Non-destructive wafer testing method

Abstract

The application provides a nondestructive wafer testing method, relates to the technical field of wafer testing, and obtains needle tip liquid adsorption data through the combination of a probe card and an electro-liquid container to perform needle tip liquid adsorption, performs adsorption state analysis and determination and liquid first adjustment on the needle tip adsorbed liquid until the adsorption state is normal, constructs a conductive channel on the surface of a wafer electrode through the needle tip adsorbed liquid, analyzes the change of the liquid and impedance of the conductive channel, further analyzes and determines the change state of the conductive channel, performs liquid second adjustment according to the channel state determination information until the channel state determination information is the normal state of the channel, further obtains wafer testing data, forms a conductive water drop under the probe through the probe adsorbed conductive liquid, and further forms a conductive channel and performs channel adjustment, so that direct contact with the conductive electrode on the wafer surface is avoided, complicated structural design is not needed, and the testing precision is improved.

Description

TECHNICAL FIELD

[0001] The application provides a non-destructive wafer testing method, and relates to the technical field of testing. BACKGROUND

[0002] The existing wafer electrical detection relies on rigid metal probes to directly contact the metal contact layer of the wafer surface pad to apply voltage for testing. The contact mode is prone to cause irreversible damage to the metal electrode, especially in the testing of high-density wiring, micro pad, ultra-thin wafer and flexible substrate. In addition, when the probe is contacted with the wafer too many times or the thickness of the wafer surface is uneven, the contact end of the probe will be deformed and warped, affecting the service life of the probe and the accuracy of the electrical test. At the same time, the existing technology is difficult to control the testing process, resulting in low efficiency and low accuracy. SUMMARY

[0003] The application provides a non-destructive wafer testing method to solve the above problems.

[0004] The application provides a non-destructive wafer testing method, which comprises the following steps:

[0005] The needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container.

[0006] The needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container.

[0007] The needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container.

[0008] Further, the needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container, comprising:

[0009] The electro-liquid container stores conductive liquid inside.

[0010] The needle tip of the probe needle card is immersed in the conductive liquid.

[0011] The needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container.

[0012] Further, the needle tip liquid adsorption data is obtained by adsorbing the needle tip liquid through the probe needle card combined with the electro-liquid container, comprising:

[0013] According to the preset adsorption data of the probe and the liquid adsorption data of the needle tip, liquid adsorption deviation data is obtained;

[0014] According to the liquid adsorption deviation data, liquid adsorption state determination is performed to obtain needle tip adsorption state determination information;

[0015] When the needle tip adsorption state determination information is in the adsorption deviation state, the needle tip liquid adsorption data is first adjusted to obtain first adsorption adjustment data until the needle tip adsorption state determination information is in the normal adsorption state.

[0016] Further, according to the liquid adsorption deviation data, liquid adsorption state determination is performed to obtain needle tip adsorption state determination information, including:

[0017] Obtain preset liquid adsorption range data;

[0018] Compare the preset liquid adsorption range data with the needle tip liquid adsorption data;

[0019] When the needle tip liquid adsorption data exceeds the preset liquid adsorption range data, it is determined that the needle tip adsorption state is in the adsorption deviation state;

[0020] When the needle tip liquid adsorption data does not exceed the preset liquid adsorption range data, it is determined that the needle tip adsorption state is in the normal adsorption state.

[0021] Further, the needle tip adsorbs liquid to construct a conductive channel with the wafer electrode surface, the liquid and impedance change of the conductive channel are analyzed, and then the change state of the conductive channel is analyzed and determined, and the liquid is second adjusted according to the channel state determination information until the channel state determination information is in the normal channel state, including:

[0022] The needle tip is connected with the wafer by adsorbing liquid to obtain a conductive channel;

[0023] The channel change data of the conductive channel is analyzed to obtain channel change analysis data;

[0024] According to the channel change analysis data, the state of the conductive channel is determined to obtain channel state determination information;

[0025] According to the channel state determination information, the needle tip adsorbs liquid to obtain second adsorption adjustment data until the channel state determination information is in the normal channel state.

[0026] Further, the channel change data of the conductive channel is analyzed to obtain channel change analysis data, including:

[0027] Obtain the needle tip liquid adsorption data when the adsorption state is normal to obtain adsorption liquid data;

[0028] Obtain data on the changes in adsorbed liquid during the conduction process to obtain liquid change data;

[0029] Impedance values ​​are acquired for the conductive channels to obtain channel impedance data.

[0030] Obtain the impedance change data of the channel impedance value during the conduction process to obtain impedance change data;

[0031] By combining liquid change data with impedance change data, synchronous change data of liquid and impedance can be obtained.

[0032] The synchronous change data is analyzed to obtain channel change analysis data.

[0033] Furthermore, the synchronous change data is analyzed to obtain channel change analysis data, including:

[0034] Information on the determination of liquid change status is obtained by combining the liquid change amount of synchronously changing data with preset liquid change range data.

[0035] Impedance change status determination information is obtained by combining the impedance change amount of synchronously changing data with the preset impedance change range data.

[0036] The liquid change state determination information and impedance change state determination information constitute the channel change analysis data.

[0037] Furthermore, based on the channel change analysis data, the state of the conductive channel is determined to obtain channel state determination information, including:

[0038] When both the liquid change state determination information and the impedance change state determination information of the channel change state determination information are abnormal change information and the two change trends are opposite, the conductive channel is determined to be in an abnormal state.

[0039] When either the liquid change state determination information or the impedance change state determination information of the channel change state determination information is an abnormal change information, the conductive channel is determined to be in a channel change state.

[0040] When both the liquid change status determination information and the impedance change status determination information of the channel change status determination information are normal change information, the conductive channel is determined to be in a normal channel state.

[0041] Further, based on the channel state determination information, a second adjustment is performed on the liquid adsorbed by the needle tip to obtain second adsorption adjustment data until the channel state determination information indicates a normal channel state, including:

[0042] When the channel status determination information indicates an abnormal channel status, the liquid adsorbed by the needle tip is adjusted until the channel status determination information indicates a normal channel status or a changed channel status.

[0043] Furthermore, the system includes:

[0044] The liquid adsorption module is used to adsorb liquid at the needle tip by combining a probe needle with an electro-liquid container, obtain the liquid adsorbed at the needle tip, and acquire the liquid adsorption data at the needle tip.

[0045] The adsorption adjustment module is used to analyze and determine the adsorption state of the liquid adsorbed by the needle tip and to adjust the liquid until the adsorption state is normal.

[0046] The channel analysis and adjustment module is used to construct a conductive channel by adsorbing liquid with the tip and the surface of the wafer electrode. It analyzes the changes in liquid and impedance in the conductive channel, and then analyzes and determines the change state of the conductive channel. Based on the channel state determination information, it performs a second adjustment of the liquid until the channel state determination information is in a normal state, and then obtains wafer test data.

[0047] The beneficial effects of this invention are as follows: This invention proposes a non-destructive wafer testing method that avoids direct contact between the probe and the metal electrodes on the wafer surface, preventing the probe from scratching the electrodes during testing. This invention constructs a conductive channel through liquid mediation, fundamentally eliminating the risk of probes scratching wafer electrodes and damaging circuit structures, achieving truly non-destructive testing. Simultaneously, it introduces a "dual adjustment" mechanism: first, it optimizes the adsorption state to ensure the basic liquid parameters are qualified; then, it dynamically adjusts the channel state to ensure the stability of the testing process, significantly reducing testing errors caused by adsorption deviations or channel abnormalities, and improving the accuracy and reliability of test data. The entire process requires no wafer pretreatment, simplifying testing steps, shortening the testing cycle, and adapting to the high-efficiency testing needs of mass production scenarios. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of non-destructive wafer electrical testing.

[0049] Figure 2 This is a schematic diagram of a probe clip;

[0050] Figure 3 This is a schematic diagram of the probe pin of the present invention immersed in the surface of a conductive liquid;

[0051] Figure 4 This is a schematic diagram of the probe needle card of the present invention after adsorbing conductive liquid. Detailed Implementation

[0052] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0053] In one embodiment of the present invention, a non-destructive wafer testing method is proposed, the method comprising:

[0054] The liquid adsorbed at the needle tip is obtained by combining a probe needle with an electro-liquid container, and the liquid adsorption data at the needle tip is acquired.

[0055] The adsorption state of the liquid adsorbed at the needle tip is analyzed and determined, and the liquid is first regulated until the adsorption state is normal.

[0056] A conductive channel is constructed by adsorbing liquid onto the surface of the wafer electrode using a needle tip. Changes in liquid and impedance are analyzed in the conductive channel, and the state of the conductive channel is analyzed and determined. Based on the channel state determination information, a second liquid adjustment is performed until the channel state determination information indicates a normal channel state, thereby obtaining wafer test data.

[0057] The working principle and technical effects of the above-mentioned technical solution are as follows: With the continuous development of integrated circuit manufacturing processes, chip sizes are shrinking and integration levels are continuously increasing, placing higher demands on wafer-level inspection technology. Wafer electrical testing, as a key step in the semiconductor manufacturing process, is an important means of preliminary verification of the electrical performance of chips before packaging. This process not only relates to product yield control but also directly affects the overall cost of subsequent packaging, testing, and system integration. In wafer electrical testing, metal probe technology is the most widely used core method. However, with the continuous increase in chip density and the shrinking of electrode sizes to the nanometer scale, excessive contact force may cause scratches on the metal electrodes, severely affecting metal layer peeling and impacting the reliability of subsequent packaging.

[0058] Existing technical solutions include piezoelectric microprobe technology, MEMS (microelectromechanical systems) flexible probe technology, and capacitive non-contact probe technology.

[0059] Among them, piezoelectric microprobe technology uses piezoelectric materials as actuators to control the extension or displacement of the probe through tiny electrical signals, thereby achieving precise control of contact force and frequency.

[0060] MEMS flexible probe technology uses microelectromechanical systems (MEMS) processes to fabricate a set of microscale elastic probe structures. These probes, typically composed of cantilever beams, serpentine springs, etc., are mounted on a silicon substrate and possess a certain degree of elasticity and deformation capability. During testing, the probes contact the chip's metal electrodes with relatively low contact force, enabling multi-point parallel conduction and electrical measurements.

[0061] Capacitive non-contact probe technology utilizes the tiny capacitance formed between the probe and the electrode to detect changes in impedance or induced current, thereby performing electrical analysis.

[0062] With the continuous development of integrated circuit manufacturing processes, chip sizes are shrinking and integration levels are constantly increasing, placing higher demands on wafer-level inspection technologies. Wafer electrical testing, a crucial step in the semiconductor manufacturing process, is an important means of preliminary verification of the electrical performance of chips before packaging. This process not only affects product yield control but also directly impacts the overall cost of subsequent packaging, testing, and system integration. In wafer electrical testing, metal probe technology is the most widely used core method. However, as chip density continues to increase and electrode sizes shrink to the nanometer scale, excessive contact force can cause scratches on the metal electrodes, severely affecting metal layer peeling and impacting the reliability of subsequent packaging.

[0063] Existing technical solutions include piezoelectric microprobe technology, MEMS (microelectromechanical systems) flexible probe technology, and capacitive non-contact probe technology.

[0064] Among them, piezoelectric microprobe technology uses piezoelectric materials as actuators to control the extension or displacement of the probe through tiny electrical signals, thereby achieving precise control of contact force and frequency.

[0065] MEMS flexible probe technology uses microelectromechanical systems (MEMS) processes to fabricate a set of microscale elastic probe structures. These probes, typically composed of cantilever beams, serpentine springs, etc., are mounted on a silicon substrate and possess a certain degree of elasticity and deformation capability. During testing, the probes contact the chip's metal electrodes with relatively low contact force, enabling multi-point parallel conduction and electrical measurements.

[0066] Capacitive non-contact probe technology utilizes the tiny capacitance formed between the probe and the electrode to detect changes in impedance or induced current, thereby performing electrical analysis.

[0067] This invention uses probe pin cards (such as...) Figure 2 As shown, a needle card with several probes (distributed on it) works in conjunction with an electro-liquid container to adsorb liquid at the needle tip, simultaneously collecting adsorption data. The adsorption state is analyzed and judged; if deviations exist, a first adjustment is made until the adsorption state meets the standard. A conductive channel is constructed using the liquid adsorbed at the needle tip and the wafer electrodes, and changes in liquid and impedance are monitored in real time. The channel state is analyzed and judged accordingly. If the channel state is abnormal, a second adjustment is made to optimize the liquid parameters until the channel state is normal. Wafer test data is obtained based on a stable channel, ensuring that each step is performed non-destructively, avoiding physical or chemical damage to the wafer. Figure 1 As shown.

[0068] This invention constructs conductive channels through liquid mediation, fundamentally eliminating the risk of probes scratching wafer electrodes and damaging circuit structures, thus achieving truly non-destructive testing. Simultaneously, it introduces a dual regulation mechanism: first, it optimizes the adsorption state to ensure the basic liquid parameters are qualified; then, it dynamically adjusts the channel state to ensure stable testing, significantly reducing testing errors caused by adsorption deviations or channel anomalies, and improving the accuracy and reliability of test data. The entire process requires no wafer pretreatment, simplifying testing steps, shortening the testing cycle, and adapting to the high-efficiency testing needs of mass production scenarios.

[0069] In one embodiment of the present invention, the step of obtaining tip-adsorbed liquid by combining a probe needle with an electro-liquid container for tip-liquid adsorption includes:

[0070] The electro-liquid container contains a conductive liquid.

[0071] Immerse the tip of the probe clip into a conductive liquid, such as... Figure 3 As shown, the conductive liquid can be adsorbed onto the needle tip through electrostatic adsorption or surface tension; the probe can be immersed in the conductive liquid to a depth of 2mm to 5mm. The conductive liquid can be an ionic liquid or a liquid metal.

[0072] Obtain preset adsorption data for the probe, and perform tip liquid adsorption based on the preset adsorption data, such as... Figure 4 As shown, a conductive water droplet is adsorbed below the needle tip, and data on liquid adsorption at the needle tip is obtained.

[0073] The working principle and technical effects of the above technical solution are as follows: This invention uses an electro-liquid container as a storage carrier for conductive liquid, providing a stable liquid source for the adsorption process. During operation, the tip of the probe clip is first immersed in the conductive liquid within the container, utilizing the surface tension between the tip and the liquid to achieve initial adsorption. Based on pre-set probe adsorption parameters (such as adsorption time and tip immersion depth), the adsorption process is precisely controlled to ensure that the amount of adsorbed liquid meets testing requirements, while simultaneously collecting relevant data on the liquid adsorbed by the tip in real time. The entire process, through carrier provision, physical adsorption, parameter control, and data acquisition, achieves controllability and traceability of the liquid adsorption at the tip.

[0074] Storing conductive liquids in dedicated electrofluid containers prevents contamination from air exposure, ensuring the stability of the liquid composition and thus guaranteeing consistent electrical performance of the conductive channels. Controlling the adsorption process based on preset adsorption parameters effectively avoids adsorption deviations caused by manual operation, improving the consistency of adsorption. Simultaneously, real-time adsorption data collection facilitates accurate subsequent assessment of the adsorption state, reducing testing problems caused by abnormal adsorption levels and ensuring smooth testing processes from the outset.

[0075] In one embodiment of the present invention, the step of analyzing and adjusting the adsorption state of the liquid adsorbed at the needle tip until the adsorption state is normal includes:

[0076] Liquid adsorption deviation data is obtained by combining the probe preset adsorption data with the needle tip liquid adsorption data;

[0077] Based on the liquid adsorption deviation data, the liquid adsorption state is determined to obtain needle tip adsorption state determination information.

[0078] When the needle tip adsorption state determination information indicates an adsorption deviation state, the needle tip liquid adsorption data is adjusted to obtain first adsorption adjustment data until the needle tip adsorption state determination information indicates a normal adsorption state.

[0079] The working principle and technical effect of the above technical solution are as follows: Combining preset probe adsorption data with actual collected needle tip liquid adsorption data, the liquid adsorption deviation data between the two is obtained through methods such as difference calculation; the current adsorption state is determined based on the deviation data. If the deviation exceeds the allowable range, it is determined to be an adsorption deviation state; if the deviation is within the allowable range, it is determined to be an adsorption normal state; when in an adsorption deviation state, the adsorption data is adjusted by changing adsorption parameters (such as changing the needle tip immersion depth, extending / shortening the adsorption time, etc.), and this process is iterated repeatedly until the adsorption state is determined to be normal. The entire process, through a closed loop of data comparison to find deviations, determining the state based on deviations, and adjusting according to the state, ensures that the adsorption state meets the test requirements.

[0080] By quantitatively analyzing adsorption deviation data, accurate determination of the adsorption state can be achieved, avoiding misjudgments caused by subjective experience and improving the objectivity of state determination. Dynamic adjustment for adsorption deviation can promptly correct adsorption amount deviations, ensuring that the amount of liquid adsorbed by the needle tip is always within a reasonable range. In addition, the closed-loop adjustment mechanism can automatically complete the optimization of adsorption state, reduce manual intervention, reduce operational complexity, and improve the efficiency of adsorption state adjustment, avoiding delays in the testing process due to adsorption problems.

[0081] In one embodiment of the present invention, liquid adsorption state determination is performed based on the liquid adsorption deviation data to obtain needle tip adsorption state determination information, including:

[0082] Obtain preset liquid adsorption range data;

[0083] Compare the preset liquid adsorption range data with the needle tip liquid adsorption data;

[0084] When the needle tip liquid adsorption data exceeds the preset liquid adsorption range data, the needle tip adsorption state is determined to be an adsorption deviation state;

[0085] When the needle tip liquid adsorption data does not exceed the preset liquid adsorption range, the needle tip adsorption state is determined to be a normal adsorption state.

[0086] The working principle and technical effect of the above technical solution are as follows: Based on the testing requirements and liquid characteristics, a reasonable preset liquid adsorption range is set, clearly defining the upper and lower limits of the adsorption amount; the actual collected needle tip liquid adsorption data is compared with the preset range one by one; if the actual adsorption data exceeds the upper or lower limit of the preset range, it indicates that the current adsorption amount is too high or too low, and it is directly judged as an adsorption deviation state; if the actual adsorption data is within the preset range, it indicates that the adsorption amount meets the testing requirements, and it is judged as a normal adsorption state. The entire process uses the preset range as a benchmark, and through simple and direct data comparison, the adsorption state is quickly determined.

[0087] The preset liquid adsorption range provides a clear and unified standard for adsorption state determination, avoiding inconsistencies in determination results caused by ambiguous standards and ensuring consistency in determination results among different operators and different test batches. The data comparison determination method is simple and efficient, requiring no complex algorithms and can quickly output determination results, shortening the adsorption state determination time and improving the overall efficiency of the testing process. At the same time, the clear determination standard makes it easy for operators to quickly identify adsorption problems, promptly initiate adjustment procedures, and reduce testing risks caused by abnormal adsorption states.

[0088] In one embodiment of the present invention, the method of constructing a conductive channel by adsorbing liquid with a needle tip onto the surface of a wafer electrode, analyzing changes in liquid and impedance within the conductive channel, further analyzing and determining the state of the conductive channel, and performing a second adjustment of the liquid based on the channel state determination information until the channel state determination information indicates a normal channel state, includes:

[0089] A conductive channel is obtained by connecting the needle tip to the wafer by adsorbing liquid at the needle tip;

[0090] Perform channel change data analysis on the conductive channel to obtain channel change analysis data;

[0091] Based on the channel change analysis data, the state of the conductive channel is determined to obtain channel state determination information;

[0092] The needle tip is adjusted to adsorb liquid based on the channel status determination information to obtain second adsorption adjustment data until the channel status determination information indicates that the channel is in normal condition.

[0093] The working principle and technical effect of the above-mentioned technical solution are as follows: The liquid adsorbed by the needle tip serves as a conductive medium, connecting the needle tip to the wafer electrode and constructing a temporary conductive channel. Changes in the liquid (such as liquid volume and morphology) and impedance during channel construction are monitored in real time. These changes are combined to form a comprehensive analysis basis, thereby determining the current state of the channel. If the channel state is abnormal, a second adjustment is made to the liquid parameters (such as replenishing liquid or adjusting liquid distribution) based on the judgment information. This state analysis and adjustment are repeated until the channel state is determined to be normal. Testing is then conducted based on the normal channel to obtain wafer test data. The entire process revolves around the conductive channel, ensuring that the channel remains in a stable and usable state through dynamic monitoring and adjustment.

[0094] By constructing conductive channels using liquid as a medium, direct physical contact between probes and wafer electrodes is eliminated, completely avoiding the risk of probes scratching electrodes and damaging the wafer surface structure, thus achieving non-destructive testing. By simultaneously monitoring changes in liquid and impedance, the channel status can be comprehensively reflected, avoiding misjudgments caused by monitoring a single parameter and improving the accuracy of channel status analysis. Dynamic adjustments for abnormal states can promptly resolve channel instability issues, ensuring a continuous and smooth testing process, reducing the number of test interruptions, and improving the reliability of test data.

[0095] In one embodiment of the present invention, the step of performing channel change data analysis on the conductive channel to obtain channel change analysis data includes:

[0096] Obtain the needle tip liquid adsorption data when the adsorption state is normal, and obtain the adsorbed liquid data;

[0097] Obtain data on the changes in adsorbed liquid during the conduction process to obtain liquid change data;

[0098] Impedance values ​​are acquired for the conductive channels to obtain channel impedance data.

[0099] Obtain the impedance change data of the channel impedance value during the conduction process to obtain impedance change data;

[0100] By combining liquid change data with impedance change data, synchronous change data of liquid and impedance can be obtained.

[0101] The synchronous change data is analyzed to obtain channel change analysis data.

[0102] The working principle and technical effects of the above-mentioned technical solution are as follows: Based on the needle tip liquid adsorption data under normal adsorption conditions, adsorbed liquid data is acquired; during the conduction process, changes in the adsorbed liquid data are continuously tracked and recorded to form liquid change data; simultaneously, the impedance value of the conductive channel is acquired in real time using specialized equipment to obtain channel impedance data, and its changes during the conduction process are monitored to generate impedance change data; subsequently, the liquid change data and impedance change data are correlated and fused to form synchronous change data of liquid and impedance; the synchronous change data is analyzed in depth to extract key information reflecting the channel state, forming channel change analysis data. The entire process comprehensively captures channel change characteristics by acquiring multi-dimensional data and performing fusion analysis.

[0103] Simultaneous acquisition of liquid and impedance change data can reflect channel changes from both physical morphology and electrical properties, avoiding the limitations of a single data dimension and making channel change analysis more comprehensive and in-depth. Data fusion analysis can uncover the intrinsic relationship between liquid and impedance changes, reducing misjudgments of the state due to incomplete data. In addition, change analysis based on baseline data of normal adsorption state can more clearly identify abnormal trends in channel changes, provide early warning of potential channel problems, and buy time for timely adjustment of the channel state.

[0104] In one embodiment of the present invention, the synchronous change data is analyzed to obtain channel change analysis data, including:

[0105] Information on the determination of liquid change status is obtained by combining the liquid change amount of synchronously changing data with preset liquid change range data.

[0106] Impedance change status determination information is obtained by combining the impedance change amount of synchronously changing data with the preset impedance change range data.

[0107] The liquid change state determination information and impedance change state determination information constitute the channel change analysis data.

[0108] The working principle and technical effect of the above technical solution are as follows: For the liquid change amount in the synchronously changing data, combined with pre-set liquid change range data, it is determined whether the liquid change is within a reasonable range, generating liquid change state determination information; then, for the impedance change amount in the synchronously changing data, referring to pre-set impedance change range data, it is analyzed whether the impedance change meets expectations, generating impedance change state determination information; the liquid change state determination information and the impedance change state determination information are integrated, and the two together constitute channel change analysis data. The entire process ensures the comprehensiveness and relevance of the channel change analysis data by independently determining each dimension and then integrating the results.

[0109] Determining the state of liquid and impedance changes in a dimensional manner can clearly identify whether the changes of both are normal, avoiding confusion caused by mutual interference between the two changes and improving the accuracy of single-dimensional state determination. Integrating the two determination information into channel change analysis data can comprehensively reflect the changes of the channel at both the physical and electrical levels. At the same time, the clear dimensional determination results make it easy for operators to quickly locate the abnormal points of channel changes (whether it is abnormal liquid change or abnormal impedance change).

[0110] In one embodiment of the present invention, the state of the conductive channel is determined based on the channel change analysis data to obtain channel state determination information, including:

[0111] When both the liquid change state determination information and the impedance change state determination information of the channel change state determination information are abnormal change information and the two change trends are opposite, the conductive channel is determined to be in an abnormal state.

[0112] When either the liquid change state determination information or the impedance change state determination information of the channel change state determination information is an abnormal change information, the conductive channel is determined to be in a channel change state.

[0113] When both the liquid change status determination information and the impedance change status determination information of the channel change status determination information are normal change information, the conductive channel is determined to be in a normal channel state.

[0114] The working principle and technical effect of the above technical solution are as follows: Based on the liquid change state and impedance change state judgment information in the channel change analysis data, three types of judgment conditions are set: When both are abnormal changes and the change trends are opposite (e.g., liquid volume decreases, impedance increases), it indicates that there is an impedance problem in the channel due to the decrease in liquid, and it is judged as an abnormal channel state; when either of them is abnormal (e.g., liquid change is normal but impedance is abnormal), it indicates that there is a local problem in the channel, and it is judged as a channel change state, at which point the impedance can be adjusted; when both are normal changes, it indicates that the channel state is stable, and it is judged as a normal channel state. Through the combination of these three types of conditions, the channel state can be accurately classified.

[0115] The multi-condition combination judgment method fully considers different combinations of liquid and impedance changes, avoiding the imprecise state division caused by single-condition judgment, and improving the accuracy of channel state judgment. It clearly distinguishes between abnormal channel states and channel change states, which facilitates the adoption of differentiated adjustment strategies for different states. For example, severe abnormal states can be given priority for emergency adjustment, while local change states can be optimized in a targeted manner, improving the rationality and efficiency of adjustment. At the same time, the clear state division enables operators to quickly grasp the severity of channel problems, reasonably arrange adjustment priorities, and ensure the orderly progress of the testing process.

[0116] In one embodiment of the present invention, a second adjustment is performed on the liquid adsorbed at the needle tip based on the channel state determination information to obtain second adsorption adjustment data until the channel state determination information indicates a normal channel state, including:

[0117] When the channel status determination information indicates an abnormal channel status, the liquid adsorbed by the needle tip is adjusted until the channel status determination information indicates a normal channel status or a changed channel status.

[0118] The working principle and technical effect of the above solution are as follows: When the channel status is determined to be abnormal, it indicates a serious problem with the current channel, requiring immediate initiation of the adjustment process. Based on the specific manifestations of the abnormal status (such as impedance abnormalities caused by abnormal liquid volume, channel instability caused by uneven liquid distribution, etc.), the parameters of the liquid adsorbed at the needle tip are adjusted accordingly (such as replenishing liquid, adjusting the liquid distribution at the needle tip, etc.), and a second adjustment is performed on the adsorption data. During the adjustment process, changes in the channel status are continuously monitored, and adjustments and status determinations are repeatedly performed until the channel status changes from abnormal to normal, or at least to a channel change state with a less severe problem. The entire process revolves around the abnormal status, targeting and resolving the core problem.

[0119] Targeted adjustments to address channel anomalies can accurately pinpoint and resolve the core issues causing these anomalies, avoiding resource waste and new problems caused by blind adjustments, thus improving adjustment efficiency. Adjusting anomalies to normal or changing states can promptly restore channel availability, reducing test interruptions caused by channel anomalies and ensuring the continuity of the testing process. Furthermore, continuous monitoring of state changes during adjustments allows for real-time verification of the adjustment effects, timely adjustments to the strategy, avoiding over- or under-adjustment, and ensuring that the adjustment results meet expectations.

[0120] According to one embodiment of the present invention, the system includes:

[0121] The liquid adsorption module is used to adsorb liquid at the needle tip by combining a probe needle with an electro-liquid container, obtain the liquid adsorbed at the needle tip, and acquire the liquid adsorption data at the needle tip.

[0122] The adsorption adjustment module is used to analyze and determine the adsorption state of the liquid adsorbed by the needle tip and to adjust the liquid until the adsorption state is normal.

[0123] The channel analysis and adjustment module is used to construct a conductive channel by adsorbing liquid with the tip and the surface of the wafer electrode. It analyzes the changes in liquid and impedance in the conductive channel, and then analyzes and determines the change state of the conductive channel. Based on the channel state determination information, it performs a second adjustment of the liquid until the channel state determination information is in a normal state, and then obtains wafer test data.

[0124] The working principle and technical effects of the above technical solution are as follows: This invention constructs a conductive channel through liquid mediation, fundamentally eliminating the risk of probes scratching wafer electrodes and damaging circuit structures, thus achieving truly non-destructive testing; at the same time, it introduces a dual adjustment mechanism, first optimizing the adsorption state to ensure that the basic liquid parameters are qualified, and then dynamically adjusting the channel state to ensure the stability of the testing process, significantly reducing testing errors caused by adsorption deviation or channel abnormalities, and improving the accuracy and reliability of test data; the entire process does not require wafer pretreatment, simplifying testing steps, shortening the testing cycle, and adapting to the high-efficiency testing needs of mass production scenarios.

[0125] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A method of non-destructive wafer testing, the method comprising: The method comprises: Through the probe needle card combined with the electric liquid container, the needle tip liquid adsorption is carried out, the needle tip liquid adsorption data is obtained, and the needle tip liquid adsorption data is obtained. The adsorption state of the needle tip liquid is analyzed and judged, and the liquid is adjusted until the adsorption state is normal. Through the needle tip liquid and the wafer electrode surface, a conductive channel is constructed, the liquid and impedance change of the conductive channel are analyzed, and then the change state of the conductive channel is analyzed and judged, the liquid is secondly adjusted according to the channel state judgment information, and the wafer test data is obtained until the channel state judgment information is the channel normal state.

2. The non-destructive wafer testing method of claim 1, wherein The method comprises: The electric liquid container stores the conductive liquid inside; The needle tip of the probe needle card is immersed in the conductive liquid; The probe preset adsorption data is obtained, the needle tip liquid adsorption is carried out according to the probe preset adsorption data, and the needle tip liquid adsorption data is obtained.

3. The non-destructive wafer testing method of claim 2, wherein, The adsorption state of the needle tip liquid is analyzed and judged, and the liquid is adjusted until the adsorption state is normal. According to the probe preset adsorption data combined with the needle tip liquid adsorption data, the liquid adsorption deviation data is obtained. According to the liquid adsorption deviation data, the liquid adsorption state is judged, and the needle tip adsorption state judgment information is obtained. When the needle tip adsorption state judgment information is the adsorption deviation state, the first adjustment data of the needle tip liquid adsorption data is obtained until the needle tip adsorption state judgment information is the adsorption normal state.

4. The non-destructive wafer testing method of claim 3, wherein, According to the liquid adsorption deviation data, the liquid adsorption state is judged, and the needle tip adsorption state judgment information is obtained. The preset liquid adsorption range data is obtained. The preset liquid adsorption range data is compared with the needle tip liquid adsorption data. When the needle tip liquid adsorption data exceeds the preset liquid adsorption range data, it is judged that the needle tip adsorption state is the adsorption deviation state. When the needle tip liquid adsorption data does not exceed the preset liquid adsorption range data, it is judged that the needle tip adsorption state is the adsorption normal state.

5. The non-destructive wafer testing method of claim 1, wherein Through the needle tip liquid and the wafer electrode surface, a conductive channel is constructed, the liquid and impedance change of the conductive channel are analyzed, and then the change state of the conductive channel is analyzed and judged, the liquid is secondly adjusted according to the channel state judgment information, and the wafer test data is obtained until the channel state judgment information is the channel normal state. The needle tip is communicated with the wafer through the needle tip liquid, and the conductive channel is obtained. The channel change data analysis of the conductive channel is carried out, and the channel change analysis data is obtained. According to the channel change analysis data, the state of the conductive channel is judged, and the channel state judgment information is obtained. According to the channel state judgment information, the second adjustment data of the needle tip liquid is obtained until the channel state judgment information is the channel normal state.

6. The non-destructive wafer testing method of claim 5, wherein, The needle tip liquid adsorption data of the adsorption state normal is obtained, and the adsorption liquid data is obtained. The change data of the adsorption liquid data in the conductive process is obtained, and the liquid change data is obtained. The impedance value of the conductive channel is collected, and the channel impedance value data is obtained. ​ Obtain the change data of the channel impedance value data in the conduction process, and obtain the impedance change data; Combine the liquid change data with the impedance change data to obtain the synchronous change data of the liquid and the impedance; Analyze the synchronous change data to obtain the channel change analysis data.

7. The non-destructive wafer testing method of claim 6, wherein, The analysis of the synchronous change data to obtain the channel change analysis data includes: Obtain liquid change state judgment information by combining the liquid change amount of the synchronous change data with the preset liquid change range data; Obtain impedance change state judgment information by combining the impedance change amount of the synchronous change data with the preset impedance change range data; The liquid change state judgment information and the impedance change state judgment information are the channel change analysis data.

8. The non-destructive wafer testing method of claim 5, wherein, According to the channel change analysis data, the state of the conduction channel is judged to obtain channel state judgment information, including: When the liquid change state judgment information and the impedance change state judgment information of the channel change state judgment information are both abnormal change information and the change trend of the two is opposite, it is judged that the conduction channel is in an abnormal channel state; When the liquid change state judgment information and the impedance change state judgment information of the channel change state judgment information are any one of abnormal change information, it is judged that the conduction channel is in a channel change state; When the liquid change state judgment information and the impedance change state judgment information of the channel change state judgment information are both normal change information, it is judged that the conduction channel is in a normal channel state.

9. The non-destructive wafer testing method of claim 5, wherein, According to the channel state judgment information, the liquid adsorbed by the needle tip is adjusted for the second time to obtain second adsorption adjustment data, until the channel state judgment information is in a normal channel state, including: When the channel state judgment information is in an abnormal channel state, the liquid adsorbed by the needle tip is adjusted until the channel state judgment information is in a normal channel state or a channel change state.

10. A system for implementing the non-destructive wafer testing method as claimed in claim 1, characterized in that, The system includes: A liquid adsorption module for adsorbing liquid by a probe card combined with an electro-liquid container to obtain needle tip liquid adsorption data; An adsorption adjustment module for adsorption state analysis and judgment and liquid first adjustment of the needle tip liquid adsorption until the adsorption state is normal; A channel analysis and adjustment module for constructing a conduction channel by the needle tip liquid adsorption and the wafer electrode surface, analyzing the changes of the liquid and the impedance of the conduction channel, and then analyzing and judging the change state of the conduction channel, and adjusting the liquid for the second time according to the channel state judgment information until the channel state judgment information is in a normal channel state, and then obtaining wafer test data.

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