Semiconductor refrigeration cooling heater

Abstract

In order to solve the existing problems, the semiconductor refrigeration cooling heater comprises a box body and a cover plate, two fan mounting grooves are formed in the box body, and fans are arranged in the fan mounting grooves; an exhaust outlet is formed in the position, between the two fan mounting grooves, of the rear wall of the box body, the exhaust outlet extends into the box body to form an exhaust groove, and the left part and the right part of the exhaust groove are each communicated with one exhaust groove; a semiconductor refrigeration device is arranged in the exhaust groove; the top of the exhaust outlet extends into the exhaust groove to form a partition plate. And the cover plate is provided with air inlets corresponding to the two fan mounting grooves and air outlets corresponding to the exhaust grooves. The structure is simple, the proportion of air outlet and air exhaust is conveniently controlled, and the function of air outlet and air exhaust at the same time is achieved.

Description

Technical Field

[0001] This invention relates to the field of indoor air conditioning technology, and in particular to a semiconductor cooling fan. Background Technology

[0002] Since the beginning of the 21st century, more and more people have moved into urban apartment buildings. A common characteristic of these buildings is their small living space, resulting in limited kitchen and bathroom space in each household. In summer, cooking in a cramped kitchen and using a cramped bathroom can be extremely hot, necessitating a product to alleviate these conditions. Currently, there are two main methods: installing air conditioning and installing a cooling fan. However, air conditioning is expensive and consumes a lot of electricity, so many families opt for the more economical cooling fan.

[0003] However, traditional ceiling fans circulate air, drawing in indoor air and then blowing it out, thus they don't actually ventilate. After using the bathroom, it often fills with unpleasant odors. In narrow, windowless bathrooms, these odors cannot dissipate, requiring an exhaust system to remove them. In the kitchen, cooking fumes fill the space, adhering to walls and utensils. Even with a range hood, these fumes aren't completely eliminated. Furthermore, ceiling fans, typically mounted on the ceiling, often blow grease-laden air directly onto people's heads, leaving their hair covered in grease. Therefore, kitchens need a proper ventilation system.

[0004] As a result, cooling fans capable of exhausting air have appeared on the market. These cooling fans typically have one fan for exhausting air and another fan for expelling air. This usually results in low air output efficiency, and the air output and exhaust cannot be carried out simultaneously. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a semiconductor cooling fan, comprising a housing and a cover. The housing contains two fan mounting slots, each housing a fan. An exhaust vent is located on the rear wall of the housing between the two fan mounting slots. An exhaust trough extends from the exhaust vent into the housing, with its left and right portions respectively connected to a separate exhaust trough. A semiconductor cooling device is housed within the exhaust trough. A partition plate extends from the top of the exhaust vent into the exhaust trough. The cover has an air inlet corresponding to the two fan mounting slots and an air outlet corresponding to the exhaust trough.

[0006] Furthermore, reinforcing ribs are arranged inside the exhaust vent.

[0007] Furthermore, the partition plate located outside the exhaust vent is an arc-shaped plate that gradually curves downwards from the outside to the inside of the exhaust vent.

[0008] Furthermore, the air inlet is a circular hole.

[0009] Furthermore, the semiconductor cooling device includes a semiconductor cooling chip, heat insulation cotton, and cooling fins. The semiconductor cooling chip is covered with heat insulation cotton on both sides, and the cooling fins are arranged on the surface of the heat insulation cotton.

[0010] Furthermore, the partition plate is installed at a position corresponding to the height of the cooling fins located above the semiconductor cooling chip.

[0011] This invention has one of the following beneficial effects: 1. It uses a semiconductor cooling chip to blow cooled air into the room, making people feel cool; it adopts a dual-fan blowing structure to achieve a large air volume and low noise, and to achieve the goal of reducing the thickness of the main unit; 2. The air outlet structure with partition plate is adopted to evenly separate the air volume into indoor air supply and outdoor exhaust. The structure is simple and efficient, minimizing wind resistance and air volume attenuation, and carrying away the heat from the semiconductor. 3. It adopts a partitioned air outlet structure to achieve both air outlet and ventilation functions, or both air outlet and exhaust functions; 4. It adopts a horizontal semiconductor cooling chip structure. The ratio of air outlet on both sides can be easily adjusted by adjusting the height of the upper and lower aluminum fins and the position of the partition plate. The cooling capacity can be easily adjusted by adding or removing cooling chips. 5. The air inlet is circular, which increases the air volume. Attached Figure Description

[0012] Figure 1 This is an exploded view of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the combined structure of the present invention; Figure 4 This is a schematic diagram of the back structure of the present invention.

[0013] In the diagram, 1. housing; 2. cover plate; 3. fan mounting slot; 4. exhaust port; 5. partition plate; 6. reinforcing rib; 7. fan; 8. semiconductor cooling chip; 9. cooling fins; 10. insulation cotton; 11. air inlet; 12. air outlet; 13. exhaust duct. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described in detail below with reference to embodiments. Specific details will be used in the following description to ensure a thorough understanding of the invention. However, the invention can still be made without these specific details, meaning that those skilled in the art can more effectively explain the nature of their work to other skilled in the art using these descriptions and statements herein. Furthermore, it should be understood that the specific embodiments described herein are merely illustrative of the application and are not intended to limit the actual scope of protection. All raw materials used in the following embodiments are commercially available products.

[0015] Example 1 like Figures 1-4 As shown, a semiconductor cooling fan includes a housing 1 and a cover plate 2. The housing 1 has two fan mounting slots 3, each housing a fan 7. An exhaust port 4 is located on the rear wall of the housing 1 between the two fan mounting slots 3. An exhaust trough 13 extends from the exhaust port 4 into the housing 1, with its left and right portions respectively connected to a separate exhaust trough 13. A semiconductor cooling device is installed within the exhaust trough 13. A partition plate 5 extends from the top of the exhaust port 4 into the exhaust trough 4. The cover plate 2 has a circular air inlet 11 corresponding to the two fan mounting slots 3 and an air outlet 12 corresponding to the exhaust trough 13.

[0016] The exhaust vent 4 is provided with reinforcing ribs 6 arranged inside. The partition plate 5 located outside the exhaust vent 4 is an arc-shaped plate that gradually curves downward from the outside to the inside of the exhaust vent 4.

[0017] The semiconductor cooling device includes a semiconductor cooling chip 8, heat insulation cotton 10, and cooling fins 9. The semiconductor cooling chip 8 is covered with heat insulation cotton 10 on both sides, and the cooling fins 9 are arranged on the surface of the heat insulation cotton 10. The installation position of the partition plate 5 corresponds to the height of the cooling fins 9 located above the semiconductor cooling chip 8.

[0018] This invention employs a semiconductor cooling chip 8 to blow cooled air into the room, providing a refreshing feeling. It utilizes a dual-fan structure 7 to achieve high airflow and low noise, while also reducing the thickness of the main unit. A partition plate 5 is used for air outlet; by controlling the height of the partition plate 5, the airflow from the semiconductor cooling device is controlled. Air below the partition plate 5 is discharged through the exhaust port 4, while air above the partition plate 5 is blown into the room through the exhaust port 12, evenly separating the airflow into indoor and outdoor exhaust. This simple and efficient structure minimizes wind resistance and airflow attenuation, carrying away heat from the semiconductor and... The cooling fan is ceiling-mounted. During installation, the cover plate 2 in the diagram is actually facing the ground. At this time, the hotter air in the semiconductor cooling device is located closer to the bottom of the cabinet 1, while the colder air is closer to the cover plate 2. Ultimately, the colder air will be better discharged from the air outlet 12, and the hotter air will be more easily discharged from the exhaust vent 4. The horizontal semiconductor cooling chip 8 structure can be used. By adjusting the height of the upper and lower cooling fins 9 and the position of the partition plate 5, the air outlet ratio on both sides can be easily adjusted. The cooling capacity can be easily adjusted by adding or removing semiconductor cooling chips 8. The air inlet 11 is a circular air inlet to increase the air intake.

[0019] The technical solutions provided by the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only for helping to understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A semiconductor cooling fan, characterized in that: The device includes a housing and a cover. The housing contains two fan mounting slots, each housing a fan. An exhaust vent is located on the rear wall of the housing between the two fan mounting slots. An exhaust trough extends from the exhaust vent into the housing, with its left and right portions respectively connected to a separate exhaust trough. A semiconductor cooling device is installed within the exhaust trough. A partition plate extends from the top of the exhaust vent into the exhaust trough. The cover has an air inlet corresponding to the two fan mounting slots and an air outlet corresponding to the exhaust trough.

2. The semiconductor cooling fan as described in claim 1, characterized in that: The exhaust vent is equipped with reinforcing ribs.

3. The semiconductor cooling fan as described in claim 1, characterized in that: The partition plate located outside the exhaust vent is an arc-shaped plate that gradually curves downwards from the outside to the inside of the exhaust vent.

4. The semiconductor cooling fan as described in claim 1, characterized in that: The air inlet is a circular hole.

5. The semiconductor cooling fan as described in claim 1, characterized in that: The semiconductor cooling device includes a semiconductor cooling chip, heat insulation cotton, and cooling fins. The semiconductor cooling chip is covered with heat insulation cotton on both the top and bottom, and the cooling fins are arranged on the surface of the heat insulation cotton.

6. The semiconductor cooling fan as described in claim 5, characterized in that: The partition plate is installed at a position corresponding to the height of the cooling fins located above the semiconductor cooling chip.

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