A display method and device based on semiconductor wafer plant layout

Abstract

The application provides a display method and device based on a semiconductor wafer factory layout, relates to the technical field of semiconductors, and can realize dynamic display of the layout in a semiconductor wafer factory. The display method comprises the following steps: obtaining device layout information of a plurality of target devices in the semiconductor wafer factory, and obtaining track layout information of a plurality of track sections in the semiconductor wafer factory; based on the device layout information of the target devices and the track layout information, displaying first layout information of the semiconductor wafer factory; obtaining current state information of the semiconductor wafer factory, wherein the current state information comprises at least one of first state information of the target devices and second state information of each track section in the semiconductor wafer factory; and based on the first layout information and the current state information, displaying second layout information of the semiconductor wafer factory.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a display method and apparatus based on semiconductor wafer fab layout. Background Technology

[0002] With the advancement and development of semiconductor technology, the requirements for production efficiency in semiconductor wafer fabs have increased. In the automated manufacturing workshops of semiconductor wafer fabs, overhead hoist transport (OHT) vehicles are typically used to transfer materials between different machines within the workshop.

[0003] However, as the number of machines in the workshop increases, the complexity of the overhead tracks and ground distribution of the machines in the OHT increases significantly, which makes it more difficult to monitor the machines and overhead tracks in the semiconductor wafer fab and makes it difficult to achieve dynamic display of the layout within the semiconductor wafer fab. Summary of the Invention

[0004] This application provides a display method and apparatus based on the layout of a semiconductor wafer fab, which can realize the dynamic display of the layout within a semiconductor wafer fab, reducing the difficulty of monitoring the machines and overhead tracks within the semiconductor wafer fab.

[0005] A first aspect of this application provides a display method based on semiconductor wafer fab layout, comprising:

[0006] Obtain equipment layout information for multiple target devices within the semiconductor wafer fab, and obtain track layout information for multiple transport track segments within the semiconductor wafer fab;

[0007] Based on the equipment layout information of the target equipment and the track layout information, the first layout information of the semiconductor wafer fab is displayed;

[0008] Obtain the current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target equipment and the second status information of each transport track segment within the semiconductor wafer fab;

[0009] Based on the first layout information and the current status information, the second layout information of the semiconductor wafer fab is displayed.

[0010] In some embodiments, the equipment layout information includes at least one of the type information, size information, and location information of each of the target equipment in the semiconductor wafer fab;

[0011] The track layout information includes at least one of the following: the connection relationship between each target device in the semiconductor wafer fab and the transport track segment; the running direction information of each transport track segment; the connection relationship of each transport track segment; the type information of each transport track segment; and the shape information of each transport track segment.

[0012] In some implementations, displaying the first layout information of the semiconductor wafer fab based on the equipment layout information and the track layout information includes:

[0013] Based on the type information of each target device, first identification information of each target device is determined, wherein different types of target devices correspond to different first identification information;

[0014] Based on the size information of each target device, the first two-dimensional size information of each target device is determined;

[0015] Based on the location information of each target device in the semiconductor wafer fab, determine the two-dimensional coordinate information of each target device;

[0016] Based on the type information of each transport track segment, a second identification information for each transport track segment is determined, wherein different types of transport track segments correspond to different second identification information;

[0017] Based on the shape information of each of the transport track segments, determine the second two-dimensional dimension information of each of the transport track segments;

[0018] Based on the first identification information, the first two-dimensional size information, the two-dimensional coordinate information, the second identification information, the second two-dimensional size information, the connection relationship between each target device and the transport track segment, and the connection relationship between each transport track segment, the first layout information of the semiconductor wafer fab is displayed.

[0019] In some implementations, the first status information includes at least one of the first usage status information and the first operating status information of each of the target devices;

[0020] The second status information includes at least one of the second usage status information and the second operation status information of each of the transport track segments.

[0021] In some implementations, displaying the second layout information of the semiconductor wafer fab based on the first layout information and the current state information includes:

[0022] Based on the first operating status information of each target device, it is determined whether each target device can operate normally;

[0023] When the target device can operate normally, the third identification information of the target device is determined based on the first usage status information of the target device, wherein different first usage status information corresponds to different third identification information;

[0024] Based on the second operating status information of each of the transport track segments, it is determined whether each of the transport track segments can operate normally;

[0025] When the transport track segment can operate normally, the fourth identification information of the transport track segment is determined based on the second usage status information of the transport track segment, wherein different second usage status information corresponds to different fourth identification information;

[0026] If at least one of the target devices cannot operate normally, or if at least one of the transport track segments cannot operate normally, the first layout information shall be corrected.

[0027] Based on the corrected first layout information, the third identification information, and the fourth identification information, the second layout information of the semiconductor wafer fab is displayed.

[0028] In some embodiments, the display method based on semiconductor wafer fab layout further includes:

[0029] Obtain the starting and ending target equipment for the target transportation task;

[0030] Based on the starting point target device, the ending point target device, and the current status information, the target transportation route is displayed.

[0031] In some implementations, displaying the target transportation route based on the originating target device, the destination target device, and the current status information includes:

[0032] Based on the transport track segment connected to the starting target device, the transport track segment connected to the ending target device, the connection relationship between each transport track segment, and the running direction of each transport track segment, a first transport path is determined;

[0033] Based on the second operating status information of each of the transport track segments and the first transport path, a second transport path is determined;

[0034] If there are multiple second transport routes, the shortest second transport route is determined as the target transport route.

[0035] In some embodiments, the display method based on semiconductor wafer fab layout further includes:

[0036] Based on the current status information, determine the target maintenance location of the equipment to be inspected;

[0037] Based on the target maintenance location and the equipment layout information, the target maintenance path is displayed.

[0038] In some implementations, obtaining the current status information of the semiconductor wafer fab includes:

[0039] To determine the location of the fault in the transport device on the transport track section within the semiconductor wafer fab;

[0040] Based on the location of the fault and the connection relationship of each of the transport track segments, the transport track segment that has stopped operating is determined;

[0041] Based on the connection relationship between the transport track segment and the target equipment, the target equipment that has been stopped is determined;

[0042] The current status information is determined based on the stopped transport track segment and the stopped target equipment.

[0043] The second aspect provided in this application embodiment provides a display device based on a semiconductor wafer fab layout, comprising:

[0044] The first acquisition module is used to acquire equipment layout information of multiple target devices within the semiconductor wafer fab, and to acquire track layout information of multiple transport track segments within the semiconductor wafer fab.

[0045] The first display module is used to display the first layout information of the semiconductor wafer fab based on the equipment layout information and the track layout information;

[0046] The second acquisition module is used to acquire the current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target equipment and the second status information of each transport track segment within the semiconductor wafer fab.

[0047] The second display module is used to display the second layout information of the semiconductor wafer fab based on the first layout information and the current status information.

[0048] This application provides a display method and apparatus based on the layout of a semiconductor wafer fab. By acquiring equipment layout information of target devices and track layout information of transport sections within the semiconductor wafer fab, a first layout information of the semiconductor wafer fab can be displayed based on the physical layout within the semiconductor wafer fab. Furthermore, by dynamically acquiring the first state information of the target devices and the second state information of the transport sections within the semiconductor wafer fab, the first layout information is adjusted based on the current state information to generate second layout information. This enables dynamic monitoring within the semiconductor wafer fab and visualization of equipment state changes, further reducing the monitoring and management complexity of the semiconductor wafer fab. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 A schematic flowchart illustrating a display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0051] Figure 2 A partial schematic diagram of the first layout information provided for a display method based on semiconductor wafer fab layout according to an embodiment of this application;

[0052] Figure 3 A schematic flowchart illustrating another display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0053] Figure 4 A schematic flowchart illustrating yet another display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0054] Figure 5 A schematic flowchart illustrating another display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0055] Figure 6 A schematic flowchart illustrating a display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0056] Figure 7 A schematic flowchart illustrating another display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0057] Figure 8A schematic flowchart illustrating yet another display method based on semiconductor wafer fab layout provided in an embodiment of this application;

[0058] Figure 9 This is a schematic structural diagram of a display device based on a semiconductor wafer fab layout, provided as an embodiment of this application. Detailed Implementation

[0059] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0061] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0062] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0063] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0064] like Figure 1 As shown, a first aspect of this application provides a display method based on semiconductor wafer fab layout, comprising:

[0065] Step S110: Obtain equipment layout information of multiple target devices within the semiconductor wafer fab, and obtain track layout information of multiple transport track segments within the semiconductor wafer fab.

[0066] For example, after the target equipment and transport track sections are set up within the semiconductor wafer fab, image acquisition can be performed within the semiconductor wafer fab to obtain equipment layout information and track layout information. Alternatively, the location and product model of the target equipment can be marked simultaneously with the setting up of the target equipment and transport track sections within the semiconductor wafer fab.

[0067] For example, when obtaining track layout information of multiple transport track segments within a semiconductor wafer fab, the transport tracks within the semiconductor wafer fab can be divided into multiple transport track blocks, and a transport track block can be further divided into multiple transport track units line_index.

[0068] For example, such as Figure 2As shown, a unified coordinate system is first established, and the absolute origin coordinates (0, 0) are determined. Here, the location of block 325_26, with the transport track unit line_index of 71, is taken as the origin (0, 0), with the horizontal axis as x and the vertical axis as y. At this point, the track's travel direction is consistent with the x-axis. Then, the actual coordinates of all line_indexes within the initial block are calculated.

[0069] For example, in calculating the actual coordinates of the line_index of each transport track unit, the actual coordinates of the line_index of each transport track unit are first calculated. For instance, for the current transport track segment current_block, current_block = 325_26, the current transport track unit current_line_index = 71, the starting coordinates (x_start, y_start) = (0, 0), at this time the track travel direction is consistent with the positive x-axis direction, denoted as: dire = x + , the ending coordinates of the track travel are (x_end, y_end), calculated according to the formula x_end = x_start + line_length, y_end = y_start, where line_length is the length of the transport track unit. When the track is curved, the deflection angle is calculated as: angle = end_angle - start_angle, where end_angle is the deflection angle corresponding to the ending coordinate, and start_angle is the deflection angle corresponding to the starting coordinate.

[0070] For example, the actual coordinates of each transport track unit's line_index within the same block are sorted. For instance, if the number of transport track units' line_index is n, the process iterates from i=2 to n, marking the block as visited after each iteration. After traversing one block, the actual coordinates of each transport track unit's line_index within the remaining blocks are determined.

[0071] Specifically, when traversing the actual coordinates of the transport track unit line_index, the starting coordinates (x_start, y_start) and ending coordinates (x_end, y_end) of the traversal start point can be set based on the principle of connecting the beginning and end. The starting coordinates (x_start i-1, y_start i-1), ending coordinates (x_end i-1, y_end i-1), starting coordinates (x_start i, y_start i), and ending coordinates (x_endi, y_end i) of the transport track unit sorted i-1 can be set. Track_type i represents the type of the transport track unit sorted i, and Track_type i-1 represents the type of the transport track unit sorted i-1. The type Track_type is 0, which indicates a straight track, and Track_type is 1, which indicates a curved track.

[0072] When Track_type i-1 = Track_type i = 0, x_start i = x_end i-1 and y_start i = y_end i-1. The track travel direction dire i-1 of the sorted i-1 transport track unit is obtained. When dire i-1 = x+, then x_end i = x_start i + line_length and y_end i = y_start i, where line_length is the length of the sorted i transport track unit. When dire i-1 = x-, then x_end i = x_start i - line_length and y_end i = y_start i. When dire i-1 = y+, then x_end i = x_start i and y_end i = y_start i + line_length. When dire i-1 = y-, then x_end i = x_start i and y_end i = y_start i - line_length. In this case, the running direction is the same as i-1.

[0073] When Track_type i-1 = 0 and Track_type i = 1, if dire i-1 = x+ and the deflection angle angle i of the transport track unit of sorted i is > 0, then x_start i = x_end i-1 – radius i×cos|angle i |, y_start i = y_end i-1 + radius i×sin |angle i|, and the track travel direction of the transport track unit of sorted i is dire i = y+; radius i is the radius of the transport track unit of sorted i. When dire i-1 = x- and angle i < 0, x_start i = x_end i-1 + radius i×cos |angle i |, y_start i = y_end i-1 + radius i×sin |angle i|, and dire i = y+. When dire i-1 =X+, angle i <0, x_start i= x_end i-1 – radius i×cos |angle i|, y_start i= y_end i-1 – radius i×sin |angle i|, then dire i=y-. When dire i-1 =X-, angle i >0, x_start i= x_end i-1 + radius i×cos |angle i|, y_start i= y_end i-1 -radius i×sin |angle i|, then dire i=y-. When dire i-1 =y+, angle i >0, x_start i = x_end i-1 – radius i×sin |angle i|, y_start i= y_end i-1 – radius i×cos |angle i|, then dire i=x-. When dire i-1 =y-, angle i <0, x_start i = x_end i-1-radius i×sin|angle i|, y_start i =y_end i-1+radius i×cos|angle i|, then dire i=x-. When dire i-1 =y+, angle i <0, x_start i = x_end i-1 + radius i×sin|angle i|, y_start i= y_ end i-1-radius i×cos|angle i|, then dire i=x+.When dire i−1 = y−, angle i > 0, x_start i = x_end i−1 + radius i × sin|angle i|, y_start i = y_end i−1 + radius i × cos|angle i|, and at this time dire i = x+.

[0074] When Track_type i - 1 = 1 and Track_type i = 0, when dire i - 1 = x + and the deflection angle angle i - 1 of the transportation track unit of sorting i - 1 < 0, x_start i = x_start i - 1 - radius i - 1 × cos|angle i - 1|, y_start i = y_start i - 1 + radius i - 1 × sin|angle i - 1|, x_end i = x_start i + line_length × sin|angle i|, y_end i = y_start i + line_length × cos|angle i|, and at this time dire i = x +. When dire i - 1 = x - and angle i - 1 > 0, x_start i = x_start i - 1 + radius i - 1 × cos|angle i - 1|, y_start i = y_start i - 1 + radius i - 1 × sin|langle i - 1|, x_end i = x_start i - line_length × sin|angle i|, y_end i = y_start i + line_length × cos|angle i|, and at this time dire i = x -. When dire i - 1 = x - and angle i - 1 < 0, x_start i = x_start i - 1 + radius i - 1 × cos|angle i - 1|, y_start i = y_start i - 1 - radius i - 1 × sin|angle i - 1|, x_end i = x_start i - line_length × sin|angle i|, y_end i = y_start i - line_length × cos|angle i|, and at this time dire i = x -. When dire i - 1 = x + and angle i - 1 > 0, x_start i = x_start i - 1 - radius i - 1 × cos|angle i - 1|, y_start i = y_start i - 1 - radius i - 1 × sin|angle i - 1|, x_end i = x_start i + line_length × sin|angle i|, y_end i = y_start i - line_length × cos|angle i|, and at this time dire i = x +.When dire i−1 = y− and angle i−1 < 0, x_start i = x_start i−1 + radius i−1×sin |angle i−1|, y_start i = y_start i−1 + radius i−1×cos |angle i−1|, x_end i = x_start i + line_length×cos |angle i|, y_end i = y_start i − line_length×sin |angle i|, and at this time dire i = y−. When dire i−1 = y+ and angle i−1 > 0, x_start i = x_start i−1 + radius i−1×sin |angle i−1|, y_start i = y_start i−1 - radius i−1×cos |angle i−1|, x_end i = x_start i + line_length×cos |angle i|, y_end i = y_start i + line_length×sin |angle i|, and at this time dire i = y+. When dire i−1 = y+ and angle i−1 < 0, x_start i = x_start i−1 - radius i−1×sin |angle i−1|, y_start i = y_start i−1 - radius i−1×cos |angle i−1|, x_end i = x_start i - line_length×cos |angle i|, y_end i = y_start i + line_length×sin |angle i|, and at this time dire i = y+. When dire i−1 = y− and angle i−1 > 0, x_start i = x_start i−1 - radius i−1×sin |angle i−1|, y_start i = y_start i−1 + radius i−1×cos |angle i−1|, x_end i = x_start i − line_length×cos |angle i|, y_end i = y_start i - line_length×sin |angle i|, and at this time dire i = y−.

[0075] When Track_type i-1 = Track_type i=1, the final track deflection angle is generally 90 degrees. When (dire i-1=y-, angle i-1<0) or (dire i-1 =y+, angle i-1>0), x_starti = x_starti-1 +2×radius i, y_starti = y_starti-1, at this time dire i =x+; when (direi-1 =y+, angle i-1 <0) or (dire i-1=y-, angle i-1>0), x_starti = x_starti-1-2×radius i, y_starti = y_starti-1, at this time dire i =x-. When (dire i-1=x-, angle i-1 <0) or (dire i-1=x+, angle i-1 >0), x_start i= x_start i-1, y_start i=y_start i-1-2×radius i, then dire i=y-. When (dire i-1= x +, angle i-1<0) or (dire i-1 =x-, angle i-1>0), x_start i= x_start i-1, y_start i= y_start i-1-2×radius i, then dire i=y+.

[0076] For example, a doubly linked queue can be established based on the first-in, first-out (FIFO) principle to form a dictionary `vis` representing whether a block has been visited. A visited block is set to `true`, and an unvisited block is set to `false`. Both are initialized to `false`. Since the actual coordinates of `current_block` have already been calculated, `vis[current_block] = true`. Substituting `current_block` into the block association table reveals `next_block`, which is then added to the queue. When the queue is not empty, a block is retrieved from it (`current_block = queue.popleft()`), and `vis` is checked: if `vis[current_block] = true`, the loop exits. If `vis[current_block] = false`, the `line_index` corresponding to the current block is sorted from smallest to largest, and its number `n` is obtained, so `current_line_index = line_index[0]`. The track type, running direction, and deflection angle of the last `line_index` corresponding to the previous block are then obtained. The process iterates through each block, calculates the actual coordinates of each line_index within the block, and marks the block after each iteration by writing vis[current_block]=true. The iteration ends when the queue is empty.

[0077] Step S120: Based on the equipment layout information and track layout information of the target equipment, display the first layout information of the semiconductor wafer fab.

[0078] It should be noted that the first layout information refers to the layout information of the target equipment and transport track segments within the semiconductor wafer fab.

[0079] For example, the first layout information of a semiconductor wafer fab can be displayed by drawing a layout diagram within the semiconductor wafer fab.

[0080] For example, during the generation of machine layout information, the data information can be preprocessed. This includes preparing the actual track coordinates, a table of distances from equipment to blocks, a list of equipment to be calculated, and the line_index corresponding to all blocks, sorting them from smallest to largest, and generating a dictionary for easy access.

[0081] For example, in calculating the length corresponding to line_index, the track type of line_index is first determined, specifically line_index can be divided into straight track and curved track. When the track type of line_index is straight track, the starting coordinates of line_index are recorded as (x0, y0) and the ending coordinates as (x1, y1). According to the distance formula: line_index = When the line_index track type is curved, let the line_index radius be r, the starting angle be a, and the ending angle be b. According to the curve length formula: line_index = r × (b - a) × π / 180. Then, sum the lengths of all line_indexes within the same block. Take devices sequentially from the device list and iterate through the line_indexes of the block containing each device, calculating the line_length (n). Sum the lengths of all line_indexes: sum = ... line_length i. Then, based on the length sum, compare sum with offset_distance. If sum < offset_distance, continue the summation process; if sum ≥ offset_distance, determine the starting coordinate of line_index at k-1 (…). , ) to the destination coordinates ( , Is the change in the x-direction or the y-direction? If the change is in the x-direction, when... When the value is greater than 0, the equipment coordinates are (equipment_x, equipment_y), equipment_x = +(offset_distance-sum),equipment_y= ,when When <0, then equipment_x= -(offset_distance - line_length). If the change is in the y-direction, when When >0, equipment_x= equipment_y= +(offset_distance-line_length), when When <0, equipment_x= equipment_y= -(offset_distance-line_length).

[0082] Step S130: Obtain the current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target equipment and the second status information of each transport track segment within the semiconductor wafer fab.

[0083] For example, the current status information of a semiconductor wafer fab can be acquired periodically. This can be achieved by communicating with target equipment to obtain usage status information reported by the target equipment, such as fault information, processing progress information, and queuing information. Furthermore, congestion and fault information for each transport track segment within the semiconductor wafer fab can be determined by acquiring image information of each transport track segment.

[0084] Step S140: Based on the first layout information and the current status information, display the second layout information of the semiconductor wafer fab.

[0085] For example, if the current status information is inconsistent with the initial status information of the target device and transport track segment displayed in the first layout information, the current status information can be updated to the corresponding position in the first layout information to obtain the second layout information.

[0086] The display method based on semiconductor wafer fab layout provided in this application, by setting and acquiring equipment layout information of target devices and track layout information of transport tracks within the semiconductor wafer fab, can display first layout information within the semiconductor wafer fab based on the physical layout within the semiconductor wafer fab. Furthermore, by dynamically acquiring first state information of target devices and second state information of transport tracks within the semiconductor wafer fab, and adjusting the first layout information based on the current state information to generate second layout information, dynamic monitoring within the semiconductor wafer fab can be achieved, enabling visualization of equipment state changes within the semiconductor wafer fab, and further reducing the monitoring and management complexity of the semiconductor wafer fab.

[0087] In some feasible implementations, the equipment layout information includes at least one of the following: type information, size information, and location information of each target equipment in the semiconductor wafer fab; the track layout information includes at least one of the following: connection relationship between each target equipment and transport track segment in the semiconductor wafer fab, running direction information of each transport track segment, connection relationship between each transport track segment, type information of each transport track segment, and shape information of each transport track segment.

[0088] For example, the type information of the target device may include the function and model of the target device, and the size and function of the target type can be determined by obtaining the type information of the target device.

[0089] For example, the scaling ratio of the first layout information can be determined based on the ratio between the size of the displayed semiconductor wafer fab image and the size information of the target device, and a block diagram of the target device within the semiconductor wafer fab can be drawn based on the scaling ratio, the size information of the target device, and the location information of the target device in the semiconductor wafer fab.

[0090] For example, the shape information of the transport track segment may include the length, width, and radius of curvature of the transport track segment. A line drawing schematic diagram of each transport track segment within the semiconductor wafer fab can be drawn based on the shape information of the transport track segment and the scaling ratio of the semiconductor wafer fab.

[0091] The display method based on semiconductor wafer fab layout provided in this application determines first layout information through equipment layout information and track layout information, which can improve the accuracy and comprehensiveness of the first layout information, thereby further improving the monitoring quality of semiconductor wafer fabs and reducing the monitoring and management difficulty of semiconductor wafer fabs.

[0092] like Figure 3 As shown, in some feasible implementations, based on the equipment layout information and track layout information of the target equipment, the first layout information of the semiconductor wafer fab is displayed, including:

[0093] Step S210: Based on the type information of each target device, determine the first identification information of each target device, wherein different types of target devices correspond to different first identification information.

[0094] For example, the first identification information is used to characterize the type information of the target device. For instance, different colors of identification are used to display the target devices with different functions.

[0095] Step S220: Based on the size information of each target device, determine the first two-dimensional size information of each target device.

[0096] For example, the first two-dimensional size information is determined by the scaling ratio corresponding to the size information of the target device and the first layout information.

[0097] Step S230: Based on the location information of each target device in the semiconductor wafer fab, determine the two-dimensional coordinate information of each target device.

[0098] Step S240: Based on the type information of each transport track segment, determine the second identification information of each transport track segment, wherein different types of transport track segments correspond to different second identification information.

[0099] For example, the second identification information is used to characterize the operating direction, track width, and track type of the transport track segment. For instance, different colored identifiers can be used to display transport track segments with different operating directions or different types.

[0100] Step S250: Based on the shape information of each transport track segment, determine the second two-dimensional dimension information of each transport track segment.

[0101] Step S260: Based on the first identification information, the first two-dimensional dimension information, the two-dimensional coordinate information, the second identification information, the second two-dimensional dimension information, the connection relationship between each target device and the transport track segment, and the connection relationship between each transport track segment, display the first layout information of the semiconductor wafer fab.

[0102] The layout display method for semiconductor wafer fabs provided in this application improves the intuitiveness and convenience of the first layout information by displaying different first identification information for different types of target equipment and different second identification information for different types of transport track segments. This facilitates a quick understanding of the layout within the semiconductor wafer fab through the first layout information and reduces the difficulty of identifying different target equipment and different transport track segments. Consequently, it further improves the monitoring quality of semiconductor wafer fabs and reduces the monitoring and management difficulties.

[0103] In some feasible implementations, the first status information includes at least one of the first usage status information and the first operating status information of each target device; the second status information includes at least one of the second usage status information and the second operating status information of each transport track segment.

[0104] For example, the first usage status information may include the current queuing information and current usage status information of the target device, and the idle status of the target device can be displayed using different colors or shapes of icons. The first operational status information can be determined by fault information sent by the target device, and the fault status and fault time of the target device can be displayed using different colors or shapes of icons. The second usage status information may include the occupancy and congestion status of the transport track segment, and the second status information can be displayed using different colors or shapes of icons. The second operational status information may include fault information of the transport track segment, which can be determined by acquiring images of the transport track segment or by the operating speed of the transport crane on the transport track segment.

[0105] The layout display method for semiconductor wafer fabs provided in this application collects first and second state information as the current state information of the semiconductor wafer fab. This allows for real-time monitoring of the usage and operation status of target equipment and transport track sections within the semiconductor wafer fab, thereby improving the comprehensiveness of the current usage status information and further enhancing the practicality and comprehensiveness of the second layout information. Ultimately, this improves the monitoring quality of the semiconductor wafer fab and reduces the monitoring and management difficulties.

[0106] like Figure 4 As shown, in some feasible implementations, based on the first layout information and the current state information, the second layout information of the semiconductor wafer fab is displayed, including:

[0107] S310. Based on the first operating status information of each target device, determine whether each target device can operate normally.

[0108] For example, when the first operating status information includes fault information sent by the target device, it can be determined whether each target device can operate normally based on whether the target device is currently malfunctioning or the impact of the malfunction on the operation of the target device.

[0109] S320. When the target device can operate normally, the third identification information of the target device is determined based on the first usage status information of the target device, wherein different first usage status information corresponds to different third identification information.

[0110] For example, the first usage status information includes the target device's current queuing information and current usage status information, etc. Different third identification information can be selected according to the target device's idle level, so as to determine whether the target device can be directly called by observation.

[0111] S330. Based on the second operating status information of each transport track segment, determine whether each transport track segment can operate normally.

[0112] For example, when the second operating status information includes fault information of the transport track segment, it can be determined whether each transport track segment can operate normally based on whether a fault has occurred in the transport track segment or the impact of the fault on the transport capacity of the transport track segment.

[0113] The second usage status information may include the occupancy and congestion status of the transport track segment, which can be displayed using different colors or shapes of markers. The second operational status information may include fault information of the transport track segment, which can be determined by acquiring images of the transport track segment or by the operating speed of the overhead crane on the transport track segment.

[0114] S340. When the transport track segment can operate normally, the fourth identification information of the transport track segment is determined based on the second usage status information of the transport track segment, wherein different second usage status information corresponds to different fourth identification information.

[0115] For example, when the second usage status information includes the occupancy and congestion status of the transport track segment, different fourth identification information can be selected according to the availability of the transport track segment, so as to determine by observation whether the transport track segment can allow the transport device to pass through, and the passage time, etc.

[0116] S350. If at least one target device cannot operate normally, or at least one transport track segment cannot operate normally, the first layout information is corrected.

[0117] For example, different identifiers or explanatory labels can be used to display target equipment or transport track segments that are not functioning properly. Alternatively, based on the initial layout information, the display of relevant information about target equipment or transport track segments that are not functioning properly can be removed.

[0118] S360, based on the corrected first layout information, third identification information and fourth identification information, displays the second layout information of the semiconductor wafer fab.

[0119] The semiconductor wafer fab layout display method provided in this application corrects and adjusts the first layout information based on the usage and operation status information of the target equipment and transport track sections, so as to dynamically adjust the displayed second layout information in real time. This can further improve the comprehensiveness of the second layout information, making it easier to directly understand the current operating status within the semiconductor wafer fab by observing the second layout information. This further improves the monitoring quality of the semiconductor wafer fab and reduces the monitoring and management difficulties.

[0120] like Figure 5 As shown, in some feasible implementations, the display method based on semiconductor wafer fab layout further includes:

[0121] Step S410: Obtain the starting point target equipment and the ending point target equipment of the target transportation task.

[0122] For example, upon receiving a target transportation task, the originating target device and the destination target device can be determined by reading the target transportation task. The target transportation path may include the originating target device, the destination target device, the transportation track segments traversed along the transportation path, and the running direction of each transportation track segment. The originating target device and the destination target device may be displayed using different identifiers.

[0123] Step S420: Display the target transportation route based on the starting point target device, the ending point target device, and the current status information.

[0124] The display method based on semiconductor wafer fab layout provided in this application, upon receiving a target transportation task, visualizes the transportation path by displaying the target transportation route. Highlighting the target transportation route facilitates evaluation of its selection and verifies the planning quality. Furthermore, by enhancing the display of the target transportation route, the transportation process of the target task can be observed more easily, thereby improving the monitoring quality of the semiconductor wafer fab and reducing the monitoring and management complexity.

[0125] like Figure 6 As shown, in some feasible implementations, the target transportation path is displayed based on the origin target device, the destination target device, and the current status information, including:

[0126] Step S510: Determine the first transportation path based on the transportation track segment connected to the starting target equipment, the transportation track segment connected to the ending target equipment, the connection relationship between each transportation track segment, and the running direction of each transportation track segment.

[0127] For example, the first transport path may include all transport paths that enable connectivity from the originating target device to the destination target device.

[0128] Step S520: Determine the second transportation path based on the second operating status information of each transportation track segment and the first transportation path.

[0129] For example, determining the second transportation path based on the second operating status information of each transportation track segment and the first transportation path may include reading the second operating status information of each transportation track segment on the first transportation path, removing first transportation paths with transportation track segments that cannot operate normally, and filtering out all first transportation paths that can be completed as the second transportation path.

[0130] Step S530: If there are multiple second transportation routes, determine the shortest second transportation route as the target transportation route.

[0131] For example, when there are multiple second transportation routes, the total transportation time corresponding to each second transportation route can be predicted based on the second usage status information of each transportation track segment on the second transportation route, and the congestion and queuing status of each transportation track segment in the second usage status information. Thus, the second transportation route with the shortest transportation time can be determined as the target transportation route.

[0132] The display method based on semiconductor wafer fab layout provided in this application initially determines a first passable transportation path based on the connection relationship and running direction between each transportation track segment, as well as the connection relationship between the starting target equipment and the ending target equipment and the transportation track segment. The first transportation path is then filtered according to second usage status information to obtain a second transportation path. Furthermore, based on the path length, the shortest second transportation path is selected as the target transportation path. This ensures the throughput of the target transportation path, saves transportation costs, shortens transportation time, and thus improves the management quality of the semiconductor wafer fab.

[0133] like Figure 7 As shown, in some feasible implementations, the display method based on semiconductor wafer fab layout further includes:

[0134] Step S610: Based on the current status information, determine the target maintenance location of the target equipment to be maintained.

[0135] Step S620: Display the target maintenance path based on the target maintenance location and equipment layout information.

[0136] It should be noted that in semiconductor wafer fabs, target equipment is usually located on the ground, while transport tracks are usually located on the top of the semiconductor wafer fab.

[0137] For example, the target maintenance path can be the shortest path between the starting point of the maintenance personnel's actions and the target maintenance location of the equipment to be maintained.

[0138] The display method based on semiconductor wafer fab layout provided in this application can determine the target equipment to be repaired by using the current status information of the target equipment, and further determine the target repair location by combining it with the first layout information. Thus, when the target equipment needs repair, the method displays the target repair path that repair personnel will take on the ground to reach the target equipment, based on the equipment layout information. This reduces the difficulty of repair in semiconductor wafer fabs, improves repair efficiency, and ultimately enhances the management quality of semiconductor wafer fabs.

[0139] like Figure 8 As shown, in some feasible implementations, obtaining the current status information of the semiconductor wafer fab includes:

[0140] Step S710: Obtain the fault location of the transport device on the transport track section within the semiconductor wafer fab.

[0141] Step S720: Based on the fault location and the connection relationship of each transport track segment, determine the transport track segment that has stopped operating.

[0142] Step S730: Based on the connection relationship between the transport track segment and the target equipment, determine the target equipment to be stopped.

[0143] Step S740: Determine the current status information based on the stopped transport track segment and the stopped target equipment.

[0144] It should be noted that if the target equipment is operating normally and the transport track section is undeformed and can be passed normally, a malfunction or shutdown of the transport device on the transport track section will cause the current transport track section to become impassable. This will further cause the transport track sections connected to the current transport track section to become impassable, and will also cause the target equipment connected to the impassable transport track section to become unusable.

[0145] The display method based on semiconductor wafer fab layout provided in this application, when a transport device malfunctions and stops operating on a transport track section within a semiconductor wafer fab, determines the impact of the malfunction on the accessibility of the transport track section based on the location of the malfunction, thereby identifying the transport track section that needs to be shut down due to the malfunction. Furthermore, by analyzing the connection relationship between the stopped transport track section and target equipment, the method determines the impact of the stopped transport track section on the input or output of the connected target equipment, thereby identifying the target equipment that is rendered unusable due to the stopped transport track section. Further refining the current status information of the semiconductor wafer fab based on the malfunction and stoppage of the transport device on the transport track section can improve the accuracy of the current status information, enhance the timeliness and accuracy of dynamic monitoring of the semiconductor wafer fab layout, improve the monitoring quality of the semiconductor wafer fab, and reduce the monitoring and management difficulties of the semiconductor wafer fab.

[0146] like Figure 9 As shown in the second aspect of this application, a display device based on a semiconductor wafer fab layout is provided, comprising: a first acquisition module 100, a first display module 200, a second acquisition module 300, and a second display module 400. The first acquisition module 100 is used to acquire equipment layout information of multiple target devices within the semiconductor wafer fab, and to acquire track layout information of multiple transport track segments within the semiconductor wafer fab; the first display module 200 is used to display first layout information of the semiconductor wafer fab based on the equipment layout information of the target devices and the track layout information; the second acquisition module 300 is used to acquire current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target devices and the second status information of each transport track segment within the semiconductor wafer fab; the second display module 400 is used to display second layout information of the semiconductor wafer fab based on the first layout information and the current status information.

[0147] The display device based on the layout of a semiconductor wafer fab provided in this application, by acquiring equipment layout information of target equipment and track layout information of transport tracks within the semiconductor wafer fab, can display first layout information within the semiconductor wafer fab based on the physical layout within the semiconductor wafer fab. Furthermore, by dynamically acquiring first state information of the target equipment and second state information of the transport tracks within the semiconductor wafer fab, and adjusting the first layout information based on the current state information to generate second layout information, dynamic monitoring within the semiconductor wafer fab can be achieved, enabling visualization of equipment state changes within the semiconductor wafer fab, and further reducing the monitoring and management complexity of the semiconductor wafer fab.

[0148] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0149] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0150] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display method based on semiconductor wafer fab layout, characterized in that, include: Obtain equipment layout information for multiple target devices within the semiconductor wafer fab, and obtain track layout information for multiple transport track segments within the semiconductor wafer fab; Based on the equipment layout information and the track layout information, the first layout information of the semiconductor wafer fab is displayed; Obtain the current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target equipment and the second status information of each transport track segment within the semiconductor wafer fab; Based on the first layout information and the current status information, the second layout information of the semiconductor wafer fab is displayed; in, The equipment layout information includes the type information, size information, and location information of each target device in the semiconductor wafer fab; The track layout information includes the connection relationship between each target device in the semiconductor wafer fab and the transport track segment, the running direction information of each transport track segment, the connection relationship of each transport track segment, the type information of each transport track segment, and the shape information of each transport track segment; the first layout information of the semiconductor wafer fab based on the device layout information and the track layout information includes: Based on the type information of each target device, first identification information of each target device is determined, wherein different types of target devices correspond to different first identification information; Based on the size information of each target device, the first two-dimensional size information of each target device is determined; Based on the location information of each target device in the semiconductor wafer fab, determine the two-dimensional coordinate information of each target device; Based on the type information of each transport track segment, a second identification information for each transport track segment is determined, wherein different types of transport track segments correspond to different second identification information; Based on the shape information of each of the transport track segments, determine the second two-dimensional dimension information of each of the transport track segments; Based on the first identification information, the first two-dimensional size information, the two-dimensional coordinate information, the second identification information, the second two-dimensional size information, the connection relationship between each target device and the transport track segment, and the connection relationship between each transport track segment, the first layout information of the semiconductor wafer fab is displayed; The step of obtaining the current status information of the semiconductor wafer fab includes: To determine the location of the fault in the transport device on the transport track section within the semiconductor wafer fab; Based on the location of the fault and the connection relationship of each of the transport track segments, the transport track segment that has stopped operating is determined; Based on the connection relationship between the transport track segment and the target equipment, the target equipment that has been stopped is determined; The current status information is determined based on the stopped transport track segment and the stopped target equipment.

2. The display method based on semiconductor wafer fab layout according to claim 1, characterized in that, The first status information includes at least one of the first usage status information and the first operating status information of each of the target devices; The second status information includes at least one of the second usage status information and the second operation status information of each of the transport track segments.

3. The display method based on semiconductor wafer fab layout according to claim 2, characterized in that, The step of displaying the second layout information of the semiconductor wafer fab based on the first layout information and the current status information includes: Based on the first operating status information of each target device, it is determined whether each target device can operate normally; When the target device can operate normally, the third identification information of the target device is determined based on the first usage status information of the target device, wherein different first usage status information corresponds to different third identification information; Based on the second operating status information of each of the transport track segments, it is determined whether each of the transport track segments can operate normally; When the transport track segment can operate normally, the fourth identification information of the transport track segment is determined based on the second usage status information of the transport track segment, wherein different second usage status information corresponds to different fourth identification information; If at least one of the target devices cannot operate normally, or if at least one of the transport track segments cannot operate normally, the first layout information shall be corrected. Based on the corrected first layout information, the third identification information, and the fourth identification information, the second layout information of the semiconductor wafer fab is displayed.

4. The display method based on semiconductor wafer fab layout according to claim 3, characterized in that, Also includes: Obtain the starting and ending target equipment for the target transportation task; Based on the starting point target device, the ending point target device, and the current status information, the target transportation route is displayed.

5. The display method based on semiconductor wafer fab layout according to claim 4, characterized in that, The step of displaying the target transportation route based on the starting point target device, the ending point target device, and the current status information includes: Based on the transport track segment connected to the starting target device, the transport track segment connected to the ending target device, the connection relationship between each transport track segment, and the running direction of each transport track segment, a first transport path is determined; Based on the second operating status information of each of the transport track segments and the first transport path, a second transport path is determined; If there are multiple second transport routes, the shortest second transport route is determined as the target transport route.

6. The display method based on semiconductor wafer fab layout according to claim 1, characterized in that, Also includes: Based on the current status information, determine the target maintenance location of the equipment to be inspected; Based on the target maintenance location and the equipment layout information, the target maintenance path is displayed.

7. A display device based on a semiconductor wafer fab layout, characterized in that, include: The first acquisition module is used to acquire equipment layout information of multiple target devices within the semiconductor wafer fab, and to acquire track layout information of multiple transport track segments within the semiconductor wafer fab. The first display module is used to display the first layout information of the semiconductor wafer fab based on the equipment layout information and the track layout information; The second acquisition module is used to acquire the current status information of the semiconductor wafer fab, wherein the current status information includes at least one of the first status information of the target equipment and the second status information of each transport track segment within the semiconductor wafer fab. The second display module is used to display the second layout information of the semiconductor wafer fab based on the first layout information and the current status information; The equipment layout information includes the type information, size information, and location information of each target device in the semiconductor wafer fab; the track layout information includes the connection relationship between each target device in the semiconductor wafer fab and the transport track segment, the running direction information of each transport track segment, the connection relationship of each transport track segment, the type information of each transport track segment, and the shape information of each transport track segment. The first display module is further configured to: determine first identification information for each target device based on the type information of each target device, wherein different types of target devices correspond to different first identification information; determine first two-dimensional size information for each target device based on the size information of each target device; determine two-dimensional coordinate information for each target device based on the position information of each target device in the semiconductor wafer fab; determine second identification information for each transport track segment based on the type information of each transport track segment, wherein different types of transport track segments correspond to different second identification information; determine second two-dimensional size information for each transport track segment based on the shape information of each transport track segment; and display first layout information of the semiconductor wafer fab based on the first identification information, the first two-dimensional size information, the two-dimensional coordinate information, the second identification information, the second two-dimensional size information, the connection relationship between each target device and the transport track segment, and the connection relationship between each transport track segment. The second acquisition module is further configured to acquire the fault location of the transport device on the transport track section within the semiconductor wafer fab; determine the transport track section that has stopped operating based on the fault location and the connection relationship between each transport track section; determine the target device that has stopped operating based on the connection relationship between the transport track section and the target device; and determine the current status information based on the transport track section that has stopped operating and the target device that has stopped operating.

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