Supporting and cofferdam structure, camera module and assembling method

Abstract

The invention relates to a supporting and cofferdam structure, a camera module and an assembling method. The supporting and cofferdam structure comprises a ring beam, supporting columns and a cofferdam. The ring beam is provided with a light transmitting hole and is provided with a light inlet side and a backlight side which are opposite in the light inlet direction of the light transmitting hole; the number of the supporting columns is multiple, the multiple supporting columns are arranged on the backlight side of the ring beam at intervals, a hollowed-out area is formed between every two adjacent supporting columns, and the supporting columns and the ring beam are independently arranged. The cofferdam is made of a shading material and covers the hollow area, so that a closed space is formed around the light hole. According to the invention, the ring beam is erected above the gold wire bonding area through the plurality of supporting columns, and the arranged hollow area corresponds to the gold wire bonding area, so that the supporting structure can accurately avoid the gold wire bonding area, supports the optical filter, the motor lens group and other structures, further reduces the area of the supporting structure, and improves the reliability of the supporting structure. The edge size of the camera module is reduced, and the size of the camera module is greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of cameras, and more particularly to a support and cofferdam structure, a camera module, and an assembly method. Background Technology

[0002] Currently, electronic devices are increasingly trending towards miniaturization, which necessitates stricter control over the size of camera modules used in these devices. In traditional chip bonding processes, camera modules typically employ injection-molded infrared filter brackets to support the IR filter and bear the weight of the motor lens assembly and voice coil motor assembly. However, to avoid damaging the gold wires connecting the chip and the circuit board, the infrared filter bracket needs to have sufficient space to avoid the gold wire bonding area; simultaneously, to ensure support strength, the infrared filter bracket requires a relatively large frame structure. In practical use, it has been found that while existing brackets can meet basic support and protection requirements, they still have significant limitations: the overall module size is large, making it difficult to adapt to the miniaturization trend. Overly large modules lead to bulky devices and a degraded user experience, becoming a key bottleneck restricting product miniaturization. Summary of the Invention

[0003] In view of this, the present invention provides a support and cofferdam structure, a camera module and an assembly method that can avoid gold wires, ensure support strength and achieve module miniaturization.

[0004] The objective of this invention is achieved through the following technical solution: A support and cofferdam structure includes a ring beam, support columns, and a cofferdam; The ring beam is provided with a light-transmitting hole and has a light-incoming side and a back-lighting side that are opposite to each other along the light-incoming direction of the light-transmitting hole; There are multiple support columns, which are spaced apart on the back side of the ring beam, and a hollow area is formed between two adjacent support columns. The support columns and the ring beam are set independently of each other. The cofferdam is made of light-blocking material and covers the hollow area, so that a closed space is formed around the light-transmitting hole.

[0005] In the above technical solution, the support and cofferdam structure can be directly mounted on the circuit board to replace the traditional injection-molded infrared filter bracket. Multiple support columns support the ring beam above the gold wire bonding area, and the hollowed-out area corresponds to the gold wire bonding area. This allows the support structure to precisely avoid the gold wire bonding area and support the filter, motor, lens assembly, and other structures, further reducing the area of ​​the support structure. This helps to reduce the edge size of the camera module and achieve a significant reduction in the camera module's volume. Secondly, the cofferdam, combined with the support structure, blocks the hollowed-out area, forming a sealed area around the light-transmitting hole to enclose the photosensitive chip. This prevents external dust from entering, isolates ambient light, and avoids direct external mechanical impact on the chip.

[0006] Furthermore, the design of the support and cofferdam structure is simple yet ingenious, with clearly defined shapes and assembly methods for each component. This facilitates standardized and automated production, improving efficiency and reducing costs. Moreover, the independent installation of the support columns and ring beams allows for the selection and combination of components of different materials and specifications based on actual needs. This optimizes material usage, avoids unnecessary waste, and ultimately reduces overall material costs while meeting structural strength and performance requirements.

[0007] Optionally, in one possible implementation, the ring beam includes multiple connecting segments, which are connected end to end to form a closed ring structure or are spaced apart to form an open ring structure; when the ring beam is an open ring structure, each connecting segment is provided with one or more supporting columns.

[0008] In the above technical solutions, the different shapes of the ring beam structures allow the support and cofferdam structures to be customized according to the overall design of the camera module and the installation space. For example, the closed ring beam structure is suitable for camera modules with high requirements for structural integrity and stability and relatively regular installation space; while the open ring beam structure can be used when space is limited or when special coordination with other components is required. By reasonably adjusting the position and length of the connecting sections and the distribution of the support columns, a perfect match between the structure and the space can be achieved, improving space utilization.

[0009] Alternatively, in one possible implementation, the cofferdam is located at any of the inner, outer, or bottom positions of the ring beam.

[0010] In the above technical solution, the camera module may contain a variety of optical components, such as some electronic components on the circuit board, and the variability of the cofferdam position can better adapt to the layout of these components.

[0011] Alternatively, in one possible implementation, the top of the cofferdam is flush with or protrudes from the light-receiving side of the ring beam.

[0012] In the above technical solution, the cofferdam can work together with the support structure to support the motor lens assembly. That is, the cofferdam has both the functions of shading and support, which can effectively distribute the pressure borne by the support structure. This allows the size of the ring beam to be further simplified, that is, the width or length of the ring beam can be reduced. After the size of the ring beam is simplified, the space occupied by the camera module in the XY plane is further reduced, thereby further compressing the volume of the camera module and better adapting to the needs of miniaturized application scenarios.

[0013] Alternatively, in one possible implementation, the support column and the ring beam may be made of the same or different materials.

[0014] In the above technical solution, using different materials for the support columns and ring beams allows for more flexible design of the support structure, enabling flexible combinations to suit different usage scenarios and needs. For example, high-strength materials can be used for the support columns, emphasizing vertical support stability; while lightweight materials can be used for the ring beams, emphasizing horizontal structural integrity. In other words, the support columns and ring beams can be selected with appropriate materials based on different stress requirements, significantly reducing overall weight while maintaining strength compared to a single material in a monolithic structure.

[0015] Optionally, in one possible implementation, the connection between the support column and the ring beam can be any of the following methods: snap-fit ​​connection, structural adhesive bonding, welding, or mortise and tenon joint connection.

[0016] In the above technical solutions, different connection methods can be selected according to different application scenarios. For example, snap-fit ​​connections are detachable, which is convenient for maintenance and adjustment and has high accuracy for repeated assembly; structural adhesive bonding has no mechanical stress concentration, good sealing performance, and is suitable for complex spaces; welding connections have high rigidity and are suitable for high-frequency vibration scenarios; mortise and tenon joints have no additional connecting parts, are more lightweight, and are suitable for high-precision camera modules.

[0017] A camera module includes a circuit board, a photosensitive chip, a filter, a support and dam structure as described above, and a motor lens assembly; The photosensitive chip is disposed on the circuit board and electrically connected to the circuit board through multiple gold wires; The support and cofferdam structure is fixed on the circuit board, the ring beam is supported above the gold wire by the support column, and the hollow area corresponds to the area where the gold wire is located. The filter and the motor lens assembly are sequentially mounted on the ring beam.

[0018] In the above technical solution, the support and cofferdam structure, through the combination of support columns and ring beams, constructs a stable frame for the motor lens assembly. The support columns are fixed to the circuit board, providing a solid support foundation for the ring beam, allowing the filter and motor lens assembly to be stably mounted on it. The ring beam is positioned above the gold wire, with the open area corresponding to the area where the gold wire is located. This design not only makes efficient use of space but also provides effective protection for the gold wire, preventing damage to the camera module caused by the pressure of the motor lens assembly and other structures on the gold wire. Furthermore, the camera module utilizes a support and cofferdam structure with further reduced support structure dimensions, resulting in a smaller camera module that more easily meets the application requirements for miniaturized camera modules.

[0019] Furthermore, the openwork areas and installation dimensions of the supporting and cofferdam structures can be flexibly designed according to different needs, and are compatible with various specifications of image sensors, filters, and motor lens assemblies. This means that the camera module can be assembled with components of different sizes, pixels, and functions according to different application scenarios and performance requirements, thereby meeting diverse market demands.

[0020] Optionally, in one possible implementation, the circuit board is further provided with a plurality of electronic components, which may be located on either side of the circuit board; when the electronic components and the gold wire are located on the same surface, there is a clearance gap between the electronic components and the gold wire.

[0021] In the above technical solution, during the assembly of the camera module, multiple electronic components need to be accurately soldered or mounted onto the circuit board and rationally arranged with the gold wires. The clearance between the electronic components and the gold wires provides a clear installation reference for the assemblers, enabling them to more easily place the electronic components in the correct position and avoid collisions or interference with the gold wires due to improper installation.

[0022] A method for assembling a camera module includes the following steps: S1. Assemble the support columns and ring beams together using a suitable connection method to form a support frame; S2. Install the support frame onto the preset positioning structure on the circuit board, so that the ring beam is located above the gold wire; S3. A light-shielding and dust-proof material is applied to the circuit board along the inner or outer side of the support frame to form a ring or partial dam to cover the entire hollow area and surround the photosensitive chip in a closed space. S4. First, fix the filter to the top of the support frame, then install the motor lens assembly on the support frame, and make the dam part contact the motor lens assembly.

[0023] In the above technical solution, by installing the support frame on the preset positioning structure on the circuit board, the positioning accuracy of the support frame is ensured, so that the ring beam is located above the gold line, and under the action of the support column and the ring beam, the support frame is minimized as much as possible, so as to maximize the reduction of the size of the motor lens assembly.

[0024] A light-shielding and dust-proof material is coated onto the circuit board along the inner or outer side of the support frame to form a dam. By precisely controlling the position and extent of the coating, it can be ensured that the dam completely covers the entire cutout area, enclosing the photosensitive chip in a sealed space. This precise dam formation method effectively prevents light from entering the photosensitive chip through unexpected paths, avoiding stray light and halo effects, and further improving image quality.

[0025] The above-mentioned camera module assembly method, through the design of support and dam structure, only requires mounting the support frame on the circuit board and coating a ring of material around the support frame to form a dam, which forms a support structure for supporting the filter and motor lens assembly. The operation is simple, which can greatly improve the assembly efficiency of the camera module and reduce the production cost of the camera module while reducing the size of the camera module.

[0026] Alternatively, in one possible implementation, in step S3, a fully automated coating device with a visual positioning system is used for coating, and a closed annular cofferdam is formed during coating using a unidirectional continuous path through a pre-generated coating path.

[0027] In the above technical solution, because the 3D model completely and accurately presents the shape, position, and relative relationship of each component inside the camera module, the device can plan a coating trajectory that is highly adapted to the actual structure. The visual positioning system can capture the actual position and posture information of the camera module in real time and compare and calibrate it with the pre-imported 3D model to ensure the accuracy of the coating position.

[0028] The advantages of this invention compared to the prior art are as follows: Independently designed support columns and ring beams can precisely avoid the gold wire bonding area. The structural design of the support columns and ring beams is more flexible, allowing for the preservation of key load-bearing structures according to actual support requirements. Compared to a single, large-area support system, this reduces the space occupied in the XY plane. Secondly, the split structure forms a three-dimensional load-bearing system. The support columns distribute the weight of the motor and lens assembly vertically, while the ring beams distribute vibration stress horizontally, avoiding the risk of deformation caused by concentrated stress at a single point.

[0029] Independently designed support columns and ring beams allow for the use of different materials, and can be flexibly adjusted according to the weight and strength requirements of different equipment.

[0030] The cofferdam provides auxiliary support, bearing part of the weight of the motor-lens assembly. This allows for further simplification of the ring beam's dimensions. While maintaining structural redundancy to ensure strength, this directly reduces the module's edge dimensions, making it particularly suitable for scenarios sensitive to "millimeter-level volume compression," such as AR devices. The coordinated force distribution of the cofferdam, support columns, and ring beam further optimizes force distribution, ensuring stability under vibration or impact conditions.

[0031] The cofferdam, together with the supporting columns, ring beams, and circuit boards, forms a continuous enclosed space that can completely block dust intrusion and stray light interference.

[0032] The pre-assembly process of the support and cofferdam structure, that is, the support columns and ring beams are formed separately and then connected, reduces the overall processing difficulty and makes it easier to control dimensional accuracy, making it suitable for large-scale mass production. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the overall structure of the support and cofferdam structure in one embodiment.

[0035] Figure 2 This is an exploded view of the overall structure of the support and cofferdam structure in one embodiment.

[0036] Figure 3 This is one of the exploded views of a camera module in one embodiment.

[0037] Figure 4 This is a top view of a partial structure of a camera module according to one embodiment.

[0038] Figure 5 This is the second exploded view of a camera module in one embodiment.

[0039] Reference numerals in the attached diagram: 1-Support and cofferdam structure; 11-Ring beam; 111-Light-transmitting hole; 112-Hollowed area; 113-Trench; 12-Support column; 13-Cofferdam; 2-Circuit board; 21-Electronic components; 3-Photosensitive chip; 4-Filter; 5-Motor lens assembly; 6-Gold wire; 7-Outer cofferdam; 8-Filling adhesive. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0042] Please refer to Figure 1 and Figure 2 This embodiment provides a support and cofferdam structure 1, including a ring beam 11, support columns 12, and a cofferdam 13; the ring beam 11 is provided with a light-transmitting hole 111, and has a light-incoming side and a backlight side opposite to each other along the light-incoming direction of the light-transmitting hole 111; there are multiple support columns 12, which are spaced apart on the backlight side of the ring beam 11, and a hollow area 112 is formed between two adjacent support columns 12, and the support columns 12 and the ring beam 11 are set independently of each other; the cofferdam 13 is made of a light-shielding material, and the cofferdam 13 covers the hollow area 112, so that a closed space is formed around the light-transmitting hole 111.

[0043] Specifically, the cross-sections of the ring beam 11 and the support column 12 can be circular, square, polygonal, or other irregular shapes, which can be selected according to the internal space and support requirements of the camera module. The support column 12 and the ring beam 11 constitute the support structure, with the support column 12 providing vertical support and the ring beam 11 enhancing horizontal stability. The cofferdam 13 is made of light-shielding, dust-proof, and somewhat sealing materials, such as polymer light-shielding adhesive, metal-coated ceramics, and semiconductor packaging resin. The cofferdam 13 is a semi-solid adhesive with a certain degree of fluidity, which, in its semi-solid state, encloses the hollow area 112 according to the actual support frame structure, and then cures after enclosure.

[0044] The support and dike structure 1 can be directly mounted on the circuit board 2 to replace the traditional injection-molded infrared filter 4 bracket. Multiple support columns 12 support the ring beam 11 above the gold wire bonding area 6, and the hollowed-out area 112 corresponds to the gold wire bonding area 6. This allows the support structure to precisely avoid the gold wire bonding area 6 and support the filter 4 and motor lens assembly 5, further reducing the area of ​​the support structure. This helps to reduce the edge size of the camera module and achieve a significant reduction in the camera module's volume. Secondly, the dike 13, combined with the support structure, blocks the hollowed-out area 112, forming a closed area around the light-transmitting hole 111 to enclose the photosensitive chip 3. This prevents external dust from entering, isolates ambient light, and avoids direct external mechanical impact on the chip.

[0045] Furthermore, the design of the support and cofferdam structure 1 is simple yet ingenious, with clearly defined shapes and assembly methods for each component. This facilitates standardized and automated production, improving efficiency and reducing costs. Additionally, the support columns 12 and ring beams 11 are independently designed, allowing for the selection and combination of components of different materials and specifications based on actual needs. This optimizes material usage while meeting structural strength and performance requirements, avoiding unnecessary waste and ultimately reducing overall material costs.

[0046] Please refer to Figure 2 In this embodiment, the ring beam 11 includes multiple connecting segments. These segments are connected end-to-end to form a closed ring structure or are spaced apart to form an open ring structure. When the ring beam 11 is an open ring structure, each connecting segment is provided with one or more support columns 12. This embodiment uses a square ring beam 11 as an example. The square ring beam 11 includes four connecting segments, which are connected vertically in sequence to form a square frame. The hollowed-out area in the middle of the frame is where the light-transmitting hole 111 is located. Four support columns 12 are also provided, each located at one of the four corners of the frame. Of course, the ring beam 11 can also be configured in different shapes according to the actual structure of the camera module, such as a circular ring or other irregular shapes. Each connecting segment can be a separate structure, and each connecting segment is connected by several support columns 12, forming multiple independent structures of support columns 12 and connecting segments. These multiple structures collectively support the motor lens assembly 5.

[0047] The different shapes of the ring beams 11 allow the support and cofferdam structure 1 to be customized according to the overall design and installation space of the camera module. For example, the closed ring beam 11 is suitable for camera modules with high requirements for structural integrity and stability and relatively regular installation space; while the open ring beam 11 can be used when space is limited or when special coordination with other components is required. By reasonably adjusting the position and length of the connecting sections and the distribution of the support columns 12, a perfect match between the structure and the space can be achieved, improving space utilization.

[0048] In this embodiment, the cofferdam 13 is located at any position on the inner side, outer side, or bottom of the ring beam 11. It can be understood that the cofferdam 13 can be located on the inner side of all support columns 12, or on the outer side of all support columns 12, or between any two adjacent support columns 12. The camera module may contain various optical elements, such as some electronic components 21 on the circuit board 2, and the variability of the cofferdam 13's position can better adapt to the layout of these components.

[0049] The cofferdam 13 is set outside the ring beam 11 to form an outer protective ring. This layout is suitable for scenarios where the edge of the photosensitive chip 3 is close to the edge of the circuit board 2. It can maximize the protection range by utilizing the gap between the support column 12 and the edge of the substrate, while avoiding occupying the effective space above the photosensitive chip 3.

[0050] The cofferdam 13 is located inside the ring beam 11, that is, on the side closest to the photosensitive chip 3 during use, forming an inner protective ring. It can form a composite structure of "inner protection + support" with the support column 12. This layout is suitable for ultra-miniaturized circular modules. The double enclosure of the column and the inner cofferdam 13 can further reduce the XY plane size of the camera module. Moreover, the cofferdam 13 directly surrounds the edge of the photosensitive chip 3, making the light-shielding and dust-proof effect more direct and effective.

[0051] It should be noted that the top of the cofferdam 13 is flush with or protrudes from the light-receiving side of the ring beam 11. The cofferdam 13 can be a multi-layered semi-solid adhesive structure, and the height of the cofferdam 13 can be determined according to the actual height of the hollow area 112. It is necessary to ensure that the cofferdam 13 can completely cover the hollow area 112 after curing.

[0052] The cofferdam 13 can also work with the support structure to support the motor lens group 5. That is, the cofferdam 13 has both the functions of shading and support, which can effectively distribute the pressure borne by the support structure. This allows the size of the ring beam 11 to be further simplified. That is, the width or length of the ring beam 11 can be reduced. After the size of the ring beam 11 is simplified, the space occupied by the XY plane of the camera module is further reduced, which can further compress the volume of the camera module and better adapt to the needs of miniaturized application scenarios.

[0053] In this embodiment, the support column 12 and the ring beam 11 are made of the same or different materials. The support column 12 and the cofferdam 13 are independently set structures, that is, the support column 12 and the cofferdam 13 are separate structures that are independently formed and then assembled.

[0054] Using different materials for the support column 12 and the ring beam 11 makes the design of the support structure more flexible, allowing for flexible combinations to suit different usage scenarios and needs. For example, the support column 12 can be made of high-strength materials such as titanium alloys or ceramics, which emphasize vertical support stability; while the ring beam 11 can be made of lightweight materials such as engineering plastics or carbon fiber composites, which emphasize the structural integrity in the horizontal direction.

[0055] The independently designed support columns 12 and ring beams 11 can be made of suitable materials according to different stress requirements. Compared with the single material of the integrated structure, the overall weight can be significantly reduced while ensuring strength. Secondly, the design is more flexible. The support column 12 can be individually adjusted according to the distribution of the gold wires 6 on the circuit board 2. For example, the support column 12 that avoids the area of ​​the gold wires 6 can be locally adjusted in height or cross-section. The ring beam 11 can be adjusted in outline according to the layout of the motor lens group 5. This can effectively solve the limitations caused by the "integral molding" of the integrated structure, make it easier to avoid key internal areas, and adapt to more different types of camera modules. Thirdly, the independent design can simplify unnecessary structures. For example, the ring beam 11 only retains the key stress-bearing sections, thereby further reducing the space occupied and further miniaturizing the main camera module.

[0056] In this embodiment, the connection between the support column 12 and the ring beam 11 can be any of the following methods: snap-fit ​​connection, structural adhesive bonding, welding, or mortise and tenon joint connection. Among them, snap-fit ​​connection is suitable for the combination of metal and plastic; structural adhesive bonding is suitable for the combination of dissimilar materials, such as ceramic and plastic; welding is suitable for homogeneous metal materials; and mortise and tenon joint is suitable for the combination of ceramic and other hard and brittle materials.

[0057] Different connection methods can be selected according to different application scenarios. For example, snap-fit ​​connections are detachable, facilitating maintenance and adjustment, and ensuring high precision in repeated assembly; structural adhesive bonding eliminates mechanical stress concentration, provides good sealing, and is suitable for complex spaces; welded connections offer high rigidity and are suitable for high-frequency vibration scenarios; mortise and tenon joints require no additional connecting parts, resulting in greater weight reduction and suitability for high-precision camera modules. Through the appropriate connection methods, the support column 12 and the ring beam 11 can form a stable force transmission system. That is, the vertical force borne by the support column 12 can be evenly distributed to the ring beam 11, and the horizontal force borne by the ring beam 11 can react on the support column 12, forming a closed-loop force system. Compared to an integrated structure, this split structure makes it easier to optimize the force distribution through local adjustments (such as adding connection points), while avoiding local stress concentration caused by excessive overall rigidity, thereby improving the structural stability of the miniaturized module.

[0058] Please refer to Figure 1 or Figure 2 In this embodiment, a groove 113 is also provided inside the light-transmitting hole 111 on the ring beam 11. The groove 113 can be used to install and position the filter 4 on the camera module. The groove 113 provides a high-precision mechanical positioning reference for the filter 4. During the assembly of the camera module, the filter 4 can be passively and accurately inserted into the predetermined position, improving assembly efficiency; at the same time, the depth design of the groove 113 can make the upper surface of the filter 4 slightly lower than or flush with the top surface of the ring beam 11, thus reducing the assembly height of the entire camera module, thereby further reducing the size of the camera module.

[0059] The groove 113 is formed on the upper surface of the ring beam 11 and can be continuous or segmented. It can be formed using methods such as vertical grooving (groove wall perpendicular to the surface of the ring beam), acute-angled grooving (groove wall at an angle of 30°-60° to the surface of the ring beam), or obtuse-angled grooving (groove wall at an angle of 120°-150° to the surface of the ring beam). The groove depth is 1 / 3 to the overall thickness of the filter 4 to ensure stability while avoiding obstruction of the effective photosensitive area. The groove width is slightly larger than the edge thickness of the filter 4, leaving a 0.01-0.05mm assembly gap, which can be filled with light-shielding adhesive to enhance fixation and sealing. Furthermore, protrusions of 0.1-0.3mm high or localized material thickening can be provided along the groove wall of the groove 113 to compensate for the impact of the grooving on the strength of the ring beam 11, ensuring that the ring beam 11 can stably support the weight of the motor assembly and optical lens assembly.

[0060] Please refer to Figure 3 and Figure 4 This embodiment also provides a camera module, including a circuit board 2, a photosensitive chip 3, a filter 4, a support and dam structure 1 as described above, and a motor-lens assembly 5. The photosensitive chip 3 is disposed on the circuit board 2 and electrically connected to the circuit board 2 through multiple gold wires 6. The support and dam structure 1 is fixed on the circuit board 2, and a ring beam 11 is erected above the gold wires 6 through support columns 12, with the hollowed-out area 112 corresponding to the area where the gold wires 6 are located. The filter 4 and the motor-lens assembly 5 are sequentially disposed on the ring beam 11. The ring beam 11 can be located directly above the gold wires 6, or inside or outside the gold wires 6.

[0061] The support and cofferdam structure 1, through the combination of support columns 12 and ring beams 11, constructs a stable frame for the motor lens assembly 5. The support columns 12 are fixed to the circuit board 2, providing a solid support foundation for the ring beams 11, allowing the filter 4 and motor lens assembly 5 to be stably mounted on the ring beams 11. The ring beams 11 are erected above the gold wire 6, and the hollowed-out area 112 corresponds to the area where the gold wire 6 is located. This design not only makes efficient use of space but also provides effective protection for the gold wire 6, preventing damage to the camera module caused by the pressure of the motor lens assembly 5 and other structures on the gold wire 6. Furthermore, the camera module uses a support and cofferdam structure 1 with a further reduced support structure size, resulting in a smaller camera module that more easily meets the application requirements for miniaturized camera modules.

[0062] Furthermore, the hollowed-out area 112 and installation dimensions of the supporting and cofferdam structure 1 can be flexibly designed according to different needs, and can be compatible with various specifications of photosensitive chips 3, filters 4, and motor lens groups 5. This means that the camera module can be assembled with components of different sizes, pixels, and functions according to different application scenarios and performance requirements, thereby meeting diverse market demands.

[0063] In this embodiment, the camera module forms a closed space to enclose the photosensitive chip 3 by tightly combining the dike 13 with the support column 12, the ring beam 11 and the circuit board 2, blocking external dust from entering and isolating ambient light. At the same time, it can also prevent external mechanical impact from directly affecting the photosensitive chip 3.

[0064] It should be noted that, in addition to its dustproof and light-shielding functions, the cofferdam 13 in this embodiment also provides auxiliary support for the motor lens assembly 5. Specifically, a material combining light-shielding properties and structural strength is selected, such as a modified epoxy resin-based light-shielding adhesive with added reinforcing components. After curing, it has suitable hardness and rigidity, capable of bearing part of the weight of the motor lens assembly 5, thereby reducing the stress load on the support column 12. It also possesses a certain degree of elasticity, which can buffer stress under vibration or impact conditions, preventing structural damage caused by hard contact. The top of the cofferdam 13 forms a surface contact connection with the bottom of the motor lens assembly 5. Through surface contact, pressure is dispersed, bearing part of the vertical force on the motor lens assembly 5. Working in conjunction with the support column 12 and the ring beam 11, it achieves multi-point force dispersion, thereby improving the overall structural stability.

[0065] Since the cofferdam 13 can assist in supporting the motor-lens assembly 5, the size of the ring beam 11 can be further simplified. Under normal circumstances, the ring beam 11 needs to bear the horizontal stabilizing force of the motor-lens assembly 5 alone, requiring a sufficiently large size. However, because the cofferdam 13 can share some of the horizontal force, the unnecessary width or length of the ring beam 11 can be reduced. With the reduced size of the ring beam 11, the space occupied by the camera module in the XY plane is significantly reduced, further adapting to the "ultra-miniaturization" requirements of scenarios such as AR devices.

[0066] In this embodiment, the circuit board 2 is also provided with multiple electronic components 21, which can be located on either side of the circuit board 2. When the electronic components 21 and the gold wire 6 are on the same surface, there is a clearance between them. During the assembly of the camera module, multiple electronic components 21 need to be accurately soldered or installed onto the circuit board 2 and arranged reasonably with the gold wire 6. The clearance between the electronic components 21 and the gold wire 6 provides a clear installation reference for the assemblers, making it easier for them to place the electronic components 21 in the correct position and avoid collisions or interference with the gold wire 6 due to improper installation.

[0067] Please refer to Figure 5 In this embodiment, the camera module also includes an outer dam 7. The outer dam 7 has the same structure as the cofferdam 13 and is located near the outer edge of the circuit board 2. A filler adhesive 8 is also placed between the outer dam 7 and the cofferdam 13. The double-layer cofferdam design of the cofferdam 13 and the outer dam 7, combined with the filler adhesive 8, forms a multi-layered sealing and protection system. The cofferdam 51 directly seals the hollow area 111 of the ring beam 11, effectively isolating dust, moisture, and other contaminants from eroding the photosensitive chip 3. The outer dam 7 forms a final barrier at the edge of the circuit board 2, further improving the overall airtightness and moisture resistance of the camera module. Furthermore, the filler adhesive 8 between the inner and outer dams 7 not only provides a sealing function but also bonds the two cofferdams into a robust whole. This structure significantly enhances the mechanical strength of the cofferdam section, enabling it to better withstand external stress, impact, and vibration, protecting the fragile gold wire 6 connection, and reducing the risk of failure due to physical damage.

[0068] Both the cofferdam 13 and the outer cofferdam 7 are ring-shaped structures. The two cofferdams can be integrally formed by local connecting ribs of the same material, or they can be formed independently and then fixed together with adhesive to ensure that the area between them forms a closed filling space. The two can be made of the same or different materials, including but not limited to high-polymer light-shielding adhesive with both light-shielding and sealing properties, high-strength and light-shielding metal-coated ceramic, or high-temperature resistant and easily moldable semiconductor packaging cofferdam resin, etc.

[0069] The outer dam 7 is located between the bottom surface of the circuit board 2 and the motor lens assembly 5, and is used to fill the gap between them. The outer dam 7 fills the gap between the circuit board 1 and the bottom surface of the motor lens assembly, which is equivalent to forming a strong "structural adhesive layer" between the motor lens assembly 5 and the circuit board 2. This not only plays a sealing role, but also firmly bonds the motor lens assembly 5, the support and dam structure 1, and the circuit board 2 into a unified rigid whole.

[0070] It should be noted that in this embodiment, the outer ring of the filling area of ​​the filler adhesive 8 covers the gold wire bonding area, the area where the electronic components 21 are located, and the gap between the two layers of dikes. The bottom of the filling layer formed by the filler adhesive 8 is attached to the surface of the circuit board 2, and the top is lower than or flush with the top of the ring beam 11, so as not to affect the assembly of the filter 4 and the motor lens assembly.

[0071] This embodiment also provides a method for assembling a camera module, including the following steps: S1. Assemble the support column 12 and the ring beam 11 together using a suitable connection method to form a support frame. The connection method between the support column 12 and the ring beam 11 can be selected according to the material characteristics. For example, if they are both metal materials, a mechanical connection with a snap-fit ​​and positioning structure can be used to ensure the verticality and coaxiality after assembly. For dissimilar materials such as ceramics and plastics, structural adhesive can be used for bonding, with the adhesive layer thickness adapted to the material characteristics to ensure connection strength and sealing. For homogeneous metal materials, welding can be used to ensure connection rigidity. S2. Install the support frame onto the preset positioning structure on the circuit board 2, so that the ring beam 11 is located above the gold wire 6. The connection method between the support frame and the circuit board 2 can be selected according to the internal space and stress requirements of the camera module. For example, screws, clips, etc. can be used to ensure installation accuracy through the preset positioning structure on the circuit board 2; or conductive glue or epoxy glue can be used for bonding, which can take into account both mechanical fixing and electrical connection (such as grounding) requirements. After the glue layer cures, ensure that there is no loosening. S3. Apply a light-shielding and dust-proof material to the circuit board 2 along the inner or outer side of the support frame to form a ring or partial dam 13 to cover the entire hollow area 112 and surround the photosensitive chip 3 in a closed space. Then, ensure that the material is tightly bonded to the support column 12, the ring beam 11 and the circuit board 2 through staged curing to avoid bubbles or gaps and ensure its airtightness. S4. First, fix the filter 4 to the top of the support frame, then install the motor-lens assembly 5 on the support frame, and make the cofferdam 13 part contact with the motor-lens assembly 5. The motor-lens assembly 5 includes a lens and a motor. It can be precisely aligned by setting a positioning structure on the ring beam 11, and ensure that the bottom of the cofferdam 13 and the motor-lens assembly 5 form a surface contact, so that the cofferdam 13 can provide auxiliary support for the motor-lens assembly 5, forming a coordinated force-bearing system in which the support column 12 and the ring beam 11 provide the main support, and the cofferdam 13 provides the auxiliary support.

[0072] By mounting the support frame onto the preset positioning structure on the circuit board 2, the positioning accuracy of the support frame is ensured, so that the ring beam 11 is located above the gold wire 6. Under the action of the support column 12 and the ring beam 11, the support frame is minimized as much as possible, so as to maximize the reduction of the size of the motor lens assembly 5.

[0073] A light-shielding and dust-proof material is coated on the circuit board 2 along the inner or outer side of the support frame to form a dam 13. By precisely controlling the position and extent of the coating, it can be ensured that the dam 13 completely covers the entire hollow area 112 and surrounds the photosensitive chip 3 in a closed space. This precise dam 13 formation method can effectively prevent light from entering the photosensitive chip 3 from unexpected paths, avoid stray light and halo phenomena, and further improve image quality.

[0074] The above-mentioned camera module assembly method, through the design of the support and dam structure 13, only requires mounting the support frame on the circuit board 2 and coating a ring of material around the support frame to form the dam 13, which forms a support structure for supporting the filter 4 and the motor lens group 5. The operation is simple, which can greatly improve the assembly efficiency of the camera module and reduce the production cost of the camera module while reducing the size of the camera module.

[0075] In step S3 of this embodiment, a fully automated coating device with a visual positioning system is used for coating. A closed annular dam 13 is formed during coating using a pre-generated coating path and a unidirectional continuous path. The visual positioning system can be a 2D camera or a 3D vision camera; this embodiment preferably uses a 3D vision camera. The coating path is generated by pre-importing a 3D model (including the position of the support column 12, the distribution of the gold wire 6, the edge contour of the circuit board 2, and electronic components 21, etc.) from the camera module, achieving precise planning of the coating path.

[0076] Because the 3D model fully and accurately presents the shape, position, and relative relationships of each component inside the camera module, the equipment can plan a coating trajectory that is highly adapted to the actual structure. The visual positioning system can capture the actual position and attitude information of the camera module in real time and compare and calibrate it with the pre-imported 3D model to ensure the accuracy of the coating position. This allows the equipment's positioning accuracy to adapt to the miniaturization requirements of the module, ensuring that the deviation between the coating position of the cofferdam 13 and the preset path is within a very small range, avoiding interference with key structures such as the support column 12 and the gold wire 6.

[0077] The coating of the cofferdam 13 adopts a unidirectional continuous path, either clockwise or counterclockwise, forming a closed loop from the starting point to the ending point; alternatively, it can use a discontinuous path, working together with the support column 12 to form a closed loop. The clockwise direction is suitable for square or rectangular camera modules, allowing for smooth coating along the right-angle transition between the edge of the circuit board 2 and the outer perimeter of the support column 12, reducing material buildup at corners. The counterclockwise direction is suitable for circular or irregularly shaped modules, facilitating uniform coating around the arc-shaped contour of the inner side of the support column 12. Unidirectional continuous coating avoids interface gaps caused by multi-segment splicing, ensuring the integrity and sealing of the cofferdam 13 structure.

[0078] Furthermore, the material for the cofferdam 13 is applied in a continuous linear fashion using equipment. During the application process, the material flow rate and viscosity changes are monitored in real time to ensure a uniform cross-sectional shape. A gradient heating process is employed during the curing stage, combined with internal venting channels (such as the gaps between support columns 12) to prevent a decrease in sealing due to internal air bubbles during material curing. The resulting cofferdam 13 fits tightly against the columnar support frame and the substrate surface without any noticeable gaps. It effectively blocks external dust and stray light while also providing structural strength to support the motor-lens assembly 5.

[0079] In the description of this invention, it should be understood that terms such as "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0080] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0081] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A support and cofferdam structure, characterized in that, This includes ring beams, support columns, and cofferdams; The ring beam is provided with a light-transmitting hole and has a light-incoming side and a back-lighting side that are opposite to each other along the light-incoming direction of the light-transmitting hole; There are multiple support columns, which are spaced apart on the back side of the ring beam, and a hollow area is formed between two adjacent support columns. The support columns and the ring beam are set independently of each other. The cofferdam is made of light-blocking material and covers the hollow area, so that a closed space is formed around the light-transmitting hole.

2. The support and cofferdam structure according to claim 1, characterized in that, The ring beam includes multiple connecting segments, which are connected end to end to form a closed ring structure or are spaced apart to form an open ring structure. When the ring beam is an open ring structure, each connecting segment is provided with one or more supporting columns.

3. The support and cofferdam structure according to claim 1, characterized in that, The cofferdam is located at any position on the inner side, outer side, or bottom of the ring beam.

4. The support and cofferdam structure according to claim 1, characterized in that, The top of the cofferdam is flush with or protrudes from the light-receiving side of the ring beam.

5. The support and cofferdam structure according to claim 1, characterized in that, The support column and the ring beam may be made of the same or different materials.

6. The support and cofferdam structure according to claim 1, characterized in that, The connection between the support column and the ring beam can be any of the following methods: snap-fit ​​connection, structural adhesive bonding, welding, or mortise and tenon joint.

7. A camera module, characterized in that, Includes circuit board, photosensitive chip, filter, support and cofferdam structure as described in any one of claims 1-6, and motor lens assembly; The photosensitive chip is disposed on the circuit board and electrically connected to the circuit board through multiple gold wires; The support and cofferdam structure is fixed on the circuit board, the ring beam is supported above the gold wire by the support column, and the hollow area corresponds to the area where the gold wire is located. The filter and the motor lens assembly are sequentially mounted on the ring beam.

8. The camera module according to claim 7, characterized in that, The circuit board is also provided with a number of electronic components, which can be located on either side of the circuit board; when the electronic components and the gold wire are located on the same surface, there is a clearance gap between the electronic components and the gold wire.

9. A method for assembling a camera module as described in claim 7 or 8, characterized in that, Includes the following steps: S1. Assemble the support columns and ring beams together using a suitable connection method to form a support frame; S2. Install the support frame onto the preset positioning structure on the circuit board, so that the ring beam is located above the gold wire; S3. A light-shielding and dust-proof material is applied to the circuit board along the inner or outer side of the support frame to form a ring or partial dam to cover the entire hollow area and surround the photosensitive chip in a closed space. S4. First, fix the filter to the top of the support frame, then install the motor lens assembly on the support frame, and make the dam part contact the motor lens assembly.

10. The assembly method of the camera module according to claim 9, characterized in that, In step S3, a fully automated coating device with a vision positioning system is used for coating. During coating, a closed ring-shaped cofferdam is formed by using a unidirectional continuous path through a pre-generated coating path.

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