Semiconductor wafer production loading equipment

Abstract

The invention relates to the technical field of manufacturing of equipment special for semiconductor devices, in particular to semiconductor wafer production loading equipment which comprises a first workbench and a toothed belt, the outer wall of the toothed belt is fixedly connected with a rotating belt, the outer wall of the rotating belt is provided with a first sliding groove, and the inner wall of the first sliding groove is fixedly connected with a first guide rod; the device has the beneficial effects that along with movement of the sliding frame, the inclination amplitude of the bag body is larger and larger, at the moment, inclination of the bag promotes the bag opening to be gradually pulled away from the flat exhaust pipe, fourth springs are promoted to rebound to drive second guide rods to slide and protrude in the direction away from the through grooves, and first balls at the ends of the second guide rods are kept to slide in the guide grooves all the time; in this way, the flat exhaust pipe continuously adjusts the exhaust angle in the bag and the distance from the bag opening in the process of exhausting air in the bag, the packaging bag is gradually shrunk and wrinkled along with the exhaust of air in the bag, and the bag wall which is gradually wrinkled is prevented from being sucked by the exhaust pipe.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing equipment technology, specifically a semiconductor wafer production loading device. Background Technology

[0002] Semiconductor crystals are the core basic materials of semiconductor devices. They have specific electrical properties and are formed into wafers after being cut and polished during the production process. Special equipment is needed to load the wafers during the production process.

[0003] Typically, after wafers are loaded into wafer cassettes, the cassettes are placed in sealed bags for vacuum extraction. After extraction, nitrogen gas is injected into the sealed bags for protection, and finally, the bags are sealed, completing the wafer loading process. Currently, existing semiconductor wafer loading equipment on the market encounters a problem during the vacuuming process of the packaged wafer cassettes. As air is removed from the bag, it gradually shrinks and wrinkles. The increasingly wrinkled and deformed bag walls are easily sucked into the vacuuming pipes, leading to poor vacuuming. Therefore, a new loading device is needed to solve this problem. Summary of the Invention

[0004] This invention provides a semiconductor wafer manufacturing loading device that effectively prevents the deformed bag wall from obstructing the suction pipe, thus solving the problem mentioned in the background art where, during the suction process of a packaging bag, as the air inside the bag is removed, the bag gradually shrinks and wrinkles, and the gradually wrinkled and deformed bag wall is easily sucked into the suction pipe, leading to poor suction. To achieve the above objective, this invention provides the following technical solution: a semiconductor wafer manufacturing loading device, comprising a first worktable and a toothed belt, a rotating belt fixedly connected to the outer wall of the toothed belt, a first sliding groove formed on the outer wall of the rotating belt, a first guide rod fixedly connected to the inner wall of the first sliding groove, a first slider slidably connected to the outer wall of the first guide rod, a first spring fixedly connected to the outer wall of the first slider, and one end of the first spring fixedly connected to the inner wall of the first sliding groove;

[0005] The outer wall of the first slider is fixedly connected to a sliding frame, the inner wall of the sliding frame has a second inclined surface, the inner wall of the sliding frame is hinged to a hinge plate, the outer wall of the first workbench has a second sliding groove, the inner wall of the second sliding groove is slidably connected to a lifting frame, the outer wall of the lifting frame is slidably connected to two second sliders, the outer wall of the lifting frame is fitted with a second spring, and the second spring is fixedly connected to the outer wall of the rotating belt.

[0006] Preferably, a drive motor is fixedly installed on the outer wall of the first workbench, and a first toothed pulley is fixedly installed on the output end of the drive motor. The outer wall of the first toothed pulley is meshed with the toothed belt, and a second toothed pulley is meshed with the inner wall of the toothed belt. The second toothed pulley is rotatably connected to the outer wall of the first workbench.

[0007] A first abutting block is fixedly connected to the outer wall of the first slider, and a fourth guide rod is fixedly connected to the outer wall of the lifting frame;

[0008] The end of the fourth guide rod is rotatably connected to a fourth ball bearing, and the outer wall of the first worktable is fixedly connected to a first protrusion and a second protrusion, the ends of the first protrusion and the second protrusion being hemispherical.

[0009] Preferably, the outer wall of the hinge plate is provided with a guide groove, the outer wall of the second slider is provided with a through groove, the inner wall of the through groove is fixedly connected with a fourth spring, one end of the fourth spring is fixedly connected with a second guide rod, the end of the second guide rod is rotatably connected with a first ball, and the first ball is slidably connected in the guide groove.

[0010] Preferably, a third guide rod is slidably connected to the inner wall of the rotating belt, a third ball is rotatably connected to one end of the third guide rod, and a second ball is rotatably connected to the other end of the third guide rod. The third ball abuts against the outer wall of the hinge plate. A fixing plate is fixedly connected to the outer wall of the first worktable, and an upward inclined surface is provided on the outer wall of the fixing plate.

[0011] The outer wall of the first workbench is also provided with a groove, and two arc surfaces are provided at the opening of the groove.

[0012] Preferably, the outer wall of the first abutment block has a first inclined surface, the outer wall of the first workbench is fixedly connected to a second workbench, the outer wall of the second workbench is fixedly connected to a fourth abutment block, the outer wall of the fourth abutment block has a fifth inclined surface, the outer wall of the second workbench is also fixedly connected to a fifth abutment block, and the outer wall of the fifth abutment block has a sixth inclined surface.

[0013] Preferably, the outer wall of the rotating belt is fixedly connected with a plurality of evenly distributed third abutment blocks, and the outer wall of the third abutment blocks is provided with a fourth inclined surface;

[0014] The inner wall of the second workbench is provided with a horizontal plate, and a guide rod is fixedly connected to the inner wall of the second workbench. The horizontal plate is slidably sleeved on the outer wall of the guide rod.

[0015] Preferably, a resistance heat melter is fixedly installed on the inner wall of the second workbench, and a second abutment block is fixedly connected to the outer wall of the horizontal plate, with a third inclined surface on the outer wall of the second abutment block.

[0016] Preferably, a second conveyor belt and a third conveyor belt are fixedly installed on the inner wall of the second workbench.

[0017] Preferably, an air pump is fixedly installed on the outer wall of the second workbench, and a connecting pipe is fixedly connected to the air pump end. A third slider is fixedly connected to one end of the connecting pipe. A third sliding groove is opened on the outer wall of the second workbench, and the third slider is slidably connected to the inner wall of the third sliding groove. A flat air extraction pipe is fixedly connected to the outer wall of the third slider.

[0018] Preferably, a third spring is fixedly connected to the outer wall of the third slider, and one end of the third spring is fixedly connected to the outer wall of the second worktable.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. In this invention, as the sliding frame moves, the hinge plate rotates upwards at an increasingly larger angle, thus increasing the tilt of the bag. This tilt causes the bag opening to gradually move away from the flat suction tube, causing the fourth spring to rebound and slide the second guide rod away from the through groove. This keeps the first ball bearing at the end of the second guide rod sliding within the guide groove, thereby allowing the flat suction tube to continuously adjust its suction angle and distance from the bag opening during the suction process. As the air inside the bag is removed, the packaging bag gradually shrinks and wrinkles, preventing the gradually wrinkled bag wall from being sucked up by the suction tube.

[0021] 2. In this invention, when the drive motor is started, the two second sliders on both sides approach each other and exert lateral pressure on both sides of the wafer cassette packaging bag placed in the sliding frame, causing the opening of the wafer cassette packaging bag to deform and the opening to become larger. The sliding frame resets and moves the wafer cassette packaging bag instantaneously toward the suction pipe, which allows the end of the flat suction pipe to enter the bag opening, preventing the bag opening of the wafer cassette packaging bag from closing and causing the suction pipe to not accurately enter the bag.

[0022] 3. In this invention, after sealing is completed, when the rotating belt continues to move counterclockwise with the sliding frame, the hinge plate will also droop down along the hinge due to gravity. At this time, the sealed bag slides along the drooping hinge plate in a direction away from the second inclined plane. The lifting frame moves up to release the restriction on the bag. At this time, the bag slides down the drooping hinge plate out of the sliding frame and smoothly enters the next conveying and processing stage. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0024] Figure 2 For the present invention Figure 1 Enlarged structural diagram at point A in the middle;

[0025] Figure 3 This is a schematic diagram of the overall top cross-sectional structure of the present invention;

[0026] Figure 4 This is a schematic diagram of the overall rear view structure of the present invention;

[0027] Figure 5 This is a schematic diagram of the overall side cross-sectional structure of the present invention;

[0028] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B;

[0029] Figure 7 This is a top view of the overall structure of the present invention;

[0030] Figure 8 This is a schematic diagram of a partial cross-sectional structure of the rotating belt and its surrounding area according to the present invention;

[0031] Figure 9 This is a schematic diagram of the side cross-sectional structure of the rotating belt and its surrounding area according to the present invention;

[0032] Figure 10 This is a schematic diagram of the sliding frame and its surrounding cross-sectional structure according to the present invention;

[0033] Figure 11 This is a schematic diagram of the sliding frame and its surrounding structure of the present invention.

[0034] Figure 12 This is a schematic diagram of the cross-sectional structure of the second slider and its surrounding area according to the present invention.

[0035] The components represented by each number in the attached diagram are listed below: 1. First worktable; 101. Second toothed pulley; 3. Drive motor; 5. First toothed pulley; 6. Toothed belt; 7. Rotating belt; 8. First slide groove; 9. First guide rod; 10. First spring; 11. First slider; 12. Sliding frame; 121. Second inclined plane; 13. Second slide groove; 14. Lifting frame; 15. Second spring; 16. Second slider; 161. Through groove; 162. Fourth spring; 17. Second guide rod; 18. First ball bearing; 19. First abutment block; 20. First inclined plane; 21. Fourth guide rod; 22. Fourth ball bearing; 23. Hinge plate; 24. Guide groove; 25. Third guide rod 26. Second ball bearing; 27. Third ball bearing; 28. Second conveyor belt; 29. ​​Third conveyor belt; 29. ​​Second worktable; 30. Air pump; 31. Connecting pipe; 32. Third slider; 33. Third slide groove; 34. Third spring; 35. Flat air extraction pipe; 36. Guide rod; 37. Horizontal plate; 38. Resistance heat melt; 39. Second contact block; 40. Third inclined plane; 41. Third contact block; 42. Fourth inclined plane; 43. Fourth contact block; 44. Fifth inclined plane; 45. Fifth contact block; 46. Sixth inclined plane; 47. Groove; 48. Arc surface; 49. First protrusion; 50. Second protrusion; 51. Fixing plate; 52. Rising inclined plane. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1: This example helps solve the problem that during the air extraction process of packaging bags, as the air inside the bag is removed, the bag gradually shrinks and wrinkles. The gradually wrinkled and deformed bag wall is easily sucked into the extraction pipe, leading to poor air extraction. Please refer to [link to relevant documentation]. Figure 1 - Figure 12 A semiconductor wafer manufacturing loading device includes a first worktable 1 and a toothed belt 6. A rotating belt 7 is fixedly connected to the outer wall of the toothed belt 6. A first groove 8 is formed on the outer wall of the rotating belt 7. A first guide rod 9 is fixedly connected to the inner wall of the first groove 8. A first slider 11 is slidably connected to the outer wall of the first guide rod 9. A first spring 10 is fixedly connected to the outer wall of the first slider 11. One end of the first spring 10 is fixedly connected to the inner wall of the first groove 8.

[0038] The outer wall of the first slider 11 is fixedly connected to a sliding frame 12. The inner wall of the sliding frame 12 has a second inclined surface 121. The inner wall of the sliding frame 12 is hinged to a hinge plate 23. The outer wall of the first worktable 1 has a second slide groove 13. The inner wall of the second slide groove 13 is slidably connected to a lifting frame 14. The outer wall of the lifting frame 14 is slidably connected to two second sliders 16. The outer wall of the lifting frame 14 is fitted with a second spring 15. The second spring 15 is fixedly connected to the outer wall of the rotating belt 7.

[0039] A drive motor 3 is fixedly installed on the outer wall of the first worktable 1. A first toothed pulley 5 is fixedly installed at the output end of the drive motor 3. The outer wall of the first toothed pulley 5 is meshed with the toothed belt 6. A second toothed pulley 101 is meshed with the inner wall of the toothed belt 6. The second toothed pulley 101 is rotatably connected to the outer wall of the first worktable 1.

[0040] The outer wall of the first slider 11 is fixedly connected to the first abutting block 19, and the outer wall of the lifting frame 14 is fixedly connected to the fourth guide rod 21;

[0041] The end of the fourth guide rod 21 is rotatably connected to the fourth ball bearing 22, and the outer wall of the first worktable 1 is fixedly connected to the first protrusion 49 and the second protrusion 50. The ends of the first protrusion 49 and the second protrusion 50 are both hemispherical.

[0042] The outer wall of the hinge plate 23 is provided with a guide groove 24, and the outer wall of the second slider 16 is provided with a through groove 161. The inner wall of the through groove 161 is fixedly connected with a fourth spring 162. One end of the fourth spring 162 is fixedly connected with a second guide rod 17, and the end of the second guide rod 17 is rotatably connected with a first ball bearing 18. The first ball bearing 18 is slidably connected in the guide groove 24.

[0043] The inner wall of the rotating belt 7 is slidably connected to a third guide rod 25. One end of the third guide rod 25 is rotatably connected to a third ball bearing 27, and the other end of the third guide rod 25 is rotatably connected to a second ball bearing 26. The third ball bearing 27 abuts against the outer wall of the hinge plate 23. The outer wall of the first worktable 1 is fixedly connected to a fixing plate 51, and the outer wall of the fixing plate 51 is provided with an upward inclined surface 52.

[0044] The outer wall of the first workbench 1 is also provided with a groove 47, and two arc surfaces 48 are provided at the opening of the groove 47.

[0045] The outer wall of the first contact block 19 has a first inclined surface 20. The outer wall of the first workbench 1 is fixedly connected to the second workbench 291. The outer wall of the second workbench 291 is fixedly connected to the fourth contact block 43. The outer wall of the fourth contact block 43 has a fifth inclined surface 44. The outer wall of the second workbench 291 is also fixedly connected to the fifth contact block 45. The outer wall of the fifth contact block 45 has a sixth inclined surface 46.

[0046] Multiple evenly distributed third contact blocks 41 are fixedly connected to the outer wall of the rotating belt 7, and the outer wall of the third contact block 41 is provided with a fourth inclined surface 42.

[0047] The inner wall of the second workbench 291 is provided with a horizontal plate 37, and a guide rod 36 is fixedly connected to the inner wall of the second workbench 291. The horizontal plate 37 is slidably sleeved on the outer wall of the guide rod 36.

[0048] The inner wall of the second workbench 291 is fixedly installed with a resistance heat fuse 38, and the outer wall of the horizontal plate 37 is fixedly connected with a second abutment block 39. The outer wall of the second abutment block 39 is provided with a third inclined surface 40.

[0049] The inner wall of the second workbench 291 is fixedly installed with a second conveyor belt 28 and a third conveyor belt 29.

[0050] An air pump 30 is fixedly installed on the outer wall of the second workbench 291. A connecting pipe 31 is fixedly connected to the air pump 30. A third slider 32 is fixedly connected to one end of the connecting pipe 31. A third slide groove 33 is opened on the outer wall of the second workbench 291. The third slider 32 is slidably connected to the inner wall of the third slide groove 33. A flat air extraction pipe 35 is fixedly connected to the outer wall of the third slider 32.

[0051] A third spring 34 is fixedly connected to the outer wall of the third slider 32, and one end of the third spring 34 is fixedly connected to the outer wall of the second worktable 291.

[0052] In this embodiment: During the use of the loading device, the drive motor 3 is started, and the drive motor 3 drives the first toothed pulley 5 at the output end to rotate. The first toothed pulley 5 drives the toothed belt 6 to rotate together through the meshing relationship. When the toothed belt 6 rotates, it drives the second toothed pulley 101 to rotate through the meshing relationship. At this time, the toothed belt 6 will mesh and move along the outer wall of the first toothed pulley 5 and the second toothed pulley 101. As the toothed belt 6 moves, it will also drive the outer wall rotating belt 7 to rotate together. The drive motor 3 is set to rotate the same number of revolutions each time it starts, that is, the distance that the rotating belt 7 moves each time is the distance between two adjacent sliding frames 12.

[0053] The wafer cassette packaging bag that needs to be sealed is placed with its open end on the hinge plate 23 inside the sliding frame 12 by a robotic arm, with the opening of the bag facing the opening of the sliding frame 12. At this time, as the sliding frame 12 moves, the fourth guide rod 21 moves synchronously with the fourth ball bearing 22. During the movement, the fourth ball bearing 22 will contact the second protrusion 50. The contact will cause the fourth ball bearing 22 to be subjected to upward force with the fourth guide rod 21. At this time, the fourth guide rod 21 will pull the second spring 15 upward with the lifting frame 14 and move upward. The wafer cassette packaging bag will slide to the inner wall of the sliding frame 12 along the tilt angle of the hinge plate 23 as shown in the figure. The upward movement of the lifting frame 14 is to prevent the wafer cassette packaging bag from being obstructed by the lifting frame 14.

[0054] At this point, the drive motor 3 continues to start. As the rotating belt 7 continues to move the sliding frame 12, the fourth ball 22 releases its contact with the second protrusion 50. The second spring 15 resets, causing the lifting frame 14 to move downwards. As the rotating belt 7 continues to move, the sliding frame 12 continues to move. When the first inclined surface 20 of the outer wall of the first contact block 19 contacts the fifth inclined surface 44 of the outer wall of the fourth contact block 43, the contact causes the first contact block 19 to be forced to move in the direction of compressing the first spring 10. At the same time, the first slider 11 slides along the outer wall of the first guide rod 9. The first slider 11 moves along with the sliding frame 12, and as the sliding frame 12 moves, the guide groove 24 on the surface of the hinge plate 23 moves along the outer wall of the first ball 18. As the slide proceeds, the second guide rod 17, under pressure along the moving guide groove 24, causes the two second sliders 16 to slide closer together along the outer wall of the lifting frame 14. This close movement of the second sliders 16 on both sides exerts lateral pressure on both sides of the wafer cassette packaging bag placed inside the sliding frame 12. Furthermore, the movement of the sliding frame 12 causes the lifting frame 14 to move closer to the upper left side of the sliding frame 12. At this point, the lifting frame 14 is closer to the uppermost point of the hinge plate 23. Since the hinge plate 23 is now an inclined surface as shown in the figure, the bag opening inside the sliding frame 12 is tilted upwards. The movement of the sliding frame 12 allows the uppermost part of the wafer cassette packaging bag to be pressed against the lower surface of the lifting frame 14, changing its tilted upward orientation to being pressed against the lower surface of the lifting frame 14. Directly in front, as the rotating belt 7 continues to move, carrying the sliding frame 12, the fourth contact block 43, having a certain length, will maintain contact for a distance after the sliding frame 12 is displaced due to the contact. Finally, when the first contact block 19 releases contact with the fourth contact block 43, the first spring 10 resets, carrying the sliding frame 12 back to its original position. During this reset, the sliding frame 12 carries the wafer cassette packaging bag instantaneously towards the flat suction tube 35. Once the end of the flat suction tube 35 enters the bag opening, even if the bag opening is no longer contacted, the open wafer cassette packaging bag can easily accommodate the flat suction tube because the end of the flat suction tube 35 is already inside the bag. The wafer cassette packaging bag 35 is contained within the bag opening. As the bag moves, the flat suction tube 35, inserted internally, moves towards the second conveyor belt 28 and the third conveyor belt 29. During this movement, the flat suction tube 35 follows the movement and is stretched by the third spring 34. Subsequently, the bag opening and the flat suction tube 35 within it enter the space between the second and third conveyor belts 28 and 29, where they are simultaneously clamped and conveyed. It is important to note that the conveying speed of the second and third conveyor belts 28 and 29 is consistent with the rotation speed of the rotating belt 7. During this movement, the suction pump 30 is activated, continuously drawing air from the flat suction tube 35 and the bag through the connecting pipe 31.Furthermore, because the bag opening is tightly compressed between the second conveyor belt 28 and the third conveyor belt 29, the airtightness of the flat suction pipe 35 during suction is guaranteed.

[0055] As the sliding frame 12 continues to move, the second ball bearing 26 will continuously climb along the rising ramp 52 opened on the outer wall of the fixed plate 51. The climbing of the second ball bearing 26 will move the third guide rod 25 upward together. The upward movement of the third guide rod 25 will move the third ball bearing 27 at one end upward in sync. The upward movement of the third ball bearing 27 will abut against the hinge plate 23, causing the hinge plate 23 to rotate upward along the hinge point to a certain extent. The upward rotation of the hinge plate 23 will cause the bag placed on its surface to rotate synchronously. At this time, the bag is being sucked out by the flat suction tube 35. As the sliding frame 12 moves, the upward rotation of the hinge plate 23 becomes larger and larger, so the tilt of the bag also becomes larger and larger. At this time, the tilt of the bag causes the bag opening to gradually be pulled away from the flat suction tube 35.

[0056] When the hinge plate 23 rotates and tilts along the hinge, the fourth spring 162 in the through groove 161 will be compressed or extended as needed, thereby causing the second guide rod 17 to slide into or out of the through groove 161, so that the first ball 18 always abuts against the guide groove 24. It should be noted that the second slide groove 13 slides in the guide groove 24. When the lifting frame 14 moves upward with the second slider 16, the second guide rod 17 and the first ball 18, it will not move with the hinge plate 23. Instead, it will cause the fourth spring 162 to rebound and cause the second guide rod 17 to slide and protrude in a direction away from the through groove 161, so as to keep the first ball 18 at the end of the second guide rod 17 always sliding in the guide groove 24.

[0057] This allows the flat suction tube 35 to continuously adjust its suction angle and distance from the bag opening during the suction process. As the air inside the bag is removed, the packaging bag gradually shrinks and wrinkles, preventing the gradually wrinkled bag wall from being sucked up by the flat suction tube 35.

[0058] After the air inside the bag is removed, the flat suction pipe 35 supplies nitrogen gas into the bag for protection. As the sliding frame 12 continues to move, the first inclined surface 20 of the outer wall of the first contact block 19 will abut against the sixth inclined surface 46 of the outer wall of the fifth contact block 45. This abutment causes the first contact block 19, along with the first slider 11, to move along the outer wall of the first guide rod 9 in the direction of compressing the first spring 10. At this time, the sliding frame 12 moves again in the direction of compressing the first spring 10. The movement of the sliding frame 12 moves the bag along with it, disengaging the bag opening from the flat suction pipe 35. At this time, the third spring 34 rebounds, causing the third slider 32 to slide back to its original position along the third slide groove 33. The flat suction pipe 35 returns to its original position. After the flat suction pipe 35 is pulled out, the bag opening is still pressed between the second conveyor belt 28 and the third conveyor belt 29 and continues to be conveyed, so the airtightness is still maintained. With this guarantee, when the rotating belt 7 continues to move with the sliding frame 12, the third contact block 41 on the outer wall of the rotating belt 7 will contact the second contact block 39 on the outer wall of the horizontal plate 37. The contact causes the fourth inclined surface 42 on the outer wall of the third contact block 41 to contact the third inclined surface 40 on the outer wall of the second contact block 39. The contact causes the second contact block 39 to move upward with the horizontal plate 37 under force. During the movement, it is guided by the guide rod 36. As the horizontal plate 37 moves upward, it eventually causes the horizontal plate 37 to press the protruding bag opening between the resistance heat melters 38. At this time, the two horizontal plates 37 press the bag opening at the pressing point onto the resistance heat melters 38 for heat fusion sealing. Since the second contact block 39 has a certain length, the third contact block 41 will move a certain distance along the lower surface of the second contact block 39 after contact. The time of this movement can make the heat fusion sealing uniform.

[0059] After sealing, as the rotating belt 7 continues to move counterclockwise with the sliding frame 12, the second ball 26 will slide into the groove 47 along the arc surface 48. Since the groove 47 is lower than the surface of the first worktable 1, the third guide rod 25 will also slide into the groove 47 along with the second ball 26 until the second ball 26 touches the bottom of the groove 47. As the third guide rod 25 moves down, the third ball 27 at the upper end of the third guide rod 25 will also move down. At this time, the hinge plate 23 will also droop down along the hinge due to gravity. The sealed bag body will slide away from the second inclined surface 121 along the drooping hinge plate 23. At this time, the fourth guide rod 21 and the fourth ball 22 will simultaneously touch the first protrusion 49. The contact will cause the fourth guide rod 21 to move up with the lifting frame 14. The upward movement of the lifting frame 14 will release the restriction on the bag body. At this time, the bag body will slide down the drooping hinge plate 23 out of the sliding frame 12 and smoothly enter the next conveying and processing stage.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0061] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer manufacturing loading apparatus, comprising a first worktable (1) and a toothed belt (6), characterized in that: The outer wall of the toothed belt (6) is fixedly connected to a rotating belt (7). The outer wall of the rotating belt (7) is provided with a first sliding groove (8). The inner wall of the first sliding groove (8) is fixedly connected to a first guide rod (9). The outer wall of the first guide rod (9) is slidably connected to a first slider (11). The outer wall of the first slider (11) is fixedly connected to a first spring (10). One end of the first spring (10) is fixedly connected to the inner wall of the first sliding groove (8). The outer wall of the first slider (11) is fixedly connected to a sliding frame (12). The inner wall of the sliding frame (12) has a second inclined surface (121). The inner wall of the sliding frame (12) is hinged to a hinge plate (23). The outer wall of the first workbench (1) has a second sliding groove (13). The inner wall of the second sliding groove (13) is slidably connected to a lifting frame (14). The outer wall of the lifting frame (14) is slidably connected to two second sliders (16). The outer wall of the lifting frame (14) is fitted with a second spring (15). The second spring (15) is fixedly connected to the outer wall of the rotating belt (7).

2. The semiconductor wafer manufacturing loading equipment according to claim 1, characterized in that: A drive motor (3) is fixedly installed on the outer wall of the first workbench (1). A first toothed pulley (5) is fixedly installed at the output end of the drive motor (3). The outer wall of the first toothed pulley (5) is meshed with the toothed belt (6). A second toothed pulley (101) is meshed with the inner wall of the toothed belt (6). The second toothed pulley (101) is rotatably connected to the outer wall of the first workbench (1). The outer wall of the first slider (11) is fixedly connected to a first abutting block (19), and the outer wall of the lifting frame (14) is fixedly connected to a fourth guide rod (21); The end of the fourth guide rod (21) is rotatably connected to a fourth ball bearing (22), and the outer wall of the first worktable (1) is fixedly connected to a first protrusion (49) and a second protrusion (50). The ends of the first protrusion (49) and the second protrusion (50) are both hemispherical.

3. The semiconductor wafer manufacturing loading equipment according to claim 2, characterized in that: The outer wall of the hinge plate (23) is provided with a guide groove (24), and the outer wall of the second slider (16) is provided with a through groove (161). The inner wall of the through groove (161) is fixedly connected with a fourth spring (162). One end of the fourth spring (162) is fixedly connected with a second guide rod (17). The end of the second guide rod (17) is rotatably connected with a first ball (18). The first ball (18) is slidably connected in the guide groove (24).

4. A semiconductor wafer manufacturing loading device according to claim 3, characterized in that: The inner wall of the rotating belt (7) is slidably connected to a third guide rod (25), one end of the third guide rod (25) is rotatably connected to a third ball bearing (27), the other end of the third guide rod (25) is rotatably connected to a second ball bearing (26), the third ball bearing (27) abuts against the outer wall of the hinge plate (23), and the outer wall of the first worktable (1) is fixedly connected to a fixing plate (51), the outer wall of the fixing plate (51) is provided with an upward inclined surface (52); The outer wall of the first workbench (1) is also provided with a groove (47), and two arc surfaces (48) are provided at the opening of the groove (47).

5. A semiconductor wafer manufacturing loading device according to claim 4, characterized in that: The outer wall of the first abutment block (19) is provided with a first inclined surface (20). The outer wall of the first workbench (1) is fixedly connected to a second workbench (291). The outer wall of the second workbench (291) is fixedly connected to a fourth abutment block (43). The outer wall of the fourth abutment block (43) is provided with a fifth inclined surface (44). The outer wall of the second workbench (291) is also fixedly connected to a fifth abutment block (45). The outer wall of the fifth abutment block (45) is provided with a sixth inclined surface (46).

6. A semiconductor wafer manufacturing loading apparatus according to claim 5, characterized in that: The outer wall of the rotating belt (7) is fixedly connected with a plurality of evenly distributed third contact blocks (41), and the outer wall of the third contact block (41) is provided with a fourth inclined surface (42); The inner wall of the second workbench (291) is provided with a horizontal plate (37), and a guide rod (36) is fixedly connected to the inner wall of the second workbench (291). The horizontal plate (37) is slidably sleeved on the outer wall of the guide rod (36).

7. A semiconductor wafer manufacturing loading apparatus according to claim 6, characterized in that: The inner wall of the second workbench (291) is fixedly equipped with a resistance heat melter (38), and the outer wall of the horizontal plate (37) is fixedly connected with a second abutment block (39), and the outer wall of the second abutment block (39) is provided with a third inclined surface (40).

8. A semiconductor wafer manufacturing loading apparatus according to claim 7, characterized in that: The inner wall of the second workbench (291) is fixedly equipped with a second conveyor belt (28) and a third conveyor belt (29).

9. A semiconductor wafer manufacturing loading device according to claim 8, characterized in that: An air pump (30) is fixedly installed on the outer wall of the second workbench (291). The air pump (30) is fixedly connected to a connecting pipe (31). One end of the connecting pipe (31) is fixedly connected to a third slider (32). A third groove (33) is opened on the outer wall of the second workbench (291). The third slider (32) is slidably connected to the inner wall of the third groove (33). A flat air extraction pipe (35) is fixedly connected to the outer wall of the third slider (32).

10. A semiconductor wafer manufacturing loading apparatus according to claim 9, characterized in that: A third spring (34) is fixedly connected to the outer wall of the third slider (32), and one end of the third spring (34) is fixedly connected to the outer wall of the second worktable (291).

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