Cutting device for semiconductor processing

Abstract

The invention discloses a cutting device for semiconductor processing, and relates to the technical field of semiconductor processing. The wafer cutting device comprises a rack, the rack is rotationally connected with a supporting shaft and a bearing disc, the supporting shaft is fixedly connected with the bearing disc, the bearing disc is rotationally connected with a plurality of wafer bearing tables, the rack is provided with a translation device, a cutting mechanism and a bearing disc rotating assembly, the bearing disc is provided with a wafer table rotating assembly, and the rack is provided with a clamping assembly. The translation device drives the cutting mechanism to move to complete the first cutting of the wafer on the wafer bearing table; then the cutting mechanism is moved, and the wafer table rotating assembly synchronously drives the wafer bearing table to rotate by 90 degrees and is limited by the clamping assembly; then the cutting mechanism is moved reversely, and secondary cutting in the vertical direction is completed; and finally, the carrying disc continues to move reversely, the carrying disc rotating assembly drives the carrying disc to rotate to the next station while limiting is relieved, and the problems that an existing device is complex, space is occupied, and cost is wasted are solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing, and particularly relates to a cutting device for semiconductor processing. BACKGROUND

[0002] In the semiconductor processing process, wafer dicing is a key process of dividing a wafer packaged with thousands of chips into single chips; the mainstream cutting technology at present is mechanical cutting using an ultrathin diamond cutter.

[0003] Patent No. CN116728624A discloses a cutting device for semiconductor processing, which realizes step-by-step horizontal and vertical cutting of a wafer through a rotating bearing disc and a wafer supporting table rotating on the bearing disc, reduces the moving track of a cutter through reciprocating movement of a slitting cutter roller, ensures cutting precision and improves cutting efficiency, reduces control difficulty, and avoids waste liquid and debris from remaining on the wafer surface and the inside of a cutting seam through centrifugal flushing of the wafer surface and the inside of the cutting seam during the cutting process and the wafer transfer process, improves cleaning effect, and facilitates subsequent processing; through the hollow roller shaft and the spray holes arranged on both sides of the cutter, deionized water is rapidly diffused on the surface of the cutter, improving the cooling and debris removal effect.

[0004] However, the above cutting device has obvious deficiencies in the wafer cutting link: it needs to rely on two independent mechanisms, a horizontal cutting mechanism and a vertical cutting mechanism, to respectively perform horizontal and vertical cutting operations, and such a separate cutting mode not only increases the overall complexity of the equipment, but also unnecessarily wastes space and manufacturing cost. SUMMARY

[0005] The application aims to provide a cutting device for semiconductor processing, which drives the cutting mechanism to move through the translation device, completes the first cutting of the wafer supporting table, then moves the cutting mechanism, synchronously drives the wafer supporting table to rotate 90 degrees by the wafer supporting table rotating assembly and is limited by the clamping assembly, then reversely moves the cutting mechanism, completes the second cutting in the vertical direction, and finally continues to reversely move, removes the limitation while driving the bearing disc to rotate to the next station by the bearing disc rotating assembly, solving the problems of the existing device, such as complexity, space occupation, and cost waste.

[0006] To solve the above technical problems, the application is implemented through the following technical scheme:

[0007] The application discloses a cutting device for semiconductor processing, which comprises a rack, a supporting shaft and a bearing disc rotatably connected to the rack, the supporting shaft being fixedly connected to the bearing disc, a plurality of wafer supporting tables rotatably connected to the bearing disc, a translation device, a cutting mechanism and a bearing disc rotating assembly installed on the rack, a wafer supporting table rotating assembly installed on the bearing disc and a clamping assembly installed on the rack; the translation device drives the cutting mechanism to move to cut wafers on the wafer supporting tables for the first time; after the cutting is completed, the cutting mechanism is continuously moved, the wafer supporting tables are driven to rotate by 90 degrees by the wafer supporting table rotating assembly and the rotating position of the wafer supporting tables is limited by the clamping assembly; then the translation device reversely moves the cutting mechanism to complete the second cutting of the wafers in the vertical direction; after the cutting is completed, the cutting mechanism is continuously reversely moved to release the limitation of the wafer supporting tables by the clamping assembly and the bearing disc is driven to rotate to the next working position by the bearing disc rotating assembly.

[0008] As a preferred technical scheme of the application, the translation device comprises an electric telescopic rod fixedly connected to the rack, a sliding seat, an abutting block and a driving rod slidably connected to the rack, the output end of the electric telescopic rod is fixedly connected to the sliding seat, the sliding seat is movably connected with a sliding rod, one end of the sliding rod is fixedly connected with a protruding block and the other end is fixedly connected with the abutting block, the abutting block is fixedly connected with the driving rod through a connecting rod, the driving rod is fixedly connected with a pushing block, the driving rod is in transmission connection with the bearing disc rotating assembly and the pushing block is in transmission connection with the wafer supporting table rotating assembly.

[0009] As a preferred technical scheme of the application, the cutting mechanism comprises a U-shaped frame fixedly connected to the sliding seat, the U-shaped frame is rotatably connected with a mounting shaft and fixedly connected with a motor, the output end of the motor is fixedly connected with the mounting shaft and the mounting shaft is fixedly connected with a plurality of cutting knives.

[0010] As a preferred technical scheme of the application, the bearing disc rotating assembly comprises a dividing disc and a driving shaft rotatably connected to the rack, the bearing disc and the dividing disc are fixedly connected with the supporting shaft, the driving rod is fixedly connected with a first gear rack, the dividing disc is provided with a circular groove and a plurality of dividing grooves, each dividing groove is in communication with the circular groove and is arranged in a ring array around the dividing disc, the driving shaft is installed with a first gear in mesh with the first gear rack through a one-way bearing, the driving shaft is fixedly connected with an eccentric rod, the eccentric rod is rotatably connected with a follower, the driving shaft drives the follower to rotate, the follower is sequentially slid into each dividing groove by the rotation and drives the bearing disc to rotate by one degree during the movement in the dividing groove, so that the dividing rotation of the bearing disc is realized.

[0011] As a preferred technical scheme of the present application, the rack is provided with a locking assembly for positioning the rotating position of the bearing disc, the locking assembly comprises a fixed plate fixedly connected with the rack, a sliding frame slidingly connected with the rack, the index disc is provided with a plurality of locking grooves arranged in a ring shape along the inner wall of the circular groove, the driving shaft is fixedly connected with an eccentric wheel, a return spring is arranged between the fixed plate and the sliding frame, one end of the sliding frame is rotatably connected with an abutment ring, and the other end is fixedly connected with a locking block, the eccentric wheel drives the sliding frame to move by rotating, so that the locking block is clamped into the locking groove, thereby limiting the index disc.

[0012] As a preferred technical scheme of the present application, the rack is provided with a locking assembly for positioning the rotating position of the bearing disc, the locking assembly comprises a fixed plate fixedly connected with the rack, a sliding frame slidingly connected with the rack, the index disc is provided with a plurality of locking grooves arranged in a ring shape along the inner wall of the circular groove, the driving shaft is fixedly connected with an eccentric wheel, a return spring is arranged between the fixed plate and the sliding frame, one end of the sliding frame is rotatably connected with an abutment ring, and the other end is fixedly connected with a locking block, the eccentric wheel drives the sliding frame to move by rotating, so that the locking block is clamped into the locking groove, thereby limiting the index disc.

[0013] As a preferred technical scheme of the present application, the rack is provided with a locking assembly for positioning the rotating position of the bearing disc, the locking assembly comprises a fixed plate fixedly connected with the rack, a sliding frame slidingly connected with the rack, the index disc is provided with a plurality of locking grooves arranged in a ring shape along the inner wall of the circular groove, the driving shaft is fixedly connected with an eccentric wheel, a return spring is arranged between the fixed plate and the sliding frame, one end of the sliding frame is rotatably connected with an abutment ring, and the other end is fixedly connected with a locking block, the eccentric wheel drives the sliding frame to move by rotating, so that the locking block is clamped into the locking groove, thereby limiting the index disc.

[0014] As a preferred technical scheme of the present application, the rack is provided with a locking assembly for positioning the rotating position of the bearing disc, the locking assembly comprises a fixed plate fixedly connected with the rack, a sliding frame slidingly connected with the rack, the index disc is provided with a plurality of locking grooves arranged in a ring shape along the inner wall of the circular groove, the driving shaft is fixedly connected with an eccentric wheel, a return spring is arranged between the fixed plate and the sliding frame, one end of the sliding frame is rotatably connected with an abutment ring, and the other end is fixedly connected with a locking block, the eccentric wheel drives the sliding frame to move by rotating, so that the locking block is clamped into the locking groove, thereby limiting the index disc.

[0015] As a preferred technical scheme of the present application, the rack is provided with a locking assembly for positioning the rotating position of the bearing disc, the locking assembly comprises a fixed plate fixedly connected with the rack, a sliding frame slidingly connected with the rack, the index disc is provided with a plurality of locking grooves arranged in a ring shape along the inner wall of the circular groove, the driving shaft is fixedly connected with an eccentric wheel, a return spring is arranged between the fixed plate and the sliding frame, one end of the sliding frame is rotatably connected with an abutment ring, and the other end is fixedly connected with a locking block, the eccentric wheel drives the sliding frame to move by rotating, so that the locking block is clamped into the locking groove, thereby limiting the index disc.

[0016] As a preferred technical scheme of the present application, the wafer supporting table is provided with positioning assemblies symmetrically arranged on both sides of the wafer supporting table, the positioning assembly comprises a positioning cylinder fixedly connected with the wafer supporting table, a connecting rod in sliding connection with the wafer supporting table, and the output end of the positioning cylinder is fixedly connected with the connecting rod, and the connecting rod is fixedly connected with an arc-shaped plate.

[0017] The present application has the following advantages:

[0018] The present application drives the cutting mechanism to move by the translation device, and performs a first transverse cutting operation on the fixed wafer on the wafer supporting table. After the first cutting is completed, the translation device continues to drive the cutting mechanism to move, and in this process, the translation device drives the wafer supporting table to rotate accurately by the wafer supporting table rotating assembly, so that the cutting direction of the wafer is adjusted to be perpendicular to the moving direction of the cutting mechanism. At the same time, the clamping assembly is started synchronously, and the rotating position of the wafer supporting table is rigidly limited to ensure the position accuracy of subsequent cutting. After the positioning of the wafer supporting table is completed, the translation device drives the cutting mechanism to move reversely to perform a second longitudinal cutting on the wafer, so as to realize the cross cutting requirement of the wafer. After the second cutting is completed, the translation device continues to drive the cutting mechanism to move reversely, and in this process, the clamping assembly releases the limitation of the wafer supporting table by the translation device. At the same time, the carrier disc rotating assembly drives the carrier disc to rotate, so as to rotate out the wafer station after the cutting is completed, and rotate the wafer supporting table with the wafer to be cut next to the cutting station, and enter the next cutting cycle. The device can complete the transverse and longitudinal cutting operation of the wafer only by a single cutting mechanism cooperating with the angle adjustment of the wafer supporting table and the station switching of the carrier disc, and solves the problems of high complexity, space waste and cost waste of the existing device.

[0019] Of course, any product implementing the present application does not necessarily need to achieve all the advantages described above. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0021] Figure 1 It is a structural schematic diagram of a semiconductor processing cutting device of the present application.

[0022] Figure 2 It is a structural schematic diagram of a semiconductor processing cutting device of the present application.

[0023] Figure 3 It is a structural schematic diagram of a semiconductor processing cutting device of the present application.

[0024] Figure 4Structure diagram of the cutting mechanism of the application;

[0025] Figure 5 Structure diagram of the carrier disc rotating assembly of the application;

[0026] Figure 6 Structure diagram of the locking assembly of the application;

[0027] Figure 7 Structure diagram of the sheet table rotating assembly of the application;

[0028] Figure 8 Structure diagram of the clamping assembly of the application;

[0029] Figure 9 Structure diagram of the positioning assembly of the application.

[0030] In the drawings, the components represented by the respective reference numerals are listed as follows:

[0031] 1, frame; 2, translation device; 3, cutting mechanism; 4, carrier disc rotating assembly; 5, sheet table rotating assembly; 6, clamping assembly; 7, positioning assembly; 11, support shaft; 12, carrier disc; 13, sheet table; 21, electric telescopic rod; 22, sliding seat; 23, abutting block; 24, driving rod; 25, sliding rod; 26, protruding block; 27, push block; 31, U-shaped frame; 32, mounting shaft; 33, motor; 34, cutting knife; 41, index disc; 411, circular groove; 412, index groove; 413, locking groove; 42, driving shaft; 43, first rack; 44, first gear; 45, eccentric rod; 46, follower; 47, locking assembly; 471, fixed plate; 472, sliding frame; 473, eccentric wheel; 474, return spring; 475, abutting ring; 476, locking block; 51, second rack; 52, limiting block; 53, second gear; 54, worm; 55, worm wheel; 56, push-pull spring; 57, guide rod; 58, flange; 61, sliding sleeve; 62, positioning block; 63, clamping block; 64, connecting plate; 65, clamping spring; 66, clamping groove; 67, abutting rod; 71, positioning cylinder; 72, connecting rod; 73, arc-shaped plate. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the application.

[0033] In the description of the present application, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery" and the like indicate the orientation or positional relationship, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0034] Referring to Figures 1-9 As shown in the drawings, the present application is a kind of cutting device for semiconductor processing, including frame 1, frame 1 rotationally connected with support shaft 11 and bearing disc 12, support shaft 11 is fixedly connected with bearing disc 12, bearing disc 12 is rotationally connected with a plurality of piece table 13: frame 1 is installed with translation device 2, cutting mechanism 3 and carrier disc rotation assembly 4, bearing disc 12 is installed with piece table rotation assembly 5, frame 1 is installed with clamping assembly 6;In use, translation device 2 drives cutting mechanism 3 to move, and the first cutting operation is carried out on the wafer fixed on piece table 13, after the first cutting, translation device 2 continues to drive cutting mechanism 3 to move, in this process, translation device 2 drives piece table 13 to rotate accurately 90 ° by means of piece table rotation assembly 5, so that the wafer cutting direction is adjusted to be perpendicular to the moving direction of cutting mechanism 3;At the same time, clamping assembly 6 is started synchronously, and the rotation position of piece table 13 is rigidly limited to ensure the position accuracy of subsequent cutting;After the positioning of piece table 13 is completed, translation device 2 drives cutting mechanism 3 to move reversely, and the wafer is cut vertically for the second time, so as to realize the cross cutting requirement of wafer;After the second cutting is completed, translation device 2 continues to drive cutting mechanism 3 to move reversely, in this process, clamping assembly 6 removes the limitation of piece table 13 by translation device 2;At the same time, carrier disc rotation assembly 4 drives bearing disc 12 to rotate, so as to rotate out the wafer station after cutting, and rotate the piece table 13 where the next wafer to be cut is located to the cutting station, and enter the next cutting cycle;The device can complete the horizontal and vertical cutting operation of wafer by means of single cutting mechanism 3 cooperating with the angle adjustment of piece table 13 and the station switching of bearing disc 12;Solve the problem of high complexity, space and cost waste of existing device.

[0035] Referring to Figures 1-4As shown, the translation device 2 includes a motorized telescopic rod 21 fixedly connected with the rack 1, a sliding seat 22 slidingly connected with the rack 1, an abutting block 23 and a driving rod 24, the output end of the motorized telescopic rod 21 is fixedly connected with the sliding seat 22, the sliding seat 22 is movably connected with a sliding rod 25, one end of the sliding rod 25 is fixedly connected with a protruding block 26, the other end is fixedly connected with the abutting block 23, the abutting block 23 is fixedly connected with the driving rod 24 through a connecting rod, the driving rod 24 is fixedly connected with a push block 27, the driving rod 24 is drivingly connected with the carrier disc rotating assembly 4, the push block 27 is drivingly connected with the wafer table rotating assembly 5; in use, the motorized telescopic rod 21 is started to push the sliding seat 22 to move; when the sliding seat 22 moves, it drives the cutting mechanism 3 to cut the wafer in the horizontal direction, after the cutting is completed, the sliding seat 22 will contact the protruding block 26, the sliding rod 25 and the abutting block 23 will move accordingly, the abutting block 23 drives the driving rod 24 to move through the connecting rod, the driving rod 24 drives the push block 27 to act, the push block 27 and the wafer table rotating assembly 5 are drivingly connected to provide driving force for the rotation of the wafer table 13, the switching of the wafer cutting direction is realized, after the switching is completed, the motorized telescopic rod 21 is started to move the sliding seat 22 in the reverse direction, the wafer is cut in the vertical direction, after the cutting is completed, the sliding seat 22 is continuously moved in the reverse direction, the sliding seat 22 will abut against the abutting block 23, which will correspondingly push the driving rod 24 to move in the reverse direction, the driving rod 24 will drive the carrier disc rotating assembly 4 to rotate the carrier disc 12 in the reverse movement process, the wafer station after the cutting is completed is rotated out, and the wafer table 13 where the next wafer to be cut is located is rotated to the cutting station to enter the next cutting cycle; it not only provides basic support for the movement of the cutting mechanism 3, but also synchronously drives the wafer table rotating assembly 5 and the carrier disc rotating assembly 4, so that the orderly cutting of the wafer and the multi-station cycle are ensured.

[0036] Please refer to Figures 1-4 As shown, the cutting mechanism 3 includes a U-shaped frame 31 fixedly connected with the sliding seat 22, the U-shaped frame 31 is rotatably connected with a mounting shaft 32 and is fixedly connected with a motor 33, the output end of the motor 33 is fixedly connected with the mounting shaft 32, and the mounting shaft 32 is fixedly connected with a plurality of cutting knives 34; in use, when the sliding seat 22 is moved by the translation device 2, the U-shaped frame 31 moves synchronously with the sliding seat 22, and the motor 33 is started to cut the wafer by the cutting knives 34, finally the wafer is cut in the horizontal and vertical directions through the cooperation of the motor 33 and the movement of the sliding seat 22.

[0037] Please refer to Figures 1-5As shown, the carrier disc rotating assembly 4 comprises an indexing disc 41 rotatably connected with the rack 1 and a driving shaft 42, the carrier disc 12 and the indexing disc 41 are fixedly connected with the support shaft 11, the driving rod 24 is fixedly connected with a first rack 43, the indexing disc 41 is provided with a circular groove 411 and a plurality of indexing grooves 412, each indexing groove 412 is communicated with the circular groove 411 and is distributed in a ring array around the indexing disc 41, the driving shaft 42 is installed with a first gear 44 engaged with the first rack 43 through a one-way bearing, the driving shaft 42 is fixedly connected with an eccentric rod 45, the eccentric rod 45 is rotatably connected with a follower 46, the driving shaft 42 drives the follower 46 to rotate, the follower 46 is sequentially slid into each indexing groove 412 by rotation, and the follower 46 drives the indexing disc 41 to rotate once in the movement process in the indexing groove 412, so as to realize the indexing rotation of the carrier disc 12; in use, when the driving rod 24 of the translation device 2 moves reversely, the first rack 43 moves synchronously, the first gear 44 engaged with the first rack 43 rotates and drives the driving shaft 42 to rotate; when the driving shaft 42 rotates, the eccentric rod 45 fixed thereon rotates synchronously, the eccentric rod 45 drives the follower 46 to eccentrically move; the follower 46 first slides into an indexing groove 412 of the indexing disc 41, drives the indexing disc 41 to rotate by the limiting action of the indexing groove 412, and the indexing disc 41 drives the carrier disc 12 to rotate synchronously through the support shaft 11; the follower 46 continues to move, slides into the circular groove 411 from the current indexing groove 412, after completing indexing positioning, slides into the next indexing groove 412, and drives the indexing disc 41 to rotate for the next indexing, so as to realize the accurate switching of the carrier disc 12; the circular groove 411 provides a transition space for the follower 46 to switch the indexing groove 412, finally realizes the orderly and accurate switching of the carrier disc 12 by the driving rod 24 driving the rack transmission, cooperating with the indexing structure of the eccentric rod 45, the follower 46 and the indexing disc 41, and guarantees the stable cutting cycle of multiple stations.

[0038] Please refer to Figures 1-6As shown, the rack 1 is provided with a locking assembly 47 for positioning the rotating position of the carrier disc 12, the locking assembly 47 comprising a fixed plate 471 fixedly connected with the rack 1, a sliding frame 472 slidingly connected with the rack 1, the indexing disc 41 being provided with a plurality of locking grooves 413 arranged in a ring shape along the inner wall of the circular groove 411, the driving shaft 42 being fixedly connected with an eccentric wheel 473, the fixed plate 471 and the sliding frame 472 being provided with a reset spring 474, one end of the sliding frame 472 being rotatably connected with an abutting ring 475, the other end being fixedly connected with a locking block 476, the eccentric wheel 473 moving the sliding frame 472 by rotating to make the locking block 476 clamped into the locking groove 413, so as to limit the indexing disc 41; the abutting ring 475 moves the sliding frame 472 by rotating the eccentric wheel 473 to make the locking block 476 clamped into the locking groove 413, so as to limit the indexing disc 41; in use, when the driving shaft 42 rotates with the carrier disc rotating assembly 4, the eccentric wheel 473 rotates synchronously: the protruding part thereof is away from the abutting ring 475, the reset spring 474 pushes the sliding frame 472 to move, driving the locking block 476 to be out of the locking groove 413, so as to release the locking to enable the carrier disc 12 to switch the station; when the carrier disc 12 rotates to the target station, the protruding part of the eccentric wheel 473 pushes the abutting ring 475, so that the sliding frame 472 compresses the reset spring 474, the locking block 476 is reset to be embedded in the corresponding locking groove 413, rigidly limiting the indexing disc 41 to fix the carrier disc 12; in the whole process, the transmission of the eccentric wheel 473 and the abutting ring 475 ensures the action to match the rhythm of the carrier disc, the reset spring 474 guarantees the stable reset of the locking block 476, realizes the accurate positioning of the carrier disc 12, avoids the cutting deviation, and guarantees the stable circulation of the multi-station.

[0039] Please refer to Figure 2 and Figure 7As shown, the wafer table rotating assembly 5 includes a second rack 51 slidingly connected with the bearing disc 12, a limiting block 52 fixedly connected with the bearing disc 12, a second gear 53 rotatably connected with the bearing disc 12, a worm 54, and a worm wheel 55 fixedly connected with the wafer table 13, the second rack 51 is engaged with the second gear 53, the second rack 51 corresponds to the position of the push block 27, and is pushed to move by the push block 27, and is provided with a push-pull spring 56 between the second rack 51 and the limiting block 52, the second gear 53 is fixedly connected with the worm 54, the worm 54 is engaged with the worm wheel 55; in use, when the push block 27 of the translation device 2 contacts the second rack 51 and pushes it to slide along the bearing disc 12, the second rack 51 compresses the push-pull spring 56 between the second rack 51 and the limiting block 52, and at the same time drives the second gear 53 engaged to rotate; the worm 54 rotating synchronously with the second gear 53 drives the worm wheel 55 engaged to rotate, and in turn drives the wafer table 13 to rotate; when the wafer table 13 rotates 90 degrees to the target position, the push block 27 stops pushing, and the adjustment of the cutting station of the wafer table 13 is completed; during the whole process, the engagement transmission of the worm 54 and the worm wheel 55 ensures the accurate rotation angle of the wafer table 13, the push-pull spring 56 ensures the automatic reset of the second rack 51 to prepare for the next action, and the limiting block 52 limits the sliding stroke of the second rack 51, so that the wafer table 13 is finally stably and accurately rotated, and the preparation for the direction switching of the wafer longitudinal cutting is completed.

[0040] As shown in Figure 2 and Figure 7 As shown, the limiting block 52 is movably connected with a guide rod 57, and the end of the guide rod 57 away from the second rack 51 is fixedly connected with a limiting flange 58; in use, in the reset stage of the wafer table rotating assembly 5, after the wafer table 13 completes the 90-degree rotation to assist the wafer longitudinal cutting, the push-pull spring 56 releases the elastic force to drive the second rack 51 to move reversely, the second rack 51 drives the second gear 53 and the worm 54 to rotate, and the worm 54 drives the worm wheel 55 to drive the wafer table 13 to rotate to the initial state; at this time, the guide rod 57 moves synchronously with the second rack 51, and the limiting flange 58 moves accordingly; when the wafer table 13 rotates to the initial position, the limiting flange 58 abuts against the limiting block 52 to form a rigid block; the block action limits the guide rod 57 from continuing to move, and in turn pulls the second rack 51 through the guide rod 57, so that the second rack 51, the second gear 53 and the worm 54 stop moving, the worm 54 no longer drives the worm wheel 55 to rotate, and the wafer table 13 is accurately stopped at the initial state; during the whole process, the guide rod 57 provides a guide for the reset movement of the second rack 51 to avoid its deviation, and the cooperation of the limiting flange 58 and the limiting block 52 controls the reset position of the wafer table 13, so that the wafer table 13 can maintain the initial angle when used again, and the consistency and precision of the wafer cutting direction switching are ensured.

[0041] As shown in Figure 2 and Figure 8As shown, the clamping assembly 6 comprises a sliding sleeve 61 fixedly connected with the rack 1, a positioning block 62 fixedly connected with the sliding rod 25, the sliding sleeve 61 is slidably connected with a connecting plate 64, the lower surface of the connecting plate 64 is fixedly connected with a clamping block 63, the upper surface of the connecting plate 64 is provided with a clamping spring 65 between the connecting plate 64 and the inner wall of the rack 1, the top wall of the positioning block 62 is provided with a clamping groove 66 for inserting the clamping block 63, the positioning block 62 is wedge-shaped towards the first cutting direction of the cutting mechanism 3, and the clamping block 63 is wedge-shaped away from the first cutting direction of the cutting mechanism 3; in use, when the cutting mechanism 3 completes the first transverse cutting, the cutting mechanism 3 is continuously moved, and the cutting mechanism 3 will be in contact with the protrusion 26 in the moving process, and drive the protrusion 26, the sliding rod 25, the abutting block 23, the driving rod 24 and the push block 27 to move, the push block 27 will drive the sheet supporting table 13 to rotate through the sheet table rotating assembly 5 in the moving process, the sliding rod 25 drives the positioning block 62 to move synchronously with the sliding seat 22, the wedge-shaped surface of the positioning block 62 towards the cutting direction is in contact with the wedge-shaped surface of the clamping block 63 away from the cutting direction, the guiding effect of the wedge-shaped surface makes the clamping block 63 be pressed and slide along the sliding sleeve 61 to one side of the connecting plate 64, the connecting plate 64 compresses the clamping spring 65, at this time the clamping block 63 is not temporarily limited, ensuring the smooth movement of the positioning block 62 with the sliding rod 25; when the push block 27 drives the sheet supporting table 13 to rotate 90 degrees through the sheet table rotating assembly 5, the clamping groove 66 is aligned with the clamping block 63, the clamping spring 65 releases the elastic force to reset the connecting plate 64, drives the clamping block 63 to slide into the clamping groove 66, and the clamping block 63 and the clamping groove 66 cooperate to rigidly limit the positioning block 62, and then fix the position of the sliding rod 25, ensuring that the sheet supporting table 13 stably maintains a 90-degree state to cooperate with the longitudinal cutting, thereby ensuring the position accuracy of the second cutting.

[0042] Please refer to Figure 2 and Figure 8As shown, the clamping block 63 is located above the sliding seat 22, the abutting rod 67 is slidably connected in the sliding sleeve 61, and the lower surface of the connecting plate 64 is fixedly connected with the abutting rod 67; the top of the sliding seat 22 is wedge-shaped, the bottom of the abutting rod 67 is wedge-shaped, and when the sliding seat 22 moves back and forth along the preset track, the wedge-shaped surface at the top can be adapted and fitted with the wedge-shaped surface at the bottom of the abutting rod 67 to form a sliding fit, and the abutting rod 67 is driven to slide synchronously along the sliding sleeve 61 through the guiding thrust of the wedge-shaped surface, so that the abutting rod 67 does not hinder the reciprocating movement of the sliding seat 22; in use, when the longitudinal cutting is completed and the sliding seat 22 moves reversely, the wedge-shaped surface at the top of the sliding seat 22 is in contact with and pressed against the wedge-shaped surface at the bottom of the abutting rod 67, thereby pushing the abutting rod 67 to slide upward along the sliding sleeve 61, the abutting rod 67 drives the connecting plate 64 to move upward synchronously, the connecting plate 64 pulls the clamping block 63 out of the clamping groove 66, thereby releasing the locking of the positioning block 62, and the sliding seat 22 will be in contact with the abutting block 23 in the subsequent movement process, at this time, the slide rod 25 continues to move with the sliding seat 22 through the abutting block 23, thereby creating conditions for the subsequent carrier disc rotating assembly 4 to drive the carrier disc 12 to switch the work station; in the whole process, the wedge-shaped structure realizes automatic clamping and unlocking without additional power, the clamping spring 65 guarantees the stable resetting and locking strength of the clamping block 63, and finally the positioning and release of the carrier wafer table 13 are accurately controlled through mechanical linkage, thereby ensuring the precision of secondary cutting and the continuity of the process.

[0043] As shown in Figure 7 and Figure 9 As shown, the carrier wafer table 13 is provided with the positioning assembly 7 symmetrically distributed on both sides of the carrier wafer table 13, the positioning assembly 7 comprises the positioning cylinder 71 fixedly connected with the carrier wafer table 13, the connecting rod 72 slidably connected with the carrier wafer table 13, the output end of the positioning cylinder 71 fixedly connected with the connecting rod 72, and the arc-shaped plate 73 fixedly connected with the connecting rod 72; in use, after the wafer to be cut is placed on the carrier wafer table 13, the positioning cylinders 71 symmetrically distributed on both sides of the carrier wafer table 13 are started, the output end of the positioning cylinder 71 pushes the connecting rod 72 to slide along the carrier wafer table 13, the connecting rod 72 drives the arc-shaped plate 73 fixed at the end to move synchronously toward the wafer, and the two arc-shaped plates 73 gradually approach and abut against the outer wall of the wafer, so that the wafer is fixed on the carrier wafer table 13 through the symmetrical clamping force, thereby facilitating the subsequent cutting operation.

[0044] In the description of the present specification, the description referring to the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The preferred embodiments of the application disclosed above are only to facilitate the elucidation of the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments described. Obviously, many modifications and variations can be made in light of the teachings above. The description is chosen and described in order to best explain the principles of the application and its practical application to thereby enable others skilled in the art to best utilize the application and get the best results from the application. The application is only limited by the claims and their full scope and equivalents.

Claims

1. A cutting device for semiconductor processing, comprising a frame (1), the frame (1) is rotationally connected with a support shaft (11) and a carrier disc (12), the support shaft (11) is fixedly connected with the carrier disc (12), the carrier disc (12) is rotationally connected with a plurality of wafer supporting tables (13), characterized in that: the frame (1) is provided with a translation device (2), a cutting mechanism (3) and a carrier disc rotation assembly (4), the carrier disc (12) is provided with a wafer supporting table rotation assembly (5), and the frame (1) is provided with a clamping assembly (6); the translation device (2) drives the cutting mechanism (3) to move to perform the first cutting on the wafer on the wafer supporting table (13); after the cutting is completed, the cutting mechanism (3) is continuously moved, the wafer supporting table (13) is rotated by 90° by the wafer supporting table rotation assembly (5), and the rotation position of the wafer supporting table (13) is limited by the clamping assembly (6); then the translation device (2) reversely moves the cutting mechanism (3) to complete the second cutting in the vertical direction of the wafer; after the cutting is completed, the cutting mechanism (3) is continuously reversely moved to release the limitation of the wafer supporting table (13) by the clamping assembly (6), and the carrier disc (12) is rotated to the next station by the carrier disc rotation assembly (4).

2. The apparatus according to claim 1, wherein the translation device (2) comprises an electric telescopic rod (21) fixedly connected with the frame (1), a sliding seat (22) slidingly connected with the frame (1), an abutment block (23) and a driving rod (24), the output end of the electric telescopic rod (21) is fixedly connected with the sliding seat (22), the sliding seat (22) is movably inserted with a sliding rod (25), one end of the sliding rod (25) is fixedly connected with a protruding block (26), the other end is fixedly connected with the abutment block (23), the abutment block (23) is fixedly connected with the driving rod (24) through a connecting rod, the driving rod (24) is fixedly connected with a push block (27), the driving rod (24) is drivingly connected with the carrier disc rotation assembly (4), and the push block (27) is drivingly connected with the wafer supporting table rotation assembly (5).

3. The apparatus according to claim 2, wherein the cutting mechanism (3) comprises a U-shaped frame (31) fixedly connected with the sliding seat (22), the U-shaped frame (31) is rotationally connected with a mounting shaft (32) and is fixedly connected with a motor (33), the output end of the motor (33) is fixedly connected with the mounting shaft (32), and the mounting shaft (32) is fixedly connected with a plurality of cutting knives (34).

4. The apparatus according to claim 2, wherein The carrier disc rotating assembly (4) comprises an indexing disc (41) rotatably connected with the rack (1) and a driving shaft (42), the carrier disc (12) and the indexing disc (41) are fixedly connected with the support shaft (11), the driving rod (24) is fixedly connected with a first rack (43), the indexing disc (41) is provided with a circular groove (411) and a plurality of indexing grooves (412), each indexing groove (412) is communicated with the circular groove (411) and is distributed in a ring array around the indexing disc (41), the driving shaft (42) is installed with a first gear (44) engaged with the first rack (43) through a one-way bearing, the driving shaft (42) is fixedly connected with an eccentric rod (45), the eccentric rod (45) is rotatably connected with a follower (46), the driving shaft (42) drives the follower (46) to rotate, the follower (46) is sequentially slid into each indexing groove (412) by rotation, and the follower (46) drives the indexing disc (41) to rotate once in the movement process in the indexing groove (412), so that the indexing rotation of the carrier disc (12) is realized.

5. The apparatus according to claim 4, wherein The rack (1) is provided with a locking assembly (47) for positioning the rotating position of the carrier disc (12), the locking assembly (47) comprises a fixed plate (471) fixedly connected with the rack (1) and a sliding frame (472) slidably connected with the rack (1), the indexing disc (41) is provided with a plurality of locking grooves (413) distributed in a ring array along the inner wall of the circular groove (411), the driving shaft (42) is fixedly connected with an eccentric wheel (473), a return spring (474) is arranged between the fixed plate (471) and the sliding frame (472), one end of the sliding frame (472) is rotatably connected with an abutting ring (475), and the other end is fixedly connected with a locking block (476), the eccentric wheel (473) drives the sliding frame (472) to move by rotation, so that the locking block (476) is clamped into the locking groove (413), and the indexing disc (41) is limited.

6. The apparatus according to claim 5, wherein The sheet table rotating assembly (5) comprises a second rack (51) slidably connected with the carrier disc (12), a limiting block (52) fixedly connected with the carrier disc (12), a second gear (53) rotatably connected with the carrier disc (12), a worm (54) and a worm wheel (55) fixedly connected with the carrier sheet table (13), the second rack (51) is engaged with the second gear (53), the second rack (51) corresponds to the position of the push block (27) and is driven to move by the push block (27), a push-pull spring (56) is arranged between the second rack (51) and the limiting block (52), the second gear (53) is fixedly connected with the worm (54), and the worm (54) is engaged with the worm wheel (55).

7. The apparatus according to claim 6, wherein The limiting block (52) is movably connected with a guide rod (57), and the guide rod (57) is fixedly connected with a limiting flange (58) at an end away from the second rack (51).

8. The apparatus according to claim 6, wherein The clamping assembly (6) comprises a sliding sleeve (61) fixedly connected with the rack (1), a positioning block (62) fixedly connected with the sliding rod (25), the sliding sleeve (61) is slidably connected with a connecting plate (64), the lower surface of the connecting plate (64) is fixedly connected with a clamping block (63), the upper surface of the connecting plate (64) is provided with a clamping spring (65) between the inner wall of the rack (1), the top wall of the positioning block (62) is provided with a clamping groove (66) for inserting the clamping block (63), the positioning block (62) is wedge-shaped towards the first cutting direction of the cutting mechanism (3), and the clamping block (63) is wedge-shaped away from the first cutting direction of the cutting mechanism (3).

9. The cutting device for semiconductor processing according to claim 8, wherein the lower surface of the connecting plate (64) is fixedly connected with an abutting rod (67); the top of the sliding seat (22) is wedge-shaped on both sides, and the bottom of the abutting rod (67) is wedge-shaped on both sides; when the sliding seat (22) moves back and forth along the preset track, the wedge-shaped surface at the top of the sliding seat (22) can be adapted and fitted with the wedge-shaped surface at the bottom of the abutting rod (67) to form a sliding fit, so that the abutting rod (67) is driven to slide along the sliding sleeve (61) by the guiding thrust of the wedge-shaped surface, so that the abutting rod (67) does not hinder the reciprocating movement of the sliding seat (22).

10. The apparatus according to claim 1, wherein The supporting piece table (13) is provided with a positioning assembly (7) symmetrically distributed on both sides of the supporting piece table (13), the positioning assembly (7) comprises a positioning cylinder (71) fixedly connected with the supporting piece table (13), and a connecting rod (72) slidably connected with the supporting piece table (13); the output end of the positioning cylinder (71) is fixedly connected with the connecting rod (72), and the connecting rod (72) is fixedly connected with an arc-shaped plate (73).

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