Communication equipment
By placing the cooling components on the side of the circuit board away from the optical cage in the communication equipment, and using heat conduction and liquid cooling components for heat dissipation, the problem of heat dissipation difficulties in optical modules is solved, and high-density arrangement and performance improvement of optical modules are achieved.
Patent Information
- Application Number
- CN202410650516.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-11-25
AI Technical Summary
In the prior art, the heat generated by the optical module during operation is difficult to dissipate effectively, resulting in performance degradation. Furthermore, the cooling components occupy the space on the side of the circuit board where the optical cage is located, affecting the high-density arrangement of the optical module.
Design a communication device in which a cooling component is located on the side of the circuit board away from the optical cage. Heat generated by the optical module is conducted to the cooling component through a heat conduction component, and heat is dissipated by a liquid cooling component to avoid heat accumulation. An optical module plug-in port is set with a plug-in method perpendicular to the circuit board to improve density.
It effectively dissipates heat from the optical module, preventing heat accumulation at the optical module, improving the performance and density layout of the optical module, and reducing the space occupied by the cooling components on the optical cage side.
Smart Images
Figure CN121008367A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of communication technology, and in particular to a communication device. Background Technology
[0002] Optical modules, as an important component of optical fiber communication, are optoelectronic devices that realize photoelectric conversion and electro-optic conversion during optical signal transmission. They are widely used in communication equipment such as switches.
[0003] Optical modules generate a lot of heat during operation, which needs to be dissipated in a timely manner; otherwise, the performance of the optical module will be reduced as heat accumulates.
[0004] In the relevant technical solutions, the optical module plug-in port of the optical cage is oriented parallel to the circuit board, and the cooling component is located on the same side of the circuit board as the optical cage, occupying the space on that side of the circuit board and making it difficult to dissipate heat in a timely manner. Summary of the Invention
[0005] This invention discloses a communication device for alleviating the space occupied by the cooling component on the side of the circuit board where the optical cage is located, and for facilitating heat dissipation.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A communication device includes: an optical module, a cooling component, a heat conduction component, a circuit board, and an optical cage; the optical cage is fixed to one side of the circuit board and has an optical module plug-in port; the cooling component is located on the side of the circuit board opposite to the optical cage, and the heat conduction component penetrates the circuit board along its thickness direction, with one end used to dissipate heat from the optical module in the optical module plug-in port, and the other end connected to the cooling component. Heat generated by the optical module passes through the circuit board to the cooling component via the heat conduction component, where the cooling component dissipates the heat, thereby preventing excessive heat accumulation in the optical module from affecting performance. The cooling component is located on the side of the circuit board opposite to the optical cage, thus not occupying space on the side where the optical cage is located; because the cooling component is far from the electronic components on the side of the circuit board where the optical cage is located, it is more conducive to heat dissipation.
[0008] Optionally, the communication device further includes a chassis, the circuit board is located inside the chassis and is perpendicular to the bottom plate of the chassis, and the orientation of the optical module plug-in port is perpendicular to the circuit board, or forms an acute angle with the circuit board.
[0009] Optionally, the heat conduction component includes a heat sink and a heat pipe. The heat sink is used to dissipate heat from the optical module in the optical module plug-in port. The heat pipe passes through the circuit board along the thickness direction of the circuit board, with one end connected to the corresponding heat sink and the other end connected to the cooling component.
[0010] Optionally, the cooling component is a liquid cooling component.
[0011] Optionally, the liquid cooling assembly includes a liquid cooling plate and a pressure plate, wherein the pressure plate presses the heat conduction assembly onto the corresponding liquid cooling plate.
[0012] Optionally, when the heat conduction component includes a radiator and a heat pipe, the pressure plate presses the end of the heat pipe away from the radiator onto the corresponding liquid cooling plate.
[0013] Optionally, the cooling component is configured one-to-one with the light cage.
[0014] Optionally, there may be multiple cooling components, and adjacent cooling components may be connected via a stacking interface.
[0015] Optionally, the optical cage has N rows and M columns of optical module plug-in ports, where N and M are both positive integers ≥ 1.
[0016] Alternatively, N = 1, 2, 3 or 4, and M = 4. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a partial structure within a communication device provided in an embodiment of this application;
[0018] Figure 2 express Figure 1 The assembly relationship between the structure shown and the chassis 60;
[0019] Figure 3 express Figure 2 A schematic diagram of the structure of the intermediate pressure plate 52, liquid cooling plate 51 and heat pipe;
[0020] Figure 4 express Figure 2 A schematic diagram showing the assembly of the optical module 70, circuit board 20, and cooling component 50;
[0021] Figure 5 express Figure 2 A variation of the structure shown;
[0022] Figure 6 express Figure 2 The diagram shows the deformed structure when N=1 and M=4.
[0023] Figure 7 express Figure 2 The diagram shows the deformed structure when N=2 and M=4.
[0024] Figure 8 express Figure 2 The diagram shows the deformed structure when N=4 and M=4. Detailed Implementation
[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0026] Combination Figures 1 to 4 :
[0027] The communication device provided in this application includes: an optical module 70, a cooling component 50, a heat conduction component 30, a circuit board 20, and an optical cage 10. The optical cage 10 is fixed to one side of the circuit board 20. The optical cage 10 can be fixed to the circuit board 20 by crimping, welding, or threading. The optical cage 10 has an optical module plug-in port 11. The cooling component 50 is located on the side of the circuit board 20 away from the optical cage 10. The heat conduction component 30 penetrates the circuit board 20 along the thickness direction of the circuit board 20. One end is used to dissipate heat from the optical module 70 in the optical module plug-in port 11, and the other end is connected to the cooling component 50. The corresponding end of the heat conduction component 30 can be located in the optical module plug-in port 11. The optical module 70 is inserted into the optical module plug-in port 11 and contacts the heat conduction component 30. However, it is not limited to this method. As long as it is ensured that the corresponding end of the heat conduction component 30 can contact the optical module 70 and dissipate heat from it, it is acceptable. The heat generated by the optical module 70 passes through the heat conduction component 30, through the circuit board 20, to the cooling component 50. The cooling component 50 dissipates the heat, thus preventing excessive heat accumulation in the optical module 70 and its impact on performance. The cooling component 50 is located on the side of the circuit board 20 away from the optical cage 10, and does not occupy the space on the side where the optical cage 10 is located. Because the cooling component 50 is far away from the electronic components on the side of the circuit board 20 where the optical cage 10 is located, it is more conducive to heat dissipation.
[0028] In one specific embodiment, the communication device further includes a chassis 60, with the circuit board 20 located inside the chassis 60 and perpendicular to the base plate 61 of the chassis 60, and fixed to the chassis 60. The orientation of the optical module plug-in port 11 is perpendicular to the circuit board 20, forming a VLC (vertical line card) architecture. Those skilled in the art will understand that the "perpendicularity" here can have engineering-permissible errors, with an error range of ±5°, for example, errors of -1°, -2°, -3°, -4°, -5°, 1°, 2°, 3°, 4°, and 5°, etc.; however, it is not limited to this vertical scenario. For example, the orientation of the optical module plug-in port 11 can also form an acute angle with the circuit board 20. Specifically, a connector can be used to adapt the optical module plug-in port 11 so that its orientation is not perpendicular to the circuit board 20. This VLC architecture achieves high-density optical module plug-in ports 11 at a lower cost. The cooling component 50 is located on the side of the circuit board 20 away from the optical cage 10, reserving space for the high-density arrangement of the optical module plug-in ports 11 and further improving the arrangement density of the optical module plug-in ports 11. In contrast, an architecture where the optical module plug-in ports 11 are parallel to the circuit board 20 can generally only stack up to 3 layers of optical module plug-in ports 11, occupying a fixed area of the circuit board 20. The cooling component 50 is located on the side of the circuit board 20 away from the optical cage 10, and cannot improve the arrangement density of the optical module plug-in ports 11.
[0029] The chassis 60 may also include a panel 62, which is vertically connected to the base plate 61. The optical module plug-in port 11 of the optical cage 10 is aligned and connected with the corresponding opening on the panel 62 so as to allow the optical module 70 to be plugged in and out from the opening on the panel 62 to the optical module plug-in port 11.
[0030] In one specific embodiment, the heat conduction component 30 includes a heat sink 32 and a heat pipe 31. The heat sink 32 is used to dissipate heat from the optical module 70 in the optical module plug-in port 11. For example, the heat sink 32 can be located in the corresponding optical module plug-in port 11. The heat sink can be pressed tightly against the optical module 70 by the spring sheet on the inner wall of the optical module plug-in port 11 to ensure good contact and timely absorb and transfer heat from the optical module 70 to the heat pipe 31. The heat pipe 31 penetrates the circuit board 20 along the thickness direction of the circuit board 20, and one end is connected to the corresponding heat sink 32 (e.g., by soldering), and the other end is connected to the cooling component 50. The heat pipe 31 has good thermal conductivity and can conduct the heat from the heat sink 32 to the cooling component 50. The heat pipe 31 can be made of materials with high thermal conductivity, such as copper. The heat pipe 31 directly penetrates the circuit board 20 along the thickness direction of the circuit board 20 without having to go around the side of the circuit board 20, which simplifies the layout of the heat pipe 31 and reduces the length of the heat pipe 31, thereby improving the heat transfer efficiency. Specifically, a through slot 21 can be opened in the circuit board 20, and the heat pipe 31 passes through the through slot 21. The through slot 21 can be set one-to-one with the heat pipe 31 to avoid the through slot 21 being too large and affecting the structural strength of the circuit board 20.
[0031] In one specific embodiment, the cooling component 50 is a liquid cooling component. In the VLC architecture described above, the circuit board 20 blocks the horizontal airflow, which is not conducive to air cooling. However, the liquid cooling component does not require air as a cooling medium, but uses coolant as a cooling medium. Therefore, even if the airflow is blocked by the circuit board 20, the liquid cooling component can still provide heat dissipation for the optical module 70 normally.
[0032] In one specific embodiment, the liquid cooling assembly includes a first support a, a liquid cooling plate 51, and a pressure plate 52. The pressure plate 52 presses the heat conduction assembly 30 onto the corresponding liquid cooling plate 51. Specifically, it can press the heat pipe 31 of the heat conduction assembly 30 onto the corresponding liquid cooling plate 51. Multiple liquid cooling plates 51 can be used, arranged at intervals along a direction perpendicular to the base plate 61 and supported by the first support a. For example, the first support a is connected to the base plate 61 by an angle steel 54. A supporting beam 57 can also be provided between the angle steel 54 and the base plate 61 to improve the support strength. A pressure plate 52 is provided below each liquid cooling plate 51, and the pressure plate 52 is supported by a second support b on the base plate 61. A buffer pad 53 is filled between the pressure plate 52 and the heat pipe 31 to ensure that there is no gap between the pressure plate 52 and the heat pipe 31, allowing the heat pipe 31 to be fully compressed onto the liquid cooling plate 51 for sufficient heat dissipation.
[0033] The first support a can be hollow inside and has a coolant inlet and outlet 56. Each liquid cooling plate 51 is connected to the coolant inlet and outlet 56 through the hollow structure of the first support a. The coolant inlet and outlet 56 are used to realize the supply and recovery of coolant and to realize the circulation of coolant, so that the liquid cooling plate 51 can dissipate the heat conducted by the heat conduction component 30 in a timely manner.
[0034] In one specific embodiment, when the heat conduction component 30 includes a heat sink 32 and a heat pipe 31, a pressure plate presses the end of the heat pipe 31 furthest from the heat sink 32 (tail end 311) onto the corresponding liquid cooling plate 51. This maximizes the length of the heat pipe 31 located between the heat sink 32 and the liquid cooling plate 51, allowing the heat sink 32 to float up and down in contact with the optical module 70, thus making thermal contact more reliable.
[0035] refer to Figure 5 Both the cooling component 50 and the optical cage 10 can be multiple sets. In a specific embodiment, the cooling component 50 and the optical cage 10 are set one-to-one. In this way, each cooling component 50 and each optical cage 10 are independent. When disassembly and maintenance are required, it is not necessary to disassemble the other cooling component 50 just because one cooling component 50 needs to be disassembled, thus improving maintenance efficiency.
[0036] Continue to refer to Figure 5 In one specific embodiment, there are multiple cooling components 50, all of which are located on the side of the circuit board 20 facing away from the optical cage 10. Therefore, they are arranged parallel to the circuit board 20, and adjacent cooling components 50 are connected via a stacking interface 55. This eliminates the need for each cooling component 50 to be connected to a specific part of the chassis 60, thus facilitating the expansion of the optical cage 10 and the cooling components 50. Specifically, an angle iron with a first bolt hole can be provided at the bottom of the cooling component 50, and a second bolt hole corresponding to the first bolt hole can be opened at the top. Connecting the corresponding first and second bolt holes with bolts enables the stacking expansion of the cooling components 50, resulting in high component reuse and significant cost benefits. The first and second bolt holes can serve as a specific embodiment of the stacking interface 55.
[0037] In one specific embodiment, the optical cage 10 has N rows and M columns of optical module plug-in ports 11, where N and M are both positive integers ≥ 1. When N and M are both 1, the optical cage 10 is a single cage; when N or M is greater than or equal to 2, the optical cage 10 is a connected cage. Regardless of which case, the cooling assembly 50 can be fixed to the side of the circuit board 20 away from the optical cage 10.
[0038] In one specific embodiment, N = 1, 2, 3, or 4, and M = 4. For example... Figure 6 As shown, N=1, M=4; Figure 7As shown, N=2, M=4; Figure 8 As shown, N=4, M=4. For cases where N takes different values, it is only necessary to replace the liquid cooling components of the liquid cooling plate 51 with different numbers of layers, which is convenient and flexible.
[0039] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the invention. Therefore, if these modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.
Claims
1. A communication device, characterized by The application relates to a communication device, comprising: a light module, a cooling assembly, a heat conduction assembly, a circuit board and a light cage; the light cage is fixed to one side of the circuit board, and the light cage has a light module plug-in port; the cooling assembly is located on the side of the circuit board away from the light cage, the heat conduction assembly penetrates the circuit board along the thickness direction of the circuit board, and one end is used for dissipating heat of the light module in the light module plug-in port, and the other end is connected with the cooling assembly.
2. The communication device of claim 1, wherein, The communication device further comprises a cabinet, the circuit board is located in the cabinet, and is perpendicular to the bottom plate of the cabinet, the light module plug-in port is oriented perpendicular to the circuit board, or forms an acute angle with the circuit board.
3. The communication device of claim 1, wherein, The heat conduction assembly comprises a heat sink and a heat pipe, the heat sink is used for dissipating heat of the light module in the light module plug-in port, the heat pipe penetrates the circuit board along the thickness direction of the circuit board, and one end is connected with the corresponding heat sink, and the other end is connected with the cooling assembly.
4. The communication device according to any one of claims 1 to 3, characterized by The cooling assembly is a liquid cooling assembly.
5. The communication device of claim 4, wherein, The liquid cooling assembly comprises a liquid cooling plate and a pressing plate, and the pressing plate press-bonds the heat conduction assembly to the corresponding liquid cooling plate.
6. The communication device of claim 5, wherein, When the heat conduction assembly comprises a heat sink and a heat pipe, the pressing plate press-bonds one end of the heat pipe away from the heat sink to the corresponding liquid cooling plate.
7. The communication device of claim 1, wherein, The cooling assembly is arranged one by one with the light cage.
8. The communication device of claim 7, wherein, The number of the cooling assemblies is multiple, and adjacent cooling assemblies are connected through a stacking interface.
9. The communication device of claim 1, wherein, The light cage has N rows and M columns of light module plug-in ports, wherein N and M are positive integers greater than or equal to 1.
10. The communication device of claim 9, wherein, N is 1, 2, 3 or 4, and M is 4.