips in the diagram.

[0024] Figure 7 This is a schematic diagram of the structure of a heat-conducting strip in one embodiment of the present invention.

[0025] Figure 8 for Figure 7 A cross-sectional view of the heat-conducting strip after it has been cut perpendicular to the extension direction.

[0026] Figure 9 for Figure 7 The diagram shows the structure of the thermal pad formed by the thermal strip.

[0027] Figure 10 This is a schematic diagram of the structure of a heat-conducting strip in another embodiment of the present invention.

[0028] Figure 11 for Figure 10 A cross-sectional view of the heat-conducting strip after it has been cut perpendicular to the extension direction.

[0029] Figure 12 for Figure 10 The diagram shows the structure of a thermal pad formed by bonding thermal strips.

[0030] Figure 13 This is a schematic diagram of the structure of a heat-conducting strip in one embodiment of the present invention.

[0031] Figure 14 for Figure 13 A cross-sectional view of the heat-conducting strip after it has been cut perpendicular to the extension direction.

[0032] Figure 15 for Figure 13 The diagram shows the structure of a thermal pad formed by bonding thermal strips.

[0033] Figure 16 This is a schematic diagram of the structure of a heat-conducting strip in another embodiment of the present invention.

[0034] Figure 17 for Figure 16 A cross-sectional view of the heat-conducting strip after it has been cut perpendicular to the extension direction.

[0035] Figure 18 for Figure 16 The diagram shows the structure of a thermal pad formed by bonding thermal strips.

[0036] Figure 19 To adopt Figure 1 The diagram shows a method for preparing a thermal pad using a thermally conductive strip.

[0037] Figure 20 This is a schematic diagram of a method for preparing a heat-conducting strip according to another embodiment of the present invention.

[0038] Figure 21 To adopt Figure 20 A schematic diagram of the preparation method of the obtained thermal conductive strip to make a thermal conductive pad.

[0039] 100-thermal conductive pad, 1-thermal conductive strip, 2-carrier filament, 21-second section, 3-thermal conductive structure, 31-thermal conductive wire, 311-winding unit, 32-thermal conductive coating, 4-roller. Detailed Implementation

[0040] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of the present invention.

[0041] In the various figures of this invention, for ease of illustration, some dimensions of structures or parts may be exaggerated relative to other structures or parts; therefore, only the basic structure of the subject matter of this invention is used to illustrate the invention.

[0042] Figures 1 to 18 The image shows a thermal pad 100 according to a preferred embodiment of the present invention. Figures 19 to 21 The following diagram illustrates the method for preparing the thermal pad of the present invention. The thermal pad 100 of the present invention is generally sheet-shaped. For ease of description, the direction perpendicular to the plane on which the thermal pad 100 is located (or the extended plane of the thermal pad 100) is defined as the thickness direction of the thermal pad 100.

[0043] Please refer to Figures 1 to 18 As shown, the thermal pad 100 of the present invention includes a plurality of thermally conductive strips 1. Each thermally conductive strip 1 includes at least one carrier filament 2 and a thermally conductive structure 3 intersecting the carrier filament 2. The extending direction of the thermally conductive structure 3 intersects the thickness direction of the thermally conductive pad 100, with an intersection angle of less than 90°. At least a portion of the thermally conductive structure 3 is at a distance of -30 μm to +100 μm from the surface of the thermally conductive pad 100.

[0044] The thermal conduction direction of the thermally conductive structure 3 is consistent with its extension direction. The thermally conductive structure 3 and the carrier filament 2 are arranged intersectingly, so that the thermal conduction direction of the thermally conductive structure 3 intersects with the carrier filament 2, and the thermal conduction direction of the thermally conductive structure 3 intersects with the thickness direction of the thermally conductive pad 100. On the one hand, the thermally conductive pad 100 is directly formed from the thermally conductive strip 1, and the object to be dissipated is in direct contact with the thermally conductive strip 1, and the heat is directly transferred to the thermally conductive strip 1, reducing thermal resistance and improving heat dissipation performance. On the other hand, this invention uses the intersecting arrangement of the carrier filament 2 and the thermally conductive structure 3 to form the thermally conductive strip 1, and then the thermally conductive strip 1 forms the thermally conductive pad 100. This transforms the manufacturing process of the thermally conductive pad 100, which has good thermal conductivity in the thickness direction, into a thermally conductive strip 1 with thermal conductivity in the thickness direction, greatly simplifying the manufacturing process and ensuring that the thermally conductive pad 100 has a high thermal conductivity and excellent resilience in the thickness direction.

[0045] When the distance between the thermally conductive structure 3 and the surface of the thermal pad 100 is negative, the thermally conductive structure 3 is located inside the thermal pad 100. For example, "-30μm" means that the thermally conductive structure 3 is embedded (inlaid) into the thermal pad 100 from the surface to a depth of 30μm. When the distance between the thermally conductive structure 3 and the surface of the thermal pad 100 is positive, the thermally conductive structure 3 protrudes from the surface of the thermal pad 100. For example, "+100μm" means that the thermally conductive structure 3 protrudes from the surface by a distance of 100μm.

[0046] At least a portion of the thermally conductive structure 3 is located at a distance of -30 μm to +100 μm from the surface of the thermally conductive pad 100. This ensures that the heat from the surface of the thermally conductive pad 100 is transferred to the thermally conductive structure 3 in a timely manner and then transferred outward along the thickness direction, thereby reducing the overall thermal resistance.

[0047] The present invention can also flexibly control thermal conductivity and flexibility by adjusting the density and arrangement of the thermal conductive structure 3 and the carrier filament 2. The thermal pad 100 of the present invention has a simple structure, convenient manufacturing process, and is easy to achieve thinness. It has excellent compressibility and high resilience, and is suitable for the application requirements of various IC packages, chip heat dissipation modules, electronic devices and optoelectronic devices for high-performance heat dissipation interfaces.

[0048] A higher thermal conductivity means that the thermal conductivity of the heat pad 100 is not less than 10 W·m. -1 ·K -1 Excellent resilience means that it can be compressed under low pressure to avoid squeezing products in contact with it; and it can rebound after the pressure is released. Low pressure refers to the pressure applied to the thermal pad 100 by the product using this thermal pad 100 under normal use conditions, such as 0N-500N.

[0049] In some embodiments, the carrier filament 2 is a thermally conductive adhesive filament. The carrier filament 2 being a thermally conductive adhesive filament means that the carrier filaments 2 can be bonded together, including the following two situations: the entire carrier filament 2 is made of thermally conductive adhesive material; or a surface layer of the carrier filament 2 (e.g., 20μm-100μm from the surface inwards) is made of thermally conductive adhesive material.

[0050] The thermally conductive adhesive filaments serve a dual purpose of adhesion and thermal conduction, allowing the thermally conductive strips 1 to be bonded together to form a thermally conductive pad 100. With this configuration, the object to be cooled comes into direct contact with the thermally conductive strips 1, allowing heat to be directly transferred to them, reducing thermal resistance and improving heat dissipation performance.

[0051] Specifically, during heating, the adjacent heat-conducting strips 1 are directly bonded together, thus bonding the adjacent heat-conducting strips 1 into one unit. Alternatively, during heating, the heat-conducting adhesive threads overflow from the gaps in the heat-conducting structure 3, and the adhesive properties of the heat-conducting adhesive bond several heat-conducting strips 1 together.

[0052] In one embodiment, the thermally conductive adhesive filament is made of thermally conductive resin, which can serve the dual purpose of adhesion and thermal conduction. The thermally conductive resin includes, but is not limited to, one or more of silicone resin, acrylic resin, or polyurethane resin.

[0053] In another embodiment, the thermally conductive filaments may also be formed by mixing thermally conductive resin and thermally conductive filler to further improve the overall thermal conductivity and mechanical strength of the thermal pad 100.

[0054] Typically, thermally conductive fillers are first mixed into thermally conductive resin, which is then used to form thermally conductive filaments. The thermally conductive resin forms the main body of the filaments, while the thermally conductive fillers are embedded within it to enhance thermal conductivity and mechanical strength.

[0055] The thermally conductive resin is as described above. The thermally conductive fillers include, but are not limited to, one or more combinations of aluminum oxide, boron nitride, silicon carbide, silver powder, copper powder, aluminum powder, chopped polymer fibers, or chopped carbon fibers. These thermally conductive fillers exhibit excellent miscibility and bonding with the thermally conductive resin, enabling them to be mixed to form thermally conductive filaments with uniform and stable thermal conductivity.

[0056] The carrier filament 2 may also have a support filament, which enhances the strength of the thermally conductive adhesive filament and maintains its strip shape, facilitating the cross-arrangement of the carrier filament 2 and the thermally conductive structure 3. Whether the support filament is located within the thermally conductive adhesive filament or on its surface, both can improve the strength of the thermally conductive adhesive filament.

[0057] The cross-sectional shape of the carrier wire 21 can be a regular or irregular shape. Regular shapes include circles, semicircles, or polygons. Polygons can be rectangles, rhombuses, parallelograms, or regular polygons with equal side lengths. Irregular shapes can be designed according to actual working conditions. This invention preferably uses a regular shape to facilitate the winding of the heat-conducting wire 22.

[0058] The thermal conductivity of the thermally conductive structure 3 is higher than that of the carrier filament 2. The thermally conductive structure 3 is attached to the carrier filament 2 and has an extending tendency in the thickness direction of the thermally conductive pad 100, so that the thermally conductive pad 100 has high thermal conductivity in the thickness direction.

[0059] Please refer to Figures 1 to 6 As shown, in one embodiment, the heat-conducting structure 3 is a heat-conducting wire 31, and the extension direction of the heat-conducting wire 31 is arranged to intersect with the carrier wire 2.

[0060] The material of the heat-conducting wire 31 may be selected from, but is not limited to, one or more of the following: metal wire, carbon fiber wire, composite heat-conducting fiber wire, or composite wire with a heat-conducting layer on the surface, in combination with the carrier wire 2 to achieve excellent heat conduction performance in the thickness direction of the heat-conducting pad 100.

[0061] The thermally conductive layer includes, but is not limited to, one or more of carbon nanotubes, graphene, boron nitride, or silver nanowires, which can improve the thermal conductivity of the thermally conductive wire 200, thereby improving the thermal conductivity of the thermally conductive pad 100.

[0062] The diameter of the heat-conducting wire 31 is 1μm-100μm. This diameter range is beneficial for improving the flexibility and compressibility of the heat-conducting pad 100, without compromising the thermal conductivity of the heat-conducting pad 100 in the thickness direction.

[0063] The diameter of the heat-conducting wire 31 is no greater than the diameter of the carrier wire 2, and preferably the diameter of the carrier wire 2 is greater than the diameter of the heat-conducting wire 31. This allows the heat-conducting wire 31 to be stably attached to the surface of the carrier wire 2, effectively achieving efficient heat conduction while ensuring the flexibility and resilience of the overall structure.

[0064] The ratio of the diameter of the heat-conducting wire 31 to the diameter of the carrier wire 2 is 0.01-1, which also enables the heat-conducting wire 31 to be stably attached to the surface of the carrier wire 2. Preferably, the ratio of the diameter of the heat-conducting wire 31 to the diameter of the carrier wire 2 is 0.01-0.2, and more preferably 0.05-0.1.

[0065] The cross-sectional shape of the heat-conducting wire 31 can also be a regular shape or an irregular shape, thus providing good adaptability in structural design. Regular shapes and irregular shapes are as described above. In one embodiment, the heat-conducting wire 31 is a flat metal wire, which has a stable structure and is easy to wind.

[0066] In some embodiments, the heat-conducting wires 31 are laid across the surface of the carrier wires 2. Specifically, several carrier wires 2 extending in a first direction are arranged at intervals along a second direction, and the heat-conducting wires 31 are laid across the surface of the carrier wires 2. The heat-conducting wires 31 are cut between adjacent carrier wires 2 to form a heat-conducting strip 1. This crossing method is simple to operate and has a high degree of controllability of the crossing angle.

[0067] In some embodiments, the heat-conducting wire 31 is wound together with the carrier wire 2 to form a structurally stable and highly efficient heat-conducting structure. The carrier wire 2 provides structural support and determines the overall shape and size of the heat-conducting strip 1. By introducing the carrier wire 2, the heat-conducting wire 31 does not need to rely on its own strength to form a continuous self-supporting structure. Simply by winding, the heat-conducting wire 31 can achieve the desired shape, forming a vertically oriented heat-conducting path that can extend randomly, exhibiting excellent thermal conductivity and resilience in the thickness direction. The winding method of the heat-conducting wire 2 is independent of its toughness and strength, which can expand the range of materials that can be selected for the heat-conducting wire 2 and allow for diversified winding methods to improve thermal conductivity in multiple directions.

[0068] The winding methods of the carrier wire 2 and the heat-conducting wire 31 include, but are not limited to, the following.

[0069] In one embodiment, one or more heat-conducting wires 31 are intertwined with one or more carrier wires 2. This intertwining method ensures a tight bond between the two, maintaining a stable configuration.

[0070] In another embodiment, such as Figures 1 to 6 As shown, the carrier filament 2 remains stationary as a support; one or more heat-conducting filaments 31 are wound around the surface of one or more carrier filaments 2 in a unidirectional, bidirectional or random manner. The winding process is simple and maintains excellent thermal conductivity and high resilience in the thickness direction.

[0071] It should be noted that the heat-conducting wire 31 can be wound tightly against the surface of the carrier wire 2, that is, the heat-conducting wire 31 is in contact with the carrier wire 2. Alternatively, the heat-conducting wire 31 can use the carrier wire 2 as a support, but it is not wound tightly against the carrier wire 2, that is, there is a gap between the heat-conducting wire 31 and the carrier wire 2, which results in better resilience.

[0072] In one embodiment, the heat-conducting wire 31 is continuously wound around the entire surface of the carrier wire 22. The heat-conducting wire 2 is wound from one end to the other along the extension direction (length direction) of the carrier wire 22, covering the entire surface in the extension direction of the body wire 12, and exhibiting good thermal conductivity in both the extension direction and radial direction of the carrier wire 2.

[0073] In another embodiment, the carrier filament 2 has at least two first segments and a second segment 21 located between adjacent first segments. The heat-conducting filament 31 is wound only around the surface of the first segment to form spaced-apart winding units 311. Alternatively, the winding density of the heat-conducting filament 31 in the first segment is greater than the winding density of the heat-conducting filament 31 in the second segment 21, and the heat-conducting filament 31 is broken at the second segment 21. Based on this structure, even if the heat-conducting filament 31 is made of a conductive material (e.g., metal wire), insulation can be achieved between adjacent winding units 311.

[0074] Specifically, multiple first and second segments 21 are arranged alternately along the extension direction of the carrier filament 2, and the length of the first segment along the extension direction of the carrier filament 2 is greater than the length of the second segment 21. For example, the first segment is 3mm-10mm long, and the length of the second segment 21 is 0.3mm-0.8mm. The heat-conducting wire 31 is wound into winding units 311 every 6mm±2mm, with an interval of 0.5mm±0.1mm. After winding, the heat-conducting wire 31 is broken in the second segment 21 by laser or discharge, so that each winding unit 311 is mutually insulated in the overall structure, avoiding the risk of electrical short circuit between the heat-conducting wires 31, and significantly improving the structural safety.

[0075] When the thermal conductive adhesive threads bond the thermal conductive strips 1 together, the thermal conductive wires 31 located between adjacent thermal conductive strips 1 are embedded into the thermal conductive pad 100, while the thermal conductive wires 31 located on the surface of the thermal conductive strip 1 facing the thermal conductive pad are exposed outwards on the surface of the thermal conductive pad 100. This embedding method ensures the bonding strength between the two, prevents detachment, and reduces interfacial thermal resistance. The exposed thermal conductive wires 31, being exposed from the surface, can directly contact the object to be cooled, improving thermal conductivity.

[0076] Of course, in some embodiments, after hot pressing, the heat-conducting wire 31 is completely embedded in the heat-conducting pad 100, and the distance between the heat-conducting wire 31 and the surface of the heat-conducting pad 100 is no more than 30μm. With this design, the heat on the surface of the heat-conducting pad 100 can be transferred to the heat-conducting wire 31 as quickly as possible, reducing the overall thermal resistance and improving the heat conduction effect.

[0077] Please refer to Figures 7 to 18 As shown, in another embodiment, the thermally conductive structure 3 is a thermally conductive coating 32. The thermally conductive structure 3 is formed by coating at least a portion of the surface of the carrier filament 2 with the thermally conductive coating 32.

[0078] The thermally conductive coating 32 is one or more of carbon nanotubes, graphene, boron nitride, or silver nanowires. It has good thermal conductivity, ensuring that the thermal pad 100 has good thermal conductivity and resilience in the thickness direction.

[0079] In some embodiments, the carrier filament 2 has a first surface and a second surface disposed opposite to each other. The first surface and the second surface can be two surfaces disposed opposite to each other in the thickness direction of the thermal pad 100. The thermally conductive coating 32 covers a portion of the carrier filament 2 in the circumferential direction, and the thermally conductive coating 32 extends at least from the first surface to the second surface in the circumferential direction of the carrier filament 2. That is, the thermally conductive coating 32 extends continuously from at least the first surface to the second surface, ensuring the thermal conductivity of the thermal pad 100 in the thickness direction; while the carrier filament 2 not covered by the thermally conductive coating 32 will bond adjacent thermally conductive strips 1 together when heated.

[0080] In some embodiments, the carrier filament 2 has first segments spaced apart along its extension direction and second segments 21 located between adjacent first segments. A thermally conductive coating 32 is applied to the entire surface of the first segments along the circumferential direction of the carrier filament 2, and the second segments 21 of the carrier filament 2 bond adjacent thermally conductive strips 1 together when heated.

[0081] In this invention, the thickness of the thermally conductive coating 32 is 1μm-100μm. If the thermally conductive coating 32 is too thick, it will harden, affecting the resilience of the thermally conductive pad 100 in the thickness direction. If the thermally conductive coating 32 is too thin, cracks may appear under repeated pressure, affecting the thermal conductivity.

[0082] In this invention, the extension direction (thermal conduction direction) of the thermally conductive structure 3 intersects with the extension direction of the carrier filament 2. The smaller the intersection angle, the more beneficial it is to the resilience in the thickness direction; the larger the intersection angle, the more beneficial it is to the thermal conductivity in the thickness direction. By setting the intersection angle to 5° to 90°, a multi-dimensional and good thermal conduction path can be constructed in the thickness direction, so that the formed thermally conductive pad 100 has both good resilience and thermal conductivity.

[0083] When the heat-conducting structure 3 is a heat-conducting wire 31, the angle between the extension direction of the heat-conducting wire 31 and the extension direction of the carrier wire 2 is 5°~90°, that is, the angle between the heat-conducting direction of the heat-conducting wire 31 and the extension direction of the carrier wire 2 is 5°~90°. When the heat-conducting strips 1 are combined to form the heat-conducting pad 100, the angle between the heat-conducting direction of the heat-conducting wire 31 and the thickness direction of the heat-conducting pad 100 is 5°~90°, so that the heat-conducting pad 100 has good thermal conductivity and electrical conductivity in the thickness direction.

[0084] When the thermally conductive structure 3 is a thermally conductive coating 32, the angle between the extension direction of the thermally conductive coating 32 and the extension direction of the carrier filament 2 is 5° to 90°, that is, the angle between the thermally conductive direction of the thermally conductive coating 32 and the extension direction of the carrier filament 2 is 5° to 90°. When the thermally conductive strip 1 is combined to form the thermally conductive pad 100, the angle between the thermally conductive direction of the thermally conductive coating 32 and the thickness direction of the thermally conductive pad 100 is 5° to 90°, so that the thermally conductive pad 100 has good thermal conductivity and electrical conductivity in the thickness direction.

[0085] Through the above structural design, the thermal pad 100 of the present invention ensures high thermal conductivity in the thickness direction while exhibiting good compressibility and resilience as a whole, and the manufacturing process is greatly simplified. Its superior performance makes it particularly suitable for heat dissipation interfaces in electronic devices, optoelectronic devices, chip packaging, and other applications requiring high thermal management.

[0086] Please refer to Figures 19 to 21As shown, the present invention also provides a method for preparing a thermally conductive pad, comprising the following steps: forming a thermally conductive strip 1 by intersecting at least a portion of a carrier filament 2 with at least a portion of a thermally conductive structure 3, wherein the carrier filament 2 is a thermally conductive adhesive filament; arranging a plurality of thermally conductive strips 1 in an array, and combining the plurality of thermally conductive strips 1 into a single unit to form a thermally conductive pad 100. The extension direction (thermal conduction direction) of the thermally conductive structure 3 intersects with the thickness direction of the thermally conductive pad 100, and the intersection angle is less than 90°. The distance from at least a portion of the thermally conductive structure 3 to the surface of the thermally conductive pad 100 is -30 μm to +100 μm. The preparation method of this invention simplifies the complex process of creating a thermally conductive pad 100 by cross-arranging the carrier filament 2 and the thermally conductive structure 3 to form a thermally conductive strip 1, and then using the thermally conductive strip 1 to form a thermally conductive pad 100. This greatly simplifies the manufacturing process and ensures that the thermally conductive pad 100 has a high thermal conductivity and excellent resilience in the thickness direction. Furthermore, since the thermally conductive pad 100 is directly formed from the thermally conductive strip 1, the object to be cooled is in direct contact with the thermally conductive strip 1, and heat is directly transferred to the thermally conductive strip 1, reducing thermal resistance and improving heat dissipation performance.

[0087] The carrier filament 2 can be any of the above-mentioned thermally conductive filaments. During heating, the thermally conductive filament melts and bonds several thermally conductive strips 1 together to form a thermally conductive pad 100.

[0088] The present invention can form the heat-conducting strip 1 in at least one of the following ways.

[0089] When any of the above-mentioned heat-conducting wires 31 are selected for the heat-conducting structure 3, the carrier wire 2 and the heat-conducting wire 31 are wound together to form the heat-conducting strip 1. Any of the above-mentioned winding methods can be selected, and will not be described in detail here.

[0090] When any of the above-mentioned heat-conducting wires 31 are selected for the heat-conducting structure 3, several carrier wires 2 extending along the first direction are arranged at intervals along the second direction, and the heat-conducting wires 31 are laid on the surface of the several carrier wires 2. The heat-conducting wires 31 are cut between adjacent carrier wires 2 to form a heat-conducting strip 1. Of course, the heat-conducting adhesive wires can also be heated or hot-pressed to enhance the bonding strength between the heat-conducting wires 31 and the carrier wires 2.

[0091] When the heat-conducting wire 31 is laid on the surface of the carrier wire 2, or when the heat-conducting wire 31 is wound with the carrier wire 2, the carrier wire 2 can be heated. The heating temperature is sufficient to soften or slightly melt the carrier wire 2, thereby improving the bonding strength between the heat-conducting wire 31 and the carrier wire 2.

[0092] A thermally conductive coating 32 is coated on the surface of the carrier filament 2, and the thermally conductive coating 32 constitutes a thermally conductive structure 3.

[0093] In one embodiment, the carrier filament 2 has a first surface and a second surface disposed opposite to each other. A thermally conductive coating 32 covers a portion of the carrier filament 2 along the circumferential direction, and the thermally conductive coating 32 extends at least from the first surface along the circumferential direction of the carrier filament 2 to the second surface. When the thermally conductive strips 1 are arranged in an array, the first surface of all the carrier filaments 2 faces one surface in the thickness direction of the thermally conductive pad 100, and the second surface of all the carrier filaments 2 faces the other surface in the thickness direction of the thermally conductive pad 100. Heating or hot-pressing melts the carrier filaments 2 to bond adjacent thermally conductive strips 1 together.

[0094] In another embodiment, the carrier filament 2 has first segments spaced apart along its extension direction and second segments 21 located between adjacent first segments. A thermally conductive coating 32 is coated on the entire surface of the first segments of the carrier filament 2 to form a conductive structure 2. After the thermally conductive strips 1 are arranged in an array, heating or hot pressing melts the second segments 21 of the carrier filament 2 to bond adjacent thermally conductive strips 1 together.

[0095] Furthermore, before forming the thermal conductive strip 1 into the thermal conductive pad 100, the preparation method of the present invention further includes shaping the thermal conductive strip 1 to facilitate the formation of the thermal conductive pad 100. For example, a rolling process can be used to construct the thermal conductive strip 1 into a flat shape, which is beneficial for subsequent arrangement and formation of the thermal conductive pad 100.

[0096] The arrangement of the thermal conductive strips 1 is not limited. A layer of thermal conductive strips 1 is arranged in the thickness direction of the thermal conductive pad 100 to avoid the formation of an interface in the thickness direction, which would affect heat transfer.

[0097] A plurality of heat-conducting strips 1 are arranged in a matrix. In one embodiment, all heat-conducting strips 1 extend along a first direction and are neatly arranged along a second direction. In another embodiment, all heat-conducting strips 1 extend along the second direction and are neatly arranged along the first direction.

[0098] Several heat-conducting strips 1 are bonded together using hot roller pressing. The pressing direction can be along the extension direction of the heat-conducting strips 1 or along a direction intersecting the extension direction of the heat-conducting strips 1, with an intersection angle not exceeding 9°. During this process, the heat-conducting adhesive filaments melt, bonding adjacent heat-conducting strips 1 together to form a heat-conducting pad 100.

[0099] In this method, "heating" is preferably hot pressing, such as hot rolling. The heating temperature is close to the melting or softening temperature of the thermally conductive adhesive filaments. After the thermally conductive adhesive filaments soften, they overflow from the gaps between the thermally conductive filaments 31 or the thermally conductive coating 32, and combine all the thermally conductive strips 1 into one, forming a thermally conductive pad 100 with the thermally conductive filaments 31 or the thermally conductive coating 32 embedded on the surface, which can reduce the internal interface thermal resistance of the thermally conductive pad 100.

[0100] The following will describe in detail the thermal pad 100 and its preparation method of the present invention with specific embodiments.

[0101] Example 1 A thermally conductive adhesive filament with a diameter of 0.2 mm and embedded with a support wire was selected as the carrier filament 2, possessing sufficient structural rigidity, thermal conductivity, and adhesiveness. The thermally conductive adhesive filament is made of silicone resin, and the support wire is made of iron wire.

[0102] A copper wire with a single filament diameter of approximately 50 μm is used as the heat-conducting wire 31.

[0103] The heat-conducting wire 31 is wound onto the surface of the carrier wire 2 in a unidirectional, bidirectional, or random manner using a winding device to form a heat-conducting strip 1. Specifically, a periodic winding method is adopted. Every 5 mm of winding forms a winding unit 311, with a small interval of 0.5 mm, and a large interval of 100 mm after every 50 winding units 311. Then, the heat-conducting wire 31 is cut at the small interval to ensure that each winding unit 311 is mutually insulated; and then, according to the length requirements, the heat-conducting strip 1 is cut at the large interval to form several heat-conducting strips 1.

[0104] Several heat-conducting strips 1 are neatly arranged, with their extension directions generally consistent and arranged in a direction roughly perpendicular to the extension direction. They are then heat-pressed together, causing the heat-conducting adhesive fibers to soften and seep out from the gaps between the heat-conducting wires 31, thus bonding all the heat-conducting strips 1 together to form a heat-conducting pad 100 with the heat-conducting wires 31 embedded on the surface. This reduces the internal interface thermal resistance of the heat-conducting pad 100.

[0105] Finally, after a cutting process, a finished thermal pad 100 with dimensions suitable for the heat dissipation interface of electronic components is obtained. Compared with existing thermal pad materials, the thermal pad 100 prepared using this embodiment significantly improves thermal conductivity in the thickness direction while maintaining good compressibility and resilience, especially under low pressure, where it is easily compressed and can quickly return to its original shape after decompression. Furthermore, this embodiment features a simple process and stable structure, avoiding the manufacturing difficulties and short-circuit risks associated with using complex metal frames in existing technologies. It is suitable for large-scale mass production and is particularly suitable for the heat dissipation management needs of IC packaging, electronic devices, or optoelectronic devices, showing promising application prospects.

[0106] Example 2 The only difference from Example 1 is that the heat-conducting wire 31 is continuously wound around the entire surface of the carrier wire 2 along the extension direction of the carrier wire 2, and the heat-conducting strip 1 of a preset length is cut according to the length requirement.

[0107] Example 3 The only difference from Example 1 is: The heat-conducting wire 31 is made of carbon fiber filaments with a diameter of approximately 5μm-10μm, which are highly flexible and have good thermal conductivity. 2-10 carbon fiber filaments form a carbon fiber bundle, which is wound together with the carrier filament 2 to further improve the heat conduction effect.

[0108] Using a winding device, 2-10 heat-conducting wires (carbon fiber bundles) are wound onto the surface of the carrier wire 2 in a unidirectional, bidirectional, or random manner. During winding, the carrier wire 2 is appropriately heated to ensure that the thermally conductive adhesive is in a suitable molten state, thereby improving the bonding strength and interface stability between the heat-conducting wire 31 and the carrier wire 2.

[0109] In this embodiment, the heat-conducting wire 31 is wound in an intermittent manner, specifically leaving a second segment 21 of about 0.3 mm for every 1 mm of winding length, so as to form a winding unit 311 periodically arranged along the axial direction of the carrier wire 2. Subsequently, the wound heat-conducting wire 31 is cut at the second segment 21 position.

[0110] Finally, the overall structure after roll forming is cut to obtain a small thermal pad 100 with a size of 25mm×25mm.

[0111] Example 4 The only difference from any of the above embodiments 1-3 is that the cross-sectional shape of the carrier filament 2 is rectangular, the width of the carrier filament 2 is 1mm, and the thickness of the carrier filament 2 is 0.3mm. When arranged, the heat-conducting strips 1 are arranged with their wide sides facing each other. This structure makes the arrangement of the heat-conducting strips 1 more orderly. During the subsequent roll forming process, the carrier filaments 2 in adjacent heat-conducting strips 1 are connected and cured, improving the strength of the heat-conducting pad 100.

[0112] Example 5 The material after mixing silicone resin and thermally conductive filler is directly extruded to obtain a carrier filament 2 with a diameter of 0.5 mm. This carrier filament 2 has both carrier and thermal conductivity functions, which simplifies the overall structure and preparation process of the thermally conductive strip 1.

[0113] In this embodiment, the thermally conductive filler is spherical aluminum oxide and short-cut carbon fiber.

[0114] The heat-conducting wire is made of copper and has a diameter of 20μm.

[0115] A winding device is used to wind copper wire onto the surface of carrier wire 2 in a unidirectional winding manner. The winding method of the heat-conducting wire 31 includes dense winding in the first section, no winding or sparse winding on the surface of the second section 21, wherein a second section 21 of approximately 0.3 mm is set after every 1 mm of dense winding. After winding is completed, the heat-conducting wire 31 at the position of the second section 21 is broken by a near-infrared laser, thereby forming independent and insulated winding units 311. This structure effectively avoids the short-circuit risk that may be caused by metal heat-conducting strips in the prior art, and improves the safety of the heat-conducting pad 100.

[0116] The heat-conducting strip 1 (carrier wire 2 with heat-conducting wire 31 wound around it) is rolled into a flat shape with a width of 1 mm and a center thickness of 0.3 mm by roller pressing.

[0117] Flat heat-conducting strips 1 are arranged neatly side by side to form an array with a height of about 1 mm. The heat-conducting strips 1 are arranged with their wide sides facing each other. This structure allows the heat-conducting adhesive layer 1 to overflow more evenly and connect and cure with each other during the subsequent roll forming process.

[0118] Then, it undergoes a curing process using a heated roller 4. Since the carrier filament 2 itself contains thermally conductive material, during the curing process, the carrier filament 2 fully overflows under the combined pressure and heat of the heated roller 4 and effectively penetrates into the winding gaps between the thermally conductive filaments 31, further reducing the internal thermal resistance of the thermal interface and significantly enhancing the mechanical strength and overall stability of the thermal pad 100. Furthermore, after curing, the cross-sectional shape of the thermally conductive strip 1 is transformed into an approximately rectangular shape, and the thermally conductive strip 1 is densely arranged, further increasing the thermal contact area, which is beneficial for significantly improving the thermal conductivity of the thermal pad 100 in the thickness direction.

[0119] Finally, the overall structure after roll forming is cut to obtain a small thermal pad 100 with a size of 25mm×25mm.

[0120] Example 6 The only difference from Example 1 is: Iron wire with a single wire diameter of approximately 30 μm was used as the heat-conducting wire 31.

[0121] Please refer to Figure 20 As shown, a plurality of carrier filaments 2 (thermal conductive filaments) extending in the second direction are arranged at intervals along the first direction. Thermal conductive filaments 31 are arranged on the upper surface of the plurality of thermal conductive filaments, extending in the first direction and spaced apart in the second direction. Using laser or chemical methods, the thermal conductive filaments 31 are cut along the dotted lines between adjacent thermal conductive filaments to form a thermal conductive strip 1. This thermal conductive strip 1 has excellent thermal conductivity in the first direction.

[0122] Please refer to Figure 21As shown, after cutting, each heat-conducting strip 1 is rotated 90° around the second direction so that the heat-conducting wires 31 extend in the vertical direction, and then several heat-conducting strips 1 are stacked along the first direction.

[0123] After stacking, the surfaces of all the heat-conducting strips 1 are scraped along a first direction, causing the heat-conducting wires 31 to adhere to the upper and lower surfaces of the carrier wires 2. Several heat-conducting strips 1 are then hot-pressed, specifically along a second direction. The heat-conducting adhesive softens and seeps out from the gaps between the heat-conducting wires 31, bonding all the heat-conducting strips 1 together to form a heat-conducting pad 100 with the heat-conducting wires 31 embedded in the surface. This reduces the internal interfacial thermal resistance of the heat-conducting pad 100. The heat-conducting pad 100 has high thermal conductivity in the thickness direction (the extension direction of the heat-conducting wires 31).

[0124] In this step, the "scraping" step is not necessary. That is, after stacking, the heat is directly hot-pressed, and the heat-conducting wire 31 will remain on the surface in the thickness direction of the heat-conducting pad 100.

[0125] Finally, after the cutting process, a finished thermal pad 100 with dimensions and specifications suitable for the heat dissipation interface of electronic components can be obtained.

[0126] This embodiment features a simple process and stable structure, avoiding the manufacturing difficulties and short-circuit risks associated with the use of complex metal frames in existing technologies. It is suitable for large-scale mass production and is particularly applicable to the heat dissipation management needs of IC packaging, electronic devices, or optoelectronic devices, demonstrating promising application prospects. The thermal pad 100 obtained in this embodiment significantly improves thermal conductivity in the thickness direction while maintaining good compressibility and resilience. It is particularly easy to compress under low pressure and can quickly return to its original shape after pressure release.

[0127] Finally, the overall structure after roll forming is cut to obtain a small thermal pad 100 with a size of 25mm×25mm.

[0128] Example 7 The difference from Example 6 is that the heat-conducting wires 31 are arranged on the upper surface of several heat-conducting adhesive wires in a way that they are spaced apart along the second direction, and the angle between the heat-conducting wires 31 and the carrier wires 2 is 45°.

[0129] Example 8 The only difference from Example 6 is that: An acrylic resin is used to form a thermally conductive filament with a diameter of 0.2 mm. Copper wires are then bonded to the outer surface of the thermally conductive filament to form a carrier filament 2.

[0130] Example 9 The mixture of silicone resin and silver powder was directly extruded to obtain a carrier filament 2 with a diameter of 0.5 mm.

[0131] A thermally conductive coating 32 is coated on the surface of the carrier filament 2 as a thermally conductive structure 3. Specifically, a silver nanowire solution is used to coat the surface of the carrier filament 2 to form the thermally conductive coating 22. In this embodiment, the thermally conductive coating 32 is continuously coated along the extension direction of the carrier filament 2, and the thermally conductive coating 32 is coated in a semi-circular manner along the circumference of the carrier filament 2 (e.g., ...). Figure 12 or Figure 18 As shown in the figure, the coating thickness is 100 μm.

[0132] A plurality of heat-conducting strips 1 are arranged in an array, with the extension directions of the heat-conducting strips 1 being generally consistent and arranged in a direction roughly perpendicular to the extension direction, and the heat-conducting coating 32 of all the heat-conducting strips 1 being located on the same side of the arrangement direction. Hot pressing is then applied to soften the heat-conducting adhesive fibers and bond adjacent heat-conducting strips 1 together to form a heat-conducting pad 100.

[0133] Finally, after a cutting process, a finished thermal pad 100 with dimensions suitable for the heat dissipation interface of electronic components is obtained. The thermal pad 100 prepared using the structure and process of this embodiment significantly improves thermal conductivity in the thickness direction compared to existing thermal pad materials, while maintaining good compressibility and resilience. It is particularly easy to compress under low pressure and can quickly return to its original shape after pressure release. Furthermore, the process of this embodiment is simple, the structure is stable, and it is suitable for large-scale mass production. It is particularly suitable for the heat dissipation management needs of IC packaging, electronic devices, or optoelectronic devices, and has good application prospects.

[0134] Example 10 A thermally conductive adhesive filament with a diameter of 0.2 mm and embedded with a support wire was selected as the carrier filament 2, possessing sufficient structural rigidity, thermal conductivity, and adhesiveness. The thermally conductive adhesive filament is made of silicone resin, and the support wire is made of iron wire.

[0135] A thermally conductive coating 32 is coated on the surface of the carrier filament 2 as a thermally conductive structure 3. Specifically, a mixed solution of carbon nanotubes and graphene is coated on the surface of the carrier filament 2 to form the thermally conductive coating 22. In this embodiment, the thermally conductive coating 32 is applied at intervals along the extension direction of the carrier filament 2 (e.g., ...). Figures 7 to 9 , Figures 13 to 15 As shown), each layer is 5 mm thick, with a 0.5 mm interval. The thermally conductive coating 32 is applied in a circle along the circumference of the carrier filament 2, with a coating thickness of 80 μm.

[0136] Several heat-conducting strips 1 are neatly arranged in a plane, with their extension directions generally consistent and arranged in a direction roughly perpendicular to the extension direction. They are then heat-pressed together, causing the heat-conducting adhesive fibers to soften and seep out from the gaps in the heat-conducting coating 32, thus bonding all the heat-conducting strips 1 together to form a heat-conducting pad 100.

[0137] Finally, after a cutting process, a finished thermal pad 100 with dimensions suitable for the heat dissipation interface of electronic components is obtained. The thermal pad 100 prepared using the structure and process of this embodiment significantly improves thermal conductivity in the thickness direction compared to existing thermal pad materials, while maintaining good compressibility and resilience. It is particularly easy to compress under low pressure and can quickly return to its original shape after pressure release. Furthermore, the process of this embodiment is simple, the structure is stable, and it is suitable for large-scale mass production. It is particularly suitable for the heat dissipation management needs of IC packaging, electronic devices, or optoelectronic devices, and has good application prospects.

[0138] It should be noted that in Examples 1-4 and 6-10, the heat-conducting strip 1 can also be rolled into a flat shape as in Example 5. The carrier filament 2 in Examples 1-10 can be used interchangeably and can be replaced with any type of carrier filament described above. The heat-conducting wire 31 in Examples 1-8 can be used interchangeably and can be replaced with any type of heat-conducting wire 31 described above. The heat-conducting coating in Examples 9-10 can be used interchangeably and can be replaced with any type of heat-conducting coating 32 described above.

[0139] In summary, the thermal pad 100 provided by this invention constructs a thermal conduction path through the intersecting arrangement of the thermal conduction mechanism 22 and the carrier filament 2, achieving a synergistic improvement in thickness-direction thermal conductivity and compression resilience. The core innovation of this invention lies in transforming the formation of the planar thermal pad 100 into a thermally conductive strip 1 with high vertical thermal conductivity, and then combining the thermally conductive strip 1 to obtain the thermal pad 100. Furthermore, through the cooperation of the thermally conductive structure 3 and the carrier filament 2, the challenge of vertically oriented thermally conductive filaments 31 and thermally conductive coating 32 of the high thermal conductivity material is transformed into vertical orientation within the thermally conductive strip 1, simplifying the structure and process. The thermal pad 100 has a simple structure, convenient manufacturing process, higher vertical thermal conductivity, and superior compression resilience. It is safe, reliable, and suitable for mass production, effectively meeting the high-performance requirements of next-generation electronic devices and optoelectronic devices for heat dissipation interface materials, and possesses broad industrial application prospects.

[0140] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0141] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A thermally conductive pad, characterized in that, It includes several heat-conducting strips, each heat-conducting strip including at least one carrier filament and a heat-conducting structure intersecting the carrier filament. The extension direction of the heat-conducting structure intersects the thickness direction of the heat-conducting pad, with an intersection angle of less than 90°. At least a portion of the heat-conducting structure is at a distance of -30μm to +100μm from the surface of the heat-conducting pad.

2. The thermal pad as described in claim 1, characterized in that: The carrier filament is a thermally conductive adhesive filament, which bonds several thermally conductive strips together.

3. The thermal pad as described in claim 2, characterized in that: The carrier filament also has at least one support filament, which is located inside the thermally conductive adhesive filament and / or on the surface of the thermally conductive adhesive filament; And / or, a layer of the thermally conductive adhesive filament within a predetermined thickness from the surface inward includes thermally conductive resin, or a layer of the thermally conductive adhesive filament within a predetermined thickness from the surface inward includes thermally conductive resin and thermally conductive filler. in The thermally conductive resin is one or more of the following: silicone resin, acrylic resin, and polyurethane resin. The thermally conductive filler is one or more of the following: aluminum oxide, boron nitride, silicon carbide, silver powder, copper powder, aluminum powder, chopped polymer fiber, or chopped carbon fiber.

4. The thermal pad according to any one of claims 1 to 3, characterized in that: The heat-conducting structure is a heat-conducting wire, and the angle between the extension direction of the heat-conducting wire and the extension direction of the carrier wire is 5° to 90°.

5. The thermal pad as described in claim 4, characterized in that: The heat-conducting wire is laid on the surface of the carrier wire, or the heat-conducting wire is wound together with the carrier wire; And / or, the heat-conducting wire is one or more of the following: metal wire, carbon fiber wire, composite heat-conducting fiber wire, or composite wire with a heat-conducting layer on the surface; the heat-conducting layer is one or more of the following: carbon nanotube, graphene, boron nitride, or silver nanowire. And / or, the diameter of the heat-conducting wire is not greater than the diameter of the carrier wire; And / or, the ratio of the diameter of the heat-conducting wire to the diameter of the carrier wire is 0.01-1; And / or, the diameter of the heat-conducting wire is 1μm-100μm; And / or, the cross-sectional shape of the heat-conducting wire is a regular shape or an irregular shape, and the regular shape is a circle or a polygon.

6. The thermal pad according to any one of claims 1 to 3, characterized in that: The carrier filament is a thermally conductive coating applied to its surface, and the angle between the extension direction of the thermally conductive coating and the extension direction of the carrier filament is 5° to 90°.

7. The thermal pad as described in claim 6, characterized in that: The carrier filament has a first surface and a second surface disposed opposite to each other, the thermally conductive coating covers a portion of the carrier filament along the circumferential direction, and the thermally conductive coating extends at least from the first surface along the circumferential direction of the carrier filament to the second surface; or, the carrier filament has first segments spaced apart along its extension direction and second segments located between adjacent first segments, the thermally conductive coating being applied to the entire surface of the first segments; And / or, the thermally conductive coating is one or more of carbon nanotubes, graphene, boron nitride, or silver nanowires; And / or, the thickness of the thermally conductive coating is 1μm-100μm.

8. A method for preparing a thermally conductive pad, characterized in that, Includes the following steps: A thermally conductive strip is formed by intersecting at least a portion of a carrier filament with at least a portion of a thermally conductive structure, wherein the carrier filament is a thermally conductive adhesive filament; A plurality of the aforementioned heat-conducting strips are arranged in an array and the plurality of heat-conducting strips are combined into one to form a heat-conducting pad. The heat-conducting direction of the heat-conducting structure is intersected with the thickness direction of the heat-conducting pad, and the intersection angle is less than 90°. At least a portion of the heat-conducting structure is at a distance of -30μm to +100μm from the surface of the heat-conducting pad.

9. The method for preparing a thermally conductive pad as described in claim 8, characterized in that: The carrier filament is a thermally conductive adhesive filament; when heated, the thermally conductive adhesive filament melts and bonds several thermally conductive strips together. And / or, the heat-conducting strip is formed using at least one of the following methods: The thermally conductive structure is a thermally conductive wire, and the carrier wire and the thermally conductive wire are wound together to form the thermally conductive strip; Alternatively, the heat-conducting structure is a heat-conducting wire, in which several carrier wires extending in a first direction are arranged at intervals in a second direction, the heat-conducting wire is laid on the surface of several carrier wires, and the heat-conducting wire is cut between adjacent carrier wires to form the heat-conducting strip; Alternatively, a thermally conductive coating may be coated on the surface of the carrier filament, the thermally conductive coating constituting the thermally conductive structure, and the thermally conductive coating being applied in the circumferential direction of the carrier filament; Alternatively, a thermally conductive coating may be applied to the entire surface of the carrier filament in the circumferential direction, and the thermally conductive coating constitutes the thermally conductive structure.

10. The application of a thermal pad as described in any one of claims 1 to 7 in IC packaging, chip heat dissipation modules, optoelectronic devices, and electronic devices.

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