Single-head ball-planting machine

Abstract

This invention relates to the field of solder ball implantation technology, specifically to a single-head solder ball implantation machine, comprising a support and an implantation mechanism. The implantation mechanism includes a housing, an implantation guide tube, and an ultrasonic vibrating coil. The housing has an implantation cavity, into which solder balls are placed. The implantation guide tube is mounted on the housing and communicates with the implantation cavity. The ultrasonic vibrating coil is mounted on the housing, located at the upper end of the implantation guide tube and abutting against it. This single-head solder ball implantation machine of the present invention generates high-frequency vibrations in the ultrasonic vibrating coil and transmits these vibrations to the implantation guide tube, causing a slight shift in the tube. This, in turn, subtly changes the direction of the airflow, dispersing the force of the airflow on the solder balls, reducing the concentration of airflow on the solder balls, weakening the influence of the airflow on the shape of the solder balls, and improving the subsequent connection effect and quality.

Description

Technical Field

[0001] This invention relates to the field of ball-planting machine technology, and specifically to a single-head ball-planting machine. Background Technology

[0002] In semiconductor packaging, a reliable connection between the chip and the substrate is crucial. The ball-mounting process, as a key step in achieving this connection, directly impacts the performance and quality of electronic products. A single-head ball-mounting machine uses laser energy to melt solder balls, then injects gas into the ball-mounting component to precisely push the molten balls to a predetermined position, completing the connection point between the chip and the substrate.

[0003] However, when gas is injected into the solder ball assembly to push the molten solder balls, the gas's fluidity and impact force inevitably create a blowing effect on the liquid solder balls at the moment of pushing. Under the interference of airflow, the surface tension distribution of the liquid solder balls becomes unbalanced, and the originally rounded shape is easily damaged, becoming irregular, affecting the subsequent connection effect and connection quality. Summary of the Invention

[0004] This invention provides a single-head solder ball placement machine to solve the problem that when existing single-head solder ball placement machines inject gas into the placement component to push the molten solder balls, the shape of the solder balls is easily damaged due to airflow interference.

[0005] The present invention provides a single-head solder ball implantation machine with the following technical solution: A single-head solder ball implantation machine is used to implant solder balls onto a clamp, comprising a support and a solder ball implantation mechanism; both the clamp and the solder ball implantation mechanism are mounted on the support, and the solder ball implantation mechanism includes a housing, a solder ball implantation guide tube, and an ultrasonic vibration coil; a solder ball implantation cavity is provided on the housing, and the solder ball is placed in the solder ball implantation cavity; a laser head is provided on the support, and the laser head is located directly above the solder ball implantation cavity for irradiating and melting the solder ball; an air inlet is provided on the housing, and the air inlet communicates with the solder ball implantation cavity; the solder ball implantation guide tube is mounted on the housing and communicates with the solder ball implantation cavity; the ultrasonic vibration coil is mounted on the housing, and the ultrasonic vibration coil is located at the upper end of the solder ball implantation guide tube and abuts against the solder ball implantation guide tube.

[0006] Furthermore, the ultrasonic vibrating coil includes multiple vibration sources, which are evenly distributed on the shell in the vertical direction, and the multiple vibration sources can vibrate sequentially in the vertical direction.

[0007] Furthermore, the housing includes an upper plate and a lower plate, which are arranged vertically on the support. The upper plate is located above the lower plate. The ball-planting guide tube and the ultrasonic vibration coil are both installed on the lower plate. A rotating cavity is defined between the upper plate and the lower plate. A feeding plate is arranged in the rotating cavity. A ball-planting tube is arranged on the upper plate. A first channel is opened on the ball-planting tube in the vertical direction. A second channel is opened on the lower plate in the vertical direction. The first channel and the second channel are coaxially arranged. The first channel, the rotating cavity and the second channel are arranged vertically and communicate with each other. A feeding hole is opened on the feeding plate. Solder balls are placed in the feeding hole. The first channel, the feeding hole and the second channel can communicate in the vertical direction and define the ball-planting cavity.

[0008] Furthermore, the feed plate is rotatable in the vertical direction, and the rotation of the feed plate in the vertical direction enables the first channel, the feed hole and the second channel to be connected in the vertical direction.

[0009] Furthermore, a feed cylinder is provided on the upper plate, which is connected to the feed hole, allowing solder balls to flow from the feed cylinder into the feed hole.

[0010] Furthermore, multiple feeding holes are provided, and these feeding holes are evenly distributed in the vertical direction on the feeding plate.

[0011] Furthermore, a driving component is provided on the support, and a rotating shaft is provided on the output shaft of the driving component. The material conveying plate is mounted on the rotating shaft, so that the material conveying plate can rotate in the vertical direction under the drive of the driving component.

[0012] Furthermore, the bulb implantation catheter has a bulb implantation port, which is coaxial with and connected to the bulb implantation cavity.

[0013] Furthermore, the air inlet is connected to an external air pump, which provides airflow to the bulb-planting chamber.

[0014] Furthermore, there are two ball-planting mechanisms, which are arranged side by side in the horizontal direction on the support.

[0015] The beneficial effects of this invention are as follows: A single-head solder ball placement machine of this invention, by setting up a solder ball placement mechanism, allows air to be introduced into the air inlet during solder ball placement into the clamp. The gas flows into the solder ball placement cavity from the air inlet. After the solder ball is placed in the cavity, the laser head is activated. The airflow and laser simultaneously act on the solder ball. The laser irradiates and melts the solder ball. The melted solder ball is moved by the airflow. At the instant the solder ball is ejected from the solder ball placement guide tube, the ultrasonic vibration coil vibrates once. By generating high-frequency vibration in the ultrasonic vibration coil and transmitting the vibration to the solder ball placement guide tube, a slight offset occurs in the guide tube, resulting in a slight change in the direction of the airflow. This disperses the force exerted by the airflow on the solder ball, preventing the airflow from blowing directly upwards on the solder ball and reducing the phenomenon of concentrated airflow directed at the solder ball. This results in a more balanced distribution of surface tension on the solder ball, weakening the influence of the airflow on the shape of the solder ball, thus helping the solder ball maintain a more regular shape and improving the subsequent connection effect and connection quality. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the single-head ball-planting machine of the present invention;

[0018] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0019] Figure 3 This is a front view of the overall structure of an embodiment of the single-head ball-planting machine of the present invention;

[0020] Figure 4 for Figure 3 Enlarged view of point B in the middle;

[0021] Figure 5 This is a schematic diagram of the ball-planting mechanism of an embodiment of a single-head ball-planting machine according to the present invention;

[0022] Figure 6 This is an exploded view of the ball-planting mechanism of an embodiment of a single-head ball-planting machine according to the present invention;

[0023] Figure 7 This is a front view of the ball-planting mechanism of an embodiment of a single-head ball-planting machine according to the present invention;

[0024] Figure 8 for Figure 7 Sectional view at the center CC;

[0025] Figure 9 for Figure 8 Enlarged view of point D in the middle;

[0026] Figure 10 This is a schematic diagram showing the distribution of multiple vibration sources on the ball-planting guide tube in an embodiment of the single-head ball-planting machine of the present invention.

[0027] In the diagram: 100, clamp; 200, support; 210, mounting plate; 220, driving component; 230, rotating shaft; 240, first slide rail mechanism; 250, second slide rail mechanism; 300, ball-planting mechanism; 310, housing; 311, upper plate; 312, lower plate; 313, rotating cavity; 314, conveying plate; 315, first channel; 316, second channel; 317, conveying hole; 318, conveying cylinder; 320, ball-planting guide tube; 321, ball-planting port; 330, ultrasonic vibration coil; 331, vibration source; 340, ball-planting cavity; 350, air inlet; 360, ball-planting tube. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] An embodiment of the single-head ball-planting machine of the present invention, such as... Figures 1 to 10 As shown.

[0030] A single-head solder ball implantation machine is used to implant solder balls onto a clamp 100, comprising a support 200 and an implantation mechanism 300. Both the clamp 100 and the implantation mechanism 300 are mounted on the support 200. The implantation mechanism 300 includes a housing 310, an implantation conduit 320, and an ultrasonic vibrating coil 330. An implantation cavity 340 is formed in the housing 310, and the solder ball is placed inside the cavity. A laser head (not shown in the accompanying drawings) is mounted on the support 200. The laser head is located directly above the implantation cavity 340 and is used to irradiate and melt the solder ball. An air inlet 350 is formed in the housing 310 and communicates with the implantation cavity 340. The implantation conduit 320 is mounted on the housing 310 and communicates with the implantation cavity 340. The ultrasonic vibrating coil 330 is mounted on the housing 310, located at the upper end of the implantation conduit 320, and abuts against the conduit 320.

[0031] Specifically, the bulb implantation conduit 320 has a bulb implantation port 321, which is coaxial with and connected to the bulb implantation cavity 340. The air inlet 350 is connected to an external air pump, which provides airflow to the bulb implantation cavity 340.

[0032] Furthermore, two ball-planting mechanisms 300 are provided. The two ball-planting mechanisms 300 are arranged side by side in the horizontal direction on the support 200.

[0033] In this embodiment, by setting up a ball-planting mechanism 300, when the ball is planted into the clamp 100, air is introduced into the air inlet 350. The gas flows from the air inlet 350 into the ball-planting cavity 340. After the solder ball is placed in the ball-planting cavity 340, the laser head is activated. The airflow blows and the laser acts on the solder ball at the same time. The laser irradiates and melts the solder ball. The melted solder ball is moved by the airflow. At the moment when the solder ball is ejected from the ball-planting guide tube 320, the ultrasonic vibration coil 330 vibrates once. That is, the vibration is completed while the solder ball is still in the ball-planting guide tube 320.

[0034] By generating high-frequency vibrations in the ultrasonic vibrating coil 330 and transmitting these vibrations to the solder ball guide tube 320, a slight offset is achieved in the guide tube 320. This causes a subtle change in the direction of the airflow, which disperses the force exerted by the airflow on the solder ball. This prevents the airflow from blowing directly upwards onto the solder ball, reducing the concentration of airflow on the solder ball. Consequently, the surface tension distribution of the solder ball becomes more even, weakening the impact of the airflow on the shape of the solder ball. This helps the solder ball maintain a more regular shape, improving the subsequent connection effect and connection quality.

[0035] In a further embodiment, the ultrasonic vibrating coil 330 includes a plurality of vibration sources 331, which are evenly distributed on the housing 310 in a vertical direction, and the plurality of vibration sources 331 are capable of vibrating sequentially in a vertical direction. The ultrasonic vibrating coil 330 is driven by electronic control.

[0036] By setting multiple vibration sources 331, at the moment the solder ball is ejected from the ball-planting guide tube 320, the multiple vibration sources 331 vibrate in sequence around the vertical direction, thereby causing the ball-planting guide tube 320 to exhibit regular circumferential vibration under the action of the vibration sources 331. This provides periodic and uniform vibration force for the solder ball blowing process, causing the solder ball to have a tendency to rotate under the propulsion of the airflow, thus shaping the solder ball and improving its roundness.

[0037] In this embodiment, the housing 310 includes an upper plate 311 and a lower plate 312, which are arranged vertically on the support 200 and are fixed together by bolts. The upper plate 311 is located above the lower plate 312, and the bulb implantation conduit 320 and the ultrasonic vibration coil 330 are both mounted on the lower plate 312. A rotating cavity 313 is defined between the upper plate 311 and the lower plate 312. A feeding plate 314 is provided in the rotating cavity 313. A ball-planting tube 360 ​​is provided on the upper plate 311. A first channel 315 is provided on the ball-planting tube 360 ​​in the vertical direction. A second channel 316 is provided on the lower plate 312 in the vertical direction. The first channel 315 and the second channel 316 are coaxially arranged. The first channel 315, the rotating cavity 313 and the second channel 316 are arranged sequentially in the vertical direction and are interconnected with each other. A feeding hole 317 is provided on the feeding plate 314. Solder balls are placed in the feeding hole 317. The first channel 315, the feeding hole 317 and the second channel 316 can be connected in the vertical direction and define the ball-planting cavity 340.

[0038] Specifically, the feed plate 314 is rotatable in the vertical direction, and the rotation of the feed plate 314 in the vertical direction enables the first channel 315, the feed hole 317 and the second channel 316 to be connected in the vertical direction.

[0039] A mounting plate 210 is provided on the support 200, and a driving component 220 is provided on the mounting plate 210. A rotating shaft 230 is provided on the output shaft of the driving component 220. The conveying plate 314 is mounted on the rotating shaft 230, so that the conveying plate 314 can rotate in the vertical direction under the drive of the driving component 220. The driving component 220 is a motor.

[0040] The upper plate 311 is provided with a feeding cylinder 318, which is connected to the feeding hole 317, and the solder balls can flow from the feeding cylinder 318 to the feeding hole 317.

[0041] Furthermore, multiple material feeding holes 317 are provided, and the multiple material feeding holes 317 are evenly distributed on the material feeding plate 314 in the vertical direction.

[0042] During solder ball placement, solder balls are added to the feed cylinder 318. The solder balls flow from the feed cylinder 318 to the feed hole 317, and then the feed plate 314 is driven to rotate. When the feed plate 314 rotates vertically, connecting the first channel 315, the feed hole 317, and the second channel 316 in the vertical direction (i.e., when the feed hole 317 is coaxial with the first channel 315), the solder balls in the feed hole 317 will fall into the solder ball placement cavity 340. Multiple feed holes 317 are provided so that the solder balls delivered from the feed cylinder 318 to the feed plate 314 can be temporarily stored in the feed holes 317, awaiting solder ball placement.

[0043] In this embodiment, a first slide rail mechanism 240 is provided on the support 200, and a second slide rail mechanism 250 is provided on the first slide rail mechanism 240. The second slide rail mechanism 250 can move horizontally along the first slide rail mechanism 240. A mounting plate 210 is mounted on the second slide rail mechanism 250, and the mounting plate 210 can move vertically relative to the second slide rail mechanism 250 and can move horizontally with the second slide rail mechanism 250. Both the first slide rail mechanism 240 and the second slide rail mechanism 250 are prior art and are both electrically driven. Further details are omitted here.

[0044] In use, the clamp 100 to be planted is first installed on the support 200. Then, the position of the planting mechanism 300 in the vertical and horizontal directions is adjusted by the first slide rail mechanism 240 and the second slide rail mechanism 250 so that the planting opening 321 can be aligned with the part of the clamp 100 to be planted, thus realizing the planting.

[0045] Based on the above embodiments, the specific working process is as follows:

[0046] In use, first install the clamp 100 that needs to be planted on the support 200, and then adjust the position of the planting mechanism 300 in the vertical and horizontal directions through the first slide rail mechanism 240 and the second slide rail mechanism 250 so that the planting opening 321 can be aligned with the part of the clamp 100 to be planted.

[0047] Then, air is introduced into the air inlet 350, and the gas flows from the air inlet 350 into the ball-planting cavity 340, adding solder balls into the feed cylinder 318. The solder balls flow from the feed cylinder 318 into the feed hole 317. The solder balls sent from the feed cylinder 318 to the feed plate 314 are temporarily stored in the feed hole 317, waiting for ball planting. Then, the feed plate 314 is driven to rotate. When the feed plate 314 rotates in the vertical direction, making the first channel 315, the feed hole 317 and the second channel 316 connected in the vertical direction, that is, when the feed hole 317 is coaxial with the first channel 315, the solder balls in the feed hole 317 will fall into the ball-planting cavity 340.

[0048] After the solder ball is placed in the implantation cavity 340, the laser head is activated. The airflow and the laser act on the solder ball simultaneously. The laser irradiates and melts the solder ball. The melted solder ball is moved by the airflow. At the moment the solder ball is ejected from the implantation catheter 320, the ultrasonic vibration coil 330 vibrates once. That is, the vibration is completed while the solder ball is still inside the implantation catheter 320.

[0049] By generating high-frequency vibrations in the ultrasonic vibrating coil 330 and transmitting these vibrations to the solder ball guide tube 320, a slight offset is achieved in the guide tube 320. This causes a subtle change in the direction of the airflow, which disperses the force exerted by the airflow on the solder ball. This prevents the airflow from blowing directly upwards onto the solder ball, reducing the concentration of airflow on the solder ball. Consequently, the surface tension distribution of the solder ball becomes more even, weakening the impact of the airflow on the shape of the solder ball. This helps the solder ball maintain a more regular shape, improving the subsequent connection effect and connection quality.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A single-head ball placer characterized by: The utility model provides a ball mounter for mounting tin balls on a clamp, comprising a support and a ball mounting mechanism; the clamp and the ball mounting mechanism are both mounted on the support, and the ball mounting mechanism comprises a housing, a ball mounting conduit and an ultrasonic vibration ring; the housing is provided with a ball mounting cavity, in which the tin balls are placed; a laser head is arranged on the support and located directly above the ball mounting cavity for irradiating and melting the tin balls; the housing is provided with an air inlet communicating with the ball mounting cavity; the ball mounting conduit is mounted on the housing and communicates with the ball mounting cavity; and the ultrasonic vibration ring is mounted on the housing and located at the upper end of the ball mounting conduit and abuts against the ball mounting conduit; The ultrasonic vibration ring comprises a plurality of vibration sources, which are uniformly distributed around the vertical direction on the housing and can vibrate around the vertical direction in sequence; the housing comprises an upper plate and a lower plate, which are sequentially arranged on the support along the vertical direction, with the upper plate located above the lower plate; the ball mounting conduit and the ultrasonic vibration ring are both mounted on the lower plate; a rotating cavity is defined between the upper plate and the lower plate; a material conveying plate is arranged in the rotating cavity; a ball mounting pipe is arranged on the upper plate and provided with a first channel arranged along the vertical direction; a second channel arranged along the vertical direction is arranged on the lower plate; the first channel and the second channel are coaxially arranged; the first channel, the rotating cavity and the second channel are sequentially arranged along the vertical direction and communicate with each other; a material conveying hole is arranged on the material conveying plate, in which the tin balls are placed; the first channel, the material conveying hole and the second channel can communicate along the vertical direction and define the ball mounting cavity; after the tin balls are placed in the ball mounting cavity, the laser head is started; the airflow blows on the tin balls together with the laser; the laser irradiates and melts the tin balls; the melted tin balls move under the blowing of the airflow; at the moment when the tin balls are shot out of the ball mounting conduit, the ultrasonic vibration ring vibrates for one cycle; the high-frequency vibration of the ultrasonic vibration ring is generated and transmitted to the ball mounting conduit, so that the ball mounting conduit slightly deviates, and the direction of the airflow blowing slightly changes, which can disperse the force of the airflow on the tin balls, avoid the airflow blowing directly above the tin balls, reduce the phenomenon of the airflow blowing on the tin balls, and make the distribution of the surface tension of the tin balls relatively balanced.

2. The single-head ball-planting machine according to claim 1, characterized in that: The material conveying plate is rotatably arranged around the vertical direction, and the rotation of the material conveying plate around the vertical direction can make the first channel, the material conveying hole and the second channel communicate along the vertical direction.

3. The single-head ball-planting machine according to claim 1, characterized in that: A material conveying cylinder is arranged on the upper plate and communicates with the material conveying hole, and the tin balls can flow from the material conveying cylinder into the material conveying hole.

4. The single-head ball-planting machine according to claim 1, characterized in that: A plurality of material conveying holes are arranged on the material conveying plate and uniformly distributed around the vertical direction.

5. The single-head ball-planting machine according to claim 1, characterized in that: A driving member is arranged on the support, an output shaft of the driving member is provided with a rotating shaft, and the material conveying plate is mounted on the rotating shaft, so that the material conveying plate can rotate around the vertical direction under the driving of the driving member.

6. The single-head ball plow of claim 1, wherein: A ball mounting port is arranged on the ball mounting conduit and coaxially communicates with the ball mounting cavity.

7. The single-head ball-planting machine according to claim 1, characterized in that: The air inlet is connected with an air pump of an external device, and the air pump is used to provide the airflow to the ball mounting cavity.

8. The single-head ball plater of claim 1, wherein: Two ball mounting mechanisms are arranged on the support and parallel along the horizontal direction.

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