Power module

Abstract

The invention relates to the technical field of chip packaging, in particular to a power module which comprises a shell, a bottom plate, a circuit carrier, a chip, a power terminal set, a signal terminal set, a cover plate and a driving circuit board. The driving circuit board is detachably installed in the shell, electrically connected with the circuit carrier and capable of being connected with an external connector. The driving circuit board is detachably connected with the shell, so that the driving circuit board can be mounted in or dismounted from the shell according to needs to realize free switching of two forms of products, and the flexibility is high. And when the driving circuit board is arranged in the shell, a relatively high integration level can be ensured. And meanwhile, the production line investment cost is reduced, and the production efficiency is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of chip packaging, and in particular to a power module. Background Technology

[0002] As one of the core components of a power electronic system, the performance of the power module directly affects the efficiency and reliability of the entire system. With the development of chip technology, the integration and power density of power modules are constantly improving, resulting in two mainstream product forms.

[0003] In the existing first product form, the drive circuit and power devices are not integrated on the same board but are designed independently. Although this is cheaper and easier to maintain, the integration level is low. In the existing second product form, the drive circuit and power devices are integrated on the same board. Although the integration level is improved, the cost is higher and the flexibility is poor.

[0004] The existing technical solutions mentioned above have the following drawbacks: they cannot achieve both high integration and high flexibility. Summary of the Invention

[0005] To balance high integration and high flexibility, this application provides a power module.

[0006] This application provides a power module, which adopts the following technical solution: A power module, comprising: case; The base plate is installed at the bottom of the housing; The circuit carrier is mounted on the top surface of the base plate; Chips are mounted on circuit carriers; The power terminal block is mounted on the outer wall of the housing and connected to the circuit carrier. The signal terminal block is installed inside the housing and connected to the circuit carrier; The drive circuit board is detachably installed inside the housing and connected to the circuit carrier.

[0007] By adopting the above technical solution, the housing isolates the circuit carrier, chip, and driver circuit board from the external environment, providing insulation and protection, while the base plate serves as a heat dissipation unit, ensuring the heat dissipation effect of the power module. The power terminal group is electrically connected to the chip via the circuit carrier and can be connected to external terminals to carry current and voltage. The signal terminal group is also electrically connected to the chip via the circuit carrier and can be connected to external terminals for signal transmission. The driver circuit board is electrically connected to the chip via the circuit carrier and can be connected to external connectors. Because the driver circuit board is detachably connected to the housing, it can be installed inside or removed as needed, allowing for free switching between the two product forms, offering high flexibility. Installing the driver circuit board inside the housing also ensures high integration. Furthermore, both product forms can be manufactured using the same production line, which helps reduce production line investment costs and ensures production efficiency.

[0008] This application further includes: A partition, detachably installed inside the housing, isolates the circuit carrier and drive circuit board; And / or, a cover plate, removably mounted on top of the housing.

[0009] By adopting the above technical solution, the partition can isolate the circuit carrier and the drive circuit board, thus protecting the circuit carrier. The cover can isolate the drive circuit board from the outside, thus protecting the drive circuit board.

[0010] This application is further configured such that: a clearance hole for inserting an external connector is formed on the cover plate or one side wall of the housing; And / or, mounting holes are formed at opposite ends of the housing; mounting holes are also formed at opposite ends of the base plate; the housing and heat dissipation devices for use with the power module are connected through the mounting holes using mounting fittings.

[0011] By adopting the above technical solution, the clearance hole facilitates the connection of the external connector to the drive circuit board from above / one side. The mounting hole facilitates the disassembly and assembly of the housing and heat dissipation devices.

[0012] This application further specifies that the power terminal group includes: The first power terminal, which is one or more, is installed in the middle of an outer side wall of the housing; There are two or more second power terminals, which are respectively installed at opposite ends of an outer side wall of the housing; The third power terminal, consisting of two or more, is installed on another outer wall of the housing.

[0013] By adopting the above technical solution, when the first power terminal is used as the positive power terminal, the second power terminal is used as the negative power terminal. Conversely, when the first power terminal is used as the negative power terminal, the second power terminal is used as the positive power terminal. The third power terminal is used as the AC power terminal. By rationally designing the number of power terminals, the power module can be adapted to various application scenarios.

[0014] This application further specifies that the distance between the bottom of each signal terminal of the signal terminal group and the edge of the corresponding chip is equal to or less than 25 mm.

[0015] By adopting the above technical solutions, the wiring length is reduced, and the signal integrity, timing performance and anti-interference ability are improved, especially for high-frequency and high-speed signals.

[0016] This application further specifies that: a first protective structure and a second protective structure are formed on the housing; the first protective structure is used to protect the power terminal group; and the second protective structure is used to protect the mounting holes.

[0017] By adopting the above technical solution, the power terminal group and mounting holes are protected, and their service life is extended.

[0018] This application further includes: A sealing ring is placed between the housing and the drive circuit board; And / or, a lock nut, removably or non-removably mounted inside the side wall of the housing; the lock nut is used to connect with a screw for use with a power terminal.

[0019] By adopting the above technical solution, the sealing ring can isolate the signal terminal group and the drive circuit board. The locking nut can improve the stability of the connection between the external terminals and the power terminals.

[0020] This application further includes: A heat conduction component is located between the base plate and the drive circuit board to transfer heat from the drive circuit board to the base plate.

[0021] By adopting the above technical solutions, the heat conduction components can further improve the heat dissipation effect and ensure the stability of the power module operation.

[0022] This application further specifies that the heat conduction component includes: A semiconductor cooling component is mounted on the top surface of the base plate; A heat transfer block is disposed between the top surface of the semiconductor cooling device and the bottom surface of the drive circuit board, and a heat transfer cavity is formed inside the heat transfer cavity; a phase change medium is stored inside the heat transfer cavity. The adsorption strip is in a "Ji" shape and is arranged in the heat transfer cavity. The top is installed at the top of the heat transfer cavity through a shape memory alloy component and can adsorb the phase change medium.

[0023] By adopting the above technical solution, when the heat generated by the drive circuit board is less, the shape memory alloy component remains in the low-temperature phase transformation state, so that the adsorption strip does not adhere to the top surface of the heat transfer cavity, and thus the phase change medium and the adsorption strip hardly participate in the heat conduction task. The heat generated by the drive circuit board is transferred to the bottom plate through the heat conduction block and the semiconductor refrigeration component. When the heat generated by the drive circuit board is more, the shape memory alloy component remains in the high-temperature phase transformation state, so that the adsorption strip adheres to the top surface of the heat transfer cavity. With the help of the adsorption strip, the liquid phase change medium climbs to the top of the heat transfer cavity and is vaporized by heating. The gaseous phase change medium flows to the bottom of the heat transfer cavity and is liquefied by cooling. In this way, the heat conduction efficiency is greatly improved.

[0024] To sum up, the beneficial technical effects of this application are as follows: 1. Since the drive circuit board and the housing are connected in a detachable manner, the drive circuit board can be installed in or removed from the housing according to needs to realize the free switching of two forms of products, with high flexibility. When the drive circuit board is installed in the housing, a high integration degree can be ensured. At the same time, the two forms of products can be manufactured using the same production line, which is beneficial to reducing the production line input cost and ensuring the production efficiency; 2. The partition can isolate the circuit carrier and the drive circuit board and play a protective role for the circuit carrier. The cover plate can isolate the drive circuit board from the outside and play a protective role for the drive circuit board; 3. By reasonably designing the number of power terminals, the power module can be adapted to a variety of application scenarios; 4. The distance between the bottom of the signal terminal and the edge of the chip is equal to or less than 25 mm, which is beneficial to reducing the wiring length, improving the signal integrity, timing performance and anti-interference ability, especially having a significant effect on high-frequency and high-speed signals; 5. By adding a heat conduction component, when the heat generated by the drive circuit board is less, the shape memory alloy component remains in the low-temperature phase transformation state, so that the adsorption strip does not adhere to the top surface of the heat transfer cavity, and thus the phase change medium and the adsorption strip hardly participate in the heat conduction task. The heat generated by the drive circuit board is transferred to the bottom plate through the heat conduction block and the semiconductor refrigeration component. When the heat generated by the drive circuit board is more, the shape memory alloy component remains in the high-temperature phase transformation state, so that the adsorption strip adheres to the top surface of the heat transfer cavity. With the help of the adsorption strip, the liquid phase change medium climbs to the top of the heat transfer cavity and is vaporized by heating. The gaseous phase change medium flows to the bottom of the heat transfer cavity and is liquefied by cooling. In this way, the heat conduction efficiency is greatly improved. Brief Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of an embodiment of the power module; Figure 2 yes Figure 1 The exploded view of the power module shown; Figure 3 yes Figure 1 The diagram shows the combined structure of the housing and base plate in the power module. Figure 4 yes Figure 1 The diagram shows the combined structure of the housing and partition in the power module. Figure 5 This is a schematic diagram of another embodiment of the power module; Figure 6 yes Figure 5 The exploded view of the power module shown; Figure 7 This is a structural schematic diagram of yet another embodiment of the power module; Figure 8 yes Figure 7 The exploded view of the power module shown; Figure 9 This is a structural schematic diagram of another embodiment of the power module; Figure 10 yes Figure 9 The exploded view of the power module shown; Figure 11 yes Figure 9 The diagram shows the combined structure of the base plate, heat conduction components, and drive circuit board in the power module.

[0026] Reference numerals: 110, housing; 111, clearance hole; 112, mounting hole; 113, first protective structure; 114, second protective structure; 120, base plate; 130, circuit carrier; 140, chip; 150, power terminal group; 151, first power terminal; 152, second power terminal; 153, third power terminal; 160, signal terminal group; 161, sealing ring; 170, drive circuit board; 181, partition; 182, cover plate; 183, locking nut; 184, first snap-fit; 185, second snap-fit; 190, heat conduction component; 191, semiconductor cooling component; 192, heat conduction block; 1921, heat transfer chamber; 1922, phase change medium; 193, adsorption strip; 194, shape memory alloy component. Detailed Implementation

[0027] The following is in conjunction with the appendix Figure 1-11 This application will be described in further detail.

[0028] Reference Figure 1 , Figure 2 and Figure 3This application discloses a power module, including a housing 110, a base plate 120, a circuit carrier 130, a chip 140, a power terminal group 150, a signal terminal group 160, and a drive circuit board 170. The base plate 120 is mounted on the bottom of the housing 110. The housing 110 isolates the circuit carrier 130, chip 140, and drive circuit board 170 from the external environment, providing insulation and protection, while the base plate 120 provides heat dissipation, ensuring the power module's heat dissipation effect. The circuit carrier 130 is mounted on the top surface of the base plate 120. The chip 140 is mounted on the circuit carrier 130. The power terminal group 150 is mounted on the outer wall of the housing 110 and electrically connected to the circuit carrier 130. The power terminal group 150 is electrically connected to the chip 140 through the circuit carrier 130 and can be connected to external terminals for carrying current and voltage. The signal terminal group 160 is mounted inside the housing 110 and electrically connected to the circuit carrier 130. The signal terminal group 160 is electrically connected to the chip 140 via the circuit carrier 130, enabling connection to external terminals for signal transmission. The drive circuit board 170 is detachably mounted within the housing 110 and electrically connected to the circuit carrier 130. The drive circuit board 170, also electrically connected to the chip 140 via the circuit carrier 130, can connect to external connectors. Because the drive circuit board 170 is detachably connected to the housing 110, it can be installed in or removed from the housing 110 as needed, allowing for seamless switching between the two product forms and offering high flexibility. Installing the drive circuit board 170 within the housing 110 also ensures high integration. Furthermore, both product forms can be manufactured using the same production line, reducing production line investment costs and ensuring production efficiency.

[0029] It should be noted that the circuit carrier 130 is connected to the base plate 120 by welding or sintering. The chip 140 is connected to the circuit carrier 130 by welding or sintering. The drive circuit board 170 is installed in the housing 110 by detachable connection methods such as screw connection, snap connection, key connection or fastener connection.

[0030] In one embodiment, reference is made to Figure 1 and Figure 4 The power module also includes a partition 181, which is detachably installed inside the housing 110 to isolate the circuit carrier 130 and the drive circuit board 170 and to protect the circuit carrier 130.

[0031] In another embodiment, refer to 5 and Figure 6 The power module also includes a cover plate 182. The cover plate 182 is detachably mounted on the top of the housing 110, isolating the drive circuit board 170 from the outside and protecting the drive circuit board 170.

[0032] In another embodiment, the power module further includes a partition 181 and a cover 182. The partition 181 is detachably mounted within the housing 110 to isolate the circuit carrier 130 and the drive circuit board 170, thus protecting the circuit carrier 130. The cover 182 is detachably mounted on the top of the housing 110 to isolate the drive circuit board 170 from the outside, thus protecting the drive circuit board 170.

[0033] It should be noted that the partition 181 and the housing 110 can be connected by detachable methods such as bolts / screws, snap-fit ​​connections, key connections, or fastener connections to facilitate the assembly and disassembly of the partition 181. Similarly, the cover 182 and the housing 110 can be connected by detachable methods such as bolts / screws, snap-fit ​​connections, key connections, or fastener connections to facilitate the assembly and disassembly of the cover 182. For example... Figure 4 As shown, the opposite sides of the partition 181 are connected to the opposite side walls of the housing 110 via first snap fasteners 184. Alternatively, the partition 181 and the housing 110 can be connected by non-removable methods such as welding, bonding, or riveting. Similarly, the cover plate 182 and the housing 110 can also be connected by non-removable methods such as welding, bonding, or riveting.

[0034] In one embodiment, a clearance hole 111 is formed on the cover plate 182 for insertion of an external connector, so that the external connector can be connected to the drive circuit board 170 from above.

[0035] In another embodiment, reference is made to... Figure 6 An clearance hole 111 is formed on one side wall of the housing 110 for inserting an external connector, so that the external connector can be connected to the drive circuit board 170 from one side.

[0036] It should be noted that the clearance hole 111 can be a round hole, a square hole, or a polygonal hole.

[0037] In one embodiment, mounting holes 112 are formed at opposite ends of the housing 110. Mounting holes 112 are also formed at opposite ends of the base plate 120. The housing 110 and the base plate 120 are connected using mounting members through the mounting holes 112. The mounting members can be bolts or a combination of bolts and metal inserts. After connecting the housing 110 and the base plate 120 using the mounting members, adhesive is used to bond the contact areas of the housing 110 and the base plate 120 to improve the sealing of the connection and enhance its stability.

[0038] Specifically, refer to Figure 1 , Figure 5 and Figure 6The power terminal group 150 includes one or more first power terminals 151, two or more second power terminals 152, and two or more third power terminals 153. One or more first power terminals 151 are mounted on the middle portion of one outer side wall of the housing 110. Two or more second power terminals 152 are respectively mounted on opposite ends of one outer side wall of the housing 110. And two or more third power terminals 153 are mounted on the other outer side wall of the housing 110.

[0039] It should be noted that, depending on the external connection requirements, the first power terminal 151 can be one or more. The second power terminal 152 can be two or more. The third power terminal 153 can be two or more. When the first power terminal 151 is used as the positive power terminal, the second power terminal 152 is used as the negative power terminal. Conversely, when the first power terminal 151 is used as the negative power terminal, the second power terminal 152 is used as the positive power terminal. The third power terminal 153 is used as an AC power terminal.

[0040] Specifically, the bottom of each signal terminal of the signal terminal group 160 is 25mm or less from the edge of the corresponding chip 140, which reduces the wiring length and improves signal integrity, timing performance and anti-interference ability, especially for high-frequency and high-speed signals.

[0041] Specifically, refer to Figure 1 A first protective structure 113 and a second protective structure 114 are formed on the housing 110. The first protective structure 113 is used to protect the power terminal group 150. The second protective structure 114 is used to protect the mounting hole 112.

[0042] It should be noted that there are multiple first protective structures 113, each corresponding to a power terminal and formed on the outside of the power terminal. Each first protective structure 113 exists as a barrier on opposite sides of the corresponding power terminal. The second protective structure 114 is formed on opposite sides of the mounting hole 112, and exists as a barrier on opposite sides of the mounting hole 112.

[0043] In one embodiment, reference is made to Figure 2 The power module also includes a sealing ring 161. The sealing ring 161 is disposed between the housing 110 and the drive circuit board 170 to isolate the signal terminal group 160 and the drive circuit board 170.

[0044] It should be noted that the signal terminal group 160 includes multiple signal terminals. A blind groove for accommodating a sealing ring 161 is formed on the housing 110 corresponding to the position of each signal terminal. Correspondingly, there are also multiple sealing rings 161, each corresponding to one of the multiple signal terminals and arranged around the outer periphery of the signal terminals.

[0045] In one embodiment, reference is made to Figure 7 and Figure 8 The power module also includes multiple locking nuts 183. Each locking nut 183 is non-removably embedded inside the side wall of the housing 110. The locking nuts 183 are used to connect with screws that mate with power terminals.

[0046] In another embodiment, reference is made to... Figure 9 and Figure 10 The power module also includes multiple locking nuts 183. Each locking nut 183 is detachably mounted inside the side wall of the housing 110 via a corresponding second snap 185 for easy replacement. The locking nuts 183 are used to connect with screws that mate with power terminals.

[0047] In one embodiment, the power module further includes a heat conduction component 190. The heat conduction component 190 is disposed between the base plate 120 and the drive circuit board 170, and is used to transfer heat from the drive circuit board 170 to the base plate 120, so as to further improve the heat dissipation effect and ensure the stability of the power module operation.

[0048] In addition, the chip 140 can be any one of MOS, IGBT, Diode, or GaN. The circuit carrier 130 can be a thin-film ceramic substrate, a thick-film printed ceramic substrate, a directly bonded copper ceramic substrate, an active metal soldered ceramic substrate, or a directly electroplated copper ceramic substrate, etc.

[0049] In one embodiment, reference is made to Figure 11, the heat conduction component 190 includes a semiconductor refrigeration element 191, a heat conduction block 192, an adsorption strip 193, and a shape memory alloy element 194. The semiconductor refrigeration element 191 is disposed on the top surface of the bottom plate 120 and is in contact with the bottom plate 120 through an insulating heat conducting pad and heat conducting silicone grease. The heat conduction block 192 is disposed between the top surface of the semiconductor refrigeration element 191 and the bottom surface of the driving circuit board 170, and a heat transfer cavity 1921 is formed inside. The bottom surface of the heat conduction block 192 is in contact with the top surface of the semiconductor refrigeration element 191 through an insulating heat conducting pad and heat conducting silicone grease. The top surface of the heat conduction block 192 is in contact with the bottom surface of the driving circuit board 170 through an insulating heat conducting pad and heat conducting silicone grease. The heat conduction block 192 is made of copper or silver, etc., and has good heat conductivity. A phase change medium 1922 is stored in the heat transfer cavity 1921 of the heat conduction block 192. The adsorption strip 193 is in a "ji" shape and is disposed in the heat transfer cavity 1921. The top is installed at the top of the heat transfer cavity 1921 through the shape memory alloy element 194 and can adsorb the phase change medium 1922. Under different working conditions, the activity of the driving circuit board 170 is different, and the generated heat is different. When the driving circuit board 170 generates less heat, the shape memory alloy element 194 maintains a low-temperature phase change, so that the adsorption strip 193 does not adhere to the top surface of the heat transfer cavity 1921, and thus the phase change medium 1922 and the adsorption strip 193 hardly participate in the heat conduction task. The heat generated by the driving circuit board 170 is transferred to the bottom plate 120 through the heat conduction block 192 and the semiconductor refrigeration element 191. When the driving circuit board 170 generates more heat, the shape memory alloy element 194 maintains a high-temperature phase change, so that the adsorption strip 193 adheres to the top surface of the heat transfer cavity 1921. With the help of the adsorption strip 193, the liquid phase change medium 1922 climbs to the top of the heat transfer cavity 1921 and is vaporized by heat. The gaseous phase change medium 1922 flows to the bottom of the heat transfer cavity 1921 and is liquefied by cooling. In this way, the heat conduction efficiency is greatly improved.

[0050] The implementation principle of the above embodiment is as follows: Since the driving circuit and chip 140 are no longer concentrated on the same board, the cost is reduced and maintenance is easier. Because the driving circuit board 170 and housing 110 are detachably connected, the driving circuit board 170 can be installed in or removed from the housing 110 as needed, allowing for free switching between the two product forms, providing high flexibility. Installing the driving circuit board 170 in the housing 110 also ensures high integration. Simultaneously, the same production line can be used to manufacture both product forms, which helps reduce production line investment costs and ensures production efficiency. By rationally designing the number of power terminals, the power module can be adapted to various application scenarios. By adding a heat conduction component 190, when the heat generated by the driving circuit board 170 is low, the shape memory alloy component 194 maintains low-temperature phase deformation, preventing the adsorption strip 193 from adhering to the top surface of the heat transfer cavity 1921, thus making the phase change medium 1922 and the adsorption strip 193 almost non-participate in heat conduction. The heat generated by the driving circuit board 170 is transferred to the base plate 120 via the heat conduction block 192 and the semiconductor cooling component 191. When the drive circuit board 170 generates a significant amount of heat, the shape memory alloy component 194 undergoes high-temperature phase deformation, causing the adsorption strip 193 to adhere to the top surface of the heat transfer cavity 1921. With the aid of the adsorption strip 193, the liquid phase change medium 1922 rises to the top of the heat transfer cavity 1921 and vaporizes upon heating. The gaseous phase change medium 1922 flows to the bottom of the heat transfer cavity 1921 and liquefies upon cooling. This process repeats continuously, significantly improving heat transfer efficiency.

[0051] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A power module, characterized in that, include: Shell (110); A base plate (120) is installed at the bottom of the housing (110); The circuit carrier (130) is mounted on the top surface of the base plate (120); Chip (140) is mounted on the circuit carrier (130); A power terminal block (150) is mounted on the outer wall of the housing (110) and connected to the circuit carrier (130); A signal terminal block (160) is installed inside the housing (110) and connected to the circuit carrier (130); The drive circuit board (170) is detachably installed inside the housing (110) and connected to the circuit carrier (130).

2. The power module according to claim 1, characterized in that, Also includes: A partition (181) is detachably installed inside the housing (110) to isolate the circuit carrier (130) and the drive circuit board (170); And / or, a cover plate (182) is detachably mounted on top of the housing (110).

3. The power module according to claim 2, characterized in that, An allowance hole (111) for inserting an external connector is formed on the cover plate (182) or on one side wall of the housing (110); And / or, mounting holes (112) are formed at opposite ends of the housing (110); the mounting holes (112) are also formed at opposite ends of the base plate (120); the housing (110) and a heat dissipation device for cooperating with the power module are connected by mounting members through the mounting holes (112).

4. The power module according to claim 1, characterized in that, The power terminal group (150) includes: The first power terminal (151) is one or more and is installed in the middle of an outer side wall of the housing (110); There are two or more second power terminals (152), which are respectively installed at opposite ends of an outer side wall of the housing (110); There are two or more third power terminals (153) installed on another outer side wall of the housing (110).

5. The power module according to claim 1, characterized in that, The distance between the bottom of each signal terminal of the signal terminal group (160) and the edge of the corresponding chip (140) is equal to or less than 25 mm.

6. The power module according to claim 3, characterized in that, A first protective structure (113) and a second protective structure (114) are formed on the housing (110); the first protective structure (113) is used to protect the power terminal group (150); the second protective structure (114) is used to protect the mounting hole (112).

7. The power module according to claim 1, characterized in that, Also includes: A sealing ring (161) is disposed between the housing (110) and the drive circuit board (170); And / or, a lock nut (183) is detachably or non-detachably mounted inside the side wall of the housing (110); the lock nut (183) is used to connect with a screw for use with a power terminal.

8. The power module according to claim 1, characterized in that, Also includes: A heat conduction component (190) is disposed between the base plate (120) and the drive circuit board (170) for transferring heat from the drive circuit board (170) to the base plate (120).

9. The power module according to claim 8, characterized in that, The heat conduction component (190) includes: A semiconductor cooling element (191) is disposed on the top surface of the base plate (120); A heat conduction block (192) is disposed between the top surface of the semiconductor refrigeration component (191) and the bottom surface of the drive circuit board (170), and a heat transfer cavity (1921) is formed inside; a phase change medium (1922) is stored in the heat transfer cavity (1921); An adsorption strip (193), in a "ji" shape, is disposed in the heat transfer cavity (1921), and the top is installed at the top of the heat transfer cavity (1921) through a shape memory alloy component (194), and can adsorb the phase change medium (1922).

Images