Heat exchange structure and equipment

Abstract

The invention discloses a heat exchange structure and equipment, and relates to the technical field of heat conduction. When the heat exchange structure is used, an object needing to be subjected to heat treatment or cold treatment is placed on the base plate, then the second side of each lower plate is connected with the temperature source module, in each temperature conduction unit, heat or cold in the temperature source module is transmitted into the corresponding lower plate, and the heat or cold in the corresponding temperature source module is transmitted into the corresponding lower plate; heat or cold is conducted to the first sides of the lower plates and the joints of the first sides of the upper plates through the lower plates, then the heat or the cold is transferred to the upper plates from the joints, and the heat or the cold is transferred to the substrate through the upper plates. According to the heat exchange structure, heat exchange can be achieved, the temperature field is homogenized, and the risk that heat stress of an object subjected to heat treatment or cold treatment is not uniform is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat conduction, in particular to a heat exchange structure and equipment. BACKGROUND

[0002] Heat treatment and cold treatment are basic treatment methods in industry, which are widely used in the processes of material and device forming, assembly and packaging, connection and separation. Non-uniform heat field can easily cause non-uniform thermal stress in the material or device, resulting in serious performance degradation or even safety hazards. Therefore, it is a basic industrial requirement to control the uniformity of temperature field distribution during cold and heat treatment. At present, there is an urgent need for a structure that can make the temperature field uniform during cold and heat treatment. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a heat exchange structure and equipment, which can realize heat exchange and make the temperature field uniform, thereby reducing the risk of non-uniform thermal stress of the object subjected to heat treatment or cold treatment.

[0004] The heat exchange structure according to the first aspect of the present application comprises: a substrate; a temperature conduction assembly, the temperature conduction assembly comprising a plurality of temperature conduction units arranged in sequence, each temperature conduction unit comprising at least two lower plate pieces and at least three upper plate pieces; each lower plate piece of the temperature conduction unit is located below the upper plate piece, and the first side of each lower plate piece and the first side of each upper plate piece are connected to each other; the second side of each upper plate piece is connected to the substrate, and the second side of each lower plate piece is used to connect to a temperature source module; a first interval is formed between the second sides of two adjacent lower plate pieces in the temperature conduction unit; a second interval is formed between the second sides of two adjacent upper plate pieces in the temperature conduction unit.

[0005] According to the heat exchange structure, when the heat exchange structure is used, the object to be heat treated or cold treated is placed on the substrate, and then the second side of each lower plate member is connected with the heat source module. In each temperature conduction unit, the heat or cold in the heat source module is transferred to the lower plate member, and then the heat or cold is conducted to the connection between the first side of each lower plate member and the first side of each upper plate member, and then the heat or cold is transferred from the connection to each upper plate member, and then the heat or cold is transferred to the substrate through the upper plate member. Since the temperature conduction unit is provided with a plurality of temperature conduction units, the heat or cold in the heat source module can be uniformly transferred to the substrate through the temperature conduction unit, so that the temperature of the substrate is uniform, that is, the temperature field of the substrate is homogenized, so that the substrate can heat treat or cold treat the object. Therefore, the heat exchange structure can realize heat exchange and homogenize the temperature field, and reduce the risk of uneven thermal stress of the object to be heat treated or cold treated.

[0006] According to some embodiments of the first aspect of the present application, the temperature conduction assembly is provided with S temperature conduction assemblies, and the S temperature conduction assemblies are sequentially stacked. The second side of each upper plate member of the temperature conduction unit located at the Sth layer is in abutment with the substrate. The second side of the upper plate member of the temperature conduction unit located at the ith layer is in abutment with the second side of the lower plate member of the temperature conduction unit located at the (i+1)th layer. The second side of the plate member of the temperature conduction unit located at the ith layer is in abutment with the second side of the upper plate member of the temperature conduction unit located at the (i-1)th layer. i is a positive integer less than S and greater than 1.

[0007] According to some embodiments of the first aspect of the present application, the connection between the first sides of each lower plate member in the same temperature conduction unit is the same as the first vertical distance between the second sides of each lower plate member in the same temperature conduction unit.

[0008] According to some embodiments of the first aspect of the present application, the connection between the first sides of each upper plate member in the same temperature conduction unit is the same as the second vertical distance between the second sides of each upper plate member in the same temperature conduction unit.

[0009] According to some embodiments of the first aspect of the present application, the number of temperature conduction units located at the ith layer is M, and the number of temperature conduction units located at the (i+1)th layer is 2M.

[0010] According to some embodiments of the first aspect of the present application, the number of lower plate members in the same temperature conduction unit is less than the number of upper plate members.

[0011] According to some embodiments of the first aspect of the present application, the first interval has a width of a first preset distance in a horizontal direction; the second interval has a width of a second preset distance in the horizontal direction; the number of the lower plate members in the temperature conduction unit is 2, and the number of the upper plate members in the temperature conduction unit is 3; the second preset distance of the temperature conduction unit located at the i-th layer is half of the first preset distance of the temperature conduction unit located at the (i-1)-th layer.

[0012] The second aspect of the present application provides a device comprising the heat exchange structure according to any one of the embodiments of the first aspect.

[0013] According to some embodiments of the second aspect of the present application, the temperature source module comprises a plurality of heating rods, and each of the heating rods abuts against the second side of each of the lower plate members of the temperature conduction unit located at the first layer.

[0014] According to some embodiments of the second aspect of the present application, the temperature source module further comprises a cooling pipeline, and each of the cooling pipelines abuts against the second side of each of the lower plate members of the temperature conduction unit located at the first layer, and the cooling pipelines are alternately distributed with the heating rods.

[0015] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be understood through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below in conjunction with the drawings and embodiments, wherein: Figure 1 FIG. 1 is a side view of a heat exchange structure according to an embodiment of the present application; Figure 2 FIG. 2 is a structural schematic view of the heat exchange structure according to an embodiment of the present application; Figure 3 FIG. 3 is a structural schematic view of a temperature conduction unit in the heat exchange structure according to an embodiment of the present application; Figure 4 FIG. 4 is a structural schematic view of a temperature source module according to an embodiment of the present application.

[0017] LIST OF REFERENCES lower plate member 110; upper plate member 120; substrate 200; temperature source module 300; heating rod 310; cooling pipeline 320. DETAILED DESCRIPTION

[0018] Embodiments of the present application are described below in the detailed description and illustrated in the accompanying drawings by which like or similar elements, structures and / or materials may have the same reference numeral. Embodiments described below are examples for the sole purpose of illustration of the application only and are not intended to limit the scope of the only aspects of the application, but to explain ways of carrying out the same.

[0019] In the description of the present application, if the orientation description is involved, for example, the orientation or position relationship indicated by up, down, front, back, left, right and the like is based on the orientation or position relationship shown in the drawings, which is only for the purpose of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0020] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If it is described as first, second, only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0021] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0022] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the description, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0023] The heat treatment refers to heating an object, and the cold treatment refers to cooling the object. The heat treatment and the cold treatment are basic treatment methods in the industry and are widely applied in processes such as material and device forming, assembly and packaging, connection and separation. A non-uniform heat field is easy to cause non-uniform thermal stress in the interior of a material or a device, and to cause serious performance degradation or even safety hazards. Traditional heat field homogenization generally adopts a large and thick heat-conducting material, so that the temperature field is gradually diffused in the heat-conducting material until uniform. Although this method is simple, the heat-conducting material needs to be thick enough to obtain a relatively uniform temperature field. However, the thick heat-conducting material affects the rate of heat transfer, causes poor real-time controllability of temperature control in a process, and the thick heat-conducting plate is heavy, which leads to a heavy final device and high transportation and installation costs.

[0024] Based on this, the application provides a heat exchange structure and device, which can realize heat exchange, make the temperature field uniform, reduce the risk of non-uniform thermal stress of an object subjected to heat treatment or cold treatment, and does not need to use thick heat-conducting material, thereby improving the efficiency of heat transfer, reducing the weight of the device, and reducing the installation cost.

[0025] With reference to Figures 1 to 4 The first aspect embodiment of the application provides a heat exchange structure, which comprises a substrate 200 and a temperature conduction assembly. The temperature conduction assembly comprises a plurality of temperature conduction units arranged in sequence. Each temperature conduction unit comprises at least two lower plate pieces 110 and at least three upper plate pieces 120. Each lower plate piece 110 of the temperature conduction unit is located below the upper plate piece 120. The first side of each lower plate piece 110 and the first side of each upper plate piece 120 are connected to each other. The second side of each upper plate piece 120 is connected to the substrate 200. The second side of each lower plate piece 110 is used to be connected to a heat source module 300.

[0026] The second sides of two adjacent lower plate pieces 110 in the temperature conduction unit form a first interval. The second sides of two adjacent upper plate pieces 120 in the temperature conduction unit form a second interval.

[0027] It is worth noting that when the heat exchange structure is in use, the object to be heat treated or cold treated is placed on the substrate 200, and then the second side of each lower plate piece 110 is connected with the heat source module 300. In each temperature conduction unit, the heat or cold in the heat source module 300 is transferred to the lower plate piece 110, and then the heat or cold is conducted to the connection between the first side of each lower plate piece 110 and the first side of each upper plate piece 120 through each lower plate piece 110, and then the heat or cold is transferred from the connection to each upper plate piece 120, and then the heat or cold is transferred to the substrate 200 through the upper plate piece 120. Since the temperature conduction unit is provided with a plurality of temperature conduction units, the heat or cold in the heat source module 300 can be uniformly transferred to the substrate 200 through the temperature conduction unit, so that the temperature of the substrate 200 is uniform, that is, the temperature field of the substrate 200 is homogenized, so that the substrate 200 can heat treat or cold treat the object. Therefore, the heat exchange structure of the present application can realize heat exchange and homogenize the temperature field, and reduce the risk of uneven thermal stress of the object to be heat treated or cold treated.

[0028] It is worth noting that the width of the first interval in the horizontal direction is a first preset distance; and the width of the second interval in the horizontal direction is a second preset distance.

[0029] It should be noted that the present application does not make specific limitations on the specific values of the first preset distance and the second preset distance, and those skilled in the art can set the values of the first preset distance and the second preset distance according to actual needs.

[0030] In some embodiments, the number of lower plate pieces 110 in the same temperature conduction unit is less than the number of upper plate pieces 120. For example, in one temperature conduction unit, the number of lower plate pieces 110 is 2, and the number of upper plate pieces 120 is 3. In one temperature conduction unit, two lower plate pieces 110 contact the heat source module 300, so two lower plate pieces 110 are equivalent to two heat sources or cold sources, and then the heat or cold is transferred to three upper plate pieces 120, which is equivalent to splitting two heat sources into three heat sources. If the number of temperature conduction units is S, then after M temperature conduction units, it is equivalent to splitting 2S heat sources into 3S heat sources, and 3M heat sources contact the substrate 200, so that the temperature on the substrate 200 is uniform.

[0031] In some embodiments, with reference to Figure 2The temperature conduction assembly is provided with S temperature conduction assemblies, the S temperature conduction assemblies are sequentially stacked, the second side of each upper plate 120 of the temperature conduction unit located at the Sth layer is in abutment with the substrate 200; the second side of the upper plate 120 of the temperature conduction unit located at the ith layer is in abutment with the second side of the lower plate 110 of the temperature conduction unit located at the (i+1)th layer; the second side of the plate of the temperature conduction unit located at the ith layer is in abutment with the second side of the upper plate 120 of the temperature conduction unit located at the (i-1)th layer; i is a positive integer less than S and greater than 1.

[0032] Specifically, the S temperature conduction assemblies are sequentially stacked from bottom to top, the second side of each upper plate 120 of the temperature conduction unit located at the Sth layer is in abutment with the substrate 200, and each lower plate 110 of the temperature conduction unit located at the 1st layer is connected with the heat source module 300. The heat or cold quantity in the heat source module 300 is transmitted to each lower plate 110 of the temperature conduction unit located at the 1st layer, and then the lower plate 110 of the 1st layer transmits the heat or cold quantity to the upper plate 120 of the 1st layer, and then the upper plate 120 of the 1st layer transmits the heat or cold quantity to the lower plate 110 of the temperature conduction unit located at the 2nd layer. In this way, the upper plate 120 of the (i-1)th layer transmits the heat or cold quantity to the lower plate 110 of the ith layer, and the lower plate 110 of the ith layer transmits the cold quantity and the heat to the upper plate 120 of the ith layer. In this way, the heat or cold quantity is gradually transmitted from the heat source module 300 to the substrate 200, so that the temperature field in the substrate 200 is uniform.

[0033] It should be noted that S is a positive integer greater than 2, and the number S of layers of the temperature conduction assembly is not specifically limited in the present application, and a person skilled in the art can set the specific value of S according to actual needs.

[0034] In some embodiments, the connection between the first sides of each lower plate 110 in the temperature conduction unit is the same as the first vertical distance between the second sides of each lower plate 110 in the same temperature conduction unit.

[0035] In some embodiments, the connection between the first sides of each upper plate 120 in the temperature conduction unit is the same as the second vertical distance between the second sides of each upper plate 120 in the same temperature conduction unit.

[0036] It should be noted that the vertical distance refers to the distance in the vertical direction. In the temperature conduction unit, the first vertical distance between the connection and the second side of each lower plate 110 is the same, so the second sides of the respective lower plates 110 are at the same horizontal position. In the temperature conduction unit, the second vertical distance between the connection and the second side of each upper plate 120 in the same temperature conduction unit is the same, so the second sides of the respective upper plates 120 are at the same horizontal position. In this way, the temperature conduction assemblies are stacked, and the temperature conduction assemblies are connected to the heat source module 300 and the substrate 200.

[0037] In some embodiments, the number of temperature conduction units in the i-th layer is M, and the number of temperature conduction units in the i+1-th layer is 2M. In this way, in the heat exchange structure, the number of temperature conduction units in each layer of temperature conduction assemblies gradually increases, and the number of heat source splits gradually increases in the process of heat or cold transfer, so that the heat or cold is uniformly transferred to the substrate 200. It should be noted that the specific value of M is not limited in the present application, and those skilled in the art can set the value of M according to the actual situation. M is a positive integer greater than or equal to 1.

[0038] In some embodiments, the number of lower plates 110 in the temperature conduction unit is 2, and the number of upper plates 120 in the temperature conduction unit is 3; the second preset distance of the temperature conduction unit in the i-th layer is half of the first preset distance of the temperature conduction unit in the i-1-th layer. Therefore, when stacked, each temperature conduction unit in the i-th layer corresponds to two temperature conduction units in the i+1-th layer, so that the size of each layer of temperature conduction units gradually decreases, thereby realizing the gradual increase in the number of temperature conduction units in each layer.

[0039] In some embodiments, the lower plate 110 and the upper plate 120 are both square plates, and are aluminum plates or steel plates. Those skilled in the art can freely set the thickness of the aluminum plate or the steel plate.

[0040] In some embodiments, the temperature conduction unit is composed of three square plates, two square plates are cross-connected, and the other square plate is arranged at the cross-connection. In some other embodiments, referring to Figure 3 , the temperature conduction unit can also be composed of a combination of square plates and arc-shaped plates. One arc-shaped plate is bent to form two upper plates 120, and one square plate is arranged in the middle of the arc-shaped plate as an upper plate 120.

[0041] The second aspect of the present application provides a device comprising the heat exchange structure of any one of the first aspect of the embodiments.

[0042] It is worth noting that, since the device comprises the heat exchange structure of the first aspect, the corresponding contents of the heat exchange structure in the first aspect can be applied to the device of the second aspect, and have the same implementation principles and technical effects. To avoid redundancy of the description, the details are not described here.

[0043] In some embodiments, the device further comprises a temperature source module 300, the temperature source module 300 comprising a plurality of heating rods 310, the heating rods 310 abutting the second side of each lower plate piece 110 of the temperature conduction unit located in the first layer.

[0044] In some embodiments, the temperature source module 300 further comprises a cooling pipe 320, the cooling pipe 320 abutting the second side of each lower plate piece 110 of the temperature conduction unit located in the first layer, the cooling pipe 320 and the heating rod 310 being alternately distributed.

[0045] Specifically, referring to Figure 4 , the cooling pipe 320 is meandered to form a plurality of gaps, and the heating rod 310 is arranged in the gap, so as to realize the alternate distribution of the cooling pipe 320 and the heating rod 310. The second side of each lower plate piece 110 of the temperature conduction unit of the first layer respectively abuts the cooling pipe 320 and the heating rod 310. Since the second side of each lower plate piece 110 of the temperature conduction unit of the first layer respectively abuts the cooling pipe 320 and the heating rod 310, the cooling capacity output by the cooling pipe 320 or the heat output by the heating rod 310 can be transmitted to the substrate 200 through each layer of temperature conduction assembly. Generally, the cooling pipe 320 stops working when the cold gas or condensate is input, and the heating rod 310 stops working when the cooling pipe 320 stops inputting the cooling or condensate. The heating rod 310 can be an electric heating rod 310. The cold gas in the cooling pipe 320 can be cold air.

[0046] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge range of ordinary skilled in the art without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A heat exchange structure, characterized in that, include: substrate; A temperature conduction assembly, comprising a plurality of temperature conduction units arranged sequentially, wherein each temperature conduction unit comprises at least two lower plates and at least three upper plates; Each of the lower plates of the temperature conduction unit is located below the upper plate, and the first side of each of the lower plates and the first side of each of the upper plates are connected to each other; the second side of each of the upper plates is connected to the substrate, and the second side of each of the lower plates is used to connect to the temperature source module. A first gap is formed between the second sides of two adjacent lower plates in the temperature conduction unit; A second gap is formed between the second sides of two adjacent upper plates in the temperature conduction unit.

2. The heat exchange structure according to claim 1, characterized in that, The temperature conduction component is provided in S units, and the S temperature conduction components are stacked in sequence. The second side of each upper plate of the temperature conduction unit located in the Sth layer abuts against the substrate. The second side of the upper plate of the temperature conduction unit located in the i-th layer abuts against the second side of the lower plate of the temperature conduction unit located in the (i+1)-th layer. The second side of the plate of the temperature conduction unit located in the i-th layer abuts against the second side of the upper plate of the temperature conduction unit located in the (i-1)-th layer; i is a positive integer less than S and greater than 1.

3. The heat exchange structure according to claim 1, characterized in that, The connection between the first sides of each of the lower plates in the temperature conduction unit is the same as the first vertical distance between the second sides of each of the lower plates in the same temperature conduction unit.

4. The heat exchange structure according to claim 1, characterized in that, The connection between the first sides of each of the upper plates in the temperature conduction unit is the same as the second vertical distance between the second sides of each of the upper plates in the same temperature conduction unit.

5. The heat exchange structure according to claim 2, characterized in that, The number of temperature conduction units located in the i-th layer is M, and the number of temperature conduction units in the (i+1)-th layer is 2M.

6. The heat exchange structure according to claim 5, characterized in that, The number of lower plates in the same temperature conduction unit is less than the number of upper plates.

7. The heat exchange structure according to claim 5, characterized in that, The width of the first interval in the horizontal direction is a first preset distance; the width of the second interval in the horizontal direction is a second preset distance; the number of the lower plate components in the temperature conduction unit is 2, and the number of the upper plate components in the temperature conduction unit is 3; The second preset distance of the temperature conduction unit located in the i-th layer is half of the first preset distance of the temperature conduction unit located in the (i-1)-th layer.

8. A device, characterized in that, Includes the heat exchange structure as described in any one of claims 1 to 7.

9. The device according to claim 8, characterized in that, It also includes a temperature source module, which includes multiple heating rods that abut against the second side of each lower plate of the temperature conduction unit located in the first layer.

10. The device according to claim 9, characterized in that, The temperature source module also includes cooling pipes, which abut against the second side of each lower plate of the temperature conduction unit located in the first layer, and the cooling pipes and heating rods are distributed alternately.

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