Electronic tester

Abstract

Disclosed is a test device that contacts a terminal on a wafer to test the wafer. The dielectric gas is used to reduce arcing between the contacts. The fixed structure and the movable structure have complementary gas interfaces that engage when the movable structure is engaged with the fixed structure. The gas cartridge has a channel block connected to the dielectric gas pressure regulator and the nitrogen pressure regulator and to the gas supply channel to selectively provide nitrogen or dielectric gas to the gas supply channel. The tray has a conductive portion to contact the rear wafer terminal, and vacuum channels, each having an enlarged portion to reduce arc.

Description

[0001] This application is a divisional application of Chinese patent application No. 202380089557.4, filed on December 27, 2023, entitled "Electronic Tester".

[0002] Cross-reference to related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 477,916, filed December 30, 2022, the entire contents of which are incorporated herein by reference. Background Technology 1) Technical Field

[0004] This invention relates to a testing apparatus for testing microelectronic circuits.

[0005] 2) Discussion of related technologies

[0006] Microelectronic circuits are typically fabricated in and on semiconductor wafers. These wafers are then "diced" or "cut" into individual dies. These dies are typically mounted onto a support substrate to provide rigidity and for electronic communication with the integrated circuits or microelectronic circuits within the die. Final packaging may include the die's package, and the resulting package can then be shipped to the customer.

[0007] Dies or packages need to be tested before being shipped to customers. Ideally, dies should be tested early in the manufacturing process to identify defects occurring during early stages of manufacturing. Wafer-level testing can be achieved by providing a manipulator and contactor with contacts, and then using the manipulator to move the wafer so that the contacts on the wafer make contact with the contacts on the contactor. Power and electronic signals can then be supplied to and from the microelectronic circuitry formed in the wafer via the contactor.

[0008] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board, and one or more devices manufactured in or mounted to the substrate.

[0009] Alternatively, the wafer can be housed within a movable wafer test module equipped with an electrical interface and a thermal chuck. When the wafer's temperature is thermally controlled by heating or cooling the thermal chuck, power and signals can be supplied to and from the wafer via the electrical interface.

[0010] After the wafer is diced, it may be necessary to test each die again, and it may also be necessary to test the die again after it is mounted onto the support substrate. Summary of the Invention

[0011] The present invention provides a testing apparatus comprising: a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a pressure relief channel formed through one of the components, the pressure relief channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a pressure relief supply connected to the pressure relief channel, the opening of the pressure relief supply allowing gas to leave the closed cavity, and the closing of the pressure relief supply preventing gas from entering the closed cavity; and an electronic tester connected to the microelectronic circuit for testing the microelectronic circuit.

[0012] The present invention also provides a testing apparatus, comprising: a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a pressure relief channel formed through one of the components, the pressure relief channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; and a pressure relief supply. The pressure reducing supply is connected to the pressure reducing channel, the opening of the pressure reducing supply allows gas to leave the closed cavity, and the closing of the pressure reducing supply prevents gas from entering the closed cavity; an electronic tester is connected to the microelectronic circuit to test the microelectronic circuit; a gas supply channel is formed through one of the components, the gas supply channel having an inlet opening outside the closed cavity and an outlet opening inside the closed cavity; and a gas supply inlet is connected to the gas supply channel, the opening of the gas supply inlet allows gas to enter the closed cavity and into the space between the contacts.

[0013] The present invention also provides a testing apparatus, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry, wherein the first component is a wafer chuck in the form of a planar component with a flat surface; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a pressure relief channel formed through one of the components, the pressure relief channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a pressure relief supply connected to the pressure relief channel, the opening of the pressure relief supply allowing gas to leave the closed cavity, and the closing of the pressure relief supply preventing gas from entering the closed cavity; a first electrical interface on the movable support structure and connected to the contacts; and a movable structure degassing interface. The device comprises: a movable structure; a fixed structure, wherein the movable support structure can be received, held by, and removed from the fixed structure; a second electrical interface on the fixed structure, wherein the second electrical interface is connected to the first electrical interface when the movable structure is held by the fixed structure, and disconnected from the first electrical interface when the movable support structure is removed from the fixed structure, wherein an electronic tester is connected to a terminal via the second electrical interface, the first electrical interface, and contacts; a hot chuck on the fixed structure, wherein the flat surface of the wafer chuck is movable toward the flat surface of the hot chuck; a degassing conduit forming part of the fixed structure; a fixed structure degassing interface forming part of the fixed structure, wherein the movable structure degassing interface is configured to engage with the fixed structure degassing interface when the wafer chuck moves toward the hot chuck to connect the outlet opening of the degassing channel to the degassing conduit of the fixed structure; and an electronic tester connected to the microelectronic circuit for testing the microelectronic circuit.

[0014] The present invention also provides a testing apparatus comprising: a tray for releasably holding a wafer, wherein the tray has at least a portion that is conductive and has an exposed surface for contacting a rear wafer terminal on a rear side of the wafer; a contact plate; contact plate front contacts mounted to the contact plate, each contact plate front contact having a surface positioned to contact a corresponding front wafer terminal on a front side of the wafer; an electronic tester connected to the contact plate front contacts such that, in use, current is conducted between the electronic tester and a circuit in the wafer through the front wafer contacts and the contact plate front contacts to test the circuit; and an electrical conductor connecting a conductive portion such that, in use, the circuit is connected to the electronic tester through the rear wafer contacts, the exposed surface of the conductive portion, and a conductive path.

[0015] The present invention also provides a testing apparatus comprising: a wafer chuck; a tray for releasably holding a wafer, the tray being releasably positioned on the wafer chuck, the wafer chuck having a vacuum channel therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a rear side of the wafer to the vacuum channel in the wafer chuck such that when a vacuum is applied to the vacuum channel, the vacuum secures the rear side of the wafer to the tray; a contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on a front side of the wafer; and an electronic tester connected to the contact plate contacts such that, in use, current is conducted between the electronic tester and a circuit in the wafer through the front wafer contacts and the contact plate contacts to test the circuit.

[0016] The present invention also provides a testing apparatus comprising: a vacuum conduit defining a vacuum channel; a wafer holder for releasably holding a wafer, the wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting a rear side of the wafer to the vacuum channel such that when a vacuum is applied to the vacuum channel, the vacuum holds the rear side of the wafer to the wafer holder, wherein each vacuum opening has an inlet opening at the wafer, an outlet opening away from the wafer, and an enlarged portion between the inlet opening and the outlet opening to reduce arcing between the openings; a contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on a front side of the wafer; and an electronic tester connected to the contact plate contacts such that, in use, current is conducted through the front wafer contacts and the contact plate contacts between the electronic tester and a circuit in the wafer to test the circuit.

[0017] The present invention also provides a gas cartridge, comprising: a vacuum regulator connectable to a pressure-reducing channel to control gas flow through the pressure-reducing channel; a dielectric gas pressure regulator connectable to a gas supply channel to control dielectric gas flow to the gas supply channel; a nitrogen pressure regulator controlling nitrogen flow to the gas supply channel; and a channel block connected to the dielectric gas pressure regulator and the nitrogen pressure regulator, and connectable to the gas supply channel to selectively supply either nitrogen or the dielectric gas to the gas supply channel.

[0018] The present invention also provides a wafer testing module, including a movable support structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a pressure relief channel formed through one of the components, the pressure relief channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a pressure relief supply connected to the pressure relief channel, the opening of the pressure relief supply allowing gas to leave the closed cavity, and the closing of the pressure relief supply preventing gas from entering the closed cavity; and a first electrical interface on the movable support structure and connected to the contacts, for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by a fixed structure.

[0019] The present invention also provides a wafer testing module, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a decompression channel formed through one of the components, the decompression channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; and a decompression supply connected to... The components include: a pressure-reducing channel, wherein opening the pressure-reducing supply allows gas to leave the enclosed cavity, and closing the pressure-reducing supply prevents gas from entering the enclosed cavity; a first electrical interface on the movable support structure and connected to the contacts, for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure; a gas supply channel formed through one of the components, the gas supply channel having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; and a gas supply inlet connected to the gas supply channel, the opening of the gas supply inlet allowing gas to enter the enclosed cavity and into the space between the contacts.

[0020] The present invention also provides a wafer testing module, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry, wherein the first component is a wafer chuck in the form of a flat surface, the flat surface being movable toward the flat surface of a hot chuck of a fixed structure; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; and a decompression channel formed through one of the components, the decompression... The pressure channel has an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity; a pressure reducing supply connected to the pressure reducing channel, the opening of which allows gas to leave the enclosed cavity, and the closing of which prevents gas from entering the enclosed cavity; a first electrical interface on the movable support structure and connected to the contact, for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure; and a movable structure degassing interface shaped to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the hot chuck to connect the outlet opening of the pressure reducing channel to the degassing conduit of the fixed structure.

[0021] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first component and a second component, the second component having contacts of terminals abutting the substrate, the terminals being connected to the microelectronic circuit; positioning a cavity seal between the first component and the second component to form a closed cavity through the surfaces of the first component and the second component and the cavity seal; and transmitting signals between an electronic tester and the microelectronic circuit to test the microelectronic circuit.

[0022] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts abutting against the substrate, the terminals being connected to the microelectronic circuit; positioning a cavity seal between the first component and the second component to form a closed cavity through the surfaces of the first component and the second component and the cavity seal; transmitting a signal between an electronic tester and the microelectronic circuit to test the microelectronic circuit; and allowing a dielectric gas to enter the closed cavity into the space between the contacts.

[0023] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts abutting against terminals of the substrate, the terminals being connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a planar component having a flat surface; positioning a cavity seal between the first component and the second component to form a closed cavity through the surfaces of the first component and the second component and the cavity seal; receiving the movable support structure through a fixed structure, wherein a first electrical interface on the movable support structure is connected to a second electrical interface on the fixed structure; moving the planar surface of the wafer chuck toward the planar surface of a hot chuck of the fixed structure to further mate a degassing interface of the movable structure with a degassing interface of the fixed structure, thereby connecting the outlet opening of the depressurization channel to a degassing conduit of the fixed structure; and transmitting a signal between an electronic tester and the microelectronic circuit to test the microelectronic circuit, wherein the signal is transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts, and the first and second electrical interfaces to test the microelectronic circuit.

[0024] The present invention also provides a method for testing a wafer, comprising: holding the wafer in a tray, wherein the tray has at least a portion that is conductive and has an exposed surface for contacting a rear wafer terminal on a rear side of the wafer; moving a contact plate and the tray toward each other such that a surface of a contact plate contact mounted to the contact plate contacts a corresponding front wafer contact on a front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front wafer contact and the contact plate contact to test the circuit; the circuit being connected to the electronic tester through the rear wafer terminal, the exposed surface of the conductive portion, and the conductive path; and removing the wafer from the tray.

[0025] The present invention also provides a method for testing a wafer, comprising: holding the wafer in a tray; positioning the tray on a chuck; applying a vacuum to a vacuum channel through the wafer chuck, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a rear side of the wafer to the vacuum channel in the wafer chuck, such that the vacuum holds the rear side of the wafer to the tray; moving a contact plate and the tray relative to each other such that a surface of a contact plate contact mounted to the contact plate contacts a corresponding front wafer contact on a front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front wafer contact and the contact plate contact to test the circuit; and removing the wafer from the tray.

[0026] The present invention also provides a method for testing a wafer, comprising: releasably holding a wafer in a wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting a rear side of the wafer to a vacuum channel; applying a vacuum to the vacuum channel, the vacuum securing the rear side of the wafer to the wafer holder; moving a contact plate and a tray toward each other such that a surface of a contact plate contact mounted to the contact plate contacts a corresponding front wafer contact on a front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front wafer contact and the contact plate contact to test the circuit, wherein each vacuum opening has an inlet opening at the wafer, an outlet opening away from the wafer, and an enlarged portion between the inlet opening and the outlet opening to reduce arcing between the openings; and removing the wafer from the tray. Attached Figure Description

[0027] The invention is further described with reference to the accompanying drawings and embodiments, wherein:

[0028] Figure 1 This is a cross-sectional side view of a test apparatus with a slot assembly according to an embodiment of the present invention;

[0029] Figure 2 It is along Figure 1 A cross-sectional side view of the test apparatus in line 2-2;

[0030] Figure 3 It is along Figure 1 A cross-sectional side view of the test apparatus in line 3-3;

[0031] Figure 4 It is along Figure 2 and Figure 3 A cross-sectional side view of the test apparatus in line 4-4;

[0032] Figure 5A , 5B Figures 5 and 5C are perspective views of the testing setup, showing a movable wafer testing module being inserted into or removed from an oven defined by a frame.

[0033] Figure 6 It is a timeline showing how one wafer test module can be inserted and used to test the electronics on the wafer, and the subsequent insertion of another wafer test module;

[0034] Figure 7 This is a three-dimensional view of the test setup, showing the insertion or removal of a slot assembly;

[0035] Figure 8A and 8B It is shown in relation to Figures 1-7A cross-sectional side view of the support used in the described wafer test module construction;

[0036] Figure 9A , 9B 10 and 10 are side views showing the apparatus for inserting and removing the movable wafer test module into and from the oven;

[0037] Figure 11 This is a 3D view taken from above the first wafer testing module;

[0038] Figure 12 This is a 3D view taken from below the first wafer testing module;

[0039] Figure 13 It is the first wafer test module along Figure 11 and 12 Sectional view of 13-13 in the image;

[0040] Figure 14 It is the edge of the first wafer test module Figure 13 Sectional view of 14-14 in the image;

[0041] Figure 15 It is the edge of the first wafer test module Figure 12 Sectional view 15-15 in the diagram;

[0042] Figure 16 It is along Figure 15 The view showing the direction of arrow A in the image, with its components removed;

[0043] Figure 17 yes Figure 15 Sectional view of 17-17;

[0044] Figure 18A(i) and 18A(ii) yes Figure 15 View in the directions of arrows A and B, with the latch mechanism in the unlocked position;

[0045] Figure 18B(i) and 18B(ii) Is with Figure 18A(i) and 18A(ii) A similar view, where the latching mechanism is in the locked position;

[0046] Figure 19 This is a perspective view showing how to use shims to set the height of the flaps in the latching mechanism;

[0047] Figure 20 This is a 3D view of the components of the pressure monitoring system;

[0048] Figure 21 This is a 3D view of the other components of the pressure monitoring system;

[0049] Figure 22A and 22B These are perspective and side views of the components of the pressure monitoring system before they are assembled.

[0050] Figure 23A and 23B Is with Figure 22A and 22B A view of the components of a similar pressure monitoring system after they have been joined together;

[0051] Figure 24 This is a block diagram showing the components of a test apparatus for introducing dielectric materials;

[0052] Figure 25 This is a top view of the slot component;

[0053] Figure 26 yes Figure 25 Cross-sectional side views of 26A-26B in the diagram;

[0054] Figure 27 yes Figure 25 Cross-sectional side views of 27A-27B in the diagram;

[0055] Figure 28 yes Figure 26 A detailed view of the area marked "C" in the middle;

[0056] Figure 29 yes Figure 27 A detailed view of the area marked "D" in the middle;

[0057] Figure 30 This is a 3D view of the slot assembly;

[0058] Figure 31 and 32 This is a partially exploded perspective view of the gas box used in the slot assembly;

[0059] Figure 33 This is a cross-sectional side view of a portion of the wafer test module and slot assembly;

[0060] Figure 34 yes Figure 33 A detailed view of the area marked "E" in the middle; and

[0061] Figure 35 and 36 yes Figure 33 The diagram shows two cross-sectional perspective views of the wafer chuck and tray of the wafer testing module, which are perpendicular to each other. Detailed Implementation

[0062] The attached image Figure 1A test apparatus 10 according to an embodiment of the present invention is shown, comprising (i) a fixed structure including a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, and a vacuum line 24E; (ii) a movable device including first and second wafer test modules 28A and 28B; and (iii) first and second wafer test modules 30A and 30B. The first and second wafer test modules 28A and 28B are described herein as “wafer test modules,” and their use is described as for testing wafers. It should be understood that the first and second wafers 28A and 28B can generally be used to test microelectronic circuits and can be classified as “first and second microelectronic circuit test packages 28A and 28B.”

[0063] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature changing device in the form of a heating resistor 38, a first slot assembly interface 40, and a plurality of second slot assembly interfaces, including a control interface 44, a power interface 46, a cold liquid supply interface 48A, a cold liquid return interface 48B, a control liquid supply interface 48C, a control liquid return interface 48D, and a vacuum interface 48E.

[0064] The first slot assembly interface 40 is located within and mounted to the slot assembly body 32. The control interface 44, the power interface 46, and the second electrical interfaces in the form of interfaces 48A to 48E are mounted in the left wall of the slot assembly body 32.

[0065] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, power cable 22, and conduits 24A to 24E are manually connected to the control interface 44, power interface 46, and interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, power cable 22, and conduits 24A to 24E must first be manually disconnected from the control interface 44, power interface 46, and interfaces 48A to 48E, respectively.

[0066] The slot assembly 18A includes a motherboard 60 with test electronics, multiple channel module boards 62 with test electronics, a flexible connector 64, and a connection board 66. A control interface 44 and a power interface 46 are connected to the motherboard 60, and a thermal controller 50 is mounted to the motherboard 60. The channel module boards 62 are electrically connected to the motherboard 60. The flexible connector 64 connects the channel module boards 62 to the connection board 66. Control functionality is provided by an electrical conductor connecting the control interface 44 to the motherboard 60. Power is supplied to the motherboard 60 via the power interface 46. Both power and control are supplied from the motherboard 60 to the channel module boards 62 via conductors. The flexible connector 64 provides a conductor connecting the channel module boards 62 to the connection board 66. The connection board 66 includes a conductor connecting the flexible connector 64 to a first slot assembly interface 40. The first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 via various conductors, allowing power and control to be supplied to the first slot assembly interface 40 via the control interface 44 and the power interface 46.

[0067] The second slot assembly 18B includes components similar to those in the first slot assembly 18A, and the same reference numerals denote the same components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, power interface 46, and interfaces 48A to 48E of the second slot assembly 18B are manually connected to a separate set of connection components, which includes a separate tester cable 20, a separate power cable 22, and separate conduits 24A to 24E.

[0068] Wafer test module 28A includes a wafer test module body formed by a wafer chuck 72 and a backplane 74. Wafer 30A has a plurality of microelectronic devices formed therein. Wafer 30A is inserted into the wafer test module body between the wafer chuck 72 and the backplane 74. Wafer test module contacts 76 contact corresponding contacts (not shown) on wafer 30A. Wafer test module 28A also includes a wafer test module interface 78 located on the backplane 74. Conductors in the backplane 74 connect the wafer test module interface 78 to the wafer test module contacts 76.

[0069] The wafer test module 28A has a lip seal 77 (also referred to herein as a "differential pressure chamber seal") connecting the backplate 74 and the wafer chuck 72. A vacuum is applied to the area defined by the lip seal 77, the backplate 74, and the wafer chuck 72. The vacuum holds the wafer test module 28A together and ensures proper contact between the wafer test module contacts 76 and the contacts on the wafer 30A.

[0070] Temperature detector 36 is located in hot chuck 34, so close enough to wafer 30A to detect the temperature of wafer 30A or to within five degrees Celsius, preferably to within one or two degrees Celsius of wafer 30A.

[0071] The slot assembly 18A also has a door 82, which is connected to the slot assembly body 32 via a hinge 84. When the door 82 is rotated to the open position, the wafer test module 28A can be inserted into the slot assembly body 32 through the door opening 86. The wafer test module 28A is then lowered onto the thermal chuck 34, and the door 82 is closed. The thermal chuck 34 is mounted onto the slot assembly body 32. The thermal chuck 34 then essentially forms a retainer with a wafer test stage.

[0072] The slot assembly 18A also has a thermal interface cavity seal 88 located between the thermal chuck 34 and the wafer chuck 72. A vacuum is applied to the area defined by the thermal interface cavity seal 88, the thermal chuck 34, and the wafer chuck 72 via the vacuum interface 48E and the vacuum line 90. Therefore, a good thermal connection is provided between the thermal chuck 34 and the wafer chuck 72. When the heating resistor 38 generates heat, the heat is conducted through the thermal chuck 34 and the wafer chuck 72 to the wafer 30A. When the thermal chuck 34 is at a lower temperature than the wafer 30A, the heat is conducted in the opposite direction.

[0073] The wafer test module interface 78 is coupled to the first slot component interface 40. Power and signals are supplied to wafer 30A through the first slot component interface 40, the wafer test module interface 78, and the wafer test module contact 76. The performance of the devices within wafer 30A is measured through the wafer test module contact 76, the wafer test module interface 78, and the first slot component interface 40.

[0074] The door 82 of slot assembly 18B in the closed position is shown. A front seal 100 is mounted on the upper surface of slot assembly 18A and seals against the lower surface of slot assembly 18B. A front seal 102 is mounted on the upper surface of slot assembly 18B and seals against the lower surface of frame 14. A front wall 104 provides a continuous seal through the door 82 of slot assemblies 18A and 18B and the front seals 100 and 102.

[0075] The slot assembly 18A also includes a thermal controller 50. A temperature detector 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the heating resistor 38 via a power interface 46 and a power line 54, causing the heating resistor 38 to heat up. The heating resistor 38 then heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34, and the heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0076] The hot chuck 34 has a hot fluid channel 224 formed therein. The hot fluid channel 224 holds a hot fluid. The hot fluid is preferably a liquid rather than a gas because liquids are incompressible and heat is convection to or from the liquid more quickly. Different hot fluids are used for different applications, with oil being used for the highest temperature applications.

[0077] Control liquid supply and return lines 226 and 228 connect the opposite ends of the hot fluid channel 224 to the cold liquid supply and return interfaces 48C and 48D, respectively. A heating resistor 38, acting as a heater, is installed at the location of the heated chuck 34 to heat the hot fluid. By recirculating the hot fluid through the hot fluid channel 224, the heated chuck 222 provides a more uniform heat distribution to the heated chuck 34, and ultimately to the wafer 30A. The temperature of the fluid can also be controlled to heat or cool the heated chuck 34.

[0078] The test apparatus 10 also includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two cold liquid supply lines 24A, connected to the first and second slot assemblies 18A and 18B, are also connected to the cooling system 240 via a manifold (not shown). An additional manifold connects a cold liquid return line 24B to the cooling system 240, a control liquid supply line 24C to the temperature control system 242, a control liquid return line 24D to the temperature control system 242, and a vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cooling plate 246 with a respective fluid channel 248. The cooling system 240 circulates fluid through the fluid channel 248 to cool the cooling plate 246. The cooling plate 246 then keeps the channel module plate 62 cooled. Temperature control system 242 circulates fluid through hot fluid channel 224 to control the temperature of hot chuck 34 and transfer heat from or to wafers 30A and 30B. Vacuum pump 244 supplies air at vacuum pressure to vacuum line 90.

[0079] Slot assembly 18A includes a separation seal 108 mounted to the upper surface of slot assembly body 32 and above its inner wall 106. Separation seal 108 seals against the lower surface of slot assembly 18B. Slot assembly 18B has a separation seal 110 mounted to the upper surface of its slot assembly body 32. Separation seal 108 seals against the lower surface of frame 14. A continuously sealed separation wall 112 is provided by the inner walls 106 of slot assemblies 18A and 18B, and separation seals 108 and 110.

[0080] Figure 2 It shows Figure 1 Test apparatus 10 on 2-2. Frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path, in which air at room temperature passes through frame 14 without being recirculated. The closed-loop path is particularly useful in cleanroom environments because it results in less particulate material being released into the air.

[0081] The test apparatus 10 also includes a temperature changing device in the form of a first fan 122, a first fan motor 124, and a water cooler 126.

[0082] The first fan 122 and the first fan motor 124 are mounted on the upper part of the first closed-loop air path 120. The water cooler 126 is mounted to the frame 14 within the upper part of the first closed-loop air path 120.

[0083] Wafer test modules 28A and 28B are positioned together with slot assemblies 18A and 18B and are located within the lower half of the first closed-loop air path 120.

[0084] In operation, current is supplied to the first fan motor 124. The first fan motor 124 causes the first fan 122 to rotate. The first fan 122 causes air to circulate clockwise through the first closed-loop air path 120.

[0085] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows over the slot assemblies 18A and 18B located above the wafer test modules 28A or 28B. The wafer test modules 28A or 28B are then cooled by convection.

[0086] Figure 3 It shows Figure 1 Test apparatus 10 on 3-3. Frame 14 defines a second closed-loop air path 150. Test apparatus 10 also includes a temperature changing device in the form of a second fan 152, a second fan motor 154, and a water cooler 156. Figure 2 There is no electric heater or throttle valve installed. The air inlet and outlet openings (not shown) can be opened to turn the second closed-loop air path 150 into an open air path, in which room temperature air passes through the frame 14 without being recirculated.

[0087] The closed-loop path is particularly useful in cleanroom environments because it results in less particulate material being released into the air. A second fan 152 and a second fan motor 154 are located in the upper part of the second closed-loop air path 150. A water cooler 156 is located slightly downstream of the second fan 152 within the second closed-loop air path 150. The main board 60 and channel module board 62, forming part of the slot assemblies 18A and 18B, are located in the lower half of the second closed-loop air path 150.

[0088] In operation, current is supplied to the second fan motor 154, which rotates the second fan 152. The second fan 152 then recirculates air clockwise through the second closed-loop air path 150. The air is cooled by a water cooler 156. The cooled air then passes through the motherboard 60 and the channel module board 62, causing heat to be transferred from the motherboard 60 and the channel module board 62 to the air via convection.

[0089] Figure 1 The continuous sealing separation wall 112 shown makes Figure 2 The air recirculated through the first closed-loop air path 120 is... Figure 3 The air in the second closed-loop air path 150 remains isolated. Figure 1 The continuous sealed front wall 104 shown prevents air from escaping from the first closed-loop air path 120.

[0090] like Figure 2 and 3 As shown, with Figure 1 The same cooling system 240 used in the cooling water cooler 126 is also used in the cooling water cooler. For example... Figure 4 As shown, the pressure ventilation device (plenum) 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuous sealed separation wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0091] Figure 5A , 5B Figure 5C illustrates how wafer test modules 30C, 30D, and 30E can be inserted or removed at any time, while all other wafer test modules are used to test wafer devices and can be in various temperature ramp states. Figure 6 The concept is illustrated in more detail. At time T1, a first wafer test module is inserted into frame 14, while a second wafer test module is located outside frame 14. At time T1, heating of the first wafer test module begins. Between T1 and T2, the temperature of the first wafer test module increases from room temperature, approximately 22°C, to a test temperature 50°C to 150°C higher than room temperature at T2. At T2, power is applied to the first wafer test module, and the devices within it are tested. At T3, the second wafer test module is inserted into frame 14, and heating of the second wafer test module begins. At T4, testing of the first wafer test module is terminated. Cooling of the first wafer test module also begins at T4. At T5, the second wafer test module reaches the test temperature, and power is supplied to it, and the wafers within it are tested. At T6, the second wafer test module reaches a temperature close to room temperature and is removed from frame 14. A third wafer test module can then be inserted in place of the first wafer test module. At T7, testing of the second wafer test module is terminated, and its cooling begins. At T8, the second wafer test module has been cooled to room temperature or near room temperature and is removed from frame 14.

[0092] Different tests can be performed at different temperatures. For example, a wafer test module can be inserted and tested at room temperature. Another test can be performed as the temperature rises. Further tests can be performed at the rising temperature. Further tests can be performed as the temperature falls. Two of these tests can be a single test running from one temperature stage to the next.

[0093] like Figure 7 As shown, a slot assembly 18A can be removed or inserted into frame 14. Slot assembly 18A can be inserted or removed, while other slot assemblies in frame 14 are used for testing wafer devices, as shown in the reference... Figure 6 As stated above.

[0094] like Figure 8A The diagram also shows a signal distribution board 500, a contact plate 502, multiple wafer contact probes 504, a contact plate retainer 506, a fastener 508, and a post 510.

[0095] The signal distribution board 500 is primarily made of insulating material and has circuitry (not shown) formed therein. Contacts 512 are formed on the lower side 514 of the signal distribution board 500. A threaded opening 516 is formed in the lower side 514.

[0096] The contact plate 502 has a plurality of probe holes 518, post holes 520, and fastener holes 522 formed therethrough from the upper side 524 to the lower side 526. Each probe hole 518 has a first portion 528 and a second portion 530. When viewed in a plan view, both the first and second portions 528 and 530 are circular. The first portion 528 has a larger diameter than the second portion 530. Figure 8A When viewed in a cross-sectional side view, the diameter of the first portion 528 is larger than that of the second portion 530, resulting in the first portion 528 being wider than the second portion 530.

[0097] The post hole 520 has a first portion 534 and a second portion 536. When viewed in a plan view, both the first portion 534 and the second portion 536 are circular. The diameter of the first portion 534 is larger than the diameter of the second portion 536. Because the diameter of the first portion 534 is larger than the diameter of the second portion 536, when... Figure 8A In a cross-sectional side view, the first portion 534 is wider than the second portion 536. The first and second portions 534 and 536 have vertical sidewalls. A water platform 538 connects the vertical sidewalls of the first and second portions 534 and 536.

[0098] Each probe 504 includes a conductive retainer portion 542, a helical spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first interior 550 and a first end 552. The second end piece 548 has a second interior 554 and a second end 556. The helical spring 544 and the first and second interiors 550 and 554 are held by the retainer portion 542, wherein the helical spring 544 is located between the first and second interiors 550 and 554. The first and second ends 552 and 556 protrude from the upper and lower ends of the retainer portion 542, respectively.

[0099] A terminal 560 is formed on the upper surface of the first end 552. A contact front contact 562 is formed on the lower end of the second end 556. The helical spring 544 and the first and second end members 546 and 548 are made of metal, and therefore of a conductive material. The helical spring 544 and the first and second end members 546 and 548 form conductors capable of conducting current between the terminal 560 and the contact front contact 562.

[0100] The corresponding probe is inserted into the corresponding probe hole 518 through the upper side 524. The second end 556 is slightly smaller than the second portion 530 so that it passes through the second portion 530 and protrudes from the lower side 526. The retainer portion 542 is slightly narrower than the first portion 528 but wider than the second portion 530 to prevent the probe 504 from falling out from the lower side 526. When the probe 504 is fully inserted into the probe hole 518, and before the contact plate 502 is mounted to the signal distribution board 500, the first end 552 still protrudes above the upper side 524 of the contact plate 502.

[0101] The column 510 has a support 564, a force transfer portion 566, and a force transmission portion 568. The column 510 is made of a single piece of metal or other material, chosen because its strength is comparable to the strength and brittleness of the ceramic material of the contact plate 502.

[0102] The column 510 is inserted into the column hole 520 via the upper side 524. The support 564 and the force transfer portion 566 are slightly narrower than the second portion 536. The force transmission portion 568 is slightly narrower than the first portion 534, but wider than the second portion 536. The lower surface 570 of the force transmission portion 568 abuts against the platform 538, thereby preventing the column 510 from falling off the lower side 526.

[0103] Column 510 has surface 572, when column 510 is as Figure 8A When fully inserted, surface 572 lies in a plane parallel to and below the surface of lower side 526. When column 510 is fully inserted, force transmission portion 568 has surface 574 in the same plane as upper side 524.

[0104] The signal distribution board 500 is positioned on top of the contact plate 502. Each contact 512 contacts a corresponding terminal 560. Because the terminal 560 is located in a plane above the plane of the upper side 524, the lower side 514 is initially spaced apart from the upper side 524.

[0105] Fastener 508 has a threaded shaft 578 and a head 580. Contact plate retainer 506 has an annular opening 582. Contact plate retainer 506 is located on the lower surface 584 of contact plate 502. Threaded shaft 578 is inserted from the bottom through an annular opening 582 and then through fastener hole 522. Head 580 contacts the lower surface of contact plate retainer 506. Head 580 is then rotated so that the threads on threaded shaft 578 are screwed into the threads on threaded opening 516. The threading action moves signal distribution plate 500 closer to contact plate 502 and contact plate retainer 506. Lower side 514 eventually contacts upper side 524. Contact 512 moves first end piece 546 downward into probe hole 518 until terminal 560 is in the same plane as upper side 524. Helical spring 544 is compressed and thus slightly deformed to allow first end piece 546 to move relative to second end piece 548.

[0106] The lower side 514 has a portion that stops against the surface 574 that forms part of the column 510. Because the column 510 is close to the signal distribution plate 500, the column 510 is in a position to transmit force to the signal distribution plate 500 through the surface 572.

[0107] The first wafer 32A has a plurality of electronic devices formed therein. Each electronic device has a plurality of terminals 588 at the upper surface 590 of the first wafer 32A. When the backplate 74 and the first wafer 32A are placed together, the first wafer 32A is aligned with the backplate 74 to ensure that each terminal 588 contacts a corresponding contact front contact 562.

[0108] A vacuum pressure is generated in the region between the upper surface 590 and the lower surface 526, while the pressure below the lower surface 592 of the wafer chuck 72 and the upper surface 594 of the signal distribution plate 500 remains at atmospheric pressure. The pressure difference generates equal and opposite forces F1 and F2 on the signal distribution plate 500 and the wafer chuck 72.

[0109] like Figure 8BAs shown, forces F1 and F2 cause the backplate 74 to move relative to the first wafer 32A and the wafer chuck 72. The helical spring 544 compresses further to allow the second end piece 548 to move into the probe hole position 518. Each helical spring 544 overcomes its spring force deformation, for example, F3. However, force F1 is still greater than the sum of all forces F3 added together. The upper surface 590 eventually abuts against the surface 572 of the support 564. Because the post 510 is close to the signal distribution plate 500, the support 564 prevents the upper surface 590 from moving closer to and contacting the underside 526 of the contact plate 502. The first wafer 32A transfers force F4 to the support 564. The force transfer portion 566 transfers force F4 through the second portion 536 of the post hole position 520. The force transmission portion 568 receives force F4 from the force transfer portion 566 and transmits force F4 to the signal distribution plate 500 via surface 574.

[0110] Therefore, it can be seen that force F4 is not borne by contact plate 502, thus preventing stress that could damage the brittle ceramic material of contact plate 502. Instead, force F4 is directly transmitted from the electronic device in the form of the first wafer 32A to the signal distribution board 500 through pillar 510.

[0111] exist Figure 8A and 8B In the illustrated embodiment, contact plate 502 serves as a support plate having a through-hole 520. Signal distribution plate 500 serves as a backing structure on a first side of the support plate and includes at least a circuit board with contacts 512. Probe 504 serves as a conductor having a contact 562 at the front end of the contact plate for contacting a terminal 588 on an electronic device located on a second side of the support plate, opposite to the first side of the support plate. Holder portion 542 serves as a portion of a conductor held by the support plate. The conductor also has a terminal 560 connected to the contact 512 on the signal distribution plate 500. A spring in the form of a helical spring 544 is provided. Wafer chuck 72 serves as a force generating device on one side of an electronic device in the form of a first wafer 32A opposite to the support plate. The force generating device and the support plate are movable relative to each other to move the electronic device closer to the support plate and deform the spring. The column 510 has a support 564 having a surface 572 in a plane spaced apart from the surface of the support plate to prevent the electronic device from moving closer to the support plate; a force transfer portion 566 extending at least partially from the support 564 through the column hole 520; and a force transmission portion 568 extending from the force transfer portion 566, the force transmission portion 568 being held by a backing structure.

[0112] Figure 9A A portion of the test apparatus 10 is shown, which is used to insert a wafer test module into each slot assembly, such as into slot assembly 18A, and to remove it therefrom. Figure 9AThe components of the test apparatus 10 shown are fixed structure components, including frame 300, a portion of the first slot assembly 18A, first slot assembly interface 40, holding structure 302, horizontal conveying device 304, vertical conveying device 306, push rod blade 308 and locking mechanism 310.

[0113] The frame 300 includes a first mounting member 312 and a second mounting member 314 spaced apart from each other. A horizontal conveying device 304 is a sliding member mounted between the first and second mounting members 312 and 314. A retaining structure 302 is mounted for sliding along the horizontal conveying device 304. Opposite ends of push rod blades 308 are respectively mounted to the first and second mounting members 312 and 314.

[0114] The locking mechanism 310 includes a connecting rod 316, a control rod 318, and a pressure rod 320. The control rod 318 is mounted to a first mounting member 312 on a pivot connection 322. The vertical conveying device 306 is a rigid beam. A connecting member 324 connects the center points of the vertical conveying device 306 and the push rod blade 308 to each other. The pressure rod 320 has a first connecting rod 326 rotatably connected to the control rod 318 and a second connecting rod 328 rotatably connected to one end of the vertical conveying device 306. Figure 9A In the unlocking configuration shown, line 330 connects pivot connection 322 to second link 328, and first link 326 is on the left side of line 330.

[0115] In use, the first wafer test module 28A is positioned on the holding structure 302. Then, the first wafer test module 28A, together with the holding structure 302, moves from left to right into the first slot assembly 18A. The placement and movement of the first wafer test module 28A can be performed manually or using a robot.

[0116] The retaining structure 302 slides along the horizontal conveying device 304. The connecting rod 316 connects one end of the control rod 318 to the retaining structure 302. When the retaining structure 302 moves horizontally along the horizontal conveying device 304, the connecting rod 316 causes the control rod 318 to rotate counterclockwise about the pivot connection 322.

[0117] The first link 326 rotates counterclockwise together with the control lever 318. The pressure lever 320 converts the movement of the first link 326 into the downward movement of the second link 328. Initially, the downward movement is minimal, but the vertical movement becomes more significant when the first wafer test module 28A is fully inserted into the first slot assembly 18A, and the vertical transport device 306 engages the first wafer test module 28A with the first slot assembly 18A. The horizontal transport device 304 is thus operable to move the first wafer test module 28A horizontally from a first position to a second position into the first slot assembly 18A, and the vertical transport device 306 is operable to move the first wafer test module 28A and the first slot assembly 18A relative to each other in a first vertical direction so that the slot assembly interface 40 engages with the wafer test module interface on the first wafer test module 28A.

[0118] exist Figure 9A In the diagram, control lever 318 is shown in the unlocked position, with first link 326 located on the first side of line 330 connecting pivot connection 322 and second link 328. Control lever 318 is... Figure 9A The unlock position is rotated through the compression position, in which the push rod blade 308 is deformed by the vertical conveying device 306 via the connecting part 324 by bending the push rod blade 308 against its spring force, and the first link 326 is aligned with the pivot connecting part 322 and the second link 328. The control lever 318 continues to rotate from the compression position to the locking position, as shown. Figure 9B and 10 As shown. In the locked position, the first link 326 is to the right of line 330, and therefore to the second side of line 330 opposite to the first side. Because the first link 326 has passed through line 330 and the push rod blade 308 has overcome its spring force deformation, the first wafer test module 28A is locked in position against the slot assembly interface 40.

[0119] The system can be unlocked by moving the holding structure 302 from right to left. The control lever 318 rotates clockwise, and the first link 326 moves from right to left along the line 330. The vertical transport device 306 moves upward, i.e., in a second vertical direction opposite to the first vertical direction, to release the first wafer test module 28A from the slot assembly interface 40. Further movement of the holding structure 302 along the horizontal transport device 304 removes the first wafer test module.

[0120] Figure 11 and 12 Other components of the first wafer test module 28A are shown, including a pressure relief check valve 600, a vacuum release check valve 602, components of a latching system including first, second, third and fourth latching assemblies 604A to 604D, and an electronic pressure sensor interface 606 forming part of a pressure monitoring system.

[0121] Figure 13 It is along Figure 11 and 12 The cross-sectional view is shown in section 13-13. A pressure-reducing channel 608 is formed in the back plate 74. The pressure-reducing channel 608 has an outlet opening 610 and an intermediate position 612 located in the same plane. The outlet opening 610 is connected to the pressure-reducing check valve 600. The intermediate position 612 is closer to the center point of the back plate 74 than the outlet opening 610. The pressure-reducing channel 608 is formed by first drilling four channels in the back plate 74 and then sealing one end of three of the channels, thereby completely isolating the formed pressure-reducing channel 608 from the atmospheric pressure outside the back plate 74.

[0122] Figure 14 yes Figure 13 In the cross-sectional view of 14-14, the pressure relief channel 608 continues downward from the middle position 612 through the support plate 74 and the signal distribution plate 500. The pressure relief channel 608 has an inlet opening 624 communicating with the differential pressure chamber 622. The lip seal 77 is located in the groove of the wafer chuck 72. The differential pressure chamber 622 is formed by the wafer chuck 72 forming the lower side of the differential pressure chamber 622, the contact plate 502, the contact plate pressure ring 506, the signal distribution plate 500 forming the upper side of the differential pressure chamber 622, and the lip seal 77 forming the connection between the upper and lower sides of the differential pressure chamber 622. The lip seal 77 is completely circular and completely surrounds the contact plate 502 and the wafer located between the contact plate 502 and the wafer chuck 72.

[0123] Figure 14 The components shown form a movable support structure 626. The movable support structure 626 has a first component 628 including a signal distribution board 500 and a backplate 74, and a second component 630 including a wafer chuck 72.

[0124] In use, the first component 628 is separated from the second component 630. The wafer is then placed on the wafer chuck 72. The first component 628 is then positioned on the second component 630. The upper peripheral edge of the lip seal 77 contacts the signal distribution plate 500. The wafer is thus held in the movable support structure 626.

[0125] Now, in conjunction with references Figure 13 and 14 The pump is connected to the pressure reducing check valve 600. The pressure reducing check valve 600 then opens. The pressure reducing channel 608 can initially be at atmospheric pressure, and the pump subsequently reduces the pressure within the pressure reducing channel 608. The differential pressure chamber 622 is exposed to a pressure below atmospheric pressure. The outer surface of the first wafer test module 28A remains exposed to atmospheric pressure. Because a pressure difference is generated between the differential pressure chamber 622 and the outer surface of the first wafer test module 28A, the spring within the contact plate 502 is compressed, as shown in the reference... Figure 8BThe lip seal 77 is made of an elastomeric material that allows the lip seal to compress against its spring force. Because the lip seal 77 compresses against its spring force, an improved seal is created between the lip seal 77 and the signal distribution plate 500, thereby maintaining the pressure within the differential pressure chamber 622. The pressure-reducing check valve 600 is then closed, thereby isolating the pressure-reducing passage 608 from external atmospheric pressure. The pump can then be disconnected from the pressure-reducing check valve 600.

[0126] The first wafer test module 28A, which contains the wafer, can now be moved within the manufacturing environment without being connected to a pump or tester. If the wafer subsequently needs to be removed, it can be... Figure 11 and 12 The vacuum release check valve 602, as shown, applies positive pressure. The vacuum release check valve 602 is spring-loaded and requires a predetermined amount of pressure to open. Air can then flow through the vacuum release passage in the backplate 74 to the differential pressure chamber 622, bringing it to atmospheric pressure. The first and second components 628 and 630 can then be separated from each other, and the wafer can be removed. The vacuum release check valve 602 subsequently closes when a new wafer is loaded into the first wafer test module 28A, and when it is necessary to reduce the pressure within the differential pressure chamber 622 using the pressure reducing check valve 600.

[0127] Figure 15 yes Figure 12 The first latch assembly 604A includes a first part 640, a second part 642, a connecting part 644, an engagement mechanism 646, a tuning block 648, a locking nut 650, a spacer 652A, a washer 652B, and a snap-fit ​​mechanism 654.

[0128] The first part 640 and the connecting part 644 are machined as a single piece and thus fixed to each other. The first part 640 has a length 660 and a width 662. In the cross-section, only half of the width 662 is shown. The length 660 is greater than the width 662. The length 660 is also greater than the diameter of the connecting part 644. The first part 640 has a tool probe hole 664 formed therein.

[0129] The second part 642 has a main body 666 and first and second flaps 668A and 668B extending from the main body 666. The second part 642 has a length 670 and a width 672 including the flaps 668A and 668B. Only half of the width 672 is shown in cross-section. Because the first and second flaps 668A and 668B form part of the length 670 but not part of the width 672, the length 670 is much larger than the width 672. The main body 666 also has an opening 674 into which a connecting portion 644 can be inserted.

[0130] The connecting portion 644 includes a first portion 678 and a second portion 680. The second portion 680 has external threads formed thereon.

[0131] The engagement mechanism 646 is formed by opposing surfaces that define the width 662 of the first part 640. The opposing surfaces forming the engagement mechanism 646 are parallel to each other to facilitate engagement of the parallel surfaces on the jaws of a tool capable of subsequently rotating the first part 640.

[0132] Tuning block 648 is mounted in a fixed position to spacer 652A. Wafer chuck 72 includes a metal portion 682 and a protective sheet 684. The protective sheet 684 forms a shoulder 686 on wafer chuck 72. Spacer 652B is located between spacer 652A and signal distribution board 500. Only a single spacer 652B is shown. Additional spacers are typically inserted one on top of the other until the leveling surface 690 of tuning block 648 is at the same vertical height as shoulder 686.

[0133] The latching mechanism 654 includes a retaining body 694, a spherical ball 696, and a spring 698. The body 666 of the second part 642 forms part of the latching mechanism 654 because the body 666 has a first latching recess 700A formed therein.

[0134] The retainer body 694 has an outer surface with threads 702. The retainer body 694 also has an end with a slot 704 formed therein, capable of receiving a tool such as a screwdriver. A spring 698 is located within the retainer body 694. A spherical ball 696 is positioned within an opening in the retainer body 694. The opening of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a snap-fit ​​surface 706. The threads 702 engage with complementary threads within a tuning block 648. A tool such as a screwdriver is inserted into the slot 704, and then the tool is rotated to adjust the distance between the snap-fit ​​surface 706 and the tuning block 648.

[0135] Intermediate protective member 708 is inserted into a complementary groove on the upper surface of backplate 74. Openings 710, 712, and 714 are formed in intermediate protective member 708, backplate 74, and signal distribution plate 500, respectively. Second portion 680 of connector 644 is inserted from above through openings 710, 712, and 714. The length 660 of first portion 640 is greater than the length of any one of openings 710, 712, and 714 in the same direction, preventing first portion 640 from entering openings 710, 712, and 714. The lower surface of first portion 640 rests against the upper surface formed within intermediate protective member 708. Then, first portion 678 of connector 644 is located within openings 710, 712, and 714, and second portion 680 of connector 644 is located below openings 710, 712, and 714. Spring-loaded washer 720, gasket 652B, and spacer 652A are then positioned from below on connector 644. Then, the second part 642 is positioned on the connecting part 644 from below. The opening 674 forms a sliding fit with the outer diameter of the thread on the second part 680 of the connecting part 644.

[0136] As the second part 642 slides upward on the connecting part 644, the first snap-fit ​​recess 700A also contacts the snap-fit ​​surface 706. The spherical ball 696 moves slightly from right to left against the spring force of the spring 698. Then, the locking nut 650 engages with the protruding end of the second part 680. Rotation of the locking nut 650 causes the body 666 of the second part 642 to tighten against the spring force of the washer 720. A gap gauge or other instrument can be used to determine the gap between the second flap 668B and the leveling surface 690. The locking nut 650 can be rotated until an acceptable gap is formed between the second flap 668B and the leveling surface 690. This gap is generally the same as the desired gap between the first flap 668A and the shoulder 686.

[0137] As the locking nut 650 rotates, the first snap-fit ​​recess 700A also moves upward. The first snap-fit ​​recess 700A is an elongated slot. As the second part 642 continues to move upward with the continued rotation of the locking nut 650, the snap-fit ​​surface 706 and the first snap-fit ​​recess 700A can thus slide on top of each other.

[0138] As shown in the figure, when the first latching assembly 604A is assembled, the wafer chuck 72 is in the proper position. Additionally, a negative pressure exists in the differential pressure chamber 622. By compressing the first wafer test module 28A, it is possible to measure whether the first and second flaps 668A and 668B are equidistant from the shoulder 686 and the leveling surface 690. As long as the leveling surface 690 has been set at the correct height using one or more shims such as shim 652B, the first latching assembly 604A can also be assembled without the wafer chuck 72 by simply measuring the gap between the second flap 668B and the leveling surface 690.

[0139] Figure 16 It is along Figure 15 The view is in direction A, but only the connector 644 and the signal distribution board 500 are shown.

[0140] The opening 712 has a first dimension 724 on the axis 726 toward the center point of the signal distribution board 500, which is larger than a second dimension 728 transverse to the axis 726. The first portion 678 of the connection 644 is smaller than the first dimension 724 in the direction of the axis 726 to allow the signal distribution board 500 and the backplate 74 (see...) Figure 15 The first part 678 is sized to slidably fit within the second part 728 to prevent the signal distribution board 500 from moving relative to the back plate 74 in a direction transverse to the axis 726.

[0141] The second portion 680 of the connecting portion 644 has a first thickness 730 and a second thickness 732. The first thickness 730 can fit through the opening 712 in the direction of the axis 726, and the first thickness 730 is larger than the second dimension 728 of the opening 712. The second thickness 732 is transverse to the first thickness 730 and can fit through the second dimension 728 of the opening 712. Because the second dimension 728 is relatively large, it allows threads to be formed thereon and it remains relatively robust. The entire second portion 680 is located below the opening 712, which allows the connecting portion 644 to rotate about its longitudinal axis without the second portion 680 getting stuck in the relatively narrow opening 712. The first portion 678 has a circular cross-section with a diameter not greater than the second dimension 728, which allows the first portion 678 to rotate freely within the relatively narrow second dimension 728 of the opening 712.

[0142] An additional opening 734 is formed in the signal distribution plate 500 for further securing of the gasket. The opening 734 is similarly proportional to the opening 712, having a longer dimension along axis 736 toward the center point of the signal distribution plate 500. When used in a manufacturing environment, the anchor passing through the opening 734 need not rotate, and the size of the opening 734 is solely for allowing thermal expansion of the signal distribution plate 500 relative to the backplate 74.

[0143] Figure 17 for Figure 15 Cross-sectional view of section 17-17, with retainer 740 inserted through. Figure 16 The opening 734 is used to secure the spacer 652A and the gasket 652B to the back plate 74. The retainer 740 includes a bolt and a nut, wherein the head of the bolt is on one side and the nut is on the opposite side.

[0144] The main body 666 has a circular outer surface 742 in which first, second, third, and fourth snap-fit ​​recesses 700A to 700D are formed. The snap-fit ​​surface 706 of the spherical sphere 696 is located within the first snap-fit ​​recess 700A, which prevents the main body 666 from rotating. An opening 674 within the main body 666 is keyed to receive the shape of the second portion 680, such that if the main body 666 remains stationary, the second portion 680 cannot rotate.

[0145] A small amount of torque is required to rotate the main body 666 and dislodge the spherical ball 696 from the first snap-fit ​​recess 700A. If the main body 666 rotates clockwise, the snap-fit ​​surface 706 rests on the circular outer surface 742 between the first snap-fit ​​recess 700A and the second snap-fit ​​recess 700B. As the main body 666 rotates, the second part 680 rotates with the main body 666 by the same angle. When the main body 666 has rotated approximately 90 degrees, the snap-fit ​​surface 706 snaps into the second snap-fit ​​recess 700B. The second snap-fit ​​recess 700B then prevents the rotation of the main body 666 and the second part 680. The first to fourth snap-fit ​​recesses 700A to 700D gently lock the main body 666 at four different rotation angles, including 0 degrees, 90 degrees, 180 degrees, and 270 degrees.

[0146] Figure 18A(i) and 18A(ii) It is along Figure 15 The view is in the direction of arrows A and B, but the locking mechanism is rotated to the unlocked position. The operator can compare the orientation of the first part 640 with the reference 750 on the upper surface of the wafer chuck 72. In Figure 18A(ii), the first latch assembly 604A is shown unlocked. The shoulder 686 is not obstructed from below by either the first flap 668A or the second flap 668B. Flaps 668A and 668B are... Figure 15 and 17 The latching mechanism 654 shown is held in the position indicated in Figure 18A(i). The pressure within the first wafer test module 28A can be reduced, and the wafer chuck 72 can be removed to insert or replace a wafer. After the wafer is replaced, the pressure within the first wafer test module 28A is reduced again to hold the first wafer test module 28A together.

[0147] When the first wafer test module 28A is fully assembled, further fault protection may be required to maintain electrical contact with the wafer even if the negative pressure within the first wafer test module 28A cannot be maintained due to a system failure. An operator can use a tool (not shown) with jaws and a probe. The probe is inserted into the tool probe hole 664. The tool probe hole 664 is tapered, such that the deeper the probe is inserted into the tool probe hole 664, the more aligned the tool becomes with the first part 640. The operator then engages the opposing parallel surfaces of the tool jaws with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool, and the tool rotates the first part 640. The connecting part 644 and the second part 642, along with their first and second flaps 668A and 668B, rotate together with the first part 640. (See reference...) Figure 17 The snap-fit ​​surface 706 disengages from the fourth snap-fit ​​recess 700D and slides on the circular outer surface 742. Then, the snap-fit ​​surface 706 snaps into the first snap-fit ​​recess 700A.

[0148] Figure 18B(i) and 18B(ii) The first latch assembly is shown after the first part 640 and the second part 642 have been rotated 90 degrees. The operator can see that the orientation of the first part 640 matches the locking position indicated by reference numeral 750. The first flap 668A is now positioned above the shoulder 686, preventing movement of the wafer chuck 72 in the vertically downward direction away from the rest of the wafer test module 28A. The second flap 668B is positioned on the tuning block 648. The first flap 668A can be disengaged from the shoulder 686 by rotating the first part 640 clockwise or counterclockwise by 90 degrees. Either flap 668A or 668B can be used to lock the wafer chuck 72 into place.

[0149] Figure 19 This diagram illustrates how one or more shims 652B to 652F are used to adjust the height of the leveling surface 690 of the tuning block 648. Ideally, the tuning block 648 should be positioned at the same height as the shoulder 686. Since the tuning block 648 is mounted to the spacer 652A, the tuning block 648 moves up and down together with the spacer 652A as more shims 652B to 652F are inserted. If the leveling surface 690 is below the shoulder 686, more shims can be inserted to raise the leveling surface 690, or if the leveling surface 690 is above the height of the shoulder 686, the shims can be removed.

[0150] The engagement mechanism 646 is conveniently located directly on the first part 640. In another arrangement, the engagement mechanism may be formed directly on the second part 642 or directly on the connecting part 644.

[0151] In another embodiment, the engagement mechanism may be a mechanism separate from the first part 640, the second part 642, and the connecting part 644. For example, the worm gear may be formed on the connecting part 644, and the engagement mechanism may be a separate rotatable mechanism that rotates the worm gear.

[0152] The engagement mechanism can also be located between the first part 640 and the connecting part 644. For example, the first flap 668A can be pivoted downward away from the shoulder 686 and backward toward the shoulder 686 using a cam system located between the first part 640 and the connecting part 644. This cam system as the engagement mechanism can alternatively be located between the connecting part 644 and the second part 642. Alternatively, the connecting part 644 can be made into two parts, and the engagement mechanism can connect these two parts and adjust the distance between them, and the distance adjustment can pivot the flap.

[0153] The first latch assembly 604A primarily uses an incompressible and non-flexible material. In alternative embodiments, a strip or other flexible material may be used for the same or similar purposes.

[0154] Instead of having a coupling mechanism 646 on the outer surface of the first part 640, the coupling mechanism may alternatively be on the inner surface of any part.

[0155] Refer again Figure 12 The first, second, third, and fourth latching assemblies 604A to 604D are identical except for their respective positions and orientations. The first and third latching assemblies 604A and 604C are located on opposite sides of the wafer chuck 72, and the second and fourth latching assemblies 604B and 604D are located on opposite sides of the wafer chuck 72. Because the latching assemblies 604A to 604D are located on more than one side of the wafer chuck 72—that is, they cover more than 180 degrees around the circumference of the wafer chuck 72—they can collectively hold all sides of the wafer chuck 72 in place around its entire circumference.

[0156] The latching system provided by the first, second, third, and fourth latching assemblies 604A to 604D facilitates easier movement of the first wafer test module 28A within the manufacturing environment without human supervision. Without the latching system, human supervision is required to determine when the negative pressure within the first wafer test module 28A fails and when the wafer 28A separates. The latching system provides structural fault protection to prevent the first wafer test module 28A from separating, even if it draws in air from the outside.

[0157] Figure 20 , 21 22A and 22B show other components of the pressure monitoring system, including pressure sensing channel 760. Figure 21 ), pressure sensor 762 ( Figure 22A and 22B), reference Figure 11 The electronic pressure sensor interface 606 ( Figure 20 , 21 768 (22A and 22B), electronic pressure connector interface 764, mounting bracket 766, and ribbon cable 768 having first and second connectors 770 and 772 at their opposite ends. Figure 20 , 22A and 22B), connector block 774 and reinforcing plate 776 ( Figure 20 ).

[0158] Pressure sensing channel 760 is similar to a reference Figure 13 The pressure relief channel 608 is formed in the back plate 74. The pressure sensing channel 760 has Figure 14 The first end is located within the differential pressure chamber 622 shown. The pressure sensing channel 760 has a second end opposite to the first end near the outer edge of the back plate 74.

[0159] The electronic pressure sensor interface 606 is in the form of a printed circuit board, which has a substrate 780 and multiple contacts, including first, second and third contacts 782A, 782B and 782C formed on the substrate 780.

[0160] Pressure sensor 762 is mounted to substrate 780 on the side opposite to the first, second, and third contacts 782A, 782B, and 782C. Pressure sensor 762 is electrically connected to the first, second, and third contacts 782A, 782B, and 782C via substrate 780. Pressure sensor 762 is capable of sensing the pressure of a gas (in this case, air) and converting the pressure into an electrical signal, wherein the magnitude of the pressure is indicated by the magnitude of the signal or another variable. Pressure can be conveniently detected using a diaphragm that displaces a known distance as pressure increases or decreases. Other pressure sensors are also within the scope of this invention, such as pressure sensors using piezoelectric crystals or pressure sensors using stress meters. In the case of moving the diaphragm, for example by moving an induction coil, the movement can be converted into a voltage, and the magnitude of the voltage then indicates the displacement and thus the pressure. The pressure sensor can be, for example, the MLX90809 sold by Melexis (www.melexis.com). The electronic pressure sensor interface 606 is mounted to backplate 74 using fastener 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing channel 760. The pressure sensor 762 can therefore sense the pressure within the differential pressure chamber 622.

[0161] The electronic pressure connector interface 764 has a plate 790 and multiple terminals, including first terminals 792A to sixth terminals 792F fixed to the plate 790. The plate 790 is mounted to a mounting bracket 766 by fasteners 794. A reinforcing plate 776 is fixed between two push rod blades 308. The mounting bracket 766 is fixed to the reinforcing plate 776 by fasteners 796. The slot assembly body 32, together with the push rod blades 308 and the reinforcing plate 776, forms part of a fixed structure, and the electronic pressure connector interface 764 is thus mounted to the fixed structure.

[0162] Connector block 774 is mounted to slot assembly body 32. Connectors 770 and 772 are connected to electronic pressure connector interface 764 and connector block 774, respectively. First to sixth terminals 792A to 792F are connected to the pressure sensing plate of the electronic tester via first connector 770, ribbon cable 768 and second connector 772.

[0163] Figure 23A and 23B The diagram illustrates the engagement of the electronic pressure sensor interface 606 with the electronic pressure connector interface 764 when the first wafer test module 28A is inserted into the slot assembly. First, second, and third contacts 782A, 782B, and 782C initially contact the first, second, and third terminals 792A, 792B, and 792C, respectively. Further movement of the electronic pressure sensor interface 606 causes the first, second, and third contacts 782A, 782B, and 782C to engage with the fourth, fifth, and sixth terminals 792D, 792E, and 792F, respectively. The first contact 782A thus contacts both the first terminal 792A and the fourth terminal 792D. Similarly, each of contacts 782B and 782C contacts two of terminals 792B, 792C, 792E, and 792F.

[0164] Terminals 792A to 792F can be elastically pressed relative to plate 790 to ensure proper contact with contacts 782A to 782C. The ribbon cable 768 allows for slight movement of the reinforcing plate 776 relative to the slot assembly body 32 when the first wafer test module 28A is inserted.

[0165] While the wafer is being tested, the pressure within the differential pressure chamber 622 can be monitored throughout the process. If the wafer test fails, the tester can be programmed to determine whether the test failure might be a result of negative pressure within the differential pressure chamber 622.

[0166] Figure 24 Further components of the test apparatus 10 and slot assemblies 18A and 18B are shown. Figure 24Additional components found in the manufacturing environment are also shown, including a nitrogen tank 802, a dielectric gas tank 804, and a vacuum pump 806. The nitrogen tank 802 and vacuum pump 806 may be backup equipment for nitrogen lines and vacuum lines that can be found in the manufacturing environment.

[0167] The test apparatus 10 includes a first nitrogen pressure regulator 810 and three manifolds 812, 814, and 816. The slot assembly 18A has three connectors 820A, 822A, and 824A. Similarly, the slot assembly 18B has three connectors 820B, 822B, and 824B.

[0168] In use, when slot assembly 18A is inserted into test apparatus 10, connectors 820A, 822A, and 824A are connected to manifolds 812, 814, and 816. When slot assembly 18B is inserted into test apparatus 10, connectors 820B, 822B, and 824B simultaneously engage with manifolds 812, 814, and 816. Connectors 820A and 820B connect slot assemblies 18A and 18B to nitrogen pressure regulator 810 via manifold 814. First nitrogen pressure regulator 810 is connected to nitrogen tank 802 via nitrogen supply inlet. Connectors 822A and 822B connect slot assemblies 18A and 18B via manifold 814 and the dielectric gas supply inlet of dielectric gas tank 804. Connectors 824A and 824B connect slot assemblies 18A and 18B to vacuum pump 806 via manifold 816, which provides vacuum to manifold 816.

[0169] Slot assemblies 18A and 18B are similar. For the purposes of discussion, only the other parts of slot assembly 18A will be discussed, but it should be understood that slot assembly 18B has similar parts.

[0170] The slot assembly 18A also includes a second nitrogen pressure regulator 830, a dielectric gas pressure regulator 834, an inlet port 838, an outlet port 840, a vacuum regulator 844, and a heating control plate 848. The second nitrogen pressure regulator 830 and the dielectric gas pressure regulator 834 are connected to connectors 820A and 822A, respectively. The inlet port 838 is connected to the second nitrogen pressure regulator 830 and the dielectric gas pressure regulator 834.

[0171] The first wafer testing module 28A has a gas supply valve 850 connected to an inlet port 838. The gas supply valve 850 is similar to the vacuum release check valve 602, except that it operates at different pressures. The gas supply passage 852 has an inlet connected to the gas supply valve 850 and... Figure 14 The outlet of the differential pressure chamber 622 shown.

[0172] The outlet port 840 is connected to the pressure reducing check valve 600. The outlet port 840 is connected to the connector 824A via the vacuum regulator 844.

[0173] The heating control board 848 is connected to the voltage pressure sensor interface 606, and also to the second nitrogen pressure regulator 830, the dielectric gas pressure regulator 834, and the vacuum regulator 844. The heating control board 848 controls the second nitrogen pressure regulator 830, the dielectric gas pressure regulator 834, and the vacuum regulator 844 based on inputs from the voltage pressure sensor interface 606.

[0174] In operation, the heating control panel 848 opens the vacuum regulator 844. Then, the vacuum generated by the vacuum pump 806 is connected to and opens the pressure-reducing check valve 600. The heating control panel 848 keeps the dielectric gas pressure regulator 834 closed. The heating control panel 848 opens the second nitrogen pressure regulator 830. Nitrogen then flows from the nitrogen tank 802 through the nitrogen supply inlet, nitrogen pressure regulator 810, manifold 812, connector 820A, second nitrogen pressure regulator 830, inlet orifice 838, gas supply valve 850, and gas supply passage 852 into the differential pressure chamber 622. The differential pressure chamber 622 is then filled with nitrogen, and all air in the differential pressure chamber 622 is discharged through the pressure-reducing check valve 600, outlet orifice 840, vacuum regulator 844, connector 824A, and vacuum pump 806. See also... Figure 8B Then, nitrogen gas is used to fill the space between the front contacts 562 of the contact plate.

[0175] Refer again Figure 8B The heating control panel 848 then closes the second nitrogen pressure regulator 830 and opens the dielectric gas pressure regulator 834. The dielectric gas then flows from the dielectric gas tank 804 through the dielectric gas supply inlet, manifold 814, connector 822A, dielectric gas pressure regulator 834, inlet orifice 838, gas supply valve 850, gas supply channel 852, differential pressure chamber 622, pressure reducing check valve 600, outlet orifice 840, vacuum regulator 844, connector 824A, and vacuum pump 806. Arrow 858 indicates the flow direction of the dielectric gas through the differential pressure chamber 622. The flow rate of the dielectric gas is controlled by the dimensions of the inlet orifice 838 and outlet orifice 840.

[0176] once Figure 8B The space between the contacts 562 at the front end of the contact plate is filled with dielectric gas. The heating control board 848 partially shuts off the dielectric gas pressure regulator 834 and the vacuum regulator 844 to reduce the flow rate of the dielectric gas. The flow rate of the dielectric gas is low, and only compensation is needed for leakage of the dielectric gas from the differential pressure chamber 622. Throughout the process of introducing nitrogen and dielectric gas into the differential pressure chamber 622, the heating control board 848 controls the vacuum regulator 844 in a certain way to maintain compression.Figure 8A The negative pressure is created by the helical spring 544 in the middle.

[0177] When compared to air, dielectric gases are chosen to reduce [the following] Figure 8B The arc between contacts 562 at the front end of the contact plate. The gas that can be used as the dielectric can be, for example, a gas sold by 3M. 4710 is an insulating gas, or commercially available octafluorocyclobutane. Both gases have a higher dielectric constant and dielectric strength than air, thus reducing arcing compared to air. When testing... Figure 25 When the first wafer 32A is in the test chamber, additional power can be provided through the contact point 562 at the front end of the contact plate. After testing is completed, the dielectric gas is replaced with nitrogen following the reverse process described above, which allows the first wafer test module 28A to be removed from the slot assembly 18A. Throughout the process, excess nitrogen and excess dielectric gas are removed from the first wafer test module 28A through the exit orifice 840, vacuum regulator 844, connector 824A, and vacuum pump 806. One manufacturing apparatus may have a scrubber that separates the gas after it leaves the vacuum pump 806. Another manufacturing apparatus may have a cryogenic pump that separates the gas after it leaves the test apparatus 10 and before it enters the vacuum pump 806.

[0178] As described above, each slot assembly 18A, 18B, etc., has its own heating control board 848 and other similar components. The heating control board 848 independently controls the introduction of nitrogen and dielectric gas into the contacts of the corresponding first wafer test module 28A, second wafer test module 28B, etc.

[0179] Figure 26 This is a top view of the slot assembly 18A while the first wafer test module 28A is in place. Figure 25 yes Figure 27 Sectional views of 26A-26B. Figure 25 yes Figure 28 Sectional views of 27A-27B.

[0180] Figure 26 and 29 They are Figure 28 and 27 Detailed views of the areas marked "C" and "D". Figure 28 The diagram shows a horizontal conveyor 304, a pusher blade 308, and a back plate 74, wherein a pressure-reducing channel 608 is formed within the back plate 74. Figure 1 A degassing duct 828 is also shown, which is fixed to the horizontal conveying device 304. The degassing duct 828 has a fixed degassing interface 832. The back plate 74 has a movable degassing interface 836.

[0181] In use, the fixed structure degassing interface 832 and the movable structure degassing interface 836 are separated from each other. (See reference...) Figure 24 The wafer chuck 72 moves downward to contact the heated chuck 34. The fixed structure degassing interface 832 moves downward and engages with the movable structure degassing interface 836. A seal seals the fixed structure degassing interface 832 and the movable structure degassing interface 836. Then, the pressure relief channel 608 extends from the back plate 74 through the degassing conduit 828. Figure 29 and 28 The vacuum shown can be applied to the degassing channel 608 through the degassing pipe 828.

[0182] Figure 1 A horizontal conveyor 304, push rod blades 308, and a backplate 74 are shown. A gas supply channel 852 is formed within the backplate 74. A gas supply conduit 826 is installed to the horizontal conveyor 304. The gas supply conduit 826 has a fixed gas supply interface 842. The backplate 74 has a movable gas supply interface 846. The fixed gas supply interface 842 is initially separated from the movable gas supply interface 846. When the wafer chuck 72 moves downwards to... Figure 24 When the hot chuck 34 contacts the gas supply port 846, the movable structural gas supply port 846 moves downward to contact the fixed structural gas supply port 842. A seal seals the movable structural gas supply port 846 to the fixed structural gas supply port 842. The gas supply passage 852 then extends through the horizontal conveyor 304, the gas supply pipe 826, and through the back plate 74. Figure 28 As shown, nitrogen and dielectric pressurized gas are supplied to the area between the contacts via gas supply conduit 826 and backplate 74. After the test is completed, backplate 74 and... Figure 29 The degassing pipe 828 shown and Figure 30 The gas supply pipe 826 shown is disconnected.

[0183] Figure 29 A gas cartridge 860 is shown forming part of the slot assembly 18A. The gas cartridge 860 connects connectors 820A, 822A, and 824A to... Figure 28 The gas supply pipe 826 shown is Figure 31 The degassing pipe 828 is shown.

[0184] like Figure 24 and 32As shown, the gas box 860 includes a base 862, an intermediate substrate 864, a channel block 866, a steering block 868, a mounting plate 870, various regulators including a second nitrogen pressure regulator 830, a dielectric gas pressure regulator 834, and a vacuum regulator 844, as well as various connectors including a vacuum receiver connector 872, a nitrogen receiver connector 874, a dielectric gas receiver connector 876, a vacuum supply connector 880, a gas supply connector 882, a valve control connector 884, a releasable interface 892, and a cover 896.

[0185] Vacuum receiver connector 872, nitrogen receiver connector 874, and dielectric gas receiver connector 876 are secured to the front of base 862. Base 862 has channels (not shown) formed therein extending from connectors 872, 874, and 876 to three releasable interfaces 892. Vacuum supply connector 880 and gas supply connector 882 are secured to one side of base 862. Further channels within base 862 connect connectors 880 and 882 to two or more releasable interfaces 892. Connectors 872, 874, 876, 880, and 882 are substantially in the same plane.

[0186] A deflector block 868 and a channel block 866 are mounted to an intermediate substrate 864. The releasable intermediate substrate 864 has three releasable interfaces (not shown) spaced equidistantly from the releasable interfaces 892 connected to connectors 872, 874, and 876. The channel block 866 has two releasable interfaces (not shown) spaced equidistantly from the releasable interfaces 892 connected to connectors 880 and 882. When the intermediate substrate 864 is mounted on the base 862, the releasable interfaces of the intermediate substrate 864 fit snugly with the releasable interfaces 892 of the base 862. A channel is formed through the intermediate substrate 864, the deflector block 868, and the channel block 866. The deflector block 868 thus connects connectors 872, 874, and 878 to the channel block 866. The deflector block 868 also transforms the gas flow from horizontal parallel in a first direction 890 to vertical parallel in a second direction 894, which is perpendicular to the first direction 890.

[0187] Regulators 830, 834, and 844 are mounted on channel block 866. Regulators 830, 834, and 844 can individually regulate various gases passing through channel block 866. After exiting regulators 830 and 834, channel block 866 merges the channels leading from regulators 830 and 834 before passing through a releasable port 892 in base 862 to gas supply connector 882.

[0188] Mounting plate 870 is fixed to one side of intermediate base plate 864. Valve control connector 884 is fixed to mounting plate 870. Valve control connector 884 is electrically connected to electrical terminals on regulators 830, 834, and 844.

[0189] The cover 896 is shaped to fit onto the channel block 866, the steering block 868, the mounting plate 870, and the intermediate base plate 864. A slot in the side of the cover 896 allows the valve control connector 884 to protrude outwards into the cover 896.

[0190] When in use, gas supply connector 882 and Figure 24 The inlet port 838 is connected, and the vacuum supply connector 880 is connected to... Figure 24 The outlet port 840 shown is connected. Valve control connector 884 is connected to... Figure 30 The heating control board 848 shown is connected. Dielectric gas receiver connector 876, nitrogen receiver connector 874, and vacuum receiver connector 872 are also connected to connectors 822A, 820A, and 824A, respectively.

[0191] Signals are provided via valve control connector 884 to regulators 830, 834, and 844 to control the gas flow and vacuum to gas supply connector 882 and vacuum supply connector 880. For example, if nitrogen is introduced, vacuum regulator 844 is opened to introduce vacuum to vacuum supply connector 880 via vacuum receiver connector 872, and dielectric gas pressure regulator 830 is opened to connect dielectric gas receiver connector 876 to gas supply connector 882.

[0192] Gas box 860 provides a maintainable form factor for regulators 830, 834, and 844. Intermediate base plate 864 can be released from base 862, thus base 862 can remain mounted to... Figure 33 The remainder of the slot assembly 18A, along with regulators 830, 834, and 844 or valve control connector 884, are serviced. The releasable interface 892 allows for a vertical connection between the intermediate substrate 864 and the base 862, where all gas and vacuum lines are connected simultaneously in a single, simple operation. Therefore, it is not necessary to disconnect the lines from connectors 872 to 882.

[0193] Figure 8AOther aspects of the test apparatus are shown. Certain components have been described with reference to the preceding figures. For example, components of slot assembly 18A include a thermal chuck 34, a hot fluid channel 224, a connection plate 66, and a first slot assembly interface 40. Components of the first wafer test module 28A, already described, include a signal distribution board 500, a reinforcing plate 776, a contact plate 502, wafer contact probes 504, contact plate front contacts 562, a wafer test module interface 78, and a wafer chuck 72. As previously mentioned, the contact plate front contacts 562 are located on the tips of the wafer contact probes 504. Some contact plate front contacts 562 are power contact plate front contacts, which provide power to terminals 588 of wafer 32A (see...). Figure 28 and 8B The terminals selected in the test are as follows: During the test, the front contacts of the power contact plate supply power to wafer 32A. During the test, some of the other front contacts 562 of the contact plate supply signals to and receive signals from wafer 32A.

[0194] Other components of the testing setup include tray 900, ground return probe 902, wafer chuck probe 908, and vacuum tube 910.

[0195] The tray 900 includes a substrate 912 of dielectric material and a conductive layer 914 formed on the substrate 912. The conductive layer 914 has a conductive portion 916 and a return terminal region 918. The conductive portion 916 and the return terminal region 918 have exposed upper surfaces 920. The wafer 32A has terminals forming part of a circuit in the wafer 32A and is located on the underside of the wafer 32A. The terminals located on the underside of the wafer 32A contact the exposed upper surface 920 of the conductive portion 916. The conductive layer 914 can then be used to provide a reference voltage, such as a ground voltage, to the terminals on the underside of the wafer 32A.

[0196] Ground return probes 902 are mounted on contact plate 502. The lower end of each ground return probe 902 forms a ground return contact 922. The ground return probes 902 extend beyond the edge of wafer 32A, such that the ground return contact 922 contacts the return terminal area 918. The ground return probes 902 form an electrical conductor connecting the conductive layer 914 to the signal distribution board 500. The electrical conductor extends through the signal distribution board 500, the wafer test module interface 78, the first slot assembly interface 40, and the connection plate 66 to the tester electronics described with reference to the previous figures. The tester electronics can then provide a reference voltage, such as ground, to terminals on the underside of wafer 32A.

[0197] Wafer chuck probes 908 are mounted to contact plate 502. Each wafer chuck probe 908 extends below contact plate 502 through wafer 32A and tray 900 and has a lower tip that contacts wafer chuck 72. A ground reference voltage is then provided to wafer chuck 72 via signal distribution plate 500 and wafer chuck probes 908. By grounding wafer chuck 72, wafer chuck 72 is maintained at a known voltage, which allows arcing between various conductive components, such as arcing between terminals on the underside of wafer 32A and wafer chuck 72, to be controlled.

[0198] When testing of wafer 32A is complete, wafer 32A can be removed from tray 900, and tray 900 can remain on wafer chuck 72. Alternatively, after testing is complete, tray 900 carrying wafer 32A is removed from wafer chuck 72, and tray 900 can provide structural rigidity for very thin wafers. In either case, when testing wafer 32A, tray 900 and wafer chuck 72 together form wafer holder 924 for wafer 32A.

[0199] Multiple vacuum openings 926 are formed through the tray 900 and partially through the wafer chuck 72. Vacuum channels 928 in the wafer chuck 72 connect the lower ends of the vacuum openings 926 to each other. Vacuum conduits 910 also define vacuum channels and connect to the vacuum channels 928 in the wafer chuck 72. Vacuum conduits 910 can be, for example, used... Figure 11 The interfaces 832 and 836 shown are connected to the vacuum channel 928.

[0200] In use, a vacuum is supplied to the vacuum opening 926 via vacuum conduit 910 and vacuum channel 928. Because the vacuum opening 926 is top-opening, the lower surface of wafer 32A is exposed to the vacuum. When a vacuum is applied, it holds wafer 32A to tray 900. A vacuum can be applied to hold wafer 32A to tray 900 when the first wafer test module 28A is assembled and before it is inserted into the slot assembly 18A. It can be used... Figure 28 The same pressure relief check valve 600 and vacuum release check valve 602 shown are used to maintain a vacuum while keeping the first wafer test module 28A closed. When the first wafer test module 28A is inserted into the slot assembly 18A, a vacuum can be maintained. Figure 24 The interfaces 832 and 836 and Figure 34 The vacuum pump 806 shown maintains a vacuum.

[0201] Figure 33 yes Figure 33Enlarged view of detail "E". Vacuum opening 926 includes a proximal portion 932, a distal portion 934, and an enlarged portion 936. The proximal portion 932 has a relatively small diameter and extends through the tray 900. The enlarged portion 936 is formed in the upper surface of the wafer chuck 72 and has a much larger diameter than the proximal portion 932. The distal portion 934 is formed from the bottom of the enlarged portion 936 and extends to... Figure 35 In the vacuum opening 926 shown, the diameter of the distal portion 934 is much smaller than the diameter of the enlarged portion 936.

[0202] By varying the diameter of the vacuum opening 926 from the inlet opening 940 to the outlet opening 942, the possibility of arcing between the conductive layer 914 and the wafer chuck 72 can be reduced when they are at different voltages. The large diameter of the enlarged portion 936 creates a greater distance, ensuring that the arc must pass through the space between the conductive layers 914, through the inlet opening 940, through the proximal portion 932, and within the enlarged portion 936 before reaching the conductive metal material of the wafer chuck 72. Furthermore, an electrical insulator 944 is formed around the inlet opening 940 to further separate the metal of the conductive layer 914 from the inlet opening 940.

[0203] The vacuum provided through the vacuum opening 926 is also used to keep the tray 900 against the wafer chuck 72. A chamfer 948 is formed around the upper periphery of the enlarged portion 936 for deburring purposes and to ensure flush contact between the lower surface of the tray 900 and the upper surface of the wafer chuck 72. Figure 14 and 36 This is a right-angled cross-section of the wafer chuck 72 and the tray 900. The attached figure shows the relative positioning of the tray 900 and the groove 950 for the lip seal 77, which will be referenced. ​ To describe in more detail.

[0204] While certain exemplary embodiments have been described and illustrated in the accompanying drawings, it should be understood that these embodiments are merely illustrative and not intended to limit the invention, and that the invention is not limited to the specific constructions and arrangements shown and described, as modifications will be conceived by those skilled in the art.

Claims

1. A testing apparatus, comprising: A movable support structure includes first and second components for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry, wherein the first component is a wafer chuck in the form of a flat piece having a flat surface. Multiple contacts, said contacts being on the second component, said contacts being mated with said terminals to make contact with said terminals; A cavity seal is located between the first component and the second component, and the cavity seal together with the surfaces of the first component and the second component forms a closed cavity; A pressure-reducing channel is formed through one of the components, the pressure-reducing channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; A pressure reducing supply connected to the pressure reducing channel, wherein opening the pressure reducing supply allows gas to leave the enclosed cavity, and closing the pressure reducing supply prevents gas from entering the enclosed cavity; A first electrical interface is located on the movable support structure and connected to the contact point; A movable structure degassing interface, which is located on the movable structure; A fixed structure, wherein the movable support structure can be received to be held by the fixed structure and can be removed from the fixed structure; A second electrical interface is located on the fixed structure. When the movable structure is held by the fixed structure, the second electrical interface is connected to the first electrical interface, and when the movable support structure is removed from the fixed structure, the second electrical interface is disconnected from the first electrical interface. The electronic tester is connected to the terminal through the second electrical interface, the first electrical interface, and the contact. A hot chuck, the hot chuck being in the fixed structure, wherein the flat surface of the wafer chuck is movable toward the flat surface of the hot chuck; A degassing pipe, which forms part of the fixed structure; A fixed structure degassing interface, which forms part of the fixed structure, and a movable structure degassing interface, which is configured to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the hot chuck, so as to connect the outlet opening of the depressurization channel to the degassing pipe of the fixed structure. as well as An electronic tester is connected to the microelectronic circuit to test the microelectronic circuit.

2. The testing apparatus according to claim 1, further comprising: A gas supply channel is formed through one of the components, the gas supply channel having an inlet opening outside the enclosed cavity and an outlet opening inside the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening the gas supply inlet allows gas to enter the enclosed cavity and the space between the contacts.

3. The testing apparatus according to claim 2 further includes: A dielectric gas source, which is connected to the gas supply channel.

4. The testing apparatus according to claim 3, wherein, Compared to air, the dielectric gas reduces the electric arc between the contacts.

5. The testing apparatus according to claim 2, further comprising: A vacuum pump, which is connected to the pressure reducing supply.

6. The testing apparatus according to claim 2, further comprising: An orifice is provided, which is connected to the gas supply channel to control the flow of the dielectric gas through the gas supply channel.

7. The testing apparatus according to claim 2, further comprising: An orifice is provided, which is connected to the pressure-reducing channel to control the flow of the dielectric gas through the pressure-reducing channel.

8. The testing apparatus according to claim 2, further comprising: A vacuum regulator connected to the pressure-reducing channel to control gas flow through the pressure-reducing channel.

9. The testing apparatus according to claim 8, further comprising: A dielectric gas pressure regulator is connected to the gas supply channel to control the flow of dielectric gas into the gas supply channel.

10. The testing apparatus according to claim 9, further comprising: A nitrogen pressure regulator is connected to the gas supply channel to control the flow of nitrogen into the gas supply channel.

11. The testing apparatus according to claim 10, further comprising: A channel block, connected to the dielectric gas pressure regulator and the nitrogen pressure regulator, and connected to the gas supply channel, to selectively supply the nitrogen or the dielectric gas to the gas supply channel.

12. The testing apparatus according to claim 11, further comprising: A gas supply connector for connecting to the gas supply channel to supply the nitrogen or the dielectric gas to the gas supply channel.

13. The testing apparatus according to claim 12, further comprising: A vacuum supply connector for connecting to the decompression channel to provide vacuum from the vacuum regulator to the decompression channel.

14. The testing apparatus according to claim 13, wherein, The vacuum supply connector is connected to the vacuum regulator via the channel block.

15. The testing apparatus according to claim 13, further comprising: A vacuum receiver connector, which is capable of being connected to a vacuum pump to connect the vacuum regulator to the vacuum pump; A nitrogen receiving connector, which can be connected to a nitrogen supply inlet to connect the nitrogen supply inlet to the nitrogen pressure regulator; as well as A dielectric gas receiving connector, which can be connected to a dielectric gas supply inlet to connect the dielectric gas supply inlet to the dielectric gas pressure regulator.

16. The testing apparatus according to claim 15, further comprising: A base, wherein the gas supply connector, vacuum supply connector, vacuum receiver connector, nitrogen receiver connector, and dielectric gas receiver connector are mounted to the base.

17. The testing apparatus according to claim 16, further comprising: An intermediate substrate, wherein the channel block is mounted to the intermediate substrate, wherein the intermediate substrate is detachable from the base in the vertical direction, wherein the base and the intermediate substrate have mating interfaces that releasably connect the gas supply connector, vacuum supply connector, vacuum receiving connector, nitrogen receiving connector and dielectric gas receiving connector to the channel block.

18. The testing apparatus according to claim 17, further comprising: Mounting plate, the mounting plate being fixed to the intermediate substrate; as well as A valve control connector is fixed to the mounting plate, through which electrical signals can be provided to the vacuum regulator, nitrogen regulator, and dielectric gas regulator.

19. The testing apparatus according to claim 15, further comprising: A deflector block connects the vacuum receiver connector, the nitrogen receiver connector, and the dielectric gas receiver connector to the channel block, and changes the airflow from horizontal parallel in a first direction to vertical parallel in a second direction perpendicular to the first direction.

20. The testing apparatus according to claim 10, further comprising: A control circuit that controls the vacuum regulator, the medium gas pressure regulator, and the nitrogen pressure regulator.

21. The testing apparatus according to claim 1, wherein, The first component is a wafer chuck in the form of a flat surface, the flat surface being movable toward the flat surface of a fixed-structure thermal chuck. The testing apparatus further includes: A gas supply conduit, which forms part of the fixed structure; A fixed structure gas supply interface, which forms part of the fixed structure; and A movable structure gas supply interface is located on the movable structure and is configured to cooperate with the fixed structure gas supply interface when the wafer chuck moves toward the hot chuck, so as to connect the inlet opening of the gas supply channel to the gas supply pipe of the fixed structure.

22. The testing apparatus according to claim 1, wherein, Opening the pressure reducing supply allows gas to exit the enclosed cavity, causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

23. The testing apparatus according to claim 1, wherein, The pressure relief channel is formed in the first component.

24. The testing apparatus according to claim 1, further comprising a latching system, the latching system comprising: A first latching assembly, the first latching assembly having: The first part is engaged with the first component; The second part is engaged with the second component; A connecting portion having opposite ends that are respectively fixed to the first portion and the second portion to form a locking device; as well as An engagement mechanism is connected to the locking device and operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship.

25. The testing apparatus according to claim 1, further comprising a pressure monitoring system, the pressure monitoring system comprising: A pressure sensor, configured to detect pressure within the enclosed cavity; as well as A voltage pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electronic tester.

26. A wafer testing module, comprising: A movable support structure includes a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry, wherein the first component is a wafer chuck in the form of a flat piece having a flat surface that is movable toward the flat surface of a thermal chuck of a fixed structure. Multiple contacts, said contacts being on the second component, said contacts being mated with said terminals to make contact with said terminals; A cavity seal is located between the first component and the second component, and the cavity seal together with the surfaces of the first component and the second component forms a closed cavity; A pressure-reducing channel is formed through one of the components, the pressure-reducing channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; A pressure reducing supply connected to the pressure reducing channel, wherein opening the pressure reducing supply allows gas to leave the enclosed cavity, and closing the pressure reducing supply prevents gas from entering the enclosed cavity; A first electrical interface, which is on the movable support structure and connected to the contact, is used to connect to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure. as well as A movable degassing interface is provided, which is configured to cooperate with a fixed degassing interface when the wafer chuck moves toward the hot chuck, so as to connect the outlet opening of the depressurization channel to the degassing pipe of the fixed structure.

27. The wafer testing module according to claim 26, further comprising: A gas supply channel is formed through one of the components, the gas supply channel having an inlet opening outside the enclosed cavity and an outlet opening inside the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening the gas supply inlet allows gas to enter the enclosed cavity and the space between the contacts.

28. The wafer testing module according to claim 27, wherein, The first component is a wafer chuck in the form of a flat surface, the flat surface being movable toward the flat surface of a fixed-structure thermal chuck. The wafer testing module further includes: A movable structural gas supply interface is configured to engage with a fixed structural gas supply interface as the wafer chuck moves toward the hot chuck to connect the inlet opening of the gas supply channel to the gas supply conduit of the fixed structure.

29. The wafer testing module according to claim 26, wherein, Opening the pressure reducing supply allows gas to exit the enclosed cavity, causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

30. The wafer testing module according to claim 26, wherein, The pressure relief channel is formed in the first component.

31. The wafer testing module according to claim 26, further comprising a latching system, the latching system comprising: A first latching assembly, the first latching assembly having: The first part is joined to the first component; The second part is engaged with the second component; A connecting portion having opposite ends that are respectively fixed to the first portion and the second portion to form a locking device; as well as An engagement mechanism is connected to the locking device and operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship.

32. The wafer testing module according to claim 26 further includes a pressure monitoring system, the pressure monitoring system comprising: A pressure sensor, configured to detect pressure within the enclosed cavity; as well as A voltage pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electrical tester.

33. A method for testing a microelectronic circuit held by a substrate, comprising: The substrate is held between a first component and a second component, the second component having contacts of terminals abutting against the substrate, the terminals being connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a flat piece having a flat surface; The cavity seal is positioned between the first component and the second component to form a closed cavity through the surfaces of the first component and the second component and the cavity seal; The movable support structure is received by a fixed structure, wherein a first electrical interface on the movable support structure is connected to a second electrical interface on the fixed structure. The flat surface of the wafer chuck is moved toward the flat surface of the hot chuck of the fixed structure to further mate the degassing interface of the movable structure with the degassing interface of the fixed structure, thereby connecting the outlet opening of the pressure reducing channel to the degassing pipe of the fixed structure. as well as Signals are transmitted between an electronic tester and the microelectronic circuit to test the microelectronic circuit, wherein the signals are transmitted between the electronic tester and the microelectronic circuit via the terminals, contacts, and a first electrical interface and a second electrical interface to test the microelectronic circuit.

34. The method of claim 33, further comprising: Dielectric gas is allowed to enter the enclosed cavity and the space between the contacts.

35. The method according to claim 34, wherein, A pressure-reducing channel is formed through one of the components, the pressure-reducing channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity, the method further comprising: Open the gas supply inlet to allow dielectric gas to enter the enclosed cavity and the space between the contacts through a gas supply channel formed by passing through one of the components.

36. The method according to claim 33, wherein, Compared to air, the dielectric gas reduces the electric arc between the contacts.

37. The method of claim 35, further comprising: The flow of the dielectric gas through the gas supply channel is controlled by allowing the dielectric gas to pass through the orifice.

38. The method of claim 35, further comprising: The flow of the dielectric gas through the decompression channel is controlled by allowing the dielectric gas to pass through the orifice.

39. The method according to claim 35, wherein, The first component and the second component form part of a movable support structure, and the method further includes: The movable support structure is received by a fixed structure, wherein a first electrical interface on the movable support structure is connected to a second electrical interface on the fixed structure, and wherein a signal is transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts, the first electrical interface, and the second electrical interface to test the microelectronic circuit.

40. The method of claim 35, further comprising: A vacuum regulator connected to the pressure-reducing channel is used to control the gas flow through the pressure-reducing channel.

41. The method of claim 35, further comprising: A dielectric gas pressure regulator connected to the gas supply channel is used to control the flow of dielectric gas into the gas supply channel.

42. The method of claim 35, further comprising: A nitrogen pressure regulator is connected to the gas supply channel to control the flow of nitrogen into the gas supply channel.

43. The method of claim 42, further comprising: The vacuum regulator, the medium gas pressure regulator, and the nitrogen pressure regulator are controlled by a control circuit.

44. The method according to claim 39, wherein, The first component is a wafer chuck in the form of a flat component with a flat surface, and the method further includes: The flat surface of the wafer chuck is moved toward the flat surface of the hot chuck of the fixed structure to further mate the movable structure gas supply interface with the fixed structure gas supply interface, thereby connecting the inlet opening of the gas supply channel to the gas supply pipe of the fixed structure.

45. The method according to claim 33, wherein, Opening the pressure-reducing supply to allow gas to exit the enclosed cavity causes the first and second components to move toward each other to ensure proper contact between the contacts and the terminals.

46. ​​The method according to claim 33, wherein, The pressure relief channel is formed in the first component.

47. The method of claim 33, further comprising: An actuating engagement mechanism moves the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the interval relationship. The locking device includes: The first part is engaged with the first component; The second part, which engages with the second component; and A connecting portion having opposite ends that are respectively fixed to the first portion and the second portion.

48. The method of claim 33, further comprising: Detect the pressure in the enclosed cavity; as well as The pressure is communicated with the electronic tester.

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