Chip transfer equipment

Abstract

The invention relates to the technical field of chip transfer, and particularly discloses chip transfer equipment which comprises a tray supply and collection module used for supplying stacked full-load trays and recovering no-load trays; the anti-displacement material taking device is used for covering the chips on the full-load material tray on the top layer and then taking out the full-load material tray, and is used for sending the no-load material tray back to the material tray supplying and receiving module; the double-platform conveying device is used for bearing the full-load trays and the no-load trays; the crystal ring supplying and receiving device is used for supplying no-load crystal rings and recovering full-load crystal rings; and the chip transfer manipulator is used for taking out the chip on the full-load tray sent out by the double-platform transportation device and transferring the chip to the no-load crystal ring. According to the chip transfer equipment provided by the invention, the waiting time of the tray supply and collection module can be shortened, so that the continuity of a chip transfer process is improved, and the production efficiency is further improved.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and more particularly to a chip transfer device. Background Technology

[0002] With the rapid development of 5G communication, artificial intelligence (AI), and the Internet of Things (IoT) technologies, the market demand for high-performance, miniaturized, and highly integrated semiconductor chips has exploded. This has directly driven the evolution of semiconductor micro-assembly processes towards higher precision and efficiency. In the core process of micro-assembly—die bonding—the chip must undergo precise transfer from a standard wafer frame to a die ring (including the metal frame and tension film). This step lays a crucial foundation for the subsequent chip lifting by the ejector pin mechanism, the pick-up by the die bonding arm, and the final mounting of the chip onto the substrate. Its efficiency and yield directly affect the overall production efficiency.

[0003] Currently, the most common chip transfer solution in the industry is a single-platform operation mode. The specific process is as follows: First, a standard tray fully loaded with chips is removed from the tray receiving module and placed on a dedicated transfer platform; then, the transfer platform moves the tray to the crystal ring station; next, the transfer mechanism (such as a nozzle) picks up the chips one by one from the tray on the transfer platform and precisely places them at the designated position on the crystal ring. The key bottleneck in this process is that the transfer platform must wait until all chips in the current tray have been completely transferred to the crystal ring before returning to the tray receiving module to perform the next tray pick-up and drop-off operation. This means that during the entire chip transfer period from the tray to the crystal ring, the tray receiving module and its related pick-up and drop-off mechanisms are completely idle and cannot perform any pre-fetching or buffering operations.

[0004] This single-platform serial operation mode has significant efficiency drawbacks. Because the operation of the material feeding and receiving module is forcibly interrupted by the transfer of materials on the transfer platform and the chip pick-and-place process, the equipment cannot achieve continuous material feeding, resulting in a longer production cycle time and reduced equipment efficiency (OEE). Especially when facing increasingly stringent production efficiency and yield requirements, this non-value-added time caused by waiting has become one of the key bottlenecks restricting capacity improvement.

[0005] Therefore, there is an urgent need to develop a chip transfer device to reduce the waiting time of the tray supply and receiving module, so as to improve the continuity of the chip transfer process and thus improve production efficiency.

[0006] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0007] One objective of this invention is to provide a chip transfer device that can reduce the waiting time of the tray supply and receiving module, thereby improving the continuity of the chip transfer process and thus increasing production efficiency.

[0008] To achieve the above objectives, the present invention provides a chip transfer device, comprising:

[0009] A tray supply and collection module is used to supply fully loaded trays that are stacked and to collect empty trays.

[0010] An anti-displacement material handling device is used to cover the chip on the full-loaded material tray at the top layer and then remove the full-loaded material tray, and to send the empty material tray back to the material tray receiving module.

[0011] A dual-platform transport device is used to receive the full-load material tray taken out by the anti-displacement material picking device and to provide the empty material tray to the anti-displacement material picking device. The dual-platform transport device includes a transverse feeding platform, a lifting feeding platform, and a displacement drive module that drives the two feeding platforms to interchange positions.

[0012] A crystal ring supply and recovery device, wherein the crystal ring supply and recovery device is used to supply empty crystal rings and recover fully loaded crystal rings;

[0013] A chip transfer robot is used to remove chips from the fully loaded tray delivered by the dual-platform transport device and transfer them to the empty crystal ring.

[0014] Optionally, the tray supply and receiving module includes a full-load tray storage device for providing full-load trays, an empty tray storage device for recovering empty trays, an NG sliding platform for placing NG trays, and an NG tray storage device for recovering NG trays, wherein each of the tray storage devices includes:

[0015] A number of silo columns are arranged at intervals to form a silo storage bin for stacking multiple silos;

[0016] A plurality of rotating claws are provided, each corresponding to one of the hopper columns, and the rotating claws are rotatably mounted on the top of the corresponding hopper column;

[0017] A linkage drive assembly is connected to each of the rotating claws for driving each of the rotating claws to rotate synchronously toward the tray receiving bin to clamp the top tray from the side, and for driving each of the rotating claws to rotate synchronously away from the tray receiving bin to release the top tray.

[0018] A lifting mechanism is located below the material tray storage compartment and is used to lift or lower the stacked material trays.

[0019] Optionally, it also includes two spaced-apart conveyor belt housings, with two hopper columns fixed to the top of each conveyor belt housing;

[0020] The surfaces of the two conveyor belt housings that are close to each other are provided with conveyor belt bodies for conveying the trays to the bottom of the tray storage bin or for laterally sending the trays out of the tray storage bin;

[0021] The lifting mechanism is located between the two conveyor belt bodies.

[0022] Optionally, the linkage drive assembly includes:

[0023] Two rotating crossbars are provided in a one-to-one correspondence with the two conveyor belt shells. The rotating crossbars are rotatably mounted on the two hopper columns on the corresponding conveyor belt shells and pass through the two corresponding rotating claws, so as to drive the rotating claws that pass through to rotate relative to the corresponding hopper columns.

[0024] Two connecting rod assemblies are provided in one-to-one correspondence with the two aforementioned pivot crossbars, and one end of the connecting rod assembly is fixedly connected to the corresponding pivot crossbar;

[0025] A direct-drive linkage mechanism is fixedly disposed relative to the two conveyor belt housings, and the drive end of the direct-drive linkage mechanism is hinged to the two linkage assemblies. The two linkage assemblies drive the two rotating shaft crossbars to rotate in opposite directions relative to each other, thereby causing the rotating claws on the two rotating shaft crossbars to rotate synchronously toward the material tray storage bin or synchronously away from the material tray storage bin.

[0026] Optionally, the transposition drive module includes:

[0027] The first transverse direct drive mechanism has its drive end connected to the transverse feeding platform and is used to drive the transverse feeding platform to reciprocate in the horizontal direction.

[0028] A lifting direct drive mechanism, the drive end of which is connected to the lifting feeding platform, is used to drive the lifting feeding platform to move up and down to avoid the lateral feeding platform;

[0029] The second transverse direct drive mechanism is arranged parallel to the first transverse direct drive mechanism, and the drive end of the second transverse direct drive mechanism is connected to the lifting direct drive mechanism. It is used to drive the lifting direct drive mechanism to drive the lifting feeding platform to reciprocate in the horizontal direction, so as to cooperate with the first transverse direct drive mechanism to realize the alternation between the two feeding platforms.

[0030] Optionally, the lifting feeding platform is provided with several clamping components for rotating downwards to clamp and fix the material tray;

[0031] The clamping assembly includes:

[0032] A rotating hook plate, the upper end of which is provided with an inverted L-shaped pressing part for pressing the material tray, and the middle part of the rotating hook plate is rotatably connected to the lifting feeding platform around a horizontal X-axis.

[0033] A U-shaped connecting rod, one end of which is hinged to the lower end of the rotating hook plate;

[0034] A sliding push rod, one end of which is slidably connected to the lifting feeding platform along the horizontal Y-axis, and the other end of which is hinged to the other end of the U-shaped connecting rod;

[0035] An opening spring is sleeved on the sliding push rod and is used to drive the sliding push rod to slide away from the rotating hook plate relative to the lifting feeding platform, so that the inverted L-shaped clamping part rotates to disengage from the material tray.

[0036] Optional,

[0037] The lifting feeding platform is provided with a push rod receiving cavity for the sliding push rod to slide, and an air inlet channel connected to each of the push rod receiving cavities.

[0038] The push rod receiving cavity is connected to the air channel on the side of the sliding push rod away from the U-shaped connecting rod, and is used to blow air onto the sliding push rod so that the sliding push rod slides toward the lifting feeding platform until the inverted L-shaped pressing part rotates toward the material tray to press the edge of the material tray.

[0039] Optionally, the anti-displacement material handling device includes:

[0040] A gripper mechanism is used to grip a material tray with a material cavity on its top surface in a horizontal direction. The mechanism includes a fixed frame, a gripper cylinder mounted on the fixed frame, and two gripping components driven by the gripper cylinder to cooperate with each other to laterally clamp or release the material tray.

[0041] A chip cover plate is located below a fixed frame and is slidably connected to the fixed frame in a vertical direction; the chip cover plate is used to press down on the material tray to prevent the chips in each of the material cavities from detaching from the corresponding material cavity.

[0042] Optionally, the anti-displacement material handling device further includes two guide plates that are installed and fixed on the fixed frame along the length direction of the material tray;

[0043] The lower end of the guide plate protrudes downward relative to the fixed frame to limit the horizontal displacement of the tray along its length.

[0044] Among them, the surfaces of the two guide plates that are close to each other are inclined surfaces, and the distance between the two inclined surfaces gradually increases from top to bottom.

[0045] Optionally, the crystal ring supply and receiving device includes an empty crystal ring box for storing empty crystal rings, a full crystal ring box for storing full crystal rings, a crystal ring conveying platform for receiving crystal rings, a crystal ring platform direct drive mechanism for driving the crystal ring conveying platform to move laterally and reciprocally, and a crystal ring transfer robot for performing crystal ring transfer operations between the empty crystal ring box and the full crystal ring box and the crystal ring conveying platform.

[0046] The beneficial effects of this invention are as follows: It provides a chip transfer device in which the alternation mechanism of the dual platforms (horizontal feeding platform / lifting feeding platform) is key. When one platform is busy transferring chips at the crystal ring station, the other platform can simultaneously / in parallel receive the next tray. The tray feeding and receiving module, the top-loading device, and the anti-displacement picking device no longer need to wait for all the chips in the current tray to be transferred, but can immediately start processing the next tray when the other platform is idle (i.e., after or during the alternation). Through parallel processing (chip transfer and the picking and placing of the next tray are carried out simultaneously), the originally idle time is effectively utilized, the production cycle is greatly reduced, the equipment utilization rate and production efficiency are improved, thereby reducing the waiting time of the tray feeding and receiving module and improving continuity.

[0047] Therefore, the chip transfer equipment provided by the present invention can reduce the waiting time of the material tray supply and receiving module, thereby improving the continuity of the chip transfer process and thus improving production efficiency. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 A front view of the chip transfer device provided in the embodiment;

[0050] Figure 2 This is a schematic diagram of the structure of the fully loaded tray storage device provided in the embodiment;

[0051] Figure 3 This is a bottom schematic diagram of the fully loaded tray storage device provided in the embodiment;

[0052] Figure 4 A schematic diagram of the linkage drive assembly provided in the embodiment;

[0053] Figure 5 A schematic diagram of the gripper mechanism provided in the embodiment;

[0054] Figure 6 A schematic diagram of the dual-platform transport device provided in the embodiment;

[0055] Figure 7 A cross-sectional schematic diagram of the lifting feeding platform provided in the embodiment;

[0056] Figure 8 This is a schematic diagram of the back of the chip transfer device provided in the embodiment.

[0057] In the picture:

[0058] 1. Material tray feeding and receiving module; 1a. Fully loaded material tray storage device; 1b. Empty material tray storage device; 1c. NG material tray storage device; 1d. NG sliding platform; 101. Material bin column; 102. Rotating claw; 103. Linkage drive assembly; 1031. Rotating shaft crossbar; 1032. First link; 1033. Second link; 1034. Linkage direct drive mechanism; 104. Lifting mechanism; 105. Conveyor belt housing; 106. Conveyor belt body;

[0059] 2. Anti-displacement material handling device; 201. Gripper mechanism; 2011. Fixed frame; 2012. Gripper cylinder; 2013. Gripping assembly; 202. Chip cover plate; 203. Guide plate; 2031. Inclined surface; 204. Gripper-driven robot arm;

[0060] 3. Dual-platform transport device; 301. Lateral feeding platform; 302. Lifting feeding platform; 3021. Inflation channel; 303. First lateral direct drive mechanism; 304. Lifting direct drive mechanism; 305. Second lateral direct drive mechanism; 306. Clamping assembly; 3061. Rotating hook plate; 3061a. Inverted L-shaped clamping part; 3062. U-shaped connecting rod; 3063. Sliding push rod; 3064. Clamping spring;

[0061] 4. Crystal ring supply and receiving device; 401. Empty crystal ring box; 402. Full crystal ring box; 403. Crystal ring conveying platform; 404. Crystal ring platform direct drive mechanism; 405. Crystal ring transfer robot;

[0062] 5. Chip transfer robotic arm;

[0063] 6. Chip flattening mechanism. Detailed Implementation

[0064] In this invention, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the invention. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this invention, as long as there is no technical contradiction or conflict, the technical features mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0065] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0066] In the description of this invention, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0067] In this invention, terms such as “first” and “second” are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0068] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0069] Similar to the understanding in the Examination Guidelines, in this invention, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this invention, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0070] In the description of the embodiments of the present invention, the spatial related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of the present invention or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0071] Unless otherwise explicitly stated or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this invention, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral arrangement; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this invention according to the specific circumstances.

[0072] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.

[0073] See Figure 1 This embodiment provides a chip transfer device, including:

[0074] The material tray supply and collection module 1 is used to supply fully loaded material trays that are stacked and to collect empty material trays.

[0075] Anti-displacement material handling device 2, which is used to cover the chip on the full-load material tray at the top layer and then remove the full-load material tray, and to send the empty material tray back to the material tray receiving module 1.

[0076] The dual-platform transport device 3 is used to receive the full-load material tray taken out by the anti-displacement material picking device 2 and to provide the empty material tray to the anti-displacement material picking device 2. The dual-platform transport device 3 includes a transverse feeding platform 301, a lifting feeding platform 302, and a displacement drive module that drives the two feeding platforms to interchange positions.

[0077] Crystal ring supply and collection device 4, which is used to supply empty crystal rings and collect fully loaded crystal rings;

[0078] The chip transfer robot 5 is used to remove the chips from the fully loaded tray delivered by the dual-platform transport device 3 and transfer them to the empty crystal ring.

[0079] The chip transfer device provided in this embodiment aims to solve the waiting problem of the material tray supply and receiving module 1 in the prior art by adopting a dual-platform parallel alternating working mechanism, thereby achieving continuous material supply. Its core working process is as follows:

[0080] S10: Full load pallet supply and lifting:

[0081] Fully loaded trays of chips are stacked and stored in tray supply and receiving module 1.

[0082] The material tray feeding and receiving module 1 lifts the top full material tray (top material tray) upwards one by one, preparing it to be taken out.

[0083] S20: Anti-displacement material handling device 2 handles material:

[0084] The anti-displacement material handling device 2 moves above the top layer material tray that has been lifted.

[0085] The anti-displacement material handling device 2 first covers the chips on the tray to prevent the chips from shifting or being disturbed during transportation.

[0086] After effectively protecting the chip, the anti-displacement material handling device 2 removes the entire top-layer material tray to the detached material tray supply and receiving module 1.

[0087] S30: First-time undertaking and transportation on both platforms:

[0088] The anti-displacement material handling device 2 places the removed top-layer material tray onto one of the platforms of the dual-platform transport device 3 (e.g., the transverse feeding platform 301, located at the material tray feeding and receiving station).

[0089] At this time, another platform (lifting and feeding platform 302) is located at the crystal ring station, and the material tray on the platform at the crystal ring station has been emptied.

[0090] The transposition drive module drives the transverse feeding platform 301 (carrying a full-loaded tray) to move to the crystal ring station (i.e., the working position of the chip transfer robot 5). Simultaneously, the transposition drive module drives the lifting feeding platform 302 (carrying an empty tray) to move to the tray feeding and receiving station (i.e., the working position of the anti-displacement picking device 2).

[0091] When the transverse feeding platform 301 arrives at the crystal ring station with a full tray, the chip transfer robot 5 (such as a suction nozzle) starts working, picking up the chips one by one from the full tray of the transverse feeding platform 301 and transferring the chips to the empty crystal ring.

[0092] Simultaneously, the anti-displacement material handling device 2 removes the empty material tray from the lifting material supply platform 302, and then places the next full material tray onto the lifting material supply platform 302.

[0093] It is worth pointing out that:

[0094] During the transfer of chips on the transverse feeding platform 301, the tray feeding and receiving module 1 and the anti-displacement picking device 2 can operate directly without waiting. Specifically, after the anti-displacement picking device 2 removes the empty tray from the lifting feeding platform 302, it can directly place the next full tray onto the lifting feeding platform 302 without waiting for the chip transfer robot 5 to pick up the chip from the transverse feeding platform 301. This reduces the waiting time of the tray feeding and receiving module 1, improves the continuity of the chip transfer process, and thus increases production efficiency.

[0095] While the transverse feeding platform 301 completes the chip transfer task, the lifting feeding platform 302 preloads the next full-load tray to be processed.

[0096] S40: Platform Switching (Transposition)

[0097] Once all chips in the tray on the transverse feeding platform 301 have been successfully transferred (becoming an empty tray), or when the transverse feeding platform 301 has completed its task:

[0098] The position switching drive module is activated, causing the two feeding platforms to exchange positions.

[0099] The typical operation is as follows: the transverse feeding platform 301, which has finished processing / emptying the material tray, leaves the crystal ring station (e.g., transversely returns to its original position); at the same time, the lifting feeding platform 302, which has been loaded with a new material tray, is replaced by the crystal ring station.

[0100] After the transfer is completed, the lifting feeding platform 302 is now in an operable position of the chip transfer robot 5, while the transverse feeding platform 301 has moved to an idle / standby position (usually the position to receive the next tray).

[0101] S50: Crystal ring treatment:

[0102] When the chip transfer robot 5 fills an empty crystal ring with chips, the crystal ring becomes a fully loaded crystal ring.

[0103] The crystal ring supply and collection device 4 is responsible for transporting and recycling the fully loaded crystal rings, and providing the next empty crystal ring to the designated workstation for the chip transfer robot 5 to continue placing chips.

[0104] S60: Cyclic operation:

[0105] By repeating steps S10-S50 above, all chips in the full-loaded trays can be transferred to the empty-loaded crystal rings.

[0106] The key to the chip transfer equipment provided by this invention is the interchange mechanism between the dual platforms (horizontal feeding platform 301 / lifting feeding platform 302). While one platform is busy transferring chips at the crystal ring station, the other platform can simultaneously / in parallel receive the next tray. The tray feeding and receiving module 1, the top-loading device, and the anti-displacement picking device 2 no longer need to wait for all chips in the current tray to be transferred; instead, they can immediately begin processing the next tray when the other platform is idle (i.e., after or during the interchange). Through parallel processing (chip transfer and the picking and placing of the next tray occur simultaneously), the previously idle time is effectively utilized, significantly reducing production cycle time, improving equipment utilization and production efficiency, thereby reducing the waiting time of the tray feeding and receiving module 1 and improving continuity.

[0107] Therefore, the chip transfer equipment provided by the present invention can reduce the waiting time of the material tray supply and receiving module 1, thereby improving the continuity of the chip transfer process and thus improving production efficiency.

[0108] The following is a detailed introduction to each module.

[0109] 1. Material tray feeding and receiving module

[0110] See Figures 2-4 In this embodiment, the material tray supply and receiving module 1 includes a full-load material tray storage device 1a for providing full-load material trays, an empty material tray storage device 1b for receiving empty material trays, an NG sliding platform 1d for placing NG material trays, and an NG material tray storage device 1c for receiving NG material trays.

[0111] Each of the aforementioned material tray storage devices includes:

[0112] A plurality of silo columns 101 are arranged at intervals to form a silo storage bin for stacking multiple silos.

[0113] A plurality of rotating claw plates 102 are corresponding one-to-one with each of the aforementioned hopper columns 101, and the rotating claw plates 102 are rotatably mounted on the top of the corresponding hopper column 101;

[0114] A linkage drive assembly 103 is connected to each of the rotating claw plates 102, for driving each of the rotating claw plates 102 to rotate synchronously toward the material tray storage bin to clamp the top material tray from the side, and for driving each of the rotating claw plates 102 to rotate synchronously away from the material tray storage bin to release the top material tray.

[0115] A lifting mechanism 104 is located below the material tray storage bin and is used to lift or lower each of the stacked material trays.

[0116] Two conveyor belt housings 105 are spaced apart, and two hopper columns 101 are fixed to the top of each conveyor belt housing 105;

[0117] The surfaces of the two conveyor belt housings 105 that are close to each other are provided with conveyor belt bodies 106 for conveying the trays to the bottom of the tray storage bin or for laterally sending the trays out of the tray storage bin.

[0118] The lifting mechanism 104 is located between the two conveyor belt bodies 106.

[0119] The working mode of the material tray feeding and receiving module 1 is as follows:

[0120] S101: The entire stack of fully loaded trays containing chips is placed onto the conveyor belt body 106 of the fully loaded tray storage device 1a by means of AGV trolley or manual operation by workers. The conveyor belt body 106 transports the fully loaded trays to the top of the lifting mechanism 104.

[0121] S102: The lifting mechanism 104 rises, lifting all the stacked full-load trays as a whole. When the top tray reaches the material picking position (the side of the top tray is aligned with the rotating claw 102):

[0122] a) The linkage drive assembly 103 drives each of the rotating claws 102 to rotate synchronously toward the top plate until the side position of the top plate is clamped and fixed, so as to prevent the top plate from shifting up and down subsequently.

[0123] b) The lifting mechanism 104 descends independently, causing all the material trays below the second-to-top layer to move downwards, thereby creating a separation gap between the second-to-top layer material tray and the top layer material tray, preventing the second-to-top layer material tray from being lifted up due to the adsorption effect when the top layer material tray is removed later.

[0124] c) The anti-displacement material handling device 2 grips the top or side surface of the top layer material tray that is individually fixed by the rotating claw 102;

[0125] d) The linkage drive assembly 103 drives each of the rotating claws 102 to rotate away from the material tray storage compartment until it remains open, so as to release the top material tray;

[0126] e) The anti-displacement material handling device 2 can remove the top tray and move it to one of the platforms of the dual-platform transport device 3;

[0127] f) After the top tray is removed, the lifting mechanism 104 rises and lifts the remaining tray to the new material removal position. The original second-to-top tray becomes the top tray. Repeat steps a to e above to remove the new top tray again. Repeat this process until the bottom tray is removed.

[0128] Optionally, a vision inspection device is provided directly above the full-load material tray storage device 1a. Correspondingly, the anti-displacement picking device 2 is equipped with a chip picker. When the vision inspection device detects a chip with a surface defect in the top-layer material tray, the anti-displacement picking device 2 uses the chip picker to remove the defective chip and place it into the NG material tray of the NG sliding platform 1d, ensuring that the chips subsequently transferred to the crystal ring are all intact, thereby reducing scrap costs.

[0129] Normally, the NG sliding platform 1d slides backward to the area directly above the full-load tray storage device 1a to avoid affecting the outward feeding of the full-load tray storage device 1a. When it is necessary to pick up or put down materials on the NG sliding platform 1d (for example, when the anti-displacement picking device 2 recycles the full-load NG tray to the NG tray storage device 1c, takes an empty tray from the empty tray storage device 1b and puts it into the NG sliding platform 1d, or puts defective chips into the NG tray), the NG sliding platform 1d will slide forward to the area directly above the full-load tray storage device 1a to pick up or put down materials.

[0130] In this embodiment, the linkage drive assembly 103 includes:

[0131] Two rotating shaft crossbars 1031 are provided in a one-to-one correspondence with the two conveyor belt housings 105. The rotating shaft crossbars 1031 are rotatably mounted on the two hopper columns 101 on the corresponding conveyor belt housings 105 and pass through the two corresponding rotating claw plates 102, so as to drive the rotating claw plates 102 that pass through to rotate relative to the corresponding hopper columns 101.

[0132] Two connecting rod assemblies are provided in one-to-one correspondence with the two pivot crossbars 1031, and one end of the connecting rod assembly is fixedly connected to the corresponding pivot crossbar 1031.

[0133] A direct-drive linkage 1034 is fixedly disposed relative to the two conveyor belt housings 105, and the drive end of the direct-drive linkage 1034 is hinged to the two linkage assemblies, so as to drive the two rotating shaft crossbars 1031 to rotate in opposite directions relative to each other through the two linkage assemblies, thereby causing the rotating claws 102 on the two rotating shaft crossbars 1031 to rotate synchronously toward the material tray storage bin or synchronously toward the material tray storage bin;

[0134] Optionally, the linkage assembly includes:

[0135] First connecting rod 1032, one end of the first connecting rod 1032 is fixedly connected to the corresponding rotating shaft cross rod 1031;

[0136] The second link 1033 has one end hinged to the other end of the first link 1032, and the other end hinged to the link direct drive mechanism 1034.

[0137] When the drive end of the direct drive mechanism 1034 extends upward, the second link 1033 will drive the lower end of the first link 1032 to rotate upward, which in turn causes the upper end of the first link 1032 to drive the corresponding rotating shaft crossbar 1031 to rotate outward, and the corresponding rotating claw 102 will rotate away from the material tray storage bin until the top material tray is released.

[0138] Conversely, when the drive end of the direct drive mechanism 1034 retracts downward, the second link 1033 will drive the lower end of the first link 1032 to rotate downward, thereby causing the upper end of the first link 1032 to drive the corresponding rotating shaft crossbar 1031 to rotate inward, and the corresponding rotating claw 102 will rotate toward the material tray storage bin to clamp the top material tray.

[0139] It should be noted that when the dual-platform transport device 3 returns the empty pallet, the working process of the empty pallet storage device 1b is as follows (the working process of the NG pallet storage device 1c is the same as that of the empty pallet storage device 1b, and will not be described again):

[0140] ① The lifting mechanism 104 is in a high lifting position;

[0141] ② The linkage drive assembly 103 drives each of the rotating claws 102 to rotate away from the material tray storage compartment until it remains open, so as to avoid interfering with the subsequent material tray placement operation;

[0142] ③ The anti-displacement material handling device 2 places the material trays layer by layer onto the lifting mechanism 104 in the material tray storage bin. Correspondingly, the lifting mechanism 104 gradually descends as the stacking height of the material trays increases, so as to complete the stacking and storage operation of the material trays.

[0143] ④ The conveyor belt body 106 delivers the entire stack of empty material trays.

[0144] II. Anti-displacement material handling device 2

[0145] See Figure 5 The anti-displacement material handling device 2 includes:

[0146] The gripper mechanism 201 is used to grip a material tray with a material cavity on the top surface in a horizontal direction. It includes a fixed frame 2011, a gripper cylinder 2012 mounted on the fixed frame 2011, and two gripping components 2013 driven by the gripper cylinder 2012 to cooperate with each other to laterally clamp or release the material tray.

[0147] A chip cover plate 202 is located below the fixed frame 2011 and is slidably connected to the fixed frame 2011 in a vertical direction; the chip cover plate 202 is used to press the material tray downward to prevent the chips in each of the material cavities from detaching from the corresponding material cavity;

[0148] The gripper-driven robot 204 is used to drive the gripper mechanism 201 to move in order to complete the tray transfer operation.

[0149] Furthermore, the anti-displacement material handling device 2 also includes two guide plates 203 that are installed and fixed on the fixed frame 2011 along the length direction of the material tray;

[0150] The lower end of the guide plate 203 protrudes downward relative to the fixed frame 2011 to limit the horizontal displacement of the tray along the length direction;

[0151] Among them, the surfaces of the two guide plates 203 that are close to each other are inclined surfaces 2031, and the distance between the two inclined surfaces 2031 gradually increases from top to bottom.

[0152] The anti-displacement picking device 2 provided in this embodiment introduces a chip cover plate 202 that is slidably connected to the gripper mechanism 201. While holding the material tray, the chip cover plate 202 is pressed down, which significantly improves the positioning stability and safety of the chip during the turnover process and prevents the chip from falling out of the material cavity on the material tray.

[0153] When it is necessary to transfer the material tray, the specific working process is as follows:

[0154] (1) The gripper mechanism 201 and the chip cover plate 202 are driven horizontally to be directly above the material tray by a transfer drive mechanism such as a transfer robot;

[0155] (2) When the gripper mechanism 201 is in the open state, the transfer drive mechanism drives the gripper mechanism 201 and the chip cover plate 202 to move vertically downward. During this process:

[0156] First, the bottom surface of the chip cover plate 202 will contact the top surface of the material tray, thereby covering the opening of each material cavity and preventing the chip in each material cavity from detaching upward from the corresponding material cavity.

[0157] Next, the gripper mechanism 201 continues to slide down until the gripping part of the gripper mechanism 201 is opposite to the side of the material tray;

[0158] (3) The gripper mechanism 201 closes and clamps the side of the material tray; finally, the material tray is transferred to the required position under the drive of the transfer drive mechanism.

[0159] When it is necessary to release the material tray, the specific working process is as follows:

[0160] (1) The gripper mechanism 201 is in the open state, and the transfer drive mechanism drives the gripper mechanism 201 and the chip cover plate 202 to move vertically upward;

[0161] (2) As the gripper mechanism 201 gradually moves upward, the chip cover plate 202 eventually moves upward together with the gripper mechanism 201 and completely detaches from the material tray so that the subsequent chip transfer robot 5 and other material picking mechanisms can pick up the material from the material cavity.

[0162] During the above process, because the chip cover plate 202 presses down on the tray and prevents the chips in each cavity from detaching from their corresponding cavities, even slight vibrations or airflow during tray transfer will not cause the chips in the cavities to push open the chip cover plate 202 and shift. Therefore, the anti-displacement pick-up device 2 provided by the present invention can prevent chips from detaching from their corresponding cavities during tray transfer.

[0163] III. Dual-platform transport device 3

[0164] See Figures 6-7 The transposition drive module includes:

[0165] The first transverse direct drive mechanism 303 is connected to the transverse feeding platform 301 at its drive end, and is used to drive the transverse feeding platform 301 to reciprocate in the horizontal direction.

[0166] The lifting direct drive mechanism 304 is connected to the lifting feeding platform 302 at its drive end, and is used to drive the lifting feeding platform 302 to move up and down to avoid the transverse feeding platform 301.

[0167] The second transverse direct drive mechanism 305 is arranged parallel to the first transverse direct drive mechanism 303, and the drive end of the second transverse direct drive mechanism 305 is connected to the lifting direct drive mechanism 304. It is used to drive the lifting direct drive mechanism 304 to drive the lifting feeding platform 302 to reciprocate in the horizontal direction, so as to cooperate with the first transverse direct drive mechanism 303 to realize the alternation between the two feeding platforms.

[0168] The dual-platform transport device 3 provided in this embodiment initially has the transverse feeding platform 301 located at the first station (tray supply and receipt station), carrying the tray and completing the current feeding task. The lifting feeding platform 302 is located at the second station (crystal ring station), and its clamping component 306 fixes the other tray, ready for position exchange. The specific position exchange process is as follows:

[0169] (1) The transverse feeding platform 301 is returned.

[0170] After the transverse feeding platform 301 completes the feeding, it is driven by the position drive module to move horizontally from the first station to the second station.

[0171] (2) Lifting and raising of the material supply platform 302

[0172] When the transverse feeding platform 301 moves to the intersection area, the lifting feeding platform 302 is controlled by the switching drive module to rise vertically first to avoid interference with the transverse platform.

[0173] The clamping component 306 keeps the tray fixed and prevents the tray from shaking or falling off due to the lifting movement.

[0174] (3) The transverse feeding platform 301 reaches the second work station.

[0175] The transverse feeding platform 301 moves completely to the second workstation and enters standby mode, waiting for the next feeding task.

[0176] (4) The lifting feeding platform 302 descends and enters the first working position.

[0177] The lifting feeding platform 302 descends vertically from the rising position, returns to the horizontal movement path, and moves horizontally to the first workstation (the original position of the transverse feeding platform 301).

[0178] Upon reaching the first workstation, clamp component 306 releases the material tray, completing the material supply handover.

[0179] (5) Alternating cycle

[0180] At this time, the lifting feeding platform 302 is located at the first station (material tray feeding and receiving station), and the transverse feeding platform 301 is located at the second station (crystal ring station).

[0181] During the next exchange, the two platforms move again according to the same logic to achieve continuous alternating material supply.

[0182] Therefore, the dual-platform transport device 3 can effectively solve the problem that the material tray is prone to shaking or falling off the platform when the two platforms meet.

[0183] Furthermore, the lifting feeding platform 302 is provided with a plurality of clamping components 306 for rotating downward to clamp and fix the material tray.

[0184] The clamping assembly 306 includes:

[0185] A rotating hook plate 3061 is provided at its upper end with an inverted L-shaped pressing part 3061a for pressing the material tray, and the middle part of the rotating hook plate 3061 is rotatably connected to the lifting feeding platform 302 about a horizontal X-axis.

[0186] U-shaped connecting rod 3062, one end of which is hinged to the lower end of the rotating hook plate 3061;

[0187] A sliding push rod 3063, one end of which is slidably connected to the lifting feeding platform 302 along the horizontal Y-axis, and the other end of which is hinged to the other end of the U-shaped connecting rod 3062;

[0188] A clamping spring 3064 is sleeved on the sliding push rod 3063 and is used to drive the sliding push rod 3063 to slide away from the rotating hook plate 3061 relative to the lifting feeding platform 302, so that the inverted L-shaped clamping part 3061a rotates to disengage from the material tray.

[0189] It should be noted that if a side-push cylinder is used to clamp and fix the material tray laterally, the impact force of the side-push cylinder is relatively large. After long-term use, the material tray is prone to deformation, resulting in an uneven surface, which increases the difficulty of positioning. In addition, the side-push cylinder is prone to vibrating out of the material tray due to uneven force, causing material to spill out. This invention uses the inclined surface of the inverted L-shaped pressing part 3061a to clamp and flatten the material tray obliquely downward when rotating from top to bottom, so as to correct the levelness of the material tray and facilitate subsequent positioning and material handling.

[0190] Furthermore, the interior of the lifting feeding platform 302 is provided with a push rod receiving cavity for the sliding push rod 3063 to slide, and an air inlet channel 3021 communicating with each of the push rod receiving cavities;

[0191] The push rod receiving cavity is connected to the air channel 3021 at a position on the side of the sliding push rod 3063 away from the U-shaped connecting rod 3062. This position is used to blow air onto the sliding push rod 3063 so that the sliding push rod 3063 slides toward the lifting feeding platform 302 until the inverted L-shaped pressing part 3061a rotates toward the material tray to press the edge of the material tray.

[0192] Under normal circumstances, the clamping spring 3064 drives the sliding push rod 3063 to slide inward, causing the inverted L-shaped clamping part 3061a to rotate and disengage from the material tray;

[0193] When it is necessary to clamp the material tray, high-pressure gas is input into the air channel 3021 to overcome the elastic force of the clamping spring 3064, causing the sliding push rod 3063 to slide outward, thereby allowing the inverted L-shaped clamping part 3061a to rotate to clamp the material tray.

[0194] IV. Crystal Ring Supply and Receiving Device 4

[0195] See Figure 1 and Figure 8 The crystal ring supply and receiving device 4 includes an empty crystal ring box 401 for storing empty crystal rings, a full crystal ring box 402 for storing full crystal rings, a crystal ring transport platform 403 for receiving crystal rings, a crystal ring platform direct drive mechanism 404 for driving the crystal ring transport platform 403 to move laterally and reciprocally, and a crystal ring transfer robot 405 for transferring crystal rings between the empty crystal ring box 401 and the full crystal ring box 402 and the crystal ring transport platform 403. Optionally, the number of crystal ring transport platforms 403 and chip transfer robots 5 is two, further improving chip transfer efficiency.

[0196] The crystal ring transfer robot 405 takes an empty crystal ring from the empty crystal ring box 401 and places it on the crystal ring conveying platform 403. The crystal ring platform direct drive mechanism 404 transports the crystal ring conveying platform 403 to the chip transfer robot 5 so that the chip transfer robot 5 can transfer the chip from the material tray to the crystal ring. After the crystal ring is fully loaded, the crystal ring platform direct drive mechanism 404 sends the crystal ring conveying platform 403 back to the crystal ring transfer robot 405, and the crystal ring transfer robot 405 puts the fully loaded crystal ring into the full crystal ring box 402.

[0197] Optionally, the chip transfer equipment also includes a chip flattening mechanism 6 located at the crystal ring station. The chip flattening mechanism 6 (including a chip pressure plate and a pressure plate direct drive mechanism that drives the chip pressure plate to move up and down) is used to press the chips on the crystal ring downwards to cooperate with the crystal ring transport platform 403 at the crystal ring station to flatten each chip.

[0198] After the chip transfer robot 5 transfers the chip onto the thin film of the crystal ring, the chips at different positions may be uneven. Therefore, when the thin film is fully loaded, the chip flattening mechanism 6 moves downward to cooperate with the crystal ring conveying platform 403 to flatten each chip. After flattening, the crystal ring platform direct drive mechanism 404 then conveys the fully loaded crystal ring to the vicinity of the full crystal ring box 402, where the crystal ring transfer robot 405 places the fully loaded crystal ring into the full crystal ring box 402.

[0199] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A chip transfer device, characterized in that, include: The material tray supply and collection module (1) is used to supply stacked full material trays and collect empty material trays. Anti-displacement material picking device (2), the anti-displacement material picking device (2) is used to cover the chip on the full-load material tray at the top layer and then take out the full-load material tray, and to send the empty material tray back to the material tray receiving module (1). A dual-platform transport device (3) is used to receive the full-load material tray taken out by the anti-displacement material picking device (2) and to provide the empty material tray to the anti-displacement material picking device (2). The dual-platform transport device (3) includes a transverse feeding platform (301), a lifting feeding platform (302), and a displacement drive module that drives the two feeding platforms to alternate positions. Crystal ring supply and collection device (4), the crystal ring supply and collection device (4) is used to supply empty crystal rings and collect fully loaded crystal rings; Chip transfer robot (5) is used to take out the chips from the full-load tray delivered by the dual-platform transport device (3) and transfer them to the empty crystal ring.

2. The chip transfer device according to claim 1, characterized in that, The tray supply and receiving module (1) includes a full-load tray storage device (1a) for providing full-load trays, an empty tray storage device (1b) for recovering empty trays, an NG sliding platform (1d) for placing NG trays, and an NG tray storage device (1c) for recovering NG trays, wherein each of the tray storage devices includes: A plurality of silo columns (101) are arranged at intervals to form a silo storage bin for stacking multiple silos; A plurality of rotating claws (102) are corresponding one-to-one with each of the aforementioned silo columns (101), and the rotating claws (102) are rotatably mounted on the top of the corresponding silo column (101); A linkage drive assembly (103) is connected to each of the rotating claws (102) for driving each of the rotating claws (102) to rotate synchronously toward the tray receiving bin to clamp the top tray from the side, and for driving each of the rotating claws (102) to rotate synchronously away from the tray receiving bin to release the top tray; A lifting mechanism (104) is located below the material tray storage bin and is used to lift or lower each of the stacked material trays.

3. The chip transfer device according to claim 2, characterized in that, It also includes two spaced-apart conveyor belt housings (105), with two hopper columns (101) fixed to the top of each conveyor belt housing (105). The surfaces of the two conveyor belt housings (105) that are close to each other are provided with conveyor belt bodies (106) for conveying the tray to the bottom of the tray storage bin or for conveying the tray laterally out of the tray storage bin. The lifting mechanism (104) is located between the two conveyor belt bodies (106).

4. The chip transfer device according to claim 3, characterized in that, The linkage drive assembly (103) includes: Two rotating shaft crossbars (1031) are provided in a one-to-one correspondence with the two conveyor belt housings (105). The rotating shaft crossbars (1031) are rotatably mounted on the two hopper columns (101) on the corresponding conveyor belt housings (105) and pass through the two corresponding rotating claws (102) so as to drive the rotating claws (102) that pass through to rotate relative to the corresponding hopper columns (101). Two connecting rod assemblies are provided in a one-to-one correspondence with the two pivot crossbars (1031), and one end of the connecting rod assembly is fixedly connected to the corresponding pivot crossbar (1031); A direct-drive linkage mechanism (1034) is fixedly disposed relative to the two conveyor belt housings (105), and the drive end of the direct-drive linkage mechanism (1034) is hinged to the two linkage assemblies so as to drive the two rotating shaft crossbars (1031) to rotate in opposite directions relative to each other through the two linkage assemblies, thereby causing the rotating claws (102) on the two rotating shaft crossbars (1031) to rotate synchronously toward the material tray storage bin or synchronously toward the material tray storage bin.

5. The chip transfer device according to claim 1, characterized in that, The transposition drive module includes: The first transverse direct drive mechanism (303) is connected to the transverse feeding platform (301) at its drive end, and is used to drive the transverse feeding platform (301) to reciprocate in the horizontal direction. The lifting direct drive mechanism (304) is connected to the lifting feeding platform (302) at its drive end, and is used to drive the lifting feeding platform (302) to move up and down to avoid the transverse feeding platform (301). The second transverse direct drive mechanism (305) is arranged parallel to the first transverse direct drive mechanism (303), and the drive end of the second transverse direct drive mechanism (305) is connected to the lifting direct drive mechanism (304). It is used to drive the lifting direct drive mechanism (304) to drive the lifting feeding platform (302) to reciprocate in the horizontal direction, so as to cooperate with the first transverse direct drive mechanism (303) to realize the alternation between the two feeding platforms.

6. The chip transfer device according to claim 1, characterized in that, The lifting feeding platform (302) is provided with several clamping components (306) for rotating downwards to clamp and fix the material tray. The clamping assembly (306) includes: A rotating hook plate (3061) is provided at its upper end with an inverted L-shaped pressing part (3061a) for pressing the material tray. The middle part of the rotating hook plate (3061) is rotatably connected to the lifting feeding platform (302) about a horizontal X-axis. U-shaped connecting rod (3062), one end of which is hinged to the lower end of the rotating hook plate (3061); A sliding push rod (3063) is provided, one end of which is slidably connected to the lifting feeding platform (302) along the horizontal Y-axis, and the other end of which is hinged to the other end of the U-shaped connecting rod (3062). A clamping spring (3064) is sleeved on the sliding push rod (3063) to drive the sliding push rod (3063) to slide away from the rotating hook plate (3061) relative to the lifting feeding platform (302), so that the inverted L-shaped clamping part (3061a) rotates to disengage from the material tray.

7. The chip transfer device according to claim 6, characterized in that, The lifting feeding platform (302) is provided with a push rod receiving cavity for the sliding push rod (3063) to slide, and an air inlet channel (3021) connected to each of the push rod receiving cavities. The push rod receiving cavity is connected to the air channel (3021) at the side of the sliding push rod (3063) away from the U-shaped connecting rod (3062), and is used to blow air onto the sliding push rod (3063) so that the sliding push rod (3063) slides toward the lifting feeding platform (302) until the inverted L-shaped pressing part (3061a) rotates toward the material tray to press the edge of the material tray.

8. The chip transfer device according to claim 1, characterized in that, The anti-displacement material handling device (2) includes: The gripper mechanism (201) is used to grip a material tray with a material cavity on its top surface in a horizontal direction. It includes a fixed frame (2011), a gripper cylinder (2012) mounted on the fixed frame (2011), and two gripping components (2013) driven by the gripper cylinder (2012) to cooperate with each other to laterally clamp or release the material tray. A chip cover plate (202) is located below a fixed frame (2011) and is slidably connected to the fixed frame (2011) in a vertical direction; the chip cover plate (202) is used to press the material tray downward to prevent the chips in each of the material cavities from detaching from the corresponding material cavity.

9. The chip transfer device according to claim 8, characterized in that, The anti-displacement material handling device (2) also includes two guide plates (203) installed and fixed on the fixed frame (2011) along the length direction of the material tray. The lower end of the guide plate (203) protrudes downward relative to the fixed frame (2011) to limit the horizontal displacement of the tray along the length direction; Among them, the surfaces of the two guide plates (203) that are close to each other are inclined surfaces (2031), and the distance between the two inclined surfaces (2031) gradually increases from top to bottom.

10. The chip transfer device according to claim 9, characterized in that, The crystal ring supply and receiving device (4) includes an empty crystal ring box (401) for storing empty crystal rings, a full crystal ring box (402) for storing full crystal rings, a crystal ring conveying platform (403) for receiving crystal rings, a crystal ring platform direct drive mechanism (404) for driving the crystal ring conveying platform (403) to move laterally and reciprocally, and a crystal ring transfer robot (405) for performing crystal ring transfer operations between the empty crystal ring box (401) and the full crystal ring box (402) and the crystal ring conveying platform (403).

Images