Substrate conveying device of bonding equipment

Abstract

The invention relates to a substrate conveying device of bonding equipment, which comprises an operation track and a plurality of substrate clamp devices which are sequentially arranged along the length direction of the operation track, and the operation track comprises an operation track bottom plate, a fixed track, a width adjusting movable track, a fixed track jacking strip and a track width adjusting lifting mechanism, the fixed rail is fixedly arranged on one side of the operation rail bottom plate, the width adjusting movable rail is movably arranged on the other side of the operation rail bottom plate, and the fixed rail jacking strip is arranged on the rail width adjusting lifting mechanism and driven by the rail width adjusting lifting mechanism to ascend and descend. And the width-adjusting movable track is arranged on the track width-adjusting lifting mechanism and is driven by the track width-adjusting lifting mechanism to lift and adjust the width. Height adjustment and distance adjustment of the substrate conveying device are achieved, decoupling between the two adjustments is achieved, the driving load is small, and precision is high.

Description

Technical Field

[0001] This invention relates to a conveying device, and more particularly to a substrate conveying device for a bonding apparatus, belonging to the technical field of conveying devices. Background Technology

[0002] Bonding equipment is the core equipment in semiconductor packaging processes that physically connects and electrically interconnects chips with substrates, wires, or other chips. Bonding equipment needs to complete multiple processing steps, therefore the chip substrates need to be transported and transferred between different stations on the production line via conveyor systems. Currently, a separate production line is typically designed for each type of chip substrate, and the specifications and dimensions of the conveyor system are fixed and adapted to the corresponding chip substrate dimensions. However, with the rapid evolution of chip processing specifications, traditional fixed-structure conveyor equipment has a high obsolescence rate, requiring replacement with new conveyor systems each time a new generation is needed, resulting in high costs. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a substrate transport device for bonding equipment, which can adjust the height and width according to the specifications of the chip substrate.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A substrate conveying device for a bonding equipment includes a working track and a plurality of substrate clamping devices arranged sequentially along the length of the working track. The working track includes a working track base plate, a fixed track, a width-adjusting movable track, a fixed track lifting bar, and a track width-adjusting lifting mechanism. The fixed track is fixedly disposed on one side of the working track base plate, and the width-adjusting movable track is movably disposed on the other side of the working track base plate. The fixed track lifting bar is disposed on the track width-adjusting lifting mechanism and is driven to rise and fall by the track width-adjusting lifting mechanism. The width-adjusting movable track is disposed on the track width-adjusting lifting mechanism and is driven to rise, fall, and adjust width by the track width-adjusting lifting mechanism.

[0005] Furthermore, the track width adjustment and lifting mechanism includes a base support, a lifting motor, a lifting bracket, a lifting mounting block, a width adjustment slider, a width adjustment track, and a width adjustment drive mechanism. The lifting motor is fixed on the base support, the lifting bracket is mounted on the lifting motor and driven by the lifting motor to move up and down in the vertical direction, the fixed track lifting bar is fixed on the lifting bracket, the width adjustment track is perpendicular to the fixed track and fixed on the base support, the width adjustment slider is slidably mounted on the width adjustment track, and the width adjustment slider is driven by the width adjustment drive mechanism to slide back and forth along the length direction of the width adjustment track, the lifting mounting block is slidably mounted on the width adjustment slider and can move up and down on the width adjustment slider in the vertical direction, a pulley is provided at the bottom of the lifting mounting block, the pulley is rotatably mounted on the lifting mounting block, the lower side of the pulley is supported on the upper side of the lifting bracket, the width adjustment movable track is fixed on the upper side of the lifting mounting block, and the width adjustment slider is driven by the width adjustment drive mechanism to move back and forth in the direction perpendicular to the fixed track.

[0006] Furthermore, the width adjustment drive mechanism includes a lead screw, a lead screw support, a nut slider, and a lead screw drive motor. The lead screw is set perpendicular to the fixed track and both ends of the lead screw are rotatably mounted on the lead screw support. The lead screw support is fixed on the base support. One end of the lead screw is connected to the lead screw drive motor and is driven to rotate by the lead screw drive motor. The nut slider is sleeved on the lead screw and threadedly connected to the lead screw. One side of the nut slider is fixedly connected to the width adjustment slider.

[0007] Furthermore, a number of anti-collapse support bars are provided on the upper side of the working track base plate. The anti-collapse support bars are arranged along the length direction of the working track base plate and are embedded in the slot clamps fixed on the working track base plate.

[0008] Furthermore, the substrate clamping device includes a substrate conveying clamp and a clamping driving mechanism. The substrate conveying clamp is driven by the clamping driving mechanism to move back and forth along the length of the working track. The substrate conveying clamp includes an upper jaw, a lower jaw, a spring plate, an electromagnet, a ferromagnetic component, and a reset mechanism. The lower ends of the upper jaw and the lower jaw are arranged vertically opposite each other. The upper end of the upper jaw is connected to the upper end of the lower jaw through the spring plate. The electromagnet is fixed on the lower jaw. The ferromagnetic component is arranged directly above the electromagnet and fixed on the upper jaw. The reset mechanism is arranged between the upper jaw and the lower jaw.

[0009] Furthermore, the lower gripper has a Z-shaped structure, and the lower end of the lower gripper is provided with vertically upward curled lower gripper teeth; the upper gripper has an L-shaped structure, and the lower end of the upper gripper forms upper gripper teeth vertically downward, with the upper gripper teeth and the lower gripper teeth located in the same vertical plane and arranged vertically.

[0010] Furthermore, the upper gripper includes an upper gripper body support and a first gripper tooth and a second gripper tooth, the first gripper tooth and the second gripper tooth being arranged side by side and detachably fixed to the upper gripper body support respectively.

[0011] Furthermore, one end of the spring sheet is fixedly connected to the upper end of the upper jaw, and the other end of the spring sheet is fixedly connected to the upper end of the lower jaw, with a gap between the upper jaw and the lower jaw; an upper limit stop is provided on the upper side of the spring sheet, the upper limit stop is located above the spring sheet and the edge of the upper limit stop extends downward and is fixed on the lower jaw, the upper limit stop limits the upward displacement of the spring sheet.

[0012] Furthermore, the reset mechanism includes a first reset spring and a second reset spring. A spring hole is opened on both sides of the upper end face of the middle part of the Z-shaped structure of the lower jaw. The lower ends of the first reset spring and the second reset spring are fixed in the two spring holes respectively. The upper ends of the first reset spring and the second reset spring abut against the lower side of the horizontal part of the L-shaped structure of the upper jaw and provide an upward elastic force to the upper jaw.

[0013] Furthermore, the clamping drive mechanism includes a driving pulley, a driven pulley, a synchronous belt, and a pulley drive motor. The driving pulley and the driven pulley are rotatably mounted on the base support, the synchronous belt is mounted on the driving pulley and the driven pulley, the substrate conveying clamp is fixed on the synchronous belt, and the driving pulley is mounted on the pulley drive motor and driven to rotate by the pulley drive motor.

[0014] Compared with the prior art, the present invention has the following advantages and effects: 1. The present invention provides a substrate conveying device for bonding equipment, wherein the height of the tracks on both sides can be adjusted, and the spacing between the tracks on both sides can also be adjusted, thereby adapting to the bonding processing of chip substrates of different specifications. 2. This invention decouples the lifting and spacing adjustment of the track by designing a special track width adjustment lifting mechanism. Compared with the conventional lifting mechanism design that requires the spacing adjustment mechanism to move together, the lifting mechanism of this invention does not need to drive the spacing adjustment mechanism to move together when lifting. The load of the lifting drive is greatly reduced, saving energy and increasing control accuracy at the same time. 3. The clamp structure of the present invention uses an electromagnet to drive the clamp to close and clamp the chip substrate. The clamping force can be controlled by adjusting the driving current of the electromagnet. Compared with the existing pneumatic clamps that require additional air pressure regulation equipment, the cost is greatly reduced. In addition, since the electromagnet only needs to be powered, compared with the complex air circuit design of the pneumatic clamp, the electromagnet only needs one power supply line, which is simple in design and low in cost. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a substrate transport device for a bonding apparatus according to the present invention.

[0016] Figure 2 This is a schematic diagram of a substrate transport device for a bonding apparatus according to the present invention from another perspective.

[0017] Figure 3 This is a schematic diagram of the track width adjustment and lifting mechanism of the present invention.

[0018] Figure 4 This is a schematic diagram of the width adjustment drive mechanism of the present invention.

[0019] Figure 5 This is a schematic diagram of the substrate conveying fixture of the present invention.

[0020] Figure 6 This is a schematic diagram of the lower gripper of the present invention.

[0021] Figure 7 This is a schematic diagram of the upper gripper of the present invention. Detailed Implementation

[0022] To illustrate in detail the technical solutions adopted by the present invention to achieve the intended technical objectives, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Furthermore, the technical means or technical features in the embodiments of the present invention can be replaced without creative effort. The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0023] like Figure 1 As shown, a substrate conveying device for a bonding apparatus of the present invention includes a working track 1 and a plurality of substrate clamping devices 2 arranged sequentially along the length of the working track 1.

[0024] like Figure 2 As shown, the working track 1 includes a working track base plate 3, a fixed track 4, a width-adjustable movable track 5, a fixed track lifting bar 34, and a track width-adjusting lifting mechanism. The fixed track 4 is fixedly installed on one side of the working track base plate 3, and the width-adjustable movable track 5 is movably installed on the other side of the working track base plate 3. The fixed track lifting bar 34 is installed on the track width-adjusting lifting mechanism and is driven to rise and fall by the track width-adjusting lifting mechanism. The fixed track lifting bar 34 is also slidably installed on the inner wall of the fixed track 4. The width-adjustable movable track 5 is installed on the track width-adjusting lifting mechanism and is driven to rise, fall, and adjust width by the track width-adjusting lifting mechanism.

[0025] like Figure 3 As shown, the track width adjustment lifting mechanism includes a base support 6, a lifting motor 7, a lifting bracket 8, a lifting mounting block 9, a width adjustment slider 10, a width adjustment track 11, and a width adjustment drive mechanism. The lifting motor 7 is fixed on the base support 6, and the lifting bracket 8 is mounted on the lifting motor 7 and driven by the lifting motor 7 to move vertically. The fixed track lifting bar 34 is fixed on the lifting bracket 8. The width adjustment track 11 is perpendicular to the fixed track 4 and fixed on the base support 6. The width adjustment slider 10 is slidably mounted on the width adjustment track 11. Block 10 is driven by the width adjustment drive mechanism to slide back and forth along the length of the width adjustment track. The lifting mounting block 9 is slidably mounted on the width adjustment slider 10 and can be raised and lowered on the width adjustment slider 10 in the vertical direction. A pulley 12 is provided at the bottom of the lifting mounting block 9. The pulley 12 is rotatably mounted on the lifting mounting block 9. The lower side of the pulley 12 is supported on the upper side of the lifting bracket 8. The width adjustment movable track 5 is fixed on the upper side of the lifting mounting block 9. The width adjustment slider 10 is driven by the width adjustment drive mechanism to move back and forth in a direction perpendicular to the fixed track.

[0026] The lifting motor 7 drives the lifting bracket 8 to move vertically upwards. The fixed track lifting bar 34 moves upwards along with the lifting bracket 8. At the same time, the lifting mounting block 9 is also lifted by the lifting bracket 8 and slides vertically upwards on the width adjustment slider 10. At this time, the fixed track lifting bar 34 and the width adjustment movable track 5 rise synchronously, completing the lifting and lowering adjustment of the two tracks. During this process, since the lifting mounting block 9 is slidably set in the width adjustment slider 10 in the vertical direction, the lifting mounting block 9 will not drive the width adjustment slider 10 to rise or fall during the lifting and lowering process, thus decoupling the lifting and lowering process from the width adjustment process.

[0027] During the width adjustment, the width adjustment drive mechanism drives the width adjustment slider 10 to slide laterally on the width adjustment track 11. Since the lifting mounting block 9 is slidably installed in the width adjustment slider 10 in the vertical direction, the lifting mounting block 9 and the width adjustment slider 10 have degrees of freedom in the vertical direction, but no degrees of freedom in the horizontal direction. Therefore, when the width adjustment slider 10 slides laterally, it will also drive the lifting mounting block 9 to move laterally, thereby realizing the adjustment of the lateral position of the width adjustment movable track 5 and completing the width adjustment of the two side tracks.

[0028] like Figure 4 As shown, the width adjustment drive mechanism includes a lead screw 13, a lead screw support 14, a nut slider 15, and a lead screw drive motor. The lead screw 13 is set perpendicular to the fixed track 4, and both ends of the lead screw 13 are rotatably mounted on the lead screw support 14. The lead screw support 14 is fixed to the base support 6. One end of the lead screw 13 is connected to the lead screw drive motor and is driven to rotate by the lead screw drive motor. The nut slider 15 is sleeved on the lead screw 13 and threadedly connected to the lead screw 13. One side of the nut slider 15 is fixedly connected to the width adjustment slider 10. The lead screw drive motor drives the lead screw 13 to rotate, thereby causing the nut slider 15 to move back and forth along the lead screw 13.

[0029] like Figure 2 As shown, several anti-collapse support bars 16 are provided on the upper side of the working track base plate 3. The anti-collapse support bars 16 are arranged along the length direction of the working track base plate 3 and are embedded in the slot clamps fixed on the working track base plate 3. The lower side of the chip substrate is supported by the several anti-collapse support bars 16 to prevent the chip substrate from collapsing.

[0030] like Figure 4As shown, the substrate clamping device 2 includes a substrate transport clamp 17 and a clamping drive mechanism. The substrate transport clamp 17 is driven by the clamping drive mechanism to move back and forth along the length of the working track. The clamping drive mechanism includes a drive pulley 18, a driven pulley 19, a synchronous belt 20, and a pulley drive motor 21. The drive pulley 18 and the driven pulley 19 are rotatably mounted on the base bracket 6. The synchronous belt 20 is mounted on the drive pulley 18 and the driven pulley 19. The substrate transport clamp 17 is fixed on the synchronous belt 20. The drive pulley 18 is mounted on the pulley drive motor 21 and is driven to rotate by the pulley drive motor 21. The pulley drive motor 21 drives the drive pulley 18 to rotate, thereby causing the synchronous belt 20 to rotate with the drive pulley 18 and the driven pulley 19. The synchronous belt 20 drives the substrate transport clamp 17 to move back and forth.

[0031] like Figure 5 , Figure 6 and Figure 7 As shown, the substrate conveying fixture 17 includes an upper jaw 22, a lower jaw 23, a spring plate 24, an electromagnet 25, a ferromagnetic component 26, and a reset mechanism. The lower ends of the upper jaw 22 and the lower ends of the lower jaw 23 are arranged vertically opposite each other. The upper end of the upper jaw 22 is connected to the upper end of the lower jaw 23 through the spring plate 24. The electromagnet 25 is fixed on the lower jaw 23. The ferromagnetic component 26 is arranged directly above the electromagnet 25 and fixed on the upper jaw 22. The reset mechanism is arranged between the upper jaw 22 and the lower jaw 23.

[0032] The lower jaw 23 has a Z-shaped structure, and the lower end of the lower jaw 23 is provided with a vertically upward curled lower jaw tooth 27; the upper jaw 22 has an L-shaped structure, and the lower end of the upper jaw 22 forms an upper jaw tooth vertically downward. The upper jaw tooth and the lower jaw tooth 27 are located in the same vertical plane and are arranged vertically.

[0033] The upper gripper 22 includes an upper gripper main support 28 and a first gripper tooth 29 and a second gripper tooth 30. The first gripper tooth 29 and the second gripper tooth 30 are arranged side by side and are detachably fixed to the upper gripper main support 28. Through the detachable design of the two sections of gripper teeth, the appropriate number and position of gripper teeth can be installed according to the actual workstation requirements, making the gripper structure more versatile.

[0034] One end of the spring plate 24 is fixedly connected to the upper end of the upper jaw 22, and the other end of the spring plate 24 is fixedly connected to the upper end of the lower jaw 23, with a gap between the upper jaw 22 and the lower jaw 23; an upper limit stop 31 is provided on the upper side of the spring plate 24, the upper limit stop 31 is located above the spring plate 24 and the edge of the upper limit stop 31 extends downward and is fixed on the lower jaw 23, the upper limit stop 31 limits the upward displacement of the spring plate 24.

[0035] The reset mechanism includes a first reset spring 32 and a second reset spring 33. A spring hole is opened on both sides of the upper end face of the middle part of the Z-shaped structure of the lower jaw 23. The lower ends of the first reset spring 32 and the second reset spring 33 are fixed in the two spring holes respectively. The upper ends of the first reset spring 32 and the second reset spring 33 abut against the lower side of the horizontal part of the L-shaped structure of the upper jaw 22 and provide an upward elastic force to the upper jaw 22.

[0036] The input current of the electromagnet is adjusted according to the required clamping force of the substrate. When the electromagnet 25 is energized, it generates an attractive force, which in turn attracts the ferromagnetic component 26 downwards. The ferromagnetic component 26 is attracted downwards to the upper end of the electromagnet 25. Since the ferromagnetic component 26 is fixed on the upper jaw 22, the upper jaw 22 is driven to move downwards, causing the first jaw tooth 29 and the second jaw tooth 30 to clamp and close with the lower jaw tooth 27, thereby completing the clamping action of the chip substrate. During the downward movement of the upper jaw 22, the spring plate 24 bends downwards, and at the same time, the first reset spring 32 and the second reset spring 33 are compressed and stored. When the electromagnet 25 is de-energized, the attractive force of the ferromagnetic component 26 disappears, and the upper jaw 22 returns to its original position under the combined action of the first reset spring 32 and the second reset spring 33, until the upper side of the spring plate 24 abuts against the upper limit member 31 to complete the limit, thus completing one clamping and releasing action of the substrate transport fixture.

[0037] This invention provides a substrate conveying device for bonding equipment. The height of the tracks on both sides is adjustable, and the spacing between the tracks is also adjustable, thus adapting to the bonding of chip substrates of different specifications. This invention decouples the lifting and spacing adjustments of the tracks through a special track width adjustment lifting mechanism. Compared to conventional lifting mechanisms that require the spacing adjustment mechanism to move along with the lifting mechanism, the lifting mechanism of this invention does not need to move the spacing adjustment mechanism during lifting, significantly reducing the load on the lifting drive, saving energy, and increasing control precision. The clamping structure of this invention uses an electromagnet to drive the clamp to close and hold the chip substrate. The clamping force can be controlled simply by adjusting the driving current of the electromagnet. Compared to existing pneumatic clamps that require additional air pressure regulation equipment, this significantly reduces costs. Furthermore, since the electromagnet only needs power, compared to the complex air circuit design of pneumatic clamps, the electromagnet only requires a single power supply line, resulting in a simple and low-cost design.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent substitutions, and improvements made to the above embodiments without departing from the scope of the present invention, based on the technical essence of the present invention and within the spirit and principles of the present invention, shall still fall within the protection scope of the present invention.

Claims

1. A substrate conveying device for a bonding apparatus, characterized in that: The device includes a working track and several base plate clamping devices arranged sequentially along the length of the working track. The working track includes a working track base plate, a fixed track, a width-adjusting movable track, a fixed track lifting bar, and a track width-adjusting lifting mechanism. The fixed track is fixedly installed on one side of the working track base plate, and the width-adjusting movable track is movably installed on the other side of the working track base plate. The fixed track lifting bar is installed on the track width-adjusting lifting mechanism and is driven to rise and fall by the track width-adjusting lifting mechanism. The width-adjusting movable track is installed on the track width-adjusting lifting mechanism and is driven to rise, fall, and adjust width by the track width-adjusting lifting mechanism.

2. The substrate conveying device for a bonding apparatus according to claim 1, characterized in that: The track width adjustment and lifting mechanism includes a base support, a lifting motor, a lifting bracket, a lifting mounting block, a width adjustment slider, a width adjustment track, and a width adjustment drive mechanism. The lifting motor is fixed on the base support, and the lifting bracket is mounted on the lifting motor and driven by the lifting motor to move vertically. The fixed track lifting bar is fixed on the lifting bracket. The width adjustment track is perpendicular to the fixed track and fixed on the base support. The width adjustment slider is slidably mounted on the width adjustment track and is driven by the width adjustment drive mechanism to slide back and forth along the length of the width adjustment track. The lifting mounting block is slidably mounted on the width adjustment slider and can move up and down vertically on the width adjustment slider. A pulley is provided at the bottom of the lifting mounting block and is rotatably mounted on the lifting mounting block. The lower side of the pulley is supported on the upper side of the lifting bracket. The width adjustment movable track is fixed on the upper side of the lifting mounting block, and the width adjustment slider is driven by the width adjustment drive mechanism to move back and forth in a direction perpendicular to the fixed track.

3. The substrate conveying device for a bonding apparatus according to claim 2, characterized in that: The width adjustment drive mechanism includes a lead screw, a lead screw support, a nut slider, and a lead screw drive motor. The lead screw is set perpendicular to the fixed track and both ends of the lead screw are rotatably mounted on the lead screw support. The lead screw support is fixed on the base support. One end of the lead screw is connected to the lead screw drive motor and is driven to rotate by the lead screw drive motor. The nut slider is sleeved on the lead screw and threadedly connected to the lead screw. One side of the nut slider is fixedly connected to the width adjustment slider.

4. The substrate conveying device for a bonding apparatus according to claim 1, characterized in that: Several anti-collapse support bars are provided on the upper side of the working track base plate. The anti-collapse support bars are arranged along the length direction of the working track base plate and are embedded in the slot clamps fixed on the working track base plate.

5. The substrate conveying device for a bonding apparatus according to claim 1, characterized in that: The substrate clamping device includes a substrate conveying clamp and a clamping drive mechanism. The substrate conveying clamp is driven by the clamping drive mechanism to move back and forth along the length of the working track. The substrate conveying clamp includes an upper jaw, a lower jaw, a spring plate, an electromagnet, a ferromagnetic component, and a reset mechanism. The lower ends of the upper jaw and the lower jaw are arranged vertically opposite each other. The upper end of the upper jaw is connected to the upper end of the lower jaw through the spring plate. The electromagnet is fixed on the lower jaw. The ferromagnetic component is arranged directly above the electromagnet and fixed on the upper jaw. The reset mechanism is arranged between the upper jaw and the lower jaw.

6. The substrate conveying device for a bonding apparatus according to claim 5, characterized in that: The lower gripper has a Z-shaped structure, and the lower end of the lower gripper has vertically upward curled lower gripper teeth; the upper gripper has an L-shaped structure, and the lower end of the upper gripper forms upper gripper teeth vertically downward. The upper gripper teeth and the lower gripper teeth are located in the same vertical plane and are arranged vertically.

7. The substrate conveying device for a bonding apparatus according to claim 6, characterized in that: The upper gripper includes an upper gripper main support and a first claw tooth and a second claw tooth. The first claw tooth and the second claw tooth are arranged side by side and are detachably fixed to the upper gripper main support.

8. The substrate conveying device for a bonding apparatus according to claim 5, characterized in that: One end of the spring sheet is fixedly connected to the upper end of the upper jaw, and the other end of the spring sheet is fixedly connected to the upper end of the lower jaw, with a gap between the upper jaw and the lower jaw; an upper limit stop is provided on the upper side of the spring sheet, the upper limit stop is located above the spring sheet and the edge of the upper limit stop extends downward and is fixed on the lower jaw, the upper limit stop limits the upward displacement of the spring sheet.

9. A substrate conveying device for a bonding apparatus according to claim 5, characterized in that: The reset mechanism includes a first reset spring and a second reset spring. A spring hole is opened on both sides of the upper end face of the middle part of the Z-shaped structure of the lower jaw. The lower ends of the first reset spring and the second reset spring are fixed in the two spring holes respectively. The upper ends of the first reset spring and the second reset spring abut against the lower side of the horizontal part of the L-shaped structure of the upper jaw and provide an upward elastic force to the upper jaw.

10. A substrate conveying device for a bonding apparatus according to claim 5, characterized in that: The clamping drive mechanism includes a driving pulley, a driven pulley, a synchronous belt, and a pulley drive motor. The driving pulley and the driven pulley are rotatably mounted on the base support. The synchronous belt is mounted on the driving pulley and the driven pulley. The substrate conveying clamp is fixed on the synchronous belt. The driving pulley is mounted on the pulley drive motor and is driven to rotate by the pulley drive motor.

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