Double-sided heat source heat dissipation device

Abstract

The invention discloses a double-sided heat source heat dissipation device which comprises a lower shell adjacent to a first heat source and an upper shell adjacent to a second heat source, and a first capillary structure, a second capillary structure and two third capillary structures are attached to the inner surface of the lower shell; the second capillary structure wraps the first capillary structure, and the two third capillary structures are connected to the two ends of the second capillary structure respectively; the upper shell and the lower shell jointly form a closed vacuum cavity, and a fifth capillary structure and a sixth capillary structure are attached to the inner surface of the upper shell; the sixth capillary structure wraps the fifth capillary structure; the first capillary structure is aligned to the fifth capillary structure and can cover the area where the first heat source and the second heat source are located; and the sixth capillary structure is aligned to the second capillary structure. The capillary structures of different specifications are arranged in a grading manner, so that the heat dissipation performance of the heat dissipation device is improved, and the heat dissipation problem that heat sources are arranged on the upper surface and the lower surface of the heat dissipation device, namely double-surface heat sources is solved.

Description

[0001] This application is a divisional application with application number 202110184596.5 and application date of February 8, 2021. Technical Field

[0002] This invention relates to a heat dissipation device, specifically a double-sided heat source heat dissipation device. Background Technology

[0003] During operation, electronic products require rapid heat dissipation from the processor to maintain operating temperature within a normal range. Common heat dissipation devices, such as vapor chambers, are typically vacuum-sealed cavities consisting of an upper and lower housing. The inner surface of the cavity has capillary structures, and the cavity is filled with a liquid working fluid. During operation, the lower housing absorbs heat from the heat source, causing the liquid working fluid in the vapor chamber near the heat source to evaporate into a gaseous state. This gaseous fluid then condenses back into a liquid state upon contact with the cooler upper housing, releasing heat. The condensed liquid working fluid then flows back to the lower housing under the influence of the capillary structures, creating a continuous cycle. Utilizing the principle of heat absorption during high-temperature evaporation and heat release during low-temperature liquefaction of the liquid working fluid, the vapor chamber exhibits rapid temperature uniformity, thus achieving heat transfer and dissipation.

[0004] With the rapid advancements in electronic products, they are becoming increasingly thinner and lighter, with more compact internal configurations and faster operating speeds. This results in a greater amount of heat generated per unit area during operation, placing higher demands on cooling systems. Take high-end thin and light laptops as an example: due to their limited internal space and concentrated heat generation, heat dissipation is a common challenge. When the chassis overheats, chips automatically reduce their frequency, affecting overall performance and potentially causing crashes or automatic shutdowns, disrupting normal user experience. High-end laptops have high-power GPUs and CPUs, thus requiring significant cooling. Furthermore, some high-end laptops have their GPUs and CPUs located on the top and bottom of the cooling system, creating a dual-sided heat source that further challenges the cooling system's performance.

[0005] Therefore, how to meet the high power requirements of high-end laptops, especially the heat dissipation requirements of dual-sided heat sources, is the key problem that this invention aims to solve. Summary of the Invention

[0006] In view of this, the present invention proposes a dual-sided heat source heat dissipation device.

[0007] A dual-sided heat dissipation device according to an embodiment of the present invention includes a lower housing adjacent to a first heat source and an upper housing adjacent to a second heat source; the inner surface of the lower housing is attached with a first capillary structure, a second capillary structure, and two third capillary structures; the second capillary structure surrounds the first capillary structure, and the two third capillary structures are respectively connected to both ends of the second capillary structure; the upper housing and the lower housing together form a sealed vacuum chamber; the inner surface of the upper housing is attached with a fifth capillary structure and a sixth capillary structure; the sixth capillary structure surrounds the fifth capillary structure; the first capillary structure is located on the fifth capillary structure and can cover the areas where the first heat source and the second heat source are located; the sixth capillary structure is located on the second capillary structure. The power of the first heat source is greater than the power of the second heat source; the lower housing also includes two fourth capillary structures, each of which is arranged along the length direction of a third capillary structure and extends to the area corresponding to the first heat source on the first capillary structure. Alternatively, the lower shell may further include a fourth capillary structure, which is arranged along the length of the two third capillary structures and passes through the regions on the first capillary structure corresponding to the first heat source and the regions corresponding to the second heat source. The capillary force of the first capillary structure is greater than that of the second capillary structure, the capillary force of the second capillary structure is greater than that of the third capillary structure, and the capillary force of the third capillary structure is greater than that of the fourth capillary structure. The capillary force of the fifth capillary structure is greater than that of the sixth capillary structure. The capillary force of the fifth capillary structure is equal to that of the first capillary structure, and the capillary force of the sixth capillary structure is equal to that of the second capillary structure. Two seventh capillary structures are also attached to the inner surface of the upper shell, and the two seventh capillary structures are respectively connected to the two ends of the sixth capillary structure. The capillary force of the sixth capillary structure is greater than that of the seventh capillary structure. The capillary force of the seventh capillary structure is equal to that of the third capillary structure. The ratio of the total capillary thickness to the vapor channel on any cross-section is less than or equal to 75%:25%. It also includes multiple eighth capillary structures, which are attached to the connectors in the regions where the first and second capillary structures are located, and communicate with either the first or second capillary structure. The capillary thickness of the first and fifth capillary structures is greater than or equal to the capillary thickness of the second and sixth capillary structures. The permeability of the fourth capillary structure is greater than the permeability of the first, second, and third capillary structures.

[0008] In the foregoing embodiments of the present invention, one or more of the first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structure, the fifth capillary structure, the sixth capillary structure, the seventh capillary structure, and the eighth capillary structure are attached to the upper shell, the lower shell, or the connector by means of powder, wire mesh, or fiber in a double-sided heat source heat dissipation device.

[0009] The dual-sided heat source heat dissipation device disclosed in the foregoing embodiments of the present invention arranges various capillary structures of different specifications in stages according to the different power requirements and locations of multiple heat sources. It makes full use of the advantages of different capillary structures, so that the working medium in the heat dissipation device can quickly and fully participate in the cyclic heat transfer of liquid-vapor two-phase change, thereby improving the heat dissipation performance of the heat dissipation device. In particular, the present invention solves the heat dissipation problem of large-scale heat dissipation devices with heat sources on both the upper and lower sides, i.e., dual-sided heat sources.

[0010] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the double-sided heat source heat dissipation device of the present invention;

[0012] Figure 2 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to Embodiment 1 of the present invention;

[0013] Figure 2a This is a plan view of the internal structure of the lower shell according to Embodiment 1 of the present invention;

[0014] Figure 2b This is a plan view of the internal structure of the upper shell according to Embodiment 1 of the present invention;

[0015] Figure 2c This is a plan view of the internal structure of the lower shell according to Embodiment 2 of the present invention;

[0016] Figure 3 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to Embodiment 3 of the present invention;

[0017] Figure 3a This is a plan view of the internal structure of the lower shell according to Embodiment 3 of the present invention;

[0018] Figure 3b This is a plan view of the internal structure of the upper shell according to Embodiment 3 of the present invention;

[0019] Figure 3c This is a plan view of the internal structure of the lower shell of Embodiment 4 of the present invention.

[0020] In the attached figures, the following labels are used:

[0021] 10, 10a, 10c... Double-sided heat source cooling device

[0022] 20, 20a, 20b, 20c, 20d… First heat source

[0023] 30, 30a, 30b, 30c, 30d… Second heat source

[0024] 100, 100a, 100b, 100c, 100d...lower shell

[0025] 101a, 101b, 101c, 101d… First capillary structure

[0026] 102a, 102b, 102c, 102d… Second capillary structure

[0027] 103a, 103b, 103c, 103d… Third capillary structure

[0028] 104a, 104b, 104c, 104d… Fourth capillary structure

[0029] 105a, 105b, 105c, 105d… connectors

[0030] 106a, 106b, 106c, 106d… Eighth capillary structure

[0031] 200, 200a, 200c... Upper casing

[0032] 201a, 201c… Fifth capillary structure

[0033] 202a, 202c… Sixth capillary structure

[0034] 203a, 203c… Seventh capillary structure

[0035] 204a, 204c... Groove section Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] The illustrative embodiments and descriptions of the present invention are used to explain the invention, but are not intended to limit the invention. Furthermore, elements / components using the same or similar reference numerals in the drawings and embodiments are used to represent the same or similar parts.

[0038] The directional terms used in this article, such as up, down, left, right, front, or back, are for reference only when referring to the accompanying drawings. Therefore, the use of directional terms is for illustrative purposes and not to limit this work.

[0039] The terms “include,” “including,” “have,” “contain,” etc., used in this article are all open-ended terms, meaning that they include but are not limited to.

[0040] The term "and / or" as used herein includes any or all of the things mentioned.

[0041] The term "multiple" in this article includes "two" and "more than two"; the term "multiple groups" in this article includes "two groups" and "more than two groups".

[0042] Certain terms used to describe this application will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the application.

[0043] Please see Figure 1 . Figure 1 This is a three-dimensional structural diagram of the double-sided heat source heat dissipation device of the present invention. Figure 1 As shown, the double-sided heat source heat dissipation device 10 includes an upper housing 200 and a lower housing 100, which together form a sealed vacuum chamber; a first heat source 20 and a second heat source 30 are respectively located on the upper and lower sides of the double-sided heat source heat dissipation device 10. The power of the first heat source 20 (such as a GPU) is higher than the power of the second heat source 30 (such as a CPU). The lower housing 100 is adjacent to the first heat source 20, and the upper housing 200 is adjacent to the second heat source 30. Figure 1 This is mainly used to illustrate the application environment of the double-sided heat source heat dissipation device 10, so as to facilitate subsequent explanations.

[0044] Please see Figure 2 , Figure 2a and Figure 2b . Figure 2 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to Embodiment 1 of the present invention; Figure 2a This is a plan view of the internal structure of the lower shell according to Embodiment 1 of the present invention; Figure 2b This is a plan view of the internal structure of the upper shell according to Embodiment 1 of the present invention. Figure 2 , Figure 2a and Figure 2bAs shown, the double-sided heat source heat dissipation device 10a includes a lower housing 100a and an upper housing 200a; a first capillary structure 101a, a second capillary structure 102a, two third capillary structures 103a, and two fourth capillary structures 104a are attached to the inner surface of the lower housing 100a; the first capillary structure 101a and the second capillary structure 102a are connected, one of the two third capillary structures 103a is connected to the first capillary structure 101a, and the other of the two third capillary structures 103a is connected to the second capillary structure 102a, and each fourth capillary structure 104a is connected along... A third capillary structure 103a is arranged along its length and extends into the region of the first heat source 20a with higher power on the first capillary structure 101a; a fifth capillary structure 201a, a sixth capillary structure 202a and two seventh capillary structures 203a are attached to the inner surface of the upper shell 200a; the fifth capillary structure 201a and the sixth capillary structure 202a are connected, one of the two seventh capillary structures 203a is connected to the fifth capillary structure 201a, and the other of the two seventh capillary structures 203a is connected to the sixth capillary structure 202a. The first capillary structure 101a is located in relation to the fifth capillary structure 201a. The areas of both the first capillary structure 101a and the fifth capillary structure 201a are larger than the area of ​​the first heat source 20a, and their positions can cover the area where the first heat source 20a is located. The sixth capillary structure 202a is located in relation to the second capillary structure 102a. The areas of both the sixth capillary structure 202a and the second capillary structure 102a are larger than the area of ​​the second heat source 30a, and their positions can cover the area where the second heat source 30a is located. The double-sided heat source heat dissipation device 10a also includes multiple connectors 105a. The top and bottom surfaces of the connectors 105a are connected to the inner surfaces of the upper housing 200a and the lower housing 100a, respectively, thereby supporting the upper housing 200a and the lower housing 100a. The eighth capillary structure 106a is attached to the connectors 105a in the area where the first capillary structure 101a and the second capillary structure 102a are located, and communicates with the first capillary structure 101a or the second capillary structure 102a. The connectors 105a are joined to the upper housing 200a or the lower housing 100a by one of the following methods: welding, diffusion bonding, hot pressing, soft soldering, hard soldering, or adhesive; or the connectors 105a are integrally formed on the upper housing 200a or the lower housing 100a. One or more of the first capillary structure 101a, the second capillary structure 102a, the third capillary structure 103a, the fourth capillary structure 104a, the fifth capillary structure 201a, the sixth capillary structure 202a, the seventh capillary structure 203a, and the eighth capillary structure 106a are attached to the upper shell 200a, the lower shell 100a, or the connector 105a by high-temperature sintering using one of the following: powder, wire mesh, or fiber.

[0045] Based on this embodiment, the capillary force relationship of each capillary structure in the lower shell 100a is as follows: first capillary structure 101a > second capillary structure 102a > third capillary structure 103a > fourth capillary structure 104a; the capillary force relationship of each capillary structure in the upper shell 200a is as follows: fifth capillary structure 201a > sixth capillary structure 202a > seventh capillary structure 203a; the capillary force relationship of each capillary structure in the lower shell 100a and the upper shell 200a is as follows: fifth capillary structure 201a = first capillary structure 101a, sixth capillary structure 202a = second capillary structure 102a, seventh capillary structure 203a = third capillary structure 103a. Generally speaking, the smaller the particles or porosity of a capillary structure, the greater the capillary force and the greater the heat transfer, but the lower the permeability and the greater the resistance to liquid flow. Conversely, the larger the particles or porosity of a capillary structure, the smaller the capillary force and the lower the heat transfer, but the higher the permeability, the more liquid it can adsorb, and the lower the resistance to liquid reflux, which is conducive to the rapid reflux of liquid.

[0046] When the double-sided heat source heat dissipation device 10a is working, the lower shell 100a absorbs the heat emitted by the first heat source 20a, causing the liquid working medium near the first heat source 20a to vaporize and evaporate into a gaseous state through the first capillary structure 101a; the upper shell 200a absorbs the heat emitted by the second heat source 30a, causing the liquid working medium near the second heat source 30a to vaporize and evaporate into a gaseous state through the sixth capillary structure 202a; this vaporization process generates local high pressure near the heat source, and the gaseous working medium flows to the cold ends on both sides of the double-sided heat source heat dissipation device 10a under the action of pressure. The gaseous working medium condenses into a liquid state due to condensation and releases heat. The condensed liquid working medium flows back to the heat source area under the action of the third capillary structure 103a and the fourth capillary structure 104a. In this embodiment, the first capillary structure 101a and the fifth capillary structure 201a, which have the greatest capillary force, have the greatest heat transfer capacity, enabling the liquid working medium near the first heat source 20a to rapidly evaporate and vaporize, thereby quickly absorbing the heat from the high-power first heat source 20a for heat transfer; the second capillary structure 102a and the sixth capillary structure 202a, which also have relatively large capillary forces, have a relatively large heat transfer capacity, enabling the liquid working medium near the second heat source 30a to rapidly evaporate and vaporize, thereby quickly absorbing the heat from the low-power second heat source 30a for heat transfer; the third capillary structure 103a and the seventh capillary structure 201a, which have relatively small capillary forces... 203a has a high permeability, can adsorb more liquid, and has low liquid reflux resistance, allowing the condensed liquid working fluid to reflux rapidly. The fourth capillary structure 104a, with the lowest capillary force, has the highest permeability, can adsorb even more liquid, and has very low liquid reflux resistance, which can significantly accelerate the reflux speed of the liquid working fluid, allowing it to quickly reflux back to the corresponding areas of the first heat source 20a and the second heat source 30a. Moreover, it allows the higher-power first heat source 20a to accept more refluxed liquid working fluid. Therefore, this embodiment effectively improves heat dissipation performance, especially taking into account the heat dissipation performance of the higher-power first heat source 20a.

[0047] The above should be noted as follows:

[0048] (1) In this embodiment, the first heat source 20a is designated as a heat source with higher power. If the second heat source 30a is designated as a heat source with higher power, the capillary force of the second capillary structure 102a and the sixth capillary structure 202a should be greater than the capillary force of the first capillary structure 101a and the fifth capillary structure 201a, and each fourth capillary structure 104a should extend to the area of ​​the corresponding second heat source 30a with higher power on the second capillary structure 102a; that is, the heat source with higher power corresponds to the capillary structure with greater capillary force and accepts more backflow liquid working fluid.

[0049] (2) In some embodiments, since the upper shell 200a is adjacent to the second heat source 30a with lower power, the upper shell 200a may not be provided with the seventh capillary structure 203a, and can directly rely on the fourth capillary structure 104a to complete the reflux of the condensed liquid working fluid, provided that the heat dissipation requirements are met.

[0050] (3) In this embodiment, the eighth capillary structure 106a is used to assist in increasing the vaporization, evaporation and transport of the liquid working fluid; in some embodiments, the eighth capillary structure 106a may not be provided on the connector 105a if the heat dissipation requirements are met.

[0051] (4) In this embodiment, the groove 204a of the upper shell 200a corresponds to the area where the second heat source 30a is located. The purpose is to enable the upper shell 200a to contact the second heat source 30a more closely to improve the heat transfer effect. However, the present invention is not limited to this. In specific applications, the designer can adjust the arrangement of grooves or protrusions and other structures to be close to the heat source according to the actual position of different heat sources and heat dissipation needs to improve the heat transfer effect.

[0052] (5) In this invention, the capillary thickness of each capillary structure may be the same or different. In this embodiment, the capillary thickness of the first capillary structure 101a and the fifth capillary structure 201a corresponding to the first heat source 20a is the same as the capillary thickness of the second capillary structure 102a and the sixth capillary structure 202a corresponding to the second heat source 30a. In other embodiments, the capillary thickness of the first capillary structure 101a and the fifth capillary structure 201a corresponding to the first heat source 20a may be greater than the capillary thickness of the second capillary structure 102a and the sixth capillary structure 202a corresponding to the second heat source 30a.

[0053] (6) In this invention, the ratio of the total capillary thickness to the vapor channel on any cross section of the double-sided heat source heat dissipation device 10a is less than or equal to 75%:25%, that is, the limit ratio of the total capillary thickness is 75%, thereby ensuring that there is enough vapor channel to meet the heat dissipation performance requirements.

[0054] Based on Embodiment 1, Embodiment 2 is formed by modifying the fourth capillary structure 104a of the lower housing 100a. Please refer to Embodiment 2. Figure 2c . Figure 2c This is a plan view of the internal structure of the lower shell according to Embodiment 2 of the present invention. Figure 2cAs shown, the lower housing 100b may be provided with a fourth capillary structure 104b. The fourth capillary structure 104b is arranged along the length direction of the two third capillary structures 103b, and passes through the area on the first capillary structure 101b corresponding to the first heat source 20b and the area on the second capillary structure 102b corresponding to the second heat source 30b. That is, the fourth capillary structure 104b completely connects the first capillary structure 101b, the second capillary structure 102b and the two third capillary structures 103b in the length direction, and passes through the areas corresponding to the first heat source 20b and the second heat source 30b. The layout of the connector 105b is adapted according to the fourth capillary structure 104b. The condensed liquid working fluid flows back through the third capillary structure 103b and the fourth capillary structure 104b. The fourth capillary structure 104b, which has the smallest capillary force and the largest permeability, significantly accelerates the flow rate of the liquid working fluid, allowing it to quickly flow back to the corresponding areas of the first heat source 20b and the second heat source 30b, thereby improving heat dissipation performance.

[0055] Please see Figure 3 , Figure 3a and Figure 3b . Figure 3 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to Embodiment 3 of the present invention; Figure 3a This is a plan view of the internal structure of the lower shell according to Embodiment 3 of the present invention; Figure 3b This is a plan view of the internal structure of the upper shell in Embodiment 3 of the present invention. Figure 3 , Figure 3a and Figure 3bAs shown, the double-sided heat source heat dissipation device 10c includes a lower housing 100c and an upper housing 200c; the inner surface of the lower housing 100c is attached with a first capillary structure 101c, a second capillary structure 102c, two third capillary structures 103c, and two fourth capillary structures 104c; the second capillary structure 102c surrounds the first capillary structure 101c, and the two third capillary structures 103c are respectively connected to the two ends of the second capillary structure 102c, and each fourth capillary structure 104c extends along a... The third capillary structure 103c is arranged along its length and extends into the region of the first heat source 20c with higher power on the first capillary structure 101c. A fifth capillary structure 201c, a sixth capillary structure 202c, and two seventh capillary structures 203c are attached to the inner surface of the upper shell 200c. The sixth capillary structure 202c surrounds the fifth capillary structure 201c, and the two seventh capillary structures 203c are respectively connected to the two ends connected to the sixth capillary structure 202c. The first capillary structure 101c is located opposite the fifth capillary structure 201c. The areas of both the first and fifth capillary structures 101c are larger than the sum of the areas of the first heat source 20c and the second heat source 30c, and their positions can cover the regions where the first and second heat sources 20c and 30c are located. The sixth capillary structure 202c is located opposite the second capillary structure 102c. The double-sided heat source cooling device 10c also includes multiple connectors 105c. The top and bottom surfaces of the connectors 105c are connected to the inner surfaces of the upper housing 200c and the lower housing 100c, respectively, thereby supporting the upper housing 200c and the lower housing 100c. The eighth capillary structure 106c is attached to the connectors 105c in the area where the first capillary structure 101c and the second capillary structure 102c are located, and communicates with the first capillary structure 101c or the second capillary structure 102c. The connectors 105c are joined to the upper housing 200c or the lower housing 100c by one of the following methods: welding, diffusion bonding, hot pressing, soft soldering, hard soldering, or adhesive; or the connectors 105c are integrally formed on the upper housing 200c or the lower housing 100c. One or more of the first capillary structure 101c, the second capillary structure 102c, the third capillary structure 103c, the fourth capillary structure 104c, the fifth capillary structure 201c, the sixth capillary structure 202c, the seventh capillary structure 203c, and the eighth capillary structure 106c are attached to the upper shell 200c, the lower shell 100c, or the connector 105c by high-temperature sintering using one of the following: powder, wire mesh, or fiber.

[0056] Based on this embodiment 3, the capillary force relationship of each capillary structure in the lower shell 100c is as follows: first capillary structure 101c > second capillary structure 102c > third capillary structure 103c > fourth capillary structure 104c; the capillary force relationship of each capillary structure in the upper shell 200c is as follows: fifth capillary structure 201c > sixth capillary structure 202c > seventh capillary structure 203c; the capillary force relationship of each capillary structure in the lower shell 100c and the upper shell 200c is as follows: fifth capillary structure 201c = first capillary structure 101c, sixth capillary structure 202c = second capillary structure 102c, seventh capillary structure 203c = third capillary structure 103c. Generally speaking, the smaller the particles or porosity of a capillary structure, the greater the capillary force and the greater the heat transfer, but the lower the permeability and the greater the resistance to liquid flow. Conversely, the larger the particles or porosity of a capillary structure, the smaller the capillary force and the lower the heat transfer, but the higher the permeability, the more liquid it can adsorb, and the lower the resistance to liquid reflux, which is conducive to the rapid reflux of liquid.

[0057] When the double-sided heat source cooling device 10c is working, the lower shell 100c absorbs the heat emitted by the first heat source 20c, causing the liquid working medium near the first heat source 20c to vaporize and evaporate into a gaseous state through the first capillary structure 101c; the upper shell 200c absorbs the heat emitted by the second heat source 30c, causing the liquid working medium near the second heat source 30c to vaporize and evaporate into a gaseous state through the fifth capillary structure 201c; this vaporization process generates local high pressure near the heat source, and the gaseous working medium flows to the cold ends on both sides of the double-sided heat source cooling device 10c under the action of pressure. The gaseous working medium condenses into a liquid state due to condensation and releases heat. The condensed liquid working medium flows back to the heat source area under the action of the third capillary structure 103c and the fourth capillary structure 104c. In this embodiment, the first capillary structure 101c and the fifth capillary structure 201c, which have the strongest capillary force, possess the greatest heat transfer capacity. They enable the liquid working fluid near the first heat source 20c and the second heat source 30c to rapidly evaporate and vaporize, quickly absorbing heat from the higher-powered first heat source 20c and the second heat source 30c for heat transfer. The second capillary structure 102c and the sixth capillary structure 202c, which also have relatively strong capillary force, transfer the vaporized gaseous working fluid to the cold end. The third capillary structure 103c and the seventh capillary structure 203c, which have relatively weak capillary force, possess higher permeability. The adsorption of more liquid and the low resistance to liquid reflux allow the condensed liquid working fluid to reflux rapidly. The fourth capillary structure 104c, with the lowest capillary force, has the highest permeability, can adsorb more liquid, and has very low resistance to liquid reflux, which can significantly accelerate the reflux speed of the liquid working fluid, allowing it to quickly flow back to the corresponding areas of the first heat source 20c and the second heat source 30c. Moreover, the first heat source 20c with higher power can accept more refluxed liquid working fluid. Therefore, this embodiment effectively improves heat dissipation performance, especially taking into account the heat dissipation performance of the first heat source 20c with higher power.

[0058] The above should be noted as follows:

[0059] (1) In this embodiment, the first heat source 20c is designated as a heat source with higher power. If the second heat source 30c is designated as a heat source with higher power, then each fourth capillary structure 104c should extend to the area of ​​the corresponding second heat source 30c with higher power on the first capillary structure 101c; that is, the heat source with higher power accepts more refluxed liquid working fluid.

[0060] (2) In some embodiments, since the upper shell 200c is adjacent to the second heat source 30c with lower power, the upper shell 200c may not be provided with the seventh capillary structure 203c, and can directly rely on the fourth capillary structure 104c to complete the reflux of the condensed liquid working fluid, provided that the heat dissipation requirements are met.

[0061] (3) In this embodiment, the eighth capillary structure 106c is used to assist in increasing the vaporization, evaporation and transport of the liquid working fluid; in some embodiments, the eighth capillary structure 106c may not be provided on the connector 105c if the heat dissipation requirements are met.

[0062] (4) In this embodiment, the groove 204c of the upper shell 200c corresponds to the area where the second heat source 30c is located. The purpose is to enable the upper shell 200c to contact the second heat source 30c more closely to improve the heat transfer effect. However, the present invention is not limited to this. In specific applications, the designer can adjust the arrangement of grooves or protrusions and other structures to be close to the heat source according to the actual position of different heat sources and heat dissipation needs to improve the heat transfer effect.

[0063] (5) In this invention, the capillary thickness of each capillary structure may be the same or different. In this embodiment, the capillary thickness of the first capillary structure 101c and the fifth capillary structure 201c corresponding to the first heat source 20c and the second heat source 30c is the same as the capillary thickness of the second capillary structure 102c and the sixth capillary structure 202c. In other embodiments, the capillary thickness of the first capillary structure 101c and the fifth capillary structure 201c corresponding to the first heat source 20c and the second heat source 30c may be greater than the capillary thickness of the second capillary structure 102c and the sixth capillary structure 202c.

[0064] (6) In this invention, the ratio of the total capillary thickness to the vapor channel on any cross section of the double-sided heat source heat dissipation device 10c is less than or equal to 75%:25%, that is, the limit ratio of the total capillary thickness is 75%, thereby ensuring that there is enough vapor channel to meet the heat dissipation performance requirements.

[0065] Based on Embodiment 3, the fourth capillary structure 104c of the lower shell 100c is modified to form Embodiment 4. Please refer to Figure 3c . Figure 3cThis is a plan view of the internal structure of the lower shell according to Embodiment 4 of the present invention. Figure 3c As shown, the lower shell 100d may be provided with a fourth capillary structure 104d. The fourth capillary structure 104d is arranged along the length direction of the two third capillary structures 103d, and passes through the area corresponding to the first heat source 20d and the area corresponding to the second heat source 30d on the first capillary structure 101d. That is, the fourth capillary structure 104d completely connects the first capillary structure 101d, the second capillary structure 102d, and the two third capillary structures 103d in the length direction, and passes through the areas corresponding to the first heat source 20d and the second heat source 30d. The layout of the connector 105d is adapted according to the fourth capillary structure 104d. The condensed liquid working fluid flows back through the third capillary structure 103d and the fourth capillary structure 104d. The fourth capillary structure 104d, which has the smallest capillary force and the largest permeability, significantly accelerates the backflow speed of the liquid working fluid, allowing it to quickly flow back to the corresponding areas of the first heat source 20d and the second heat source 30d, thereby improving heat dissipation performance.

[0066] It should be noted that the above embodiments are applicable to the case where multiple heat sources are arranged on the upper and lower sides of the heat dissipation device. However, the present invention is not limited thereto, and it is also applicable to the case where multiple heat sources are located on the same side of the heat dissipation device.

[0067] In summary, the present invention proposes a double-sided heat source heat dissipation device, which, according to the different power requirements and locations of multiple heat sources, arranges various capillary structures of different specifications in a graded manner, making full use of the advantages of different capillary structures, so that the working medium in the heat dissipation device can quickly and fully participate in the cyclic heat transfer of liquid-vapor two-phase change, thereby improving the heat dissipation performance of the heat dissipation device; the present invention particularly solves the heat dissipation problem of large-scale heat dissipation devices with heat sources on both the upper and lower sides, i.e., double-sided heat sources.

[0068] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A double-sided heat source heat dissipation device, characterized in that, include: A lower housing adjacent to a first heat source, wherein a first capillary structure, a second capillary structure, and two third capillary structures are attached to the inner surface of the lower housing; The second capillary structure surrounds the first capillary structure, and the two third capillary structures are respectively connected to the two ends of the second capillary structure; An upper housing adjacent to a second heat source, the upper housing and the lower housing together forming a sealed vacuum chamber, the inner surface of the upper housing having a fifth capillary structure and a sixth capillary structure attached thereto; the sixth capillary structure surrounds the fifth capillary structure; The first capillary structure is located in the fifth capillary structure and can cover the areas where the first heat source and the second heat source are located; The sixth capillary structure is located in the second capillary structure.

2. The double-sided heat source heat dissipation device as described in claim 1, characterized in that, The power of the first heat source is greater than that of the second heat source; the lower housing also includes two fourth capillary structures, each of which is arranged along the length of the third capillary structure and extends to the area on the first capillary structure corresponding to the first heat source.

3. The double-sided heat source heat dissipation device as described in claim 1, characterized in that, The power of the first heat source is greater than the power of the second heat source; the lower housing also includes a fourth capillary structure, which is arranged along the length of the two third capillary structures and passes through the area on the first capillary structure corresponding to the location of the first heat source and the area corresponding to the location of the second heat source.

4. The double-sided heat source heat dissipation device as described in any one of claims 2 or 3, characterized in that, The capillary force of the first capillary structure is greater than that of the second capillary structure, the capillary force of the second capillary structure is greater than that of the third capillary structure, and the capillary force of the third capillary structure is greater than that of the fourth capillary structure.

5. The double-sided heat source heat dissipation device as described in claim 4, characterized in that, The capillary force of the fifth capillary structure is greater than that of the sixth capillary structure.

6. The double-sided heat source heat dissipation device as described in claim 5, characterized in that, The capillary force of the fifth capillary structure is equal to the capillary force of the first capillary structure, and the capillary force of the sixth capillary structure is equal to the capillary force of the second capillary structure.

7. The double-sided heat source heat dissipation device as described in claim 4, characterized in that, The inner surface of the upper shell is also attached with two seventh capillary structures, which are respectively connected to the two ends of the sixth capillary structure.

8. The double-sided heat source heat dissipation device as described in claim 7, characterized in that, The capillary force of the sixth capillary structure is greater than that of the seventh capillary structure.

9. The double-sided heat source heat dissipation device as described in claim 8, characterized in that, The capillary force of the seventh capillary structure is equal to the capillary force of the third capillary structure.

10. The double-sided heat source heat dissipation device as described in claim 9, characterized in that, The ratio of the total capillary thickness to the steam channel on any cross-section is less than or equal to 75%:25%.

11. The double-sided heat source heat dissipation device as described in claim 7, characterized in that, It also includes multiple eighth capillary structures, which are attached to the connectors in the regions where the first capillary structure and the second capillary structure are located, and are in communication with the first capillary structure or the second capillary structure.

12. The double-sided heat source heat dissipation device as described in claim 10, characterized in that, The capillary thickness of the first capillary structure and the fifth capillary structure is greater than or equal to the capillary thickness of the second capillary structure and the sixth capillary structure.

13. The double-sided heat source heat dissipation device as described in claim 9, characterized in that, The permeability of the fourth capillary structure is greater than that of the first capillary structure, the second capillary structure, and the third capillary structure.

14. The double-sided heat source heat dissipation device as described in any one of claims 11, characterized in that, One or more of the first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structure, the fifth capillary structure, the sixth capillary structure, the seventh capillary structure, and the eighth capillary structure are attached to the upper shell, the lower shell, or the connector by sintering using one of the following: powder, wire mesh, or fiber.

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