Bonding equipment for multiple cylindrical semiconductor wafers

Abstract

The invention discloses a bonding device for multiple cylindrical semiconductor wafers, and relates to the technical field of wafer bonding processing, the bonding device comprises a placing plate, a lifting motor and a wafer body, and also comprises a fixing device and a cleaning device; wherein the fixing device comprises a pressing plate and a fixing assembly, the pressing plate is fixedly installed at the output end of the lifting motor, the fixing assembly comprises a fixing frame, a sliding plate, a pressing rod, a pushing and pressing plate, a connecting rod, a clamping plate, a clamping piece, a fixing rod and a tray, the fixing frame is fixedly installed above the placing plate, the sliding plate is slidably installed in the fixing frame, and the fixing plate is fixedly installed in the fixing frame. The pressing rod is fixedly installed above the sliding plate, and the pushing and pressing plate is installed at the bottom of the inner wall of the fixing frame in a sliding mode. The wafer clamping device has the advantages that the situation that the wafers deviate, mismatching or dislocation is caused between the wafers in the machining process, the bonding quality and device performance are improved, and the machining cost of the wafers is reduced is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer bonding processing, in particular to a bonding equipment for multiple cylindrical semiconductor wafer pieces. BACKGROUND

[0002] The multiple cylindrical wafer pieces are a device structure stacked in a cylindrical or barrel shape by multiple thin wafer pieces. Each wafer piece can be of different materials or have different functional layers, and they are assembled together to form an integral structure through a bonding process.

[0003] The patent with the patent announcement number CN216528822U relates to a wafer carrier table, which includes a plate body, a placement area for placing a wafer is arranged in the middle of the plate body, a plurality of concentric annular grooves are arranged on the placement area, the grooves between the annular grooves support the bottom of the wafer, at least one air suction port is arranged in each annular groove on the plate body, a suction port is arranged on the sidewall of the body, the suction port is in communication with each air suction port through a suction channel, and a positioning device for positioning the wafer is arranged around the placement area on the plate body. The patent can better support the wafer, the stress on the wafer is more uniform, and the processing difficulty of the carrier table is reduced.

[0004] In the above-mentioned patent, the suction port is in communication with each air suction port through a suction channel, and a positioning device for positioning the wafer is arranged around the placement area on the plate body. The patent can better support the wafer, the stress on the wafer is more uniform, and the processing difficulty of the carrier table is reduced to facilitate the processing of the wafer piece body. However, when the wafer piece is operated and processed, the wafer piece is prone to deviation, which may cause mismatching or misalignment between the wafer pieces during the processing process, affect the final bonding quality and device performance, and reduce the processing cost of the wafer piece.

[0005] Therefore, it is necessary to design a bonding equipment for multiple cylindrical semiconductor wafer pieces that avoids wafer piece deviation and fixes the wafer pieces. SUMMARY

[0006] The present application relates to the technical field of wafer bonding processing, in particular to a bonding equipment for multiple cylindrical semiconductor wafer pieces.

[0007] In order to solve the above technical problems, the present application provides the following technical scheme: a kind of multi-piece cylindrical semiconductor wafer bonding equipment, including placing plate, lifting motor and wafer body, further including fixing device, cleaning device, collection device and knocking device;Wherein, fixing device includes pressing plate and fixed component, the pressing plate is fixedly installed in the output end of lifting motor, the fixed component includes fixed frame, sliding plate, pressure rod, push plate, connecting rod, clamping plate, clamping piece, fixed rod and tray, the fixed frame is fixedly installed above placing plate, the sliding plate is slidably installed in the inside of fixed frame, the pressure rod is fixedly installed above sliding plate, the push plate is slidably installed in the inner wall bottom of fixed frame, the connecting rod is fixedly installed at the side of push plate away from sliding plate, the clamping plate is fixedly installed at the end of connecting rod away from push plate, the clamping piece is fixedly installed at the side of clamping plate away from connecting rod, the fixed rod is fixedly installed on the surface of sliding plate, and the tray is fixedly installed at the end of fixed rod away from sliding plate;Wherein, cleaning device includes connecting plate and cleaning component, the connecting plate is fixedly installed on the surface of lifting motor, and the cleaning component is arranged above connecting plate, collection device includes air frame and collection component, and the collection component is arranged above placing plate, knocking device includes processing frame and knocking component, and the knocking component is arranged above placing plate, the clamping piece moves and contacts wafer body and is fixed, can effectively avoid wafer body to produce deviation, so that the mismatch or misplacement between wafer body in processing process, influence the final bonding quality and device performance, reduce the processing cost of wafer body.

[0008] According to the above technical scheme, the side of the push plate close to the sliding plate is provided with an inclined surface, the tray is fixedly connected to the inner wall bottom of the fixed frame by an elastic telescopic rod, the clamping piece has elasticity, the elastic telescopic rod can drive the tray to reset, and the clamping piece has elasticity and can better clamp the wafer body and prevent the wafer body from being damaged.

[0009] According to the above technical scheme, the connecting plate is fixedly installed on the surface of the lifting motor, the cleaning component includes a lower receiving rod, a plastic rod, a brush, a sliding rod and an upper receiving rod, the lower receiving rod is fixedly installed above the connecting plate, the plastic rod is fixedly installed above the connecting plate, the brush is slidably installed above the lower receiving rod, the sliding rod is slidably installed above the lower receiving rod, the brush is hinged to the sliding rod, the upper receiving rod is fixedly installed on the surface of the pressing plate, one end of the upper receiving rod away from the pressing plate is hinged to one end of the sliding rod away from the brush, the brush moves to contact and rub the plastic rod to generate static electricity, the static electricity can effectively adsorb dust flying in the cleaning process, avoid dust to cause poor contact of wafer body in the bonding process, reduce the processing cost and maintenance cost of wafer body.

[0010] According to the technical scheme, the brush is in contact with the plastic rod near one end of the lower supporting rod, a clock spring one is arranged at the joint of the sliding rod and the lower supporting rod, the brush moves to be in contact with the plastic rod to generate static electricity through friction, the static electricity can effectively adsorb the dust splashed in the cleaning process, and the clock spring one can drive the sliding rod to reset.

[0011] According to the technical scheme, the air frame is fixedly installed above the placing plate, the collecting device comprises a collecting frame, a baffle, a collecting box, an electrostatic adsorption plate, a communication rod and an extrusion plate, the collecting frame is fixedly installed on the surface of the air frame, a sliding groove one is formed in the surface of the collecting frame, the baffle is hingedly connected above the inner wall of the sliding groove one, the collecting box is fixedly installed at the bottom of the inner wall of the collecting frame, the electrostatic adsorption plate is slidably installed above the inner wall of the collecting frame, the communication rod slidably penetrates the inner and outer walls of the collecting frame and the air frame, the electrostatic adsorption plate is fixedly installed at the end of the communication rod away from the air frame, and the extrusion plate is fixedly installed at the end of the communication rod away from the collecting frame, so that the collecting box can adsorb the scattered dust to avoid the dust from escaping to the outside and falling on the surface of the wafer body again, the cleaning effect is improved, and the maintenance cost is effectively reduced.

[0012] According to the technical scheme, a clock spring two is arranged at the joint of the baffle and the sliding groove one, the air frame is communicated with the collecting box through a pipeline, and negative pressure generated in the air frame can guide the gas in the collecting box into the air frame through the pipeline.

[0013] According to the technical scheme, a one-way valve one is arranged in the pipeline, a collecting pipe is arranged above the collecting box, a one-way valve two is arranged in the collecting pipe, the clock spring two can drive the baffle to reset, the one-way valve one can prevent the air in the air frame from entering the collecting box, and the one-way valve two can prevent the air in the collecting box from entering the collecting frame.

[0014] According to the technical scheme, the processing frame is fixedly installed above the placing plate, the knocking assembly comprises a rocker, a rocker plate, a convex block and a knocking rod, a sliding groove two is formed in the surface of the processing frame, the rocker is fixedly installed on the surface of the pressing rod, one end of the rocker away from the pressing rod is slidably installed on the inner wall of the sliding groove two, the rocker plate is fixedly installed at the end of the rocker away from the pressing rod, the convex block is fixedly installed on one side of the rocker plate close to the pressing rod, and the knocking rod is hingedly connected to the inner wall of the sliding groove two, the knocking rod moves and resets under the action of a clock spring three, thereby knocking and vibrating the sliding plate, the sliding plate vibrates to drive the fixed rod to vibrate, the fixed rod vibrates to drive the tray to vibrate, the tray vibrates to drive the wafer body to vibrate, the vibration can effectively remove the bubbles in the adhesive in the bonding process, avoid the bubbles from causing the wafer bodies to be not tightly bonded, thereby affecting the final bonding quality and device performance, and reduce the processing cost of the wafer body.

[0015] According to the above technical scheme, the end of the knocking rod away from the processing frame is in contact with the sliding plate, the end of the knocking rod away from the sliding plate is provided with a second bevel surface, the knocking rod moves up and down to knock the sliding plate to generate vibration, and the vibration can effectively remove bubbles in the adhesive during the bonding process, so that the wafer bodies are not bonded tightly due to the bubbles.

[0016] According to the above technical scheme, the second bevel surface is in contact with the protrusion, the knocking rod is provided with a third clock spring at the intersection with the second sliding groove, the third clock spring can drive the knocking rod to reset, and the protrusion moves downward to contact the second bevel surface and drive the knocking rod to knock the sliding plate to generate vibration.

[0017] Compared with the prior art, the present application has the following beneficial effects: (1) The bonding equipment drives the pressing plate to contact and extrude the pressing rod to move downward through the lifting motor, and then extrudes the sliding plate to move downward, so that the sliding plate moves downward to extrude the push plate and drive the clamping plate to tighten, the clamping piece clamps and fixes the wafer body, which can effectively prevent the wafer from deviating, so that the mismatch or misalignment between the wafers during processing affects the final bonding quality and device performance, and reduces the processing cost of the wafers.

[0018] (2) During the downward movement of the pressing plate, the upper supporting rod is also driven to move downward, and then the sliding rod is extruded to move to the two sides of the lifting motor, the sliding rod moves to drive the brush to clean the surface of the wafer, and the brush is in contact with the plastic rod to generate static electricity, which can effectively adsorb dust during cleaning, avoid poor contact of the wafer during the bonding process due to dust, and reduce the processing cost and maintenance cost of the wafer.

[0019] (3) The brush moves to the two sides into the collecting frame, the brush contacts the static electricity absorption plate to release static electricity, so that the dust is separated from the surface of the brush, avoiding the damage of the wafer caused by the friction of the dust on the brush to the subsequent wafer, and the static electricity absorption plate moves to drive the communication rod to extrude the extrusion plate in the air frame, the extrusion plate moves to generate negative pressure through the conduit to make the collecting box inside generate negative pressure, the collecting box generates negative pressure through the collecting hole to collect the dust scattered on the surface of the brush, avoiding the dust from escaping to the outside and falling on the surface of the wafer again, improving the cleaning effect and effectively reducing the maintenance cost.

[0020] (4), the adhesive equipment, the pressure bar moves down and drives the lever to move down, the lever moves and drives the rocker to move, the rocker moves and drives the protrusion to move and contact the knocking bar, the knocking bar moves down and resets under the action of the third clockwork spring, and then repeatedly moves, so that the knocking bar knocks the sliding plate, the sliding plate is knocked and vibrates to drive the fixed rod and the tray to vibrate, the tray vibrates to drive the wafer to vibrate, the wafer vibrates to effectively remove the bubbles in the adhesive in the bonding process, avoid the bubbles to cause the wafer to bond not closely, and then affect the final bonding quality and device performance, reduce the processing cost of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings are used to provide further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings: Figure 1 is a schematic diagram of the overall structure of the present application; Figure 2 is a schematic diagram of the fixing device structure of the present application; Figure 3 is a schematic diagram of the push plate and clamping plate structure of the present application; Figure 4 is a schematic diagram of the cleaning device structure of the present application; Figure 5 is a schematic diagram of the brush and plastic rod structure of the present application; Figure 6 is a schematic diagram of the collection device structure of the present application; Figure 7 is a schematic diagram of the knocking device structure of the present application.

[0022] In the drawings: 1, placing plate; 2, lifting motor; 3, wafer body; 4, fixing assembly; 41, pressing plate; 42, fixed frame; 43, sliding plate; 431, pressure bar; 44, push plate; 45, connecting rod; 46, clamping plate; 461, clamping piece; 47, fixed rod; 48, tray; 5, cleaning assembly; 51, connecting plate; 52, lower supporting rod; 53, plastic rod; 54, brush; 55, sliding rod; 56, upper supporting rod; 6, collection assembly; 61, air frame; 62, collection frame; 621, baffle; 63, collection box; 64, static absorbing plate; 65, communication rod; 66, extrusion plate; 7, knocking assembly; 71, processing frame; 72, lever; 73, rocker; 74, protrusion; 75, knocking bar. DETAILED DESCRIPTION

[0023] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application. Embodiment one

[0024] Please refer to Figures 1-5 The present embodiment provides: a kind of adhesion equipment of multi-piece barrel-shaped semiconductor wafer, including placing plate 1, lifting motor 2 and wafer body 3, also including fixing device and cleaning device;Wherein, fixing device includes pressing plate 41 and fixed assembly 4, pressing plate 41 is fixedly installed at the output end of lifting motor 2, fixed assembly 4 includes fixed frame 42, sliding plate 43, pressing rod 431, push plate 44, connecting rod 45, clamping plate 46, clamping piece 461, fixed rod 47 and tray 48, fixed frame 42 is fixedly installed above placing plate 1, sliding plate 43 is slidably installed in the inside of fixed frame 42, pressing rod 431 is fixedly installed above sliding plate 43, push plate 44 is slidably installed at the bottom of the inner wall of fixed frame 42, connecting rod 45 is fixedly installed at the side of push plate 44 away from sliding plate 43, clamping plate 46 is fixedly installed at the end of connecting rod 45 away from push plate 44, clamping piece 461 is fixedly installed at the side of clamping plate 46 away from connecting rod 45, fixed rod 47 is fixedly installed on the surface of sliding plate 43, and tray 48 is fixedly installed at the end of fixed rod 47 away from sliding plate 43;Wherein, cleaning device includes connecting plate 51 and cleaning assembly 5, connecting plate 51 is fixedly installed on the surface of lifting motor 2, cleaning assembly 5 is arranged above connecting plate 51, clamping piece 461 moves and contacts wafer body 3 and is fixed, can effectively avoid wafer body 3 to produce deviation, so that the mismatch or misplacement between wafer body 3 in processing process, influence the final adhesion quality and device performance, reduce the processing cost of wafer body 3.

[0025] The side of push plate 44 close to sliding plate 43 is provided with an inclined surface one, the tray 48 and the inner wall bottom of the fixed frame 42 are fixedly connected through the elastic telescopic rod, the clamping piece 461 has elasticity, the elastic telescopic rod can drive the tray 48 to reset, the clamping piece 461 has elasticity and can better clamp the wafer body 3 and prevent the wafer body 3 from being damaged.

[0026] The connecting plate 51 is fixedly installed on the surface of the lifting motor 2, the cleaning assembly 5 comprises a lower supporting rod 52, a plastic rod 53, a brush 54, a sliding rod 55 and an upper supporting rod 56, the lower supporting rod 52 is fixedly installed above the connecting plate 51, the plastic rod 53 is fixedly installed above the connecting plate 51, the brush 54 is slidingly installed above the lower supporting rod 52, the sliding rod 55 is slidingly installed above the lower supporting rod 52, the brush 54 is hingedly connected with the sliding rod 55, the upper supporting rod 56 is fixedly installed on the surface of the pressing plate 41, one end of the upper supporting rod 56 away from the pressing plate 41 is hingedly connected with one end of the sliding rod 55 away from the brush 54, the brush 54 moves to contact and rub the plastic rod 53 to generate static electricity, the static electricity can effectively adsorb the splashed dust in the cleaning process, so that the poor contact caused by the dust in the bonding process of the wafer body 3 is avoided, and the processing cost and the maintenance cost of the wafer body 3 are reduced.

[0027] One end of the brush 54 close to the lower supporting rod 52 is in contact with the plastic rod 53, a clock spring one is arranged at the joint of the sliding rod 55 and the lower supporting rod 52, the brush 54 moves to contact and rub the plastic rod 53 to generate static electricity, the static electricity can effectively adsorb the splashed dust in the cleaning process, and the clock spring one can drive the sliding rod 55 to reset.

[0028] When the embodiment one works, the lifting motor 2 is started, the output end of the lifting motor 2 moves downward to drive the pressing plate 41 to move downward, the pressing plate 41 moves downward to contact and press the pressing rod 431 to move downward, the pressing rod 431 moves downward to drive the sliding plate 43 to move downward, the sliding plate 43 moves downward to drive the fixed rod 47 to move downward, the fixed rod 47 moves downward to drive the tray 48 to move downward, the tray 48 moves to drive the wafer body 3 to move downward, the sliding plate 43 moves downward to contact and press the push plate 44 to move away from the sliding plate 43, the push plate 44 moves to drive the connecting rod 45 to move, the connecting rod 45 moves to drive the clamping plate 46 to move, the clamping plate 46 moves to drive the clamping piece 461 to move, the clamping piece 461 moves to contact the wafer body 3 and fix the wafer body 3, so that the wafer body 3 is effectively prevented from being deviated, the mismatch or misplacement between the wafer bodies 3 in the processing process is avoided, the final bonding quality and the device performance are affected, and the processing cost of the wafer body 3 is reduced.

[0029] The pressing plate 41 moves downward to drive the upper supporting rod 56 to move downward, the upper supporting rod 56 moves downward to press the sliding rod 55 to move to the two sides of the connecting plate 51, the sliding rod 55 moves to drive the brush 54 to move, the brush 54 moves to clean the dust on the surface of the wafer body 3, meanwhile, the brush 54 moves to contact and rub the plastic rod 53 to generate static electricity, the static electricity can effectively adsorb the splashed dust in the cleaning process, so that the poor contact caused by the dust in the bonding process of the wafer body 3 is avoided, and the processing cost and the maintenance cost of the wafer body 3 are reduced. Embodiment two

[0030] Please refer toFigures 1-7 On the basis of embodiment one, the embodiment further includes a collecting device and a knocking device. The collecting device includes an air frame 61 and a collecting assembly 6, and the collecting assembly is arranged above the placing plate 1. The knocking device includes a processing frame 71 and a knocking assembly 7, and the knocking assembly 7 is arranged above the placing plate 1. The air frame 61 is fixedly installed above the placing plate 1. The collecting device 6 includes a collecting frame 62, a baffle 621, a collecting box 63, an electrostatic absorption plate 64, a communication rod 65 and an extrusion plate 66. The collecting frame 62 is fixedly installed on the surface of the air frame 61. A chute one is formed on the surface of the collecting frame 62. The baffle 621 is hingedly arranged above the inner wall of the chute one. The collecting box 63 is fixedly installed at the bottom of the inner wall of the collecting frame 62. The electrostatic absorption plate 64 is slidably installed above the inner wall of the collecting frame 62. The communication rod 65 slidably penetrates the inner and outer walls of the collecting frame 62 and the air frame 61. The electrostatic absorption plate 64 is fixedly installed at the end of the communication rod 65 away from the air frame 61. The extrusion plate 66 is fixedly installed at the end of the communication rod 65 away from the collecting frame 62. The collecting box 63 can adsorb the scattered dust to avoid the dust from escaping to the outside and falling on the surface of the wafer body 3 again, thereby improving the cleaning effect and effectively reducing the maintenance cost.

[0031] The baffle 621 is provided with a clock spring two at the intersection with the chute one. The air frame 61 is communicated with the collecting box 63 through a conduit. The negative pressure generated in the air frame 61 can guide the gas in the collecting box 63 into the air frame 61 through the conduit.

[0032] A one-way valve one is arranged in the conduit. A collecting pipe is arranged above the collecting box 63. A one-way valve two is arranged in the collecting pipe. The clock spring two can drive the baffle 621 to reset. The one-way valve one can prevent the air in the air frame 61 from entering the collecting box 63. The one-way valve two can prevent the air in the collecting box 63 from entering the collecting frame 62.

[0033] The processing frame 71 is fixedly installed above the placing plate 1. The knocking assembly 7 includes a lever 72, a rocker 73, a protrusion 74 and a knocking rod 75. A chute two is formed on the surface of the processing frame 71. The lever 72 is fixedly installed on the surface of the pressing rod 431. The end of the lever 72 away from the pressing rod 431 is slidably installed on the inner wall of the chute two. The rocker 73 is fixedly installed at the end of the lever 72 away from the pressing rod 431. The protrusion 74 is fixedly installed on the side of the rocker 73 close to the pressing rod 431. The knocking rod 75 is hingedly arranged on the inner wall of the chute two. The knocking rod 75 moves and resets under the action of a clock spring three, thereby knocking and vibrating the sliding plate 43. The vibration of the sliding plate 43 drives the fixed rod 47 to vibrate. The vibration of the fixed rod 47 drives the tray 48 to vibrate. The vibration of the tray 48 drives the wafer body 3 to vibrate. The vibration can effectively remove the bubbles in the adhesive during the bonding process, thereby avoiding the tightness of the bonding between the wafer bodies 3 due to the bubbles, and affecting the final bonding quality and device performance, thereby reducing the processing cost of the wafer body 3.

[0034] The end of the knocking rod 75 away from the processing frame 71 is in contact with the sliding plate 43, and the end of the knocking rod 75 away from the sliding plate 43 is provided with an inclined surface two. The knocking rod 75 moves up and down to knock the sliding plate 43 to generate vibration. The vibration can effectively remove the bubbles in the adhesive during the bonding process, so as to avoid that the bubbles cause the wafer bodies 3 to be not tightly bonded.

[0035] The inclined surface one is in contact with the protrusion 74, and the knocking rod 75 is provided with a spring three at the intersection with the sliding groove two. The spring three can drive the knocking rod 75 to reset. The protrusion 74 moves downward to contact the inclined surface two and drive the knocking rod 75 to knock the sliding plate 43 to generate vibration.

[0036] When the embodiment two works, the brush 54 moves to contact and press the baffle 621 to open the entrance of the collecting frame 62. The brush 54 moves into the inside of the collecting frame 62 to contact and press the electrostatic absorption plate 64 to move away from the baffle 621. The electrostatic absorption plate 64 moves to drive the communication rod 65 to move. The communication rod 65 moves to drive the pressing plate 66 to move. The pressing plate 66 moves to press the air in the air frame 61 and make the side of the pressing plate 66 close to the collecting frame 62 generate negative pressure. The negative pressure makes the air in the collecting box 63 enter the inside of the air frame 61 through the conduit. The air flow loss in the collecting box 63 generates negative pressure. The negative pressure makes the air in the collecting frame 62 enter the inside of the collecting box 63 through the collecting hole. The dust scattered on the surface of the brush 54 due to the elimination of static electricity can be effectively collected. The dust is avoided from escaping to the outside and falling on the surface of the wafer body 3 again. The cleaning effect is improved, and the maintenance cost is effectively reduced.

[0037] The pressing rod 431 moves downward to drive the lever 72 to move downward in the processing frame 71. The lever 72 moves downward to drive the lever plate 73 to move downward. The lever plate 73 moves downward to drive the protrusion 74 to move downward. The protrusion 74 moves downward to contact and drive the knocking rod 75 close to the side of the protrusion 74 to move downward. The side of the knocking rod 75 away from the protrusion 74 moves upward. The knocking rod 75 moves and resets under the action of the spring three to knock the sliding plate 43 and generate vibration. The sliding plate 43 generates vibration to drive the fixed rod 47 to generate vibration. The fixed rod 47 generates vibration to drive the tray 48 to generate vibration. The tray 48 generates vibration to drive the wafer body 3 to generate vibration. The vibration can effectively remove the bubbles in the adhesive during the bonding process, so as to avoid that the bubbles cause the wafer bodies 3 to be not tightly bonded. The final bonding quality and device performance are affected, and the processing cost of the wafer body 3 is reduced.

[0038] It is to be noted that, in the present text, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0039] Finally, it should be noted that the above-mentioned only constitutes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will still be able to make modifications to the technical solutions described in the foregoing embodiments or make equivalent replacements to some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-piece cylindrical semiconductor wafer bonding apparatus comprising a placement plate (1), a lifting motor (2), and a wafer body (3), characterized in that: Also include fixing device, cleaning device, collection device and knocking device; Wherein, the fixing device includes a pressing plate (41) and a fixing assembly (4), the pressing plate (41) is fixedly installed on the output end of the lifting motor (2), the fixing assembly (4) includes a fixed frame (42), a sliding plate (43), a pressing rod (431), a push plate (44), a connecting rod (45), a clamping plate (46), a clamping piece (461), a fixed rod (47) and a tray (48), the fixed frame (42) is fixedly installed above the placing plate (1), the sliding plate (43) is slidingly installed in the fixed frame (42), the pressing rod (431) is fixedly installed above the sliding plate (43), the push plate (44) is slidingly installed on the inner wall bottom of the fixed frame (42), the connecting rod (45) is fixedly installed on the side of the push plate (44) away from the sliding plate (43), the clamping plate (46) is fixedly installed on the end of the connecting rod (45) away from the push plate (44), the clamping piece (461) is fixedly installed on the side of the clamping plate (46) away from the connecting rod (45), the fixed rod (47) is fixedly installed on the surface of the sliding plate (43), and the tray (48) is fixedly installed on the end of the fixed rod (47) away from the sliding plate (43); Wherein, the cleaning device includes a connecting plate (51) and a cleaning assembly (5), the connecting plate (51) is fixedly installed on the surface of the lifting motor (2), the cleaning assembly (5) is arranged above the connecting plate (51), the collection device includes an air frame (61) and a collection assembly (6), the collection assembly (6) is arranged above the placing plate (1), and the knocking device includes a processing frame (71) and a knocking assembly (7), the knocking assembly (7) is arranged above the placing plate (1); The processing frame (71) is fixedly installed above the placing plate (1), the knocking assembly (7) includes a rocker (72), a rocker plate (73), a protrusion (74) and a knocking rod (75), the surface of the processing frame (71) is provided with a second chute, the rocker (72) is fixedly installed on the surface of the pressing rod (431), one end of the rocker (72) away from the pressing rod (431) is slidingly installed on the inner wall of the second chute, the rocker plate (73) is fixedly installed on the end of the rocker (72) away from the pressing rod (431), the protrusion (74) is fixedly installed on the side of the rocker plate (73) close to the pressing rod (431), and the knocking rod (75) is hinged to the inner wall of the second chute.

2. The apparatus according to claim 1, wherein: The side of the push plate (44) close to the sliding plate (43) is provided with an inclined surface one, the tray (48) and the inner wall bottom of the fixed frame (42) are fixedly connected through an elastic telescopic rod, and the clamping piece (461) is elastic.

3. The apparatus of claim 1 wherein: the plurality of cylindrical semiconductor wafers are bonded together in a plurality of pairs of wafers; and the plurality of pairs of wafers are bonded together in a plurality of groups of wafers. The connecting plate (51) is fixedly installed on the surface of the lifting motor (2), the cleaning assembly (5) comprises a lower supporting rod (52), a plastic rod (53), a brush (54), a sliding rod (55) and an upper supporting rod (56), the lower supporting rod (52) is fixedly installed above the connecting plate (51), the plastic rod (53) is fixedly installed above the connecting plate (51), the brush (54) is slidingly installed above the lower supporting rod (52), the sliding rod (55) is slidingly installed above the lower supporting rod (52), the brush (54) is hinged to the sliding rod (55), and the upper supporting rod (56) is fixedly installed on the surface of the pressing plate (41), and one end, away from the pressing plate (41), of the upper supporting rod (56) is hinged to one end, away from the brush (54), of the sliding rod (55).

4. The apparatus of claim 3 wherein: One end, close to the lower supporting rod (52), of the brush (54) is in contact with the plastic rod (53), and the intersection between the sliding rod (55) and the lower supporting rod (52) is provided with a clock spring one.

5. The apparatus of claim 1 wherein: the plurality of cylindrical semiconductor wafers are bonded together in a plurality of pairs of wafers; and the plurality of pairs of wafers are bonded together in a plurality of groups of wafers. The air frame (61) is fixedly installed above the placing plate (1), the collecting assembly (6) comprises a collecting frame (62), a baffle (621), a collecting box (63), an electrostatic absorption plate (64), a communication rod (65) and a pressing plate (66), the collecting frame (62) is fixedly installed on the surface of the air frame (61), a sliding groove one is formed in the surface of the collecting frame (62), the baffle (621) is hinged above the inner wall of the sliding groove one, the collecting box (63) is fixedly installed at the bottom of the inner wall of the collecting frame (62), the electrostatic absorption plate (64) is slidingly installed above the inner wall of the collecting frame (62), the communication rod (65) slidingly penetrates through the inner and outer walls of the collecting frame (62) and the air frame (61), the electrostatic absorption plate (64) is fixedly installed at one end, away from the air frame (61), of the communication rod (65), and the pressing plate (66) is fixedly installed at one end, away from the collecting frame (62), of the communication rod (65).

6. The apparatus of claim 5 wherein: The intersection between the baffle (621) and the sliding groove one is provided with a clock spring two, and the air frame (61) and the collecting box (63) are communicated through a pipeline.

7. The apparatus of claim 6 wherein: A one-way valve one is arranged in the pipeline, a collecting pipe is arranged above the collecting box (63), and a one-way valve two is arranged in the collecting pipe.

8. The apparatus of claim 1 wherein: the plurality of cylindrical semiconductor wafers are bonded together in a plurality of pairs of wafers; and the plurality of pairs of wafers are bonded together in a plurality of groups of wafers. One end, away from the processing frame (71), of the knocking rod (75) is in contact with the sliding plate (43), and one end, away from the sliding plate (43), of the knocking rod (75) is formed as an inclined surface two.

9. The apparatus of claim 8 wherein: the plurality of blocks are cylindrical; and the plurality of blocks are arranged in a circular pattern. The inclined surface two is in contact with the protrusion (74), and the intersection between the knocking rod (75) and the sliding groove two is provided with a clock spring three.

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