Electrical connection unit

Abstract

The electrical connection unit includes a first electronic component, a base member, a bus bar, a metal plate, and a heat conductive member. The base member includes a flat surface portion having a first surface and a second surface, and a first housing portion penetrating the flat surface portion in a first direction. The bus bar is electrically connected to a first electronic component, and includes a plate portion housed in the first housing portion and an exposed portion exposed to the outside of the base member. And a gap is formed between the metal plate and the plane part. The heat conducting member is disposed between the exposed portion and the metal plate. The contact surface of the heat-conducting member and the exposed portion is closer to the metal plate than the second surface in the first direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, further reductions in the thickness of electrical connection units are expected.

[0008] One embodiment provides an electrical connection unit that enables thinning.

[0009] Technical means for solving problems

[0010] One embodiment of the electrical connection unit includes a first electronic component, a base component, a busbar, a metal plate, and a heat-conducting component. The base component includes a plate-like or sheet-like planar portion having a first surface facing the first electronic component and a second surface located on the side opposite to the first surface. With the thickness direction of the planar portion set as a first direction, the base component has a first receiving portion extending through the planar portion in the first direction. The busbar is electrically connected to the first electronic component. The busbar includes a plate portion received in the first receiving portion and extending along the first surface. The plate portion includes an exposed portion on the second surface side that protrudes to the outside of the base component. The metal plate has a gap with the planar portion and faces the second surface of the planar portion. The heat-conducting component is disposed between the exposed portion of the busbar and the metal plate. The contact surface between the heat-conducting component and the exposed portion is closer to the metal plate in the first direction than the second surface.

[0011] Invention Effects

[0012] According to one embodiment, the electrical connection unit can be made thinner. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the first embodiment.

[0014] Figure 2 This is a perspective view used to illustrate the main body of the first embodiment.

[0015] Figure 3 This is a perspective view used to illustrate the sub-units of the first embodiment.

[0016] Figure 4 This is a perspective view showing a portion of the subunit of the first embodiment.

[0017] Figure 5 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0018] Figure 6 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0019] Figure 7 This is a perspective view showing the connecting component of the first embodiment.

[0020] Figure 8 This is a perspective view showing the wiring substrate of the first embodiment.

[0021] Figure 9 This is a perspective view showing an exploded view of a portion of the wiring substrate of the first embodiment.

[0022] Figure 10 This is a top view showing the wiring substrate of the first embodiment.

[0023] Figure 11 This is a perspective view showing an exploded portion of the connecting unit of the first embodiment.

[0024] Figure 12 This is a bottom view showing the wiring substrate of the first embodiment.

[0025] Figure 13 It is along Figure 10 The cross-sectional view of the structure shown along line F13-F13.

[0026] Figure 14 It is along Figure 10 The cross-sectional view of the structure shown along line F14-F14.

[0027] Figure 15 This is a perspective view showing the three-dimensional wiring structure of the busbar according to the first embodiment.

[0028] Figure 16 This is a top view showing the three-dimensional wiring structure of the busbar according to the first embodiment.

[0029] Figure 17 This is a cross-sectional view showing the electrical connection unit of the comparative example.

[0030] Figure 18This is a perspective view illustrating the insulating ribs of the second embodiment.

[0031] Figure 19 for Figure 18 A sectional view of the structure shown along line F19-F19;

[0032] Figure 20 This is a cross-sectional view illustrating the insulating wall of the third embodiment.

[0033] Explanation of reference numerals in the attached figures

[0034] 1…Electrical connection unit

[0035] SU… subunit

[0036] 10… Electronic components

[0037] 13, 13A, 13B…terminals

[0038] 20…Connecting parts

[0039] 21…Part 1

[0040] 21h…First mounting hole

[0041] 22…Part Two

[0042] 22h…Second mounting hole

[0043] 30…Connecting parts

[0044] 31…Part One

[0045] 32…Part Two

[0046] 40… Wiring substrate

[0047] 41…Base board

[0048] 42…Busbar

[0049] 42e1…End of busbar

[0050] 42p…board section

[0051] 42u…exposed area

[0052] 42ua…Part 1

[0053] 42ub…Part Two

[0054] 43… Fastening components (fastening parts)

[0055] 51…Planar portion (insulating base)

[0056] 51a…First page, third page

[0057] 51b…Second page, Fourth page

[0058] 52…Fixed part

[0059] 52a…Part 1, Part 3

[0060] 52b…Part Two, Part Four

[0061] 55…Containment Department

[0062] 56…Kahebu

[0063] 56a…concave

[0064] 61…First connecting part

[0065] 62…Second connecting part

[0066] 63… Extension

[0067] 64…Extension

[0068] 71…Fastening components

[0069] 72… Fastening components

[0070] 73… Fastening components

[0071] 80… metal sheet

[0072] 81…Flat section (metal base)

[0073] 82…Fixed part

[0074] 83…Fixed part

[0075] 92… Thermal conductive components

[0076] 92a…First heat conduction section

[0077] 92b…Second heat-conducting section

[0078] 100…Connecting parts

[0079] 101…Part 1

[0080] 102…Part Two Detailed Implementation

[0081] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0082] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0083] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 11 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 11 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction." The Z direction is an example of the "first direction." The X direction is an example of the "second direction." Furthermore, the "second direction" is not limited to the X direction; it can also be the Y direction or other directions.

[0084] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0085] (First Implementation)

[0086] <1. Structure of the Electrical Connection Unit>

[0087] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 according to the first embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0088] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0089] <2. Main Body>

[0090] First, let's explain the main body MU.

[0091] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (SUX, SUY, SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0092] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0093] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0094] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0095] In this embodiment, three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY in the +X direction. Sub-units SUX and SUY are electrically connected via multiple connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY in the -X direction. Sub-units SUZ and SUY are connected via multiple connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y (in... Figure 2 (Only one is shown in the figure) and electrically connected. The connecting busbar 75 is arranged on the side opposite to the metal plate 80 relative to the multiple sub-units SU.

[0096] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0097] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunit SUX, subunit SUY, and subunit SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Furthermore, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40". The single subunit SU included in the three subunits SUX, SUY, and SUZ is an example of a "first subunit". On the other hand, the other subunits SU included in the three subunits SUX, SUY, and SUZ are examples of "second subunits".

[0098] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0099] <3. Structure of Subunits>

[0100] Next, the structure of the subunit SU will be explained.

[0101] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0102] <3.1 Electronic components and connecting components for connecting components>

[0103] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0104] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0105] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N.

[0106] <3.1.1 Type 1 Electronic Components>

[0107] Figure 5 This is a perspective view showing a first type of electronic component 10M and a first type of connecting component 20M. The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. The electronic component 10M, for example, has a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0108] (case)

[0109] The housing 11 is the outer contour component that forms most of the external shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 houses the main body portion 12 of the component. Alternatively, the housing 11 and the main body portion 12 of the component can be formed integrally.

[0110] In this embodiment, the housing 11 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates the terminals 13A and 13B from each other. Additionally, in this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates the first portions 21 of the two connecting members 20M connected to the electronic component 10M from each other.

[0111] (Main body of the component)

[0112] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0113] (terminal)

[0114] Terminal 13 is an electrical connection portion exposed to the outside of housing 11. Terminal 13 is electrically connected to the main body 12 of component inside housing 11. In this embodiment, electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a terminal on the positive side. The other of terminals 13A and 13B is a terminal on the negative side. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0115] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 71 (e.g., a screw or bolt) as described later. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10M has a threaded groove.

[0116] (Installation Department)

[0117] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 11 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The object to be fastened to the mounting part 14 will be described later.

[0118] <3.1.2 Type 1 Connecting Components>

[0119] The first type of connecting member 20M is a member that electrically connects the first type of electronic component 10M to the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. In this embodiment, the width L12 of the connecting member 20M in the long side direction (e.g., the X direction) of the electronic component 10M is smaller than the width L11 in the long side direction of the electronic component 10M. The connecting member 20M has, for example, a first portion 21 and a second portion 22.

[0120] (Part 1)

[0121] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction) and connected to the terminal 13 of the electronic component 10M from the horizontal direction (e.g., the X direction).

[0122] The first portion 21 of the connecting member 20M has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) passes. The first mounting hole 21h is open in a horizontal direction (e.g., the X direction). Additionally, the first portion 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a receiving portion that accommodates the head of the fastening member 71 inserted into the first mounting hole 21h. By engaging the fastening member 71 passing through the first mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10M, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. Alternatively, the first portion 21 may not have the recess 25.

[0123] (Part Two)

[0124] The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20M is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20M has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second mounting hole 22h of the second portion 22 is through which the fastening member 43 passes. And, by making the engaging member 44 (e.g., a nut, see...) Figure 3 The first part 21 engages with the end of the fastening member 43 passing through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42. In this embodiment, a connecting member 20M is formed in an L-shape by the first part 21 and the second part 22.

[0125] <3.1.3 Second Type of Electronic Components>

[0126] Figure 6 This is a perspective view showing a second type of electronic component 10N and a second type of connecting component 20N. The second type of electronic component 10N is an electronic component with two terminals 13 separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a housing 11, a main body 12, and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of the electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0127] In electronic component 10N, terminals 13A and 13B are separately disposed at opposite ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole 13h opens in the Z direction. For example, the mounting hole 13h of electronic component 10N is a through hole through which the fastening member 72 passes. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0128] <3.1.4 Second type of connecting component>

[0129] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. In this embodiment, the width L12 of the connecting member 20N in the long side direction (e.g., the X direction) of the electronic member 10N is smaller than the width L11 in the long side direction of the electronic member 10N. The connecting member 20N has, for example, a first portion 21, a second portion 22, and a third portion 23.

[0130] (Part 1)

[0131] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending in the Z direction. The first portion 21 is an upright portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent to the terminal 13 of the electronic component 10N in the Z direction and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a first mounting hole 21h for engaging with the fastening member 72. The first mounting hole 21h is open in the Z direction. The inner peripheral surface of the first mounting hole 21h of the connecting member 20N has a threaded groove. By engaging the fastening member 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, with the first mounting hole 21h of the first portion 21, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10N.

[0132] (Part Two)

[0133] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20N is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20N has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h opens in the Z direction. In the second portion 22, the fastening member 43, described later, passes through the second mounting hole 22h. And, by engaging the engaging member 44 (e.g., a nut, see...) Figure 3 The second part 22 engages with the end of the fastening member 43 that passes through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42.

[0134] (Part Three)

[0135] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the aforementioned connecting member 20M. On the other hand, the connecting member 20N may not have the third part 23.

[0136] <3.2 Connecting components for external connections>

[0137] Next, the connecting component 30 for external connection will be described.

[0138] Figure 7 This is a perspective view showing the connection member 30 for external connection. The connection member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connection member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The external connection is electrically connected to the external device via busbar 76. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection component 30 may have, for example, a first portion 31, a second portion 32, and a third portion 33.

[0139] (Part 1)

[0140] The first part 31 is the portion connected to the external connection busbar 76. The first part 31 is a cuboid portion extending along the Z direction. The first part 31 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first part 31 is adjacent to and connected to the external connection busbar 76 in the Z direction. The first part 31 has a first mounting hole 31h through which a fastening member 73 (e.g., a screw or bolt) passes. The first mounting hole 31h is open in the Z direction. The inner circumferential surface of the first mounting hole 31h has a threaded groove. By engaging the fastening member 73, which passes through the mounting hole 76h of the external connection busbar 76, with the mounting hole 31h of the first part 31, the first part 31 is physically and electrically connected to the external connection busbar 76.

[0141] (Part Two)

[0142] Part 2, 32, is related to busbar 42 (see reference). Figure 8 The second part 32 protrudes horizontally (e.g., in the X direction) from the end of the first part 31 on the -Z direction side. The second part 32 is a plate portion along the horizontal direction. The second part 32 is adjacent to and connected to the busbar 42 in the Z direction. The second part 32 is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 42) protruding in the +Z direction from the busbar 42. Figure 8 The second part 32 is physically and electrically connected to the busbar 42. In this embodiment, the second part 32 has a second mounting hole 32h through which the fastening member 43 passes. The second mounting hole 32h opens in the Z direction. In the second part 32, the fastening member 43, described later, passes through the second mounting hole 32h. And, by engaging the locking member 44 (e.g., a nut, see...) Figure 3 The second part 32 engages with the end of the fastening member 43 that passes through the second mounting hole 32h, thereby fixing the second part 32 to the busbar 42.

[0143] (Part Three)

[0144] The third part 33 is an upright wall (side wall) that rises from both ends of the second part 32 in the horizontal direction toward the +Z direction. The third part 33 is a wall along the Z direction. The third part 33 is connected to the first part 31 and to the second part 32. The third part 33 extends obliquely, for example, in a manner that widens in the X direction (or Y direction) as it moves toward the -Z direction. Alternatively, the connecting member 30 may not have the third part 33.

[0145] <3.3 Substrate for Wiring>

[0146] Next, the wiring substrate 40 will be described.

[0147] Figure 8 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0148] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and a plurality of fastening members 43. In this embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Furthermore, the wiring substrate 40 may also be formed by other structures instead of insert molding. A variation of the wiring substrate 40 formed by another structure will be described later.

[0149] Figure 9 This is a partially exploded perspective view of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42, and fastening member 43 will be described with reference to the partially exploded view of the wiring substrate 40.

[0150] (Substrate board)

[0151] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of a "substrate component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52. The fixing portions 52 will be described later.

[0152] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0153] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0154] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0155] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0156] (Busbar)

[0157] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0158] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in a housing portion 55 and extends along the planar portion 51 along its entire length. Hereinafter, the portion of each busbar 42 housed in the housing portion 55 and extending along the planar portion 51 is sometimes referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0159] Figure 10 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0160] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0161] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0162] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0163] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0164] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0165] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0166] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extensions 63 extend in a straight line along the X direction. The extensions 63 extend through the region R that overlaps with the electronic component 10 when viewed from the Z direction, crossing the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0167] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction.

[0168] The following describes several layout examples of busbar 42. Furthermore, the plurality of electronic components 10 includes three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, first-type electronic components 10M. Electronic component 10C is, for example, second-type electronic components 10N. Moreover, the types of electronic components 10 are not limited to the examples described above. Additionally, the plurality of connecting components 20 includes six connecting components 20A, 20B, 20C, 20D, 20E, and 20F. The plurality of connecting components 30 includes two connecting components 30A and 30B. The plurality of connecting busbars 75 includes two connecting busbars 75A and 75B. The plurality of external connection busbars 76 includes two external connection busbars 76A and 76B.

[0169] (First deployment example)

[0170] First, a layout example related to busbar 42A will be described. Busbar 42A has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. When viewed from the Z direction, the first connecting portion 61 is located on the +X direction side relative to the electronic component 10A. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10A via a connecting member 20A, which serves as a first connecting member 20. When viewed from the Z direction, the second connecting portion 62 is located on the -X direction side relative to the electronic component 10A. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75A.

[0171] Since the extension 63 is housed in the housing 55, it extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across both sides of the region R. For example, the extension 63 extends in a straight line along the X direction. The extension 63 extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction, covering both the +X and -X direction sides of the region R. The busbar 42A is an example of a "first busbar". The housing 55A housing the busbar 42A is an example of a "first housing". The busbar 42A is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0172] (Second deployment example)

[0173] Next, an example of the arrangement related to busbar 42B will be described. Busbar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10A via a connecting member 20B, which is a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76A via a connecting member 30A, which is a second connecting member 30. When viewed from the Z direction, the extension portion 64 extends to the region R that overlaps with the electronic component 10A, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10A. Furthermore, busbar 42B may also have an extension portion 63 similar to busbar 42A, which extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. Busbar 42B is another example of a "first busbar". The receiving portion 55B that receives busbar 42B is another example of a "first receiving portion". Busbar 42B is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0174] (Third deployment example)

[0175] Next, a layout example related to busbar 42C will be described. Busbar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10B via a connecting member 20C, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75B. The extension portion 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10B when viewed from the Z direction. Busbar 42C is another example of a "first busbar". The receiving portion 55C that houses busbar 42C is another example of a "first receiving portion". Busbar 42C is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0176] (Fourth deployment example)

[0177] Next, a layout example related to busbar 42D will be described. Busbar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to terminal 13A of electronic component 10B via connecting member 20D, which is a first connecting member 20. The second connecting portion 62 is electrically connected to terminal 13B of electronic component 10C via connecting member 20E, which is a second connecting member 20. Busbar 42D is another example of a "first busbar". The receiving portion 55D that houses busbar 42D is another example of a "first receiving portion". Busbar 42D is, for example, a busbar included in the negative line NL of electrical connection unit 1.

[0178] (Fifth Layout Example)

[0179] Next, a layout example related to busbar 42E will be described. Busbar 42E has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10C via a connecting member 20F, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76B via a connecting member 30B, which serves as a second connecting member 30. Busbar 42E is another example of a "first busbar". The receiving portion 55E that houses busbar 42E is another example of a "first receiving portion". Busbar 42E is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0180] (Fastening components)

[0181] Next, refer to again Figure 9The fastening component 43 will now be described. The fastening component 43 is a component used to secure the busbar 42 to a connecting component (connecting component 20, connecting component 30, connecting busbar 75, or connecting component 100) of the busbar 42. The fastening component 43 is, for example, a riveting bolt fixed to the busbar 42. The fastening component 43 is an example of a "fastening part".

[0182] In this embodiment, the first connecting portion 61 and the second connecting portion 62 of the busbar 42 each have a through hole 42h. The through hole 42h penetrates the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. Furthermore, the fastening member 43 is not limited to riveting; it can also be fixed to the busbar 42 by welding or other methods.

[0183] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71 or the fastening member 72, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the second mounting hole 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the second mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0184] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0185] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0186] <4.1 Metal Plate>

[0187] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 may also be referred to as a "rigid component".

[0188] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0189] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 between itself and the second surface 51b of the planar portion 51 of each sub-unit SU (see reference). Figure 13 ), and the second surface 51b of the planar portion 51 facing each subunit SU. The gap S1 is an example of the "first gap".

[0190] The fixing part 82 is a fixing part used to fix the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction.

[0191] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction.

[0192] <4.2 Insulating Sheets>

[0193] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0194] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be provided between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above. Furthermore, if the heat-conducting components 92 are insulating and the necessary insulation is ensured by the heat-conducting components 92, the insulating sheet 91 may be omitted.

[0195] <4.3 Thermal Conductive Components>

[0196] The thermally conductive component 92 is a component used to transfer heat generated by the electronic component 10 when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 80. The thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). The thermally conductive component 92 is formed, for example, of a material with a higher thermal conductivity than the substrate plate 41. However, the thermally conductive component 92 is not limited to the above examples and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0197] Figure 12 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0198] Figure 13 It is along Figure 10 The diagram shows a cross-sectional view along line F13-F13 of the structure. In this embodiment, a heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0199] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0200] In this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0201] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 13 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0202] <4.4 Insulating Cover>

[0203] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent contact with the electrical path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the electrical path of the main body MU.

[0204] <5. Exposed Structure of Busbars>

[0205] Next, the exposed structure of the busbar 42 will be described.

[0206] <5.1 Exposed structure on the upper surface side of the busbar>

[0207] First, refer to Figure 8 The exposed structure on the upper surface side of the busbar 42 will be described. In this embodiment, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate 41 on the upper surface side (the first surface 51a side of the planar portion 51). For example, the extension 63 of the busbar 42 overlaps with the electronic component 10 at least in the region R (refer to) when viewed from the Z direction. Figure 10 Part of it is exposed on the upper surface laterally to the outside of the substrate plate 41.

[0208] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length between the first connecting portion 61 and the second connecting portion 62 and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the base plate 41 on the upper surface, along its entire length between the first connecting portion 61 and the second connecting portion 62.

[0209] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the substrate plate 41 on the upper surface along its entire length.

[0210] like Figure 13 As shown, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side (second surface 51b side), in addition to the upper surface side. For example, the entire length of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side.

[0211] <5.2 Exposed Structure on the Lower Surface Side of the Busbar>

[0212] Reference Figure 13 The exposed structure on the lower surface side of the busbar 42 will be described. In this embodiment, the plate portion 42p of the busbar 42 includes an exposed portion 42u on the lower surface side (the second surface 51b side of the planar portion 51) that exposes to the outside of the base plate 41. In this embodiment, the exposed portion 42u of the busbar 42 extends along the entire length of the busbar 42. In this embodiment, a heat-conducting member 92 is disposed between the exposed portion 42u of the busbar 42 and the metal plate 80. For example, the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42.

[0213] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the region that overlaps with the connecting member 20 when viewed from the Z direction. At least a portion of the heat-conducting member 92 overlaps with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction. For example, at least a portion of the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction.

[0214] like Figure 14 As shown, the contact surface COS between the heat-conducting component 92 and the exposed portion 42u (42ua) is closer to the metal plate 80 in the first direction (Z direction) than the second surface 51b. In other words, the second surface 51b is recessed in the Z direction relative to the contact surface COS. At this time, a portion of the side peripheral surface 42CS of the busbar 42 is exposed to the outside of the base plate 41. The side peripheral surface 42CS faces a direction intersecting the first direction.

[0215] Furthermore, the thickness of the busbar 42 in the first direction (Z direction) can be greater than the thickness of the second surface 51b of the base plate 41 in the Z direction. Therefore, compared to when the thickness of the busbar 42 and the thickness of the second surface 51b of the base plate 41 are the same, the cross-sectional area of ​​the busbar 42 can be increased. The electrical connection unit 1 equipped with the busbar 42 can use a larger rated current. The rated current is determined by substituting the cross-sectional area into the upper limit of the current density relative to the rated current (JISC 8480:2016 "Current Density of Strip Conductors"). In this case, as described above, a portion of the side peripheral surface 42CS is exposed to the outside of the base plate 41, thereby improving the heat dissipation performance of the busbar 42.

[0216] Furthermore, the location of the heat-conducting component 92 is not limited to the location disclosed above. For example, at least a portion of the heat-conducting component 92 may overlap with the exposed portion 42u of the busbar 42 in the area overlapping with the connecting component 30 when viewed from the Z direction. In this case, the heat-conducting component 92 receives heat from the external device via the external connection busbar 76, and the received heat is moved and dissipated through the metal plate 80.

[0217] Furthermore, at least a portion of the heat-conducting component 92 can overlap with the connecting busbar 75 in the area overlapping with the second connection portion 62 when viewed from the Z direction. At this time, the heat-conducting component 92 receives heat from other sub-units via the connecting busbar 75, and the received heat is moved and dissipated through the metal plate 80.

[0218] In this embodiment, the exposed portion 42u of the busbar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction, and a second portion 42ub disposed in the region overlapping with the electronic component 10 when viewed from the Z direction.

[0219] The heat-conducting component 92 includes a first heat-conducting portion 92a and a second heat-conducting portion 92b. The first heat-conducting portion 92a overlaps with a first portion 42ua of the exposed portion 42u of the busbar 42 in the region overlapping with the connecting component 20 when viewed from the Z direction. For example, the first heat-conducting portion 92a is in contact with the first portion 42ua of the exposed portion 42u of the busbar 42. On the other hand, the second heat-conducting portion 92b overlaps with a second portion 42ub of the exposed portion 42u of the busbar 42 in the region overlapping with the electronic component 10 when viewed from the Z direction. For example, the second heat-conducting portion 92b is in contact with the second portion 42ub of the exposed portion 42u of the busbar 42.

[0220] It should be noted that, as described above, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side (first surface 51a side), in addition to the lower surface side. For example, the entire length of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side. For example, the second portion 42ub of the exposed portion 42u of the busbar 42 is also exposed to the outside of the substrate plate 41 on the upper surface side, in addition to the lower surface side, and faces the electronic component 10.

[0221] <6. Three-dimensional cabling structure of busbars>

[0222] Next, the three-dimensional wiring structure CS of busbar 42 will be explained.

[0223] Figure 15 This is a three-dimensional view showing the three-dimensional wiring structure CS of busbar 42. Figure 16 This is a top view showing a three-dimensional cabling structure CS with busbars 42. The three-dimensional cabling structure CS has busbars 42F, 42G, 42H, and 42I as multiple busbars 42. Additionally, the three-dimensional cabling structure CS includes multiple connecting components 100. Furthermore, the three-dimensional cabling structure CS includes connecting busbars 75C and 75D as multiple connecting busbars 75.

[0224] Busbars 42F and 42G are, for example, busbars 42 included in subunit SUY. The planar portion 51 of the base plate 41 of subunit SUY has receiving portions 55F and 55G as multiple receiving portions 55. Busbar 42F is received in receiving portion 55F and extends along the planar portion 51. Busbar 42G is received in receiving portion 55G and extends along the planar portion 51. Busbar 42F is an example of a "first busbar". The receiving portion 55F that receives busbar 42F is an example of a "first receiving portion". Busbars 42F and 42G are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0225] In this embodiment, the busbar 42F has a first portion 42Fa extending in the X direction and a second portion 42Fb that bends from the first portion 42Fa and extends in the Y direction. The second portion 42Fb extends along the boundary B between subunit SUY and subunit SUZ.

[0226] On the other hand, busbars 42H and 42I are, for example, busbars 42 included in subunit SUZ. The planar portion 51 of the base plate 41 of subunit SUZ has receiving portions 55H and 55I as a plurality of receiving portions 55. Busbar 42H is received in receiving portion 55H and extends along planar portion 51. Busbar 42I is received in receiving portion 55I and extends along planar portion 51. Busbars 42H and 42I are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0227] The connecting member 100 has the same structure as the connecting member 30 for external connection described above. For example, the connecting member 100 has a first part 101, a second part 102, and a third part 103. Furthermore, regarding the details of the connecting member 100, in the description related to the connecting member 30 described above, simply replace "connecting member 30" with "connecting member 100", "first part 31" with "first part 101", "first mounting hole 31h" with "first mounting hole 101h", "second part 32" with "second part 102", "second mounting hole 32h" with "second mounting hole 102h", and "third part 33" with "third part 103". The connecting member 100 is a member that forms a vertical power path. The connecting member 100 can also be referred to as a "vertical wiring member".

[0228] Multiple connecting components 100 include connecting component 100A and connecting component 100B. Viewed from the Z direction, connecting component 100A overlaps with the second connecting portion 62 of busbar 42G within the subunit SUY. Connecting component 100A is adjacent to and connected to the second connecting portion 62 of busbar 42G from the Z direction. Connecting component 100A extends from busbar 42G towards the +Z direction. Connecting component 100A is an example of a "third connecting component".

[0229] Viewed from the Z direction, the connecting member 100B overlaps with the second connecting portion 62 of the busbar 42I in the subunit SUZ. The connecting member 100B is adjacent to the second connecting portion 62 of the busbar 42I in the Z direction and is connected to the second connecting portion 62 of the busbar 42I from the Z direction. The connecting member 100B stands upright from the busbar 42I in the +Z direction.

[0230] One end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42F in the Z direction within sub-unit SUY, and is connected to the second connection portion 62 of bus 42F in the Z direction. The other end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42H in the Z direction within sub-unit SUZ, and is connected to the second connection portion 62 of bus 42H in the Z direction. According to this structure, bus 42F of sub-unit SUY and bus 42H of sub-unit SUZ are electrically connected via the connecting bus 75C. The connecting bus 75C is a bus 75 located in the first layer (lower layer) of the three-dimensional cabling structure CS.

[0231] On the other hand, the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100A in the Z direction in the sub-unit SUY, and is connected to the first portion 101 of the connecting member 100A in the Z direction. The other end of the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100B in the Z direction in the sub-unit SUZ, and is connected to the first portion 101 of the connecting member 100B in the Z direction.

[0232] The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B at a position away from the bus 42F in the Z direction. The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B, and extends in a horizontal direction (e.g., the X direction). The connecting bus 75D is electrically connected to the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B. According to this structure, the bus 42F of subunit SUY and the bus 42I of subunit SUZ are electrically connected via the two connecting members 100 and the connecting bus 75D.

[0233] In this embodiment, the connecting bus 75D extends across the second portion 42Fb of bus 42F at a position away from bus 42F in the +Z direction. Thus, a three-dimensional cross structure is formed by the connecting bus 75D and bus 42F. In this embodiment, the connecting bus 75D extends across the boundaries B of multiple sub-units SU.

[0234] In this embodiment, the three-dimensional wiring structure CS of the busbar 42 is positioned across the boundary B of the multiple sub-units SU. With this arrangement, the connection structure between the multiple sub-units SU is strengthened by the three-dimensional wiring structure CS. Alternatively, the three-dimensional wiring structure CS of the busbar 42 may not be positioned at the boundary B of the multiple sub-units SU, but rather within one or more sub-units SU.

[0235] <7. Advantages>

[0236] As a comparative example, consider an electrical connection unit in which the busbar is positioned upright relative to the lower wall of the housing. In such a comparative example, since the cross-sectional area of ​​the busbar is determined, for example, to realize its function as a wiring material, it is sometimes difficult to reduce the width (height) of the upright busbar. In this case, the width of the upright busbar becomes a bottleneck, and the thinning of the electrical connection unit may become difficult.

[0237] On the other hand, in this embodiment, the electrical connection unit 1 includes a first electronic component 10 and a wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a first busbar 42. The base plate 41 has a plate-shaped or sheet-shaped planar portion 51, which has a first surface 51a facing the first electronic component 10. The planar portion 51 has a first receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction. At least a portion of the first busbar 42 is received in the first receiving portion 55 and extends along the planar portion 51. According to this structure, at least a portion of the wiring path is formed on a plane, and compared with the structure of the comparative example described above, the width of the busbar is less likely to become a bottleneck, making it easier to achieve a thinner electrical connection unit 1.

[0238] Furthermore, in this embodiment, the configuration of the heat-conducting component 92 is also considered. For example, as... Figure 17 As shown, when a portion of the heat-conducting component 92' contacts both the busbar 42 and the base plate 41', if the second surface 51b of the base plate 41 protrudes in the first direction (Z direction) relative to the contact surface COS, then the second surface 51b presses the heat-conducting component 92 down in the -Z direction. This makes it difficult to ensure the contact area of ​​the contact surface COS, and thus difficult to ensure the heat dissipation of the heat-conducting component 92 located at this location.

[0239] In this embodiment, the contact surface COS between the heat-conducting component 92 and the exposed portion 42u (42ua) is closer to the metal plate 80 in the first direction (Z direction) than the second surface 51b. With this structure, the second surface 51b of the substrate plate 41 is less likely to protrude in the Z direction relative to the contact surface COS, and the second surface 51b is less likely to press down on the heat-conducting component 92 in the -Z direction. Since the contact area of ​​the contact surface COS is easily ensured, the heat dissipation of the heat-conducting component 92 provided at this location is easily ensured.

[0240] In this embodiment, the thickness of the busbar 42 in the first direction (Z direction) is greater than the thickness of the planar portion 51 of the base component (e.g., base plate 41) in the first direction. With this structure, the cross-sectional area of ​​the busbar 42 can be increased compared to when the thickness of the busbar 42 and the thickness of the second surface 51b of the base plate 41 are the same. The electrical connection unit 1 equipped with the busbar 42 can use a larger rated current. The rated current is determined by substituting the cross-sectional area into the upper limit of the current density relative to the rated current (JISC 8480:2016 "Current Density of Strip Conductors").

[0241] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length and extends along the planar portion 51. With this structure, the assemblability of the electrical connection unit 1 can be improved, and the electrical connection unit 1 can be easily made thinner.

[0242] In this embodiment, the busbar 42 is housed in the housing portion 55 along its entire length and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the second surface 51b side. With this structure, a larger portion functions as a heat dissipation area, thus further improving the heat dissipation of the electrical connection unit 1.

[0243] In this embodiment, a portion of the side peripheral surface 42CS of the busbar 42 facing the direction intersecting the first direction (Z direction) is exposed to the outside of the base component (e.g., base plate 41). With this structure, a portion of the side peripheral surface 42CS functions as a heat dissipation area, thus further improving the heat dissipation of the electrical connection unit 1.

[0244] In this embodiment, the busbar 42 is integrated with the base component (e.g., base plate 41). This structure eliminates or reduces the need for manual installation of the busbar 42 into the housing. Since the busbar 42 is difficult to detach from the receiving portion 55, the assemblability of the electrical connection unit 1 can be further improved. For example, the busbar 42 is integrated with the base component (e.g., base plate 41) through insert molding.

[0245] In the variation described later, busbar 42 is covered by an insulating sheet. With this structure, busbars that have never undergone lamination can easily achieve reduced voltage drop and low inductance.

[0246] (Second Implementation)

[0247] Next, the second embodiment will be described. In the second embodiment, the insulating rib 53 is provided between two adjacent busbars 42, which differs from the first embodiment. Furthermore, the structure other than that described below is the same as that of the first embodiment.

[0248] Figure 18 This is a perspective view illustrating the insulating rib 53. In this embodiment, the substrate 41 has an insulating rib 53. The insulating rib 53 is a rib that rises from the second surface 51b of the planar portion 51 in the -Z direction. The insulating rib 53 is made of synthetic resin and has insulating properties. The insulating rib 53 is an example of an "insulating wall". The insulating rib 53 is provided, for example, as part of the substrate 41. The insulating rib 53 is disposed between two busbars 42 arranged in a state where the lower surface side is exposed, ensuring an insulating distance between the two busbars 42.

[0249] When viewed from the Z direction, the insulating rib 53 is located between busbars 42A and 42B, extending parallel to busbars 42A and 42B in the X direction. Alternatively, busbars 42A, 42B, and the insulating rib 53 may extend in a straight line in the Y direction instead of the X direction.

[0250] Figure 19 express Figure 18 The structure shown is a cross-sectional view along line F19-F19. (See figure) Figure 19 As shown, the insulating rib 53 is located in the Y direction between the side peripheral surface 42CS of busbar 42A and the side peripheral surface 42CS of busbar 42B. The insulating rib 53 electrically insulates the side peripheral surface 42CS of busbar 42A from the side peripheral surface 42CS of busbar 42B.

[0251] With this structure, even when busbars 42A and 42B are arranged within a specified distance, the necessary insulation distance can be ensured by the insulating rib 53. Therefore, it is easy to arrange multiple busbars 42 close to each other. If multiple busbars 42 can be easily arranged close to each other, miniaturization of the electrical connection unit 1 can be achieved. For example, in this embodiment, the insulating rib 53 is located in the Y direction between the side peripheral surface 42CS of busbar 42A and the side peripheral surface 42CS of busbar 42B. Therefore, by providing the insulating rib 53, it is easy to arrange busbars 42A and 42B, which have exposed side peripheral surfaces CS, close to each other.

[0252] (Third Implementation)

[0253] Next, the third embodiment will be described. In the third embodiment, the difference from the first embodiment is that an insulating wall 95 is provided between two adjacent busbars 42. Furthermore, the structure other than that described below is the same as that of the first embodiment.

[0254] Figure 20This is a perspective view illustrating the insulating wall 95. In this embodiment, an insulating wall 95 is provided between the second surface 51b of the planar portion 51 of the substrate plate 41 and the planar portion 81 of the metal plate 80. The insulating wall 95 extends in the Z direction, for example, covering both the second surface 51b of the planar portion 51 of the substrate plate 41 and the planar portion 81 of the metal plate 80. The insulating wall 95 is made of synthetic resin and has insulating properties. The insulating wall 95 is formed, for example, by compression between the substrate plate 41 and the metal plate 80 using an elastic insulating member. Similar to the insulating rib 53 in the second embodiment, the insulating wall 95 is disposed between two busbars 42 arranged in a state where the lower surface side is exposed, ensuring an insulating distance between the two busbars 42.

[0255] Similar to the insulating rib 53 in the second embodiment, the insulating wall 95, when viewed from the Z direction, is located between busbars 42A and 42B, and extends parallel to busbars 42A and 42B in the X direction. Alternatively, busbars 42A, 42B, and the insulating wall 95 may extend linearly in the Y direction instead of the X direction.

[0256] The insulating wall 95 is located in the Y direction between the side peripheral surface 42CS of busbar 42A and the side peripheral surface 42CS of busbar 42B. The insulating wall 95 electrically insulates the side peripheral surface 42CS of busbar 42A from the side peripheral surface 42CS of busbar 42B.

[0257] With this structure, even when busbars 42A and 42B are arranged within a specified distance, the necessary insulation distance can be ensured by the insulating wall 95. Therefore, it is easy to arrange multiple busbars 42 close to each other. If multiple busbars 42 can be easily arranged close to each other, miniaturization of the electrical connection unit 1 can be achieved. For example, in this embodiment, the insulating wall 95 is located in the Y direction between the side peripheral surface 42CS of busbar 42A and the side peripheral surface 42CS of busbar 42B. Therefore, by providing the insulating wall 95, it is easy to arrange busbars 42A and 42B, which have exposed side peripheral surfaces CS, close to each other.

[0258] <Variation Example>

[0259] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as that of the first embodiment.

[0260] (First variation)

[0261] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0262] (Second variation)

[0263] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0264] (Third variation)

[0265] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged such that multiple busbars 42 arranged horizontally are sandwiched between them, for example, from both sides in the Z direction. For example, the multiple components may be integrally formed by sandwiching the multiple busbars 42 together through lamination. The multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. A sheet component may, for example, be a flexible sheet component. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0266] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0267] [Potential for Industrial Applications]

[0268] According to the present invention, the electrical connection unit can be made thinner.

Claims

1. An electrical connection unit, characterized in that, have: First electronic component; A substrate component, the substrate component including a plate-shaped or sheet-shaped planar portion, the planar portion having a first surface facing the first electronic component and a second surface located on the side opposite to the first surface; A busbar, which is electrically connected to the first electronic component; A metal plate having a gap between itself and the planar portion, and facing the second surface of the planar portion; as well as A heat-conducting component is disposed between the busbar and the metal plate. When the thickness direction of the planar portion is set as a first direction, the base component has a first receiving portion that penetrates the planar portion in the first direction. The busbar includes a plate portion housed in the first receiving portion and extending along the first surface, the plate portion including an exposed portion on the second surface side extending to the outside of the base component. The heat-conducting component is disposed between the exposed portion and the metal plate. The contact surface between the heat-conducting component and the exposed portion is closer to the metal plate in the first direction than the second surface.

2. The electrical connection unit according to claim 1, characterized in that, The thickness of the busbar in the first direction is greater than the thickness of the planar portion in the first direction.

3. The electrical connection unit according to claim 1 or 2, characterized in that, The busbar is housed in the first receiving portion along its entire length and extends along the planar portion.

4. The electrical connection unit according to claim 3, characterized in that, The busbar is received in the first receiving portion along its entire length and extends along the planar portion, and is exposed to the outside of the base component on the second surface side along its entire length.

5. The electrical connection unit according to claim 1 or 2, characterized in that, A portion of the side circumferential surface of the busbar, facing the direction intersecting the first direction, is exposed to the outside of the base component.

6. The electrical connection unit according to claim 1 or 2, characterized in that, The busbar is integrated with the base component.

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