Electronic waste precious metal separation and extraction device and extraction process

Abstract

The invention discloses an electronic waste precious metal separation and extraction device and an extraction process, and relates to the technical field of electronic waste recovery, the device comprises a rack, the rack is provided with a washing pool, an extraction tank, a water storage tank and an extraction tank, and the washing pool is located in the middle of the rack; the L-shaped supporting plate is movably mounted on the rack and is used for supporting the circuit board; the first guide groove and the second guide groove are matched to limit the two ends of the fixing part of the supporting plate and enable the supporting plate to move according to a preset path and a preset angle, so that the circuit board moves into the washing pool and the welding spots are washed off. The solution in the washing pool is pushed to penetrate through the notch in the fixing part of the supporting plate to be in contact with the back face of the circuit board, impact tin soldering points on the back face of the circuit board and gradually dissolve the tin soldering points, and meanwhile, the solution below the supporting plate is extruded to guide the solution to impact upwards along the slope in the notch of the supporting part to collide with the front face of the circuit board; the tin in the circuit board plug-in element hole is impacted so that the electronic component is separated from the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic waste recycling, in particular to an electronic waste precious metal separation and extraction device and extraction process. BACKGROUND

[0002] It is known that the circuit board is a common electronic equipment, which contains various rare metals, among which gold, silver and palladium are core precious metals, and gallium, selenium, scandium and other trace elements, so the scrapped circuit board still has good recycling value.

[0003] For example, the application with the application publication number CN103695653B and the application publication date of June 8, 2016, and the name of a method for extracting precious metals from circuit boards by wet process, which includes the following steps: using hot lye and acidic sodium chlorate solution to treat the whole circuit board (including the plastic substrate and the electronic components welded thereon) in sequence, so that the welded electronic components are automatically detached from the plastic substrate, at the same time, all the printed metals on the plastic substrate and the metals on the electronic components above them are mostly in the form of soluble metal ions transferred to the lye and acid, thereby obtaining a plastic substrate and an electronic component plastic shell completely free of metals. The method has the characteristics of high extraction rate of precious metals from the circuit board, and the circuit board does not need to be crushed and roasted before extracting the precious metals. This method not only avoids the pollution of toxic substances to the environment during the roasting of the circuit board, but also avoids the loss of precious metals due to dust during the crushing of the circuit board.

[0004] The prior art has the following disadvantages: there are many capacitors and resistors on the circuit board, and these electronic components are welded on the circuit board, and the internal of many electronic components contains precious metals such as palladium and gold, while the substrate of the circuit board is mainly composed of copper foil, resin and glass fiber, only the surface is plated with gold, if the circuit board and the electronic components are crushed together, the mass fraction of the substrate in the crushed material is high, which leads to an increase in the amount of chemical raw materials used for extraction and an increase in extraction cost. SUMMARY

[0005] The purpose of the present application is to provide an electronic waste precious metal separation and extraction device and extraction process to solve the above-mentioned deficiencies in the prior art.

[0006] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme: an electronic waste precious metal separation and extraction device, comprising a rack, the rack is provided with:

[0007] a washing pool located in the middle of the rack;

[0008] an L-shaped supporting plate movably installed on the rack and used for supporting the circuit board;

[0009] The first guide groove and the second guide groove cooperatively limit both ends of the fixed part of the supporting plate and move the supporting plate along a predetermined path and at a predetermined angle, so as to move the circuit board into the washing pool and wash off the solder points.

[0010] As a further description of the above technical solution: the first guide groove and the second guide groove each include a second flat part inside the washing pool, first and second inclined parts connected to both ends of the second flat part and a first flat part connected to the top end of the first inclined part.

[0011] As a further description of the above technical solution: the fixed part is provided with a movable rod, and the movable rod is symmetrically provided with clamping plates.

[0012] As a further description of the above technical solution: the supporting part of the supporting plate in the first flat part is in a horizontal state, and the two clamping plates are in an open state.

[0013] As a further description of the above technical solution: the distance between the two first flat parts is the same as the distance between the two first inclined parts.

[0014] As a further description of the above technical solution: the connection between the first flat part and the first inclined part of the first guide groove is provided with a rack coupled with the supporting plate.

[0015] As a further description of the above technical solution: the distance between the two second flat parts is equal to the distance between the two first inclined parts.

[0016] As a further description of the above technical solution: the connection between the first inclined part and the second flat part of the second guide groove is provided with a baffle.

[0017] As a further description of the above technical solution: the distance between the two second inclined parts is less than the distance between the two second flat parts.

[0018] An electronic waste precious metal separation and extraction process based on the electronic waste precious metal separation and extraction device in the above solution further includes the following steps:

[0019] S1, place the circuit board with the back facing up on the supporting plate, and fix the side edge of the circuit board on the fixed plate of the supporting plate;

[0020] S2, move the supporting plate along the first guide groove and the second guide groove to tilt the circuit board into the solution in the washing pool and tend to be in a horizontal state;

[0021] S3, the solution washes off the solder points on the back of the circuit board, and the electronic components fall off the circuit board;

[0022] S4, the supporting plate carries the circuit board away from the washing pool.

[0023] In the above technical solution, the electronic waste precious metal separation and extraction device and extraction process provided by the application has the following beneficial effects: during work, the worker places the circuit board with the back face upward on the supporting plate, and the side edge of the circuit board is fixed on the fixing plate of the supporting plate; the motor drives the chain and the supporting plate to move through the chain wheel; the first guide block moves along the first guide groove, and the second guide block moves along the second guide groove, so that the supporting plate with the circuit board is obliquely downward into the washing tank, and the solution in the washing tank is pushed to contact the back face of the circuit board through the gap on the fixing part of the supporting plate, impact the soldering points on the back face of the circuit board, and gradually dissolve the soldering points; at the same time, the solution below the supporting plate is extruded to guide the solution to impact upward along the slope in the gap of the supporting part, collide with the front face of the circuit board, impact the tin in the plug-in component hole of the circuit board, so that the electronic components are separated from the circuit board, and the supporting plate continues to move to immerse the circuit board completely into the solution; the supporting plate and the circuit board tend to be in a horizontal state, the electronic components are convenient to fall off from the circuit board, and then fall off from the gap of the supporting part into the washing tank, so that the substrate of the circuit board is separated from the electronic components, and the subsequent extraction work is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0025] Figure 1 The general structure schematic diagram provided for the embodiments of the present application;

[0026] Figure 2 The internal structure schematic diagram provided for the embodiments of the present application;

[0027] Figure 3 The Figure 2 enlarged view of A in FIG. 1;

[0028] Figure 4 The structure schematic diagram of the first guide groove and the second guide groove provided for the embodiments of the present application;

[0029] Figure 5 The Figure 4 enlarged view of B in FIG. 1;

[0030] Figure 6 The Figure 4 enlarged view of C in FIG. 1;

[0031] Figure 7 The Figure 4 enlarged view of D in FIG. 1;

[0032] Figure 8 TheFigure 4 Enlarged view at middle F;

[0033] Figure 9 Structure schematic view of the supporting plate provided by the embodiment of the present application;

[0034] Figure 10 Structure schematic view of the supporting plate provided by the embodiment of the present application;

[0035] Figure 11 For Figure 10 Enlarged view at middle F.

[0036] Explanation of reference numerals:

[0037] 1, frame; 11, supporting plate; 111, movable rod; 112, sliding rod; 113, clamping plate; 114, locking rod; 115, first guide block; 116, second guide block; 117, driving chain; 118, fixed part; 119, supporting part; 12, first guide groove; 121, first flat part; 122, first inclined part; 123, second flat part; 124, second inclined part; 125, ring part; 126, connecting part; 127, rack; 128, gear block; 129, jacking rod; 13, second guide groove; 131, unlocking groove; 132, gear; 133, insertion groove; 134, blocking piece; 135, gear ring; 14, washing pool. DETAILED DESCRIPTION

[0038] In order to make the skilled in the art better understand the technical solutions of the present application, the present application will be further described in detail below in combination with the drawings.

[0039] Embodiment one

[0040] Please refer to Figures 1-11 The present application provides a technical solution: an electronic waste precious metal separation and extraction device, comprising a frame 1, the frame 1 is provided with:

[0041] A washing pool 14 is located in the middle of the frame 1;

[0042] An L-shaped supporting plate 11 is movably installed on the frame 1 and used for supporting the circuit board;

[0043] A first guide groove 12 and a second guide groove 13 cooperate to limit both ends of the fixed part 118 of the supporting plate 11 and make the supporting plate 11 move according to a predetermined path and a predetermined angle, so that the circuit board moves into the washing pool 14 and the solder joints are washed away.

[0044] Specifically, the L-shaped supporting plate 11 is composed of a fixed part 118 and a supporting part 119, the supporting part 119 is provided with a plurality of notches, the bottom of the notch is provided with a slope for guiding the liquid to move above the supporting part 119, the fixed part 118 is provided with a vertical long notch in a linear array, the two ends of the fixed part 118 are respectively provided with a first guide block 115 matched with the first guide groove 12 and a second guide block 116 matched with the second guide groove 13, the first guide block 115 is located at the connection between the fixed part 118 and the supporting part 119, the inside of the rack 1 is provided with a chain with the same moving path as the first guide groove 12, a chain wheel for driving the chain to move and a motor for driving the chain 117, and the first guide block 115 is rotatably installed on the chain link.

[0045] Further, in the working process, the worker places the circuit board with the back upward on the supporting plate 11, and fixes the side of the circuit board on the fixed plate of the supporting plate 11, the motor drives the chain and the supporting plate 11 to move through the chain wheel, the first guide block 115 moves along the first guide groove 12, and the second guide block 116 moves along the second guide groove 13, so that the supporting plate 11 with the circuit board is obliquely rushed into the washing pool 14, and the solution in the washing pool 14 is pushed to contact the back of the circuit board through the notches on the fixed part 118 of the supporting plate 11, impact the soldering points on the back of the circuit board, and gradually dissolve the soldering points, at the same time, the solution below the supporting plate 11 is extruded to guide the solution to impact upward along the slope in the notch of the supporting part 119, and collide with the front of the circuit board, impact the tin in the plug-in element hole of the circuit board, so that the electronic components are separated from the circuit board, the supporting plate 11 continues to move to immerse the circuit board into the solution completely, the supporting plate 11 and the circuit board tend to be horizontal, the electronic components are convenient to fall off from the circuit board, and then fall off from the notch of the supporting part 119 into the cleaning pool, so that the substrate of the circuit board is separated from the electronic components, and the subsequent extraction work is facilitated.

[0046] Further, the solution in the washing pool 14 is specifically a tin stripping solution.

[0047] In still another embodiment of the present application, the first guide groove 12 and the second guide groove 13 each include a second flat part 123 located inside the washing pool 14, a first inclined part 122 and a second inclined part 124 communicated with both ends of the second flat part 123 and inclined upward, and a first flat part 121 communicated with the top end of the first inclined part 122.

[0048] Specifically, the first guide groove 12 and the second guide groove 13 each include two ring parts 125 connected with the first flat part 121 and the second inclined part 124 respectively, and a connecting part 126 horizontally located below the washing pool 14 and arranged between the two ring parts 125.

[0049] Further, when working, the supporting plate 11 is in the first flat part 121, at this time, the worker fixes the circuit board on the supporting plate 11, then the supporting plate 11 moves into the first inclined part 122 along with the chain, the supporting plate 11 with the circuit board is obliquely rushed into the washing pool 14, and pushes the solution in the washing pool 14 to impact the tin soldering point on the circuit board, then the supporting plate 11 enters the second flat part 123, the supporting plate 11 tends to be horizontal, the solution continuously dissolves the tin soldering point, and the electronic component is conveniently dropped from the circuit board, then the supporting plate 11 moves along the second inclined part 124, the supporting plate 11 keeps the state of being nearly horizontal, avoiding the circuit board from falling off the supporting plate 11, then the supporting plate 11 returns to the first flat part 121 along the ring part 125, the connecting part 126 and another ring part 125, and when passing through the connecting part 126, the fixing part 118 releases the circuit board, so that the circuit board is separated from the supporting plate 11.

[0050] In still another embodiment of the present application, the fixing part 118 is provided with the movable rod 111, the movable rod 111 is symmetrically provided with the clamping plate 113, the clamping plate 113 is pushed by the circuit board to insert the movable rod 111 and clamp the circuit board, the supporting part 119 of the supporting plate 11 in the first flat part 121 is in the horizontal state, and the two clamping plates 113 are in the open state.

[0051] Specifically, the movable rod 111 is rotatably installed on the fixing part 118, the movable rod 111 is radially provided with the sliding rod 112, the spring is arranged between the sliding rod 112 and the movable rod 111, the two clamping plates 113 are hingedly connected to the sliding rod 112, and the torsion spring is arranged between the clamping plates 113 and the sliding rod 112, the locking rod 114 is slidably arranged on the movable rod 111, the spring is arranged between the locking rod 114 and the movable rod 111, the recess is arranged on the sliding rod 112 and matched with the locking rod 114, and the unlocking groove 131 matched with the locking rod 114 is arranged on the rack 1.

[0052] Further, when the supporting plate 11 is at the connecting portion 126, the locking rod 114 is inserted into the unlocking slot 131 on the rack 1 under the pushing of the spring and separated from the sliding rod 112, the sliding rod 112 moves outward of the movable rod 111 under the pushing of the spring, the clamping plate 113 is no longer pushed and rotates to the direction away from the circuit board under the action of the torsion spring, the clamping plate 113 is opened, the circuit board is separated from the supporting plate 11, the supporting plate 11 continues to move and enters the first flat portion 121, at this time, the staff inserts the side edge of the circuit board between the two clamping plates 113 and pushes the sliding rod 112 to move inward of the movable rod 111, the side wall of the groove on the movable rod 111 pushes the clamping plate 113, so that the clamping plate 113 approaches the circuit board and clamps the circuit board, the locking rod 114 is opposite to the groove on the sliding rod 112, then the supporting plate 11 takes the locking rod 114 away from the unlocking slot 131, the locking rod 114 is inserted into the groove on the sliding rod 112 under the pushing of the rack 1, the locking rod 114 locks the sliding rod 112 and the clamping plate 113 on the movable rod 111, and further fixes the circuit board on the movable rod 111.

[0053] Further, the two ends of the movable rod 111 are provided with gear rings 135, and there is a gap between the middle part of the movable rod 111 and the fixed portion 118, the rack 1 is provided with an insertion slot 133 and a linear array of top rods 129 on the two sides and in close contact, the end of the insertion slot 133 is provided with a slope, the spring is arranged between the top rod 129 and the rack 1, the part of the top rod 129 extending into the washing pool 14 is semispherical, the inside of the insertion slot 133 is provided with tooth blocks 128 in upper and lower staggered distribution and meshing with the gear rings 135, and the insertion slots 133 on the two sides of the mounting frame are staggered.

[0054] Further, when the supporting plate 11 moves to the second flat portion 123, the top rod 129 on the edge is opposite to the end of the movable rod 111 and pushes the movable rod 111 under the action of the spring, the movable rod 111 moves axially and the end is inserted into the insertion slot 133, and the movable rod 111 drives the circuit board to move, so that the other part of the circuit board is opposite to the notch on the supporting portion 119, the supporting plate 11 continues to move, the gear ring 135 at the end of the movable rod 111 alternately meshes with the tooth blocks 128 on the upper and lower sides of the insertion slot 133, when the gear ring 135 meshes with the tooth block 128 below, the tooth block 128 pushes the movable rod 111 to rotate, the circuit board swings upward, when the gear ring 135 meshes with the tooth block 128 above, the tooth block 128 pushes the movable rod 111 to rotate, the circuit board swings downward, in the process of alternating meshing, the circuit board swings up and down and gradually shakes off the electronic elements on it.

[0055] In still another embodiment of the present application, the distance between the two first flat portions 121 is the same as the distance between the two first inclined portions 122, and the connecting portion between the first flat portion 121 and the first inclined portion 122 of the first guide slot 12 is provided with a gear rack 127 coupled with the supporting plate 11.

[0056] Specifically, the first guide block 115 of the supporting plate 11 is provided with a gear 132 engaged with the rack 127, and the first flat part 121 of the second guide groove 13 is provided with a circular arc at the connection with the first inclined part 122.

[0057] Further, in the process of moving the supporting plate 11 from the first flat part 121 to the first inclined part 122 by the chain, the gear 132 is engaged with the rack 127 and pushes the gear 132 and the supporting plate 11 to rotate counterclockwise as a whole, the second guide block 116 moves along the circular arc at the connection of the first flat part 121 and the first inclined part 122 of the second guide groove 13, and the supporting plate 11 changes from the horizontal state in the first flat part 121 to the inclined rotation in the first inclined part 122, and the interval of the two first flat parts 121 is the same as the interval of the two first inclined parts 122, so that the smooth movement of the supporting plate 11 can be ensured.

[0058] In another embodiment of the present application, the interval of the two second flat parts 123 is equal to the interval of the two first inclined parts 122, and the first inclined part 122 of the second guide groove 13 is provided with a baffle 134 at the connection with the second flat part 123.

[0059] Specifically, the baffle 134 is made of silicon rubber with certain elasticity and acid resistance.

[0060] Further, in the process of moving the supporting plate 11 from the first inclined part 122 to the second flat part 123 by the chain, in the process of moving the supporting plate 11, the baffle 134 in the second guide groove 13 will block the second guide block 116 and be deformed by the second guide block 116, and the first guide block 115 continues to move under the driving of the chain and gradually faces the second flat part 123 of the first guide groove 12, until the second guide block 116 faces the second flat part 123 of the second guide groove 13, the first guide block 115 faces the second flat part 123 of the first guide groove 12, the baffle 134 is deformed to the limit and is staggered with the second guide block 116, the first guide block 115 moves along the second flat part 123 of the first guide groove 12, and the second guide block 116 moves along the second flat part 123 of the second guide groove 13, and the interval of the two second flat parts 123 is equal to the interval of the two first inclined parts 122, and the two second flat parts 123 limit the supporting plate 11, so that the circuit board on the supporting plate 11 tends to be in a horizontal state.

[0061] In another embodiment of the present application, the interval of the two second inclined parts 124 is smaller than the interval of the two second flat parts 123.

[0062] Specifically, when the support plate 11 moves to the connection between the second flat part 123 and the second inclined part 124, the first guide block 115 and the second guide block 116 on the support plate 11 are respectively opposite to the bottom ends of the two second inclined parts 124, then the chain carries the support plate 11 into the second inclined part 124, and the first guide block 115 and the second guide block 116 simultaneously enter the second inclined part 124, the interval between the two second inclined parts 124 is smaller than the interval between the two second flat parts 123, the two second inclined parts 124 cooperate to limit the support plate 11, so that the support plate 11 is nearly translated obliquely upward, the circuit board keeps a state of tending to be horizontal, and the solution above the circuit board passes through the holes of the circuit board plug-in component, further pushing the electronic components to separate from the substrate.

[0063] Embodiment two

[0064] An electronic waste precious metal separation and extraction process based on the electronic waste precious metal separation and extraction device in embodiment one, further comprising the following steps:

[0065] S1, the support plate 11 is in the first flat part 121, the staff inserts the side of the circuit board between the two clamping plates 113 and pushes the sliding rod 112 to move to the inside of the movable rod 111, the side wall of the groove on the movable rod 111 pushes the clamping plate 113, so that the clamping plate 113 approaches the circuit board and clamps the circuit board, the lock rod 114 is opposite to the groove on the sliding rod 112, then the support plate 11 carries the lock rod 114 away from the unlocking groove 131, the lock rod 114 is pushed into the groove on the sliding rod 112 by the rack 1, the lock rod 114 locks the sliding rod 112 and the clamping plate 113 on the movable rod 111, and then fixes the circuit board on the movable rod 111;

[0066] S2, the support plate 11 enters the first inclined part 122 with the movement of the chain, the support plate 11 obliquely rushes into the washing tank 14 with the circuit board, and pushes the solution in the washing tank 14 to impact the tin solder joints on the circuit board;

[0067] S3, then the support plate 11 enters the second flat part 123, the support plate 11 tends to be horizontal, the solution continuously dissolves the tin solder joints, and the electronic components are conveniently dropped from the circuit board, the top rod 129 at the edge is opposite to the end of the movable rod 111 and pushes the movable rod 111 under the action of the spring, the movable rod 111 moves axially and the end is inserted into the insertion slot 133, and moves the circuit board, so that the other part of the circuit board is opposite to the notch on the supporting part 119, the support plate 11 continues to move, the gear ring 135 at the end of the movable rod 111 alternately engages with the tooth blocks 128 on the upper and lower sides of the insertion slot 133, when the gear ring 135 engages with the lower tooth block 128, the tooth block 128 pushes the movable rod 111 to rotate, and the circuit board swings upward, when the gear ring 135 engages with the upper tooth block 128, the tooth block 128 pushes the movable rod 111 to rotate, and the circuit board swings downward, in the process of alternate engagement, the circuit board swings up and down to gradually shake off the electronic components thereon;

[0068] S4, the support plate 11 moves to the joint of the second flat part 123 and the second inclined part 124, the first guide block 115 and the second guide block 116 on the support plate 11 respectively face the bottom end of the two second inclined parts 124, then the chain carries the support plate 11 into the second inclined part 124, and the first guide block 115 and the second guide block 116 simultaneously enter the second inclined part 124, the interval of the two second inclined parts 124 is less than the interval of the two second flat parts 123, the two second inclined parts 124 cooperate to limit the support plate 11, so that the support plate 11 nearly translates obliquely upward, the circuit board keeps the state of tending to be horizontal, the solution above the circuit board passes through the hole of the circuit board plug-in component, and further pushes the electronic component to separate from the substrate;

[0069] S5, the support plate 11 continues to move, moves along the ring part 125, the connecting part 126 and another ring part 125, and returns to the first flat part 121, and when the support plate 11 is in the connecting part 126, the lock rod 114 is embedded in the unlocking slot 131 on the rack 1 under the pushing of the spring and is separated from the sliding rod 112, the sliding rod 112 moves outward of the movable rod 111 under the pushing of the spring, the clamping plate 113 no longer is pushed and rotates away from the circuit board under the action of the torsional spring, the clamping plate 113 opens, and the circuit board separates from the support plate 11.

[0070] The above only describes certain exemplary embodiments of the present application by way of illustration, and it is needless to say that the described embodiments can be modified in various ways without departing from the spirit and scope of the present application for those skilled in the art. Therefore, the above drawings and descriptions are illustrative in nature and should not be understood as limiting the scope of protection of the claims of the present application.

Claims

1. An electronic waste precious metal separation and extraction device, characterized in that, The utility model relates to a circuit board cleaning device, which comprises a rack (1) provided with: a washing pool (14) located in the middle of the rack (1); an L-shaped supporting plate (11) movably mounted on the rack (1) and used for supporting the circuit board; a first guide groove (12) and a second guide groove (13) which cooperatively limit both ends of a fixed part (118) of the supporting plate (11) and make the supporting plate (11) move along a predetermined path and at a predetermined angle, so that the circuit board moves into the washing pool (14) and the solder joints are washed away.

2. The electronic waste precious metal separation and extraction device according to claim 1, characterized in that, The first guide groove (12) and the second guide groove (13) each comprise a second flat part (123) located inside the washing pool (14), first and second inclined parts (122, 124) which communicate with both ends of the second flat part (123) and are inclined upward, and a first flat part (121) which communicates with the top end of the first inclined part (122).

3. The electronic waste precious metal separation and extraction device of claim 2, wherein, The fixed part (118) is provided with a movable rod (111), and the movable rod (111) is symmetrically provided with clamping plates (113) which are pushed by the circuit board to be inserted into the movable rod (111) and clamp the circuit board.

4. The electronic waste precious metal separation and extraction device of claim 3, wherein, The supporting part (119) of the supporting plate (11) located at the first flat part (121) is in a horizontal state, and the two clamping plates (113) are in an open state.

5. The electronic waste precious metal separation and extraction device of claim 2, wherein, The distance between the two first flat parts (121) is the same as the distance between the two first inclined parts (122).

6. The electronic waste precious metal separation and extraction device of claim 2, wherein, The connection between the first flat part (121) and the first inclined part (122) of the first guide groove (12) is provided with a rack (127) which is coupled with the supporting plate (11).

7. The electronic waste precious metal separation and extraction device of claim 2, wherein, The distance between the two second flat parts (123) is equal to the distance between the two first inclined parts (122).

8. The electronic waste precious metal separation and extraction device of claim 2, wherein, The connection between the first inclined part (122) and the second flat part (123) of the second guide groove (13) is provided with a baffle (134).

9. The electronic waste precious metal separation and extraction device of claim 2, wherein, The distance between the two second inclined parts (124) is less than the distance between the two second flat parts (123).

10. An electronic waste precious metal separation and extraction process, characterized in that, The electronic waste precious metal separation and extraction device according to any one of claims 1-9 further comprises the following steps: S1, place the circuit board with the back facing upward on the supporting plate (11), and fix the side edge of the circuit board on the fixed plate of the supporting plate (11); S2, move the supporting plate (11) along the first guide groove (12) and the second guide groove (13) to make the circuit board tilt and immerse in the solution in the washing pool (14) and tend to be horizontal; S3, the solution washes away the solder joints on the back of the circuit board, and the electronic components fall off the circuit board; S4, the supporting plate (11) takes the circuit board away from the washing pool (14).

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