Self-adaptive dynamic heat dissipation device, central control equipment and electrical equipment control system

Abstract

The embodiment of the invention relates to a self-adaptive dynamic heat dissipation device, central control equipment and an electrical equipment control system.The circuit comprises a shell, a controller, a temperature sensor, a fan assembly, a movable cover plate and a cover plate driving assembly, a heat dissipation opening is formed in the side wall of the shell, and the movable cover plate is arranged on the side wall where the heat dissipation opening is located; the heat dissipation holes correspond to the heat dissipation holes; the controller is used for receiving the temperature sensing signal from the temperature sensor, and if the temperature indicated by the temperature sensing signal is larger than or equal to the preset temperature, the controller sends a cover plate opening instruction to the cover plate driving assembly and sends a fan starting instruction to the fan assembly, so that the fan assembly is started; the cover plate driving assembly is used for driving the movable cover plate to be opened according to the cover plate opening instruction. According to the embodiment of the invention, when heat dissipation is needed, the movable cover plate and the fan assembly can be opened, so that air in the shell flows out, the flowing air can block pollutants outside the heat dissipation opening, and the pollutants are prevented from damaging electronic components in the shell.

Description

Technical Field

[0001] This application relates to the field of intelligent electrical appliance technology, and in particular to an adaptive dynamic heat dissipation device, a central control device, and an electrical equipment control system. Background Technology

[0002] Currently, in the smart home field, there are control devices that can control electrical appliances through touch operation, voice interaction, and device linkage. For example, these control devices use a 4-inch screen as the interface and connect to smart devices throughout the house via wireless protocols (such as Wi-Fi and Bluetooth). Because these products generate heat during operation, their structure typically includes ventilation holes to dissipate heat when continuous operation generates high temperatures.

[0003] However, when the product is in standby mode, the temperature does not rise, so heat dissipation is unnecessary. However, due to the presence of ventilation holes, dust, lint, mold, and humid, polluted air in the room can enter the casing through these holes. For example, when the control device's base is embedded in a wall, the various bases in the room are connected by conduits within the wall. These conduits are filled with dust, lint, mold, and humid, polluted air, which then flows into the product. Dust, lint, and mold can adhere to the product's circuit boards, and in humid air, they can corrode the pins of electronic components or the circuit boards, or accelerate the oxidation and mold growth of electronic component pins, ultimately leading to equipment malfunction. Summary of the Invention

[0004] In view of this, in order to solve some or all of the above-mentioned technical problems, embodiments of this application provide an adaptive dynamic heat dissipation device, a central control device, and an electrical equipment control system.

[0005] In a first aspect, embodiments of this application provide an adaptive dynamic heat dissipation device, which includes: a housing, a controller, a temperature sensor, a fan assembly, a movable cover plate, and a cover plate driving assembly. A heat dissipation vent is provided on the side wall of the housing, and the movable cover plate is disposed on the side wall where the heat dissipation vent is located, corresponding to the heat dissipation vent. The fan assembly and the temperature sensor are disposed inside the housing. The temperature sensor, the cover plate driving assembly, and the fan assembly are all electrically connected to the controller. The controller is used to receive a temperature sensing signal from the temperature sensor. If the temperature indicated by the temperature sensing signal is greater than or equal to a preset temperature, the controller sends a cover plate opening command to the cover plate driving assembly and a fan start command to the fan assembly, causing the fan assembly to start. The cover plate driving assembly is used to drive the movable cover plate to open according to the cover plate opening command.

[0006] In one possible implementation, the controller is further configured to: if the temperature indicated by the temperature sensing signal is lower than a preset temperature, send a cover closing command to the cover driving assembly and a fan stop command to the fan assembly to stop the fan assembly from operating.

[0007] In one possible implementation, the cover plate driving assembly includes an electromagnet electrically connected to a controller; a magnetic force support is provided on the movable cover plate, and a preset distance is maintained between the magnetic force support and the electromagnet when the movable cover plate is closed; the cover plate driving assembly is used to drive the electromagnet to be energized when a cover plate opening command is received; the electromagnet generates an attractive force when energized, causing the magnetic force support to drive the movable cover plate to open.

[0008] In one possible implementation, a torsion spring is provided on the movable cover plate, and the closing torque generated by the torsion spring on the movable cover plate is less than the attraction force generated by the electromagnet on the magnetic support when energized.

[0009] In one possible implementation, the fan assembly includes a fan and an air duct structure, with the fan positioned at the air inlet of the air duct structure and the air outlet of the air duct structure connected to a heat dissipation port.

[0010] In one possible implementation, the device further includes a device plate that covers the housing to form an enclosed space inside the housing; a controller and a temperature sensor are disposed on the device plate; and a fan assembly, a movable cover plate, and a cover plate drive assembly are disposed within the enclosed space.

[0011] In one possible implementation, a wiring hole is provided on the side wall of the housing, one end of which extends through the bottom of the housing; a sealing gasket is provided between the other end of the wiring hole and the device plate.

[0012] Secondly, embodiments of this application provide a central control device, which includes: a display screen assembly and the adaptive dynamic heat dissipation device described in the first aspect; the adaptive dynamic heat dissipation device is installed in the wall in an embedded manner, and the display screen assembly is installed on the housing of the adaptive dynamic heat dissipation device and exposed outside the wall.

[0013] In one possible implementation, the central control device also includes a protective housing, which is embedded in the wall, and an adaptive dynamic heat dissipation device is installed inside the protective housing.

[0014] Thirdly, embodiments of this application provide an electrical equipment control system, including: at least one electrical device, and a central control device as described in the second aspect above, wherein the central control device is communicatively connected to the at least one electrical device.

[0015] The adaptive dynamic heat dissipation device, central control equipment, and electrical equipment control system provided in this application embodiment, by setting up a housing, controller, temperature sensor, fan assembly, movable cover plate, and cover plate drive assembly in the adaptive dynamic heat dissipation device, with heat dissipation vents provided on the side wall of the housing, and the movable cover plate set on the side wall where the heat dissipation vents are located, corresponding to the heat dissipation vents, and the fan assembly and temperature sensor are set inside the housing, the controller receives temperature sensing signals from the temperature sensor, if the temperature indicated by the temperature sensing signal is greater than or equal to a preset temperature, sends a cover plate opening command to the cover plate drive assembly and a fan start command to the fan assembly, causing the fan assembly to start and simultaneously driving the movable cover plate to open. This application embodiment realizes heat dissipation by opening the movable cover plate and fan when heat dissipation is needed, greatly improving the scattering efficiency. This application embodiment does not require heat dissipation holes on the housing, and when heat dissipation is needed, the movable cover plate and fan assembly can be opened to allow air inside the housing to flow out. The flowing air can block pollutants such as dust, lint, mold, and humid and polluted air outside the heat dissipation vents, avoiding damage to the electronic components inside the housing by pollutants, thereby improving heat dissipation performance and reducing the equipment failure rate. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0019] Figure 1 This is a schematic diagram of the structure of an adaptive dynamic heat dissipation device provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of another adaptive dynamic heat dissipation device provided in an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the circuit board structure provided in an embodiment of this application;

[0022] Figure 4A cross-sectional schematic diagram of the adaptive dynamic heat dissipation device provided in the embodiments of this application;

[0023] Figure 5 This is a rear view of the adaptive dynamic heat dissipation device provided in an embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the structure of the sealing gasket provided in the embodiments of this application;

[0025] Figure 7 This is a schematic diagram of the structure of a central control device provided in an embodiment of this application;

[0026] Figure 8 This is a schematic diagram of another central control device provided in an embodiment of this application;

[0027] Figure 9 This is a schematic diagram of the structure of an electrical equipment control system provided in an embodiment of this application.

[0028] Figure label:

[0029] 100 - Adaptive dynamic heat dissipation device; 101 - Housing; 102 - Controller; 103 - Temperature sensor; 104 - Fan assembly; 1041 - Fan; 1042 - Air duct structure; 105 - Movable cover; 106 - Cover drive assembly; 1061 - Electromagnet; 107 - Heat dissipation vent; 108 - Magnetic support; 109 - Torsion spring; 110 - Wiring hole; 111 - Circuit board; 112 - Sealing gasket; 700 - Central control equipment; 701 - Display assembly; 702 - Protective housing; 900 - Electrical equipment control system; 901 - At least one electrical device. Detailed Implementation

[0030] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application.

[0031] Those skilled in the art will understand that the terms "first" and "second" in the embodiments of this application are only used to distinguish different steps, devices or modules, and do not represent any specific technical meaning, nor do they indicate the logical order between them.

[0032] It should also be understood that in this embodiment, "multiple" can refer to two or more, and "at least one" can refer to one, two or more.

[0033] It should also be understood that any component, data or structure mentioned in the embodiments of this application can generally be understood as one or more unless explicitly defined or given contrary guidance in the context.

[0034] Furthermore, the term "and / or" in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0035] It should also be understood that the description of the various embodiments in this application emphasizes the differences between the various embodiments, and the similarities or similarities can be referred to each other. For the sake of brevity, they will not be described in detail.

[0036] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0037] Techniques, circuits, and devices known to a person skilled in the art may not be discussed in detail, but where appropriate, such techniques, circuits, and devices should be considered part of the specification.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. To facilitate understanding of the embodiments of this application, the application will be described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0040] Figure 1 This is a schematic diagram of an adaptive dynamic heat dissipation device 100 provided in an embodiment of this application. This device 100 is typically used in central control equipment that controls various electrical devices. The device 100 specifically includes: a housing 101, a controller 102, a temperature sensor 103, a fan assembly 104, a movable cover 105, and a cover drive assembly 106.

[0041] A heat dissipation vent 107 is provided on the side wall of the housing 101, and a movable cover plate 105 is provided on the side wall where the heat dissipation vent 107 is located, corresponding to the heat dissipation vent 107. Figure 1As shown, the side where the heat dissipation vent 107 is located is parallel to the surface of the movable cover plate 105, and the movable cover plate 105 can block the heat dissipation vent 107 when it is closed.

[0042] The fan assembly 104 and the temperature sensor 103 are housed inside the housing 101. The temperature sensor 103, the cover drive assembly 106, and the fan assembly 104 are all electrically connected to the controller 102.

[0043] The fan assembly 104 may include components such as fan blades, fan drive circuit, and fan mounting bracket. The controller 102 can control the fan assembly 104 to start or stop by sending commands to the fan drive circuit.

[0044] The controller 102 receives a temperature sensing signal from the temperature sensor 103. If the temperature indicated by the temperature sensing signal is greater than or equal to a preset temperature, it sends a cover opening command to the cover driving assembly 106 and a fan start command to the fan assembly 104, causing the fan assembly 104 to start. The cover driving assembly 106 drives the movable cover 105 to open according to the cover opening command.

[0045] During normal operation of the device containing the adaptive dynamic heat dissipation device 100, the housing 101 needs to be sealed. The temperature inside the housing 101 rises due to heat dissipation from the electronic components. When the temperature reaches a preset temperature (e.g., 45°C), the controller 102 activates the fan assembly 104. When the fan assembly 104 is running, airflow occurs within the housing 101, and hot air escapes through the ventilation holes, thus achieving active heat dissipation. Figure 2 As shown, the housing 101 isolates the internal space from the outside through the circuit board 111. When the movable cover 105 is in the open state, its surface is at a certain angle to the side wall of the housing 101, so that air flows out from the heat dissipation port 107.

[0046] like Figure 1 As shown, the air inlet of the fan assembly 104 is parallel to the bottom surface of the housing 101. Air enters from the air inlet, passes through the air duct on the side of the fan, and flows out of the housing 101 from the heat dissipation vent 107 on the side wall.

[0047] The controller 102 described above is a variety of electronic devices with logic processing capabilities, such as MCU (Microcontroller Unit) and DSP (Digital Signal Processor). The controller 102 can be installed inside or outside the housing 101, and is connected to the fan assembly 104 and the cover plate drive assembly 106 inside the housing 101 via cables. Figure 1 The location of the controller 102 shown is only an example and does not constitute a limitation on the installation location of the controller 102.

[0048] The aforementioned cover plate drive assembly 106 can respond to commands sent by the controller 102, thereby driving the movable cover plate 105 to move, so that the movable cover plate 105 can block or open the heat dissipation vent 107. The aforementioned cover plate drive assembly 106 can be implemented in various ways. For example, a servo motor can be installed on the side wall of the housing 101, and by controlling the rotation of the servo motor, the transmission components such as the screw can be driven to move, thereby opening or closing the movable cover plate 105.

[0049] The adaptive dynamic heat dissipation device provided in this application embodiment comprises a housing 101, a controller 102, a temperature sensor 103, a fan assembly 104, a movable cover 105, and a cover drive assembly 106. The housing 101 has heat dissipation vents 107 on its sidewalls. The movable cover 105 is positioned on the sidewall where the heat dissipation vents 107 are located, corresponding to the vents. The fan assembly 104 and the temperature sensor 103 are housed within the housing 101. The controller 102 receives temperature sensing signals from the temperature sensor 103. If the temperature indicated by the temperature sensing signal is greater than or equal to a preset temperature, it sends a cover opening command to the cover drive assembly 106 and a fan start command to the fan assembly 104, causing the fan assembly 104 to start and simultaneously driving the movable cover 105 to open. This application embodiment achieves heat dissipation by opening the movable cover 105 and the fan when heat dissipation is needed, significantly improving scattering efficiency. In this embodiment, there is no need to provide heat dissipation holes on the housing 101. When heat dissipation is required, the movable cover 105 and the fan assembly 104 can be opened to allow air to flow out of the housing 101. The flowing air can block pollutants such as dust, lint, mold, and humid air from entering the heat dissipation vent 107, thus preventing pollutants from damaging the electronic components inside the housing 101. This improves heat dissipation performance and reduces the equipment failure rate.

[0050] In some optional implementations of this embodiment, the controller 102 is further configured to:

[0051] If the temperature indicated by the temperature sensing signal is lower than the preset temperature, a cover closing command is sent to the cover driving assembly 106 and a fan stop command is sent to the fan assembly 104 to stop the fan assembly 104 from running.

[0052] Specifically, after the fan assembly 104 is started and the movable cover 105 is opened, the temperature inside the housing 101 will gradually decrease as heat dissipation proceeds. When the temperature drops below the preset temperature, the fan assembly 104 can be stopped and the movable cover 105 can be closed to prevent dust, mold and other contaminants from entering the housing 101.

[0053] This embodiment enables the movable cover 105 and fan assembly 104 to be closed when heat dissipation is not required, keeping the inside of the housing 101 in a closed state. This prevents contaminants such as dust, lint, mold, and humid air from entering the housing 101 and damaging electronic components, thereby further reducing the equipment failure rate.

[0054] In some optional implementations of this embodiment, such as Figure 3 As shown, the cover plate driving assembly 106 includes an electromagnet 1061, which is electrically connected to the controller 102. Figure 3 The electromagnet 1061 shown is mounted on a circuit board 111 and connected to a controller 102 also on the circuit board 111. When the circuit board 111 covers the housing 101, the electromagnet 1061 is located in an enclosed space within the housing 101.

[0055] like Figure 1 , Figure 2 As shown, a magnetic support 108 is provided on the movable cover 105. When the movable cover 105 is closed, the magnetic support 108 and the electromagnet 1061 maintain a preset distance.

[0056] The magnetic support 108 can be made of various materials such as metal sheets or permanent magnets. When it is a magnet, the attraction between the electromagnet 1061 and the permanent magnet is greater, which makes the movable cover 105 more stable when it is open.

[0057] The cover plate driving assembly 106 is used to drive the electromagnet 1061 to be energized when a cover plate opening command is received; the electromagnet 1061 generates an attractive force when energized, causing the magnetic support 108 to drive the movable cover plate 105 to open.

[0058] The electromagnet 1061 may include a coil, and the cover drive assembly 106 responds to the cover opening command or the cover closing command, thereby energizing or de-energizing the electromagnet 1061. For example, the cover drive assembly 106 may include switching elements such as transistors, field-effect transistors, and relays, and energizes or de-energizes the electromagnet 1061 by receiving the cover opening command or cover closing command from the controller 102.

[0059] Because the electromagnet 1061 has a simple structure and generates a stable magnetic force, the device structure can be simplified, the cost can be reduced, and the movable cover 105 can be kept in the open state more stably under the control of the controller 102.

[0060] In some optional implementations of this embodiment, such as Figure 1 , Figure 2As shown, a torsion spring 109 is provided on the movable cover plate 105. The closing torque generated by the torsion spring 109 on the movable cover plate 105 is less than the attraction force generated by the electromagnet 1061 on the magnetic support 108 when energized.

[0061] The direction of the aforementioned closing torque is towards the side wall where the heat dissipation vent 107 is located. When the electromagnet 1061 is energized, the movable cover 105 can be opened under the action of the attraction because the closing torque is less than the attraction force generated by the electromagnet 1061; when the electromagnet 1061 is de-energized, the closing torque can restore the movable cover 105 to the closed state.

[0062] In this embodiment, by setting a torsion spring 109, the movable cover 105 is restored to the closed state by mechanical force when the temperature inside the housing 101 is low, without the need to continue to provide power to the cover drive assembly 106, thereby helping to reduce power consumption and simplify the structure of the device.

[0063] In some optional implementations of this embodiment, such as Figure 1 As shown, the fan assembly 104 includes a fan 1041 and an air duct structure 1042. The fan 1041 is disposed at the air inlet of the air duct structure 1042, and the air outlet of the air duct structure 1042 is connected to the heat dissipation port 107.

[0064] like Figure 4 As shown, it illustrates a cross-sectional schematic diagram of the adaptive dynamic heat dissipation device. Figure 4 The movable cover 105 is in the open state. When the fan 1041 rotates, as shown by the arrow in the figure, air enters the air duct structure 1042 from the air inlet, flows from the air outlet of the air duct structure 1042 to the heat dissipation port 107, and then flows out of the housing 101.

[0065] In this embodiment, by setting an air duct structure 1042 in the fan assembly 104, the air inside the housing 101 can flow out of the housing 101 through the air duct, thereby dissipating heat more efficiently from the inside of the housing 101.

[0066] In some optional implementations of this embodiment, such as Figure 2 As shown, the device also includes a circuit board 111, which covers the housing 101 to form a closed space inside the housing 101.

[0067] It should be noted that after the circuit board 111 covers the housing 101, it does not completely seal the interior of the housing 101. The edges of the circuit board 111 may have gaps, or ventilation holes may be provided on the circuit board 111, allowing outside air to flow into the housing 101 and improving heat dissipation efficiency. Typically, this adaptive dynamic heat dissipation device is embedded in the wall. When the fan assembly 104 is running, indoor air can flow into the interior space of the housing 101 through the gaps at the edges of the circuit board 111.

[0068] like Figure 3 As shown, the controller 102 and temperature sensor 103 are mounted on the circuit board 111; the fan assembly 104, the movable cover 105, and the cover drive assembly 106 are mounted in the enclosed space.

[0069] When the circuit board 111 covers the housing 101 Figure 3 The circuit board 111 shown is flipped over and fixed to the housing 101 by bolts, forming as shown. Figure 2 The state shown. At this time, the temperature sensor 103, controller 102 and other devices on the circuit board 111 are located in the enclosed space inside the housing 101.

[0070] In this embodiment, the housing 101 is enclosed by setting up a circuit board 111, and the controller 102, temperature sensor 103 and other devices are set on the circuit board 111. This makes the circuit structure of the device simpler, the heat generation location more concentrated, and improves the heat dissipation efficiency of electronic devices.

[0071] In some optional implementations of this embodiment, such as Figure 1 As shown, a wiring hole 110 is provided on the side wall of the housing 101, and one end of the wiring hole 110 extends through the bottom of the housing 101. Figure 5 As shown, it illustrates a schematic diagram of the rear side of the housing 101. Figure 5 As can be seen, the wiring hole 110 penetrates the bottom of the housing 101, and the cable can be connected to the circuit board 111 inside the housing 101 through the wiring hole 110.

[0072] like Figure 6 As shown, the wiring hole 110 is located at one end inside the housing 101, and a sealing gasket 112 is provided between it and the circuit board 111. The sealing gasket 112 can completely isolate the space inside the wiring hole 110 from the internal space of the housing 101. It should be noted that, for the purpose of illustrating the shape of the sealing gasket 112, Figure 6 The sealing gasket 112 shown is not placed between the circuit board 111 and the wiring hole 110. In actual installation, the sealing gasket 112 needs to be placed on the wiring hole 110, and then the circuit board 111 is covered on the sealing gasket 112 and fixed, so as to achieve complete isolation between the wiring hole 110 and the internal space of the housing 101.

[0073] This embodiment achieves complete isolation between the wiring hole 110 and the internal space of the housing 101 by setting the wiring hole 110 and the sealing gasket 112. The cable outside the housing 101 is connected to one end of the wiring hole 110 at the bottom of the housing 101, thereby preventing contaminants outside the housing 101 from entering the interior of the housing 101 through the wiring hole 110, and further reducing the risk of damage to the internal components of the housing 101 caused by contaminants.

[0074] Figure 7 A schematic diagram of the structure of a central control device 700 provided in this application embodiment is shown below. Figure 7 As shown, the central control device 700 specifically includes: a display screen assembly 701 and the aforementioned adaptive dynamic heat dissipation device 100.

[0075] The adaptive dynamic heat dissipation device is installed in the wall by embedding, and the display assembly 701 is mounted on the housing 101 of the adaptive dynamic heat dissipation device and exposed outside the wall.

[0076] The display assembly 701 can be connected to various electronic components within the adaptive dynamic heat dissipation device via terminal blocks. The portion of the central control equipment embedded in the wall is completely isolated from the conduits in the wall, and the cables in the conduits can be connected to the housing 101 via the wiring holes 110 on the housing 101 of the adaptive dynamic heat dissipation device.

[0077] The central control device provided in this application embodiment, by applying the above-mentioned adaptive dynamic heat dissipation device, can turn on the fan assembly 104 and the movable cover plate 105 when the temperature of the part embedded in the cavity is high, so as to cool down the components inside the housing 101, thereby blocking pollutants such as dust, lint, mold, and humid and polluted air in the conduit inside the wall from the housing 101, avoiding damage to the electronic components inside the central control device by pollutants, and reducing the failure rate of the central control device while improving heat dissipation performance.

[0078] In some optional implementations of this embodiment, such as Figure 8 As shown, the central control device also includes a protective housing 702, which is installed in the wall by embedding, and an adaptive dynamic heat dissipation device is installed inside the protective housing 702.

[0079] The protective shell 702 may be provided with a wire hole to facilitate the connection of the wire to the outer shell of the aforementioned adaptive dynamic heat dissipation device.

[0080] In this embodiment, by setting a protective shell 702 inside the wall, a part of the central control equipment is installed inside the protective shell 702, which facilitates the installation and disassembly of the central control equipment and improves the convenience of equipment maintenance.

[0081] Figure 9 This is a schematic diagram of the structure of an electrical equipment control system 900 provided in an embodiment of this application, as shown below. Figure 9 As shown, the electrical equipment control system 900 includes: at least one electrical device 901 (including electrical devices 1-N), and a central control device 700 described in the above embodiments, wherein the central control device is communicatively connected to at least one electrical device 901.

[0082] The aforementioned electrical appliances can be of various types, such as air conditioners, televisions, refrigerators, robot vacuum cleaners, and other smart home devices.

[0083] The central control device can communicate with at least one electrical device 901 via wired or wireless means. The central control device can perform functions such as voice recognition, status monitoring, and touchscreen control, thereby providing convenience for users to manage electrical equipment.

[0084] The electrical equipment control system provided in this application embodiment can actively cool the components inside the housing by applying the above-mentioned central control equipment, and block pollutants such as dust, lint, mold, and humid and polluted air in the conduit inside the wall from the outside of the housing, so as to avoid damage to the electronic components inside the central control equipment and reduce the equipment failure rate.

[0085] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different circuits to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0086] The steps of the circuits or algorithms described in connection with the embodiments disclosed herein can be implemented in hardware, software modules executed by a processor, or a combination of both. The software modules can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium known in the art.

[0087] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also mean including the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0088] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An adaptive dynamic heat dissipation device, characterized in that, The device includes: a housing, a controller, a temperature sensor, a fan assembly, a movable cover plate, and a cover plate driving assembly. A heat dissipation vent is provided on the side wall of the housing, and the movable cover plate is disposed on the side wall where the heat dissipation vent is located, corresponding to the heat dissipation vent. The fan assembly and the temperature sensor are disposed within the housing; The temperature sensor, the cover plate drive assembly, and the fan assembly are all electrically connected to the controller; The controller is used to receive a temperature sensing signal from the temperature sensor. If the temperature indicated by the temperature sensing signal is greater than or equal to a preset temperature, it sends a cover opening command to the cover driving assembly and a fan start command to the fan assembly to start the fan assembly. The cover plate driving component is used to drive the movable cover plate to open according to the cover plate opening command.

2. The apparatus according to claim 1, characterized in that, The controller is also used for: If the temperature indicated by the temperature sensing signal is lower than the preset temperature, a cover closing command is sent to the cover driving assembly, and a fan stop command is sent to the fan assembly to stop the fan assembly from running.

3. The apparatus according to claim 1, characterized in that, The cover plate driving assembly includes an electromagnet, which is electrically connected to the controller. A magnetic force support is provided on the movable cover plate. When the movable cover plate is closed, the magnetic force support and the electromagnet maintain a preset distance. The cover plate driving assembly is used to drive the electromagnet to be energized when the cover plate opening command is received; the electromagnet generates an attractive force when energized, causing the magnetic support to drive the movable cover plate to open.

4. The apparatus according to claim 3, characterized in that, A torsion spring is provided on the movable cover plate. The closing torque generated by the torsion spring on the movable cover plate is less than the attraction force generated by the electromagnet on the magnetic support when energized.

5. The apparatus according to claim 1, characterized in that, The fan assembly includes a fan and an air duct structure. The fan is disposed at the air inlet of the air duct structure, and the air outlet of the air duct structure is connected to the heat dissipation port.

6. The apparatus according to claim 1, characterized in that, The device also includes a device plate that covers the housing, thereby forming a closed space inside the housing. The controller and the temperature sensor are mounted on the device board; The fan assembly, the movable cover plate, and the cover plate drive assembly are disposed within the enclosed space.

7. The apparatus according to claim 6, characterized in that, A wiring hole is provided on the side wall of the housing, one end of which penetrates through the bottom of the housing; a sealing gasket is provided between the other end of the wiring hole and the device plate.

8. A central control device, characterized in that, The central control device includes: a display screen assembly and an adaptive dynamic heat dissipation device as described in any one of claims 1-7; The adaptive dynamic heat dissipation device is installed in the wall by embedding, and the display screen assembly is mounted on the housing of the adaptive dynamic heat dissipation device and exposed outside the wall.

9. The central control device according to claim 8, characterized in that, The central control device also includes a protective shell, which is embedded in the wall, and the adaptive dynamic heat dissipation device is installed inside the protective shell.

10. An electrical equipment control system, characterized in that, include: At least one electrical device, and a central control device as described in claim 8 or 9, wherein the central control device is communicatively connected to the at least one electrical device.

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