Attitude measuring device, measuring method, and semiconductor processing apparatus

Abstract

The application relates to the technical field of semiconductor processing, in particular to a posture measuring device, a measuring method and a semiconductor processing equipment. The device comprises a workpiece table, a reflection assembly and a vertical optical measuring system. The workpiece table at least comprises a support plate, the support plate has a first surface, and the first surface is used for carrying a workpiece. A light transmission hole penetrating through the support plate is arranged on the support plate. The reflection assembly is located on the side of the support plate close to the first surface, and the reflection assembly is used for reflecting a light beam incident to the reflection assembly. The vertical optical measuring system is located on the side of the support plate away from the first surface. Measuring light emitted by the optical measuring system passes through the support plate from bottom to top, and the reflection assembly is arranged to reflect the measuring light, so that the vertical optical measuring system does not affect the working of an objective lens of an exposure equipment. In addition, the optical measuring system is arranged below the support plate, the measuring light path can be significantly shortened, and the measuring light path is simplified, so that the integration difficulty of the whole machine is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a posture measurement device, a measurement method and a semiconductor processing equipment. BACKGROUND

[0002] Photolithography technology has been widely used in the manufacture of semiconductor precision devices. Through photolithography technology, a specific pattern can be projected on a wafer coated with photoresist. In the process of projection lithography, the projection objective lens remains stationary, and the wafer is moved to the projection objective lens by the workpiece table to complete exposure. After one exposure is completed, the workpiece table moves the wafer to the next exposure area, and this process is repeated until the entire wafer area is exposed.

[0003] In the above process, the position information of the workpiece table needs to be obtained in real time so as to control the position of the workpiece table in the exposure process through a driving mechanism. The position information of the workpiece table includes vertical position information, i.e. three degrees of freedom information of the workpiece table along the Z-axis displacement, rotation around the X-axis and rotation around the Y-axis. At present, the vertical position of the workpiece table is usually measured by a laser interference measurement system arranged above the worktable. However, the laser interference measurement system arranged above the worktable will affect the work of the projection objective lens, which may cause exposure failure. SUMMARY

[0004] The embodiment of the present application provides a posture measurement device and a semiconductor equipment, which can realize accurate measurement of the vertical posture of the workpiece table and will not affect exposure.

[0005] In a first aspect, an embodiment of the present application provides a posture measurement device, and in a possible implementation manner of the first aspect, the posture measurement device comprises: a workpiece table, the workpiece table at least comprising a support plate, the support plate having a first surface, the first surface being used for carrying a workpiece; the support plate is provided with a light transmission hole penetrating through the support plate; a reflection assembly, the reflection assembly being located on a side of the support plate close to the first surface, the reflection assembly being used for reflecting a light beam incident to the reflection assembly; a vertical optical measurement system, the vertical optical measurement system being located on a side of the support plate away from the first surface; the vertical optical measurement system is used for emitting measurement light, the measurement light being capable of being incident to the reflection assembly along a first direction through the light transmission hole, and the reflection assembly being used for reflecting the measurement light to obtain reflected light, the reflected light being capable of passing through the light transmission hole in the opposite direction of the first direction; the vertical optical measurement system is further used for receiving the reflected light, and determining a vertical posture of the workpiece table according to the measurement light and the reflected light; wherein the first direction is parallel to the thickness direction of the support plate.

[0006] The attitude measurement device provided in this application embodiment has a reflective component positioned above a support plate and a vertical optical measurement system positioned below the support plate. The measurement light emitted by the optical measurement system passes through the support plate from bottom to top, and is reflected by the reflective component, thus ensuring that the vertical optical measurement system does not interfere with the objective lens operation of the exposure equipment. Furthermore, positioning the optical measurement system below the support plate simplifies the optical path and shortens the light propagation path from the light source to the vertical optical measurement system, effectively reducing the overall integration complexity.

[0007] Furthermore, the attitude measurement device provided in this application reduces the number of 45° mirrors, avoiding the problem of excessive workpiece stage load caused by 45° mirrors, which severely affects the control accuracy of the workpiece stage. Moreover, by eliminating the 45° mirrors, the measurement optical system can be optimized, reducing errors caused by mirror surface shape and avoiding the need for more complex algorithm compensation in existing technologies. Simultaneously, by directly measuring vertical height and tilt, the measurement optical path is significantly shortened, simplifying the test optical path and effectively reducing the integration difficulty of the entire device at the application level. Furthermore, this attitude measurement device uses a vertical optical measurement system, completely decoupling horizontal and vertical measurements. When adjusting the verticality of the vertical beam, the vertical attitude of the optical measurement system can be directly adjusted, avoiding the problem that the bonding plate of the vertical reflector must be an adjustable mover design, thus improving the measurement accuracy of the entire interferometer measurement system.

[0008] Furthermore, the attitude measurement device provided in this application embodiment allows the reflective component to remain fixed as a measurement reference, while only the optical measurement system moves with the workpiece stage. By using free space as a medium, the measurement stroke is not physically limited and long-distance measurement can be performed, effectively solving the problems of insufficient measurement stroke and measurement accuracy in existing capacitive sensor vertical measurement technology.

[0009] In one possible implementation of the first aspect, the workpiece stage includes a workpiece receiving stage and a receiving stage base; the workpiece receiving stage includes a side wall and a support plate, the support plate is disposed at one end of the side wall along a first direction and the first surface faces away from the side wall, and the receiving stage base is disposed at the other end of the side wall along the first direction; the workpiece receiving stage and the receiving stage base together enclose a closed receiving space, a vertical optical measurement system is disposed within the receiving space, and the vertical optical measurement system is connected to the receiving stage base.

[0010] In one possible implementation of the first aspect, the vertical optical measurement system includes at least three sets of optical measurement subsystems, which are spaced apart on the base of the receiving platform. The optical measurement subsystems are used to emit measurement light and receive reflected light. The measurement light emitted by each set of optical measurement subsystems is reflected by a reflective component to obtain a corresponding reflected light. The optical measurement subsystems are also used to determine the distance between the measurement point and the reflective component based on the measurement light and the corresponding reflected light. The distances between the at least three sets of measurement points and the reflective component are used to determine the vertical orientation of the workpiece stage.

[0011] In one possible implementation of the first aspect, the optical measurement subsystem includes an optical measurement component and a vertical attitude adjustment base. The vertical attitude adjustment base is connected to the receiving platform base, and the optical measurement component is mounted on the vertical attitude adjustment base. The optical measurement component is used to emit measurement light and receive the reflected light corresponding to the measurement light, and to determine the distance between the measurement point and the reflecting component based on the measurement light and the reflected light corresponding to the measurement light. The vertical attitude adjustment base is used to adjust the vertical attitude of the optical measurement component relative to the reflecting component.

[0012] In one possible implementation of the first aspect, the receiving platform base includes a mounting platform; the vertical attitude adjustment base includes a fixed plate, a first yaw adjustment plate, and a first pitch adjustment plate; the fixed plate is connected to the mounting platform, and the fixed plate includes a second surface facing away from the mounting platform, the second surface being curved; the first yaw adjustment plate is connected to the fixed plate, and the first yaw adjustment plate includes a third surface facing the fixed plate and a fourth surface facing away from the fixed plate, both the third and fourth surfaces being curved, the extension directions of the third and fourth surfaces being different, and the third surface being in contact with the second surface; the first pitch adjustment plate is connected to the first yaw adjustment plate, and the first pitch adjustment plate includes a fifth surface facing the first yaw adjustment plate and a sixth surface facing away from the first yaw adjustment plate, the fifth surface being curved and in contact with the fourth surface, and the sixth surface being planar.

[0013] In one possible implementation of the first aspect, the optical measurement component includes an optical measuring instrument, a photoelectric conversion module, and a signal processing module; the optical axis of the photoelectric conversion module coincides with the optical axis of the optical measuring instrument; the optical measuring instrument is used to generate measurement light using a light beam emitted from a light source, and to generate a detection light signal based on the reflected light corresponding to the measurement light; the detection light signal can be transmitted to the photoelectric conversion module; the photoelectric conversion module is used to convert the detection light signal into an electrical signal; the signal processing module is electrically connected to the photoelectric conversion module, and the signal processing module is used to process the electrical signal to obtain the distance between the measurement point and the reflecting component.

[0014] In one possible implementation of the first aspect, the optical measuring instrument is a laser interferometer, and the optical measuring component further includes a light source collimation module; the light source collimation module and the laser interferometer are respectively disposed on opposite sides of the photoelectric conversion module, and the signal processing module is disposed on the side of the light source collimation module away from the photoelectric conversion module; the light source collimation module is used to generate a parallel beam, which can pass through the photoelectric conversion module and enter the laser interferometer; the optical axis of the light source collimation module, the optical axis of the photoelectric conversion module, and the optical axis of the laser interferometer are coaxial, and the optical axis of the laser interferometer passes through a light-transmitting aperture.

[0015] In one possible implementation of the first aspect, the optical measuring instrument is a laser interferometer, and the optical measuring system further includes a light source collimation module. The optical measuring components also include a beam guiding mirror group and a coupling component. The light source collimation module is sequentially connected to at least three beam guiding mirror groups, and the optical axis of the light source collimation module coincides with the optical axis of the at least three beam guiding mirror groups. At least three laser interferometers correspond to a beam guiding mirror group, and the beam guiding mirror group is used to transmit the parallel beam generated by the light source collimation module to the laser interferometer. Each laser interferometer is connected to a coupling component. The photoelectric conversion module is connected to the coupling component through an optical fiber, and the coupling component is used to transmit the interference signal to the photoelectric conversion module through the optical fiber. The photoelectric conversion module is electrically connected to the signal processing module.

[0016] In one possible implementation of the first aspect, the optical measurement subsystem further includes a collimation adjustment base and at least three mirror group adjustment bases; the at least three mirror group adjustment bases are disposed on a receiving platform base, and each beam guiding mirror group is disposed on one mirror group adjustment base; the collimation adjustment base includes a second yaw adjustment plate and a second pitch adjustment plate; the second yaw adjustment plate is connected to the receiving platform base, and the second yaw adjustment plate includes an eighth surface and a ninth surface facing each other, the eighth surface facing the receiving platform base and being planar, and the ninth surface facing away from the receiving platform base and being curved; the second pitch adjustment plate is connected to the second yaw adjustment plate, and the second pitch adjustment plate includes a tenth surface facing the second yaw adjustment plate and an eleventh surface facing away from the second yaw adjustment plate, the tenth surface being curved and fitting with the ninth surface, and the eleventh surface being planar.

[0017] In one possible implementation of the first aspect, the second yaw adjustment plate further includes a first side surface, and the second pitch adjustment plate further includes a second side surface, with the first side surface and the second side surface fitting together.

[0018] In one possible implementation of the first aspect, the reflective component includes a fixed structure and a reflector, the fixed structure including a seventh surface facing the first surface, the reflector being disposed on the seventh surface, and the reflecting surface of the reflector facing the first surface.

[0019] In one possible implementation of the first aspect, the fixing structure is provided with a clearance hole that penetrates the fixing structure, the clearance hole being used to provide clearance space for the assembly of the reflector.

[0020] In one possible implementation of the first aspect, the optical measuring instrument is a spectral confocal lens, and at least three sets of spectral confocal lenses have the same depth of field; the optical measuring assembly also includes a light source collimation module and a coupling assembly; the coupling assembly and the spectral confocal lens are respectively disposed on opposite sides of the light source collimation module, and the coupling assembly is connected to the photoelectric conversion module via an optical fiber; the light source collimation module is used to generate a parallel beam of light, which can enter the spectral confocal lens, and the coupling assembly is used to couple the reflected light emitted from the spectral confocal lens into the optical fiber for transmission to the photoelectric conversion module; the optical axis of the coupling assembly, the optical axis of the light source collimation module, and the optical axis of the spectral confocal lens are coaxial.

[0021] In one possible implementation of the first aspect, the reflective component includes a fixed structure comprising a seventh surface facing the first surface, the seventh surface being used to reflect the measurement light emitted by the optical measurement subsystem, the seventh surface being within the depth of field of at least three sets of spectral confocal lenses.

[0022] In one possible implementation of the first aspect, the vertical optical measurement system includes four sets of optical measurement subsystems, wherein the distance between the measurement point and the reflective component measured by any set of optical measurement subsystems is used to determine the system error; the system error is used to correct the distance between the measurement point and the reflective component measured by the remaining three sets of optical measurement subsystems; and the corrected distance between the measurement point and the reflective component is used to determine the vertical orientation of the workpiece stage.

[0023] In one possible implementation of the first aspect, the attitude measuring device further includes a horizontal measuring system for measuring the horizontal attitude of the workpiece stage.

[0024] Secondly, embodiments of this application provide a measurement method, the method comprising: controlling a vertical optical measurement system to emit measurement light, the measurement light being able to pass through a light-transmitting hole in a workpiece stage along a first direction and be incident on a reflective component; the workpiece stage includes at least a support plate, the support plate having a first surface for supporting a workpiece; the light-transmitting hole penetrating the support plate; the reflective component being located on the side of the support plate near the first surface, the reflective component being used to reflect the light beam incident on the reflective component; wherein, the first direction is parallel to the thickness direction of the support plate; the vertical optical measurement system receiving reflected light obtained by the reflective component reflecting the measurement light; the reflected light being able to pass through the light-transmitting hole in the opposite direction of the first direction; the vertical optical measurement system determining the vertical orientation of the workpiece stage based on the measurement light and the reflected light.

[0025] In one possible implementation of the second aspect, the vertical optical measurement system includes at least three sets of optical measurement subsystems, which are used to emit measurement light and receive reflected light; wherein the measurement light emitted by each set of optical measurement subsystems is reflected by a reflective component to obtain a corresponding reflected light; the vertical orientation of the workpiece stage is determined based on the measurement light and the reflected light by the vertical optical measurement system, including: determining the distance between the measurement point of each set of optical measurement subsystems and the reflective component based on the measurement light and the corresponding reflected light by each set of optical measurement subsystems; and determining the vertical orientation of the workpiece stage based on the distance between each measurement point and the reflective component.

[0026] In one possible implementation of the second aspect, the vertical orientation of the workpiece stage includes the angle of deviation of the measuring surface relative to the second direction and the angle of deviation of the measuring surface relative to the third direction. The measuring surface is a plane defined by measuring points of at least three sets of optical measuring subsystems, and the first direction, the second direction, and the third direction are perpendicular to each other. The at least three measuring points include a first measuring point, a second measuring point, and a third measuring point. Determining the vertical orientation of the workpiece stage based on the distance between each measuring point and the reflecting component includes: determining the angle of deviation of the measuring surface relative to the second direction based on the distance between the first and second measuring points and the distances of the first and second measuring points respectively to the reflecting component; and determining the angle of deviation of the measuring surface relative to the third direction based on the distance between the third measuring point and the reflecting component and the initial distance between the third measuring point and the reflecting component.

[0027] Thirdly, embodiments of this application provide a semiconductor processing apparatus, which includes the attitude measurement device provided in the first aspect. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an attitude measurement device provided in an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the structure of a horizontal actuator provided in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the structure of a vertical actuator provided in an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the structure of a buffer clip provided in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the structure of a receiving platform base provided in an embodiment of this application;

[0033] Figure 6 A schematic diagram of the structure of a workpiece receiving platform provided in an embodiment of this application;

[0034] Figure 7A A schematic diagram of a vertical optical measurement system provided in an embodiment of this application;

[0035] Figure 7B A schematic diagram of another vertical optical measurement system provided in this application embodiment;

[0036] Figure 8 This is a schematic diagram of the structure of an optical measurement subsystem provided in an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of the structure of a vertical attitude adjustment base provided in an embodiment of this application;

[0038] Figure 10 This is a schematic diagram of the structure of a fixing plate provided in an embodiment of this application;

[0039] Figure 11 This is a schematic diagram of the structure of a first yaw adjustment plate provided in an embodiment of this application;

[0040] Figure 12 This is a schematic diagram of the structure of a first pitch adjustment plate provided in an embodiment of this application;

[0041] Figure 13 This is a schematic diagram of the structure of an optical filtering module provided in an embodiment of this application;

[0042] Figure 14 This is a schematic diagram of the structure of an optical measuring instrument according to an embodiment of this application;

[0043] Figure 15 This is a schematic diagram of the structure of a reflective component according to an embodiment of this application;

[0044] Figure 16A A schematic diagram of a measuring surface and a reference surface provided for an embodiment of this application;

[0045] Figure 16B A schematic diagram of a spatial rectangular coordinate system established in the initial state, provided for an embodiment of this application;

[0046] Figure 16C A schematic diagram of the vertical orientation of the measuring surface of a workpiece stage in a first state, provided as an embodiment of this application;

[0047] Figure 16D A schematic diagram illustrating the angle of a measuring surface relative to the X and Y axes, provided for an embodiment of this application;

[0048] Figure 17 This is a schematic diagram of another attitude measurement device provided in an embodiment of this application;

[0049] Figure 18AA schematic diagram of another vertical optical measurement system provided in this application embodiment;

[0050] Figure 18B A schematic diagram of another vertical optical measurement system provided in this application embodiment;

[0051] Figure 19 A schematic diagram of another optical measurement subsystem provided in an embodiment of this application;

[0052] Figure 20 This is a schematic diagram of the structure of a spectral confocal lens provided in an embodiment of this application;

[0053] Figure 21 This is a schematic diagram of another reflective component provided in an embodiment of this application;

[0054] Figure 22 This is a schematic diagram of the structure of another attitude measurement device provided in the embodiments of this application;

[0055] Figure 23 This is a schematic diagram of another receiving platform base provided in an embodiment of this application;

[0056] Figure 24 This is a schematic diagram of the structure of a second yaw adjustment plate provided in an embodiment of this application;

[0057] Figure 25 This is a schematic diagram of the structure of a second pitch adjustment plate provided in an embodiment of this application;

[0058] Figure 26A A schematic diagram of the structure of another vertical optical measurement system provided in the embodiments of this application;

[0059] Figure 26B A schematic diagram of the structure of another vertical optical measurement system provided in the embodiments of this application;

[0060] Figure 27 This is a schematic diagram of the structure of another optical measurement subsystem according to an embodiment of this application;

[0061] Figure 28 This is a schematic diagram of the structure of another optical measuring instrument according to an embodiment of this application;

[0062] Figure 29 This is a schematic diagram of the structure of a horizontal measurement system provided in an embodiment of this application;

[0063] Figure 30 This is a flowchart of a vertical attitude measurement method provided in an embodiment of this application.

[0064] Explanation of reference numerals in the attached figures:

[0065] 1-Workpiece stage;

[0066] 11-Vertical actuator; 111-Guide surface; 112-Third mounting hole; 113-Fourth mounting hole;

[0067] 12-Horizontal actuator; 12a-Horizontal moving part; 121-Sliding guide rail; 122-Mounting base; 123-Second mounting hole; 124-First mounting hole;

[0068] 13-Workpiece receiving platform; 131-Accommodation space; 132-Light transmission hole; 133-Ninth mounting hole; 134-Support plate; 135-Side wall;

[0069] 14-Receiving platform base; 141-Sixth mounting hole; 142-Mounting platform; 143-Eighth mounting hole; 144-Seventh mounting hole; 145-Collimation module fixing platform; 146-Mirror assembly fixing platform; 147-Tenth mounting hole; 148-Eleventh mounting hole;

[0070] 15-Buffer clip; 151-Guide through hole; 152-Fifth mounting hole;

[0071] 2-Vertical optical measurement system;

[0072] 21-Optical Measurement Subsystem; 210-Light Source; 2101-Fiber Optic Fiber; 211-Signal Processing Module; 212-Photoelectric Conversion Module; 213-Light Source Collimation Module; 2130-Collimation Adjustment Base; 2131-Second Yaw Adjustment Plate; 21311-Eighth Surface; 21312-Ninth Surface; 21313-Fourth Oval Through Hole; 21314-Fourth Threaded Hole; 21315-First Side Surface; 2132-Second Pitch Adjustment Plate; 21321-Tenth Surface; 213 22-Eleventh surface; 21323-Fifth oblong through hole; 21324-Fifth threaded hole; 21325-Second side surface; 214-Laser interferometer; 2141-First beam splitter; 2142-Third focusing lens; 2143-First plane mirror; 2144-First pyramidal mirror; 2145-Second pyramidal mirror; 2146-Slide; 2147-Second plane mirror; 2148-Second beam splitter; 215-Vertical attitude adjustment base; 21 51-Fixed plate; 21511-First threaded hole; 21512-First oblong through hole; 21513-Second surface; 2152-First yaw adjustment plate; 21521-Third surface; 21522-Fourth surface; 21523-Second oblong through hole; 21523a-Outer second oblong through hole; 21523b-Inner second oblong through hole; 21524-Second threaded hole; 2153-First pitch adjustment plate; 21531-Fifth surface; 21532-Third oblong through hole Hole; 21532a - Outer third oblong through hole; 21532b - Inner third oblong through hole; 21533 - Third threaded hole; 21534 - Sixth surface; 216 - Optical filter module; 2161 - First focusing lens; 2162 - Pinhole aperture; 2163 - Second focusing lens; 217 - Coupling assembly; 218 - Beam guide mirror group; 2180 - Mirror group adjustment base; 219 - Spectral confocal lens; 2191 - Third plane mirror; 2192 - Fourth focusing lens;

[0073] 22-Measuring surface;

[0074] 3-Reflective assembly; 31-Fixing structure; 311-Boss; 312-Allowing hole; 313-Seventh surface; 32-Reflector; 33-Reference surface;

[0075] 4-Horizontal measurement system; 41-Secondary direction measurement system; 42-Third direction measurement system. Detailed Implementation

[0076] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many exemplary details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0077] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0078] The following explains the terminology that may appear in the embodiments of this application.

[0079] In the description of the embodiments of this application, "and / or" is merely a way of describing the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects before and after are in an "or" relationship. When there are multiple associated objects, it can represent choosing one, choosing two, or choosing all.

[0080] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0081] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0082] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0083] During wafer exposure, it is necessary to obtain the six-DOF position information of the workpiece stage (X, Y, Rz, Z, Rx, Ry) in real time so that the motion system can control the stage's position during scanning. The vertical positions Z, Rx, and Ry are typically measured using a laser interferometry system positioned above the stage. However, placing the laser interferometry system above the stage can interfere with the projection lens's operation, potentially leading to exposure failure. For example, the laser interferometry system occupies the objective lens's mounting space, and if both are mounted on the same side, they can interfere with each other's accuracy.

[0084] Currently, some solutions employ a 45-degree reflector and a rectangular plane mirror, respectively, on the workpiece stage and the main frame. The horizontal measurement light from the laser interferometer is reflected by the 45-degree mirror to the rectangular plane mirror on the main frame, and then reflected back along the original optical path to complete the measurement of vertical height and tilt. However, at the application level, this solution not only incurs huge design costs and increases the load on the workpiece stage, but also makes assembly and adjustment inconvenient during integration. Furthermore, it inevitably introduces a large number of measurement errors, ultimately limiting the overall accuracy of the machine.

[0085] In addition, some solutions involve installing several capacitive sensors on top of the projection lens. These sensors measure the distance between the metal plate on top of the workpiece stage and the top of the projection lens, thus determining the height and tilt of the workpiece stage. However, both of these vertical positions have limitations, and these solutions cannot meet the measurement requirements for non-metallic workpiece stages. This demonstrates a significant inherent flaw in the capacitive sensor measurement method.

[0086] In view of this, embodiments of this application provide an attitude measurement device, which may include a workpiece stage, a reflective assembly, and a vertical optical measurement system. The workpiece stage includes at least a support plate having a first surface for supporting a workpiece. A light-transmitting hole is provided on the support plate. The reflective assembly is located on the side of the support plate near the first surface and is used to reflect incident light beams. The vertical optical measurement system is located on the side of the support plate opposite to the first surface. The vertical optical measurement system emits measurement light that can pass through the light-transmitting hole along a first direction and be incident on the reflective assembly, and then reflected by the reflective assembly to obtain reflected light. The reflected light can pass through the light-transmitting hole in the opposite direction of the first direction, which is parallel to the thickness direction of the support plate. The vertical optical measurement system also receives the reflected light and determines the vertical attitude of the workpiece stage based on the measurement light and the reflected light.

[0087] It is understandable that the reflective component is positioned above the support plate, while the vertical optical measurement system is positioned below it. The measurement light emitted by the optical measurement system passes through the support plate from bottom to top, and is reflected by the reflective component, thus ensuring that the vertical optical measurement system does not interfere with the objective lens operation of the exposure equipment. Furthermore, positioning the optical measurement system below the support plate simplifies the optical path, shortening the light propagation path from the light source to the vertical optical measurement system, thereby effectively reducing the overall integration complexity of the system.

[0088] Furthermore, the attitude measurement device provided in this application reduces the number of 45° mirrors, avoiding the problem of excessive workpiece stage load caused by 45° mirrors, which severely affects the control accuracy of the workpiece stage. Moreover, by eliminating the 45° mirrors, the measurement optical system can be optimized, reducing errors caused by mirror surface shape and avoiding the need for more complex algorithm compensation in existing technologies. Simultaneously, by directly measuring vertical height and tilt, the measurement optical path is significantly shortened, simplifying the test optical path and effectively reducing the integration difficulty of the entire device at the application level. Furthermore, this attitude measurement device uses a vertical optical measurement system, completely decoupling horizontal and vertical measurements. When adjusting the verticality of the vertical beam, the vertical attitude of the optical measurement system can be directly adjusted, avoiding the problem that the bonding plate of the vertical reflector must be an adjustable mover design, thus improving the measurement accuracy of the entire interferometer measurement system.

[0089] Furthermore, the attitude measurement device provided in this application embodiment allows the reflective component to remain fixed as a measurement reference, while only the optical measurement system moves with the workpiece stage. By using free space as a medium, the measurement stroke is not physically limited and long-distance measurement can be performed, effectively solving the problems of insufficient measurement stroke and measurement accuracy in existing capacitive sensor vertical measurement technology.

[0090] Figure 1This is a schematic diagram of the structure of an attitude measurement device provided in an embodiment of this application, with reference to... Figure 1 As shown, the attitude measurement device includes a workpiece stage 1, a vertical optical measurement system 2, and a reflection component 3.

[0091] For ease of explanation, in the following description, the length direction of the fixed structure in the attitude measurement device is defined as the X-axis direction, the width direction of the fixed structure is defined as the Y-axis direction, and the thickness direction of the fixed structure is defined as the Z-axis direction. The X-axis, Y-axis and Z-axis directions can be perpendicular to each other.

[0092] In workpiece stage 1, the Z-axis direction can be vertical or nearly vertical; for example, the angle between the Z-axis and the vertical direction is 0° to 15°. The positive Z-axis direction can be upward, and the negative Z-axis direction can be downward. The XY plane can be horizontal or nearly horizontal; for example, the angle between the XY plane and the vertical direction is 0° to 15°.

[0093] It is understood that the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors, such as an angle of 89° between two structural features, is also within the scope of mutual perpendicularity in this application. Similarly, the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors, such as an angle of 1° between two structural features, is also within the scope of mutual parallelism in this application. The limitations on mutual parallelism and mutual perpendicularity will not be repeated below.

[0094] refer to Figure 1 As shown, the workpiece stage 1 may include a vertical actuator 11, a horizontal actuator 12, a workpiece receiving stage 13, a receiving stage base 14, and a buffer clamp 15.

[0095] The horizontal actuator 12 is used to realize the horizontal movement of the workpiece stage 1. The horizontal movement of the workpiece stage 1 may include movement along the X-axis, movement along the Y-axis, and rotation about the Z-axis.

[0096] The horizontal actuator 12 may include a horizontal drive unit and a horizontal motion unit 12a. The horizontal drive unit may be a drive motor used to drive the workpiece stage 1 to move horizontally. The horizontal motion unit 12a may be connected to the horizontal drive unit. The horizontal motion unit 12a has a groove inside, which provides space for the installation of the vertical actuator 11.

[0097] It is understandable that the shape of the horizontal motion part 12a can be any shape, as long as there is enough space to install the vertical actuator 11.

[0098] For example, Figure 2 This is a schematic diagram of the structure of a horizontal actuator 12 provided in an embodiment of this application, with reference to...Figure 2 As shown, a sliding guide rail 121 is provided at the bottom of the horizontal movement part 12a, which is used to guide the horizontal movement of the workpiece stage 1. In some embodiments, the sliding guide rail 121 can also limit the horizontal movement of the workpiece stage 1.

[0099] refer to Figure 2 As shown, a mounting base 122 is provided on the horizontal moving part 12a. The mounting base 122 is used to mount the vertical actuator 11, so that the vertical actuator 11 can be positioned by the mounting base 122 during assembly. Exemplarily, the mounting base 122 may be provided with one or more first mounting holes 124, which can engage with fasteners, such as screws, pins, and / or rivets. The vertical actuator 11 can be fixed to the mounting base 122 by fasteners.

[0100] refer to Figure 2 As shown, the horizontal moving part 12a is also provided with two or more second mounting holes 123, which can be spaced circumferentially along the edge of the horizontal actuator 12. The second mounting holes 123 are used to fix the buffer clip 15, which can be connected to the horizontal actuator 12 by fasteners.

[0101] The vertical actuator 11 is used to realize the vertical movement of the workpiece stage 1. The vertical movement of the workpiece stage 1 may include movement along the Z-axis, rotation about the X-axis, and rotation about the Y-axis.

[0102] refer to Figure 1 As shown, the number of vertical actuators 11 can be three sets. Through the cooperation of the three sets of vertical actuators 11, the workpiece stage 1 can achieve vertical attitude adjustment with three degrees of freedom. It can be understood that the number of mounting bases on the horizontal actuator 12 can be equal to the number of vertical actuators 11. The three sets of vertical actuators 11 can be arranged in an equilateral triangle on the horizontal actuator 12. That is, the lines connecting the centers and / or centers of gravity of the three sets of vertical actuators 11 can form an equilateral triangle. The equilateral triangle arrangement of the vertical actuators 11 on the horizontal actuator 12 provides better stability when driving the workpiece stage 1 to perform vertical movement.

[0103] In some embodiments, the number of vertical actuators 11 may be more or less.

[0104] For any set of vertical actuators 11, one end of the vertical actuator 11 along the negative Z-axis is provided with a first mounting structure. The first mounting structure can cooperate with the first mounting hole 124 to realize the connection between the vertical actuator 11 and the mounting base 122.

[0105] For example, Figure 3 This is a schematic diagram of the structure of a vertical actuator 11 provided in an embodiment of this application, with reference to... Figure 3 As shown, the first mounting structure can be a third mounting hole 112, which can mate with the first mounting hole 124 on the mounting base 122. For example, the first mounting hole 124 and the third mounting hole 112 are threaded holes, and the fastener can be a screw, which can pass through the first mounting hole 124 and the third mounting hole 112, thereby fixing the vertical actuator 11 to the mounting base 122.

[0106] In some embodiments, the vertical actuator 11 can also be connected to the mounting base 122 by welding or bonding, so that the mounting base does not need to be provided with the first mounting hole 124, and the vertical actuator 11 does not need to be provided with the third mounting hole 112.

[0107] The vertical actuator 11 has a second mounting structure at one end along the positive Z-axis, which is used to connect the vertical actuator 11 to the receiving platform base 14. For example, refer to... Figure 3 As shown, the second mounting structure can be a fourth mounting hole 113, which can mate with fasteners, such as screws, pins, and / or rivets. The receiving platform base 14 can be connected to the vertical actuator 11 via fasteners.

[0108] By setting a first mounting structure and a second mounting structure at opposite ends of the vertical actuator 11 along the Z-axis, the vertical actuator 11 can be fixed in the workpiece stage 1, thus preventing internal vibration of the workpiece stage 1 during operation.

[0109] The side of the vertical actuator 11 may be provided with a first guide structure, which can contact the second guide structure on the buffer clamp 15 to guide the vertical movement of the workpiece table 1.

[0110] For example, refer to Figure 3 As shown, the side of the vertical actuator 11 is a guide surface 111. That is, the first guiding structure is the guide surface 111, which can be a high-precision surface designed at the micrometer level. The second guiding structure can be a guide through-hole 151, in which the vertical actuator 11 can pass. For example, the guide surface 111 can be a cylindrical surface, and the guide through-hole 151 can be a circular hole; the diameter of the guide surface 111 can be smaller than the diameter of the guide through-hole 151. The cooperation between the guide surface 111 and the guide through-hole 151 ensures the accuracy of the vertical movement of the workpiece stage 1 and decouples the horizontal and vertical movements of the workpiece stage 1.

[0111] In some embodiments, the first guide structure and the second guide structure can also be other guide structures. For example, the first guide structure can be a vertical guide rail, and the second guide structure can be a slider. The slider can move vertically along the vertical guide rail. Optionally, the vertical guide rail can be a hollow cylinder, and the slider moves up and down along the inside of the hollow cylinder. It is understood that the vertical guide rail can be a mechanical guide rail, an air-bearing guide rail, a magnetic levitation guide rail, etc., and the embodiments of this application do not limit this.

[0112] refer to Figure 1 As shown, the buffer clip 15 is disposed between the horizontal actuator 12 and the receiving platform base 14. The buffer clip 15 is made of a metal material with a large deformation coefficient, which can absorb the slight changes and deformations caused by the horizontal actuator 12 being subjected to heat or force for a long time.

[0113] It is understandable that when the workpiece stage 1 is working, the horizontal actuator 12 may deform in the Z direction at various positions. The buffer clamp 15 can compensate for the vertical deformation of the horizontal actuator 12 to a certain extent, so that the position of the receiving platform base 14 is not affected by the small deformation, thereby improving the vertical attitude adjustment accuracy of the workpiece stage 1.

[0114] The vertical actuator 11 can pass through the buffer clamp 15, and the buffer clamp 15 can also guide the vertical movement of the vertical actuator 11. The buffer clamp 15 is provided with a second guide structure, which cooperates with the first guide structure on the vertical actuator 11 to constrain the horizontal movement of the vertical actuator 11, thereby decoupling the vertical movement of the vertical actuator 11 from the horizontal movement and ensuring that the risk of horizontal movement can be eliminated when the vertical actuator 11 is working.

[0115] For example, Figure 4 This is a schematic diagram of the structure of a buffer clip 15 provided in an embodiment of this application, with reference to... Figure 4 As shown, the second guiding structure is a guide through hole 151, which penetrates the buffer clamp 15. The number of guide through holes 151 is the same as the number of vertical actuators 11, and the distribution of guide through holes 151 on the buffer clamp 15 is the same as the distribution of vertical actuators 11 on horizontal actuators 12. The inner wall of the vertical through hole is designed with high precision to ensure that the vertical actuator 11 will not wobble in the horizontal direction, thus ensuring the motion control accuracy of the workpiece stage 1.

[0116] refer to Figure 4As shown, the buffer clip 15 also has a third mounting structure for mounting the buffer clip 15 to the horizontal actuator 12. Exemplarily, the third mounting structure may be two or more fifth mounting holes 152 spaced circumferentially along the edge of the buffer clip 15. These fifth mounting holes 152 can engage with fasteners, such as screws, pins, and / or rivets. The buffer clip 15 can be fixed to the horizontal actuator 12 by these fasteners.

[0117] Continue to refer to Figure 1 As shown, the receiving platform base 14 is disposed between the buffer clamp 15 and the workpiece receiving platform 13, and the receiving platform base 14 is connected to both the vertical actuator 11 and the workpiece receiving platform 13. The receiving platform base 14 is used to support the workpiece receiving platform 13 and to provide an installation position for the vertical optical measurement system 2.

[0118] Figure 5 This is a structural schematic diagram of a receiving platform base 14 provided in an embodiment of this application, with reference to... Figure 5 As shown, the receiving platform base 14 may have two or more sixth mounting holes 141, and the multiple sixth mounting holes 141 may be spaced apart circumferentially along the edge of the receiving platform base 14. The sixth mounting holes 141 may be countersunk through holes, so that the receiving platform base 14 may be fixed to the buffer clip 15 by countersunk screws.

[0119] In some embodiments, the receiving platform base 14 can also be fixed to the buffer clip 15 by other means, such as by welding, riveting and / or snap-fitting.

[0120] refer to Figure 5 As shown, the receiving platform base 14 may have multiple sets of seventh mounting holes 144, which are used to connect the receiving platform base 14 to the vertical actuator 11. It can be understood that the number of sets of seventh mounting holes 144 is equal to the number of vertical actuators 11, and each set of seventh mounting holes 144 may include one or more mounting holes to achieve a reliable connection between the receiving platform base 14 and the vertical actuator 11. The seventh mounting holes 144 may also be countersunk holes, allowing the receiving platform base 14 to be fixed to the vertical actuator 11 using countersunk screws.

[0121] In some embodiments, the receiving platform base 14 can also be fixed to the vertical actuator 11 in other ways, such as by welding, riveting and / or snap-fitting.

[0122] refer to Figure 5As shown, the receiving platform base 14 is also provided with a mounting platform 142, which is located on one side of the receiving platform base 14 along the positive Z-axis. The mounting platform 142 provides a mounting and positioning interface for the optical measurement subsystem 21 in the vertical optical measurement system 2, so that the optical measurement subsystem 21 can be positioned by the mounting platform 142 during assembly. Exemplarily, the mounting platform 142 may be provided with one or more eighth mounting holes 143, which can engage with fasteners, such as screws, pins, and / or rivets. The optical measurement subsystem 21 can be fixed to the mounting platform 142 by fasteners.

[0123] The number of mounting platforms 142 can be the same as the number of optical measurement subsystems 21. For example, there can be three mounting platforms 142 arranged in an equilateral triangle on the receiving platform base 14. That is, the lines connecting the centers and / or centroids of the three mounting platforms 142 can form an equilateral triangle. This equilateral triangle arrangement of the three mounting platforms 142 on the receiving platform base 14 ensures that the position of the measurement light emitted by the optical measurement subsystem 21 is within an equilateral triangle, facilitating subsequent calculation of the vertical attitude of the first surface, simplifying the calculation process, reducing hardware requirements, and saving computational resources.

[0124] In some embodiments, to ensure the motion stability of the workpiece receiving platform 13 and the receiving platform base 14, the vertical actuator 11 is positioned at a staggered location on the horizontal actuator 12, which is offset from the optical measurement subsystem 21 on the receiving platform base 14. That is, the mounting base 122 and the mounting platform 142 are staggered. In other words, the projections of the mounting base 122 and the mounting platform 142 onto the horizontal plane do not coincide.

[0125] The workpiece receiving platform 13 can be positioned above the receiving platform base 14 and connected to the receiving platform base 14. Figure 6 This is a schematic diagram of the structure of a workpiece receiving platform 13 provided in an embodiment of this application, with reference to... Figure 6 As shown, the workpiece receiving platform 13 may include a support plate 134 and a side wall 135. The support plate 134 may be disposed at one end of the side wall 135 along the positive Z-axis, and the first surface of the support plate 134 may face away from the side wall 135. The support plate 134 and the side wall 135 may together enclose an accommodating space 131 with one end open, and the vertical optical measurement system 2 may be disposed in the accommodating space 131.

[0126] The support plate 134 has a first surface, which is the bearing surface of the workpiece receiving platform 13. The first surface is designed as a high-precision surface with high flatness and smoothness, and the surface roughness of the precision surface is less than or equal to 10 micrometers. The first surface is used to receive the workpiece, which, exemplarily, can be a wafer and / or a photomask.

[0127] refer to Figure 6 As shown, the support plate 134 is provided with a light-transmitting hole 132. The light-transmitting hole 132 is used to provide a propagation path for the optical path propagation of the optical measurement subsystem 21. In addition, the light-transmitting hole 132 can also provide an installation interface for the optical filtering module 216 in the vertical optical measurement system 2. It can be understood that the number of light-transmitting holes 132 can be the same as the number of optical measurement subsystems 21.

[0128] refer to Figure 6 As shown, a ninth mounting hole 133 is provided at one end of the side wall 135 along the negative Z-axis. The ninth mounting hole 133 is used to connect the workpiece receiving platform 13 and the receiving platform base 14. Exemplarily, the ninth mounting hole 133 can be a threaded hole, and the workpiece receiving platform 13 and the receiving platform base 14 can be connected by screws.

[0129] In some embodiments, the workpiece receiving platform 13 and the receiving platform base 14 can also be connected by other means, such as by welding, riveting and / or snap-fitting.

[0130] refer to Figure 6 As shown, the workpiece receiving platform 13 is connected to the receiving platform base 14. The receiving platform base 14 can be positioned at the opening of the accommodating space 131. The workpiece receiving platform 13 and the receiving platform base 14 together enclose an accommodating cavity with a hollow, closed internal structure. The hollow structure reduces the weight of the workpiece stage 1, thereby reducing the difficulty of controlling the workpiece stage 1. Simultaneously, the aforementioned accommodating cavity provides protection for the vertical optical measurement system 2, and also provides a relatively enclosed light propagation space for the vertical optical measurement system 2, reducing the impact of ambient temperature and airflow disturbances on the vertical optical measurement system 2, and improving the measurement accuracy of the vertical optical measurement system 2.

[0131] The vertical optical measurement system 2 may include at least three sets of optical measurement subsystems 21. These three sets of optical measurement subsystems 21 are spaced apart on the receiving platform base 14 and each is connected to a mounting platform 142. Each optical measurement subsystem 21 is used to emit measurement light and receive reflected light. The measurement light emitted by each set of optical measurement subsystems 21 is reflected by the reflecting component 3 to obtain its corresponding reflected light. The optical measurement subsystems 21 are also used to determine the distance between the measurement surface 22 and the reflecting component 3 based on the measurement light and its corresponding reflected light. The measurement surface 22 is the plane defined by the measurement points of the at least three sets of optical measurement subsystems 21. The measurement point may be the point of emission of the measurement light. By measuring the distance between each measurement point and the reflecting component 3, the vertical orientation of the workpiece stage 1 can be determined.

[0132] Figure 7A This is a schematic diagram of the structure of a vertical optical measurement system 2 provided in an embodiment of this application, with reference to... Figure 7A As shown, the vertical optical measurement system 2 may include three sets of optical measurement subsystems 21.

[0133] It can be understood that the vertical optical measurement system 2 may include N sets of optical measurement subsystems, where N is an integer greater than or equal to 3. Each set of optical subsystems can measure the distance between a measurement point and the reflecting component 3. When N is greater than 3, the measurement points corresponding to N-3 optical measurement subsystems can be used as redundant measurement points. By setting redundant measurement points, the measurement accuracy of the vertical optical measurement system 2 can be improved.

[0134] For example, the vertical optical measurement system 2 may include four sets of optical measurement subsystems 21. Figure 7B This is a schematic diagram of another vertical optical measurement system 2 provided in an embodiment of this application, with reference to... Figure 7B As shown, the vertical optical measurement system 2 may also include four sets of optical measurement subsystems 21. The distance between the measurement point and the reflecting component measured by any one set of optical measurement subsystems is used to determine the system error. The system error is used to correct the distances between the measurement points and the reflecting component measured by the remaining three sets of optical measurement subsystems. The corrected distance between the measurement point and the reflecting component is used to determine the vertical orientation of the workpiece stage. For example, any one of the four sets of optical measurement subsystems 21 can serve as a redundant measurement point to detect machining errors in machined parts, assembly and adjustment errors of guide rails, control errors in the control system, and positional errors caused by fluctuations in the workpiece during horizontal movement.

[0135] It should be noted that in other embodiments, there may be more than four sets of optical measurement subsystems, i.e., N can be greater than or equal to 5, and the vertical optical measurement system 2 can have two or more redundant measurement points simultaneously. In this way, in addition to measuring the aforementioned errors (machining errors of machined parts, assembly and adjustment errors of guide rails, control errors of the control system, positional errors caused by the undulations of the workpiece during horizontal movement, etc.), the influence of the environment (temperature, air pressure, humidity) and the jitter of the measured reflector on the interferometer measurement system can also be measured. This facilitates the elimination of noise interference from the environment and the measured reflector in the entire vertical optical measurement system 2, thereby improving measurement accuracy.

[0136] Figure 8 This is a schematic diagram of the structure of an optical measurement subsystem 21 provided in an embodiment of this application, with reference to... Figure 8 As shown, any set of optical measurement subsystems 21 may include an optical measurement component and a vertical attitude adjustment base 215. The vertical attitude adjustment base 215 is connected to the mounting platform 142 on the receiving platform base 14, and the optical measurement component is mounted on the vertical attitude adjustment base 215. The optical measurement component is used to emit measurement light and receive the reflected light corresponding to the measurement light, and to determine the distance between the measurement surface 22 and the reflecting component 3 based on the measurement light and the reflected light corresponding to the measurement light. The vertical attitude adjustment base 215 is used to adjust the vertical attitude of the optical measurement component relative to the reflecting component 3.

[0137] The vertical attitude adjustment base 215 is used to adjust the vertical attitude of the optical measurement component. The vertical attitude adjustment base 215 provides the optical measurement component with dual degrees of freedom for yaw and pitch adjustment, and provides sufficient degrees of freedom for adjusting the perpendicularity of the laser beam relative to the reflecting component 3. In other words, the vertical attitude adjustment base 215 can adjust the angle of the laser beam emitted by the optical measurement component relative to the reflecting component 3, so that the laser beam is perpendicular to the reflecting surface in the reflecting component 3. This eliminates the need for flexible adjustment components in the reflecting component 3 to adjust its vertical attitude, thus improving the accuracy of vertical attitude measurement.

[0138] For example, Figure 9 This is a structural schematic diagram of a vertical attitude adjustment base 215 provided in an embodiment of this application, with reference to... Figure 9 As shown, the vertical attitude adjustment base 215 may include a fixed plate 2151, a first yaw adjustment plate 2152 and a first pitch adjustment plate 2153.

[0139] Figure 10 This is a structural schematic diagram of a fixing plate 2151 provided in an embodiment of this application, with reference to... Figure 10As shown, the bottom surface of the fixing plate 2151, i.e., the surface facing the negative Z-axis, is a flat design. The fixing plate 2151 can be connected to the mounting platform 142 on the receiving platform base 14. For example, the fixing plate 2151 is provided with a first oblong through hole 21512. The design position of the first oblong through hole 21512 corresponds to the position of the eighth mounting hole 143 on the receiving platform base 14. The first oblong through hole 21512 and the eighth mounting hole 143 can be connected by fasteners, thereby fixing the fixing plate 2151 to the receiving platform base 14.

[0140] In some embodiments, the fixing plate 2151 can also be fixed to the mounting platform 142 in other ways, such as by welding, riveting and / or snap-fitting.

[0141] The mounting plate 2151 also includes a second surface 21513 facing away from the mounting platform 142, and the second surface 21513 may be curved. (See reference) Figure 10 As shown, the second surface 21513 is the upper surface of the fixed plate 2151, i.e., the surface facing the positive Z-axis direction. The second surface 21513 has a curved surface design. The curved surface design has the characteristics of high modality and good stability. The second surface 21513 is provided with a first threaded hole 21511. The first yaw adjustment plate 2152 and the fixed plate 2151 can be connected through the first threaded hole 21511.

[0142] The first yaw adjustment plate 2152 is connected to the fixed plate 2151. The first yaw adjustment plate 2152 includes a third surface 21521 and a fourth surface 21522. The third surface 21521 faces the fixed plate 2151, and the fourth surface 21522 faces away from the fixed plate 2151. Both the third surface 21521 and the fourth surface 21522 are curved surfaces. The third surface 21521 can be convex and fits against the second surface 21513. The fourth surface 21522 is concave. It should be noted that the third surface 21521 can also be concave, corresponding to the second surface 21513 being convex, as long as the two can cooperate to provide sliding guidance. The present invention does not limit the cooperation shape of the third surface 21521 and the second surface 21513.

[0143] Figure 11 A schematic diagram of the structure of a first yaw adjustment plate 2152 provided in an embodiment of this application is shown below. Figure 11As shown, the third surface 21521 is the lower surface of the first yaw adjustment plate 2152, that is, the surface facing the negative Z-axis direction. The third surface 21521 is a curved surface design, and the curvature of the third surface 21521 is the same as the curvature of the second surface 21513, so that the second surface 21513 and the third surface 21521 can fit together to realize the motion guidance of the first yaw adjustment plate 2152 relative to the fixed plate 2151, thereby facilitating the adjustment of the yaw degree of freedom of the first yaw adjustment plate 2152.

[0144] The fourth surface 21522 is the upper surface of the first yaw adjustment plate 2152, i.e., the surface facing the positive Z-axis direction. The fourth surface 21522 has a curved design. The extension direction of the fourth surface 21522 is perpendicular to the extension direction of the third surface 21521. For example, the third surface 21521 can extend along the X-axis direction, and the fourth surface 21522 can extend along the Y-axis direction. That is, on the same cutting plane, such as the YZ plane, the outline of the third surface 21521 is a straight line, and the outline of the fourth surface 21522 is an arc.

[0145] The first yaw adjustment plate 2152 is provided with a second oblong through hole 21523, which can be configured to correspond one-to-one with the first threaded hole 21511. The second oblong through hole 21523 and the first threaded hole 21511 cooperate to limit the first yaw adjustment plate 2152 relative to the fixed plate 2151. For example, the second oblong through hole 21523 and the first threaded hole 21511 can be connected by a screw, the size of which is larger than the axial depth of the second oblong through hole 21523. When the first yaw adjustment plate 2152 is tilted, the screw can move within the second oblong through hole 21523, that is, the second oblong through hole 21523 can limit the screw, thereby limiting the first yaw adjustment plate 2152 relative to the fixed plate 2151.

[0146] It should be noted that the first yaw adjustment plate 2152 includes two ends, and the number of second oblong through holes 21523 provided at each end is not limited in this invention. When the number of second oblong through holes 21523 at each end of the first yaw adjustment plate 2152 is one or two, the pitch angle of the first yaw adjustment plate 2152 can be finely adjusted manually. When the number of second oblong through holes 21523 at each end of the first yaw adjustment plate 2152 is three or more (corresponding to...) Figure 11 The pitch angle of the first yaw adjustment plate 2152 can be adjusted more precisely by adjusting the tightness of the screws in the outermost waist-shaped through holes on both sides of each end.

[0147] The fixing plate 2151 also includes two ends, corresponding to the two ends of the first yaw adjustment plate 2152. The number and position of the fourth threaded hole 21314 at each end of the first yaw adjustment plate 2152 correspond one-to-one with the second oblong through hole 21523 at the corresponding end of the first yaw adjustment plate 2152.

[0148] In practical applications, the first yaw adjustment plate 2152 has a structure with three second waist-shaped through holes 21523 at each end.

[0149] like Figure 11 As shown, each end of the first yaw adjustment plate 2152 is provided with at least three second oblong through holes 21523. For any one end, it may include an outer second oblong through hole 21523a and an inner second oblong through hole 21523b. It can be understood that by adjusting the tightness of the screw provided in the outer second oblong through hole 21523a, the pitch angle of the first yaw adjustment plate 2152 can be adjusted more precisely.

[0150] The first yaw adjustment plate 2152 is also provided with a second threaded hole 21524, and the first yaw adjustment plate 2152 and the first pitch adjustment plate 2153 can be connected through the second threaded hole 21524.

[0151] The first pitch adjustment plate 2153 is connected to the first yaw adjustment plate 2152. The first pitch adjustment plate 2153 includes a fifth surface 21531 and a sixth surface 21534. The fifth surface 21531 faces the first yaw adjustment plate 2152 and is curved, for example, convex. The fifth surface 21531 can fit against the fourth surface 21522. The sixth surface 21534 faces away from the first yaw adjustment plate 2152 and can be planar. It should be noted that the fifth surface 21531 can also be concave, corresponding to the convex surface of the fourth surface 21522, as long as the two can cooperate to provide sliding guidance. The present invention does not limit the cooperation shape of the fifth surface 21531 and the fourth surface 21522.

[0152] Figure 12 A schematic diagram of the structure of a first pitch adjustment plate 2153 provided in an embodiment of this application is shown below. Figure 12 As shown, the fifth surface 21531 is the lower surface of the first pitch adjustment plate 2153, i.e., the surface facing the negative Z-axis direction. The fifth surface 21531 is a curved surface design, and the curvature of the fifth surface 21531 is the same as that of the fourth surface 21522, so that the fifth surface 21531 and the fourth surface 21522 can fit together to realize the motion guidance of the first pitch adjustment plate 2153 relative to the first yaw adjustment plate 2152, so as to facilitate the pitch degree of freedom adjustment of the first pitch adjustment plate 2153.

[0153] The sixth surface 21534 is the upper surface of the first pitch adjustment plate 2153, that is, the surface facing the positive Z-axis direction. The sixth surface 21534 is planar to facilitate the fixing of the optical measurement components.

[0154] The first pitch adjustment plate 2153 is provided with a third oblong through hole 21532, which corresponds one-to-one with the second threaded hole 21524. The third oblong through hole 21532 and the second threaded hole 21524 cooperate to limit the position of the first pitch adjustment plate 2153 relative to the first yaw adjustment plate 2152. For example, the third oblong through hole 21532 and the second threaded hole 21524 can be connected by a screw, the size of which is larger than the axial depth of the third oblong through hole 21532. When the first pitch adjustment plate 2153 is pitched, the screw can move within the third oblong through hole 21532, that is, the third oblong through hole 21532 can limit the screw, thereby limiting the position of the first pitch adjustment plate 2153 relative to the fixed plate 2151.

[0155] It should be noted that the first pitch adjustment plate 2153 includes two ends, and the number of third oblong through holes 21532 provided at each end is not limited in this invention. When the number of third oblong through holes 21532 at one end of the first pitch adjustment plate 2153 is one or two, the pitch angle of the first pitch adjustment plate 2153 can be finely adjusted manually. When the number of third oblong through holes 21532 at each end of the first pitch adjustment plate 2153 is three or more (corresponding to...) Figure 12 The pitch angle of the first pitch adjustment plate 2153 can be adjusted more precisely by adjusting the tightness of the screws in the outermost waist-shaped through holes on both sides of each end.

[0156] The first yaw adjustment plate 2152 also includes two ends, corresponding to the two ends of the first pitch adjustment plate 2153. The number and position of the second threaded hole 21524 at each end of the first yaw adjustment plate 2152 correspond one-to-one with the third oblong through hole 21532 at the corresponding end of the first pitch adjustment plate 2153.

[0157] In practical applications, each end of the first pitch adjustment plate 2153 can be provided with a structure of three third waist-shaped through holes 21532.

[0158] refer to Figure 12 The first pitch adjustment plate 2153 shown has at least three third oblong through holes 21532 at each end. For any one end, it may include an outer third oblong through hole 21532a and an inner third oblong through hole 21532b. It can be understood that by adjusting the tightness of the screw provided in the outer third oblong through hole 21532a, the pitch angle of the first pitch adjustment plate 2153 can be adjusted more precisely.

[0159] The first pitch adjustment plate 2153 is also provided with a third threaded hole 21533, through which the first pitch adjustment plate 2153 and the optical measurement component can be connected.

[0160] The optical measurement subsystem 21 also includes an optical filtering module 216, which can be disposed in the light-transmitting aperture 132. The optical filtering module 216 is used to filter stray light in the measurement light and the reflected light. Specifically, the optical filtering module 216 can filter out stray light other than the measurement light, improve the imaging quality of the reflected light reflected back to the optical measurement components, and thus improve the measurement accuracy of the vertical optical measurement system 2.

[0161] refer to Figure 1 and Figure 6 As shown, the optical filter module 216 can be set at the light-transmitting hole 132 on the support plate 134. Figure 13 This is a schematic diagram of the structure of an optical filtering module 216 provided in an embodiment of this application, with reference to... Figure 13 As shown, the optical filtering module 216 may include a first focusing lens 2161, a second focusing lens 2163, and a pinhole stop 2162. Both the first focusing lens 2161 and the second focusing lens 2163 are high-precision focusing lenses.

[0162] The focal lengths of the first focusing lens 2161 and the second focusing lens 2163 can be equal. The first focusing lens 2161 is located at twice the focal length of the second focusing lens 2163, and the second focusing lens 2163 is located at twice the focal length of the first focusing lens 2161. That is, the two focusing lenses can be located at twice the focal length of each other. In some embodiments, the first focusing lens 2161 and the second focusing lens 2163 can also be the same.

[0163] A pinhole stop 2162 is disposed between the first focusing lens 2161 and the second focusing lens 2163, and is located at the focal planes of the first focusing lens 2161 and the second focusing lens 2163. The pinhole stop 2162 has a micrometer-sized aperture through which a light beam can pass. The diameter of this aperture can be designed according to the focal lengths of the two focusing lenses.

[0164] The optical axes of the two focusing lenses and the pinhole stop 2162 can be set coaxially, that is, the optical axes of the first focusing lens 2161, the second focusing lens 2163 and the pinhole stop 2162 coincide, so as to ensure that the optical filtering module 216 can effectively filter and improve the light propagation efficiency.

[0165] The optical measurement component in the optical measurement subsystem 21 is used to emit measurement light and receive reflected light reflected by the reflection component 3, thereby calculating the distance between the measurement surface 22 and the reflection component 3 based on the measurement light and the reflected light. The optical measurement component may include an optical measuring instrument, a photoelectric conversion module 212, and a signal processing module 211. In some embodiments, the optical measurement component may also include a light source 210 and a light source collimation module 213.

[0166] Light source 210 is the starting part of the optical measurement assembly, used to generate a light beam. For example, light source 210 can be a laser, which is capable of generating a laser beam. Light source collimation module 213 is used to convert the light beam generated by light source 210 into a parallel beam, so as to facilitate optical processing by the subsequent optical measurement instrument.

[0167] In some embodiments, the light source 210 may also include a light source collimation module 213.

[0168] The optical measuring instrument uses the parallel beam generated by the light source collimation module 213 to generate measurement light. The optical measuring instrument obtains the detection light signal by projecting the measurement light onto the reflective component 3 and receiving the reflected light reflected by the reflective component 3. For example, the optical measuring instrument may be a laser interferometer 214, a spectral confocal lens 219, etc.

[0169] The photoelectric conversion module 212 is used to convert the detection optical signal obtained by the optical measuring instrument into an electrical signal, so as to facilitate subsequent processing to obtain the distance between the measuring surface 22 and the reflective component 3. For example, the photoelectric conversion module 212 can be a photoelectric conversion chip.

[0170] The signal processing module 211 processes the electrical signal to obtain the distance between the measuring surface 22 and the reflecting component 3. Exemplarily, the signal processing module 211 may be an electrical signal connector.

[0171] An optical path is formed between the light source 210, the light source collimation module 213, the optical measuring instrument, and the photoelectric conversion module 212, thereby enabling the transmission of light beams. Exemplarily, the optical path can be a spatial propagation path, an optical fiber 2101 propagation path, or a waveguide propagation path. To improve light propagation efficiency, the optical axes of the light source collimation module 213, the optical measuring instrument, and the photoelectric conversion module 212 can be aligned.

[0172] By designing the optical propagation links between the various parts of the optical measurement assembly, the distance between the measurement surface 22 and the reflective assembly 3 can be measured. It is understood that the reflective assembly 3 can employ different structural designs for different optical measurement instruments. The following description, in conjunction with the accompanying drawings, introduces the structures of different combinations of optical measurement assemblies and reflective assemblies 3.

[0173] In some optional embodiments, the optical measuring instrument can be a laser interferometer, such as a high-precision laser interferometer 214. The optical measuring assembly also includes a light source collimation module 213. The light source collimation module 213 and the laser interferometer 214 are respectively disposed on opposite sides of the photoelectric conversion module 212, and the signal processing module 211 is disposed on the side of the light source collimation module 213 opposite to the photoelectric conversion module 212. The light source collimation module 213 is used to generate a parallel beam that can pass through the photoelectric conversion module 212 and enter the laser interferometer 214. The optical axis of the light source collimation module 213, the optical axis of the photoelectric conversion module 212, and the optical axis of the laser interferometer 214 are coaxial, and the optical axis of the laser interferometer 214 and the optical axis of the optical filtering module 216 are coaxial.

[0174] For example, Figure 14 This is a schematic diagram of the structure of an optical measuring instrument according to an embodiment of this application. (Refer to...) Figure 14 As shown, the laser interferometer 214 may include a first beam splitter 2141, a third focusing lens 2142, and a first plane mirror 2143.

[0175] The first beam splitter 2141 can be a polarizing beam splitter (PBS). The first beam splitter 2141 can split an incident laser beam into a measuring arm laser and a reference arm laser, whose polarization vibration angles are perpendicular to each other. For example, the reference arm laser's polarization vibration direction is horizontal, while the measuring arm laser's vibration direction can be vertical; the measuring arm laser is the measuring light, and the reference arm laser is the reference light. The third focusing lens 2142 can be a high-precision focusing lens. The first plane mirror 2143 can be a high-precision first plane mirror 2143.

[0176] The detected optical signal includes an interference signal. The laser interferometer 214 includes a first beam splitter 2141, a third focusing lens 2142, and a first plane mirror 2143. The first beam splitter 2141 generates a reference light and a measurement light using a parallel beam emitted from the light source collimation module 213. The reflected light from the measurement light, after being reflected by the reflecting component 3, is incident on the photoelectric conversion module 212. The reference light, after being focused by the third focusing lens 2142, is incident on the first plane mirror 2143. The first plane mirror 2143 reflects the focused reference light back to the photoelectric conversion module 212. The reflected light and the reference light meet within the laser interferometer 214, generating an interference signal.

[0177] Specifically, after a laser beam enters the first beam splitter 2141, the resulting measuring arm laser can propagate as free-space light to the reflecting component 3, and after reflection by the reflecting component 3, it is incident on the photoelectric conversion module 212. The reference arm laser split by the first beam splitter 2141 can be focused to a single point after passing through the third focusing lens 2142. The focal point of the third focusing lens 2142 can be located on the reflecting surface of the first plane mirror 2143. The reference arm laser focused on the first plane mirror 2143, after passing through the first plane mirror 2143, can meet the measuring arm laser within the laser interferometer 214 to generate an interference signal. The interference signal is the detection light signal.

[0178] In some embodiments, in order to ensure that the reflected light from the reference arm laser reflected back to the photoelectric conversion module 212 can be fully imaged, the reflecting surface of the first planar mirror 2143 can be located on the focal plane of the third focusing lens 2142, thereby ensuring the quality of the interference signal and the accuracy of the measurement.

[0179] The reflective assembly 3 is located above the workpiece receiving platform 13. The reflective assembly 3 may include a fixing structure 31 and a reflector 32. The fixing structure 31 includes a seventh surface 313 facing the first surface, and the reflector 32 is disposed on the seventh surface 313 with its reflecting surface facing the first surface. The fixing structure 31 can be a rigid structure. By using a rigid fixing structure 31 to fix the reflector 32, the defect of low measurement accuracy due to excessively low structural modes that exists in the use of a flexible fixing structure 31 can be avoided.

[0180] The number of reflectors 32 can be equal to the number of optical measurement subsystems 21. For example, if there are three sets of optical measurement subsystems 21, the number of reflectors 32 can be three. The reflectors 32 can be high-precision, high-reflectivity plane reflectors. The reflectors 32 can be bonded to the seventh surface 313 using glue and / or tape.

[0181] For example, Figure 15 This is a schematic diagram of the structure of a reflective component 3 according to an embodiment of this application. (Refer to...) Figure 15 As shown, the lower surface of the fixed structure 31 is the seventh surface 313, and three protrusions 311 are provided on the seventh surface 313. The number of protrusions 311 is the same as the number of reflectors 32, and the reflectors 32 can be set on the protrusions 311. The three protrusions 311 can be distributed in an equilateral triangle on the seventh surface 313, so that the three reflectors 32 are distributed in an equilateral triangle on the seventh plane.

[0182] It can be understood that the equilateral triangle formed by the three reflectors 32 corresponds vertically to the equilateral triangle formed by the three optical measurement subsystems 21, thereby reducing the loss of the light beam during propagation and improving the accuracy of the optical measurement system.

[0183] The boss 311 can position the reflector 32. The surface of the boss 311 is designed with high precision, with flatness and smoothness. The surface precision of the boss 311 can be at the micrometer level, which can ensure that the reflecting surface of the reflector 32 is flat, reduce measurement error, and thus improve the measurement accuracy of the optical measurement system.

[0184] In some embodiments, the fixing structure 31 is further provided with a clearance hole 312 penetrating through the fixing structure 31. The clearance hole 312 can provide clearance space for the assembly of the reflector 32, thereby improving the scalability of the attitude measurement device. For example, the objective lens of the lithography machine is mounted on the fixing structure 31 through the clearance hole 312, thereby improving the overall scalability of the device.

[0185] In this embodiment, using three sets of vertical optical measurement subsystems 21 and three reflecting mirrors 32, the vertical attitude of the three degrees of freedom (Z, Rx, Ry) of the first surface in the workpiece stage 1 can be measured. (Reference) Figure 8 As shown, to ensure the measurement accuracy and reliability of the vertical optical measurement system 2, for any set of optical measurement subsystems 21, the optical axes of the light source collimation module 213, laser interferometer 214, photoelectric conversion module 212, and optical filtering module 216 can be kept coaxial. Simultaneously, to ensure that the vertical optical measurement system 2 in this embodiment has a large measurement stroke in the horizontal direction, the reflector 32 can be coaxial with the optical axis of its corresponding laser interferometer 214.

[0186] It is understandable that the optical axis of the reflector 32 is coaxial with that of the corresponding laser interferometer 214. When the workpiece stage 1 drives the vertical optical measurement system 2 to move horizontally, it will ensure that the light from the vertical optical measurement system 2 can still illuminate the reflector 32 within the horizontal stroke range.

[0187] Compared to placing the vertical optical measurement system 2 above the workpiece stage 1, when the workpiece stage 1 moves horizontally, the vertical optical measurement system 2 can move with the workpiece stage 1, but the measurement point will not change, thus not affecting the position of the measurement point and improving the measurement accuracy.

[0188] In this embodiment, the laser interferometer 214 can be fixed to the vertical attitude adjustment base 215 via the third threaded hole 21533 on the vertical attitude adjustment base 215. The vertical attitude adjustment base 215 can provide two degrees of freedom of pitch and yaw, thereby allowing adjustment of the perpendicularity of the emitted laser beam in the laser interferometer 214 relative to the reflector 32.

[0189] During the measurement process, the parallel beam emitted from the light source collimation module 213 is split into a measuring arm laser and a reference arm laser by the laser interferometer 214. The reference arm laser is retained inside the laser interferometer 214, while the measuring arm laser continues to propagate in space. After being filtered by the optical filtering module 216, it illuminates the reflecting surface of the reflector 32, thus obtaining reflected light. The reflected light is filtered again by the optical filtering module 216 and returns to the laser interferometer 214, where it coincides with the reference arm laser to generate an interference signal. Next, the photoelectric conversion module 212 calculates the interference signal and converts it into an electrical signal, which is then transmitted through the signal processing module 211 to measure the distance H between the measuring surface 22 and the reflecting surface of the reflector 32.

[0190] After obtaining the distances between the measurement points of at least three sets of optical measurement subsystems 21 and the reflecting surfaces of the mirrors 32, the vertical orientation of the workpiece stage 1 can be determined based on the distance between each measurement point and the reflecting surface of the mirrors 32. The reflecting surfaces of the at least three sets of mirrors 32 can define a reference plane 33, and the distances between the measurement points of the at least three sets of optical measurement subsystems 21 and the reflecting surfaces of the mirrors 32 can be the distances between the measurement points of the at least three sets of optical measurement subsystems 21 and the reference plane.

[0191] For example, Figure 16A This is a schematic diagram of a measuring surface 22 and a reference surface 33 provided in an embodiment of this application. (Refer to...) Figure 16A As shown, the vertical optical measurement system 2 may include three sets of optical measurement subsystems 21, each corresponding to a measurement point. The reflecting surfaces of the three sets of mirrors 32 can determine the reference plane 33.

[0192] In the initial state, i.e., when the workpiece stage 1 is in its initial position, the measuring surface 22 can be located below the reference surface 33, and the measuring surface 22 is parallel to the reference surface 33. For ease of calculation, a spatial rectangular coordinate system can be constructed in the initial state. For ease of calculation, in the initial state, the line connecting the first measuring point A and the second measuring point B can be parallel to the X-axis direction.

[0193] For example, Figure 16B A schematic diagram of a spatial rectangular coordinate system established in the initial state is provided for an embodiment of this application. (Refer to...) Figure 16B As shown, the measuring surface 22 is parallel to the reference surface 33, and the measuring points may include a first measuring point A, a second measuring point B, and a third measuring point C. It is understood that the first measuring point A, the second measuring point B, and the third measuring point C cannot simultaneously lie on a straight line.

[0194] Draw a perpendicular line from the third measurement point C to the line connecting the first measurement point A and the second measurement point B. The intersection of the perpendicular line and the line connecting the first measurement point A and the second measurement point B is D, that is, CD is perpendicular to AB.

[0195] For ease of calculation, the first measurement point A and the second measurement point B can be located directly above the X-axis, and the third measurement point C can be located directly above the Y-axis. That is, the coordinates of the first measurement point A and the second measurement point B on the Y-axis can be 0, and the coordinates of the third measurement point C on the X-axis can be 0. The distances of the first measurement point A, the second measurement point B, and the third measurement point C from the reference plane 33 are all H0. In other words, in the initial state, the coordinates of the first measurement point A are (x01, 0, H0), the coordinates of the second measurement point B are (x02, 0, H0), and the coordinates of the third measurement point C are (0, y03, H0).

[0196] Understandable. Figure 16B The initial state shown for constructing a spatial rectangular coordinate system is merely an example. In some implementations, the first measurement point A and the third measurement point C may have a Y-axis coordinate of 0, and the second measurement point B may have a X-axis coordinate of 0. Alternatively, the third measurement point C and the second measurement point B may have a Y-axis coordinate of 0, and the first measurement point A may have a X-axis coordinate of 0. In other embodiments, the first measurement point A and the second measurement point B may not be directly above the X-axis, and the third measurement point C may not be directly above the Y-axis.

[0197] The vertical degrees of freedom of the workpiece stage 1 include movement along the Z-axis, rotation around the X-axis, and rotation around the Y-axis. During operation, the workpiece stage can move along the Z-axis and rotate around the X-axis and Y-axis, thus placing the workpiece stage in a first state. It can be understood that the first state can be any state of the workpiece stage during operation.

[0198] For example, Figure 16C This application provides a schematic diagram of the vertical orientation of the measuring surface of a workpiece stage in a first state, in conjunction with... Figure 16B and Figure 16C As shown, when the workpiece stage is in the first state, the three sets of optical measurement subsystems 21 can measure the distance HA between the first measurement point A and the reference surface, the distance HB between the second measurement point B and the reference surface, and the distance HC between the third measurement point C and the reference surface.

[0199] Ideally, the reference plane is on a single plane, called the ideal plane. However, due to installation or other errors, the reflecting surface of each set of reflectors 32 may differ from the ideal plane. The difference between the ideal plane and the actual reflecting surface of the reflector 32 can be called the "height error value". The height error values ​​of the three optical measurement subsystems 21 corresponding to the heights of the three sets of reflectors 32 are recorded to provide calibration constants for subsequent algorithm calculations. For example, these calibration parameters are used to calibrate the distances HA, HB, and HC between the measurement points measured by the three sets of optical measurement subsystems 21 and the reference plane.

[0200] The vertical orientation of the workpiece stage 1 includes the angle of deviation of the measuring surface 22 relative to the X-axis direction (corresponding to the second direction) and the angle of deviation of the measuring surface 22 relative to the Y-axis direction (corresponding to the third direction).

[0201] Rotating the workpiece stage 1 about the X-axis by θx causes the measuring surface to deflect by θx relative to the Y-axis. In the first state, the angle between the measuring surface and the Y-axis is θx. Rotating the workpiece stage 1 about the Y-axis by θy causes the measuring surface to deflect by θy relative to the X-axis. In the first state, the angle between the measuring surface and the X-axis is θy.

[0202] To facilitate understanding, the measurement surface in the first state can be translated along the Z-axis so that point D coincides with the origin O of the coordinate system. It can be understood that after the translation, the distance between the first measurement point A and the reference surface is HA-HD, the distance between the second measurement point B and the reference surface is HB-HD, and the distance between the third measurement point C and the reference surface is HC-HD. If point D is a fixed point for rotation, the distance between point D and the reference surface after rotation remains H0. Therefore, after translating the measurement surface along the Z-axis so that point D coincides with the origin O of the coordinate system, the distance between the first measurement point A and the reference surface after the translation is HA-H0, the distance between the second measurement point B and the reference surface is HB-H0, and the distance between the third measurement point C and the reference surface is HC-H0.

[0203] For example, Figure 16D This is a schematic diagram illustrating the deflection angle of a measuring surface relative to the X and Y axes. (See reference...) Figure 16D Let θx be the angle of deflection of the measuring surface relative to the X-axis, and θy be the angle of deflection of the measuring surface relative to the Y-axis. The projection of the first measuring point A onto the X-axis is A1, the projection of the second measuring point B onto the Z-axis is B1, and the projection of the third measuring point C onto the Y-axis is C1. Extend AA1 and BB1 to intersect at point E, and the angle between AB and BE is α. It can be understood that θy is equal to angle α, and the distance between points A and E is equal to the height difference between HA and HB. Based on the above conditions, the angle of deflection θy of the measuring surface relative to the X-axis can be calculated using the following formula:

[0204] ,

[0205] Formula (1);

[0206] Wherein, LAB is the distance between the first measurement point A and the second measurement point B. In the initial state, the distance between the first measurement point A and the second measurement point B can be obtained based on the relative positions between the measurement subsystems.

[0207] The angle θx of the measuring surface relative to the Y-axis can be calculated using the following formula:

[0208] ,

[0209] Formula (2);

[0210] Where LCD represents the distance between the third measurement point C and point D. The distance between the third measurement point C and point D can be obtained in the initial state based on the relative positions between the measurement subsystems.

[0211] It can be understood that, according to formulas (1) and (2), the angle θy of the measuring surface relative to the X-axis and the angle θx of the measuring surface relative to the Y-axis are independent of the initial positions of the first measuring point A, the second measuring point B, and the third measuring point C. Therefore, in practical applications, when constructing a spatial rectangular coordinate system in the initial state, it is not necessary to set the first measuring point A, the second measuring point B, and / or the third measuring point C directly above the coordinate axes.

[0212] In this embodiment, the light source collimation module 213, laser interferometer 214, photoelectric conversion module 212, and signal processing module 211 are integrated into one unit. Utilizing free space for optical measurement effectively avoids the problem of light jitter caused by the high-speed movement of the workpiece stage 1 affecting measurement accuracy. Furthermore, a vertical attitude adjustment base 215 is used to achieve dual degrees of freedom for the optical measurement subsystem 21 (tilt and yaw), effectively reducing the overall integration difficulty while avoiding the defects of low structural modes and low measurement accuracy caused by the flexible structure design of the fixed structure 31 of the reflector 32. An optical filtering module 216 is used in the optical path to eliminate interference from diffuse reflection light during the propagation of the laser beam in space, thereby improving optical measurement accuracy. In addition, this embodiment omits light guiding elements and adopts a direct measurement mode using an interferometer, effectively reducing procurement and R&D costs for compensation algorithms.

[0213] Figure 17 This is a schematic diagram of another attitude measurement device provided in an embodiment of this application, with reference to... Figure 17 As shown, with Figure 1 The difference between the attitude measurement devices shown is that... Figure 17The optical measuring instrument in the attitude measurement device shown can be a spectral confocal lens 219. The optical measurement assembly also includes a coupling component 217, which is used to couple the light emitted by the light source (not shown) to the light source collimation module 213. The coupling component 217 can be one or more optical elements such as lenses and fiber optic flanges.

[0214] The optical measuring instrument is a spectral confocal lens 219. The optical measuring assembly also includes a light source collimation module 213 and a coupling component 217. The coupling component 217 and the spectral confocal lens 219 are respectively disposed on opposite sides of the light source collimation module 213. The coupling component 217 is connected to the photoelectric conversion module 212 via an optical fiber 2101. The light source collimation module 213 generates a parallel light beam that can enter the spectral confocal lens 219. The coupling component 217 couples the reflected light emitted from the spectral confocal lens 219 into the optical fiber 2101 for transmission to the photoelectric conversion module 212. The optical axis of the coupling component 217, the optical axis of the light source collimation module 213, and the optical axis of the spectral confocal lens 219 are coaxial.

[0215] For example, Figure 18A This is a schematic diagram of another vertical optical measurement system 2 provided in an embodiment of this application, with reference to... Figure 18A As shown, the vertical optical measurement system 2 may include three sets of optical measurement subsystems 21, and... Figure 7A The difference between the optical measurement subsystem 21 and the vertical optical measurement system 2 shown is that... Figure 18A The optical measurement subsystem 21 in the vertical optical measurement system 2 shown uses a spectral confocal lens 219 to measure the distance between the measurement surface 22 and the reflective component 3.

[0216] In some embodiments, Figure 18B This is a schematic diagram of another vertical optical measurement system 2 provided in an embodiment of this application, with reference to... Figure 18B As shown, the vertical optical measurement system 2 may also include four sets of optical measurement subsystems 21.

[0217] Figure 19 This is a schematic diagram of another optical measurement subsystem 21 provided in an embodiment of this application, with reference to... Figure 19As shown, any set of optical measurement subsystems 21 may include optical measurement components, which may include a light source 210, a light source collimation module 213, a coupling component 217, an optical fiber 2101, a spectral confocal lens 219, a photoelectric conversion module 212, and a signal processing module 211. The light source 210 can be connected to the coupling component 217 via the optical fiber 2101, the coupling component 217 can be connected to the light source collimation module 213, the light source collimation module 213 can be connected to the spectral confocal lens 219, the photoelectric conversion module 212 can be connected to the coupling component 217 via the optical fiber 2101, and the signal processing module 211 is electrically connected to the photoelectric conversion module 212.

[0218] Figure 20 This is a schematic diagram of the structure of a spectral confocal lens 219 provided in an embodiment of this application, with reference to... Figure 20 As shown, the spectral confocal lens 219 includes a third plane mirror 2191 and a fourth focusing lens 2192. The fourth focusing lens 2192 is located above the third plane mirror 2191. The third plane mirror 2191 can be a high-precision, high-reflectivity plane mirror. The fourth focusing lens 2192 is a high-precision focusing lens.

[0219] The parallel beam emitted by the light source collimation module 213 is white light. When the white light enters the interior of the spectral confocal lens 219, its propagation direction is changed by the third plane mirror 2191 and then transmitted to the fourth focusing lens 2192. The fourth focusing lens 2192 can focus the measurement light onto the reflecting component 3 to obtain the reflected light.

[0220] This embodiment utilizes the principle of white light dispersion measurement to achieve distance measurement. The principle of dispersion refers to the phenomenon where light disperses as it passes through different media because different wavelengths of light have different refractive indices. The essence of dispersion is the relationship between the wavelength of light and the refractive index of the medium, and it is generally divided into normal dispersion and anomalous dispersion. In the visible light range, the refractive index of transparent materials decreases monotonically with increasing wavelength; this phenomenon has important applications in fields such as spectral analysis and optical communication. For this reason, when light of different wavelengths passes through the same lens, the focal point is at a different position, thus achieving the purpose of measuring distance.

[0221] Specifically, white light emitted from light source 210 is coupled through coupling component 217 into light source collimation module 213 and converted into a parallel beam. Upon entering the spectral confocal lens 219, it is first reflected by the third plane mirror 2191, changing the beam's propagation direction from horizontal to vertical. The vertically propagating beam is then focused by the fourth focusing lens 2192 onto the reflecting component 3, and after reflection by the reflecting component 3, returns to the spectral confocal lens 219 along the same path. Utilizing the principle that the focusing lens has different refractive efficiencies for different wavelengths of light, the vertical distance from the reflecting component 3 to the spectral confocal lens 219 is thus obtained.

[0222] To ensure that the light beam reflected by the reflecting component 3 can be completely imaged by the spectral confocal lens 219, the seventh surface 313 can be located on the focal plane of the fourth focusing lens 2192. The detailed internal structure of the spectral confocal lens 219 is shown in the diagram below. Figure 19 As shown.

[0223] In this embodiment, Figure 21 This is a schematic diagram of another reflective component 3 provided in an embodiment of this application, with reference to... Figure 21 As shown, the reflective component 3 may include a fixing structure 31, which includes a seventh surface 313 facing the first surface. The seventh surface 313 is used to reflect the measurement light emitted by the optical measurement subsystem 21 to obtain reflected light. The seventh surface 313 is designed as a precision surface with high flatness and smoothness.

[0224] In this embodiment, since diffuse reflection beams can meet the measurement requirements of the spectral confocal lens 219, the material of the fixing structure 31 can be arbitrarily designed, thereby effectively improving measurement accuracy. Simultaneously, there is no need to install a high-precision, high-reflectivity plane mirror in the reflection assembly 3, thus reducing the cost of the vertical measurement device.

[0225] In this embodiment, the vertical three degrees of freedom, namely the vertical attitudes of Z, Rx, and Ry, of the first surface in the workpiece stage 1 can be measured by using three sets of vertical optical measurement subsystems 21 and reflection components 3.

[0226] refer to Figure 17 As shown, to ensure the maximization of measurement accuracy, reliability, and measurement range of the vertical optical measurement system 2, the optical axes of the coupling component 217, the light source collimation module 213, and the spectral confocal lens 219 in each optical measurement subsystem 21 can be kept coaxial. Simultaneously, to ensure that the beam reflected by the reflection component 3 can be completely imaged by the spectral confocal lens 219, the seventh surface 313 can be located at the common focal plane of the three fourth focusing lenses 2192.

[0227] During the measurement process, the measuring light is emitted from the light source 210 and coupled into the optical fiber 2101. After passing through the light source collimation module 213, it enters the spectral confocal lens 219. Then, it is focused by the fourth focusing lens 2192 in the spectral confocal lens 219 and emitted onto the seventh surface 313 of the fixed structure 31. The beam is then reflected back into the spectral confocal lens 219, and then coupled into the optical fiber 2101 again through the light source collimation module 213 and the coupling component 217. It is then transmitted through the optical fiber 2101 to the photoelectric conversion module 212. The photoelectric conversion module 212 calculates the optical signal and converts it into an electrical signal. Finally, the signal processing module 211 outputs the calculated vertical spatial distance H of the workpiece stage 1.

[0228] In this embodiment, the vertical attitude of the workpiece stage 1 with three degrees of freedom can be calculated based on the relative positional relationship of the optical measurement subsystem 21 and the measured vertical results H1, H2, and H3. The plane containing the seventh surface 313 of the fixed structure 31 can be the reference plane 33. The plane determined by the three measurement points of the three sets of optical measurement subsystems 21 is the measurement plane 22. The height difference between the three measurement points and the reference plane 33 is obtained by measurement, providing calibration constants for subsequent algorithm calculations.

[0229] For the calculation method of the vertical orientation of workpiece stage 1, please refer to [reference needed]. Figures 1 to 16D Some corresponding descriptions are provided, but will not be repeated here.

[0230] In this embodiment, the principle of white light dispersion measurement and optical fiber 2101 light transmission measurement are utilized. Furthermore, the optical measurement subsystem 21 adopts a split-integration design, allowing the light source 210, photoelectric conversion module 212, and signal processing module 211 to be located outside the receiving cavity. This keeps these components away from the spectral confocal lens 219, effectively reducing thermal drift caused by excessive energy consumption of the light source 210, photoelectric conversion module 212, and signal processing module 211. It also effectively avoids the problem of light jitter caused by the high-speed movement of the workpiece stage 1 affecting measurement accuracy. In addition, this embodiment omits the use of a light guide element and instead employs a spectral confocal measurement mode, avoiding the measurement limitation of requiring a high-precision reflector 32 in the laser interferometer 214 measurement structure. This significantly reduces the procurement and R&D costs of the compensation algorithm.

[0231] Figure 22 This is a schematic diagram of another attitude measurement device provided in an embodiment of this application, with reference to... Figure 22 As shown, with Figure 1 The difference between the attitude measurement devices shown is that... Figure 22In the attitude measurement device shown, the optical measurement subsystem 21 includes a collimation adjustment base 2130 and at least three lens group adjustment bases 2180. The collimation adjustment base 2130 is mounted on the receiving platform base 14, and the light source collimation module 213 is mounted on the collimation adjustment base 2130. At least three lens group adjustment bases 2180 are mounted on the receiving platform base 14, and each beam guiding lens group 218 is mounted on one lens group adjustment base 2180.

[0232] For example, the vertical optical measurement system 2 includes three sets of optical measurement subsystems 21 and a set of light source collimation modules 213, which can be set in the collimation adjustment base 2130.

[0233] It is understood that in other embodiments, as long as the light source collimation module 213 exists, the collimation adjustment base 2130 can be configured accordingly.

[0234] Each optical measurement subsystem 21 may include a beam guide mirror group 218, a mirror group adjustment base 2180, a laser interferometer 214, a coupling component 217, an optical fiber 2101, a photoelectric conversion module 212, a signal processing module 211, a vertical attitude adjustment base 215, and an optical filtering module 216. The three optical measurement subsystems 21 share a single light source collimation module 213, which is mounted on the collimation adjustment base 2130, thereby making the vertical attitude of the light source collimation module 213 adjustable. Simultaneously, the beam guide mirror group 218 in each optical measurement subsystem 21 may be mounted on the mirror group adjustment base 2180, thereby making the vertical attitude of the beam guide mirror group 218 adjustable.

[0235] Specifically, Figure 23 This is a schematic diagram of another receiving platform base 14 provided in an embodiment of this application, with reference to... Figure 23 As shown, with Figure 5 The difference between the base 14 shown is that... Figure 23 The base 14 shown also includes a collimation module fixing platform 145 and a lens assembly fixing platform 146. The collimation module fixing platform 145 has a tenth mounting hole 147 for connecting the collimation adjustment base 2130 to the collimation module fixing platform 145. The lens assembly fixing platform 146 has an eleventh mounting hole 148 for connecting the lens assembly fixing platform 146 to the lens assembly adjustment base 2180.

[0236] The collimation adjustment base 2130 provides the light source collimation module 213 with dual degrees of freedom in yaw and pitch, thereby reducing the adjustment difficulty of the integrated vertical optical measurement system 2. The collimation adjustment base 2130 may include a second yaw adjustment plate 2131 and a second pitch adjustment plate 2132.

[0237] Figure 24 This is a schematic diagram of the structure of a second yaw adjustment plate 2131 provided in an embodiment of this application, with reference to... Figure 24 As shown, the second yaw adjustment plate 2131 includes an eighth surface 21311 and a ninth surface 21312. The eighth surface 21311 is the lower surface of the second yaw adjustment plate 2131, i.e., the surface facing the negative Z-axis direction, and can be planar. The second yaw adjustment plate 2131 can be connected to the alignment module fixing platform 145 on the receiving platform base 14. For example, the second yaw adjustment plate 2131 is provided with a fourth oblong through hole 21313, the position of which corresponds to the position of the tenth mounting hole 147 on the receiving platform base 14. Fasteners can be used to connect the fourth oblong through hole 21313 to the tenth mounting hole 147, thereby fixing the second yaw adjustment plate 2131 to the alignment module fixing platform 145.

[0238] In some embodiments, the second yaw adjustment plate 2131 can also be fixed to the collimation module fixing platform 145 in other ways, such as by welding, riveting and / or snapping.

[0239] The ninth surface 21312 is the upper surface of the second yaw adjustment plate 2131, that is, the surface facing the positive direction of the Z-axis. The ninth surface 21312 is a curved surface design.

[0240] The second yaw adjustment plate 2131 is provided with a fourth threaded hole 21314, and the second yaw adjustment plate 2131 and the second pitch adjustment plate 2132 can be connected through the fourth threaded hole 21314.

[0241] The second yaw adjustment plate 2131 also includes a first side surface 21315, which is a high-precision surface. For example, the precision of the first side surface 21315 is less than or equal to 10 micrometers.

[0242] The second pitch adjustment plate 2132 is connected to the second yaw adjustment plate 2131. The second pitch adjustment plate 2132 includes a tenth surface 21321 and an eleventh surface 21322. The tenth surface 21321 faces the second yaw adjustment plate 2131 and is curved, for example, convex. The tenth surface 21321 can fit against the ninth surface 21312. The eleventh surface 21322 faces away from the second yaw adjustment plate 2131 and can be planar. It should be noted that the tenth surface 21321 can also be concave, corresponding to the convex surface of the ninth surface 21312, as long as the two can cooperate to provide sliding guidance. The present invention does not limit the cooperation shape of the tenth surface 21321 and the ninth surface 21312.

[0243] Figure 25 This is a schematic diagram of the structure of a second pitch adjustment plate 2132 provided in an embodiment of this application, with reference to... Figure 25 As shown, the tenth surface 21321 is the lower surface of the second pitch adjustment plate 2132, i.e., the surface facing the negative Z-axis direction. The tenth surface 21321 is a curved surface design, and the curvature of the tenth surface 21321 is the same as that of the ninth surface 21312, so that the tenth surface 21321 and the ninth surface 21312 can fit together to realize the motion guidance of the second pitch adjustment plate 2132 relative to the second yaw adjustment plate 2131, so as to facilitate the pitch degree of freedom adjustment of the second pitch adjustment plate 2132.

[0244] The eleventh surface 21322 is the upper surface of the second pitch adjustment plate 2132, that is, the surface facing the positive Z-axis direction. The eleventh surface 21322 is a planar design to facilitate fixing the light source collimation module 213.

[0245] The second pitch adjustment plate 2132 is provided with a fifth oblong through hole 21323, which corresponds one-to-one with the fourth threaded hole 21314. The fifth oblong through hole 21323 and the fourth threaded hole 21314 cooperate to limit the second pitch adjustment plate 2132 relative to the second yaw adjustment plate 2131. For example, the fifth oblong through hole 21323 and the fourth threaded hole 21314 can be connected by a screw, the size of which is larger than the axial depth of the fifth oblong through hole 21323. When the second pitch adjustment plate 2132 is pitched, the screw can move within the fifth oblong through hole 21323, that is, the fifth oblong through hole 21323 can limit the screw, thereby limiting the second pitch adjustment plate 2132 relative to the second yaw adjustment plate 2131.

[0246] It should be noted that the second pitch adjustment plate 2132 includes two ends, and the present invention does not limit the number of fifth waist-shaped through holes 21323 provided at each end.

[0247] Figure 24 and Figure 25Each end of the second pitch adjustment plate 2132 has a corresponding fifth oblong through hole 21323 and a corresponding fourth threaded hole 21314 at each end of the second yaw adjustment plate 2131. In other embodiments, there may be more than one fifth oblong through hole 21323 at each end of the second pitch adjustment plate 2132. When the number of fifth oblong through holes 21323 at each end of the second pitch adjustment plate 2132 is one or two, the pitch angle of the second pitch adjustment plate 2132 can be finely adjusted manually. When the number of fifth oblong through holes 21323 at each end of the second pitch adjustment plate 2132 is three or more, the pitch angle of the second pitch adjustment plate 2132 can be adjusted more precisely by adjusting the tightness of the screws in the outermost oblong through holes on both sides of each end. The setting principle can be referred to the setting of the outer third oblong through hole 21532a and the inner third oblong through hole 21532b of the first pitch adjustment plate 2153.

[0248] The second yaw adjustment plate 2131 also includes two ends, corresponding to the two ends of the second pitch adjustment plate 2132. The number and position of the fourth threaded hole 21314 at each end of the second yaw adjustment plate 2131 correspond one-to-one with the fifth oblong through hole 21323 at the corresponding end of the second pitch adjustment plate 2132.

[0249] In practical applications, the second pitch adjustment plate 2132 can be configured with three fifth oblong through holes at each end.

[0250] The second pitch adjustment plate 2132 is also provided with a fifth threaded hole 21324, which is used to realize the connection between the second pitch adjustment and the light source collimation module 213.

[0251] The second pitch adjustment plate 2132 also includes a second side surface 21325, which is a high-precision surface. For example, the precision of the second side surface 21325 is less than or equal to 10 micrometers. The first side surface 21315 and the second side surface 21325 can be of equal size, so that the second pitch adjustment plate 2132 can provide guidance for the pitch adjustment of the light source collimation module 213.

[0252] The structure of the lens adjustment base 2180 can be the same as that of the collimation adjustment base 2130. For the specific implementation of the lens adjustment base 2180, please refer to the relevant description of the collimation adjustment base 2130, which will not be repeated here.

[0253] Figure 26A This is a schematic diagram of the structure of another vertical optical measurement system 2 provided in the embodiments of this application, with reference to... Figure 26A As shown, the vertical optical measurement system 2 may include three sets of optical measurement subsystems 21, and... Figure 7A The difference between the optical measurement subsystem 21 and the vertical optical measurement system 2 shown is that...Figure 23 The vertical optical measurement system 2 shown shares a single light source collimation module 213 among the three optical measurement subsystems 21.

[0254] In some embodiments, Figure 26B This is a schematic diagram of the structure of another vertical optical measurement system 2 provided in the embodiments of this application, with reference to... Figure 26B As shown, the vertical optical measurement system 2 may also include four sets of optical measurement subsystems 21.

[0255] Specifically, the optical measurement system further includes a light source collimation module 213, an optical measuring instrument is a laser interferometer 214, and the optical measurement components also include a beam guide mirror group 218 and a coupling component 217. The light source collimation module 213 is sequentially connected to at least three beam guide mirror groups 218, and the optical axis of the light source collimation module 213 coincides with the optical axis of the at least three beam guide mirror groups 218. At least three laser interferometers 214 each correspond to a beam guide mirror group 218, and the beam guide mirror group 218 is used to transmit the parallel beam generated by the light source collimation module 213 to the laser interferometer 214. Each laser interferometer 214 is connected to a coupling component 217. The photoelectric conversion module 212 is connected to the coupling component 217 through an optical fiber 2101, and the coupling component 217 is used to transmit the interference signal to the photoelectric conversion module 212. The photoelectric conversion module 212 is electrically connected to the signal processing module 211.

[0256] For example, Figure 27 This is a schematic diagram of the structure of another optical measurement subsystem 21 according to an embodiment of this application, with reference to... Figure 27 As shown, the optical measurement subsystem 21 includes a beam guiding mirror group (not shown in the figure), a laser interferometer 214, a coupling component 217, an optical fiber 2101, a photoelectric conversion module 212, a signal processing module 211, a vertical attitude adjustment base 215, an optical filtering module 216, and a mirror group adjustment base 2180.

[0257] To achieve optimal optical propagation efficiency, the optical axis of the light source collimation module 213 can be fully aligned with the optical axes of the beam guide mirror group 218, the laser interferometer 214, and the optical filter module 216. Furthermore, the optical axes of the beam guide mirror group 218 in the three optical measurement subsystems 21 are also aligned.

[0258] Figure 28 This is a schematic diagram of the structure of another optical measuring instrument according to an embodiment of this application. (Refer to...) Figure 28 As shown, with Figure 14 The vertical optical measuring instrument shown is different from the one shown. Figure 28The vertical optical measuring instrument shown includes a second plane mirror 2147, a second beam splitter 2148, a first cornerstone mirror 2144, a second cornerstone mirror 2145, and a glass slide 2146. The glass slide 2146 can be a quarter-glass slide 2146.

[0259] The detected optical signal includes an interference signal. The second beam splitter 2148 is used to generate a reference light and a measurement light using the beam transmitted by the beam guide mirror group 218. After the measurement light passes through the optical path between the glass slide 2146, the reflecting component 3, the second beam splitter 2148, the first cornerstone mirror 2144, and the first plane mirror, it enters the coupling component 217. After the reference light passes through the optical path between the second beam splitter 2148, the second cornerstone mirror 2145, and the first plane mirror, it enters the coupling component 217 and encounters the measurement light to generate an interference signal.

[0260] Specifically, the laser interferometer 214 may include a second plane mirror 2147, a second beam splitter 2148, a first cornerstone mirror 2144, a second cornerstone mirror 2145, and a quarter-glass slide 2146. The second plane mirror 2147 reflects the horizontal laser beam propagated by the beam guide mirror group 218 into a vertically propagating beam. This vertical beam then propagates to the second beam splitter 2148, which splits an incident laser beam into a measuring arm laser and a reference arm laser, whose polarization vibration angles are perpendicular to each other. The laser beam transmitted through the second beam splitter 2148 is the measuring arm laser, while the laser beam reflected by the second beam splitter 2148 is the reference arm laser. For example, if the transmitted measuring arm laser vibrates vertically, the reflected reference arm laser will have a horizontal polarization vibration direction.

[0261] When the reflected, vertically propagating laser beam enters the second beam splitter 2148, the split transmission measurement arm laser propagates as free-space light to the high-precision reflecting surface of the reflecting component 3. During this process, the measurement arm laser passes through the quarter-glass slide 2146 for the first time, causing its vertical polarization angle to rotate by 45°. Then, the measurement arm laser is reflected back to the second beam splitter 2148 by the high-precision reflecting surface of the reflecting component 3. During this process, the measurement arm laser passes through the quarter-glass slide 2146 a second time, and its angle rotates by 45°, causing its polarization angle to continue rotating by 45°. Therefore, the measurement arm laser, which vibrates vertically, undergoes two consecutive rotations to become a measurement arm laser that vibrates horizontally. Therefore, the measuring arm laser reflected by the high-precision reflective surface of the reflective component 3 to the second beam splitter 2148 will change from transmitted light to reflected light, be reflected by the second beam splitter 2148 to the first cornerstone mirror 2144, and then be reflected twice by the first cornerstone mirror 2144 to the second beam splitter 2148 again. It will then be reflected by the second beam splitter 2148 to the high-precision reflective surface of the reflective component 3, and then reflected back to the second beam splitter 2148 by the reflective component 3. Similarly, the measuring arm laser, which originally vibrates in the horizontal polarization direction, will also pass through the quarter-glass slide 2146 twice during this process. Therefore, the measuring arm laser, which vibrates in the horizontal polarization direction, will continue to change its polarization direction twice, thus becoming a measuring arm laser that vibrates in the vertical polarization direction. The measuring arm laser, which vibrates in the vertical polarization direction, will then pass through the second beam splitter 2148 and propagate to the second plane mirror 2147, and then be reflected by the second plane mirror 2147 into the coupling component 217.

[0262] Meanwhile, the other reference arm laser beam vibrates horizontally, so it is directly reflected by the second beam splitter 2148 to the inside of the second cornerstone mirror 2145. After two reflections inside the second cornerstone mirror 2145, it returns to the second beam splitter 2148, then is reflected by the second beam splitter 2148 to the second plane mirror 2147, and finally reflected by the second plane mirror 2147 to the inside of the coupling assembly 217. Inside the coupling assembly 217, the vertically polarized measuring arm laser and the horizontally polarized reference arm laser meet, generating an interference signal. The coupling assembly 217 couples the interference signal into the optical fiber 2101, where it is transmitted to the photoelectric conversion module 212 in the form of light from the optical fiber 2101. Finally, the photoelectric conversion module 212 converts the interfering optical signal into an electrical signal, which is then transmitted out by the signal processing module 211.

[0263] In this embodiment, the specific implementation of the reflective component 3 can be the same as... Figure 15 The reflection component 3 shown is the same; for details on the implementation of reflection component 3, please refer to [link / reference]. Figure 15 The corresponding introductions will not be repeated here.

[0264] Figure 26A In a corresponding embodiment, the laser interferometer 214 can be fixed to the vertical attitude adjustment base 215 via the third threaded hole 21533 on the vertical attitude adjustment base 215. The vertical attitude adjustment base 215 can provide two degrees of freedom of pitch and yaw, thereby allowing adjustment of the perpendicularity of the emitted laser beam in the laser interferometer 214 relative to the reflector 32.

[0265] During the measurement process, the parallel beam emitted from the collimation module 213 is split into a measurement arm laser and a reference arm laser by the laser interferometer 214. The reference arm laser is retained inside the laser interferometer 214, while the measurement arm laser continues to propagate in space. After being filtered by the optical filtering module 216, it illuminates the reflecting surface of the reflector 32, thus obtaining reflected light. After being filtered by the optical filtering module 216, the reflected light returns to the laser interferometer 214 and coincides with the reference arm laser inside the laser interferometer 214 to generate an interference signal. Then, the photoelectric conversion module 212 calculates the interference signal and converts it into an electrical signal, which is then transmitted through the signal processing module 211 to measure the distance H between the measurement surface 22 and the reflecting surface of the reflector 32.

[0266] In this embodiment, the measurement light is transmitted from the optical fiber 2101 to the light source collimation module 213 and emitted in free space. It is then split into three measurement sub-beams by three sets of beam guiding mirrors 218 and transmitted to the interiors of three sets of laser interferometers 214. Inside the laser interferometers 214, the measurement sub-beams are further split into measurement light and reference light. The reference light is retained inside the laser interferometers 214, while the measurement light continues to propagate in space, illuminating the high-precision, high-power planar reflector 32 above it. The light is then reflected back into the laser interferometers 214 and coincides with the reference light inside, generating an interference signal. This signal is then coupled into the optical fiber 2101 by the coupling component 217, and transmitted through the optical fiber 2101 to the photoelectric conversion module 212. The photoelectric signal is then processed and converted into an electrical signal, which is finally transmitted through the signal processing module 211 to measure the vertical spatial distance H of the workpiece stage 1.

[0267] In this embodiment, the vertical three-degree-of-freedom vertical attitude of the workpiece stage 1 is calculated based on the relative positional relationship of the three sets of optical measurement subsystems 21 and the measured vertical results H1, H2, and H3. First, the plane containing the measured lower surfaces of the three sets of reflectors 32 is taken as the reference plane 33, and the plane containing the three sets of optical measurement subsystems 21 is taken as the measurement plane 22. The height error values ​​of the plane containing the measured lower surfaces of the three sets of reflectors 32 from the reference plane 33 and the corresponding three sets of optical measurement subsystems 21 are recorded to provide calibration constants for subsequent algorithm calculation.

[0268] For the calculation method of the vertical orientation of workpiece stage 1, please refer to [reference needed]. Figures 1 to 16D Some corresponding descriptions are provided, but will not be repeated here.

[0269] In this embodiment, the optical measurement subsystem 21 adopts a split-integration design, integrating the light source 210, photoelectric conversion module 212, and signal processing module 211 externally to the workpiece stage 1. This effectively reduces thermal drift caused by excessive energy consumption of the light source 210, photoelectric conversion module 212, and signal processing module 211. Simultaneously, the laser interferometer 214 employs a four-subdivision high-precision planar interferometer, effectively improving the measurement resolution of the optical measurement system. Furthermore, the reference light and measurement light are essentially symmetrically distributed within the laser interferometer 214, effectively avoiding errors caused by differences in refractive indices between air and the interferometer mirrors. In addition, this embodiment completely decouples the horizontal and vertical measurement interferometers, directly using a vertical interferometer to measure vertical height and tilt, simplifying the assembly and adjustment process of the vertical optical measurement system 2 and significantly reducing procurement and compensation algorithm development costs.

[0270] In some embodiments, the attitude measurement device further includes a horizontal measurement system, which can cooperate with the vertical optical measurement system 2 to measure the six degrees of freedom of the workpiece stage 1.

[0271] For example, Figure 29 This is a schematic diagram of a horizontal measurement system provided in an embodiment of this application, with reference to... Figure 29 As shown, the horizontal measurement system 4 is used to measure the horizontal orientation of the workpiece stage 1. The horizontal orientation of the workpiece stage 1 can include its position along the X-axis, its displacement along the Y-axis, and its rotation angle around the Z-axis. The horizontal measurement system 4 can include an optical measurement system. The optical measurement system can emit measurement light propagating horizontally towards the workpiece stage, and the workpiece stage 1 can reflect the measurement light back to the optical measurement system. Therefore, the distance between the measurement point and the workpiece stage 1 can be determined based on the measurement light and the reflected light.

[0272] For example, the system may include two second-direction measurement systems 41 and two third-direction measurement systems 42. The measurement points corresponding to the two second-direction measurement systems 41 can be measurement points X1 and X2, and the measurement points corresponding to the two third-direction measurement systems 42 can be measurement points Y1 and Y2. The displacement of the workpiece stage 1 along the X-axis can be measured based on measurement points X1 and / or X2, and the displacement of the workpiece stage 1 along the Y-axis can be measured based on measurement points Y1 and / or Y2. The rotation angle of the workpiece stage 1 about the Z-axis can be determined based on the positional difference between measurement points X1 and X2, or based on the positional difference between measurement points Y1 and Y2.

[0273] In some embodiments, the horizontal measurement system 4 may include a second-direction measurement system 41 and two third-direction measurement systems 42. In other embodiments, the horizontal measurement system 4 may also include two second-direction measurement systems 41 and one third-direction measurement system 42.

[0274] Both the second-direction measurement system 41 and the third-direction measurement system 42 may include a laser interferometer.

[0275] exist Figure 29 In one embodiment, the corresponding optical measurement system for the horizontal measurement system 4 is disposed outside the workpiece stage. In other embodiments, the corresponding optical measurement system for the horizontal measurement system 4 may also be disposed on the workpiece stage.

[0276] As described above, in the attitude measurement device provided in this application embodiment, the reflective component is disposed above the support plate, and the vertical optical measurement system is disposed below the support plate. The measurement light emitted by the optical measurement system passes through the support plate from bottom to top, and is reflected by the reflective component, thus ensuring that the vertical optical measurement system does not affect the objective lens operation of the exposure equipment. Furthermore, since the measurement device is disposed on the workpiece stage, compared to a reflective device disposed on the workpiece stage, the attitude measurement device provided in this application embodiment has a smaller mass and less impact on the movement mass of the workpiece stage, making it more suitable for scenarios with high requirements for the speed and acceleration of the workpiece stage. Simultaneously, the vertical optical measurement system being disposed within the workpiece stage allows it to move synchronously with the workpiece stage, ensuring that the position of the measurement point does not move, thereby improving measurement accuracy. In addition, disposing of the vertical optical measurement system below the support plate shortens the propagation path from the light source to the vertical optical measurement system, simplifying the optical path and effectively reducing the integration difficulty of the entire device.

[0277] This application also provides a vertical attitude measurement method, which can be implemented based on the above-mentioned attitude measurement device. Figure 30 A flowchart of a vertical attitude measurement method provided in this application embodiment is shown below. Figure 30 As shown, the method includes:

[0278] S101: Controls the vertical optical measurement system 2 to emit measurement light.

[0279] In this embodiment, the measuring light passes through the light-transmitting hole 132 in the workpiece stage 1 along a first direction and is incident on the reflecting assembly 3. The workpiece stage 1 includes at least a support plate 134, which has a first surface for supporting the workpiece. The light-transmitting hole 132 penetrates the support plate 134. The reflecting assembly 3 is located on the side of the support plate 134 near the first surface, and is used to reflect the light beam incident on the reflecting assembly 3. The first direction is parallel to the thickness direction of the support plate 134.

[0280] S102: The vertical optical measurement system 2 receives the reflected light obtained by the reflection component 3 reflecting the measurement light.

[0281] In this embodiment of the application, the reflected light can pass through the light-transmitting hole 132 in the opposite direction to the first direction.

[0282] S103: Vertical optical measurement system 2, which determines the vertical orientation of workpiece stage 1 based on the measurement light and reflected light.

[0283] In this embodiment, the vertical optical measurement system 2 includes at least three sets of optical measurement subsystems 21. The optical measurement subsystems 21 are used to emit measurement light and receive reflected light. The measurement light emitted by each set of optical measurement subsystems 21 is reflected by the reflective component 3 to obtain the corresponding reflected light.

[0284] When determining the vertical orientation of the workpiece stage 1, the distance between the measurement point of each optical measurement subsystem 21 and the reflection component 3 can be determined based on the measurement light and the corresponding reflected light of each optical measurement subsystem 21. Then, the vertical orientation of the workpiece stage 1 is determined based on the distance between each measurement point and the reflection component 3.

[0285] The vertical orientation of the workpiece stage 1 includes the angle of deviation of the measurement surface relative to the second direction and the angle of deviation of the measurement surface relative to the third direction. The measurement surface 22 is a plane defined by the measurement points of at least three sets of optical measurement subsystems 21. The first direction, the second direction, and the third direction are mutually perpendicular. The measurement points may include a first measurement point A, a second measurement point B, and a third measurement point C. For example, the first direction may be the Z-axis direction, the second direction may be the X-axis direction, and the third direction may be the Y-axis direction.

[0286] Based on the distance between the first measurement point A and the second measurement point B, and the distances between the first measurement point A and the second measurement point B and the reflective component 3, the deflection angle of the measurement surface relative to the second direction can be determined. The specific calculation method can be found in formula (1), and will not be repeated here.

[0287] Based on the distance between the third measurement point and the reflective component 3, and the initial distance between the third measurement point C and the reflective component 3, the deflection angle of the measurement surface relative to the third direction can be determined. The specific calculation method can be referred to formula (2) for details, which will not be repeated here.

[0288] This application also provides a semiconductor processing apparatus, which includes the attitude measurement device described above.

[0289] It is understood that the attitude measurement device provided in this application embodiment can be applied in a lithography machine to measure the vertical attitude of the workpiece stage 1. In some embodiments, the attitude measurement device provided in this application embodiment can also be applied in other semiconductor processing equipment, such as wafer processing equipment, to measure the vertical attitude of the wafer during wafer processing.

[0290] Although this application has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art should understand that various changes in form and detail may be made thereto without departing from the spirit and scope of this application.

Claims

1. A posture measuring apparatus characterized by comprising: The utility model relates to a vertical optical measurement system and a workpiece table, and belongs to the technical field of optical measurement. The utility model discloses a workpiece table (1), the workpiece table (1) at least includes support plate (134), the support plate (134) has first surface, and the first surface is used to carry workpiece;The support plate (134) is equipped with the through hole (132) of passing through the support plate (134) on; Reflective component (3), the reflective component (3) is located the support plate (134) is close to the first surface one side, the reflective component (3) is used to reflect the light beam of incidence to the reflective component (3); Vertical optical measurement system (2), the vertical optical measurement system (2) is located the support plate (134) is away from the first surface one side;The vertical optical measurement system (2) is used for emitting measurement light, the measurement light can pass through the through hole (132) and be incident to the reflective component (3) along first direction, and the reflective component (3) is reflected to get reflected light, the reflected light can pass through the through hole (132) along the opposite direction of first direction;The vertical optical measurement system (2) is also used for receiving the reflected light, and according to the measurement light and the reflected light, determines the vertical attitude of the workpiece table (1);Wherein, the first direction is parallel to the thickness direction of the support plate (134).

2. The attitude measuring apparatus according to claim 1, characterized by The workpiece table (1) includes a workpiece receiving table (13) and a receiving table base (14). The workpiece receiving table (13) includes a side wall (135) and the support plate (134), the support plate (134) is arranged at one end of the side wall (135) along the first direction, and the first surface is away from the side wall (135), and the receiving table base (14) is arranged at the other end of the side wall (135) along the first direction. The workpiece receiving table (13) and the receiving table base (14) jointly enclose a closed containing space (131), the vertical optical measurement system (2) is arranged in the containing space (131), and the vertical optical measurement system (2) is connected with the receiving table base (14).

3. The attitude measuring apparatus according to claim 2, characterized by The vertical optical measurement system (2) includes at least three groups of optical measurement subsystems (21), and the at least three groups of optical measurement subsystems (21) are arranged on the receiving table base (14) with intervals. The optical measurement subsystem (21) is used for emitting the measurement light and receiving the reflected light, wherein the measurement light emitted by each group of optical measurement subsystems (21) is reflected by the reflective component (3) to obtain corresponding reflected light. The optical measurement subsystem (21) is also used for determining the distance between a measurement point and the reflective component (3) according to the measurement light and the corresponding reflected light of the measurement light, and the distances between the at least three groups of measurement points and the reflective component (3) are used to determine the vertical attitude of the workpiece table (1).

4. The attitude measuring apparatus according to claim 3, characterized by The optical measurement subsystem (21) includes an optical measurement component and a vertical attitude adjustment base (215), the vertical attitude adjustment base (215) is connected with the receiving table base (14), and the optical measurement component is arranged on the vertical attitude adjustment base (215). The optical measurement assembly is configured to emit the measurement light, receive reflected light corresponding to the measurement light, and determine the distance between the measurement point and the reflection assembly (3) based on the measurement light and the reflected light corresponding to the measurement light. The vertical attitude adjustment base (215) is configured to adjust a vertical attitude of the optical measurement assembly relative to the reflection assembly (3).

5. The attitude measuring apparatus according to claim 4, characterized by The receiving base (14) comprises a mounting platform (142). The vertical attitude adjustment base (215) comprises a fixing plate (2151), a first yaw adjustment plate (2152), and a first pitch adjustment plate (2153). The fixing plate (2151) is connected to the mounting platform (142), and the fixing plate (2151) comprises a second surface (21513) facing away from the mounting platform (142), wherein the second surface (21513) is a curved surface. The first yaw adjustment plate (2152) is connected to the fixing plate (2151), and the first yaw adjustment plate (2152) comprises a third surface (21521) facing the fixing plate (2151) and a fourth surface (21522) facing away from the fixing plate (2151), wherein the third surface (21521) and the fourth surface (21522) are curved surfaces, the extending directions of the third surface (21521) and the fourth surface (21522) are different, and the third surface (21521) is attached to the second surface (21513). The first pitch adjustment plate (2153) is connected to the first yaw adjustment plate (2152), and the first pitch adjustment plate (2153) comprises a fifth surface (21531) facing the first yaw adjustment plate (2152) and a sixth surface (21534) facing away from the first yaw adjustment plate (2152), wherein the fifth surface (21531) is a curved surface, the fifth surface (21531) is attached to the fourth surface (21522), and the sixth surface (21534) is a flat surface.

6. The attitude measuring apparatus according to claim 4, characterized by The optical measurement assembly comprises an optical measurement instrument, a photoelectric conversion module (212), and a signal processing module (211). An optical axis of the photoelectric conversion module (212) coincides with an optical axis of the optical measurement instrument. The optical measurement instrument is configured to generate the measurement light using a light beam emitted by a light source (210), and generate a detection light signal based on reflected light corresponding to the measurement light; the detection light signal can be transmitted to the photoelectric conversion module (212). The photoelectric conversion module (212) is configured to convert the detection light signal into an electrical signal. The signal processing module (211) is electrically connected to the photoelectric conversion module (212), and the signal processing module (211) is configured to process the electrical signal to obtain the distance between the measurement point and the reflection assembly (3).

7. The attitude measuring apparatus according to claim 6, characterized by The optical measurement instrument is a laser interferometer (214), and the optical measurement assembly further comprises a light source collimation module (213). The light source collimation module (213) and the laser interferometer (214) are respectively arranged on opposite sides of the photoelectric conversion module (212), and the signal processing module (211) is arranged on a side of the light source collimation module (213) away from the photoelectric conversion module (212); The light source collimation module (213) is used for generating a parallel light beam, and the parallel light beam can pass through the photoelectric conversion module (212) and enter the laser interferometer (214); The optical axis of the light source collimation module (213), the optical axis of the photoelectric conversion module (212) and the optical axis of the laser interferometer (214) are coaxial, and the optical axis of the laser interferometer (214) passes through the light transmission hole (132).

8. The attitude measuring apparatus according to claim 6, characterized by The optical measurement instrument is a laser interferometer (214), and the detection light signal is an interference signal; the optical measurement system further comprises a light source collimation module (213), and the optical measurement assembly further comprises a light beam transmission lens group (218) and a coupling assembly (217); The light source collimation module (213) is sequentially connected with at least three groups of the light beam transmission lens group (218), and the optical axis of the light source collimation module (213) coincides with the optical axis of at least three groups of the light beam transmission lens group (218); At least three laser interferometers (214) correspond to one group of the light beam transmission lens group (218) respectively, and the light beam transmission lens group (218) is used for transmitting the parallel light beam generated by the light source collimation module (213) to the laser interferometer (214); Each laser interferometer (214) is connected with one group of the coupling assembly (217); The photoelectric conversion module (212) is connected with the coupling assembly (217) through an optical fiber (2101), and the coupling assembly (217) is used for transmitting the interference signal to the photoelectric conversion module (212) through the optical fiber (2101); The photoelectric conversion module (212) is electrically connected with the signal processing module (211).

9. The attitude measuring apparatus according to claim 8, characterized by The optical measurement subsystem (21) further comprises a collimation adjustment base (2130) and at least three lens group adjustment bases (2180); At least three lens group adjustment bases (2180) are arranged on the receiving table base (14), and each group of the light beam transmission lens group (218) is arranged on one lens group adjustment base (2180); The collimation adjustment base (2130) comprises a second yaw adjustment plate (2131) and a second pitch adjustment plate (2132); The second yaw adjustment plate (2131) is connected with the receiving table base (14), the second yaw adjustment plate (2131) comprises opposite eighth and ninth surfaces (21311 and 21312), the eighth surface (21311) faces the receiving table base (14), and the eighth surface (21311) is a plane, and the ninth surface (21312) is away from the receiving table base (14), and the ninth surface (21312) is a curved surface; The second pitch adjusting plate (2132) is connected with the second yaw adjusting plate (2131), the second pitch adjusting plate (2132) comprises a tenth surface (21321) facing the second yaw adjusting plate (2131) and an eleventh surface (21322) facing away from the second yaw adjusting plate (2131), the tenth surface (21321) is a curved surface, and the tenth surface (21321) is attached to the ninth surface (21312), and the eleventh surface (21322) is a flat surface.

10. The attitude measuring apparatus according to claim 9, characterized by The second yaw adjusting plate (2131) further comprises a first side surface (21315), and the second pitch adjusting plate (2132) further comprises a second side surface (21325), the first side surface (21315) is attached to the second side surface (21325).

11. The attitude measuring apparatus according to any one of claims 7 to 10, characterized by The reflecting assembly (3) comprises a fixing structure (31) and a reflecting mirror (32), the fixing structure (31) comprises a seventh surface (313) facing the first surface, the reflecting mirror (32) is arranged on the seventh surface (313), and a reflecting surface of the reflecting mirror (32) faces the first surface.

12. The attitude measuring apparatus according to claim 11, characterized by The fixing structure (31) is provided with a avoiding hole (312) penetrating through the fixing structure (31), the avoiding hole (312) is used for providing an avoiding space for assembly of the reflecting mirror (32).

13. The attitude measuring apparatus according to claim 6, characterized by The optical measuring instrument is a spectral confocal lens (219), and depths of field of at least three groups of the spectral confocal lens are same; the optical measuring assembly further comprises a light source collimation module (213) and a coupling assembly (217); The coupling assembly (217) and the spectral confocal lens (219) are arranged on opposite sides of the light source collimation module (213) respectively, and the coupling assembly (217) is connected with the photoelectric conversion module (212) through an optical fiber (2101); The light source collimation module (213) is used for generating a parallel light beam, the parallel light beam can enter the spectral confocal lens (219), and the coupling assembly (217) is used for coupling reflected light emitted by the spectral confocal lens (219) into the optical fiber (2101) to be transmitted to the photoelectric conversion module (212); An optical axis of the coupling assembly (217), an optical axis of the light source collimation module (213) and an optical axis of the spectral confocal lens (219) are coaxial.

14. The attitude measuring apparatus according to claim 13, characterized by The reflecting assembly (3) comprises a fixing structure (31), the fixing structure (31) comprises a seventh surface (313) facing the first surface, the seventh surface (313) is used for reflecting measuring light emitted by the optical measuring sub-system (21) to obtain reflected light, and the seventh surface (313) is within a depth of field of at least three groups of the spectral confocal lens (219).

15. The attitude measuring apparatus according to claim 3, characterized by The vertical optical measurement system (2) includes four groups of optical measurement sub-systems (21), wherein the distance between any one of the optical measurement sub-systems (21) and the reflection component (3) is used to determine a system error; the system error is used to correct the distance between the remaining three groups of optical measurement sub-systems (21) and the reflection component (3); and the corrected distance between the measurement point and the reflection component (3) is used to determine the vertical attitude of the workpiece table (1).

16. The attitude measuring apparatus according to claim 1, characterized by The attitude measurement device further includes a horizontal measurement system, which is used to measure the horizontal attitude of the workpiece table (1).

17. A method of measurement, characterized by, The method comprises: controlling a vertical optical measurement system (2) to emit measurement light, the measurement light being capable of being incident on a reflection component (3) through a light transmission hole (132) in a workpiece table (1) along a first direction; the workpiece table (1) comprising at least a support plate (134), the support plate (134) having a first surface for carrying a workpiece; the light transmission hole (132) penetrating through the support plate (134); the reflection component (3) being located on a side of the support plate (134) close to the first surface, the reflection component (3) being used to reflect a light beam incident on the reflection component (3); wherein the first direction is parallel to the thickness direction of the support plate (134); the vertical optical measurement system (2) receives reflected light obtained by the reflection component (3) reflecting the measurement light; the reflected light is capable of passing through the light transmission hole (132) along the reverse direction of the first direction; the vertical optical measurement system (2) determines the vertical attitude of the workpiece table (1) according to the measurement light and the reflected light.

18. The method of measuring of claim 17, wherein, The vertical optical measurement system (2) includes at least three groups of optical measurement sub-systems (21), which are used to emit the measurement light and receive the reflected light; wherein the measurement light emitted by each group of optical measurement sub-systems (21) is reflected by the reflection component (3) to obtain corresponding reflected light; The vertical optical measurement system (2) determines the vertical attitude of the workpiece table (1) according to the measurement light and the reflected light, comprising: each group of optical measurement sub-systems (21) determines the distance between the measurement point of each group of optical measurement sub-systems (21) and the reflection component (3) according to the measurement light and the corresponding reflected light of the measurement light; determining the vertical attitude of the workpiece table (1) according to the distance between each measurement point and the reflection component (3).

19. The method of measuring of claim 18, wherein, The vertical attitude of the workpiece table (1) includes the deflection angle of the measurement surface (22) relative to the second direction and the deflection angle of the measurement surface relative to the third direction, the measurement surface (22) being a plane determined by at least three groups of optical measurement sub-systems (21) measurement points, the first direction, the second direction and the third direction being perpendicular to each other; the at least three measurement points include a first measurement point, a second measurement point and a third measurement point; The determining the vertical posture of the workpiece table (1) according to the distance between each of the measuring points and the reflection assembly (3) comprises: determining the deflection angle of the measuring surface (22) relative to the second direction according to the distance between the first measuring point and the second measuring point and the distance between each of the first measuring point and the second measuring point and the reflection assembly (3); determining the deflection angle of the measuring surface (22) relative to the third direction according to the distance between the third measuring point and the reflection assembly (3) and the initial distance between the third measuring point and the reflection assembly (3).

20. A semiconductor processing apparatus, characterized by comprising: The posture measuring device according to any one of claims 1 to 16. The posture measuring device according to any one of claims 1 to 16.

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