A plastic packaging jig for CSP products

Abstract

A kind of CSP product plastic encapsulation jig, lower jig assembly includes bottom jig and its support, bottom jig is installed on support by mounting bottom plate, bottom jig adopts one mould two cavity structures, for simultaneously accommodating two CSP packages, bottom jig is equipped with material placing table, the short side of material placing table is equipped with material edge pressing mechanism at both ends, the side of the long side of material placing table is also equipped with material edge pressing mechanism, for the positioning and fixing of CSP package around, one top corner of material placing table is equipped with positioning mechanism, for the positioning of CSP package.The lower jig assembly of the present application adopts one mould two cavity structures, so that single operation can simultaneously handle two CSP packages, improve production efficiency, bottom jig is fixed on support by mounting bottom plate, ensure the stability and rigidity of overall structure.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically a molding fixture for CSP products. Background Technology

[0002] With the continuous development of semiconductor technology, chip sizes are getting smaller and chip pitches are getting narrower, and traditional plastic encapsulation processes can no longer meet the requirements. CSP (Chip Scale Package) packaging technology has emerged to meet this need. It directly encapsulates the chip on the substrate without pins, and has advantages such as small size, light weight, and low power consumption.

[0003] However, existing CSP packaging molding processes also have the following technical problems:

[0004] First, existing technologies generally employ a single-mode structure, meaning they can only process one CSP package at a time. This results in low equipment utilization and limited output per unit time, making it difficult to meet the current market demand for large-scale, continuous production. Furthermore, traditional fixtures lack flexibility during installation and commissioning, making it difficult to quickly adapt to CSP products of different sizes or structures, increasing changeover time and manual intervention costs.

[0005] Secondly, traditional fixtures often rely on simple mechanical pressure plates or fixed clamps, lacking the ability to position and flexibly hold the CSP package around its perimeter, which can easily cause the workpiece to shift or deform during the encapsulation process. Although some equipment is equipped with pneumatic clamps, it lacks an effective size adjustment mechanism and buffer device, making it unable to adapt to products of different thicknesses. Uneven clamping force can easily lead to product damage or poor encapsulation.

[0006] Furthermore, traditionally, fixture structures often lack dedicated through-holes or venting channels, preventing the effective expulsion of residual gas during the molding process. This leads to defects such as bubbles and voids, affecting packaging reliability. Simultaneously, due to poor heat conduction paths, the molding material is heated unevenly during curing, further reducing the consistency of packaging quality. Summary of the Invention

[0007] In view of the above situation and to overcome the defects of the prior art, the present invention provides a molding fixture for CSP products, so as to at least partially solve the above technical problems.

[0008] The technical solution adopted in this invention is as follows:

[0009] This invention proposes a molding fixture for CSP products, comprising:

[0010] The assembly includes a lower fixture assembly, an upper fixture assembly, and a loading / unloading mechanism. The lower fixture assembly includes a bottom fixture and its support. The bottom fixture is mounted on the support via a mounting base plate. The bottom fixture adopts a two-cavity mold structure to simultaneously accommodate two CSP packages. The bottom fixture is equipped with a material placement platform. Material pressing mechanisms are provided at both ends of the short side of the material placement platform, and a material pressing mechanism is also provided on one side of the long side of the material placement platform for positioning and fixing the CSP packages around their perimeter. A positioning mechanism is provided at one apex of the material placement platform for positioning the CSP packages.

[0011] In one embodiment of the present invention, the material pressing mechanism is connected to the bracket of the lower fixture assembly via a mounting plate. The material pressing mechanism is provided with a size adjustment component, which is used to adjust the position of the material pressing mechanism. The size adjustment component is connected to a first pressing block, which is moved up and down and extended and retracted by a cylinder power component. The cylinder power component is mounted on the extension and retraction power component.

[0012] In one embodiment of the present invention, the positioning mechanism is connected to the mounting base plate via a mounting plate. The mounting plate is provided with an adjustment mechanism for adjusting the position of the positioning mechanism. The adjustment mechanism is connected to a power cylinder, and the power cylinder is connected to a second pressure block.

[0013] In one embodiment of the present invention, the upper fixture assembly includes a positioning plate and a pressure plate. The positioning plate is disposed in the upper fixture assembly, the pressure plate is disposed in the upper fixture assembly, a plurality of through holes are provided between the lower fixture assembly and the upper fixture assembly, the through holes are disposed between the lower fixture assembly and the upper fixture assembly, and a plurality of vent holes are provided between the pressure plate and the positioning plate, the vent holes are disposed between the pressure plate and the positioning plate.

[0014] In one embodiment of the present invention, the loading and unloading mechanism is disposed between the lower fixture assembly and the upper fixture assembly. The loading and unloading mechanism includes a material picking structure disposed in the loading and unloading mechanism. The material picking structure is provided with a CCD component disposed in the material picking structure. The loading and unloading mechanism is provided with a double module disposed in the loading and unloading mechanism.

[0015] In one embodiment of the present invention, the bracket of the lower fixture assembly is a rectangular frame structure, the bracket is provided with multiple mounting holes for fixing the mounting base plate, the mounting base plate is made of metal and has good rigidity and wear resistance, the bottom fixture is an integral casting, and the surface of the bottom fixture is provided with multiple machined surfaces to adapt to different process requirements.

[0016] In one embodiment of the present invention, the material placement platform is a rectangular platform structure, the surface of the material placement platform is provided with a plurality of positioning grooves for supporting CSP products, the edge of the material placement platform is provided with a guide structure for guiding the entry and exit of CSP products, and the material of the material placement platform is aluminum alloy, which has good thermal conductivity and mechanical strength.

[0017] In one embodiment of the present invention, the first pressing block in the material pressing mechanism is made of an elastic material, which can adapt to products of different thicknesses. The surface of the first pressing block is provided with anti-slip texture to prevent the product from shifting during the pressing process. A buffer pad is provided between the first pressing block and the cylinder power assembly to reduce the impact of impact on the product.

[0018] In one embodiment of the present invention, the second pressure block of the positioning mechanism is an adjustable structure that can be adjusted according to the product size; the power cylinder is a linear cylinder that can provide a stable clamping force; and the mounting plate is a horizontal mounting plate that supports the positioning mechanism and ensures its stable position.

[0019] In one embodiment of the present invention, the loading and unloading mechanism is powered by a double module, which can synchronously control the movement of the material handling structure.

[0020] The beneficial effects of the technical solution of this invention are as follows:

[0021] The fixture assembly of this invention adopts a two-cavity structure, allowing two CSP packages to be processed simultaneously in a single operation, thus improving production efficiency. The bottom fixture is fixed to the bracket via a mounting base plate, ensuring the stability and rigidity of the overall structure. Furthermore, the bottom fixture has multiple machined surfaces, providing flexible adaptability to different process flows.

[0022] This invention achieves clamping and positioning of CSP products through the coordinated operation of a pressing mechanism and a positioning mechanism. The pressing mechanism adjusts its position using a size adjustment component, and combined with a cylinder power component and an elastic pressure block, it can accommodate products of different thicknesses and effectively prevent workpiece displacement during the pressing process. The anti-slip texture and buffer pads on the pressure block surface further enhance the stability and safety of clamping. The positioning mechanism achieves adjustable positioning through an adjustment mechanism and a linear cylinder, improving the versatility and precision control capabilities of the structure.

[0023] This invention uses an upper fixture assembly to press and seal the CSP package through the cooperation of a positioning plate and a pressure plate. The through holes and vents not only help to expel gas during the molding process, but also improve heat conduction performance, thereby improving the molding quality and consistency.

[0024] This invention achieves automatic material identification, gripping, and handling through a loading and unloading mechanism. The material handling structure is equipped with a CCD component, enabling visual positioning and identification of workpieces without manual intervention, thus enhancing the structure's intelligence level. A dual-module acts as a power source, synchronously controlling the movement of the material handling structure to ensure the smoothness and synchronization of loading and unloading actions, improving the overall coordination and stability of the machine.

[0025] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0027] Figure 1 This is a schematic diagram of the structure of the molding fixture for CSP products proposed in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the bottom fixture for CSP product molding jig proposed in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the material pressing mechanism for the CSP product molding fixture proposed in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the positioning mechanism for CSP product molding fixture proposed in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the loading and unloading mechanism for CSP product molding fixtures proposed in an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the upper fixture assembly for CSP product molding fixture proposed in an embodiment of the present invention.

[0033] In the diagram: 1. Lower jig assembly; 2. Upper jig assembly; 3. Loading / unloading mechanism; 2-01. Positioning plate; 2-02. Pressure plate; 3-01. Double module; 3-02. Material handling structure; 10. Bottom jig; 10-01. Mounting base plate; 10-02. Material placement platform; 10-03. Material pressing mechanism; 10-04. Positioning mechanism; 10-03-01. Vertical plate; 10-03-02. Size adjustment component; 10-03-04. First pressing block; 10-03-05. Cylinder power component; 10-03-06. Telescopic power component; 10-04. Positioning mechanism; 10-04-01. Mounting plate; 10-04-02. Adjustment mechanism; 10-04-03. Power cylinder; 10-04-04. Second pressing block. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] The following describes an embodiment of the present invention for sealing CSP products with reference to the accompanying drawings.

[0036] like Figures 1 to 6 As shown, this embodiment of the invention provides a molding fixture for CSP products, including: a lower fixture assembly 1, an upper fixture assembly 2, and a loading / unloading mechanism 3. The lower fixture assembly 1 includes a bottom fixture 10 and its support. The bottom fixture 10 is mounted on the support via a mounting base plate 10-01. The bottom fixture 10 adopts a two-cavity structure to simultaneously accommodate two CSP packages. The bottom fixture 10 is provided with a material placement platform 10-02. Material pressing mechanisms 10-03 are provided at both ends of the short side of the material placement platform 10-02. One end of the long side of the material placement platform 10-02... The side is also provided with a material pressing mechanism 10-03 for positioning and fixing the CSP package around its perimeter. A positioning mechanism 10-04 is provided at one of the top corners of the material placement platform 10-02 for positioning the CSP package. The bracket of the lower fixture assembly 1 is a rectangular frame structure with multiple mounting holes for fixing the mounting base plate 10-01. The mounting base plate 10-01 is made of metal and has good rigidity and wear resistance. The bottom fixture 10 is an integral casting with multiple machined surfaces to adapt to different process requirements.

[0037] In specific applications, the bottom fixture 10 of this invention adopts a two-cavity structure, enabling the simultaneous processing of two CSP packages in a single operation, thus improving production efficiency. The bottom fixture 10 is mounted on the bracket via a mounting base plate 10-01. The mounting base plate is made of metal, possessing excellent rigidity and wear resistance, ensuring that the fixture will not deform or wear during prolonged use, thereby guaranteeing positioning accuracy and service life. Furthermore, the rigidity of the mounting base plate enhances the overall structural stability, preventing positioning misalignment caused by external forces.

[0038] Furthermore, the bottom fixture 10 itself is a single casting with multiple machined surfaces, the arrangement of which fully considers different process requirements. For example, heating, cooling, and pressure control are required during the molding process, and different machined surfaces can be adapted to corresponding process fixtures or sensors, improving process adaptability and controllability. The overall casting structure also avoids assembly errors caused by splicing multiple parts, improving the overall precision and consistency of the fixture.

[0039] Furthermore, a material placement platform 10-02 is provided on the top of the bottom fixture 10. Material pressing mechanisms 10-03 are provided at both ends of the short side and one side of the long side of the material placement platform. The material pressing mechanism 10-03 achieves precise positioning and fixation of the CSP package by applying uniform pressure around it. The pressing mechanism should have sufficient elasticity and adjustment capability to adapt to CSP packages of different sizes and shapes, and maintain a stable clamping state during the molding process to prevent positional displacement due to vibration or pressure changes.

[0040] In addition, a positioning mechanism 10-04 is provided at one of the top corners of the material placement platform. The positioning mechanism 10-04 is used for key point positioning of the CSP package, further enhancing the positioning accuracy. The positioning mechanism 10-04 typically adopts a high-precision mechanical structure or magnetic suction structure to ensure that the CSP package can be quickly and accurately aligned with the mold during placement, reducing manual intervention and improving the level of automation. The support of the lower fixture assembly is a rectangular frame structure with multiple mounting holes, which facilitates the secure fixing of the mounting base plate 10-01 to the equipment base.

[0041] Furthermore, the upper fixture assembly 2 works in conjunction with the lower fixture assembly 1 to press and shape the CSP package during the molding process. The structure of the upper fixture must match the material placement platform and positioning mechanism of the lower fixture to ensure that pressure can be applied accurately during the mold closing process and to maintain a seal to prevent resin leakage or air bubbles. The loading and unloading mechanism 3 automatically feeds the CSP package onto the material placement platform of the lower fixture assembly and removes it after molding. The loading and unloading mechanism must work in coordination with the positioning mechanism and edge pressing mechanism of the lower fixture to ensure that the positioned CSP package is not disturbed during the feeding and unloading process.

[0042] In one possible implementation, the material pressing mechanism 10-03 is connected to the bracket of the lower fixture assembly 1 via a mounting plate 10-03-01. The material pressing mechanism 10-03 is equipped with a size adjustment component 10-03-02, which is used to adjust the position of the material pressing mechanism 10-03. The size adjustment component 10-03-02 is connected to a first pressing block 10-03-04, and the first pressing block 10-03-04 is driven by a cylinder power component 10-03-05. The cylinder power assembly 10-03-05 is mounted on the telescopic power assembly 10-03-06 for downward and retractive movements. The first pressing block 10-03-04 in the material pressing mechanism 10-03 is made of elastic material, which can adapt to products of different thicknesses. The surface of the first pressing block 10-03-04 is provided with anti-slip texture to prevent the product from shifting during the pressing process. A buffer pad is provided between the first pressing block 10-03-04 and the cylinder power assembly 10-03-05 to reduce the impact of impact on the product.

[0043] In specific applications of this invention, the material pressing mechanism 10-03 is connected to the bracket of the lower fixture assembly 1 via the mounting plate 10-03-01, ensuring the stability and adjustability of the pressing mechanism. The mounting plate, as a load-bearing and positioning component, can firmly fix the pressing mechanism in the fixture system, while providing basic support for subsequent dimensional adjustments. The mounting plate is usually made of high-strength materials and has good rigidity and durability to cope with mechanical stress and fatigue deformation generated during long-term use.

[0044] Secondly, the material pressing mechanism 10-03 is equipped with a size adjustment component 10-03-02 to achieve precise adjustment of the pressing mechanism's position to adapt to CSP packages of different sizes. The size adjustment component generally includes a slide rail, lead screw, threaded pair, or hydraulic adjustment device structure, capable of fine-tuning the lateral or longitudinal position according to actual needs. This ensures that the first pressing block 10-03-04 accurately conforms to the edge of the workpiece, preventing uneven clamping or positioning misalignment due to dimensional deviations. The size adjustment component 10-03-02 is further connected to the first pressing block 10-03-04, which serves as the actuator directly contacting the CSP package. In this design, the pressing block is made of an elastic material, such as silicone, rubber, or polymer composite material. This material possesses good cushioning performance and deformation recovery capability, adapting to CSP packages of different thicknesses and avoiding pressure damage or deformation caused by rigid clamping. Simultaneously, the use of elastic materials enhances the adaptability and safety of the pressing mechanism, especially when handling thin or fragile packages, effectively reducing the risk of mechanical damage. To further improve the working effect of the pressing block, its surface is provided with anti-slip texture. This texture is usually a diamond, strip, or dot structure, which can increase friction and prevent the CSP package from shifting due to vibration or pressure changes during the pressing process.

[0045] In addition, a buffer pad is provided between the first pressure block 10-03-04 and the cylinder power assembly 10-03-05. The function of the pad is to reduce the impact force and protect the CSP package from excessive pressure damage. The buffer pad is usually made of rubber, polyurethane or other elastic materials, which can absorb some energy during the process of the cylinder driving the pressure block to press down, making the pressure application more gentle and controllable.

[0046] Furthermore, the cylinder power assembly 10-03-05 drives the first pressing block 10-03-04 to move up and down and extend and retract, ensuring that the pressing mechanism can perform action control according to the preset program. Through linkage with the control system, the cylinder power assembly can achieve precise force control and time control, thereby ensuring the uniform distribution and continuous stability of pressure during the molding process.

[0047] Finally, the cylinder power assembly 10-03-05 is installed on the telescopic power assembly 10-03-06. This assembly further enhances the motion freedom and adjustment capability of the pressing mechanism. The telescopic power assembly typically adopts an electric servo motor, hydraulic cylinder, or pneumatic actuator structure, which can realize more complex action modes, such as multi-directional movement, angle adjustment, or dynamic compensation functions. This allows the pressing mechanism to not only move up and down in the vertical direction, but also move forward and backward or left and right in the horizontal direction, thereby better adapting to CSP packages of different shapes and sizes.

[0048] In one possible implementation, the positioning mechanism 10-04 is connected to the mounting base plate 10-01 via a mounting plate 10-04-01. The mounting plate 10-04-01 is provided with an adjustment mechanism 10-04-02, which is used to adjust the position of the positioning mechanism 10-04. The adjustment mechanism 10-04-02 is connected to a power cylinder 10-04-03, which is connected to a second pressure block 10-04-04. The second pressure block 10-04-04 of the positioning mechanism 10-04 is an adjustable structure that can be adjusted according to the product size. The power cylinder 10-04-03 is a linear cylinder that can provide a stable clamping force. The mounting plate 10-04-01 is a horizontal mounting plate that supports the positioning mechanism 10-04 and ensures its stable position.

[0049] In a specific application of this invention, the positioning mechanism 10-04 is connected to the mounting base plate 10-01 via the mounting plate 10-04-01. The mounting plate, as the basic support structure of the entire positioning mechanism, not only bears the weight of the positioning component, but also provides a stable mounting platform for subsequent adjustment and power drive. The horizontal mounting plate helps to ensure that the positioning mechanism maintains good levelness and stability during operation, and avoids positioning errors caused by tilting or vibration.

[0050] Secondly, the mounting plate 10-04-01 is equipped with an adjustment mechanism 10-04-02 to achieve fine-tuning of the position and angle of the positioning mechanism 10-04, so as to adapt to CSP packages of different sizes and shapes. The adjustment mechanism usually includes a sliding guide rail, a threaded adjustment device, and a gear transmission unit structure, which can make adjustments in the horizontal, vertical and even rotational directions according to actual needs, enhancing the versatility and compatibility of the fixture system, so that the same set of fixtures can be used for various specifications of CSP products, reducing the time cost of equipment replacement and debugging.

[0051] The adjusting mechanism 10-04-02 is further connected to the power cylinder 10-04-03, which is a linear cylinder with good force control precision and motion stability, providing uniform and controllable clamping force during operation. The linear cylinder ensures the smooth vertical movement of the second clamping block 10-04-04, avoiding the vibration and impact caused by traditional hydraulic or electric drives. The power cylinder 10-04-03 is ultimately connected to the second clamping block 10-04-04, which is an adjustable structure that can be manually or automatically adjusted according to the specific dimensions of the CSP package. This not only improves the applicability of the positioning mechanism but also enhances its flexibility in mass production. For example, when handling thin or irregularly shaped CSP products, adjusting the position or angle of the clamping block can achieve a closer contact and a more stable clamping effect.

[0052] In one possible implementation, the upper fixture assembly 2 includes a positioning plate 2-01 and a pressure plate 2-02. The positioning plate 2-01 is disposed in the upper fixture assembly 2, and the pressure plate 2-02 is disposed in the upper fixture assembly 2. A plurality of through holes are provided between the lower fixture assembly 1 and the upper fixture assembly 2. A plurality of vent holes are provided between the pressure plate 2-02 and the positioning plate 2-01.

[0053] In specific applications of this invention, the positioning plate 2-01 is used to position and support the CSP package, ensuring that it maintains a stable position and posture during the molding process. The positioning plate is typically made of high-strength metal material and has multiple positioning grooves or holes to accommodate CSP packages of different sizes. Furthermore, through a reasonable structural layout and installation method, the positioning plate achieves alignment and synchronous movement between the upper and lower fixtures, avoiding poor molding or product damage caused by misalignment.

[0054] Secondly, the pressure plate 2-02 applies uniform pressure to the CSP package, ensuring that the molding compound fully fills and adheres to the product surface. The pressure plate is generally a structural component with a certain degree of rigidity, connected to an external drive mechanism (such as a cylinder or hydraulic device) to achieve vertical lifting movement. To improve the pressing effect, the surface of the pressure plate is usually provided with anti-slip texture or elastic buffer layer to enhance the contact performance with the CSP package and prevent product displacement or deformation due to insufficient friction or uneven pressure.

[0055] The through hole provided between the upper fixture assembly 2 and the lower fixture assembly 1 not only reduces the overall weight, but also enables the internal airflow and heat exchange, which helps to improve the material flowability and curing efficiency during the molding process. For example, when the mold is closed, it forms an effective air passage, allowing excess gas to be discharged in time, thereby avoiding air bubble residue and improving the molding quality.

[0056] Meanwhile, the vent holes provided between the pressure plate 2-02 and the positioning plate 2-01 further enhance the airtightness and ventilation capacity of the entire molding structure. The function of the vent holes is twofold: firstly, to guide excess gas to be discharged smoothly during the molding process, reducing the generation of bubbles and voids; secondly, to be used for temperature control and pressure balance. Especially in the high-temperature and high-pressure molding environment, good ventilation helps to maintain the stability of the system and prevent equipment failure or product quality problems caused by pressure imbalance.

[0057] In one possible implementation, the loading / unloading mechanism 3 is disposed between the lower fixture assembly 1 and the upper fixture assembly 2. The loading / unloading mechanism 3 includes a material picking structure 3-02, which is disposed within the loading / unloading mechanism 3. The material picking structure 3-02 is equipped with a CCD component, which is disposed within the material picking structure 3-02. The loading / unloading mechanism 3 is equipped with a double-unit module 3-01, which is disposed within the loading / unloading mechanism 3. The loading / unloading mechanism 3 is powered by the double-unit module 3-01, which can synchronously control the movement of the material picking structure 3-02.

[0058] In specific applications of this invention, the loading / unloading mechanism 3 is positioned between the lower fixture assembly 1 and the upper fixture assembly 2, ensuring smooth flow of the workpiece between the upper and lower fixtures during the encapsulation process. The material handling structure 3-02 grips and releases the CSP package. This structure typically consists of a robotic arm, grippers, suction cups, or other gripping devices, and is equipped with a CCD component for image recognition and position correction. The CCD component has high resolution and fast response capabilities, enabling real-time capture of the workpiece's position information, providing accurate data support for subsequent positioning and gripping. Furthermore, the CCD component can also detect the workpiece's appearance quality, such as damage, missing corners, or stains, thereby achieving online quality inspection and anomaly alarms, further enhancing the overall intelligence level of the structure.

[0059] Building upon this foundation, the dual-module 3-01 employs a dual-axis or multi-axis linkage structure, enabling synchronous motion control in multiple directions. This ensures the material handling structure remains stable, vibration-free, and delay-free during movement. The dual-module not only enhances motion stability and speed response but also strengthens the structure's anti-interference capabilities and reliability, making it particularly suitable for high-speed, high-frequency automated production scenarios. The dual-module 3-01 can synchronously control the movement of the material handling structure 3-02. Through synchronous control, multi-degree-of-freedom composite movements can be achieved, such as lateral movement, longitudinal lifting, and rotational adjustment, allowing the material handling structure to flexibly adapt to CSP packages in different positions and orientations.

[0060] In one possible implementation, the material placement platform 10-02 is a rectangular platform structure. The surface of the material placement platform 10-02 is provided with multiple positioning grooves for carrying CSP products. The edge of the material placement platform 10-02 is provided with a guide structure for guiding the entry and exit of CSP products. The material of the material placement platform 10-02 is aluminum alloy, which has good thermal conductivity and mechanical strength.

[0061] In a specific application of this invention, the material placement platform 10-02 adopts a rectangular platform structure. The rectangular platform also facilitates maximizing space utilization, ensuring that more workpieces or auxiliary equipment can be accommodated within a limited working area. In addition, the symmetry and stability of the rectangular structure also help improve the mechanical balance during equipment operation, reducing vibration and offset problems caused by structural asymmetry, thereby improving the overall stability and operational safety of the machine.

[0062] Secondly, the surface of the material placement table 10-02 is equipped with multiple positioning slots. Each positioning slot is machined according to the size and shape of the CSP product to ensure that the workpiece maintains the correct posture and position after placement, avoiding poor sealing or mold damage due to shaking or displacement. The positioning slots also consider the ease of workpiece placement and removal, for example, by setting chamfers, bevels, or elastic buckles to make the placement or removal of CSP products smoother, reducing manual intervention and operation time. In addition, the distribution of the positioning slots can be optimized and adjusted according to the production cycle to achieve multi-station parallel processing and improve overall operation efficiency.

[0063] Furthermore, the edge of the material placement platform 10-02 is equipped with a guide structure to guide the entry and exit of CSP products, thereby realizing automated handling and positioning control. The guide structure can be in the form of raised guide rails, inclined surfaces, limit plates or flexible guards, which play a guiding, anti-deviation and anti-collision role during the movement of workpieces, ensuring that workpieces can flow smoothly on the predetermined path and avoiding collisions, blockages or accidental entry caused by improper operation or equipment errors.

[0064] Finally, the material of the material placement platform 10-02 is aluminum alloy. Aluminum alloy has good thermal conductivity, which can dissipate heat quickly during the plastic sealing process, preventing local overheating from damaging the CSP product, and also facilitating the subsequent cooling process. Its high mechanical strength ensures that the platform will not deform or be damaged during long-term use, extending the service life of the equipment. Its good corrosion resistance makes it suitable for various environmental conditions, especially performing well in humid, high-temperature or chemical-containing industrial scenarios.

[0065] In practical use, the loading and unloading mechanism 3 places the package body on the material placement platform 10-02, then the positioning mechanism 10-04 is activated to position the material, then each pressing mechanism is activated to press the material, and then the positioning plate 2-01 and the pressing plate 2-02 are placed on the package body.

[0066] Specifically, pressure is applied to press the package into the through hole of the lower fixture.

[0067] Specifically, molding compound is then injected into the through-hole to fill the package.

[0068] Specifically, once the molding compound has cured, the package can be removed from the fixture.

[0069] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0070] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A CSP product plastic packaging jig, characterized in that, Include: Lower fixture assembly (1), upper fixture assembly (2) and feeding mechanism (3), the lower fixture assembly (1) includes bottom fixture (10) and its support, the bottom fixture (10) is installed on the support through the installation bottom plate (10-01), the bottom fixture (10) adopts one mould two cavity structure, for simultaneously accommodating two CSP package, the bottom fixture (10) is equipped with material placing table (10-02), the short side both ends of material placing table (10-02) are equipped with material edge compression mechanism (10-03), one side of material placing table (10-02) long edge is also equipped with material edge compression mechanism (10-03), for the four around positioning and fixing of CSP package, one top corner of material placing table (10-02) is equipped with positioning mechanism (10-04), for the positioning of CSP package; The positioning mechanism (10-04) is connected to the installation bottom plate (10-01) through the mounting plate (10-04-01), the mounting plate (10-04-01) is equipped with adjusting mechanism (10-04-02), the adjusting mechanism (10-04-02) is used for adjusting the position of the positioning mechanism (10-04), the adjusting mechanism (10-04-02) is connected to the power cylinder (10-04-03), the power cylinder (10-04-03) is connected to the second pressing block (10-04-04); The upper fixture assembly (2) includes positioning plate (2-01) and pressing plate (2-02), the positioning plate (2-01) is arranged in the upper fixture assembly (2), the pressing plate (2-02) is arranged in the upper fixture assembly (2), a plurality of through holes are arranged between the lower fixture assembly (1) and the upper fixture assembly (2), the through hole is arranged between the lower fixture assembly (1) and the upper fixture assembly (2), a plurality of air holes are arranged between the pressing plate (2-02) and the positioning plate (2-01), the air hole is arranged between the pressing plate (2-02) and the positioning plate (2-01); The feeding mechanism (3) is arranged between the lower fixture assembly (1) and the upper fixture assembly (2), the feeding mechanism (3) includes material taking structure (3-02), the material taking structure (3-02) is arranged in the feeding mechanism (3), the material taking structure (3-02) is equipped with CCD assembly, the CCD assembly is arranged in the material taking structure (3-02), the feeding mechanism (3) is equipped with double die group (3-01), the double die group (3-01) is arranged in the feeding mechanism (3).

2. The CSP product plastic packaging jig according to claim 1, wherein, The material pressing mechanism (10-03) is connected to the bracket of the lower fixture assembly (1) via a mounting plate (10-03-01). The material pressing mechanism (10-03) is provided with a size adjustment component (10-03-02). The size adjustment component (10-03-02) is used to adjust the position of the material pressing mechanism (10-03). The size adjustment component (10-03-02) is connected to the first pressing block (10-03-04). The first pressing block (10-03-04) achieves up-and-down movement and telescopic action through a cylinder power component (10-03-05). The cylinder power component (10-03-05) is mounted on the telescopic power component (10-03-06).

3. The CSP product plastic packaging jig according to claim 1, wherein, The bracket of the lower fixture assembly (1) is a rectangular frame structure. The bracket is provided with multiple mounting holes for fixing the mounting base plate (10-01). The mounting base plate (10-01) is made of metal. The bottom fixture (10) is an integral casting. The surface of the bottom fixture (10) is provided with multiple machining surfaces to adapt to different process requirements.

4. The CSP product plastic packaging jig according to claim 1, wherein, The material placement platform (10-02) is a rectangular platform structure. The surface of the material placement platform (10-02) is provided with multiple positioning grooves for supporting CSP packages. The edge of the material placement platform (10-02) is provided with a guide structure for guiding the CSP packages into and out. The material of the material placement platform (10-02) is aluminum alloy, which has good thermal conductivity and mechanical strength.

5. The CSP product plastic packaging fixture according to claim 2, wherein, The first pressing block (10-03-04) in the material pressing mechanism (10-03) is made of elastic material and can adapt to products of different thicknesses. The surface of the first pressing block (10-03-04) is provided with anti-slip texture to prevent the product from shifting during the pressing process. A buffer pad is provided between the first pressing block (10-03-04) and the cylinder power assembly (10-03-05) to reduce the impact of impact on the product.

6. The CSP product plastic packaging fixture according to claim 1, wherein, The second pressure block (10-04-04) of the positioning mechanism (10-04) is an adjustable structure that can be adjusted according to the product size. The power cylinder (10-04-03) is a linear cylinder that can provide a stable clamping force. The mounting plate (10-04-01) is a horizontal mounting plate used to support the positioning mechanism (10-04) and ensure its stable position.

7. The CSP product plastic sealing jig according to claim 1, wherein The loading and unloading mechanism (3) is powered by a double module (3-01), which can synchronously control the movement of the material handling structure (3-02).

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