Target material composition for magnetron sputtering coating and magnetron sputtering coating device

Abstract

The invention relates to the technical field of magnetron sputtering, in particular to a target material composition for magnetron sputtering coating and a magnetron sputtering coating device. According to the target material composition, a multi-channel connector is suitable for being installed in a pipe cavity of a first to-be-plated pipe and / or a pipe cavity of a second to-be-plated pipe which are / is communicated with each other; the first sputtering target is suitable for being arranged in a tube cavity of a first to-be-plated tube in a penetrating manner; the at least one second sputtering target is suitable for being arranged in a pipe cavity of a second pipe to be plated in a penetrating manner, and the second sputtering target is connected with the first sputtering target through the multi-channel connector; wherein a first included angle is formed between the first to-be-plated pipe and the second to-be-plated pipe, the first to-be-plated pipe and the second to-be-plated pipe are connected to the connecting position, and the distance between the multi-channel connector and the connecting position is in negative correlation with the angle of the first included angle. The target material composition can be perfectly matched with a complex structure of a vacuum chamber to be plated, it is guaranteed that a sputtering target with a proper distance can be installed in any area in each pipe to be plated, and the film layer covering area and the film plating uniformity of the inner wall of a vacuum chamber pipeline are remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of magnetron sputtering technology, in particular to a target material composition for magnetron sputtering coating and a magnetron sputtering coating device. BACKGROUND

[0002] With the development of particle accelerators to higher energy and higher current, higher requirements are put forward for the surface material of the accelerator vacuum chamber. Surface treatment of the accelerator vacuum chamber is an important measure to improve the beam quality. However, due to the structural characteristics of the accelerator vacuum chamber, the target material of the coating device must be inserted into the pipeline for coating. In the prior art, a planar target is commonly used for coating, but due to the variety of accelerator vacuum chambers and the different cross-sectional shapes, the structure of many vacuum chambers is very complex, and the coating area of the planar target is too small to effectively coat the inner wall of the complex structure of the vacuum chamber pipeline. The current target material scheme usually uses one or more wire targets to pass through the interior of the vacuum chamber for coating. For simple structure of the vacuum chamber, this scheme can meet the coating requirements, but for complex structure of the vacuum chamber, the target material scheme cannot effectively coat most areas of the vacuum chamber due to the small coverage area, resulting in a serious lack of coating layer coverage area and poor coating uniformity, which seriously affects the working quality of the coated vacuum chamber. In addition, the target material scheme has poor applicability and cannot effectively adapt to the complex structure of the vacuum chamber, which greatly limits the large-scale application of magnetron sputtering coating technology in the accelerator vacuum system. SUMMARY

[0003] The present application provides a target material composition for magnetron sputtering coating and a magnetron sputtering coating device to solve the defect that the coating area of the planar target in the prior art is too small to effectively coat the inner wall of the complex structure of the vacuum chamber pipeline, and to realize the perfect adaptation of the target material composition to the complex structure of the vacuum chamber, effectively improving the film layer coverage area and coating uniformity of the inner wall of the vacuum chamber pipeline.

[0004] The present application provides a target material composition for magnetron sputtering coating, comprising: a multi-channel connecting joint adapted to be installed in the lumen of a first to-be-coated pipe and / or the lumen of a second to-be-coated pipe, the first to-be-coated pipe and the second to-be-coated pipe being in communication with each other; a first sputtering target adapted to be arranged in the lumen of the first to-be-coated pipe; at least one second sputtering target adapted to be arranged in the lumen of the second to-be-coated pipe, and the second sputtering target being connected with the first sputtering target through the multi-channel connecting joint; wherein a first included angle is formed between the first to-be-coated pipe and the second to-be-coated pipe, the first to-be-coated pipe and the second to-be-coated pipe are connected at a connection position, and the distance between the multi-channel connecting joint and the connection position is negatively related to the angle of the first included angle.

[0005] According to the target material composition for magnetron sputtering film coating provided by the application, the multi-channel connecting joint comprises at least two joint parts; the at least two joint parts comprise: a first joint part, two ends of the first joint part are respectively fixedly connected with the first sputtering target; the two ends of the first joint part are arranged along the length direction of the first to-be-coated pipe; at least one second joint part, one end of the second joint part is fixedly connected with the first joint part, and the other end of the second joint part is fixedly connected with the second sputtering target; wherein, a second included angle is formed between the first joint part and the second joint part, a first included angle is formed between the first to-be-coated pipe and the second to-be-coated pipe towards which the protruding end of the second joint part is directed, and the angle of the second included angle is positively correlated with the angle of the first included angle.

[0006] According to the target material composition for magnetron sputtering film coating provided by the application, the multi-channel connecting joint further comprises: a first connecting hole, which is arranged at the end of the joint part and along the length direction of the joint part; the first connecting hole is suitable for inserting the first sputtering target or the second sputtering target; a second connecting hole, which is arranged on the side wall of the joint part and is communicated with the first connecting hole; a top screw, which is inserted into the second connecting hole through screw threads and can be tightly pressed against the first sputtering target or the second sputtering target in the first connecting hole.

[0007] According to the target material composition for magnetron sputtering film coating provided by the application, the multi-channel connecting joint further comprises: a reinforcing rib, which is fixedly connected with the connecting end of the first joint part and the second joint part.

[0008] According to the target material composition for magnetron sputtering film coating provided by the application, a third included angle is formed between the first sputtering target and the second sputtering target, and the angle of the third included angle ranges from greater than or equal to 60 degrees.

[0009] According to the target material composition for magnetron sputtering film coating provided by the application, the first sputtering target is arranged along the axis of the first to-be-coated pipe; and / or, the second sputtering target is arranged along the axis of the second to-be-coated pipe.

[0010] According to the target material composition for magnetron sputtering film coating provided by the application, the second to-be-coated pipe is a straight pipe or a bent pipe.

[0011] According to the target material composition for magnetron sputtering film coating provided by the application, the first sputtering target and the second sputtering target are both single-element metal or alloy filament targets; the material quality of the multi-channel connecting joint, the first sputtering target and the second sputtering target is the same.

[0012] The application further provides a magnetron sputtering coating device, comprising the target material composition for magnetron sputtering coating, a vacuum chamber to be coated, a solenoid, and a target material composition for magnetron sputtering coating.

[0013] The magnetron sputtering coating device provided by the application further comprises an auxiliary vacuum chamber, a measuring element, an electrode flange, and a vacuum pump set.

[0014] The target material composition for magnetron sputtering coating provided by the application comprises a multi-channel connecting joint, a first sputtering target, and at least one second sputtering target. The multi-channel connecting joint is adapted to be installed in the lumen of the first pipe to be coated and / or the lumen of the second pipe to be coated, and the first pipe to be coated and the second pipe to be coated are in communication with each other. The first sputtering target is adapted to be arranged in the lumen of the first pipe to be coated. The at least one second sputtering target is adapted to be arranged in the lumen of the second pipe to be coated, and the second sputtering target is connected to the first sputtering target through the multi-channel connecting joint. The first pipe to be coated and the second pipe to be coated form a first included angle, the first pipe to be coated and the second pipe to be coated are connected at a connection position, and the distance between the multi-channel connecting joint and the connection position is negatively correlated with the angle of the first included angle. For the complex pipe structure of the multi-pipe to be coated, the target material composition can combine the multiple sputtering targets in various multi-dimensional combinations through the multi-channel connecting joint, thereby flexibly changing the arrangement direction of the multiple sputtering targets inside the lumens of the various pipes to be coated, and further enabling the target material composition to perfectly fit the complex structure of the vacuum chamber to be coated, ensuring that any area in each pipe to be coated of the vacuum chamber to be coated is provided with a sputtering target at a suitable distance, and significantly improving the film coverage area and the film uniformity of the inner wall of the pipe of the vacuum chamber.

[0015] Further, due to the variety of accelerator vacuum chambers, the cross-sectional shapes are different, and many vacuum chamber structures are complex. For example, the main pipeline of the injection, extraction vacuum chamber and bifurcated diode vacuum pipeline usually extends into two beam tubes connected at an angle; for another example, the vacuum chamber for installing the vacuum pump group and the beam diagnosis probe element is provided with many connecting pipes, and the vacuum pipeline at different beam intersections is a multi-way pipe. For the above-mentioned complex structure of the vacuum chamber, compared with the direct bending sputtering target, the target material composition can reasonably change the layout direction of the sputtering target by using the multi-channel connecting joint, which can increase the beam branch of the sputtering target, greatly increase the distribution range of the sputtering target, and avoid the defects such as poor sputtering quality, small sputtering range and insufficient sputtering uniformity caused by the sputtering target at the beam intersection due to large-angle bending touching the inner wall of the pipeline, and the collision of different sputtering targets, thereby further improving the film coverage area and the film uniformity of the inner wall of the vacuum chamber pipeline.

[0016] Therefore, the target material composition for magnetron sputtering film coating has simple structure, easy processing of components, easy implementation, low cost, wide application range, and can meet the film coating requirements of almost all accelerator vacuum chamber inner walls, solve the film coating problem of complex structure vacuum chamber, and improve the overall performance of the accelerator vacuum system, thereby creating an excellent operating environment for the beam.

[0017] The application also provides a magnetron sputtering film coating device (hereinafter referred to as a "film coating device" for short), which comprises the above-mentioned target material composition, the vacuum chamber to be coated and the solenoid. By arranging the above-mentioned target material composition, the magnetron sputtering film coating device has all the advantages of the above-mentioned target material composition, which will not be described here in detail. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Figure 1 is a structural schematic diagram of the working state of the magnetron sputtering film coating device provided by the application.

[0020] Figure 2 is one of the structural schematic diagrams of the target material composition for magnetron sputtering film coating provided by the application.

[0021] Figure 3 is Figure 2 is the internal structural schematic diagram of the target material composition for magnetron sputtering film coating shown in

[0022] Figure 4 is Figure 2The connection structure diagram of the multi-channel connecting joint shown in FIG. 1.

[0023] Figure 5 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figure 2 The front view of the multi-channel connecting joint shown in FIG. 1.

[0024] Figure 6 The structure diagram of the target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 2.

[0025] Figure 7 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figure 6 The front view of the target material composition for magnetron sputtering coating shown in FIG. 1.

[0026] Figure 8 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figure 6 The top view of the target material composition for magnetron sputtering coating shown in FIG. 1.

[0027] Figure 9 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figure 6 The connection structure diagram of the multi-channel connecting joint shown in FIG. 1.

[0028] Figure 10 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figure 6 The structure diagram of the multi-channel connecting joint shown in FIG. 1.

[0029] Reference signs: 1, vacuum chamber to be coated; 2, solenoid; 3, target material composition; 4, auxiliary vacuum chamber; 5, measuring element; 6, gas inlet valve; 7, electrode flange; 8, air extraction unit; 9, first pipe to be coated; 10, second pipe to be coated; 11, connecting flange; 12, first sputtering target; 13, second sputtering target; 14, first pipe cavity; 15, multi-channel connecting joint; 151, first joint part; 152, top screw; 153, reinforcing rib; 154, first connecting hole; 155, second connecting hole; 156, second joint part; 16, second pipe cavity; 17, third pipe to be coated; 18, fourth pipe to be coated; 19, third pipe cavity; 20, fourth pipe cavity; 21, connecting position. DETAILED DESCRIPTION

[0030] In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be clearly and completely described below in combination with the drawings in the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0031] The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1. Figures 1-10 The target material composition for magnetron sputtering coating provided by the present application is shown in FIG. 1.

[0032] As Figure 1 shown, the magnetron sputtering coating device of the embodiment of the present application comprises a target assembly 3, a vacuum chamber 1 to be coated and a solenoid 2. The vacuum chamber 1 to be coated comprises a first pipe 9 to be coated and a second pipe 10 to be coated which are in communication with each other. Preferably, the first pipe 9 to be coated and the second pipe 10 to be coated are composed of various structures based on the layout position and operation requirements of the accelerator vacuum chamber, for example Figure 2 and Figure 3 As shown, the first pipe 9 to be coated as the main pipe in the injection, extraction vacuum chamber and bifurcated diode iron vacuum pipe extends into two beam pipes which are in angular communication, i.e. the first pipe 9 to be coated and the second pipe 10 to be coated which are in communication with each other at the end, and a first included angle A is formed between the first pipe 9 to be coated and the second pipe 10 to be coated. The first pipe 9 to be coated is a straight pipe; one end of the second pipe 10 to be coated is connected to the first pipe 9 to be coated at a connection position 21, and the second pipe 10 to be coated is relatively formed with a certain curvature of the elbow pipe. For another example, the vacuum chamber for installing the vacuum pump group and the beam diagnosis probe element is provided with many connecting pipes, and the vacuum pipes at different beam intersections are multi-pass pipes, i.e. as shown Figure 6 , the first pipe 9 to be coated as the main pipe, and six second pipes 10 to be coated are respectively connected to the side wall of the first pipe 9 to be coated, so that the multi-pass pipes are formed at the multiple beam intersections of the vacuum chamber. The target assembly 3 of the embodiment of the present application is arranged in the vacuum chamber 1 to be coated. The specific assembly structure of the target assembly is described in detail in the subsequent part, and is not described here. The inside of the vacuum chamber 1 to be coated can form a vacuum environment. The solenoid 2 is sleeved and installed outside the vacuum chamber to be coated. The inner wall of the pipe cavity of the first pipe 9 to be coated and the second pipe 10 to be coated serves as the surface of the workpiece to be coated. The solenoid 2 is used to generate a magnetic field in the vacuum chamber 1 to be coated, so that the magnetic field can act on the target assembly 3. The target assembly 3 as the energized medium can provide sputtered target particles, so as to realize the magnetron sputtering coating of the inner wall of each pipe to be coated in the vacuum chamber.

[0033] It should be noted that the target assembly in the present application is suitable for magnetron sputtering coating based on the solenoid 2. The working principle of the magnetron sputtering coating device of the present application is as follows: based on the physical vapor deposition (PVD) technology, high-energy particles bombard the surface of the target assembly, so that the target particles (atoms or molecules) are sputtered out and deposited on the substrate on the inner wall of the pipe of the vacuum chamber 1 to be coated to form a thin film. The solenoid 2 generates a magnetic field, so that the electrons form a spiral orbit motion near the surface of the target, prolong the residence time of the electrons in the target area, improve the ionization efficiency of the working gas, thereby increasing the plasma density and the sputtering rate.

[0034] It should be noted that, in order to improve the vacuum chamber pumping performance, the inner wall surface of the tube cavity of the vacuum chamber needs to be plated with NEG film; in order to reduce the impedance, the inner wall surface of the tube cavity of the vacuum chamber can be plated with Cu; in order to reduce the desorption rate, the inner wall surface of the tube cavity of the vacuum chamber can be plated with NEG, Au or Pd. Among them, NEG is a kind of alloy material with high gas adsorption capacity, which interacts with gas molecules through physical adsorption or chemical adsorption, and fixes them on the surface or inside of the material, thereby reducing the gas partial pressure in the vacuum system.

[0035] In some embodiments, as shown in Figure 1 The plating device further includes an auxiliary vacuum chamber 4, a measuring element 5, an electrode flange 7 and a vacuum pump set 8. The auxiliary vacuum chamber 4 is connected to the vacuum chamber to be plated 1, and the auxiliary vacuum chamber 4 is provided with an air inlet valve 6. The auxiliary vacuum chamber 4 is used to provide a vacuum environment in the vacuum chamber, and to carry out related measurement, target material power supply control and other operation control work. The measuring element 5, the electrode flange 7 and the vacuum pump set 8 are connected to the auxiliary vacuum chamber 4 respectively. The measuring element 5 is used to measure the plating film condition in the vacuum chamber to be plated 1 through the auxiliary vacuum chamber 4. The electrode flange 7 is used to supply power to the target assembly. The vacuum pump set 8 is used to pump the vacuum chamber to be plated 1 through the auxiliary vacuum chamber 4.

[0036] As shown in Figure 3 , Figure 7 and Figure 8 The target assembly of the embodiment of the present application includes a multi-channel connecting joint 15, a first sputtering target 12 and at least one second sputtering target 13. The multi-channel connecting joint 15 is adapted to be installed in the tube cavity of the first vacuum chamber to be plated 9, or installed in the tube cavity of the second vacuum chamber to be plated 10, or installed at the connection of the tube cavities of the first vacuum chamber to be plated 9 and the second vacuum chamber to be plated 10. The first sputtering target 12 is adapted to be arranged in the tube cavity of the first vacuum chamber to be plated 9. Each second sputtering target 13 is adapted to be arranged in the tube cavity of the corresponding second vacuum chamber to be plated 10. And the second sputtering target 13 is connected with the first sputtering target 12 through the multi-channel connecting joint 15. Among them, the first vacuum chamber to be plated 9 and the second vacuum chamber to be plated 10 form a first included angle A, which corresponds to the case of encountering a complex pipe structure of multiple vacuum chambers to be plated connected in series. The target assembly uses the multi-channel connecting joint 15 to increase the layout direction of the sputtering target, without directly bending the sputtering target at a large angle, that is, the first vacuum chamber to be plated 9 and the second vacuum chamber to be plated 10 are connected at an angle through the multi-channel connecting joint 15. This setting effectively increases the spattering range of the target material particles to the inner wall of the pipe during the plating process, ensuring that the branch pipes of the vacuum chamber to be plated can also be reliably plated; on the other hand, it can ensure that the sputtering target is arranged at a relatively intermediate position of the vacuum chamber to be plated, improve the uniformity of the sputtering target in the vacuum chamber to be plated at the same axial position to the circumferential inner wall of the pipe, and prevent the occurrence of missed sputtering or uneven plating thickness.

[0037] In some embodiments, preferably, the first to-be-coated pipe 9 and the second to-be-coated pipe 10 are connected to the connection position 21, and the distance between the multi-channel connection joint 15 and the connection position 21 is negatively correlated with the angle of the first included angle A. The negative correlation means that, based on the first to-be-coated pipe 9 and each second to-be-coated pipe 10 forming a corresponding first included angle A, the greater the angle of the first included angle A, the smaller the distance between the multi-channel connection joint 15 and the connection position 21. On the one hand, this arrangement can significantly improve the structural adaptability of the second sputtering target 13 and the corresponding second to-be-coated pipe 10, and effectively avoid the collision between the second sputtering target 13 and the inner wall of the second to-be-coated pipe 10 to affect the film coating effect; on the other hand, since the beam intersection is formed in the lumen connected by the first to-be-coated pipe 9 and the second to-be-coated pipe 10, the diameter of the lumen at the beam intersection is significantly larger than the diameters of the lumens of the first to-be-coated pipe 9 and the second to-be-coated pipe 10, so that the partial overlap of the second sputtering target 13 and the first sputtering target 12 at the beam intersection can expand the sputtering range, ensure that the target material particles are uniformly and reliably sputtered onto the pipe wall, and improve the film coating reliability.

[0038] As can be seen, for the complex pipe structure of the multi-channel to-be-coated pipe, the target material assembly 3 can perform various multi-dimensional combinations of multiple sputtering targets through the multi-channel connection joint 15, thereby flexibly changing the arrangement direction of the multiple sputtering targets inside the lumens of the to-be-coated pipes, and further enabling the target material assembly 3 to perfectly fit the complex structure of the to-be-coated vacuum chamber 1, ensuring that any area in each to-be-coated pipe of the to-be-coated vacuum chamber 1 is provided with a sputtering target at a suitable distance, and significantly improving the film layer coverage area and film coating uniformity of the inner wall of the vacuum chamber pipe.

[0039] It should be noted that in each embodiment of the present application, preferably, at least one second sputtering target 13 is arranged in the lumen of each second to-be-coated pipe 10 to ensure that the inner wall of each second to-be-coated pipe 10 is within the film coating range. Further preferably, only one second sputtering target 13 is arranged in the lumen of each second to-be-coated pipe 10 to reasonably optimize the target material cost and effectively avoid the situation that the film coating is uneven due to the collision of the target materials caused by disordered layout, thereby improving the film coating reliability and uniformity.

[0040] In some specific embodiments, in order to improve the sputtering uniformity of the inner wall of each to-be-coated pipe, preferably, the first sputtering target 12 is arranged along the axis of the first to-be-coated pipe 9; and / or, the second sputtering target 13 is arranged along the axis of the second to-be-coated pipe 10. Arranging the sputtering target on the axis of the to-be-coated pipe can ensure that the rate at which the target material particles are sputtered onto the inner wall of the to-be-coated pipe is relatively uniform during the spiral motion of the electrons around the sputtering target, and the coverage range of the film layer is more comprehensive and uniform.

[0041] It should be noted that the first sputtering target 12 and the second sputtering target 13 are both single-element metal or alloy filament targets, and the corresponding material sputtering target can be selected based on the film coating requirements of the inner wall of the vacuum chamber.

[0042] It should be noted that, in order to ensure that the inner wall of the to-be-plated pipe in the circumferential position of the multi-channel connecting joint 15 can be uniformly and reliably plated, the material of the multi-channel connecting joint 15, the first sputtering target 12 and the second sputtering target 13 is preferably the same. That is, the multi-channel connecting joint 15 at the connecting position 21 of the first sputtering target 12 and the second sputtering target 13 can also provide sputtered target material particles as part of the sputtering target.

[0043] It should be noted that the diameter of the first sputtering target 12 and the second sputtering target 13 is preferably in the range of 1 mm to 10 mm.

[0044] It should be noted that, according to the shape of the to-be-plated pipe of the vacuum chamber 1 and the position and number of the branch pipes (i.e. the second to-be-plated pipe 10), the second sputtering target 13 is preferably arranged in the inner hole of each second to-be-plated pipe 10, and the distance between the second sputtering target 13 and the inner wall of the second to-be-plated pipe 10 is preferably in the range of 20 mm to 100 mm, so as to ensure effective magnetron sputtering.

[0045] It should be noted that in the target material assembly of the embodiment of the present application, a third included angle is formed between the first sputtering target 12 and the second sputtering target 13, and the third included angle is greater than or equal to 60 degrees. That is, the target material assembly of the present application can be connected by the multi-channel connecting joint 15 to combine the first sputtering target 12 and the second sputtering target 13 at multiple angles, so as to adapt to various angle range vacuum chamber to-be-plated pipe connecting structures, increase the assembly adaptability of the sputtering target to the complex structure vacuum chamber, especially for the pipe connecting structure with an included angle greater than or equal to 60 degrees.

[0046] In some specific embodiments, such as Figure 4 , Figure 5 , Figure 9 and Figure 10As shown, the multi-channel connecting joint 15 comprises at least two joint parts. Preferably, the at least two joint parts comprise a first joint part 151 and at least one second joint part 156. Two ends of the first joint part 151 are respectively fixedly connected with the first sputtering target 12, and the two ends of the first joint part 151 are arranged along the length direction of the first to-be-coated pipe 9. The first joint part 151 is used to connect two first sputtering targets 12, so as to arrange a plurality of first sputtering targets 12 in the interior of the first to-be-coated pipe 9 in series, and realize the target material arrangement of the main pipeline. One end of each second joint part 156 is fixedly connected to the first joint part 151, and the other end of each second joint part 156 is fixedly connected with the second sputtering target 13. The second joint part 156 is used to introduce the second sputtering target 13 into the corresponding second to-be-coated pipe 10 as a branch of the first sputtering target 12, so as to ensure that each branch pipeline of the vacuum chamber can realize coating. Wherein, a second included angle B is formed between the first joint part 151 and the second joint part 156, a first included angle A is formed between the first to-be-coated pipe 9 and the second to-be-coated pipe 10 towards which the extending end of the second joint part 156 faces, and the angle of the second included angle B is positively correlated with the angle of the first included angle A. Further preferably, the angle of the third included angle is positively correlated with the angle of the second included angle B, and thus the angle of the third included angle is positively correlated with the angle of the first included angle A.

[0047] It should be noted that the positive correlation described in the embodiments of the present application refers to: based on the first to-be-coated pipe 9 and the second to-be-coated pipe 10 towards which the extending end of the second joint part 156 faces forming a corresponding first included angle A, the larger the angle of the first included angle A, the larger the included angle between the first joint part 151 and the second joint part 156. For example Figures 3-5 As shown, the first included angle A formed between the first to-be-coated pipe 9 and the second to-be-coated pipe 10 is less than 90 degrees, then the second included angle B formed between the first joint part 151 and the second joint part 156 is less than 90 degrees, and correspondingly, the third included angle formed between the first sputtering target 12 and the second sputtering target 13 is less than 90 degrees. For another example Figures 7-10 As shown, the first included angle A formed between the first to-be-coated pipe 9 and the second to-be-coated pipe 10 is equal to 90 degrees, then the second included angle B formed between the first joint part 151 and the second joint part 156 is equal to 90 degrees, and correspondingly, the third included angle formed between the first sputtering target 12 and the second sputtering target 13 is equal to 90 degrees. Obviously, as the first included angle A increases, the second included angle B increases accordingly; correspondingly, in the case that the first included angle A reaches 90 degrees, the setting position of the multi-channel connecting joint 15 at the beam intersection is located at the center of the inner wall of the pipe cavity where the first to-be-coated pipe 9 and the second to-be-coated pipe 10 are connected. This setting can further improve the structural adaptability of the second sputtering target 13 and the corresponding second to-be-coated pipe 10, and effectively avoid the collision between the second sputtering target 13 and the inner wall of the second to-be-coated pipe 10 affecting the coating effect, so as to ensure that the sputtering target in the branch beam pipeline and the pipeline structure of the branch pipeline are more adaptive, and improve the coating uniformity and coating coverage.

[0048] In some embodiments, as shown in Figure 5 and Figure 10 The multi-channel connecting joint 15 further comprises a first connecting hole 154, a second connecting hole 155 and a threaded rod 152. Preferably, each joint part is provided with a first connecting hole 154, a second connecting hole 155 and a threaded rod 152. The first connecting hole 154 is formed at the end of the joint part and extends along the length direction of the joint part. The first connecting hole 154 is adapted to insert the first sputtering target 12 or the second sputtering target 13. The second connecting hole 155 is formed at the side wall of the joint part and is communicated with the first connecting hole 154. The threaded rod 152 is screwed into the second connecting hole 155 and can be tightened against the first sputtering target 12 or the second sputtering target 13 in the first connecting hole 154. The combination of the threaded rod 152 and the second connecting hole 155 can tightly fix the sputtering target from the side of the first connecting hole 154, which improves the connecting strength between the joint part and the corresponding sputtering target and ensures reliable mechanical and electrical connection between the multiple wire-shaped sputtering targets.

[0049] In some embodiments, as shown in Figure 5 The multi-channel connecting joint 15 further comprises a reinforcing rib 153. The reinforcing rib 153 is fixed to the connecting end of the first joint part 151 and the second joint part 156. The reinforcing rib 153 reinforces the connecting position 21 of each joint part.

[0050] Two specific embodiments are given below to explain the structure and composition of the target assembly according to the embodiments of the present application in detail.

[0051] As shown in Figures 2-5 The vacuum chamber 1 to be plated has two pipes to be plated. The first pipe to be plated 9 is the main pipe. The side of the first pipe to be plated 9 is communicated with a second pipe to be plated 10, which is a branch pipe. The first angle A between the first pipe to be plated 9 and the second pipe to be plated 10 is an acute angle. The first pipe to be plated 9 is a straight pipe, and the second pipe to be plated 10 is a curved pipe with an arc. The position where the second pipe to be plated 10 is connected with the first pipe to be plated 9 and forms an acute angle is taken as the connecting position 21. The two-way metal joint is taken as the multi-channel connecting joint 15, which is arranged at the part of the beam intersection inside the first pipe to be plated 9 and the second pipe to be plated 10, which is relatively far away from the connecting position 21. That is, the center of the inner wall of the pipe cavity where the first pipe to be plated 9 is connected with the second pipe to be plated 10 is taken as the origin, and the multi-channel connecting joint 15 and the connecting position 21 are respectively located on the two sides of the origin. Figure 3 and Figure 4As shown, two first sputtering targets 12 are respectively arranged through the two ends of the first joint part 151 of the multi-channel connecting joint 15, and one second sputtering target 13 is fixed to the extended end of the second joint part 156 of the multi-channel connecting joint 15. This arrangement can ensure that the branch sputtering target (second sputtering target 13) drawn out of the multi-channel connecting joint 15 can be arranged in the second plating pipe 10 at a more suitable angle, reducing the bending deformation of the second sputtering target 13 and improving the plating film quality.

[0052] For example Figures 6-10 As shown, the vacuum chamber 1 to be plated is a seven-channel vacuum chamber. The first plating pipe 9 is taken as the main pipe, and six second plating pipes 10 are respectively connected to the side wall of the first plating pipe 9 in different directions, serving as branch pipes. Among them, the six second plating pipes 10 are divided into three pairs of branch pipes, and each pair of branch pipes is symmetrically connected to the side wall of the main pipe along the radial direction, that is, the first angle between each second plating pipe 10 and the first plating pipe 9 is 90 degrees. Among them, the three pairs of branch pipes are respectively located in different planes. For example Figure 6 As shown, the first plating pipe 9 is taken as the X-axis to establish a rectangular coordinate system, and the three pairs of branch pipes are arranged along the X-axis direction at intervals. The first pair of branch pipes and the third pair of branch pipes are arranged along the Y-axis, and the second pair of branch pipes is arranged along the Z-axis. In order to realize the all-around plating film of all areas of the vacuum chamber (including the main pipe and the branch pipe), seven sputtering targets with corresponding lengths are arranged in the vacuum chamber, and the four-way metal joint is connected at the intersection position of the three pairs of branch pipes and the main pipe. The four-way metal joint is one of the structural components of the multi-channel connecting joint 15. The difference lies in that the number and setting angle of the joint parts are adapted to the number and angle of the pipes of the vacuum chamber to be plated. This arrangement can realize the full coverage of the target assembly to all inner surfaces of the pipes of the vacuum chamber, and realize the uniform plating film of the inner wall of the vacuum chamber.

[0053] It should be noted that the structural components of the multi-channel connecting joint 15 are not limited to the above two structural forms. Based on the structure and number of the pipes to be plated of the vacuum chamber, the corresponding joint parts can be combined at corresponding angles, as long as the second sputtering target 13 can be extended into the corresponding second plating pipe 10 through the second joint part 156.

[0054] It should be noted that the cross-sectional shape of the joint part of the multi-channel connecting joint 15 is preferably one of a circle, an ellipse, a rectangle, or a polygon. Different cross-sectional shapes of joint parts can also be combined, as long as they can be adapted to the installation of sputtering targets with corresponding cross-sectional structures and ensure the reliability of the connection. For example Figure 10 As shown, the first joint part 151 of the multi-channel connecting joint 15 is a square tube, and the second joint part 156 is a circular tube.

[0055] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; and although the present application has been described in detail with reference to the foregoing embodiments, it should be appreciated by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A target material composition for magnetron sputter coating, characterized in that The application relates to a multi-channel connecting joint for magnetron sputtering. The multi-channel connecting joint comprises: a first sputtering target arranged in the first pipe cavity; at least one second sputtering target arranged in the second pipe cavity, and the second sputtering target is connected with the first sputtering target through the multi-channel connecting joint; wherein a first included angle is formed between the first pipe and the second pipe, the first pipe and the second pipe are connected at a connecting position, and the distance between the multi-channel connecting joint and the connecting position is negatively related to the angle of the first included angle.

2. The target composition for magnetron sputter coating according to claim 1, characterized in that The multi-channel connecting joint comprises at least two joint parts. The at least two joint parts comprise: a first joint part, two ends of the first joint part are respectively fixedly connected with the first sputtering target, and the two ends of the first joint part are arranged along the length direction of the first pipe; at least one second joint part, one end of the second joint part is fixedly connected with the first joint part, and the other end of the second joint part is fixedly connected with the second sputtering target; wherein a second included angle is formed between the first joint part and the second joint part, the first pipe and the second pipe, which is directed towards the extending end of the second joint part, form the first included angle, and the angle of the second included angle is positively related to the angle of the first included angle.

3. The target composition for magnetron sputter coating according to claim 2, characterized in that The multi-channel connecting joint further comprises: a first connecting hole arranged at the end of the joint part and arranged along the length direction of the joint part, the first connecting hole is adapted to insert the first sputtering target or the second sputtering target; a second connecting hole arranged at the side wall of the joint part and communicated with the first connecting hole; a jackscrew inserted into the second connecting hole in a threaded mode and capable of jacking against the first sputtering target or the second sputtering target in the first connecting hole.

4. The target composition for magnetron sputter coating according to claim 2, wherein The multi-channel connecting joint further comprises: a reinforcing rib fixedly connected with the connecting end of the first joint part and the second joint part.

5. The target composition for magnetron sputter coating according to any one of claims 1 to 4, characterized in that A third included angle is formed between the first sputtering target and the second sputtering target, and the angle of the third included angle is greater than or equal to 60 degrees.

6. The target composition for magnetron sputter coating according to any one of claims 1 to 4, characterized in that The first sputtering target is arranged along the axis of the first pipe, and / or the second sputtering target is arranged along the axis of the second pipe.

7. The target composition for magnetron sputter coating according to any one of claims 1 to 5, characterized in that The second pipe is a straight pipe or a bent pipe.

8. The target composition for magnetron sputter coating according to any one of claims 1 to 5, characterized in that The first sputtering target and the second sputtering target are both single-metal or alloy wire targets, and the material of the multi-channel connecting joint, the first sputtering target and the second sputtering target is the same.

9. A magnetron sputter coating device, characterized in that The application relates to a target material composition for magnetron sputtering. The target material composition is arranged in the vacuum chamber. A solenoid is arranged on the periphery of the vacuum chamber. The solenoid is used to generate a magnetic field in the vacuum chamber, the inside of the vacuum chamber can form a vacuum environment, the inner wall of the first pipe and the second pipe serves as the surface of a workpiece to be plated, and the target material composition serves as a current-carrying medium to provide sputtered target material particles. ​ 10. The magnetron sputter coating apparatus of claim 9, wherein, The application also comprises an auxiliary vacuum chamber, a measuring element, an electrode flange and a vacuum pump set, wherein the auxiliary vacuum chamber is connected to the vacuum chamber to be plated, the auxiliary vacuum chamber is provided with an air inlet valve; the measuring element, the electrode flange and the vacuum pump set are connected to the auxiliary vacuum chamber respectively.

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