Chip plastic package process simulation system and method based on virtual reality

Abstract

The invention provides a virtual reality-based chip plastic package process simulation system and method. The system comprises a model construction module, a scene integration module and a behavior interaction module, the model building module is used for building a three-dimensional model related to a chip plastic packaging process; wherein the three-dimensional model comprises an equipment model, a scene model and a role model; the scene integration module is used for rendering the three-dimensional model based on a Unity engine to obtain a virtual scene of the chip plastic packaging process; and the behavior interaction module is used for performing analogue simulation on the operation process of the chip plastic packaging process in response to the operation of the user on the virtual scene. According to the invention, the understanding of employees on the operation process before entering the production line for practice is improved, and the possibility that new employees have problems on the production line is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip plastic packaging process, and in particular to a chip plastic packaging process simulation system and method based on virtual reality. BACKGROUND

[0002] With the vigorous development of the chip industry, the requirements for practitioners become more stringent, and at the same time, the consequences caused by operation problems become more serious, so that the training of practitioners cannot be carried out entirely on the production line, and they need to master some basic knowledge to further train on the production line. At present, most companies train practitioners based on books and ppt training, without intuitive operation demonstration and the severity of the consequences caused by mistakes. When directly operating, due to the different qualities of practitioners and the different degrees of knowledge grasping, there may be illegal operation or error operation in the operation process, resulting in problems of a whole batch of materials and causing serious losses.

[0003] Virtual simulation technology is a low-cost solution that can meet the basic training of practitioners and avoid serious consequences caused by practitioners' unfamiliarity with the steps. At present, in the existing virtual simulation, virtual and reality are basically combined to restore the operation process in the real workshop, but basically they are presented in the third person perspective, lack of immersion, and basically they are linear processes, with poor effect. SUMMARY

[0004] Therefore, the purpose of the present application is to provide a chip plastic packaging process simulation system and method based on virtual reality to improve the understanding of practitioners about the operation process before entering the production line for practice and reduce the possibility of problems of new practitioners on the production line.

[0005] In order to achieve the above-mentioned purpose, the technical solutions adopted by the present application are as follows: In a first aspect, the present application provides a chip plastic packaging process simulation system based on virtual reality, comprising: a model construction module, a scene integration module and a behavior interaction module; the model construction module is used to establish a three-dimensional model related to the chip plastic packaging process; wherein the three-dimensional model comprises: a device model, a scene model and a role model; the scene integration module is used to render the three-dimensional model based on the Unity engine to obtain a virtual scene of the chip plastic packaging process; the behavior interaction module is used to simulate the operation process of the chip plastic packaging process in response to the operation of the user to the virtual scene.

[0006] Optionally, the behavior interaction module comprises: a learning mode, a practice mode and an examination mode; the learning mode is configured to respond to first operations of the user on the device model and the role model in the virtual scene, so as to enable the user to learn the operation process of the chip packaging process; the practice mode is configured to respond to second operations of the user on the device model and the role model in the virtual scene, so as to enable the user to practice the operation process of the chip packaging process; and the examination mode is configured to respond to third operations of the user on the device model and the role model in the virtual scene, and obtain a first score corresponding to the third operations.

[0007] Optionally, the learning mode is specifically configured to provide prompt information and explanation information of the operation process of the chip packaging process to the user, and respond to first operations of the user on the role model and the device model based on the prompt information of the operation process, to simulate and analogize the operation process of the chip packaging process.

[0008] Optionally, the practice mode is specifically configured to provide prompt information of the operation process of the chip packaging process to the user, and respond to second operations of the user on the role model and the device model based on the prompt information of the operation process, to simulate and analogize the operation process of the chip packaging process.

[0009] Optionally, the practice mode is further configured to, after completion of a preset operation process, display practice questions or consequence prompt information caused by operation errors to the user in the form of a pop-up window, obtain first response results of the user to the practice questions, and determine whether to enter a next operation process based on the first response results; when the first response results are selection errors, the next operation process is not entered, and when the number of selection errors exceeds a preset number, problem analysis of the practice questions is displayed to the user in the form of a pop-up window.

[0010] Optionally, the examination mode is further configured to, after completion of a preset operation process, display examination questions to the user in the form of a pop-up window, obtain second response results of the user to the examination questions, and obtain a second score corresponding to the second response results.

[0011] Optionally, the method further comprises: a result output and analysis module configured to view the operation behavior and the examination score of the user.

[0012] In a second aspect, the present application provides a chip packaging process simulation method based on virtual reality, applied to the chip packaging process simulation system based on virtual reality provided in any of the first aspect, the method comprising: establishing a three-dimensional model related to the chip packaging process; wherein the three-dimensional model comprises: a device model, a scene model and a role model; rendering the three-dimensional model based on the Unity engine to obtain a virtual scene of the chip packaging process; and responding to operations of the user on the virtual scene to simulate and analogize the operation process of the chip packaging process.

[0013] In a third aspect, the present application provides an electronic device, comprising a processor and a memory, the memory storing computer executable instructions capable of being executed by the processor, and the processor executes the computer executable instructions to implement the steps of the method provided in the second aspect.

[0014] In a fourth aspect, the present application provides a computer readable storage medium, the computer readable storage medium storing a computer program, and the computer program is executed by the processor to implement the steps of the method provided in the second aspect.

[0015] The present application has the following beneficial effects: The simulation system and method for chip plastic packaging process based on virtual reality provided by the present application, comprising: a model construction module, a scene integration module and a behavior interaction module; the model construction module is used to establish a three-dimensional model related to the chip plastic packaging process; wherein the three-dimensional model comprises: a device model, a scene model and a role model; the scene integration module is used to render the three-dimensional model based on the Unity engine to obtain a virtual scene of the chip plastic packaging process; and the behavior interaction module is used to simulate and simulate the operation process of the chip plastic packaging process in response to the operation of the user on the virtual scene. The system establishes a virtual scene related to the chip plastic packaging process based on the Unity engine, and the user can simulate and simulate the operation process of the chip plastic packaging process in the virtual scene through interactive operation, thereby improving the understanding of the operation process of the practitioner before entering the production line for practice, and reducing the possibility of problems of new practitioners on the production line.

[0016] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and achieved by the structure particularly pointed out in the specification, claims and drawings.

[0017] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0019] Figure 1 A structure schematic diagram of a simulation system for chip plastic packaging process based on virtual reality provided by the present application is shown in the figure. Figure 2 A 3D modeling scene schematic diagram provided for an embodiment of the present application; Figure 3 A Unity engine running interface effect drawing provided for an embodiment of the present application; Figure 4 A flowchart of a chip plastic packaging process simulation method based on virtual reality provided for an embodiment of the present application; Figure 5 A structural schematic diagram of an electronic device provided for an embodiment of the present application. DETAILED DESCRIPTION

[0020] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] At present, in the existing virtual simulation, virtual and reality are basically combined to restore the operation process in the real workshop, but basically a third-person perspective is presented, lacking of immersion, and basically a linear flow is used, with poor effect.

[0022] Therefore, the chip plastic packaging process simulation system and method based on virtual reality provided in the embodiments of the present application can improve the understanding of the operation process of the practitioners before entering the production line for practice, and reduce the possibility of problems of new practitioners on the production line.

[0023] To facilitate the understanding of the present embodiment, first, a chip plastic packaging process simulation system based on virtual reality disclosed in the embodiments of the present application is introduced in detail. Referring to Figure 1 A structural schematic diagram of a chip plastic packaging process simulation system based on virtual reality, which shows that the system mainly includes the following parts: a model construction module 10, a scene integration module 20 and a behavior interaction module 30.

[0024] The model construction module 10 is used to establish a three-dimensional model related to the chip plastic packaging process; wherein the three-dimensional model includes: a device model, a scene model and a role model.

[0025] In an embodiment, a three-dimensional model involved in a chip plastic packaging process is established by using a three-dimensional modeling software, wherein a flow of the chip plastic packaging process includes chip frame chip arranging, plastic packaging material pretreatment, plastic packaging material arranging, chip frame plastic packaging, and chip frame burr removing. The three-dimensional model includes a device model (chip arranging machine, plastic packaging material preheating machine, plastic packaging machine, burr removing device, and related auxiliary materials), a scene model (factory building, etc.), and a role model (task role such as an employee). A model surface number is less than 500,000, a model precision needs to reach a 0.1 mm level of detail (mainly a chip and a device interface used in a plastic packaging process), and a 2k resolution material map is used. Specifically, three-dimensional modeling is referred to as Figure 2 .

[0026] The scene integration module 20 is configured to render the three-dimensional model based on the Unity engine to obtain a virtual scene of the chip plastic packaging process.

[0027] In an embodiment, the scene model, the role model, and the device model constructed in the three-dimensional modeling software are imported into the Unity engine, a corresponding map is pasted to a material ball, a scene is arranged, the device model is placed in a suitable position, light is added to simulate a light effect in a real scene, the scene is baked, corresponding UI and text are added, and an effect in the scene is closer to reality.

[0028] The behavior interaction module 30 is configured to simulate an operation flow of the chip plastic packaging process in response to an operation of a user on the virtual scene.

[0029] In an embodiment, referring to a Unity engine running interface effect diagram as shown in Figure 3 , various interactive functions are designed in the Unity engine, a user can learn steps of chip plastic packaging, and can insert text explanation and principle explanation in the operation flow. In the embodiment, key step links are set: frame is taken, auxiliary materials are taken, a chip arranging machine is operated, a plastic packaging material preheating machine is operated, a plastic packaging machine is operated, a burr removing device is operated, a logistics system is entered, and a goods shelf is sent into. The user can simulate the operation flow of the chip plastic packaging process by controlling the role model and the device model in the virtual scene, and needs to complete a previous operation step to perform a next operation step. The system can respond to the operation of the user, output a determination result of each operation step, and a determination response time is less than or equal to 100 ms. Meanwhile, when the user operates incorrectly or deviates, the user is prompted about a consequence caused by the incorrect operation or the deviation.

[0030] The chip plastic packaging process simulation system based on virtual reality provided by the embodiment of the application can establish a virtual scene related to the chip plastic packaging process based on a Unity engine, and a user can simulate and simulate the operation process of the chip plastic packaging process in the virtual scene through interactive operation, thereby improving the understanding of the operation process of the user before entering the production line for practice and reducing the possibility of problems of new employees on the production line.

[0031] In an embodiment, the behavior interaction module includes a learning mode, a practice mode and a test mode. When the program is opened, the user enters a selection interface to select the learning mode, the practice mode or the test mode.

[0032] The learning mode is used to respond to the first operation of the user on the device model and the role model in the virtual scene, so that the user learns the operation process of the chip plastic packaging process. In a specific implementation, the learning mode is specifically used to provide prompt information and explanation information of the operation process of the chip plastic packaging process to the user, and respond to the first operation of the user on the role model and the device model based on the prompt information of the operation process, to simulate and simulate the operation process of the chip plastic packaging process.

[0033] Specifically, the learning mode can provide prompt information and explanation information of the operation process of the chip plastic packaging process to the user, that is, each operation step is explained, and the next operation process is always prompted during operation. The operation process explanation can be text explanation, voice explanation or video explanation.

[0034] After the user enters the learning mode, the user can view the explanation information of the current operation step, and operate according to the current operation step displayed on the screen. If the user makes a mistake in operation, the system will prompt the consequences caused by the operation error. In the embodiment of the application, part of the non-standard operation steps (for example, part of the parameters are correct and part of the parameters are incorrect) can be set. After the user completes the non-standard operation step, the system displays the consequences caused by the operation, so as to deepen the impression of the user and improve the teaching effect.

[0035] The practice mode is used to respond to the second operation of the user on the device model and the role model in the virtual scene, so that the user practices the operation process of the chip plastic packaging process. In a specific implementation, the practice mode is specifically used to provide prompt information of the operation process of the chip plastic packaging process to the user, and respond to the second operation of the user on the role model and the device model based on the prompt information of the operation process, to simulate and simulate the operation process of the chip plastic packaging process.

[0036] Specifically, in the practice mode, only prompt information of the operation flow of the chip plastic packaging process is provided to the user, and each operation step will not be explained. After entering the learning mode, the user can operate according to the prompt information of the operation flow.

[0037] Further, the practice mode is also used to show the user the practice question or the consequence prompt information caused by the operation error through the pop-up window after the completion of the preset operation flow, and obtain the first response result of the user to the practice question, and judge whether to enter the next operation flow based on the first response result; when the first response result is a selection error, the next operation flow is not entered, and when the number of selection errors exceeds the preset number of times, the problem analysis of the practice question is shown to the user through the pop-up window.

[0038] In specific implementation, in the practice mode, when the user is operating and reaches the preset operation flow, a problem pop-up window will pop up to show the user the practice question related to the operation flow. The user can make a selection, and if the selection is wrong, the next step will not be entered. When the user makes a selection error multiple times (i.e., the number of selection errors exceeds the preset number of times), the system can pop up a problem analysis. If the user still makes a selection error after the problem analysis is popped up, the system will pop up an answer. At the same time, the consequences caused by the operation error can be added in part of the operation steps, and when the user enters or completes the operation step, the consequence prompt information caused by the operation error can be shown to the user through the pop-up window.

[0039] In addition, a prompt button is added in the practice mode, and the user can obtain the prompt information of the next operation by clicking the prompt button when he does not know how to proceed to the next step.

[0040] The examination mode is used to respond to the third operation of the user on the device model and the role model in the virtual scene, obtain the first score corresponding to the third operation, and show the user the examination question through the pop-up window after the completion of the preset operation flow, and obtain the second response result of the user to the examination question and the second score corresponding to the second response result.

[0041] In specific implementation, the examination mode assigns scores to each operation step and examination question, and does not provide any prompt during the operation process regardless of whether the operation is correct or not. After all the operations are completed, the scores are displayed, and the user can view the first scores of each operation step and the second scores of each examination question.

[0042] After the user enters the examination mode, the system does not provide prompt information and explanation information of the operation process, and the user needs to operate according to the self-mastery degree, the system scores according to the operation of the user during the operation process, records the first score of each operation process, and after completing the preset operation process, the system pops up the related examination questions, the user selects the answer, and the system records the selection of the user and gives the corresponding second score.

[0043] In an embodiment, the above system further comprises a result output and analysis module for viewing the operation behavior and examination score of the user. In specific implementation, in the background system, the operation behavior, learning achievement, examination score and missed points of the user can be viewed, so that the training personnel can understand the advantages and disadvantages of each student and carry out targeted teaching.

[0044] Taking the operation of the film arranging machine in the integrated circuit production workshop as an example, after the student (user) enters the virtual production workshop (i.e. the virtual scene) and completes the material taking, the student needs to operate the display screen on the film arranging machine, set the material taking position and film arranging position of the gripper, and align the center point. During the movement of the gripper alignment, a slight mechanical movement sound can be heard, increasing the authenticity (herein, in the practice mode, when the center point is not aligned, the aligned button is clicked, a gripper damage caused by misalignment during the descent is popped up, and a repair sheet is popped up, showing the repair time and repair cost, etc.). After the setting is completed, the frame box taken is placed on the feeding position, the frame box enters the innermost part along the feeding position of the rolling belt, is clamped by the clamp, is lowered to the track, the frame is pushed to the track by the push head, and the frame moves along the track to the specified position. The gripper moves above the frame, is lowered to clamp the frame, is raised, moves to the first frame placing position, is lowered to place the frame on the first placing position, and the operation is repeated until all the placing positions are placed. At this time, the operation of the film arranging machine task is completed.

[0045] For ease of understanding, the embodiment of the application further provides an operation training method applied to the chip plastic packaging process simulation system based on virtual reality, mainly including the following steps: (1) Demand analysis: obtaining the specific demand and target of the operation training of the cooperation of enterprises, schools and training institutions in the integrated circuit industry, and determining the function and content of the simulation system.

[0046] (2) 3D modeling: according to the result of demand analysis, the modeling work of scene, role, device model and auxiliary material is carried out by using 3D modeling software. In the modeling process, attention is paid to details and reality, and the quality of the model is ensured.

[0047] (3) Unity engine development: Import the model into the Unity engine, conduct scene and integration, interaction design and logic programming. Through continuous testing and optimization, ensure the stability and smoothness of the simulation system.

[0048] (4) Content production: According to the requirements of operation training, produce supporting task cases and teaching materials, and integrate them into the simulation system.

[0049] (5) Test and evaluation: Test and evaluate the simulation system by professional personnel and students, collect feedback, and improve and perfect the system.

[0050] (6) Promotion and application: The developed simulation system is promoted to enterprises, schools and training technicians in the integrated circuit industry for practical application and further collection of modification suggestions.

[0051] The above system provided by the embodiment of the present application can quickly enable the practitioner to master the operation steps and knowledge by simulating the standard operation of each step in the chip plastic packaging process and adding knowledge points (i.e. prompt information and explanation information), and at the same time, since the user needs to interact with the operation, compared with reading books and PPT, the user's learning interest and experience can be improved. In terms of non-standard operation, part of the steps of illegal operation are added in the system, and the consequences of illegal operation (such as direct economic loss, equipment damage, etc.) are also shown, so as to clarify the necessity of correct operation and deepen the impression of the user. Through this way, the practitioner's understanding of the operation process before entering the production line for practice can be improved, thereby reducing the possibility of problems of newly trained practitioners on the production line.

[0052] For the chip plastic packaging process simulation system based on virtual reality provided by the foregoing embodiment, the embodiment of the present application further provides a chip plastic packaging process simulation method based on virtual reality, referring to the flowchart of a chip plastic packaging process simulation system based on virtual reality shown in Figure 4 The method mainly includes the following steps S401 to S403: Step S401: Establish a three-dimensional model related to the chip plastic packaging process; wherein the three-dimensional model includes: a device model, a scene model and a role model.

[0053] Step S402: Render the three-dimensional model based on the Unity engine to obtain a virtual scene of the chip plastic packaging process.

[0054] Step S403: In response to the operation of the user to the virtual scene, simulate the operation process of the chip plastic packaging process.

[0055] The chip plastic packaging process simulation method based on virtual reality provided by the embodiment of the present application can establish a virtual scene related to the chip plastic packaging process based on a Unity engine, and a user can simulate the operation process of the chip plastic packaging process in the virtual scene through interactive operation, thereby improving the understanding of the operation process of the practitioner before entering the production line for practice, and reducing the possibility of problems of new practitioners on the production line.

[0056] It should be noted that the method provided by the embodiment of the present application has the same implementation principle and technical effects as the foregoing system embodiments, and for brief description, the part not mentioned in the method embodiment can refer to the corresponding content in the foregoing system embodiments.

[0057] The embodiment of the present application also provides an electronic device, specifically, the electronic device includes a processor and a storage device; the storage device stores a computer program, and the computer program performs the method according to any one of the above embodiments when executed by the processor.

[0058] Figure 5 The structure diagram of an electronic device provided by the embodiment of the present application is shown, and the electronic device 100 includes a processor 50, a memory 51, a bus 52 and a communication interface 53, the processor 50, the communication interface 53 and the memory 51 are connected through the bus 52; the processor 50 is used to execute the executable modules stored in the memory 51, such as a computer program.

[0059] The memory 51 can include a high-speed random access memory (RAM, Random Access Memory), and can also include a non-volatile memory, such as at least one disk memory. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 53 (which can be wired or wireless), and the Internet, a wide area network, a local area network, a metropolitan area network, etc. can be used.

[0060] The bus 52 can be an ISA bus, a PCI bus or an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, Figure 5 Only one bidirectional arrow is used in the figure, but it does not mean that there is only one bus or one type of bus.

[0061] The memory 51 is used to store a program, and the processor 50 executes the program after receiving an execution instruction. The method executed by the device defined by the flow process disclosed in any one of the foregoing embodiments of the present application can be applied to the processor 50 or realized by the processor 50.

[0062] The processor 50 can be an integrated circuit chip with signal processing capability. In implementation, each step of the above method can be completed by integrated logic circuit of hardware in the processor 50 or by instructions in the form of software. The processor 50 described above can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component. Each method, step and logic block diagram disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor. The steps of the method disclosed in combination with the embodiments of the present application can be directly embodied as a hardware code processor for execution, or a combination of hardware and software modules in the code processor for execution. The software module can be located in a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium in the art. The storage medium is located in the memory 51, and the processor 50 reads the information in the memory 51, and combines the hardware to complete the steps of the above method.

[0063] The computer program product of the readable storage medium provided by the embodiments of the present application includes a computer readable storage medium storing program codes, and the program codes include instructions for executing the method described in the foregoing method embodiments. For specific implementation, reference can be made to the foregoing method embodiments, which will not be described here.

[0064] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the parts of the present application that essentially contribute to the prior art or the parts of the technical solutions can be embodied in the form of software products. The computer software product is stored in a storage medium and includes instructions for making a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0065] Finally, it should be noted that: the above-described embodiments are only specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit them. The protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily think of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed by the present application, or make equivalent replacements to some of the technical features. The modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A virtual reality-based chip plastic packaging process simulation system, characterized in that, The simulation system comprises a model construction module, a scene integration module and a behavior interaction module. The model construction module is configured to establish a three-dimensional model related to a chip plastic packaging process, wherein the three-dimensional model comprises a device model, a scene model and a role model. The scene integration module is configured to render the three-dimensional model based on a Unity engine to obtain a virtual scene of the chip plastic packaging process. The behavior interaction module is configured to simulate an operation process of the chip plastic packaging process in response to an operation of a user on the virtual scene. The behavior interaction module comprises a learning mode, a practice mode and an examination mode.

2. The system of claim 1, wherein, The learning mode is configured to enable the user to learn the operation process of the chip plastic packaging process in response to a first operation of the user on the device model and the role model in the virtual scene. The practice mode is configured to enable the user to practice the operation process of the chip plastic packaging process in response to a second operation of the user on the device model and the role model in the virtual scene. The examination mode is configured to enable the user to obtain a first score corresponding to a third operation of the user on the device model and the role model in the virtual scene. The learning mode is specifically configured to provide prompt information and explanation information of the operation process of the chip plastic packaging process to the user, and simulate the operation process of the chip plastic packaging process in response to the first operation of the user on the role model and the device model based on the prompt information of the operation process.

3. The system of claim 2, wherein, The practice mode is specifically configured to provide prompt information of the operation process of the chip plastic packaging process to the user, and simulate the operation process of the chip plastic packaging process in response to the second operation of the user on the role model and the device model based on the prompt information of the operation process.

4. The system of claim 2, wherein, The practice mode is further configured to display an exercise question or consequence prompt information caused by an operation error to the user through a pop-up window after a preset operation process is completed, obtain a first response result of the user on the exercise question, and determine whether to enter a next operation process based on the first response result.

5. The system of claim 4, wherein, When the first response result is a selection error, the next operation process is not entered, and when a number of selection errors exceeds a preset number, the exercise question is displayed to the user through a pop-up window. The examination mode is further configured to display an examination question to the user through a pop-up window after a preset operation process is completed, obtain a second response result of the user on the examination question and a second score corresponding to the second response result.

6. The system of claim 2, wherein, The simulation system further comprises a result output and analysis module configured to view an operation behavior and an examination score of the user.

7. The system of claim 1, wherein, The method is applied to the simulation system and comprises the following steps. A three-dimensional model related to a chip plastic packaging process is established, wherein the three-dimensional model comprises a device model, a scene model and a role model. 8.A virtual reality-based chip plastic packaging process simulation method, characterized in that, ​ ​ rendering the three-dimensional model based on a Unity engine to obtain a virtual scene of the chip plastic packaging process; in response to an operation of a user on the virtual scene, simulating and modeling an operation flow of the chip plastic packaging process.

9. An electronic device, comprising: comprising a processor and a memory, the memory storing computer executable instructions capable of being executed by the processor, and the processor executes the computer executable instructions to implement the steps of the method of claim 8.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, the computer program is executed by the processor to implement the steps of the method of claim 8. the computer program is executed by the processor to implement the steps of the method of claim 8.

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