Fan filter for semiconductor machine

Abstract

The invention provides a fan filter for a semiconductor machine table, which comprises a frame, a plurality of air inlets are formed in the frame to form an air inlet surface of the fan filter for the semiconductor machine table, and the frame is of a turnover concave structure; the filter element forms an air outlet surface of the fan filter for the semiconductor machine table and is detachably connected with the inner surface of the folded edge of the frame; and the single fan module is arranged corresponding to the air inlet, is arranged in the frame, and comprises impellers distributed in the circumferential direction and an area A defined by the adjacent impellers, and a part of the inner end face of the area A is open. The overall thickness is reduced, and the air speed of the air outlet face is uniform.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and in particular relates to a fan filter for semiconductor equipment. Background Technology

[0002] In semiconductor wafer fabrication, cleanroom control based on particulate contamination management is a core factor determining process yield, device performance, and production stability. Therefore, wafer fabrication equipment has stringent cleanroom requirements, generally requiring the internal environment of the equipment containing the wafers to have a cleanliness level of at least Class 1000. Wafer fabrication equipment typically incorporates an Equipment Fan Filter Unit (EFU) to filter particulate contaminants and various potential polluting gases to meet cleanroom process requirements.

[0003] Specifically, an EFU (Electronic Air Filter Unit) is a combination device of a fan and a filter, which can be combined with high-efficiency filters, ultra-high-efficiency filters, or chemical filters to meet the air filtration needs of different applications. The technology and development originated from fan filter units (FFUs). They are typically installed on the top or side of the equipment, drawing in air from the back, compressing and boosting it with the fan, and then discharging the air to the outside through the filter. They usually also integrate a controller and power supply to realize functions such as reading the start / stop status and adjusting the airflow.

[0004] For semiconductor equipment, internal installation space is extremely limited, while high requirements are placed on airflow and air velocity uniformity. Currently, mainstream EFU products on the market can be divided into two types based on airflow direction and fan type: axial flow fans and centrifugal fans. EFUs using axial flow fans have better air velocity uniformity on the air outlet surface, but their larger thickness and bulkier structure limit their integration into semiconductor equipment. EFUs using centrifugal fans have a smaller overall thickness, but structural limitations result in a smaller airflow directly below the fan and poorer overall air velocity uniformity.

[0005] As can be seen from the above, developing ultra-thin fan filters with uniform airflow suitable for semiconductor equipment is a technical problem that urgently needs to be solved in the field of semiconductor equipment technology. Summary of the Invention

[0006] The purpose of this invention is to provide a fan filter for semiconductor equipment, which reduces the overall thickness and provides uniform airflow velocity at the outlet surface. Semiconductor equipment includes, for example, lithography machines and heat treatment furnaces. The technical solution adopted is as follows: A fan filter for semiconductor equipment, comprising: Frame 1, which has several air inlets to form the air inlet surface of the fan filter for semiconductor equipment, is a folded and recessed structure. Filter element 5, which forms the air outlet surface of the fan filter for semiconductor equipment, is detachably connected to the inner surface of the folded edge of frame 1. And a single fan module 3, which is set in the frame 1, corresponding to the air inlet. It includes circumferentially distributed impellers, and a region A enclosed between adjacent impellers, a part of which is open at its inner end face.

[0007] Preferably, the single fan module 3 includes: a fan mounting plate 3.6, an impeller assembly 3.4, a fan motor 3.5, a fan mounting plate fastener 3.1, a fan motor fastener 3.7, and an impeller assembly fastener 3.8; The fan mounting plate 3.6 is fixed to the frame 1 through the threaded holes of the connecting column and the fan mounting plate fastener 3.1, and forms a space with the frame 1 for the impeller assembly 3.4 and the fan motor 3.5 to rotate; The fan mounting plate 3.6 is detachably connected to the housing of the fan motor 3.5; the fan motor 3.5 is located in the space enclosed by the impeller cylinder, its rotation shaft is set towards the air inlet and is fixed to the impeller cylinder 3.41 of the impeller assembly 3.4 by the impeller assembly fastener 3.8; The impeller assembly 3.4 includes an upper impeller fixing plate, an impeller cylinder 3.41, an impeller, and a lower impeller fixing plate; The impeller cylinder 3.41 is fixed to the lower impeller fixing plate and located within the area enclosed by the upper impeller fixing plate; the impeller is connected to the upper impeller fixing plate and the lower impeller fixing plate; The fixed plate on the impeller has an edge flush with the edge of the impeller and is a ring structure to form the air inlet surface of the impeller assembly 3.4; The lower fixed plate of the impeller has a smaller area than the upper fixed plate of the impeller, and the impeller extends beyond the lower fixed plate. It is an annular structure and is connected to the impeller cylinder 3.41.

[0008] Preferably, it further includes a filter screen 3.2, which is disposed at the air inlet of the frame 1, welded to the inner circumferential wall of the air inlet, and is at the same level as the outer surface of the frame 1.

[0009] Preferably, it further includes a wind deflector ring 3.3, which is an annular structure disposed on the inner surface of the frame 1. It is disposed corresponding to the filter screen 3.2 and surrounds the corresponding air inlet, and a preset gap is formed between it and the fixed plate on the impeller.

[0010] Preferably, an annular groove is formed on the outer circumferential surface of the windshield ring 3.3.

[0011] Preferably, the fan fixing plate 3.6 includes the connecting column and the plate body, and the connecting column and the plate body are fixedly connected by welding.

[0012] Preferably, it further includes a fan baffle 2, which is welded to the frame 1, and the single fan module 3 is provided on both sides of the baffle.

[0013] Preferably, it further includes a rubber sealing strip 4, which is disposed on the inner surface of the folded edge of the frame 1.

[0014] Preferably, the frame 1 is made of sheet metal.

[0015] Compared with the prior art, the advantages of the present invention are: 1. Using a centrifugal backward-curved fan reduces the overall thickness of the filter, saving installation space and adapting to the narrow installation space inside semiconductor equipment; the fan impeller structure is optimized, increasing the air volume on the fan's outlet surface (inner end face) and improving the uniformity of air velocity at the filter's outlet surface.

[0016] 2. The design of the filter screen and the wind deflector has been optimized. The wind deflector adopts a built-in installation method, which reduces the overall thickness of the filter.

[0017] 3. Adopt a multi-fan parallel arrangement scheme to improve the overall air volume and air velocity of the filter.

[0018] Currently, EFUs generally suffer from insufficient air volume and low air velocity, making it difficult to meet the needs of semiconductor equipment for EFU products.

[0019] 4. Install baffles between each fan to reduce airflow reduction caused by mutual airflow interference. Attached Figure Description

[0020] Figure 1 This is a front view of the air inlet of a fan filter for a semiconductor machine. Figure 2 This is a view of the air outlet of a fan filter for a semiconductor machine. Figure 3 This is a diagram showing the internal structure of a fan filter for a semiconductor machine. Figure 4 An exploded view of a fan filter for semiconductor equipment; Figure 5 This is an exploded view of a single fan module; Figure 6 This is a 3D view of a single fan module; Figure 7 This is a structural diagram of a wind turbine in the existing technology; Figure 8 for Figure 6 Structural diagram of the fan in the middle; Figure 9 for Figure 6 A schematic diagram of the air outlet of a medium-sized fan.

[0021] Among them, 1-frame, 2-fan baffle. 3-Single fan module, 3.1-Fan mounting plate fasteners, 3.2-Filter screen, 3.3-Wind deflector ring, 3.4-Impeller assembly, 3.41-Impeller cylinder, 3.410-Mounting hole; 3.5 - Fan motor; 3.6 - Fan mounting plate; 3.7 - Fan motor fasteners; 3.8 - Impeller assembly fasteners. 4-Rubber sealing strip, 5-Filter element. Detailed Implementation

[0022] The fan filter for semiconductor equipment of the present invention will now be described in more detail with reference to the schematic diagrams, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0023] like Figures 1-6 , Figures 8-9 A fan filter for semiconductor equipment, comprising: Frame 1 has several air inlets to form the air intake surface of the fan filter for semiconductor equipment, which is a folded and recessed structure.

[0024] There are two ways to connect frame 1 to the machine base: 1. Threaded holes can be machined in the back plate (the planar structure of frame 1) where the air inlet is located, and bolts can be used to connect it to the frame on the machine base. 2. Threaded holes on the folded edges around frame 1 can be used to connect and fix it to the frame of the machine base with long bolts.

[0025] Filter element 5, which forms the air outlet surface of the fan filter for semiconductor equipment, is detachably connected to the inner surface of the folded edge of frame 1. Rubber sealing strip 4 is provided on the inner surface of the folded edge of frame 1; And a single fan module 3, which is set in the frame 1, corresponding to the air inlet. It includes circumferentially distributed impellers, and a region A enclosed between adjacent impellers, a part of which is open at its inner end face.

[0026] In this embodiment, "inner" direction refers to the side facing the filter element 5.

[0027] In this embodiment, the frame 1 is made of sheet metal, and threaded holes are provided on the four folded edges. Bolts are used to install and fix the frame 1 and the filter element 5, which facilitates disassembly and replacement.

[0028] In this embodiment, a fan baffle 2 is further included, which is welded to the frame 1, and a single fan module 3 is provided on both sides of the baffle.

[0029] Frame 1 is also welded with sheet metal bent baffles to isolate each individual fan module. The height of the baffle is similar to the height of the impeller, which can effectively reduce interference between the fans. The bending angle is ≥120°, which can effectively reduce turbulence and disturbance caused by the baffle.

[0030] The rubber sealing strip 4 has a thickness of ≥1.5mm. It is placed on the mating surface of the frame 1 and the filter element 5 during installation and has a pre-drilled through hole for bolts to pass through. This can improve the sealing effect and reduce air volume loss caused by leakage.

[0031] like Figure 5 , Figure 8 As shown, the single fan module 3 includes: fan mounting plate fastener 3.1, filter screen 3.2, wind baffle ring 3.3, impeller assembly 3.4, fan motor 3.5, fan mounting plate 3.6, fan motor fastener 3.7, and impeller assembly fastener 3.8. The fan mounting plate 3.6 is locked and fixed to the frame 1 through the threaded holes of its connecting column and the fan mounting plate fastener 3.1, and forms a space with the frame 1 for the impeller assembly 3.4 and the fan motor 3.5 to rotate; The housing of the fan motor 3.5 has three threaded holes, which are locked and fixed to the fan mounting plate 3.6 by three fan motor fasteners 3.7 and installed inside the impeller cylinder 3.41; The impeller cylinder 3.41 of the impeller assembly 3.4 has a mounting hole 3.410 (which is a through hole), which is connected and locked to the output shaft of the fan motor 3.5 by the impeller assembly fastener 3.8, and the output shaft of the fan motor 3.5 drives the impeller assembly 3.4 to rotate.

[0032] Specifically, the outer surface of the rotating shaft (output shaft) of the fan motor 3.5 is provided with external threads, and the impeller assembly fastener 3.8 is screwed into the external threads and embedded in the mounting hole 3.410 on the impeller cylinder 3.41, such as... Figure 8 As shown. Specifically, the impeller assembly fastener 3.8 is a lock nut.

[0033] Fasteners 3.1 for the fan mounting plate and 3.7 for the fan motor are locking bolts.

[0034] Impeller assembly 3.4 includes an upper fixed plate for the impeller, an impeller, an impeller cylinder, and a lower fixed plate for the impeller; wherein the impeller is distributed circumferentially along the impeller cylinder; The impeller cylinder is fixed to the lower impeller fixing plate and located within area B enclosed by the upper impeller fixing plate; the impeller is connected to both the upper and lower impeller fixing plates; in this embodiment, the impeller cylinder 3.41 is connected to the inner edge of the lower impeller fixing plate, such as... Figure 8 As shown, the impeller cylinder and the lower fixed plate of the impeller are integrally formed.

[0035] The impeller has a fixed plate with its edge flush with the edge of the impeller. It is a ring-shaped structure to form the air inlet surface of the fan assembly 3.4. The lower fixed plate of the impeller has a smaller area than the upper fixed plate of the impeller, and the impeller extends beyond the lower fixed plate. It is an annular structure and is connected to the impeller cylinder 3.41.

[0036] like Figure 1 As shown, filter 3.2 is welded to the inner circumferential wall of the air inlet of frame 1.

[0037] Filter 3.2 is a planar filter with a circumferential spoke welded structure. The spoke diameter is ≤2mm, which can significantly reduce the air inlet resistance caused by it. The filter is directly welded to the air inlet of the frame, keeping it at the same level as the air inlet surface of the fan filter, avoiding the increase in overall thickness caused by external installation.

[0038] Filter 3.2 is a planar filter. The air inlet on the back plate (the planar structure of frame 1) where the air inlet is located is the same size as the diameter of the filter. By welding the filter spokes to the circumference (inner circumferential wall) of the air inlet, the filter and the back plate of the air inlet can be kept at the same level.

[0039] The wind deflector ring 3.3 is a ring structure that is set on the inner surface of the frame 1. It is set in correspondence with the filter screen 3.2 and surrounds the corresponding air inlet. A preset gap is formed between it and the fixed plate on the impeller.

[0040] The windshield ring 3.3 has an annular groove on its outer circumference, forming an outward C-shape. Figure 5 As shown.

[0041] The outer end face of the wind deflector 3.3 is riveted to the inner end face of the air inlet, such as... Figure 5 As shown, external installation should be avoided to prevent an increase in overall thickness. The gap between the inner end face of the baffle ring 3.3 and the fixed plate on the impeller should be ≤1.5mm, which can significantly reduce air leakage through the gap between the impeller and the frame, as shown above. Figure 6 As shown.

[0042] The impeller of a conventional fan is fixed by two identical mounting plates, as shown above. Figure 7 As shown. This structure causes the impeller to only discharge air horizontally, resulting in no airflow being discharged from the area directly below the impeller.

[0043] Figure 7 In the middle section, the area A enclosed between adjacent impellers has a closed end face in the air outlet direction, that is, it is closed by the lower fixed plate of the impeller. Air enters from the area B enclosed by the upper fixed plate of the impeller, then flows into area A, and exits horizontally through area A.

[0044] The improved fan has a smaller lower fixed plate diameter, which is approximately 60% of the upper fixed plate diameter. Figure 8 As shown.

[0045] This design increases the vertical component of the impeller's airflow direction, such as... Figure 9 As shown by the dashed line, this increases the airflow directly below the fan, thereby improving the uniformity of airflow across the entire air outlet surface.

[0046] By adopting a multi-fan module layout scheme and synchronous control of multiple fans, the system integration and the overall air volume of the fan filter system are improved.

[0047] Furthermore, the fan mounting plate 3.6 includes a connecting column and a plate body, with the connecting column welded to the plate body. The other end of the connecting column has a threaded hole, which can be connected to the fan mounting plate fastener 3.7 to lock the fan mounting plate 3.6 to the frame 1.

[0048] The plate body adopts a narrow-sided triangular plate structure, which can ensure the installation stability of the fan module and reduce system vibration. More importantly, the narrow-sided plate can significantly reduce its frontal area, thereby reducing the air resistance of the fan module's exhaust.

[0049] In summary, this invention provides an ultra-thin, high-volume fan filter for environmental control of semiconductor equipment: A multi-fan arrangement is adopted, and baffles are installed between each fan to reduce mutual interference and greatly improve the overall EFU wind speed and air volume. The use of a flat filter screen and a centrifugal backward-curved fan reduces the overall thickness of the system. This saves installation space and is suitable for installations with limited internal space.

[0050] "Back-tilted fan" is a professional term in the fan industry. It is a type of centrifugal fan classified according to the tilt direction of the impeller blades and is widely used in ventilation, air conditioning, industrial dust removal and other fields.

[0051] Specifically, centrifugal fan impeller blades can be divided into three categories based on the outlet installation angle (the angle between the blade and the impeller's plane of rotation): Forward-curved fans: The blades are tilted in the same direction as the impeller rotation, and the outlet installation angle is >90°. They are characterized by high air pressure, small air volume, and low efficiency. Radial fans: blades are arranged radially, outlet installation angle = 90°, with moderate air pressure and air volume, and are often used in medium pressure scenarios; ⦁ Back-curved fan: The blades are tilted in the opposite direction to the impeller rotation, and the outlet installation angle is <90°. It is characterized by high efficiency and low noise, and is suitable for occasions that require large air volume and high efficiency (such as ventilation of large buildings and industrial waste gas treatment).

[0052] This classification is a fundamental term in fan design, selection, and technical communication. It is clearly defined in industry standards (such as GB / T 1236-2017 "Performance Testing of Standardized Air Ducts for Industrial Fans"), product manuals, and technical documents, and therefore falls under the category of professional terminology.

[0053] The filter screen uses a circumferential spoke design and the fan mounting plate uses a narrow-sided triangular plate design to reduce the overall air resistance of the filter.

[0054] An improved impeller structure was adopted, which increased the air volume directly below the fan and improved the uniformity of air velocity across the entire air outlet surface.

[0055] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.

Claims

1. A fan filter for semiconductor equipment, characterized in that, include: The frame (1) has several air inlets to form the air inlet surface of the fan filter for semiconductor equipment, which is a folded and recessed structure. The filter element (5) forms the air outlet surface of the fan filter for semiconductor equipment, and is detachably connected to the inner surface of the folded edge of the frame (1). And a single fan module (3), which is set in the frame (1) corresponding to the air inlet. It includes circumferentially distributed impellers, and a region A enclosed between adjacent impellers, a part of which is open at the inner end face.

2. The fan filter for semiconductor equipment according to claim 1, characterized in that, The single fan module (3) includes: a fan mounting plate (3.6), an impeller assembly (3.4), a fan motor (3.5), a fan mounting plate fastener (3.1), a fan motor fastener (3.7), and an impeller assembly fastener (3.8). The fan mounting plate (3.6) is fixed to the frame (1) through the threaded holes of the connecting column and the fan mounting plate fastener (3.1), and forms a space with the frame (1) for the impeller assembly (3.4) and the fan motor (3.5) to rotate; The fan mounting plate (3.6) is detachably connected to the housing of the fan motor (3.5); the fan motor (3.5) is located in the space enclosed by the impeller cylinder, its rotation shaft is set towards the air inlet and is fixed to the impeller cylinder (3.41) of the impeller assembly (3.4) by the impeller assembly fastener (3.8); The impeller assembly (3.4) includes an upper impeller fixing plate, an impeller cylinder (3.41), an impeller, and a lower impeller fixing plate; The impeller cylinder (3.41) is fixed to the lower impeller fixing plate and located within the area enclosed by the upper impeller fixing plate; the impeller is connected to the upper impeller fixing plate and the lower impeller fixing plate; The fixed plate on the impeller has an edge flush with the edge of the impeller and is an annular structure to form the air inlet surface of the impeller assembly (3.4); The lower fixed plate of the impeller has a smaller area than the upper fixed plate of the impeller, and the impeller extends beyond the lower fixed plate. It is an annular structure and is connected to the impeller cylinder (3.41).

3. The fan filter for semiconductor machine tools according to claim 2, characterized in that, It further includes a filter screen (3.2), which is disposed at the air inlet of the frame (1), is welded to the inner circumferential wall of the air inlet, and is at the same level as the outer surface of the frame (1).

4. The fan filter for semiconductor machine tools according to claim 2, characterized in that, It further includes a windshield ring (3.3), which is a ring structure. It is set on the inner surface of the frame (1), and is set in correspondence with the filter (3.2) and surrounds the corresponding air inlet. A preset gap is formed between it and the fixed plate on the impeller.

5. The fan filter for semiconductor equipment according to claim 4, characterized in that, An annular groove is formed on the outer circumference of the windshield ring (3.3).

6. The fan filter for semiconductor machine tools according to claim 2, characterized in that, The fan mounting plate (3.6) includes the connecting column and the plate body, and the connecting column and the plate body are fixedly connected by welding.

7. The fan filter for semiconductor machine tools according to claim 1, characterized in that, It further includes a fan baffle (2), which is welded to the frame (1), and the single fan module (3) is provided on both sides of it.

8. The fan filter for semiconductor equipment according to claim 1, characterized in that, It further includes a rubber sealing strip (4) disposed on the inner surface of the folded edge of the frame (1).

9. The fan filter for semiconductor machine tools according to claim 1, characterized in that, The frame (1) is made of sheet metal.

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