A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink and its preparation method

Abstract

This invention provides a highly photosensitive, alkali-soluble epoxy acrylate resin solder resist ink and its preparation method. The ink comprises component A and component B. Component A includes the following components in parts by weight: 10-30 parts of highly photosensitive, alkali-soluble epoxy acrylate resin, 5-15 parts of acrylic resin, 15-40 parts of active monomer, 10-25 parts of filler, 4-8 parts of additives, and 30-60 parts of solvent. Component B includes the following components in parts by weight: 10-30 parts of phenolic epoxy resin and 5-20 parts of solvent. The highly photosensitive, alkali-soluble epoxy acrylate resin of this invention not only has good alkali solubility but also better photosensitivity. Furthermore, this invention modifies the filler, enhancing the compatibility and binding effect between components, thereby effectively improving the overall performance of the solder resist ink, including adhesion, strength, and stability, and showing promising application prospects.

Description

Technical Field

[0001] This invention relates to the field of solder resist ink technology, and in particular to a highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink and its preparation method. Background Technology

[0002] In the digital age, the global electronics and information industry continues to prosper, deeply penetrating daily life and various core fields. In the consumer market, products such as smartphones, tablets, and smartwatches are iterating at an accelerated pace, becoming not only more powerful but also thinner and more sophisticated in design. In industrial settings, automated production line control systems optimize production efficiency, while core robot control modules ensure the precise execution of complex tasks. Medical devices safeguard health and life, and traffic signal control devices maintain traffic order; electronic devices in these fields all have extremely high standards for performance and stability.

[0003] Circuit boards are the core foundational components of electronic devices, responsible for signal transmission and the coordinated operation of various components. Manufacturing defects or reliability vulnerabilities can easily lead to device malfunctions. Solder resist ink, as a key protective material in circuit board manufacturing, plays a significant role: it protects circuits from short circuits during processing and ensures solder joint quality during the soldering process.

[0004] However, traditional solder resist inks have several shortcomings. In terms of photosensitivity, for products like micro-pitch chip packaging substrates that require stringent circuit precision, traditional inks have low photosensitivity, making it difficult to achieve accurate image capture. This results in blurred circuit edges, lowering yield rates and significantly increasing production costs. Regarding solubility, if subsequent processing requires removing localized solder resist layers from the circuit board, traditional inks not only dissolve slowly but also leave behind a large amount of impurities. Even with alkaline solutions, they may damage the circuit board, severely limiting process flexibility. Furthermore, the adhesion strength between the ink and the circuit board is insufficient. When electronic products are subjected to high-temperature aging, humid and hot environments, or frequent mechanical vibration, the ink is prone to blistering and peeling, which can damage the circuitry, loosen solder joints, and ultimately reduce the stability and shorten the lifespan of the electronic product.

[0005] Alkali-soluble, highly photosensitive epoxy acrylate is a novel material used in solder resist inks. Its high photosensitive properties enable it to have a fast exposure response, accurately meeting the imaging requirements of fine-pitch circuit boards, significantly improving the clarity of circuit edges, and helping to increase product yield. The alkali-soluble design allows the development process to use a mild alkaline solution, avoiding damage to the substrate caused by traditional solvents, while also reducing volatile pollutants and meeting environmental protection process requirements.

[0006] However, this type of ink also has its shortcomings. The adhesion and temperature resistance of the ink still need to be improved. Electronic devices face problems such as detachment and blistering under complex working conditions. In addition, its alkali solubility makes its corrosion resistance weaker than that of traditional inks. At the same time, the raw material cost is higher than that of traditional solder resist inks, which increases production input to a certain extent.

[0007] In conclusion, there is an urgent need to develop a new technical solution to address the problems existing in current products and meet the needs of the market and consumers. Summary of the Invention

[0008] Based on this, the present invention provides a high photosensitive alkali-soluble epoxy acrylic resin solder resist ink, the main component of which is a high photosensitive alkali-soluble epoxy acrylic resin. This component not only has good alkali solubility, but also has better photosensitive effect. At the same time, the present invention also modifies the filler to enhance the compatibility and binding effect between components, thereby effectively improving the overall performance of the solder resist ink, such as adhesion, strength and stability, and has good application prospects.

[0009] One object of the present invention is to provide a highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink, wherein the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink comprises component A and component B.

[0010] Component A comprises the following components in parts by mass:

[0011] 10-30 parts of highly photosensitive, alkali-soluble epoxy acrylic resin

[0012] 5-15 parts of acrylic resin

[0013] 15-40 parts of active monomer

[0014] 10-25 parts of filler

[0015] 4-8 parts of auxiliary agent

[0016] Solvent 30-60 parts;

[0017] Component B comprises the following components in parts by mass:

[0018] 10-30 parts of phenolic epoxy resin

[0019] Solvent 5-20 parts;

[0020] in,

[0021] The highly photosensitive, alkali-soluble epoxy acrylic resin is obtained by reacting phenolic epoxy resin, acrylic acid, acid anhydride, and cashew phenol glycidyl ether.

[0022] Furthermore, the filler is a fumaric acid modified filler.

[0023] Furthermore, the filler includes boron nitride and titanium dioxide.

[0024] Furthermore, the mass ratio of boron nitride to titanium dioxide is (3-5):1.

[0025] Furthermore, the active monomer is selected from monofunctional active monomers or polyfunctional active monomers.

[0026] Furthermore, the additives are selected from one or more of the following: dispersants, wetting agents, defoamers, leveling agents, thickeners, toughening agents, photoinitiators, antioxidants, and preservatives.

[0027] Another object of the present invention is to provide a method for preparing the above-mentioned highly photosensitive, alkali-soluble epoxy acrylate resin solder resist ink, wherein the method for preparing the highly photosensitive, alkali-soluble epoxy acrylate resin solder resist ink includes the following steps:

[0028] S1. Phenolic epoxy resin, acrylic acid, polymerization inhibitor and catalyst are mixed and heated to react to obtain phenolic epoxy acrylic resin.

[0029] S2. The phenolic epoxy acrylate resin, acid anhydride, polymerization inhibitor and catalyst are mixed, heated and reacted, and then cashew phenol glycidyl ether is added and the reaction is continued to obtain a highly photosensitive alkali-soluble epoxy acrylate resin.

[0030] S3. Add the filler to the alkaline solution, heat and react to obtain the pretreated filler;

[0031] S4. The pretreated filler, fumaric acid and catalyst are mixed and heated to react, and then fumaric acid modified filler is obtained.

[0032] S5. Mix the highly photosensitive alkali-soluble epoxy acrylate resin, acrylic resin, modified filler, active monomer, additives and solvent to obtain component A; mix the phenolic epoxy resin and solvent to obtain component B; mix component A and component B, stir and disperse evenly, then grind and filter to obtain the product.

[0033] Further, in steps S1 and S2, the mass ratio of the phenolic epoxy resin, acrylic acid, acid anhydride, and cashew phenol glycidyl ether is (8-12):(3-6):(3-7):(1-2).

[0034] Furthermore, the mass ratio of the pretreated filler to fumaric acid is (2-5):1.

[0035] Furthermore, the particle size of the filter is 0.1-2 μm.

[0036] The present invention has the following beneficial effects:

[0037] This invention discloses a highly photosensitive, alkali-soluble epoxy acrylate resin solder resist ink, which is a compound of highly photosensitive, alkali-soluble epoxy acrylate resin and fillers. The highly photosensitive, alkali-soluble epoxy acrylate resin is obtained by reacting phenolic epoxy resin with acrylic acid to introduce double bonds, then introducing carboxyl groups through the reaction of hydroxyl groups with acid anhydrides, and finally introducing long carbon chains and more unsaturated double bonds through the reaction of carboxyl groups with cashew phenol glycidyl ether. The resulting product not only effectively improves photosensitivity and alkali solubility but also has better film-forming properties and stability. Meanwhile, this invention also modifies the filler by grafting fumaric acid groups onto the surface of inorganic particles. This improves compatibility with organic resins, thereby enhancing dispersion. Furthermore, the introduction of double bonds and carboxyl groups allows for cross-linking reactions with organic resins and active monomers, and further integrates boron nitride and titanium dioxide. This improves the ink's photosensitivity and thermal stability, and further enhances its integrity, forming a more stable cross-linked structure. This promotes improvements in the product's overall strength, stability, and solvent resistance. In summary, the high-sensitivity, alkali-soluble epoxy acrylic resin solder resist ink of this invention overcomes the shortcomings and problems of existing technologies, possesses excellent performance, and is of great significance to the development and application of solder resist inks. Detailed Implementation

[0038] To more clearly illustrate the technical solution of the present invention, the following embodiments are provided. Unless otherwise stated, the raw materials, reactions, and post-processing methods appearing in the embodiments are all commercially available raw materials and technical methods well known to those skilled in the art.

[0039] The terms "preferred," "more preferably," and "more suitable" used in this invention refer to embodiments of the invention that provide certain beneficial effects under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the description of one or more preferred embodiments does not imply that other embodiments are unavailable, nor is it intended to exclude other embodiments from the scope of this invention.

[0040] It should be understood that, except in any operational instance or otherwise indicated, all figures representing the amounts of ingredients used, for example, in the specification and claims, should be understood to be modified in all cases by the term "about". Therefore, unless otherwise stated, the numerical parameters set forth in the following specification and appended claims are approximations varying with the desired performance to be obtained according to the invention.

[0041] The acrylic resin used in this embodiment of the invention is Sartoma CN104 NS.

[0042] The active monomer in the embodiments of the present invention is methyl acrylate.

[0043] The additives in the embodiments of the present invention are leveling agent isopropanol, photoinitiator ITX and UVI-6976 in a mass ratio of 1:1:0.5.

[0044] The solvent used in the embodiments of the present invention is a divalent ester.

[0045] The phenolic epoxy resin used in this embodiment of the invention was purchased from Nan Ya Epoxy Resin and has an epoxy value of 0.56 eq / 100g.

[0046] The cashew phenol glycidyl ether used in this embodiment of the invention was purchased from Maclean's and has an epoxy value of 0.20~0.28 eq / 100g.

[0047] In the embodiments of the present invention, the particle size of both boron nitride and titanium dioxide is ≤50 nm.

[0048] In the embodiments of this invention, "parts" refers to parts by mass.

[0049] Example 1

[0050] A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink, comprising component A and component B.

[0051] Component A comprises the following components in parts by mass:

[0052] 20 parts of highly photosensitive alkali-soluble epoxy acrylic resin

[0053] 6 parts acrylic resin

[0054] 15 parts of active monomer

[0055] 10 parts of filler

[0056] 4 parts of auxiliary agent

[0057] 30 parts solvent;

[0058] Component B comprises the following components in parts by mass:

[0059] 15 parts of phenolic epoxy resin

[0060] 10 parts solvent;

[0061] The preparation method of the above-mentioned highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink includes the following steps:

[0062] S1. Mix 10 parts of phenolic epoxy resin, 4.8 parts of acrylic acid, 0.015 parts of hydroquinone and 0.15 parts of N,N-dimethylaniline, heat to 75℃ and react until the acid value is lower than 10 mg KOH / g. After washing with water, phenolic epoxy acrylic resin is obtained.

[0063] S2. The phenolic epoxy acrylate resin is mixed with 5 parts maleic anhydride, 0.02 parts hydroquinone and 0.2 parts N,N-dimethylaniline, heated to 85°C and reacted until the acid value is constant. Then 1.9 parts cashew phenol glycidyl ether is added, and the temperature is raised to 110°C and the reaction is continued for 2 hours to obtain a highly photosensitive alkali-soluble epoxy acrylate resin.

[0064] S3. Mix 4 parts boron nitride and 1 part titanium dioxide, soak them in 150 parts of 5 mol / L sodium hydroxide aqueous solution, stir and react at 80℃ for 12 h, and then wash to obtain the pretreated filler.

[0065] S4. Using 100 parts of N,N-dimethylacetamide as a solvent, mix 5 parts of the pretreated filler, 2 parts of fumaric acid, 0.005 parts of hydroquinone and 0.1 parts of p-toluenesulfonic acid, stir and react at 100°C for 12 h, and then wash to obtain fumaric acid modified filler.

[0066] S5. According to the above-mentioned mass proportions, mix the highly photosensitive alkali-soluble epoxy acrylate resin, acrylic resin, modified filler, active monomer, additives and solvent to obtain component A; mix the phenolic epoxy resin and solvent to obtain component B; mix the components A and B, stir and disperse evenly, and then grind to a fineness of <1 μm to obtain the product.

[0067] Example 2

[0068] A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink, comprising component A and component B.

[0069] Component A comprises the following components in parts by mass:

[0070] 25 parts of highly photosensitive alkali-soluble epoxy acrylic resin

[0071] 8 parts acrylic resin

[0072] 20 parts of active monomer

[0073] 15 parts of filler

[0074] 5 parts of auxiliary agent

[0075] 40 parts solvent;

[0076] Component B comprises the following components in parts by mass:

[0077] 20 parts of phenolic epoxy resin

[0078] 15 parts solvent;

[0079] The preparation method of the above-mentioned highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink includes the following steps:

[0080] S1. Mix 10 parts of phenolic epoxy resin, 4.8 parts of acrylic acid, 0.015 parts of hydroquinone and 0.15 parts of N,N-dimethylaniline, heat to 75℃ and react until the acid value is lower than 10 mg KOH / g. After washing with water, phenolic epoxy acrylic resin is obtained.

[0081] S2. The phenolic epoxy acrylate resin is mixed with 5 parts maleic anhydride, 0.02 parts hydroquinone and 0.2 parts N,N-dimethylaniline, heated to 85°C and reacted until the acid value is constant. Then 1.9 parts cashew phenol glycidyl ether is added, and the temperature is raised to 110°C and the reaction is continued for 2 hours to obtain a highly photosensitive alkali-soluble epoxy acrylate resin.

[0082] S3. Mix 4 parts boron nitride and 1 part titanium dioxide, soak them in 150 parts of 5 mol / L sodium hydroxide aqueous solution, stir and react at 80℃ for 12 h, and then wash to obtain the pretreated filler.

[0083] S4. Using 100 parts of N,N-dimethylacetamide as a solvent, mix 5 parts of the pretreated filler, 2 parts of fumaric acid, 0.005 parts of hydroquinone and 0.1 parts of p-toluenesulfonic acid, stir and react at 100°C for 12 h, and then wash to obtain fumaric acid modified filler.

[0084] S5. According to the above-mentioned mass proportions, mix the highly photosensitive alkali-soluble epoxy acrylate resin, acrylic resin, modified filler, active monomer, additives and solvent to obtain component A; mix the phenolic epoxy resin and solvent to obtain component B; mix the components A and B, stir and disperse evenly, and then grind to a fineness of <1 μm to obtain the product.

[0085] Example 3

[0086] A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink, comprising component A and component B.

[0087] Component A comprises the following components in parts by mass:

[0088] 30 parts of highly photosensitive alkali-soluble epoxy acrylic resin

[0089] 10 parts acrylic resin

[0090] 25 parts of active monomer

[0091] 20 parts of filler

[0092] 7 parts of auxiliary agent

[0093] 50 parts solvent;

[0094] Component B comprises the following components in parts by mass:

[0095] 25 parts of phenolic epoxy resin

[0096] 20 parts solvent;

[0097] The preparation method of the above-mentioned highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink includes the following steps:

[0098] S1. Mix 10 parts of phenolic epoxy resin, 4.8 parts of acrylic acid, 0.015 parts of hydroquinone and 0.15 parts of N,N-dimethylaniline, heat to 75℃ and react until the acid value is lower than 10 mg KOH / g. After washing with water, phenolic epoxy acrylic resin is obtained.

[0099] S2. The phenolic epoxy acrylate resin is mixed with 5 parts maleic anhydride, 0.02 parts hydroquinone and 0.2 parts N,N-dimethylaniline, heated to 85°C and reacted until the acid value is constant. Then 1.9 parts cashew phenol glycidyl ether is added, and the temperature is raised to 110°C and the reaction is continued for 2 hours to obtain a highly photosensitive alkali-soluble epoxy acrylate resin.

[0100] S3. Mix 4 parts boron nitride and 1 part titanium dioxide, soak them in 150 parts of 5 mol / L sodium hydroxide aqueous solution, stir and react at 80℃ for 12 h, and then wash to obtain the pretreated filler.

[0101] S4. Using 100 parts of N,N-dimethylacetamide as a solvent, mix 5 parts of the pretreated filler, 2 parts of fumaric acid, 0.005 parts of hydroquinone and 0.1 parts of p-toluenesulfonic acid, stir and react at 100°C for 12 h, and then wash to obtain fumaric acid modified filler.

[0102] S5. According to the above-mentioned mass proportions, mix the highly photosensitive alkali-soluble epoxy acrylate resin, acrylic resin, modified filler, active monomer, additives and solvent to obtain component A; mix the phenolic epoxy resin and solvent to obtain component B; mix the components A and B, stir and disperse evenly, and then grind to a fineness of <1 μm to obtain the product.

[0103] Comparative Example 1

[0104] A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that cashew phenol glycidyl ether is not added in step S2, while the other components and preparation methods are the same as in Example 1.

[0105] Comparative Example 2

[0106] A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that in step S4, fumaric acid is replaced with lauric acid, while the other components and preparation methods are the same as in Example 1.

[0107] Test case

[0108] The performance of the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist inks prepared in the examples and comparative examples was tested.

[0109] Test method:

[0110] The ink samples prepared in the examples and comparative examples were coated onto PCB boards and cured with light for 0.5 h (wavelength 395 nm, intensity 25.0 mW / cm²). 2 (The film is exposed to ultraviolet light), and then heat-cured at 150°C for 1 hour to form a 0.5 mm thick film.

[0111] Adhesion: Use a needle tip to draw an "X" shape on the film, then apply cellophane tape to the marks and pull it. Evaluate according to the following criteria:

[0112] Good: Not torn off;

[0113] Medium: Tear off a small amount;

[0114] Poor: A large amount was torn off.

[0115] Corrosion resistance: At 20°C, the PCB board coated with ink was immersed in a 10 wt% sulfuric acid solution for 30 minutes. After removal, the coating condition and adhesion were evaluated according to the following criteria:

[0116] Good: No changes or slight changes were found;

[0117] Poor: The coating film shows swelling or swelling and peeling.

[0118] Water resistance: At 20°C, the PCB circuit board coated with ink was immersed in deionized water for 24 hours. After removal, the coating condition and adhesion were evaluated according to the following criteria:

[0119] Good: No changes or slight changes were found;

[0120] Poor: The coating film shows swelling or swelling and peeling.

[0121] Heat resistance: Thermal shock performance was tested according to the method in IPC-SM-840E and evaluated based on the following benchmarks:

[0122] Good: No bubbles or cracks;

[0123] Poor: Bubbles and cracks appear.

[0124] Bending resistance: Bend the ink film 180° with the outer side facing outwards, then return it to a horizontal position. Repeat the bending until cracks appear on the film, and record the number of bends.

[0125] The test results are shown in Table 1.

[0126] Table 1 Performance Test Results

[0127]

[0128] As shown in Table 1, the high-sensitivity, alkali-soluble epoxy acrylate resin solder resist ink of the present invention possesses excellent comprehensive performance. After photocuring, the ink film exhibits good adhesion, mechanical strength, and stability, demonstrating good photosensitivity while ensuring sufficient alkali solubility. In contrast, in Comparative Example 1, the high-sensitivity, alkali-soluble epoxy acrylate resin lacks cashew phenol segments, reducing the double bond content and the presence of long alkyl segments. Consequently, the chemical crosslinking and physical entanglement between components are relatively reduced, leading to a decrease in adhesion, thermal stability, and flexural strength. In Comparative Example 2, lauric acid was grafted onto the filler, which, while beneficial for improving dispersion, prevents crosslinking between the filler and the organic resin and active monomers through chemical bonds, resulting in reduced bonding strength. Therefore, under extreme conditions, cracking and detachment are prone to occur, and the overall performance is not ideal.

[0129] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0130] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink, characterized in that, The highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink comprises component A and component B. Component A comprises the following components in parts by mass: 10-30 parts of highly photosensitive, alkali-soluble epoxy acrylic resin 5-15 parts of acrylic resin 15-40 parts of active monomer 10-25 parts of filler 4-8 parts of auxiliary agent Solvent 30-60 parts; Component B comprises the following components in parts by mass: 10-30 parts of phenolic epoxy resin Solvent 5-20 parts; in, The highly photosensitive, alkali-soluble epoxy acrylic resin is obtained by reacting phenolic epoxy resin, acrylic acid, acid anhydride and cashew phenol glycidyl ether. The filler is a fumaric acid modified filler; The additives include photoinitiators; The preparation method of the highly photosensitive, alkali-soluble epoxy acrylic resin includes the following steps: S1. Phenolic epoxy resin, acrylic acid, polymerization inhibitor and catalyst are mixed and heated to react to obtain phenolic epoxy acrylic resin. S2. The phenolic epoxy acrylate resin, acid anhydride, polymerization inhibitor and catalyst are mixed, heated and reacted, and then cashew phenol glycidyl ether is added and the reaction is continued to obtain a highly photosensitive alkali-soluble epoxy acrylate resin.

2. The high-sensitivity, alkali-soluble epoxy acrylic resin solder resist ink according to claim 1, characterized in that, The filler includes boron nitride and titanium dioxide.

3. The high-sensitivity, alkali-soluble epoxy acrylic resin solder resist ink according to claim 2, characterized in that, The mass ratio of boron nitride to titanium dioxide is (3-5):

1.

4. The high-sensitivity, alkali-soluble epoxy acrylic resin solder resist ink according to claim 1, characterized in that, The active monomer is selected from monofunctional active monomers or polyfunctional active monomers.

5. The high-sensitivity, alkali-soluble epoxy acrylic resin solder resist ink according to claim 1, characterized in that, The additives also include one or more of the following: dispersants, wetting agents, defoamers, leveling agents, thickeners, toughening agents, antioxidants, and preservatives.

6. The method for preparing the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink according to any one of claims 1-5, characterized in that, The preparation method of the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink includes the following steps: S1. Phenolic epoxy resin, acrylic acid, polymerization inhibitor and catalyst are mixed and heated to react to obtain phenolic epoxy acrylic resin. S2. Mix the phenolic epoxy acrylate resin, acid anhydride, polymerization inhibitor and catalyst, heat and react, then add cashew phenol glycidyl ether and continue the reaction to obtain a highly photosensitive alkali-soluble epoxy acrylate resin. S3. Add the filler to the alkaline solution, heat and react to obtain the pretreated filler; S4. The pretreated filler, fumaric acid and catalyst are mixed and heated to react, and then fumaric acid modified filler is obtained. S5. Mix the highly photosensitive alkali-soluble epoxy acrylate resin, acrylic resin, modified filler, active monomer, additives and solvent to obtain component A; mix the phenolic epoxy resin and solvent to obtain component B; mix component A and component B, stir and disperse evenly, then grind and filter to obtain the product.

7. The method for preparing the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink according to claim 6, characterized in that, In steps S1 and S2, the mass ratio of the phenolic epoxy resin, acrylic acid, acid anhydride, and cashew phenol glycidyl ether is (8-12):(3-6):(3-7):(1-2).

8. The method for preparing the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink according to claim 6, characterized in that, The mass ratio of the pretreated filler to fumaric acid is (2-5):

1.

9. The method for preparing the highly photosensitive, alkali-soluble epoxy acrylic resin solder resist ink according to claim 6, characterized in that, The particle size of the filter is 0.1-2 μm.

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