Perovskite photovoltaic module packaging method

Abstract

The invention discloses a method for packaging a perovskite photovoltaic module. The method comprises the following steps: firstly, leading out positive and negative electrodes of the perovskite photovoltaic module; then coating a low-temperature packaging agent on the perovskite photovoltaic module and carrying out curing treatment; hot melt adhesive is laid on the periphery of the perovskite photovoltaic module; placing a packaging cover plate at the upper end of the perovskite photovoltaic module; and finally, arranging a thermal insulation material and a rectangular-ambulatory-plane heat conduction frame on the lower surface of a hot pressing plate, pressurizing the rectangular-ambulatory-plane heat conduction frame by the hot pressing plate under the condition that a nitrogen source blows nitrogen, melting and curing the hot melt adhesive for edge sealing, and forming a sealing structure by the perovskite photovoltaic module. According to the invention, the heat conduction frame and the heat insulation material are used for realizing hot melting sealing and heat insulation protection of the assembly, and low-temperature packaging is carried out, so that high-temperature damage to the perovskite photovoltaic assembly caused by a conventional lamination packaging process is avoided, the packaging structure is prepared by a low-temperature process, the assembly is stable in performance before and after packaging, and the packaging efficiency is improved. And the long-term stability is good.

Description

Technical Field

[0001] This invention belongs to the field of solar cell technology, and in particular relates to a perovskite photovoltaic module encapsulation method. Background Technology

[0002] Perovskite materials possess characteristics such as tunable bandgap, high absorption coefficient, long carrier lifetime, and high mobility, enabling perovskite photovoltaic devices to exhibit excellent photoelectric conversion efficiency. However, the long-term stability of perovskite photovoltaics remains a major challenge to their commercial viability. The stability of perovskite photovoltaics is influenced by external environmental factors such as water, oxygen, light, and heat, as well as internal material composition and lattice defects. These factors lead to cell performance degradation and device decomposition through different mechanisms (DOI: 10.1002 / eem2.127396). Therefore, improving the long-term stability of perovskite photovoltaics is crucial before large-scale commercialization. Encapsulation technology is essential for blocking the impact of external factors on the stability of perovskite photovoltaics.

[0003] Currently, perovskite photovoltaic module encapsulation technology mainly originates from crystalline silicon photovoltaic encapsulation technology. The typical encapsulation process involves hot-pressing a polyolefin (POE) film with butyl rubber edge seals using a laminator to isolate water and oxygen (e.g., patent CN119486276A). However, during lamination, the POE film and butyl rubber generally require temperatures of 100–180°C, with encapsulation times typically ranging from 10 to 30 minutes. Unlike crystalline silicon, which can withstand this high temperature process, excessively high encapsulation temperatures significantly impact the device structure of perovskite photovoltaics, leading to a series of adverse consequences such as accelerated ion migration, decomposition of the perovskite and transport layer materials, and accelerated electrode aging. This results in a substantial decrease in the efficiency and a severe weakening of the stability of the encapsulated perovskite photovoltaic module (DOI: 10.1002 / eem2.12739). Therefore, there is an urgent need for a low-temperature encapsulation structure and its fabrication method suitable for perovskite photovoltaic modules, achieving excellent water and oxygen barrier properties and long-term stability without compromising the performance of the perovskite photovoltaic module. Summary of the Invention

[0004] To address the above technical problems, the present invention aims to provide a perovskite photovoltaic module encapsulation method that enables the preparation of the encapsulation structure using a low-temperature process, avoiding the damage to the perovskite photovoltaic module caused by high temperatures during traditional encapsulation processes, thereby ensuring stable performance of the module before and after encapsulation and exhibiting good long-term stability.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A perovskite photovoltaic module encapsulation structure includes a heating module, a perovskite photovoltaic module module, and a support module; the heating module, the perovskite photovoltaic module module, and the support module are arranged sequentially from top to bottom; the support module includes a glass substrate and a support platform, with the glass substrate disposed on the upper surface of the support platform; the perovskite photovoltaic module includes an encapsulation cover plate, a low-temperature encapsulation hot melt adhesive, and a perovskite photovoltaic module; the perovskite photovoltaic module is placed on the upper surface of the glass substrate; the low-temperature encapsulation hot melt adhesive is disposed on or around the perovskite photovoltaic module; and the encapsulation cover plate is disposed at the top of the perovskite photovoltaic module.

[0006] The heating module includes a hot press plate, a heat insulation material, and a U-shaped heat-conducting frame; the heat insulation material and the U-shaped heat-conducting frame are disposed on the lower surface of the hot press plate. The U-shaped heat-conducting frame is an annular frame structure. The heat insulation material is arranged inside the U-shaped heat-conducting frame. The U-shaped heat-conducting frame is used to surround the perovskite photovoltaic module. The heat insulation material is used to isolate the hot press plate and the encapsulation cover plate.

[0007] The hot press plate has a through hole running vertically through it, and a nitrogen gas source is connected to the upper end of the through hole. The low-temperature encapsulation hot melt adhesive includes a low-temperature encapsulant and a hot melt adhesive.

[0008] A packaging method using the aforementioned perovskite photovoltaic module encapsulation structure includes the following steps: Step 1): Lead out the positive and negative electrodes of the perovskite photovoltaic module. Specifically, attach the busbar to the positive and negative electrodes of the perovskite photovoltaic module to lead out the positive and negative electrodes of the perovskite photovoltaic module; the busbar is one of copper, aluminum, gold and silver metals and their alloys. Step 2): Coating the perovskite photovoltaic module with the low-temperature encapsulant and curing it, wherein the low-temperature encapsulant is one of epoxy resin, silicone rubber, solid paraffin, polyurethane, polyacrylate, epoxy acrylate, and polyurethane acrylate; the coating method is one of spin coating, blade coating, drop coating, and slot coating; the curing method is one of room temperature curing and ultraviolet crosslinking; and the temperature range of the low-temperature encapsulant is room temperature to 100 °C. Step 3): Lay the hot melt adhesive around the perovskite photovoltaic module. The hot melt adhesive is one of butyl rubber, polyolefin and its compound. Step 4): Place an encapsulation cover plate on the upper end of the perovskite photovoltaic module. The encapsulation cover plate is one of glass, polyethylene terephthalate, and polyimide. The material of the U-shaped heat-conducting frame is one of copper, aluminum, and iron metals and their alloys. The heat insulation material is one of rock wool, glass fiber, asbestos, silicate, aerogel, and vacuum plate. Step 5): Place the heat insulation material and the U-shaped heat-conducting frame on the lower surface of the hot press plate. Then, under the condition of nitrogen blowing from the nitrogen source, press the U-shaped heat-conducting frame with the hot press plate at the preset temperature. After a preset time, the hot melt adhesive melts and solidifies to seal the edge, and the perovskite photovoltaic module forms a sealed structure. The preset temperature is 100-150℃ and the preset time is 1-10min.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention uses a U-shaped heat-conducting frame and heat-insulating material to simultaneously achieve hot melt sealing of the hot melt adhesive around the edge of the module and heat insulation protection of the working area of ​​the module. At the same time, the working area is encapsulated at a low temperature, thereby avoiding the high-temperature damage to the perovskite photovoltaic module caused by the conventional lamination encapsulation process. It achieves the preparation of the encapsulation structure with a low-temperature process, so that the module has stable performance before and after encapsulation and good long-term stability. Attached Figure Description

[0010] Figure 1 The diagram shows the encapsulation structure of the perovskite photovoltaic module prepared according to this invention. Figure 2 Temperature charts for the packaging process are provided for testing with temperature test strips. In the chart, a is the temperature chart for the packaging process of Comparative Example 1, and b is the temperature chart for the packaging process of Example 1. Figure 3 The images shown are from a water immersion experiment of a 5*5 cm perovskite photovoltaic module in Example 3, where a is the back electrode surface and b is the light-receiving surface. Figure 4 This is a current-voltage curve of the perovskite photovoltaic module before and after encapsulation in Comparative Example 1 of the present invention. Figure 5 This is a current-voltage curve of the perovskite photovoltaic module before and after encapsulation in Embodiment 1 of the present invention; Figure 6 This is a current-voltage curve of the perovskite photovoltaic module before and after encapsulation in Comparative Example 2 of the present invention. Figure 7 This is a current-voltage curve of the perovskite photovoltaic module before and after encapsulation in Embodiment 2 of the present invention; Figure 8 This is a current-voltage curve of the perovskite photovoltaic module before and after packaging, as shown in Comparative Example 3 of the present invention. Figure 9 This is a current-voltage curve of the perovskite photovoltaic module before and after encapsulation in Embodiment 3 of the present invention; Figure 10 This is a test diagram of the long-term working stability of the encapsulated perovskite components in Embodiment 1 and Comparative Example 1 of the present invention.

[0011] In the diagram, 1-hot press plate, 2-thermal insulation material, 3-U-shaped heat conduction frame, 4-encapsulation cover plate, 5-low temperature encapsulation hot melt adhesive, 6-perovskite photovoltaic module, 7-glass substrate, 8-busbar, 9-support platform. Detailed Implementation

[0012] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0013] It should be noted that, unless otherwise specified, the features in the following embodiments and implementation methods can be combined with each other.

[0014] Unless otherwise specified in the embodiments of this invention, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be obtained through conventional technical means or commercially available.

[0015] like Figure 1 As shown, the encapsulation structure includes a heating module, a perovskite photovoltaic module, and a support module; the heating module, the perovskite photovoltaic module, and the support module are arranged sequentially from top to bottom; the support module includes a glass substrate 7 and a support platform 9, with the glass substrate 7 arranged on the upper surface of the support platform 9; the perovskite photovoltaic module includes an encapsulation cover plate 4, a low-temperature encapsulation hot melt adhesive 5, and a perovskite photovoltaic module 6, with the perovskite photovoltaic module 6 placed on the upper surface of the glass substrate 7, the low-temperature encapsulation hot melt adhesive 5 arranged on or around the perovskite photovoltaic module 6, and the encapsulation cover plate 4 arranged at the upper end of the perovskite photovoltaic module 6.

[0016] The heating module includes a hot press plate 1, a heat insulation material 2, and a U-shaped heat-conducting frame 3. The heat insulation material 2 and the U-shaped heat-conducting frame 3 are fixedly installed on the lower surface of the hot press plate 1. The U-shaped heat-conducting frame 3 is a quadrilateral annular frame structure. The heat insulation material 2 is arranged inside the U-shaped heat-conducting frame 3, which surrounds the perovskite photovoltaic module 6. The heat insulation material 2 serves to isolate the hot press plate 1 from the encapsulation cover plate 4. The U-shaped heat-conducting frame 3 and the heat insulation material 2 are arranged between the hot press plate 1 and the encapsulation cover plate 4. A through-hole is formed inside the hot press plate 1, with a nitrogen source connected to the upper end of the through-hole. The low-temperature encapsulation hot melt adhesive 5 includes a low-temperature encapsulant and a hot melt adhesive.

[0017] The encapsulation method includes the following steps: Step 1): Lead out the positive and negative electrodes of the perovskite photovoltaic module 6. Specifically, attach the busbar 8 to the positive and negative electrodes of the perovskite photovoltaic module 6 to lead out the positive and negative electrodes of the perovskite photovoltaic module 6. The busbar 8 is one of copper, aluminum, gold and silver conductive metals and their alloys. Preferably, the busbar 8 is copper, aluminum, silver and other conductive metals. The perovskite photovoltaic module 6 is a normal / reverse single-junction perovskite solar cell or a tandem perovskite solar cell. Step 2): Apply a low-temperature encapsulant to the working area of ​​the perovskite photovoltaic module 6 and cure it under an ultraviolet curing light source. The low-temperature encapsulant is one of epoxy resin, silicone rubber, solid paraffin, polyurethane, polyacrylate, epoxy acrylate, and polyurethane acrylate. The coating method is one of spin coating, blade coating, drop coating, and slot coating. The curing method is one of room temperature curing and ultraviolet crosslinking. Preferably, the low-temperature encapsulant is epoxy resin, silicone rubber, solid paraffin, polyurethane, polyacrylate, etc. Preferably, the curing conditions are room temperature curing or ultraviolet irradiation. The temperature range of the low-temperature encapsulant is room temperature to 100 ℃. Step 3): Lay hot melt adhesive around the working area of ​​the perovskite photovoltaic module 6. The hot melt adhesive is one of butyl rubber, polyolefin and its compound. Step 4): Place an encapsulation cover plate 4 on the upper end of the perovskite photovoltaic module 6. The encapsulation cover plate 4 is one of glass, polyethylene terephthalate (PET), and polyimide (PI). The material of the U-shaped heat-conducting frame 3 is one of copper, aluminum, and iron metals and their alloys. The heat insulation material 2 is one of rock wool, glass fiber, asbestos, silicate, aerogel, and vacuum plate. Preferably, the heat insulation material 2 includes rock wool, glass fiber, asbestos, aerogel, vacuum plate, etc. Step 5): Fix the heat insulation material 2 and the U-shaped heat-conducting frame 3 on the lower surface of the hot press plate 1. Then, under the condition of blowing nitrogen gas from the nitrogen source to protect the middle working area from damage, press the hot press plate 1 at the preset temperature onto the U-shaped heat-conducting frame 3. After a preset time, the hot melt adhesive melts and solidifies to seal the edges, and the perovskite photovoltaic module 6 forms a sealed structure. The preset temperature is 100-150℃ and the preset time is 1-10min. Preferably, the preset temperature is 110-135℃ and the preset hot pressing time is 5-8min.

[0018] The perovskite photovoltaic module 6 was encapsulated using the above encapsulation method, and its performance was tested and compared with that of the laminated perovskite photovoltaic module 6.

[0019] Example 1: The positive and negative electrodes of the prepared 5*5 cm inverted perovskite photovoltaic module were led out using copper busbars. Silicone rubber was spin-coated onto the perovskite working area and cured at room temperature for 4 hours. Butyl tape was applied around the working area, followed by a glass encapsulation cover, a brass U-shaped heat-conducting frame, and a rock wool insulation layer placed in the center of the brass U-shaped heat-conducting frame. The entire encapsulation structure was placed under a hot press plate 1 at a temperature of 100℃ for 8 minutes. After the butyl rubber melted and cured, a sealed encapsulation structure was formed. The encapsulation process temperature is detailed below. Figure 2 As shown in b, the encapsulated component will undergo JV testing, such as... Figure 10 As shown, the obtained data is compared with the data before packaging to verify performance stability.

[0020] Comparative Example 1: The positive and negative electrodes of the prepared 5*5 cm inverted perovskite photovoltaic module were led out using copper busbars. A POE film was laid over the perovskite working area, and butyl tape was applied around the perimeter. A glass encapsulation cover was then placed on top. The entire encapsulation structure was placed under a hot press plate (1) at 100℃ for 8 minutes. After the butyl tape and POE film melted and solidified, a sealed encapsulation structure was formed. The encapsulation process temperature is detailed in [reference needed]. Figure 2 As shown in diagram a, the encapsulated component will undergo JV testing, as follows: Figure 10 As shown, the obtained data is compared with the data before packaging to verify performance stability.

[0021] Example 2: The positive and negative electrodes of the prepared 5*5 cm inverted perovskite photovoltaic module were led out using aluminum busbars. Epoxy acrylate was drop-coated onto the perovskite working area and cured with 365 nm ultraviolet light for 30 s. Butyl adhesive tape was applied around the working area, followed by a PET encapsulation cover, an aluminum alloy U-shaped heat-conducting frame, and a fiberglass insulation layer placed in the center of the frame. The entire encapsulation structure was placed under a hot press plate 1 at 120℃ for 3 minutes. After the butyl adhesive melted and cured, a sealed encapsulation structure was formed.

[0022] Comparative Example 2: The positive and negative electrodes of the prepared 5*5 cm inverted perovskite photovoltaic module were led out using aluminum busbars. A POE film was laid over the perovskite working area, and butyl tape was applied around the perimeter. A glass encapsulation cover was then placed on top. The entire encapsulation structure was placed under a hot press plate 1 at 120℃ for 6 minutes. After the butyl tape and POE film melted and solidified, a sealed encapsulation structure was formed.

[0023] Example 3: The positive and negative electrodes of the prepared 5*5 cm perovskite photovoltaic module were led out using copper busbars. Molten paraffin wax at 50°C was applied to the perovskite working area and allowed to cool and solidify at room temperature. Butyl tape was applied around the working area, followed by a PI encapsulation cover plate, a stainless steel U-shaped heat-conducting frame, and an asbestos insulation layer placed in the center of the heat-conducting frame. The entire encapsulation structure was placed under a hot press plate 1 at a temperature of 135°C for 3 minutes. After the butyl adhesive melted and solidified, a sealed encapsulation structure was formed. Figure 3 Images of perovskite photovoltaic devices immersed in water, including Figure 3 a is a diagram of the back electrode surface. Figure 3 b is a diagram of the illuminated surface.

[0024] Comparative Example 3: The positive and negative electrodes of the prepared 5*5 cm perovskite photovoltaic module were led out using copper busbars. A POE film was laid over the perovskite working area, and butyl tape was applied around the perimeter. A glass encapsulation cover was then placed on top. The entire encapsulation structure was placed under a hot press plate at 135℃ for 3 minutes. After the butyl tape and POE film melted and solidified, a sealed encapsulation structure was formed.

[0025] The perovskite photovoltaic modules packaged in Examples 1-3 and Comparative Examples 1-3 were subjected to JV curve testing using a solar simulator, and the photoelectric conversion efficiency was calculated. Figures 4-9 As can be seen, the performance parameters such as current density, voltage, and fill factor of the devices in Examples 1-3 are significantly more stable than those in Comparative Examples 1-3 before and after packaging. For example, the reverse scanning efficiency of Example 1 decreased by only 0.05% after packaging, with a decrease of only 0.26%, while the reverse scanning efficiency of Comparative Example 1 decreased by 6.45%, with a decrease of 34.49%. The reverse scanning efficiency of Example 2 decreased by only 0.09% after packaging, with a decrease of only 0.47%, while the reverse scanning efficiency of Comparative Example 2 decreased by 8.99%, with a decrease of 46.17%. The reverse scanning efficiency of Example 3 decreased by only 0.02% after packaging, with a decrease of only 0.09%, while the reverse scanning efficiency of Comparative Example 3 decreased by 11.26%, with a decrease of 57.56%. Therefore, the packaging method described in this invention can significantly reduce damage to battery performance and improve battery stability.

[0026] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0027] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A perovskite photovoltaic module encapsulation structure, characterized in that: The system includes a heating module, a perovskite photovoltaic module, and a support module; the heating module, the perovskite photovoltaic module, and the support module are arranged sequentially from top to bottom; the support module includes a glass substrate (7) and a support platform (9), with the glass substrate (7) arranged on the upper surface of the support platform (9); the perovskite photovoltaic module includes an encapsulation cover plate (4), a low-temperature encapsulation hot melt adhesive (5), and a perovskite photovoltaic module (6), with the perovskite photovoltaic module (6) placed on the upper surface of the glass substrate (7), the low-temperature encapsulation hot melt adhesive (5) arranged on or around the perovskite photovoltaic module (6), and the encapsulation cover plate (4) arranged at the upper end of the perovskite photovoltaic module (6).

2. A perovskite photovoltaic module encapsulation structure according to claim 1, characterized in that: The heating module includes a hot press plate (1), a heat insulation material (2), and a U-shaped heat conduction frame (3); the heat insulation material (2) and the U-shaped heat conduction frame (3) are provided on the lower surface of the hot press plate (1). The U-shaped heat conduction frame (3) is an annular frame structure. The heat insulation material (2) is arranged inside the U-shaped heat conduction frame (3). The U-shaped heat conduction frame (3) is used to surround the perovskite photovoltaic module (6). The heat insulation material (2) is used to isolate the hot press plate (1) and the encapsulation cover plate (4).

3. A perovskite photovoltaic module encapsulation structure according to claim 2, characterized in that: The hot press plate (1) has a through hole running vertically through it, and a nitrogen source is connected to the upper end of the through hole.

4. A perovskite photovoltaic module encapsulation structure according to claim 2, characterized in that: The low-temperature encapsulation hot melt adhesive (5) includes a low-temperature encapsulant and a hot melt adhesive.

5. A packaging method employing the perovskite photovoltaic module packaging structure as described in any one of claims 1-4, characterized in that, The method includes the following steps: Step 1): Lead out the positive and negative electrodes of the perovskite photovoltaic module (6); Step 2): Coat the perovskite photovoltaic module (6) with the low-temperature encapsulant and perform a curing process; Step 3): Apply the hot melt adhesive around the perovskite photovoltaic module (6); Step 4): Place the encapsulation cover plate (4) on the upper end of the perovskite photovoltaic module (6); Step 5): The heat insulation material (2) and the U-shaped heat conduction frame (3) are placed on the lower surface of the hot press plate (1). Then, under the condition of nitrogen blowing from the nitrogen source, the hot press plate (1) at the preset temperature is pressed against the U-shaped heat conduction frame (3). After a preset time, the hot melt adhesive melts and solidifies to seal the edge, and the perovskite photovoltaic module (6) forms a sealed structure.

6. The perovskite photovoltaic module encapsulation method according to claim 5, characterized in that: Step 1) specifically refers to: The busbar (8) is attached to the positive and negative electrodes of the perovskite photovoltaic module (6) to bring out the positive and negative electrodes of the perovskite photovoltaic module (6); the busbar (8) is one of copper, aluminum, gold and silver metals and their alloys.

7. The perovskite photovoltaic module encapsulation method according to claim 5, characterized in that: The low-temperature encapsulating agent in step 2) is one of epoxy resin, silicone rubber, solid paraffin, polyurethane, polyacrylate, epoxy acrylate, and polyurethane acrylate; the coating method is one of spin coating, blade coating, drop coating, and slot coating; and the curing method is one of room temperature curing and ultraviolet crosslinking. The temperature range of the low-temperature encapsulant is room temperature to 100°C.

8. The perovskite photovoltaic module encapsulation method according to claim 5, characterized in that: The hot melt adhesive mentioned in step 3) is one of butyl rubber, polyolefin and its compound.

9. A perovskite photovoltaic module encapsulation method according to claim 5, characterized in that: The encapsulation cover (4) in step 4) is one of glass, polyethylene terephthalate and polyimide; the material of the U-shaped heat-conducting frame (3) is one of copper, aluminum and iron metals and their alloys; the heat insulation material (2) is one of rock wool, glass fiber, asbestos, silicate, aerogel and vacuum plate.

10. A perovskite photovoltaic module encapsulation method according to claim 5, characterized in that: The preset temperature in step 5) is 100-150℃, and the preset time is 1-10min.

Images