Electrical connection unit

Abstract

This electrical connection unit is provided with: a first subunit having a plurality of first bus bars and a first base member including a plate-shaped or sheet-shaped first flat surface section and a first positioning section; and a second sub-unit electrically connected to the first sub-unit and having a plurality of second bus bars and a second base member including a plate-shaped or sheet-shaped second flat surface portion and a second positioning portion, the first positioning portion having a first facing surface extending in the first direction from a first base end of the first flat surface portion on the second sub-unit side, and the second positioning portion having a second facing surface extending in the second direction from a second base end of the first flat surface portion on the second sub-unit side. The second positioning portion has a second facing surface facing the first facing surface and extending in the first direction along the first facing surface from a second base end on the first subunit side of the second planar portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, improvements in assemblability are expected for electrical connection units.

[0008] One implementation provides an electrical connection unit that enables improved assemblability.

[0009] Technical means for solving problems

[0010] An electrical connection unit according to one embodiment includes: a first subunit having: a plurality of first busbars, the plurality of first busbars including portions disposed on the same plane; and a first base member, the first base member including a plate-shaped or sheet-shaped first planar portion and a first positioning portion for holding the plurality of first busbars; and a second subunit having: a plurality of second busbars including portions disposed on the same plane; and a second base member including a plate-shaped or sheet-shaped second planar portion and a second positioning portion for holding the plurality of second busbars, the second subunit being electrically connected to the first subunit; wherein the thickness direction of the first planar portion is designated as a first direction and the direction intersecting the first direction is designated as a second direction, the first positioning portion has a first opposing surface extending from a first base end on the second subunit side of the first planar portion along the first direction, the second positioning portion has a second opposing surface facing the first opposing surface and extending from a second base end on the first subunit side of the second planar portion along the first opposing surface in the first direction.

[0011] Invention Effects

[0012] According to one implementation method, improved assemblability can be achieved. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the embodiment.

[0014] Figure 2 This is a perspective view of the main body used to illustrate the implementation method.

[0015] Figure 3 This is a perspective view showing a partial disassembly of the electrical connection unit of the embodiment.

[0016] Figure 4 This is a perspective view showing the first wiring substrate according to the embodiment.

[0017] Figure 5 This is a top view showing the first wiring substrate of the embodiment.

[0018] Figure 6 This is a side view of the first base component in the embodiment.

[0019] Figure 7 This is a perspective view showing the second wiring substrate according to an embodiment.

[0020] Figure 8 This is a top view showing the second wiring substrate according to an embodiment.

[0021] Figure 9 This is a side view of the second base component in the embodiment.

[0022] Figure 10 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0023] Figure 11 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0024] Figure 12 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0025] Figure 13 This is a perspective view of a first wiring substrate showing a modified example of the embodiment.

[0026] Explanation of reference numerals in the attached figures

[0027] 1 Electrical connection unit

[0028] 10 Electronic components

[0029] 10X Electronic Components

[0030] 10Y Electronic Components

[0031] 10Z Electronic Components

[0032] 14 Installation Department

[0033] 14h mounting hole

[0034] 40. Wiring substrate

[0035] 40M wiring substrate

[0036] 40X First Wiring Substrate

[0037] 40Y Second Wiring Substrate

[0038] 40Z Third Wiring Substrate

[0039] 41. Base plate (first base component, second base component)

[0040] 42 busbars (First busbar, Second busbar)

[0041] 43 Fastening components

[0042] 45 First Positioning Section

[0043] 45s First Opposite Surface

[0044] 46 Second Positioning Section

[0045] 46s Second Opposite Surface

[0046] 47 Insulation Ribs

[0047] 51. Planar section (first planar section, second planar section)

[0048] 51a First page

[0049] 51b Second page

[0050] 51h Through Hole

[0051] 51Xe first matrix end

[0052] 51Ye second matrix end

[0053] 52 Fixing part

[0054] 52a Erecting board section

[0055] 52b Horizontal plate section

[0056] 52h insertion hole

[0057] 55 Containment Department

[0058] 75 Connecting busbars

[0059] 80 metal sheet

[0060] 80e1 first end

[0061] 80e2 second end

[0062] 80e3 third end

[0063] 80e4 fourth end

[0064] 81 Planar section

[0065] 82 Fixing part

[0066] 82h locking hole

[0067] 83 Fixing part

[0068] 83h locking hole

[0069] 91 Insulating sheet

[0070] 92 Thermal conductive components

[0071] 93 Insulating Cover

[0072] 93h vent

[0073] 111 Fastening components

[0074] 112 Fastening components

[0075] MP stage

[0076] MU Main Body

[0077] SU subunit

[0078] SUX subunit (first subunit)

[0079] SUY sub-unit (second sub-unit)

[0080] SUZ subunit Detailed Implementation

[0081] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0082] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Facing" refers to the case where the imaginary projected images of two objects overlap when viewed from a specific direction. That is, "facing" is not limited to the case where two objects face each other directly, but may also include the case where two objects face each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical." "Sheet-like" or "sheet" is not limited to components with a thickness of 1 mm or more, but may also be components with a thickness of less than 1 mm (so-called membranes).

[0083] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 3 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 3 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction." The Z direction is an example of the "first direction." The X direction is an example of the "second direction."

[0084] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these representations are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation posture of the electrical connection unit 1).

[0085] (Implementation Method)

[0086] <1. Structure of the electrical connection unit>

[0087] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 of this embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0088] Electrical connection unit 1 is electrically connected to an external device. In this invention, "external device" refers to an electrical device located outside of electrical connection unit 1. Examples of external devices include, but are not limited to, a battery cell mounted on a vehicle or an inverter for driving a vehicle's motor.

[0089] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 3 ), multiple heat-conducting components 92 and an insulating cover 93.

[0090] <2. Main Body>

[0091] First, let's explain the main body MU.

[0092] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has three sub-units SU (sub-unit SUX, sub-unit SUY, and sub-unit SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0093] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0094] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0095] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0096] In this embodiment, the three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is arranged on the +X direction side relative to sub-unit SUY. Sub-units SUX and SUY are electrically connected via a plurality of connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is arranged on the -X direction side relative to sub-unit SUY.

[0097] In this embodiment, the three wiring substrates (first wiring substrate 40X, second wiring substrate 40Y, and third wiring substrate 40Z) included in the three sub-units SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates (first wiring substrate 40X, second wiring substrate 40Y, and third wiring substrate 40Z) are arranged at the same height position in the Z direction. The arrangement of these three wiring substrates (first wiring substrate 40X, second wiring substrate 40Y, and third wiring substrate 40Z) forms a large wiring substrate 40M. Furthermore, the two or more sub-units SU are not limited to sub-units SU with different functions; they can also be sub-units SU with the same function.

[0098] Each subunit SU includes, for example, multiple electronic components 10 and a wiring substrate 40. The wiring substrate 40 includes, for example, a base plate 41, multiple busbars 42, and multiple fastening components 43. The detailed structure of each subunit SU will be described later.

[0099] <3. Metal Plate>

[0100] Figure 3 This is a perspective view showing a partial exploded view of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 can also be referred to as a "rigid component".

[0101] Viewed from the Z direction, the metal plate 80 is rectangular in shape along the X direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of end portions along the long side of the metal plate 80, separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of end portions along the short side of the metal plate 80, separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0102] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU.

[0103] The fixing part 82 is a boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction. For example, the fixing part 82 protrudes beyond the first surface 51a of the flat part 51 of the base plate 41 (see reference). Figure 4 The fixing part 82 protrudes more in the +Z direction than the fixing part 83. The fixing part 82 faces the fixing part 52 of the base plate 41 in the Z direction. The fixing part 82 has an engaging hole 82h that opens in the +Z direction (see reference). Figure 10 The inner circumferential surface of the engagement hole 82h has a threaded groove.

[0104] The fixing part 83 is a boss protruding from the flat part 81 in the +Z direction. The fixing part 83 is inserted into the through hole 51h of the flat part 51 of the base plate 41 (see reference). Figure 4 The fixing part 83 protrudes beyond the first surface 51a of the flat part 51 through the through hole 51h (a position closer to the +Z direction side than the first surface 51a). The fixing part 83 faces the mounting part 14 of the electronic component 10 in the Z direction (see reference). Figure 11 The fixing part 83 has a locking hole 83h that opens in the +Z direction. The inner circumferential surface of the locking hole 83h has a threaded groove.

[0105] Fastening component 112 (e.g., screw or bolt) passes through mounting hole 14h of mounting portion 14 of electronic component 10 from the +Z direction side (see reference). Figure 11When the fastening member 112, passing through the mounting hole 14h of the mounting portion 14 of the electronic component 10, engages with the engaging hole 83h of the fixing portion 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without passing through the base plate 41. Here, the mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. In addition, the fastening member 112 is an example of a "second fastening member".

[0106] <4. Insulating sheet>

[0107] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0108] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be disposed between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above.

[0109] <5. Thermal Conductive Components>

[0110] The heat-conducting component 92 is a component used to transfer the heat generated by the electronic component 10 when energized and / or the heat generated by the busbar 42 itself when energized to the metal plate 80. The heat-conducting component 92 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the heat-conducting component 92 is not limited to the above example and may also be a heat-conducting component formed of thermally conductive gel or other materials.

[0111] <6. Insulating Cover>

[0112] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to ensure the safety of the power supply path to the main body MU. The insulating cover 93 is made of, for example, synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted along the metal plate 80 on the +Z direction side of the metal plate 80. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component covering the power supply path of the main body MU.

[0113] <7. Detailed Structure of Sub-units>

[0114] Next, the structure of the subunit SU will be explained.

[0115] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Hereinafter, subunit SUX will be described in detail as an example. Furthermore, without distinguishing between subunit SUX, subunit SUY, and subunit SUZ, they are simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they are simply referred to as "electronic component 10". Furthermore, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they are simply referred to as "wiring substrate 40". Subunit SUX is an example of a "first subunit". Subunit SUY is an example of a "second subunit".

[0116] <7.1 Electronic Components>

[0117] First, let’s describe the electronic component 10.

[0118] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or two or more of these unitized electronic components. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized.

[0119] <7.2 Wiring Substrate (Common Structure)>

[0120] Next, the wiring substrate 40 will be described.

[0121] Figure 4 This is a perspective view of the first wiring substrate 40X of the subunit SUX. Figure 5 This is a top view of the first wiring substrate 40X of the subunit SUX. Furthermore, Figure 4 and Figure 5 The structures of the first wiring substrate 40X shown include the common structures of the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, as well as the structures unique to the first wiring substrate 40X. Hereinafter, for convenience, [the term will be used...] Figure 4 and Figure 5 The common structure of the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z will be described. Furthermore, regarding the structure unique to the subunit SUX, [the following is a description of the structure]. Figure 4 and Figure 5 Explain its meaning.

[0122] The wiring substrate 40 is a component that forms at least a portion of the power path between multiple electronic components 10 and / or at least a portion of the power path between the electronic components 10 and an external device. In this invention, "wiring substrate" refers to a substrate-type layout structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a single plane when viewed as a whole. It should be noted that in this invention, "plate-shaped" is not limited to a completely flat case, and may include the presence of fixing structures protruding in the Z-direction, ribs, etc., in a portion of the structure. Figure 4 as well as Figure 5 As shown, in this embodiment, the wiring substrate 40 is plate-shaped along the X and Y directions.

[0123] As described above, the wiring substrate 40 includes, for example, a base plate 41, a plurality of busbars 42, and a plurality of fastening members 43. In this embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Alternatively, the wiring substrate 40 may be formed by other structures instead of insert molding.

[0124] (Substrate board)

[0125] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of a "substrate component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52.

[0126] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0127] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0128] The planar portion 51 has a through hole 51h. The through hole 51h penetrates the planar portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 83 of the metal plate 80, which will be described later. The fixing portion 83 of the metal plate 80 protrudes through the through hole 51h of the base plate 41 to a position closer to the +Z direction side than the first surface 51a of the planar portion 51. The mounting portion 14 of the electronic component 10 is fixed to the fixing portion 83 on the first surface 51a side of the planar portion 51.

[0129] Each fixing part 52 has, for example, an upright plate part 52a and a horizontal plate part 52b.

[0130] The upright plate portion 52a rises from the end of the flat portion 51 of the base plate 41 toward the +Z direction. The upright plate portion 52a is a plate portion along the Y and Z directions. The thickness direction of the upright plate portion 52a is the X direction.

[0131] The horizontal plate portion 52b extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is a plate portion extending horizontally. The horizontal plate portion 52b faces the fixing portion 82 of the metal plate 80 in the Z direction. The horizontal plate portion 52b has a through hole 52h, which faces the engaging hole 82h of the fixing portion 82 of the metal plate 80. Figure 3 As shown, a fastening member 111 (e.g., a screw or bolt) passes through a through-hole 52h. When the fastening member 111, passing through the through-hole 52h of the fixing portion 52 of the base plate 41, engages with the engaging hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80. The fastening member 111 is an example of a "first fastening member".

[0132] (Busbar)

[0133] Each busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. The busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, each busbar 42 may also be a wiring component for connecting electronic components 10 to external devices. Each busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. Multiple busbars 42 are arranged horizontally with spacing between them. Each busbar 42 includes portions disposed on the same plane. Multiple busbars 42 are held by a planar portion 51 of the substrate 41.

[0134] like Figure 4 and Figure 5 As shown, at least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is received in the receiving portion 55 and extends along the planar portion 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the receiving portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is received in the receiving portion 55 along its entire length and extends along the planar portion 51.

[0135] (Fastening components)

[0136] Fastening component 43 is a component used to secure busbar 42 and its connecting parts (connecting busbar 75, connecting parts connected to terminals of electronic component 10, or connecting parts for connecting to external devices). Fastening component 43 is, for example, a rivet bolt fixed to busbar 42. Fastening component 43 is an example of a "fastening part".

[0137] <7.3 First Wiring Substrate (Special Structure)>

[0138] Next, the unique structure of the first wiring substrate 40X will be explained.

[0139] Here, the busbar 42 of the first wiring substrate 40X is an example of a "first busbar". Furthermore, the base plate 41 of the first wiring substrate 40X is an example of a "first base component". Additionally, the planar portion 51 of the first wiring substrate 40X is an example of a "first planar portion". The upright plate portion 52a of the first wiring substrate 40X is an example of a "first part". Furthermore, the horizontal plate portion 52b of the first wiring substrate 40X is an example of a "second part".

[0140] like Figure 4 and Figure 5 As shown, the substrate 41 of the first wiring substrate 40X further includes a first positioning portion 45. The first positioning portion 45 has a first opposing surface 45s that is a plane facing the -X direction. The first positioning portion 45 has a rectangular shape extending in the Z direction, with the first opposing surface 45s as part of its outer peripheral surface. Specifically, the first positioning portion 45 has a rectangular shape in which the first opposing surface 45s is set as an outer peripheral plane on the -X direction side. The first opposing surface 45s is disposed at the end portion of the planar portion 51 of the first wiring substrate 40X on the -X side (sub-unit SUY side), i.e., the first substrate end 51Xe. The first positioning portion 45 is disposed between a pair of connecting busbars 75 arranged separately in the Y direction, as described later.

[0141] like Figure 6As shown, the first opposing surface 45s extends from the first substrate end 51Xe in the +Z direction. That is, the first opposing surface 45s extends from the first substrate end 51Xe to the side opposite to the metal plate 80. Specifically, the first opposing surface 45s extends in the +Z direction from the first substrate end 51Xe, protruding from the first surface 51a of the planar portion 51 of the first wiring substrate 40X. For example, the first opposing surface 45s may also be coplanar with the end surface of the first substrate end 51Xe facing the -X direction.

[0142] Compared to the pair of fixing portions 52 arranged in the Y direction on the first base end 51Xe side of the substrate plate 41 of the first wiring substrate 40X, the first opposing surface 45s protrudes more in the +Z direction. Here, each fixing portion 52 on the first base end 51Xe side stands upright in the +Z direction across the upright plate portion 52a and the horizontal plate portion 52b, and extends in the -X direction in the XY plane from the upright end.

[0143] <7.4 Second Wiring Substrate (Special Structure)>

[0144] Next, the unique structure of the second wiring substrate 40Y will be explained.

[0145] Here, the busbar 42 of the second wiring substrate 40Y is an example of a "second busbar". Furthermore, the base plate 41 of the second wiring substrate 40Y is an example of a "second base component". Additionally, the planar portion 51 of the second wiring substrate 40Y is an example of a "second planar portion". The upright plate portion 52a of the second wiring substrate 40Y is an example of a "third portion". Furthermore, the horizontal plate portion 52b of the second wiring substrate 40Y is an example of a "fourth portion".

[0146] like Figure 7 and Figure 8 As shown, the substrate 41 of the second wiring substrate 40Y further includes a second positioning portion 46. The second positioning portion 46 has a second opposing surface 46s that is a plane facing the +X direction. The second positioning portion 46 has a rectangular shape extending along the Z direction, with the second opposing surface 46s as part of its outer peripheral surface. Specifically, the second positioning portion 46 has a rectangular shape in which the second opposing surface 46s is set as an outer peripheral plane on the +X direction side. The second opposing surface 46s is disposed at the end portion of the planar portion 51 of the second wiring substrate 40Y on the +X side (sub-unit SUX side), i.e., the second substrate end 51Ye. The second positioning portion 46 is disposed between a pair of connecting busbars 75 arranged separately in the Y direction, as described later.

[0147] like Figure 9As shown, the second opposing surface 46s extends in the +Z direction from the second substrate end 51Ye, opposite to and along the first opposing surface 45s. That is, the second opposing surface 46s extends from the second substrate end 51Ye towards the side opposite to the metal plate 80. Specifically, the second opposing surface 46s extends in the +Z direction from the second substrate end 51Ye, protruding from the first surface 51a of the planar portion 51 of the second wiring substrate 40Y. For example, the second opposing surface 46s may also be coplanar with the end face of the second substrate end 51Ye facing the +X direction. For example, the second opposing surface 46s and the first opposing surface 45s may also have the same shape and the same dimensions.

[0148] Compared to the pair of fixing portions 52 arranged along the Y direction on the second base end 51Ye side, the second opposing surface 46s protrudes more significantly in the +Z direction from the base plate 41 of the second wiring substrate 40Y. Here, each fixing portion 52 on the second base end 51Ye side rises in the +Z direction across both the upright plate portion 52a and the horizontal plate portion 52b, and extends in the +X direction within the XY plane from the upright end.

[0149] <7.5 Fixed Structures Associated with Multiple Subunits>

[0150] Next, return Figure 2 The fixed structure associated with the multiple sub-units SU will be described. In this embodiment, the main body MU is divided into multiple sub-units SU (e.g., sub-unit SUX, sub-unit SUY, sub-unit SUZ).

[0151] The subunit SUX includes multiple electronic components 10X, a substrate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10X. The electronic components 10X are an example of a "first electronic component".

[0152] Subunit SUY includes multiple electronic components 10Y, a substrate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10Y. Subunit SUY extends, for example, along the X direction and is electrically connected to subunit SUX via a pair of connecting busbars 75 arranged separately in the Y direction. Electronic component 10Y is an example of a "second electronic component".

[0153] The subunit SUZ includes multiple electronic components 10Z, a base plate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10Z. The subunit SUZ is an example of a "third subunit." The electronic components 10Z are an example of a "third electronic component." The base plate 41 of the subunit SUZ is an example of a "third base component." The planar portion 51 of the base plate 41 of the subunit SUZ is an example of a "third planar portion."

[0154] In this embodiment, multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are fixed to the metal plate 80. Through this fixing, the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are integrally held by a metal plate 80.

[0155] In this embodiment, the long side of sub-unit SUX is in the X direction. The long side of sub-unit SUY is in the X direction. The long side of sub-unit SUZ is in the X direction. Multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are adjacent in the X direction and arranged in a row in the X direction. The long side of metal plate 80 is in the X direction. The length of metal plate 80 in the X direction is greater than the sum of the lengths of the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) in the X direction.

[0156] In this embodiment, the fixing part 52 of sub-unit SUX and the fixing part 52 of sub-unit SUY are arranged in a position that overlaps each other in the Z direction. The fixing parts 52 of sub-unit SUX and sub-unit SUY are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111. The fixing part 52 of sub-unit SUX is an example of a "first fixing part". The fixing part 52 of sub-unit SUY is an example of a "second fixing part".

[0157] Similarly, the fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are arranged in a position that overlaps each other in the Z direction. The fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111.

[0158] In this embodiment, the heat generated by the electronic components 10X and busbar 42 included in subunit SUX is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUX. Similarly, the heat generated by the electronic components 10Y and busbar 42 included in subunit SUY is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUY. The heat generated by the electronic components 10Z and busbar 42 included in subunit SUZ is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUZ. The heat generated by the multiple subunits SU (e.g., three subunits SUX, SUY, and SUZ) is, for example, different.

[0159] In this embodiment, a large metal plate 80 can facilitate the cooling of multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ). For example, when the heat output of the multiple sub-units SU is different, the large metal plate 80 can achieve homogenization of the heat output of the multiple sub-units SU.

[0160] <8. Manufacturing method of electrical connection unit>

[0161] Next, the manufacturing method of electrical connection unit 1 will be described.

[0162] Figures 10 to 12 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit 1. Furthermore, in the wiring substrate 40 of each subunit SU, with the fastening member 43 fixed to the busbar 42, the base plate 41 and the multiple busbars 42 are integrated by insert molding or other methods. Through this integration, the wiring substrate 40 of each subunit SU is prepared in advance.

[0163] (First process)

[0164] Figure 10 This refers to the first process. In the first process, each subunit SU is mounted on a metal plate 80 placed on a mounting platform MP. The first process is performed as follows, for example. First, an insulating sheet 91 is mounted on the surface of the flat portion 81 of the metal plate 80 (see reference). Figure 3 Next, the heat-conducting component 92 is fixed to the upper surface of the insulating sheet 91 using an adhesive or the like. Then, the insulating sheet 91 and the heat-conducting component 92 are positioned between each sub-unit SU, and each sub-unit SU is placed on the metal plate 80. Finally, the fixing part 52 of each sub-unit SU is fixed to the fixing part 82 of the metal plate 80 using the fastening member 111.

[0165] (Second process)

[0166] Figure 11This indicates the second process. In the second process, the mounting portion 14 of the electronic components 10 of each subunit SU is fixed to the fixing portion 83 of the metal plate 80 by the fastening member 112. Alternatively, the first process can be performed together with the second process.

[0167] (Third process)

[0168] Figure 12 This indicates the third step. In the third step, the insulating cover 93 is installed vertically onto the metal plate 80. Through this installation, the electrical connection unit 1 is completed.

[0169] <9. Advantages>

[0170] According to this embodiment, the second opposing surface 46s is opposite to the first opposing surface 45s and extends in the Z direction along the first opposing surface 45s. With this structure, the position of the sub-unit SUY, which is the second sub-unit and is adjacent to the sub-unit SUX, which is the first sub-unit, can be physically defined. This definition facilitates the alignment of the sub-units SU with each other according to this embodiment. Therefore, improved assemblability is achieved. For example, the sub-unit SUY can be installed while the second opposing surface 46s is in contact with the first opposing surface 45s of the installed sub-unit SUX, thus facilitating the assembly of the sub-units SU with each other.

[0171] According to this embodiment, the height of the first opposing surface 45s from the flat surface 51 is greater than the height of the fixing part 52 from the flat surface 51. With this structure, when the sub-unit SUY is installed at the end extending from the first opposing surface 45s, the first opposing surface 45s contacts the second opposing surface 46s before the fixing part 52 contacts the sub-unit SUY. Therefore, it is easy to align the sub-units SU with each other.

[0172] According to this embodiment, the first opposing surface 45s and the second opposing surface 46s extend toward the side opposite to the metal plate 80. With this structure, the sub-unit SUY can be mounted toward the metal plate 80 relative to the sub-unit SUX mounted on the metal plate 80 while the second opposing surface 46s is along the first opposing surface 45s. Therefore, it is easy to align the sub-units SU on the metal plate 80 with each other.

[0173] According to this embodiment, the first positioning portion 45 has a rectangular shape extending along the Z direction. This structure improves the mechanical strength of the first positioning portion 45. Furthermore, this structure allows for the upward rectification and dissipation of heat from the wiring substrate 40 by utilizing the hollow space and outer periphery of the first positioning portion 45 extending away from the substrate 41.

[0174] According to this embodiment, the first positioning part 45 is disposed between a pair of connecting busbars 75. This structure effectively utilizes the space between the pair of connecting busbars 75. Therefore, the electrical connection unit 1 can be miniaturized. Furthermore, this structure ensures the electrical insulation distance between the pair of connecting busbars 75.

[0175] <10. Variations>

[0176] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the embodiment described above.

[0177] In the above embodiment, the first wiring substrate 40X has a first positioning portion 45 protruding in the +Z direction. However, as long as the sub-units SU can be aligned with each other, the structure of the first positioning portion 45 protruding in the +Z direction can also be used in conjunction with other functions. As a variation, such as Figure 13 As shown, the first positioning portion 45 can also be connected to the extended end of the insulating rib 47 of the base plate 41 of the subunit SUX. Here, the insulating rib 47 is a wall that rises from the first surface 51a of the planar portion 51 and extends along the first surface 51a. The insulating rib 47 can also extend between multiple electronic components 10X.

[0178] In the above embodiment, the first positioning part 45 has a rectangular shape. However, it can be configured in any way as long as the sub-units SU can be aligned with each other. As a variation, the first positioning part 45 may also have a prism shape with the first opposing surface 45s as the outer peripheral plane on the -X direction side. As a variation, the first positioning part 45 may also have a plate shape with the first opposing surface 45s as the plate surface on the -X direction side.

[0179] In the above embodiment, the second positioning part 46 has a rectangular shape. However, it can be configured in any way as long as the sub-units SU can be aligned with each other. As a variation, the second positioning part 46 may also have a prism shape with the second opposing surface 46s as the outer peripheral plane on the -X direction side. As a variation, the second positioning part 46 may also have a plate shape with the second opposing surface 46s as the plate surface on the -X direction side.

[0180] In the above embodiment, the first opposing surface 45s and the end face of the first base end 51Xe facing the -X direction are coplanar. However, as long as the sub-units SU can be aligned with each other, it can be configured in any way. As a variation, the first opposing surface 45s and the end face of the first base end 51Xe facing the -X direction can also be offset in the X direction.

[0181] In the above embodiment, the second opposing surface 46s and the end face of the second base end 51Ye facing the +X direction are coplanar. However, as long as the sub-units SU can be aligned with each other, it can be configured in any way. As a variation, the second opposing surface 46s and the end face of the second base end 51Ye facing the +X direction can also be offset in the X direction.

[0182] In the above embodiment, the first opposing surface 45s and the second opposing surface 46s are planes. However, they can be configured in any way as long as the sub-units SU can be aligned with each other. As a variation, the first opposing surface 45s and the second opposing surface 46s can also be curved surfaces that can make contact with each other. For example, the first opposing surface 45s and the second opposing surface 46s can also be curved surfaces that extend straight along the Z direction and can make contact with each other.

[0183] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0184] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42.

[0185] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0186] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0187] [Potential for Industrial Applications]

[0188] According to the present invention, improved assemblability can be achieved.

Claims

1. An electrical connection unit, characterized in that, have: The first subunit has: A plurality of first busbars, the plurality of first busbars including portions disposed on the same plane; and A first base component, comprising a plate-like or sheet-like first planar portion and a first positioning portion, the first planar portion holding a plurality of the first busbars; and The second subunit has: A plurality of second busbars, the plurality of second busbars including portions arranged on the same plane; and The second base component includes a plate-like or sheet-like second planar portion and a second positioning portion, the second planar portion holding a plurality of the second busbars. The second subunit is electrically connected to the first subunit. When the thickness direction of the first planar portion is defined as the first direction, and the direction intersecting the first direction is defined as the second direction, The first positioning portion has a first opposing surface extending in the first direction from the first base end on the second sub-unit side of the first planar portion. The second positioning portion has a second opposing surface that faces the first opposing surface and extends from the second base end of the second planar portion along the first opposing surface in the first direction.

2. The electrical connection unit according to claim 1, characterized in that, The first base component further includes a fixing part, which stands upright from one side extending from the first base end toward the first opposing surface in the first direction, and extends along the second planar portion from the upright end. The first opposing surface protrudes more in the first direction compared to the fixed portion.

3. The electrical connection unit according to claim 1 or 2, characterized in that, The electrical connection unit also includes a metal plate. The first subunit and the second subunit are respectively fixed to the metal plate, and the metal plate holds the first subunit and the second subunit together as a whole. The first opposing surface extends from the first substrate end toward the side opposite to the metal plate. The second opposing surface extends from the second substrate end toward the side opposite to the metal plate.

4. The electrical connection unit according to claim 1 or 2, characterized in that, The first positioning part has the first opposing surface as part of the outer peripheral surface and has a square tube shape extending along the first direction.

5. The electrical connection unit according to claim 1 or 2, characterized in that, The first subunit further comprises: a plurality of electronic components electrically connected to a plurality of the first busbars; and an insulating rib extending between the plurality of electronic components. The first positioning part is connected to the extended end of the insulating rib.

6. The electrical connection unit according to claim 1 or 2, characterized in that, The electrical connection unit also includes a pair of connecting busbars that electrically connect the first subunit and the second subunit. The first positioning part is disposed between the pair of connecting busbars.

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