Mask stage and deposition apparatus including the same

Abstract

The invention relates to a reticle stage and a deposition apparatus. A mask stage includes: a stage frame supporting a mask frame; a plurality of moving modules disposed on the stage frame to overlap the mask frame; and a plurality of attachment modules disposed on the stage frame to overlap the mask frame, in which the plurality of moving modules and the plurality of attachment modules are spaced apart from each other, and in which at least one of the plurality of attachment modules is disposed between the plurality of moving modules.

Description

[0001] This application claims priority to and all the benefits of Korean Patent Application No. 10-2024-0065964, filed on May 21, 2024, the contents of which are incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The present application relates to a mask stage and a deposition apparatus including the mask stage. BACKGROUND

[0003] An organic light emitting display device is a display device using a phenomenon in which an electron injected from a cathode and a hole injected from an anode recombine to form an exciton in an organic thin film and light of a specific wavelength is generated from the energy of the formed exciton.

[0004] In an organic light emitting display device, a vacuum deposition method can be used as a method of depositing an organic material or a metal used as an electrode on a substrate. The vacuum deposition method is a method in which a substrate on which an organic thin film is to be grown is arranged within a vacuum chamber, a mask assembly having the same pattern as a pattern of a thin film to be formed is closely adhered to the substrate, a deposition material such as an organic material is evaporated or sublimated by using a deposition source, and then the deposition material is deposited on the substrate.

[0005] The mask assembly used in the vacuum deposition method can be closely adhered to the substrate by being supported by a mask stage. SUMMARY

[0006] Embodiments of the present application provide a mask stage and a deposition apparatus including the mask stage, in which close adhesion between a mask assembly and a mask stage can be enhanced, and a pattern opening of the mask assembly can be aligned on a deposition area of a substrate.

[0007] Embodiments of the present application are not limited to those set forth herein. The above and other embodiments of the present application will become more fully understood from the detailed description given herein below, taken in conjunction with the accompanying drawings.

[0008] According to embodiments, a mask stage includes a stage frame supporting a mask frame, a plurality of moving modules disposed on the stage frame to overlap the mask frame, and a plurality of attachment modules disposed on the stage frame to overlap the mask frame, wherein the plurality of moving modules and the plurality of attachment modules are spaced apart from each other, and wherein at least one of the plurality of attachment modules is disposed between the plurality of moving modules.

[0009] In embodiments, the plurality of moving modules are disposed to be spaced apart from each other in one direction, wherein the plurality of attachment modules are disposed to be spaced apart from each other in one direction to be disposed between the plurality of moving modules.

[0010] In an embodiment, some of the plurality of attachment modules are disposed to be spaced apart from each other in another direction intersecting the one direction.

[0011] In an embodiment, the plurality of moving modules include a first moving module and a second moving module, and the plurality of attachment modules are disposed in a range from a position away from the first moving module by a length of about 20% of a length between the first moving module and the second moving module with respect to the first moving module to a position away from the first moving module by a length of about 80% of the length between the first moving module and the second moving module with respect to the first moving module.

[0012] In an embodiment, one of the plurality of attachment modules is disposed at a position away from the first moving module by a length of about 50% of the length between the first moving module and the second moving module with respect to the first moving module.

[0013] In an embodiment, the table frame includes a first plate, a second plate, a third plate, and a fourth plate, wherein the first plate and the third plate extend in a second direction and are disposed to be parallel to each other, and the second plate and the fourth plate extend in a first direction intersecting the second direction and are disposed to be parallel to each other.

[0014] In an embodiment, the plurality of moving modules are disposed on the first plate and the third plate in the second direction, and the plurality of attachment modules are disposed between the plurality of moving modules disposed on the first plate and between the plurality of moving modules disposed on the third plate, respectively.

[0015] In an embodiment, the plurality of moving modules are disposed on one side and the other side of the first plate and the third plate in the second direction, respectively.

[0016] In an embodiment, the plurality of attachment modules are disposed on the first plate and the third plate in the second direction.

[0017] In an embodiment, the plurality of moving modules are disposed on the second plate and the fourth plate in the first direction, the plurality of attachment modules are disposed on the second plate and the fourth plate in the first direction, and the plurality of moving modules and the plurality of attachment modules are alternately disposed.

[0018] In an embodiment, the plurality of moving modules are disposed to be spaced apart from one side and the other side of the second plate and the fourth plate in the first direction.

[0019] In an embodiment, a portion of the plurality of attachment modules is disposed on the second plate between one side of the second plate and the mobile module spaced apart from the one side of the second plate, and a portion of the plurality of attachment modules is disposed on the fourth plate between one side of the fourth plate and the mobile module spaced apart from the one side of the fourth plate, and a portion of the plurality of attachment modules is disposed on the second plate between the other side of the second plate and the mobile module spaced apart from the other side of the second plate, and a portion of the plurality of attachment modules is disposed on the fourth plate between the other side of the fourth plate and the mobile module spaced apart from the other side of the fourth plate.

[0020] In an embodiment, the mobile module moves the mask frame in upward and downward directions with respect to the stage frame, and the attachment module attaches the mask frame to the stage frame.

[0021] In an embodiment, the mobile module includes a main body embedded in the stage frame, and a moving member protruded from the main body toward an upper portion of the stage frame.

[0022] In an embodiment, the attachment module is embedded in the stage frame and is partially exposed to an upper portion of the stage frame.

[0023] In an embodiment, the attachment module is provided as a zero electromagnetic body that removes a magnetic force when power is applied and generates a magnetic force when the power is removed.

[0024] According to an embodiment, a deposition apparatus includes a chamber, a substrate support disposed within the chamber to support a substrate, a mask assembly disposed below the substrate, a mask stage to support the mask assembly, and a deposition source to emit a deposition material toward the mask assembly, wherein the mask stage includes a plurality of mobile modules overlapping the mask assembly, and a plurality of attachment modules overlapping the mask assembly, wherein at least one of the plurality of attachment modules is disposed between the plurality of mobile modules.

[0025] In an embodiment, the plurality of mobile modules is disposed to be spaced apart from each other in one direction, and the plurality of attachment modules is disposed to be spaced apart from each other in the one direction and between the plurality of mobile modules.

[0026] In an embodiment, some of the plurality of attachment modules is disposed to be spaced apart from each other in another direction intersecting the one direction.

[0027] In an embodiment, the plurality of mobile modules includes a first mobile module and a second mobile module, and the plurality of attachment modules is disposed in a range from a position away from the first mobile module by a length of about 20% of a length between the first mobile module and the second mobile module to a position away from the first mobile module by a length of about 80% of the length between the first mobile module and the second mobile module with respect to the first mobile module.

[0028] In an embodiment, one of the plurality of attachment modules is disposed at a location that is about 50% of a length between the first mobile module and the second mobile module away from the first mobile module.

[0029] In an embodiment, in a mask table and a deposition apparatus, a tight adhesion between a mask assembly and the mask table can be enhanced, and pattern openings of the mask assembly can be aligned on a deposition area of a substrate.

[0030] Effects according to embodiments are not limited to those mentioned above, and more various effects are included in the following description of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0031] The above and other aspects and features of the present application will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a schematic block diagram illustrating a deposition apparatus according to an embodiment;

[0033] Figure 2 is a perspective view of a mask assembly according to an embodiment of Figure 1 ;

[0034] Figure 3 is a perspective view of a division mask according to an embodiment of Figure 2 ;

[0035] Figure 4 is a perspective view of a mask assembly and a mask table according to an embodiment of Figure 1 ;

[0036] Figure 5 is a perspective view of a table frame of a mask table according to an embodiment of Figure 1 ;

[0037] Figure 6 is a plan view of a mask table according to an embodiment of Figure 1 ;

[0038] Figure 7 is a sectional view taken along line AA' of Figure 6 ;

[0039] Figure 8 is a sectional view taken along line BB' of Figure 6 ;

[0040] Figure 9 is a diagram illustrating an example in which attachment modules according to an embodiment of Figure 6 are disposed between mobile modules;

[0041] Figure 10is a view showing a state of a mask frame according to an embodiment; Figure 6 is a view showing another example of a state in which attachment modules are disposed between mobile modules according to an embodiment;

[0042] Figure 11 is a view showing a state in which a mask frame is moved in an upward direction of a mask stage by a mobile module of the mask stage according to an embodiment;

[0043] Figure 12 is a view showing a state in which a mask frame is attached to a stage frame by an attachment module of a mask stage according to an embodiment;

[0044] Figure 13 is a view showing a state of a mask frame according to an embodiment; Figure 11 and Figure 12 ;

[0045] Figure 14 is a partial enlarged view showing a state in which a mask assembly of a deposition apparatus is closely adhered to a substrate according to an embodiment; and

[0046] Figure 15 is a cross-sectional view schematically showing a display device manufactured using a deposition apparatus according to an embodiment. DETAILED DESCRIPTION

[0047] Advantages and features of the present application and methods for accomplishing the same will become apparent from the description of exemplary embodiments given below with reference to the accompanying drawings. However, the present application is not limited to the exemplary embodiments disclosed herein, and can be implemented in various different ways. The exemplary embodiments are provided to make the disclosure of the present application thorough and to completely convey the scope of the present application to those skilled in the art.

[0048] As used herein, the phrase "element A on element B" means that element A can be disposed directly on element B and / or element A can be disposed indirectly on element B via another element C. Identical reference numerals denote identical elements throughout the specification. The figures, dimensions, ratios, angles, numbers, and the like given in the drawings are merely illustrative and do not limit the present application.

[0049] Although terms such as first, second, and the like are used to arbitrarily distinguish between elements described by these terms, and thus the terms do not necessarily indicate spatial or other priority of such elements. The terms are used only to distinguish one element from another element. Thus, as used herein, a first element can be a second element within the technical scope of the present application.

[0050] Features of various exemplary embodiments of the present application can be partially or wholly combined. As will be clearly understood by those skilled in the art, various modifications and operations can be technically performed. Various exemplary embodiments can be implemented individually or in combination.

[0051] Hereinafter, exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0052] Figure 1 FIG. 1 is a diagram schematically showing a deposition apparatus 10 according to an embodiment.

[0053] In an embodiment and with reference to Figure 1 The deposition apparatus 10 can deposit an organic material or a metal to be used as an electrode on a substrate SUB. The deposition apparatus 10 can include a chamber 100, a substrate support 110, a deposition source 120, a mask assembly 200, and a mask stage 300.

[0054] In an embodiment, the chamber 100 can provide a space for performing a deposition process. An inside of the chamber 100 can be maintained in a vacuum state while the deposition process is performed. Maintaining the inside of the chamber 100 in the vacuum state can mean maintaining a pressure of the inside of the chamber 100 in a low pressure state. The chamber 100 can include a load-in / out port (not shown) for loading and unloading the substrate SUB. In addition, the chamber 100 can include a vacuum pump (not shown) for controlling the pressure in the chamber 100 and an exhaust port (not shown) connected to the vacuum pump for exhausting a deposition material that is not deposited on the substrate SUB.

[0055] In an embodiment, the substrate SUB on which the organic material or the metal to be used as the electrode is deposited can be provided as an insulating substrate, a semiconductor substrate, a display device substrate, etc., but is not limited thereto. In an embodiment, the substrate SUB for use in an organic light emitting display device will be described as an example. A predetermined structure can be formed on the substrate SUB by a deposition process, wherein the structure formed on the substrate SUB by the deposition process can be formed differently according to a manufacturing process of the organic light emitting display device. For example, in a process of forming a hole injection layer, a pixel defining layer and an anode electrode can be formed on the substrate SUB. In addition, in a process of forming an organic light emitting layer, not only the pixel defining layer and the anode electrode but also a hole injection layer and a hole transport layer can be formed on the substrate SUB.

[0056] In an embodiment, the substrate support 110 can support the substrate SUB, and can be disposed within the chamber 100. In an embodiment, the substrate support 110 can be disposed on an upper side within the chamber 100, and the substrate SUB can be seated on a lower portion of the substrate support 110 and supported by the substrate support 110. In addition, the substrate support 110 can include a fixing member (not shown), wherein the fixing member can assist in fixing of the substrate SUB and the mask assembly 200, and can be used to consistently maintain a distance between the substrate SUB and the mask assembly 200. The fixing member can be disposed as a detachable frame structure.

[0057] In an embodiment, the deposition source 120 can provide a deposition material to be deposited on the substrate SUB, wherein the deposition source 120 can be disposed within the chamber 100 and can be disposed to face the substrate SUB. In an exemplary embodiment, when the substrate support 110 having the substrate SUB seated thereon is disposed on an upper side within the chamber 100, the deposition source 120 can be disposed on a lower side within the chamber 100. The deposition source 120 can discharge the deposition material to the mask assembly 200.

[0058] Figure 2 is a perspective view of a mask assembly 200 according to an embodiment. Figure 1 is a perspective view of a mask assembly 200 according to an embodiment. Figure 3 is a perspective view of a division mask 220 according to an embodiment. Figure 2 is a perspective view of a division mask 220 according to an embodiment.

[0059] In an embodiment and with reference to Figure 2 and Figure 3 , the mask assembly 200 can include a mask frame 210 and a plurality of division masks 220 disposed on the mask frame 210.

[0060] In an embodiment, the mask frame 210 forms an outer frame of the mask assembly 200, and can have a quadrilateral strip shape in which the mask openings 211 are formed at a center. The mask frame 210 can have a predetermined thickness in the third direction DR3 to stably support the division masks 220, etc. The mask frame 210 can include a pair of long sides and a pair of short sides, thereby disposing the mask openings 211 at the center. For example, the pair of long sides can extend in the first direction DR1 and can be disposed in parallel to each other in the second direction DR2, and the pair of short sides can extend in the second direction DR2 and can be disposed in parallel to each other in the first direction DR1.

[0061] In an embodiment, the planar shape of the mask opening 211 can be approximately rectangular and can provide a path through which the deposition material passes. In another embodiment, the mask frame 210 can have a rectangular strip shape having the same length in two pairs of edges, and the planar shape of the mask opening 211 can be a square. The mask frame 210 can include a material having high rigidity, for example, a metal such as stainless steel.

[0062] In an embodiment, the division mask 220 can be disposed on the mask frame 210, wherein the division mask 220 can have one surface (an upper surface of the division mask 220) and another surface (a lower surface of the division mask 220). One surface of the division mask 220 can be a surface in contact with the substrate SUB during the deposition process, and the other surface of the division mask 220 can be a surface opposite to one surface of the division mask 220 and on which the deposition material is provided. The other surface of the division mask 220 can be in contact with the mask frame 210. Figure 3 Figure 3 In an embodiment, the division mask 220 can have a shape in which the length (for example, the length in the second direction DR2) is greater than the width (for example, the width in the first direction DR1). In an embodiment, the division mask 220 can extend in the second direction DR2, and can be divided into a plurality of portions disposed in the second direction DR2. In another embodiment, the division mask 220 can be a mother mask integrally formed with a planar area covering the mask opening 211. In one embodiment, the division mask 220 can be a fine metal mask made of a metal material, wherein the division mask 220 can be made of a metal such as stainless steel, nickel, cobalt, or an alloy thereof. In another embodiment, the division mask 220 can be magnetic.

[0063] In an embodiment, the division mask 220 can include a fixed portion 221 located at both ends in the second direction DR2, a plurality of pattern portions 222 located toward the center compared to the fixed portion 221, and a rib portion 223 located between the pattern portions 222.

[0064] In an embodiment, the division mask 220 can include a fixed portion 221 located at both ends in the second direction DR2, a plurality of pattern portions 222 located toward the center compared to the fixed portion 221, and a rib portion 223 located between the pattern portions 222.

[0065] ​In an embodiment, the fixed portion 221 can be a portion in contact with and coupled to the mask frame 210. For example, the fixed portion 221 can be welded and coupled to the mask frame 210. A method of welding the fixed portion 221 to the mask frame 210 is not particularly limited, but laser welding, resistance heating welding, or the like can be exemplified. The fixed portion 221 can include a welded portion WE formed by being welded to the mask frame 210. The welded portion WE can be formed as a plurality of points in an area corresponding to the fixed portion 221. In the present embodiment, the welded portion WE is shown to be disposed in a row, but is not limited thereto. In another embodiment, the welded portion WE can be disposed in a plurality of rows or more.

[0066] In an embodiment, the pattern portion 222 is a portion in which a plurality of pattern openings 224 providing a path through which a deposition material passes are formed. The plurality of pattern portions 222 can be disposed to be spaced apart from each other in the second direction DR2 in which the mask 220 is divided. In an embodiment, although three pattern portions 222 are shown to be spaced apart from each other in the second direction DR2, the present disclosure is not limited thereto. In addition, the rib portion 223 can be disposed between the pattern portions 222 disposed adjacent to each other in the second direction DR2. The rib portion 223 can serve as a marker for spacing the pattern portions 222 disposed adjacent to each other in the second direction DR2. Since the pattern opening 224 is not formed in the rib portion 223, passage of the deposition material can be shielded.

[0067] In an embodiment, the pattern portion 222 can correspond to one display device (for example, an organic light emitting display device). In this case, patterns corresponding to a plurality of display devices can be simultaneously deposited by using a single process of one mask assembly 200. In other words, the mask assembly 200 can correspond to one mother substrate, and patterns corresponding to a plurality of display devices can be simultaneously formed on the mother substrate.

[0068] In an embodiment, the pattern opening 224 can be an opening passing through one surface and the other surface of the divided mask 220. The pattern opening 224 of the divided mask 220 aligned on the substrate SUB can expose a deposition area DA of the substrate SUB (refer to FIG. 2B). Figure 14 In other words, the pattern opening 224 can have a planar shape substantially the same as a shape of a deposition pattern desired to be formed. In an embodiment, although the pattern opening 224 is shown to be arranged in a substantially matrix shape having a dot shape, spaced apart from each other in the first direction DR1 and the second direction DR2 on a plane, the present disclosure is not limited thereto. The pattern opening 224 can have a slit shape extending in the first direction DR1 or the second direction DR2 on a plane.

[0069] In an embodiment, the division mask 220 can be fixed to the mask frame 210 by performing welding in a state in which both end portions in the second direction DR2 are applied with a tensional force in the first direction DR1 or the second direction DR2. In another embodiment, the division mask 220 can be tensioned not only in the first direction DR1 but also in the second direction DR2.

[0070] In an embodiment, the gap mask 230 can be disposed between the plurality of division masks 220, in which the gap mask 230 can be disposed at a gap between the division masks 220 for blocking any passage of the deposition material between the division masks 220. The gap mask 230 can have a length (a length in the second direction DR2) identical to that of the division mask 220. The gap mask 230 can not be provided with an opening, thereby blocking the passage of the deposition material. In an embodiment, although the gap mask 230 is illustrated to be disposed, it is not limited thereto. In another embodiment, the gap mask 230 can be omitted.

[0071] Figure 4 is a perspective view illustrating a mask assembly 200 and a mask stage 300 according to an embodiment. Figure 1 is a perspective view illustrating a mask assembly 200 and a mask stage 300 according to an embodiment. Figure 5 is a perspective view illustrating a mask stage 300 according to an embodiment. Figure 1 is a perspective view illustrating a stage frame 310 of a mask stage 300 according to an embodiment. Figure 6 is a plan view of a mask stage 300 according to an embodiment. Figure 1 is a plan view of a mask stage 300 according to an embodiment. Figure 7 is a cross-sectional view taken along line AA' of Figure 6 is a cross-sectional view taken along line AA' of Figure 8 is a cross-sectional view taken along line BB' of Figure 6 is a cross-sectional view taken along line BB' of

[0072] In an embodiment and with reference to Figures 4 to 8 , the mask stage 300 can be disposed under the mask assembly 200 to support the mask assembly 200, in which the mask stage 300 can include a stage frame 310, a moving module 320, and an attachment module 330.

[0073] In an embodiment, the stage frame 310 can be disposed under the mask assembly 200 to overlap with the mask frame 210 of the mask assembly 200, thereby supporting the mask frame 210. The stage frame 310 forms an outer frame of the mask stage 300 and can have a rectangular strip shape including a stage opening 311 formed at a center thereof. The stage frame 310 can have a predetermined thickness in a third direction DR3 to stably support the mask frame 210, etc. The stage frame 310 can include a first plate 310-1, a second plate 310-2, a third plate 310-3, and a fourth plate 310-4.

[0074] In an embodiment, the first plate 310-1 and the third plate 310-3 can be provided as plates having a predetermined thickness, extending in the second direction DR2. The first plate 310-1 and the third plate 310-3 can be formed to have a thickness in the third direction DR3. The first plate 310-1 and the third plate 310-3 can be spaced apart from each other in the first direction DR1 and provided in parallel to each other, the first direction DR1 being oriented orthogonally to the second direction DR2 on the plane.

[0075] In an embodiment, the second plate 310-2 and the fourth plate 310-4 can be provided as plates having a predetermined thickness, extending in the first direction DR1, wherein the second plate 310-2 and the fourth plate 310-4 can be formed to have a thickness in the third direction DR3. The second plate 310-2 and the fourth plate 310-4 can be spaced apart from each other in the second direction DR2 and provided in parallel to each other.

[0076] In an embodiment, the first plate 310-1, the second plate 310-2, the third plate 310-3, and the fourth plate 310-4 can be connected to each other to define the stage opening 311 at the center of the stage frame 310. For example, one side of the second plate 310-2 in the first direction DR1 can be connected to one side of the first plate 310-1 in the second direction DR2, and one side of the fourth plate 310-4 in the first direction DR1 can be connected to the other side of the first plate 310-1 in the second direction DR2. In addition, the other side of the second plate 310-2 in the first direction DR1 can be connected to one side of the third plate 310-3 in the second direction DR2, and the other side of the fourth plate 310-4 in the first direction DR1 can be connected to the other side of the third plate 310-3 in the second direction DR2. In this way, the first plate 310-1, the second plate 310-2, the third plate 310-3, and the fourth plate 310-4 can be connected to each other, so that the stage opening 311 can be formed at the center of the stage frame 310. The stage opening 311 can overlap the mask opening 211 of the mask assembly 200. One side in the first direction DR1 can be the lower side of Figure 6 , the other side in the first direction DR1 can be the upper side of Figure 6 , one side in the second direction DR2 can be the left side of Figure 6 , and the other side in the second direction DR2 can be the right side of Figure 6 .

[0077] In an embodiment, the moving modules 320 can be provided on the stage frame 310 to overlap the mask frame 210. A plurality of moving modules 320 can be provided and arranged to be spaced apart from each other on the stage frame 310, wherein the moving modules 320 can move the mask frame 210 in the upward direction and the downward direction of the stage frame 310.

[0078] In an embodiment, the moving module 320 can include a body 321 and a moving member 322.

[0079] The body 321 can be provided as a plate having a substantially rectangular shape with a predetermined thickness, in which the thickness of the body 321 can be thinner than the thickness of the table frame 310. The body 321 can be disposed to be embedded in the table frame 310, and an upper portion of the body 321 can be disposed to be exposed to an upper portion of the table frame 310.

[0080] The moving member 322 can be disposed within the body 321 and can be disposed to be ejected toward an upper portion of the body 321. In other words, the moving member 322 can be disposed within the body 321 to be ejected toward an upper portion of the table frame 310. A plurality of moving members 322 can be provided to be spaced apart from each other. The moving member 322 can be in contact with a lower surface of the mask frame 210 when the mask frame 210 is supported by the table frame 310.

[0081] In an embodiment, the attachment module 330 can be disposed on the table frame 310 to overlap the mask frame 210. A plurality of attachment modules 330 can be provided and disposed on the table frame 310 to be spaced apart from each other. The attachment module 330 can attach the mask frame 210 to the table frame 310.

[0082] The attachment module 330 can be disposed to be embedded in the table frame 310 and can be disposed such that an upper portion thereof is exposed to an upper portion of the table frame 310. The attachment module 330 can be in contact with a lower surface of the mask frame 210 when the mask frame 210 is supported by the table frame 310. The attachment module 330 can be provided as a zero electromagnetic body in which a magnetic force is removed when power is applied and a magnetic force is generated when the power is removed. For example, the mask frame 210 can be separated from the attachment module 330 when power is applied to the attachment module 330, and the mask frame 210 can be attached to the attachment module 330 when the power is released from the attachment module 330.

[0083] Hereinafter, a case in which the moving module 320 and the attachment module 330 are disposed on the first plate 310-1, the second plate 310-2, the third plate 310-3, and the fourth plate 310-4 will be described according to an embodiment.

[0084] A plurality of moving modules 320 and a plurality of attachment modules 330 can be disposed on the first plate 310-1. The plurality of moving modules 320 and the plurality of attachment modules 330 can be disposed on the first plate 310-1 along the second direction DR2.

[0085] One of the plurality of moving modules 320 can be disposed on one side of the first plate 310-1 in the second direction DR2, and another moving module 320 can be disposed on the other side of the first plate 310-1 in the second direction DR2.

[0086] A plurality of attachment modules 330 can be disposed between the moving modules 320 disposed on the first plate 310-1. In other words, the plurality of attachment modules 330 can be disposed between the moving modules 320 disposed on one side of the first plate 310-1 in the second direction DR2 and the moving modules 320 disposed on the other side of the first plate 310-1 in the second direction DR2. The plurality of attachment modules 330 can be disposed on the first plate 310-1 in the second direction DR2.

[0087] When the moving modules 320 disposed on one side of the first plate 310-1 in the second direction DR2 are referred to as first moving modules 320 and the moving modules 320 disposed on the other side of the first plate 310-1 in the second direction DR2 are referred to as second moving modules 320, the plurality of attachment modules 330 can be disposed between the first moving modules 320 and the second moving modules 320 in the second direction DR2.

[0088] The plurality of attachment modules 330 can be disposed on the first plate 310-1 in a range from a position located a length of about 20% from the first moving modules 320 with respect to a length between the first moving modules 320 and the second moving modules 320 to a position located a length of about 80% from the first moving modules 320 with respect to the length between the first moving modules 320 and the second moving modules 320.

[0089] In addition, one of the plurality of attachment modules 330 can be disposed on the first plate 310-1 at a position located a length of about 50% from the first moving modules 320 with respect to the length between the first moving modules 320 and the second moving modules 320. In other words, one of the plurality of attachment modules 330 can be disposed on the first plate 310-1 at a midpoint between the first moving modules 320 and the second moving modules 320.

[0090] In an embodiment, a plurality of moving modules 320 and a plurality of attachment modules 330 can be disposed on the second plate 310-2. The plurality of moving modules 320 and the plurality of attachment modules 330 can be disposed on the second plate 310-2 in the first direction DR1. The plurality of moving modules 320 and the plurality of attachment modules 330 can be alternately disposed.

[0091] In an embodiment, one of the plurality of moving modules 320 can be disposed to be spaced apart from one side of the second plate 310-2 in the first direction DR1, and another moving module 320 can be disposed to be spaced apart from the other side of the second plate 310-2 in the first direction DR1.

[0092] In an embodiment, when the moving module 320 disposed to be spaced apart from one side of the second plate 310-2 in the first direction DR1 is referred to as a first moving module 320 and the moving module 320 disposed to be spaced apart from the other side of the second plate 310-2 in the first direction DR1 is referred to as a second moving module 320, the attachment module 330 can be disposed to be located between the first moving module 320 and the second moving module 320.

[0093] In an embodiment, the attachment module 330 can be disposed between one side of the second plate 310-2 in the first direction DR1 and the first moving module 320 and between the other side of the second plate 310-2 in the first direction DR1 and the second moving module 320.

[0094] In an embodiment, the attachment module 330 disposed to be located between the first moving module 320 and the second moving module 320 on the second plate 310-2 can be disposed on the second plate 310-2 at a position located about 50% of a length from the first moving module 320 to the second moving module 320 with respect to the length between the first moving module 320 and the second moving module 320.

[0095] In an embodiment, the attachment module 330 disposed to be located between one side of the second plate 310-2 in the first direction DR1 and the first moving module 320 on the second plate 310-2 can be disposed on the second plate 310-2 at a position located about 50% of a length from the first moving module 320 to a moving module 320 disposed on one side of the first plate 310-1 in the second direction DR2 with respect to the length between the first moving module 320 and the moving module 320 disposed on one side of the first plate 310-1 in the second direction DR2. In other words, the attachment module 330 can be disposed on the second plate 310-2 at a midpoint between the first moving module 320 and the moving module 320 disposed on one side of the first plate 310-1 in the second direction DR2.

[0096] In addition, in an embodiment, the attachment module 330 disposed to be located between the other side of the second plate 310-2 in the first direction DR1 and the second moving module 320 on the second plate 310-2 can be disposed on the second plate 310-2 at a position located about 50% of a length from the second moving module 320 to one side of the third plate 310-3 in the second direction DR2 with respect to the length between the second moving module 320 and one side of the third plate 310-3 in the second direction DR2. In other words, the attachment module 330 can be disposed on the second plate 310-2 at a midpoint between the second moving module 320 and a moving module 320 disposed on one side of the third plate 310-3 in the second direction DR2.

[0097] In an embodiment, the plurality of moving modules 320 and the plurality of attachment modules 330 can be disposed on the third plate 310-3. The plurality of moving modules 320 and the plurality of attachment modules 330 can be disposed on the third plate 310-3 in the second direction DR2.

[0098] In an embodiment, one of the plurality of moving modules 320 can be disposed on one side of the third plate 310-3 in the second direction DR2, and another moving module 320 can be disposed on the other side of the third plate 310-3 in the second direction DR2.

[0099] In an embodiment, the plurality of attachment modules 330 can be disposed between the moving modules 320 disposed on the third plate 310-3. In other words, the plurality of attachment modules 330 can be disposed between the moving modules 320 disposed on one side of the third plate 310-3 in the second direction DR2 and the moving modules 320 disposed on the other side of the third plate 310-3 in the second direction DR2. The plurality of attachment modules 330 can be disposed on the third plate 310-3 in the second direction DR2.

[0100] In an embodiment, when the moving module 320 disposed on one side of the third plate 310-3 in the second direction DR2 is referred to as a first moving module 320 and the moving module 320 disposed on the other side of the third plate 310-3 in the second direction DR2 is referred to as a second moving module 320, the plurality of attachment modules 330 can be disposed between the first moving module 320 and the second moving module 320 in the second direction DR2.

[0101] In an embodiment, the plurality of attachment modules 330 can be disposed on the third plate 310-3 in a range from a position located a length of about 20% from the first moving module 320 with respect to a length between the first moving module 320 and the second moving module 320 to a position located a length of about 80% from the first moving module 320 with respect to the length between the first moving module 320 and the second moving module 320.

[0102] Further, in an embodiment, one of the plurality of attachment modules 330 can be disposed on the third plate 310-3 at a position located a length of about 50% from the first moving module 320 with respect to a length between the first moving module 320 and the second moving module 320. In other words, one of the plurality of attachment modules 330 can be disposed on the third plate 310-3 at a midpoint between the first moving module 320 and the second moving module 320.

[0103] In an embodiment, the plurality of mobile modules 320 and the plurality of attachment modules 330 can be disposed on the fourth plate 310-4. The plurality of mobile modules 320 and the plurality of attachment modules 330 can be disposed on the fourth plate 310-4 in the first direction DR1. The plurality of mobile modules 320 and the plurality of attachment modules 330 can be alternately disposed.

[0104] In an embodiment, one of the plurality of mobile modules 320 can be disposed spaced apart from one side of the fourth plate 310-4 in the first direction DR1, and another mobile module 320 can be disposed spaced apart from the other side of the fourth plate 310-4 in the first direction DR1.

[0105] In an embodiment, when the mobile module 320 disposed spaced apart from one side of the fourth plate 310-4 in the first direction DR1 is referred to as a first mobile module 320 and the mobile module 320 disposed spaced apart from the other side of the fourth plate 310-4 in the first direction DR1 is referred to as a second mobile module 320, the attachment module 330 can be disposed between the first mobile module 320 and the second mobile module 320.

[0106] Further, in an embodiment, the attachment module 330 can be disposed between one side of the fourth plate 310-4 in the first direction DR1 and the first mobile module 320, and can be disposed between the other side of the fourth plate 310-4 in the first direction DR1 and the second mobile module 320.

[0107] In an embodiment, the attachment module 330 disposed between the first mobile module 320 and the second mobile module 320 on the fourth plate 310-4 can be disposed on the fourth plate 310-4 at a position located about 50% of a length from the first mobile module 320 away with respect to the length between the first mobile module 320 and the second mobile module 320.

[0108] In an embodiment, the attachment module 330 disposed between one side of the fourth plate 310-4 in the first direction DR1 and the first mobile module 320 on the fourth plate 310-4 can be disposed on the fourth plate 310-4 at a position located about 50% of a length from the first mobile module 320 away with respect to the length between the first mobile module 320 and the mobile module 320 disposed on the other side of the first plate 310-1 in the second direction DR2. In other words, the attachment module 330 can be disposed on the fourth plate 310-4 at a midpoint between the first mobile module 320 and the mobile module 320 disposed on the other side of the first plate 310-1 in the second direction DR2.

[0109] Also, in an embodiment, the attachment module 330 provided on the fourth plate 310-4 to be located between the fourth plate 310-4 and the second moving module 320 on the other side of the fourth plate 310-4 in the first direction DR1 can be provided on the fourth plate 310-4 at a position located at a length of about 50% from the second moving module 320 to the moving module 320 provided on the other side of the third plate 310-3 in the second direction DR2. In other words, the attachment module 330 can be provided on the fourth plate 310-4 at a midpoint between the second moving module 320 and the moving module 320 provided on the other side of the third plate 310-3 in the second direction DR2.

[0110] Figure 9 FIG. 1 is a view illustrating a deposition apparatus 10 according to an embodiment of the disclosure. Figure 6 FIG. 2 is a view illustrating an example in which attachment modules 330 are provided between moving modules 320 in FIG. 1. Figure 10 FIG. 3 is a view illustrating another example in which attachment modules 330 are provided between moving modules 320 in FIG. 1. Figure 6 FIG. 4 is a view illustrating an example in which attachment modules 330 are provided between moving modules 320 in FIG. 1.

[0111] In an embodiment and with reference to FIGS. 1 to 4, the attachment module 330 can be provided on the fourth plate 310-4 to be located between the fourth plate 310-4 and the second moving module 320 on the other side of the fourth plate 310-4 in the first direction DR1. Figure 9 and Figure 10 In an embodiment and with reference to FIGS. 1 to 4, a plurality of attachment modules 330 can be provided to be spaced apart from each other in another direction intersecting one direction on which the moving modules 320 are provided. For example, when the extension direction of the stage frame 310 is a length direction and the direction oriented in the plane orthogonally to the length direction of the stage frame 310 is a width direction, the plurality of attachment modules 330 can be provided to be spaced apart from each other in the width direction of the stage frame 310.

[0112] In an embodiment, one of the plurality of attachment modules 330 can be provided on one side (an upper side of the stage frame 310) in the width direction of the stage frame 310, and another attachment module 330 can be provided on the other side (a lower side of the stage frame 310) in the width direction of the stage frame 310. In addition, another attachment module 330 of the plurality of attachment modules 330 can be provided between the attachment module 330 provided on one side in the width direction of the stage frame 310 and the attachment module 330 provided on the other side in the width direction of the stage frame 310. In this way, when the plurality of attachment modules 330 are provided in the width direction of the stage frame 310, the mask frame 210 can be more firmly attached to the stage frame 310 at points where the attachment modules 330 are provided in the width direction. Figure 9 Figure 9 Hereinafter, the effects and advantages of the mask stage 300 and the deposition apparatus 10 including the mask stage 300 according to the disclosure will be described with reference to the accompanying drawings.

[0113]

[0114] Figure 11 ​​is a view showing a state in which the moving module 320 of the mask stage 300 moves the mask frame 210 in the upward direction of the mask stage 300 according to an embodiment. Figure 12 is a view showing a state in which the attaching module 330 of the mask stage 300 attaches the mask frame 210 to the stage frame 310 according to an embodiment. Figure 13 is a view showing a state in which the Figure 11 and Figure 12 according to an embodiment. Figure 14 is a partial enlarged view showing a state in which the mask assembly 200 of the deposition apparatus 10 according to an embodiment is closely adhered to the substrate SUB.

[0115] In an embodiment and with reference to Figure 11 The mask frame 210 disposed on the upper portion of the stage frame 310 can be moved in the upward direction of the stage frame 310 by the moving module 320. When the moving member 322 disposed within the main body 321 of the moving module 320 is ejected in the upward direction of the main body 321, the mask frame 210 can be moved in the upward direction of the stage frame 310.

[0116] In an embodiment and with reference to Figure 12 The mask frame 210 disposed on the upper portion of the stage frame 310 can be attached to the stage frame 310 by the attaching module 330. When the mask frame 210 is attached to the stage frame 310, power can not be applied to the attaching module 330.

[0117] In an embodiment and with reference to Figure 13 A portion of the mask frame 210 can be moved to the upper portion of the stage frame 310 by the moving module 320, and another portion of the mask frame 210 can be attached to the stage frame 310 by the attaching module 330.

[0118] In an embodiment and with reference to Figure 14 When a portion of the mask frame 210 is moved to the upper portion of the stage frame 310 by the moving module 320, the deposition area DA of the substrate SUB and the pattern opening 224 of the mask assembly 200 can not match each other. In this way, when the deposition area DA of the substrate SUB and the pattern opening 224 are mismatched with each other due to the moving module 320, the attaching module 330 can attach a portion of the mask frame 210 to the stage frame 310 so that the pattern opening 224 can be moved in the direction of the arrow of Figure 14 , thereby the deposition area DA of the substrate SUB and the pattern opening 224 of the mask assembly 200 can be aligned.

[0119] Figure 15 is a cross-sectional view schematically showing a display device 400 manufactured using the deposition apparatus 10 according to an embodiment.

[0120] In an embodiment and with reference to Figure 15 The barrier layer BR can be disposed on the substrate 401, which can be made of an insulating material such as a polymer resin, for example. The substrate 401 can be made of polyimide, for example. The substrate 401 can be a flexible substrate capable of withstanding bending, folding, rolling, etc.

[0121] In an embodiment, the barrier layer BR can be a layer for protecting the transistors of the thin film transistor layer TFTL and the light emitting layer 472 of the light emitting element layer EML from moisture permeation through the substrate 401, which is susceptible to moisture permeation. The barrier layer BR can be made of a plurality of inorganic layers alternately stacked. For example, the barrier layer BR can be formed of a multilayer in which one or more inorganic layers among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked.

[0122] In an embodiment, the thin film transistor TFT can be disposed on the barrier layer BR, wherein the thin film transistor TFT can include an active layer ACT and a gate electrode GE.

[0123] The active layer ACT of the thin film transistor TFT can be disposed on the barrier layer BR and can include polycrystalline silicon, single crystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor.

[0124] In an embodiment, the active layer ACT can include a channel region, a source region SE, and a drain region DE. The channel region can be a region overlapping the gate electrode GE in a third direction DR3 that is a thickness direction of the substrate 401. The source region SE can be disposed at one side of the channel region, and the drain region DE can be disposed at the other side of the channel region. The source region SE and the drain region DE can be regions not overlapping the gate electrode GE in the third direction DR3. The source region SE and the drain region DE can be regions having electrical conductivity by doping a silicon semiconductor or an oxide semiconductor with ions or impurities.

[0125] In an embodiment, a first gate insulating layer 430 can be disposed on the active layer ACT of the thin film transistor TFT. The first gate insulating layer 430 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0126] In an embodiment, the gate electrode GE and the first capacitor electrode CAE1 of the thin film transistor TFT can be disposed on the first gate insulating layer 430. The gate electrode GE can overlap the active layer ACT in the third direction DR3. Although Figure 15The gate electrode GE and the first capacitor electrode CAE1 are shown to be disposed apart from each other, but in another embodiment, the gate electrode GE and the first capacitor electrode CAE1 can be connected to each other. The gate electrode GE and the first capacitor electrode CAE1 can be formed of a single layer or multiple layers made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof.

[0127] In an embodiment, a first interlayer insulating layer 441 can be disposed on the gate electrode GE and the first capacitor electrode CAE1 of the thin film transistor TFT. The first interlayer insulating layer 441 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The first interlayer insulating layer 441 can be formed of multiple inorganic layers.

[0128] In an embodiment, a second capacitor electrode CAE2 can be disposed on the first interlayer insulating layer 441 and can overlap the first capacitor electrode CAE1 in a third direction DR3. When the first capacitor electrode CAE1 is connected to the gate electrode GE, the second capacitor electrode CAE2 can overlap the gate electrode GE in the third direction DR3. Since the first interlayer insulating layer 441 has a predetermined dielectric constant, a capacitor can be formed of the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer insulating layer 441 disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second capacitor electrode CAE2 can be formed of a single layer or multiple layers made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof.

[0129] In an embodiment, a second interlayer insulating layer 442 can be disposed on the second capacitor electrode CAE2 and can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). The second interlayer insulating layer 442 can be formed of multiple inorganic layers.

[0130] In an embodiment, a first anode connection electrode ANDE1 can be disposed on the second interlayer insulating layer 442 and can be connected to the drain region DE of the thin film transistor TFT through a first connection contact hole ANCT1 passing through the first gate insulating layer 430, the first interlayer insulating layer 441, and the second interlayer insulating layer 442. The first anode connection electrode ANDE1 can be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0131] In an embodiment, a first planarization layer 460 for planarizing a step difference due to a thin film transistor TFT can be disposed on the first anode connection electrode ANDE1. The first planarization layer 460 can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin.

[0132] In an embodiment, a second anode connection electrode ANDE2 can be disposed on the first planarization layer 460 and can be connected to the first anode connection electrode ANDE1 through a second connection contact hole ANCT2 passing through the first planarization layer 460. The second anode connection electrode ANDE2 can be formed of a single layer or a multi-layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy thereof.

[0133] In an embodiment, a second planarization layer 480 can be disposed on the second anode connection electrode ANDE2 and can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin.

[0134] In an embodiment, light emitting elements LEL and banks 490 can be disposed on the second planarization layer 480, wherein each of the light emitting elements LEL can include a pixel electrode 471, a light emitting layer 472, and a common electrode 473.

[0135] The pixel electrode 471 can be disposed on the second planarization layer 480 and can be connected to the second anode connection electrode ANDE2 through a third connection contact hole ANCT3 passing through the second planarization layer 480.

[0136] In a top emission structure that emits light in a direction of the common electrode 473 with respect to the light emitting layer 472, the pixel electrode 471 can be formed of a metal material having high reflectivity such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO / Al / ITO), an APC alloy, and a stacked structure of the APC alloy and ITO (ITO / APC / ITO). The APC alloy can be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0137] In an embodiment, the banks 490 can be formed to separate the pixel electrodes 471 on the second planarization layer 480, thereby defining a plurality of light emitting areas EA. The banks 490 can be disposed to cover edges of the pixel electrodes 471 and can be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin.

[0138] In an embodiment, each of the plurality of light emitting areas EA represents an area in which a pixel electrode 471, a light emitting layer 472, and a common electrode 473 are sequentially stacked to recombine holes from the pixel electrode 471 with electrons from the common electrode 473 in the light emitting layer 472 to thereby emit light.

[0139] In an embodiment, the light emitting layer 472 can be disposed on the pixel electrode 471 and the bank 490, and can include an organic material to emit light of a predetermined color. For example, the light emitting layer 472 includes a hole transport layer, an organic material layer, and an electron transport layer.

[0140] In an embodiment, the common electrode 473 can be disposed on the light emitting layer 472 and can be disposed to cover the light emitting layer 472. The common electrode 473 can be a common layer commonly formed in the plurality of light emitting areas EA. Additionally, a capping layer can be formed on the common electrode 473.

[0141] In an embodiment, in a top emission structure, the common electrode 473 can be formed of a transparent metal material, such as ITO and IZO, which can transmit light, or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode 473 is formed of a semi-transmissive metal material, emission efficiency can be improved by a microcavity.

[0142] In an embodiment, a spacer 491 can be disposed on the bank 490, wherein the spacer 491 can function to support the mask assembly 200 during a manufacturing process of manufacturing the light emitting layer 472. For example, the spacer 491 can support the division mask 220 of the mask assembly 200. The spacer 491 can prevent the division mask 220 from sagging, and can be formed of an organic layer, such as an acrylic resin, an epoxy resin, a phenol resin, and a polyimide resin.

[0143] In an embodiment, an encapsulation layer TFEL can be disposed on the common electrode 473, and can include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light emitting layer 472 of the light emitting element layer EML. Additionally, the encapsulation layer TFEL can include at least one organic layer to protect the light emitting element layer EML from particles, such as dust. According to various embodiments, the encapsulation layer TFEL can include an inorganic layer and an organic layer.

[0144] It should be understood that aspects and features of the embodiments of the present application are not limited to those described herein. The above-mentioned and other aspects of the present application will become more apparent by reference to the following description and accompanying drawings. Accordingly, it will be understood that the present application can be embodied in other specific embodiments without changing the technical spirit or essential characteristics of the present application. Therefore, it will be understood that the exemplary embodiments described above are illustrative, and not restrictive, in all aspects. The disclosed embodiments of the present application are used in a general and descriptive sense, and are not intended to be limiting. Each component specifically shown in the embodiments of the present application can be implemented by modification, and such modifications and differences related to the present application should be interpreted as included in the scope of the present application. Furthermore, the embodiments or parts of the embodiments can be combined in whole or in part without departing from the scope of the present application.

Claims

1. A mask stage, comprising: Platform frame, supporting mask frame; Multiple movable modules are arranged on the stage frame to overlap with the mask frame; as well as Multiple attachment modules are arranged on the stage frame to overlap with the mask frame. The plurality of mobile modules and the plurality of attachment modules are spaced apart from each other, and At least one of the plurality of attachment modules is disposed between the plurality of mobile modules.

2. The mask stage according to claim 1, wherein, The plurality of mobile modules are configured to be spaced apart from each other in one direction, and The plurality of attachment modules are configured to be spaced apart from each other in one direction, so as to be disposed between the plurality of movable modules.

3. The mask stage according to claim 2, wherein, Some of the plurality of attachment modules are configured to be spaced apart from each other in another direction that intersects with the first direction.

4. The mask stage according to claim 1, wherein, The plurality of moving modules includes a first moving module and a second moving module, and The plurality of attachment modules are positioned from a position where the first moving module is 20% of the length between the first moving module and the second moving module to a position where the first moving module is 80% of the length between the first moving module and the second moving module.

5. The mask stage according to claim 4, wherein, One of the plurality of attachment modules is positioned at a distance from the first moving module away from a length of 50% relative to the length between the first moving module and the second moving module.

6. The mask stage according to claim 1, wherein, The platform frame includes a first plate, a second plate, a third plate, and a fourth plate. Wherein, the first plate and the third plate extend in the second direction and are arranged to be parallel to each other, and The second plate and the fourth plate extend in a first direction intersecting the second direction and are configured to be parallel to each other.

7. The mask stage according to claim 6, wherein, The plurality of moving modules are disposed on the first plate and the third plate along the second direction, and The plurality of attachment modules are configured to be located between the plurality of mobile modules disposed on the first board and between the plurality of mobile modules disposed on the third board.

8. The mask stage according to claim 7, wherein, The plurality of movable modules are disposed on one side and the other side of the first plate and the third plate in the second direction.

9. The mask stage according to claim 7, wherein, The plurality of attachment modules are disposed on the first plate and the third plate along the second direction.

10. The mask stage according to claim 6, wherein, The plurality of moving modules are arranged along the first direction on the second plate and the fourth plate. The plurality of attachment modules are disposed on the second plate and the fourth plate along the first direction, and The plurality of mobile modules and the plurality of attachment modules are arranged alternately.

11. The mask stage according to claim 10, wherein, The plurality of moving modules are configured to be spaced apart from the second plate and the fourth plate on one side and the other side in the first direction.

12. The mask stage according to claim 11, wherein, A portion of the plurality of attachment modules is disposed on the second plate between one side of the second plate and the movable module spaced apart from the one side of the second plate, and a portion of the plurality of attachment modules is disposed on the fourth plate between one side of the fourth plate and the movable module spaced apart from the one side of the fourth plate. A portion of the plurality of attachment modules is disposed on the second plate between the other side of the second plate and the movable module spaced apart from the other side of the second plate, and a portion of the plurality of attachment modules is disposed on the fourth plate between the other side of the fourth plate and the movable module spaced apart from the other side of the fourth plate.

13. The mask stage according to claim 1, wherein, The moving module causes the mask frame to move relative to the stage frame in the upper and lower directions, and The attachment module attaches the mask frame to the stage frame.

14. The mask stage according to claim 13, wherein, The mobile module includes: The main body is embedded in the platform frame; and The movable component is pushed out from the main body toward the upper part of the platform frame.

15. The mask stage according to claim 13, wherein, The attachment module is embedded in the stage frame and partially exposed on the upper part of the stage frame.

16. The mask stage according to claim 15, wherein, The attachment module is provided to be a zero electromagnet that removes the magnetic force when an electric current is applied and generates the magnetic force when the electric current is removed.

17. A deposition apparatus, comprising: chamber; A substrate support is disposed within the cavity and supports the substrate; A mask assembly disposed beneath the substrate; Mask stage, supporting the mask assembly; as well as The deposition source emits deposition material into the mask assembly. The mask stage includes: Multiple moving modules overlap with the mask assembly; and Multiple attachment modules overlap with the mask assembly, wherein At least one of the plurality of attachment modules is disposed between the plurality of mobile modules.

18. The deposition apparatus according to claim 17, wherein, The plurality of mobile modules are configured to be spaced apart from each other in one direction, and The plurality of attachment modules are configured to be spaced apart from each other in one direction, so as to be disposed between the plurality of movable modules.

19. The deposition apparatus according to claim 18, wherein, Some of the plurality of attachment modules are configured to be spaced apart from each other in another direction that intersects with the first direction.

20. The deposition apparatus according to claim 17, wherein, The plurality of moving modules includes a first moving module and a second moving module, and The plurality of attachment modules are arranged within a range from a position where the first moving module is 20% away from the length between the first moving module and the second moving module to a position where the first moving module is 80% away from the length between the first moving module and the second moving module.

21. The deposition apparatus according to claim 20, wherein, One of the plurality of attachment modules is positioned at a distance from the first moving module away from a length of 50% relative to the length between the first moving module and the second moving module.

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