S-shaped continuous jet three-dimensional field collaborative micro-channel cold plate

Abstract

The invention belongs to the technical field of heat dissipation of electronic equipment, and discloses an S-shaped continuous jet three-dimensional field synergistic micro-channel cold plate which comprises a cold plate body and a cooling cavity, the two ends in the cooling cavity are provided with a flow dividing runner and a backflow runner, a plurality of cooling runners are arranged between the flow dividing runner and the backflow runner, and the S-shaped continuous jet three-dimensional field synergistic micro-channel cold plate is of a full-parallel-connection multi-layer array structure. Each cooling flow channel comprises a flow dividing manifold, a plurality of heat dissipation subunits correspondingly arranged below the heat source and a backflow manifold which are sequentially connected, the flow dividing manifolds communicate with the flow dividing flow channels, the backflow manifolds communicate with the backflow flow channels, and the multiple heat dissipation subunits are connected in series end to end to form a periodic continuous jet flow structure. According to the cold plate, the flow-thermal field collaborative optimization technology is used, on the premise that the flow resistance of cooling liquid and the heat dissipation capacity of the cold plate are not sacrificed, uniform distribution of the flow of the cooling liquid below each heat source and optimization of the heat dissipation area are guaranteed, efficient and uniform cooling of a high-power array chip on the cold plate is achieved, and the service life of the high-power array chip is prolonged. Finally, the heat dissipation capability of the cold plate is greatly improved.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for electronic devices, and mainly relates to an S-shaped continuous jet three-dimensional field synergistic microchannel cold plate. Background Technology

[0002] As electronic devices evolve towards higher power density, miniaturization, and integration, heat dissipation has become a core bottleneck restricting system performance, reliability, and lifespan. The heat flux density of core components in electronic devices such as 5G base stations and supercomputing servers exceeds 500 W / cm³. 2 This far exceeds the limits of traditional air cooling. With the increase in integration, the size of electronic devices is shrinking by an average of 12% per year, and the proportion of heat dissipation space is constantly decreasing. Therefore, there is an urgent need for liquid cooling solutions with higher space efficiency. At the same time, the continuous maturation of material manufacturing technology makes it possible to process flow channel structures with higher complexity and smaller feature size.

[0003] To achieve heat dissipation in high-power electronic devices, cold plates are required to be thin and lightweight while possessing excellent heat dissipation performance, low flow resistance, and strong temperature uniformity. CN112670696A discloses a liquid-cooled plate for a phased array antenna, whose internal flow channels mainly consist of a water distribution cavity, parallel flow channels, and a water collection cavity. Disorderly arranged flow-disrupting elements are fabricated within the water distribution cavity and the water collection cavity to ensure uniform flow distribution in each parallel flow channel. The parallel flow channels are designed as two layers to increase the heat exchange area, with each layer having a series structure. CN103970943A discloses a Z-shaped single-layer series flow channel cold plate for a phased array antenna, which has higher heat exchange efficiency compared to traditional flat DC channels. CN110165355B discloses a cold plate for a phased array antenna, which improves the local heat exchange capacity of the cold plate by adding micro-pillar structures inside the single-layer series-parallel flow channels.

[0004] However, the existing patents and designs mentioned above have the following problems: (1) Ordinary microchannel heat dissipation structures often adopt regular structures such as rectangular and circular channels, which result in uneven heat dissipation and insufficient heat dissipation efficiency (<250W / cm). 2 (1) Limitations such as flow resistance and heat dissipation of cold plate cannot be optimized at the same time; (2) Cold plate is mostly a planar periodic structure, which cannot achieve effective coordination between flow field and temperature field, resulting in heat dissipation bottleneck; (3) The interior of cold plate is filled with heat dissipation enhancement structures such as fins, which is not conducive to the overall weight control of cold plate; (4) Cold plate is mainly based on metal substrate machining and adopts welding and sealing molding method, which cannot meet the processing requirements of complex flow channels in high power density.

[0005] Therefore, there is an urgent need for a heat dissipation plate suitable for high-power electronic devices that can ensure uniform distribution of coolant flow and optimized heat dissipation area under each heat source without sacrificing coolant flow resistance and heat dissipation capacity, thereby significantly improving the heat dissipation performance of the heat dissipation plate. Summary of the Invention

[0006] To address the problems in the prior art, this invention first proposes an S-shaped continuous jet three-dimensional field-coordinated microchannel cold plate, suitable for heat dissipation of high-power electronic devices. This cold plate adopts a multi-stage flow channel architecture, employing a multi-manifold continuous jet flow channel structure and a contraction-expansion field coordinated flow structure using a flow-thermal field co-design method, as well as a local vortex enhancement and flow guidance structure, achieving a significant improvement in the heat dissipation performance of the cold plate without sacrificing flow resistance. At the same time, the cold plate is integrally formed using additive manufacturing technology, ensuring the processing accuracy of the flow channel and the thermal conductivity of the cold plate.

[0007] To achieve the above objectives, this device is implemented through the following technical solution: An S-shaped continuous jet three-dimensional field-coordinated microchannel cold plate includes a cold plate and a cooling cavity. The cooling cavity has a branch flow channel and a return flow channel at both ends, and multiple cooling channels are arranged in parallel multi-layer array structure between the two. Each cooling channel includes a branch manifold, multiple heat dissipation sub-units correspondingly arranged below the heat source, and a return flow manifold connected in sequence. The branch manifold is connected to the branch flow channel, and the return flow manifold is connected to the return flow channel. The multiple heat dissipation sub-units are connected in series to form a periodic continuous jet structure.

[0008] Furthermore, the heat dissipation subunit includes an upward-flowing jet manifold, a top-mounted co-expansion section, a downward-flowing drainage section, and a bottom-mounted X-shaped confluence structure connected in sequence. The jet manifold, co-expansion section, and drainage section are all dual-channel structures, and the heat dissipation subunit forms a microchannel heat dissipation structure with dual S-shaped channels.

[0009] Furthermore, the jet manifold is arranged perpendicular to the branch manifold, changing the flow direction of the coolant therein from parallel to the x-direction to perpendicular to the z-direction of the heat source surface.

[0010] Furthermore, the synergistic contraction and expansion section is set close to the surface of the heat source and adopts a contraction and expansion structure. It contracts on the side close to the heat source, causing the coolant flow direction to deviate from the x-horizontal direction, thereby enhancing the synergy between the flow field and the temperature field.

[0011] Furthermore, the area ratio of the expanding section to the contracting section of the synergistic expansion and contraction section is 0.5 to 0.75.

[0012] Furthermore, the diversion section guides the coolant flow to the bottom X-shaped confluence structure. The X-shaped structure of the bottom X-shaped confluence structure changes the flow channel from a two-dimensional xz bidirectional flow to a three-dimensional xyz tridirectional flow, and forms a local vortex at the bottom.

[0013] Furthermore, the contraction ratio of the bottom X-shaped busbar structure is 0.5 to 0.8.

[0014] Furthermore, the cold plate is provided with a coolant inlet and a coolant outlet, and its upper surface is connected to the carrier plate. Multiple heat sources are arranged on the carrier plate, and the diversion channel and return channel are respectively connected to the coolant inlet and the coolant outlet.

[0015] Furthermore, the cold plate is manufactured using additive manufacturing technology.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This invention provides an S-shaped continuous jet three-dimensional field-coordinated microchannel cold plate. Under engineering multi-boundary constraints, the cold plate adopts additive manufacturing technology to achieve high-power heat dissipation design. Using flow-thermal field co-optimization technology, the uniform distribution of coolant flow and optimization of heat dissipation area under each heat source are ensured without sacrificing coolant flow resistance and the heat dissipation capacity of the cold plate. At the same time, combined with the flow-thermal field co-optimized heat dissipation structure and jet manifold design, efficient and uniform cooling of high-power array chips on the cold plate is achieved, ultimately greatly increasing the heat dissipation capacity of the cold plate and providing technical support for improving the heat dissipation performance of subsequent high-power electronic equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the external structure of the cold plate of the present invention.

[0018] Figure 2 This is a front view (perspective) of the cold plate of the present invention.

[0019] Figure 3 This is a top view (perspective) of the cold plate of the present invention.

[0020] Figure 4 This is a schematic diagram of the cooling cavity of the present invention.

[0021] Figure 5 This is a schematic diagram of the heat dissipation subunit of the present invention.

[0022] Figure 6 This is a bottom view of the bottom X-channel structure of the present invention.

[0023] in: 1. Cold plate; 2. Cooling cavity; 3. Heat dissipation subunit; 4. Coolant inlet; 5. Coolant outlet; 6. Flow channel; 7. Return channel; 8. Flow manifold; 9. Return manifold; 10. Jet manifold; 11. Cooperative expansion and contraction section; 12. Drainage section; 13. Bottom X-shaped busbar structure; 14. Carrier plate; 15. Heat source; 16. Connector electrical interface. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this invention easier to understand, the liquid cooling architecture of this invention will be specifically described below in conjunction with embodiments and accompanying drawings.

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In the description of this invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "upper surface", "lower surface", and "horizontal" is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing this invention and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0027] The present invention will be further described below with reference to the accompanying drawings and examples.

[0028] like Figures 1-6 As shown, an S-shaped continuous jet three-dimensional field-coordinated microchannel cold plate is suitable for heat dissipation of high-power electronic devices. Its external dimensions are 15mm×13mm×7.5mm. The cold plate is manufactured using additive manufacturing (3D printing) technology and includes a cold plate 1 and a cooling cavity 2 inside it. The materials used to make the cold plate include, but are not limited to, aluminum alloys such as AlSi10Mg, AlSi7Mg, and Scalmalloy, titanium alloys such as Ti6Al4V and Ti 6242, high-temperature alloys such as Inconel 718 and Inconel 625, and stainless steels such as 304 and 316.

[0029] The cold plate 1 is provided with a coolant inlet 4 and a coolant outlet 5. Its upper surface is connected to the carrier plate 14. Multiple heat sources 15 are arranged on the carrier plate 14. The connector electrical interface 16 passes through both the cold plate 1 and the carrier plate 14. The heat from the heat sources 15 is conducted to the interior of the cold plate through the carrier plate 14, and efficient liquid cooling is achieved by the coolant in the inner cavity of the cold plate. It should be noted that the components inside the cooling cavity 2 must avoid the connector electrical interface 16.

[0030] The cooling chamber 2 has a flow channel 6 and a return flow channel 7 at both ends. Multiple cooling channels are provided between the flow channel 6 and the return flow channel 7. The flow channel 6 and the return flow channel 7 are connected to the coolant inlet 4 and the coolant outlet 5, respectively. The multiple cooling channels form a fully parallel, multi-layer, array structure. Each cooling channel includes a flow manifold 8, multiple heat dissipation sub-units 3 and a return flow manifold 9 connected in sequence. The multiple heat dissipation sub-units 3 are connected in series to form a periodic continuous jet structure.

[0031] It should be noted that the number of layers and the number of parallel connections in the fully parallel multi-layer array structure can be set according to actual needs. This embodiment takes the upper and lower double layers, with 3 cooling channels in each layer as an example for explanation.

[0032] The heat dissipation subunit 3 is located directly below each heat source 15, with dimensions of approximately 3mm × 3mm × 1.2mm. It is S-shaped and includes an upward-flowing jet manifold 10, a top co-expansion section 11, a downward-flowing guide section 12, and a bottom X-converging structure 13 connected in sequence. The jet manifold 10 at the beginning of the heat dissipation subunit 3 is connected to the branch manifold 8. The heat dissipation subunit 3 in the middle is connected end to end, that is, the bottom X-converging structure 13 at the front is connected to the jet manifold 10 at the rear, and the bottom X-converging structure 13 at the end of the heat dissipation subunit 3 is connected to the return manifold 9. The jet manifold 10, the co-expansion section 11, and the guide section 12 are all dual-channel systems. The heat dissipation subunit 3 actually forms a microchannel heat dissipation structure with dual S-shaped channels.

[0033] The jet manifold 10, positioned perpendicular to the branch manifold 8, divides the coolant in the branch manifold 8 into two parts and changes the flow direction of the coolant in the jet manifold 10 from parallel to the heat source surface to perpendicular to the heat source surface. This allows the coolant to impact the heat source surface perpendicularly, ensuring that the velocity gradient and temperature gradient are aligned, thus removing heat more quickly. Based on the flow-heat field co-optimization design, it reduces flow resistance loss, serving to both divert, turbulent, and increase the local jet velocity, while simultaneously improving heat transfer efficiency and enhancing the heat transfer effect. The co-expansion and contraction section 11, positioned close to the heat source surface, adopts an expansion and contraction structure, with the expansion section area ratio determined according to... The flow velocity is controlled between 0.5 and 0.75. The flow channel contracts on the side near the heat source to increase the local flow velocity and change the flow direction, thereby enhancing the synergy between the flow field and the temperature field (z-axis temperature gradient) and avoiding a 90° vertical angle between them. The heat transfer efficiency is improved by utilizing the synergistic effect of the flow-heat field. The guide section 12 is used to guide the fluid flow and is designed according to the flow velocity to reduce the flow dead zone. The bottom X-shaped confluence structure 13 transforms the two-dimensional xz bidirectional flow channel into a three-dimensional xyz three-axis flow channel and forms a local vortex structure at the bottom to enhance heat transfer and improve the overall heat transfer effect. The contraction ratio is 0.5 to 0.8.

[0034] It should be noted that in this embodiment, lowercase x refers to the dimension, and uppercase X refers to the bottom X confluence structure 13.

[0035] The main factors affecting the structure of the heat dissipation subunit 3 are chip temperature rise, flow distribution of the shunt and return manifold, local flow velocity of the flow channel, and global flow resistance of the coolant. The structure of the heat dissipation subunit 3 can effectively achieve flow distribution of the entire heat source array.

[0036] The cooling process of the S-shaped continuous jet three-dimensional field synergistic microchannel cold plate described above (the dashed arrows in the figure indicate the flow direction of the coolant): The coolant enters the distribution channel 6 through the coolant inlet 4 of the cold plate 1, and then enters the heat dissipation sub-unit 3 of the double S-shaped periodic microchannel through the distribution manifold 8. The four heat dissipation sub-units 3 are connected end to end to form a double S-shaped channel, and then flow to the return channel 7 through the return manifold 9. The coolant of the multiple periodic double S-shaped channels is collected and recycled here, and finally flows out of the cold plate 1 from the coolant outlet 5.

[0037] The S-shaped continuous jet three-dimensional field-coordinated microchannel cold plate described in this embodiment, under the same boundary conditions, can achieve a heat flux density of 250 W / cm² compared to the traditional serpentine cold plate. 2 Increased to over 600w / cm 2 The cooling effect is improved by more than 100%.

[0038] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A three-dimensional field-coordinated microchannel cold plate with S-shaped continuous jet, characterized in that, It includes a cold plate (1) and a cooling cavity (2). The cooling cavity (2) has a flow channel (6) and a return flow channel (7) at both ends. Multiple cooling channels are provided between the two, forming a fully parallel multi-layer array structure. Each cooling channel includes a flow manifold (8) connected in sequence, multiple heat dissipation sub-units (3) correspondingly set below the heat source (15), and a return flow manifold (9). The flow manifold (8) is connected to the flow channel (6), and the return flow manifold (9) is connected to the return flow channel (7). Multiple heat dissipation sub-units (3) are connected in series to form a periodic continuous jet structure.

2. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 1, characterized in that, The heat dissipation subunit (3) includes an upward-flowing jet manifold (10), a top-mounted co-expansion section (11), a downward-flowing drainage section (12), and a bottom-mounted X-convergence structure (13) connected in sequence. The jet manifold (10), the co-expansion section (11), and the drainage section (12) are all dual-channel structures. The heat dissipation subunit (3) forms a microchannel heat dissipation structure with dual S-shaped channels.

3. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 2, characterized in that, The jet manifold (10) is arranged perpendicular to the branch manifold (8), changing the flow direction of the coolant therein from parallel to the x-direction to the z-direction perpendicular to the heat source surface.

4. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 2, characterized in that, The co-contraction and expansion section (11) is set close to the surface of the heat source and adopts a contraction and expansion structure, which contracts on the side close to the heat source.

5. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 2, characterized in that, The area ratio of the expansion section to the contraction section of the synergistic expansion and contraction section (11) is 0.5 to 0.

75.

6. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 2, characterized in that, The diversion section (12) guides the coolant to flow to the bottom X-shaped confluence structure (13). The X-shaped structure of the bottom X-shaped confluence structure (13) changes the flow channel from two-dimensional xz bidirectional to three-dimensional xyz tridirectional, and forms a local vortex at the bottom.

7. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 2, characterized in that, The contraction ratio of the bottom X-shaped busbar structure (13) is 0.5 to 0.

8.

8. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 1, characterized in that, The cold plate (1) is provided with a coolant inlet (4) and a coolant outlet (5), and its upper surface is connected to the carrier plate (14). Multiple heat sources (15) are arranged on the carrier plate (14). The diversion channel (6) and the return channel (7) are respectively connected to the coolant inlet (4) and the coolant outlet (5).

9. The S-shaped continuous jet three-dimensional field synergistic microchannel cold plate according to claim 1, characterized in that, The cold plate is manufactured using additive manufacturing technology.

Images