Wafer spraying mechanism and method
By designing the spraying components and the loop structure, the problem of solution waste in the wafer spraying mechanism is solved, achieving uniform spraying on the wafer surface, avoiding solution waste, and facilitating use.
Patent Information
- Application Number
- CN202511624649.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2025-12-12
AI Technical Summary
Existing wafer coating mechanisms suffer from solution waste during uniform coating and cannot achieve uniform coating without relying on wafer rotation.
It adopts a spraying assembly and a return structure. The nozzle is driven to move in a spiral motion by a sliding component to achieve uniform spraying, and the nozzle is returned to its original position by a return structure to avoid solution waste.
It enables uniform spraying of solution from the nozzle without relying on wafer rotation, avoiding solution waste and making it easy to use.
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Figure CN121103580A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of spray coating technology, specifically to a wafer spray coating mechanism and method. Background Technology
[0002] A wafer is a silicon wafer formed after a silicon ingot has been ground, polished, and sliced. It refers to the raw material used to make silicon semiconductor circuits. In the photolithography process of chips, a wafer spraying machine is used to spray photoresist, thin film, etc. onto the surface of the wafer.
[0003] However, existing wafer coating equipment directly drips the solution onto the center of the wafer. To achieve more uniform coating, the wafer needs to be rotated, using the centrifugal force generated by the rotation to move the liquid outward and gradually spread it across the wafer surface. However, this method has certain drawbacks. During rotation, the solution in the center gradually diffuses outward, requiring a continuous supply of solution to the wafer. At the same time, some liquid is thrown off the wafer, resulting in solution waste. It is impossible to avoid solution waste while ensuring uniform coating, making it inconvenient to use. Summary of the Invention
[0004] The purpose of this invention is to solve the problem that existing wafer coating mechanisms cannot avoid wasting solution while ensuring uniform coating, which makes them inconvenient to use.
[0005] To achieve the above objectives, the present invention provides the following technical solution: The wafer coating system includes: A coating assembly, comprising: a nozzle for coating wafers; A loop structure is disposed above the nozzle to allow the nozzle to move outward during spraying; the loop structure includes a slider connected to the nozzle to drive the nozzle to move. A return structure is connected to the loop structure; the return structure includes a push gripper, which is located on the same horizontal plane as the sliding member, so that when the push gripper moves, it can push the sliding member to move and return the nozzle to its original position.
[0006] Preferably, the loop structure further includes: A support plate, wherein a groove is formed on the lower end face of the support plate, the groove being composed of a strip groove and a spiral groove, the strip groove and the spiral groove being intersected, and the two ends of the strip groove being connected to the two ends of the spiral groove; A lever is positioned parallel to the bottom of the support plate; The first motor is fixedly mounted above the support plate; The bevel gear set consists of a first bevel gear and a second bevel gear. The axis of the first bevel gear passes through the support plate and is fixedly connected to one end of the actuating rod. The axis of the second bevel gear is fixedly connected to the output end of the first motor. The edge of the first bevel gear meshes with the edge of the second bevel gear. This allows the actuating rod to rotate in a horizontal plane through the bevel gear set when the first motor is running.
[0007] Preferably, the sliding member consists of a vertical rod and three sets of coaxially arranged discs. The lower disc is fixedly connected to the nozzle; the upper disc is disposed in the slide groove and is slidably connected to the support plate through the slide groove; the surface of the vertical rod is in contact with the edge of the actuating rod, so that when the actuating rod rotates, it can apply a pushing force to the vertical rod, causing the vertical rod to move along the slide groove; the two ends of the vertical rod are fixedly connected to the upper and lower sets of discs and pass through the middle disc.
[0008] Preferably, the return structure further includes: An electric actuator is positioned above the support plate; A connecting rod, the two ends of which are fixedly connected to the output ends of the push gripper and the electric push rod, so that when the electric push rod is started, it can push the connecting rod and the push gripper to move synchronously. Multiple sets of guide blocks are disposed in the strip groove, so that the guide blocks can prevent the slider from entering the strip groove; A lifting structure is fixedly connected to the guide block and is used to lift the guide block.
[0009] Preferably, the pushing claw has a notch on the side near the slider, and the inner diameter of the notch is the same as the outer diameter of the disk in the middle, so that the pushing claw can fix the disk in the middle when pushing the disk in the middle to move.
[0010] Preferably, the lifting structure includes: Two sets of grooved plates are connected by a crossbar in the middle; the grooved plates are fixedly connected to the connecting rod, so that the two sets of grooved plates move vertically along with the connecting rod at the same time; the surface of the grooved plates is provided with sliding tracks; A sliding rod, both ends of which are disposed in the slide rail and are slidably connected to the groove plate through the slide rail, so that when the groove plate moves horizontally, the sliding rod can move vertically through the slide rail; A movable plate is disposed above the support plate and directly above the strip groove; the movable plate is fixedly connected to the sliding rod; the side of the movable plate near the support plate is fixedly connected to multiple sets of guide blocks, so that when the sliding rod moves vertically, it can drive the movable plate and multiple sets of guide blocks to move synchronously. Two sets of limiting components are symmetrically arranged on both sides of the movable plate and connected to the movable plate, so that the movable plate can move in the vertical direction.
[0011] Preferably, each set of the limiting components includes: A movable sleeve is fixedly connected to the movable plate; A limiting rod passes through the movable sleeve and is slidably connected to the movable sleeve, so that the limiting rod can restrict the movable sleeve to move only vertically; one end of the limiting rod is fixedly connected to the support plate.
[0012] Preferably, it further includes: an adjustment structure; the adjustment structure is disposed between the two sets of groove plates and connected to the support plate, for blocking the spiral groove on the support plate and restricting the movement of the sliding member.
[0013] Preferably, the adjustment structure includes: The protective frame is fixedly connected to the support plate; Two sets of movable rods, one end of each set of movable rods passing through the protective frame and slidably connected to the protective frame; cylindrical pins are provided on the surface of the movable rods; A limiting plate is fixedly connected to the other end of the moving rod, so that the limiting plate and the moving rod move synchronously; the limiting plate is located in the spiral groove, so that when the limiting plate contacts the sliding member, it can stop the sliding member in the strip groove; A rotating component has slots at both ends, in which the cylindrical pin is placed and slidably connected to the cylindrical pin through the slots. When the rotating component rotates, it can cause two sets of cylindrical pins to move vertically through the slots, and the two sets of cylindrical pins move in opposite directions. The output end of the second motor is fixedly connected to the center of the rotating component.
[0014] Preferably, the spraying assembly further includes: A mixing component is fixedly mounted above the support plate; the liquid inlet of the mixing component is connected to an external pipeline. A connecting pipe, one end of which is connected to the liquid outlet of the mixing component, and the other end of which is connected to the nozzle; The structure is arranged and connected to the connecting pipe for tidying up the connecting pipe.
[0015] Preferably, the finishing structure includes: Two sets of second transverse wheels, the edges of which are in contact with the connecting pipe and located on both sides of the connecting pipe, can cause the two sets of second transverse wheels to move in opposite directions when the connecting pipe is moved by an external force; Two sets of elastic elements, each set of elastic elements has a baffle at one end and a support frame at the other end, the support frame is rotatably connected to the second transverse wheel; the edge of the baffle is fixedly connected to the support plate; A limiting post penetrates the baffle and is slidably connected to the baffle; one end of the limiting post is fixedly connected to the support frame, and the limiting post can restrict the movement direction of the support frame; A guide structure, connected to the connecting pipe, is used to control the direction of movement of the connecting pipe.
[0016] Preferably, the guiding component includes: A vertical wheel is disposed on the edge of the support plate and is rotatably connected to the support plate; the edge of the vertical wheel is in contact with the connecting pipe, and the vertical wheel can change the moving direction of the connecting pipe in a vertical plane; Two sets of first transverse wheels, the edges of which are in contact with the connecting pipe and located close to the mixing component and the vertical wheel, the first transverse wheels being able to change the direction of movement of the connecting pipe in a horizontal plane.
[0017] A wafer coating method, applied to a wafer coating mechanism as described in any one of claims, characterized in that: the method includes the following steps: Step S: By operating the spraying assembly, the spraying assembly can directly spray the surface of the wafer; Step S: By operating the loop structure, the spraying assembly will rotate and move outward during the spraying process, so as to evenly spray the solution onto the surface of the wafer. Step S: After spraying is completed, the return structure is activated, which pushes the gripper to return the slider and nozzle to the starting position of the spraying process, ready for the next spraying cycle. The beneficial effect of this invention is that the return structure allows the slider to move spirally outwards, simultaneously moving the nozzle and ensuring even spraying on the wafer. This eliminates reliance on wafer rotation, avoids solution waste, and simplifies operation. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 A three-dimensional diagram of the central connecting structure viewed from below; Figure 3 for Figure 2 Enlarged 3D schematic diagram of the central connecting structure; Figure 4 for Figure 3 A three-dimensional diagram of the central connecting structure viewed from below; Figure 5 for Figure 4 Exploded view of the middle section connection structure; Figure 6 for Figure 1 Enlarged 3D schematic diagram of the central connecting structure; Figure 7 for Figure 6 A three-dimensional diagram of the central connecting structure viewed from below; Figure 8 for Figure 7 Enlarged 3D schematic diagram of the central connecting structure; Figure 9 for Figure 8 A three-dimensional diagram of the central connecting structure viewed from below; Figure 10 for Figure 5 Enlarged 3D schematic diagram of the central connecting structure; Figure 11 for Figure 10 Exploded view of the central connecting structure; Figure 12 for Figure 1 A three-dimensional schematic diagram of the connection structure of the central nozzle, connecting pipe, and mixing component.
[0019] In the diagram: 1. Nozzle, 2. Sliding component, 3. Support plate, 4. Bevel gear set, 5. First motor, 6. Actuating rod, 7. Connecting rod, 8. Electric push rod, 9. Pushing gripper, 10. Slot plate, 11. Sliding rod, 12. Moving plate, 13. Guide block, 14. Limiting rod, 15. Moving sleeve, 16. Connecting pipe, 17. Mixing component, 18. Vertical wheel, 19. First horizontal wheel, 20. Second horizontal wheel, 21. Elastic component, 22. Limiting post, 23. Protective frame, 24. Moving rod, 25. Limiting plate, 26. Rotating component, 27. Second motor. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings: This embodiment: Please see Figure 1-12 In this embodiment, the wafer coating mechanism includes a coating component, a loop structure, and a return structure.
[0021] In this embodiment, the spraying assembly includes a spray nozzle 1 for spraying coating onto the wafer.
[0022] In this embodiment, the solution inlet size of the nozzle 1 is larger than the solution outlet size; the sprayed solution is photoresist.
[0023] A loop structure is disposed above the nozzle 1 to allow the nozzle 1 to move outward during spraying; the loop structure includes a slider 2, which is connected to the nozzle 1 and is used to drive the nozzle 1 to move.
[0024] In this embodiment, by operating the loop structure, the sliding member 2 can be moved spirally outward. The sliding member 2 simultaneously drives the nozzle 1 to move, so that the nozzle 1 can be evenly sprayed on the wafer without relying on the rotation of the wafer, thus avoiding waste of solution and making it easy to use.
[0025] The return structure is connected to the loop structure; the return structure includes: a pusher 9, which is located on the same horizontal plane as the slider 2, so that when the pusher 9 moves, it can push the slider 2 to move and return the nozzle 1 to its original position.
[0026] In this embodiment, by operating the return structure, the return structure can push the slider 2 and the nozzle 1, which have been moved to the outer position, back to their original positions. During the return process, the nozzle 1 stops spraying to prevent waste of solution.
[0027] like Figure 3 and Figure 4 As shown, the loop structure also includes: a support plate 3, a toggle lever 6, a bevel gear set 4, and a first motor 5.
[0028] The lower end face of the support plate 3 is provided with a sliding groove, which is composed of a strip sliding groove and a spiral sliding groove. The strip sliding groove and the spiral sliding groove are arranged intersectingly, and the two ends of the strip sliding groove are connected to the two ends of the spiral sliding groove.
[0029] In this embodiment, when the slider 2 is in the spiral groove, the loop structure will push the slider 2 to move outward along the spiral groove; while when the slider 2 is in the strip groove, the return structure will push the slider 2 to move along the strip groove; the shape of the support plate 3 is not limited, and can be circular, hexagonal, octagonal, etc.
[0030] The lever 6 is positioned parallel to the bottom of the support plate 3.
[0031] In this embodiment, by rotating the lever 6, a force can be transmitted to the slider 2, causing the slider 2 to move along the groove.
[0032] The first motor 5 is fixedly mounted above the support plate 3.
[0033] In this embodiment, the first motor 5 is a small motor, which is a common existing technology on the market, and will not be described in detail here; the model of the first motor 5 is selected according to actual needs, as long as it meets the working conditions.
[0034] The bevel gear set 4 consists of a first bevel gear and a second bevel gear. The shaft of the first bevel gear passes through the support plate 3 and is fixedly connected to one end of the lever 6. The shaft of the second bevel gear is fixedly connected to the output end of the first motor 5. The edge of the first bevel gear meshes with the edge of the second bevel gear. This allows the lever 6 to rotate in the horizontal plane through the bevel gear set 4 when the first motor 5 is running.
[0035] In this embodiment, the bevel gear set 4 is used to change the rotation in the vertical plane to the rotation in the horizontal plane; the tooth ratio of the first bevel gear and the second bevel gear is 3 to 1, that is, the second bevel gear rotates three times for the first bevel gear to rotate one time.
[0036] When the nozzle 1 starts spraying, the external power supply of the first motor 5 is connected and the first motor 5 is started. The output end of the first motor 5 drives the lever 6 to rotate horizontally through the change of the bevel gear set 4. After the lever 6 contacts the sliding member 2, it pushes the sliding member 2 to move along the inner wall of the slide groove, so that the sliding member 2 moves spirally outward. At the same time, the sliding member 2 drives the nozzle 1 to move, so that the nozzle 1 can spray evenly on the wafer without relying on the rotation of the wafer, avoiding waste of solution and making it easy to use.
[0037] like Figure 5 As shown, the sliding member 2 consists of a vertical rod and three sets of coaxially arranged discs. The lower disc is fixedly connected to the nozzle 1; the upper disc is set in the slide groove and is slidably connected to the support plate 3 through the slide groove; the surface of the vertical rod is in contact with the edge of the actuating rod 6, so that when the actuating rod 6 rotates, it can apply a pushing force to the vertical rod, causing the vertical rod to move along the slide groove; the two ends of the vertical rod are fixedly connected to the upper and lower sets of discs and pass through the middle disc.
[0038] In this embodiment, the actuating rod 6 is located between the middle disk and the lower disk. As the actuating rod 6 rotates horizontally, it will contact the vertical rod and push the vertical rod to move. Since there is no rigid connection between the actuating rod 6 and the vertical rod, the sliding member 2 will move outward along the groove after being subjected to force.
[0039] like Figure 6 and Figure 7 As shown, the return structure also includes: an electric push rod 8, a connecting rod 7, multiple sets of guide blocks 13, and a lifting structure.
[0040] Specifically, the electric push rod 8 is positioned above the support plate 3.
[0041] In this embodiment, the electric actuator 8 is a common structure on the market, and its model can be selected according to actual needs, as long as it meets the working conditions.
[0042] The two sets of connecting rods 7 are fixedly connected to the output ends of the push gripper 9 and the electric push rod 8, so that when the electric push rod 8 is started, it can push the connecting rods 7 and the push gripper 9 to move synchronously.
[0043] In this embodiment, the connecting rod 7 is shaped like a "U" after being rotated 90 degrees clockwise, and the length of the upper side is shorter than the length of the lower side. At the same time, the length of the lower side is greater than the radius of the support plate 3, so that the support plate 3 will not hinder the movement of the connecting rod 7.
[0044] Multiple sets of guide blocks 13 are disposed in the strip groove, so that the guide blocks 13 can prevent the slider 2 from entering the strip groove.
[0045] In this embodiment, due to the intersection of the strip groove and the spiral groove, part of the spiral groove will be cut off. The shape of the multiple sets of guide blocks 13 is the same as the cut-off part, so that when the moving plate 12 contacts the support plate 3, the guide blocks 13 will block the cut-off part, so that the slider 2 will not move into the cut-off part when it moves spirally.
[0046] The lifting structure is fixedly connected to the guide block 13 and is used to lift the guide block 13.
[0047] like Figure 2 As shown, the push gripper 9 has a notch on the side near the slider 2, and the inner diameter of the notch is the same as the outer diameter of the disk in the middle, so that the push gripper 9 can fix the disk in the middle when it pushes the disk in the middle to move.
[0048] In this embodiment, when the pusher 9 moves, it will contact the middle disk on the slider 2; the notch shape of the pusher 9 is the same as the cross-sectional shape of the middle disk.
[0049] When it is necessary to return to the original position, the external power supply of the electric push rod 8 is turned on, and the electric push rod 8 is started, causing the output end of the electric push rod 8 to retract. This causes the connecting rod 7 to drive the jaw 9 to move synchronously. After the jaw 9 moves a certain distance, it will contact the sliding part 2 located at the edge. As the jaw 9 continues to move, it will push the sliding part 2 to move, so that the sliding part 2 returns to its original position along the strip groove, making it easier to spray the next time.
[0050] like Figure 8 and Figure 9 As shown, the lifting structure includes: two sets of slot plates 10, sliding rods 11, moving plates 12, and two sets of limiting components.
[0051] The two sets of groove plates 10 are connected by a crossbar in the middle; the groove plates 10 are fixedly connected to the connecting rod 7, so that the two sets of groove plates 10 move vertically with the connecting rod 7 at the same time; the surface of the groove plates 10 is provided with a slide rail.
[0052] In this embodiment, the two sets of groove plates 10 can be moved synchronously by the crossbar; the slide consists of a horizontal slide and an inclined slide, one end of the horizontal slide is connected to the upper end of the inclined slide, and the included angle between the horizontal slide and the inclined slide is an obtuse angle.
[0053] Both ends of the sliding rod 11 are set in the slide rail and are slidably connected to the groove plate 10 through the slide rail, so that when the groove plate 10 moves horizontally, the sliding rod 11 can move vertically through the slide rail.
[0054] In this embodiment, the sliding rod 11 is located at the end of the inclined slide away from the horizontal slide, so that when the groove plate 10 moves horizontally, the sliding rod 11 can move vertically upward through the slide; while when the sliding rod 11 moves to the horizontal slide, the groove plate 10 will not apply force to the sliding rod 11, so that the sliding rod 11 remains at this height.
[0055] The movable plate 12 is positioned above the support plate 3 and directly above the strip groove; the movable plate 12 is fixedly connected to the sliding rod 11; the side of the movable plate 12 closest to the support plate 3 is fixedly connected to multiple sets of guide blocks 13, so that when the sliding rod 11 moves vertically, it can drive the movable plate 12 and the multiple sets of guide blocks 13 to move synchronously.
[0056] In this embodiment, the sliding rod 11 also drives the moving plate 12 to move.
[0057] Two sets of limiting components are symmetrically arranged on both sides of the movable plate 12 and connected to the movable plate 12, so that the movable plate 12 can move in the vertical direction.
[0058] In this embodiment, the limiting component can restrict the moving plate 12 to move only vertically.
[0059] During the return process, the push gripper 9 can only contact the slider 2 after moving a certain distance. During the contact between the push gripper 9 and the slider 2, the connecting rod 7 will drive the two sets of groove plates 10 to move synchronously. The groove plates 10 will slide between the slide rail and the sliding rod 11, causing the sliding rod 11 to move vertically upward. The sliding rod 11 will simultaneously drive the moving plate 12 and the guide block 13 to move, causing the guide block 13 to disengage from the support plate 3. After the guide block 13 moves to the top, it will maintain this height under the support of the slide rail. At this time, the push gripper 9 will contact the slider 2 and push the slider 2 to move, so that the guide block 13 will not restrict the slider 2 from moving along the strip groove.
[0060] like Figure 6 and Figure 7 As shown, each set of limiting components includes: a movable sleeve 15 and a limiting rod 14.
[0061] Specifically, the movable sleeve 15 is fixedly connected to the movable plate 12; the limiting rod 14 passes through the movable sleeve 15 and is slidably connected to the movable sleeve 15, so that the limiting rod 14 can restrict the movable sleeve 15 to move only vertically; one end of the limiting rod 14 is fixedly connected to the support plate 3.
[0062] In this embodiment, the movable sleeve 15 slides along the outer wall of the limiting rod 14 when it moves, thereby restricting the vertical movement of the movable plate 12 connected to the movable sleeve 15.
[0063] Because different wafers require different areas to be coated, the coating area cannot be adjusted according to the wafer.
[0064] To address the aforementioned issues, this embodiment proposes an implementation method in which the wafer coating mechanism further includes an adjustment structure. The adjustment structure is disposed between two sets of groove plates 10 and connected to the support plate 3, and is used to block the spiral groove on the support plate 3 to restrict the movement of the sliding member 2.
[0065] like Figure 10 and Figure 11 As shown, the adjustment structure includes: a protective frame 23, two sets of moving rods 24, a limiting plate 25, a rotating part 26, and a second motor 27.
[0066] The protective frame 23 is fixedly connected to the support plate 3; one end of each set of movable rods 24 passes through the protective frame 23 and is slidably connected to the protective frame 23; cylindrical pins are provided on the surface of the movable rods 24.
[0067] In this embodiment, the protective frame 23 is a U-shaped structure rotated 180 degrees; the protective frame 23 can restrict the moving rod 24 to move only vertically.
[0068] The limiting plate 25 is fixedly connected to the other end of the moving rod 24, so that the limiting plate 25 and the moving rod 24 move synchronously; the limiting plate 25 is located in the spiral groove, so that when the limiting plate 25 contacts the sliding member 2, it can stop the sliding member 2 in the strip groove.
[0069] In this embodiment, when the limiting plate 25 is at its lowest position, it will be inserted into the spiral groove. At the same time, one side of the limiting plate 25 is in the same vertical plane as the side wall of the strip groove, and the limiting plate 25 is located outside the strip groove, thereby restricting the sliding member 2 from moving in a spiral. At this time, the sliding member 2 stops at the intersection of the spiral groove and the strip groove, so that the return structure can push the sliding member 2 back to its original position.
[0070] The rotating part 26 has slots at both ends, so that the cylindrical pins are placed in the slots and the rotating part 26 is slidably connected to the cylindrical pins through the slots. When the rotating part 26 rotates, it can make the two sets of cylindrical pins move vertically through the slots, and the two sets of cylindrical pins move in opposite directions.
[0071] In this embodiment, the rotation of the rotating component 26 is used to move the two sets of cylindrical pins in opposite directions, so that only one set of limiting plates 25 can be inserted into the spiral groove at the same time, making the adjustment more flexible.
[0072] The output end of the second motor 27 is fixedly connected to the center of the rotating component 26.
[0073] In this embodiment, the second motor 27 is a common existing technology on the market, and its model is selected according to actual needs as long as it meets the working conditions.
[0074] When the spraying area needs to be adjusted, the external power supply of the second motor 27 is turned on, and the second motor 27 is started. The output end of the second motor 27 drives the rotating part 26 to rotate slowly. The rotating part 26 slides between the slot and the cylindrical pin, causing the cylindrical pin to move vertically. The two sets of cylindrical pins move in opposite directions. The downward moving cylindrical pin will drive the moving rod 24 and the limiting plate 25 to move simultaneously, so that the limiting plate 25 is inserted into the spiral groove, thereby limiting the distance that the sliding part 2 can move, and thus limiting the spraying area.
[0075] like Figure 1 and Figure 12 As shown, the spraying assembly also includes a mixing component 17 and a connecting pipe 16.
[0076] Specifically, the mixing component 17 is fixedly installed above the support plate 3; the liquid inlet of the mixing component 17 is connected to an external pipeline.
[0077] In this embodiment, the mixing component 17 contains an ultrasonic generator and a pump. The ultrasonic generator generates ultrasonic waves of different wavelengths to break up the particles in the solution and achieve a fine overall solution. At the same time, the pump enables the mixing component 17 to have a back-suction function and a conveying function, which can draw back the solution located in the connecting pipe 16 and the nozzle 1 when spraying stops.
[0078] One end of the connecting pipe 16 is connected to the liquid outlet of the mixing component 17, and the other end is connected to the nozzle 1.
[0079] In this embodiment, the connecting pipe 16 is a flexible hose that can be bent and is made of corrosion-resistant material.
[0080] Organize the structure and connect it to the connecting pipe 16 for organizing the connecting pipe 16.
[0081] like Figure 1 and Figure 12 As shown, the sorting structure includes: two sets of second transverse wheels 20, two sets of elastic elements 21, a limiting post 22, and a guide structure.
[0082] The edges of the two sets of second transverse wheels 20 are in contact with the connecting pipe 16 and are located on both sides of the connecting pipe 16. When the connecting pipe 16 is moved by an external force, the two sets of second transverse wheels 20 can move in opposite directions.
[0083] In this embodiment, the second transverse wheel 20 is used to organize the connecting pipe 16 and can change its position according to the length of the connecting pipe 16 above the support plate 3.
[0084] Each set of elastic elements 21 has a baffle at one end and a support frame at the other end. The support frame is rotatably connected to the second transverse wheel 20. The edge of the baffle is fixedly connected to the support plate 3.
[0085] In this embodiment, when the length of the connecting tube 16 above the support plate 3 is shortened, the connecting tube 16 causes the two sets of second transverse wheels 20 to move closer to each other, and the second transverse wheels 20 will compress the elastic element 21 again; when the length of the connecting tube 16 above the support plate 3 is increased, the elastic element 21 rebounds, causing the two sets of second transverse wheels 20 to move away from each other, so that the second transverse wheels 20 are always in contact with the connecting tube 16, and the connecting tube 16 is tidied up.
[0086] The limiting post 22 penetrates the baffle and is slidably connected to the baffle; one end of the limiting post 22 is fixedly connected to the support frame, and the limiting post 22 can restrict the movement direction of the support frame.
[0087] In this embodiment, the limiting post 22 restricts the movement direction of the second transverse wheel 20.
[0088] The guide assembly includes: a vertical wheel 18 and two sets of first lateral wheels 19.
[0089] The vertical wheel 18 is located on the edge of the support plate 3 and is rotatably connected to the support plate 3; the edge of the vertical wheel 18 is in contact with the connecting pipe 16, and the vertical wheel 18 can change the moving direction of the connecting pipe 16 in the vertical plane.
[0090] In this embodiment, the vertical wheel 18 can change the extension direction of the connecting pipe 16 from the horizontal direction to the vertical direction, so that the connecting pipe 16 can bypass the support plate 3 and the support plate 3 will not cause obstruction.
[0091] The edges of the two sets of first transverse wheels 19 are in contact with the connecting tube 16 and are located close to the mixing component 17 and the vertical wheel 18. The first transverse wheels 19 can change the direction of movement of the connecting tube 16 in the horizontal plane.
[0092] In this embodiment, the first horizontal wheel 19 can change the vertical connecting pipe 16 to the horizontal direction, so that the connecting pipe 16 can communicate with the mixing component 17.
[0093] During the spraying process, the vertical roller 18 divides the connecting pipe 16 into two parts, one part located below the support plate 3 and the other part located above the support plate 3. The connecting pipe 16 located below is always taut. As the nozzle 1 moves, when the length of the connecting pipe 16 above the support plate 3 shortens, the connecting pipe 16 causes the two sets of second transverse rollers 20 to move closer to each other, and the second transverse rollers 20 compress the elastic element 21 again. When the length of the connecting pipe 16 above the support plate 3 increases, the elastic element 21 rebounds, causing the two sets of second transverse rollers 20 to move away from each other, so that the second transverse rollers 20 are always in contact with the connecting pipe 16, thus tidying up the connecting pipe 16.
[0094] A wafer coating method, applied to the aforementioned wafer coating mechanism, includes the following steps: S1: By operating the spraying assembly, the spraying assembly can directly spray the surface of the wafer.
[0095] Different solutions are delivered to the mixing assembly 17 through external pipes. The ultrasonic generator in the mixing assembly 17 generates ultrasonic waves of different wavelengths to break up the particles in the solution and achieve a fine overall solution. Then, the pump in the mixing assembly 17 is used to send the combined solution to the nozzle 1 through the connecting pipe 16 and spray it onto the wafer.
[0096] S2: By operating the loop structure, the spraying assembly will rotate and move outward during the spraying process, so as to evenly spray the solution onto the surface of the wafer.
[0097] By connecting the external power supply to the first motor 5, the first motor 5 is started. The output end of the first motor 5 drives the lever 6 to rotate horizontally through the change of the bevel gear set 4. After the lever 6 contacts the sliding member 2, it pushes the sliding member 2 to move along the inner wall of the groove, so that the sliding member 2 moves spirally outward. At the same time, the sliding member 2 drives the nozzle 1 to move, so that the nozzle 1 can be evenly sprayed on the wafer without relying on the rotation of the wafer, avoiding waste of solution and making it easy to use.
[0098] S3: After the spraying is completed, the return mechanism will push the slider 2 and the nozzle 1 back to the starting position of the spraying by pushing the gripper 9, so as to carry out the next spraying.
[0099] By connecting the external power supply of the electric push rod 8, the electric push rod 8 is started, causing the output end of the electric push rod 8 to retract, thereby driving the push gripper 9 to move synchronously through the connecting rod 7. After the push gripper 9 moves a certain distance, it will contact the sliding part 2 located at the edge. As the push gripper 9 continues to move, it pushes the sliding part 2 to move, so that the sliding part 2 returns to its original position along the strip groove, making it convenient for the next spraying.
[0100] During the return process, the push gripper 9 can only contact the slider 2 after moving a certain distance. While the push gripper 9 is in contact with the slider 2, the connecting rod 7 drives the two sets of groove plates 10 to move synchronously. The groove plates 10 slide between the slide rail and the sliding rod 11, causing the sliding rod 11 to move vertically upwards. Simultaneously, the sliding rod 11 drives the moving plate 12 and the guide block 13 to move, causing the guide block 13 to disengage from the support plate 3. After the guide block 13 reaches its highest position, it maintains this height with the support of the slide rail. At this time, the push gripper 9 contacts the slider 2 and pushes the slider 2 to move, ensuring that the guide block 13 does not restrict the slider 2 from moving along the strip groove. Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes in form and detail are possible within the scope of the claims.
Claims
1. A wafer coating mechanism, characterized in that: include: A coating assembly, comprising: a nozzle (1) for coating a wafer; A loop structure is disposed above the nozzle (1) for moving the nozzle (1) outward during spraying; the loop structure includes a slider (2) connected to the nozzle (1) for driving the nozzle (1) to move. The return structure is connected to the loop structure; the return structure includes: a push gripper (9), the push gripper (9) and the slider (2) are located in the same horizontal plane, so that when the push gripper (9) moves, it can push the slider (2) to move and make the nozzle (1) return to its original position.
2. The wafer coating mechanism according to claim 1, characterized in that: The loop structure also includes: The support plate (3) has a groove on its lower end face. The groove is composed of a strip groove and a spiral groove. The strip groove and the spiral groove are arranged to cross each other, and the two ends of the strip groove are connected to the two ends of the spiral groove. A lever (6) is positioned parallel to the bottom of the support plate (3); The first motor (5) is fixedly installed above the support plate (3); The bevel gear set (4) consists of a first bevel gear and a second bevel gear. The shaft of the first bevel gear passes through the support plate (3) and is fixedly connected to one end of the lever (6). The shaft of the second bevel gear is fixedly connected to the output end of the first motor (5). The edge of the first bevel gear meshes with the edge of the second bevel gear. When the first motor (5) is running, the lever (6) can be rotated in the horizontal plane through the bevel gear set (4).
3. The wafer coating mechanism according to claim 2, characterized in that: The sliding member (2) consists of a vertical rod and three sets of coaxially arranged discs. The lower disc is fixedly connected to the nozzle (1). The upper disc is set in the groove and is slidably connected to the support plate (3) through the groove. The surface of the vertical rod is in contact with the edge of the actuating rod (6), so that when the actuating rod (6) rotates, it can apply a pushing force to the vertical rod, so that the vertical rod moves along the groove. The two ends of the vertical rod are fixedly connected to the upper and lower sets of discs and pass through the middle disc.
4. The wafer coating mechanism according to claim 3, characterized in that: The return structure also includes: An electric push rod (8) is positioned above the support plate (3); The connecting rod (7) has two ends fixedly connected to the output ends of the push gripper (9) and the electric push rod (8), so that when the electric push rod (8) is started, it can push the connecting rod (7) and the push gripper (9) to move synchronously. Multiple sets of guide blocks (13) are disposed in the strip groove, so that the guide blocks (13) can prevent the slider (2) from entering the strip groove; The lifting structure is fixedly connected to the guide block (13) and is used to lift the guide block (13).
5. The wafer coating mechanism according to claim 4, characterized in that: The push gripper (9) has a notch on the side near the slider (2), and the inner diameter of the notch is the same as the outer diameter of the disk in the middle, so that the push gripper (9) can fix the disk in the middle when pushing the disk in the middle to move.
6. The wafer coating mechanism according to claim 5, characterized in that: The lifting structure includes: Two sets of slotted plates (10) are connected by a crossbar in the middle; the slotted plates (10) are fixedly connected to the connecting rod (7) so that the two sets of slotted plates (10) move vertically along with the connecting rod (7) at the same time; the surface of the slotted plates (10) is provided with a sliding track; The sliding rod (11) has both ends set in the slide rail and is slidably connected to the groove plate (10) through the slide rail, so that when the groove plate (10) moves horizontally, the sliding rod (11) can move vertically through the slide rail; A movable plate (12) is disposed above the support plate (3) and directly above the strip groove; the movable plate (12) is fixedly connected to the sliding rod (11); the side of the movable plate (12) near the support plate (3) is fixedly connected to multiple sets of guide blocks (13), so that when the sliding rod (11) moves vertically, it can drive the movable plate (12) and multiple sets of guide blocks (13) to move synchronously; Two sets of limiting components are symmetrically arranged on both sides of the movable plate (12) and connected to the movable plate (12) so that the movable plate (12) can move in the vertical direction.
7. The wafer coating mechanism according to claim 6, characterized in that: Each set of limiting components includes: The movable sleeve (15) is fixedly connected to the movable plate (12); A limiting rod (14) passes through the movable sleeve (15) and is slidably connected to the movable sleeve (15), so that the limiting rod (14) can restrict the movable sleeve (15) to move only vertically; one end of the limiting rod (14) is fixedly connected to the support plate (3).
8. The wafer coating mechanism according to claim 6, characterized in that: Also includes: Adjustment structure; the adjustment structure is set between the two sets of groove plates (10) and connected to the support plate (3) to block the spiral groove on the support plate (3) and restrict the movement of the sliding member (2).
9. The wafer coating mechanism according to claim 8, characterized in that: The adjustment structure includes: The protective frame (23) is fixedly connected to the support plate (3); Two sets of movable rods (24), one end of each set of movable rods (24) passes through the protective frame (23) and is slidably connected to the protective frame (23); cylindrical pins are provided on the surface of the movable rods (24); The limiting plate (25) is fixedly connected to the other end of the moving rod (24) so that the limiting plate (25) and the moving rod (24) move synchronously; the limiting plate (25) is located in the spiral groove so that when the limiting plate (25) contacts the sliding member (2), it can stop the sliding member (2) in the strip groove; Rotating component (26), with slots at both ends, so that the cylindrical pin is placed in the slots, and the rotating component (26) is slidably connected to the cylindrical pin through the slots, so that when the rotating component (26) rotates, the two sets of cylindrical pins can move vertically through the slots, and the two sets of cylindrical pins move in opposite directions. The output end of the second motor (27) is fixedly connected to the center of the rotating part (26).
10. The wafer coating mechanism according to claim 2, characterized in that: The spraying assembly also includes: A mixing component (17) is fixedly disposed above the support plate (3); the inlet of the mixing component (17) is connected to an external pipeline; Connecting pipe (16), one end of which is connected to the liquid outlet of the mixing component (17), and the other end is connected to the nozzle (1); The structure is arranged and connected to the connecting pipe (16) for arranging the connecting pipe (16).
11. The wafer coating mechanism according to claim 10, characterized in that: The sorting structure includes: Two sets of second transverse wheels (20) have their edges in contact with the connecting pipe (16) and are located on both sides of the connecting pipe (16). When the connecting pipe (16) is moved by an external force, the two sets of second transverse wheels (20) can move in opposite directions. Two sets of elastic elements (21), each set of elastic elements (21) has a baffle at one end and a support frame at the other end, the support frame is rotatably connected to the second transverse wheel (20); the edge of the baffle is fixedly connected to the support plate (3); A limiting post (22) penetrates the baffle and is slidably connected to the baffle; one end of the limiting post (22) is fixedly connected to the support frame, and the limiting post (22) can restrict the movement direction of the support frame; A guide structure, connected to the connecting pipe (16), is used to control the moving direction of the connecting pipe (16).
12. The wafer coating mechanism according to claim 11, characterized in that: The guiding component includes: A vertical wheel (18) is disposed on the edge of the support plate (3) and is rotatably connected to the support plate (3); the edge of the vertical wheel (18) is in contact with the connecting pipe (16), and the vertical wheel (18) can change the moving direction of the connecting pipe (16) in the vertical plane; Two sets of first transverse wheels (19) have their edges in contact with the connecting pipe (16) and are located close to the mixing component (17) and the vertical wheel (18). The first transverse wheels (19) are capable of changing the direction of movement of the connecting pipe (16) in the horizontal plane.
13. A wafer coating method, applied to the wafer coating mechanism as described in any one of claims 1-12, characterized in that: The method includes the following steps: S1: By operating the spraying assembly, the spraying assembly can directly spray the surface of the wafer; S2: By operating the loop structure, the loop structure will cause the spraying assembly to rotate outward during the spraying process, so as to spray the solution evenly on the surface of the wafer; S3: After the spraying is completed, by operating the return structure, the return structure will push the slider (2) and the nozzle (1) back to the starting position of the spraying by pushing the gripper (9) so as to carry out the next spraying.