A system and method for detecting a gas in an environment within a wafer cassette

Abstract

The embodiment of the application provides a kind of wafer box inner environment gas detection system and method, it is related to semiconductor technical field, can realize the real-time monitoring of wafer box inner environment.The system includes: air supplement module, for filling clean gas into wafer box, wherein the air supplement module is used to be communicated with the gas inlet of wafer box by the gas outlet on wafer preparation device;Gas collection module, for collecting the detected gas discharged by the wafer box under the condition that the air supplement module fills the wafer box, wherein the gas collection module is used to be communicated with the gas outlet of wafer box by the gas inlet on wafer preparation device;Gas detection module, for detecting the detected gas, to determine the gas composition in the wafer box, wherein the gas detection module is arranged in gas detection device, and the gas detection module is communicated with the gas collection module by gas channel.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a gas detection system and method for the environment inside a wafer cassette. Background Technology

[0002] In the process of semiconductor device fabrication, wafers typically need to go through multiple different processes, each corresponding to a different process equipment. Between different process equipment, wafers need to be loaded into wafer cassettes for transfer and transport.

[0003] During wafer fabrication, impurities often remain on the wafer. When the wafer is transferred to a wafer cassette, gaseous impurities from the surrounding environment and the wafer surface are transferred into the cassette, contaminating the internal environment and affecting the product yield. However, traditional methods for gas detection within wafer cassettes are often insufficient for real-time monitoring, leading to poor timeliness of detection results. This can cause secondary contamination of the wafers stored within the cassette, further impacting wafer fabrication quality. Summary of the Invention

[0004] This application provides a gas detection system and method for the internal environment of a wafer cell, which can realize real-time monitoring of the internal environment of the wafer cell, improve the detection quality of the internal environment of the wafer cell, further improve the preparation quality of the wafers loaded inside the wafer cell, and improve the product yield.

[0005] A first aspect of this application provides a gas detection system for the environment inside a wafer cassette, comprising:

[0006] A gas replenishment module is used to fill the wafer cassette with clean gas, wherein the gas replenishment module is connected to the gas inlet of the wafer cassette through the gas outlet on the wafer fabrication apparatus;

[0007] A gas collection module is used to collect the gas to be tested discharged from the wafer cassette when the gas replenishment module fills the wafer cassette with gas. The gas collection module is connected to the gas outlet of the wafer cassette through the gas inlet on the wafer fabrication apparatus.

[0008] A gas detection module is used to detect the gas to be detected in order to determine the gas composition in the wafer cell. The gas detection module is disposed in the gas detection device and is connected to the gas collection module through a gas channel.

[0009] In some embodiments, the gas detection system for the wafer cassette environment further includes:

[0010] The control module is used to control the air inlet and air outlet of the wafer fabrication apparatus to open after the wafer cassette is moved to the wafer fabrication apparatus and before the wafer fabrication apparatus fabricates the wafer loaded in the wafer cassette.

[0011] In some embodiments, the gas detection system for the wafer cassette environment further includes:

[0012] The alarm module is used to determine the pollution status of the gas environment inside the wafer cassette based on the gas composition inside the wafer cassette, and to send an alarm message when the gas environment inside the wafer cassette is polluted.

[0013] In some embodiments, the gas replenishment module is used to fill the wafer cassette with clean gas when a wafer is loaded inside the cassette.

[0014] In some implementations, the gas replenishment module corresponds one-to-one with the gas collection module, and one gas detection module corresponds to multiple sets of gas replenishment modules and gas collection modules.

[0015] In some embodiments, when one gas detection module corresponds to multiple sets of gas replenishment modules and gas collection modules, the gas channels connected to different gas collection modules are independent of each other.

[0016] A second aspect of this application provides a gas detection method for the environment inside a wafer cassette, comprising:

[0017] Clean gas is supplied to the wafer cassette via a gas supply module, wherein the gas supply module is connected to the gas inlet of the wafer cassette via a gas outlet on the wafer fabrication apparatus.

[0018] The gas collection module collects the gas to be tested discharged from the wafer cassette when the gas replenishment module fills the wafer cassette with gas. The gas collection module is used to connect the gas inlet on the wafer fabrication device to the gas outlet of the wafer cassette.

[0019] The gas to be detected is detected by a gas detection module to determine the gas composition in the wafer cell. The gas detection module is located inside the gas detection device and is connected to the gas collection module through a gas channel.

[0020] In some embodiments, the gas detection method for the environment inside the wafer cassette further includes:

[0021] The operating status of each wafer fabrication apparatus is determined based on the gas composition of the same wafer cassette in different wafer fabrication apparatuses.

[0022] In some embodiments, determining the operating status of each wafer fabrication apparatus based on the gas composition of the same wafer cassette in different wafer fabrication apparatuses includes:

[0023] Obtain the preceding wafer fabrication apparatus and the target wafer fabrication apparatus corresponding to the target wafer cassette, wherein the preceding wafer fabrication apparatus and the target wafer fabrication apparatus are two adjacent wafer fabrication apparatuses in the fabrication process corresponding to the wafer in the wafer cassette;

[0024] The first gas composition of the target wafer cassette during the preceding wafer fabrication apparatus and the second gas composition of the target wafer cassette during the target wafer fabrication apparatus are obtained;

[0025] Based on the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the first gas composition, the target gas composition of the target wafer cassette in the target wafer fabrication apparatus is determined;

[0026] The operating status of the preceding wafer fabrication apparatus is determined by comparing the target gas composition with the second gas composition.

[0027] In some embodiments, determining the target gas composition of the target wafer cassette in the target wafer fabrication apparatus based on the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the first gas composition includes:

[0028] The fabrication completion time of the preceding wafer fabrication apparatus and the gas detection time of the target wafer fabrication apparatus are obtained.

[0029] The reaction time of the gas components in the target wafer cell is determined based on the time difference between the preparation completion time and the gas detection time.

[0030] Based on the first gas composition, the fabrication process of the preceding wafer fabrication apparatus, and the reaction time, the target gas composition of the target wafer cassette in the target wafer fabrication apparatus is determined.

[0031] This application provides a gas detection system and method for the internal environment of a wafer cassette. By setting an outlet and an inlet on the wafer fabrication apparatus, and connecting the outlet and inlet of the wafer fabrication apparatus to the inlet and outlet of the wafer cassette respectively, the gas composition of the internal environment of the wafer cassette containing the wafer can be detected when the wafer cassette is transported to the corresponding wafer fabrication apparatus. The wafer cassette is inflated by a gas replenishment module to promote the discharge of gas inside the wafer cassette. A gas collection module collects the gas inside the wafer cassette, and the gas collection module is connected to a gas detection module in a gas detection device via a gas channel. This allows the gas to be detected to be transmitted to the gas detection module, thereby facilitating remote detection of the gas inside the wafer cassette and determining the gas composition of the internal environment of the wafer cassette containing the wafer. It enables the sharing of gas detection modules and allows for real-time in-situ monitoring of the environment inside the wafer cell, improving the detection quality and efficiency. This facilitates the assessment of the contamination impact of the wafer cell environment on the wafer based on the gas composition, allowing for timely cleaning and replacement of the wafer cell. Ultimately, this improves the fabrication quality of the wafers loaded inside the wafer cell and increases product yield. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A schematic structural diagram of a gas detection system for the environment inside a wafer cassette, provided in an embodiment of this application;

[0034] Figure 2 A schematic structural diagram of another gas detection system for the environment inside a wafer cassette provided in an embodiment of this application;

[0035] Figure 3 A schematic structural diagram of another gas detection system for the environment inside a wafer cassette provided in this application embodiment;

[0036] Figure 4 A schematic flowchart illustrating a gas detection method for the environment inside a wafer cassette, provided as an embodiment of this application;

[0037] Figure 5 A schematic flowchart illustrating another gas detection method for the environment inside a wafer cassette provided in this application embodiment;

[0038] Figure 6A schematic flowchart illustrating another gas detection method for the environment inside a wafer cassette provided in this application embodiment;

[0039] Figure 7 This is a schematic flowchart illustrating another gas detection method for the environment inside a wafer cell provided in an embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 00. Wafer box; 100. Gas replenishment module; 200. Gas collection module; 300. Gas detection module. Detailed Implementation

[0042] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0044] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0045] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0046] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0047] In the process of semiconductor device fabrication, wafers typically need to go through multiple different processes, each corresponding to a different process equipment. Between different process equipment, wafers need to be loaded into wafer cassettes for transfer and transport.

[0048] During wafer fabrication, the process environment may contain residual impurities such as moisture, acidic gases, alkaline gases, and volatile organic compounds. When the wafer is transferred to the wafer cassette, these gaseous impurities are also transferred into the cassette, causing contamination of the cassette environment. Simultaneously, impurities on the wafer surface may also contaminate the inner surface of the cassette through contact with the wafer cassette. This contamination of the cassette environment further impacts the wafers within the cassette, leading to reduced product yield.

[0049] Therefore, proposing a gas detection system for the environment inside a wafer cassette that can achieve real-time monitoring of the environment inside the wafer cassette is a technical problem that urgently needs to be solved.

[0050] like Figure 1As shown, a first aspect of this application provides a gas detection system for the environment inside a wafer cassette, comprising: a gas replenishment module 100, a gas collection module 200, and a gas detection module 300. The gas replenishment module 100 is used to fill the wafer cassette 00 with clean gas, and is connected to the gas inlet of the wafer cassette 00 via a gas outlet on the wafer fabrication apparatus. The gas collection module 200 is used to collect the gas to be detected discharged from the wafer cassette 00 while the gas replenishment module 100 is filling the wafer cassette 00, and is connected to the gas outlet of the wafer cassette 00 via a gas inlet on the wafer fabrication apparatus. The gas detection module 300 is used to detect the gas to be detected to determine the gas composition within the wafer cassette 00, and is disposed within a gas detection device, and is connected to the gas collection module 200 via a gas channel.

[0051] It should be noted that the wafer cell 00 is the detection object of the gas detection system for the wafer cell environment provided in the embodiments of this application, and is not a structure within the gas detection system for the wafer cell environment. The parts of the drawings in the specification of this application involving the wafer cell 00 are only for the purpose of facilitating the understanding of the technical solution.

[0052] For example, such as Figure 2 As shown, the gas replenishment module 100 and the gas collection module 200 can be installed in the wafer fabrication apparatus, and the gas detection module 300 is installed in the gas detection device. A gas channel is provided between the wafer fabrication apparatus and the gas detection device, and the gas channel is used to connect the gas detection module 300 and the gas collection module 200.

[0053] For example, such as Figure 3 As shown, the gas replenishment module 100 and the gas collection module 200 can also be installed within the gas detection device. A gas channel is provided between the wafer fabrication apparatus and the gas detection device. One end of one gas channel is connected to the gas inlet of the wafer cassette 00 via the gas outlet of the wafer fabrication apparatus, and the other end is connected to the gas outlet of the gas replenishment module 100, allowing clean gas output from the gas replenishment module 100 to enter the wafer cassette 00 through the gas channel. Another gas channel is connected to the gas outlet of the wafer cassette 00 via the gas inlet of the wafer fabrication apparatus, and the other end is connected to the gas inlet of the gas collection module 200, allowing the gas to be detected within the wafer cassette 00 to be output to the gas collection module 200. Multiple wafer fabrication apparatuses can correspond to a set of gas replenishment modules 100 and gas collection modules 200. The gas inlets and outlets of each wafer fabrication apparatus are connected to the gas collection module 200 and the gas replenishment module 100 respectively via gas channels.

[0054] For example, the gas replenishment module 100 may include a gas pump for preparing clean gas or pumping clean gas into the wafer cassette 00. The clean gas may include high-purity air or high-purity nitrogen, etc.

[0055] The gas detection system for the internal environment of a wafer cassette provided in this application embodiment, by setting an outlet and an inlet on the wafer fabrication apparatus and connecting the outlet and inlet of the wafer fabrication apparatus to the inlet and outlet of the wafer cassette 00 respectively, allows for the detection of the gas composition of the internal environment of the wafer cassette 00 containing the wafer when it is transported to the corresponding wafer fabrication apparatus. The wafer cassette 00 is inflated by a gas replenishment module 100 to promote the discharge of gas from the wafer cassette 00. The gas is collected by a gas collection module 200 and connected to a gas detection module 300 within a gas detection device via a gas channel. This allows the gas to be detected to be transmitted to the gas detection module 300, facilitating remote detection of the gas within the wafer cassette 00 and determining the gas composition of the internal environment of the wafer cassette 00 containing the wafer. It enables the sharing of gas detection modules 300 and allows for real-time in-situ monitoring of the environment inside the wafer cassette 00, improving the detection quality and efficiency of the environment inside the wafer cassette 00. This facilitates the assessment of the contamination impact of the environment inside the wafer cassette 00 on the wafer based on the gas composition, allowing for timely cleaning and replacement of the wafer cassette 00. Ultimately, this improves the fabrication quality of the wafers loaded inside the wafer cassette 00 and increases product yield.

[0056] In some feasible embodiments, the gas detection system for the environment inside the wafer cassette further includes a control module for controlling the opening of the air inlet and the air outlet of the wafer fabrication apparatus after the wafer cassette 00 is moved to the wafer fabrication apparatus and before the wafer fabrication apparatus fabricates the wafer loaded in the wafer cassette 00.

[0057] The gas detection system for the wafer cassette environment provided in this application embodiment, by setting a control module, controls the opening and closing of the air inlet and outlet of the wafer fabrication device according to the position of the wafer cassette 00 and the fabrication status of the wafer loaded in the wafer cassette 00. It can automatically start detecting the gas composition of the environment inside the wafer cassette 00 before the wafer loaded in the wafer cassette 00 enters the corresponding wafer fabrication device, thereby facilitating timely replacement of the wafer cassette 00, avoiding damage to the wafer loaded in the wafer cassette 00 by contaminating gases inside the wafer cassette 00, improving the cleanliness of the wafer surface, improving the wafer fabrication quality, and increasing product yield.

[0058] In some feasible implementations, the gas detection system for the environment inside the wafer cell further includes an alarm module, used to determine the pollution status of the gas environment inside the wafer cell 00 based on the gas composition inside the wafer cell 00, and to send alarm information when the gas environment inside the wafer cell 00 is polluted.

[0059] For example, the alarm information may include the specific composition of various gases inside the wafer cassette 00, the location of the wafer fabrication apparatus where the wafer cassette 00 is located, and the model of the wafer cassette 00.

[0060] The gas detection system for the internal environment of a wafer cassette provided in this application embodiment, by setting an alarm module, can facilitate the location of wafer cassettes 00 where the internal environment is contaminated by management personnel, and promptly transfer the wafers loaded in the contaminated wafer cassettes 00 to clean wafer cassettes 00, shortening the contact time between the wafers and the contaminated environment, further reducing the damage of contaminated gases to the wafer surface, and reducing the management cost in the wafer fabrication process.

[0061] In some feasible implementations, the gas replenishment module 100 is used to fill the wafer cassette 00 with clean gas when the wafer is loaded inside the wafer cassette 00.

[0062] The gas detection system for the internal environment of a wafer cassette provided in this application embodiment, by setting up a gas replenishment module 100 to fill the wafer cassette 00 containing wafers with clean gas, can realize gas detection of the internal environment of the wafer cassette 00 under load, thereby further realizing real-time monitoring of the internal environment of the wafer cassette and improving the detection quality of the internal environment of the wafer cassette.

[0063] In some feasible implementations, the gas replenishment module 100 corresponds one-to-one with the gas collection module 200, and one gas detection module 300 corresponds to multiple sets of gas replenishment modules 100 and gas collection modules 200.

[0064] The gas detection system for the wafer cell environment provided in this application embodiment, by setting one gas detection module 300 to correspond to multiple sets of gas replenishment modules 100 and gas collection modules 200, allows one gas detection module 300 to correspond to multiple wafer fabrication devices, thereby reducing the number of gas detection modules 300, improving the utilization rate of gas detection modules 300, saving gas detection costs in the wafer cell environment, and reducing management costs in the wafer fabrication process.

[0065] In some feasible implementations, when one gas detection module 300 corresponds to multiple sets of gas replenishment modules 100 and gas collection modules 200, the gas channels connected to different gas collection modules 200 are independent of each other.

[0066] The gas detection system for the wafer cell environment provided in this application embodiment can avoid cross-contamination of gas components in each wafer cell 00 by setting up independent gas channels, thereby affecting the accuracy of the detection results of the gas detection module 300 and improving the objectivity and accuracy of the gas detection system.

[0067] like Figure 4As shown, a second aspect of this application provides a gas detection method for the environment inside a wafer cassette, comprising:

[0068] Step S110: Inject clean gas into the wafer cassette through the gas replenishment module, wherein the gas replenishment module is used to connect the gas outlet on the wafer fabrication device to the gas inlet of the wafer cassette.

[0069] Step S120: When the wafer cell is filled with gas by the gas replenishment module, the gas to be tested discharged from the wafer cell is collected by the gas collection module. The gas collection module is used to connect the gas inlet on the wafer fabrication device to the gas outlet of the wafer cell.

[0070] Step S130: Detect the gas to be detected by the gas detection module to determine the gas composition in the wafer cell. The gas detection module and the gas collection module are connected through a gas channel.

[0071] This application provides a gas detection method for the internal environment of a wafer cassette. By setting an outlet and an inlet on the wafer fabrication apparatus, and connecting the outlet and inlet of the wafer fabrication apparatus to the inlet and outlet of the wafer cassette respectively, the gas composition of the internal environment of the wafer cassette containing the wafer can be detected when the wafer cassette is transported to the corresponding wafer fabrication apparatus. The wafer cassette is inflated by a gas replenishment module to promote the discharge of gas inside the wafer cassette. A gas collection module collects the gas inside the wafer cassette, and the gas collection module is connected to a gas detection module in a gas detection device through a gas channel. The gas to be detected can be transmitted to the gas detection module, thereby facilitating remote detection of the gas inside the wafer cassette and determining the gas composition of the internal environment of the wafer cassette containing the wafer. It enables the sharing of gas detection modules and allows for real-time in-situ monitoring of the environment inside the wafer cell, improving the detection quality and efficiency. This facilitates the assessment of the contamination impact of the wafer cell environment on the wafer based on the gas composition, allowing for timely cleaning and replacement of the wafer cell. Ultimately, this improves the fabrication quality of the wafers loaded inside the wafer cell and increases product yield.

[0072] like Figure 5 As shown, in some feasible embodiments, the gas detection method for the environment inside a wafer cell includes steps S210 to S240. Steps S210 to S230 are as described above and will not be repeated here. Based on the above, the gas detection method for the environment inside a wafer cell further includes:

[0073] Step S240: Determine the operating status of each wafer fabrication device based on the gas composition of the same wafer cassette in different wafer fabrication devices.

[0074] This application provides a gas detection method for the environment inside a wafer cassette. By monitoring the changes in gas composition within the same wafer cassette at different process stages, and considering the impact of different wafer fabrication processes on the gas composition of the wafer cassette environment, it can determine whether the gas composition detected in the wafer cassette at the corresponding wafer fabrication device conforms to the variation pattern of the wafers loaded in the wafer cassette at different process stages. This allows for the determination of whether the wafer fabrication device at different process stages has experienced operational malfunctions, causing gas contamination within the wafer cassette environment. Based on the gas composition within the wafer cassette environment, fault detection and fault location of the wafer fabrication device can be achieved, improving the practicality of gas detection results within the wafer cassette environment, increasing wafer fabrication yield, and reducing management costs in the wafer fabrication process.

[0075] like Figure 6 As shown, in some feasible embodiments, the gas detection method for the environment inside the wafer cassette includes steps S310 to S370. Steps S310 to S330 are as described above and will not be repeated here. Based on the above, the operating status of each wafer fabrication apparatus is determined according to the gas composition of the same wafer cassette in different wafer fabrication devices, including:

[0076] Step S340: Obtain the preceding wafer fabrication apparatus and the target wafer fabrication apparatus corresponding to the target wafer cassette, wherein the preceding wafer fabrication apparatus and the target wafer fabrication apparatus are two adjacent wafer fabrication apparatuses in the fabrication process corresponding to the wafer within the wafer cassette.

[0077] Step S350: Obtain the first gas composition of the target wafer cassette in the preceding wafer fabrication apparatus and the second gas composition of the target wafer cassette in the target wafer fabrication apparatus.

[0078] Step S360: Determine the target gas composition of the target wafer cassette in the target wafer fabrication apparatus based on the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the composition of the first gas.

[0079] Step S370: Compare the target gas composition and the second gas composition to determine the operating status of the preceding wafer fabrication apparatus.

[0080] This application provides a gas detection method for the environment inside a wafer cassette. By analyzing the fabrication process of the preceding wafer fabrication apparatus and the first gas composition measured before the wafer cassette enters the preceding fabrication apparatus, the changing gas composition introduced into the wafer cassette environment during the current wafer fabrication process can be determined. Furthermore, by analyzing the first gas composition and the changing gas composition, the target gas composition formed in the wafer cassette after completing the preceding wafer fabrication process can be determined. By comparing the target gas composition with the second gas composition measured after the wafer cassette completes the preceding wafer fabrication process, it can be determined whether there is a difference between the actual and expected fabrication process of the preceding wafer fabrication apparatus, and thus whether there is a malfunction in the preceding wafer fabrication apparatus. This method can further improve the practicality of gas detection results within the wafer cassette environment, increase wafer fabrication yield, and reduce management costs in the wafer fabrication process.

[0081] like Figure 7 As shown, in some feasible embodiments, the gas detection method for the environment inside the wafer cassette includes steps S410 to S490. Steps S410 to S450, and step S490, are as described above and will not be repeated here. Based on the foregoing, according to the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the first gas composition, the target gas composition of the target wafer cassette in the target wafer fabrication apparatus is determined, including:

[0082] Step S460: Obtain the preparation completion time of the preceding wafer fabrication apparatus and the gas detection time of the target wafer fabrication apparatus.

[0083] Step S470: Determine the reaction time of the gas components in the target wafer cell based on the time difference between the preparation completion time and the gas detection time.

[0084] Step S480: Determine the target gas composition of the target wafer cassette in the target wafer fabrication apparatus based on the first gas composition, the fabrication process of the preceding wafer fabrication apparatus, and the reaction time.

[0085] This application provides a gas detection method for the environment inside a wafer cassette. Based on the fabrication process of the preceding wafer fabrication apparatus, other gas components are introduced when the wafer is transferred back to the original wafer cassette after fabrication. Furthermore, by obtaining the time difference between the completion time of the preceding wafer fabrication apparatus and the gas detection time of the target wafer fabrication apparatus, the reaction time between the other gas components and the first gas component can be determined. Therefore, based on the chemical reactions that can occur between the other gas components and the first gas component, the target gas component can be determined. This avoids simply superimposing the first gas component with other gas components, improving the accuracy and objectivity of the target gas component. This further improves the accuracy of fault location during wafer fabrication, reduces the risk of misjudgment, lowers management costs in the wafer fabrication process, and increases the yield of wafer fabrication.

[0086] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0087] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A gas detection system for the environment inside a wafer cassette, characterized in that, include: A gas replenishment module is used to fill the wafer cassette with clean gas, wherein the gas replenishment module is connected to the gas inlet of the wafer cassette through the gas outlet on the wafer fabrication apparatus; A gas collection module is used to collect the gas to be tested discharged from the wafer cassette when the gas replenishment module fills the wafer cassette with gas. The gas collection module is connected to the gas outlet of the wafer cassette through the gas inlet on the wafer fabrication apparatus. A gas detection module is used to detect the gas to be detected in order to determine the gas composition in the wafer cell. The gas detection module is disposed in the gas detection device and is connected to the gas collection module through a gas channel. The control module is used to control the air inlet and air outlet of the wafer fabrication apparatus to open after the wafer cassette is moved to the wafer fabrication apparatus and before the wafer fabrication apparatus fabricates the wafer loaded in the wafer cassette. The gas replenishment module corresponds one-to-one with the gas collection module, and one gas detection module corresponds to multiple sets of gas replenishment modules and gas collection modules.

2. The gas detection system for the environment inside a wafer cassette according to claim 1, characterized in that, The gas replenishment module and the gas collection module are disposed within the wafer fabrication apparatus; or The gas replenishment module and the gas collection module are installed inside the gas detection device.

3. The gas detection system for the environment inside a wafer cassette according to claim 1, characterized in that, Also includes: The alarm module is used to determine the pollution status of the gas environment inside the wafer cassette based on the gas composition inside the wafer cassette, and to send an alarm message when the gas environment inside the wafer cassette is polluted.

4. The gas detection system for the environment inside a wafer cassette according to claim 1, characterized in that, The gas replenishment module is used to fill the wafer cassette with clean gas when the wafer is loaded in the wafer cassette.

5. The gas detection system for the environment inside a wafer cassette according to claim 1, characterized in that, The gas replenishment module includes a gas pump for preparing clean gas or pumping clean gas into the wafer cassette.

6. The gas detection system for the environment inside a wafer cassette according to claim 1, characterized in that, In the case where one gas detection module corresponds to multiple sets of gas replenishment modules and gas collection modules, the gas channels connected to different gas collection modules are independent of each other.

7. A method for detecting gases in the environment inside a wafer cell, characterized in that, include: After the wafer cassette is moved to the wafer fabrication apparatus, and before the wafer fabrication apparatus fabricates the wafer loaded in the wafer cassette, the air inlet and the air outlet of the wafer fabrication apparatus are controlled to open. Clean gas is supplied to the wafer cassette via a gas supply module, wherein the gas supply module is connected to the gas inlet of the wafer cassette via a gas outlet on the wafer fabrication apparatus. The gas collection module collects the gas to be tested discharged from the wafer cassette when the gas replenishment module fills the wafer cassette with gas. The gas collection module is used to connect the gas inlet on the wafer fabrication device to the gas outlet of the wafer cassette. The gas to be detected is detected by a gas detection module to determine the gas composition in the wafer cell. The gas detection module is disposed in a gas detection device and is connected to the gas collection module through a gas channel. The gas replenishment module corresponds one-to-one with the gas collection module, and one gas detection module corresponds to multiple sets of gas replenishment modules and gas collection modules.

8. The gas detection method for the environment inside a wafer cell according to claim 7, characterized in that, Also includes: The operating status of each wafer fabrication apparatus is determined based on the gas composition of the same wafer cassette in different wafer fabrication apparatuses. The step of determining the operating status of each wafer fabrication apparatus based on the gas composition of the same wafer cassette in different wafer fabrication apparatuses includes: Obtain the preceding wafer fabrication apparatus and the target wafer fabrication apparatus corresponding to the target wafer cassette, wherein the preceding wafer fabrication apparatus and the target wafer fabrication apparatus are two adjacent wafer fabrication apparatuses in the fabrication process corresponding to the wafer in the wafer cassette; The first gas composition of the target wafer cassette during the preceding wafer fabrication apparatus and the second gas composition of the target wafer cassette during the target wafer fabrication apparatus are obtained; Based on the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the first gas composition, the target gas composition of the target wafer cassette in the target wafer fabrication apparatus is determined; The operating status of the preceding wafer fabrication apparatus is determined by comparing the target gas composition with the second gas composition.

9. The gas detection method for the environment inside a wafer cassette according to claim 8, characterized in that, The step of determining the target gas composition of the target wafer cassette in the target wafer fabrication apparatus based on the fabrication process of the target wafer cassette in the preceding wafer fabrication apparatus and the first gas composition includes: The fabrication completion time of the preceding wafer fabrication apparatus and the gas detection time of the target wafer fabrication apparatus are obtained. The reaction time of the gas components in the target wafer cassette is determined based on the time difference between the preparation completion time and the gas detection time. Based on the first gas composition, the fabrication process of the preceding wafer fabrication apparatus, and the reaction time, the target gas composition of the target wafer cassette in the target wafer fabrication apparatus is determined.

Images