High-density fin micro-jet heat dissipation system based on hydrophilic surface modification

Abstract

The invention discloses a hydrophilic surface modification-based high-density fin micro-jet heat dissipation system which sequentially comprises a cover plate, a jet plate, a cavity plate and a jet bottom plate which are stacked from top to bottom, and sealing gaskets are arranged between the cover plate and the jet plate, between the jet plate and the cavity plate and between the cavity plate and the jet bottom plate; the jet bottom plate is provided with a high-density fin structure, the jet bottom plate is arranged on a heating chip or a heat source, and the surface of the jet bottom plate is a hydrophilic surface. The heat exchange efficiency under high heat flux is remarkably improved, and the heat dissipation requirement of a high-power chip can be effectively met.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a high-density finned micro-jet heat dissipation system based on hydrophilic surface modification. Background Technology

[0002] With the rapid development of artificial intelligence, the demand for computing power across society continues to rise. The rapid growth in computing power has spurred the continuous expansion of data centers, whose high-load operation leads to enormous power consumption. In my country, data centers account for more than 2% of the total electricity consumption of the entire society annually, accompanied by substantial carbon emissions. Power Usage Effectiveness (PUE) is a key indicator for measuring the energy consumption of data centers. Various countries have introduced policies to limit PUE values, and my country requires that the PUE value of newly built large-scale data centers be below 1.3 by 2025.

[0003] To reduce PUE (Power Usage Effectiveness), liquid cooling technology has become a key energy-saving measure. Traditional data centers allocate approximately 45% of their power to cooling systems; compared to air cooling, liquid cooling significantly reduces energy consumption and improves heat dissipation efficiency. Currently, the maximum heat flux of high-performance chips has reached 200W / cm². 2 It is expected to exceed 500W / cm² in the future. 2 Locally reaching 1000W / cm 2 The maximum heat dissipation capacity of air cooling is only about 37W / cm². 2 Liquid cooling technology has become the key to overcoming the heat dissipation problem.

[0004] Micro-jet cooling technology has attracted widespread attention due to its superior performance. It rapidly heats up a surface through high-speed fluid action. However, existing micro-jet cooling systems have shortcomings: smooth base plates have small heat exchange areas, and while fin structures increase the area, their arrangement has varying impacts on flow characteristics, requiring optimization. Surface enhancement technologies (such as hydrophilic surface treatments) can enhance heat flux density and heat transfer efficiency, significantly impacting jet cooling performance. However, existing hydrophilic treatment methods each have their drawbacks. Surface oxidation has obvious advantages, but its application effect and process optimization need further improvement. Therefore, there is an urgent need for a highly efficient and practical high-density finned micro-jet cooling system based on hydrophilic surface modification. Summary of the Invention

[0005] To overcome the aforementioned shortcomings and deficiencies of existing technologies, the present invention aims to provide a high-density finned micro-jet cooling system based on hydrophilic surface modification. Specifically, it combines jet cooling with hydrophilic surface treatment to address the problem of heat dissipation due to the continuously increasing high heat flux density of chips.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] A high-density finned micro-jet heat dissipation system based on hydrophilic surface modification includes, from top to bottom, a cover plate, a jet plate, a cavity plate, and a jet base plate stacked together. Sealing gaskets are provided between the cover plate and the jet plate, between the jet plate and the cavity plate, and between the cavity plate and the jet base plate. The jet base plate has a high-density finned structure and is placed on a heat-generating chip or heat source. The surface of the jet base plate has a hydrophilic surface.

[0008] Furthermore, the cover plate is provided with a pressure chamber groove structure for liquid distribution.

[0009] Furthermore, the shape of the pressure chamber groove structure is consistent with the shape of the cavity plate.

[0010] Furthermore, the high-density fin structure is composed of multiple fins arranged in an array and manufactured by shovel teeth.

[0011] Furthermore, the fin thickness is 0.2-0.4 mm, the tooth spacing is 0.1-0.3 mm, the tooth height is 4.5-5.1 mm, and the fin direction is parallel or perpendicular to the cooling medium flow direction.

[0012] Furthermore, the cavity plate and the injection base plate form a heat exchange cavity and a manifold cavity.

[0013] Furthermore, the spray plate is provided with an array of spray micro-holes.

[0014] Furthermore, the array of jet micro-holes is positioned directly above the heat source, and its area is the same as the heat exchange area of ​​the heat source.

[0015] Furthermore, the spraying base plate undergoes surface oxidation treatment to form an oxide layer micro-nano structure on its surface, creating a hydrophilic surface.

[0016] The hydrophilic surface treatment process includes the following:

[0017] Remove impurities from the surface of the spray base plate;

[0018] A hydrophilic solution was prepared using K2S2O8 and KOH;

[0019] After removing impurities, the spray plate is subjected to water bath oxidation treatment. Specifically, the spray plate is immersed in a constant temperature water bath, a beaker containing a hydrophilic solution is placed above a constant temperature heating platform, the temperature of the heating platform is controlled at 80°C, the spray plate is placed in the beaker, and left for about 60 minutes until the sample surface is completely covered with a black hydrophilic layer.

[0020] Finally, place the sample in an ultrasonic cleaner for 3-5 minutes and then dry it to complete the hydrophilic surface treatment.

[0021] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0022] (1) This invention combines jet cooling technology with hydrophilic surface modification. By forming a hydrophilic oxide layer on the surface of the jet base plate, the spreadability and wettability of the coolant are enhanced. At the same time, the high-speed jet reduces the thermal boundary layer, which significantly improves the heat exchange efficiency under high heat flux density and can effectively meet the heat dissipation requirements of high-power chips.

[0023] (2) The spray base plate adopts a high-density fin structure arranged vertically or horizontally, so that the flow direction of the cooling medium can be parallel or perpendicular to the fins, which enhances fluid disturbance and optimizes the flow path. Combined with the array of spray micro-holes distributed in the corresponding heat source area, it realizes the targeted and uniform heat dissipation and improves the local convective heat transfer efficiency.

[0024] (3) In terms of manufacturing process, the high-precision fine-pitch fins of the spray base plate are processed by shovel teeth. The surface oxidation hydrophilic treatment process is simple and environmentally friendly. The resulting oxide layer is thin and stable, which enhances performance while taking into account manufacturing economy and feasibility. Attached Figure Description

[0025] Figure 1 This is an exploded view of the structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the bottom surface of the cover plate of the present invention;

[0028] Figure 4 This is a schematic diagram of the cavity of the jet base plate structure of the present invention. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0030] Example

[0031] like Figures 1-4As shown, a high-density finned micro-jet heat dissipation system based on hydrophilic surface modification is mounted on a heat-generating chip. It includes an inlet pipe 1, an outlet pipe 2, a cover plate 3, a jetting plate 5, a cavity plate 7, a jetting base plate 8, sealing gaskets 4 and 6. Sealing gasket 4 is positioned between the cover plate 3 and the jetting plate 5. Sealing gaskets 6 are positioned between the jetting plate 5 and the cavity plate 7, and between the cavity plate 7 and the jetting base plate 8, respectively, to ensure the sealing of the connections between the plates and prevent leakage of the cooling medium. The plates are connected as a single unit by bolts or welding. The inlet pipe 1 and the outlet pipe 2 are parallel to each other and located on the same side of the micro-jet heat dissipation system. The jetting base plate 8 is mounted on the heat-generating chip or heat source, and thermally conductive silicone grease is applied between them to reduce thermal resistance. The hollow shapes of sealing gaskets 4 and 6 are different, while the hollow shape of sealing gasket 6 is the same as the inner cavity shape of the matched cavity plate.

[0032] like Figure 1 and Figure 3 As shown, the cover plate 3 is made of aluminum, copper or other materials with good thermal conductivity. It is provided with a cooling medium inlet 31 and a cooling medium outlet 32. The cooling medium inlet 31 is connected to the inlet pipe 1, and the cooling medium outlet 32 ​​is connected to the outlet pipe 2. The bottom surface of the cover plate 3 integrates a pressure chamber groove structure 33 for liquid distribution. The cooling medium inlet 31 is connected to the internal pressure chamber 33. After the cooling medium enters from the cooling medium inlet 31, it is separated from the cooling medium outlet 32 ​​channel by the isolation effect of the sealing gasket 4 to ensure that the cooling medium flows according to the designed path.

[0033] The spray plate 5 is made of aluminum, copper or other materials with good thermal conductivity, and is provided with an array of spray micro-holes 51 and a spray plate cooling medium outlet 52. The cooling medium passes through the array of spray micro-holes 51 under pressure to form a high-pressure jet. The array of spray micro-holes 51 is located directly above the heat source, and its area is the same as the heat exchange area of ​​the heat source. The diameter of the spray plate 5 holes and the hole spacing are consistent to ensure the uniformity of the jet and the impact effect.

[0034] like Figure 1 and Figure 4 As shown, the cavity plate 7 is made of aluminum, copper, or other materials with good thermal conductivity, and is provided with a cavity 71 and a cooling medium outlet 72. The cavity plate 7 is located between the spray plate 5 and the spray base plate 8, and is used to adjust the spray height. It forms a heat exchange cavity 10 and a manifold 11 with the sealing gasket 6 and the spray base plate 8. The cavity plate 7 and the sealing gasket 6 have the same planar dimensions, and cavity plates 7 of different thicknesses can be replaced to change the spray height according to the different power heat dissipation requirements of the chip.

[0035] The sealing gaskets 4 and 6 are made of nylon, graphite or other sealing materials. The sealing gasket 4 is equipped with a cooling medium inlet 41 and an outlet 42, while the sealing gasket 6 is only equipped with an outlet 62.

[0036] The spray base plate 8 is made of aluminum, copper or other materials with good thermal conductivity, and has a high-density fin structure arranged vertically or horizontally. It is made by shaving teeth and the number of fins can be selected in the range of 130-160. The thickness of the fins 81 is 0.2-0.4mm, the tooth spacing is 0.1-0.3mm, the tooth height is 4.5-5.1mm, and the direction of the fins 81 can be parallel or perpendicular to the flow direction of the cooling medium to improve the local convection efficiency.

[0037] In this embodiment, the spray base plate 8 undergoes surface oxidation treatment to form an oxide layer micro-nano structure on its surface, creating a hydrophilic surface. The hydrophilic surface treatment method for the high-density finned micro-jet heat dissipation system based on hydrophilic surface modification includes the following steps:

[0038] S1. Before hydrophilic treatment, pretreatment is carried out to remove impurities from the surface of the spray base plate 8 and keep its surface clean. The specific process is as follows: soak the spray base plate 8 in hydrochloric acid for 10 minutes, then place it in ethanol for 10 minutes, and finally place it in an ultrasonic cleaner to rinse it with deionized water.

[0039] S2. Prepare aqueous solutions of appropriate volumes using K2S2O8 and KOH, with concentrations of 0.1 mol / L and 1 mol / L for K2S2O8 and KOH, respectively. Weigh out the corresponding mass of powder, add it to deionized water, and stir until completely dissolved.

[0040] S3. Perform water bath oxidation treatment. Soak the treated spray base plate 8 in a constant temperature water bath for 1 hour. Place a beaker containing a hydrophilic solution above a constant temperature heating platform and control the temperature of the heating platform to 80°C. Place the spray base plate 8 into the beaker and leave it for about 60 minutes until the sample surface is completely covered with a black hydrophilic layer.

[0041] S4. Finally, place the sample in an ultrasonic cleaner for 3 minutes and then dry it to complete the preparation of the hydrophilic surface.

[0042] In this embodiment, the spray base plate adopts a vertical high-density fin structure. The fins, which are perpendicular to the flow direction of the cooling medium, enhance fluid turbulence. The surface is modified with hydrophilicity through oxidation to form an oxide layer micro-nano structure to improve wettability. The array of micropores in the spray plate corresponds to the distribution of the heat source area. Together with the pressure chamber of the cover plate, they form a high-pressure jet to achieve precise and efficient cooling.

[0043] The working principle of this embodiment is as follows:

[0044] The heat generated by the heat-generating chip or heat source is transferred to the spray base plate 8. The cooling medium enters the pressure chamber 33 through the inlet pipe 1 and the inlet 31 of the cover plate 3. Under pressure, it forms a high-pressure jet through the array of micro-jet holes 51 of the spray plate 5. The jet impacts the high-density fin structure 81 on the upper surface of the spray base plate 8. The direction of the fins 81 is parallel or perpendicular to the coolant outlet direction, resulting in different flow characteristics: after entering, the coolant also impacts the base plate 8 for initial heat exchange, and then flows to the confluence chamber 11 through the two side channels. During this process, it fully contacts the high-density fin structure 81, which has undergone hydrophilic surface treatment, and absorbs heat. Because the surface of the spray base plate 8 is hydrophilic, the cooling medium can spread quickly and form a uniform liquid film, enhancing the heat exchange effect. The cooling medium that has absorbed heat gathers in the confluence chamber 11 and flows out through the coolant outlet 72 on the cavity plate 7, the cooling medium outlet 52 on the spray plate 5, and the cooling medium outlet 32 ​​on the cover plate 3, finally exiting through the outlet pipe 2, completing the entire heat dissipation process. Through the above cycle, the heat generated by the heat-generating chip is continuously carried away, achieving efficient heat dissipation.

[0045] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the embodiments described above. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A high-density finned micro-jet heat dissipation system based on hydrophilic surface modification, characterized in that, From top to bottom, it includes a cover plate, a spray plate, a cavity plate, and a spray base plate stacked on top of each other. Sealing gaskets are provided between the cover plate and the spray plate, between the spray plate and the cavity plate, and between the cavity plate and the spray base plate. The spray base plate has a high-density fin structure and is placed on the heating chip or heat source. The surface of the spray base plate is hydrophilic.

2. The high-density finned micro-jet heat dissipation system according to claim 1, characterized in that, The cover plate is provided with a pressure chamber groove structure for liquid distribution.

3. The high-density finned micro-jet heat dissipation system according to claim 2, characterized in that, The shape of the pressure chamber groove structure is consistent with the shape of the cavity plate.

4. The high-density finned micro-jet heat dissipation system according to claim 1, characterized in that, The high-density fin structure consists of multiple fins arranged in an array and is manufactured by shovel-tooth processing.

5. The high-density finned micro-jet heat dissipation system according to claim 4, characterized in that, The fins have a thickness of 0.2-0.4 mm, a tooth spacing of 0.1-0.3 mm, a tooth height of 4.5-5.1 mm, and the fin direction is parallel or perpendicular to the flow direction of the cooling medium.

6. The high-density finned micro-jet heat dissipation system according to claim 1, characterized in that, The cavity plate and the injection base plate form a heat exchange cavity and a manifold.

7. The high-density finned micro-jet heat dissipation system according to claim 1, characterized in that, The spray plate is equipped with an array of spray micro-holes.

8. The high-density finned micro-jet heat dissipation system according to claim 7, characterized in that, The array of jet micro-holes is positioned directly above the heat source, and its area is the same as the heat exchange area of ​​the heat source.

9. The high-density finned micro-jet heat dissipation system according to claim 1, characterized in that, The spray base plate undergoes surface oxidation treatment to form an oxide layer micro-nano structure on its surface, creating a hydrophilic surface.

10. The high-density finned micro-jet heat dissipation system according to claim 9, characterized in that, The hydrophilic surface treatment process includes the following: Remove impurities from the surface of the spray base plate; A hydrophilic solution was prepared using K2S2O8 and KOH; After removing impurities, the spray base plate is subjected to water bath oxidation treatment. Specifically, the spray base plate is immersed in a constant temperature water bath, a beaker containing a hydrophilic solution is placed above a constant temperature heating platform, the temperature of the heating platform is controlled at 80°C, the spray base plate is placed in the beaker, and left for about 60 minutes until the surface of the spray base plate is completely covered with a black hydrophilic layer. Finally, place the sprayed base plate into an ultrasonic cleaner for 3-5 minutes, then dry it to complete the hydrophilic surface treatment.

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