Electromagnetic wave modulation device and electromagnetic wave modulation array

Abstract

An electromagnetic wave modulation device comprises a first substrate, a second substrate, a liquid crystal layer, a first conductive layer, a second conductive layer and a metal layer, the first substrate is provided with a first surface facing the second substrate, the second substrate is provided with a second surface facing the first substrate, and the liquid crystal layer is arranged between the first surface and the second surface. The first conducting layer is arranged on the second surface and has a first thickness, the second conducting layer is arranged on the second surface and electrically connected with the first conducting layer and has a second thickness larger than the first thickness, a groove is formed in the second conducting layer, and the metal layer is arranged on the first surface and electrically connected with the first conducting layer. The vertical projection of the metal layer on the second substrate at least covers a part of the slot.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an electromagnetic wave modulation device, in particular to an electromagnetic wave modulation array arranged using the electromagnetic wave modulation device. BACKGROUND

[0002] Since the 5th generation mobile communication network (5G communication) uses high-frequency signals, the wavelength of the signals is short and the amplitude is small, so the signal coverage range is small, and the penetration ability is relatively poor and is easily shielded by other obstacles. Even if the signal can penetrate, it still cannot effectively cover the entire indoor environment.

[0003] In such a communication scenario, the use of a reconfigurable intelligent surface (RIS) device can effectively improve the range of signal coverage. The RIS can be controlled to change the phase and amplitude of the received electromagnetic wave signals, and the changed electromagnetic wave signals are transmitted in a specified direction. The RIS can be divided into two types: penetrating and reflective. The reflective RIS can change the received signals and reflect them in a specified direction to the target position. The penetrating RIS can change the received signals and let them penetrate, thereby transmitting to the target position in a specified direction.

[0004] However, since most of the area of the penetrating RIS uses thick metal as the ground layer, the light transmittance is generally poor, and the optical transmittance is almost below 10%, which leads to the inability to be applied in some occasions, such as integration with windows. SUMMARY

[0005] The purpose of the present disclosure is to provide an electromagnetic wave modulation device with high light transmittance, so as to have a certain visibility in the occasion of signal adjustment.

[0006] In order to achieve the above purpose, one aspect of the present disclosure provides an electromagnetic wave modulation device, comprising a first substrate, a second substrate, a liquid crystal layer, a first conductive layer, a second conductive layer and a metal layer, the first substrate has a first surface facing the second substrate, the second substrate has a second surface facing the first substrate, the liquid crystal layer is arranged between the first surface and the second surface, the first conductive layer is arranged on the second surface and has a first thickness, the second conductive layer is arranged on the second surface and electrically connected with the first conductive layer, and has a second thickness greater than the first thickness, wherein the second conductive layer is formed with a slot, the metal layer is arranged on the first surface, and the vertical projection of the metal layer on the second substrate covers at least part of the slot.

[0007] According to some embodiments of the present disclosure, the minimum value of the distance PT between the outer wall of the second conductive layer and the slot satisfies:

[0008] 0.005λ≤ PT ≤ 0.1λ,

[0009] wherein λ is the wavelength of the signal radiated by the electromagnetic wave modulation device and is between 3 mm and 150 mm.

[0010] According to some embodiments of the present disclosure, the portion of the first conductive layer is disposed above or below the second conductive layer, and the first conductive layer is misaligned with the region of the second substrate and the slot in the region of the second substrate.

[0011] According to some embodiments of the present disclosure, the second conductive layer is composed of metal, and the portion of the first conductive layer is disposed above the second conductive layer and is composed of metal.

[0012] According to some embodiments of the present disclosure, the ratio of the second thickness to the first thickness is between 10 and 50,000.

[0013] According to some embodiments of the present disclosure, the second conductive layer is composed of metal, and the portion of the first conductive layer is disposed below the second conductive layer and is composed of transparent metal oxide.

[0014] According to some embodiments of the present disclosure, the ratio of the second thickness to the first thickness is between 2.5 and 1,000.

[0015] According to some embodiments of the present disclosure, the second conductive layer and the slot are in the shape of a cross.

[0016] According to some embodiments of the present disclosure, the vertical projection of the metal layer on the second substrate covers at least the intersection region of the slot.

[0017] According to some embodiments of the present disclosure, at least one of the four end portions of the second conductive layer is a distance away from the sidewall of the second substrate.

[0018] An aspect of the present disclosure provides an electromagnetic wave modulation array, which includes a plurality of the above-described electromagnetic wave modulation devices and a third conductive layer. The plurality of electromagnetic wave modulation devices are arranged in an array. The third conductive layer is disposed around the array and is electrically connected to the second conductive layer.

[0019] According to some embodiments of the present disclosure, the second conductive layer and the third conductive layer are formed simultaneously in the same metal process.

[0020] The electromagnetic wave modulation device and the electromagnetic wave modulation array formed by arranging the electromagnetic wave modulation device provided in the above embodiments still use a thick conductive layer as a ground layer in the region where electromagnetic wave resonance mainly occurs (the region near the slot), so it does not affect the efficiency of electromagnetic wave radiation. In addition, most other regions use a transparent conductive layer (e.g., indium tin oxide or an extremely thin metal layer), so it can provide high light transmittance and can be applied in more situations. Attached Figure Description

[0021] The nature of this disclosure can be understood from the following detailed description and accompanying diagrams. It should be noted that many features are not drawn to industry-standard scale. In fact, the dimensions of various features may be increased or decreased arbitrarily for clarity of discussion.

[0022] Figure 1A A top perspective view of an electromagnetic wave modulation device illustrated in one embodiment of the present disclosure.

[0023] Figure 1B Draw Figure 1A A bottom view of the first substrate of the electromagnetic wave modulation device.

[0024] Figure 1C Draw Figure 1A A top view of the second substrate of the electromagnetic wave modulation device.

[0025] Figure 2 The cross-sectional view of the electromagnetic wave modulation device in Figure 1 along the tangent AA' is shown.

[0026] Figure 3 A top perspective view of an electromagnetic wave modulation device illustrated according to another embodiment of this disclosure.

[0027] Figure 4 Draw Figure 3 A cross-sectional view of the electromagnetic wave modulation device drawn along the tangent BB'.

[0028] Figure 5A A schematic diagram of an electromagnetic wave modulation device is shown in another embodiment of the present disclosure.

[0029] Figure 5B Draw Figure 5A A bottom view of the first substrate of the electromagnetic wave modulation device.

[0030] Figure 5C Draw Figure 5A A top view of the second substrate of the electromagnetic wave modulation device.

[0031] Figure 6A A schematic diagram of an electromagnetic wave modulation device is shown in another embodiment based on the present disclosure.

[0032] Figure 6B schematic diagram Figure 6A bottom view of a first substrate of an electromagnetic wave modulation device.

[0033] Figure 7 schematic diagram of an electromagnetic wave modulation array according to an embodiment of the present disclosure.

[0034] wherein the reference signs:

[0035] 100, 300, 500, 600: electromagnetic wave modulation device

[0036] 110, 510, 610: first substrate

[0037] 120, 520: second substrate

[0038] 121, 551, 552, 553, 554: sidewall

[0039] 130: liquid crystal layer

[0040] 140, 340, 540: first conductive layer

[0041] 150, 350, 550: second conductive layer

[0042] 151, 351: outer wall

[0043] 152, 352: inner wall

[0044] 153, 353: end portion

[0045] 154, 354: arm portion

[0046] 160, 560, 660: metal layer

[0047] 170: driving assembly

[0048] 180: wire

[0049] 190: protective layer

[0050] 700: electromagnetic wave modulation array

[0051] 710: third conductive layer

[0052] AA', BB': tangent line

[0053] PT, PT1, PT2, PT3, PT4, PT5, PT6: pitch

[0054] L1: distance

[0055] ST1, ST2: slot

[0056] S1: first surface

[0057] S2: second surface

[0058] CA: cross-over area

[0059] T1, T2, T3, T4: thickness DETAILED DESCRIPTION

[0060] The following examples are illustrative of specific embodiments of the present disclosure. Unless otherwise noted, the examples set forth herein are not intended to be exhaustive or otherwise to limit the specific embodiments or applications of the disclosure. For example, although the application is illustrated with respect to a particular embodiment, various embodiments can omit, substitute, add to, combine, and / or modify one or more features illustrated herein. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the disclosure without departing from its central scope. Accordingly, the breadth and scope of the present disclosure should not be limited by any of the included examples, but should be defined only in accordance with the following claims and their equivalents.

[0061] Spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0062] In the following description, for purposes of explanation and not limitation, specific details are set forth such as fibrous layers, films, substrates, and regions so as to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known methods, devices, and materials are omitted so as not to obscure the description of the present application with unnecessary detail. Moreover, descriptions of well-known methods, devices, and materials can be found in any of a variety of textbooks and other publications within the field of the application. For example, the figures can show components that are drawn to scale and other components that are not drawn to scale. Further, the figures can show components that are drawn in a particular manner and other components that are not drawn in that manner. Therefore, the drawings should not necessarily be considered to be to scale and should be interpreted in light of the description herein. The same reference numerals in different drawings represent the same or similar elements.

[0063] Furthermore, the terms "approximately," "approximately," or "substantially" used in this case not only encompass explicitly stated numerical values ​​and ranges, but also the permissible deviation range understandable to someone with ordinary knowledge in the technical field to which the disclosed content pertains. This deviation range can be determined by errors that arise during measurement, such as those caused by limitations of the measurement system or process conditions. Additionally, "approximately" can indicate a deviation within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The terms "approximately," "approximately," or "substantially" used in this case can be chosen based on optical, etching, mechanical, or other properties to select an acceptable deviation range or standard deviation, and are not applied to all optical, etching, mechanical, and other properties using a single standard deviation.

[0064] Please refer to the above as well. Figure 1A , Figure 1B , Figure 1C and Figure 2 . Figure 1A A top perspective view of an electromagnetic wave modulation device illustrated in one embodiment of the present disclosure. Figure 1B Draw Figure 1A A bottom view of the first substrate of the electromagnetic wave modulation device. Figure 1C Draw Figure 1A A top view of the second substrate of the electromagnetic wave modulation device. Figure 2 The diagram illustrates a cross-sectional view of the electromagnetic wave modulation device shown along tangent AA' in Figure 1. In this embodiment, the electromagnetic wave modulation device 100 can serve as a transmissive reconfigurable smart surface device to change the phase, amplitude, and / or polarization direction of the received electromagnetic wave signal. The electromagnetic wave modulation device 100 may include a first substrate 110, a second substrate 120, a liquid crystal layer 130, a first conductive layer 140, a second conductive layer 150, a metal layer 160, and a driving component 170. Figure 2 As shown, the first substrate 110 has a first surface S1 facing the second substrate 120. The second substrate 120 has a second surface S2 facing the first substrate 110. A liquid crystal layer 130 is disposed between the first surface S1 and the second surface S2. The first substrate 110 and the second substrate 120 may be transparent substrates, and their materials may include glass, quartz, or polymer materials (e.g., polyimide-based materials or polycarbonate-based materials).

[0065] like Figure 1C As shown, the first conductive layer 140 and the second conductive layer 150 are disposed on the second surface S2 of the second substrate 120 and are electrically connected. In this embodiment, the first conductive layer 140 and the second conductive layer 150 serve as ground electrodes.

[0066] like Figure 1BAs shown, the metal layer 160 and the driving component 170 are disposed on the first surface S1 of the first substrate 110. The driving component 170 can be electrically connected with the metal layer 160 via the conductive wire 180. The metal layer 160 can serve as a bias electrode and form electric field with the first conductive layer 140 and the second conductive layer 150 on the second substrate 120 by different voltages provided by the driving component 170, so as to change the twist degree of the liquid crystal molecules of the liquid crystal layer 130, thereby changing the phase, amplitude and / or polarization direction of the electromagnetic wave signal.

[0067] The second conductive layer 150 further has a slot ST1 formed therein, wherein the vertical projection of the metal layer 160 on the second substrate 120 covers at least part of the slot ST1. The metal layer 160 can also be used to radiate electromagnetic wave signals, and the electromagnetic wave signals can resonate in the slot ST1. In the embodiment, the second conductive layer 150 and the slot ST1 can have a "cross" shape in a top view. In other words, the slot ST1 can have two intersecting grooves and the included angle between the two grooves is about 90 degrees. In an embodiment, the vertical projection of the metal layer 160 on the second substrate 120 covers at least the intersection area CA of the slot ST1. Preferably, the vertical projection of the metal layer 160 on the second substrate 120 completely covers the intersection area CA of the slot ST1 (as shown), so as to have a better radiation effect. Figure 1A

[0068] Further, as shown in Figure 1A and Figure 2 , the second conductive layer 150 has an outer wall 151 and an inner wall 152, wherein the inner wall 152 constitutes the side wall of the slot ST1. In an embodiment, the minimum value of the spacing PT between the outer wall 151 and the inner wall 152 of the second conductive layer 150 (or the spacing PT between the outer wall 151 of the second conductive layer 150 and the side wall of the slot ST1) satisfies: 0.005λ≤PT≤0.1λ, wherein λ is the wavelength of the signal radiated by the electromagnetic wave modulation device 100. In an embodiment, the electromagnetic wave modulation device 100 can be applied to a frequency range of 2GHz to 100GHz. In other words, the wavelength of the signal radiated by the electromagnetic wave modulation device 100 can be between 3 to 150mm.

[0069] Preferably, the spacing PT between the outer wall 151 and the inner wall 152 of the second conductive layer 150 is the same, but the present disclosure is not limited thereto. For example, in Figure 1A , in the case where the second conductive layer 150 and the slot ST1 have a "cross" shape, the end portion 153 of the second conductive layer 150 can be substantially flush with the side wall 121 of the second substrate 120, and the spacing PT1 between the outer wall 151 and the inner wall 152 of the second conductive layer 150 at each end portion 153 can be greater than or equal to the spacing PT2 between the outer wall 151 and the inner wall 152 of the second conductive layer 150 at each arm portion 154.​

[0070] In one embodiment, the first conductive layer 140 is formed on the second substrate 120 in a region that is different from the region where the second conductive layer 150 is formed on the second substrate 120. The inner wall of the first conductive layer 140 directly contacts the outer wall 151 of the second conductive layer 150 to achieve electrical connection. In another embodiment, a portion of the first conductive layer 140 can be formed on or under the second conductive layer 150. By forming the second conductive layer 150 on the first conductive layer 140 or forming the first conductive layer 140 on the second conductive layer 150, a better contact area can be achieved and the manufacturing process is easier. However, in the above embodiments, the first conductive layer 140 is formed on the second substrate 120 in a region that is different from the region where the slot ST1 is formed on the second substrate 120. In other words, the slot ST1 is formed on the second substrate 120 in a region where no conductive layer is formed.

[0071] For example, in Figure 2 , a portion of the first conductive layer 140 is formed under the second conductive layer 150. In other words, the first conductive layer 140 is first formed on the second surface S2 of the second substrate 120, and then the second conductive layer 150 is formed on the first conductive layer 140. In this embodiment, the second conductive layer 150 is composed of metal, such as aluminum, copper, silver, gold, or alloys thereof, or other low-resistance metals. The second conductive layer 150 can have a thickness T2, and the thickness T2 can be between 0.5 microns and 50 microns. The first conductive layer 140 can be composed of transparent metal oxide, such as indium tin oxide. The first conductive layer 140 can have a thickness T1, and the thickness T1 can be between 50 nanometers and 200 nanometers. Therefore, the ratio of the thickness of the second conductive layer 150 to the thickness of the first conductive layer 140 can be, for example, between 2.5 and 1000. Since the conductive layer serving as the ground is mostly composed of the transparent first conductive layer 140, the light transmittance can be greatly improved without affecting the radiation efficiency.

[0072] In one embodiment, after the first conductive layer 140, the second conductive layer 150, and the slot ST1 are sequentially formed on the second substrate 120, a protective layer 190 can be formed on the first conductive layer 140, the second conductive layer 150, and the slot ST1 to protect the electrical properties of the first conductive layer 140, the second conductive layer 150, and the slot ST1. The protective layer 190 can be composed of inorganic materials such as silicon oxide, silicon nitride, or organic materials. In addition, after the metal layer 160, the driving component 170 (not shown in the figure), and the conductive wire 180 (not shown in the figure) are formed on the first substrate 110, a protective layer 190 can also be formed on these components to prevent the subsequently injected liquid crystal layer 130 from affecting the properties of these components.

[0073] In another embodiment, please refer to Figure 3 and Figure 4 .Figure 3 A top perspective view of an electromagnetic wave modulation device illustrated according to another embodiment of this disclosure. Figure 4 Draw Figure 3 The electromagnetic wave modulation device is shown in cross-sectional view along tangent BB'. The components included in the electromagnetic wave modulation device 300 are substantially the same as those in the electromagnetic wave modulation device 100, the difference being that, for example... Figure 4 As shown, a portion of the first conductive layer 340 is disposed above the second conductive layer 350. Additionally, as... Figure 3 As shown, the end 353 of the second conductive layer 350 of the electromagnetic wave modulation device 300 is a certain distance L1 from the sidewall 121 of the second substrate 120; that is, they are not flush with each other as in the electromagnetic wave modulation device 100. In other words, the area of ​​the second conductive layer 350 on the second substrate 120 is reduced (that is, the area of ​​the first conductive layer 340 on the first substrate 120 is increased), thus the electromagnetic wave modulation device 300 has higher light transmittance.

[0074] In addition, in this embodiment, although the end 353 of the second conductive layer 350 is a certain distance L1 from the side wall 121 of the second substrate 120, the distance PT3 between the outer wall 351 and the inner wall 352 of the second conductive layer 350 at each end 353 is still greater than or equal to the distance PT4 between the outer wall 351 and the inner wall 352 of the second conductive layer 350 at each arm 354.

[0075] In this embodiment, a portion of the first conductive layer 340 is disposed above the second conductive layer 350. In other words, the second conductive layer 350 is first formed on the second substrate 120, and then the first conductive layer 340 is formed on the second conductive layer 350. In this embodiment, both the first conductive layer 340 and the second conductive layer 350 are composed of metals, such as aluminum, copper, silver, gold, or alloys thereof, which are low-resistance metals. The second conductive layer 350 may have a thickness T4, which can be between 0.5 micrometers and 50 micrometers. The first conductive layer 340 may have a thickness T3, which can be between 1 nanometer and 50 nanometers. Therefore, the ratio of the thicknesses of the second conductive layer 350 and the first conductive layer 340 can be, for example, between 10 and 50,000. Because the first conductive layer 340 uses metal and has a very small thickness, it not only has good conductivity but also provides a certain degree of light transmittance.

[0076] Similarly, after the second conductive layer 350, the first conductive layer 340 and the slot ST1 are sequentially formed on the second substrate 120, a protective layer 190 can be formed on the first conductive layer 140 and the slot ST1 to protect the electrical properties of the first conductive layer 140, the second conductive layer 350 and the slot ST1.

[0077] It is worth mentioning that the positional relationship between the first conductive layer and the second conductive layer is not limited to that shown in Figure 1 and 2.Figure 3 In an embodiment, in other embodiments, according to requirements, the first conductive layer 140 of the electromagnetic wave modulation device 100 in FIG. 1 may also be formed above the second conductive layer 150, or Figure 3 the second conductive layer 350 of the electromagnetic wave modulation device 300 may also be formed above the first conductive layer 340.

[0078] Please refer to Figure 5A , Figure 5B and Figure 5C . Figure 5A A schematic diagram of an electromagnetic wave modulation device according to another embodiment of the present disclosure. Figure 5B Illustrate Figure 5A a bottom view of the first substrate of the electromagnetic wave modulation device. Figure 5C Illustrate Figure 5A a top view of the second substrate of the electromagnetic wave modulation device. The components included in the electromagnetic wave modulation device 500 are substantially the same as those of the electromagnetic wave modulation devices 100 and 300, and the difference is that, as Figure 5B shown, the metal layer 560 of the electromagnetic wave modulation device 500 is in a "cross" shape on the first substrate 510. In addition, as Figure 5C shown, the second conductive layer 550 of the electromagnetic wave modulation device 500 and the slotted ST2 formed in the second conductive layer 550 are both in a "square" shape on the second substrate 520. The vertical projection of the metal layer 560 on the second substrate 520 of the electromagnetic wave modulation device 500 at least covers a part of the slotted ST2. Preferably, as Figure 5A shown, the four arms of the metal layer 560 in a "cross" shape respectively cover a part of the four sides of the slotted ST2 in a "square" shape on the second substrate, and the four sides are connected to form a "square" shape.

[0079] In this embodiment, the first conductive layer 540 is disposed below the second conductive layer 550, and the thickness of the first conductive layer 540 is less than the thickness of the second conductive layer 550. The ratio of the two can be, for example, within the range of the above embodiment, but the position, composition, and thickness relationship between the first conductive layer 540 and the second conductive layer 550 can be adjusted according to actual situations, and the present disclosure is not limited thereto.

[0080] As Figure 5CAs shown, similarly, the second conductive layer 550 has sidewalls 551, 552, 553, and 554, where the sidewall 552 constitutes the outer wall of the slot ST2 and the sidewall 553 constitutes the inner wall of the slot ST2. The sidewalls 551 and 552 have a spacing PT5, and the sidewalls 553 and 554 have a spacing PT6. The minimum values of the spacings PT5 and PT6 satisfy: 0.005λ ≤ PT5, PT6 ≤ 0.1λ, where λ is the wavelength of the signal radiated by the electromagnetic wave modulation device 500. Similarly, the frequency range applicable to the electromagnetic wave modulation device 500 is between 2 GHz and 100 GHz, so the wavelength of the signal that the electromagnetic wave modulation device 500 can radiate can be between 3 and 150 millimeters.

[0081] Since the conductive layer serving as the ground terminal is mostly composed of the transparent first conductive layer 540, the electromagnetic wave modulation device 500 can significantly improve the light transmittance without affecting the radiation efficiency.

[0082] Please refer to Figure 6A and Figure 6B . Figure 6A Schematic diagram of an electromagnetic wave modulation device according to another embodiment of the present disclosure. Figure 6B Shown Figure 6A is a bottom view of the first substrate of the electromagnetic wave modulation device shown. The components included in the electromagnetic wave modulation device 600 are substantially the same as those of the electromagnetic wave modulation device 500, and the ground terminal of the electromagnetic wave modulation device 600 adopts the configuration of the second substrate 520 of the electromagnetic wave modulation device 500. The difference between the two is that, as Figure 6B shown, four separately arranged metal layers 660 are formed on the first substrate 610 of the electromagnetic wave modulation device 600, and the vertical projections of these metal layers 660 on the second substrate 520 at least cover part of the slot ST2. Preferably, as Figure 6A shown, these four metal layers 660 respectively cover a part of the four sides of the slot ST2 in the shape of a "square". Since the metal layers 660 are separately arranged, the first conductive layer 540 in the central region of the second substrate 520 is not covered by the metal layer 560 as Figure 5A shown, so the light transmittance can be further improved.

[0083] It should be noted that for the sake of simplicity of the schematic content, the driving components and the wires connecting the driving components to the metal layers are omitted in the schematic diagrams of the electromagnetic wave modulation devices 500 and 600.

[0084] Please refer to Figure 7 , Figure 7 Schematic diagram of an electromagnetic wave modulation array according to an embodiment of the present disclosure. In this embodiment, the electromagnetic wave modulation array 700 may include multiple Figure 1AThe electromagnetic wave modulation devices 100 can be arranged in an array, and the third conductive layer 710 is disposed around the array and electrically connected to the second conductive layer 150 of the electromagnetic wave modulation devices 100. Specifically, the third conductive layer 710 can be in direct contact with the second conductive layer 150 of the electromagnetic wave modulation devices 100 at the periphery of the array to achieve better conduction effect. In one embodiment, during the formation of the electromagnetic wave modulation array 700, the second conductive layer 150 of the plurality of electromagnetic wave modulation devices 100 and the third conductive layer 710 can be formed together using the same metal in the same process, to simplify the complexity of the process and achieve good grounding effect.

[0085] It should be noted that, for the purpose of clear understanding of the drawings, Figure 7 The driving components and the wires connecting the driving components and the metal layer are omitted. However, the driving components of the respective electromagnetic wave modulation devices 100 can be connected to the same controller (not shown in the figure) respectively. The controller can control the respective driving components to provide different voltages, so that the liquid crystal molecules in the corresponding regions are twisted to a specified angle, thereby controlling the phase, amplitude and / or polarization direction of the electromagnetic wave signal in each region of the electromagnetic wave modulation array 700.

[0086] In other embodiments, the electromagnetic wave modulation array 700 can also include a plurality of Figure 3 、 Figure 5A or Figure 6A electromagnetic wave modulation devices arranged according to Figure 7 array manner, and the third conductive layer 710 is disposed around the array and electrically connected to the second conductive layer of the electromagnetic wave modulation devices via the first conductive layer of the electromagnetic wave modulation devices.

[0087] In summary, the electromagnetic wave modulation device and the electromagnetic wave modulation array arranged by using the electromagnetic wave modulation device provided by the present disclosure still use a conductive layer with large thickness as the ground layer in the region where electromagnetic wave resonance mainly occurs (the region near the slot), so as not to affect the efficiency of electromagnetic wave radiation. In addition, transparent conductive layers (for example, indium tin oxide or very thin metal layers) are used in most other regions, so as to provide high light transmittance (for example, more than 50%), which can be applied in more occasions.

[0088] Although the embodiments of the present disclosure have been disclosed as above, they are not intended to limit the embodiments of the present disclosure, and anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the embodiments of the present disclosure. Therefore, the protection scope of the embodiments of the present disclosure shall be subject to the scope defined by the following patent claim.

Claims

1. An electromagnetic wave modulation device, characterized in that, include: First substrate; A second substrate, wherein the first substrate has a first surface facing the second substrate, and the second substrate has a second surface facing the first substrate; A liquid crystal layer is disposed between the first surface and the second surface; A first conductive layer is disposed on the second surface and has a first thickness; A second conductive layer is disposed on the second surface and electrically connected to the first conductive layer, and has a second thickness greater than the first thickness, wherein the second conductive layer has a groove formed therein; as well as A metal layer is disposed on the first surface, and the metal layer at least partially covers the slot in a vertical projection onto the second substrate.

2. The electromagnetic wave modulation device as described in claim 1, characterized in that, The minimum value of the distance PT between the outer wall of the second conductive layer and the slot satisfies: 0.005λ≤PT≤0.1λ, Where λ is the wavelength of the signal radiated by the electromagnetic wave modulation device and is between 3 mm and 150 mm.

3. The electromagnetic wave modulation device as described in claim 1, characterized in that, A portion of the first conductive layer is disposed above or below the second conductive layer, and the region of the first conductive layer on the second substrate is offset from the region of the slot on the second substrate.

4. The electromagnetic wave modulation device as described in claim 3, characterized in that, The second conductive layer is made of metal, and the portion of the first conductive layer is disposed above the second conductive layer and is also made of metal.

5. The electromagnetic wave modulation device as described in claim 4, characterized in that, The ratio of the second thickness to the first thickness is between 10 and 50,000.

6. The electromagnetic wave modulation device as described in claim 3, characterized in that, The second conductive layer is composed of metal, and the portion of the first conductive layer is disposed below the second conductive layer and is composed of a transparent metal oxide.

7. The electromagnetic wave modulation device as described in claim 6, characterized in that, The ratio of the second thickness to the first thickness is between 2.5 and 1000.

8. The electromagnetic wave modulation device as described in claim 1, characterized in that, The second conductive layer forms a cross shape with the slot.

9. The electromagnetic wave modulation device as described in claim 8, characterized in that, The vertical projection of the metal layer onto the second substrate at least covers one intersection area of ​​the slot.

10. The electromagnetic wave modulation device as described in claim 8, characterized in that, At least one of the four ends of the second conductive layer is at a certain distance from the sidewall of the second substrate.

11. An electromagnetic wave modulation array, characterized in that, include: A plurality of electromagnetic wave modulation devices as described in claim 1, arranged in an array; and A third conductive layer is disposed around the array and electrically connected to the second conductive layer.

12. The electromagnetic wave modulation array as described in claim 11, characterized in that, The second conductive layer and the third conductive layer are formed simultaneously in one process using the same metal.

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