Server mainboard working environment automatic adaptation system and method

Abstract

The invention relates to a server mainboard working environment automatic adaptation system and method, and the system comprises a BMC module which is used for obtaining the chip temperature data and working state data of each chip module in real time; the BMC module is also used for judging whether an abnormal chip module with an abnormal state exists or not according to the working state data; if the abnormal chip module exists, an adjusting instruction is generated according to the chip temperature data of the abnormal chip module, and the adjusting instruction is sent to a PCB bonding pad temperature adjusting module; and the PCB bonding pad temperature adjusting module is used for heating or cooling the abnormal chip module through the heat conduction channel according to the adjusting instruction. Due to the existence of the heat conduction channel between the PCB bonding pad temperature adjusting module and the bonding pad of each chip module, heating or heat dissipation of each chip module under a low-temperature or high-temperature condition can be realized, and the reliability of normal starting of the server mainboard in an extreme environment is improved.

Description

Technical Field

[0001] This invention belongs to the field of server motherboard adaptation technology, and in particular relates to an automatic adaptation system and method for server motherboard working environment. Background Technology

[0002] In general, common electronic products in everyday life are not designed with high temperature requirements. However, some industrial control and military equipment, which have higher environmental requirements, sometimes need to start at low or high temperatures. Electronic chips, especially integrated circuit chips, will prevent the device from starting if the temperature exceeds the specified range.

[0003] Therefore, the startup of a circuit board under extreme conditions is a problem that urgently needs to be solved. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a server motherboard operating environment automatic adaptation system and method.

[0005] The technical solution adopted in this invention is:

[0006] Firstly, an automatic adaptation system for server motherboard operating environments is provided, including:

[0007] Multiple chip modules, PCB pad temperature regulation modules, and BMC modules are installed on the server PCB motherboard;

[0008] Each chip module's pads have a heat conduction channel with the PCB pad temperature regulation module;

[0009] The BMC module is used to acquire chip temperature data and operating status data of each chip module in real time.

[0010] The BMC module is also used to determine whether there is an abnormal chip module based on the working status data; if there is an abnormal chip module, an adjustment command is generated based on the chip temperature data of the abnormal chip module and the adjustment command is sent to the PCB pad temperature adjustment module.

[0011] The PCB pad temperature control module is used to heat or dissipate heat from abnormal chip modules through the heat conduction channel according to the adjustment command.

[0012] Furthermore, a layer of thermally conductive copper foil is embedded in the PCB board of each chip module. The thermally conductive copper foil forms an independent heat conduction channel between the pads of each chip module and the PCB pad temperature regulation module. The number of chip modules and heat conduction channels are both integers N greater than 0.

[0013] Furthermore, the PCB pad temperature control module includes:

[0014] The system includes a temperature intelligent control unit, a heating parameter regulator, a heat dissipation equalization regulator, a heating channel selector, a heat dissipation channel selector, and N heating elements.

[0015] N heat conduction channels are respectively connected to the heat generation channel selector and the heat dissipation channel selector;

[0016] Heating elements are installed on all N heat conduction channels corresponding to the heating channel selector;

[0017] The temperature intelligent regulation unit is connected to the heating parameter regulator, the heat dissipation equalization regulator, the heating channel selector, and the heat dissipation channel selector;

[0018] The heating parameter regulator is connected to the heating channel selector, and the heat dissipation equalization regulator is connected to the heat dissipation channel selector.

[0019] Furthermore, the server motherboard operating environment automatic adaptation system also includes:

[0020] FPGA processing module, temperature detection module, operation log storage module, data parsing module, and data import module;

[0021] The temperature detection module is used to detect the chip temperature data of each chip module in real time.

[0022] The operation log storage module is used to store the operating status data of each chip module;

[0023] The FPGA processing module is used to obtain the chip temperature data of each chip module through the temperature detection module;

[0024] The data import module is used to obtain the motherboard parameters of the server PCB motherboard and the chip design parameters of each chip module;

[0025] The data parsing module is used to store the motherboard parameters and chip design parameters imported by the data import module.

[0026] Furthermore, the BMC module includes:

[0027] The data reading unit is used to read the chip temperature data of each chip module from the FPGA processing module, the working status data of each chip module from the operation log storage module, and the motherboard parameters and chip design parameters from the data parsing module.

[0028] The data processing unit is used to obtain the PCB temperature point map based on the motherboard parameters and to determine the operating temperature threshold of each chip module based on the chip design parameters.

[0029] The status judgment unit is used to determine whether the status of each chip module is abnormal based on the working status data.

[0030] The chip positioning unit is used to locate the abnormal chip module in the PCB board temperature point map when there is an abnormal chip module.

[0031] The adjustment instruction generation unit is used to generate adjustment instructions for the abnormal chip module based on the chip temperature data and operating temperature threshold of the abnormal chip module.

[0032] The instruction transmission unit is used to send adjustment instructions to the PCB pad temperature adjustment module.

[0033] Furthermore, the adjustment instruction generation unit is specifically used to obtain the current chip temperature value T at the current time point t based on the chip temperature data corresponding to the abnormal chip module. t ;

[0034] The adjustment instruction generation unit is also used to obtain the maximum temperature threshold T based on the operating temperature threshold corresponding to the abnormal chip module. max and minimum temperature threshold T min When the current chip temperature value T St Greater than the highest temperature threshold T max When the current chip temperature value T is reached, the first heat dissipation adjustment command is generated; when the current chip temperature value T is reached... St Less than the minimum temperature threshold T min At that time, the first heating adjustment command is generated.

[0035] Furthermore, the adjustment instruction generation unit is also used when T min ≤T t ≤T max At that time, based on the chip temperature data, the historical chip temperature sequence [T] up to the current time point t is obtained. t-Y T t-Y-1 , ..., T t-1 The value of Y is greater than 1;

[0036] The adjustment instruction generation unit is also used to determine the temperature change trend of the abnormal chip module based on the historical chip temperature sequence. If the temperature change trend is an increase in temperature, the chip temperature value T at the first prediction time point t+M1 is predicted. t+M1 Reaching the highest temperature threshold T max Generate a second heat dissipation adjustment command. The second heat dissipation adjustment command includes a heat dissipation start timestamp t+U, where the value of M1 is greater than 1 and the value of U is less than M1.

[0037] The adjustment instruction generation unit is also used to predict the chip temperature value T at the second prediction time point t+M2 if the temperature change trend is a decrease. t+M2 Reaching the minimum temperature threshold T minA second heating adjustment command is generated, which includes a heating start timestamp t+V, where the value of M2 is greater than 1 and the value of V is less than M2.

[0038] Furthermore, the adjustment instruction generation unit is also used to obtain signal quality data of the abnormal chip module through the FPGA processing module, based on the current chip temperature value T. t Signal quality data and preset temperature-signal quality table are used to optimize the chip operating parameters of abnormal chip modules.

[0039] Secondly, an automatic adaptation method for server motherboard operating environment is provided, applied to a server motherboard operating environment automatic adaptation system. The server motherboard operating environment automatic adaptation system includes multiple chip modules, a PCB pad temperature regulation module, and a BMC module disposed on the server PCB motherboard. Each chip module's pad has a heat conduction channel with the PCB pad temperature regulation module. The automatic adaptation method for the server motherboard operating environment includes:

[0040] The BMC module acquires real-time chip temperature and operating status data for each chip module.

[0041] The BMC module determines whether there are any abnormal chip modules with abnormal status based on the working status data.

[0042] If an abnormal chip module is present, an adjustment command is generated based on the chip temperature data of the abnormal chip module, and the adjustment command is sent to the PCB pad temperature adjustment module.

[0043] The PCB pad temperature control module heats or dissipates heat from abnormal chip modules through the heat conduction channel according to the control command.

[0044] The beneficial effects achieved by this invention are as follows:

[0045] The BMC module acquires real-time chip temperature and operating status data for each chip module. Based on the operating status data, it determines whether any chip modules are malfunctioning. If a malfunctioning chip module is found, it generates an adjustment command based on its chip temperature data and sends the command to the PCB pad temperature adjustment module. The PCB pad temperature adjustment module then heats or cools the malfunctioning chip module via a heat conduction channel according to the adjustment command. Because of the heat conduction channel between the PCB pad temperature adjustment module and the pads of each chip module, heating or cooling of each chip module can be achieved under low or high temperature conditions, improving the reliability of the server motherboard's normal startup in extreme environments. Attached Figure Description

[0046] Figure 1 This is a structural diagram of the server motherboard working environment automatic adaptation system of the present invention;

[0047] Figure 2 This is a structural diagram of the PCB pad temperature regulation module of the present invention;

[0048] Figure 3 This is an overall framework diagram of the server motherboard working environment automatic adaptation system of the present invention;

[0049] Figure 4 This is a flowchart of the automatic adaptation method for the server motherboard working environment according to the present invention. Detailed Implementation

[0050] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0051] like Figure 1 As shown, this embodiment of the invention provides an automatic adaptation system for the working environment of a server motherboard, comprising:

[0052] Multiple chip modules 101, PCB pad temperature regulation module 102 and BMC module 103 are disposed on the server PCB motherboard;

[0053] Each chip module 101 has a heat conduction channel between its pads and the PCB pad temperature regulation module 102;

[0054] BMC module 103 is used to acquire chip temperature data and operating status data of each chip module in real time;

[0055] BMC module 103 is also used to determine whether there is an abnormal chip module with an abnormal status based on the working status data; if there is an abnormal chip module, an adjustment command is generated based on the chip temperature data of the abnormal chip module and the adjustment command is sent to PCB pad temperature adjustment module 102.

[0056] The PCB pad temperature adjustment module 102 is used to heat or dissipate heat from abnormal chip modules through the heat conduction channel according to the adjustment command.

[0057] exist Figure 1 In the embodiment shown, the specific heat conduction channel is implemented in the following way: a layer of thermally conductive copper foil is embedded in the PCB board of each chip module 101, and the thermally conductive copper foil forms an independent heat conduction channel between the pads of each chip module and the PCB pad temperature regulation module 102. The number of chip modules 101 and the number of heat conduction channels are both integers N greater than 0.

[0058] Combination Figure 1 The illustrated embodiment, with reference to Figure 2 As shown, the PCB pad temperature regulation module 102 includes:

[0059] The system includes a temperature intelligent control unit, a heating parameter regulator, a heat dissipation equalization regulator, a heating channel selector, a heat dissipation channel selector, and N heating elements.

[0060] N heat conduction channels are respectively connected to the heat generation channel selector and the heat dissipation channel selector;

[0061] Heating elements are installed on all N heat conduction channels corresponding to the heating channel selector;

[0062] The temperature intelligent regulation unit is connected to the heating parameter regulator, the heat dissipation equalization regulator, the heating channel selector, and the heat dissipation channel selector;

[0063] The heating parameter regulator is connected to the heating channel selector, and the heat dissipation equalization regulator is connected to the heat dissipation channel selector.

[0064] Suppose that chip module A needs to be heated. The intelligent temperature control unit can control the heat conduction channel selector to activate the corresponding heat conduction channel for chip module A. Specifically, this activation can be achieved by connecting the heating element to the thermally conductive copper foil, and then controlling the heating parameter regulator to adjust the heating power of the heating element. The heating element can be a heating resistor; by adjusting the current flowing through the heating resistor, the heating power can be adjusted. After the heating element generates heat, the temperature of the solder pads on chip module A is increased through heat conduction channels, thus heating chip module A.

[0065] Suppose that heat dissipation is required for chip module B. Heat dissipation is different from heating. Heating can be done through heat-generating elements, while heat dissipation is generally achieved by removing heat through liquid nitrogen, air cooling, or water cooling. After the heat dissipation channel selector controls the heat conduction channel of chip module B, the heat dissipation equalization regulator cools down the heat conduction channel. For example, liquid nitrogen is used to cool the heat conduction channel. Through the principle of heat transfer, the temperature at the pads of chip module B will be reduced, thereby achieving heat dissipation for chip module B.

[0066] based on Figure 1 The illustrated embodiments, such as Figure 3 As shown, the server motherboard operating environment automatic adaptation system also includes:

[0067] FPGA processing module 301, temperature detection module 302, operation log storage module 303, data parsing module 304, and data import module 305;

[0068] Temperature detection module 302 is used to detect the chip temperature data of each chip module in real time;

[0069] The operation log storage module 303 is used to store the operating status data of each chip module;

[0070] The FPGA processing module 301 is used to obtain the chip temperature data of each chip module 101 through the temperature detection module 302;

[0071] The data import module 305 is used to obtain the motherboard parameters of the server PCB motherboard and the chip design parameters of each chip module 101.

[0072] The data parsing module 304 is used to store the motherboard parameters and chip design parameters imported by the data import module 305.

[0073] In conjunction with the embodiments shown above, the BMC module 103 includes:

[0074] The data reading unit is used to read the chip temperature data of each chip module 101 from the FPGA processing module 301, read the working status data of each chip module 101 from the operation log storage module 303, and read the motherboard parameters and chip design parameters from the data parsing module 304.

[0075] The data processing unit is used to obtain the PCB temperature point map based on the motherboard parameters and to determine the operating temperature threshold of each chip module 101 based on the chip design parameters.

[0076] The status judgment unit is used to determine whether the status of each chip module 101 is abnormal based on the working status data.

[0077] The chip positioning unit is used to locate the abnormal chip module 101 in the PCB board temperature point map when there is an abnormal chip module 101, and to identify it as an abnormal chip module.

[0078] The adjustment instruction generation unit is used to generate adjustment instructions for the abnormal chip module based on the chip temperature data and operating temperature threshold of the abnormal chip module.

[0079] The instruction transmission unit is used to send adjustment instructions to the PCB pad temperature adjustment module 102.

[0080] When generating adjustment commands, the adjustment command generation unit primarily considers temperature conditions, and specifically includes the following steps:

[0081] (1) Obtain the current chip temperature value T at the current time point t based on the chip temperature data corresponding to the abnormal chip module. t ;

[0082] (2) Obtain the highest temperature threshold T based on the operating temperature threshold corresponding to the abnormal chip module. max and minimum temperature threshold Tmin The operating temperature threshold is set during chip design; both high and low temperatures can affect the chip's lifespan and performance.

[0083] (3) When the current chip temperature value T St Greater than the highest temperature threshold T max At that time, a first heat dissipation adjustment instruction is generated; the first heat dissipation adjustment instruction contains the identifier of the specified abnormal chip module, such as the unique ID of the abnormal chip module, which is used to instruct the heat dissipation channel selector to conduct the heat conduction channel corresponding to the abnormal chip module, and also contains a control instruction to control the power of the heat dissipation equalization regulator.

[0084] (4) When the current chip temperature value T St Less than the minimum temperature threshold T min At that time, a first heating adjustment command is generated; the first heating adjustment command includes not only the identifier of the specified abnormal chip module, but also the command to control the heating power of the heating element by the heating parameter regulator.

[0085] (5) When T min ≤T t ≤T max At that time, based on the chip temperature data, the historical chip temperature sequence [T] up to the current time point t is obtained. t-Y T t-Y-1 , ..., T t-1 The value of Y is greater than 1;

[0086] (6) Determine the temperature change trend of the abnormal chip module based on the historical chip temperature sequence. Assume that the historical chip temperature sequence is [20℃, 20.2℃, 20.5℃, 20.9℃, 21.2℃, ..., 25℃]. It can be seen that the temperature is slowly increasing. According to common sense in the field of electronic devices, the chip will generate energy consumption during operation, which will cause the temperature to rise. Another situation is that in high latitude or high altitude areas, due to the influence of low temperature in the external environment, the chip temperature will also decrease with the change of external temperature.

[0087] (7) If the temperature trend is upward, then although T min ≤T t ≤T max However, it may reach the highest temperature threshold T later. max Therefore, in order to ensure the chip's operating environment, heat dissipation can be carried out in advance. Since the temperature change trend has been calculated, the chip temperature T at the first predicted time point t+M1 can be predicted. t+M1 Reaching the highest temperature threshold T maxThe second heat dissipation adjustment command is generated. The second heat dissipation adjustment command also includes a heat dissipation start time stamp t+U, that is, the heat dissipation equalization regulator is controlled to perform heat dissipation at t+U. The value of M1 is greater than 1 and the value of U is less than M1.

[0088] (8) If the temperature trend is decreasing, then the chip temperature T at the second predicted time point t+M2 can be predicted. t+M2 Reaching the minimum temperature threshold T min A second heating adjustment command is generated, which includes a heating start timestamp t+V, where the value of M2 is greater than 1 and the value of V is less than M2.

[0089] It should be noted that, considering that both high and low temperatures can affect the signal quality of chip communication, the signal quality data of abnormal chip modules can be obtained through the FPGA processing module, based on the current chip temperature value T. t Signal quality data and preset temperature-signal quality table are used to optimize the chip operating parameters of abnormal chip modules.

[0090] The beneficial effects achieved by the embodiments of the present invention are as follows:

[0091] The BMC module 103 acquires real-time chip temperature and operating status data for each chip module 101; it determines whether there are any abnormal chip modules based on the operating status data; if an abnormal chip module is found, it generates an adjustment command based on the chip temperature data of the abnormal chip module and sends the adjustment command to the PCB pad temperature adjustment module 102; the PCB pad temperature adjustment module 102 heats or cools the abnormal chip module according to the adjustment command through the heat conduction channel. Due to the existence of the heat conduction channel between the PCB pad temperature adjustment module and the pads of each chip module, heating or cooling of each chip module can be achieved under low or high temperature conditions, improving the reliability of the server motherboard's normal startup in extreme environments.

[0092] Based on the server motherboard operating environment automatic adaptation system described in the above embodiments, the following embodiments illustrate the server motherboard operating environment automatic adaptation method applied to the server motherboard operating environment automatic adaptation system.

[0093] like Figure 4 As shown, this embodiment of the invention provides a method for automatic adaptation of a server motherboard's operating environment, including:

[0094] 401, the BMC module acquires chip temperature data and operating status data of each chip module in real time;

[0095] 402, The BMC module determines whether there are any abnormal chip modules with abnormal status based on the working status data;

[0096] If an abnormal chip module is found, proceed to step 403; if no abnormal chip module is found, return to step 401 to continue real-time monitoring of the chip module.

[0097] 403. Generate adjustment instructions based on the chip temperature data of the abnormal chip module and send the adjustment instructions to the PCB pad temperature adjustment module.

[0098] 404, the PCB pad temperature regulation module heats or dissipates heat from the abnormal chip module through the heat conduction channel according to the regulation command.

[0099] The beneficial effects achieved by the embodiments of the present invention are as follows:

[0100] The BMC module acquires real-time chip temperature and operating status data for each chip module. Based on the operating status data, it determines whether any chip modules are malfunctioning. If a malfunctioning chip module is found, it generates an adjustment command based on its chip temperature data and sends the command to the PCB pad temperature adjustment module. The PCB pad temperature adjustment module then heats or cools the malfunctioning chip module via a heat conduction channel according to the adjustment command. Because of the heat conduction channel between the PCB pad temperature adjustment module and the pads of each chip module, heating or cooling of each chip module can be achieved under low or high temperature conditions, improving the reliability of the server motherboard's normal startup in extreme environments.

[0101] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0102] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0103] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0104] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0105] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of the claims of the present invention pending approval.

Claims

1. A server motherboard operating environment automatic adaptation system, characterized in that, include: Multiple chip modules, PCB pad temperature regulation modules, and BMC modules are installed on the server PCB motherboard; Each of the chip modules has a heat conduction channel between its pads and the PCB pad temperature regulation module; The BMC module is used to acquire chip temperature data and operating status data of each chip module in real time. The BMC module is also used to determine whether there is an abnormal chip module with an abnormal status based on the working status data; if there is an abnormal chip module, an adjustment command is generated based on the chip temperature data of the abnormal chip module, and the adjustment command is sent to the PCB pad temperature adjustment module. The PCB pad temperature adjustment module is used to heat or dissipate heat from the abnormal chip module through the heat conduction channel according to the adjustment command.

2. The server motherboard operating environment automatic adaptation system according to claim 1, characterized in that, A layer of thermally conductive copper foil is embedded in the PCB board of each chip module. The thermally conductive copper foil forms an independent heat conduction channel between the pads of each chip module and the PCB pad temperature regulation module. The number of chip modules and the number of heat conduction channels are both integers N greater than 0.

3. The server motherboard operating environment automatic adaptation system according to claim 2, characterized in that, The PCB pad temperature regulation module includes: The system includes a temperature intelligent control unit, a heating parameter regulator, a heat dissipation equalization regulator, a heating channel selector, a heat dissipation channel selector, and N heating elements. The N heat conduction channels are respectively connected to the heat generation channel selector and the heat dissipation channel selector; The heating element is provided on each of the N heat conduction channels corresponding to the heating channel selector; The temperature intelligent adjustment unit is connected to the heating parameter regulator, the heat dissipation equalization regulator, the heating channel selector, and the heat dissipation channel selector; The heating parameter regulator is connected to the heating channel selector, and the heat dissipation equalization regulator is connected to the heat dissipation channel selector.

4. The server motherboard operating environment automatic adaptation system according to claim 3, characterized in that, The server motherboard operating environment automatic adaptation system also includes: FPGA processing module, temperature detection module, operation log storage module, data parsing module, and data import module; The temperature detection module is used to detect the chip temperature data of each chip module in real time. The operation log storage module is used to store the working status data of each chip module; The FPGA processing module is used to obtain chip temperature data for each chip module through the temperature detection module; The data import module is used to obtain the motherboard parameters of the server PCB motherboard and the chip design parameters of each chip module. The data parsing module is used to store the motherboard parameters and chip design parameters imported by the data import module.

5. The server motherboard operating environment automatic adaptation system according to claim 4, characterized in that, The BMC module includes: The data reading unit is used to read the chip temperature data of each chip module from the FPGA processing module, read the working status data of each chip module from the operation log storage module, and read the motherboard parameters and the chip design parameters from the data parsing module. The data processing unit is used to obtain a PCB temperature point map based on the motherboard parameters and to determine the operating temperature threshold of each chip module based on the chip design parameters. A status determination unit is used to determine whether the status of each chip module is abnormal based on the working status data. A chip positioning unit is used to locate the chip module with an abnormal state in the PCB board temperature point map when there is an abnormal chip module, and designate it as an abnormal chip module. An adjustment instruction generation unit is used to generate an adjustment instruction corresponding to the abnormal chip module based on the chip temperature data corresponding to the abnormal chip module and the operating temperature threshold. The instruction transmission unit is used to send the adjustment instruction to the PCB pad temperature adjustment module.

6. The server motherboard operating environment automatic adaptation system according to claim 5, characterized in that, The adjustment instruction generation unit is specifically used to obtain the current chip temperature value T at the current time point t based on the chip temperature data corresponding to the abnormal chip module. t ; The adjustment instruction generation unit is further configured to obtain the maximum temperature threshold T based on the operating temperature threshold corresponding to the abnormal chip module. max and minimum temperature threshold T min When the current chip temperature value T St Greater than the highest temperature threshold T max When the current chip temperature value T is reached, a first heat dissipation adjustment command is generated; when the current chip temperature value T is reached... St Less than the minimum temperature threshold T min At that time, the first heating adjustment command is generated.

7. The server motherboard operating environment automatic adaptation system according to claim 6, characterized in that, The adjustment command generation unit is also used when T min ≤T t ≤T max At that time, based on the chip temperature data, the historical chip temperature sequence [T] prior to the current time point t is obtained. t-Y T t-Y-1 , ..., T t-1 The value of Y is greater than 1; The adjustment instruction generation unit is further configured to determine the temperature change trend of the abnormal chip module based on the historical chip temperature sequence. If the temperature change trend is an increase in temperature, the chip temperature value T at the first prediction time point t+M1 is then predicted. t+M1 Reaching the highest temperature threshold T max A second heat dissipation adjustment command is generated, which includes a heat dissipation start timestamp t+U, wherein the value of M1 is greater than 1 and the value of U is less than M1. The adjustment instruction generation unit is further configured to, if the temperature change trend is a decrease in temperature, predict the chip temperature value T at the second prediction time point t+M2. t+M2 Reaching the minimum temperature threshold T min A second heating adjustment command is generated, which includes a heating start timestamp t+V, wherein the value of M2 is greater than 1 and the value of V is less than M2.

8. The server motherboard operating environment automatic adaptation system according to claim 7, characterized in that, The adjustment command generation unit is also used to obtain the signal quality data of the abnormal chip module through the FPGA processing module, and to determine the current chip temperature value T. t The signal quality data and the preset temperature-signal quality table are used to optimize the chip operating parameters of the abnormal chip module.

9. A method for automatic adaptation to the operating environment of a server motherboard, characterized in that, An automatic adaptation system for server motherboard operating environment is provided. The system includes multiple chip modules, a PCB pad temperature regulation module, and a BMC module mounted on a server PCB motherboard. Each chip module's pad has a heat conduction channel with the PCB pad temperature regulation module. The automatic adaptation method for the server motherboard operating environment includes: The BMC module acquires the chip temperature data and operating status data of each chip module in real time. The BMC module determines whether there is an abnormal chip module with an abnormal status based on the working status data. If the abnormal chip module exists, an adjustment command is generated based on the chip temperature data of the abnormal chip module, and the adjustment command is sent to the PCB pad temperature adjustment module. The PCB pad temperature adjustment module heats or dissipates heat from the malfunctioning chip module through the heat conduction channel according to the adjustment command.

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