Micro-channel radiator with sine fins and operation method of micro-channel radiator

Abstract

The invention discloses a micro-channel radiator with sine fins and an operation method of the micro-channel radiator. The micro-channel radiator comprises an upper cover plate, a middle-layer structural plate and a bottom cover plate, a micro-channel for liquid to circularly flow is formed in the middle-layer structural plate; a liquid inlet pipe is arranged at one end of the upper cover plate, and a liquid outlet pipe is arranged at the other end; the liquid inlet pipe is communicated with an end inlet of the micro-channel, and the liquid outlet pipe is communicated with a tail outlet of the micro-channel; liquid flows into the micro-channel through the liquid inlet pipe and then flows out of the tail outlet; the microchannel comprises a groove cavity, and the length direction of the groove cavity is consistent with the length direction of the middle-layer structural plate; a plurality of flow guide grooves which are parallel to one another are formed in the groove cavity; the length direction of the flow guide groove is consistent with that of the groove cavity; the flow guide groove is divided into three sections, and sine fins are arranged among the sections in an array mode. According to the invention, the sine-type fins with a certain rule are placed in the middle of the micro-channel, and the temperature of the chip is reduced by destroying a fluid thermal boundary layer, so that the heat dissipation problem of high heat release equipment can be solved.

Description

Technical Field

[0001] This invention relates, and more particularly, to a microchannel heat sink with sinusoidal fins and a heat dissipation method thereof. Background Technology

[0002] With the rapid development of the electronics industry, various related products are upgrading towards high integration and miniaturization. As the integration level of electronic devices increases, the heat flux density per unit area will reach 100–1000 W / cm². 2 The thermal safety issues of electronic devices caused by high heat flux densities are becoming increasingly prominent. During the operation of high-density integrated circuits, if the generated heat is not dissipated in time, excessively high temperatures can significantly affect the normal operation of components, reduce their performance, shorten their lifespan, and even pose risks such as combustion and explosion. To ensure the stable and reliable operation of microelectronic products, reducing the temperature rise caused by excessively high local heat flux densities is crucial for the development of microelectronic devices. Therefore, among various heat dissipation solutions, microchannel heat sinks are a heat dissipation method that effectively meets the needs of chip development trends.

[0003] Microchannel heat dissipation devices are a highly efficient liquid cooling method. Due to their small size and light weight, they can address the growing trend of miniaturized and high-power chips. Microchannel heat dissipation devices are generally composed of multiple layers of substrates processed with etching and other techniques to create flow channels, which are then welded together.

[0004] However, current DC-type cuboid microchannels have unsatisfactory heat dissipation efficiency and are unable to meet the increasingly high heat flux density requirements of chips. Summary of the Invention

[0005] This invention provides a microchannel heat sink with sinusoidal fins and a heat dissipation method thereof.

[0006] This invention overcomes the shortcomings of traditional DC-type cuboid microchannels with low thermal performance and effectively solves the technical problem of chip heat dissipation under higher power.

[0007] This invention is achieved through the following technical solution:

[0008] A microchannel heat sink with sinusoidal fins includes an upper cover plate 1, a middle structural plate 2, and a bottom cover plate 3 stacked from top to bottom.

[0009] The middle layer structural plate 2 is provided with microchannels 21 for liquid circulation;

[0010] One end of the upper cover plate 1 is provided with an inlet pipe 4, and the other end is provided with an outlet pipe 5;

[0011] The inlet pipe 4 is connected to the end inlet 22 of the microchannel, and the outlet pipe 5 is connected to the tail outlet 23 of the microchannel; the liquid flows into the microchannel 21 through the inlet pipe 4 and then flows out from the tail outlet 23.

[0012] The microchannel 21 includes a cavity, the length direction of which is consistent with the length direction of the middle layer structural plate 2;

[0013] Multiple parallel guide channels are provided inside the tank cavity; the length direction of the guide channels is consistent with the length direction of the tank cavity.

[0014] The guide channel is divided into a first section 24, a second section 25 and a third section 26;

[0015] A first sinusoidal rib array 27 is provided between the first segment 24 and the second segment 25;

[0016] A second sinusoidal rib array 28 is provided between the second segment 25 and the third segment 26.

[0017] The two ends of the cavity are isosceles triangular openings; a first circular opening 22 and a second circular opening 23 are respectively opened at the apex of the isosceles triangular opening;

[0018] The first circular opening 22 is connected to the inlet pipe 4; the second circular opening 23 is connected to the outlet pipe 5.

[0019] The first sinusoidal rib array 27 and the second sinusoidal rib array 28, each sinusoidal rib in the array is composed of two sinusoidal structures spliced ​​together.

[0020] The axes of the inlet pipe 4 and the outlet pipe 5 are perpendicular to the surface of the upper cover plate 1.

[0021] The inlet pipe 4 and outlet pipe 5 are connected to the upper cover plate 1 by a metal adhesive.

[0022] The bottom outer surface of the bottom cover plate 3 is in contact with the chip 6 to be cooled.

[0023] The upper cover plate 1, the middle structural plate 2, and the bottom cover plate 3 are made of metal.

[0024] The microchannel 21 is fabricated by CNC machining.

[0025] A method for operating a microchannel heat sink with sinusoidal fins includes the following steps: Cooling water first enters the isosceles triangular groove through the inlet pipe 4, so that the flow rate between each guide groove is evenly distributed. Then, it passes through the first section 24 of the guide groove, the first sinusoidal fin array 27, the second section 25 of the guide groove, the second sinusoidal fin array 28 and the third section 26 of the guide groove in sequence, and finally flows out from the tail outlet 23 at the isosceles triangular groove. While flowing out of the guide groove, the cooling water carries away the heat of the chip 6, thereby dissipating heat from the chip 6.

[0026] Compared with the prior art, the present invention has the following advantages and effects:

[0027] The present invention features a segmented array of sinusoidal fins arranged in a certain regular pattern within a microchannel. When the cooling medium flows through the sinusoidal fins of the microchannel, the thermal boundary layer is continuously disrupted, the fluid is in an underdeveloped state, and vortices are formed on the fins, which helps to improve the heat exchange efficiency of the heat sink.

[0028] This invention cleverly divides the flow channel into three sections and sets a sinusoidal fin array between the three sections. When the cooling water flows out, it forms a secondary vortex, which further improves the heat exchange efficiency of the heat sink.

[0029] In this invention, the axes of the inlet pipe and the outlet pipe are perpendicular to the surface of the upper cover plate. Cooling water first enters the isosceles triangular groove vertically through the inlet pipe, impacting the isosceles triangular groove area. Then, under the action of the isosceles triangular geometry, the cooling water flow rate between each guide groove is evenly distributed, and a certain jet impact effect is formed, which greatly improves the heat exchange efficiency of the inlet section.

[0030] The isosceles triangular structure at the inlet of the channel in this invention not only ensures uniform flow distribution among the microchannels and avoids excessive flow distribution to the microchannels, i.e., the second section of the guide trench, but also improves the uniformity of the flow distribution process, thereby improving the overall heat exchange efficiency and heat exchange uniformity of the microchannels.

[0031] The tail outlet of the microchannel in this invention also has an isosceles trapezoidal structure, which makes the whole device compact, with good manufacturability and balance. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the planar structure of the microchannel heat sink with sinusoidal fins of the present invention.

[0033] Figure 2 This is an exploded view of the three-dimensional structure of the microchannel heat sink with sinusoidal fins of the present invention. Figure 1 .

[0034] Figure 3 This is an exploded view of the three-dimensional structure of the microchannel heat sink with sinusoidal fins of the present invention. Figure 2 .

[0035] Figure 4 This is a top view of the middle layer structure plate of the present invention.

[0036] Figure 5 This is a schematic diagram of a single sinusoidal rib structure of the present invention.

[0037] Figure 6 This is a graph showing the relationship between temperature, power, and flow rate. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to specific embodiments.

[0039] like Figure 1-6 As shown, the present invention discloses a microchannel heat sink with sinusoidal fins, comprising an upper cover plate 1, a middle layer structural plate 2 and a bottom cover plate 3 stacked from top to bottom;

[0040] The middle layer structural plate 2 is provided with microchannels 21 for liquid circulation;

[0041] One end of the upper cover plate 1 is provided with an inlet pipe 4, and the other end is provided with an outlet pipe 5;

[0042] The inlet pipe 4 is connected to the end inlet 22 of the microchannel, and the outlet pipe 5 is connected to the tail outlet 23 of the microchannel; the liquid flows into the microchannel 21 through the inlet pipe 4 and then flows out from the tail outlet 23.

[0043] The microchannel 21 includes a cavity, the length direction of which is consistent with the length direction of the middle layer structural plate 2;

[0044] Multiple parallel guide channels are provided inside the tank cavity; the length direction of the guide channels is consistent with the length direction of the tank cavity.

[0045] The guide channel is divided into a first section 24, a second section 25 and a third section 26;

[0046] A first sinusoidal rib array 27 is provided between the first segment 24 and the second segment 25;

[0047] A second sinusoidal rib array 28 is provided between the second segment 25 and the third segment 26.

[0048] The two ends of the cavity are isosceles triangular openings; a first circular opening 22 and a second circular opening 23 are respectively opened at the apex of the isosceles triangular opening;

[0049] The first circular opening 22 is connected to the inlet pipe 4; the second circular opening 23 is connected to the outlet pipe 5.

[0050] The first sinusoidal rib array 27 and the second sinusoidal rib array 28, each sinusoidal rib in the array is composed of two sinusoidal structures spliced ​​together.

[0051] The axes of the inlet pipe 4 and the outlet pipe 5 are perpendicular to the surface of the upper cover plate 1. Cooling water enters the isosceles triangular groove vertically through the inlet pipe, impacting the isosceles triangular groove area. Then, under the action of the isosceles triangular geometry, the cooling water flow between each guide groove is evenly distributed, and a certain jet impact effect is formed, which greatly improves the heat exchange efficiency of the inlet section.

[0052] The inlet pipe 4 and outlet pipe 5 are connected to the upper cover plate 1 by a metal adhesive.

[0053] The bottom outer surface of the bottom cover plate 3 is in contact with the chip 6 to be cooled. The larger the contact area, the better the heat transfer efficiency.

[0054] The upper cover plate 1, the middle structural plate 2, and the bottom cover plate 3 are made of metal, such as copper or aluminum.

[0055] The microchannel 21 is fabricated by CNC machining or other machining processes.

[0056] A method for operating a microchannel radiator with sinusoidal fins includes the following steps: Cooling water first enters the isosceles triangular groove through the inlet pipe 4, so that the flow rate between each guide groove is evenly distributed. Then, it passes through the first section 24 of the guide groove, the first sinusoidal fin array 27, the second section 25 of the guide groove, the second sinusoidal fin array 28, and the third section 26 of the guide groove in sequence, and finally flows out from the tail outlet 23 at the isosceles triangular groove. When the cooling water flows through the sinusoidal fins of the microchannel, the thermal boundary layer is continuously disrupted, the fluid is in an underdeveloped state, and vortices are formed on the fins, which helps to improve the heat exchange efficiency of the heat sink.

[0057] As the cooling water flows out of the guide trench, it carries away the heat from chip 6, thereby dissipating heat from chip 6.

[0058] In actual operation, cooling water is introduced into the inlet pipe 4 through a precision flow control system, and the surface temperature of the laser chip is monitored in real time by a high-precision temperature sensor.

[0059] Test conditions and methods:

[0060] 1) Input three different thermal powers into chip 6: 25W, 50W and 150W;

[0061] 2) Adjust the cooling water inlet flow rate to vary within the range of 0.07-0.7 L / min;

[0062] 3) Record the temperature data after running stably for 10 minutes under each operating condition;

[0063] 4) Each test group was repeated three times and the average value was taken.

[0064] The test results are shown in the table below:

[0065]

[0066] Figure 6 The temperature-power-flow rate curve shown indicates that:

[0067] 1) At 25W and 50W power, even with the lowest test flow rate of 0.07L / min, the maximum chip temperature can still be controlled below 70℃;

[0068] 2) When the power is increased to 150W, the cooling flow rate needs to be increased to 0.35L / min to ensure that the maximum chip temperature does not exceed the safety threshold of 70℃;

[0069] 3) At 150W power, when the flow rate is below 0.3L / min, the chip temperature will rise rapidly to above 80℃.

[0070] The superior heat dissipation performance of this invention is mainly reflected in the following aspects: it has an extremely high heat dissipation margin under low power (≤50W) conditions; it can still ensure safe operation under high power (150W) conditions by appropriately increasing the flow rate; and the overall heat dissipation system has a fast response and good temperature stability.

[0071] The present invention does not limit the size of the sinusoidal rib and the microchannel 21; the size can be set arbitrarily according to the actual application requirements.

[0072] The present invention places sinusoidal fins in a certain pattern in the middle of the microchannel, thereby reducing the temperature of the chip 6 by disrupting the fluid thermal boundary layer, thus addressing the heat dissipation problem of high heat release devices.

[0073] The present invention can be well implemented as described above.

[0074] The embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A microchannel heat sink with sinusoidal fins, characterized in that, It includes an upper cover plate (1), a middle structural plate (2) and a bottom cover plate (3) stacked from top to bottom; The middle layer structure plate (2) is provided with microchannels (21) for liquid circulation; One end of the upper cover plate (1) is provided with a liquid inlet pipe (4), and the other end is provided with a liquid outlet pipe (5); The liquid inlet pipe (4) is connected to the end inlet 22 of the microchannel, and the liquid outlet pipe (5) is connected to the tail outlet (23) of the microchannel; the liquid flows into the microchannel (21) from the liquid inlet pipe (4) and then flows out from the tail outlet (23).

2. The microchannel heat sink with sinusoidal fins according to claim 1, characterized in that, The microchannel (21) includes a cavity, the length direction of which is consistent with the length direction of the middle layer structure plate (2); Multiple parallel guide channels are provided inside the tank cavity; the length direction of the guide channels is consistent with the length direction of the tank cavity. The guide channel is divided into a first section (24), a second section (25) and a third section (26); A first sinusoidal rib array (27) is provided between the first segment (24) and the second segment (25); A second sinusoidal rib array (28) is provided between the second segment (25) and the third segment (26).

3. The microchannel heat sink with sinusoidal fins according to claim 1, characterized in that, The two ends of the cavity are isosceles triangular openings; a first circular opening (22) and a second circular opening (23) are respectively opened at the apex of the isosceles triangular opening; The first round opening (22) is connected to the inlet pipe (4); the second round opening (23) is connected to the outlet pipe (5).

4. The microchannel heat sink with sinusoidal fins according to claim 3, characterized in that, The first sinusoidal rib array (27) and the second sinusoidal rib array (28) are each sinusoidal rib formed by splicing two sinusoidal structures.

5. The microchannel heat sink with sinusoidal fins according to claim 3, characterized in that, The axes of the inlet pipe (4) and the outlet pipe (5) are perpendicular to the surface of the upper cover plate (1).

6. The microchannel heat sink with sinusoidal fins according to claim 3, characterized in that, The inlet pipe (4) and outlet pipe (5) are connected to the top cover plate (1) by a metal adhesive.

7. The microchannel heat sink with sinusoidal fins according to claim 3, characterized in that, The bottom outer surface of the bottom cover plate (3) is in contact with the surface of the chip (6) to be cooled.

8. The microchannel heat sink with sinusoidal fins according to claim 3, characterized in that, The upper cover plate (1), the middle structural plate (2) and the bottom cover plate (3) are made of metal.

9. The microchannel heat sink with sinusoidal fins according to claim 1, characterized in that, The microchannel (21) is fabricated by CNC machining.

10. The method of operating the heat sink with sinusoidal fins and microchannels as described in any one of claims 1-7, characterized in that... Includes the following steps: Cooling water enters the isosceles triangular groove through the inlet pipe (4) to distribute the flow evenly among the guide grooves. Then, it passes through the first section (24), the first sinusoidal fin array (27), the second section (25), the second sinusoidal fin array (28), and the third section (26) of the guide groove in sequence, and finally flows out from the tail outlet (23) at the isosceles triangular groove at the end. As the cooling water flows out of the guide groove, it carries away the heat of the chip (6) and thus dissipates the heat of the chip (6).

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