Copper conductor material and preparation method thereof

Abstract

The invention belongs to the technical field of copper conductor materials, and provides a copper conductor material and a preparation method thereof.The copper conductor material is composed of, by mass, 0.1%-0.3% of Al, 0.1%-3.0% of Ni, 2.5%-4.0% of Fe, 0.5%-8.0% of Ag, 0.1%-5.0% of Cd, 0.01%-0.03% of rare earth metal elements and the balance Cu and inevitable impurities. Wherein the rare earth metal element is at least one of Nd, Ce and Pr. Through reasonable design of types and contents of component elements in the raw materials of the copper conductor material, the conductivity, heat resistance and mechanical strength of the copper conductor material are improved. Meanwhile, the preparation method is simple and easy to operate, industrial production is facilitated, and the production cost is reduced.

Description

Technical Field

[0001] This invention belongs to the field of copper conductor materials technology, specifically relating to a copper conductor material and its preparation method. Background Technology

[0002] Copper conductors are widely used in the power, communications, electronics, and construction industries as a core conductive material, due to their outstanding electrical conductivity, thermal conductivity, and mechanical properties. Copper conductors are among the most commonly used wire materials because of their high conductivity, good mechanical properties, and conductivity second only to silver, but at a lower cost. Copper conductor materials can be further subdivided into sub-sectors with excellent conductivity, such as copper wire, copper busbar, copper foil, and copper rod.

[0003] However, with the advancement of technology and the deepening of applications, higher requirements are being placed on the performance of copper conductor materials. Although copper has good electrical conductivity, its high-temperature mechanical strength is generally low. Currently, alloying and composite technologies are mainly used to address this issue. These technologies, such as solid solution strengthening, precipitation strengthening, grain refinement strengthening, and deformation strengthening, are used to strengthen the copper matrix. These techniques are relatively mature, the processes are simple, and the costs are low, making them suitable for large-scale production. However, the resulting materials have relatively low strength and conductivity, still failing to meet the performance requirements of high-tech materials. Composite methods produce copper alloys with high tensile strength, but the processes are complex and the production costs are high, hindering industrial production.

[0004] Therefore, it is of great significance to develop a copper conductor material with ideal hardness, conductivity, softening temperature, tensile strength and yield strength. Summary of the Invention

[0005] The purpose of this invention is to provide a copper conductor material and its preparation method, so as to solve the technical problem of low strength of copper conductor materials in the prior art.

[0006] The objective of this invention can be achieved through the following technical solutions: A copper conductor material, by mass percentage, is composed of the following components: Al 0.1-0.3%, Ni 0.1-3.0%, Fe 2.5-4.0%, Ag 0.5-8.0%, Cd 0.1-5.0%, rare earth metal elements 0.01-0.03%, with the balance being Cu and unavoidable impurities.

[0007] As a further embodiment of the present invention, the copper conductor material, by mass percentage, is composed of the following components: Al 0.15-0.3%, Ni 0.5-3.0%, Fe 3.0-4.0%, Ag 1.0-8.0%, Cd 0.5-4.5%, rare earth metal elements 0.02-0.03%, with the balance being Cu and unavoidable impurities.

[0008] As a further aspect of the present invention, the rare earth metal element is at least one selected from Nd, Ce, and Pr. The incorporation of rare earth metal elements can significantly improve the conductivity, mechanical properties, and corrosion resistance of copper conductor materials.

[0009] This invention also provides a method for preparing a copper conductor material, comprising the following steps: Step 1: Mix the raw materials according to the formula, and after mixing evenly, put them into the smelting furnace for smelting. After holding the mixture at the temperature until it is completely melted, refine and remove slag, let it stand to remove gas, and obtain copper molten liquid. Step 2: Cast the molten copper to obtain an ingot; Step 3: After solution treatment, hot rolling, cold rolling, aging treatment and annealing, the ingot is used to obtain copper conductor profiles. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0010] As a further aspect of the present invention, the vacuum degree in the smelting furnace in step 1 is ≤1×10⁻⁶. -3 The melting temperature is 1250-1500℃, and the melting time is 30-60min.

[0011] As a further embodiment of the present invention, the temperature of the copper melt in step 2 is 1050-1100℃.

[0012] As a further embodiment of the present invention, the solution treatment temperature in step 3 is 500-650℃, and the solution treatment time is 2-3h.

[0013] As a further aspect of the present invention, in step 3, the total deformation during hot rolling is 50-70%, and the total deformation during cold rolling is 40-50%. By combining hot rolling and cold rolling, the elongation, oxidation resistance, and conductivity of the copper conductor can be significantly improved, thereby enhancing the overall performance of the copper conductor.

[0014] As a further embodiment of the present invention, the aging treatment temperature in step 3 is 200-350℃, and the aging treatment time is 5-12h.

[0015] As a further aspect of the present invention, the annealing temperature in step 3 is 400-550℃, and the holding time is 30-60 minutes. During the annealing process, if the annealing temperature is below 400℃, the internal stress of the material may not be completely eliminated, and the grains may not be sufficiently refined. If the annealing temperature is above 550℃, the grains may grow excessively, thereby reducing the strength and ductility of the copper conductor material.

[0016] The beneficial effects of this invention are: This invention improves the conductivity, heat resistance, and mechanical strength of copper conductor materials by rationally designing the types and contents of constituent elements in the raw materials. The incorporation of aluminum promotes grain growth, increases the hardness and strength of copper, and improves its plasticity and toughness, making it easier to shape during processing. The incorporation of Ag, besides its excellent conductivity which improves the conductivity of copper-based materials, also strengthens the copper conductor material, simultaneously enhancing its strength and toughness, thus achieving better elongation properties. The incorporation of Cd significantly increases the carrier concentration in the copper material, thereby improving its conductivity.

[0017] In addition to selecting the raw materials for copper conductors, this invention also optimizes and strictly controls their processing technology. First, the copper conductor raw materials are smelted using a vacuum smelting process, ensuring no contact with air during smelting and obtaining copper materials with minimal oxygen and other gases. Simultaneously, the smelting temperature is precisely controlled to ensure a uniform distribution of alloy components, avoiding compositional deviations caused by excessively high or low temperatures. The cast ingot then undergoes solution treatment, hot rolling, cold rolling, aging treatment, and annealing. Solution treatment provides a foundation for subsequent strengthening; hot and cold rolling improve microstructure uniformity and further refine grain size; aging treatment enhances precipitation strengthening, significantly improving strength and hardness; and finally, annealing eliminates stress and improves processing performance. By strictly controlling the parameters during processing and coordinating the processes, the electrical conductivity, mechanical strength, and heat resistance of the copper conductor material are further improved.

[0018] The method for preparing a copper conductor provided by this invention is simple, easy to operate, and facilitates industrial production, thereby reducing production costs. Detailed Implementation

[0019] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1

[0021] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0022] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0023] Example 2

[0024] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.2%, Ni 1.0%, Fe 3.0%, Ag 4.0%, Cd 2.0%, Nd 0.02%, balance Cu and unavoidable impurities.

[0025] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0026] Example 3

[0027] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.28%, Ni 2.5%, Fe 4.0%, Ag 7.5%, Cd 4.8%, Nd 0.03%, balance Cu and unavoidable impurities.

[0028] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0029] Example 4

[0030] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0031] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1500℃, the melting time is 30min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas to obtain copper melt. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0032] Example 5

[0033] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0034] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1100℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0035] Example 6

[0036] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0037] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 650℃, solution treatment time is 2h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0038] Example 7

[0039] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0040] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution temperature is 500℃, solution time is 3h), hot rolling (total deformation is 65%), cold rolling (total deformation is 48%), aging treatment (aging temperature is 200℃, aging time is 12h), and annealing treatment (annealing temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0041] Example 8

[0042] This example provides a copper conductor material and its preparation method: A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0043] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 350℃, aging treatment time is 5h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0044] Example 9

[0045] A copper conductor material, by weight percentage, comprises the following components: Al 0.1%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0046] The preparation method of the copper conductor material is as follows: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1250℃, the melting time is 60min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas. Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot; Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 500℃, holding time is 40min), copper conductor profile is obtained. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

[0047] Comparative Example 1

[0048] The only difference from Example 1 is the composition of the copper conductor material: A copper conductor material, by weight percentage, comprises the following components: Al 0.07%, Ni 0.1%, Fe 2.5%, Ag 0.5%, Cd 0.1%, Nd 0.01%, balance Cu and unavoidable impurities.

[0049] Comparative Example 2

[0050] The only difference from Example 1 is the composition of the copper conductor material: A copper conductor material, by weight percentage, comprises the following components: Al 0.07%, Ni 0.05%, Fe 2.5%, Ag 0.5%, Cd 0.1%, balance Cu and unavoidable impurities.

[0051] Comparative Example 3

[0052] The only difference from Example 1 is the melting temperature and time in step 1 of the preparation method: Step 1: Mix the raw materials according to the specified ratio, and after mixing evenly, put them into the melting furnace for melting. The vacuum degree in the melting furnace should be ≤1×10⁻⁶. -3 The melting temperature is 1150℃, the melting time is 70min, and after holding at the temperature until completely melted, the copper melt is refined and slag is removed, and then allowed to stand to remove gas.

[0053] Comparative Example 4

[0054] The only difference from Example 1 is the temperature of the molten copper in step 2 of the preparation method: Step 2: Cool the molten copper to 1050℃ and cast it to obtain an ingot.

[0055] Comparative Example 5

[0056] The only difference from Example 1 is the temperature and time during the solution treatment in step 3: Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 400℃, solution treatment time is 1.5h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained.

[0057] Comparative Example 6

[0058] The only difference from Example 1 is the total deformation during hot rolling in step 3: Step 3: After the ingot undergoes solution treatment (solution treatment temperature is 500℃, solution treatment time is 3h), hot rolling treatment (total deformation of hot rolling is 40%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging treatment temperature is 200℃, aging treatment time is 12h), and annealing treatment (annealing treatment temperature is 400℃, holding time is 60min), copper conductor profile is obtained.

[0059] Comparative Example 7

[0060] The only difference from Example 1 is the total deformation amount of the cold rolling process in step 3.

[0061] Step 3: After the ingot undergoes solution treatment (solution temperature is 500℃, solution time is 3h), hot rolling (total deformation is 50%), cold rolling (total deformation is 30%), aging treatment (aging temperature is 200℃, aging time is 12h), and annealing treatment (annealing temperature is 400℃, holding time is 60min), copper conductor profile is obtained.

[0062] Comparative Example 8

[0063] The only difference from Example 1 is the temperature and time of the aging treatment in step 3: Step 3: After solution treatment (solution temperature is 500℃, solution time is 3h), hot rolling (total deformation is 50%), cold rolling (total deformation is 40%), aging treatment (aging temperature is 170℃, aging time is 4h), and annealing treatment (annealing temperature is 400℃, holding time is 60min), copper conductor profiles are obtained.

[0064] Comparative Example 9

[0065] The only difference from Example 1 is the annealing temperature and time in step 3: Step 3: After the ingot undergoes solution treatment (solution temperature is 500℃, solution time is 3h), hot rolling treatment (total deformation of hot rolling is 50%), cold rolling treatment (total deformation of cold rolling is 40%), aging treatment (aging temperature is 200℃, aging time is 12h), and annealing treatment (annealing temperature is 350℃, holding time is 65min), copper conductor profile is obtained.

[0066] Comparative Example 10

[0067] The only difference from Example 1 is the annealing temperature and time in step 3: Step 3: After the ingot undergoes solution treatment (solution temperature is 500℃, solution time is 3h), hot rolling (total deformation is 50%), cold rolling (total deformation is 40%), aging treatment (aging temperature is 200℃, aging time is 12h), and annealing treatment (annealing temperature is 650℃, holding time is 65min), copper conductor profile is obtained.

[0068] Performance tests were conducted on Examples 1-9 and Comparative Examples 1-10, with mechanical properties determined according to the methods disclosed in GB / T10623-2008 Test Method for Mechanical Properties of Metallic Materials. The test results are shown in Table 1. Table 1

[0069] As can be seen from Table 1, compared with Comparative Examples 1-10, the copper conductor materials obtained in Examples 1-9 have better mechanical properties and electrical conductivity. This shows that the selection and proportion of raw materials and the uniformity of the preparation process affect the mechanical properties and electrical conductivity of copper conductor materials.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0071] It should be understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. Some or all steps may be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation rules of this application.

[0072] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this application are available on the market or can be prepared by existing methods.

[0073] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions, and all technical features and optional technical features of this application can be combined to form new technical solutions.

[0074] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A copper conductor material, characterized in that, It consists of the following components by mass percentage: Al 0.1-0.3%, Ni 0.1-3.0%, Fe 2.5-4.0%, Ag 0.5-8.0%, Cd 0.1-5.0%, rare earth metal elements 0.01-0.03%, with the balance being Cu and unavoidable impurities.

2. The copper conductor material according to claim 1, characterized in that, The copper conductor material, by mass percentage, consists of the following components: Al 0.15-0.3%, Ni 0.5-3.0%, Fe 3.0-4.0%, Ag 1.0-8.0%, Cd 0.5-4.5%, rare earth metal elements 0.02-0.03%, with the balance being Cu and unavoidable impurities.

3. The copper conductor material according to claim 1, characterized in that, The rare earth metal element is at least one of Nd, Ce and Pr.

4. The method for preparing a copper conductor material according to claim 1, characterized in that, Includes the following steps: Step 1: Mix the raw materials according to the formula, and after mixing evenly, put them into the smelting furnace for smelting. After holding the mixture at the temperature until it is completely melted, refine and remove slag, let it stand to remove gas, and obtain copper molten liquid. Step 2: Cast the molten copper to obtain an ingot; Step 3: After solution treatment, hot rolling, cold rolling, aging treatment and annealing, the ingot is used to obtain copper conductor profiles. Step 4: After straightening, cutting and anti-corrosion treatment of the copper conductor profile, the copper conductor material is obtained.

5. The method for preparing a copper conductor material according to claim 4, characterized in that, In step 1, the vacuum degree in the smelting furnace is ≤1×10⁻⁶. -3 The melting temperature is 1250-1500℃, and the melting time is 30-60min.

6. The method for preparing a copper conductor material according to claim 4, characterized in that, In step 2, the temperature of the molten copper is 1050-1100℃.

7. The method for preparing a copper conductor material according to claim 4, characterized in that, The solution treatment temperature in step 3 is 500-650℃, and the solution treatment time is 2-3 hours.

8. The method for preparing a copper conductor material according to claim 4, characterized in that, In step 3, the total deformation during hot rolling is 50-70%, and the total deformation during cold rolling is 40-50%.

9. The method for preparing a copper conductor material according to claim 4, characterized in that, In step 3, the aging treatment temperature is 200-350℃, and the aging treatment time is 5-12h.

10. A method for preparing a copper conductor material according to claim 4, characterized in that, In step 3, the annealing temperature is 400-550℃ and the holding time is 30-60min.

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