A method, system, apparatus, and medium for ion source position calibration based on a removal function

Abstract

The application provides an ion source position calibration method based on a removal function, which comprises the following steps: processing a plurality of removal function spots at preset symmetrical positions of a workpiece; obtaining surface data of the workpiece after processing, and subtracting surface data of the workpiece before processing to calculate an interference error surface of the removal function spots; extracting a pixel center position of the removal function and a pixel center position of the workpiece based on the interference error surface; determining an actual deviation of the removal function spots relative to the center position of the workpiece according to the pixel center position of the removal function and the extracted pixel center position of the workpiece; and adjusting the ion source position according to the actual deviation to complete calibration. Compared with the prior art, the ion source position calibration method based on the removal function can calculate the actual deviation through actual processing of the removal function spot positions, and can compensate for the deviation of the ion source position to achieve the effect of improving the ion beam polishing precision. The system has the same beneficial effects.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical processing, and in particular to an ion source position calibration method, system, device and medium based on a removal function in an ion beam polishing process. BACKGROUND

[0002] Ultra-precision optical elements have broad application prospects in deep space exploration, laser systems, advanced instruments and other high-end fields. With the development of these fields, the requirements for the surface shape accuracy of optical elements have reached the nanometer level or even higher. Ion beam polishing (IBF) uses an ion beam to complete the processing of optical elements, avoiding problems such as subsurface damage, polishing tool wear and unstable removal function that are faced by traditional contact polishing methods. At the same time, based on the principle of ion sputtering, ion beam polishing can achieve atomic-level polishing precision, so it is usually used as the last processing step for ultra-precision optical elements.

[0003] The removal function of the ion beam is a rotationally symmetric continuous function, with a single peak at the center of the removal function having the maximum removal amount, and the removal amount decreases to zero as the radius increases, that is, a two-dimensional Gaussian removal function. The actual removal function is obtained through a fixed-point bombardment experiment.

[0004] Accurate calculation of the removal function is a prerequisite for implementing ion beam ultra-precision polishing, and its precision is directly related to the final processing quality of ion beam polishing. Therefore, the removal function needs to be determined before ion beam polishing. At the same time, the position calibration of the ion source and the alignment of the processing error are important factors affecting the polishing precision. When the actual processing position of the ion source does not align with the ideal position, it will directly affect the quality of ion beam polishing shaping, especially after high-precision ion beam polishing shaping, ion source position calibration is particularly important, and is directly related to the final processing precision.

[0005] Currently, the existing technology usually indirectly measures the ion source position through a Faraday cup, mainly by measuring the position of the Faraday cup to indirectly determine the position of the ion source. However, the indirectly determined ion source position will have a position measurement error of the Faraday cup, and it is not possible to achieve very accurate ion source position determination.

[0006] In view of this, it is a technical problem to be solved by those skilled in the art to provide an ion source position calibration method and system based on a removal function that can improve the polishing precision of an ion beam. SUMMARY

[0007] To solve the above technical problems, the present application aims to provide a method, system, device and medium for calibrating ion source position of ion beam polishing machine based on removal function, which calculates actual deviation of removal function spot and workpiece center position, compensates actual deviation of ion source position, and thus realizes accurate calibration of ion source position, and improves ion beam polishing precision.

[0008] The first object of the present application is to provide a method for calibrating ion source position based on removal function.

[0009] The technical solutions provided by the present application are as follows.

[0010] A method for calibrating ion source position based on removal function, comprising the following steps:

[0011] Processing a plurality of removal function spots at preset symmetrical positions of the workpiece;

[0012] Obtaining surface data of the workpiece after processing, and calculating interference error surface of the removal function spot by subtracting surface data of the workpiece before processing;

[0013] Extracting pixel center position information of the removal function based on the interference error surface;

[0014] Extracting pixel center position information of the workpiece based on the interference error surface;

[0015] Determining actual deviation of the removal function spot relative to the center position of the workpiece according to the pixel center position information of the removal function and the pixel center position information of the workpiece;

[0016] Adjusting the ion source position according to the actual deviation to complete calibration.

[0017] Preferably, the preset symmetrical positions are four points distributed symmetrically along the coordinate axis at a symmetrical distance, with the center position of the workpiece as the coordinate axis origin, wherein two points are distributed symmetrically along the x-axis at the symmetrical distance, and the other two points are distributed symmetrically along the y-axis at the symmetrical distance.

[0018] Preferably, when extracting the pixel center position information of the removal function based on the interference error surface, the following steps are included:

[0019] Generating a removal function spot original image based on the interference error surface, and removing edge error and center error of the removal function spot original image to obtain a first image, wherein the first image only contains the removal function spot;

[0020] extracting contour information of the removal function spot and a center coordinate of a minimum circumscribed circle of the removal function spot in the first image to obtain first position information of the removal function spot;

[0021] judging whether there is an axis rotation error according to the first position information and the center coordinate, and performing angle calibration on the first image to obtain standard position information of the removal function spot;

[0022] calculating a pixel distance of the removal function spot based on the standard position information, performing pixel position calibration on the removal function spot according to the pixel distance of the removal function spot and an actual distance of the removal function spot to obtain a pixel size of the removal function, and calculating pixel center position information of the removal function.

[0023] Preferably, the angle calibration comprises:

[0024] calculating a phase angle of the removal function spot based on the first image, determining a rotation angle by an inverse tangent function, and rotating the removal function spot in the first image to obtain a second image;

[0025] performing rotation correction on the second image to align the removal function spot with a standard coordinate axis to obtain a third image and the standard position information of the removal function spot.

[0026] Preferably, in the step of extracting the pixel center position information of the workpiece based on the interference error surface type, the following steps are included:

[0027] generating an interference error measurement data image based on the interference error surface type;

[0028] rotating the interference error measurement data image according to the rotation angle, and extracting contour information of the interference error measurement data image;

[0029] calibrating a pixel radius of the workpiece according to the pixel size of the removal function and an actual size of the workpiece, and calculating the pixel center position information of the workpiece by a least square method according to the pixel radius of the workpiece.

[0030] Preferably, in the step of determining the actual deviation of the removal function spot relative to the center position of the workpiece according to the pixel center position information of the removal function and the pixel center position information of the workpiece, the following steps are included:

[0031] calculating the pixel center position information of the workpiece and the pixel center position information of the removal function to obtain the pixel deviation, wherein the pixel deviation includes a horizontal deviation and a vertical deviation;

[0032] The pixel deviation is converted into an actual physical distance to obtain the actual deviation.

[0033] A second object of the present application is to provide an ion source position calibration system based on a removal function.

[0034] The technical solutions provided by the present application are as follows.

[0035] An ion source position calibration system based on a removal function comprises:

[0036] A processing module is configured to generate a removal function spot at a preset position of a workpiece.

[0037] A measurement module is configured to obtain surface profile data of the workpiece before and after processing and generate an interference error surface profile of the removal function spot.

[0038] A processing module is configured to extract pixel center position information of the removal function spot and pixel center position information of the workpiece according to the interference error surface profile and calculate an actual deviation.

[0039] A calibration module is configured to adjust a processing position of an ion source according to the actual deviation.

[0040] Preferably, the processing module comprises an image processing unit configured to remove edge noise and center noise in an image generated based on the interference error surface profile, extract a contour of the image, and perform angle calibration on the image.

[0041] A third object of the present application is to provide a computer device.

[0042] The technical solutions provided by the present application are as follows.

[0043] A computer device comprises a memory and a processor, the memory stores a computer program, and the processor executes any one of the method steps of the ion source position calibration method based on a removal function.

[0044] A fourth object of the present application is to provide a computer readable storage medium.

[0045] The technical solutions provided by the present application are as follows.

[0046] A computer readable storage medium stores a computer program, and the computer program is executed by a processor to execute any one of the method steps of the ion source position calibration method based on a removal function.

[0047] The application provides an ion source position calibration method based on a removal function, which comprises the following steps: processing a plurality of removal function spots at preset symmetrical positions of a workpiece; obtaining surface data of the workpiece after processing, and subtracting surface data of the workpiece before processing to calculate an interference error surface of the removal function spots; extracting a pixel center position of the removal function and a pixel center position of the workpiece based on the interference error surface; determining an actual deviation of the removal function spots relative to the center position of the workpiece according to the pixel center position of the removal function and the pixel center position of the workpiece; and adjusting the ion source position according to the actual deviation to complete calibration. Compared with the prior art, the ion source position calibration method based on the removal function can calculate the actual deviation through actual processing of the removal function spot positions, and can compensate the ion source position deviation to improve the ion beam polishing precision. The system has the same beneficial effects.

[0048] The application further provides an ion source position calibration system based on a removal function. Since the system and the ion source position calibration method based on the removal function solve the same technical problem and belong to the same technical concept, the system should have the same beneficial effects, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0050] Figure 1 The flow chart of the ion source position calibration method based on the removal function in the embodiment of the present application;

[0051] Figure 2 The removal function spot original image in the embodiment of the present application;

[0052] Figure 3 The image (a) after edge error removal and the image (b) after center error removal based on the removal function spot original image in the embodiment of the present application;

[0053] Figure 4 The second image in the embodiment of the present application;

[0054] Figure 5 The second image needing coordinate axis alignment in the embodiment of the present application;

[0055] Figure 6 The interference error measurement data image in the embodiment of the present application;

[0056] Figure 7 An image obtained by angle rotation based on the interference error measurement data image in the embodiment of the present application;

[0057] Figure 8 An image obtained by profile extraction based on the rotated interference error measurement data image in the embodiment of the present application;

[0058] Figure 9 An image obtained by calibrating the pixel center position information of the workpiece based on the profile-extracted interference error measurement data image in the embodiment of the present application;

[0059] Figure 10 An original interference error surface data image of the workpiece based on the loss function spot processing in the experimental data;

[0060] Figure 11 An interference error surface data image of the workpiece processed after the ion source position correction based on the method of the present application in the experimental data;

[0061] Figure 12 A structural schematic diagram of an ion source position calibration system based on a removal function in the embodiment of the present application;

[0062] Figure 13 An internal structure diagram of a computer device in the embodiment of the present application. DETAILED DESCRIPTION

[0063] In order for those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0064] As shown in Figure 1 The present application provides a removal function-based ion source position calibration method, which comprises the following steps:

[0065] S1, processing a plurality of removal function spots at preset symmetric positions of the workpiece;

[0066] Before step S1, it further comprises measuring the surface data before processing by an interferometer; in step S1, a plurality of removal function spots are processed at symmetric positions with the workpiece center as the coordinate axis origin by using an ion beam machine tool.

[0067] Preferably, the preset symmetrical positions in step S1 are specifically four points distributed symmetrically along the coordinate axes with the center position of the workpiece as the coordinate axis origin, wherein two points are distributed symmetrically along the x-axis and two points are distributed symmetrically along the y-axis.

[0068] As an embodiment, four removal function spots are machined at the four symmetrical distances from the center of the workpiece using an ion beam machine, i.e., four spots are machined at the same distance from the center of the workpiece in the up, down, left and right directions. The distance is generally determined according to the actual size of the workpiece, and is generally 30-50 mm. For example, the four-point coordinates can be (0, 50), (0, -50), (50, 0) and (-50, 0). The spot machining time is determined according to the actual working condition. For example, the spot machining time can be 120 s.

[0069] S2, obtaining the surface data of the workpiece after machining, and subtracting the surface data of the workpiece before machining to obtain the interference error surface of the removal function spot;

[0070] In step S2, the surface data after machining is measured by an interferometer, and the surface data after machining of the workpiece is subtracted from the surface data before machining of the workpiece to obtain the interference error surface of the removal function spot.

[0071] S3, extracting the pixel center position information of the removal function based on the interference error surface;

[0072] Preferably, when step S3 is performed, the following steps are included:

[0073] S3.1, generating a removal function spot original image based on the interference error surface, and removing the edge error and center error of the removal function spot original image to obtain a first image, wherein the first image only contains the removal function spot;

[0074] In actual application, the interference error surface data of the removal function is read by matlab, the origin coordinates of the removal function spot original image are set according to the depth information of the interference error surface, and the depth information of the interference error surface is read based on the origin coordinates to generate the removal function spot original image, as shown in Figure 2 P1, P2, P3 and P4 are four removal function spots; the generated removal function spot original image is removed according to the specific circumstances, as shown in Figure 3 (a); and then the center error is removed to obtain the first image containing only the four removal function spots, as shown in Figure 3(b) as shown. Edge error removal: first read the matrix size of the original image of the removal function spot, then set the size of the edge to zero the matrix outside the edge, which will present black on the image, to achieve the removal of edge error; similarly, the removal of the center error is also this method, set the size of the center area.

[0075] S3.2, extract the contour information of the removal function spot in the first image and the center coordinates of the minimum circumscribed circle of the removal function spot, to obtain the first position information of the removal function spot;

[0076] As an embodiment, the center coordinates of the minimum circumscribed circle of the removal function spot are the center coordinates of the minimum circumscribed circles of the four removal function spots.

[0077] S3.3, judging whether there is a coordinate axis rotation error according to the first position information and the center coordinates, and performing angle calibration on the first image to obtain standard position information of the removal function spot;

[0078] Preferably, the angle calibration in step S3.3 includes:

[0079] S3.3.1, calculating the phase angle of the removal function spot based on the first image, determining the rotation angle by the inverse tangent function and rotating the removal function spot in the first image to obtain a second image;

[0080] In actual application, whether there is rotation during image measurement is determined according to the four-point coordinates of the first position information of the removal function spot, including: calculating the phase angle between the removal function spots, judging whether P1 and P2 are on a straight line and whether P1 and P2 are on the x-axis or y-axis of the coordinate axis of the first image through the phase angle; when it is judged that there is rotation, the inverse tangent angle is calculated as the rotation angle according to the center coordinates of P1 and P2 two points, and the removal function spot in the first image is rotated to obtain a second image as shown in Figure 4 , wherein the rotation angle is generally a smaller rotation angle, and the rotation angle includes the rotation angle with the x-axis of the first image coordinate system and the rotation angle with the y-axis. The calculation method of the phase angle: the positions of the four removal function spots are extracted, then the positions of the upper and lower spots are determined through coordinates, and the included angle with the standard y-coordinate vertical line is calculated according to the coordinates of the upper and lower spots, that is, the rotation angle, and then the rotation transformation is performed.

[0081] S3.3.2, rotating the second image to align the removal function spot with the standard coordinate axis to obtain a third image and the standard position information of the removal function spot.

[0082] In actual application process, the first position information of the function spot is removed, and the four-point coordinates are determined to determine whether there is rotation in image measurement, and the function spot is removed. Whether there is an angle with the standard coordinate axis of the second image, wherein the standard coordinate axis generally takes the positive direction of x axis to the right, and the positive direction of y axis is upward. If the second image is as shown in Figure 5 , the image needs to be rotated again to align the function spot with the standard coordinate axis to obtain the standard position information of the function spot.

[0083] S3.4, the pixel distance of the function spot is calculated based on the standard position information, the pixel position of the function spot is calibrated according to the pixel distance of the function spot and the actual distance of the function spot, the pixel size of the function is obtained, and the pixel center position information of the function is calculated.

[0084] In actual application process, the pixel distance of P1 and P2 is calculated according to the position coordinates of the standard position information of P1~P4, then the pixel distance of each function spot single point is calculated according to the actual distance of the function spot, pixel calibration is performed, and the pixel size of the function is obtained; then, the pixel center position of the function spot is calculated, and the calculation method is that the center of P1 and P2 is the y axis center; the center of P3 and P4 is the x axis center. Pixel calibration is specific: for example, the pixel distance between two function spots can be calculated based on two upper and lower positions, and then the actual distance between the two spots on the machine tool is known, so that the proportion between the pixel distance and the actual distance can be obtained.

[0085] S4, the pixel center position information of the workpiece is extracted based on the interference error surface type;

[0086] Preferably, when step S4 is performed, the following steps are included:

[0087] S4.1, the interference error measurement data image is generated based on the interference error surface type;

[0088] In actual application process, the interference error surface type data of the function is read by matlab, and the entire surface type data region is extracted according to the depth information of the interference error surface type to generate the interference error measurement data image, as shown in Figure 6 .

[0089] S4.2, the interference error measurement data image is rotated according to the rotation angle, and the contour information of the interference error measurement data image is extracted;

[0090] In actual application process, the interference error measurement data image is rotated according to the rotation angle of step S3.3.1 to obtain the rotated interference error measurement data image as shown in Figure 7As shown; the contour information of the interferometric error measurement data image is extracted from the rotated interferometric error measurement data image, such as... Figure 8 As shown.

[0091] S4.3. Based on the pixel size of the removal function and the actual size of the workpiece, the pixel radius of the workpiece is calibrated, and the pixel center position information of the workpiece is calculated by least squares method based on the pixel radius of the workpiece.

[0092] In practical applications, the pixel radius of the workpiece is determined based on the pixel size of the removal function in step S3.4 and the actual size of the workpiece. The pixel center position information of the workpiece is then calculated using the least squares method based on the pixel radius. Figure 9 As shown.

[0093] S5. Determine the actual deviation of the spot in the removal function relative to the center position of the workpiece based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece.

[0094] Preferably, step S5 specifically includes:

[0095] S5.1 Calculate the pixel center position information of the workpiece and the pixel center position information of the removal function to obtain the pixel deviation, wherein the pixel deviation includes the horizontal deviation and the vertical deviation;

[0096] S5.2 Convert the pixel deviation into the actual physical distance to obtain the actual deviation.

[0097] S6. Adjust the ion source position according to the actual deviation to complete the calibration.

[0098] This paper also demonstrates the effectiveness of the proposed method through experimental data. The specific workpiece type processed was a 100mm diameter fused silica workpiece. The experimental parameters were set as follows: power 100W, grid voltage 800V, accelerating grid voltage 123V, gas flow rate 11sccm, vacuum degree 5×10⁻²Pa, RF power 130W, and argon flow rate 5sccm. Figure 10 It is known that a groove exists in the original interference error surface data of the workpiece processed based on the loss function speckle pattern, which is difficult to handle in ion source processing. However, after using the ion source calibration method of this application, the processed image is as follows: Figure 11 As shown, Figure 10 The original grooves in the ion source have completely disappeared, which indicates that the alignment error of the ion source in the method of this application is very small, thus proving the effectiveness of the method of this application.

[0099] This invention provides an ion source position calibration method based on a removal function, comprising the following steps: processing multiple removal function spots at a preset symmetrical position on the workpiece; acquiring the surface profile data of the workpiece after processing, and calculating the interference error surface profile of the removal function spots by subtracting it from the surface profile data of the workpiece before processing; extracting the pixel center position of the removal function and the pixel center position of the workpiece based on the interference error surface profile; determining the actual deviation of the removal function spots relative to the center position of the workpiece based on the pixel center position of the removal function and the extracted pixel center position of the workpiece; and adjusting the ion source position according to the actual deviation to complete the calibration. Compared with the prior art, the ion source position calibration method based on a removal function of this invention calculates the actual deviation between the removal function spots actually processed by the ion beam machine tool and the center position of the workpiece, and compensates for the actual deviation of the ion source position, thereby achieving accurate calibration of the ion source position and improving the accuracy of ion beam polishing.

[0100] In one embodiment, such as Figure 12 As shown, an ion source position calibration system based on a removal function is provided, comprising:

[0101] The processing module is used to generate removal function spots at preset positions on the workpiece;

[0102] The measurement module is used to acquire surface profile data of the workpiece before and after processing and generate an interference error surface profile after removing function speckles;

[0103] The processing module is used to extract the pixel center position information of the removal function blob and the pixel center position information of the workpiece based on the interference error surface pattern, and to calculate the actual deviation.

[0104] The calibration module is used to adjust the processing position of the ion source according to the actual deviation.

[0105] Preferably, the processing module includes an image processing unit for removing edge noise and center noise from the image generated based on the interference error surface pattern, extracting the contour of the image, and performing angle calibration on the image.

[0106] For specific limitations regarding the ion source position calibration system based on the removal function, please refer to the limitations of the ion source position calibration method based on the removal function mentioned above, which will not be repeated here. Each module in the aforementioned ion source position calibration system based on the removal function can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the corresponding operations of each module.

[0107] Those skilled in the art will understand that Figure 13The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0108] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program, the processor executing the computer program to perform the following steps:

[0109] Multiple removal function spots are processed at preset symmetrical positions on the workpiece;

[0110] Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots;

[0111] Pixel center position information is extracted and removed based on the interference error surface pattern;

[0112] Pixel center position information of the workpiece is extracted based on the interference error surface pattern;

[0113] The actual deviation of the spot from the workpiece center position is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece.

[0114] Adjust the ion source position according to the actual deviation to complete the calibration.

[0115] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0116] Multiple removal function spots are processed at preset symmetrical positions on the workpiece;

[0117] Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots;

[0118] Pixel center position information is extracted and removed based on the interference error surface pattern;

[0119] Pixel center position information of the workpiece is extracted based on the interference error surface pattern;

[0120] The actual deviation of the spot from the workpiece center position is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece.

[0121] Adjust the ion source position according to the actual deviation to complete the calibration.

[0122] In the embodiments provided in this application, it should be understood that the disclosed methods and systems can be implemented in other ways. The system embodiments described above are merely illustrative. For example, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, and can be electrical, mechanical, or other forms.

[0123] Furthermore, in the various embodiments of the present invention, each functional module can be fully integrated into a processor, or each module can be a separate device, or two or more modules can be integrated into a device; each functional module in the various embodiments of the present invention can be implemented in hardware or in the form of hardware plus software functional units.

[0124] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by program instructions and related hardware. The aforementioned program instructions can be stored in a computer-readable storage medium. When the program instructions are executed, they perform the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as mobile storage devices, read-only memory (ROM), magnetic disks, or optical disks.

[0125] It should be understood that the use of terms such as "system," "device," "unit," and / or "module" in this application is merely one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0126] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0127] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" or "several" means two or more, unless otherwise explicitly specified.

[0128] If a flowchart is used in this application, it is used to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0129] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ion source position calibration method based on a removal function, characterized in that, Includes the following steps: Multiple removal function spots are processed at preset symmetrical positions on the workpiece; Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots; The pixel center position information of the removal function is extracted based on the interference error surface pattern; The pixel center position information of the workpiece is extracted based on the interference error surface pattern; The actual deviation of the spot in the removal function relative to the center position of the workpiece is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Adjust the ion source position according to the actual deviation to complete the calibration; When performing the extraction of pixel center position information based on the interference error surface pattern to obtain the removal function, the following steps are included: Based on the interference error surface pattern, a first image is generated by removing the function speckle, and the edge error and center error of the first image are removed to obtain a first image, wherein the first image contains only the function speckle. Extract the contour information of the removed function blob and the center coordinates of the smallest circumcircle of the removed function blob from the first image to obtain the first position information of the removed function blob; Based on the first position information and the center coordinates, it is determined whether there is a coordinate axis rotation error, and the first image is calibrated at an angle to obtain the standard position information of the removed function blob. The pixel distance of the removed function blob is calculated based on the standard position information. The pixel position of the removed function blob is calibrated according to the pixel distance of the removed function blob and the actual distance of the removed function blob, so as to obtain the pixel size of the removed function and calculate the pixel center position information of the removed function. The preset symmetrical positions are specifically: four points distributed symmetrically along the coordinate axis with the center position of the workpiece as the origin of the coordinate axis, wherein two points are symmetrically distributed along the x-axis of the coordinate axis according to the symmetrical distance, and two points are symmetrically distributed along the y-axis of the coordinate axis according to the symmetrical distance.

2. The ion source position calibration method according to claim 1, characterized in that, The angle calibration includes: The phase angle of the removed function blob is calculated based on the first image, the rotation angle is determined by the arctangent function, and the removed function blob in the first image is rotated to obtain the second image; The second image is rotated and corrected so that the removed function blob is aligned with the standard coordinate axis, resulting in a third image and the standard position information of the removed function blob.

3. The ion source position calibration method as described in claim 2, characterized in that, When performing the extraction of pixel center position information of the workpiece based on the interference error surface pattern, the following steps are included: Generate an interference error measurement data image based on the interference error surface pattern; The interference error measurement data image is rotated according to the rotation angle, and the contour information of the interference error measurement data image is extracted; The pixel radius of the workpiece is calibrated based on the pixel size of the removal function and the actual size of the workpiece, and the pixel center position information of the workpiece is calculated by least squares method based on the pixel radius of the workpiece.

4. The ion source position calibration method according to claim 3, characterized in that, When performing the step of determining the actual deviation of the removal function spot relative to the workpiece center position based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece, the specific steps include: The pixel deviation is obtained by calculating the pixel center position information of the workpiece and the pixel center position information of the removal function, wherein the pixel deviation includes lateral deviation and longitudinal deviation; The pixel deviation is converted into the actual physical distance to obtain the actual deviation.

5. An ion source position calibration system based on a removal function, characterized in that, include: The processing module is used to generate removal function spots at preset positions on the workpiece; The measurement module is used to acquire the surface profile data of the workpiece before and after processing and generate the interference error surface profile of the removed function spots; The processing module is used to extract the pixel center position information of the removal function blob and the pixel center position information of the workpiece based on the interference error surface pattern, and to calculate the actual deviation. A calibration module is used to adjust the processing position of the ion source according to the actual deviation; When performing the extraction of pixel center position information based on the interference error surface pattern to obtain the removal function, the following steps are included: Based on the interference error surface pattern, a first image is generated by removing the function speckle, and the edge error and center error of the first image are removed to obtain a first image, wherein the first image contains only the function speckle. Extract the contour information of the removed function blob and the center coordinates of the smallest circumcircle of the removed function blob from the first image to obtain the first position information of the removed function blob; Based on the first position information and the center coordinates, it is determined whether there is a coordinate axis rotation error, and the first image is calibrated at an angle to obtain the standard position information of the removed function blob. The pixel distance of the removed function blob is calculated based on the standard position information. The pixel position of the removed function blob is calibrated according to the pixel distance of the removed function blob and the actual distance of the removed function blob, so as to obtain the pixel size of the removed function and calculate the pixel center position information of the removed function. The preset symmetrical positions are specifically: four points distributed symmetrically along the coordinate axis with the center position of the workpiece as the origin of the coordinate axis, wherein two points are symmetrically distributed along the x-axis of the coordinate axis according to the symmetrical distance, and two points are symmetrically distributed along the y-axis of the coordinate axis according to the symmetrical distance.

6. The ion source position calibration system as described in claim 5, characterized in that, The processing module includes an image processing unit, used to remove edge noise and center noise from the image generated based on the interference error surface pattern, extract the contour of the image, and perform angle calibration on the image.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 4.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.

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