Wafer grinding equipment

Abstract

The invention relates to the technical field of grinding equipment, in particular to wafer grinding equipment which comprises a platform. The device comprises a platform and further comprises a first station, a second station, two measuring assemblies and a coaxial mechanical arm, the first station and the second station are oppositely installed on the left portion and the right portion of the platform, the first station is used for grinding the upper surface of a wafer, the second station is used for grinding the lower surface of the wafer, and the two measuring assemblies are installed on the first station and the second station respectively. The two measuring assemblies are used for measuring the grinding thinning amount of the wafer, the coaxial mechanical arm is installed in the middle of the platform, and the coaxial mechanical arm is used for feeding the first station, taking out the wafer subjected to rough grinding in the first station, overturning the wafer, feeding the wafer subjected to rough grinding in the second station, taking out the wafer subjected to fine grinding in the second station and discharging the wafer; the double grinding stations are adopted to grind the upper surface and the lower surface of the wafer at a high speed, the coaxial transfer manipulator is adopted to efficiently overturn and transfer the wafer, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of grinding equipment, and in particular to a wafer grinding equipment. BACKGROUND

[0002] After a crystal bar is cut into wafer blanks, the wafer blanks need to be thinned by grinding to make the wafers reach a specified thickness. Various wafer grinding equipment is disclosed in the prior art. For example, a silicon carbide wafer grinding equipment is disclosed in Chinese Patent Application No. CN119973864A. The wafer grinding equipment includes an operating table, an upper surface of the operating table is provided with a placing groove, a positioning mechanism is installed inside the placing groove, a mounting frame is fixed to the rear end of the operating table, a grinding machine is slidably connected to the front end of the mounting frame, and a lifting assembly is installed between the mounting frame and the grinding machine. The positioning mechanism is used to position the silicon carbide wafer to avoid the wafer from being placed inside the placing groove and to avoid dust from being scattered. The silicon wafer is clamped by a clamping assembly. The height of the clamping block is controlled according to the thickness of the silicon wafer during clamping to avoid the height of the clamping block from exceeding the thickness of the silicon wafer. The height of the grinding machine is controlled by the lifting assembly. The motor control or manual control is selected according to the situation to make the control effect more accurate and to avoid damage to the silicon wafer. For another example, a wafer grinding support plate and a wafer grinding device are disclosed in Chinese Patent Application No. CN114714246A. The wafer grinding support plate (sometimes referred to as "support plate") that holds the wafer W inside the workpiece hole is set to be clamped by upper and lower platforms. The two sides of the wafer W are simultaneously ground by rotating the platforms and the support plate.

[0003] The first wafer grinding equipment described above can only grind one side of the wafer. The second wafer grinding equipment can grind both sides of the wafer, but it uses a support plate hole to clamp the side wall of the wafer. Since the wafer is very thin, the corresponding support plate is also very thin, which leads to insufficient clamping stability of the wafer and is not conducive to high-speed grinding, resulting in low work efficiency. SUMMARY

[0004] To solve the above technical problems, the present application provides a wafer grinding equipment that uses two grinding stations to grind the upper and lower surfaces of the wafer at high speed, uses a coaxial transfer robot to efficiently flip and transfer the wafer, and improves work efficiency.

[0005] The wafer grinding device of the present application comprises a platform, a first work station, a second work station, two measuring assemblies and a coaxial mechanical arm, the first work station and the second work station are oppositely arranged on the left and right parts of the platform, the first work station is used for grinding the upper surface of the wafer, the second work station is used for grinding the lower surface of the wafer, the two measuring assemblies are respectively arranged on the first work station and the second work station, the two measuring assemblies are used for measuring the grinding thinning amount of the wafer, the coaxial mechanical arm is arranged on the middle part of the platform, and the coaxial mechanical arm is used for feeding the first work station, taking out the wafer after rough grinding in the first work station and feeding the second work station after turning over, and taking out the wafer after fine grinding in the second work station; during work, the coaxial mechanical arm loads the wafer blank to the first work station, the first work station adsorbs the lower surface of the wafer, the first work station runs to grind and thin the upper surface of the wafer blank, one measuring assembly measures the grinding thinning amount one of the wafer on the first work station, the first work station stops when the thinning amount one reaches a specified value, the coaxial mechanical arm runs to take out the wafer on the first work station, loads the wafer to the second work station after turning over, the second work station adsorbs the upper surface of the wafer, the second work station runs to grind and thin the lower surface of the wafer, the other measuring assembly measures the grinding thinning amount two of the wafer on the second work station, the second work station stops when the thinning amount two reaches a specified value, and the coaxial mechanical arm runs to take out the wafer on the second work station and unload it; compared with the prior art, the double grinding stations composed of the first work station and the second work station are used to grind the upper and lower surfaces of the wafer respectively, and the coaxial mechanical arm is used to feed and turn over the wafer on the first work station and the second work station, so that the continuous grinding work of the first work station and the second work station on the wafer is realized, the whole end surface of the wafer is adsorbed, the clamping stability of the wafer is good, the upper and lower surfaces of the wafer can be high-speed ground, and the work efficiency is improved.

[0006] Preferably, the coaxial mechanical arm comprises a lower platform, a shaft tube, a turnover motor, a cross arm one, an inner shaft and a cross arm two, the lower platform is installed below the platform and can be lifted, the shaft tube is rotatably installed on the lower platform, the upper end of the shaft tube extends above the platform, the turnover motor is installed on the outer wall of the upper end of the shaft tube, the inner end of the cross arm one is installed on the output shaft of the turnover motor through a vertical rod, the inner shaft is concentrically and rotatably installed inside the shaft tube, the upper end of the inner shaft extends above the shaft tube, the inner end of the cross arm two is installed on the upper end of the inner shaft, the cross arm two is arranged in parallel with the cross arm one, and the outer end lower surfaces of the cross arm one and the cross arm two are provided with suction disc assemblies; the shaft tube drives the turnover motor and the cross arm one to rotate horizontally to cover the loading and unloading area, the work station one in front of the platform and the turnover area behind the platform, so that the cross arm one transfers the wafer blank adsorbed in the loading and unloading area to the work station one and places the wafer blank on the work station one, the lower surface suction disc assembly of the cross arm one adsorbs the upper surface of the wafer after the upper surface of the wafer blank is polished, and the wafer is transferred to the turnover area, the turnover motor drives the cross arm one to turn over 1-80 degrees through the vertical rod, so as to turn over the wafer to the lower surface, and realize the turnover of the wafer; the inner shaft drives the cross arm two to rotate horizontally to cover the loading and unloading area, the work station two in front of the platform and the turnover area behind the platform, so that when the cross arm two is in the turnover area, the cross arm two moves above the wafer and adsorbs the lower surface of the wafer on the cross arm one through the suction disc assembly of the cross arm two, the suction disc assembly of the cross arm one releases the wafer, the cross arm two is transferred to the work station two and places the wafer on the work station two, and the suction disc assembly of the cross arm two adsorbs the lower surface of the wafer and transfers it to the loading and unloading area after the lower surface of the wafer is polished, the suction disc assembly of the cross arm two releases the wafer, the loading, turnover, transfer and unloading of the wafer are completed, and the work efficiency is improved.

[0007] Preferably, the coaxial mechanical arm further comprises a push rod, one end of the push rod is connected with the lower platform, and the other end of the push rod is connected with the platform; when the piston rod of the push rod is elongated, the lower platform is lowered, thereby driving the shaft tube and the inner shaft to descend, and further driving the cross arm one and the cross arm two to descend, so that the wafers on the cross arm one and the cross arm two are placed on the work station one and the work station two; and when the piston rod of the push rod is retracted, the shaft tube and the inner shaft are raised, thereby driving the cross arm one and the cross arm two to ascend, so that the cross arm one and the cross arm two raise the wafers on the work station one and the work station two, and the wafers on the work station one and the work station two are conveniently taken out.

[0008] Preferably, the motor one, the gear one, the gear two, the motor two, the gear three and the gear four are further included, the motor one is installed on the lower platform, the output shaft of the motor one is concentrically installed with the gear one, the gear two is concentrically installed on the outer wall of the shaft pipe, the gear one is engaged with the gear two, the motor two is installed on the lower platform, the output shaft of the motor two is concentrically installed with the gear three, the gear four is concentrically installed on the lower end of the inner shaft, and the gear three is engaged with the gear four; the motor one drives the gear one to rotate, the gear one drives the shaft pipe to rotate by engaging the gear two, the motor two drives the gear three to rotate, the gear three drives the inner shaft to rotate by engaging the gear four, and the coaxial independent driving of the shaft pipe and the inner shaft is realized, and the practicability is good.

[0009] Preferably, the work station one includes a mounting table, a plurality of screws, a motor three, a tray, a motor four and a grinding disc, the mounting table is installed below the platform through the plurality of screws, the motor three is installed on the mounting table, the tray is concentrically installed on the output shaft of the motor three, the tray is provided with a suction cup assembly, the motor four is installed on the upper portal of the platform in a lifting manner, the grinding disc is concentrically installed on the output shaft of the motor four, and the grinding disc is located above the tray; the work station two is the same in structure as the work station one; during work, the lower surface or the upper surface of the wafer is adsorbed on the suction cup assembly of the tray, the adsorption of the wafer is stable and reliable, a positioning structure is arranged to make the adsorption of the wafer accurate, the motor three drives the tray to rotate forward, the motor four is lowered to press the grinding disc on the surface of the wafer, and the motor four drives the grinding disc to rotate reversely, so that the surface of the wafer is efficiently ground, and the practicability is good.

[0010] Preferably, the vertical sliding shaft, the linear motor and the connecting plate are further included, the lower end of the vertical sliding shaft is connected with the motor four, the upper end of the vertical sliding shaft is slidingly connected with the upper portal of the platform, the stator of the linear motor is installed on the portal of the platform, the lower end of the telescopic shaft of the linear motor is connected with the connecting plate, and the connecting plate is connected with the vertical sliding shaft; the linear motor drives the telescopic shaft to extend, so that the vertical sliding shaft is pushed down through the connecting plate, the linear motor drives the telescopic shaft to contract, so that the vertical sliding shaft is pulled up through the connecting plate, the height of the motor four and the grinding disc is controlled, and the grinding and thinning amount of the surface of the wafer is controlled.

[0011] Preferably, the pressure sensor is further included, the pressure sensor is installed at the lower end of the telescopic shaft of the linear motor, and the measuring end of the pressure sensor is connected with the connecting plate; the telescopic shaft of the linear motor is connected with the connecting plate through the pressure sensor, the pressure of the linear motor on the connecting plate is detected through the pressure sensor, so that the grinding pressure of the grinding disc on the wafer is controlled, and the grinding precision is improved.

[0012] Preferably, the measuring assembly comprises a crossbeam, a slide rod, a spring, a measuring instrument and a measuring rod, the crossbeam is installed at the four ends of the motor, the upper end of the slide rod is slidingly installed on the crossbeam, one end of the spring is connected with the crossbeam, the other end of the spring is connected with the slide rod, the measuring instrument is installed on the slide rod, and the measuring rod is installed on the measuring end of the measuring instrument; the crossbeam is lifted along with the motor, when the motor is lowered to press the grinding disc on the surface of the wafer, the crossbeam drives the slide rod to descend, the lower end of the slide rod is abutted on the platform, the spring is compressed or stretched, the measuring rod is in contact with the surface of the wafer, and the measuring instrument measures the grinding thinning amount of the wafer through the measuring rod, thereby improving the grinding precision.

[0013] Preferably, the two nozzles are installed on the two crossbeams respectively, and the two nozzles are respectively directed to the two trays; the two nozzles are connected with the external grinding liquid pipeline, and the two nozzles spray the grinding liquid to the two trays on the work station one and the work station two respectively, so that the wafer is cooled and the grinding effect is improved.

[0014] Preferably, the two annular grooves and the two limiting rings are further included, the upper surfaces of the two trays are provided with the annular grooves, and the two limiting rings are detachably installed in the two annular grooves respectively; the two limiting rings are respectively located at the outer sides of the wafers on the two trays, the height of the limiting ring protruding from the tray is the upper limit of the thickness of the wafer after thinning, so that the hardware limit of the wafer grinding thinning amount is realized; the limiting ring can be made of a material prone to sparking, bright sparks are generated when the limiting ring is rubbed by the nozzle, the photosensitive element for detecting the bright sparks is arranged, and the corresponding motor four is controlled to stop; the limiting ring can be an electrode ring coated with insulating paint, an electrode sheet is arranged in the water collecting groove of the grinding liquid, and a detection circuit is arranged between the electrode sheet and the limiting ring; when the limiting ring is rubbed by the nozzle, the insulating paint is damaged, so that the limiting ring forms a path through the grinding liquid and the electrode sheet, the detection circuit generates an electric signal, the electric signal is sent to the controller of the motor four, and the corresponding motor four is controlled to stop.

[0015] Compared with the prior art, the wafer is continuously ground by the work station one and the work station two, the whole end surface of the wafer is adsorbed, the clamping stability of the wafer is good, the upper and lower surfaces of the wafer can be ground at a high speed, and the working efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a front view structural schematic diagram of the wafer grinding state of the present application; Figure 2 is a structural schematic diagram of the wafer grinding state of the present application; Figure 3is a schematic diagram of the front view structure of the wafer grinding state of the present application; Figure 4 is a schematic diagram of the structure of the wafer grinding state of the present application; Figure 5 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 6 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 7 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 8 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 9 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 10 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 11 is a schematic diagram of the structure of the wafer transfer state of the present application; Figure 12 is a schematic diagram of the structure of the wafer transfer state of the present application.

[0017] Markings in the drawings: 1, platform; 2, station one; 3, station two; 4, measurement assembly; 5, coaxial mechanical arm; 6, lower platform; 7, shaft tube; 8, turnover motor; 9, cross arm one; 10, inner shaft; 11, cross arm two; 12, push rod; 13, motor one; 14, gear one; 15, gear two; 16, motor two; 17, gear three; 18, gear four; 19, mounting table; 20, screw; 21, motor three; 22, tray; 23, motor four; 24, grinding disc; 25, vertical sliding shaft; 26, linear motor; 27, connecting plate; 28, pressure sensor; 29, cross beam; 30, slide rod; 31, spring; 32, measuring instrument; 33, measuring rod; 34, spray head; 35, annular groove; 36, limit ring. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0019] Example 1, as Figures 1 to 8 , Figure 12As shown, a wafer grinding device comprises a platform 1; further comprises a station one 2, a station two 3, two measuring assemblies 4 and a coaxial mechanical arm 5, the station one 2 and the station two 3 are oppositely installed on the left and right parts of the platform 1, the station one 2 is used for grinding the upper surface of the wafer, the station two 3 is used for grinding the lower surface of the wafer, the two measuring assemblies 4 are respectively installed on the station one 2 and the station two 3, the two measuring assemblies 4 are used for measuring the grinding thinning amount of the wafer, the coaxial mechanical arm 5 is installed on the middle part of the platform 1, the coaxial mechanical arm 5 is used for feeding the station one 2, taking out the wafer after rough grinding in the station one 2 and feeding the station two 3 after turning over, and taking out the wafer after fine grinding in the station two 3; the coaxial mechanical arm 5 comprises a lower platform 6, a shaft tube 7, a turning motor 8, a horizontal arm one 9, an inner shaft 10 and a horizontal arm two 11, the lower platform 6 is installed below the platform 1 in a lifting manner, the shaft tube 7 is rotatably installed on the lower platform 6, the upper end of the shaft tube 7 extends above the platform 1, the turning motor 8 is installed on the outer wall of the upper end of the shaft tube 7, the inner end of the horizontal arm one 9 is installed on the output shaft of the turning motor 8 through a vertical rod, the inner shaft 10 is concentrically and rotatably installed inside the shaft tube 7, the upper end of the inner shaft 10 extends above the shaft tube 7, the inner end of the horizontal arm two 11 is installed on the upper end of the inner shaft 10, the horizontal arm two 11 and the horizontal arm one 9 are arranged in parallel, and the outer end lower surfaces of the horizontal arm one 9 and the horizontal arm two 11 are provided with suction disc assemblies; further comprises a push rod 12, one end of the push rod 12 is connected with the lower platform 6, and the other end of the push rod 12 is connected with the platform 1; further comprises a motor one 13, a gear one 14, a gear two 15, a motor two 16, a gear three 17 and a gear four 18, the motor one 13 is installed on the lower platform 6, the output shaft of the motor one 13 is concentrically installed with the gear one 14, the gear two 15 is concentrically installed on the outer wall of the shaft tube 7, the gear one 14 is engaged with the gear two 15, the motor two 16 is installed on the lower platform 6, the output shaft of the motor two 16 is concentrically installed with the gear three 17, the gear four 18 is concentrically installed on the lower end of the inner shaft 10, and the gear three 17 is engaged with the gear four 18.

[0020] When the piston rod of the push rod 12 is elongated, the lower platform 6 is pushed to descend, thereby driving the shaft tube 7 and the inner shaft 10 to descend, and further driving the horizontal arm one 9 and the horizontal arm two 11 to descend, so that the wafers on the horizontal arm one 9 and the horizontal arm two 11 are placed on the station one 2 and the station two 3; when the piston rod of the push rod 12 is retracted, the shaft tube 7 and the inner shaft 10 are driven to ascend, and further driving the horizontal arm one 9 and the horizontal arm two 11 to ascend, so that the wafers on the horizontal arm one 9 and the horizontal arm two 11 are lifted to the station one 2 and the station two 3, and the wafers on the station one 2 and the station two 3 are conveniently taken out.

[0021] The motor 13 drives the gear 14 to rotate, the gear 14 meshes with the gear 15 to drive the shaft tube 7 to rotate, the motor 16 drives the gear 17 to rotate, the gear 17 meshes with the gear 18 to drive the inner shaft 10 to rotate, thereby achieving the coaxial independent driving of the shaft tube 7 and the inner shaft 10, the shaft tube 7 drives the turnover motor 8 and the horizontal arm 9 to rotate to cover the loading and unloading area in front of the platform 1, the work station 2 and the turnover area behind the platform 1, so that the horizontal arm 9 moves the wafer blank in the loading and unloading area to the work station 2 and places the wafer blank on the work station 2, and the lower surface suction cup assembly of the horizontal arm 9 adsorbs the upper surface of the wafer and moves the wafer to the turnover area, the turnover motor 8 drives the horizontal arm 9 to turn over 1-80 degrees through the vertical rod, so as to turn over the wafer to the lower surface, thereby achieving the turnover of the wafer; the inner shaft 10 drives the horizontal arm 11 to rotate to cover the loading and unloading area in front of the platform 1, the work station 3 and the turnover area behind the platform 1, so that when the horizontal arm 11 is in the turnover area, the horizontal arm 11 moves to the upper side of the wafer, and the suction cup assembly of the horizontal arm 11 adsorbs the lower surface of the wafer on the horizontal arm 9, the suction cup assembly of the horizontal arm 9 releases the wafer, the horizontal arm 11 moves to the work station 3 and places the wafer on the work station 3, and the suction cup assembly of the horizontal arm 11 adsorbs the lower surface of the wafer and moves to the loading and unloading area, and the suction cup assembly of the horizontal arm 11 releases the wafer, thereby completing the loading, turnover, moving and unloading of the wafer and improving the work efficiency.

[0022] In work, the coaxial mechanical arm 5 loads the wafer blank to the work station 2, the work station 2 adsorbs the lower surface of the wafer, the work station 2 runs to grind and thin the upper surface of the wafer blank, a measuring assembly 4 measures the grinding and thinning amount one of the wafer on the work station 2, when the thinning amount one reaches the specified value, the work station 2 stops, the coaxial mechanical arm 5 runs to take out the wafer on the work station 2, turns over and loads to the work station 3, the work station 3 adsorbs the upper surface of the wafer, the work station 3 runs to grind and thin the lower surface of the wafer, another measuring assembly 4 measures the grinding and thinning amount two of the wafer on the work station 3, when the thinning amount two reaches the specified value, the work station 3 stops, the coaxial mechanical arm 5 runs to take out the wafer on the work station 3 and unloads, compared with the prior art, the double grinding work stations composed of the work station 2 and the work station 3 grind the upper and lower surfaces of the wafer respectively, and the coaxial mechanical arm 5 loads and unloads the wafer on the work station 2 and the work station 3 and turns over the wafer, thereby realizing the continuous grinding work of the work station 2 and the work station 3 on the wafer, adsorbing the entire end surface of the wafer, making the wafer clamping stability good, being able to grind the upper and lower surfaces of the wafer at high speed and improving the work efficiency.

[0023] Embodiment 2, as Figures 1 to 8 , Figure 9 and Figure 10As shown, on the basis of embodiment 1, the work station 2 comprises a mounting table 19, a plurality of screws 20, a motor 3 21, a tray 22, a motor 4 23 and a grinding disc 24, the mounting table 19 is mounted below the platform 1 through the plurality of screws 20, the motor 3 21 is mounted on the mounting table 19, the tray 22 is concentrically mounted on the output shaft of the motor 3 21, the suction cup assembly is arranged on the tray 22, the motor 4 23 is mounted on the upper portal of the platform 1 in a lifting manner, the grinding disc 24 is concentrically mounted on the output shaft of the motor 4 23, and the grinding disc 24 is located above the tray 22; the work station 2 and the work station 3 are the same in structure; further comprising a vertical sliding shaft 25, a linear motor 26 and a connecting plate 27, the lower end of the vertical sliding shaft 25 is connected with the motor 4 23, the upper end of the vertical sliding shaft 25 is slidingly connected with the upper portal of the platform 1, the stator of the linear motor 26 is mounted on the portal of the platform 1, the telescopic shaft of the linear motor 26 is connected with the connecting plate 27, and the connecting plate 27 is connected with the vertical sliding shaft 25; further comprising a pressure sensor 28, the pressure sensor 28 is mounted on the lower end of the telescopic shaft of the linear motor 26, and the measuring end of the pressure sensor 28 is connected with the connecting plate 27.

[0024] The linear motor 26 drives the telescopic shaft to elongate, so as to push the vertical sliding shaft 25 to descend through the connecting plate 27, the linear motor 26 drives the telescopic shaft to contract, so as to pull the vertical sliding shaft 25 to ascend through the connecting plate 27, the height of the motor 4 23 and the grinding disc 24 is controlled, and the grinding and thinning amount of the surface of the wafer is controlled.

[0025] The telescopic shaft of the linear motor 26 is connected with the connecting plate 27 through the pressure sensor 28, the pressure of the linear motor 26 on the connecting plate 27 is detected through the pressure sensor 28, so as to control the grinding pressure of the grinding disc 24 on the wafer, and the grinding precision is improved.

[0026] In work, the lower surface or the upper surface of the wafer is adsorbed on the suction cup assembly of the tray 22, the adsorption of the wafer is stable and reliable, and the positioning structure is arranged to make the wafer adsorption accurate, the motor 3 21 drives the tray 22 to rotate forward, the motor 4 23 is lowered to press the grinding disc 24 on the surface of the wafer, and the motor 4 23 drives the grinding disc 24 to rotate reversely, so as to grind the surface of the wafer efficiently.

[0027] Embodiment 3, as Figures 1 to 8 , Figure 9 and Figure 11As shown, on the basis of embodiment 1, the measuring assembly 4 comprises a crossbeam 29, a slide bar 30, a spring 31, a measuring instrument 32 and a measuring rod 33, the end of the crossbeam 29 is installed on the motor four 23, the upper end of the slide bar 30 is slidingly installed on the crossbeam 29, one end of the spring 31 is connected with the crossbeam 29, the other end of the spring 31 is connected with the slide bar 30, the measuring instrument 32 is installed on the slide bar 30, and the measuring rod 33 is installed on the measuring end of the measuring instrument 32; further comprising two spray heads 34, the two spray heads 34 are respectively installed on the two crossbeams 29, and the two spray heads 34 respectively face the two trays 22; further comprising two annular grooves 35 and two limiting rings 36, the annular grooves 35 are arranged on the upper surfaces of the two trays 22, and the two limiting rings 36 are respectively detachably installed in the two annular grooves 35.

[0028] The measuring instrument 32 can be a micrometer or the like, the crossbeam 29 follows the motor four 23 to ascend and descend, when the motor four 23 descends to make the grinding disc 24 press tightly on the surface of the wafer, the crossbeam 29 drives the slide bar 30 to descend, so that the lower end of the slide bar 30 abuts against the platform 1, the spring 31 is compressed or stretched, at the same time, the measuring rod 33 is in contact with the surface of the wafer, and as the wafer surface is thinned by grinding, the measuring instrument 32 measures the grinding thinning amount of the wafer through the measuring rod 33, improves the grinding precision, the two spray heads 34 are connected with the external grinding liquid pipeline, the two spray heads 34 respectively spray the grinding liquid to the two trays 22 on the workstations one 2 and two 3, cool the wafer, and improve the grinding effect, the two limiting rings 36 are respectively located outside the wafers on the two trays 22, the height of the limiting ring 36 protruding from the tray 22 is the upper limit of the thickness of the wafer after thinning, so as to hardware limit the wafer grinding thinning amount; the limiting ring 36 can be a material prone to sparking, when the limiting ring 36 is rubbed by the spray head 34, bright sparks are generated, the bright sparks are detected by a photosensitive piece to control the corresponding motor four 23 to stop; the limiting ring 36 can be an electrode ring coated with insulating paint on the surface, an electrode sheet is arranged in a water collecting groove of the grinding liquid, a detection circuit is arranged between the electrode sheet and the limiting ring 36, when the limiting ring 36 is rubbed by the spray head 34, the insulating paint is damaged, so that the limiting ring 36 forms a passage through the grinding liquid and the electrode sheet, so that the detection circuit generates an electric signal, the electric signal is sent to the controller of the motor four 23, so that the corresponding motor four 23 stops.

[0029] As Figures 1 to 12As shown, the wafer grinding device of the present application, in operation, first, the cross arm 9 loads the wafer blank to the work station 2, the tray 22 of the work station 2 adsorbs the lower surface of the wafer, the grinding disc 24 of the work station 2 operates to grind and thin the upper surface of the wafer blank, a measuring assembly 4 measures the grinding and thinning amount one of the upper surface of the wafer on the work station 2, when the thinning amount one reaches the specified value, the motor four 23 stops and rises, then the cross arm 9 takes out the wafer on the work station 2, the overturning motor 8 drives the cross arm 9 to overturn, the cross arm 11 adsorbs and takes down the wafer on the cross arm 9, the cross arm 11 transfers and places the wafer to the tray 22 of the work station 3, then the chuck assembly of the tray 22 of the work station 3 adsorbs the upper surface of the wafer, the grinding disc 24 of the work station 3 grinds and thins the lower surface of the wafer, another measuring assembly 4 measures the grinding and thinning amount two of the lower surface of the wafer on the work station 3, when the thinning amount two reaches the specified value, the work station 3 stops, the cross arm 11 operates to take out and discharge the wafer on the work station 3; finally, the two nozzles 34 respectively spray the grinding liquid to the two trays 22 on the work station 1 and the work station 2, to cool the wafer, and the two limit rings 36 limit and block the two grinding discs 24, to hardware limit the grinding and thinning amount of the wafer.

[0030] The main functions realized by the present application are: 1. The double grinding work stations composed of the work station 2 and the work station 3 grind the upper and lower surfaces of the wafer respectively, and the coaxial mechanical arm 5 feeds and overturns the wafer on the work station 2 and the work station 3, to realize the continuous grinding work of the wafer by the work station 2 and the work station 3, and improve the work efficiency; 2. The whole end surface of the wafer is adsorbed, so that the wafer has good clamping stability, can be high-speed ground on the upper and lower surfaces, and improves the work efficiency; 3. The grinding and thinning amount of the wafer surface can be measured, to improve the grinding precision; 4. The limit ring 36 protrudes the height of the tray 22 to the upper limit of the thickness of the wafer after thinning, to hardware limit the grinding and thinning amount of the wafer.

[0031] The wafer grinding equipment of the present application is installed, connected or arranged in a common mechanical manner, and can be implemented as long as the beneficial effects can be achieved. The platform 1, the work station 1 2, the work station 2 3, the measuring assembly 4, the shaft tube 7, the overturning motor 8, the cross arm 1 9, the inner shaft 10, the cross arm 2 11, the push rod 12, the motor 1 13, the gear 1 14, the gear 2 15, the motor 2 16, the gear 3 17, the gear 4 18, the screw rod 20, the motor 3 21, the tray 22, the motor 4 23, the grinding disc 24, the vertical sliding shaft 25, the linear motor 26, the pressure sensor 28, the sliding rod 30, the spring 31, the measuring rod 33, and the spray head 34 are purchased on the market, and the technical personnel in the industry only need to install and operate according to the attached instruction manual, without the need for the technical personnel in the field to exert creative labor.

[0032] The above is only the preferred embodiment of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the technical principles of the present application, and these improvements and modifications should be considered as the protection scope of the present application.

Claims

1. A wafer polishing apparatus, comprising a platform (1); characterized in that, It also includes station 1 (2), station 2 (3), two measuring components (4) and coaxial robotic arm (5). Station 1 (2) and station 2 (3) are installed opposite each other on the left and right sides of platform (1). Station 1 (2) is used to grind the upper surface of the wafer, and station 2 (3) is used to grind the lower surface of the wafer. The two measuring components (4) are installed on station 1 (2) and station 2 (3) respectively. The two measuring components (4) are used to measure the amount of thinning of the wafer. The coaxial robotic arm (5) is installed in the middle of platform (1). The coaxial robotic arm (5) is used to load the wafer at station 1 (2), take out the wafer after coarse grinding at station 1 (2) and flip it over to load the wafer at station 2 (3), and take out the wafer after fine grinding at station 2 (3) to unload it.

2. The wafer grinding equipment as described in claim 1, characterized in that, The coaxial robotic arm (5) includes a lower platform (6), a shaft tube (7), a flip motor (8), a horizontal arm one (9), an inner shaft (10), and a horizontal arm two (11). The lower platform (6) is installed below the platform (1) in a liftable manner. The shaft tube (7) is rotatably installed on the lower platform (6). The upper end of the shaft tube (7) extends above the platform (1). The flip motor (8) is installed on the upper outer wall of the shaft tube (7). The inner end of the horizontal arm one (9) is installed on the output shaft of the flip motor (8) through a vertical rod. The inner shaft (10) is installed concentrically inside the shaft tube (7). The upper end of the inner shaft (10) extends above the shaft tube (7). The inner end of the horizontal arm two (11) is installed on the upper end of the inner shaft (10). The horizontal arm two (11) and the horizontal arm one (9) are arranged in parallel. The lower surface of the outer end of the horizontal arm one (9) and the horizontal arm two (11) are both provided with suction cup assemblies.

3. The wafer grinding equipment as described in claim 2, characterized in that, It also includes a push rod (12), one end of which is connected to the lower platform (6), and the other end of which is connected to the platform (1).

4. The wafer grinding equipment as described in claim 2, characterized in that, It also includes motor one (13), gear one (14), gear two (15), motor two (16), gear three (17) and gear four (18). Motor one (13) is installed on the lower platform (6). Gear one (14) is installed concentrically on the output shaft of motor one (13). Gear two (15) is installed concentrically on the outer wall of the shaft tube (7). Gear one (14) meshes with gear two (15). Motor two (16) is installed on the lower platform (6). Gear three (17) is installed concentrically on the output shaft of motor two (16). Gear four (18) is installed concentrically on the lower end of the inner shaft (10). Gear three (17) meshes with gear four (18).

5. The wafer grinding apparatus as described in claim 1, characterized in that, Workstation 1 (2) includes a mounting platform (19), multiple screws (20), motor 3 (21), tray (22), motor 4 (23), and grinding disc (24). The mounting platform (19) is installed below the platform (1) via multiple screws (20). Motor 3 (21) is installed on the mounting platform (19). The tray (22) is concentrically installed on the output shaft of motor 3 (21). A suction cup assembly is provided on the tray (22). Motor 4 (23) is installed on the upper frame of the platform (1) in a liftable manner. The grinding disc (24) is concentrically installed on the output shaft of motor 4 (23). The grinding disc (24) is located above the tray (22). Workstation 2 (3) has the same structure as workstation 1 (2).

6. The wafer grinding apparatus as described in claim 5, characterized in that, It also includes a vertical sliding shaft (25), a linear motor (26) and a connecting plate (27). The lower end of the vertical sliding shaft (25) is connected to the motor (23), and the upper end of the vertical sliding shaft (25) is slidably connected to the upper gantry of the platform (1). The stator of the linear motor (26) is installed on the gantry of the platform (1). The lower end of the telescopic shaft of the linear motor (26) is connected to the connecting plate (27), and the connecting plate (27) is connected to the vertical sliding shaft (25).

7. The wafer grinding apparatus as described in claim 6, characterized in that, It also includes a pressure sensor (28), which is installed at the lower end of the telescopic shaft of the linear motor (26), and the measuring end of the pressure sensor (28) is connected to the connecting plate (27).

8. The wafer grinding apparatus as described in claim 5, characterized in that, The measuring component (4) includes a crossbeam (29), a slide bar (30), a spring (31), a measuring instrument (32), and a measuring rod (33). The end of the crossbeam (29) is mounted on the motor (23). The upper end of the slide bar (30) is slidably inserted into the crossbeam (29). One end of the spring (31) is connected to the crossbeam (29), and the other end of the spring (31) is connected to the slide bar (30). The measuring instrument (32) is mounted on the slide bar (30), and the measuring rod (33) is mounted on the measuring end of the measuring instrument (32).

9. The wafer grinding apparatus as described in claim 8, characterized in that, It also includes two nozzles (34), which are mounted on two crossbeams (29) respectively, and the two nozzles (34) face two trays (22) respectively.

10. A wafer grinding apparatus as described in claim 5, characterized in that, It also includes two annular grooves (35) and two limiting rings (36). Annular grooves (35) are provided on the upper surface of both trays (22), and the two limiting rings (36) are detachably installed in the two annular grooves (35).

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