High-frequency high-speed low-dielectric-loss flexible copper-clad plate preparation device and preparation process thereof

Abstract

The invention discloses a high-frequency high-speed low-dielectric-loss flexible copper-clad plate preparation device and a preparation process thereof. The device comprises a copper foil unwinding shaft, an insulating film unwinding shaft and a protective layer unwinding shaft which are arranged at the feeding end of the device in parallel; the interlayer preheating device is arranged at the downstream of the insulating film unwinding shaft, the shutdown avoiding moving device is arranged between the protective layer unwinding shaft and the heating roller pressing assembly, the heating roller pressing assembly and the inert gas protection device are arranged at a thermal compounding station in the middle and are integrated in a sealed cavity, and an outlet of the sealed cavity extends to a discharging end; and a protective layer winding assembly and a flexible copper-clad plate winding shaft are sequentially arranged at the discharging end according to the discharging sequence. Through the mode, the high-frequency 10 GHz dielectric constant of the flexible copper-clad plate is stably less than 2.5 and the dielectric loss tangent value is less than 0.002 through an adhesive-free compounding process; the reel-to-reel intelligent production line is achieved, thinning, flexibility and high-frequency signal integrity are considered, and the mass production requirement of flexible electronic products in the 5G / 6G era is met.

Description

Technical Field

[0001] This invention relates to the field of electronic materials, and in particular to a high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate preparation apparatus and its preparation process. Background Technology

[0002] With the widespread adoption of 5G / 6G communication technologies, the requirements for signal transmission speed (≥10 Gb / s) and latency (<1 ms) in information and electronic products have significantly increased, driving the development of electronic products towards high performance, miniaturization, thinness, and aesthetics. Under this trend, circuit boards, as core components of electronic devices, need to meet more stringent performance standards. Flexible printed circuit boards (FPCBs), due to their advantages of thinness, lightweight, and good flexibility, have become the preferred substrate for high-end electronic products.

[0003] Flexible copper clad laminate (FCCL), as a key material in the production of FPCBs, directly affects the final performance of the circuit board. Currently, the industry mainly uses two types of structures: 1. Three-layer flexible copper clad laminate (3L-FCCL): It is composed of copper foil (rolled or electrolytic copper foil), insulating base film (PET or PI film) and adhesive. The adhesive is mainly epoxy resin or acrylic resin.

[0004] Its advantages are that the adhesive significantly improves the peel strength between the copper foil and the insulating base film, and the composite process is mature and widely used. The disadvantages are that the polar adhesive introduces a large number of polar groups, which leads to a significant increase in the dielectric constant and dielectric loss tangent of the system under high-frequency conditions (such as 10 GHz) (dielectric constant > 3.5), and the finished products are mostly rigid, which is difficult to meet the requirements of high-frequency flexible applications.

[0005] 2. Two-layer flexible copper clad laminate (2L-FCCL): Based on 3L-FCCL, the adhesive layer is eliminated, and the copper foil and the insulating base film are directly bonded by physical or chemical means.

[0006] Its advantages include improved heat resistance and dimensional stability after the adhesive is removed, and superior dielectric properties compared to 3L-FCCL. Its disadvantages are that mainstream manufacturing relies on sheet-type vacuum high-temperature pressing, which cannot achieve continuous production, is inefficient, and is difficult to match the needs of large-scale manufacturing.

[0007] Therefore, there is an urgent need to develop an integrated technology solution that can simultaneously achieve high frequency, low loss, continuous roll-to-roll production, and binder-free lamination. Summary of the Invention

[0008] The main technical problem solved by this invention is to provide a high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate preparation device and its preparation process, which can achieve intelligent continuous roll-to-roll bonding of copper foil and insulating film under adhesive-free conditions, and prepare high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate to support the mass production needs of flexible electronic products in the 5G / 6G era.

[0009] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide a high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate fabrication apparatus, comprising: The unwinding assembly includes a copper foil unwinding shaft, an insulating film unwinding shaft, and a protective layer unwinding shaft arranged in parallel at the feed end of the device. Multi-axis parallel unwinding enables continuous roll-to-roll production. The interlayer preheating device is located downstream of the insulating film unwinding shaft and is used for directional preheating of the insulating film. A stop-and-avoid movement device is installed between the protective layer unwinding shaft and the heating roller pressing assembly to protect the protective layer from the high temperature of the heating roller. The heating roller pressing assembly and inert gas protection device are located in the middle of the hot composite station and are integrated into a sealed cavity. The inlet of the sealed cavity directly receives the material output from the interlayer preheating device and the stop avoidance moving device, and the outlet of the sealed cavity extends to the discharge end. The discharge end is equipped with a protective layer winding assembly and a flexible copper-clad laminate winding shaft in the order of discharge.

[0010] In a preferred embodiment of the present invention, the copper foil unwinding shaft includes an upper copper foil unwinding shaft and a lower copper foil unwinding shaft that can be operated independently, and an insulating film unwinding shaft is disposed between the upper copper foil unwinding shaft and the lower copper foil unwinding shaft; the protective layer unwinding shaft includes a first protective layer unwinding shaft and a second protective layer unwinding shaft that can be operated independently, and the first protective layer unwinding shaft and the second protective layer unwinding shaft are respectively disposed outside the upper copper foil unwinding shaft and the lower copper foil unwinding shaft.

[0011] In a preferred embodiment of the present invention, the interlayer preheating device employs an infrared radiation heater to preheat the insulating film at high temperature, controlling its shrinkage in the X and Y directions. Considering the heat-sensitive characteristics of the composite film, infrared preheating at 300~400℃ ensures a material shrinkage rate of ≤0.5%, avoiding transmission distortion of high-frequency signals caused by substrate deformation.

[0012] In a preferred embodiment of the present invention, the stop avoidance moving device is matched with the protective layer unwinding shaft, including a first protective layer avoidance moving roller and a second protective layer avoidance moving roller, which can move away from the heating roller pressing assembly, and the moving distance is 50-100mm.

[0013] During intermittent shutdowns, the protective layer automatically detaches from the high-temperature zone (quantitative design of the movement distance), preventing the protective film from deforming or aging due to continuous heating. This solves the problem of protective layer scrapping caused by frequent start-ups and shutdowns in traditional processes, and supports 24-hour continuous operation of the production line.

[0014] In a preferred embodiment of the present invention, the heating roller pressing assembly is a dual electromagnetic heating roller pressing assembly, including an upper metal roller and a lower metal roller, through which the copper foil and the insulating film are directly fused. High-temperature pressing at 350~450℃ causes the interface between the copper foil and the film to melt and bond, eliminating the dielectric loss of polar groups at the source and achieving a dielectric loss tangent of <0.002.

[0015] In a preferred embodiment of the present invention, the inert gas protection device maintains a positive pressure nitrogen atmosphere to prevent oxidation of the copper foil and insulating film composite material during the metal roller thermal bonding process. The positive pressure nitrogen atmosphere blocks air penetration, ensuring a free oxide layer at the copper foil-film interface, resulting in a 90° peel strength >1.5 N / mm and stable high-frequency performance. In a preferred embodiment of the present invention, the protective layer winding assembly is matched with the protective layer unwinding shaft, and a second protective layer peeling and winding assembly and a first protective layer peeling and winding assembly are sequentially provided along the discharge direction. The protective layer can be independently wound after peeling and reused ≥50 times, reducing the production cost of high-frequency copper-clad laminates by more than 30%.

[0016] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is: to provide a manufacturing process for a flexible copper-clad laminate manufacturing device with high thermal conductivity and low dielectric properties, comprising the following steps: Step A: Under the set tension, the first protective layer, the upper copper foil, the middle insulating film, the lower copper foil, and the second protective layer are sequentially pulled to the heating roller pressing assembly from top to bottom via each unwinding shaft. The middle insulating film is preheated by passing through the interlayer preheating device before being pulled to the heating roller pressing assembly. Step B: In an inert gas environment provided by an inert gas protection device, the material from Step A is thermally composited and molded. Step C: The substrate after thermal composite molding is cooled to room temperature by cooling rollers, and then the second protective layer is peeled off by the second protective layer peeling and winding assembly and then wound up separately. The first protective layer is peeled off by the first protective layer peeling and winding assembly and then wound up separately. Finally, the flexible copper clad laminate is wound onto the flexible copper clad laminate winding shaft.

[0017] In a preferred embodiment of the present invention, the method realizes intelligent continuous roll-to-roll single-sided flexible copper cladding production or double-sided flexible copper cladding production, and the mode switching is completed by selecting to enable the upper copper foil unwinding shaft or simultaneously enabling the upper and lower copper foil unwinding shafts. The single mode is used for flexible circuits of wearable devices, while the dual mode supports high-frequency IC carrier boards for base stations, covering the full-scenario requirements of small, thin, and high-performance components.

[0018] In a preferred embodiment of the present invention, the method enables continuous roll-to-roll production under adhesive-free conditions, and the resulting flexible copper-clad laminate has a dielectric constant of less than 2.5, a dielectric loss tangent of less than 0.002 at a high frequency of 10 GHz, and a 90° peel strength of greater than 1.5 N / mm.

[0019] The beneficial effects of this invention are as follows: This invention avoids the degradation of dielectric properties caused by polar resins through an adhesive-free composite process, ensuring that the dielectric constant of the flexible copper-clad laminate at high frequencies of 10 GHz is stable at <2.5 and the dielectric loss tangent is <0.002; through a roll-to-roll intelligent production line, the linear speed can reach 0.5~10m / min, realizing continuous operation of the entire process from material unwinding, composite to rewinding, replacing the inefficient sheet vacuum pressing mode; while ensuring a 90° peel strength of >1.5 N / mm, it also takes into account thinness, flexibility and high-frequency signal integrity, supporting the mass production needs of flexible electronic products in the 5G / 6G era. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of a preferred embodiment of the high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate fabrication apparatus of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of this invention, it should be noted that the terms "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is conventionally placed during use. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] In this invention, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] Please see Figure 1 The embodiments of the present invention include: A high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate fabrication apparatus, comprising: The unwinding assembly includes copper foil unwinding shafts, insulating film unwinding shafts, and protective layer unwinding shafts arranged in parallel at the feed end of the device. The spacing between them is reasonable to ensure that the materials do not cross or interfere with each other.

[0028] The copper foil unwinding shaft includes an upper copper foil unwinding shaft 1 and a lower copper foil unwinding shaft 3 that can be operated independently, and an insulating film unwinding shaft 2 is located between the upper copper foil unwinding shaft and the lower copper foil unwinding shaft; The protective layer unwinding shaft includes a first protective layer unwinding shaft 4 and a second protective layer unwinding shaft 5 that can be operated independently. The first protective layer unwinding shaft 4 and the second protective layer unwinding shaft 5 are respectively located outside the upper copper foil unwinding shaft 1 and the lower copper foil unwinding shaft 3.

[0029] Multi-axis parallel unwinding enables continuous roll-to-roll production and supports switching between single / double-sided copper plating modes.

[0030] The interlayer preheating device 6 is located downstream of the insulating film unwinding shaft 2 and uses an infrared radiation heater to preheat the insulating film in a directional manner.

[0031] To address the heat-sensitive characteristics of composite films, infrared preheating at 300~400℃ reduces the material shrinkage rate to ≤0.5%, controlling shrinkage in the X and Y directions and ensuring dimensional stability.

[0032] A stop-avoidance moving device is installed between the protective layer unwinding shaft and the heating roller pressing assembly 9. It is configured in conjunction with the protective layer unwinding shaft and includes a first protective layer avoidance moving roller 7 and a second protective layer avoidance moving roller 8. It can move away from the heating roller pressing assembly by a distance of 50-100mm.

[0033] During intermittent shutdowns, the protective layer automatically detaches from the high-temperature zone (quantitative design of the movement distance), preventing the protective film from deforming or aging due to continuous heating. This solves the problem of protective layer scrapping caused by frequent start-stop cycles in traditional processes and supports 24-hour continuous operation of the production line.

[0034] The heated roller pressing assembly 9 and the inert gas protection device 9 are located in the central thermal bonding station and are integrated into a sealed cavity. The heated roller pressing assembly 9 is a dual electromagnetic heated roller pressing assembly, including an upper metal roller and a lower metal roller. The surface temperature of the upper metal roller and the lower metal roller is 350-450℃, and the pressing pressure is adjustable from 5-20MPa.

[0035] The copper foil and insulating film are directly fused together by the upper and lower metal rollers, eliminating the dielectric loss of polar groups at the source and achieving a dielectric loss tangent of <0.002.

[0036] The inert gas protection device 9 maintains a positive pressure of nitrogen at a pressure of 0.1-0.3 MPa to prevent oxidation of the copper foil and insulating film composite material during the hot composite forming process of the metal roller.

[0037] It is preferred to introduce positive pressure nitrogen gas with a pressure of 0.1~0.3 MPa and an oxygen content of ≤50 ppm. Positive pressure nitrogen gas is used to block air penetration, ensure that there is no oxide layer at the copper foil-film interface, and make the 90° peel strength >1.5 N / mm and the high frequency performance stable.

[0038] The inlet of the sealed cavity directly receives the material output from the jacket preheating device 6 and the shutdown avoidance moving device, and the outlet of the sealed cavity extends to the discharge end.

[0039] The discharge end is equipped with a protective layer winding assembly and a flexible copper-clad laminate winding shaft 14 in sequence according to the discharge order. The protective layer winding assembly is matched with the protective layer unwinding shaft, and a second protective layer peeling and winding assembly and a first protective layer peeling and winding assembly are arranged in sequence along the discharge direction. After the protective layer is peeled off, it can be independently wound up and reused ≥50 times, reducing the production cost of high-frequency copper-clad laminates by more than 30%.

[0040] The fabrication process of the above-mentioned high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate fabrication device includes the following steps: Step A: Under the set tension, the first protective layer, the upper copper foil, the middle insulating film, the lower copper foil, and the second protective layer are sequentially pulled to the heating roller pressing assembly 9 from top to bottom via each unwinding shaft.

[0041] The intermediate insulating film is preheated at 300~400°C through the interlayer preheating device 6 and then pulled to the heating roller pressing assembly 9. The intermediate insulating film is preferably a polyimide-fluoropolymer insulating composite film, a thermoplastic polyimide / thermally conductive low-dielectric ePTFE / thermoplastic polyimide insulating composite film, or a thermoplastic polyimide / thermosetting polyimide / thermoplastic polyimide insulating composite film.

[0042] The preferred first protective layer is located on the upper side of the upper copper foil, protecting the upper copper foil from high-temperature oxidation. The second protective layer is located on the lower side of the lower copper foil, protecting the lower copper foil from high-temperature oxidation.

[0043] Step B: In the inert gas environment provided by the inert gas protection device 9, at a temperature of 350~450℃, the material from step A is thermally composited and molded. Step C: The substrate after thermoforming is cooled to room temperature by a cooling roller, and then the second protective layer is peeled off by the second protective layer peeling device 10, and the first protective layer is peeled off by the first protective layer peeling device 11. Finally, the first protective layer is wound up by the first protective layer winding shaft 12, the second protective layer is wound up by the second protective layer winding shaft 13, and finally the flexible copper clad laminate is wound up by the flexible copper clad laminate winding shaft 14.

[0044] During intermittent shutdown, the first protective layer avoids the moving roller 7 and moves backward to keep it away from the high-temperature metal roller 9, preventing deformation, wrinkling, or aging due to high temperatures. The second protective layer avoids the moving roller 8 and moves backward to keep it away from the high-temperature metal roller 9, preventing deformation, wrinkling, or aging due to high temperatures.

[0045] The method enables intelligent continuous roll-to-roll single-sided flexible copper clad production or double-sided flexible copper clad production, and the mode switching is completed by selecting to enable the upper copper foil unwinding shaft or simultaneously enabling the upper and lower copper foil unwinding shafts.

[0046] Single-mode is used for flexible circuits in wearable devices, while dual-mode supports high-frequency IC carrier boards for base stations, covering the full-scenario needs of small, thin, and high-performance devices.

[0047] The method enables continuous roll-to-roll production without adhesives, and the resulting flexible copper-clad laminate has a dielectric constant of less than 2.5, a dielectric loss tangent of less than 0.002 at a high frequency of 10GHz, and a 90° peel strength of greater than 1.5 N / mm.

[0048] The present invention provides an apparatus and method for fabricating high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminates: By using adhesive-free hot-pressing lamination and inert gas protection technology, the high-frequency loss problem caused by polar adhesives is completely eliminated, enabling the flexible copper clad laminate to have a dielectric constant of less than 2.5 and a dielectric loss tangent of less than 0.002 at a high frequency of 10GHz, fully meeting the high requirements of 5G / 6G communication for signal transmission.

[0049] It adopts a roll-to-roll continuous production process with a linear speed of 0.5~10m / min, which is more than 10 times more efficient than the traditional sheet vacuum pressing process, and can meet the needs of large-scale mass production.

[0050] The infrared preheating device precisely controls the substrate shrinkage rate to ensure dimensional stability; the double protective layer design and inert gas protection effectively prevent copper foil oxidation, resulting in a peel strength greater than 1.5 N / mm.

[0051] The protective layer can be reused more than 50 times, reducing production costs by more than 30%; a single machine can simultaneously meet the production of single-sided and double-sided copper clad laminates, reducing equipment investment by 50%.

[0052] We can produce lightweight single-sided flexible copper-clad laminates for wearable devices, as well as high-density double-sided flexible copper-clad laminates for base station IC substrates, covering the needs of various electronic products in the 5G / 6G era.

[0053] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A high-frequency, high-speed, low-dielectric-loss flexible copper-clad laminate fabrication apparatus, characterized in that, include: The unwinding assembly includes a copper foil unwinding shaft, an insulating film unwinding shaft, and a protective layer unwinding shaft arranged in parallel at the feed end of the device; The interlayer preheating device is located downstream of the insulating film unwinding shaft and is used for directional preheating of the insulating film. A stop-and-avoid movement device is installed between the protective layer unwinding shaft and the heating roller pressing assembly to protect the protective layer from the high temperature of the heating roller. The heating roller pressing assembly and inert gas protection device are located in the middle of the hot composite station and are integrated into a sealed cavity. The inlet of the sealed cavity directly receives the material output from the interlayer preheating device and the stop avoidance moving device, and the outlet of the sealed cavity extends to the discharge end. The discharge end is equipped with a protective layer winding assembly and a flexible copper-clad laminate winding shaft in the order of discharge.

2. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The copper foil unwinding shaft includes an upper copper foil unwinding shaft and a lower copper foil unwinding shaft that can operate independently, and an insulating film unwinding shaft is located between the upper copper foil unwinding shaft and the lower copper foil unwinding shaft; the protective layer unwinding shaft includes a first protective layer unwinding shaft and a second protective layer unwinding shaft that can operate independently, and the first protective layer unwinding shaft and the second protective layer unwinding shaft are respectively located outside the upper copper foil unwinding shaft and the lower copper foil unwinding shaft.

3. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The interlayer preheating device uses an infrared radiation heater to preheat the insulating film at high temperature and control its shrinkage in the X and Y directions.

4. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The stop avoidance moving device is matched with the protective layer unwinding shaft and includes a first protective layer avoidance moving roller and a second protective layer avoidance moving roller. It can move away from the heating roller pressing assembly, and the moving distance is 50-100mm.

5. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The heating roller pressing assembly is a dual electromagnetic heating roller pressing assembly, including an upper metal roller and a lower metal roller, through which the copper foil and the insulating film are directly fused.

6. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The inert gas protection device maintains a positive pressure nitrogen component to prevent the copper foil and insulating film composite material from being oxidized during the hot composite forming process of the metal roller.

7. The apparatus for fabricating flexible copper-clad laminates with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The protective layer winding assembly is matched with the protective layer unwinding shaft, and a second protective layer peeling and winding assembly and a first protective layer peeling and winding assembly are sequentially provided along the discharge direction.

8. The fabrication process of the flexible copper-clad laminate fabrication apparatus with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, Includes the following steps: Step A: Under the set tension, the first protective layer, the upper copper foil, the middle insulating film, the lower copper foil, and the second protective layer are sequentially pulled to the heating roller pressing assembly from top to bottom via each unwinding shaft. The middle insulating film is preheated by passing through the interlayer preheating device before being pulled to the heating roller pressing assembly. Step B: In an inert gas environment provided by an inert gas protection device, the material from Step A is thermally composited and molded. Step C: The substrate after thermal composite molding is cooled to room temperature by cooling rollers, and then the second protective layer is peeled off by the second protective layer peeling and winding assembly and then wound up separately. The first protective layer is peeled off by the first protective layer peeling and winding assembly and then wound up separately. Finally, the flexible copper clad laminate is wound onto the flexible copper clad laminate winding shaft.

9. The fabrication process of the flexible copper-clad laminate fabrication apparatus with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The method enables intelligent continuous roll-to-roll single-sided flexible copper clad production or double-sided flexible copper clad production, and the mode switching is completed by selecting to enable the upper copper foil unwinding shaft or simultaneously enabling the upper and lower copper foil unwinding shafts.

10. The fabrication process of the flexible copper-clad laminate fabrication apparatus with high thermal conductivity and low dielectric properties according to claim 1, characterized in that, The method enables continuous roll-to-roll production without adhesives, and the resulting flexible copper-clad laminate has a dielectric constant of less than 2.5, a dielectric loss tangent of less than 0.002 at a high frequency of 10GHz, and a 90° peel strength of greater than 1.5 N / mm.

Images