Memory efficient die bonder

Abstract

The application discloses a kind of memory efficient die bonder, it is related to die bonder technical field, including support plate, the support plate is provided with substrate support platform, substrate support platform is provided with substrate body, the side surface of substrate support platform is equipped with second connecting shaft, second connecting shaft is rotatably connected with first connecting shaft, the side surface of first connecting shaft is fixedly connected with chip support platform, first guide rod is provided in chip support platform, first guide rod is fixedly connected with movable plate, clamping assembly is arranged between movable plate and chip support platform, negative pressure assembly and vacuum chuck are installed on movable plate, the substrate support platform is fixedly connected with pressure block.The application solves the problem that the existing die bonder cannot fix multiple chips and substrates at a time by turning over the chip support structure while keeping the substrate support structure stationary, and cannot automatically generate negative pressure in the vacuum chuck using rotational force before turning over the chip support structure.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of die bonder, and particularly relates to an efficient die bonder for memory. BACKGROUND

[0002] With the continuous progress of memory technology, the requirements of packaging technology are also increasing. As a key device in semiconductor packaging, the die bonder is used to accurately fix the memory chip on the packaging substrate, ensure the electrical connection between the chip and the substrate, and provide effective thermal management. However, the existing die bonder still has some deficiencies.

[0003] An invention patent with the publication number CN113113523A discloses a die bonder, which comprises a support plate, a transfer device and a flux titration device. The flux titration device is located above the support plate, and the flux titration device comprises a gantry and a flux titration part. The gantry is arranged above the support plate, and the flux titration part is arranged on the side of the gantry close to the support plate. By integrating the transfer device and the flux titration device, the flux printing and physical interface process in the surface mounting line body can be reduced, thereby improving the production capacity and yield of the production line. In addition, by integrating the transfer device and the flux titration device, the investment of the surface mounting production line can be reduced, and the layout space can be saved, thereby achieving the effect of reducing the cost. Although the above-mentioned device can realize the function of reducing the space occupation, when in use, the device cannot fix multiple chips and substrates at one time by turning over the chip support structure while keeping the substrate support structure stationary, and the working efficiency is low.

[0004] An invention patent with the publication number CN120600670A discloses an expanding mechanism and a memory stick master control chip die bonder, which comprises a working machine, a eutectic system, a first feeding system, a second feeding system and a visual positioning system. The eutectic system comprises a die bonding support table, a two-dimensional motion module connected below the die bonding support table, a dispensing mechanism arranged above the die bonding support table, and a die bonding heating assembly arranged on the die bonding support table. A plate channel is arranged on the die bonding support table. The die bonding heating assembly comprises a material loading top plate and a heating piece arranged in the material loading top plate. The material loading top plate is located in the plate channel. The first feeding system comprises a chip feeding table, a two-dimensional moving module and a crystal taking device. The two-dimensional moving module is used for driving the chip feeding table to move. The crystal taking device comprises a thimble mechanism and a chip material conveying mechanism. The device realizes the integration of eutectic die bonding and adhesive die bonding functions on one equipment. Although the above-mentioned device can realize the die bonding function, when in use, the device cannot simultaneously die bond multiple groups of chips and substrates, and the working efficiency is low. In addition, the device cannot automatically generate negative pressure in the vacuum chuck by using the rotating force before turning over the chip support structure, and usually needs an additional negative pressure equipment, which increases the cost. SUMMARY

[0005] The present application aims at solving the problem that the existing die bonder cannot fix multiple chips and substrates at one time by turning the chip supporting structure while keeping the substrate supporting structure fixed, and cannot automatically generate negative pressure in the vacuum chuck by using rotating force before turning the chip supporting structure, and provides a high-efficiency memory die bonder.

[0006] To achieve the above object, the present application provides the following technical scheme: a high-efficiency memory die bonder, comprising a support plate, a substrate supporting platform is arranged on the support plate, a substrate body is arranged on the substrate supporting platform, a second connecting shaft is installed on the side surface of the substrate supporting platform, a first connecting shaft is rotatably connected to the second connecting shaft, a chip supporting platform is fixedly connected to the side surface of the first connecting shaft, a first guide rod is arranged in the chip supporting platform, an active plate is fixedly connected to the first guide rod, a clamping assembly is arranged between the active plate and the chip supporting platform, a negative pressure assembly and a vacuum chuck are installed on the active plate, a pressing block is fixedly connected to the substrate supporting platform, a first motor is installed on the support plate, a connecting rod is fixedly connected to the output shaft of the first motor, a connecting block is fixedly connected to the outer side of the connecting rod, and a traction assembly is installed on the outer side of the connecting block.

[0007] As a further scheme of the present application: an extension plate and a convex plate are installed on the support plate, the support plate, the extension plate, the convex plate, the substrate supporting platform and the second connecting shaft are fixedly connected as an integral structure, a stand is installed on the extension plate, and an adjusting assembly is installed on the stand.

[0008] As a further scheme of the present application: the first connecting shaft and the second connecting shaft are distributed between the substrate supporting platform and the chip supporting platform, and the chip supporting platform constitutes a rotating structure with the substrate supporting platform through the first connecting shaft and the second connecting shaft.

[0009] As a further scheme of the present application: the first guide rod penetrates the inside of the chip supporting platform, and the first guide rod and the active plate are perpendicular to each other.

[0010] As a further scheme of the present application: the pressing blocks are distributed at equal intervals on the substrate supporting platform, a first bevel surface is arranged on the pressing block, the position and number of the pressing blocks correspond to the position and number of the clamping assemblies one by one; the clamping assembly comprises an outer bushing fixedly installed on the chip supporting platform, a connecting block is arranged in the outer bushing, a moving groove is formed in the active plate for the sliding of the connecting block, a first spring is fixedly arranged between the connecting block and the active plate, a second bevel surface is arranged on the upper and lower sides of the connecting block, and a roller shaft is installed in the middle of the connecting block.

[0011] As a further scheme of the present application, the traction assembly comprises a swivel ring fixedly connected to the first connecting shaft, a torsional spring is installed in the swivel ring, the inner side of the torsional spring is connected to the adapter block, the outer side of the adapter block is fixedly provided with a side plate, the traction steel rope is fixedly connected to the side plate, and a second guide rod for guiding the traction steel rope is fixedly arranged on the second connecting shaft.

[0012] As a further scheme of the present application, the negative pressure assembly comprises a groove and a through hole arranged in the movable plate, the groove and the vacuum chuck are in communication with each other, the positions and the number of the groove and the vacuum chuck are one-to-one corresponding, the groove and the through hole are in communication with each other, the sealing block is fixedly arranged between the movable plate and the shell, the pull rod is slidingly installed in the sealing block, the pull rod is connected to the traction steel rope, the sealing piston is fixedly connected to the pull rod, and the through hole is located between the sealing block and the sealing piston.

[0013] As a further scheme of the present application, the outer side of the negative pressure assembly is provided with the shell, the shell and the movable plate are fixedly connected, the shell, the traction assembly and the negative pressure assembly are symmetrically distributed on both sides of the movable plate, and the traction steel rope penetrates through the shell and is connected to the negative pressure assembly.

[0014] As a further scheme of the present application, the adjusting assembly comprises a first connecting frame fixedly connected to the stand, the first electric sliding seat is installed on the first connecting frame, the side surface of the first electric sliding seat is slidingly provided with the sliding block, the second motor is installed on the sliding block, the mounting shaft is fixedly connected to the output shaft of the second motor, the second electric sliding seat and the second connecting frame are fixedly arranged at the bottom of the mounting shaft, and the articulated arm mounting block is slidingly arranged on the side surface of the second electric sliding seat.

[0015] As a further scheme of the present application, the sliding block and the first connecting frame are slidingly connected, and the articulated arm mounting block and the second connecting frame are slidingly connected.

[0016] Compared with the prior art, the present application has the following advantages:

[0017] The substrate supporting platform and the chip supporting platform are arranged, the function of efficient die bonding is realized, the substrate supporting platform of the device remains fixed, the chip supporting platform can be rotated through the first connecting shaft and the second connecting shaft, a plurality of chips after vacuum adsorption are stably fixed with the substrate, the problem that the existing die bonder cannot fix a plurality of chips and substrates at one time is solved, and the device has the advantages of higher working efficiency.

[0018] Through the connecting rod, the connecting block, the traction assembly and the negative pressure assembly, the chip is adsorbed, and then the chip supporting platform is turned over to realize die bonding function, when the first motor drives the connecting rod to rotate, the connecting rod and the connecting block rotate to pull the traction steel rope first, the traction steel rope pulls the pull rod on the negative pressure assembly under the guidance of the second guide rod, when the traction steel rope pulls the pull rod, the pull rod drives the sealing piston to slide in the cavity formed by the movable plate, the shell and the sealing block, thereby reducing the air pressure in the same column of grooves and through holes, cooperating with the vacuum chuck connected with the groove to realize the chip negative pressure adsorption function, so that the device generates negative pressure to realize the adsorption function, then gradually tightens the torsion spring, and then gradually pulls the rotating ring 1805 and drives the first connecting shaft and the chip supporting platform to rotate, so that the device can first adsorb the chip by using the negative pressure, and then fix the chip and the substrate, the convenience of the device in use is enhanced, no additional negative pressure equipment is needed, the production cost of the device is reduced, and the problem that the existing die bonder cannot automatically generate negative pressure in the vacuum chuck before turning over the chip supporting structure by using the rotating force is solved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the application;

[0020] Figure 2 It is a schematic diagram of the connecting structure of the support plate and the convex plate of the application;

[0021] Figure 3 It is Figure 2 the enlarged schematic diagram of the structure in A of the application;

[0022] Figure 4 It is Figure 2 the enlarged schematic diagram of the structure in B of the application;

[0023] Figure 5 It is a schematic diagram of the connecting structure of the column and the adjusting assembly of the application;

[0024] Figure 6 It is a schematic diagram of the overall structure of the adjusting assembly of the application;

[0025] Figure 7 It is a schematic diagram of the split structure of the movable plate and the shell of the application;

[0026] Figure 8 It is Figure 7 the enlarged schematic diagram of the structure in C of the application;

[0027] Figure 9 It is a schematic diagram of the internal structure of the movable plate of the application;

[0028] Figure 10 It is Figure 9 the enlarged schematic diagram of the structure in D of the application;

[0029] Figure 11 It isFigure 9 Enlarged schematic view of structure at middle E;

[0030] Figure 12 Structure schematic view of the traction steel rope in the shell in the embodiment of the application;

[0031] Figure 13 Structure schematic view of the movable plate and the shell in the embodiment of the application;

[0032] Figure 14 Structure schematic view of the chip supporting platform in the closed state in the embodiment of the application;

[0033] Figure 15 Structure schematic view of the connecting block in the shrunken state after the chip supporting platform is closed in the embodiment of the application.

[0034] The reference signs are as follows: 1, support plate; 2, extension plate; 3, convex plate; 4, base plate supporting platform; 5, base plate body; 6, first connecting shaft; 7, second connecting shaft; 8, chip supporting platform; 9, first guide rod; 10, movable plate; 11, pressing block; 12, first inclined surface; 13, clamping assembly; 1301, outer bushing; 1302, connecting block; 1303, first spring; 1304, second inclined surface; 1305, roller; 1306, moving groove; 14, first motor; 15, shell; 16, connecting rod; 17, linking block; 18, traction assembly; 1801, torsional spring; 1802, side plate; 1803, traction steel rope; 1804, second guide rod; 1805, rotating ring; 19, negative pressure assembly; 1901, recess; 1902, through hole; 1903, sealing block; 1904, sealing piston; 1905, pull rod; 20, stand column; 21, adjusting assembly; 2101, first connecting frame; 2102, first electric sliding seat; 2103, sliding block; 2104, second motor; 2105, mounting shaft; 2106, second electric sliding seat; 2107, second connecting frame; 2108, joint arm mounting block; 22, vacuum chuck. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0036] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set up" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The following describes embodiments of the invention based on its overall structure.

[0037] Example 1: As Figures 1-15 As shown, this embodiment proposes a high-efficiency die bonding machine for memory, including a support plate 1, a substrate support platform 4 disposed on the support plate 1, a substrate body 5 disposed on the substrate support platform 4, a second connecting shaft 7 mounted on the side of the substrate support platform 4, a first connecting shaft 6 rotatably connected to the second connecting shaft 7, a chip support platform 8 fixedly connected to the side of the first connecting shaft 6, a first guide rod 9 disposed inside the chip support platform 8, a movable plate 10 fixedly connected to the first guide rod 9, a locking assembly 13 disposed between the movable plate 10 and the chip support platform 8, a negative pressure assembly 19 and a vacuum suction cup 22 mounted on the movable plate 10, a pressure block 11 fixedly connected to the substrate support platform 4, a first motor 14 mounted on the support plate 1, a connecting rod 16 fixedly connected to the output shaft of the first motor 14, a connecting block 17 fixedly connected to the outside of the connecting rod 16, and a traction assembly 18 mounted on the outside of the connecting block 17.

[0038] The substrate supported by the substrate supporting platform 4 is completed by dispensing, the first motor 14 drives the connecting rod 16 to rotate, the connecting rod 16 will first pass through the traction assembly 18 and the negative pressure assembly 19 to generate negative pressure in the vacuum chuck 22, and the vacuum chuck 22 is stably adsorbed to the chip by the negative pressure, so that the device can first adsorb the chip, and then drive the second connecting shaft 7 to rotate, the second connecting shaft 7 will drive the movable plate 10 and the chip supporting platform 8 to rotate when rotating, until the position of the chip on the vacuum chuck 22 corresponds to the position of the substrate body 5, at this time the pressing block 11 acts on the clamping assembly 13, the clamping assembly 13 will make the movable plate 10 and the chip supporting platform 8 out of the clamping state after being extruded, and the chip supporting platform 8 will automatically press down to fix the substrate on the substrate body 5, after the fixing is completed, the first motor 14 drives the connecting rod 16 to reverse rotation, and the fixed substrate and the chip are transferred to the movable plate 10, and the core die bonding step is completed, and then the subsequent wire bonding process can be carried out.

[0039] Embodiment 2: The scheme in embodiment 1 is further introduced in combination with a specific working mode, and details are described below:

[0040] As shown in Figure 1 , Figure 2 , Figure 5 and Figure 6 , as a preferred embodiment, on the basis of the above mode, further, the supporting plate 1 is provided with an extension plate 2 and a convex plate 3, the supporting plate 1, the extension plate 2, the convex plate 3, the substrate supporting platform 4 and the second connecting shaft 7 are fixedly connected as a whole structure, the extension plate 2 is provided with a stand 20, and the stand 20 is provided with an adjusting assembly 21, the supporting plate 1, the extension plate 2 and the convex plate 3 are used for supporting the whole device, and the stability of the whole device is ensured, and the adjusting assembly 21 facilitates subsequent cooperation with external articulated arm equipment to take and place chips or substrates.

[0041] As shown in Figures 1-4 , as a preferred embodiment, on the basis of the above mode, further, the first connecting shaft 6 and the second connecting shaft 7 are distributed between the substrate supporting platform 4 and the chip supporting platform 8, the chip supporting platform 8 forms a rotating structure between the first connecting shaft 6 and the second connecting shaft 7 and the substrate supporting platform 4, and through the rotating structure on the device, the device can simultaneously fix multiple groups of chips and substrates after adsorbing multiple chips, and the working efficiency of the device is improved.

[0042] As shown in Figure 6 , as a preferred embodiment, on the basis of the above mode, further, the first guide rod 9 penetrates the inside of the chip supporting platform 8, and the first guide rod 9 and the movable plate 10 are perpendicular to each other, which facilitates subsequent automatic sliding of the movable plate 10 by the first guide rod 9 after the chip is rotated by 180°, so as to conveniently fix the substrate and the chip, and the convenience of the device in use is enhanced.

[0043] As Figure 8 shown, as a preferred embodiment, on the basis of the above-mentioned manner, further, the pressure block 11 is distributed on the substrate support platform 4 at equal intervals, the first inclined surface 12 is arranged on the pressure block 11, the position and number of the pressure block 11 are one-to-one corresponding to the position and number of the clamping assembly 13, when the chip rotates 180° and docks, the first inclined surface 12 can abut against the clamping assembly 13, so that a plurality of groups of chips can be conveniently docked with the corresponding position of the substrate, the clamping assembly 13 comprises an outer sleeve 1301 fixedly installed on the chip support platform 8, the outer sleeve 1301 is arranged with a connecting block 1302, the movable plate 10 is arranged with a moving groove 1306 for sliding of the connecting block 1302, the first spring 1303 is fixedly arranged between the connecting block 1302 and the movable plate 10, the second inclined surface 1304 is arranged on the upper and lower sides of the connecting block 1302, the roller 1305 is installed in the middle of the connecting block 1302, and the Figure 7 and Figure 8 As can be seen, after the chip support platform 8 rotates to the same side of the substrate support platform 4, the first inclined surface 12 on the pressure block 11 abuts against the second inclined surface 1304 on the connecting block 1302, so that the second inclined surface 1304 is separated from the outer sleeve 1301, at this time, the movable plate 10 and the chip support platform 8 are in a disengaged state, the movable plate 10 slides downward under the action of its own gravity, so that the roller 1305 on the connecting block 1302 rolls on the pressure block 11, since the first spring 1303 makes the two sides of the roller 1305 abut against the connecting block 1302 and the movable plate 10 at this time, the downward moving speed of the movable plate 10 can be reduced to ensure the stability of the chip and the substrate when they are fixed.

[0044] As Figure 2 , Figure 4 , Figure 9 and Figure 10 shown, as a preferred embodiment, on the basis of the above-mentioned manner, further, the traction assembly 18 comprises a rotating ring 1805 fixedly connected to the first connecting shaft 6, the torsional spring 1801 is installed in the rotating ring 1805, the inner side of the torsional spring 1801 is connected to the adapter block 17, the side plate 1802 is fixedly arranged on the outer side of the adapter block 17, the traction steel wire 1803 is fixedly connected to the side plate 1802, and the second guide rod 1804 for guiding the traction steel wire 1803 is fixedly arranged on the second connecting shaft 7. When the adapter block 17 rotates, the traction steel wire 1803 is first pulled, the traction steel wire 1803 can act on the negative pressure assembly 19, so that the device first generates negative pressure to realize the adsorption function, then the torsional spring 1801 is gradually tightened, after the torsional spring 1801 is tightened, the rotating ring 1805 is pulled, the rotating ring 1805 drives the first connecting shaft 6 to rotate, and the first connecting shaft 6 drives the chip support platform 8 to rotate when rotating, so that the device can first adsorb the chip by using negative pressure before fixing the chip and the substrate.

[0045] As Figure 10 and Figure 11 shown, as a preferred embodiment, on the basis of the above-mentioned mode, further, the negative pressure assembly 19 comprises a groove 1901 and a through hole 1902 opened in the movable plate 10, the groove 1901 and the vacuum chuck 22 are in communication with each other, the positions and the number of the groove 1901 and the vacuum chuck 22 are one-to-one corresponding, the groove 1901 and the through hole 1902 are in communication with each other, the sealing block 1903 is fixedly arranged between the movable plate 10 and the shell 15, the pull rod 1905 is slidingly installed in the sealing block 1903, the pull rod 1905 is connected with the traction steel wire 1803, the sealing piston 1904 is fixedly connected on the pull rod 1905, the through hole 1902 is located between the sealing block 1903 and the sealing piston 1904, when the traction steel wire 1803 pulls the pull rod 1905, the pull rod 1905 drives the sealing piston 1904 to slide in the cavity formed by the movable plate 10, the shell 15 and the sealing block 1903, so as to reduce the air pressure in the same column of the groove 1901 and the through hole 1902, and realize the negative pressure adsorption function in cooperation with the vacuum chuck 22 above the groove 1901.

[0046] As Figures 9-11 shown, as a preferred embodiment, on the basis of the above-mentioned mode, further, the negative pressure assembly 19 is installed on the outside of the shell 15, the shell 15 is fixedly connected with the movable plate 10, the shell 15, the traction assembly 18 and the negative pressure assembly 19 are symmetrically distributed on both sides of the movable plate 10, the traction steel wire 1803 penetrates in the shell 15 and is connected with the negative pressure assembly 19, so that the left and right sides of the device can produce negative pressure at the same time, thereby improving the negative pressure adsorption effect of the device on the chip and enhancing the stability of the device during work.

[0047] As Figure 5 and Figure 6As shown, as a preferred embodiment, on the basis of the above mode, further, the adjusting assembly 21 comprises a first connecting frame 2101 fixedly connected to the stand 20, a first electric sliding seat 2102 is installed on the first connecting frame 2101, a sliding block 2103 is slidably arranged on the side surface of the first electric sliding seat 2102, a second motor 2104 is installed on the sliding block 2103, an installation shaft 2105 is fixedly connected to the output shaft of the second motor 2104, a second electric sliding seat 2106 and a second connecting frame 2107 are fixedly arranged at the bottom of the installation shaft 2105, a joint arm mounting block 2108 is slidably arranged on the side surface of the second electric sliding seat 2106, the sliding block 2103 and the first connecting frame 2101 are in sliding connection, the joint arm mounting block 2108 and the second connecting frame 2107 are in sliding connection, which facilitates the subsequent installation of the joint arm on the joint arm mounting block 2108, the external joint arm takes or places the substrate or the chip, the installation shaft 2105, the second electric sliding seat 2106, the second connecting frame 2107 and the joint arm mounting block 2108 are driven to rotate by the second motor 2104, so as to switch the taking or placing angle of the device to the chip or the substrate, the position of the sliding block 2103 in the first connecting frame 2101 is adjusted by the first electric sliding seat 2102, and the installation position of the joint arm mounting block 2108 in the second connecting frame 2107 is adjusted by the second electric sliding seat 2106, so that the device can accurately sample the chip and the substrate after the subsequent external joint arm.

[0048] Embodiment 3: The schemes in Embodiment 1 and Embodiment 2 are further introduced in combination with specific working modes, and details are described below:

[0049] Specifically, the memory efficient die bonder is used as follows: Figure 5 and Figure 6 As shown, the joint arm is installed below the joint arm mounting block 2108, the external joint arm takes or places the substrate or the chip, the installation shaft 2105, the second electric sliding seat 2106, the second connecting frame 2107 and the joint arm mounting block 2108 are driven to rotate by the second motor 2104, so as to switch the taking or placing angle of the device to the chip or the substrate, the position of the sliding block 2103 in the first connecting frame 2101 is adjusted by the first electric sliding seat 2102, and the installation position of the joint arm mounting block 2108 in the second connecting frame 2107 is adjusted by the second electric sliding seat 2106, so that the device can accurately sample the chip and the substrate after the subsequent external joint arm, and the chip and the substrate can be stably placed on the vacuum chuck 22 and the substrate supporting platform 4.

[0050] As shown, Figures 1-3 and Figures 9-11As shown, the support plate 1, extension plate 2, and protruding plate 3 are used to support the entire device and ensure its overall stability. The adjustment component 21 on the column 20 facilitates the subsequent placement and removal of chips or substrates by external articulated arm equipment. The substrate supported by the substrate support platform 4 supports the substrate after dispensing. The first motor 14 drives the connecting rod 16 to rotate. When the connecting rod 16 rotates, it first generates negative pressure in the vacuum suction cup 22 through the traction component 18 and the negative pressure component 19. The negative pressure is used to stably adsorb the chip in the vacuum suction cup 22. When the connecting rod 16 and the connecting block 17 rotate, they first pull the traction steel rope 1803. Under the guidance of the second guide rod 1804, the traction steel rope 1803 pulls the pull rod 1905 on the negative pressure component 19. When the steel cable 1803 pulls the lever 1905, the lever 1905 drives the sealing piston 1904 to slide within the cavity formed by the movable plate 10, the outer shell 15, and the sealing block 1903, thereby reducing the air pressure in the grooves 1901 and through holes 1902 in the same row. This, combined with the vacuum suction cup 22 above the groove 1901, achieves the negative pressure adsorption function. The device first generates negative pressure to achieve the adsorption function, and then gradually tightens the torsion spring 1801. After the torsion spring 1801 is fully tightened, it will pull the rotating ring 1805. The rotating ring 1805 drives the first connecting shaft 6 to rotate. When the first connecting shaft 6 rotates, it will drive the chip support platform 8 to rotate, so that the device can use negative pressure to adsorb the chip before fixing the chip and the substrate.

[0051] When the chip support platform 8 rotates 180°, as Figures 1-8 As shown, the chip support platform 8 rotates to the same side as the substrate support platform 4. The first beveled surface 12 on the pressure block 11 abuts against the second beveled surface 1304 on the connecting block 1302, causing the second beveled surface 1304 to disengage from the outer bushing 1301. At this time, the movable plate 10 and the chip support platform 8 are disengaged, and the movable plate 10 slides downward under its own gravity, causing the roller 1305 on the connecting block 1302 to roll on the pressure block 11. Since the first spring 1303 keeps the roller 1305 in contact with the connecting block 1302 and the movable plate 10 on both sides, the downward speed of the movable plate 10 can be reduced to ensure the stability of the chip and substrate during fixation, and to ensure that the substrate and chip are stably connected and fixed after dispensing. This allows the device to first adsorb the chip and then perform the die bonding operation. After completing the core die bonding step, subsequent processes such as wire bonding can be performed.

[0052] like Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, Figure 12 The lower arrow indicates the direction of movement of the traction steel cable 1803, and the upper arrow indicates the direction of movement of the pull rod 1905. Since the traction steel cable 1803 passes through the outer casing 15, when the traction steel cable 1803 is pulled outward, it will pull the pull rod 1905 to move outward synchronously. The pulling process can be combined with...Figure 13 The arc arrow in the figure shows that the arc arrow represents the rotating direction of the chip supporting platform 8, and the traction steel rope 1803 is pulled due to the overturning of the chip supporting platform 8, thereby completing the Figure 12 The action of pulling the pull rod 1905 outward, so that the pull rod 1905 and the traction steel rope 1803 move outward synchronously. When the chip supporting platform 8 is completely overturned, combined with the Figure 14 And Figure 15 As can be seen, at this time, the connecting block 1302 abuts against the pressing block 11, so that the connecting block 1302 is separated from the outer bushing 1301, at this time, the movable plate 10 is no longer clamped with the chip supporting platform 8 through the connecting block 1302 and the outer bushing 1301, combined with the Figure 14 As shown in the figure, since the first guide rod 9 penetrates the inside of the chip supporting platform 8, and the first guide rod 9 and the movable plate 10 are perpendicular to each other, the movable plate 10 will slide downward under the action of its own gravity, thereby fixing the chip and the substrate.

[0053] The above-described is only the preferred specific implementation mode of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art, according to the technical scheme and the inventive concept of the present application, within the technical range disclosed by the present application, makes equivalent replacement or change, should be covered in the protection scope of the present application.

Claims

1. A memory-efficient die bonder comprising a support plate (1), characterized in that, The support plate (1) is provided with a substrate supporting platform (4), the substrate supporting platform (4) is provided with a substrate body (5), the side of the substrate supporting platform (4) is provided with a second connecting shaft (7), the first connecting shaft (6) is rotatably connected to the second connecting shaft (7), the side of the first connecting shaft (6) is fixedly connected with a chip supporting platform (8), the first guide rod (9) is arranged in the chip supporting platform (8), the movable plate (10) is fixedly connected to the first guide rod (9), the engaging assembly (13) is arranged between the movable plate (10) and the chip supporting platform (8), the negative pressure assembly (19) and the vacuum chuck (22) are arranged on the movable plate (10), the substrate supporting platform (4) is fixedly connected with the pressing block (11), the first motor (14) is arranged on the support plate (1), the connecting rod (16) is fixedly connected to the output shaft of the first motor (14), the connecting rod (16) is fixedly connected with the adapter block (17) on the outer side, and the traction assembly (18) is arranged on the outer side of the adapter block (17). The support plate (1) is provided with an extension plate (2) and a convex plate (3), the support plate (1), the extension plate (2), the convex plate (3), the substrate supporting platform (4) and the second connecting shaft (7) are fixedly connected as an integral structure, and the extension plate (2) is provided with a stand column (20), and the stand column (20) is provided with an adjusting assembly (21). The first connecting shaft (6) and the second connecting shaft (7) are arranged between the substrate supporting platform (4) and the chip supporting platform (8), and the chip supporting platform (8) is rotatably connected between the substrate supporting platform (4) and the first connecting shaft (6) and the second connecting shaft (7).

2. The memory-efficient die bonder of claim 1, wherein, The first guide rod (9) penetrates the inside of the chip supporting platform (8), and the first guide rod (9) and the movable plate (10) are perpendicular to each other.

3. The memory-efficient die bonder of claim 1, wherein: The pressing blocks (11) are distributed at equal intervals on the substrate supporting platform (4), the first inclined surface (12) is arranged on the pressing block (11), the positions and the number of the pressing blocks (11) correspond to the positions and the number of the engaging assemblies (13) one by one, the engaging assembly (13) comprises an outer bushing (1301) fixedly installed on the chip supporting platform (8), the outer bushing (1301) is provided with a connecting block (1302), the movable plate (10) is provided with a moving groove (1306) for sliding of the connecting block (1302), the first spring (1303) is fixedly arranged between the connecting block (1302) and the movable plate (10), the second inclined surface (1304) is arranged on the upper side and the lower side of the connecting block (1302), and the roller (1305) is arranged in the middle of the connecting block (1302).

4. The memory-efficient die bonder of claim 1, wherein, The traction assembly (18) comprises a swivel joint (1805) fixedly connected to the first connecting shaft (6), a torsion spring (1801) is mounted in the swivel joint (1805), the inner side of the torsion spring (1801) is connected with the adapter block (17), the outer side of the adapter block (17) is fixedly provided with a side plate (1802), the side plate (1802) is fixedly connected with the traction steel wire (1803), and the second connecting shaft (7) is fixedly provided with a second guide rod (1804) for guiding the traction steel wire (1803).

5. The memory-efficient die bonder of claim 4, wherein, The negative pressure assembly (19) comprises a groove (1901) and a through hole (1902) formed in the movable plate (10), the groove (1901) and the vacuum chuck (22) are in communication with each other, the positions and the number of the groove (1901) and the vacuum chuck (22) are one-to-one correspondence, the groove (1901) and the through hole (1902) are in communication with each other, the movable plate (10) and the shell (15) are fixedly provided with a sealing block (1903), the sealing block (1903) is slidably installed with a pull rod (1905), the pull rod (1905) is connected with the traction steel wire (1803), the pull rod (1905) is fixedly connected with a sealing piston (1904), and the through hole (1902) is located between the sealing block (1903) and the sealing piston (1904).

6. The memory-efficient die bonder of claim 5, wherein, The outer side of the negative pressure assembly (19) is provided with the shell (15), the shell (15) and the movable plate (10) are fixedly connected, the shell (15), the traction assembly (18) and the negative pressure assembly (19) are symmetrically distributed on both sides of the movable plate (10), and the traction steel wire (1803) penetrates through the shell (15) and is connected with the negative pressure assembly (19).

7. The memory-efficient die bonder of claim 1, wherein, The adjusting assembly (21) comprises a first connecting frame (2101) fixedly connected to the stand (20), a first electric sliding seat (2102) is mounted on the first connecting frame (2101), a sliding block (2103) is slidably arranged on the side surface of the first electric sliding seat (2102), a second motor (2104) is mounted on the sliding block (2103), a mounting shaft (2105) is fixedly connected to the output shaft of the second motor (2104), a second electric sliding seat (2106) and a second connecting frame (2107) are fixedly arranged at the bottom of the mounting shaft (2105), and a joint arm mounting block (2108) is slidably arranged on the side surface of the second electric sliding seat (2106).

8. The memory-efficient die bonder of claim 7, wherein, The sliding block (2103) and the first connecting frame (2101) are in sliding connection, and the joint arm mounting block (2108) and the second connecting frame (2107) are in sliding connection.

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