Substrate warpage flattening apparatus

Abstract

The application provides a substrate warping flattening device, which comprises a first limiting conveying mechanism, a flattening mechanism and a second limiting conveying mechanism arranged in sequence in the conveying direction of a substrate, wherein the first limiting conveying mechanism, the flattening mechanism and the second limiting conveying mechanism respectively have a first conveying gap, a flattening gap and a second conveying gap for conveying the substrate; the flattening mechanism has an initial working condition in which the flattening gap is in a first position and a correction working condition in which the flattening gap is in a second position; and the second position is a position capable of bending the part of the substrate in the flattening gap in a direction opposite to the warping direction. The substrate warping flattening device can effectively improve the flattening effect and the flattening efficiency of the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of substrate preparation, in particular to a substrate warping flattening device. BACKGROUND

[0002] The coreless packaging substrate is prone to warping in the preparation process due to the absence of core board support. The flattening method and device of the traditional packaging substrate are not suitable for the flattening of the coreless packaging substrate, and there are problems such as poor flattening effect and poor warping correction effect, which need to be solved urgently. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a substrate warping flattening device to solve the above technical problems.

[0004] The present application provides a substrate warping flattening device, which comprises a first limiting conveying mechanism, a flattening mechanism and a second limiting conveying mechanism arranged in sequence in the conveying direction of the substrate.

[0005] The flattening mechanism can move back and forth in the first direction and has an initial working condition in which the flattening gap is in the first position and a correction working condition in which the flattening gap is in the second position in the first direction; the second position is a position that can make the part of the substrate in the flattening gap bend in the direction opposite to the warping direction;

[0006] When the substrate is conveyed through the first conveying gap and the flattening gap to the second conveying gap, the flattening mechanism is controlled to switch from the initial working condition to the correction working condition; when the substrate leaves the second conveying gap, the flattening mechanism is controlled to switch from the correction working condition to the initial working condition;

[0007] Wherein, the first direction is the vertical direction of the substrate conveying direction, and the distance between the first position and the second position is determined by the warping height of the substrate.

[0008] Optionally, the flattening mechanism comprises a first roller and a second roller movably arranged up and down, and the first roller and the second roller have the flattening gap therebetween;

[0009] The first roller and the second roller are connected with a first driving member, and the first driving member drives the first roller and the second roller to move back and forth in the first direction.

[0010] Optionally, the first limiting conveying mechanism comprises a first fixed rod, a third roller and a fourth roller movably arranged up and down on the first fixed rod, and the third roller and the fourth roller have the first conveying gap therebetween.

[0011] The fourth roller is connected with a second driving member, and the second driving member drives the fourth roller to roll to convey the substrate located in the first conveying gap.

[0012] Optionally, the second limiting conveying mechanism comprises a second fixed rod and a fifth roller and a sixth roller movably arranged on the second fixed rod, and the fifth roller and the sixth roller have the second conveying gap therebetween.

[0013] The sixth roller is connected with a third driving member, and the third driving member drives the sixth roller to roll to convey the substrate located in the second conveying gap.

[0014] Optionally, the substrate conveying device further comprises:

[0015] a first conveying mechanism configured to be located on one side of the first limiting conveying mechanism to convey the substrate to the first limiting conveying mechanism.

[0016] a warping measuring mechanism configured to be located above the first conveying mechanism to measure the warping height of the substrate.

[0017] Optionally, the distance between the first position and the second position is positively correlated with the warping height of the substrate and is less than the warping height of the substrate.

[0018] Optionally, the distance between the first position and the second position is determined by the thickness and the warping height of the substrate, is positively correlated with the warping height of the substrate, and is negatively correlated with the thickness of the substrate.

[0019] Optionally, the conveying speed of the substrate is determined by the thickness and the warping height of the substrate, is negatively correlated with the warping height of the substrate, and is positively correlated with the thickness of the substrate.

[0020] Optionally, the conveying speed of the substrate is calculated by the following formula:

[0021] ;

[0022] wherein, V is the conveying speed of the substrate, T is the thickness of the substrate, W is the warping height of the substrate, a is a first coefficient, b is a second coefficient, c is a third coefficient.

[0023] Optionally, the distance between the first position and the second position is calculated by the following formula:

[0024] ;

[0025] wherein, is a distance between the first position and the second position, is a warping height of the substrate, is a thickness of the substrate, is a fourth coefficient, is a fifth coefficient.

[0026] From the above, it can be seen that the present application provides a substrate warping flattening device, which realizes the flattening of the substrate by setting the first limiting conveying mechanism, the flattening mechanism and the second limiting conveying mechanism. The first limiting conveying mechanism is used to convey the substrate to the flattening mechanism and the second limiting conveying mechanism. When the substrate reaches the second limiting mechanism, the flattening mechanism is switched from the initial working condition to the correction working condition, and force is applied to the part of the substrate in the flattening gap. The stressed part of the substrate bends in the direction opposite to the warping direction. When the substrate leaves the flattening gap, a certain rebound occurs. The rebound height and the bending height generated in the flattening gap are offset, so that the substrate is in a flat state, and the warping flattening of the substrate is realized. At the same time, the distance between the first position and the second position is the height of the substrate that can bend in the opposite direction of the warping direction under the force of the flattening mechanism. The distance between the first position and the second position is determined by the warping height of the substrate, which can fully consider the influence of the internal stress, size, material and other factors of the substrate on the rebound, effectively evaluate the rebound height of the substrate after removing the external force applied by the flattening mechanism, and thus effectively improve the flattening effect. The substrate warping flattening device of the present application can effectively improve the flattening effect of the substrate, especially when applied to the flattening of the coreless packaging substrate, which can effectively improve the flattening effect of the coreless packaging substrate. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present application or related art, the following will briefly introduce the drawings needed to be used in the embodiments or related art description. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0028] Figure 1 It is a schematic diagram of the hierarchical structure of a coreless packaging substrate in an embodiment of the present application.

[0029] Figure 2 It is a schematic diagram of a support layer core plate structure provided with coreless packaging substrates on both sides in an embodiment of the present application.

[0030] Figure 3 It is a schematic diagram of the structure of the substrate warping flattening device when the flattening mechanism is in the initial working condition in an embodiment of the present application.

[0031] Figure 4 Fig. 1 is a schematic view of a substrate warping flattening device structure when the leveling mechanism is in a correction working condition according to an embodiment of the present application;

[0032] Figure 5 Fig. 2 is a schematic view of a cross section of a substrate according to an embodiment of the present application;

[0033] Figure 6 Fig. 3 is a schematic view of a cross section of another substrate according to an embodiment of the present application;

[0034] Figure 7 Fig. 4 is a comparison chart of warping heights of a coreless packaging substrate before and after being processed by a substrate warping flattening device according to an embodiment of the present application.

[0035] Fig. 1 is a schematic view of a substrate warping flattening device structure when the leveling mechanism is in a correction working condition according to an embodiment of the present application; DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application is further described in detail below with reference to specific embodiments and the accompanying drawings.

[0037] It should be noted that, unless otherwise defined, technical terms or scientific terms used in the embodiments of the present application shall have the common meaning understood by one of ordinary skill in the art to which the embodiments of the present application belong. The terms "first", "second", and similar terms used in the embodiments of the present application do not denote any order, quantity, or importance, but are merely used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms do not mean physical or mechanical connection, but can include electrical connection, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are merely used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0038] The middle of the conventional packaging substrate is usually provided with a relatively thick rigid insulating material to provide mechanical support and rigidity, which also leads to the problems of thick and poor heat dissipation performance of the conventional packaging substrate. With the pursuit of ultra-thin characteristics of intelligent products, especially with the development of wearable devices, there is an increasing demand for ultra-thin and high-efficiency heat dissipation packaging substrates, and the limitations of conventional packaging substrates with a certain thickness are gradually highlighted.

[0039] A coreless packaging substrate is an integrated circuit packaging substrate without the rigid insulating material in the conventional packaging substrate. Since the rigid insulating material is not provided, the coreless packaging substrate is thinner, can realize high-density wiring, and has better heat dissipation performance and electrical performance. On the basis of improving the performance of terminal products, it can also effectively reduce the thickness of the products, and has wide application prospects in high-end smart phones, wearable smart devices, high-density memory devices, communication chips, etc.

[0040] Figure 1 is a schematic diagram of one of the coreless packaging substrates, which further explains the structure of the coreless packaging substrate in combination with Figure 1 . Figure 1 The coreless packaging substrate 10 in comprises a first copper layer 11, a first dielectric layer 13, a second copper layer 12, a second dielectric layer 14, and a third copper layer 15 stacked in sequence. In the coreless packaging substrate 10 of Figure 1 , there is no rigid insulating material, and the overall thickness is thinner, and it performs better in terms of heat dissipation, electrical performance, etc. The coreless packaging substrate can also be provided in a different hierarchical structure than Figure 1 , which is not limited in particular.

[0041] In the preparation process of the coreless packaging substrate, such as Figure 2As shown, generally, coreless packaging substrates 10 are first formed on both sides of the support layer core board 20, forming a structure of two coreless packaging substrates 10 sandwiching a support layer core board 20. Then, a depaneling device is used to separate the coreless packaging substrates 10 on both sides of the support layer core board 20 from the middle support layer core board 20, resulting in two coreless packaging substrates 10 with identical structures. The support layer core board can also be set to be similar to... Figure 2 Different structures are possible, with no specific restrictions. Because coreless packaging substrates lack rigid insulating material support, they experience significant warping after being separated from the intermediate support layer core board using depaneling equipment. This is due to two main reasons. First, the formation of the coreless packaging substrate on both sides of the support layer core board typically involves multiple high-temperature processes (such as lamination, curing, and electroplating) and chemical treatments. Different materials (copper, resin, and support core board) have different coefficients of thermal expansion, generating and accumulating significant internal stress during heating and cooling. When separated from the intermediate support layer core board, this accumulated stress is released instantaneously, causing the coreless packaging substrate to deform freely, resulting in warping. Second, the coreless packaging substrate itself may have an asymmetrical structure. For example, the circuit density and copper thickness of the top layer may differ from those of the bottom layer. When separated from the intermediate support layer core board, this material asymmetry is exposed, causing the substrate to bend to one side, resulting in warping. Furthermore, improper application of external force during separation can easily lead to warping of the coreless packaging substrate. For example, when separating the coreless packaging substrate from the support core board using a depaneling device, external force needs to be applied to the coreless packaging substrate, and this external force can easily cause warping. Therefore, how to flatten the warped deformation of the coreless packaging substrate is a crucial problem that urgently needs to be solved in its manufacturing process, and it is also a significant factor directly affecting the yield of the coreless packaging substrate.

[0042] In the traditional warpage leveling process of packaging substrates, clamps or rollers are typically used to flatten the substrate. For example, the substrate is placed on a platform and then a certain external force is applied to flatten it. However, these traditional leveling methods and devices are not suitable for coreless packaging substrates. Because coreless packaging substrates lack rigid insulating material, their rigidity is poor, and they have a certain elastic deformation space. When placed on a platform and flattened using pressure plates or rollers, the coreless packaging substrate can change from a bent state to a flat state under the applied external force. However, when the external force is removed, it will spring back and revert to its warped shape. Therefore, the existing leveling process for coreless packaging substrates suffers from poor leveling effect and inadequate warpage correction, which urgently needs to be addressed.

[0043] In view of this, this application provides a substrate warping leveling device, such as... Figure 3 , Figure 4The device can be used for flattening coreless packaging substrates, effectively corrects the warping deformation, improves the flattening effect, and comprises:

[0044] The device comprises a first limiting conveying mechanism 40, a flattening mechanism 30 and a second limiting conveying mechanism 50 arranged in sequence in the conveying direction of the substrate 60; the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 respectively have a first conveying gap 41, a flattening gap 31 and a second conveying gap 51 for conveying the substrate 60;

[0045] The flattening mechanism 30 can reciprocate in the first direction and has an initial working condition in which the flattening gap 31 is in the first position and a correction working condition in which the flattening gap 31 is in the second position; the second position is a position that can make the part of the substrate 60 in the flattening gap 31 bend in the direction opposite to the warping direction;

[0046] When the substrate 60 is conveyed through the first conveying gap 41, the flattening gap 31 and the second conveying gap 51, the flattening mechanism 30 is controlled to switch from the initial working condition to the correction working condition; when the substrate 60 leaves the second conveying gap 51, the flattening mechanism 30 is controlled to switch from the correction working condition to the initial working condition;

[0047] The first direction is the vertical direction of the conveying direction of the substrate 60, and the distance between the first position and the second position is determined by the warping height of the substrate 60.

[0048] When it is needed to flatten the substrate 60 (for example, a coreless packaging substrate), first, the substrate 60 is placed or conveyed to the first conveying gap 41 on the first limiting conveying mechanism 40, at this time, the flattening mechanism 30 is in the initial working condition, the first conveying gap 41, the flattening gap 31 and the second conveying gap 51 are in the same level, the substrate 60 is driven by the first limiting conveying mechanism 40 to pass through the flattening gap 31 of the flattening mechanism 30 to the second conveying gap 51 of the second limiting conveying mechanism 50. When the substrate 60 is conveyed to the second conveying gap 51, the substrate 60 is located in the first conveying gap 41, the flattening gap 31 and the second conveying gap 51 at the same time, the first limiting conveying mechanism 40 and the second limiting conveying mechanism 50 not only have the effect of conveying the substrate 60, but also have the effect of limiting, at this time, the flattening mechanism 30 is controlled to switch from the initial working condition to the correction working condition, so that the second conveying gap 51 is moved from the first position to the second position, thereby driving the part of the substrate 60 located in the flattening gap 31 to bend in the direction opposite to the warping direction. The flattening mechanism 30 remains in the correction working condition, and the second limiting conveying mechanism 50 drives the substrate 60 to pass through the flattening mechanism 30 in the correction working condition, so that each part of the substrate 60 passing through the flattening gap 31 will bend in the direction opposite to the warping direction; when the substrate 60 leaves the flattening gap 31, a certain rebound occurs, at this time, the rebound height and the bending height generated in the flattening gap 31 are offset, so that the substrate 60 is in a flat state, and the warping of the substrate 60 is flattened.

[0049] The distance between the first position and the second position is the height of the substrate 60 that can be bent in the direction opposite to the warping direction under the force of the flattening mechanism 30. The rebound height of the substrate 60 after the external force of the flattening working condition is removed is affected by multiple factors such as the internal stress, size and material of the substrate 60. These factors usually exist on the substrate 60 at the same time, so that the accurate determination and calculation of the rebound height becomes extremely complex. However, the internal stress, size and material of the substrate 60 not only affect the rebound height, but also have an important influence on the warping height of the substrate 60. Therefore, in this application, the warping height of the substrate 60 is used as a reference benchmark to determine the distance between the first position and the second position, that is, to determine the height of the substrate 60 that can be bent in the direction opposite to the warping direction under the force of the flattening mechanism 30, thereby offsetting the rebound height of the substrate 60 after the external force of the flattening working condition is removed. On the one hand, it can avoid considering and calculating the influence factors such as the internal stress, size and material of the substrate 60 one by one, thereby reducing the calculation complexity. On the other hand, the warping influence factor is highly related to the rebound height influence factor, and the warping height of the substrate 60 can accurately evaluate the distance between the first position and the second position, that is, effectively evaluate the rebound height of the substrate 60 after the external force of the flattening working condition is removed, thereby effectively improving the flattening effect.

[0050] Specifically, before the substrate 60 is sent into or placed in the first conveying gap 41 of the first limiting conveying mechanism 40, the warping height of the substrate 60 is measured, which is the vertical distance between the highest point of the arching of the substrate 60 and the reference plane. Figure 5 、 Figure 6 is a schematic diagram of the substrate 60 with different warping directions. As shown in Figure 5 、 Figure 6 , the highest point of the arching of the substrate 60 is point A, and the projections of the two ends of the substrate 60 are points B and C. The reference plane is the line connecting points B and C, and the vertical distance between point A and the reference plane is the warping height of the substrate 60. In Figure 3 、 Figure 4 , the X-axis direction is the conveying direction of the substrate 60, and the Y-axis direction is the first direction, which is perpendicular to the conveying direction of the substrate 60, i.e., perpendicular to the main plane of the substrate 60. During the correction process, the flattening mechanism 30 applies an external force to the substrate 60 in the perpendicular direction.

[0051] In the example given in Figure 3 、 Figure 4 , the warping direction of the substrate 60 is upward arching, so the second position is below the first position at this time. After the upward arching substrate 60 enters the flattening gap 31, the stressed part of the substrate 60 bends downward under the external force applied by the flattening mechanism 30. When the warping direction of the substrate 60 is downward arching, as shown in Figure 6 , the second position is above the first position. After the downward arching substrate 60 enters the flattening gap 31, the stressed part of the substrate 60 bends upward under the external force applied by the flattening mechanism 30. Through the action of the flattening mechanism 30, the substrate 60 can produce deformation opposite to the warping direction. When the external force of the flattening mechanism 30 is removed, the substrate 60 will rebound due to its own characteristics. At this time, the rebound height and the reverse bending height caused by the external force of the flattening mechanism 30 are offset, thereby realizing the flattening of the substrate 60.

[0052] In the present application, the flattening of the substrate 60 is realized by setting the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50. The first limiting conveying mechanism 40 is used to convey the substrate 60 to the flattening mechanism 30 and the second limiting conveying mechanism 50. When the substrate 60 reaches the second limiting mechanism, the flattening mechanism 30 is switched from the initial working condition to the correction working condition, and the substrate 60 is forced at the position in the flattening gap 31. The forced position of the substrate 60 bends in the direction opposite to the warping direction. When the substrate 60 leaves the flattening gap 31, a certain rebound occurs. The rebound height is offset by the bending height generated in the flattening gap 31, so that the substrate 60 is in a flat state, and the warping flattening of the substrate 60 is realized. At the same time, the distance between the first position and the second position is the height of the substrate 60 that can be bent in the opposite direction of the warping direction under the force of the flattening mechanism 30. The distance between the first position and the second position is determined by the warping height of the substrate 60. The influence of the internal stress, size, material and other factors of the substrate 60 on the rebound can be fully considered, the rebound height of the substrate 60 after removing the external force applied by the flattening mechanism 30 can be effectively evaluated, and the flattening effect can be effectively improved. The substrate warping flattening device of the present application can effectively improve the flattening effect of the substrate 60, especially when applied to the flattening of the coreless packaging substrate, the flattening effect of the coreless packaging substrate can be effectively improved.

[0053] In some embodiments, as shown in Figure 3 、 Figure 4 The flattening mechanism 30 includes a first roller 32 and a second roller 33 movably arranged above and below, and the first roller 32 and the second roller 33 have the flattening gap 31 therebetween.

[0054] The first roller 32 and the second roller 33 are connected with a first driving member 34, and the first driving member 34 drives the first roller 32 and the second roller 33 to reciprocate in the first direction.

[0055] The first driving member 34 includes a servo motor 35 and a lead screw 36. The first roller 32 and the second roller 33 are movably connected with one end of the lead screw 36, and the other end of the lead screw 36 is connected with the servo motor 35. The servo motor 35 is rotated to drive the lead screw 36 to extend and retract, thereby driving the first roller 32 and the second roller 33 to move in the first direction (i.e. Figure 3 、 Figure 4The servo motor 35 can include a hydraulic servo motor, a permanent magnet synchronous servo motor, an alternating current servo motor, a direct current servo motor, etc., or can be other servo motors, and the specific implementation is not limited. The first driving member 34 can also be configured as other structures that can drive the first roller 32 and the second roller 33 to reciprocate in the first direction, and the specific implementation is not limited. The first roller 32 and / or the second roller 33 can also be connected with a fourth driving member (not shown in the figure), and under the driving of the fourth driving member, the first roller 32 and / or the second roller 33 are driven to rotate to assist in the conveying of the substrate 60, and the specific implementation is not limited.

[0056] When the first roller 32 and the second roller 33 are switched to the positions of the correcting working condition, the first roller 32 releases the pressure on the substrate 60, and the second roller 33 supports the substrate 60, so that the part of the substrate 60 in the flattening gap 31 is bent in the direction opposite to the warping direction.

[0057] In some embodiments, as shown in FIGS. Figure 3 , Figure 4 The fourth roller 44 is connected with a second driving member (not shown in the figure), and the second driving member drives the fourth roller 44 to roll to convey the substrate 60 located in the first conveying gap 41.

[0058] The fourth roller 44 is connected with a second driving member (not shown in the figure), and the second driving member drives the fourth roller 44 to roll to convey the substrate 60 located in the first conveying gap 41.

[0059] The second driving member can include a hydraulic servo motor, a permanent magnet synchronous servo motor, an alternating current servo motor, a direct current servo motor, etc., or can be other driving mechanisms that can drive the fourth roller 44, and the specific implementation is not limited. The fourth roller 44 is driven to roll by the second driving member to drive the substrate 60 to move in the conveying direction. The third roller 43 and the fourth roller 44 can be solid rollers or hollow rollers, and the specific implementation is not limited. The third roller 43 can also be connected with the second driving member to rotate simultaneously with the fourth roller 44, or can be connected with other driving members. The third roller 43 can also be configured to rotate under the traction of the conveyed substrate 60, and the specific implementation is not limited. The third roller 43 and the fourth roller 44 can be rollers with an outer diameter of 32 mm, or can be rollers with other outer diameter parameters, and the specific implementation is not limited.

[0060] When the substrate 60 enters the first conveying gap 41 between the third roller 43 and the fourth roller 44, and the warping height is greater than the height of the first conveying gap 41, the substrate 60 will be subjected to an external force of the third roller 43 at this time, thereby achieving preliminary correction and effectively improving the correction effect.

[0061] In some embodiments, as shown in Figure 3 , Figure 4 The second limiting conveying mechanism 50 includes a second fixed rod 52 and a fifth roller 53 and a sixth roller 54 movably arranged above and below the second fixed rod 52, and the second conveying gap 51 is formed between the fifth roller 53 and the sixth roller 54.

[0062] The sixth roller 54 is connected with a third driving member (not shown in the figure), and the third driving member drives the sixth roller 54 to roll to convey the substrate 60 located in the second conveying gap 51.

[0063] The third driving member can include a hydraulic servo, a permanent magnet synchronous servo, an alternating current servo, a direct current servo, etc., or other driving mechanisms capable of driving the sixth roller 54, and the specific type is not limited. The third driving member drives the sixth roller 54 to roll to drive the substrate 60 to move in the conveying direction. The fifth roller 53 and the sixth roller 54 can be solid rollers or hollow rollers, and the specific type is not limited. The fifth roller 53 can also be connected with the third driving member to rotate simultaneously with the sixth roller 54, and the rotating direction of the fifth roller 53 and the sixth roller 54 can be opposite, or the fifth roller 53 can be connected with other driving members, and the fifth roller 53 can also be arranged to rotate under the traction of the conveyed substrate 60, and the specific type is not limited.

[0064] When the substrate 60 enters the second conveying gap 51 between the fifth roller 53 and the sixth roller 54, the flattening mechanism 30 is adjusted from the initial working condition to the correction working condition, and when the first roller 32 applies an external force to the substrate 60, the first limiting conveying mechanism 40 and the second limiting conveying mechanism 50 can limit the substrate 60 to avoid excessive movement of the substrate 60, thereby successfully completing the pressure application to the substrate 60 and ensuring the flattening effect.

[0065] In some embodiments, as shown in Figure 3 , Figure 4 The apparatus further comprises:

[0066] A first conveying mechanism 61 is arranged on one side of the first limiting conveying mechanism 40 to convey the substrate 60 to the first limiting conveying mechanism 40.

[0067] A warping measuring mechanism 63 is arranged above the first conveying mechanism 61 to measure the warping height of the substrate 60.

[0068] Specifically, the first conveying mechanism 61 comprises a plurality of conveying roller assemblies 611, each of the roller conveying assemblies comprises a roller 612 and a bridge 613, the roller 612 is movably arranged on the bridge 613 to form a goose-shaped roller, the substrate 60 is placed on the roller 612 and is conveyed by the rotation of the roller 612. The warping measurement mechanism 63 can be a cross-section shape laser scanning device, such as a Keyence cross-section shape laser scanning device, which calculates the warping height by scanning the cross-section profile of the substrate 60, or other mechanisms that can measure the warping height, which are not limited in particular. The outer diameter of the roller 612 can be 32 mm, or other outer diameters of the roller 612 can be selected, which are not limited in particular.

[0069] When it is necessary to flatten the substrate 60, the substrate 60 is placed on the first conveying mechanism 61, for example, the roller 612, one by one, and the warping height of the substrate 60 is measured by the warping measurement mechanism 63 above the first conveying mechanism 61, so as to determine the distance between the first position and the second position according to the warping height, thereby realizing the flattening of the warped substrate 60.

[0070] As shown in Figure 3 , Figure 4 , a second conveying mechanism 62 can also be arranged on one side of the second limiting conveying mechanism 50, the second conveying mechanism 62 can also be arranged to comprise a plurality of conveying roller assemblies 611, or can be arranged to comprise a plurality of rollers 612, or can be arranged to other structures that can realize the conveying of the substrate 60, such as a conveying belt assembly, etc., which are not limited in particular. The substrate 60 is conveyed by the second conveying mechanism 62 in a direction away from the flattening mechanism 30, thereby realizing the automation of the flattening of the substrate 60.

[0071] The substrate warping flattening device of the present application further comprises a first metal sensor 64 and a second metal sensor 65, the first metal sensor 64 is used to sense whether the substrate 60 is conveyed to the first limiting conveying mechanism 40, and the second metal sensor 65 is used to sense whether the substrate 60 is conveyed to the second limiting conveying mechanism 50.

[0072] The first metal sensor 64 can be arranged on the first limiting conveying mechanism 40, or can be arranged between the first conveying mechanism 61 and the first limiting conveying mechanism 40 as shown in Figure 3 , Figure 4 , which are not limited in particular. The second metal sensor 65 can be arranged on the second limiting conveying mechanism 50, or can be arranged between the second conveying mechanism 62 and the second limiting conveying mechanism 50 as shown in Figure 3 , Figure 4 , which are not limited in particular.

[0073] In some embodiments, the distance between the first position and the second position is positively correlated with the warping height of the substrate 60 and is less than the warping height of the substrate 60.

[0074] Specifically, the movement range of the flattening mechanism 30 in the first direction can be set to 0-50 mm, i.e., the maximum distance between the first position and the second position is 50 mm, or other ranges can be set according to actual conditions, etc. Different models and specifications of the first driving member 34 can be selected to adjust the movement range of the flattening mechanism 30, and the specific adjustment is not limited.

[0075] The essence of warping of the substrate 60 is that there is uneven residual stress inside. When using the traditional direct flattening method of the packaging substrate, for example, the substrate 60 is placed on a platform, and then the substrate 60 is flattened by a pressing plate, a pressing roller, etc. For the substrate 60 with a certain resilience, especially the coreless packaging substrate, direct flattening is essentially a pure elastic confrontation, i.e., the external force forces the material to elastically deform, temporarily suppresses the warped geometry, but does not eliminate the internal stress, but instead adds new elastic stress, and stores more energy in the form of elastic potential. Once the constraint is removed, the elastic recovery effect of the coreless packaging substrate will drive the material to release all potential energy and rebound to the warped state, thereby resulting in poor flattening effect of the coreless packaging substrate. In the present application, under the correction working condition of the flattening mechanism 30, the flattening gap 31 is located at the second position, which can make the part of the substrate 60 located in the flattening gap 31 bend in the direction opposite to the warping direction, introduce a new stress field opposite to the original internal stress direction in the substrate 60, and release and reshape the internal residual stress. When the external force is removed, the elastically deformed part will still try to recover like a spring, i.e., rebound, but at this time the internal structure and stress distribution of the material have been permanently rewritten by plastic deformation, and the rebound amplitude is only determined by the remaining elastic deformation, and the substrate 60 will not rebound to the original warping height. By accurately controlling the distance between the second position and the first position, the amount of reverse bending of the substrate 60 under the action of the external force of the flattening mechanism 30 can be controlled to accurately compensate for the rebound amount of the substrate 60, so that the substrate 60 is stabilized on a new, internal stress significantly reduced, and more flat mechanical equilibrium state after elastic recovery.

[0076] The greater the warping height of the substrate 60, the greater the elastic potential energy in the substrate 60, that is, the greater the rebound height when the external force of the flattening mechanism 30 is removed in flattening. The warping deformation of the substrate 60 includes two deformations, namely plastic deformation and elastic deformation, and the rebound height when rebounding after the external force is removed is only affected by the elastic deformation height, and the rebound height generally does not exceed the warping height before flattening. Therefore, the distance between the first position and the second position is set to be less than the warping height of the substrate 60, and the greater the warping height of the substrate 60, the greater the distance between the first position and the second position, and the smaller the warping height of the substrate 60, the smaller the distance between the first position and the second position. The distance between the first position and the second position of the flattening mechanism 30 is determined by the warping deformation degree of different substrates 60, and the warping deformation difference between different substrates 60 is fully considered, thereby effectively improving the flattening effect.

[0077] In some embodiments, the distance between the first position and the second position is determined by the thickness and warping height of the substrate 60, and is positively correlated with the warping height of the substrate 60 and negatively correlated with the thickness of the substrate 60.

[0078] When the substrate 60 is thick, the stiffness of the substrate 60 is improved, the elasticity is low, and the bending degree that can be tolerated is also low. If the flattening mechanism 30 applies an external force to the substrate 60 to bend the substrate 60 in the opposite direction at a height that is too high, on the one hand, the substrate 60 may be damaged, and the product yield is improved. On the other hand, after the external force of the flattening mechanism 30 is removed, due to poor rebounding ability, the substrate 60 may not be able to rebound to a flat state, affecting the flattening effect of the substrate 60. When the substrate 60 is thin, the stiffness of the substrate 60 is poor, the elasticity is good, and the bending degree that can be tolerated is also large. At this time, if the flattening mechanism 30 applies an external force to the substrate 60 to bend the substrate 60 in the opposite direction at a height that is insufficient, after the external force of the flattening mechanism 30 is removed, due to good rebounding, the substrate 60 may rebound to the original warping state, which also affects the flattening effect of the substrate 60.

[0079] Therefore, in the present application, the differences in stiffness and elastic properties of substrates 60 of different thicknesses are fully considered, and the thickness and warping height of the substrate 60 are used to determine the distance between the first position and the second position, and are positively correlated with the warping height of the substrate 60 and negatively correlated with the thickness of the substrate 60. The greater the warping height of the substrate 60, the greater the distance between the first position and the second position, and the smaller the warping height of the substrate 60, the smaller the distance between the first position and the second position. The greater the thickness of the substrate 60, the smaller the distance between the first position and the second position, and the smaller the thickness of the substrate 60, the greater the distance between the first position and the second position. The influence of the thickness of the substrate 60 on the flattening effect is fully considered, and the flattening effect and yield of the substrate 60 are effectively improved.

[0080] In some embodiments, the conveying speed of the substrate 60 is determined according to the thickness and the warping height of the substrate 60, and is negatively correlated with the warping height of the substrate 60 and positively correlated with the thickness of the substrate 60.

[0081] The flattening of the substrate 60 is a continuous operation process, that is, a plurality of substrates 60 are continuously sent into the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 in sequence. When the substrate 60 is thin, especially the coreless packaging substrate which has poor rigidity, the speed is too fast, and the substrate 60 is easily wound on the third roller 43 or the fourth roller 44 of the first limiting conveying mechanism 40 or wound on the fifth roller 53 or the sixth roller 54 of the second limiting conveying mechanism 50, which easily causes damage to the substrate 60 and affects the production efficiency. When the warping height of the substrate 60 is higher, the deformation degree of the substrate 60 is larger, and the stress time of the substrate 60 usually needs to be increased to ensure that the substrate 60 can be flattened. The change of the conveying speed of the substrate 60 affects the stress time of the substrate 60. Specifically, the conveying speed of the substrate 60 ranges from 0 to 5.0 m / min, and can also be set to other ranges, which are not limited in particular.

[0082] In the present application, the thickness and the warping height of the substrate 60 are used to determine the conveying speed of the substrate 60. When the substrate 60 is thin, the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 are set to convey the substrate 60 at a slower conveying speed to ensure that the substrate 60 will not be jammed during the flattening operation process. When the substrate 60 is thick, the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 are set to convey the substrate 60 at a faster conveying speed to ensure the production efficiency. When the warping is higher, the conveying speed of the substrate 60 conveyed by the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 is reduced to ensure the flattening effect. When the warping is lower, the conveying speed of the substrate 60 conveyed by the first limiting conveying mechanism 40, the flattening mechanism 30 and the second limiting conveying mechanism 50 is increased to ensure the production efficiency. In the present application, the thickness and the warping height of the substrate 60 are used to determine the conveying speed of the substrate 60, which can realize multiple technical effects such as improving the flattening effect, the production efficiency and the product yield.

[0083] In some embodiments, the conveying speed of the substrate 60 is calculated by the following formula:

[0084] ;

[0085] wherein, V is the conveying speed of the substrate 60, T is the thickness of the substrate 60, W is the warping height of the substrate 60, a is the first coefficient, b is the second coefficient, is a third coefficient.

[0086] Specifically, the first coefficient may be set to 0.4, 0.5, 0.6, 0.8, 0.9, etc. according to actual conditions, or other values, and the specific limitation is not limited. The second coefficient may be set to 0.01, 0.02, 0.03, 0.04, 0.05, etc. according to actual conditions, or other values, and the specific limitation is not limited. The second coefficient is set to 1, 1.5, 1.6, 1.8, 2, 2.2, 2.4, 2.5, etc. according to actual conditions, or other values, and the specific limitation is not limited. Exemplarily, when is 0.5, is 0.02, is 2, at this time , , the units of H are mm, and the unit of V is m / min.

[0087] In some embodiments, the distance between the first position and the second position is calculated by the following formula:

[0088] ;

[0089] wherein, is the distance between the first position and the second position, is the warping height of the substrate 60, is the thickness of the substrate 60, is a fourth coefficient, is a fifth coefficient.

[0090] Specifically, the fourth coefficient may be set to 8, 8.5, 9, 9.5, 10, 10.2, 10.5, 10.8, 11, etc. according to actual conditions, or other values, and the specific limitation is not limited. The fifth coefficient may be set to 2, 2.2, 2.4, 2.5, 2.6, 2.8, 3, 3.2, 3.5, 3.6, 4, etc. according to actual conditions, or other values, and the specific limitation is not limited. Exemplarily, when is 0.2, is 10.2, at this time , , , the units of H are mm.

[0091] After the conveying speed of the substrate 60 is determined according to the warping height and thickness of the substrate 60, the production efficiency is ensured. Therefore, in the present application, the conveying speed of the second limiting conveying mechanism 50 is determined first to ensure the production efficiency, and then the distance between the first position and the second position is determined based on the specific conditions of the warping height and thickness of the substrate 60, which can effectively ensure the flattening effect of the substrate 60.

[0092] Hereinafter, the operation process of the present application will be further explained in combination with a specific embodiment. Figure 3 、 Figure 5

[0093] The substrate warping flattening device comprises a first conveying mechanism 61, a first limiting conveying mechanism 40, a flattening mechanism 30, a second limiting conveying mechanism 50 and a second conveying mechanism 62 arranged in sequence in the conveying direction, a first metal sensor 64 is arranged between the first conveying mechanism 61 and the first limiting conveying mechanism 40, and a second metal sensor 65 is arranged between the second limiting conveying mechanism 50 and the second conveying mechanism 62. The substrate warping flattening device further comprises a warping measuring mechanism 63 and a control center (not shown in the figure) for realizing automatic control, which receives various information, calculates the distance between the first position and the second position and the conveying speed of the substrate 60, and controls the operation of the first conveying mechanism 61, the first limiting conveying mechanism 40, the flattening mechanism 30, the second limiting conveying mechanism 50, the second conveying mechanism 62 and the warping measuring mechanism 63.

[0094] When the substrate warping flattening device is started, the control center controls the first conveying mechanism 61, the first limiting conveying mechanism 40, the flattening mechanism 30, the second limiting conveying mechanism 50 and the second conveying mechanism 62 to start operating at an initial speed, and the warping measuring mechanism 63 is turned on. The substrate 60 that needs to be flattened is placed or conveyed to the first conveying mechanism 61, and then the warping height of the substrate 60 on the first conveying mechanism 61 is measured by the warping measuring mechanism 63, and the warping height data is sent to the control center. Specifically, the side of the substrate 60 that is arched upward can be defined as the front side, and all the substrates 60 are placed on the first conveying mechanism 61 with the front side facing upward, i.e. Figure 7 、 ​ ​The placing direction of the substrate 60. When the substrate 60 is conveyed by the first conveying mechanism 61 to the vicinity of the first limiting conveying mechanism 40, the first metal sensor 64 senses the presence of the substrate 60 and sends a signal indicating the presence of the substrate 60 to the control center. The control center calculates the distance between the first position and the second position and the conveying speed of the substrate 60 according to the warping height sent by the warping measuring mechanism 63 and the thickness of the substrate 60 stored in advance. The control center controls the first conveying mechanism 61, the first limiting conveying mechanism 40, the flattening mechanism 30, the second limiting conveying mechanism 50, and the second conveying mechanism 62 to convey the substrate 60 at the calculated conveying speed. When the substrate 60 is conveyed to the second limiting conveying mechanism 50, the second metal sensor 65 senses the presence of the substrate 60 and sends a signal indicating the presence of the substrate 60 to the control center. At this time, the control center controls the flattening mechanism 30 to switch from the initial working condition to the correction working condition to apply an external force to the substrate 60. The control center controls the flattening mechanism 30 to remain in the correction working condition, and the first conveying mechanism 61, the first limiting conveying mechanism 40, the flattening mechanism 30, the second limiting conveying mechanism 50, and the second conveying mechanism 62 continue to convey the substrate 60 until the substrate 60 leaves the second limiting conveying mechanism 50. When the substrate 60 leaves the second limiting conveying mechanism 50, the second metal sensor 65 detects the absence of the substrate 60 and sends a signal indicating the absence of the substrate 60 to the control center. The control center then controls the flattening mechanism 30 to switch from the correction working condition to the initial working condition. At this time, the next substrate 60 is conveyed or placed on the first conveying mechanism 61, and the flattening operation on the next substrate 60 is started, thereby realizing automatic continuous operation.

[0095] In the following, the technical effects of the present application are illustrated by collecting warping data of a plurality of coreless packaging substrates before and after flattening.

[0096] A plurality of coreless packaging substrates with a length of 623 mm are subjected to warping correction using the substrate warping flattening device of the present application, and the results are shown in Table 1. ​ As shown in Table 1, the warping height of the plurality of coreless packaging substrates before correction is between 15.2 and 25.7 mm, and the warping height of the coreless packaging substrates after treatment by the substrate warping flattening device of the present application is between 3.6 and 8.5 mm. Generally, a coreless packaging substrate with a warping height <10 mm is considered to be qualified. Obviously, the substrate warping flattening device of the present application can effectively realize the flattening of coreless packaging substrates.

[0097] Those skilled in the art should understand that the above discussion of any embodiment is merely exemplary and is not intended to be limiting of the scope of the application including the claims, which encompass numerous alternatives, modifications and variations as will become apparent to those skilled in the art. Numerous specific details of the applications are set forth in the accompanying descriptions and in part illustrated in the drawings. However, the application is not limited to the specifics described herein but includes all alternatives, modifications and variations as will become apparent to those skilled in the art.

[0098] In addition, those skilled in the art will appreciate that the present application embodiments can be practiced in an art- encompassing number of variations and modifications without exceeding the scope of the application as recited in the claims. Such variations and modifications are considered to be within the scope of the present application as disclosed in the specification.

[0099] For simplicity and clarity of illustration, the drawing figures can or can not show all of the components of a device or apparatus as described herein. Further, explanations in the specification are provided for the purpose of illustrating the present application embodiments and their best mode, and it should be understood that those skilled in the art can make modifications and alterations to the present application embodiments without departing from the scope and spirit of the application. In describing and illustrating the present application embodiments, specific terminology is used for the sake of clarity. This terminology is not intended to limit the scope of the application. The terms "a" and "an" are understood to mean one or more, and the singular is understood to include the plural unless the context clearly dictates otherwise.

[0100] While the present application has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted for elements thereof without departing from the scope of the present application. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the present application without departing from their central scope. Therefore, it is intended that the present application not be limited to the particular implementation disclosed, but will include all implementations falling within the scope of the appended claims.

Claims

1. A substrate warpage flattening apparatus characterized by comprising: The first limiting conveying mechanism, the flattening mechanism and the second limiting conveying mechanism are sequentially arranged in the conveying direction of the substrate, and each has a first conveying gap, a flattening gap and a second conveying gap for conveying the substrate; The flattening mechanism is capable of reciprocating in the first direction and has an initial working condition in which the flattening gap is in the first position and a correction working condition in which the flattening gap is in the second position in the first direction; The second position is capable of bending the part of the substrate in the flattening gap in a direction opposite to the warping direction; When the substrate is conveyed through the first conveying gap, the flattening gap and the second conveying gap, the flattening mechanism is controlled to switch from the initial working condition to the correction working condition; When the substrate leaves the second conveying gap, the flattening mechanism is controlled to switch from the correction working condition to the initial working condition; The first direction is perpendicular to the conveying direction of the substrate, and the distance between the first position and the second position is determined by the warping height of the substrate.

2. The substrate warpage flattening apparatus of claim 1, wherein The flattening mechanism comprises a first roller and a second roller movably arranged above and below, and the flattening gap is between the first roller and the second roller; The first roller and the second roller are connected with a first driving member, and the first driving member drives the first roller and the second roller to reciprocate in the first direction.

3. The substrate warpage flattening apparatus of claim 1, wherein The first limiting conveying mechanism comprises a first fixed rod, a third roller and a fourth roller movably arranged above and below the first fixed rod, and the first conveying gap is between the third roller and the fourth roller; The fourth roller is connected with a second driving member, and the second driving member drives the fourth roller to roll to convey the substrate in the first conveying gap.

4. The substrate warpage flattening apparatus of claim 1, wherein The second limiting conveying mechanism comprises a second fixed rod, a fifth roller and a sixth roller movably arranged above and below the second fixed rod, and the second conveying gap is between the fifth roller and the sixth roller; The sixth roller is connected with a third driving member, and the third driving member drives the sixth roller to roll to convey the substrate in the second conveying gap.

5. The substrate warpage flattening apparatus of claim 1, wherein Further comprising: A first conveying mechanism configured to be located on one side of the first limiting conveying mechanism to convey the substrate to the first limiting conveying mechanism; A warping measuring mechanism configured to be located above the first conveying mechanism to measure the warping height of the substrate.

6. The substrate warpage flattening apparatus according to any one of claims 1 to 5, wherein The distance between the first position and the second position is positively correlated with the warping height of the substrate and is less than the warping height of the substrate.

7. The substrate warpage flattening apparatus according to any one of claims 1 to 5, wherein The distance between the first position and the second position is determined by the thickness and warping height of the substrate and is positively correlated with the warping height of the substrate and negatively correlated with the thickness of the substrate.

8. The substrate warpage flattening apparatus according to any one of claims 1 to 5, wherein The conveying speed of the substrate is determined by the thickness and warping height of the substrate and is negatively correlated with the warping height of the substrate and positively correlated with the thickness of the substrate.

9. The substrate warpage flattening apparatus of claim 8, wherein The conveying speed of the substrate is calculated by the following formula: ； wherein, is a conveying speed of the substrate, is a thickness of the substrate, is a warping height of the substrate, is a first coefficient, is a second coefficient, is a third coefficient.

10. The substrate warpage flattening apparatus of claim 9, wherein The distance between the first position and the second position is calculated by the following formula: ； wherein, is a distance of the first position and the second position, is a warpage height of the substrate, is a thickness of the substrate, is a fourth coefficient, is a fifth coefficient.

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