Heat dissipation device, vapor chamber and electronic equipment

Abstract

The embodiment of the invention relates to the field of heat dissipation, and provides a heat dissipation device, a vapor chamber and electronic equipment, the heat dissipation device is integrated with the vapor chamber and a liquid cooling module, the vapor chamber comprises an evaporation area and a condensation area, the liquid cooling module comprises a cooler, a radiator and a liquid cooling pipe, and the vapor chamber and the liquid cooling module can act synergistically. The heat dissipation performance and the temperature equalizing performance of the heat dissipation device can be improved, and the conflict between the ultrathin design and the high-performance requirement of the vapor chamber is solved. Moreover, at least part of the liquid cooling module is arranged on the periphery of the first end area of the vapor chamber in a surrounding mode along the first plane, the first end area of the vapor chamber is at least part of the area, except for at least part of the end area of the condensation area, of all the end areas of the vapor chamber, and therefore at least part of the end area of the condensation area can be exposed in the air. Enough space can be provided, at least part of the end area of the condensation area is provided with the liquid injection pipe so as to inject the cooling medium into the vapor chamber, and finally manufacturing of the vapor chamber and the heat dissipation device is completed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, and more particularly, to a heat dissipation device, a vapor chamber and an electronic device. BACKGROUND

[0002] As a kind of high-efficiency phase change heat transfer element, the vapor chamber is a mainstream heat dissipation structure of electronic devices such as mobile phones and tablets. With the high intelligence of electronic devices such as mobile phones and tablets, the functions of electronic devices are becoming more and more rich and the performance is becoming more and more strong, and the whole machine power consumption is also becoming more and more large, which leads to the heat generation of electronic devices is also becoming more and more large, and the performance requirement of the vapor chamber is also becoming more and more high. At the same time, with the development of the light and thin of electronic devices, the need for high-performance ultra-thin vapor chamber is also more and more strong, but the thickness reduction and the increase of heat transfer area and heat transfer distance of the vapor chamber lead to the difficulty of improving the heat dissipation performance of the vapor chamber, which makes the ultra-thin design and high performance requirement of the vapor chamber exist conflict. SUMMARY

[0003] The embodiments of the present application provide a heat dissipation device, a vapor chamber and an electronic device, which improve the heat dissipation performance of the heat dissipation device, and can meet the ultra-thin design of the electronic device and the vapor chamber and the high requirement of the electronic device on the heat dissipation performance.

[0004] In a first aspect, a heat dissipation device is provided, comprising: a vapor chamber and a liquid cooling module, wherein the vapor chamber comprises an evaporation area and a condensation area distributed along a first direction (such as y direction), and the first direction is parallel to the length direction of the vapor chamber; the liquid cooling module comprises a cooler, a radiator and a liquid cooling pipe, the cooler and the radiator are communicated through the liquid cooling pipe, the cooler is used for absorbing heat to convert low-temperature liquid in the cooler into high-temperature liquid, the radiator is used for dissipating heat to convert the inflowing high-temperature liquid into low-temperature liquid, and the liquid cooling pipe is used for transmitting the high-temperature liquid from the cooler to the radiator and transmitting the low-temperature liquid from the radiator to the cooler; wherein the cooler is arranged adjacent to the evaporation area, the radiator is arranged adjacent to the condensation area, at least part of the liquid cooling module is arranged around the periphery of a first end area of the vapor chamber along a first plane (such as Dy plane), the first end area of the vapor chamber is at least part of the area of all end areas of the vapor chamber except at least part of the end area of the condensation area, and the first plane is parallel to the plane formed by the first direction (such as y direction) and a second direction (such as x direction), and the second direction is parallel to the width direction of the vapor chamber.

[0005] At least part of the liquid cooling module means part or all components of the liquid cooling module, for example, part of the components of the liquid cooling module can be one of the cooler, the radiator and the liquid cooling pipe, or any combination of two or three, and all components of the liquid cooling module include the cooler, the radiator and the liquid cooling pipe.

[0006] The first end region or all end regions of the vapor chamber represent the regions where the end portions distributed on the main plane of the vapor chamber are located, and the main plane represents the distribution plane of the vapor chamber. The at least partial end region of the condensation region represents a partial end region or all end regions of the condensation region. The first end region of the vapor chamber is at least a partial region of all end regions of the vapor chamber except for the at least partial end region of the condensation region, and the at least partial region herein represents all or partial regions.

[0007] In the above embodiment, the vapor chamber and the liquid cooling module are integrated in the heat dissipation device. The evaporator of the vapor chamber and the cooler of the liquid cooling module are located in the hot area of the electronic device, and the condenser of the vapor chamber and the radiator are located in the cold area of the electronic device. The heat generating device in the electronic device is arranged (such as attached) on the evaporator of the vapor chamber or the cooler of the liquid cooling module.

[0008] When the power consumption of the heat generating device is large (referred to as high power), the liquid cooling module and the vapor chamber can work cooperatively to dissipate heat, and good heat dissipation performance can be achieved. Specifically, the cooler absorbs the heat generated by the heat generating device, the low-temperature liquid in the cooler becomes high-temperature liquid, the high-temperature liquid flows into the radiator through the liquid cooling pipe, the radiator dissipates heat to transfer heat to the cold area of the electronic device, the high-temperature liquid becomes low-temperature liquid, and the low-temperature liquid returns to the cooler through the liquid cooling pipe, thereby completing a heat conduction cycle. At the same time, the evaporator of the vapor chamber is also affected by the heat of the heat generating device, so that the liquid cooling medium in the evaporator becomes steam (gas phase cooling medium), the steam is transported to the condenser through the steam cavity structure, the steam is condensed into liquid after releasing heat in the condenser, and the liquid returns to the evaporator by the capillary force generated by the capillary structure, thereby completing a heat conduction cycle. In this way, the heat conduction in the electronic device can be strengthened, and the temperature uniformity of the entire electronic device can be optimized.

[0009] When the power consumption of the heat generating device is low (referred to as low power), the vapor chamber or the liquid cooling module can be used for heat dissipation. Exemplarily, since the power consumption of the vapor chamber is small, the vapor chamber is used for heat dissipation when the power consumption is low from the perspective of energy saving.

[0010] The heat dissipation device provided by the embodiment of the present application can improve the heat dissipation performance and temperature uniformity performance of the heat dissipation device, and can well meet the heat dissipation and temperature uniformity requirements of highly intelligent electronic devices such as mobile phones and tablets. Especially under the demand for thinness of electronic devices and heat plates, in order to achieve better heat dissipation performance and temperature uniformity performance, long-distance heat transfer is often required, which requires larger size steam channels and capillary channels. The heat plate and the liquid cooling module in the heat dissipation device of the present application jointly realize high heat transfer, solve the conflict between the thin design of the heat plate and the long-distance heat transfer requirement, that is, under the demand for thinness of electronic devices and heat plates and the high requirement of electronic devices on heat dissipation performance, the heat dissipation device integrated with the heat plate and the liquid cooling module has good heat dissipation performance and temperature uniformity performance.

[0011] In addition, the heat plate and the liquid cooling module are reasonably arranged, that is, at least part of the liquid cooling module is arranged around the periphery of the first end region of the heat plate along the first plane (such as the Dy plane), and the first end region of the heat plate is at least part of the region of the heat plate other than at least part of the end region of the condensation region. In this way, the periphery of at least part of the end region of the condensation region (such as the first end of the condensation region) of the heat plate is free of other components of the heat dissipation device, and at least part of the end region of the condensation region is exposed to air. The periphery of at least part of the end region of the condensation region exposed to air can provide sufficient space to open a liquid injection pipe on at least part of the end region of the condensation region to inject cooling medium into the heat plate, and finally complete the manufacture of the heat plate and the heat dissipation device.

[0012] In some embodiments, the cooler is a micro-channel cooler; and / or, the heat sink is a micro-channel heat sink.

[0013] In this embodiment, the micro-channel cooler and the micro-channel heat sink are both micro-channel structures. Compared with traditional cold plate structures, the flow channel of the micro-channel structure has a small size (the equivalent diameter of the flow channel is between 10-1000 μm), a small flow resistance, a significant micro-scale effect, a high heat exchange efficiency, and outstanding heat exchange performance.

[0014] In some embodiments, the liquid cooling pipe includes an outlet pipe and an inlet pipe, both of which are located on the same side of the heat plate. The outlet pipe is used to transfer high-temperature liquid from the cooler to the heat sink, and the inlet pipe is used to transfer low-temperature liquid from the heat sink to the cooler. The cooler and the heat sink can be flexibly arranged.

[0015] The heat dissipation device provided in the embodiments of the present application has the liquid outlet pipe and the liquid inlet pipe arranged on the same side of the vapor chamber, which can reduce the space occupied by the pipes on one side of the vapor chamber, rationally arrange the cooler and the radiator, reserve more space for the condensation area of the vapor chamber, and avoid arranging other components on the periphery of at least part of the end area of the condensation area, so that the coolant can be injected into the vapor chamber through the liquid injection port arranged at the end of the condensation area. In addition, the above structure is compact in layout and small in space occupation, which is beneficial to the arrangement of the heat dissipation device in the electronic device and is very suitable for electronic devices with limited internal space.

[0016] In the above embodiment in which the liquid outlet pipe and the liquid inlet pipe are located on the same side of the vapor chamber, in some embodiments, the liquid outlet pipe and the liquid inlet pipe are located on the side of any one end of the vapor chamber distributed along the second direction (such as the x direction). The any one end of the vapor chamber along the second direction can be the first end or the second end of the vapor chamber.

[0017] The heat dissipation device provided in the embodiments of the present application has the liquid outlet pipe and the liquid inlet pipe located on the side of any one end of the vapor chamber distributed along the second direction (such as the x direction), which means that the liquid outlet pipe and the liquid inlet pipe extend along the first direction (such as the y direction), and the longer pipes facilitate the flow of liquid. In addition, the evaporation area and the condensation area are distributed along the first direction, and the flow direction of the liquid in the liquid outlet pipe and the liquid inlet pipe is the same as the flow direction of the liquid and the gas in the vapor chamber. The same flow direction of the medium can reduce unnecessary heat exchange loss and improve the heat dissipation performance.

[0018] In the embodiments of the present application, the vapor chamber and the liquid cooling module have two arrangement modes in whole: a first arrangement mode and a second arrangement mode.

[0019] In the first arrangement mode, all components of the liquid cooling module are arranged around the periphery of the first end area of the vapor chamber along the first plane (such as the Dy plane).

[0020] The heat dissipation device provided in the embodiments of the present application has all components of the liquid cooling module arranged around the periphery of the first end area of the vapor chamber along the first plane, which means that the liquid cooling module and the vapor chamber are arranged side by side. The structure is compact in layout and does not additionally occupy the space in the third direction (such as the z direction) perpendicular to the first plane, which is beneficial to the assembly of the heat dissipation device and the electronic device.

[0021] In the first arrangement mode, in some embodiments, the first end area is at least part of the end area of the vapor chamber except any one end of the condensation area.

[0022] The any one end of the condensation area can be any one of the first end, the second end and the third end of the condensation area.

[0023] In some embodiments, either end of the condensation zone is a partial region of one end of the vapor chamber distributed along the second direction (e.g., the x direction), the liquid cooling pipe is disposed on one side of the other end of the vapor chamber distributed along the second direction, and the cooler and the heat sink are respectively disposed on two sides of the two ends of the vapor chamber distributed along the first direction (e.g., the y direction); or, the cooler and the liquid cooling pipe are disposed on one side of the other end of the vapor chamber distributed along the second direction, and the heat sink is disposed on one side of one end of the vapor chamber distributed along the first direction.

[0024] In one example, either end of the condensation zone is a partial region of the first end of the vapor chamber distributed along the second direction, the liquid cooling pipe is disposed on one side of the second end of the vapor chamber distributed along the second direction, the cooler is disposed on one side of the fourth end of the vapor chamber distributed along the first direction, the cooler is adjacent to the evaporation zone, the fourth end of the vapor chamber is distributed with the evaporation zone, and the heat sink is disposed on one side of the third end of the vapor chamber distributed along the first direction, the heat sink is adjacent to the condensation zone, and the third end of the vapor chamber is distributed with the condensation zone.

[0025] In this example, the liquid cooling module is disposed on three sides of the periphery of the vapor chamber, the first end region of the vapor chamber is a region other than the first end of the vapor chamber among all the end regions of the vapor chamber (i.e., the second end, the third end, and the fourth end), or in other words, the first end region of the vapor chamber is a partial region other than the first end of the condensation zone among all the end regions of the vapor chamber 1.

[0026] In another example, either end of the condensation zone is a partial region of the first end of the vapor chamber distributed along the second direction, the cooler and the liquid cooling pipe are disposed on one side of the second end of the vapor chamber distributed along the second direction, the cooler is adjacent to the evaporation zone, the second end of the vapor chamber is distributed with the evaporation zone, the heat sink is disposed on one side of the third end of the vapor chamber distributed along the first direction, the heat sink is adjacent to the condensation zone, and the third end of the vapor chamber is distributed with the condensation zone.

[0027] In this example, the liquid cooling module is disposed on two sides of the periphery of the vapor chamber, the first end region of the vapor chamber is a region other than the first end and the fourth end of the vapor chamber among all the end regions of the vapor chamber (i.e., the second end and the third end), or in other words, the first end region of the vapor chamber is a partial region other than the first end of the condensation zone among all the end regions of the vapor chamber.

[0028] In other embodiments, the first end region is at least a partial region other than the two ends of the condensation zone among all the end regions of the vapor chamber, and the two ends of the condensation zone are connected.

[0029] In an example, the heat spreader, the liquid outlet pipe and the liquid inlet pipe are arranged on one side of the second end of the vapor chamber distributed along the second direction (e.g., the x direction), the heat spreader is arranged adjacent to the condensation area, the second end of the vapor chamber is distributed with the condensation area, the cooler is arranged on one side of the fourth end of the vapor chamber distributed along the first direction (e.g., the y direction), the cooler is arranged adjacent to the evaporation area, and the fourth end of the vapor chamber is distributed with the evaporation area.

[0030] In this example, the liquid cooling module is arranged around the periphery of the vapor chamber on both sides, and the periphery of the first end and the third end of the vapor chamber is free of other components. The first end region of the vapor chamber is a region of the entire end region of the vapor chamber except the first end and the third end of the vapor chamber (i.e., the second end and the fourth end), or in other words, the first end region of the vapor chamber is a partial region of the entire end region of the vapor chamber except the first end and the third end of the condensation area, and the first end and the third end are connected.

[0031] In the second arrangement, the first part of the liquid cooling module is arranged around the periphery of the first end region of the vapor chamber along the first plane (e.g., the Dy plane), and the second part of the liquid cooling module except the first part is arranged on one side of the vapor chamber in the third direction (e.g., the z direction), and the third direction is parallel to the thickness direction of the vapor chamber.

[0032] The heat dissipation device provided by the embodiments of the present application can be understood as follows: the vapor chamber and the first part of the liquid cooling module are arranged side by side, and the vapor chamber and the second part of the liquid cooling module are arranged in layers. Therefore, for the liquid cooling module, the first part and the second part of the liquid cooling module are also arranged in layers. This arrangement can flexibly arrange the various components of the liquid cooling module in space based on actual conditions, for example, the space in the first plane (e.g., the Dy plane) is insufficient, or in order to reserve more space for the liquid injection pipe in the condensation area, or in order to improve the heat conduction performance of the heat source area, and the like. In this way, the heat dissipation device can be used in as many scenarios as possible. In addition, since only the second part of the liquid cooling module occupies the space in the thickness direction of the heat dissipation device, the space occupied by most of the regions of the heat dissipation device in the thickness direction is relatively small, and the overall ultra-thin requirement of the heat dissipation device is also met as much as possible.

[0033] In the second arrangement, in some embodiments, the heat dissipation device comprises a first cover plate, a second cover plate and a fourth cover plate arranged in layers along the third direction, a first cavity is formed between the first cover plate and the second cover plate, a second cavity is formed between the second cover plate and the fourth cover plate, the first cover plate, the second cover plate and the structure in the first cavity together form the vapor chamber and the first part of the liquid cooling module, the second cover plate, the fourth cover plate and the structure in the second cavity together form the second part of the liquid cooling module, and the second part of the liquid cooling module comprises the cooler.

[0034] It can be understood that the heat-generating device is arranged on the cover plate (for example, the part of the second cover plate located in the heat source area) of the heat source area of the heat dissipation device, and the heat source area includes the cooler and the evaporation area. When the heat-generating device is arranged in the evaporation area, heat can be transferred from the evaporation area to the cooler through the cover plate of the heat source area, and when the heat-generating device is arranged in the cooler, heat can be transferred from the cooler to the evaporation area through the cover plate of the heat source area. The thickness of the cover plate is relatively thin, so that the overall heat conduction performance of the cover plate is poor, especially the heat conduction performance of the heat source area, and the heat cannot be well transferred between the evaporation area and the cooler through the cover plate, which will affect the overall heat dissipation performance to some extent.

[0035] The heat dissipation device provided by the embodiment of the present application is characterized in that the cooler and the vapor chamber are stacked, and the cooler is formed by the fourth cover plate. In this way, the cover plate of the heat source area includes the part of the second cover plate located in the heat source area and the fourth cover plate, which means that the thickness of the cover plate of the heat source area is the sum of the thickness of the part of the second cover plate located in the heat source area and the thickness of the fourth cover plate. The fourth cover plate used to form the cooler is equivalent to increasing the thickness of the cover plate of the heat source area. In this way, the heat conduction area of the heat source area can be increased, and the heat conduction performance of the heat source area can be improved, so that the heat dissipation performance of the entire heat dissipation device can be improved.

[0036] In the second arrangement, in some embodiments, the first end region is at least part of the total end region of the vapor chamber except for any one end of the condensation area.

[0037] Any one end of the condensation area can be any one of the first end, the second end and the third end of the condensation area.

[0038] In some embodiments, any one end of the condensation area is a part of the end of the vapor chamber distributed along the second direction (such as the x direction), the liquid cooling pipe is arranged on one side of the other end of the vapor chamber distributed along the second direction, the heat sink is arranged on one side of one end of the vapor chamber along the first direction (such as the y direction), and the cooler is arranged on one side of the vapor chamber along the third direction (such as the z direction). In the projection of the heat dissipation device in the first plane (such as the Dy plane), the projection of the cooler is located on one side of the projection of the liquid cooling pipe in the first direction, or the projection of the cooler and the projection of the heat sink are distributed along the first direction.

[0039] In an example, the liquid outlet pipe and the liquid inlet pipe are located at the second end of the vapor chamber along the second direction (e.g., the x direction), the heat sink is arranged at one side of the third end of the vapor chamber along the first direction (e.g., the y direction), the heat sink is arranged adjacent to the condensation area, the third end of the vapor chamber is distributed with the condensation area, the cooler is arranged at one side of the third direction (e.g., the z direction) of the vapor chamber, the cooler is arranged adjacent to the evaporation area, and the cooler and the evaporation area are arranged in a stacked manner in the third direction; in the projection of the heat dissipation device in the first plane (e.g., the Dy plane), the projection of the cooler is located at one side of the projection (or the projection of the liquid inlet pipe) of the liquid outlet pipe in the first direction, or the projection of the cooler and the projection of the heat sink are distributed in the first direction.

[0040] In this example, the first part of the liquid cooling module is arranged in a three-sided surrounding manner at the periphery of the vapor chamber, and the periphery of the first end of the vapor chamber is free of other components. The first end region of the vapor chamber is a region of the entire end region of the vapor chamber except the first end of the vapor chamber (i.e., the second end, the third end, and the fourth end), or in other words, the first end region of the vapor chamber is a partial region of the entire end region of the vapor chamber except the first end of the condensation area.

[0041] In some embodiments, the vapor chamber includes a capillary structure and a vapor cavity structure extending along the first direction (e.g., the y direction), the capillary structure includes a plurality of capillary channels, and the vapor cavity structure includes a plurality of vapor channels, and the plurality of capillary channels and the plurality of vapor channels are arranged alternately.

[0042] In the above-described embodiments in which the plurality of capillary channels and the plurality of vapor channels of the vapor chamber are arranged alternately, in some embodiments, the liquid cooling pipe includes a liquid outlet pipe and a liquid inlet pipe, the liquid outlet pipe is arranged between the vapor chamber and the liquid inlet pipe, the liquid outlet pipe is used to transmit high-temperature liquid from the cooler to the heat sink, and the liquid inlet pipe is used to transmit low-temperature liquid from the heat sink to the cooler.

[0043] The heat dissipation device provided by the embodiments has the following advantages. Because the plurality of capillary channels of the capillary structure and the plurality of vapor channels of the vapor cavity structure are arranged alternately, the overall temperature in the vapor chamber is relatively high. The liquid outlet pipe used to transmit high-temperature liquid in the liquid cooling module is arranged closer to the vapor chamber, so that the temperature difference between the high-temperature liquid in the liquid outlet pipe and the temperature in the vapor chamber is relatively small. As a result, the heat exchange loss between the vapor chamber and the liquid cooling module can be reduced, and thus the heat dissipation performance of the entire heat dissipation device can be improved, and the temperature uniformity of the heat dissipation device is better.

[0044] In the design of the vapor chamber, in some embodiments, the evaporation area includes four vertical channels arranged in the first direction from the end of the evaporation area, and the four vertical channels include, in sequence, a vertical first capillary channel, a vertical first vapor channel, a vertical second capillary channel, and a vertical second vapor channel, the second capillary channel has at least one gap, and the at least one gap communicates the first vapor channel and the second vapor channel; the vapor cavity structure further includes a transverse third vapor channel, the third vapor channel communicates with the second vapor channel, and the third vapor channel extends from the second vapor channel to the condensation area, and the vapor from the evaporation area can flow to the condensation area through the first vapor channel, the at least one gap, the second vapor channel, and the third vapor channel.

[0045] In the related prior art, the first vapor channel and the second vapor channel are not communicated, and are separated by the second capillary channel, the flow resistance of the vapor is large, and it is not conducive to heat dissipation of the vapor chamber. The heat dissipation device provided by the embodiments of the present application communicates the first vapor channel and the second vapor channel through the first gap, so that the vapor can flow from the first vapor channel to the second vapor channel through the first gap, and then flow to the condensation area through the third vapor channel. The first gap increases the area of the vapor channel, which can reduce the vapor resistance and facilitate smooth flow of the vapor, so that the heat dissipation performance and the uniform temperature performance of the vapor chamber can be improved.

[0046] In the design of the vapor chamber, in some embodiments, the at least one gap includes a first gap and a second gap arranged at intervals, and a vertical first capillary branch is formed between the first gap and the second gap, a transverse second capillary branch is arranged between the first capillary channel and the first capillary branch, and the second capillary branch communicates the first capillary channel and the first capillary branch.

[0047] The heat dissipation device provided by the embodiments of the present application communicates the first vapor channel and the second vapor channel through the first gap and the second gap, respectively, so that the vapor can flow from the first vapor channel to the second vapor channel through the first gap, and also can flow from the first vapor channel to the second vapor channel through the second gap, and then flow to the condensation area through the third vapor channel. The two gaps increase the area of the vapor channel, which can better reduce the vapor resistance and facilitate smooth flow of the vapor. However, since the first gap and the second gap are obtained by sacrificing part of the capillary branches of the second capillary channel, too many gaps may affect the contact area of the heat source due to the reduction of the capillary channel. Therefore, the additional second capillary branch can effectively make up for the heat dissipation loss caused by the removal of part of the capillary channel, and can increase the flow of low-temperature liquid, so as to not affect the contact area of the heat source. Therefore, in general, the above-mentioned embodiments have smaller vapor resistance without affecting the contact area of the heat source, the overall temperature difference of the vapor chamber is smaller, and the heat dissipation performance and the uniform temperature performance of the vapor chamber are better improved.

[0048] In the design of the vapor chamber, in some embodiments, the end region of the vapor chamber distributed along the second direction includes a third capillary channel in the transverse direction, a fourth capillary channel in the transverse direction, and a third capillary branch in the vertical direction, the third capillary branch communicates the third capillary channel and the fourth capillary channel, the fourth capillary channel communicates with the first capillary channel, and the liquid from the condensation region can flow back to the evaporation region through the third capillary channel, the third capillary branch, the fourth capillary channel and the first capillary channel.

[0049] The third capillary branch in the vertical direction communicates the third capillary channel and the fourth capillary channel, so that the liquid from the condensation region flows to the fourth capillary channel through the third capillary branch in the third capillary channel, and then flows back to the end of the vapor region, so that more liquid in the condensation region can flow back to the evaporation region smoothly, and it can be understood that more low-temperature liquid in the evaporation region can better absorb heat, thereby improving the heat dissipation efficiency.

[0050] In the design of the vapor chamber, in some embodiments, the third capillary branch is adjacent to the second vapor channel, and the third capillary branch is located on the side of the second vapor channel away from the second capillary channel.

[0051] In the design of the driving pump, in some embodiments, the heat dissipation device further comprises a driving pump arranged on the outer surface of the liquid cooling module, and the driving pump communicates with the liquid cooling pipe; wherein the driving pump comprises a shell, a pump body and a sealing assembly, the pump body and the sealing assembly are accommodated in the shell, and the sealing assembly is sealingly installed between the pump body and the liquid cooling module.

[0052] The driving pump is arranged on the outer surface of the liquid cooling module, which means that the driving pump directly contacts the outer surface of the liquid cooling module, and the space between the driving pump and the outer surface of the liquid cooling module is small, so that the heat dissipation device with the driving pump occupies a small space, and the driving pump and the heat dissipation device can be well applied to electronic devices with small overall size which pursue thinness. In addition, the sealing assembly sealingly installed between the pump body and the liquid cooling module can play a sealing role to prevent water from leaking between the pump body and the liquid cooling module or foreign matter from entering the pump body. In addition, since the liquid cooling module and the vapor chamber are designed in an integrated manner, the vibration of the driving pump providing power for the liquid cooling module can improve the evaporation of the liquid in the vapor chamber, thereby improving the heat dissipation and temperature equalization performance of the vapor chamber.

[0053] In the design of the driving pump, in some embodiments, the sealing assembly comprises a first sealing member and a second sealing member.

[0054] The pump body is provided with an inlet, a first sealing groove, an outlet and a second sealing groove near the bottom of the liquid cooling module, the first sealing groove is arranged around the periphery of the inlet, the second sealing groove is arranged around the periphery of the outlet, the liquid cooling module is provided with a third sealing groove corresponding to the first sealing groove and a fourth sealing groove corresponding to the second sealing groove, wherein the first sealing member is sealingly installed in a sealing space formed by the first sealing groove and the third sealing groove, and the second sealing member is sealingly installed in a sealing space formed by the second sealing groove and the fourth sealing groove.

[0055] The heat dissipation device provided by the embodiment of the present application is characterized in that the first sealing groove is arranged around the periphery of the inlet, the third sealing groove is arranged around the periphery of the first opening, and the first sealing member is sealingly installed in a sealing space formed by the first sealing groove and the third sealing groove, so that the sealing member surrounds the connection between the inlet and the first opening, and when liquid leaks from the connection between the inlet and the first opening, the liquid leakage can be prevented by the first sealing member sealingly installed around the connection. Similarly, the second sealing groove is arranged around the periphery of the outlet, the fourth sealing groove is arranged around the periphery of the second opening, and the second sealing member is sealingly installed in a sealing space formed by the second sealing groove and the fourth sealing groove, so that the second sealing member surrounds the connection between the outlet and the second opening, and when liquid leaks from the connection between the outlet and the second opening, the liquid leakage can be prevented by the second sealing member sealingly installed around the connection.

[0056] In addition, since the first sealing member and the second sealing member are compressible, they can absorb vibration energy, so as to play a certain damping effect on the driving pump, thereby reducing noise.

[0057] In the design of the driving pump, in some embodiments, the sealing assembly further comprises a third sealing member; the bottom of the pump body is provided with a fifth sealing groove, the fifth sealing groove is arranged around the periphery of at least part of the first sealing groove and at least part of the second sealing groove, the liquid cooling module is provided with a sixth sealing groove corresponding to the fifth sealing groove, the sixth sealing groove is arranged around the periphery of at least part of the third sealing groove and at least part of the fourth sealing groove, wherein the third sealing member is sealingly installed in a sealing space formed by the fifth sealing groove and the sixth sealing groove.

[0058] The heat dissipation device provided in the embodiments of the present application has the following advantages: the fifth sealing groove is arranged around the periphery of at least a part of the first sealing groove and at least a part of the second sealing groove, the sixth sealing groove is arranged around the periphery of at least a part of the third sealing groove and at least a part of the fourth sealing groove, the first sealing member is sealingly installed in the sealing space formed by the first sealing groove and the third sealing groove, the third sealing member is sealingly installed in the sealing space formed by the second sealing groove and the fourth sealing groove, and the third sealing member is sealingly installed in the third sealing space formed by the fifth sealing groove and the sixth sealing groove. Therefore, the third sealing member surrounds at least a part of the first sealing member and at least a part of the second sealing member, so that the liquid leakage can be further prevented by the third sealing member, and the sealing performance is improved.

[0059] In addition, it can be understood that, since the first sealing member and the second sealing member are spaced apart and the two sealing members have small volumes, the two sealing members form an interference fit with the bottom of the pump body and the liquid cooling module, so that the overall stress between the bottom of the pump body and the liquid cooling module is uneven, and the damping effect is limited. Since the third sealing member surrounds at least a part of the first sealing member and at least a part of the second sealing member, the third sealing member has a large volume, so that the contact area between the third sealing member and the pump body and the liquid cooling module is large, the stress of the pump body and the liquid cooling module becomes more uniform, and the damping effect is increased and the noise is reduced. Therefore, the third sealing member can further improve the damping effect of the drive pump and further reduce the noise.

[0060] In the design of the drive pump, in some embodiments, the third sealing member has an I-shaped structure, including a vertical edge and two horizontal edges, and the vertical edge is located between the first sealing member and the second sealing member.

[0061] The heat dissipation device provided in the embodiments of the present application has the following advantages: the third sealing member has an I-shaped structure, the stress between the pump body and the liquid cooling module is more uniform, the balance is good, and the damping effect is better.

[0062] In the design of the drive pump, in some other embodiments, the third sealing member has a ring-shaped structure and surrounds the periphery of the first sealing member and the second sealing member.

[0063] In the design of the drive pump, in some embodiments, the pump body is a pump body made of a non-metal material, the shell is a shell made of a metal material, and the shell and the liquid cooling module are welded and connected.

[0064] The heat dissipation device provided in the embodiments of the present application has the following advantages: the third sealing member has an I-shaped structure, the stress between the pump body and the liquid cooling module is more uniform, the balance is good, and the damping effect is better.

[0065] In the embodiment in which the pump body is of non-metal material, the driving pump further comprises a fourth sealing member, which seals the gap between the circumferential surface of the pump body and the circumferential surface of the shell.

[0066] The fourth sealing member fills the gap between the circumferential surface of the pump body and the circumferential surface of the shell. Since the fourth sealing member is sealingly installed (for example, the fourth sealing member is compressed, and the fourth sealing member forms an interference fit with the pump body and the shell), the fourth sealing member not only has a sealing effect, but also has a certain damping effect, thereby reducing noise.

[0067] In the design of the driving pump, in some embodiments, the pump body is of metal material, the shell is of non-metal material, the pump body is connected to the shell through an adhesive layer, and the pump body is welded to the liquid cooling module. The shell is made of aerogel.

[0068] The shell formed of aerogel has good noise reduction effect due to the sound absorption property of aerogel.

[0069] In the design of the driving pump, in some embodiments, the driving pump further comprises a flexible circuit board connected to the pump body, and the shell is provided with a through hole, the flexible circuit board is arranged in the through hole, and a gap between the through hole and the flexible circuit board is filled with a waterproof adhesive layer.

[0070] The gap between the through hole and the flexible circuit board is filled with the waterproof adhesive layer, so that the waterproof adhesive layer can have a sealing effect and prevent liquid from leaking.

[0071] In a second aspect, a vapor chamber is provided. The vapor chamber includes a capillary structure and a vapor cavity structure extending along a first direction. The capillary structure includes a plurality of capillary channels. The vapor cavity structure includes a plurality of vapor channels. The plurality of capillary channels and the plurality of vapor channels are alternately arranged. The vapor chamber includes an evaporation area and a condensation area distributed along the first direction. The first direction is parallel to a length direction of the vapor chamber. The evaporation area includes four vertical channels arranged in sequence along the first direction from an end of the evaporation area. The four vertical channels include, in sequence, a first vertical capillary channel, a first vertical vapor channel, a second vertical capillary channel, and a second vertical vapor channel. The second vertical capillary channel has at least one slit. The at least one slit connects the first vapor channel and the second vapor channel. The vapor cavity structure further includes a third vapor channel. The third vapor channel is connected to the second vapor channel. The third vapor channel extends from the second vapor channel to the condensation area. Vapor from the evaporation area can flow to the condensation area through the first vapor channel, the at least one slit, the second vapor channel, and the third vapor channel.

[0072] In some embodiments, the at least one breakage includes a first breakage and a second breakage arranged at intervals, a first capillary branch is formed between the first breakage and the second breakage, a second capillary branch is arranged between the first capillary channel and the first capillary branch, and the second capillary branch communicates the first capillary channel and the first capillary branch.

[0073] In some embodiments, the end region of the heat plate distributed along the second direction includes a third capillary channel, a fourth capillary channel, and a third capillary branch, the third capillary branch communicates the third capillary channel and the fourth capillary channel, the fourth capillary channel communicates the first capillary channel, and liquid from the condensation area can flow back to the evaporation area through the third capillary channel, the third capillary branch, the fourth capillary channel, and the first capillary channel.

[0074] In some embodiments, the third capillary branch is adjacent to the second vapor channel, and the third capillary branch is located on a side of the second vapor channel away from the second capillary channel.

[0075] The beneficial effects of the various embodiments of the heat plate in the second aspect can be referred to the specific description of the heat plate in the first aspect, and will not be repeated here.

[0076] In a third aspect, a driving pump is provided, which is applied to a liquid cooling module. The liquid cooling module includes a cooler, a radiator, and a liquid cooling pipe. The cooler and the radiator are communicated through the liquid cooling pipe. The cooler is used to absorb heat to convert low-temperature liquid in the cooler into high-temperature liquid. The radiator is used to dissipate heat to convert the inflowing high-temperature liquid into low-temperature liquid. The liquid cooling pipe is used to transport the high-temperature liquid from the cooler to the radiator and to transport the low-temperature liquid from the radiator to the cooler. The driving pump is used to be arranged on the outer surface of the liquid cooling module. The driving pump is used to be communicated with the liquid cooling pipe. The driving pump includes a shell, a pump body, and a sealing assembly. The pump body and the sealing assembly are contained in the shell. The sealing assembly is sealingly mounted between the pump body and the liquid cooling module.

[0077] In some embodiments, the sealing assembly includes a first sealing member and a second sealing member. The pump body is provided with an inlet, a first sealing groove, an outlet, and a second sealing groove near the bottom of the liquid cooling module. The first sealing groove is arranged around the periphery of the inlet. The second sealing groove is arranged around the periphery of the outlet. The liquid cooling module is provided with a third sealing groove corresponding to the first sealing groove and a fourth sealing groove corresponding to the second sealing groove. The first sealing member is sealingly mounted in the sealing space formed by the first sealing groove and the third sealing groove. The second sealing member is sealingly mounted in the sealing space formed by the second sealing groove and the fourth sealing groove.

[0078] In some embodiments, the sealing assembly further comprises a third sealing member; the bottom of the pump body is provided with a fifth sealing groove, the fifth sealing groove is arranged around the periphery of at least a part of the first sealing groove and at least a part of the second sealing groove, the liquid cooling module is provided with a sixth sealing groove corresponding to the fifth sealing groove, the sixth sealing groove is arranged around the periphery of at least a part of the third sealing groove and at least a part of the fourth sealing groove, and the third sealing member is sealingly installed in a sealing space formed by the fifth sealing groove and the sixth sealing groove.

[0079] In some embodiments, the third sealing member is in an I-shaped structure, comprising a vertical edge and two horizontal edges, and the vertical edge is located between the first sealing member and the second sealing member.

[0080] In some embodiments, the third sealing member is in a ring-shaped structure, and is arranged around the periphery of the first sealing member and the second sealing member.

[0081] In some embodiments, the pump body is a pump body made of a non-metal material, the shell is a shell made of a metal material, and the shell is welded to the liquid cooling module.

[0082] In some embodiments, the drive pump further comprises a fourth sealing member, and the fourth sealing member is sealingly installed in a gap between the circumferential side surface of the pump body and the circumferential side surface of the shell.

[0083] In some embodiments, the pump body is a pump body made of a metal material, the shell is a shell made of a non-metal material, the pump body is connected to the shell through an adhesive layer, and the pump body is welded to the liquid cooling module.

[0084] In some embodiments, the shell is made of aerogel.

[0085] In some embodiments, the drive pump further comprises a flexible circuit board connected to the pump body, and the shell is provided with a through hole, the flexible circuit board is arranged in the through hole, and a gap between the through hole and the flexible circuit board is filled with a waterproof adhesive layer.

[0086] The beneficial effects of the various embodiments of the drive pump in the third aspect can be referred to the specific description of the drive pump in the first aspect, and will not be described again.

[0087] In the fourth aspect, an electronic device is provided, comprising a heat generating device and a heat dissipation device as described in the first aspect above, and the heat generating device is arranged in the evaporation area of the vapor chamber of the heat dissipation device, or the heat generating device is arranged in the cooler of the liquid cooling module of the heat dissipation device.

[0088] In some embodiments, the electronic device further comprises a mainboard, a middle frame and a display screen, the mainboard and the display screen are arranged on two sides of the middle frame, the mainboard is provided with a heat generating device, and the heat dissipation device is arranged on the side of the middle frame close to the display screen.

[0089] In some embodiments, the electronic device further comprises a circuit board, a middle frame and a display screen, the mainboard and the display screen are arranged on two sides of the middle frame, and the mainboard is provided with a heat generating device, wherein a part of the heat dissipation device is arranged on a side of the middle frame close to the display screen, and another part of the heat dissipation device is arranged on a side of the middle frame away from the display screen.

[0090] In a fifth aspect, an electronic device is provided, comprising a heat generating device and the vapor chamber as in the second aspect above, the heat generating device is arranged on the evaporation area of the vapor chamber.

[0091] In some embodiments, the electronic device further comprises a circuit board, a middle frame and a display screen, the mainboard and the display screen are arranged on two sides of the middle frame, and the mainboard is provided with a heat generating device, wherein a part of the heat dissipation device is arranged on a side of the middle frame close to the display screen, and another part of the heat dissipation device is arranged on a side of the middle frame away from the display screen. BRIEF DESCRIPTION OF DRAWINGS

[0092] Figure 1 FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application, which is configured with a heat dissipation device.

[0093] Figure 2 FIG. 2 is a cross-sectional view of the heat dissipation device in the xy plane.

[0094] Figure 3 FIG. 3 is a schematic diagram of the working medium flow direction. Figure 2 FIG. 4 is a schematic diagram of the working medium flow direction.

[0095] Figure 4 FIG. 5 is a schematic structural diagram of the heat dissipation device.

[0096] Figure 5 FIG. 6 is a schematic structural diagram of another angle of the heat dissipation device.

[0097] Figure 6 FIG. 7 is a cross-sectional view of another structure of the heat dissipation device in the xy plane.

[0098] Figure 7 FIG. 8 is a schematic diagram of the working medium flow direction. Figure 6 FIG. 9 is a schematic diagram of the working medium flow direction.

[0099] Figure 8 FIG. 10 is a schematic block diagram of another structure of the heat dissipation device.

[0100] Figure 9 FIG. 11 is a schematic structural diagram of another structure of the heat dissipation device.

[0101] Figure 10 FIG. 12 is a schematic structural diagram of another structure of the heat dissipation device.

[0102] Figure 11 FIG. 13 is a schematic diagram of the working medium flow direction. Figure 10A schematic structural view of the heat dissipation device from another angle.

[0103] Figure 12 A schematic structural view of the heat dissipation device from another angle. Figure 10 A sectional view of the heat dissipation device in xy plane.

[0104] Figure 13 A sectional view of the heat dissipation device in xy plane. Figure 10 Another sectional view of the heat dissipation device in xy plane.

[0105] Figure 14 A perspective view of the capillary structure and the vapor cavity structure separated from the sectional view of the heat dissipation device. Figure 12

[0106] A schematic structural view of another structure of the heat dissipation device provided by the embodiment of the present application. Figure 15

[0107] A schematic structural view of another structure of the heat dissipation device provided by the embodiment of the present application. Figure 16

[0108] A schematic structural view of another structure of the heat dissipation device provided by the embodiment of the present application. Figure 17

[0109] A schematic structural view of the heat dissipation device including a driving pump provided by the embodiment of the present application. Figure 18

[0110] A schematic structural view of the driving pump from different angles provided by the embodiment of the present application. Figure 19

[0111] An exploded view of the driving pump provided by the embodiment of the present application. Figure 20

[0112] Another angle of the exploded view of the driving pump provided by the embodiment of the present application. Figure 21

[0113] A schematic structural view of the heat dissipation device without the driving pump provided by the embodiment of the present application. Figure 22

[0114] A sectional view of the heat dissipation device in xy plane. Figure 23 Figure 22 A schematic view of a partial region of the structure of the three sealing members and the two gaskets cooperating with the liquid cooling module.

[0115] Figure 24 Another schematic structural view of the pump body and the third sealing member provided by the embodiment of the present application.

[0116] Figure 25 A sectional view of the heat dissipation device in xy plane.

[0117] Figure 26 Figure 18 ​​A schematic diagram showing the separation of the flexible circuit board from the outer casing at point B in the central region.

[0118] Figure 27 This is a frequency response curve of a drive pump with an aerogel shell and a drive pump with a metal shell provided in the embodiments of this application.

[0119] Figure 28 This is a cross-sectional view of the heat dissipation plate in the xy plane of the heat dissipation device provided in the embodiments of this application.

[0120] Figure 29 From Figure 28 A schematic structural diagram of the inner cavity of the heat spreader separated from the heat spreader.

[0121] Figure 30 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0122] Figure 31 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0123] Figure 32 yes Figure 31 A magnified view of a portion of region C.

[0124] Figure 33 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0125] Figure 34 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0126] Figure 35 This is a schematic block diagram of an electronic device equipped with a heat dissipation device provided in an embodiment of this application.

[0127] Figure 36 This is another schematic block diagram of an electronic device equipped with a heat dissipation device provided in the embodiments of this application.

[0128] Figure Labels

[0129] 100. Electronic equipment; 20. Heating components; 21. Display screen; 22. Mid-frame; 23. Motherboard; 24. Small board; 25. Battery; 26. Back cover;

[0130] 10. Heat dissipation device; 101. First cover plate; 102. Second cover plate; 10a. Liquid injection pipe; 103. Third cover plate; 104. Fourth cover plate;

[0131] 11, heat plate; 111, evaporation area; 112, condensation area; 1121, first end of condensation area; 1122, second end of condensation area; 1123, third end of condensation area; 113, capillary channel; 114, vapor channel; 11a, first end of heat plate; 11b, second end of heat plate; 11c, third end of heat plate; 11d, fourth end of heat plate; 113a1, first vertical capillary channel; 113a2, second vertical capillary channel; 113b1, third horizontal capillary channel; 113b2, fourth horizontal capillary channel; 113b3, fifth horizontal capillary channel; 113c1, first capillary branch; 113c2, second capillary branch; 113c3, third capillary branch; 113c4, fourth capillary branch; 113c5, fifth capillary branch; 114a1, first vertical vapor channel; 114a2, second vertical vapor channel; 114b1, third horizontal vapor channel; 114b2, fourth horizontal vapor channel; 114b3, fifth horizontal vapor channel; 114c1, first break; 114c2, second break;

[0132] 121, cooler; 1211, first pipe; 1212, second pipe; 122, radiator; 123, liquid outlet pipe; 1231, second communication pipe; 124, liquid inlet pipe; 1241, first communication pipe; 126, first connection pipe; 1261, third communication pipe; 127, second connection pipe; 1271, fourth communication pipe; 128, support part; 1201, first opening; 1202, second opening; 1203, third sealing groove; 1204, fourth sealing groove; 1205, sixth sealing groove;

[0133] 13, drive pump; 131, housing; 1311, through hole; 1312, rim; 132, pump body; 133, flexible circuit board; 1341, first gasket; 1342, second gasket; 1351, first sealing member; 1352, second sealing member; 1353, third sealing member; 1353a, horizontal edge; 1353b, vertical edge; 1354, fourth sealing member; 1355, adhesive member; 1356, adhesive layer; 1361, liquid inlet; 1362, liquid outlet; 1371, first sealing groove; 1372, second sealing groove; 1373, fifth sealing groove. DETAILED DESCRIPTION

[0134] The technical solutions in the present application will be described below with reference to the drawings.

[0135] The electronic device generates power consumption and heat when implementing various functions, and needs to be cooled. The purpose of cooling is to strengthen the heat conduction in the electronic device to optimize the uniformity of the electronic device, thereby reducing the maximum temperature of the electronic device and helping the dissipation of heat on the surface of the machine body. Common cooling methods include passive cooling and active cooling. Passive cooling includes, for example, heat plate, graphite and graphene, and active cooling includes, for example, active liquid cooling.

[0136] The heat plate, also known as a heat plate, or a super heat plate, or a heat plate, uses the method of absorbing heat by phase change of liquid boiling to gas in the sealed cavity and condensation of gas to liquid, and uses capillary force, gravity, etc. as the liquid cooling medium transport power to complete the phase change cycle of gas-liquid phase in the evaporation zone and the condensation zone, thereby realizing efficient heat exchange by using phase change latent heat, heat conduction, convection, etc. Specifically, the cooling medium in the evaporation zone of the heat plate absorbs heat and rapidly vaporizes into steam. The steam is gaseous cooling medium, and the steam is transported to the condensation zone with lower pressure and condenses to release heat. The condensed and liquefied cooling medium returns to the evaporation zone under the capillary action of the capillary structure, completing a heat transfer cycle. The heat plate can be considered as a heat pipe with higher shape freedom, which can realize irregular design. The traditional heat pipe is only applied to one-dimensional heat dissipation, and the heat plate can also realize two-dimensional and three-dimensional heat dissipation.

[0137] However, with the high intelligence of electronic devices such as mobile phones and tablets, the functions of electronic devices are becoming more and more rich and the performance is becoming more and more strong, and the whole machine power consumption is also becoming more and more large, resulting in the heat generation of the electronic device is also more and more large, and the performance requirement of the heat plate is also more and more high. At the same time, with the development of light and thin electronic devices, the need for high-performance ultra-thin heat plates is also more and more strong, but the thickness reduction and the increase of heat transfer area and heat transfer distance of the heat plate lead to the difficulty in improving the heat dissipation performance of the heat plate. For example, the capillary structure of the ultra-thin heat plate is in a slender structure, the capillary force is insufficient, resulting in insufficient liquid return, and the phenomenon of dry burning is easy to occur, and the steam resistance of the ultra-thin heat plate is large. Therefore, the ultra-thin design of the heat plate and the long-distance heat transfer requirement exist conflict, it is difficult to improve the heat dissipation performance and uniformity of the heat plate.

[0138] Based on this, in one aspect, the embodiment of the present application provides a heat dissipation device integrating a vapor chamber and a liquid cooling module. The vapor chamber and the liquid cooling module can work together to improve the heat dissipation and temperature equalization performance. Especially under the demand of thinning of electronic devices and vapor chambers, in order to achieve better heat dissipation performance and temperature equalization performance, long-distance heat transfer is often required, which requires larger size steam channels and capillary channels. The heat dissipation device integrating the vapor chamber and the liquid cooling module solves the conflict between the thin design of the vapor chamber and the long-distance heat transfer requirement, that is, under the thin design of the vapor chamber and the long-distance heat transfer requirement, the heat dissipation device integrating the vapor chamber and the liquid cooling module has good heat dissipation performance and temperature equalization performance, meeting the thin design of electronic devices and vapor chambers and the high requirement of electronic devices on heat dissipation performance. In addition, the vapor chamber and the liquid cooling module are reasonably arranged, at least part of the liquid cooling module is arranged around the periphery of the first end region of the vapor chamber along the first plane (such as the xy plane), and the first end region of the vapor chamber is at least part of the region of the vapor chamber except at least part of the region of the condensation area. In this way, the periphery of at least part of the end region of the condensation area (such as the first end of the condensation area) of the vapor chamber is free of other components of the heat dissipation device, and at least part of the end region of the condensation area is exposed to air. The periphery of at least part of the end region of the condensation area exposed to air can provide sufficient space to open a liquid injection pipe on at least part of the end region of the condensation area to inject cooling medium into the vapor chamber, thereby completing the manufacture of the vapor chamber and the heat dissipation device.

[0139] In another aspect, the embodiment of the present application also provides a drive pump which can be used in combination with the liquid cooling module of the above-mentioned heat dissipation device. The drive pump not only provides a power source for the liquid cooling module, but also better meets the high requirements of intelligent electronic devices on waterproof performance and noise reduction performance through sealing and noise reduction design of the drive pump. In addition, since the liquid cooling module and the vapor chamber are integrated, the vibration of the drive pump providing a power source for the liquid cooling module is beneficial to the evaporation of the liquid in the vapor chamber, thereby improving the heat dissipation and temperature equalization performance of the vapor chamber.

[0140] In still another aspect, the embodiment of the present application also provides a vapor chamber which can be the vapor chamber of the above-mentioned heat dissipation device or an independent vapor chamber. By breaking part of the capillary channels of the evaporation area to increase the steam channels, the steam resistance can be reduced, thereby improving the heat dissipation and temperature equalization performance of the vapor chamber. Optionally, capillary channels can also be added to part of the steam channels of the evaporation area to increase the low-temperature liquid. More low-temperature liquid can carry away more heat, thereby improving the heat dissipation and temperature equalization performance of the vapor chamber.

[0141] It should be understood that the above-mentioned driving pump and the vapor chamber can be used in combination with the heat dissipation device, or can be used independently, and the embodiments of the present application do not make any limitation. For example, the driving pump can be used in combination with an independent liquid cooling module. For another example, the vapor chamber can be used independently, and does not need to be integrated with the liquid cooling module.

[0142] Hereinafter, the heat dissipation device is described first, and then the driving pump and the vapor chamber are described.

[0143] The heat dissipation device of the embodiments of the present application can be applied to various types of electronic devices, for example, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a watch or a wearable device, etc.

[0144] Figure 1 is a schematic structural diagram of an electronic device provided by the embodiments of the present application and configured with a heat dissipation device. It should be understood that Figure 1 is a schematic structural diagram of a mobile phone as an example of an electronic device, and should not constitute any limitation on the form of the electronic device to which the heat dissipation device is applied.

[0145] For ease of description, the width direction of the electronic device is defined as the x-axis direction, the length direction of the electronic device is defined as the y-axis direction, and the thickness direction of the electronic device is defined as the z-axis direction. The x-axis direction, the y-axis direction and the z-axis direction are perpendicular to each other, the x-axis direction and the y-axis direction constitute an xy plane, the x-axis direction and the z-axis direction constitute an xz plane, and the y-axis direction and the z-axis direction constitute a yz plane.

[0146] Reference Figure 1 Taking the electronic device as a mobile phone as an example, the electronic device 100 includes a display screen 21, a middle frame 22, a mainboard 23, a small plate 24, a battery 25, a back cover 26 and a heat dissipation device 10.

[0147] The middle frame 22 and the back cover 26 form the shell of the electronic device, and the cavity formed by the middle frame 22 and the back cover 26 contains various devices and structures, for example, the cavity formed by the middle frame 22 and the back cover 26 contains Figure 1 The display screen 21, the mainboard 23, the small plate 24, the battery 25 and the heat dissipation device 10 are shown.

[0148] The display screen 21 and the heat dissipation device 10 are installed on the same side of the middle frame 22, wherein the heat dissipation device 10 is arranged between the middle frame 22 and the display screen 21, and the heat dissipation device 10 and the middle frame 22 jointly bear the display screen 21. In the length direction (such as the y direction) of the electronic device 100, the heat dissipation device 10 can span the mainboard 23, the battery 25 and the small plate 24 in the electronic device 100, that is, the heat dissipation device 10 is arranged along the length direction (such as the y direction) of the electronic device 100.

[0149] It can be understood that, since the heat dissipation device 10 is arranged along the length direction (such as the y direction) of the electronic device 100, the length direction of the heat dissipation device 10 is also the length direction of the electronic device 100, and the width direction of the heat dissipation device 10 is also the width direction of the electronic device 100.

[0150] The mainboard 23, the battery 25 and the small plate 24 are arranged on the side of the middle frame 22 away from the display screen 21, or in other words, the mainboard 23, the battery 25 and the small plate 24 are arranged on opposite sides of the middle frame 22, respectively. Among them, the mainboard 23 is provided with one or more heat generating devices 20 (three heat generating devices are shown), and the heat generating device 20 can be attached to the heat dissipation device 10. The small plate 24 is provided with at least one electronic element, such as a loudspeaker, a microphone, etc. Figure 1

[0151] It should be understood that the heat generating device 20 refers to a single device with certain functions that can generate heat when working, or a module or module composed of several single devices. For example, the heat generating device 20 can be a system on chip (SoC), a power management unit (PMU), a fast charging chip, a power amplifier (PA), a camera, a display screen, a battery, etc. The heat generating device 20 is arranged on the mainboard 23, and the mainboard 23 can be a single layer board or a multi-layer board arranged in layers and spaced apart. For a multi-layer board, heat generating devices 20 can be arranged on each layer.

[0152] In some embodiments, based on the actual situation, if only one heat generating device 20 is attached to the heat dissipation device 10, the SoC that generates the most heat can be attached to the outer surface of the heat dissipation device 10.

[0153] In the length direction (y direction) of the electronic device 100, the electronic device 100 includes a hot zone and a cold zone (not shown in the figure), the hot zone has more heat generating devices and generates more heat, and the cold zone has fewer heat generating devices and generates less heat. Exemplarily, the hot zone and the cold zone are relatively distributed along the length direction (y direction) of the electronic device. In the Figure 1 In the electronic device 100 shown, the upper end of the electronic device 100 in the length direction (y direction) can be a hot zone, which can include the mainboard 23 and the area near the mainboard 23, and the lower end of the electronic device 100 in the length direction (y direction) can be a cold zone, which can include the lower end of the battery 25, or the cold zone includes the lower end of the battery 25 and part or all of the area of the small plate 24.

[0154] ​In the embodiment of the present application, the heat dissipation device 10 can dissipate heat from the hot area (for example, the heat generating device 20 on the mainboard 23) of the electronic device 100 and bring the heat to the cold area (for example, the lower end of the battery 25 and part or all of the area of the small plate 24) of the electronic device 100, so as to strengthen the heat conduction in the electronic device 100 and optimize the temperature uniformity of the entire electronic device.

[0155] Hereinafter, the related structure of the heat dissipation device of the embodiment of the present application will be described in detail. Figures 2 to 34

[0156] It should be understood that the heat dissipation device 10 is arranged along the length direction (for example, the y direction) of the electronic device 100, the length direction of the heat dissipation device 10 is the same as the length direction of the electronic device 100, the width direction of the heat dissipation device 10 is the same as the width direction of the electronic device 100, and in the following description, the heat dissipation device 10 will continue to be described based on the above-mentioned coordinates.

[0157] Hereinafter, three directions and a plane are defined, which are respectively denoted as a first direction, a second direction and a third direction, and a first plane. Among them, the first direction is parallel to the length direction (for example, the y direction) of the heat dissipation device 10, the second direction is parallel to the width direction (for example, the x direction) of the heat dissipation device 10, and the third direction is parallel to the thickness direction (for example, the z direction) of the heat dissipation device 10. The first plane (for example, the xy plane) is parallel to the plane formed by the first direction and the second direction, and the first plane can also be understood as a plane parallel to the main plane of the heat dissipation device 10, and the main plane is the distribution plane of the heat dissipation device 10.

[0158] I. Heat dissipation device

[0159] Figure 2 is a cross-sectional view of the heat dissipation device provided by the embodiment of the present application in the xy plane. Figure 3 is Figure 2 annotated with the flow direction of the working medium.

[0160] Referring to Figure 2 , the heat dissipation device 10 of the embodiment of the present application includes a heat spreading plate 11 and a liquid cooling module, that is, the heat spreading plate 11 and the liquid cooling module are integrated on the heat dissipation device 10.

[0161] In terms of area division, the heat spreading plate 11 includes an evaporation area 111 and a condensation area 112 distributed along the first direction (for example, the y direction). The evaporation area 111 is arranged adjacent to the hot area of the electronic device, and the hot area of the electronic device is provided with a heat generating device, and the condensation area 112 is arranged adjacent to the cold area of the electronic device.

[0162] In terms of structure, the heat spreading plate 11 includes a capillary structure and a vapor cavity structure, wherein the capillary structure includes a plurality of capillary channels 113 (for example,​Figure 2 The gray channel in the middle), the steam chamber structure includes multiple steam channels 114 (such as the gray channel in the middle), Figure 2 (The white channels in the middle). The capillary structure is used to generate capillary force to transfer the liquid cooling medium, completing the entire power cycle and thus the thermodynamic cycle. It is the key to maintaining two-phase heat exchange. The liquid cooling medium flows back from the condensation zone 112 to the evaporation zone 111 through the various capillary channels. The vapor chamber structure is used to transfer the gaseous cooling medium. The gaseous cooling medium is transferred from the evaporation zone 111 to the condensation zone 112 through the various vapor channels 114.

[0163] In some embodiments, reference Figure 2 The multiple capillary channels 113 of the capillary structure and the multiple steam channels 114 of the steam chamber structure are arranged alternately, thus achieving the required heat dissipation performance while maintaining the ultra-thin profile of the heat spreader 11. In other words, a capillary channel 113 is formed between two steam channels 114, or a steam channel 114 is formed between two capillary channels 113. For example, see reference... Figure 2 The arrangement of the capillary structure and the steam chamber structure is as follows: steam channel 114, capillary channel 113, steam channel 114, capillary channel 113...

[0164] refer to Figure 2 and Figure 3 The heat conduction principle of the heat spreader 11 is as follows: The heat generated by the heating element is conducted to the evaporation zone 111 of the heat spreader 11. When the evaporation zone 111 is heated, the liquid cooling medium in this area evaporates and vaporizes, absorbing heat and rapidly expanding in volume. The vapor (gas-phase cooling medium) is rapidly transferred from the evaporation zone 111 (high-pressure zone) to the condensation zone 112 (low-pressure zone) through the vapor passage 114 of the vapor chamber structure. Figure 3 The solid arrow indicates the direction of steam flow. Because the temperature in condensation zone 112 is lower, the steam releases heat and condenses into a liquid (liquid cooling medium). The liquid then returns to evaporation zone 111 via capillary action generated by the capillary structure. Figure 3 The dashed arrow actually indicates the direction of liquid flow, thus completing one heat conduction cycle.

[0165] The cooling medium filled in the heat spreader 11 can be any one of water, ethylene glycol solution, propylene glycol solution, fluorinated liquid, liquid metal, refrigerant, or organic compound. Furthermore, the cooling medium can be a single component or a mixture of at least two media.

[0166] refer to Figure 2 and Figure 3The liquid cooling module includes a cooler 121, a heat sink 122, and a liquid cooling pipe. The liquid cooling pipe is arranged between the cooler 121 and the heat sink 122, and the cooler 121 and the heat sink 122 are in communication through the liquid cooling pipe. Specifically, the liquid cooling pipe includes an outlet pipe 123 and an inlet pipe 124. One end of the outlet pipe 123 is in communication with the cooler 121, and the other end is in communication with the heat sink 122. One end of the inlet pipe 124 is in communication with the cooler 121, and the other end is in communication with the heat sink 122. In addition, the cooler 121 is arranged adjacent to a hot area of the electronic device, and the heat sink 122 is arranged adjacent to a cold area of the electronic device.

[0167] The cooler 121 is used to absorb heat generated by the heat generating device to convert the low-temperature liquid (low-temperature cooling medium) in the cooler 121 into high-temperature liquid (high-temperature cooling medium). The outlet pipe 123 is used to transport the high-temperature liquid from the cooler 121 to the heat sink 122. The heat sink 122 is used for heat dissipation to convert the inflowing high-temperature liquid into low-temperature liquid. The inlet pipe 124 is used to return the low-temperature liquid from the heat sink 122 to the cooler 121.

[0168] Reference is made to Figure 2 and Figure 3 The heat conduction principle of the liquid cooling module is as follows: when the liquid cooling module is working, the cooler 121 absorbs heat generated by the heat generating device, the low-temperature liquid in the cooler 121 becomes high-temperature liquid, the high-temperature liquid flows into the heat sink 122 through the outlet pipe 123, the heat sink 122 dissipates heat to transfer heat to the cold area of the electronic device, the high-temperature liquid becomes low-temperature liquid, and the low-temperature liquid returns to the cooler 121 through the inlet pipe 124, thereby completing a heat conduction cycle.

[0169] In some embodiments, reference is made to Figure 2 and Figure 3 At least one of the cooler 121 and the heat sink 122 is a microchannel structure, that is, the cooler 121 is a microchannel cooler, and / or the heat sink 122 is a microchannel heat sink. It should be understood that "and / or" herein means that the cooler 121 exists alone, the cooler 121 and the heat sink 122 exist together, and the heat sink 122 exists alone.

[0170] The microchannel structure is a structure with a plurality of fine flow channels. Specifically, the channel of the cooler 121 is a channel structure with a plurality of fine flow channels, and / or the channel of the heat sink 122 is a channel structure with a plurality of fine flow channels. Compared with the cooler or the heat sink of the traditional cold plate structure, the flow channel of the microchannel structure has a small size (the flow channel equivalent diameter is between 10-1000 μm), a small flow resistance, a significant microscale effect, a high heat exchange efficiency, and outstanding heat exchange performance.

[0171] Figure 4is a schematic structural diagram of a heat dissipation device provided by an embodiment of the present application. Figure 5 is a schematic structural diagram of the heat dissipation device from another angle provided by an embodiment of the present application. It should be understood that, Figure 4 , Figure 5 and Figure 2 are heat dissipation devices of the same structure, Figure 2 is Figure 4 a cross-sectional view of the heat dissipation device shown from the angle in the xy plane.

[0172] Referring to Figure 4 , in the embodiment of the present application, the heat dissipation device 10 further comprises a driving pump 13 in communication with the liquid cooling pipe. The driving pump 13 drives the circulating flow of the cooling medium of the liquid cooling module as a power source. The driving pump 13 is used to transmit the high-temperature liquid flowing out of the cooler 121 to the radiator 122 through the liquid outlet pipe 123 of the liquid cooling pipe, and transmit the low-temperature liquid flowing out of the radiator 122 to the cooler 121 through the liquid inlet pipe 124 of the liquid cooling pipe, so as to drive the circulating flow of the cooling medium in the liquid cooling module. It should be understood that, for the sake of brevity, Figure 4 The schematic driving pump 13 is a schematic diagram of the driving pump after removing the flexible circuit board, and does not represent the actual structural form of the driving pump 13.

[0173] Among them, the whole formed by the driving pump 13 and the liquid cooling module can be called an active liquid cooling system.

[0174] The position of the driving pump 13 can be flexibly set, as long as the driving pump 13 can be in communication with the liquid cooling pipe. The present application does not make any limitation. It should also be understood that the driving pump 13 and the liquid cooling pipe can be in direct communication or indirect communication. Indirect communication means that there are other components or structures between the driving pump 13 and the liquid inlet pipe 124 or the liquid outlet pipe 123 of the liquid cooling pipe. Direct communication means that there are no other components or structures between the driving pump 13 and the liquid inlet pipe 124 or the liquid outlet pipe 123 of the liquid cooling pipe.

[0175] In some embodiments, referring to Figure 4 , the driving pump 13 is arranged on the outer surface (such as the outer surface of the first cover plate 101) of the liquid cooling module, and the driving pump 13 is in direct contact with the liquid cooling module. In an example, referring to Figure 2The projection of the driving pump 13 is located on the area 10b of the projection position of the driving pump 13, that is, the projection of the driving pump 13 is located between the liquid inlet pipe 124 and the cooler 121, the driving pump 13 is in communication with the liquid cooling pipe, specifically, one end of the driving pump 13 is directly communicated with the liquid inlet pipe 124, and the other end is communicated (indirectly communicated) with the liquid outlet pipe 123 through the cooler 121. In other examples, the projection of the driving pump 13 can also be located between the cooler 121 and the liquid outlet pipe 123, or the projection of the driving pump 13 is located between the radiator 122 and the liquid inlet pipe 124, or the projection of the driving pump 13 is located between the radiator 122 and the liquid outlet pipe 123, or the projection of the driving pump 13 is located between different areas of the cooler 121 (such as the area 10b shown in Figure 6 FIG. 10), or the driving pump 13 is arranged between different areas of the radiator 122.

[0176] In other embodiments (not shown in the figure), the driving pump 13 can be arranged independently of the liquid cooling module, and there is no direct contact between the driving pump 13 and the liquid cooling module. The inlet pipe and the outlet pipe extending outwardly can be arranged on the driving pump 13 to communicate with the liquid cooling pipe of the liquid cooling module, so as to realize the communication between the driving pump 13 and the liquid cooling module.

[0177] In the embodiments of the present application, the number of driving pumps 13 can be one or more, and multiple driving pumps 13 can be arranged according to actual needs to obtain the required flow rate. As shown in Figure 4 FIG. 10, the heat dissipation device 10 includes two driving pumps 13 (denoted as driving pump 13a and driving pump 13b) connected in parallel, and the two driving pumps 13 connected in parallel can increase the flow rate. It should be understood that the driving pump 13 serves as the power source of the liquid cooling module, and the more the number of driving pumps 13 connected in parallel, the greater the flow rate of the liquid, and the faster the transmission speed of the cooling medium in the liquid cooling module, which is beneficial to improve the heat dissipation performance.

[0178] Exemplarily, referring to Figure 3The first opening 1201a and the second opening 1202a, which are connected to the driving pump 13a, and the first opening 1201b and the second opening 1202b, which are connected to the driving pump 13b, are arranged between the inlet pipe 124 and the cooler 121. For the driving pump 13a, the low-temperature liquid from the inlet pipe 124 flows into the driving pump 13a through the first opening 1201a, the low-temperature liquid is pressurized by the driving pump 13a and flows out of the driving pump 13a through the second opening 1202a, the pressurized low-temperature liquid flows into the cooler 121 from the driving pump 13a, and the low-temperature liquid absorbs heat in the cooler 121 to become high-temperature liquid and is discharged to the outlet pipe 123. Similarly, for the driving pump 13b, the low-temperature liquid from the inlet pipe 124 flows into the driving pump 13b through the first opening 1201b, the low-temperature liquid is pressurized by the driving pump 13b and flows out of the driving pump 13b through the second opening 1202b, the pressurized low-temperature liquid flows into the cooler 121 from the driving pump 13b, and the low-temperature liquid absorbs heat in the cooler 121 to become high-temperature liquid and is discharged to the outlet pipe 123.

[0179] It should be understood that the driving pump 13 will vibrate to a certain extent during operation, and the vibration of the driving pump 13 can accelerate the evaporation of the liquid in the vapor chamber 11. Therefore, the integration of the liquid cooling module and the vapor chamber 11 can also improve the VC performance of the vapor chamber 11.

[0180] Regarding the distribution of the liquid cooling module and the vapor chamber 11, reference is made to Figure 2 The cooler 121 is arranged adjacent to the evaporation area 111, and the heat sink 122 is arranged adjacent to the condensation area 112. At least part of the liquid cooling module is arranged around the periphery of the first end region of the vapor chamber 11 along the first plane (such as the xy plane). The first end region of the vapor chamber 11 is at least part of the total end region of the vapor chamber 11, excluding at least part of the end region of the condensation area 112.

[0181] Here, one component (such as the cooler 121 or the heat sink 122) arranged adjacent to another component (such as the evaporation area 111 or the condensation area 112) can be understood as being arranged in a small distance range (such as less than or equal to 50 mm) on or around the other component. For example, Figure 2 For example, the cooler 121 is arranged adjacent to the evaporation area 111 as shown in the figure. There is no other component between the cooler 121 and the evaporation area 111. The cooler 121 is arranged outside one end of the evaporation area 111 along the first direction (such as the y direction). The distance between the cooler 121 and the evaporation area 111 is very small. It can be understood that, except for the necessary partition structure between the cooler 121 and the evaporation area 111, the smaller the distance between the two, the better. For example, Figure 2The heat sink 122 shown is arranged adjacent to the condensation area 112, and there are no other components between the heat sink 122 and the condensation area 112. The heat sink 122 is arranged outside one end of the condensation area 112 along the first direction (for example, the y direction).

[0182] The at least part of the liquid cooling module represents part or all of the components of the liquid cooling module. For example, the part of the liquid cooling module can be one of the cooler, the heat sink, the liquid outlet pipe, and the liquid inlet pipe, or any combination of two or three of them. The whole of the liquid cooling module includes the cooler, the heat sink, the liquid outlet pipe, and the liquid inlet pipe.

[0183] The end region in the first end region or the whole end region of the vapor chamber 11 represents the region where the end of the vapor chamber 11 distributed on the main plane of the vapor chamber 11 is located. The main plane represents the distribution plane of the vapor chamber 11. Referring to Figure 2 , the vapor chamber 11 is distributed along the xy plane, which is the main plane of the vapor chamber 11. The vapor chamber 11 is square in shape. The vapor chamber 11 has four ends distributed on the main plane (for example, the xy plane), two ends along the second direction (for example, the x direction) (referred to as the first end 11a and the second end 11b of the vapor chamber 11), and two ends along the first direction (for example, the y direction) (referred to as the third end 11c and the fourth end 11d of the vapor chamber 11). The whole end region of the vapor chamber 11 includes the first end 11a, the second end 11b, the third end 11c, and the fourth end 11d of the vapor chamber 11. The explanations of other end regions below are the same as this, and will not be repeated here.

[0184] The at least part of the end region of the condensation area 112 represents part or all of the end region of the condensation area 112. For example, Figure 2 The condensation area 112 shown includes three ends: two ends distributed along the second direction (for example, the x direction) (referred to as the first end 1121 and the second end 1122 of the condensation area 112), and one end distributed along the first direction (for example, the y direction) (referred to as the third end 1123 of the condensation area 112). The part of the end region of the condensation area 112 can include one or any combination of two of the first end 1121, the second end 1122, and the third end 1123. The whole end region of the condensation area 112 includes the first end 1121, the second end 1122, and the third end 1123. It should be understood that the third end 1123 of the condensation area 112 is distributed on the same side as the third end 11c of the vapor chamber 11, and the third end 1123 of the condensation area 112 is also the third end 11c of the vapor chamber 11.

[0185] The first end region of the vapor chamber 11 is at least part of the end region of the vapor chamber 11, excluding the at least part of the end region of the condensation area 112. The at least part of the region here represents all or part of the region.

[0186] Specifically, for the distribution of the above-mentioned vapor chamber 11 and liquid cooling module, as a whole, it can be divided into two arrangement modes, which are referred to as a first arrangement mode and a second arrangement mode.

[0187] In the first arrangement mode, the vapor chamber 11 and the liquid cooling module are arranged side by side in a first plane (a main plane of the vapor chamber 11 or the heat dissipation device 10, such as the xy plane), in which case, all components (the cooler 121, the heat sink 122, the liquid outlet pipe 123, and the liquid inlet pipe 124) of the liquid cooling module are arranged around the periphery of the first end region of the vapor chamber 11 along the first plane (such as the xy plane).

[0188] In an example, as shown in the distribution of the vapor chamber 11 and the liquid cooling module, Figure 2 all components (the cooler 121, the heat sink 122, the liquid outlet pipe 123, and the liquid inlet pipe 124) of the liquid cooling module are arranged around the periphery of the second end 11b, the third end 11c, and the fourth end 11d of the vapor chamber 11 along the first plane (such as the xy plane), and the periphery of the first end 11a of the vapor chamber 11 does not have other components. Here, the first end region of the vapor chamber 11 is the region including the second end 11b, the third end 11c, and the fourth end 11d of the vapor chamber 11, in other words, the first end region of the vapor chamber 11 is a partial region of the vapor chamber 11 except for the first end 1121 of the condensation region 112 (which is an example of at least a partial end region), and in this example, the at least partial end region of the condensation region 112 is the region including the first end 1121 of the condensation region 112, which is a partial end region of the condensation region 112.

[0189] In another example, all components (the cooler 121, the heat sink 122, the liquid outlet pipe 123, and the liquid inlet pipe 124) of the liquid cooling module are arranged around the periphery of the second end 11b and the third end 11c of the vapor chamber 11 along the first plane (such as the xy plane), and the periphery of the first end 11a and the fourth end 11d of the vapor chamber 11 does not have other components. Here, the first end region of the vapor chamber 11 is the region including the second end 11b and the third end 11c of the vapor chamber 11, in other words, the first end region of the vapor chamber 11 is a partial region of the vapor chamber 11 except for the first end 1121 of the condensation region 112 (which is an example of at least a partial end region). The specific description of the related structure can be referred to the description of Figure 6 and Figure 7 .

[0190] In the second arrangement, the heat plate 11 and the partial region of the liquid cooling module are arranged in a stacked manner, in which case, some components (such as the heat sink 122, the liquid outlet pipe 123, and the liquid inlet pipe 124) of the liquid cooling module are arranged in a circumferential manner along the first plane (such as the xy plane) around the periphery of the first end region of the heat plate 11, and the other components are arranged on one side of the heat plate 11 in the third direction (such as the z direction), i.e., the other components are arranged in a stacked manner with the heat plate 11.

[0191] In an example, some components (such as the heat sink 122, the liquid outlet pipe 123, and the liquid inlet pipe 124) of the liquid cooling module are arranged in a circumferential manner along the first plane (such as the xy plane) around the periphery of the second end 11b and the third end 11c of the heat plate 11, and the periphery of the first end 11a and the fourth end 11d of the heat plate 11 is not provided with other components, and the cooler 121 can be arranged on one side of the heat plate 11 in the third direction (such as the z direction) (i.e., the cooler 121 is arranged in a stacked manner with the heat plate 11), for example, the cooler 121 can be arranged on one side of the fourth end 11d of the heat plate 11 in the third direction (such as the z direction), or the cooler 121 can be arranged on one side of the second end 11b of the heat plate 11 in the third direction (such as the z direction). Here, the first end region of the heat plate 11 is the region including the second end 11b and the third end 11c of the heat plate 11, in other words, the first end region of the heat plate 11 is a partial region of the heat plate 11 other than the first end 1121 of the condensation region 112 (i.e., an example of at least a partial region) of the heat plate 11. The specific description of the related structure can be referred to the description below regarding the first arrangement. Figure 12 and Figure 14

[0192] The specific description of the above two arrangements can be referred to the related description below, which will not be described here.

[0193] It should be understood that, regarding the arrangement of the liquid cooling module and the heat plate 11, as long as the description "at least a part of the liquid cooling module is arranged in a circumferential manner along the first plane (such as the xy plane) around the periphery of the first end region of the heat plate 11, and the first end region of the heat plate 11 is at least a partial region of the heat plate 11 other than at least a partial region of the condensation region 112" is met, the embodiments of the present application do not limit the arrangement of the liquid cooling module and the heat plate 11 in any form.

[0194] In implementation, when the heat dissipation device 10 is manufactured, the end of the condensation region 112 of the heat plate 11 is provided with a liquid injection pipe 10a (such as Figure 3 ​As shown by the dashed line, the cooling medium is injected into the heat spreader 11 through the injection pipe 10a. After the cooling medium is injected into the heat spreader 11, the injection pipe 10a is removed, thus completing the fabrication of the heat spreader 11 and the heat dissipation device 10. It can be seen that if the arrangement between the liquid cooling module and the heat spreader 11 is unreasonable (e.g., other components are installed around the condensation zone 112), there will be insufficient space around the condensation zone 112 to open the injection pipe and complete the fabrication of the heat spreader 11 and the heat dissipation device 10. In this embodiment, the heat spreader 11 and the liquid cooling module are arranged reasonably, that is, at least a part of the liquid cooling module is arranged around the first end region of the heat spreader 11 along the first plane (e.g., the xy plane). The first end region of the heat spreader 11 is at least a part of the entire end region of the heat spreader 11 except for at least a part of the end region of the condensation zone 112. In this way, at least a part of the end region of the condensation zone 112 of the heat spreader 11 (e.g., the condensation zone 112) of the heat spreader 11 is at least a part of the end region of the heat spreader 11 except for at least a part of the end region of the condensation zone 112. Figure 3 There are no other components of the heat dissipation device 10 around the first end 1121 of the condensation zone 112 shown, so that at least part of the end area of ​​the condensation zone 112 is exposed to the air, and there is enough space to open the liquid injection pipe. In this way, the cooling medium is injected into the heat spreader 11 through the liquid injection pipe, and the heat spreader 11 and the heat dissipation device 10 are finally completed.

[0195] It should be understood that Figure 2 The liquid injection pipe 10a shown by the dashed line in the heat dissipation device 10 is only to illustrate the position and approximate shape of the liquid injection pipe 10a. The heat dissipation device 10 that is finally manufactured is the heat dissipation device 10 after the liquid injection pipe 10a is removed. That is, the heat dissipation device 10 that is finally manufactured does not have the liquid injection pipe 10a.

[0196] As previously described, the electronic device 100 includes a hot zone and a cold zone. The heat dissipation device 10 is installed after the electronic device. The cooler 121 of the liquid cooling module and the evaporation zone 111 of the vapor chamber 11 are both located in the hot zone of the electronic device. The heat-generating components are disposed on the evaporation zone 111 of the cooler 121 or the vapor chamber 111. The heat sink 122 of the liquid cooling module and the condensation zone 112 of the vapor chamber 11 are both located in the cold zone of the electronic device. In this way, the liquid cooling module and the vapor chamber 11 can dissipate heat from the hot zone of the electronic device 100 and transfer heat to the cold zone of the electronic device 100, thereby enhancing heat conduction within the electronic device 100 and optimizing the temperature uniformity of the electronic device.

[0197] It should be understood that when the heating element is placed in the cooler 121, heat can be transferred to the evaporation zone 111 through the cooler 121, and when the heating element is placed in the evaporation zone 111, heat can be transferred to the cooler 121 through the evaporation zone 111.

[0198] When the power consumption of the heat-generating device is high (referred to as high power consumption), the liquid cooling module and the heat spreader 11 can work together to dissipate heat and achieve good heat dissipation performance. Specifically, the control system in the electronic device activates the drive pump, so the liquid cooling module starts working. The cooler 121 absorbs the heat generated by the heat-generating device, and the low-temperature liquid in the cooler 121 becomes a high-temperature liquid. Under the action of the drive pump 13, the high-temperature liquid flows into the heat sink 122 through the outlet pipe 123. The heat sink 122 dissipates heat and transfers the heat to the cold area of ​​the electronic device. The high-temperature liquid becomes a low-temperature liquid. Under the action of the drive pump 13, the low-temperature liquid flows back into the cooler 121 through the inlet pipe 124, thus completing one heat conduction cycle. At the same time, the evaporation zone 111 of the heat spreader 11 is also affected by the heat of the heating device, causing the liquid cooling medium inside to turn into steam (gas phase cooling medium). The steam is transferred to the condensation zone 112 through the steam chamber structure. After releasing heat in the condensation zone 112, the steam condenses into liquid. The liquid then returns to the evaporation zone 111 with the help of the capillary force generated by the capillary structure, thus completing one heat conduction cycle.

[0199] When the power consumption of the heat-generating device is low (hereinafter referred to as low power consumption), heat dissipation can be achieved through the heat spreader 11 or the liquid cooling module. For example, since the heat spreader 11 consumes little energy, from an energy-saving perspective, the heat spreader 11 is used for heat dissipation when the power consumption is low. In this case, the drive pump 13 does not start and the liquid cooling module does not work.

[0200] It should be understood that in the above-mentioned heat dissipation device 10, if heat dissipation is carried out through the heat dissipation plate 11 when the power consumption is low, the heat-generating device needs to be placed on the evaporation area 111 of the heat dissipation plate 11. If heat dissipation is carried out through the liquid cooling module when the power consumption is low, the heat-generating device needs to be placed on the cooler 121.

[0201] The heat dissipation device 10 integrating a heat spreader 11 and a liquid cooling module provided in this application embodiment can work synergistically with the heat spreader 11 and the liquid cooling module at high power, thereby improving the heat dissipation performance and temperature uniformity of the heat dissipation device 10. This can well meet the heat dissipation and temperature uniformity requirements of highly intelligent electronic devices such as mobile phones and tablets. Especially under the requirement of ultra-thin electronic devices and heat spreader 11, in order to achieve better heat dissipation and temperature uniformity, long-distance heat transfer is often required, which requires larger vapor channels 114 and capillary channels 113. The heat dissipation device 10 of this application, in which the heat spreader 11 and the liquid cooling module work together to achieve high heat transfer, solves the conflict between the ultra-thin design of heat spreader 11 and the requirement of long-distance heat transfer. That is, under the ultra-thin design of heat spreader 11 and the requirement of long-distance heat transfer, the heat dissipation device 10 integrating heat spreader 11 and liquid cooling module has good heat dissipation performance and temperature uniformity, which meets the ultra-thin design of electronic devices and heat spreader 11 and the high requirements of electronic devices for heat dissipation performance. Furthermore, the heat spreader 11 and the liquid cooling module are rationally arranged such that at least a portion of the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (e.g., the xy plane). The first end region of the heat spreader 11 is at least a portion of the entire end region of the heat spreader 11, excluding at least a portion of the end region of the condensation zone 112. Thus, at least a portion of the end region of the condensation zone 112 of the heat spreader 11 (e.g., the xy plane) is arranged around the periphery of the first end region of the heat spreader 11. Figure 2 There are no other components of the heat dissipation device 10 around the first end 1121 of the condensation zone 112 shown. At least a part of the end area of ​​the condensation zone 112 is exposed to the air. Since there are no other components around the at least part of the end area of ​​the condensation zone 112 exposed to the air, there is enough space to open a liquid injection pipe on the at least part of the end area of ​​the condensation zone 112 to inject the cooling medium into the heat spreader 11, and finally complete the fabrication of the heat spreader 11 and the heat dissipation device 10.

[0202] The following is a detailed description of the two arrangements of the heat spreader 11 and the liquid cooling module.

[0203] First arrangement method

[0204] In the first arrangement, the heat spreader 11 and the liquid cooling module are arranged side by side on a first plane (such as the xy plane). Specifically, all components of the liquid cooling module (cooler 121, radiator 122, liquid outlet pipe 123 and liquid inlet pipe 124) are arranged around the periphery of the first end region of the heat spreader 11 along the first plane (such as the xy plane). The first end region is at least a portion of the end regions of the heat spreader 11, excluding at least a portion of the end regions of the condensation zone 112.

[0205] refer to Figure 4 and Figure 5The heat dissipation device 10 includes a first cover plate 101 and a second cover plate 102. The first cover plate 101 and the second cover plate 102 are connected to form a closed cavity. The closed cavity can prevent the leakage of internal liquid (cooling medium in the heat spreader 11 and cooling medium in the liquid cooling module). The main structure of the heat spreader 11 and the liquid cooling module is formed inside the cavity. The main structure of the heat spreader 11 includes, but is not limited to, capillary structure and vapor chamber structure. The main structure of the liquid cooling module includes, but is not limited to, the channel of the cooler 121, the channel of the radiator 122, the channel of the liquid outlet pipe 123, and the channel of the liquid inlet pipe 124. The main structure of the heat spreader 11 and the main structure of the liquid cooling module are both located between the first cover plate 101 and the second cover plate 102. The plane on which the first cover plate 101 or the second cover plate 102 is distributed is parallel to the first plane (such as the xy plane). Thus, the main structure of the heat spreader 11 and the main structure of the liquid cooling module are arranged side by side on the first plane. Since the first cover plate 101 and the second cover plate 102 are the shells shared by the liquid cooling module and the heat spreader 11, the structure inside the cavity between the first cover plate 101, the second cover plate 102 and the first cover plate 101 and the second cover plate 102 is formed as a whole into the heat spreader 11 and the liquid cooling module. Therefore, the heat spreader 11 and the liquid cooling module are arranged side by side on the first plane.

[0206] It should be understood that, for the heat spreader 11, the area of ​​the first cover plate 101 and the second cover plate 102 located in the heat spreader 11 forms the shell of the heat spreader 11. Based on this, the area of ​​the first cover plate 101 and the second cover plate 102 located in the heat spreader 11, as well as the structure of the cavities within that area (the main structure of the heat spreader 11, such as capillary structures and vapor chamber structures), forms the heat spreader 11. For the liquid cooling module, the area of ​​the first cover plate 101 and the second cover plate 102 located in the liquid cooling module forms the shell of the liquid cooling module. Based on this, the area of ​​the first cover plate 101 and the second cover plate 102 located in the liquid cooling module, as well as the structure of the cavities within that area (the main structure of the liquid cooling module, such as the channels of the cooler 121, the channels of the radiator 122, the channels of the outlet pipe 123, and the channels of the inlet pipe 124), forms the liquid cooling module. Furthermore, a drive pump 13 can be disposed on the first cover plate 101 (e.g., Figure 4 The embodiments of this application do not limit the scope of the application to the second cover plate 102 (not shown in the figure).

[0207] In some embodiments, the main structure of the heat spreader 11 (e.g., capillary structure and vapor chamber structure) and the channels of the cooler 121, radiator 122, outlet pipe 123 and inlet pipe 124 of the liquid cooling module can be integrally formed on the second cover plate 102. For example, the main structure of the heat spreader 11 and the various channels of the liquid cooling module can be etched on the second cover plate 102. The relevant channels may not be provided on the first cover plate 101. The first cover plate 101 and the second cover plate 102 are connected relative to each other. For example, they can be sealed by welding, so that the channels of the cooler 121, radiator 122, outlet pipe 123 and inlet pipe 124 form the cooler 121, radiator 122, outlet pipe 123 and inlet pipe 124 in the heat dissipation device 10, and the main structure of the heat spreader 11 forms the heat spreader 11 in the heat dissipation device 10, thus forming the heat dissipation device 10 integrating the heat spreader 11 and the liquid cooling module. In this embodiment, reference Figure 5 The heating element 20 is disposed on the second cover plate 102. For example, it can be disposed on the second cover plate 102 in the part located in the evaporation zone 111 or the part of the cooler 121.

[0208] In other embodiments, one of the first cover plate 101 and the second cover plate 102 (e.g., the second cover plate 102) can be integrally formed with the channels of the cooler 121, the radiator 122, the outlet pipe 123, and the inlet pipe 124 of the liquid cooling module. The other of the first cover plate 101 and the second cover plate 102 (e.g., the first cover plate 101) is integrally formed with the main structure of the heat spreader 11 (e.g., capillary structure and vapor chamber structure). The first cover plate 101 and the second cover plate 102 are connected relative to each other, for example, by welding to seal the connection, so that the channels of the cooler 121, the radiator 122, the outlet pipe 123, and the inlet pipe 124 form the cooler 121, the radiator 122, the outlet pipe 123, and the inlet pipe 124 in the heat dissipation device 10, and the main structure of the heat spreader 11 forms the heat spreader 11 in the heat dissipation device 10, thus forming a heat dissipation device 10 that integrates the heat spreader 11 and the liquid cooling module.

[0209] In some embodiments, the first cover plate 101 and the second cover plate 102 may be made of copper, but are not limited thereto. The first cover plate 101 and the second cover plate 102 may also be made of copper alloy, stainless steel, titanium or titanium alloy, aluminum and aluminum alloy, etc.

[0210] In some embodiments, the first cover plate 101 and the second cover plate 102 can be connected by high-temperature hard welding. It is understood that the connection method of the first cover plate 101 and the second cover plate 102 is not limited to this.

[0211] In this embodiment of the application, for example, the liquid outlet pipe 123 and the liquid inlet pipe 124 are both located on the same side of the heat spreader 11, and the cooler 121 and the radiator 122 can be flexibly arranged.

[0212] In the above embodiment, the liquid outlet pipe 123 and the liquid inlet pipe 124 are located on the same side of the heat spreader 11, which reduces the space occupied by the pipes on one side of the heat spreader 11. This allows for a more reasonable arrangement of the cooler 121 and the radiator 122, reserving more space for the condensation zone 112 of the heat spreader 11. It also avoids placing other components around at least a portion of the end area of ​​the condensation zone 112, facilitating the injection of coolant into the heat spreader 11 through the injection port located at the end of the condensation zone 112. Furthermore, the above structural layout is compact and occupies little space, which is beneficial for the arrangement of the heat dissipation device 10 within electronic devices and is very suitable for electronic devices with limited internal space.

[0213] In some embodiments, reference Figure 2 The liquid outlet pipe 123 and the liquid inlet pipe 124 are both located on one side of either end of the heat spreader 11 along the second direction (x direction). Either end of the heat spreader 11 along the second direction can be either the first end 11a or the second end 11b of the heat spreader 11.

[0214] In the above embodiment, the liquid outlet pipe 123 and the liquid inlet pipe 124 extend along a first direction (e.g., the y-direction), in the same direction as the length of the heat spreader 11. It can be understood that because the liquid outlet pipe 123 and the liquid inlet pipe 124 extend along the length of the heat spreader 11, the longer pipes facilitate liquid flow. Furthermore, since the evaporation zone 111 and the condensation zone 112 are distributed along the first direction (y-direction), the flow direction of the liquid in the liquid outlet pipe 123 and the liquid inlet pipe 124 is the same as the flow direction of the liquid and gas in the heat spreader 11. This unidirectional flow of the medium reduces unnecessary heat exchange losses and improves heat dissipation performance.

[0215] In embodiments where both the outlet pipe 123 and the inlet pipe 124 are located on one side of either end of the heat spreader 11 along the second direction (x direction), in some embodiments, reference is made to... Figure 2 The outlet pipe 123 is located between the heat spreader 11 and the inlet pipe 124. That is, the outlet pipe 123 is closer to the heat spreader 11 than the inlet pipe 124.

[0216] Because the multiple capillary channels 113 of the capillary structure and the multiple steam channels 114 of the steam chamber structure are arranged alternately, the overall temperature inside the heat spreader 11 is relatively high. By placing the liquid outlet pipe 123 used to transfer high-temperature liquid in the liquid cooling module closer to the heat spreader 11, the temperature difference between the high-temperature liquid in the liquid outlet pipe 123 and the temperature inside the heat spreader 11 is reduced. This reduces the heat exchange loss between the heat spreader 11 and the liquid cooling module, thereby improving the heat dissipation performance of the entire heat dissipation device 10 and making the temperature uniformity of the heat dissipation device 10 better.

[0217] Of course, in other embodiments, the inlet pipe 124 is disposed between the heat spreader 11 and the outlet pipe 123. That is, the inlet pipe 124 is closer to the heat spreader 11 than the outlet pipe 123. The heat dissipation performance of this structure is slightly worse than that of the above embodiment, but it can still improve the heat dissipation performance.

[0218] For ease of description, the distribution of the liquid cooling module and the heat exchanger 11 will be described in detail below, taking as an example that both the liquid outlet pipe 123 and the liquid inlet pipe 124 are located on one side of the second end 11b of either end of the heat exchanger 11 along the second direction (x direction), and taking as an example that the liquid outlet pipe 123 is disposed between the heat exchanger 11 and the liquid inlet pipe 124.

[0219] In some embodiments, reference Figure 2 The liquid outlet pipe 123 and the liquid inlet pipe 124 are both disposed on one side of the second end 11b of the heat spreader 11 distributed along the second direction (x direction). The cooler 121 and the radiator 122 are respectively disposed on both sides of the two ends of the heat spreader 11 distributed along the first direction (y direction). For example, the cooler 121 is disposed on one side of the fourth end 11d of the heat spreader 11 distributed along the first direction (y direction), and the cooler 121 is disposed adjacent to the evaporation zone 111. The fourth end 11d of the heat spreader 11 has the evaporation zone 111. The radiator 122 is disposed on one side of the third end 11c of the heat spreader 11 distributed along the first direction (y direction), and the radiator 122 is disposed adjacent to the condensation zone 112. The third end 11c of the heat spreader 11 has the condensation zone 112.

[0220] As can be seen, in this embodiment, the liquid cooling module is arranged around the periphery of the heat spreader 11 on three sides, and there are no other components around the first end 11a of the heat spreader 11. In conjunction with the above description, the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a (i.e., the second end 11b, the third end 11c, and the fourth end 11d). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, it can also be said that the first end region of the heat spreader 11 is the part of the entire end region of the heat spreader 11 excluding the first end 1121 of the condensation zone 112.

[0221] Figure 6 This is a cross-sectional view of another structure of the heat dissipation device provided in the embodiments of this application in the xy plane. Figure 7 yes Figure 6 A schematic diagram showing the flow direction of the working fluid.

[0222] In other embodiments, reference is made to... Figure 6 andFigure 7 The cooler 121, the liquid outlet pipe 123, and the liquid inlet pipe 124 are all disposed on one side of the second end 11b of the heat spreader 11 distributed along the second direction (x direction). The cooler 121 is disposed adjacent to the evaporation zone 111, and the evaporation zone 111 is distributed on the second end 11b of the heat spreader 11. The radiator 122 is disposed on one side of one end of the heat spreader 11 distributed along the first direction (y direction). For example, the radiator 122 is disposed on one side of the third end 11c of the heat spreader 11 distributed along the first direction (y direction). The radiator 122 is disposed adjacent to the condensation zone 112, and the condensation zone 112 is distributed on the third end 11c of the heat spreader 11.

[0223] As can be seen, in this embodiment, the liquid cooling module is arranged around the periphery of the heat spreader 11 on both sides, and there are no other components around the first end 11a and the fourth end 11d of the heat spreader 11. In conjunction with the above description, the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a and the fourth end 11d (i.e., the second end 11b and the third end 11c). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, it can also be said that the first end region of the heat spreader 11 is the part of the entire end region of the heat spreader 11 excluding the first end 1121 of the condensation zone 112.

[0224] In this embodiment, reference Figure 6 The projection of drive pump 13 is located in region 10b, which is located between coolers 121. Specifically, refer to... Figure 7The cooler 121 includes two pipe sections. The section closer to the inlet pipe 124 is designated as the first pipe section 1211, and the section closer to the outlet pipe 123 is designated as the second pipe section 1212. The first pipe section 1211 is connected to the inlet pipe 124, and the second pipe section 1212 is connected to the outlet pipe 123. One end of the drive pump 13 is connected to the inlet pipe 124 through the first pipe section 1211 of the cooler 121, and the other end is connected to the outlet pipe 123 through the second pipe section 1212 of the cooler 121. In an embodiment where the heat dissipation device 10 includes two drive pumps 13 (drive pump 13a and drive pump 13b), a first opening 1201a and a second opening 1202a connecting drive pump 13a are provided between the two pipe sections, as are a first opening 1201b and a second opening 1202b connecting drive pump 13b. For drive pump 13a, the cryogenic liquid from inlet pipe 124 flows into the first pipe 1211 of cooler 121 and then into drive pump 13a through the first opening 1201a. Drive pump 13a pressurizes the liquid and then the pressurized liquid flows into the second pipe 1212 of cooler 121 through the second opening 1202a. The cryogenic liquid in cooler 121 absorbs heat and becomes a high-temperature liquid, which is then discharged to outlet pipe 123. Similarly, for drive pump 13b, the cryogenic liquid from inlet pipe 124 flows into the first pipe 1211 of cooler 121 and then into drive pump 13b through the first opening 1201b. Drive pump 13b pressurizes the liquid and then the pressurized liquid flows into the second pipe 1212 of cooler 121 through the second opening 1202b. The cryogenic liquid in cooler 121 absorbs heat and becomes a high-temperature liquid, which is then discharged to outlet pipe 123.

[0225] Figure 8 This is a schematic block diagram of another structure of the heat dissipation device provided in the embodiments of this application. It should be noted that... Figure 8 This is only used to illustrate the positional relationship between the liquid cooling module and the heat spreader 11, and no specific limitations are made regarding the form of the various components or structures in the liquid cooling module and the heat spreader 11. Furthermore, Figure 8 The drive pump 13 is not shown in the figure. The drive pump 13 can be flexibly set according to the actual situation without any limitation.

[0226] In other embodiments, reference is made to... Figure 8The radiator 122, the liquid outlet pipe 123, and the liquid inlet pipe 124 are all disposed on one side of the second end 11b of the heat spreader 11 distributed along the second direction (x direction). The radiator 122 is disposed adjacent to the condensation zone 112, and the condensation zone 112 is distributed at the second end 11b of the heat spreader 11. The cooler 121 is disposed on one side of one end of the heat spreader 11 distributed along the first direction (y direction). For example, the cooler 121 is disposed on one side of the fourth end 11d of the heat spreader 11 distributed along the first direction (y direction). The cooler 121 is disposed adjacent to the evaporation zone 111, and the evaporation zone 111 is distributed at the fourth end 11d of the heat spreader 11.

[0227] As can be seen, in this embodiment, the liquid cooling module is arranged around the periphery of the heat spreader 11 on both sides, and there are no other components around the first end 11a and the third end 11c of the heat spreader 11. Based on the above description, the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a and the third end 11c (i.e., the second end 11b and the fourth end 11d). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, and the third end 11c of the heat spreader 11 includes the third end 1123 of the condensation zone 112, in fact, the third end 1123 of the condensation zone 112 is the third end 11c of the heat spreader 11. Therefore, it can also be said that the first end region of the heat spreader 11 is the part of the entire end region of the heat spreader 11 excluding the first end 1121 and the third end 1123 of the condensation zone 112, and the first end 1121 and the third end 1123 are connected.

[0228] It should be understood that the distribution of the liquid cooling module and the heat spreader in the first arrangement of the above example is only illustrative and should not be construed as limiting the embodiments of this application. In implementation, the liquid cooling module and the heat spreader can be flexibly arranged based on the actual situation.

[0229] As mentioned above, the heating element is disposed on the evaporation zone 111 of the heat spreader 11 or the cooler 121. For ease of description, the area on the heat dissipation device 10 where the heating element is disposed can be simply referred to as the heat source area of ​​the heat dissipation device 10 (e.g., Figures 2 to 6 The heat source region (shown) is equipped with a heating device and includes at least a portion of the cooler 121 and / or at least a portion of the evaporation region 111. For example, if the heating device is disposed in the evaporation region 111, the heat source region may include part or all of the evaporation region 111; exemplaryly, the heat source region may also include part or all of the cooler 121. As another example, if the heating device is disposed on the cooler 121, the heat source region may include part or all of the cooler 121; exemplaryly, the heat source region may also include part or all of the evaporation region 111. (See reference...) Figures 2 to 6The heat source area of ​​the heat dissipation device 10 includes the entire area of ​​the evaporation zone 111 and the cooler 121.

[0230] In practice, the heating element is specifically positioned on the cover plate of the heat source area. For example, the cover plate of the heat source area is the portion of the second cover plate 102 located in the heat source area. The second cover plate 102 includes the cover plate of the heat source area, and the heating element is positioned on the portion of the second cover plate 102 located in the heat source area. When the heating element is positioned in the evaporation zone 111, heat can be transferred from the evaporation zone 111 to the cooler 121 through the cover plate of the heat source area. When the heating element is positioned in the cooler 121, heat can be transferred from the cooler 121 to the evaporation zone 111 through the cover plate of the heat source area. Generally, the cover plate (such as the second cover plate 102) is relatively thin (e.g., thickness greater than or equal to 0.03 mm and less than or equal to 0.1 mm), resulting in poor overall thermal conductivity, especially in the heat source area. Heat cannot be effectively transferred between the evaporation zone 111 and the cooler 121 through the cover plate, which to some extent affects the overall heat dissipation performance.

[0231] Based on this, in the first arrangement described above, the thickness of the cover plate in the heat source area can be increased. That is, the thickness of the cover plate in the heat source area is greater than the thickness of the remaining areas of the cover plate (such as the second cover plate 102) to improve the thermal conductivity of the heat source area. It should be understood that the increased thickness of the cover plate in the heat source area can be flexibly designed according to actual conditions (such as the required heat dissipation). Theoretically, within a certain range, the greater the increase in thickness, the better the thermal conductivity. For example, the increased thickness of the cover plate in the heat source area is greater than or equal to 0.02 mm and less than or equal to 0.5 mm. For instance, the increased thickness of the cover plate in the heat source area can be 0.03 mm, 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.45 mm, etc.

[0232] Figure 9 This is a schematic structural diagram of another structure of the heat dissipation device provided in the embodiments of this application.

[0233] refer to Figure 9 Taking the portion of the second cover plate 102 located in the heat source area as an example, in implementation, a plate (referred to as the third cover plate 103) is fixed (e.g., welded) to one side of the portion of the second cover plate 102 located in the heat source area. The heating device 20 is disposed (e.g., attached) on the third cover plate 103. It should be understood that the thickness of the cover plate added to the heat source area is the same as the thickness of the third cover plate 103, and after adding the third cover plate 103, the thickness of the cover plate in the heat source area is the sum of the thickness of the portion of the second cover plate 102 located in the heat source area and the thickness of the third cover plate 103.

[0234] In the above embodiment, by providing a third cover plate 103 on one side of the area located in the heat source region of the second cover plate 102, and the heating device is disposed on the third cover plate 103, the added fourth cover plate 104 is equivalent to increasing the thickness of the cover plate in the heat source region. That is, the thickness of the cover plate in the heat source region is the sum of the thickness of the area located in the heat source region of the second cover plate 102 and the thickness of the third cover plate 103. In this way, the cover plate in the heat source region with increased thickness can increase the heat conduction area of ​​the heat source region, which can improve the heat conduction performance of the heat source region, thereby improving the heat dissipation performance of the entire heat dissipation device 10.

[0235] The third cover plate 103 can be made of any thermally conductive material, such as copper or graphite aluminum. However, compared to copper, graphite aluminum has higher thermal conductivity, resulting in better heat dissipation and better temperature uniformity.

[0236] by Figure 9 Taking the heat dissipation device 10 shown as an example, the third cover plate 103 is made of graphite aluminum, and the heat-generating device 20 is disposed on the third cover plate 103. Under the condition that other structural parameters remain unchanged, compared to... Figures 2 to 5 The structure of the heat dissipation device 10 without the addition of the third cover plate 103 can reduce the temperature difference of the entire plate by about 1.95℃ and the temperature difference of the heat source area by about 1.8℃, significantly improving the uniformity and stability of the entire plate.

[0237] Second arrangement method

[0238] In the second arrangement, the heat spreader 11 and a portion of the liquid cooling module (referred to as the first portion) are arranged side-by-side on a first plane (e.g., the x-plane). Specifically, the first portion of the liquid cooling module (e.g., cooler 121, radiator 122, outlet pipe 123, and inlet pipe 124) is arranged around the periphery of the first end region of the heat spreader 11 along the first plane (e.g., the xy-plane). The other portion of the heat spreader 11 and the liquid cooling module (referred to as the second portion) are stacked along a third direction (the thickness direction of the heat spreader 11, e.g., the z-direction). Specifically, the second portion of the liquid cooling module is located on one side of the heat spreader 11 along the third direction (the thickness direction of the heat spreader 11, e.g., the z-direction). It can be understood that since the heat spreader 11 and the first portion of the liquid cooling module are arranged side-by-side, and the heat spreader 11 and the second portion of the liquid cooling module are stacked, the first and second portions of the liquid cooling module are also stacked.

[0239] The second arrangement described above allows for flexible spatial arrangement of the various components of the liquid cooling module based on actual conditions. For example, if there is insufficient space in the xy plane, or to reserve more space for the liquid injection pipe in the condensation zone 112, or to improve the thermal conductivity of the heat source zone, the heat dissipation device 10 can be adapted to more scenarios. Furthermore, since only a portion of the liquid cooling module (i.e., the second portion) occupies space in the thickness direction of the heat dissipation device 10, most areas of the heat dissipation device 10 occupy less space in the thickness direction while maintaining the ultra-thin requirement of the heat spreader 11, thus also maintaining the overall ultra-thin requirement of the heat dissipation device 10 as much as possible.

[0240] It should be understood that the second part may include any combination of the cooler 121, the radiator 122, the liquid outlet pipe 123, and the liquid inlet pipe 124. This application embodiment does not impose any limitations. The first part is the portion of the liquid cooling module other than the first part. For example, the second part of the liquid cooling module may include the cooler 121. As another example, the second part of the liquid cooling module may include the radiator 122. As yet another example, the second part of the liquid cooling module may include the liquid outlet pipe 123 and the liquid inlet pipe 124.

[0241] The following, combined with Figures 10 to 17 The second arrangement of the heat spreader 11 and the liquid cooling module is described in detail.

[0242] Figure 10 This is a schematic structural diagram of another structure of the heat dissipation device provided in the embodiments of this application. Figure 11 yes Figure 10 A schematic structural diagram of the heat dissipation device from another angle. Figure 12 yes Figure 10 The heat dissipation device is shown in cross-sectional view in the xy plane. Figure 13 yes Figure 10 Another cross-sectional view of the heat dissipation device in the xy plane. Figure 14 From Figure 12 The cross-sectional view shows a perspective view separating the capillary structure and the vapor chamber structure. Figure 14 The outline of the invisible fourth cover plate 104 and the cooler 121 mounted on the fourth cover plate 104 is shown in dashed lines. It should be understood that, for the sake of brevity... Figure 11 The schematic diagram of drive pump 13 is a schematic of drive pump after removing the flexible circuit board, and does not represent the actual structural form of drive pump 13.

[0243] refer to Figure 10 and Figure 11The heat dissipation device 10 includes a first cover plate 101, a second cover plate 102, and a fourth cover plate 104 arranged sequentially along a third direction. The first cover plate 101 and the second cover plate 102 are connected to form a closed cavity, and the second cover plate 102 and the fourth cover plate 104 are connected to form a closed cavity. The closed cavity can prevent the leakage of internal liquid (cooling medium in the heat spreader 11 and cooling medium in the liquid cooling module). The main structure of the heat spreader 11 and the main structure of the first part of the liquid cooling module are formed in the cavity between the first cover plate 101 and the second cover plate 102, and the main structure of the second part of the liquid cooling module is formed in the cavity between the second cover plate 102 and the fourth cover plate 104.

[0244] refer to Figures 12 to 14 The second part of the liquid cooling module includes a cooler 121 (such as...). Figure 13 and Figure 14 In the embodiment shown, the first part of the liquid cooling module includes a heat sink 122, a channel for the liquid outlet pipe 123, and a liquid inlet pipe 124 (as shown). Figure 12 and Figure 14 As shown), the main structure of the second part includes the channel of the cooler 121, and the main structure of the first part includes the channel of the radiator 122, the channel of the liquid outlet pipe 123, and the channel of the liquid inlet pipe 124. The main structure of the heat spreader 11 includes, but is not limited to, capillary structure and steam chamber structure.

[0245] Continue to refer to Figures 12 to 14 The main structure of the heat spreader 11 and the main structure of the first part of the liquid cooling module are both located between the first cover plate 101 and the second cover plate 102. The plane on which the first cover plate 101 or the second cover plate 102 is distributed is parallel to the first plane (such as the xy plane). Thus, the main structure of the heat spreader 11 and the main structure of the first part of the liquid cooling module are arranged side by side on the first plane. Since the first cover plate 101 and the second cover plate 102 are the shells shared by the first part of the liquid cooling module and the heat spreader 11, the structure inside the cavity between the first cover plate 101, the second cover plate 102 and the first cover plate 101 and the second cover plate 102 is formed as a whole to form the heat spreader 11 and the first part of the liquid cooling module. Therefore, the heat spreader 11 and the first part of the liquid cooling module are arranged side by side on the first plane. The main structure of the second part of the liquid-cooled module is located between the second cover plate 102 and the fourth cover plate 104. A portion of the second cover plate 102 and the fourth cover plate 104 form the shell of the second part of the liquid-cooled module. The portion of the second cover plate 102, the fourth cover plate 104, and the main structure of the second part of the liquid-cooled module between them constitute the second part of the liquid-cooled module. Specifically, on the projection of the first plane, the projection of a portion of the second cover plate 102 coincides with the projection of the fourth cover plate 104.

[0246] As can be seen, since the first cover plate 101, the second cover plate 102 and the fourth cover plate 104 are arranged sequentially along a third direction (such as the z direction), and the structure of the first cover plate 101, the second cover plate 102 and the cavity between them is formed as a whole into the heat spreader 11 and the first part of the liquid cooling module, and a part of the second cover plate 102, the fourth cover plate 104 and the main structure of the second part of the liquid cooling module between them are formed into the second part of the liquid cooling module, the second part of the liquid cooling module and the heat spreader 11 are stacked along a third direction (such as the z direction), and the second part of the liquid cooling module and the first part of the liquid cooling module are also stacked along a third direction (such as the z direction).

[0247] Furthermore, the drive pump 13 can be disposed on the first cover plate 101 or the second cover plate 102 (e.g., Figure 11 As shown in the figure, the embodiments in this application are not limited in any way.

[0248] In some embodiments, the main structure of the heat spreader 11 (e.g., capillary structure and vapor chamber structure) and the main structure of the first part of the liquid cooling module (e.g., the channel of the radiator 122, the channel of the liquid outlet pipe 123, and the channel of the liquid inlet pipe 124) can be integrally formed on the second cover plate 102. For example, the main structure of the heat spreader 11 and the main structure of the first part of the liquid cooling module can be etched on the second cover plate 102. The relevant channels may not be provided on the first cover plate 101. The first cover plate 101 and the second cover plate 102 are connected relative to each other. For example, they can be sealed by welding, so that the main structure of the first part of the liquid cooling module forms the first part of the liquid cooling module in the heat dissipation device 10, and the main structure of the heat spreader 11 forms the heat spreader 11 in the heat dissipation device 10. The main structure of the second part of the liquid cooling module (such as the channel of the cooler 121) can be integrally formed on the fourth cover plate 104. For example, the main structure of the second part of the liquid cooling module can be etched on the fourth cover plate 104, and the fourth cover plate 104 and the second cover plate 102 can be connected opposite each other on the side away from the first cover plate 101. For example, they can be sealed by welding, so that the main structure of the second part of the liquid cooling module forms the second part of the liquid cooling module in the heat dissipation device 10. Thus, the heat dissipation device 10 integrating the heat spreader 11 and the liquid cooling module is finally formed.

[0249] In some embodiments, the first cover plate 101, the second cover plate 102 and the fourth cover plate 104 may be made of copper, but are not limited thereto. The first cover plate 101, the second cover plate 102 and the fourth cover plate 104 may also be made of copper alloy, stainless steel, titanium or titanium alloy, tungsten or tungsten alloy, chromium or chromium alloy, etc.

[0250] In some embodiments, the first cover plate 101 and the second cover plate 102 can be connected by high-temperature hard welding, and the second cover plate 102 and the fourth cover plate 104 can be connected by high-temperature hard welding. It is understood that the connection method of the first cover plate 101 and the second cover plate 102, and the second cover plate 102 and the fourth cover plate 104 is not limited to this.

[0251] It should be understood that the arrangement of a fourth cover plate 104 on one side of the second cover plate 102 and the formation of a second portion of the liquid-cooled module based on the fourth cover plate 104 and the second cover plate 102 are merely illustrative. In other embodiments, a fourth cover plate 104 is arranged on one side of the first cover plate 101, and a second portion of the liquid-cooled module is formed based on the first cover plate 101 and the fourth cover plate 104.

[0252] As mentioned above, the second part of the liquid cooling module may include any combination of the cooler 121, the radiator 122, the liquid outlet pipe 123 and the liquid inlet pipe 124. This application embodiment does not make any limitation. The first part of the liquid cooling module is the part of the liquid cooling module other than the first part.

[0253] In some embodiments (referred to as Embodiment 1), the first part of the liquid cooling module includes a heat sink 122, an outlet pipe 123 and an inlet pipe 124, and correspondingly, the second part of the liquid cooling module includes a cooler 121.

[0254] In some other embodiments (referred to as Embodiment 2), the first part of the liquid cooling module includes a cooler 121, an outlet pipe 123 and an inlet pipe 124, and correspondingly, the second part of the liquid cooling module includes a radiator 122.

[0255] In some other embodiments (referred to as Embodiment 3), the first part of the liquid cooling module includes an outlet pipe 123 and an inlet pipe 124, and correspondingly, the second part of the liquid cooling module includes a cooler 121 and a radiator 122.

[0256] The following description, using the three embodiments described above as examples, further illustrates the arrangement of the liquid cooling module and the heat spreader 11.

[0257] Example 1

[0258] The first part of the liquid cooling module includes a heat sink 122, an outlet pipe 123 and an inlet pipe 124, and the second part of the liquid cooling module includes a cooler 121.

[0259] In some embodiments, reference Figure 12 and Figure 14 The outlet pipe 123 and the inlet pipe 124 are both located on the same side of the heat spreader 11. For example, the outlet pipe 123 and the inlet pipe 124 are both located at either end of the heat spreader 11 along the second direction (x direction). Figure 2 and Figure 14The second end 11b) shown is located on one side, wherein either end of the heat spreader 11 along the second direction (x direction) can be either the first end 11a or the second end 11b of the heat spreader 11. A radiator 122 is disposed on one side of the third end 11c of the heat spreader 11 along the first direction (y direction), and the radiator 122 is disposed adjacent to the condensation zone 112, which is distributed at the third end 11c of the heat spreader 11. A cooler 121 is disposed on one side of the heat spreader 11 along the third direction (z direction), and the cooler 121 is disposed adjacent to the evaporation zone 111. It can be understood that the cooler 121 and the evaporation zone 111 are stacked in the third direction (e.g., the z direction). For example, refer to... Figure 14 In the projection of the heat dissipation device 10 onto the first plane (such as the xy plane), the projection of the cooler 121 is located on one side of the projection of the liquid outlet pipe 123 (or the projection of the liquid inlet pipe 124) in the first direction (such as the y direction).

[0260] As can be seen, in this embodiment, the first part of the liquid cooling module is arranged around the periphery of the heat spreader 11 on three sides, and there are no other components around the first end 11a of the heat spreader 11. In conjunction with the above description, the first part of the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a (i.e., the second end 11b, the third end 11c, and the fourth end 11d). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, it can also be said that the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 1121 of the condensation zone 112.

[0261] Since the cooler 121 is stacked with the liquid outlet pipe 123, liquid inlet pipe 124, and radiator 122 of the liquid cooling module, in order to facilitate the delivery of the cooling medium, refer to Figure 14 The inlet pipe 124 has a first connecting pipe 1241 at one end near the cooler 121, and the outlet pipe 123 has a second connecting pipe 1231 at one end near the cooler 121. Both the first connecting pipe 1241 and the second connecting pipe 1231 are connected to the cooler 121. High-temperature liquid flowing out of the cooler 121 can be discharged to the outlet pipe 123 through the second connecting pipe 1231, and low-temperature liquid flowing out of the inlet pipe 124 can flow into the cooler 121 through the first connecting pipe 1241. It should be understood that both the first connecting pipe 1241 and the second connecting pipe 1231 extend in a third direction (such as the z-direction) to achieve communication between the outlet pipe 123 and the inlet pipe 124 and the cooler 121, respectively.

[0262] refer to Figure 13 and Figure 14The cooler 121 includes a first pipe 1211 and a second pipe 1212 spaced apart. The first pipe 1211 is connected to the inlet pipe 124 via a first connecting pipe 1241, and the second pipe 1212 is connected to the outlet pipe 123 via a second connecting pipe 1231. The low-temperature liquid flowing out of the inlet pipe 124 can flow into the first pipe 1211 of the cooler 121 through the first connecting pipe 1241, and the high-temperature liquid flowing out of the second pipe 1212 of the cooler 121 can be discharged to the outlet pipe 123 through the second connecting pipe 1231.

[0263] refer to Figure 14 The first part of the liquid cooling module also includes two connecting pipes spaced apart: a first connecting pipe 126 and a second connecting pipe 127. Both the first connecting pipe 126 and the second connecting pipe 127 are connected to the cooler 121. Specifically, the first connecting pipe 126 is connected to the first pipe 1211 of the cooler 121, and the second connecting pipe 127 is connected to the second pipe 1212 of the cooler 121. The first connecting pipe 126 has a first opening 1201 (e.g., 1201a or 1201b) that connects to the inlet of the drive pump 13, and the second connecting pipe 127 has a second opening 1202 (e.g., 1202a or 1202b) that connects to the outlet of the drive pump 13. Liquid flowing out of the first pipe 1211 of the cooler 121 enters the first connecting pipe 126 and flows into the drive pump 13 through the first opening 1201. The drive pump 13 pressurizes the liquid and flows the pressurized liquid into the second connecting pipe 127 through the second opening 1202. Then, the liquid flows to the second pipe 1212 of the cooler 121 through the second connecting pipe 127.

[0264] To connect the cooler 121 to the two connecting pipes, refer to Figure 14 A third connecting pipe 1261 is provided at one end of the first connecting pipe 1211 near the first pipe 1211 of the cooler 121. The first connecting pipe 126 is connected to the first pipe 1211 of the cooler 121 through the third connecting pipe 1261. A fourth connecting pipe 1271 is provided at one end of the second connecting pipe 1212 near the second pipe 1212 of the cooler. The second connecting pipe 127 is connected to the second pipe 1212 of the cooler 121 through the fourth connecting pipe 1271. It should be understood that both the third connecting pipe 1261 and the fourth connecting pipe 1271 extend along a third direction (such as the z-direction). In an embodiment where the heat dissipation device 10 includes two drive pumps (drive pump 13a and drive pump 13b), the first connecting pipe 126 has two first openings: a first opening 1201a connecting the liquid inlet of drive pump 13a and a first opening 1201b connecting the liquid inlet of drive pump 13b. The second connecting pipe 127 has a second opening 1202 connecting the liquid outlet of drive pump 13a and a second opening 1202b connecting the liquid outlet of drive pump 13b. Figure 14The dashed arrows indicate the flow direction of the cooling medium: the low-temperature liquid from the inlet pipe 124 flows into the first pipe 1211 of the cooler 121 through the first connecting pipe 1241, and into the first connecting pipe 126 through the third connecting pipe 1261. For the drive pump 13a, the liquid flows into the drive pump 13a through the first opening 1201a on the first connecting pipe 126. The drive pump 13a pressurizes the liquid and sends the pressurized liquid into the second connecting pipe 127 through the second opening 1202a. For the drive pump 13b, the liquid flows into the drive pump 13b through the first opening 1201b on the first connecting pipe 126. 3b pressurizes the liquid and directs the pressurized liquid into the second connecting pipe 127 through the second opening 1202b, and into the second pipe 1212 of the cooler 121 through the fourth connecting pipe 1271. The low-temperature liquid in the cooler 121 absorbs heat and becomes a high-temperature liquid. The high-temperature liquid is discharged to the outlet pipe 123 through the second connecting pipe 1231. The high-temperature liquid flows into the radiator 122 through the outlet pipe 123. The radiator 122 dissipates heat and transfers heat to the cold area of ​​the electronic device. The high-temperature liquid becomes a low-temperature liquid and flows back into the cooler 121 through the inlet pipe 124, thus completing one heat conduction cycle.

[0265] Continue to refer to Figure 13 In this embodiment, the fourth cover plate 104 may be integrally formed with a channel for the cooler 121. The fourth cover plate 104 and the second cover plate 102 are connected to each other on the side away from the first cover plate 101. For example, they can be sealed together by welding to form the cooler 121.

[0266] In some embodiments, the fourth cover plate 104 is further provided with a plurality of support portions 128, which are spaced apart. The support portions 128 are connected to the side of the second cover plate 102 opposite to the first cover plate 101, and the support portions 128 can provide support for the fourth cover plate 104. For example, at least one support portion 128 is provided on the first pipe 1211 of the cooler 121, and / or at least one support portion 128 is provided on the second pipe 1212 of the cooler 121.

[0267] refer to Figure 12 and Figure 14 The evaporation zone 111 of the cooler 121 and the heat spreader 11 forms the heat source zone of the heat dissipation device 10. The heat-generating device 20 is disposed on the cover plate of the heat source zone. The cover plate of the heat source zone includes the portion of the second cover plate 102 located in the heat source zone and the fourth cover plate 104. (Reference) Figure 11When the heating element 20 is located in the evaporation zone 111, the heating element 20 can be located in the part of the second cover plate 102 located in the evaporation zone 111. Heat is transferred from the evaporation zone 111 to the cooler 121 through the cover plate of the heat source zone. When the heating element 20 is located in the cooler 121 (not shown in the figure), the heating element 20 can be located on the side of the fourth cover plate 104 away from the second cover plate 102. Heat is transferred from the cooler 121 to the evaporation zone 111 through the cover plate of the heat source zone.

[0268] It is understood that, since the cover plate of the heat source area includes the portion of the second cover plate 102 located in the heat source area and the fourth cover plate 104, compared with the embodiment in the first arrangement where the cover plate of the heat source area includes the portion of the second cover plate 102 located in the heat source area, the addition of the fourth cover plate 104 in this embodiment is equivalent to increasing the thickness of the cover plate of the heat source area. In this way, the heat conduction area of ​​the heat source area can be increased, the heat conduction performance of the heat source area can be improved, and thus the heat dissipation performance of the entire heat dissipation device 10 can be improved.

[0269] Figure 15 This is a schematic block diagram of another structure of the heat dissipation device provided in the embodiments of this application. It should be noted that... Figure 15 This is only used to illustrate the positional relationship between the liquid cooling module and the heat spreader 11. No specific limitations are made on the specific form of each component or structure in the liquid cooling module and the heat spreader 11. Please refer to the structural design of each component above. Figure 15 and Figure 14 The main difference is that the position of the cooler 121 has changed.

[0270] refer to Figure 15 The arrangement of the liquid outlet pipe 123, the liquid inlet pipe 124, and the radiator 122 is the same as... Figure 14 Similarly, for a detailed description, please refer to the relevant description above, which will not be repeated here. For the cooler 121, the cooler 121 is disposed on one side of the heat spreader 11 in the third direction (z direction), adjacent to the evaporation zone 111, and the cooler 121 and the evaporation zone 111 are stacked in the third direction (e.g., the z direction). In the projection of the heat dissipation device 10 onto the first plane (e.g., the xy plane), the projections of the cooler 121 and the heat dissipation device 122 are distributed along the first direction (e.g., the y direction).

[0271] In order to achieve the circulation of liquid between cooler 121, inlet pipe 124, outlet pipe 123, and radiator 122, and Figure 14 Similarly, structures such as the first connecting pipe 1241, the second connecting pipe 1231, the first connecting pipe 126, the second connecting pipe 127, the third connecting pipe 1261, and the fourth connecting pipe 1271 can be set up. For a detailed description, please refer to [reference needed]. Figure 14 The relevant descriptions will not be repeated here.

[0272] In addition, Figure 15 In this configuration, the cooler 121 and the evaporation zone 111 are stacked in a third direction to achieve [the desired effect]. Figure 14 Similarly, a fourth cover plate 104 is added to one side of the second cover plate 102, and a channel for the cooler 121 is provided on the fourth cover plate 104. A portion of the second cover plate 102, the fourth cover plate 104, and the channel for the cooler 121 between them form the cooler 121. In this way, the cover plate of the heat source area includes the portion of the second cover plate 102 located in the heat source area and the fourth cover plate 104. Compared with the embodiment in the first arrangement where the cover plate of the heat source area includes the portion of the second cover plate 102 located in the heat source area, the addition of the fourth cover plate 104 in this embodiment is equivalent to increasing the thickness of the cover plate of the heat source area. This increases the heat conduction area of ​​the heat source area, improves the heat conduction performance of the heat source area, and thus improves the heat dissipation performance of the entire heat dissipation device 10.

[0273] Example 2

[0274] The first part of the liquid cooling module includes a cooler 121, an outlet pipe 123 and an inlet pipe 124, and the second part of the liquid cooling module includes a radiator 122.

[0275] Figure 16 This is a schematic block diagram of another structure of the heat dissipation device provided in the embodiments of this application. It should be noted that... Figure 16 This is only used to illustrate the positional relationship between the liquid cooling module and the heat spreader 11. No specific limitations are made on the specific form of each component or structure in the liquid cooling module and the heat spreader 11. Please refer to the structural design of each component above. Figure 16 and Figure 14 The main difference is that the cooler 121 and the heat spreader 11 are arranged side by side, while the radiator 122 and the heat spreader 11 are stacked. The following only discusses... Figure 16 and Figure 14 The differences will be described in detail, while the rest will be described briefly.

[0276] In some embodiments, reference Figure 16Both the liquid outlet pipe 123 and the liquid inlet pipe 124 are located on one side of either end of the heat spreader 11 along the second direction (x direction) (such as the second end 11b shown in 16). Either end of the heat spreader 11 along the second direction (x direction) can be either the first end 11a or the second end 11b of the heat spreader 11. The cooler 121 is disposed on one side of the fourth end 11d of the heat spreader 11 along the first direction (y direction). The cooler 121 is disposed adjacent to the evaporation zone 111, which is distributed at the fourth end 11d of the heat spreader 11. The radiator 122 is disposed on one side of the heat spreader 11 along the third direction (z direction). The radiator 122 is disposed adjacent to the condensation zone 112. It can be understood that the radiator 122 and the condensation zone 112 are stacked in the third direction (e.g., the z direction).

[0277] In one example, reference Figure 16 In the projection of the heat dissipation device 10 onto the first plane (e.g., the xy plane), the projections of the cooler 121 and the heat dissipation device 122 are distributed along the first direction (e.g., the y-direction). In other examples, in the projection of the heat dissipation device 10 onto the first plane (e.g., the xy plane), the projection of the cooler 121 is located on one side of the projection of the liquid outlet pipe 123 (or the projection of the liquid inlet pipe 124) along the first direction (e.g., the y-direction). Figure 16 Not shown in the image, please refer to the following: Figure 14 Related design.

[0278] In order to achieve the circulation of liquid between radiator 122, inlet pipe 124, outlet pipe 123, and radiator 122, and Figure 14 Similarly, structures such as a connecting pipe for connecting the radiator 122 to the liquid inlet pipe 124 and a connecting pipe for connecting the radiator 122 to the liquid outlet pipe 123 can be provided. For details, please refer to [reference needed]. Figure 14 The relevant descriptions will not be repeated here.

[0279] As can be seen, in this embodiment, the first part of the liquid cooling module (cooler 121, liquid outlet pipe 123, and liquid inlet pipe 124) is arranged around the periphery of the heat spreader 11 on both sides, and there are no other components around the first end 11a and the third end 11c of the heat spreader 11. In conjunction with the above description, the first part of the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a and the third end 11c (i.e., the second end 11b and the fourth end 11d). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, it can also be said that the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 1121 of the condensation zone 112.

[0280] Example 3

[0281] The first part of the liquid cooling module includes an outlet pipe 123 and an inlet pipe 124, and the second part of the liquid cooling module includes a cooler 121 and a radiator 122.

[0282] Figure 17 This is a schematic block diagram of another structure of the heat dissipation device provided in the embodiments of this application. It should be noted that... Figure 17 This is only used to illustrate the positional relationship between the liquid cooling module and the heat spreader 11. No specific limitations are made on the specific form of each component or structure in the liquid cooling module and the heat spreader 11. Please refer to the structural design of each component above. Figure 17 and Figure 14 The main difference is that both the cooler 121 and the radiator 122 are stacked on top of the heat spreader 11. The following only discusses... Figure 17 and Figure 14 The differences will be described in detail, while the rest will be described briefly.

[0283] In some embodiments, reference Figure 17 Both the liquid outlet pipe 123 and the liquid inlet pipe 124 are located on one side of either end (such as the second end 11b shown in 17) of the heat spreader 11 along the second direction (x direction). Either end of the heat spreader 11 along the second direction (x direction) can be either the first end 11a or the second end 11b of the heat spreader 11. Both the cooler 121 and the radiator 122 are disposed on one side of the heat spreader 11 along a third direction (z direction). The cooler 121 is disposed adjacent to the evaporation zone 111, and the radiator 122 is disposed adjacent to the condensation zone 112. It can be understood that the cooler 121 and the evaporation zone 111 are stacked in the third direction (e.g., the z direction), and the radiator 122 and the condensation zone 112 are stacked in the third direction (e.g., the z direction). Exemplarily, in the projection of the heat dissipation device 10 onto a first plane (e.g., the xy plane), the projections of the cooler 121 and the radiator 122 are distributed along the first direction (e.g., the y direction).

[0284] As can be seen, in this embodiment, the first part of the liquid cooling module (liquid outlet pipe 123 and liquid inlet pipe 124) is arranged around the periphery of the heat spreader 11 on one side, and there are no other components around the first end 11a, the third end 11c, and the fourth end 11d of the heat spreader 11. In conjunction with the above description, the first part of the liquid cooling module is arranged around the periphery of the first end region of the heat spreader 11 along a first plane (such as the xy plane). In this embodiment, the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 11a, the third end 11c, and the fourth end 11d (i.e., the second end 11b). Since the first end 11a of the heat spreader 11 includes the first end 1121 of the condensation zone 112, it can also be said that the first end region of the heat spreader 11 is the region of all end regions of the heat spreader 11 excluding the first end 1121 of the condensation zone 112.

[0285] The distribution of the liquid cooling module and the heat spreader 11 has been described in detail above. It should be understood that the above embodiments are illustrative and should not be construed as limiting the embodiments of this application. For example, in other embodiments, the liquid outlet pipe 123 and the liquid inlet pipe 124 can be disposed on both sides of the heat spreader 11 along the second direction (e.g., the x-direction), and the radiator 122 is disposed on one side of the heat spreader 11 along the third direction (e.g., the z-direction) and adjacent to the condensation zone 112. That is, the radiator 122 is stacked in the condensation zone 112 along the third direction, and the cooler 121 is disposed at one end of the heat spreader 11 along the first direction (e.g., the y-direction) and adjacent to the evaporation zone 111. In this way, there are no other components around the third end 1123 of the condensation zone 112, which can reserve space for the liquid injection pipe, through which the cooling medium is injected into the heat spreader 11.

[0286] II. Drive Pump

[0287] For ease of description, the following example will be taken in conjunction with the example of a heat dissipation device 10 formed by the second arrangement described above (i.e., the second part of the liquid cooling module is stacked with the heat spreader 11 and the first part of the liquid cooling module). Figures 18 to 27 The driving pump of the embodiments of this application will be described in detail.

[0288] Figure 18 This is a schematic structural diagram of a heat dissipation device including a drive pump, provided in an embodiment of this application. Figure 18 Compared with the second arrangement method Figure 11 The difference in structure is that, Figure 18 A complete drive pump 13 is illustrated, which includes an added flexible circuit board. Figure 18 A drive pump 13 is illustrated. It should also be understood that, as mentioned above, the number of drive pumps 13 can be one or more; for the sake of brevity, only one drive pump 13 is illustrated here.

[0289] Figure 19 This is a schematic structural diagram of the drive pump provided in the embodiments of this application at different angles. Figure 20 This is an exploded view of the drive pump provided in the embodiment of this application. Figure 21 This is an exploded view of the drive pump provided in an embodiment of this application from another angle. Figure 22 This is a schematic structural diagram of a heat dissipation device without a drive pump provided in an embodiment of this application. Figure 23 yes Figure 22 A magnified view of a portion of region A in the middle. Figure 24 This is a schematic diagram of a partial area of ​​the structure in which three seals and two gaskets mate with the liquid cooling module.

[0290] refer to Figure 18 The drive pump 13 is disposed on the outer surface of the liquid cooling module of the heat dissipation device. The drive pump 13 is in direct contact with the liquid cooling module. For example, the drive pump 13 is disposed on the outer surface of the second cover plate 102 (i.e., the surface of the second cover plate 102 facing away from the first cover plate 101). The drive pump 13 is disposed adjacent to the fourth cover plate 104, on which the second part of the liquid cooling module (such as the cooler 121) is disposed.

[0291] refer to Figure 19 and Figure 21 The drive pump 13 has an inlet 1361 and an outlet 1362 near the bottom of the liquid cooling module. (Refer to...) Figure 22 and Figure 23 The liquid cooling module in the heat dissipation device 10 has a first opening 1201 and a second opening 1202 that connects to the drive pump 13. The inlet 1361 is adapted to the first opening 1201, and the outlet 1362 is adapted to the second opening 1202. Liquid from the liquid cooling pipe flows out from the first opening 1201, flows into the drive pump 13 through the inlet 1361, is pressurized in the drive pump 13, flows out from the outlet 1362, and flows into the liquid cooling pipe through the second opening 1202.

[0292] In the above embodiment, the drive pump 13 is disposed on the outer surface of the liquid cooling module of the heat dissipation device. The bottom of the drive pump 13 is provided with an inlet 1361 and an outlet 1362. The inlet 1361 is connected to the first opening 1201 on the liquid cooling module, and the outlet 1362 is connected to the second opening 1202 on the liquid cooling module. The drive pump 13 is in direct contact with the outer surface of the liquid cooling module. In this way, the space between the drive pump 13 and the outer surface of the liquid cooling module is very small, so that the space occupied by the heat dissipation device 10 equipped with the drive pump 13 is also small. Both the drive pump 13 and the heat dissipation device 10 can be well applied to electronic devices with small overall size and a pursuit of thinness and lightness.

[0293] refer to Figures 19 to 21The drive pump 13 includes a housing 131 and a pump body 132. The pump body 132 is housed within the housing 131, and the housing 131 protects the pump body 132. The pump body 132 can be understood as the main body of the drive pump 13, used to realize the pump 13's function of conveying and pressurizing liquid.

[0294] The driving pump 13 can be of various types, and this application embodiment does not limit it in any way. For example, the driving pump 13 includes, but is not limited to, micromechanical driving pumps, piezoelectric pumps, electroosmotic pumps, or microelectro-mechanical system (MEMS) micropumps, capillary pumps, etc.

[0295] For electronic devices that prioritize a slim and lightweight design, the drive pump 13 also needs to be small in size; for example, its thickness should be between 0.5mm and 0.7mm. Since piezoelectric pumps do not require an additional drive motor or impeller, they occupy little space, meeting the miniaturization requirements of drive pumps. They are a typical micro-pump and can be well-suited for use in electronic devices that prioritize a slim and lightweight design, such as mobile phones, laptops, and tablets.

[0296] In intelligent electronic devices such as mobile phones and tablets, high sealing requirements are necessary to improve water resistance and prevent foreign objects from entering the device. The flow of liquid between the drive pump 13 and the liquid cooling module inevitably leads to leakage; therefore, a sealing design is necessary. Based on this, the drive pump 13 in this embodiment further includes a sealing assembly, which is sealed and installed between the pump body 132 and the liquid cooling module.

[0297] The sealing assembly is typically made of a soft, compressible material, such as rubber, sponge, or flexible metal, and this application embodiment does not impose any limitation. After installation, the sealing assembly provides a seal, preventing leakage of waterproof liquid between the pump body 132 and the liquid cooling module.

[0298] In some embodiments, reference Figures 19 to 21 The sealing assembly includes a first gasket 1341 and a second gasket 1342, that is, the drive pump 13 is provided with a first gasket 1341 and a second gasket 1342. The first gasket 1341 is installed at the connection between the liquid inlet 1361 of the drive pump 13 and the first opening 1201 of the liquid cooling module, and the second gasket 1342 is installed at the connection between the liquid outlet 1362 of the drive pump 13 and the second opening 1202 of the liquid cooling module.

[0299] The first gasket 1341 has an annular structure, and the hollow area of ​​the annular structure is used for liquid flow. The first gasket 1341 has two ends extending outward along the axial direction. One end of the first gasket 1341 is inserted into the liquid inlet 1361 to be installed in the liquid inlet 1361 of the drive pump 13 (e.g., Figure 19As shown), the other end of the first gasket 1341 is inserted into the first opening 1201 to be installed on the first opening 1201 of the liquid cooling module (as shown). Figure 24 As shown), the first gasket 1341 is installed at the connection between the liquid inlet 1361 and the first opening 1201.

[0300] The second gasket 1342 has an annular structure, and the hollow area of ​​the annular structure is used for liquid flow. The second gasket 1342 has two ends extending outward along the axial direction. One end of the second gasket 1342 is inserted into the outlet 1362 to be installed at the outlet 1362 of the drive pump 13 (e.g., Figure 19 As shown), the other end of the second gasket 1342 is inserted into the second opening 1202 to be mounted on the second opening 1202 of the liquid cooling module (as shown). Figure 24 As shown), the second gasket 1342 is installed at the connection between the liquid outlet 1362 and the second opening 1202.

[0301] In the embodiment where the drive pump 13 includes a first gasket 1341 and a second gasket 1342, a small gap will be generated at the connection between the liquid inlet 1361 of the drive pump 13 and the first opening 1201 of the liquid cooling module when they are installed together. By installing the first gasket 1341 at the connection, the gap can be filled, forming an effective sealing layer to prevent liquid leakage. Similarly, by installing the second gasket 1342 at the connection between the liquid outlet 1362 of the drive pump 13 and the second opening 1202 of the liquid cooling module, the gap can be filled, forming an effective sealing layer to prevent liquid leakage.

[0302] In some embodiments, reference Figure 21 The sealing assembly also includes a first seal 1351, that is, the drive pump 13 includes a first seal 1351. A first sealing groove 1371 is provided at the bottom of the pump body 132, and the first sealing groove 1371 is arranged around the periphery of the liquid inlet 1361. (Refer to...) Figure 23 The liquid-cooled module has a third sealing groove 1203, which surrounds the first opening 1201. The third sealing groove 1203 corresponds to the first sealing groove 1371, and the three grooves together form a sealed space (denoted as the first sealed space). The first sealing element 1351 is sealed and installed within this first sealed space. Specifically, one end of the first sealing element 1351 is installed in the first sealing groove 1371, and the other end is installed in the third sealing groove 1203. The first sealing element 1351 is compressed, thus creating an interference fit between the first sealing element 1351 and the first sealed space, achieving a sealed installation of the first sealing element 1351. (Reference) Figure 24In an embodiment where a first gasket 1341 is installed at the connection between the liquid inlet 1361 and the first opening 1201, a first seal 1351 surrounds the periphery of the first gasket 1341.

[0303] It should be understood that for the compressible first seal 1351, a sealing installation means that the first seal 1351 is compressed to form an interference fit with the sealing space. The explanation of the sealing installation of the second, third, and fourth seals described below is the same as here, and will not be repeated below.

[0304] In the above embodiment, since the first sealing groove 1371 is arranged around the periphery of the liquid inlet 1361, the third sealing groove 1203 is arranged around the periphery of the first opening 1201, and the first sealing member 1351 is sealed and installed in the first sealing space formed by the first sealing groove 1371 and the third sealing groove 1203, the first sealing member 1351 will surround the connection between the liquid inlet 1361 and the first opening 1201. Thus, when liquid leaks from the connection between the liquid inlet 1361 and the first opening 1201, the first sealing member 1351, which is installed around the connection, can prevent liquid leakage. It can be understood that when the sealing effect of the first gasket 1341 is not good or fails, causing liquid to leak from the connection between the liquid inlet 1361 and the first opening 1201, the first sealing member 1351 can provide a further sealing effect, thereby preventing liquid leakage. Furthermore, since the first sealing member 1351 is compressible and can absorb vibration energy, it can provide a certain degree of vibration damping for the drive pump 13, thereby reducing noise.

[0305] In other embodiments, reference is made to... Figure 21 The sealing assembly also includes a second seal 1352, that is, the drive pump 13 includes a second seal 1352. A second sealing groove 1372 is provided at the bottom of the pump body 132, and the second sealing groove 1372 is arranged around the periphery of the liquid outlet 1362. (Refer to...) Figure 23 The liquid-cooled module has a fourth sealing groove 1204, which surrounds the second opening 1202. The fourth sealing groove 1204 corresponds to the second sealing groove 1372, and together they form a sealed space (denoted as the second sealing space). The second sealing element 1352 is sealed and installed within this second sealing space. Specifically, one end of the second sealing element 1352 is installed in the second sealing groove 1372, and the other end is installed in the fourth sealing groove 1204. The second sealing element 1352 is compressed, thus creating an interference fit between the second sealing element 1352 and the second sealing space, achieving a sealed installation of the second sealing element 1352. (Reference) Figure 24In an embodiment where a second gasket 1342 is installed at the connection between the liquid outlet 1362 and the second opening 1202, a second seal 1352 surrounds the periphery of the second gasket 1342.

[0306] In the above embodiment, since the second sealing groove 1372 is arranged around the periphery of the liquid outlet 1362, and the fourth sealing groove 1204 is arranged around the periphery of the second opening 1202, and the second sealing member 1352 is sealed and installed in the second sealing space formed by the second sealing groove 1372 and the fourth sealing groove 1204, the second sealing member 1352 will surround the connection between the liquid outlet 1362 and the second opening 1202. Thus, when liquid leaks from the connection between the liquid outlet 1362 and the second opening 1202, the second sealing member 1352, which is installed around the connection, can prevent liquid leakage. It can be understood that when the sealing effect of the second gasket 1342 is not good or fails, causing liquid to leak from the connection between the liquid outlet 1362 and the second opening 1202, the second sealing member 1352 can provide a further sealing effect, thereby preventing liquid leakage. Furthermore, since the second sealing member 1352 is compressible and can absorb vibration energy, it can provide a certain degree of vibration damping for the drive pump 13, thereby reducing noise.

[0307] It should be understood that the first sealing element 1351 and the second sealing element 1352 are generally annular structures, and their outlines can be any shape such as circular, elliptical, or square. This application embodiment does not impose any limitations on these shapes. Furthermore, the shape of the sealing element matches the shape of the sealing groove on which it is installed. For example, if the first sealing element 1351 is a circular annular structure, correspondingly, the shapes of the first sealing groove 1371 and the third sealing groove 1203 are also circular annular structures.

[0308] In some embodiments, reference Figure 21 The sealing assembly also includes a third seal 1353, meaning the drive pump 13 includes the third seal 1353. A fifth sealing groove 1373 is provided at the bottom of the pump body 132. The fifth sealing groove 1373 surrounds at least a portion of the area of ​​the first sealing groove 1371 and at least a portion of the area of ​​the second sealing groove 1372. (Refer to...) Figure 23The liquid-cooled module has a sixth sealing groove 1205 corresponding to the fifth sealing groove 1373. The sixth sealing groove 1205 surrounds at least a portion of the third sealing groove 1203 and at least a portion of the fourth sealing groove 1204. The fifth sealing groove 1373 and the sixth sealing groove 1205 together form a sealing space (denoted as the third sealing space), within which the third sealing element 1353 is sealed and installed. Specifically, one end of the third sealing element 1353 is installed in the fifth sealing groove 1373, and the other end is installed in the sixth sealing groove 1205. The third sealing element 1353 is compressed, thus forming an interference fit between the third sealing element 1353 and the third sealing space, thereby achieving the sealing installation of the third sealing element 1353. (Reference) Figure 24 In an embodiment where a first seal 1351 and a second seal 1352 are installed, a third seal 1353 surrounds at least a portion of the periphery of the first seal 1351 and at least a portion of the periphery of the second seal 1352.

[0309] It should be understood that at least a portion of the first sealing groove 1371 refers to part or all of the first sealing groove. The explanation of at least a portion of other sealing grooves and seals is the same as here and will not be repeated.

[0310] In the above embodiments, since the fifth sealing groove 1373 is disposed around at least a portion of the area of ​​the first sealing groove 1371 and at least a portion of the area of ​​the second sealing groove 1372, and the sixth sealing groove 1205 is disposed around at least a portion of the area of ​​the third sealing groove 1203 and at least a portion of the area of ​​the fourth sealing groove 1204, the first sealing member 1351 is sealed and installed in the first sealing space formed by the first sealing groove 1371 and the third sealing groove 1203, the third sealing member 1353 is sealed and installed in the second sealing space formed by the second sealing groove 1372 and the fourth sealing groove 1204, and the third sealing member 1353 is sealed and installed in the third sealing space formed by the fifth sealing groove 1373 and the sixth sealing groove 1205, the third sealing member 1353 will surround at least a portion of the area of ​​the first sealing member 1351 and at least a portion of the area of ​​the second sealing member 1352. In this way, when liquid leakage occurs, the third sealing member 1353 can further prevent liquid leakage and improve sealing performance.

[0311] Furthermore, the third seal 1353 can further improve the vibration damping effect of the drive pump 13 and further reduce noise. Because the first seal 1351 and the second seal 1352 are spaced apart and have small volumes, they form an interference fit with the bottom of the pump body 132 and the liquid cooling module, resulting in uneven overall force distribution between the bottom of the pump body 132 and the liquid cooling module, thus limiting the vibration damping effect. Since the third seal 1353 encloses at least a portion of the first seal 1351 and at least a portion of the second seal 1352, its larger volume results in a larger contact area between the third seal 1353 and the pump body 132 and the liquid cooling module. This makes the force distribution between the pump body 132 and the liquid cooling module more uniform, increasing the vibration damping effect and reducing noise.

[0312] In this embodiment, the shape of the third seal 1353 can be arbitrary and is not limited in any way. Furthermore, the shapes of the fifth sealing groove 1373 and the sixth sealing groove 1205 match those of the third sealing groove 1203.

[0313] In some embodiments, reference Figure 21 and Figure 24 The third seal 1353 has an I-shaped structure, including a vertical side 1353b and two horizontal sides 1353a. The vertical side 1353b is located between the first seal 1351 and the second seal 1352 (e.g., Figure 24 (As shown). The I-shaped third seal 1353 surrounds three sides of the first seal 1351 and three sides of the second seal 1352. In this way, the third seal 1353 can prevent liquid leakage from at least three sides of the first seal 1351 and three sides of the second seal 1352.

[0314] Correspondingly, refer to Figure 21 The fifth sealing groove 1373 has an I-shaped structure, including a vertical groove 1373b and two horizontal grooves 1373a. The vertical groove 1373b is located between the first sealing groove 1371 and the second sealing groove 1372. The I-shaped fifth sealing groove 1373 surrounds three sides of the first sealing groove 1371 and three sides of the second sealing groove 1372. (Reference) Figure 23 The sixth sealing groove 1205 has an I-shaped structure, including a vertical groove 1205b and two horizontal grooves 1205a. The vertical groove 1205b is located between the third sealing groove 1203 and the fourth sealing groove 1204. The I-shaped sixth sealing groove 1205 surrounds three sides of the third sealing groove 1203 and three sides of the fourth sealing groove 1204.

[0315] The aforementioned I-shaped third seal 1353, due to the symmetrical structure of the I-shaped structure, results in more uniform force distribution between the pump body 132 and the liquid cooling module, better balance, and better shock absorption.

[0316] Figure 25 This is another schematic structural diagram of the pump body and the third seal provided in the embodiments of this application.

[0317] In other embodiments, reference is made to... Figure 25 The third seal 1353 has a ring-shaped structure and surrounds the first seal 1351 and the second seal 1352. It can be understood that the ring-shaped third seal 1353 encloses the four sides of the first seal 1351 and the four sides of the second seal 1352. In this way, the third seal 1353 can prevent liquid leakage from the four sides of the first seal 1351 and the four sides of the second seal 1352, resulting in a better sealing effect.

[0318] Correspondingly, refer to Figure 25 The fifth sealing groove 1373 has a ring-shaped structure, enclosing the four sides of the first sealing groove 1371 and the four sides of the second sealing groove 1372. Similarly, the sixth sealing groove 1205 also has a ring-shaped structure (not shown in the figure), enclosing the four sides of the third sealing groove 1203 and the four sides of the fourth sealing groove 1204.

[0319] In other embodiments, the third seal 1353 may also be an L-shaped structure, a U-shaped structure, or other similar structures.

[0320] In the embodiment described above, where the drive pump 13 is installed to seal between the pump body 132 and the liquid cooling module via a sealing assembly (two gaskets and at least one of three seals), the compression of the various components of the sealing assembly may vary, potentially resulting in height differences. These height differences can create gaps, affecting the sealing effect to some extent. For example, the first seal 1351, the second seal 1352, and the third seal 1353 may have height differences after compression, creating gaps. Therefore, in some embodiments, waterproof adhesive is filled into the sealing space between the pump body 132 and the liquid cooling module. By filling any potential gaps with waterproof adhesive, a waterproof seal is achieved, further improving the sealing effect.

[0321] Figure 26 yes Figure 18 A schematic diagram showing the separation of the flexible circuit board from the outer casing at point B in the central region.

[0322] refer to Figure 20 and Figure 21 The drive pump 13 also includes a flexible circuit board 133, see reference. Figure 26 The outer casing 131 is provided with a through-hole 1311, and the flexible circuit board 133 passes through the through-hole 1311. One end of the flexible circuit board 133 extends out of the outer casing 131 for connection with the motherboard of the electronic device to control the drive pump 13. The other end of the flexible circuit board 133 is connected to the pump body 132.

[0323] The width of the through-hole 1311 is greater than the thickness of the flexible circuit board 133. This facilitates the insertion of the flexible circuit board 133 through the through-hole 1311 during installation. However, a certain gap exists at the connection between the flexible circuit board 133 and the through-hole 1311, which affects the sealing effect to some extent. Therefore, in some embodiments, the gap between the through-hole 1311 and the flexible circuit board 133 is filled with a waterproof adhesive layer (not shown in the figure). For example, the waterproof adhesive layer can be formed using waterproof glue. This waterproof adhesive layer provides a sealing effect, preventing liquid leakage.

[0324] In this embodiment, the pump body 132 can be made of metal or non-metal. The design of the sealing assembly between the pump body 132 and the liquid cooling module can be applied to pump bodies 132 made of different materials. Other design aspects differ slightly depending on the material of the pump body 132.

[0325] It should be noted that "metallic pump body 132" means that the main structure of the pump body 132 is made of a metallic material (e.g., copper), while a small portion of the structure may be made of a non-metallic material. Similarly, "non-metallic pump body 132" means that the main components of the pump body 132 are made of a non-metallic material, while a small portion of the structure may be made of a metallic material. Non-metallic materials can be, for example, polyethylene terephthalate (PET), polyethylene, polypropylene, polyurethane, and other polymeric materials.

[0326] For the non-metallic pump body 132, in some embodiments, the housing 131 of the drive pump 13 is made of metal and is welded to the liquid cooling module.

[0327] For example, refer to Figure 21 The outer shell 131 has circumferentially distributed and outwardly extending edges 1312. The edges 1312 are welded to the outer surface of the liquid cooling module (such as the outer surface of the second cover plate 102) to achieve a welded connection between the outer shell 131 and the liquid cooling module.

[0328] In the above embodiment, the drive pump 13 can be fixed to the liquid cooling module by welding the housing 131 to the liquid cooling module. Furthermore, the welding also serves as a seal, preventing liquid leakage at the weld joint.

[0329] Because there is a gap between the peripheral surface of the outer casing 131 and the peripheral surface of the pump body 132, sealing is not ideal. Therefore, in some embodiments, reference is made to... Figure 20 and Figure 21 The drive pump 13 also includes a fourth seal 1354, which seals the gap between the peripheral side of the pump body 132 and the peripheral side of the housing 131.

[0330] In the above embodiment, the fourth seal 1354 fills the gap between the peripheral side surface of the pump body 132 and the peripheral side surface of the housing 131. During installation, the fourth seal 1354 is compressed, forming an interference fit between the fourth seal 1354 and the pump body 132 and the housing 131, thereby achieving a sealing installation of the fourth seal 1354 at the gap. Because the fourth seal 1354 is compressed, it not only provides a sealing effect but also plays a certain role in shock absorption, thereby reducing noise.

[0331] In embodiments where the pump body 132 is made of non-metallic material, in one specific example, the space between the drive pump 13 and the liquid cooling module is sealed by welding the first gasket 1341, the second gasket 1342, the first seal 1351, the second seal 1352, the third seal 1353 in the sealing assembly, the metal outer shell 131, and the liquid cooling module. The interior of the drive pump 13 is sealed by the fourth seal 1354, and the through-hole 1311 through which the flexible circuit board 133 passes is sealed by a waterproof adhesive layer. The drive pump 13 is sealed at all possible locations where liquid leakage may occur, achieving a multi-layered sealing effect. Furthermore, the first seal 1351, the second seal 1352, the third seal 1353, and the fourth seal 1354 dampen the vibration of the drive pump 13, thereby reducing the noise of the drive pump 13.

[0332] For the pump body 132 made of metal, in some embodiments, the housing 131 of the pump 13 is made of non-metallic material, the pump body 132 and the housing 131 are connected by an adhesive layer, and the pump body 132 is welded to the liquid cooling module.

[0333] Exemplarily, the adhesive layer can be formed by adhesive backing, and the formed adhesive layer is attached between the peripheral side surface of the pump body 132 and the peripheral side surface of the housing 131, and the structure can be as follows: Figure 20 The fourth seal 1354 shown is the structure formed by the pump body 132 and the housing 131. The bottom edge of the pump body 132 is welded to the outer surface of the liquid cooling module to achieve a welded connection between the pump body 132 and the liquid cooling module.

[0334] In the above embodiments, the connection between the pump body 132 and the outer shell 131 is achieved through an adhesive layer, and the connection between the pump body 132 and the liquid cooling module is achieved through welding, so as to fix the drive pump 13 on the liquid cooling module.

[0335] In the above embodiments, for example, the non-metallic shell can be made of aerogel. Since aerogel has sound-absorbing properties, a shell formed from aerogel can achieve good noise reduction.

[0336] For the pump body 132 made of metal, in other embodiments, the outer casing 131 of the drive pump 13 can also be made of metal. This application does not impose any limitations on the embodiments.

[0337] Figure 27 This is a frequency response curve of the drive pump with an aerogel shell and the drive pump with a metal shell provided in the embodiments of this application. It can be seen that the sound pressure of the drive pump with the aerogel shell is significantly lower than that of the drive pump with the metal shell, and the drive pump with the aerogel shell has a very good noise reduction effect.

[0338] In embodiments where the pump body 132 is made of metal, in one specific example, the space between the drive pump 13 and the liquid cooling module is sealed by the first gasket 1341, the second gasket 1342, the first seal 1351, the second seal 1352, and the third seal 1353 in the sealing assembly. A waterproof adhesive layer seals the opening 1311 through which the flexible circuit board 133 passes. This seals the drive pump 13 at all potential leakage points, achieving a multi-layered sealing effect. Furthermore, the non-metallic outer shell 131, the first seal 1351, the second seal 1352, and the third seal 1353 dampen the vibration of the drive pump 13, thereby reducing the noise of the drive pump 13.

[0339] The driving pump 13 of the embodiments of this application has been described in detail above. It should be understood that the driving pump illustrated above is not only applicable to the heat dissipation devices formed by the first and second arrangement methods illustrated in the embodiments of this application, but also applicable to any form of heat dissipation device integrating a heat spreader 11 and a liquid cooling module, and also applicable to any form of liquid cooling module as an independent component. The embodiments of this application do not impose any limitations. Furthermore, when the driving pump 13 is applied to the heat dissipation device 10 described above, the driving pump 13 can be part of the heat dissipation device 10, or it can be applied as an independent component to the liquid cooling module of the heat dissipation device 10. The embodiments of this application do not impose any limitations.

[0340] III. Heat Spreader

[0341] In the aforementioned heat dissipation device 10, the structure of the heat spreader 11 can be flexibly designed based on actual conditions and is not limited to the structure shown in the above figure. The following, in conjunction with... Figures 28 to 34 The structure of the heat spreader 11 in the embodiments of this application will be described in detail. Figures 28 to 34 The heat spreader 11 can be a structure separated from the heat dissipation device 10, or it can be an independent heat spreader. This application embodiment does not make any limitation.

[0342] Figures 28 to 34Five different structural forms of the heat spreader 11 are provided. These variations primarily address reducing steam resistance, increasing capillary force, and improving liquid reflux. It should be understood that… Figures 18 to 34 The structure is merely illustrative; any modifications to the heat spreader 11 based on at least one of the above angles are within the scope of protection of the embodiments of this application.

[0343] First structure

[0344] Figure 28 This is a cross-sectional view of the heat dissipation plate in the xy plane of the heat dissipation device provided in the embodiments of this application. Figure 29 From Figure 28 A schematic structural diagram of the inner cavity of the heat spreader separated from the heat spreader.

[0345] The first structure, the heat spreader 11, is designed primarily to reduce steam resistance.

[0346] refer to Figure 28 The heat spreader 11 includes a first cover plate 101 (not shown in the figure) and a second cover plate 102. An inner cavity 110 of the heat spreader 11 is formed between the first cover plate 101 and the second cover plate 102. A capillary structure and a vapor chamber structure are formed within the inner cavity 110. The capillary structure includes multiple capillary channels 113, and the vapor chamber structure includes multiple vapor channels 114. The multiple capillary channels 113 and the multiple vapor channels are arranged alternately. The heat spreader 11 includes an evaporation zone 111 and a condensation zone 112 distributed along a first direction (y-direction).

[0347] The capillary structure includes transverse capillary channels 113 and vertical capillary channels 113, at least one transverse capillary channel 113 and at least one vertical capillary channel 113 being interconnected to allow liquid to flow back from the condensation zone 112 to the evaporation zone 111. Here, the y-direction is defined as transverse and the x-direction as vertical. For example, refer to... Figure 29 Capillary channels 113a1 and 113a2 are vertical capillary channels 113, and capillary channel 113b1 is a horizontal capillary channel 113.

[0348] Similarly, the steam chamber structure includes a transverse steam channel 114 and a vertical steam channel 114, with at least one transverse steam channel 114 and at least one vertical steam channel 114 interconnected to allow steam to be transferred from the evaporation zone 111 to the condensation zone 112. For example, see reference... Figure 29 Steam passages 114a1 and 114a2 are vertical steam passages 114, while steam passage 114b1 is a horizontal steam passage 114.

[0349] refer to Figure 29The evaporation zone 111 includes four vertical channels arranged sequentially from its end along a first direction (e.g., the y-direction). These four vertical channels sequentially include: a first vertical capillary channel 113a1, a first vertical steam channel 114a1, a second vertical capillary channel 113a2, and a second vertical steam channel 114a2. The second capillary channel 113a2 has a slit (denoted as the first slit 114c1), which connects the first steam channel 114a1 and the second steam channel 114a2. Thus, steam can flow from the first steam channel 114a1 to the second steam channel 114a2 through the first slit 114c1.

[0350] The steam chamber structure also includes a transverse third steam channel 114b1, which is connected to the second steam channel 114a2 and extends from the second steam channel 114a2 to the condensation zone 112. In this way, steam can flow from the first steam channel 114a1 to the second steam channel 114a2 through the first slit 114c1, and then flow to the condensation zone 112 through the third steam channel 114b1, forming a steam channel extending from the evaporation zone 111 to the condensation zone 112. That is, the steam flow path is sequentially: first steam channel 114a1, first slit 114c1, second steam channel 114a2, and third steam channel 114b1.

[0351] In existing technologies, the first steam channel 114a1 and the second steam channel 114a2 are not connected; they are separated by the second capillary channel 113a2. This results in significant steam flow resistance, which is detrimental to the heat dissipation and heat equalization effects of the heat spreader 11. In the above embodiment, the first slit 114c1 connects the first steam channel 114a1 and the second steam channel 114a2, allowing steam to flow from the first steam channel 114a1 to the second steam channel 114a2 through the first slit 114c1, and then to the condensation zone 112 through the third steam channel 114b1. It can be seen that the added first slit 114c1 is equivalent to increasing the area of ​​the steam channel, reducing steam resistance, and facilitating smooth steam flow. Therefore, it can improve the heat dissipation and heat equalization performance of the heat spreader 11.

[0352] In conjunction with the above embodiments, in some embodiments, reference is made to Figure 29The evaporation zone 111 also includes a transverse fourth steam channel 114b2, which is connected to the first steam channel 114a1. Thus, starting from the transverse fourth steam channel 114b2, a complete steam channel is formed extending from the evaporation zone 111 to the condensation zone 112, and the steam flow path is as follows: fourth steam channel 114b2, first steam channel 114a1, first slit 114c1, second steam channel 114a2, and third steam channel 114b1.

[0353] It should be understood that in other embodiments, the evaporation zone 111 may not include the fourth steam channel 114b2 described above, the first steam channel 114a1 may serve as the channel through which steam begins to flow, or the evaporation zone 111 may include more steam channels. This application embodiment does not impose any limitations.

[0354] The second structure

[0355] Figure 30 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0356] The second structure is mainly designed with the heat spreader 11 designed to reduce steam resistance. However, the main difference between the second and first structures is that a slit is added to the second capillary channel 113a2 in the second structure, which can better reduce steam resistance. The rest of the area is designed the same as the first structure.

[0357] refer to Figure 30 The evaporation zone 111 includes a vertical first capillary channel 113a1, a vertical first steam channel 114a1, a vertical second capillary channel 113a2, and a vertical second steam channel 114a2. The steam chamber structure also includes a transverse third steam channel 114b1 connecting the second steam channel 114a2. The second capillary channel 113a2 has two slits: a first slit 114c1 and a second slit 114c2, spaced apart. The first slit 114c1 connects the first steam channel 114a1 and the second steam channel 114a2, and the second slit 114c2 also connects the first steam channel 114a1 and the second steam channel 114a2. In this way, steam can flow from the first steam channel 114a1 to the second steam channel 114a2 through the first gap 114c1 and the second gap 114c2 respectively, and then flow to the condensation zone 112 through the third steam channel 114b1 connected to the second steam channel 114a2, forming a steam channel extending from the evaporation zone 111 to the condensation zone 112.

[0358] In the above embodiment, the first steam passage 114a1 and the second steam passage 114a2 are connected by the first gap 114c1 and the second gap 114c2, respectively, so that steam can flow from the first steam passage 114a1 to the second steam passage 114a2 through the first gap 114c1, and can also flow from the first steam passage 114a1 to the second steam passage 114a2 through the second gap 114c2, and then flow to the condensation zone 112 through the third steam passage 114b1. It can be seen that compared to Figure 29 The first structure shown is compared to the second structure, where the addition of a second slit 114c2 on top of the first slit 114c1 is equivalent to increasing the area of ​​the steam channel. This can better reduce steam resistance and facilitate the smooth flow of steam, thus improving the heat dissipation and temperature uniformity of the heat spreader 11.

[0359] In conjunction with the above embodiments, in some embodiments, reference is made to Figure 30 The evaporation zone 111 also includes a fourth transverse steam channel 114b2, which is connected to the first steam channel 114a1.

[0360] The third structure

[0361] Figure 31 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application. Figure 32 yes Figure 31 A magnified view of a portion of region C.

[0362] Based on the second structure, the third structure mainly further designs the heat spreader 11 from the perspective of increasing capillary force. That is, the main difference between the third structure and the second structure is that the third structure considers increasing capillary force in the evaporation zone 111, such as adding capillary branches between the first capillary channel 113a1 and the second capillary channel 113a2. That is, the design of the remaining areas is the same as that of the second structure.

[0363] refer to Figure 31 and Figure 32 The evaporation zone 111 includes a vertical first capillary channel 113a1, a vertical first steam channel 114a1, a vertical second capillary channel 113a2, and a vertical second steam channel 114a2. The steam chamber structure also includes a transverse third steam channel 114b1 that connects to the second steam channel 114a2. The second capillary channel 113a2 has a first slit 114c1 and a second slit 114c2. The relationship between the various channels can be referred to the relevant description of the second structure above, and will not be repeated here.

[0364] Continue to refer to Figure 32A first capillary segment 113c1 of a second capillary channel 113a2 is formed between the first fracture 114c1 and the second fracture 114c2. That is, the second capillary channel 113a2 is divided into three capillary segments by the first fracture 114c1 and the second fracture 114c2: a capillary segment 113c4 located at the upper end of the first fracture 114c1, a capillary segment 113c5 located at the lower end of the second fracture 114c2, and a first capillary segment 113c1 located between the first fracture 114c1 and the second fracture 114c2.

[0365] A transverse second capillary branch 113c2 is disposed between the first capillary channel 113a1 and the first capillary branch 113c1, and the second capillary branch 113c2 connects the first capillary channel 113a1 and the first capillary branch 113c1. (Comparison) Figure 30 The second structure shown is equivalent to adding a transverse second capillary branch 113c2 in a certain region of the first steam channel 114a1.

[0366] It should be understood that the capillary channel 113 carries a cryogenic liquid, and the added second capillary branch 113c2 increases the flow of cryogenic liquid, allowing for better heat absorption and improving the heat dissipation performance of the heat spreader 11. It should also be understood that since the first slit 114c1 and the second slit 114c2 are obtained by sacrificing a portion of the capillary branch of the second capillary channel 113a2, the additional second capillary branch 113c2 effectively compensates for the heat loss caused by removing a portion of the capillary channel, thus not affecting the contact area of ​​the heat source.

[0367] Overall, compared to Figure 30 The second structure shown and Figure 29 The first and third structures shown have low steam resistance without affecting the contact area of ​​the heat source, and the overall temperature difference of the heat spreader 11 is small, thus effectively improving heat dissipation and temperature uniformity.

[0368] It should be understood that during the implementation process, while adhering to the basic principles, the capillary structure and steam chamber structure can be flexibly adjusted based on the actual situation. The basic principle is to minimize steam resistance as much as possible without affecting the heat source contact area. Specifically, steam channels can be added in areas with high steam resistance to reduce steam resistance. Based on this, capillary channels can also be added in other areas to minimize the impact on the heat source contact area.

[0369] The fourth structure

[0370] Figure 33 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0371] Based on the third structure, the fourth structure further designs the heat spreader 11 from the perspective of liquid reflux. That is, the difference between the fourth and third structures is that the fourth structure primarily considers liquid reflux. Figure 32 The third structure shown has an improved region S3, which adds capillary branches between unconnected capillary channels, while the rest of the region is designed the same as the third structure.

[0372] The structure of the evaporation zone 111 in the fourth structure can be referenced. Figure 32 The structure shown will not be described in detail again.

[0373] refer to Figure 33 In the end region of the heat spreader 11 distributed along the second direction (x direction), a transverse third capillary channel 113b1, a vertical third capillary branch 113c3, and a transverse fourth capillary channel 113b2 are arranged sequentially along the second direction. The third capillary branch 113c3 connects the third capillary channel 113b1 and the fourth capillary channel 113b2. The fourth capillary channel 113b2 connects the first capillary channel 113a1. Thus, the third capillary channel 113b1, the third capillary branch 113c2, the fourth capillary channel 113b2, and the first capillary channel 113a1 are sequentially connected. Liquid from the condensation zone 112 can flow back to the evaporation zone 111 by sequentially passing through the third capillary channel 113b1, the third capillary branch 113c2, the fourth capillary channel 113b2, and the first capillary channel 113a1. Furthermore, the third capillary channel 113b1 is adjacent to the third steam channel 114b1, for example, the third capillary channel 113b1 is located below the third steam channel 114b1.

[0374] contrast Figure 32 The third structure shown in the diagram is characterized by the third capillary channel 113b1 not being connected to the other capillary channels, preventing the liquid within the third capillary channel 113b1 from flowing smoothly back to the evaporation zone 111. Figure 33 In the fourth structure shown, it is equivalent to in Figure 32 In the third structure shown, a capillary branch 113c3 is added at position S3 of the transverse fifth vapor channel 114b3. This connects the third capillary channel 113b31 and the fourth capillary channel 113b2 located on both sides of the transverse fifth vapor channel 114b3. Therefore, the liquid from the condensation zone 112 can flow through the third capillary branch 113c3 to the fourth capillary channel 113b2 in the third capillary channel 113b1, and then flow back to the end of the evaporation zone 111. This allows more liquid in the condensation zone 112 to flow back smoothly to the evaporation zone 111. It can be understood that more low-temperature liquid in the evaporation zone 111 can better absorb heat and improve heat dissipation efficiency.

[0375] In conjunction with the above embodiments, in some embodiments, reference is made to Figure 33 The evaporation zone 111 may also include a transverse fifth capillary channel 113b3, which is connected to the first capillary channel 113a1. Thus, starting from the fourth capillary channel 113b1, a complete capillary channel is formed extending from the condensation zone 112 to the evaporation zone 111, as shown below. Figure 33 As shown by the arrows, the liquid from the condensation zone 112 flows back to the end of the evaporation zone 111 through the third capillary channel 113b1, the third capillary branch 113c3, the fourth capillary channel 113b2, the first capillary channel 113a1 and the fifth capillary channel 113b3 in sequence.

[0376] Fifth structure

[0377] Figure 34 This is another schematic structural diagram of the inner cavity of the heat spreader provided in the embodiments of this application.

[0378] Based on the third structure, the fifth structure further designs the heat spreader 11 from the perspective of liquid reflux. That is, the difference between the fifth and third structures is that the fifth structure primarily considers liquid reflux, improving region S4 of the third structure shown in Figure 32, while the remaining regions are designed the same as the third structure. It should be understood that both the fifth and fourth structures can be understood as improvements to the third structure at different locations to improve liquid reflux.

[0379] The structure of the evaporation zone 111 in the fifth structure can be referenced. Figure 32 The structure shown will not be described in detail again.

[0380] refer to Figure 34 In the end region of the heat spreader 11 distributed along the second direction (x direction), a transverse third capillary channel 113b1, a vertical third capillary branch 113c3, and a transverse fourth capillary channel 113b2 are arranged sequentially along the second direction. The third capillary branch 113c3 connects the third capillary channel 113b1 and the fourth capillary channel 113b2. The fourth capillary channel 113b2 connects to the first capillary channel 113a1. Thus, the third capillary channel 113b1, the third capillary branch 113c2, the fourth capillary channel 113b2, and the first capillary channel 113a1 are sequentially connected. The third capillary branch 113c3 is adjacent to the second steam channel 114a2, and the third capillary branch 113c3 is located on the side of the second steam channel 114a2 away from the second capillary channel 113a2. That is, the second steam channel 114a2 is located between the second capillary channel 113a2 and the third capillary branch 113c3.

[0381] In the above embodiment, the liquid from the condensation zone 112 can flow through the third capillary branch 113c3 to the fourth capillary channel 113b2 in the third capillary channel 113b1, and then flow back to the end of the evaporation zone 111, so that more liquid in the condensation zone 112 can flow back to the evaporation zone 111 smoothly. It can be understood that more low-temperature liquid in the evaporation zone 111 can better absorb heat and improve heat dissipation efficiency.

[0382] The heat spreader 11 of this application embodiment has been described in detail above. It should be noted again that... Figures 28 to 34 The heat spreader 11 shown can be applied to the heat dissipation device 10 described above, or it can be used as an independent heat spreader. This application embodiment does not make any limitation.

[0383] Figure 35 This is a schematic block diagram of an electronic device 100 equipped with a heat dissipation device provided in an embodiment of this application. Figure 36 This is another schematic block diagram of the electronic device 100 equipped with a heat dissipation device provided in the embodiments of this application. It should be understood that, for ease of understanding, Figure 35 and Figure 36 The different components are indicated by boxes, but this does not mean that the components are square in shape.

[0384] refer to Figure 35 , combined Figure 1 The electronic device 100 includes a display screen 21, a middle frame 22, a motherboard 23, a small board 24, a battery 25, a heat-generating device 20, and a heat dissipation device 10. In the thickness direction (e.g., the z-direction) of the electronic device 100, the motherboard 23, the battery 25, and the small board 24 are located on the side of the middle frame 22 away from the display screen 21. One or more heat-generating devices 20 are provided on the motherboard 23. The motherboard 23 and the small board 24 are located on both sides of the length direction (e.g., the y-direction) of the middle frame 22. The battery 25 is disposed between the motherboard 23 and the small board 24. Along the length direction (e.g., the y-direction) of the electronic device 100, the electronic device 100 includes a hot area H and a cold area C. Exemplarily, the hot area H and the cold area C are distributed relative to each other along the length direction (e.g., the y-direction) of the electronic device 100. The upper end of the electronic device 100 in the length direction (e.g., the y-direction) can be the hot area H, which may include the motherboard 23 and the area near the motherboard 23. The lower end of the electronic device 100 in the length direction (e.g., the y-direction) can be the cold area C, which may include the lower end of the battery 25, or the cold area C may include the lower end of the battery 25 and part or all of the area of ​​the small board 24.

[0385] For the heat dissipation device 10, exemplarily, a heat-generating device 20 (such as a SOC) is disposed (such as attached) on the cooler 121 of the liquid cooling module of the heat dissipation device 10. Along the length of the electronic device (such as the y-direction), the heat dissipation device 10 may span the motherboard 23, battery 25, and sub-board 24 in the electronic device 100. The evaporation zone 111 of the cooler 121 of the liquid cooling module and the heat spreader 11 is located in the hot zone H of the electronic device 100 and is capable of absorbing heat from the hot zone H. The condensation zone 112 of the heat dissipation module and the heat spreader 111 is located in the cold zone C of the electronic device 100 and is capable of dissipating heat to components or structures in the cold zone C to enhance heat conduction within the electronic device 100 and optimize the overall temperature uniformity of the electronic device.

[0386] In the thickness direction (e.g., the z-direction) of the electronic device 100, in the first arrangement of the heat dissipation device 10 shown above, since the heat dissipation plate 11 and the liquid cooling module are arranged side by side, the entire heat dissipation device 10 is located on the side of the middle frame 22 near the display screen 21.

[0387] In the thickness direction (e.g., the z-direction) of the electronic device 100, in the second arrangement of the heat dissipation device 10 illustrated above, since the heat spreader 11 and the second part of the liquid cooling module are stacked, the heat dissipation device 10 can have the following two arrangements in the electronic device 100. In one example, a part of the heat dissipation device 10 is disposed on the side of the middle frame 22 near the display screen 21, and another part of the heat dissipation device 10 is disposed on the side of the middle frame 22 away from the display screen 21. For example, the heat spreader 11 and the first part of the liquid cooling module are disposed on the side of the middle frame 22 near the display screen 21, and the second part of the liquid cooling module (e.g., cooler 121) is disposed on the side of the middle frame 22 away from the display screen 21. In another example, the entire heat dissipation device 10 is disposed on the side of the middle frame 22 near the display screen 21.

[0388] refer to Figure 36 ,and Figure 35 The difference is that, in Figure 36 In the middle, the heating element 20 is disposed on the evaporation zone 111 of the heat spreader 11.

[0389] It should be understood that Figure 35 and Figure 36 This illustration is merely intended to show the arrangement of the heat dissipation device 10 within the electronic device 100 and should not be construed as limiting the specific form of any component or structure. Furthermore, based on the two arrangement methods of the liquid cooling module and the heat spreader 11 described above, the positions of the cooler 121, the radiator 122, and the liquid cooling pipes in the liquid cooling module can be flexibly adjusted according to the distribution of various components within the electronic device 100. For example, as... Figure 8 As shown, the heat sink 122 is located on one side of the second end 11b of the heat spreader 11. In this structure, the heat sink can also be located...Figure 35 and Figure 36 The cold zone C of the electronic device 100 shown. For example, if the position of the heating element 20 changes, the positions of the cooler 121 and the evaporation zone 111 can also be flexibly adjusted.

[0390] This application also provides an electronic device, which includes a display screen, a mid-frame, a motherboard, a small board, a battery, a heat-generating device, and a heat spreader. The design of the display screen, mid-frame, motherboard, small board, battery, and heat-generating device can be referred to the relevant description above, and will not be repeated here. This embodiment does not include a liquid cooling module. The heat-generating device is disposed in the evaporation area of ​​the heat spreader, which is located on the side of the mid-frame near the display screen. The heat spreader can be as described above... Figures 28 to 34 Example of a heat spreader.

[0391] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0392] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0393] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0394] For example, the interpretation of "contact" can be that one element is in direct or indirect contact with another element; in addition, the contact between two elements described in the embodiments of this application can be understood as contact within the allowable range of installation error, and there may be a very small gap due to installation error.

[0395] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0396] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0397] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0398] It should also be understood that the terms “inner,” “outer,” “upper,” “bottom,” “front,” “rear,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0399] In the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more. "At least a part of an element" refers to part or all of an element. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after it are in an "or" relationship.

[0400] It should be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0401] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipating device, characterized by, The application relates to a liquid cooling module and a vapor chamber. The liquid cooling module comprises a cooler, a radiator and a liquid cooling pipe. The cooler is used for absorbing heat to convert low-temperature liquid in the cooler into high-temperature liquid. The radiator is used for dissipating heat to convert the inflowing high-temperature liquid into low-temperature liquid.

2. The heat dissipating device according to claim 1, wherein The liquid cooling pipe is used for transmitting the high-temperature liquid from the cooler to the radiator and transmitting the low-temperature liquid from the radiator to the cooler.

3. The heat dissipating device according to claim 2, wherein The cooler is arranged adjacent to the evaporation area.

4. The heat dissipating device according to any one of claims 1 to 3, characterized in that, The radiator is arranged adjacent to the condensation area.

5. The heat dissipating device of claim 4, wherein At least part of the liquid cooling module is arranged around the periphery of the first end area of the vapor chamber along a first plane.

6. The heat dissipating device according to claim 5, wherein The first plane is parallel to the plane formed by the first direction and a second direction. The second direction is parallel to the width direction of the vapor chamber. The first end area is at least part of the end area of the vapor chamber except at least part of the end area of the condensation area.

7. The heat dissipating device according to any one of claims 1 to 3, wherein The liquid cooling pipe comprises an outflow pipe and an inflow pipe. The outflow pipe and the inflow pipe are located on the same side of the vapor chamber. The outflow pipe is used for transmitting the high-temperature liquid from the cooler to the radiator. The inflow pipe is used for transmitting the low-temperature liquid from the radiator to the cooler. The outflow pipe and the inflow pipe are located on one side of any end of the vapor chamber along the second direction. All components of the liquid cooling module are arranged around the periphery of the first end area of the vapor chamber along the first plane. The first end area is at least part of the end area of the vapor chamber except any end of the condensation area. Any end of the condensation area is part of the end of the vapor chamber along the second direction. The liquid cooling pipe is arranged on one side of the other end of the vapor chamber along the second direction. The cooler and the radiator are arranged on two sides of the two ends of the vapor chamber along the first direction respectively. The cooler and the liquid cooling pipe are arranged on one side of the other end of the vapor chamber along the second direction. The radiator is arranged on one side of the end of the vapor chamber along the first direction. The first part of the liquid cooling module is arranged around the periphery of the first end area of the vapor chamber along the first plane. The second part of the liquid cooling module except the first part is arranged on one side of the vapor chamber along a third direction. The third direction is parallel to the thickness direction of the vapor chamber.

8. The heat dissipating device according to claim 7, wherein The heat dissipation device comprises a first cover plate, a second cover plate and a fourth cover plate which are sequentially stacked along the third direction, a first cavity is formed between the first cover plate and the second cover plate, a second cavity is formed between the second cover plate and the fourth cover plate, the first cover plate, the second cover plate and the structure in the first cavity jointly form the first part of the vapor chamber and the liquid cooling module, and the second cover plate, the fourth cover plate and the structure in the second cavity jointly form the second part of the liquid cooling module, wherein the second part of the liquid cooling module comprises the cooler.

9. The heat dissipating device of claim 8, wherein, The first end region is at least part of the end region of the vapor chamber except any end part of the condensation region.

10. The heat dissipating device of claim 9, wherein, Any end part of the condensation region is a part of the end region of the vapor chamber distributed along the second direction, the liquid cooling pipe is arranged on one side of the other end of the vapor chamber distributed along the second direction, the heat sink is arranged on one side of one end of the vapor chamber along the first direction, and the cooler is arranged on one side of the vapor chamber along the third direction. In the projection of the heat dissipation device on the first plane, the projection of the cooler is located on one side of the projection of the liquid cooling pipe in the first direction, or the projection of the cooler and the projection of the heat sink are distributed along the first direction.

11. The heat dissipating device according to any one of claims 1 to 10, wherein The cooler is a micro-channel cooler, and / or the heat sink is a micro-channel heat sink.

12. The heat dissipating device according to any one of claims 1 to 11, wherein, The vapor chamber comprises capillary structures and vapor cavity structures extending along the first direction, the capillary structures comprise a plurality of capillary channels, and the vapor cavity structures comprise a plurality of vapor channels, and the plurality of capillary channels and the plurality of vapor channels are alternately arranged.

13. The heat dissipating device of claim 12, wherein, The liquid cooling pipe comprises an outlet pipe and an inlet pipe, the outlet pipe is arranged between the vapor chamber and the inlet pipe, the outlet pipe is used for transmitting high-temperature liquid from the cooler to the heat sink, and the inlet pipe is used for transmitting low-temperature liquid from the heat sink to the cooler.

14. The heat dissipating device of claim 12, wherein, The evaporation region comprises four vertical channels arranged in the first direction from the end of the evaporation region, the four vertical channels comprise a vertical first capillary channel, a vertical first vapor channel, a vertical second capillary channel and a vertical second vapor channel in sequence, the second capillary channel has at least one discontinuous joint, and the at least one discontinuous joint communicates the first vapor channel and the second vapor channel. The vapor cavity structure further comprises a transverse third vapor channel, the third vapor channel communicates with the second vapor channel, the third vapor channel extends from the second vapor channel to the condensation region, and vapor from the evaporation region can flow to the condensation region through the first vapor channel, the at least one discontinuous joint, the second vapor channel and the third vapor channel.

15. The heat dissipating device of claim 14, wherein, At least one of the slits comprises a first slit and a second slit arranged at intervals, a first capillary branch is formed between the first slit and the second slit, a second capillary branch is arranged between the first capillary channel and the first capillary branch, and the second capillary branch communicates the first capillary channel and the first capillary branch.

16. The heat dissipating device according to claim 14 or 15, characterized in that The end region of the vapor chamber distributed along the second direction comprises a third capillary channel, a fourth capillary channel and a third capillary branch, the third capillary branch communicates the third capillary channel and the fourth capillary channel, the fourth capillary channel communicates the first capillary channel, and liquid from the condensation area can flow back to the evaporation area through the third capillary channel, the third capillary branch, the fourth capillary channel and the first capillary channel.

17. The heat dissipating device of claim 16, wherein, The third capillary branch is adjacent to the second vapor channel, and the third capillary branch is located on the side of the second vapor channel away from the second capillary channel.

18. The heat dissipating device according to any one of claims 1 to 17, characterized in that, The heat dissipation device further comprises a driving pump arranged on the outer surface of the liquid cooling module, and the driving pump is in communication with the liquid cooling pipe. The driving pump comprises a shell, a pump body and a sealing assembly, the pump body and the sealing assembly are contained in the shell, and the sealing assembly is sealingly installed between the pump body and the liquid cooling module.

19. The heat dissipating device of claim 18, wherein, The sealing assembly comprises a first sealing member and a second sealing member. The pump body is provided with an inlet, a first sealing groove, an outlet and a second sealing groove near the bottom of the liquid cooling module, the first sealing groove is arranged around the periphery of the inlet, the second sealing groove is arranged around the periphery of the outlet, the liquid cooling module is provided with a third sealing groove corresponding to the first sealing groove and a fourth sealing groove corresponding to the second sealing groove, the first sealing member is sealingly installed in the sealing space formed by the first sealing groove and the third sealing groove, and the second sealing member is sealingly installed in the sealing space formed by the second sealing groove and the fourth sealing groove.

20. The heat dissipating device of claim 19, wherein, The sealing assembly further comprises a third sealing member. The bottom of the pump body is provided with a fifth sealing groove, the fifth sealing groove is arranged around at least part of the periphery of the first sealing groove and at least part of the periphery of the second sealing groove, the liquid cooling module is provided with a sixth sealing groove corresponding to the fifth sealing groove, the sixth sealing groove is arranged around at least part of the periphery of the third sealing groove and at least part of the periphery of the fourth sealing groove, and the third sealing member is sealingly installed in the sealing space formed by the fifth sealing groove and the sixth sealing groove.

21. The heat dissipating device of claim 20, wherein, The third sealing member has an I-shaped structure comprising a vertical edge and two horizontal edges, and the vertical edge is located between the first sealing member and the second sealing member.

22. The heat dissipating device according to any one of claims 18 to 21, wherein, The pump body is a pump body made of non-metallic material, the shell is a shell made of metal material, and the shell is welded to the liquid cooling module; and The driving pump further comprises a fourth sealing member, and the fourth sealing member is sealingly installed in the gap between the circumferential surface of the pump body and the circumferential surface of the shell.

23. The heat dissipating device according to any one of claims 18 to 21, wherein, The pump body is a metal pump body, the shell is a non-metal shell, the pump body and the shell are connected through an adhesive layer, the pump body is welded to the liquid cooling module, and the shell is made of aerogel.

24. The heat dissipating device according to any one of claims 18 to 23, wherein, The driving pump further comprises a flexible circuit board connected to the pump body, and a through hole is arranged on the shell, the flexible circuit board is arranged in the through hole, and a gap between the through hole and the flexible circuit board is filled with a waterproof adhesive layer.

25. A vapor chamber, characterized by, The vapor chamber comprises capillary structures and vapor cavity structures extending along a first direction, the capillary structures comprise a plurality of capillary channels, the vapor cavity structures comprise a plurality of vapor channels, the plurality of capillary channels and the plurality of vapor channels are alternately arranged, the vapor chamber comprises evaporation areas and condensation areas distributed along the first direction, and the first direction is parallel to the length direction of the vapor chamber. The evaporation area comprises four vertical channels arranged in the first direction from the end of the evaporation area, and the four vertical channels comprise a vertical first capillary channel, a vertical first vapor channel, a vertical second capillary channel, and a vertical second vapor channel in sequence, the second capillary channel has at least one gap, and the at least one gap is connected to the first vapor channel and the second vapor channel. The vapor cavity structure further comprises a third vapor channel transversely arranged, the third vapor channel is connected to the second vapor channel, the third vapor channel extends from the second vapor channel to the condensation area, and vapor from the evaporation area can flow to the condensation area through the first vapor channel, the at least one gap, the second vapor channel, and the third vapor channel.

26. The vapor chamber of claim 25, wherein, The at least one gap comprises a first gap and a second gap arranged at intervals, a first capillary branch is arranged vertically between the first gap and the second gap, a second capillary branch is arranged transversely between the first capillary channel and the first capillary branch, and the second capillary branch is connected to the first capillary channel and the first capillary branch.

27. The vapor chamber of claim 25 or 26, wherein, The end area of the vapor chamber distributed along a second direction comprises a third capillary channel, a fourth capillary channel, and a third capillary branch arranged transversely, the third capillary branch is connected to the third capillary channel and the fourth capillary channel, the fourth capillary channel is connected to the first capillary channel, liquid from the condensation area can flow back to the evaporation area through the third capillary channel, the third capillary branch, the fourth capillary channel, and the first capillary channel, and the second direction is parallel to the width direction of the vapor chamber.

28. The vapor chamber of claim 27, wherein, The third capillary branch is adjacent to the second vapor channel, and the third capillary branch is located on the side of the second vapor channel away from the second capillary channel.

29. An electronic device, comprising: The heat generating device is arranged in the evaporation area of the vapor chamber of the heat dissipation device or the cooler of the liquid cooling module of the heat dissipation device.

30. The electronic device of claim 29, wherein, The electronic device further comprises a mainboard, a middle frame and a display screen, the mainboard and the display screen are arranged on two sides of the middle frame, the heat generating device is arranged on the mainboard, and the heat dissipation device is arranged on the side of the middle frame close to the display screen.

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