Three-dimensional vapor chamber element

Abstract

A three-dimensional steam cavity element comprises an upper cover, a lower plate and a plurality of flow channel fins, the upper cover is provided with an upper surface, the lower plate is opposite to the upper cover, a closed air cavity is formed in the upper cover when the upper cover is coupled to the lower plate, and the flow channel fins are arranged on the upper surface of the upper cover at intervals to form a plurality of micro-flow channels, surround to form an opening and are communicated with one another. The three-dimensional steam cavity element is provided with a heat absorption area and a condensation area, the heat absorption area is located on the lower plate, and the condensation area is located on the upper cover. Compared with the prior art, the three-dimensional steam cavity element can be applied to liquid cooling heat dissipation, when the three-dimensional steam cavity element receives splashing of cooling liquid, the structure of the three-dimensional steam cavity element can directly enable the cooling liquid to be splashed to the highest-temperature position and then flow through the micro-channel, and therefore the overall heat dissipation efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a three-dimensional vapor cavity element, in particular to a three-dimensional vapor cavity element with a cover and a shoveling micro-channel structure combined to increase the surface area of the heat dissipation and have the function of jet flow heat dissipation. BACKGROUND

[0002] When the high-performance chips of servers and communication switches and the thermal design power (TDP) and power density of communication chips gradually rise, the temperature of the chips also gradually rises, and the 3D stacked IC package also makes it difficult to dissipate the heat generated by the lowermost chip. The traditional air-cooled heat dissipation technology has faced a bottleneck, and the liquid-cooled heat dissipation technology has emerged. Among them, the cold plate type liquid-cooled heat dissipation technology has gradually become the mainstream.

[0003] However, the conventional cold plate type heat dissipation technology can be roughly divided into shoveling micro-channel type cold plates, jet flow type cold plates, and two-phase flow type cold plates. However, when the chip power exceeds 1,000W, the power density exceeds 100W / cm2, and the package structure is 3D stacked, the conventional cold plate type heat dissipation technology also faces the bottleneck of heat dissipation and heat dissipation. Although the general pure jet flow type cold plate can effectively reduce the chip temperature in the impact area of the cooling liquid, it can also cause the problem of excessive temperature difference of the entire chip; the shoveling micro-channel cold plate relying on the heat dissipation fins also faces the problems of difficulty in reducing thermal resistance and uniformity; and the two-phase flow type cold plate also faces the problems of complex and expensive two-phase cooling liquid circulation system and insufficient heat dissipation area.

[0004] Therefore, in order to solve the heat dissipation and heat dissipation challenges brought by the gradual rise of chip power and power density in the conventional various cold plate type liquid-cooled heat sinks, it is necessary to invent and provide a more efficient three-dimensional vapor cavity element to solve the problem of chip heat dissipation and heat dissipation. SUMMARY

[0005] Therefore, the purpose of the present application is to provide a three-dimensional vapor cavity element which is simple in structure, convenient to operate and maintain, can overcome the defects of the prior art, increase the heat dissipation surface area, effectively improve the heat dissipation efficiency, solve the problem of chip heat dissipation, and improve the service life.

[0006] To achieve the above purpose, the present application discloses a three-dimensional vapor cavity element, characterized in that it comprises:

[0007] a cover having an upper surface;

[0008] a lower plate arranged relative to the cover, forming a closed air cavity when the cover is coupled to the lower plate; and

[0009] a plurality of flow channel fins are spaced apart on the upper surface of the upper cover to form a plurality of micro flow channels, and the plurality of flow channel fins are arranged around the opening on the upper surface of the upper cover, and the opening and the micro flow channels are in communication with each other;

[0010] The three-dimensional vapor chamber element has a heat absorption region and a condensation region. The heat absorption region is located on the lower plate, and the condensation region is located on the upper cover.

[0011] The flow channel fins are spaced apart on the upper surface of the upper cover to form the micro flow channels.

[0012] The lower plate has a lower plate lower surface, and the lower plate lower surface opposite to the opening is used to contact a heat source.

[0013] The upper surface of the upper cover has an opening surface opposite to the opening, and the opening surface is used to receive a cooling liquid spray.

[0014] The opening is used to provide the cooling liquid to flow through and spray on the opening surface, and then flow through the micro flow channels on the upper surface of the upper cover.

[0015] The flow channel width of the micro flow channels is less than or equal to 1mm.

[0016] The opening surface is provided with a plurality of heat dissipation structures, and the opening surface is located at a hot spot of the heat source.

[0017] The continuous porous capillary structure is further included, and is arranged between the upper cover and the lower plate in the sealed air chamber.

[0018] The plurality of support columns with the porous capillary structure are further included, and are respectively arranged between the upper cover and the lower plate in the sealed air chamber.

[0019] The flow channel fins further surround a micro flow channel buffer area formed between the upper surface of the upper cover and the micro flow channels.

[0020] In summary, the three-dimensional vapor cavity element of the present application first absorbs the heat energy of the heat source through the lower plate lower surface which is preferentially close to the heat source. The working fluid inside the three-dimensional vapor cavity element can directly absorb the heat energy through the lower plate lower surface and then perform phase change and two-phase flow circulation heat dissipation in the porous capillary structure and the closed air cavity. Further, the upper cover of the three-dimensional vapor cavity element of the present application is further provided with a flow channel fin, and the middle of the flow channel fin is further provided with an opening. When the three-dimensional vapor cavity element of the present application is applied to liquid cooling heat dissipation, the opening can be used to accommodate a spray head. By setting the spray head in the semi-open shell and vertically setting the spray opening of the spray head at the hottest spot of the heat source (i.e. the wafer), the cooling liquid can be directly sprayed and impacted on the opening surface of the upper cover close to the heat source hot spot for forced heat exchange.

[0021] Therefore, in addition to increasing the heat dissipation surface area in the two-phase flow circulation heat dissipation of the three-dimensional vapor cavity element, the flow channel fin of the three-dimensional vapor cavity element of the present application can also directly spray and impact the opening surface of the upper cover when applied to liquid cooling, directly dissipating heat at the hottest place and allowing the cooling liquid to take away the heat energy from the heat sink. In summary, the present application provides an innovative three-dimensional vapor cavity element which can further combine with the heat exchange cavity shell of the liquid cooling circulation to form a heat sink with phase change function and spray flow and micro-channel heat dissipation function, to solve the shortcomings of the conventional liquid cooling heat sink. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The structure schematic diagram of the three-dimensional vapor cavity element of a specific embodiment of the present application is shown.

[0023] Figure 2 The exploded schematic diagram of the three-dimensional vapor cavity element according to Figure 1 is shown.

[0024] Figure 3 The schematic diagram of the three-dimensional vapor cavity element according to Figure 1 applied to liquid cooling heat dissipation is shown.

[0025] Figure 4 The schematic diagram of the three-dimensional vapor cavity element of another specific embodiment of the present application is shown.

[0026] Figure 5 The schematic diagram of the three-dimensional vapor cavity element of another specific embodiment of the present application is shown.

[0027] Figure 6 The schematic diagram of the three-dimensional vapor cavity element of another specific embodiment of the present application is shown.

[0028] Figure 7 The schematic diagram of the three-dimensional vapor cavity element of another specific embodiment of the present application is shown. Detailed Implementation

[0029] To make the advantages, spirit, and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It should be noted that these specific embodiments are merely representative examples of the present invention, and the specific methods, apparatus, conditions, materials, etc., exemplified are not intended to limit the present invention or the corresponding specific embodiments. Furthermore, the elements in the figures are only used to illustrate their relative positions and are not drawn to scale; the step numbers in the present invention are only for distinguishing different steps and do not represent the order of the steps, as will be stated previously.

[0030] Please refer to the following: Figure 1 as well as Figure 2 , Figure 1 This shows a schematic diagram of the structure of a three-dimensional vapor chamber element 1 according to a specific embodiment of the present invention. Figure 2 Showing according to Figure 1 An exploded view of the three-dimensional vapor chamber element 1. (See diagram below.) Figure 1 as well as Figure 2 As shown, the three-dimensional vapor chamber element 1 of this specific embodiment includes an upper cover 10, a lower plate 20, and multiple flow channel fins 30. The upper cover 10 has an upper surface 101, and the lower plate 20 has a lower plate lower surface 201. When the upper cover 10 is coupled to the lower plate 20, a sealed air chamber 204 is formed between the upper cover 10 and the lower plate 20. Multiple flow channel fins 30 are spaced apart on the upper surface 101 of the upper cover 10 to form multiple microchannels 31. Simultaneously, the multiple flow channel fins 30 surround the upper surface 101 of the upper cover 10 to form an opening 32, and the opening 32 communicates with each microchannel 31. The three-dimensional vapor chamber element 1 has a heat absorption region 81 and a condensation region 82. The heat absorption region 81 is located on the lower plate 20, and the condensation region 82 is located on the upper cover 10, and both are in contact with a heat source 90 relative to the lower plate lower surface 201 of the opening 32.

[0031] In the embodiment, the three-dimensional vapor chamber element 1 further comprises a continuous porous capillary structure (not shown) and a plurality of porous capillary support pillars 41, and the upper cover 10 is provided with a filling port sealing structure 103. In practice, the porous capillary structure is provided on the lower surface of the upper cover 10 and the lower plate upper surface of the lower plate 20, and the support pillars 41 are provided between the upper cover 10 and the lower plate 20. When the upper cover 10 and the lower plate 20 are coupled, the plurality of porous capillary support pillars 41 are located between the upper cover 10 and the lower plate 20, and further, the plurality of porous capillary support pillars 41 form a continuous capillary structure with the porous capillary structure on the lower surface of the upper cover 10 and the lower plate upper surface of the lower plate 20. Then, the working fluid is injected into the cavity between the upper cover 10 and the lower plate 20 from the pre-provided filling port (not shown) of the lower plate 20, and vacuumizing and sealing the filling port, and the internal cavity after vacuumizing forms a sealed cavity 204. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol, or a two-phase cooling liquid such as R134a.

[0032] Please continue to refer to Figure 1 and Figure 2 The flow channel fin 30 structure of the three-dimensional vapor chamber element 1 of the embodiment is a whole quadrilateral. In practice, the metal material can be first milled to the specific contour of the whole structure and the opening 32 in the middle of the upper cover 10 by a chisel tooth process, then the flow channel fin 30 is sequentially cut and pin processed, and the gap between each flow channel fin 30 forms a micro flow channel 31 so that the cooling liquid can flow more uniformly, and then the flow channel fin 30 is coupled to the upper surface 101 of the upper cover 10 by welding. In another embodiment, the metal material can be directly reserved for the thickness of the upper cover and the opening and the structure features of the flow channel fin can be directly milled on the upper surface of the material, so that the flow channel fin is integrally formed on the upper cover. When the integrally formed upper cover is coupled to the lower cover, a three-dimensional vapor chamber element is formed. Due to the integrally formed relationship, the thermal resistance between the flow channel fin and the upper cover can be reduced, thereby improving the heat dissipation efficiency.

[0033] In practical application, the lower plate 20 of the three-dimensional vapor chamber element 1 serves as the heat absorption area 81 to preferentially absorb the heat energy of the heat source 90, at which time the working fluid in the sealed cavity 204 of the three-dimensional vapor chamber element 1 absorbs the heat energy, and the working fluid changes from liquid to gas, and then the gaseous working fluid migrates to the condensation area 82. Due to the temperature drop, the working fluid subjected to the temperature drop changes back to liquid, and finally flows back to the heat absorption area 81 along the porous capillary structure and the support pillars 41, thereby repeating the two-phase flow circulation inside the three-dimensional vapor chamber element 1.

[0034] In practical applications, the three-dimensional vapor chamber element 1 of this invention can be installed in a semi-open shell and filled with coolant to simultaneously perform two-phase flow heat dissipation and liquid cooling heat dissipation inside the three-dimensional vapor chamber element. Please refer to [further details omitted]. Figure 1 , Figure 2 as well as Figure 3 , Figure 3 Showing according to Figure 1 A schematic diagram of a three-dimensional vapor chamber element 1 applied to liquid cooling heat dissipation. (See diagram below.) Figure 3 As shown, the three-dimensional vapor chamber element 1 is installed inside the semi-open housing 70. When the three-dimensional vapor chamber element 1 of the present invention is actually used for heat dissipation, Figure 3 The arrows shown indicate the direction of coolant flow. Coolant flows in from the inlet of the semi-open housing 70, and then flows directly downwards from the inlet above the three-dimensional vapor chamber element 1, passing through the opening surface 102 of the upper cover 10. Next, the coolant flows along the flow direction of the microchannels 31 and further undergoes forced heat exchange with the large-area flow channel fins 30. Finally, the coolant is discharged from the outlet of the semi-open housing 70, completing a liquid cooling cycle of heat exchange.

[0035] Please continue reading. Figure 3 It is worth noting that the opening of the three-dimensional vapor chamber element 1 in this specific embodiment is positioned corresponding to the location of the heat source 90. That is, the opening and the heat source 90 are at the closest vertical distance. Therefore, when the coolant flows in from the inlet of the semi-open housing 70, the coolant can flow directly out from the spray nozzle above the three-dimensional vapor chamber element 1 and spray directly onto the upper surface area of ​​the cover that is closest to the heat source 90, allowing the coolant to directly undergo forced heat exchange and dissipate heat at the highest temperature, thereby significantly increasing the overall heat dissipation efficiency.

[0036] Therefore, in addition to heat dissipation through the two-phase flow circulation within the aforementioned three-dimensional vapor chamber element 1, further cooling can be achieved by directly spraying coolant from the spray nozzles above the three-dimensional vapor chamber element onto the upper surface of the cover. This allows the low-temperature coolant to further remove heat from the cover area. The coolant then flows through the heat exchange chamber and finally exits from the outlet. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane, or hydrofluorocarbon refrigerants, but is not limited to these. Other fluids that absorb and remove heat can also be used. Please note that considering the heat exchange area of ​​the microchannel and the flow rate of the coolant, Figure 2 The microchannel shown in the diagram has a channel width d less than or equal to 1 mm, and further includes a microchannel buffer area 33 formed between the upper surface of the top cover and the microchannel, allowing the coolant flow rate to be adjusted when flowing through the microchannel buffer area 33. In practical applications, the channel width, the thickness of the channel fins, the drainage structure, and the microchannel buffer area are not limited by these specifications and can be adjusted according to the design.

[0037] In another embodiment, a plurality of heat dissipation structures (not shown) are further provided on the opening surface of the upper cover of the three-dimensional vapor cavity element, which can be small cylinders extending upward from the opening surface or recessed downward into the opening surface, thereby increasing the heat dissipation efficiency of the three-dimensional vapor cavity element, but the shape, number, and arrangement of the heat dissipation structures can be optimized according to actual needs.

[0038] The three-dimensional vapor cavity element 1 described above can be applied to electronic components of a larger size near the heat source, but the three-dimensional vapor cavity element can also be in other forms. Please refer to Figure 4 , Figure 4 A schematic diagram of a three-dimensional vapor cavity element 2 of another specific embodiment of the present application is shown. As shown in Figure 4 , the lower plate lower surface 201 of the lower plate 21 of the three-dimensional vapor cavity element 2 of the present specific embodiment contacts the heat source 90. At this time, the size of the heat source 90 is larger, and the three-dimensional vapor cavity element 2 can be applied to any size of heat source 90. Other devices of the present specific embodiment are substantially the same as the devices corresponding to the foregoing specific embodiments, and therefore will not be described here. The three-dimensional vapor cavity element 2 of the present specific embodiment can also be installed in the semi-open shell described above, allowing the three-dimensional vapor cavity element 2 to perform liquid cooling heat dissipation.

[0039] Please refer to Figure 5 , Figure 5 A schematic diagram of a three-dimensional vapor cavity element 3 of another specific embodiment of the present application is shown. As shown in Figure 5 , the upper cover 11 of the three-dimensional vapor cavity element 3 of the composite liquid cooling heat sink 3 of the present specific embodiment is provided with a recessed opening 1101, which can be milled or processed using a mold to form the recessed opening feature when pre-processing. When the cooling liquid flows out of the spray opening, the cooling liquid can directly splash the opening surface of the recessed opening 1101, thereby increasing the heat dissipation efficiency. Other devices of the present specific embodiment are substantially the same as the devices corresponding to the foregoing specific embodiments, and therefore will not be described here.

[0040] Please refer to Figure 6 , Figure 6 A schematic diagram of a three-dimensional vapor cavity element 4 of another specific embodiment of the present application is shown. As shown in Figure 6 , the three-dimensional vapor cavity element 4 of the present specific embodiment includes an upper cover 11 and a lower plate 21. The cooling liquid can directly splash the opening surface of the recessed opening 1101 of the upper cover 11, thereby increasing the heat dissipation efficiency. The lower plate 21 can also avoid the height of the electronic component. Other devices of the present specific embodiment are substantially the same as the devices corresponding to the foregoing specific embodiments, and therefore will not be described here.

[0041] Further, the three-dimensional vapor chamber element of the present application can also be installed on electronic products with multiple heat sources simultaneously. Please refer to Figure 7 , Figure 7 a schematic diagram of a three-dimensional vapor chamber element 5 of another embodiment of the present application is shown. As shown in Figure 7 , the three-dimensional vapor chamber element 5 of the present embodiment comprises three sets of upper covers 10 simultaneously, which can be coupled with one set of lower plates 20 to form the three-dimensional vapor chamber element 5 and can be bonded on three heat sources 90 simultaneously. In practice, the number and arrangement of the three-dimensional vapor chamber elements can be optimized according to actual needs. The other devices of the present embodiment are substantially the same as those corresponding to the aforementioned embodiments, and thus will not be described here. Further, the three-dimensional vapor chamber element 5 of the present embodiment can also be installed in a semi-open shell and provided with three sets of cooling liquid openings corresponding to the heat sources 90, so that the three-dimensional vapor chamber element 5 can perform liquid cooling heat dissipation.

[0042] In summary, the three-dimensional vapor chamber element of the present application first absorbs the heat energy of the heat source by preferentially adhering to the lower surface of the lower plate, and the working fluid inside the three-dimensional vapor chamber element can directly absorb the heat energy through the lower surface of the lower plate and then perform phase change and two-phase flow circulation heat dissipation in the porous capillary structure and the closed air cavity. Further, the upper cover of the three-dimensional vapor chamber element of the present application is further provided with a flow channel fin, and the middle of the flow channel fin is further provided with an opening. When the three-dimensional vapor chamber element of the present application is applied to liquid cooling heat dissipation, the opening can be used to accommodate a spray head. By setting the spray head in a semi-open shell and vertically setting the spray opening of the spray head at the hottest spot of the heat source (i.e. the wafer), the cooling liquid can be directly sprayed and impacted on the opening surface of the upper cover close to the heat spot of the heat source for forced heat exchange.

[0043] Therefore, the flow channel fin of the three-dimensional vapor chamber element of the present application can not only increase the heat dissipation surface area in the two-phase flow circulation heat dissipation of the three-dimensional vapor chamber element, but also can directly spray and impact the opening surface of the upper cover when applied to liquid cooling, directly dissipating heat at the highest temperature place and allowing the cooling liquid to take away the heat energy from the heat dissipater. In summary, the present application provides an innovative three-dimensional vapor chamber element which can be further combined with a liquid cooling circulation heat exchange cavity shell to form a heat dissipater with phase change function and spray flow and micro-channel heat dissipation function, to solve the shortcomings of the conventional liquid cooling heat dissipaters.

[0044] From the above description of the preferred embodiments, it is manifest that various modifications and variations can be made to the specific implementation without departing from the contemplated spirit and scope of the application. Therefore, it is intended that the scope of the application be limited only by the broadest interpretation of the appended claims to have the full scope of equivalency, while reserving any undefined or unrecited techniques as ineligible for purposes of patenting.

Claims

1. A three-dimensional vapor cavity element, characterized by The three-dimensional vapor chamber element comprises: an upper cover having an upper surface; a lower plate arranged opposite to the upper cover to form a sealed air cavity when the upper cover is coupled to the lower plate; and a plurality of flow channel fins arranged at intervals on the upper surface of the upper cover to form a plurality of micro flow channels, wherein the plurality of flow channel fins surround the upper surface of the upper cover to form an opening, and the opening and the micro flow channels are mutually penetrated. The three-dimensional vapor chamber element has a heat absorption area and a condensation area, wherein the heat absorption area is located on the lower plate, and the condensation area is located on the upper cover. The plurality of flow channel fins are arranged at intervals on the upper surface of the upper cover by integral molding to form the plurality of micro flow channels.

2. The three-dimensional vapor cavity element of claim 1, wherein, The lower plate has a lower plate lower surface opposite to the lower plate lower surface of the opening to contact a heat source.

3. The three-dimensional vapor cavity element of claim 2, wherein, The upper surface of the upper cover has an opening surface opposite to the opening, and the opening surface is used to receive a cooling liquid spray.

4. The three-dimensional vapor cavity element of claim 3, wherein, The opening is used to provide the cooling liquid to flow through and spray on the opening surface, and then flow through the micro flow channels on the upper surface of the upper cover.

5. The three-dimensional vapor cavity element of claim 4, wherein, The flow channel width of the micro flow channels is less than or equal to 1mm.

6. The three-dimensional vapor cavity element of claim 1, wherein, The opening surface is provided with a plurality of heat dissipation structures, and the opening surface is located at a hot spot of the heat source.

7. The three-dimensional vapor cavity element of claim 4, wherein, Further comprising a continuous porous capillary structure arranged between the upper cover and the lower plate in the sealed air cavity.

8. The three-dimensional vapor cavity element of claim 1, wherein, Further comprising a plurality of support columns with porous capillary structures arranged between the upper cover and the lower plate in the sealed air cavity.

9. The three-dimensional vapor cavity element of claim 1, wherein, The plurality of flow channel fins further surround a micro flow channel buffer area formed between the upper surface of the upper cover and the micro flow channels.

10. The three-dimensional vapor cavity element of claim 1, wherein, ​

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