Device for leveling warpage of substrate

Abstract

The invention provides a substrate warping leveling device which comprises a first limiting conveying mechanism, a leveling mechanism and a second limiting conveying mechanism which are sequentially arranged in the conveying direction of a substrate. The first limiting conveying mechanism, the leveling mechanism and the second limiting conveying mechanism are respectively provided with a first conveying gap, a leveling gap and a second conveying gap which are used for conveying a substrate; the leveling mechanism has an initial working condition that the leveling gap is located at the first position and a correction working condition that the leveling gap is located at the second position; and the second position is a position capable of enabling the part, located in the leveling gap, on the substrate to be bent in the direction opposite to the warping direction. According to the substrate warping leveling device, the leveling effect and the leveling efficiency of the substrate can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of substrate preparation, in particular to a substrate warping flattening device. BACKGROUND

[0002] The coreless packaging substrate is prone to warping in the preparation process due to the lack of core board support. The traditional flattening method and device of the packaging substrate are not suitable for the flattening of the coreless packaging substrate, and there are problems such as poor flattening effect and poor warping correction effect, which need to be solved urgently. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a substrate warping flattening device to solve the above technical problems.

[0004] The present application provides a substrate warping flattening device, which comprises a first limiting conveying mechanism, a flattening mechanism and a second limiting conveying mechanism arranged in sequence in the conveying direction of the substrate. The flattening mechanism can move back and forth in the first direction and has an initial working condition in which the flattening gap is in the first position and a correction working condition in which the flattening gap is in the second position in the first direction; the second position is a position that can make the part of the substrate in the flattening gap bend in the direction opposite to the warping direction; When the substrate is conveyed through the first conveying gap and the flattening gap to the second conveying gap, the flattening mechanism is controlled to switch from the initial working condition to the correction working condition; when the substrate leaves the second conveying gap, the flattening mechanism is controlled to switch from the correction working condition to the initial working condition; Wherein, the first direction is the vertical direction of the substrate conveying direction, and the distance between the first position and the second position is determined by the warping height of the substrate.

[0005] Optionally, the flattening mechanism comprises a first roller and a second roller movably arranged up and down, and the flattening gap is between the first roller and the second roller; The first roller and the second roller are connected with a first driving member, and the first driving member drives the first roller and the second roller to move back and forth in the first direction.

[0006] Optionally, the first limiting conveying mechanism comprises a first fixed rod, a third roller and a fourth roller movably arranged up and down on the first fixed rod, and the first conveying gap is between the third roller and the fourth roller; The fourth roller is connected to the second driving member, which drives the fourth roller to roll in order to convey the substrate located in the first conveying gap.

[0007] Optionally, the second limiting transmission mechanism includes a second fixed rod and a fifth roller and a sixth roller that are movably disposed on the second fixed rod, and the fifth roller and the sixth roller have the second transmission gap between them; The sixth roller is connected to the third driving member, which drives the sixth roller to roll in order to convey the substrate located in the second conveying gap.

[0008] Optionally, it also includes: A first conveying mechanism is configured to be located on one side of the first limiting conveying mechanism for conveying the substrate to the first limiting conveying mechanism. A warpage measuring mechanism is configured to be located above the first conveying mechanism for measuring the warpage height of the substrate.

[0009] Optionally, the distance between the first position and the second position is positively correlated with the warp height of the substrate and is less than the warp height of the substrate.

[0010] Optionally, the distance between the first position and the second position is determined by the thickness and warpage height of the substrate, and is positively correlated with the warpage height of the substrate and negatively correlated with the thickness of the substrate.

[0011] Optionally, the conveying speed of the substrate is determined based on the thickness and warpage height of the substrate, and is negatively correlated with the warpage height of the substrate and positively correlated with the thickness of the substrate.

[0012] Optionally, the transfer speed of the substrate is calculated using the following formula: ; in, The conveying speed of the substrate is [missing information]. The thickness of the substrate is given. The warpage height of the substrate is [value missing]. As the first coefficient, As the second coefficient, It is the third coefficient.

[0013] Optionally, the distance between the first position and the second position is calculated using the following formula: ; in, The distance between the first position and the second position is... The warpage height of the substrate is [value missing]. The thickness of the substrate is given. It is the fourth coefficient. It is the fifth coefficient.

[0014] As described above, this application provides a substrate warping and leveling device. It achieves substrate leveling by setting a first limiting conveying mechanism, a leveling mechanism, and a second limiting conveying mechanism. The first limiting conveying mechanism conveys the substrate to the leveling and second limiting conveying mechanisms. When the substrate reaches the second limiting mechanism, the leveling mechanism switches from its initial operating state to a correction operating state, applying force to the portion of the substrate within the leveling gap. The force-bearing portion of the substrate bends in the opposite direction to the warping direction. When the substrate leaves the leveling gap, it springs back to a certain extent. The springback height cancels out the bending height generated in the leveling gap, thus bringing the substrate to a flat state and achieving substrate warping and leveling. Simultaneously, the distance between the first and second positions is the height to which the substrate can bend in the opposite direction to the warping direction under the force applied by the leveling mechanism. Determining the distance between the first and second positions by the warping height of the substrate allows for full consideration of the influence of substrate internal stress, size, material, and other factors on its springback, effectively evaluating the springback height of the substrate after the external force applied by the leveling mechanism is removed, thereby effectively improving the leveling effect. The substrate warping and leveling device of this application can effectively improve the leveling effect of the substrate, especially when applied to the leveling of coreless packaging substrates. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the layer structure of a coreless packaging substrate in an embodiment of this application; Figure 2 This is a schematic diagram of the support layer core board structure with coreless packaging substrates on both sides in an embodiment of this application. Figure 3 This is a schematic diagram of the substrate warping leveling device structure in the initial working condition of the leveling mechanism in the embodiments of this application; Figure 4 This is a schematic diagram of the substrate warping leveling device structure when the leveling mechanism is in the correction condition in the embodiments of this application; Figure 5 This is a cross-sectional schematic diagram of one type of substrate in an embodiment of this application; Figure 6 This is a cross-sectional schematic diagram of another substrate in an embodiment of this application; Figure 7 This is a comparison diagram of the warpage height of the coreless packaging substrate before and after being processed by the substrate warpage leveling device in the embodiments of this application.

[0017] Explanation of reference numerals in the attached drawings: 10-Coreless packaging substrate; 11-First copper layer; 12-Second copper layer; 13-First dielectric layer; 14-Second dielectric layer; 15-Third copper layer; 20-Support layer core board; 30-Leveling mechanism; 31-Leveling gap; 32-First roller; 33-Second roller; 34-First driving component; 35-Servo motor; 36-Lead screw; 40-First limiting transmission mechanism; 41-First transmission gap; 42-First fixing rod; 43-Third roller; 44-Fourth roller; 50-Second limiting transmission mechanism; 51-Second transmission gap; 52-Second fixing rod; 53-Fifth roller; 54-Sixth roller; 60-Substrate; 61-First conveying mechanism; 611-Transmitting roller assembly; 612-Rolling wheel; 613-Bridge body; 62-Second conveying mechanism; 63-Warp measurement mechanism; 64-First metal sensor; 65-Second metal sensor. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] Traditional packaging substrates typically have a relatively thick layer of rigid insulating material in the middle to provide mechanical support and rigidity. This results in problems such as the thickness of traditional packaging substrates and poor heat dissipation performance. With the increasing pursuit of ultra-thin features in smart products, especially with the development of wearable devices, there is a growing demand for ultra-thin packaging substrates with high heat dissipation efficiency, making the limitations of traditional packaging substrates with a certain thickness increasingly apparent.

[0021] Coreless packaging substrates are integrated circuit packaging substrates that do not have the rigid insulating material found in traditional packaging substrates. Because they do not have rigid insulating material, they are thinner, enabling high-density wiring and providing better heat dissipation and electrical performance. While improving the performance of end products, they can also effectively reduce product thickness, and have broad application prospects in high-end smartphones, wearable smart devices, high-density storage devices, and communication chips.

[0022] Figure 1 This is a schematic diagram of one type of coreless packaging substrate, combined with... Figure 1 To further explain the coreless packaging substrate structure. Figure 1 The coreless packaging substrate 10 includes a first copper layer 11, a first dielectric layer 13, a second copper layer 12, a second dielectric layer 14, and a third copper layer 15 stacked sequentially. Figure 1 The coreless packaging substrate 10 does not contain rigid insulating material, has a thinner overall thickness, and exhibits better performance in terms of heat dissipation and electrical properties. The coreless packaging substrate can also be configured to be integrated with... Figure 1 Different hierarchical structures are possible, but no specific restrictions are imposed.

[0023] In the fabrication process of coreless packaging substrates, such as Figure 2 As shown, generally, coreless packaging substrates 10 are first formed on both sides of the support layer core board 20, forming a structure of two coreless packaging substrates 10 sandwiching a support layer core board 20. Then, a depaneling device is used to separate the coreless packaging substrates 10 on both sides of the support layer core board 20 from the middle support layer core board 20, resulting in two coreless packaging substrates 10 with identical structures. The support layer core board can also be set to be similar to... Figure 2Different structures are possible, with no specific restrictions. Because coreless packaging substrates lack rigid insulating material support, they experience significant warping after being separated from the intermediate support layer core board using depaneling equipment. This is due to two main reasons. First, the formation of the coreless packaging substrate on both sides of the support layer core board typically involves multiple high-temperature processes (such as lamination, curing, and electroplating) and chemical treatments. Different materials (copper, resin, and support core board) have different coefficients of thermal expansion, generating and accumulating significant internal stress during heating and cooling. When separated from the intermediate support layer core board, this accumulated stress is released instantaneously, causing the coreless packaging substrate to deform freely, resulting in warping. Second, the coreless packaging substrate itself may have an asymmetrical structure. For example, the circuit density and copper thickness of the top layer may differ from those of the bottom layer. When separated from the intermediate support layer core board, this material asymmetry is exposed, causing the substrate to bend to one side, resulting in warping. Furthermore, improper application of external force during separation can easily lead to warping of the coreless packaging substrate. For example, when separating the coreless packaging substrate from the support core board using a depaneling device, external force needs to be applied to the coreless packaging substrate, and this external force can easily cause warping. Therefore, how to flatten the warped deformation of the coreless packaging substrate is a crucial problem that urgently needs to be solved in its manufacturing process, and it is also a significant factor directly affecting the yield of the coreless packaging substrate.

[0024] In the traditional warpage leveling process of packaging substrates, clamps or rollers are typically used to flatten the substrate. For example, the substrate is placed on a platform and then a certain external force is applied to flatten it. However, these traditional leveling methods and devices are not suitable for coreless packaging substrates. Because coreless packaging substrates lack rigid insulating material, their rigidity is poor, and they have a certain elastic deformation space. When placed on a platform and flattened using pressure plates or rollers, the coreless packaging substrate can change from a bent state to a flat state under the applied external force. However, when the external force is removed, it will spring back and revert to its warped shape. Therefore, the existing leveling process for coreless packaging substrates suffers from poor leveling effect and inadequate warpage correction, which urgently needs to be addressed.

[0025] In view of this, this application provides a substrate warpage leveling device, such as... Figure 3 , Figure 4 As shown, the device can be used to level coreless packaging substrates, effectively correcting their warpage and improving the leveling effect. The device includes: The system includes a first limiting conveying mechanism 40, a leveling mechanism 30, and a second limiting conveying mechanism 50 arranged sequentially in the conveying direction of the substrate 60; the first limiting conveying mechanism 40, the leveling mechanism 30, and the second limiting conveying mechanism 50 each have a first conveying gap 41, a leveling gap 31, and a second conveying gap 51 for conveying the substrate 60. The leveling mechanism 30 can reciprocate in a first direction and has an initial working condition in the first direction where the leveling gap 31 is in a first position and a correction working condition where the leveling gap 31 is in a second position; the second position is a position that allows the portion of the substrate 60 located at the leveling gap 31 to bend in the opposite direction to the warping direction. When the substrate 60 is conveyed to the second conveying gap 51 via the first conveying gap 41 and the leveling gap 31, the leveling mechanism 30 is controlled to switch from the initial working condition to the correction working condition; when the substrate 60 leaves the second conveying gap 51, the leveling mechanism 30 is controlled to switch from the correction working condition to the initial working condition. Wherein, the first direction is the direction perpendicular to the conveying direction of the substrate 60, and the distance between the first position and the second position is determined by the warpage height of the substrate 60.

[0026] When leveling the substrate 60 (e.g., a coreless packaging substrate) is required, the substrate 60 is first placed or conveyed to the first conveying gap 41 on the first limiting conveying mechanism 40. At this time, the leveling mechanism 30 is in its initial working state, and the first conveying gap 41, the leveling gap 31, and the second conveying gap 51 are at the same level. The substrate 60 passes through the leveling gap 31 of the leveling mechanism 30 and reaches the second conveying gap 51 of the second limiting conveying mechanism 50 under the drive of the first limiting conveying mechanism 40. When the substrate 60 is conveyed to the second conveying gap 51, the substrate 60 is simultaneously located in the first conveying gap 41, the leveling gap 31, and the second conveying gap 51. The first limiting conveying mechanism 40 and the second limiting conveying mechanism 50 not only have the function of conveying the substrate 60, but also have the function of limiting. At this time, the leveling mechanism 30 is controlled to switch from the initial working state to the correction working state, so that the second conveying gap 51 moves from the first position to the second position, thereby causing the part of the substrate 60 located in the leveling gap 31 to bend in the opposite direction to the warping direction. The leveling mechanism 30 remains in the correction state, and the second limit conveying mechanism 50 drives the substrate 60 through the leveling mechanism 30 in the correction state, so that each part of the substrate 60 passing through the leveling gap 31 will bend in the opposite direction to the warping direction; when the substrate 60 leaves the leveling gap 31, a certain amount of springback occurs. At this time, the springback height cancels out the bending height generated in the leveling gap 31, thereby making the substrate 60 in a flat state and realizing the warping leveling of the substrate 60.

[0027] The distance between the first and second positions is the height to which the substrate 60 can bend in the opposite direction to the warping direction under the force applied by the leveling mechanism 30. The springback height of the substrate 60 after the external force applied during leveling is removed is affected by multiple factors, including the internal stress, dimensions, and material of the substrate 60. These influencing factors usually coexist on the substrate 60, making the accurate determination and calculation of the springback height extremely complex. However, the internal stress, dimensions, and material of the substrate 60 not only affect the springback height but also have a significant impact on the warping height of the substrate 60. Therefore, in this application, the warpage height of the substrate 60 is used as a reference to determine the distance between the first position and the second position, that is, to determine the height at which the substrate 60 can bend in the opposite direction of the warpage under the force applied by the leveling mechanism 30. This offsets the springback height of the substrate 60 after the external force applied during the leveling process is removed. On the one hand, this avoids directly considering and calculating the influencing factors such as the internal stress, size, and material of the substrate 60 one by one, reducing the computational complexity. On the other hand, the warpage influencing factors and the springback height influencing factors are highly correlated. By using the warpage height of the substrate 60, the distance between the first position and the second position can be accurately evaluated, that is, the springback height of the substrate 60 after the external force applied during the leveling process is removed can be effectively evaluated, thereby effectively improving the leveling effect.

[0028] Specifically, before the substrate 60 is fed into or placed in the first transfer gap 41 of the first limiting transfer mechanism 40, the warp height of the substrate 60 is measured. The warp height is the vertical distance between the highest point of the arch of the substrate 60 and the reference plane. Figure 5 , Figure 6 This is a schematic diagram of substrate 60 with different warping directions. (Example) Figure 5 , Figure 6 As shown, the highest point of the arch on the substrate 60 is point A, and the projections of the two ends of the substrate 60 are points B and C. Taking the line connecting points B and C as a reference plane, the vertical distance of point A from the reference plane is the warpage height of the substrate 60. Figure 3 , Figure 4 In the diagram, the X-axis direction is the conveying direction of the substrate 60, and the Y-axis direction is the first direction. The first direction is perpendicular to the conveying direction of the substrate 60, that is, perpendicular to the main plane of the substrate 60. During the correction process, the leveling mechanism 30 applies external force to the substrate 60 in a vertical direction.

[0029] exist Figure 3 , Figure 4 In the given example, the warping direction of the substrate 60 is upward arching. Therefore, the second position is below the first position. After the upward arching substrate 60 enters the leveling gap 31, under the external force applied by the leveling mechanism 30, the stressed part of the substrate 60 bends downward. When the warping direction of the substrate 60 is downward arching, such as... Figure 6As shown, the second position is located above the first position. After the downward-arched substrate 60 enters the leveling gap 31, the stressed portion of the substrate 60 bends upward under the external force applied by the leveling mechanism 30. Under the action of the leveling mechanism 30, the substrate 60 can produce a deformation opposite to the warping direction. When the external force of the leveling mechanism 30 is removed, the substrate 60 rebounds to a certain extent due to its own characteristics. At this time, the height of the rebound cancels out the reverse bending height generated by the external force of the overall mechanism on the substrate 60, thereby achieving the leveling of the substrate 60.

[0030] In this application, the substrate 60 is leveled by setting a first limiting conveying mechanism 40, a leveling mechanism 30, and a second limiting conveying mechanism 50. The first limiting conveying mechanism 40 conveys the substrate 60 to the leveling mechanism 30 and the second limiting conveying mechanism 50. When the substrate 60 reaches the second limiting mechanism, the leveling mechanism 30 switches from the initial working condition to the correction working condition and applies force to the part of the substrate 60 that is in the leveling gap 31. The force-bearing part of the substrate 60 bends in the opposite direction to the warping direction. When the substrate 60 leaves the leveling gap 31, a certain amount of rebound occurs. The rebound height cancels out the bending height generated in the leveling gap 31, thereby making the substrate 60 in a flat state and realizing the warping leveling of the substrate 60. Meanwhile, the distance between the first and second positions is the height to which the substrate 60 can bend in the opposite direction of the warping direction under the force applied by the leveling mechanism 30. Determining the distance between the first and second positions by the warping height of the substrate 60 can fully consider the influence of factors such as the internal stress, size, and material of the substrate 60 on its springback, effectively assessing the springback height of the substrate 60 after the external force applied by the leveling mechanism 30 is removed, thereby effectively improving the leveling effect. Using the substrate warping leveling device of this application to level the substrate 60 can effectively improve the leveling effect of the substrate 60, especially when applied to the leveling of coreless packaging substrates, it can effectively improve the leveling effect of coreless packaging substrates.

[0031] In some embodiments, such as Figure 3 , Figure 4 As shown, the leveling mechanism 30 includes a first roller 32 and a second roller 33 that are movably arranged vertically, and the leveling gap 31 is provided between the first roller 32 and the second roller 33; The first roller 32 and the second roller 33 are connected to the first driving member 34, and the first driving member 34 drives the first roller 32 and the second roller 33 to reciprocate in the first direction.

[0032] The first driving component 34 includes a servo motor 35 and a lead screw 36. A first roller 32 and a second roller 33 are movably connected to one end of the lead screw 36, and the other end of the lead screw 36 is connected to the servo motor 35. The rotation of the servo motor 35 drives the extension and retraction of the lead screw 36, thereby causing the first roller 32 and the second roller 33 to move in a first direction (i.e.,...). Figure 3 , Figure 4 The servo motor 35 can reciprocate along the Y-axis. It may be a hydraulic servo motor, a permanent magnet synchronous servo motor, an AC servo motor, a DC servo motor, or other types of servo motors; no specific limitation is imposed. The first drive unit 34 can also be configured as other structures capable of driving the first roller 32 and the second roller 33 to reciprocate in the first direction; no specific limitation is imposed. The first roller 32 and / or the second roller 33 can also be connected to a fourth drive unit (not shown in the figure). Under the drive of the fourth drive unit, the first roller 32 and / or the second roller 33 are driven to rotate to assist in the transfer of the substrate 60; no specific limitation is imposed.

[0033] When the first roller 32 and the second roller 33 are switched to the correction mode, the first roller 32 releases pressure on the substrate 60, and the second roller 33 supports the substrate 60, thereby causing the part of the substrate 60 in the leveling gap 31 to bend in the opposite direction to the warping direction.

[0034] In some embodiments, such as Figure 3 , Figure 4 As shown, the first limiting transmission mechanism 40 includes a first fixed rod 42 and a third roller 43 and a fourth roller 44 that are movably disposed on the first fixed rod 42. The third roller 43 and the fourth roller 44 have the first transmission gap 41 between them. The fourth roller 44 is connected to the second driving member (not shown in the figure), which drives the fourth roller 44 to roll to convey the substrate 60 located in the first conveying gap 41.

[0035] The second driving component can include a hydraulic servo motor, a permanent magnet synchronous servo motor, an AC servo motor, a DC servo motor, or any other driving mechanism capable of driving the fourth roller 44; there are no specific limitations. The second driving component drives the fourth roller 44 to roll, thereby moving the substrate 60 in the conveying direction. The third roller 43 and the fourth roller 44 can be solid or hollow rollers; there are no specific limitations. The third roller 43 can also be connected to the second driving component and rotate simultaneously with the fourth roller 44, with the rotation directions of the third roller 43 and the fourth roller 44 being opposite. It can also be connected to other driving components, and the third roller 43 can also be configured to rotate under the traction of the conveyed substrate 60; there are no specific limitations. The third roller 43 and the fourth roller 44 can be rollers with an outer diameter of 32mm, or rollers with other outer diameter parameters can be selected; there are no specific limitations.

[0036] When the substrate 60 enters the first conveying gap 41 between the third roller 43 and the fourth roller 44, if the warping height is greater than the height of the first conveying gap 41, it will be subjected to the external force of the third roller 43, achieving preliminary correction and effectively improving the correction effect.

[0037] In some embodiments, such as Figure 3 , Figure 4 As shown, the second limiting transmission mechanism 50 includes a second fixed rod 52 and a fifth roller 53 and a sixth roller 54 that are movably disposed on the second fixed rod 52. The fifth roller 53 and the sixth roller 54 have a second transmission gap 51 between them. The sixth roller 54 is connected to the third drive member (not shown in the figure), which drives the sixth roller 54 to roll to convey the substrate 60 located in the second conveying gap 51.

[0038] The third driving component can include a hydraulic servo motor, a permanent magnet synchronous servo motor, an AC servo motor, a DC servo motor, or any other driving mechanism capable of driving the sixth roller 54; there are no specific limitations. The sixth roller 54 is driven to roll by the third driving component, thereby moving the substrate 60 in the conveying direction. The fifth roller 53 and the sixth roller 54 can be solid or hollow rollers; there are no specific limitations. The fifth roller 53 can also be connected to the third driving component and rotate simultaneously with the sixth roller 54, with the rotation directions of the fifth roller 53 and the sixth roller 54 being opposite. It can also be connected to other driving components, and the fifth roller 53 can also be configured to rotate under the traction of the conveyed substrate 60; there are no specific limitations.

[0039] When the substrate 60 enters the second conveying gap 51 between the fifth roller 53 and the sixth roller 54, the leveling mechanism 30 is adjusted from the initial working condition to the correction working condition. When the first roller 32 applies external force to the substrate 60, the first limiting conveying mechanism 40 and the second limiting conveying mechanism 50 can limit the substrate 60 to prevent the substrate 60 from moving excessively, thereby successfully completing the pressure application on the substrate 60 and ensuring the leveling effect.

[0040] In some embodiments, such as Figure 3 , Figure 4 As shown, it also includes: The first conveying mechanism 61 is configured to be located on one side of the first limiting conveying mechanism 40 for conveying the substrate 60 to the first limiting conveying mechanism 40. A warpage measuring mechanism 63 is configured above the first conveying mechanism 61 to measure the warpage height of the substrate 60.

[0041] Specifically, the first conveying mechanism 61 includes multiple conveying roller assemblies 611. Each roller conveying assembly includes a rolling roller 612 and a bridge body 613. The rolling roller 612 is movably mounted on the bridge body 613, forming a goose-shaped roller. The substrate 60 is placed on the rolling roller 612, and the substrate 60 is conveyed by the rotation of the rolling roller 612. The warpage measurement mechanism 63 can be a cross-sectional shape laser scanning device, such as a Keyence cross-sectional shape laser scanning device, which calculates the warpage height by scanning the cross-sectional profile of the substrate 60. It can also be any other mechanism capable of measuring warpage height; there are no specific limitations. The outer diameter of the rolling roller 612 can be 32mm, or other outer diameters can be selected; there are no specific limitations.

[0042] When it is necessary to level the substrate 60, the substrates 60 are placed one by one on the first conveying mechanism 61, such as on the roller 612. The warping height of the substrate 60 is measured by the warping measuring mechanism 63 above the first conveying mechanism 61, and the distance between the first position and the second position is determined according to the warping height, so as to achieve the leveling of the warped substrate 60.

[0043] like Figure 3 , Figure 4 As shown, a second conveying mechanism 62 can also be provided on one side of the second limiting conveying mechanism 50. The second conveying mechanism 62 can be configured to include multiple conveying roller assemblies 611, multiple rolling wheels 612, or other structures capable of conveying the substrate 60, such as a conveyor belt assembly, etc., without any specific limitations. The substrate 60 is conveyed away from the leveling mechanism 30 by the second conveying mechanism 62, thereby realizing the automated operation of leveling the substrate 60.

[0044] The substrate warping and leveling device of this application further includes a first metal sensor 64 and a second metal sensor 65. The first metal sensor 64 is used to sense whether the substrate 60 is being transferred to the first limiting transfer mechanism 40, and the second metal sensor 65 is used to sense whether the substrate 60 is being transferred to the second limiting transfer mechanism 50.

[0045] The first metal sensor 64 can be mounted on the first limit transmission mechanism 40, or as follows: Figure 3 , Figure 4 The arrangement shown is between the first conveying mechanism 61 and the first limiting conveying mechanism 40, but the specific arrangement is not limited. The second metal sensor 65 can be located on the second limiting conveying mechanism 50, or as shown in the diagram. Figure 3 , Figure 4 The arrangement shown is between the second conveying mechanism 62 and the second limiting conveying mechanism 50, but the specific arrangement is not limited.

[0046] In some embodiments, the distance between the first position and the second position is positively correlated with the warp height of the substrate 60 and is less than the warp height of the substrate 60. Specifically, the leveling mechanism 30 can be set to a range of 0 to 50 mm in the first direction, that is, the maximum distance between the first position and the second position is 50 mm. Other ranges can also be set according to the actual situation. The different ranges of the leveling mechanism 30 can be adjusted by selecting different models and specifications of the first driving component 34. There are no specific restrictions.

[0047] The warping of substrate 60 is essentially due to uneven residual stress within it. When using traditional direct flattening methods for packaging substrates, such as placing substrate 60 on a platform and then flattening it using pressure plates and rollers, for substrate 60 with a certain degree of resilience, especially for coreless packaging substrates, direct flattening is essentially a purely elastic resistance. That is, external force forces the material to undergo elastic deformation, temporarily suppressing the warped geometry, but without eliminating the internal stress. Instead, it adds new elastic stress and stores more energy in the form of elastic potential energy. Once the constraint is removed, the elastic recovery effect of the coreless packaging substrate will drive the material to release all potential energy and spring back to the warped state, resulting in poor flattening effect of the coreless packaging substrate. In this application, under the correction condition of the flattening mechanism 30, the flattening gap 31 is located in the second position, which allows the portion of substrate 60 located at the flattening gap 31 to bend in the opposite direction to the warping direction. This introduces a new stress field inside substrate 60 that is opposite to the original internal stress direction, thereby releasing and reshaping the internal residual stress. When the external force is removed, the elastically deformed portion will still attempt to recover like a spring, i.e., it will rebound. However, at this point, the internal structure and stress distribution of the material have been permanently rewritten by the plastic deformation, and the rebound amplitude is determined only by the remaining elastic deformation, and it will not rebound to the original warp height. By precisely controlling the distance between the second position and the first position, the amount of reverse bending of the substrate 60 under the action of the leveling mechanism 30 can be controlled to accurately compensate for the rebound amount of the substrate 60, so that the substrate 60 is precisely stabilized in a new, flatter mechanical equilibrium state with significantly reduced internal stress after elastic recovery.

[0048] The greater the warpage height of the substrate 60, the greater its internal elastic potential energy, meaning a greater rebound height when the external force of the leveling mechanism 30 is removed during leveling. The warpage deformation of the substrate 60 includes two types of deformation: plastic deformation and elastic deformation. The rebound height upon removal of the external force is only affected by its elastic deformation height, and generally will not exceed the warpage height before leveling. Therefore, the distance between the first and second positions is set to be less than the warpage height of the substrate 60. Furthermore, the greater the warpage height of the substrate 60, the greater the distance between the first and second positions; conversely, the smaller the warpage height of the substrate 60, the smaller the distance. By determining the distance between the first and second positions of the leveling mechanism 30 based on the degree of warpage deformation of different substrates 60, the differences in warpage deformation between different substrates 60 are fully considered, thereby effectively improving the leveling effect.

[0049] In some embodiments, the distance between the first position and the second position is determined by the thickness and warpage height of the substrate 60, and is positively correlated with the warpage height of the substrate 60 and negatively correlated with the thickness of the substrate 60.

[0050] When the substrate 60 is thicker, its rigidity increases, its elasticity decreases, and it can withstand a lower degree of bending. If the leveling mechanism 30 applies external force to the substrate 60 to make it bend backwards to an excessive height, it may damage the substrate 60, increasing the product defect rate. Furthermore, after the external force of the leveling mechanism 30 is removed, the substrate 60 may not be able to spring back to a flat state due to its poor springback ability, affecting the leveling effect of the substrate 60. Conversely, when the substrate 60 is thinner, its rigidity is lower, its elasticity is higher, and it can withstand a greater degree of bending. In this case, if the external force applied by the leveling mechanism 30 to the substrate 60 to make it bend backwards to an insufficient height, the substrate 60 may spring back to its original warped state after the external force of the leveling mechanism 30 is removed, which will also affect the leveling effect of the substrate 60.

[0051] Therefore, this application fully considers the differences in rigidity and elasticity of substrates 60 with different thicknesses, and uses the thickness and warpage height of substrate 60 to jointly determine the distance between the first position and the second position. The distance is positively correlated with the warpage height of substrate 60 and negatively correlated with the thickness of substrate 60. When the warpage height of substrate 60 is larger, the distance between the first position and the second position is larger; when the warpage height of substrate 60 is smaller, the distance between the first position and the second position is smaller. When the thickness of substrate 60 is thicker, the distance between the first position and the second position is smaller; when the thickness of substrate 60 is thinner, the distance between the first position and the second position is larger. This fully considers the influence of substrate 60 thickness on the leveling effect, effectively improving the leveling effect and yield of substrate 60.

[0052] In some embodiments, the conveying speed of the substrate 60 is determined based on the thickness and warpage height of the substrate 60, and is negatively correlated with the warpage height of the substrate 60 and positively correlated with the thickness of the substrate 60.

[0053] The leveling of substrate 60 is a continuous process, in which multiple substrates 60 are continuously and sequentially fed into the first limiting conveyor mechanism 40, the leveling mechanism 30, and the second limiting conveyor mechanism 50. When the substrate 60 is thin, especially the coreless packaging substrate with poor rigidity, jamming can easily occur if the speed is too high. Specifically, the substrate may get caught on the third roller 43 or the fourth roller 44 of the first limiting conveyor mechanism 40, or on the fifth roller 53 or the sixth roller 54 of the second limiting conveyor mechanism 50, easily causing damage to the substrate 60 and affecting production efficiency. The higher the warpage height of the substrate 60, the greater the deformation of the substrate 60, usually requiring an increased stress time to ensure leveling. Variations in the conveying speed of the substrate 60 affect this stress time. Specifically, the conveying speed of the substrate 60 varies from 0 to 5.0 m / min, but other ranges are also possible and not limited.

[0054] In this application, the conveying speed of substrate 60 is determined by the thickness and warpage height of substrate 60. When substrate 60 is thinner, the first limiting conveying mechanism 40, the leveling mechanism 30, and the second limiting conveying mechanism 50 are used to convey substrate 60 at a slower speed to ensure that the substrate does not jam during the leveling process. When substrate 60 is thicker, the first limiting conveying mechanism 40, the leveling mechanism 30, and the second limiting conveying mechanism 50 are used to convey substrate 60 at a faster speed to ensure production efficiency. When the warpage is higher, the conveying speed of substrate 60 by the first limiting conveying mechanism 40, the leveling mechanism 30, and the second limiting conveying mechanism 50 is reduced to ensure the leveling effect. When the warpage is lower, the conveying speed of substrate 60 by the first limiting conveying mechanism 40, the leveling mechanism 30, and the second limiting conveying mechanism 50 is increased to ensure production efficiency. In this application, determining the conveying speed of substrate 60 by the thickness and warpage height of substrate 60 can achieve multiple technical effects, such as improving the leveling effect, production efficiency, and product yield.

[0055] In some embodiments, the transmission speed of the substrate 60 is calculated using the following formula: ; in, The conveying speed of the substrate 60 The thickness of the substrate 60 is [missing information]. The warpage height of the substrate 60 As the first coefficient, As the second coefficient, It is the third coefficient.

[0056] Specifically, the first coefficient The value can be set to 0.4, 0.5, 0.6, 0.8, 0.9, etc., depending on the actual situation; other values ​​are also acceptable. There are no specific restrictions. Second coefficient The value can be set to 0.01, 0.02, 0.03, 0.04, 0.05, etc., depending on the actual situation; other values ​​are also acceptable. There are no specific restrictions. Second coefficient The value can be set to 1, 1.5, 1.6, 1.8, 2, 2.2, 2.4, 2.5, etc., depending on the actual situation; other values ​​are also acceptable. For example, when... 0.5 When it is 0.02, When it is 2, at this time , The units for H are mm, and the unit for V is m / min.

[0057] In some embodiments, the distance between the first position and the second position is calculated using the following formula: ; in, The distance between the first position and the second position is... The warpage height of the substrate 60 The thickness of the substrate 60 is [missing information]. It is the fourth coefficient. It is the fifth coefficient.

[0058] Specifically, the fourth coefficient The value can be set to 8, 8.5, 9, 9.5, 10, 10.2, 10.5, 10.8, or 11, depending on the actual situation; there are no specific restrictions. Fifth coefficient. The value can be set to 2, 2.2, 2.4, 2.5, 2.6, 2.8, 3, 3.2, 3.5, 3.6, or 4, depending on the actual situation. There are no specific restrictions. For example, when... 0.2 When it is 10.2, at this time , , The units for H are both mm.

[0059] After determining the conveying speed of substrate 60 based on its warp height and thickness, a basic guarantee for production efficiency is provided. Therefore, in this application, the conveying speed of the second limiting conveying mechanism 50 is first determined to ensure production efficiency; then, the distance between the first position and the second position is determined based on the specific warp height and thickness of substrate 60, which can effectively ensure the flattening effect of substrate 60.

[0060] The following, combined with Figure 3 , Figure 5 The following is a specific embodiment to further explain the operation process of this application.

[0061] The substrate warping and leveling device includes a first conveying mechanism 61, a first limiting conveying mechanism 40, a leveling mechanism 30, a second limiting conveying mechanism 50, and a second conveying mechanism 62 arranged sequentially in the conveying direction. A first metal sensor 64 is disposed between the first conveying mechanism 61 and the first limiting conveying mechanism 40, and a second metal sensor 65 is disposed between the second limiting conveying mechanism 50 and the second conveying mechanism 62. The substrate warping and leveling device also includes a warping measurement mechanism 63 and a control center (not shown in the figure) for automated control. The control center receives various information, calculates the distance between the first and second positions, the conveying speed of the substrate 60, and controls the operation of the first conveying mechanism 61, the first limiting conveying mechanism 40, the leveling mechanism 30, the second limiting conveying mechanism 50, the second conveying mechanism 62, and the warping measurement mechanism 63.

[0062] When the substrate warping and leveling device is started, the control center controls the first conveying mechanism 61, the first limiting conveying mechanism 40, the leveling mechanism 30, the second limiting conveying mechanism 50, and the second conveying mechanism 62 to start operating at an initial speed, and activates the warping measurement mechanism 63. The substrate 60 to be leveled is placed or conveyed to the first conveying mechanism 61, and then the warping height of the substrate 60 on the first conveying mechanism 61 is measured by the warping measurement mechanism 63, and the warping height data is sent to the control center. Specifically, the side of the substrate 60 that is arched upwards can be defined as the front side, and all substrates 60 are placed with their front side facing up on the first conveying mechanism 61, i.e. Figure 7 , ​ The placement direction of the substrate 60. When the substrate 60 is conveyed by the first conveying mechanism 61 to a position close to the first limiting conveying mechanism 40, the first metal sensor 64 senses the presence of the substrate 60 and sends a signal indicating the presence of the substrate 60 to the control center. The control center calculates the distance between the first position and the second position and the conveying speed of the substrate 60 based on the warp height sent by the warp measurement mechanism 63 and the pre-stored thickness of the substrate 60. The control center controls the first conveying mechanism 61, the first limiting conveying mechanism 40, the leveling mechanism 30, the second limiting conveying mechanism 50, and the second conveying mechanism 62 to convey the substrate 60 at the calculated conveying speed. When the substrate 60 is conveyed to the second limiting conveying mechanism 50, the second metal sensor 65 senses the presence of the substrate 60 and sends a signal indicating the presence of the substrate 60 to the control center. At this time, the control center controls the leveling mechanism 30 to switch from the initial working condition to the correction working condition, applying external force to the substrate 60. The control center keeps the leveling mechanism 30 in the correction mode. The first conveying mechanism 61, the first limiting conveying mechanism 40, the leveling mechanism 30, the second limiting conveying mechanism 50, and the second conveying mechanism 62 continue to convey the substrate 60 until the substrate 60 leaves the second limiting conveying mechanism 50. When the substrate 60 leaves the second limiting conveying mechanism 50, the second metal sensor 65 detects that no substrate 60 is present and sends a signal indicating that the substrate 60 is not present to the control center. The control center then controls the leveling mechanism 30 to switch from the correction mode to the initial mode. At this time, the next substrate 60 is conveyed or placed on the first conveying mechanism 61, and the leveling operation for the next substrate 60 is started, thereby realizing automated continuous operation.

[0063] The technical effects of this application will be illustrated below by collecting warpage data of multiple coreless packaging substrates before and after flattening.

[0064] The substrate warpage leveling device of this application was used to correct the warpage of multiple coreless package substrates with a length of 623 mm. The results are as follows: ​As shown, the warpage height of the multiple coreless package substrates before correction was between 15.2 and 25.7 mm, while the warpage height of the coreless package substrates after being processed by the substrate warpage leveling device of this application was between 3.6 and 8.5 mm. Generally, a warpage height of <10 mm for a coreless package substrate is considered acceptable. Obviously, the substrate warpage leveling device of this application can effectively achieve the leveling of coreless package substrates.

[0065] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0066] Furthermore, given that details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that embodiments of this application may be practiced without these details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0067] To simplify the description and discussion, and to avoid obscuring the embodiments of this application, well-known power / ground connections to other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application may be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0068] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. The embodiments of this application are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A substrate warping leveling device, characterized in that, The system includes a first limiting conveying mechanism, a leveling mechanism, and a second limiting conveying mechanism arranged sequentially in the conveying direction of the substrate; the first limiting conveying mechanism, the leveling mechanism, and the second limiting conveying mechanism each have a first conveying gap, a leveling gap, and a second conveying gap for conveying the substrate. The leveling mechanism can reciprocate in a first direction and has an initial working condition in the first direction where the leveling gap is in a first position, and a correction working condition where the leveling gap is in a second position. The second position is a position that allows the portion of the substrate located in the leveling gap to bend in the opposite direction to the warping direction; When the substrate is conveyed to the second conveying gap via the first conveying gap and the leveling gap, the leveling mechanism is controlled to switch from the initial working condition to the correction working condition. When the substrate leaves the second transfer gap, the leveling mechanism is controlled to switch from the correction mode to the initial mode. Wherein, the first direction is the direction perpendicular to the substrate conveying direction, and the distance between the first position and the second position is determined by the warpage height of the substrate.

2. The substrate warping leveling device according to claim 1, characterized in that, The leveling mechanism includes a first roller and a second roller that are movably arranged vertically, and the leveling gap is provided between the first roller and the second roller. The first roller and the second roller are connected to the first driving member, and the first driving member drives the first roller and the second roller to reciprocate in the first direction.

3. The substrate warping leveling device according to claim 1, characterized in that, The first limiting transmission mechanism includes a first fixed rod and a third roller and a fourth roller that are movably disposed on the first fixed rod, and the third roller and the fourth roller have the first transmission gap between them; The fourth roller is connected to the second driving member, which drives the fourth roller to roll in order to convey the substrate located in the first conveying gap.

4. The substrate warping leveling device according to claim 1, characterized in that, The second limiting transmission mechanism includes a second fixed rod and a fifth roller and a sixth roller that are movably disposed on the second fixed rod, and the fifth roller and the sixth roller have the second transmission gap between them; The sixth roller is connected to the third driving member, which drives the sixth roller to roll in order to convey the substrate located in the second conveying gap.

5. The substrate warping leveling device according to claim 1, characterized in that, Also includes: A first conveying mechanism is configured to be located on one side of the first limiting conveying mechanism for conveying the substrate to the first limiting conveying mechanism. A warpage measuring mechanism is configured to be located above the first conveying mechanism for measuring the warpage height of the substrate.

6. A substrate warping leveling device according to any one of claims 1 to 5, characterized in that, The distance between the first position and the second position is positively correlated with the warp height of the substrate and is less than the warp height of the substrate.

7. A substrate warping leveling device according to any one of claims 1 to 5, characterized in that, The distance between the first position and the second position is determined by the thickness and warpage height of the substrate, and is positively correlated with the warpage height of the substrate and negatively correlated with the thickness of the substrate.

8. A substrate warping leveling device according to any one of claims 1 to 5, characterized in that, The conveying speed of the substrate is determined based on the thickness and warpage height of the substrate, and is negatively correlated with the warpage height and positively correlated with the thickness of the substrate.

9. A substrate warping leveling device according to claim 8, characterized in that, The transmission speed of the substrate is calculated using the following formula: ； in, The conveying speed of the substrate is [missing information]. The thickness of the substrate is given. The warpage height of the substrate is [value missing]. As the first coefficient, As the second coefficient, It is the third coefficient.

10. A substrate warping leveling device according to claim 9, characterized in that, The distance between the first position and the second position is calculated using the following formula: ； in, The distance between the first position and the second position is... The warpage height of the substrate is [value missing]. The thickness of the substrate is given. It is the fourth coefficient. It is the fifth coefficient.

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