Cooling system, cooling management method, electronic equipment and program product

Abstract

The embodiment of the invention provides a cooling system, a cooling management method, electronic equipment and a program product, the cooling system is a vertical immersed liquid cooling system, and the cooling system comprises a closed server cooling box, a cooling liquid management unit, a primary side and a cooling liquid conveying pipeline; the closed server cooling box is arranged to contain the server and non-conductive cooling liquid, and electronic elements of the server are immersed in the cooling liquid; the closed server cooling box and the primary side are connected with the cooling liquid management unit through a cooling liquid conveying pipeline; and the cooling liquid management unit is used for cooling management. Through the scheme of the embodiment, the reliability and the heat dissipation performance of the cooling system and the integration level of the data center architecture can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of data center heat dissipation technology, and in particular to a cooling system, cooling management method, electronic device, and software product. Background Technology

[0002] Currently, data center cooling technology still faces challenges in several areas, including reliability, cooling efficiency, coolant management, and integration with existing data centers. Existing liquid cooling solutions still have room for improvement in terms of reliability, efficiency, and maintainability. Summary of the Invention

[0003] This disclosure provides a cooling system, a cooling management method, an electronic device, and a program product.

[0004] In a first aspect, embodiments of this disclosure provide a cooling system, which is a vertical immersion liquid cooling system, comprising: a closed equipment cooling tank, a coolant management unit, a primary side, and coolant delivery pipelines;

[0005] The enclosed equipment cooling box is configured to contain the equipment and a non-conductive coolant, with the electronic components of the equipment immersed in the coolant;

[0006] The enclosed equipment cooling box and the primary side are connected to the coolant management unit via the coolant delivery pipeline;

[0007] The coolant management unit is configured to perform cooling management.

[0008] Secondly, this disclosure also provides a cooling management method applied to the coolant management unit of the cooling system, comprising:

[0009] Collect the pressure value at the inlet of the variable frequency pump and determine whether the pressure value exceeds the preset pressure value upper limit;

[0010] The cooling management mode is determined based on the assessment results.

[0011] Thirdly, embodiments of this disclosure also provide an electronic device, including:

[0012] One or more processors;

[0013] A memory having stored one or more programs that, when executed by one or more processors, enable the one or more processors to implement the cooling management method.

[0014] One or more input / output (I / O) interfaces are connected between the processor and the memory and configured to enable information exchange between the processor and the memory.

[0015] Fourthly, this disclosure also provides a computer program product, which includes a computer program that, when executed by a processor, implements the cooling management method.

[0016] The cooling system of this embodiment is a vertical immersion liquid cooling system. The system includes: a closed equipment cooling tank, a coolant management unit, a primary side, and coolant delivery pipes. The closed equipment cooling tank is configured to contain the equipment and non-conductive coolant, with the electronic components of the equipment immersed in the coolant. The closed equipment cooling tank and the primary side are connected to the coolant management unit via the coolant delivery pipes. The coolant management unit is configured to perform cooling management. This embodiment improves the reliability, heat dissipation performance, and integration of the data center architecture of the cooling system. Attached Figure Description

[0017] In the accompanying drawings of the embodiments disclosed herein:

[0018] Figure 1 This is a schematic diagram of the cooling system structure provided in an embodiment of the present disclosure;

[0019] Figure 2 This is a schematic diagram of the coolant management unit structure provided in an embodiment of this disclosure;

[0020] Figure 3 This is a schematic diagram of a closed equipment cooling box structure provided in an embodiment of this disclosure;

[0021] Figure 4 A schematic diagram illustrating the quick-connector and flow control valve configuration provided in this embodiment of the disclosure;

[0022] Figure 5 This is a schematic diagram of the regulating valve V provided in an embodiment of this disclosure;

[0023] Figure 6 A schematic diagram of a scheme for configuring a local regulating valve V in each rack according to an embodiment of this disclosure;

[0024] Figure 7 A schematic diagram showing that each enclosed equipment cooling box provided in this embodiment of the present disclosure is independently equipped with a set of pressure safety valves;

[0025] Figure 8 A flowchart of a cooling management method provided in an embodiment of this disclosure;

[0026] Figure 9 A schematic diagram of a cooling management method provided in an embodiment of this disclosure;

[0027] Figure 10 This is a block diagram of an electronic device provided in an embodiment of the present disclosure. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions of this disclosure, the communication-sensing data processing method and computer-readable storage medium provided in the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0029] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0030] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0031] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0032] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0033] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0034] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0035] Modern data centers, as the core of information technology infrastructure, are facing unprecedented challenges. With the rapid development of artificial intelligence, big data, cloud computing, and high-performance computing, the power density per server rack is continuously increasing, rising rapidly from the traditional 5-8 kW / rack to 15-30 kW / rack, and even reaching 50-150 kW / rack in high-performance computing and AI (Artificial Intelligence) training scenarios. The heat dissipation resulting from this high power density has become a key bottleneck for the sustainable development of data centers.

[0036] Traditional air cooling systems can no longer meet the heat dissipation requirements of high-density computing environments, and have the following significant problems:

[0037] Low energy efficiency: Data center PUE (Power Usage Effectiveness) is generally above 1.4, and cooling system energy consumption accounts for about 40% of the total energy consumption;

[0038] High water consumption: Large data centers can consume millions of gallons of water annually;

[0039] Severe noise pollution: The operation of numerous fans generates high-decibel noise, affecting the working environment;

[0040] A significant heat dissipation bottleneck exists: when the power density of the equipment exceeds 15kW / rack, pure air cooling is insufficient for effective heat dissipation.

[0041] A prominent issue is uneven heat dissipation within the device, leading to excessively high temperatures in core components such as the CPU (Central Processing Unit) and GPU (Graphics Processing Unit).

[0042] Currently, there are two main liquid cooling technologies for data centers: cold plate liquid cooling and immersion liquid cooling.

[0043] Compared to traditional air cooling, liquid cooling technology can effectively reduce PUE to 1.1-1.3, reduce energy consumption by 30%-40%, and significantly reduce water consumption and noise pollution. Especially for high-density computing scenarios such as high-performance computing and AI training, liquid cooling technology has become an essential choice.

[0044] However, existing liquid cooling technologies still face many challenges in practical applications: cold plate liquid cooling typically uses water-based coolants, and heat is conducted through contact between the cold plate and the heat-generating elements. Approximately 60%-80% of the heat is removed by the cold plate liquid cooling, with the remainder still requiring air cooling. This solution achieves partial liquid cooling, but the system architecture is complex. When constructing HVAC systems for data centers, both air cooling and liquid cooling must be considered, which is not conducive to rapid deployment of data centers or responding to future changing business risks. It also lacks elastic expansion capabilities and poses a risk of leakage.

[0045] Traditional immersion liquid cooling uses a horizontal enclosure design, completely submerging the equipment in non-conductive coolant. While it can solve 100% liquid cooling heat dissipation, it consumes a large amount of coolant, makes it difficult to precisely control the flow of coolant to core heat-generating components, and has low integration with existing data center architecture, affecting operational and maintenance practices.

[0046] Currently, data center cooling technology still faces challenges in several areas, including reliability, cooling efficiency, coolant management, and integration with existing data centers. Existing liquid cooling solutions still have room for improvement in terms of reliability, efficiency, and maintainability.

[0047] The cooling system of this embodiment is a vertical immersion liquid cooling system. The system includes: a closed server cooling box, a coolant management unit, a primary side, and coolant delivery pipes. The closed server cooling box is configured to contain the server and non-conductive coolant, with the server's electronic components immersed in the coolant. The closed server cooling box and the primary side are connected to the coolant management unit via the coolant delivery pipes. The coolant management unit is configured to perform cooling management. This embodiment improves the reliability, heat dissipation performance, and integration of the data center architecture of the cooling system.

[0048] The solutions disclosed herein can be applied to, but are not limited to, immersion cooling scenarios for any enclosed device, such as, but not limited to, immersion liquid cooling scenarios for enclosed servers and energy storage batteries.

[0049] The embodiments of this disclosure will be described in detail below.

[0050] This disclosure provides a cooling system 1, which is a vertical immersion liquid cooling system, such as... Figure 1 As shown, it includes: a closed equipment cooling tank 11, a coolant management unit 12 (i.e., CDU, Coolant Distribution Unit), a primary side 13, and a coolant delivery pipeline 14;

[0051] The enclosed equipment cooling box 11 is configured to contain the equipment 2 to be cooled and the non-conductive coolant 15, and the electronic components of the equipment 2 are immersed in the coolant 15;

[0052] The enclosed equipment cooling box 11 and the primary side 13 are connected to the coolant management unit 12 via coolant delivery pipe 14;

[0053] The coolant management unit 12 is configured to perform cooling management.

[0054] In this embodiment of the disclosure, the cooling system 1 can be a vertical immersion liquid cooling system.

[0055] In this embodiment of the disclosure, the device 2 to be cooled may include, but is not limited to, a closed server and an energy storage battery.

[0056] In this embodiment, the non-conductive coolant may include, but is not limited to, hydrocarbons or fluorinated liquids. Hydrocarbons and fluorinated liquids have characteristics such as high heat dissipation performance, low viscosity, high insulation, and long-term stability. This coolant remains stable in a temperature range of -40°C to 150°C, has strong chemical inertness, and is not prone to reacting with system components.

[0057] In this embodiment of the disclosure, the cooling system 1 may further include a plurality of racks 16, each rack 16 being provided with a plurality of enclosed equipment cooling boxes 11;

[0058] The coolant delivery pipeline 14 includes a main pipeline 141 and branch pipelines 142; each branch pipeline 142 is connected to multiple enclosed equipment cooling boxes 11 within a rack 16.

[0059] In this embodiment, the coolant delivery pipeline 14 includes a supply pipeline and a return pipeline, and the main pipeline 141 and the branch pipeline 142 respectively include a supply pipeline and a return pipeline. The supply pipeline is used to supply coolant to the closed equipment cooling tank 11, and the return pipeline is used to transfer the coolant back to the coolant management unit 12.

[0060] In this embodiment of the disclosure, the plurality of racks 16 may be vertical racks.

[0061] In this embodiment, a vertical installation method using a standard 19-inch rack can be adopted, but is not limited to. The device 2 to be cooled (e.g., a server) can be installed in the rack using vertical sliding rails, and the overall structural height (e.g., 42U) is fully compatible with existing data center infrastructure. This method supports conventional cabling, pull-out maintenance, and front and rear air intake / exhaust channel design logic, allowing the data center to deploy this system without structural modifications, significantly reducing engineering modification costs and improving the system's engineering feasibility and industry applicability.

[0062] In the embodiments disclosed herein, such as Figure 2 As shown, the coolant management unit 12 includes: a variable frequency pump 121, a control unit 122, a sensor 123, a regulating component 124, and a heat exchanger 125;

[0063] The variable frequency pump 121 is configured to pump the coolant 15 into the closed equipment cooling tank 11 through the coolant delivery pipe 14.

[0064] The heat exchanger 125 is connected between the closed equipment cooling box 11 and the primary side 13 via the coolant delivery pipe 14, and is configured to dissipate heat from the coolant 15.

[0065] Sensor 123 is installed on coolant delivery pipe 14 and is configured to detect the pressure and temperature of coolant 15.

[0066] The control unit 122 is connected to the sensor 123 and the adjustment assembly 124 respectively;

[0067] The control unit 122 is configured to adjust the coolant supply and / or flow rate of the closed equipment cooling tank 11 based first on pressure and then on temperature, thereby achieving precise cooling.

[0068] In this embodiment of the disclosure, sensor 123 may include, but is not limited to, temperature sensors (such as T0, T1, T2) and pressure sensors (such as P0, P1, P2).

[0069] In this embodiment of the disclosure, the regulating component 124 may include, but is not limited to, an electric regulating valve (such as V1) and a pressure valve (or pressure relief valve, pressure relief valve, etc., which may be marked as RV).

[0070] In this embodiment of the disclosure, the coolant management unit 12 may further include: a voltage regulator 126;

[0071] The pressure stabilizing device 126 is set to stabilize the pressure value at the inlet of the variable frequency pump.

[0072] In this embodiment of the disclosure, the coolant management unit 12 integrates a mechanical device to ensure pressure stability. A pressure stabilizing device is added to the inlet of the variable frequency pump of the CDU. The pressure stabilizing device contains a bladder material that is compatible with coolant. Since liquid is incompressible, when the temperature rises, the pressure increases and the bladder expands. When the temperature drops, the pressure drops and the bladder contracts, thereby maintaining the stability of the pressure on the inlet side of the variable frequency pump.

[0073] In this embodiment of the disclosure, if the pressure is still higher than the preset value (e.g., +0.5 bar) after the above solution is implemented, the mechanical safety valve (RV) in the system will open to release some coolant in order to maintain the system pressure within a safe range.

[0074] In this embodiment of the disclosure, there are multiple devices 2; each device 2 is placed in a closed device cooling box 11.

[0075] In this embodiment of the disclosure, the enclosed equipment cooling box 11 is a sealed unit that can withstand a maximum working pressure of ({a}+1) bar.

[0076] In the embodiments disclosed herein, such as Figure 3 As shown, the device 2 placed inside the enclosed equipment cooling box 11 may include heat-generating electronic components (such as memory, power supply, CPU, GPU, etc. of servers, energy storage batteries, etc.). The enclosed equipment cooling box 11 is filled with non-conductive coolant, completely immersing the heat-generating electronic components in the coolant. Through the regulation of the CDU, the cooled coolant is sent into the enclosed equipment cooling box 11 to absorb the heat from the electronic components, and then sent back to the CDU for further cooling.

[0077] In this embodiment of the disclosure, the closed equipment cooling box 11 is provided with a liquid distribution channel inside, which is used to guide the coolant in the closed equipment cooling box 11.

[0078] In this embodiment of the disclosure, by setting a precise liquid distribution channel inside the enclosed equipment cooling box 11, it can be ensured that the coolant directly acts on the core heat-generating components such as the CPU and GPU, thereby improving the heat dissipation effect.

[0079] In the embodiments disclosed herein, such as Figure 4 As shown, the liquid supply pipe is connected to the liquid inlet on the closed equipment cooling box 11, and the liquid return pipe is connected to the liquid outlet on the closed equipment cooling box.

[0080] In this embodiment, the liquid supply pipe and the liquid return pipe are connected to the closed equipment cooling box 11 by quick-connect QC connectors, which facilitates the loading, unloading and maintenance of the product.

[0081] In this embodiment of the disclosure, a flow control valve TX (as shown in TX1 and TX2) is provided at the connection between the return pipe and the liquid outlet.

[0082] In this embodiment of the present disclosure, a regulating valve V may also be installed between each enclosed equipment cooling tank 11 and the liquid supply pipeline and the liquid return pipeline, such as... Figure 5 As shown, this allows for precise control of coolant flow, thereby achieving energy saving and accurate temperature control.

[0083] In this embodiment of the disclosure, the regulating valve may include, but is not limited to, an electric regulating valve or a mechanical temperature-sensing regulating valve.

[0084] In this embodiment of the disclosure, when the regulating valve is an electrically operated regulating valve, the coolant management unit 12 can automatically adjust the valve opening based on the comparison result between the outlet temperature Tx of each enclosed equipment cooling tank 11 and the preset temperature threshold: when the outlet temperature is higher than the preset temperature threshold, the coolant management unit 12 will increase the valve opening to increase the coolant flow rate and improve the heat exchange efficiency; when the temperature is lower than the preset temperature threshold, the valve opening will decrease to reduce the coolant flow rate, avoid overcooling, and achieve energy-saving operation of the system.

[0085] In this embodiment, when a temperature-sensing regulating valve is used, the valve mechanically and adaptively adjusts according to a preset temperature based on a built-in thermistor, eliminating the need for an external electrical control system. This method is simple in structure, responds quickly, and is suitable for scenarios where control accuracy requirements are relatively low but system reliability requirements are high.

[0086] In this embodiment of the disclosure, the above-mentioned adjustment method not only improves the system's responsiveness to load changes, but also helps to maintain the operating temperature of the core components of the device 2 within the ideal range, thereby improving the overall operational stability and extending the service life of the device 2.

[0087] In this embodiment, the coolant management unit 12 can be integrated into the rack 16 to build a compact, integrated liquid cooling solution, or it can be deployed as a standalone device outside the rack 16 and connected to multiple racks via the coolant delivery pipe 14 to achieve centralized liquid cooling management.

[0088] In this embodiment, when the coolant management unit 12 (CDU) is integrated into the rack 16, a single-rack self-circulating system is formed. The CDU integrates a coolant pump, heat exchanger, sensors, and control unit, enabling direct control of the coolant supply and return to the equipment 2 within the rack. This structure is compact, with simple wiring and convenient deployment, making it suitable for scenarios with limited space or high requirements for independent modular operation and maintenance.

[0089] In this embodiment, when the coolant management unit 12 (CDU) is independently installed outside the rack, multiple racks 16 can be connected via supply and return pipelines to provide unified coolant distribution and recovery for all racks 16. This architecture enables centralized resource scheduling, unified control of cooling capacity, and centralized maintenance management, making it suitable for large-scale deployment scenarios at the data center level. Furthermore, to ensure the independence and accuracy of temperature control across multiple racks 16, each rack 16 can still be configured with a local regulating valve V (such as an electronically controlled or temperature-sensing type), such as... Figure 6 As shown, distributed temperature control optimization is achieved.

[0090] In this embodiment of the disclosure, the flexible CDU deployment method takes into account both the integrated needs of small-scale deployments and the centralized management needs of large-scale systems, enhancing the modularity, scalability and engineering adaptability of the system, which is conducive to adapting to data centers of different sizes and architectures.

[0091] In this embodiment of the present disclosure, in order to ensure the pressure safety of the vertical immersion liquid cooling system during operation, a pressure safety valve RV is provided in the system CDU unit to automatically release pressure when the pressure rises abnormally, so as to prevent damage to system components.

[0092] In practical implementation, there are several feasible arrangements for the pressure safety valve RV:

[0093] In a typical configuration, only one main pressure relief valve may be installed. This main pressure relief valve is usually installed on the main supply or return line to protect the overall system pressure. When the system pressure exceeds the set threshold due to abnormal operation (such as coolant pump malfunction, supply blockage, or drastic changes in ambient temperature), the relief valve will automatically open to release some coolant or gas to maintain system pressure stability.

[0094] In another configuration that enhances safety, each enclosed equipment cooling box 11 can be independently equipped with a set of pressure relief valves, such as... Figure 7 As shown in the diagram. This solution is particularly suitable for system architectures with branch regulating valves: when a valve in a branch of a chassis is accidentally closed due to a control strategy or malfunction, it may cause a local pressure increase in that branch. If no independent pressure relief valve is installed, in extreme cases, it may lead to deformation inside the enclosed equipment cooling box 11, seal failure, or even equipment damage. Therefore, installing an independent pressure relief valve in each enclosed equipment cooling box 11 can effectively prevent the risks caused by abnormal local pressure and significantly improve the system's fault tolerance and operational safety.

[0095] In this embodiment of the disclosure, the above configuration not only provides a global overpressure protection mechanism, but also allows for flexible selection of local overpressure protection schemes based on deployment scale and security level requirements, thereby achieving a balance between system security and flexibility.

[0096] In the embodiments of this disclosure, the above-described vertical immersion liquid cooling system can achieve efficient management of heat in the data center.

[0097] In this embodiment of the disclosure, the coolant circulation process in the thermal management process can begin from the CDU. The CDU pumps low-temperature, non-conductive coolant through coolant delivery pipes to enclosed equipment cooling tanks in the vertical equipment rack via a variable frequency pump. Each enclosed equipment cooling tank is sealed and filled with coolant, and electronic components (such as CPUs, GPUs, and memory) are completely immersed in it.

[0098] In this embodiment of the disclosure, when the electronic components are running, the heat they generate is absorbed by the coolant in the fully submerged, enclosed equipment cooling tank, and the temperature of the coolant rises accordingly, thus achieving heat absorption.

[0099] In this embodiment of the disclosure, the high-temperature coolant is refluxed. After absorbing heat, the high-temperature coolant flows out through the liquid outlet of the closed equipment cooling tank and returns to the CDU via the coolant delivery pipeline.

[0100] In this embodiment of the disclosure, within the CDU, high-temperature coolant enters a heat exchanger, such as a plate heat exchanger. Through the plate structure, the high-temperature coolant exchanges heat with the cooling medium (typically water or refrigerant) on the primary side. The heat of the coolant is transferred to the primary side medium, causing its temperature to decrease. After absorbing heat, the primary side medium dissipates the heat to the environment through an external cooling system (such as a cooling tower or chiller unit), thereby achieving heat exchange.

[0101] In this embodiment, the cooled coolant flows out of the plate heat exchanger and the flow rate and pressure are regulated by the CDU through an electric regulating valve and a pump to ensure that it is sent back into the closed equipment cooling tank 11 at an appropriate temperature and pressure to continue circulating, thereby realizing coolant recirculation.

[0102] In this embodiment of the disclosure, through this cyclical cooling process, low-temperature coolant continuously enters the server chassis to absorb heat, while high-temperature coolant returns to the CDU to cool down, ensuring stable heat dissipation for the electronic components in the data center.

[0103] In this embodiment of the disclosure, pressure and temperature management is required throughout the entire cycle process. The pressure and temperature of the coolant are monitored and adjusted in real time to keep the operation within a safe and efficient range.

[0104] This disclosure also provides a cooling management method applied to the coolant management unit of the cooling system, such as... Figure 8 , Figure 9 As shown, it includes steps S11-S12:

[0105] Step S11: Collect the pressure value at the inlet of the variable frequency pump and determine whether the pressure value exceeds the preset pressure value upper limit;

[0106] Step S12: Determine the cooling management mode based on the judgment result.

[0107] In this embodiment of the disclosure, the CDU monitors the temperature and pressure sensors integrated in the cooling system, and uses the variable frequency pump 121 and the electric regulating valve V1 to control the temperature and pressure of the cooling system, ensuring that the cooling system operates within the normal temperature and pressure range.

[0108] In this embodiment, P_in can be used to indicate the pressure value at the inlet of the variable frequency pump, and under the cooling architecture of this embodiment, it can be used as the detection pressure value of the pressure sensor P0; P_in_max represents the maximum allowable pressure value at the inlet of the variable frequency pump, which is defaulted to {a} bar here, and ΔP represents the pressure hysteresis value.

[0109] In this embodiment of the disclosure, Tset_out can be used to indicate the set value of the return liquid temperature, and T_out can be used to indicate the actual value of the return liquid temperature. Under this cooling architecture, it can be used as the detected temperature value of the temperature sensor T0; ΔT represents the temperature hysteresis value.

[0110] In this embodiment of the disclosure, Tset_in can be used to indicate the set value of the liquid supply temperature, and T_in can be used to indicate the actual value of the liquid supply temperature. Under this cooling architecture, it can be used as the detected temperature value of temperature sensor T2; T_dp represents the ambient dew point temperature.

[0111] In this embodiment of the disclosure, the typical supply liquid temperature T_in can be controlled between 25-40°C, the return liquid temperature T_out can be controlled between 45-55°C, and the pressure is controlled within the range of {a} bar, where the range of {a} is optional, such as between 1.2 bar and 2.5 bar.

[0112] In this embodiment of the present disclosure, after the cooling system is started, the pressure value P_in at the inlet of the variable frequency pump of the cooling system is first collected, and it is determined whether it exceeds the preset pressure value upper limit P_in_max.

[0113] In this embodiment of the disclosure, the cooling management mode may include, but is not limited to, a temperature control mode and a pressure priority control mode;

[0114] The temperature control mode is maintained in response to the pressure value being lower than the upper pressure limit.

[0115] When the pressure value is greater than or equal to the pressure limit, the system enters the pressure priority control mode.

[0116] In this embodiment of the disclosure, if P_in does not exceed P_in_max, the cooling system maintains the normal temperature control mode.

[0117] In this embodiment of the disclosure, the temperature control mode may include, but is not limited to, performing the following adjustments based on a proportional-integral (PI) algorithm:

[0118] Controlling the opening of the regulating valve in the control assembly to adjust the liquid supply temperature T_set; and / or,

[0119] Control the speed of the variable frequency pump and adjust the return liquid temperature T_out.

[0120] In the embodiments disclosed herein, all the above adjustments are performed using a PI algorithm to execute closed-loop regulation, ensuring that the cooling system operates under normal conditions.

[0121] In this embodiment of the disclosure, if P_in exceeds P_in_max, the cooling system enters the pressure priority control mode.

[0122] In this embodiment of the disclosure, the pressure-priority control mode may include:

[0123] Adjust the target value of the coolant temperature downwards until the target value of the coolant temperature reaches the preset temperature limit; the coolant temperature includes: supply temperature and / or return temperature;

[0124] In response to a pressure drop below the upper pressure limit but above the preset lower pressure limit during the adjustment process, the current target value of the coolant temperature is maintained, and the system switches to temperature control mode.

[0125] In response to the pressure value consistently being greater than or equal to the pressure limit during the adjustment process, the preset variable frequency pump adjustment strategy is activated.

[0126] In this embodiment of the disclosure, the target value T_set of the liquid supply temperature is adjusted first to alleviate system pressure.

[0127] In this embodiment, the control unit can dynamically lower the target value T_set of the supply liquid temperature until it reaches the lower temperature limit, such as the minimum temperature limit T_dp + 2°C. If the system pressure recovers to the normal range (P_in ≤ P_in_max) during this process, the current T_set value is maintained, and the system switches back to the conventional temperature control mode. If the target value T_set of the supply liquid temperature has dropped to the lower temperature limit, but the pressure has not recovered, the variable frequency pump regulation strategy is activated.

[0128] In this embodiment of the disclosure, the variable frequency pump regulation strategy may include:

[0129] The pump speed control target of the variable frequency pump is switched from the coolant temperature to the pressure value at the inlet of the variable frequency pump;

[0130] Reduce pump speed;

[0131] In response to a pressure drop below the upper pressure limit but above the preset lower pressure limit during the adjustment process, the pump speed control target of the variable frequency pump is switched back to the coolant temperature.

[0132] In this embodiment of the disclosure, the pump speed control target can be switched to the pressure value at the inlet of the variable frequency pump, and the pump speed can be reduced in stages to further reduce the pressure value at the inlet of the variable frequency pump; once P_in returns to the set range, the return liquid temperature control is reactivated so that the variable frequency pump returns to the control target of T_out.

[0133] In this embodiment of the disclosure, for example, the phased reduction of pump speed may include: first reducing to a first pump speed, then after a certain period of time, reducing from the first pump speed to a second pump speed, and so on. During this process, the pressure value at the inlet of the variable frequency pump can be monitored in real time until the pressure value drops to less than the upper pressure limit but greater than the preset lower pressure limit, at which point the reduction of pump speed stops. The pump speed reduction may be the same or different each time during the reduction process.

[0134] In this embodiment of the disclosure, the method may further include:

[0135] The pressure value is maintained below the preset upper pressure limit and above the preset lower pressure limit, and the coolant temperature is below the preset upper temperature limit and above the preset lower temperature limit. The cooling management mode is maintained as temperature control mode.

[0136] In this embodiment of the disclosure, once the pressure value at the inlet of the variable frequency pump and the temperature of the coolant are both stable within the set range, the control unit can exit the pressure priority control mode and automatically return to the normal temperature control mode.

[0137] In this embodiment of the disclosure, when the heat generated by electronic components in different enclosed equipment cooling boxes 11 is different, under this architecture, the return liquid temperature Tx at the outlet of each enclosed equipment cooling box 11 can be detected. After the CDU obtains multiple return liquid temperatures Tx, it can control the return liquid temperature according to the highest return liquid temperature T.

[0138] In this embodiment, the automatic pressure control logic in the aforementioned cooling architecture is based on the following reason: liquid temperature and pressure are strongly correlated, ΔP≈β*ΔT, where ΔP is the pressure change, β is the volume expansion coefficient of the liquid, and ΔT is the temperature change. Therefore, when the on-site temperature setting is unreasonable or the pressure is higher than the preset value, the system will prioritize controlling the temperature to the dew point temperature of the computer room + x℃ (x can be 2; excessively low temperatures will cause condensation and other risks). This can be achieved by adjusting valve V1, which will switch the temperature control target of valve V1 from the supply liquid temperature to the dew point temperature + y℃ (y can be 3). Furthermore, as the variable frequency pump speed increases, the flow rate increases, and the system pressure rises. When the monitored pressure P_in is higher than the preset value, the variable frequency pump will prioritize reducing its speed to ensure the pressure remains within a reliable range.

[0139] This disclosure embodiment includes at least the following advantages:

[0140] 1. High heat dissipation efficiency: Through a fully immersion design, 100% of the heat is dissipated through liquid cooling, eliminating the need for additional air cooling.

[0141] 2. High reliability: It uses non-conductive coolant, so minor leaks will not cause system failure, and it has strong fault tolerance.

[0142] 3. Easy coolant management: It uses highly stable hydrocarbon or fluorinated fluids, which are not easily affected by environmental pollution and deterioration.

[0143] 4. Less coolant consumption: Compared with the traditional horizontal immersion design, the coolant consumption is significantly reduced, reaching 50% of that of the traditional horizontal immersion design.

[0144] 5. Good compatibility with existing data centers: Maintains the vertical installation method of servers, which conforms to the operation and maintenance habits of data centers.

[0145] 6. Precise cooling: The coolant acts directly on the core heat-generating components, improving flow rate and heat dissipation efficiency.

[0146] This disclosure also provides an electronic device 100, such as... Figure 10 As shown, it includes:

[0147] One or more processors 101;

[0148] The memory 102 stores one or more programs that, when executed by the one or more processors, cause the one or more processors 101 to implement the cooling management method.

[0149] One or more input / output (I / O) interfaces 103 are connected between the processor 101 and the memory 102 and configured to enable information interaction between the processor 101 and the memory 102.

[0150] This disclosure also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the cooling management method.

[0151] This disclosure also provides a computer program product, which includes a computer program that, when executed by a processor, implements the cooling management method.

[0152] In the embodiments disclosed herein, any of the foregoing audio processing methods are applicable to the embodiments of the electronic device, storage medium, and program product, and will not be described in detail here.

[0153] Those skilled in the art will understand that all or some of the functional modules / units disclosed above can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0154] In hardware implementations, the division between functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be executed by several physical components working together.

[0155] Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit (CPU), digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software may be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technique for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory (FLASH) or other disk storage; read-only optical disc (CD-ROM), digital versatile disc (DVD) or other optical disc storage; magnetic cartridges, magnetic tapes, disk storage or other magnetic storage; and any other media that can be used to store desired information and can be accessed by a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0156] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A cooling system, said cooling system being a vertical immersion liquid cooling system, comprising: Enclosed equipment cooling tank, coolant management unit, primary side and coolant delivery pipeline; The enclosed equipment cooling box is configured to contain the equipment to be cooled and a non-conductive coolant, with the electronic components of the equipment immersed in the coolant; The enclosed equipment cooling box and the primary side are connected to the coolant management unit via the coolant delivery pipeline; The coolant management unit is configured to perform cooling management.

2. The cooling system according to claim 1, wherein, The coolant management unit includes: a variable frequency pump, a control unit, sensors, a regulating component, and a heat exchanger; The variable frequency pump is configured to pump the coolant into the closed equipment cooling tank via the coolant delivery pipeline; The heat exchanger is connected between the closed equipment cooling tank and the primary side via the coolant delivery pipe, and is configured to dissipate heat from the coolant. The sensor is installed on the coolant delivery pipeline and is configured to detect the pressure and temperature of the coolant. The control unit is connected to both the sensor and the adjustment assembly. The control unit is configured to adjust the coolant supply and / or flow rate of the closed equipment cooling tank by controlling the regulating component, based first on the pressure and then on the temperature.

3. The cooling system according to claim 2, wherein, The coolant management unit also includes: a pressure stabilizing device; The pressure stabilizing device is configured to stabilize the pressure value at the inlet of the variable frequency pump.

4. The cooling system according to claim 1, wherein, There are multiple devices; each device is placed in a closed device cooling box.

5. The cooling system according to claim 1, wherein, The enclosed equipment cooling box is equipped with a liquid distribution channel, which is used to guide the coolant in the enclosed equipment cooling box.

6. The cooling system according to claim 1, 4 or 5 further includes multiple racks, each rack being provided with multiple of the enclosed equipment cooling boxes; The coolant delivery pipeline includes a main pipeline and branch pipelines; each branch pipeline is connected to one of the multiple enclosed equipment cooling boxes within the frame.

7. The cooling system according to claim 1, wherein, The non-conductive coolant includes hydrocarbons or fluorinated liquids.

8. A cooling management method, applied to the coolant management unit of the cooling system according to any one of claims 1-7, comprising: Collect the pressure value at the inlet of the variable frequency pump and determine whether the pressure value exceeds the preset pressure value upper limit; The cooling management mode is determined based on the assessment results.

9. The cooling management method according to claim 8, wherein, The cooling management modes include: temperature control mode and pressure priority control mode; The step of determining the cooling management mode based on the judgment result includes: The temperature control mode is maintained in response to the pressure value being less than the upper pressure limit. In response to the pressure value being greater than or equal to the pressure limit, the system enters the pressure priority control mode.

10. The cooling management method according to claim 8 or 9, wherein, The upper limit of the pressure value includes: 1.2 bar - 2.5 bar.

11. The cooling management method according to claim 9, wherein, The temperature control mode includes: performing the following adjustments based on a proportional-integral (PI) algorithm: Controlling the opening of the regulating valve in the control assembly to regulate the liquid supply temperature; and / or, Control the speed of the variable frequency pump and adjust the return liquid temperature.

12. The cooling management method according to claim 9, wherein, The pressure priority control mode includes: Adjust the target value of the coolant temperature downwards until the target value of the coolant temperature reaches the preset temperature limit value; the coolant temperature includes: supply temperature and / or return temperature; In response to the pressure value dropping to less than the upper pressure limit and greater than the preset lower pressure limit during the adjustment process, the current target value of the coolant temperature is maintained, and the temperature control mode is switched. In response to the pressure value being greater than or equal to the upper pressure limit during the adjustment process, a preset variable frequency pump adjustment strategy is activated.

13. The cooling management method according to claim 12, wherein, The variable frequency pump regulation strategy includes: The pump speed control target of the variable frequency pump is switched from the coolant temperature to the pressure value at the inlet of the variable frequency pump; Reduce the pump speed; In response to the pressure value dropping to below the upper pressure limit and above the preset lower pressure limit during the adjustment process, the pump speed control target of the variable frequency pump is switched back to the coolant temperature.

14. The cooling management method according to claim 12, wherein, The method further includes: The pressure value is maintained below the preset upper pressure limit and above the preset lower pressure limit, and the coolant temperature is below the preset upper temperature limit and above the preset lower temperature limit, thus maintaining the cooling management mode as the temperature control mode.

15. An electronic device comprising: One or more processors; A memory having stored one or more programs thereon, which, when executed by one or more processors, cause the one or more processors to implement the cooling management method according to any one of claims 8-14; One or more input / output (I / O) interfaces are connected between the processor and the memory and configured to enable information exchange between the processor and the memory.

16. A computer program product comprising a computer program that, when executed by a processor, implements the cooling management method according to any one of claims 8-14.

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