Electronic identification system

Abstract

The invention belongs to the technical field of display, and particularly relates to an electronic identification system which comprises a power supply accessory which comprises a carrier and an electromagnetic transmitting coil arranged on the carrier; the identification piece comprises a display substrate and a logic control panel, one of the logic control panel and the display substrate is provided with an induction coil, and the logic control panel is connected with the induction coil and the display substrate; wherein the identification piece can move relative to the carrier, and when the identification piece moves until the induction coil is opposite to the electromagnetic transmitting coil, the induction coil can be matched with the electromagnetic transmitting coil to supply power to the logic control panel; and the logic control board is configured to provide a display signal for the display substrate through the electric energy provided by the induction coil when receiving picture information. According to the invention, it is ensured that the identification piece can still stably obtain electric energy and complete picture updating in dynamic use, and the flexibility, economy and environmental protection of the system are integrally improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to an electronic identification system. Background Technology

[0002] With the increasing application of electronic paper display devices in various fields, market demands for their ease of use, durability, and cost control are gradually rising. However, current display devices such as electronic tags on the market cannot be dynamically updated in real time. Summary of the Invention

[0003] The purpose of this application is to solve the problem that electronic price tag display devices cannot be dynamically updated in real time in related technologies.

[0004] This application provides an electronic identification system, comprising: a power supply accessory including a carrier and an electromagnetic transmitting coil disposed on the carrier; and an identification element including a display substrate and a logic control board, wherein one of the logic control board and the display substrate is provided with an induction coil, and the logic control board is connected to the induction coil and the display substrate; wherein the identification element is movable relative to the carrier, and when the identification element moves to a position where the induction coil is opposite to the electromagnetic transmitting coil, the induction coil can cooperate with the electromagnetic transmitting coil to supply power to the logic control board, and the logic control board is configured to provide a display signal to the display substrate through the power supplied by the induction coil when receiving screen information.

[0005] The electronic identification system proposed in this application has at least the following beneficial effects: The proposed solution includes power supply components and identification components. The power supply components include a carrier and an electromagnetic transmitting coil. The identification component is movable relative to the carrier and may include a display substrate, a logic control board, and an induction coil. By using electromagnetic induction combined with power supply to replace traditional battery power, the lifespan limitations, high costs of frequent replacement and maintenance, and environmental pollution problems associated with battery components are effectively avoided. Simultaneously, the battery compartment design is eliminated, allowing the identification component to be ultra-thin and adaptable to more scenarios. Furthermore, the identification component can move freely relative to the carrier, and power supply is triggered only when the induction coil and electromagnetic transmitting coil are in contact. This overcomes the limitations of traditional electronic identification requiring fixed-position power supply and refresh, meeting the needs of dynamic scenarios and enabling dynamic real-time updates of the display screen. Upon receiving screen information, the logic control board can directly use the power provided by the induction coil to transmit display signals to the display substrate, ensuring that the identification component can still stably obtain power and complete screen updates during dynamic use, thus improving the overall system's flexibility, economy, and environmental friendliness.

[0006] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part by practice of this application. It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0007] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0008] Figure 1 A schematic diagram of the connection between the identification element and the power supply accessory provided in some embodiments is shown.

[0009] Figure 2 A schematic diagram of a logic control board with an induction coil provided in some embodiments is shown.

[0010] Figure 3 A schematic diagram of the current generated by the induction coil and the electromagnetic emission coil provided in some embodiments is shown.

[0011] Figure 4 A schematic diagram of a structure in which an induction coil is located in a non-display area is shown in some embodiments.

[0012] Figure 5 A cross-sectional schematic diagram of the bridging wires, bridging induction coils, and connecting traces provided in some embodiments is shown.

[0013] Figure 6 A schematic diagram of the structure of the bridging wiring section and the bridging main body wiring section provided in some embodiments is shown.

[0014] Figure 7 A schematic diagram of a structure in which the induction coil and data line are arranged on the same layer is shown in some embodiments.

[0015] Figure 8 A schematic diagram of the structure of an induction coil using a first coil and a second coil is shown in some embodiments.

[0016] Figure 9 A schematic diagram of the structure of the second coil multiplexing bridging routing section provided in some embodiments is shown.

[0017] Figure 10 A schematic diagram of a structure in which the first coil and the second coil are interleaved is shown in some embodiments.

[0018] Figure 11A schematic cross-sectional structure of an interlaced first coil and a second coil provided in some embodiments is shown.

[0019] Figure 12 A schematic diagram of the structure of an external start-up coil provided in some embodiments is shown.

[0020] Figure 13 A schematic diagram of the structure of the compensation module, the first switch, and the second switch connection provided in some embodiments is shown.

[0021] Figure 14 A schematic diagram of a structure in which the display control line is multiplexed as an induction coil is shown in some embodiments.

[0022] Figure 15 A schematic diagram of the structure connecting the switching unit on the substrate and the display control line is shown in some embodiments.

[0023] Figure 16 It shows Figure 15 A magnified schematic diagram of the startup module at point G.

[0024] Figure 17 It shows Figure 15 An enlarged schematic diagram of the connection between adjacent display control lines in the first zone at point H.

[0025] Figure 18 It shows Figure 15 A magnified structural diagram of the connecting unit at point I.

[0026] Figure 19 A schematic diagram of the induced current flow structure provided in some embodiments is shown.

[0027] Figure 20 It shows Figure 19 A schematic diagram of the current flow structure of adjacent display control lines in the first zone at point J.

[0028] Figure 21 A cross-sectional schematic diagram of a first surface having a driving layer is shown in some embodiments.

[0029] Figure 22 A schematic diagram of a structure in some embodiments is shown, showing that the second surface is provided with an induction coil and a logic control board.

[0030] Figure 23 A cross-sectional schematic diagram of a flexible circuit board connected to a logic control board via a connector is shown in some embodiments.

[0031] Figure 24 A cross-sectional schematic diagram is shown in some embodiments, illustrating the connection between the driver chip and the logic control board via a first conductive adhesive.

[0032] Figure 25A schematic diagram of a structure in some embodiments is shown, showing the second conductive adhesive on the second surface directly connected to the logic control board.

[0033] Figure 26 A schematic diagram of a structure in some embodiments is shown, showing that the second surface of the substrate has an energy storage device.

[0034] Figure 27 A cross-sectional schematic diagram of an embodiment in which the electronic ink layer is disposed above the driving layer is shown.

[0035] Explanation of reference numerals in the attached figures: 10. Electronic identification system; 100. Power supply accessories; 110. Carrier; 120. Electromagnetic transmitting coil; 130. External start-up coil; 200. Identification component; 210. Display substrate; 211. Substrate; 2110. Display area; 2111. Non-display area; 2111a. First area; 2111b. Second area; 2112. First surface; 2113. Second surface; 2114. Connecting hole; 212. Display signal line; 213. Display control line; 214. Driving layer; 2140. Pixel electrode; 2141. Thin film transistor; 21410. Gate; 2 1411, Semiconductor layer; 21412, Source; 21413, Drain; 215, Driver chip; 216, Electronic ink layer; 217, First bridge wire; 218, Connection trace; 219, Connector; 2100, First conductive adhesive; 2101, Second conductive adhesive; 2102, Second connection wire; 2103, Second bridge wire; 220, Induction coil; 221, First coil; 2210, Main body wiring section; 2211, Bridging wiring section; 2212, Conductive via section; 222, Second coil; 230, Logic control board; 241, First switch; 242, ... Two switches; 250, compensation module; 251, compensation coil; 252, first holding capacitor; 253, third switch; 254, first rectifier diode; 260, energy storage device; 270, rectifier circuit module; 280, flexible circuit board; 281, conductive pin; 291, starting module; 2910, starting coil; 2911, second holding capacitor; 2912, third switch group; 29120, sixth transistor; 2913, second rectifier diode; 292, first switch group; 2920, fourth transistor; 293, second switch group; 2930, fifth transistor; 294, switch... Off-line wiring; 295, Fourth switch group; 2950, ​​Seventh transistor; 296, Fifth switch group; 2960, Eighth transistor; 297, Sixth switch group; 2970, Ninth transistor; 298, Connection unit; 2980, First connection line; 2981, Tenth transistor; 2982, Eleventh transistor; 299, Twelfth transistor; 2000, Housing; 2001, Receiving cavity; 2010, Cover plate; A, First node; B, Second node; C, Third node; D, Fourth node; E, Fifth node; F, Sixth node; X, First direction; Y, Second direction. Detailed Implementation

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of example embodiments to those skilled in the art. In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified. In this application, unless otherwise explicitly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral part; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two elements or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0037] See Figure 1 As shown, this application provides an electronic identification system 10, which may include a power supply accessory 100 and an identification element 200. In some embodiments, see... Figure 1 As shown, the power supply accessory 100 may include a carrier 110 and an electromagnetic transmitting coil 120 disposed on the carrier 110. See also: [link to embodiments]. Figure 2 As shown, the identifier 200 may include a display substrate 210, an induction coil 220, and a logic control board 230. The display substrate 210 may be an electronic paper display panel, which can be used to display images. The logic control board 230 connects the induction coil 220 and the display substrate 210. It should be noted that the display substrate 210 may also be a liquid crystal display panel or an organic light-emitting diode display panel, as long as it can achieve image display refresh.

[0038] In some embodiments, the induction coil 220 can be disposed on the logic control board 230, which can reduce the amount of non-display area 2111 occupied by the induction coil 220. This allows for a narrower bezel design for the display substrate 210, achieving a narrow bezel design. In some embodiments, the marker 200 can move relative to the carrier 110. When the marker 200 moves to a position where the induction coil 220 is opposite to the electromagnetic emission coil 120, the induction coil 220 can cooperate with the electromagnetic emission coil 120 to supply power to the logic control board 230. The logic control board 230 is configured to provide a display signal to the display substrate 210 through the power supplied by the induction coil 220 when it receives screen information. That is, the induction coil 220 and the electromagnetic emission coil 120 form an induced current in the induction coil 220 through electromagnetic coupling. The induced current can supply power to the logic control board 230, and under power supply, the logic control board 230 can provide a display signal to the display substrate 210 when it receives screen information.

[0039] This application replaces traditional battery power supply with electromagnetic induction, effectively reducing the lifespan limitations of battery components and the high costs and environmental pollution associated with frequent replacement and maintenance. It also eliminates the need for a battery compartment, allowing the sign 200 to be ultra-thin and adaptable to more scenarios. Furthermore, the sign 200 can move freely relative to the carrier 110, and power is triggered only when the induction coil 220 and electromagnetic emission coil 120 are aligned. This overcomes the limitations of traditional electronic signs requiring fixed-position power supply and refresh, meeting the needs of dynamic scenarios. The logic control board 230, upon receiving screen information, can directly transmit display signals to the display substrate 210 using the power provided by the induction coil 220, ensuring that the sign 200 can stably obtain power and update the screen even during dynamic use. This comprehensively improves the system's flexibility, economy, and environmental friendliness, solving the problem that traditional electronic sign display devices cannot dynamically update price tag content in real time.

[0040] In some embodiments, the carrier 110 can be a display rack. The display rack can include three display layers, each layer having an electromagnetic emission coil 120 laid out entirely, and an identification element 200 movably mounted on the display layer. The identification element 200 can be an electronic tag, which can be used to display product information on the display rack. By laying electromagnetic emission coils 120 out of the entire display layer of the display rack and movably mounting the identification element 200 on this display layer, the induction coil 220 of the identification element 200 can cooperate with the electromagnetic emission coils 120 laid out entirely to provide power when the display layer moves to any position. This meets the need for flexible adjustment of the identification element 200's position without affecting subsequent power acquisition and display signal transmission, solving the problem that traditional electronic tags require fixed-position power supply. It should be noted that the display rack can also include one, two, four, or five display layers; the specific number of display layers can be designed according to different embodiments, which will not be elaborated here.

[0041] In some embodiments, each display layer may be provided with multiple electromagnetic emitting coils 120, which are laid out at least along the moving direction of the sign 200, wherein the spacing between adjacent electromagnetic emitting coils 120 is smaller than the size of the induction coil 220. This ensures that as the sign 200 moves along the moving direction within the display layer, its induction coil 220 always maintains a cooperative state with at least one electromagnetic emitting coil 120, reducing power supply dead zones and ensuring stable power supply when the sign 200 moves. This allows the sign 200 to flexibly adjust its position without affecting the power supply to the subsequent logic control board 230 and the display signal transmission to the display substrate 210, solving the problem of traditional electronic signs requiring fixed-position power supply.

[0042] In some embodiments, the electromagnetic transmitting coil 120 is a honeycomb coil arranged at intervals along the row and column directions on the display layer. The electromagnetic transmitting coil 120 can be formed on the surface of a circuit board by coating a metal layer onto the board and then etching it, and the electromagnetic transmitting coil 120 covers the surface of the display layer.

[0043] In some embodiments, the electronic identification system 10 may further include a position sensor and a controller. The position sensor is configured to acquire the location of the identification element 200, and the controller is configured to control the power supply of the electromagnetic transmitting coil 120 at the location of the identification element 200 based on the position information acquired by the position sensor, so that the induction coil 220 can cooperate with the electromagnetic transmitting coil 120 to supply power to the logic control board 230. Thus, by setting the position sensor to acquire the location of the identification element 200 in real time, and then controlling the power supply of the electromagnetic transmitting coil 120 at the location of the identification element 200 based on the position information by the controller, precise triggering power supply of the electromagnetic transmitting coil 120 can be achieved. This reduces energy waste from unnecessary coil power supply and ensures that the induction coil 220 of the identification element 200 stably cooperates with the corresponding electromagnetic transmitting coil 120 to supply power to the logic control board 230. This ensures that the identification element 200 can still stably acquire power to support the display function during movement, meeting the energy-saving and stability requirements of a battery-free power supply architecture. It should be noted that the electronic identification system 10 may also include a system-on-chip (SoC). The controller can be integrated onto a system-on-a-chip.

[0044] In some embodiments, the position sensor includes a trigger end and a sensing end. The trigger end can be disposed on the tag 200, and the sensing end can correspond one-to-one with the electromagnetic transmitting coil 120. The sensing end is electrically connected to the controller, and the sensing end is configured to transmit an electrical signal to the controller when the trigger end and the sensing end come into contact. The controller supplies power to the electromagnetic transmitting coil 120 at the sensing end according to this electrical signal, so that the sensing coil 220 on the tag 200 generates current. By disposing the trigger end of the position sensor on the tag 200, and having the sensing end correspond one-to-one with the electromagnetic transmitting coil 120 and electrically connected to the controller, so that when the two come into contact, the sensing end transmits an electrical signal to the controller to control the power supply of the corresponding electromagnetic transmitting coil 120, the power supply of the coil at the location of the tag 200 can be accurately triggered to reduce energy waste, and the current generated by the sensing coil 220 on the tag 200 can be stably generated to provide reliable support for the power supply of the logic control board 230, thus meeting the energy-saving and stable power supply requirements of the battery-free electronic tag system 10. The trigger end and the sensing end can adopt, for example, an NFC triggering mechanism to obtain the location of the tag 200.

[0045] In some other embodiments, the carrier 110 can also be work clothes worn by the user, and the work clothes can have a sensing area, within which an electromagnetic emission coil 120 is woven. In some other embodiments, the identification element 200 can be a work badge. When the user wears the work badge, as the user walks, the work badge will move closer to or further away from the sensing area, so that the sensing coil 220 in the identification element 200 periodically approaches the electromagnetic emission coil 120, allowing the sensing coil 220 and the electromagnetic emission coil to periodically cooperate for energy storage. This converts the daily walking amount into the number of times the work badge's energy is refreshed, eliminating the need for a fixed battery or charging method. In some other embodiments, multiple electromagnetic emission coils 120 can be woven into the sensing area, arranged in an array. By setting multiple electromagnetic emission coils 120 in the sensing area, the cooperation area between the sensing coil 220 and the electromagnetic emission coil 120 can be increased.

[0046] In some embodiments, see Figure 2 As shown, the identifier 200 is mounted on the logic control board 230. The identifier 200 contains four induction coils 220 arranged in an array along both the column and row directions. Each row has two induction coils 220, with adjacent rows of induction coils 220 spaced apart. Induction coils 220 in the same row are connected in parallel, meaning they are formed by the same trace, and are spaced apart along the row direction.

[0047] For example, when the sign 200 contacts the electromagnetic emission coil 120 of the display shelf or work uniform, the contact area between the induction coil 220 in the upper row and the electromagnetic emission coil 120 can be larger than the contact area between the induction coil 220 in the lower row and the electromagnetic emission coil 120. In this case, the induced current generated by the upper induction coil 220 is greater than the induced current generated by the lower induction coil 220. This ensures that when the sign 200 moves to any position in the display shelf or work badge sensing area, the induction coil 220 and the electromagnetic emission coil 120 have a mutually cooperating position, and electromagnetic coupling can occur to generate induced current to power the logic control board 230. This effectively reduces power supply dead zones and provides reliable assurance for the sign 200 to stably obtain electromagnetic induction power in dynamic scenarios, support the power supply of the logic control board 230, and transmit display signals to the display substrate 210, meeting the usage requirements of a battery-free power supply architecture. It should be noted that the sign 200 may also have six, eight, or ten induction coils 220 arranged in an array in the row and column directions; no specific limitation is made here.

[0048] In some embodiments, since the marker 200 may be offset from the electromagnetic transmitting coil 120, in order to ensure the generation of induced current, the trigger terminal in the position sensor can feed back the received signal strength to the sensing terminal. The sensing terminal adjusts the driving frequency and transmitting power according to the signal strength to send an electrical signal to the controller, effectively reducing power supply dead zones. In some embodiments, see Figure 3 As shown, the identification element 200 may also include an energy storage element 260. The energy storage element 260 is disposed on the logic control board 230 and electrically connected to the induction coil 220. After the current generated by the cooperation of the induction coil 220 and the electromagnetic emission coil 120 supplies power to the logic control board 230, it then charges the energy storage element 260. By setting the energy storage element 260 electrically connected to the induction coil 220 on the logic control board 230 of the electronic identification system 10, and supplying power to the logic control board 230 first and then charging the energy storage element 260, it can ensure that the logic control board 230 can obtain power in real time to drive the display substrate 210 to update the screen, and it can also store the remaining power generated by the cooperation of the induction coil 220 and the electromagnetic emission coil 120, reducing the ineffective dissipation of energy. This effectively reduces the possibility that the identification element 200 will not work due to lack of power supply when the cooperation between the two is interrupted, and effectively ensures the stable operation of the battery-free power supply architecture, so as to meet the technical requirements of battery-free, low-cost, and continuous power supply. It should be noted that the current generated by the interaction between the induction coil 220 and the electromagnetic transmitting coil 120 can directly charge the energy storage device 260, and then the energy storage device 260 can be used to power the logic control board 230 to refresh the display of the display substrate 210. In some embodiments, the controller is also configured to stop supplying power to the electromagnetic transmitting coil 120 after the display substrate 210 has completed the refresh display. The position sensor continuously detects the position of the marker 200. In this way, energy waste caused by the ineffective power supply of the electromagnetic transmitting coil 120 after the display refresh is completed can be reduced, and continuous detection can ensure that when the marker 200 moves subsequently, the controller can promptly trigger the corresponding electromagnetic transmitting coil 120 to supply power based on the position information, ensuring stable power supply and display function of the marker 200 in dynamic scenarios. In some embodiments, see Figure 3As shown, the identifier 200 may also include a rectifier circuit module 270. The induction coil 220 is electrically connected to the logic control board 230 and the energy storage device 260 via the rectifier circuit module 270 to rectify the alternating current generated by the induction coil 220 into direct current. This direct current is then supplied to the logic control board 230 and the energy storage device 260 to meet the DC power requirements of the logic control board 230 driving the display substrate 210 and the energy storage device 260 storing electrical energy, ensuring stable operation of both to support the display refresh and power retention of the identifier 200. It should be noted that when the display substrate 210 requires high-energy refresh, the logic control board 230 can be powered simultaneously by the induction coil 220 and the energy storage device 260. When high-energy refresh is not required, the logic control board 230 can be powered solely by the current generated by the induction coil 220, reducing ineffective energy dissipation.

[0049] In some embodiments, the logic control board 230 and the system-on-a-chip can acquire screen information via data traffic, Bluetooth, or WiFi. The logic control board 230 provides display signals to the display substrate 210 through the flexible circuit board 280 described below, so that the display substrate 210 refreshes the screen. In some embodiments, the logic control board 230 is provided with an energy management chip. The rectifier module, the boost module, and the energy storage device 260 are integrated on the energy management chip. The energy storage device 260 can support instantaneous high-current discharge and can accurately adapt to the instantaneous high-current demand of the display substrate 210 when refreshing the screen in the electronic identification system 10, effectively reducing display refresh failure or incompleteness due to insufficient current. At the same time, in the case of power interruption or unstable current of the induction coil 220, it can still provide a stable and sufficient instantaneous current to the logic control board 230 to ensure that it reliably drives the display substrate 210 to complete the screen update. It should be noted that the boost module can adopt a charge pump boost scheme, using capacitor charging and discharging to achieve voltage multiplication. In some embodiments, see Figure 2 As shown, the display substrate 210 may include a substrate 211, which may be a glass substrate, but is not limited to it, and may also be a substrate of other materials, such as PI material, etc. In some embodiments, the substrate 211 has a display area 2110 and a non-display area 2111 disposed around the display area 2110. The display area 2110 is provided with display signal lines 212, which can be used to transmit display information to realize screen display. The non-display area 2111 may include display control lines 213. The display control lines 213 may be disposed on the same layer as the display signal lines 212 in the display area 2110 and connected to the display signal lines 212. The display control lines 213 may be configured to transmit the display signals provided by the logic control board 230 to the display signal lines 212 for screen display refresh.

[0050] In this application, "same-layer configuration" refers to a layer structure formed using the same film deposition process to create a film layer for a specific pattern, and then using the same mask to form a single patterning process. That is, one patterning process corresponds to one mask (also called a photomask). Depending on the specific pattern, a single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses. This simplifies the manufacturing process, saves manufacturing costs, and improves production efficiency.

[0051] In some embodiments, see Figure 23 As shown, the display substrate 210 also includes a driving layer 214 disposed on the substrate 211. The driving layer 214 may include pixel electrodes 2140 and a plurality of thin-film transistors 2141. The pixel electrodes 2140 may be transparent electrodes, such as indium tin oxide (ITO) or indium gallium zinc oxide (IGZO). The thin-film transistors 2141 may include a gate 21410, a semiconductor layer 21411, a source 21412, and a drain 21413. A scan signal on the gate 21410 is used to turn on the source 21412 and the drain 21413. The source 21412 or the drain 21413 is connected to the pixel electrode 2140 to release a driving signal to the pixel electrode 2140, thereby driving the color particles in the electronic ink layer 216 described below for display.

[0052] In some embodiments, the display area 2110 may include scan lines and data lines. Scan lines may extend in the row direction, and data lines may extend in the column direction. The scan lines and data lines are on different layers and insulated from each other. Both scan lines and data lines may be made of metal or alloy materials, such as molybdenum, aluminum, and titanium, to ensure good conductivity, but are not limited to these; other materials with good conductivity may also be used. Data signals on the data lines are transmitted to the pixel electrode 2140 via scan line input signals. The pixel electrode 2140 controls the movement of electrophoretic particles in the electrophoretic solution, as described below. The pixel electrode 2140 may be a transparent electrode, for example, made of ITO (indium tin oxide) to improve light transmittance, but is not limited to this; other transparent conductive materials may also be used.

[0053] In some embodiments, see Figure 2As shown, the display substrate 210 may further include a driver chip 215 disposed on the substrate 211. The driver chip 215 can be electrically connected to the logic control board 230 and the display control line 213 disposed in the non-display area 2111. The logic control board 230 transmits screen signals to the driver chip 215. The driver chip 215 provides scanning signals to the display signal line 212 in the display area 2110 through the display control line 213 according to the screen signals, so as to drive the thin film transistor 2141 in the sub-pixel to turn on or off, thereby driving the movement of electrophoretic particles in the display area 2110. It can be understood that the driver chip 215 can be fixed to the pins on the substrate 211 by anisotropic conductive adhesive (ACF) to achieve vertical conductivity and lateral insulation.

[0054] In some embodiments, see Figure 27 As shown, the display substrate 210 may further include an electronic ink layer 216. The electronic ink layer 216 is disposed above the display substrate 210 and is disposed opposite to the display substrate 210. The electronic ink layer 216 may include multiple microcapsule structures (not shown) or multiple microcup structures (not shown), each microcapsule structure / microcup structure corresponding one-to-one with a sub-pixel in the display area 2110. Each microcapsule structure / microcup structure includes black electrophoretic particles and white electrophoretic particles. By adjusting the voltage of the pixel electrode 2140 in the sub-pixel, the movement direction of the black and white electrophoretic particles is controlled, thereby realizing the display image. In some embodiments, see... Figure 2 As shown, the identifier 200 may also include a flexible circuit board 280. The logic control board 230 is connected to the driver chip 215 on the display substrate 210 via the flexible circuit board 280. This flexible circuit board 280 may include a pin array, one end of which is connected to the logic control board 230 and the other end of which is connected to the display substrate 210.

[0055] In some embodiments, see Figure 4 As shown, the substrate 211 has a bonding area at its edge, and the pin array includes multiple conductive pins 281 (Pin) spaced apart from each other. The end of the conductive pin 281 away from the logic control board 230 is connected to the pin on the glass substrate through anisotropic conductive adhesive to electrically connect with the driver chip 215, thereby transmitting screen signals to the driver chip 215 to control the scan signals and data signals on the scan lines and data lines, thereby controlling the movement of electrophoretic particles.

[0056] In some embodiments, see Figure 12As shown, the power supply accessory 100 may further include an external start-up coil 130, which may be disposed on the carrier 110 and may be correspondingly arranged with the electromagnetic transmitting coil 120. For example, an electromagnetic transmitting coil 120 may correspond to an external start-up coil 130, and the electromagnetic transmitting coil 120 and the external start-up coil 130 may be arranged side by side. In some embodiments, see Figure 4 As shown, the induction coil 220 is disposed in the non-display area 2111 of the substrate 211. The induction coil 220 may include a first coil 221, which can electromagnetically induce the electromagnetic emission coil 120 to form an induced current in the first coil 221, and use this induced current to supply power to the logic control board 230. It can be understood that placing the induction coil 220 in the non-display area 2111 can reduce the interference of the induction coil 220 on the signals of the display signal lines 212 in the display area 2110, ensure the normal transmission of the signals of the display signal lines 212, and thus ensure the normal display of the display substrate 210.

[0057] In some embodiments, the logic control board 230 can be disposed on one side of the display substrate 210 and electrically connected to the opposite ends of the induction coil 220. That is, when the first coil 221 and the electromagnetic emission coil 120 generate an induced current through electromagnetic induction, this induced current can serve as a power supply for the logic control board 230, supplying power to the logic control board 230. In this way, supplying power to the logic control board 230 through the induced current generated by the first coil 221, compared to the scheme of designing a battery within the identifier 200, can reduce the internal space occupied by the battery in the identifier 200, thereby thinning the identifier 200 and effectively reducing the manufacturing cost and volume of the identifier 200. Furthermore, by using the first coil 221 in conjunction with the electromagnetic emission coil 120 to supply power to the logic control board 230, compared to the scheme of placing the first coil 221 within the logic control board 230, the design size of the logic control board 230 can be reduced, and the manufacturing cost of the logic control board 230 can be lowered.

[0058] In some embodiments, see Figure 4 As shown, the first coil 221 may be arranged in multiple turns around the display area 2110 to generate a sufficiently large induced current to power the logic control board 230. In some embodiments, see... Figure 4 and Figure 5As shown, the first coil 221 has a start end (not shown in the figure) and a tail end (not shown in the figure). The start end is electrically connected to the logic control board 230. The first coil 221 can be arranged along the outer contour of the display area 2110 and is arranged around the display area 2110 at least two turns (or one, three, four or five turns). That is, the first coil 221 is formed around the display area 2110 in the non-display area 2111. The tail end is located in the inner loop of the first coil 221 and crosses the multiple turns of the first coil 221 through the first bridge wire 217 described below to connect with the logic control board 230 so as to transfer the induced current generated on the first coil 221 to the logic control board 230 and supply power to the logic control board 230.

[0059] In some embodiments, see Figure 6 As shown, the first coil 221 may include multiple main trace portions 2210 and bridging trace portions 2211. The main trace portions 2210 are disposed on the same layer as the display control line 213 and are spaced apart. The bridging trace portions 2211 are disposed on different layers from the main trace portions 2210 and the display control line 213, and overlap in the stacking direction of the substrate 211. The bridging trace portions 2211 can be connected to the main trace portions 2210 located on both sides of the display control line 213 through conductive via portions 2212, so that the first coil 221 is a connecting path, and the induced current generated by the first coil 221 can supply power to the logic control board 230. It is worth mentioning that if there are traces affecting the first coil 221 in the winding direction of the first coil 221, the separated main trace portions 2210 can be bridged by the bridging trace portions 2211, and it is not limited to the display control line 213.

[0060] In some embodiments, the line width of the bridging trace 2211 is greater than the line width of the main trace 2210. By making the line width of the bridging trace 2211 greater than the line width of the main trace 2210, the connection stability of the main traces 2210 at both ends of the display control line 213 can be increased, and the problem of breakage of the bridging trace 2211 at the display control line 213 can be reduced. See also [other embodiments]. Figure 4 As shown, the pin array in the flexible circuit board 280 includes two conductive pins 281. These pins can be located at opposite edges of the flexible circuit board 280. One end of one conductive pin 281 can be connected to the logic control board 230, and the other end can be connected to the beginning of the first coil 221. One end of the other conductive pin 281 is connected to the logic control board 230, and the other end is connected to the aforementioned connection trace 218, so as to guide the induced current in the first coil 221 into the logic control board 230 to supply power to the logic control board 230.

[0061] In some embodiments, see Figure 5 and Figure 6As shown, the display substrate 210 may further include a first bridge wire 217. This first bridge wire 217 may be located on a different layer from the first coil 221. One end of the first bridge wire 217 may be electrically connected to the logic control board 230, and the other end may cross the multiple turns of the first coil 221 surrounding the display area 2110 to connect to the tail end of the inner loop of the first coil 221. This allows the tail end of the first coil 221 to be electrically connected to the logic control board 230, supplying power to the logic control board 230. It should be noted that both the first bridge wire 217 and the first coil 221 can use metal traces, such as molybdenum-based alloys (Mo / Ti) or copper-based alloys (Cu / Mo). An insulating layer may be provided between the first bridge wire 217 and the first coil 221 to reduce interference between them. The first bridge wire 217 can be connected to the tail end of the first coil 221 through a via structure on the insulating layer to introduce the induced current on the first coil 221 into the logic control board 230, supplying power to the logic control board 230. Furthermore, the first bridging wire 217 can be disposed on the same layer as the bridging wiring section 2211, that is, the first bridging wire 217 is manufactured at the same time as the bridging wiring section 2211 is manufactured, thereby reducing the manufacturing cost of the first bridging wire 217 and improving the manufacturing efficiency of the identification component 200.

[0062] In one example, the display signal line 212 can be a scan line. The first coil 221 and the display control line 213 can be arranged in the same layer as the scan line. By arranging the first coil 221 in the same layer as the scan line, the first coil 221 can be closer to the lower surface of the display substrate 210, and the distance between it and the electromagnetic emission coil 120 is shorter. This reduces the interference experienced between the first coil 221 and the electromagnetic emission coil 120, thereby improving the energy transmission efficiency between the electromagnetic emission coil 120 and the first coil 221 and reducing the energy loss between them. Furthermore, by arranging the display control line 213, the first coil 221, and the scan line in the same layer, the display control line 213 and the first coil 221 can be fabricated simultaneously with the scan line, eliminating the need for additional fabrication processes for the first coil 221 and reducing the manufacturing cost of the marker 200.

[0063] Another example, see Figure 7As shown, the display signal line 212 can also be a data line. The display control line 213 and the first coil 221 can also be arranged on the same layer as the data line to reduce the impact on the scan line layer routing and the subsequent driver chip 215 routing. Compared to the scheme where the first coil 221 is arranged on the same layer as the scan line, this reduces the number of bridging traces 2211 and conductive vias 2212, lowering production costs. After the display control line 213, the first coil 221, and the data line are arranged on the same layer, the first coil 221 can bridge broken main traces 2210 using bridging traces 2211 (which is on a different layer than the data line) to cross data lines or other signal lines on the same layer, making the first coil 221 a connected circuit. The first bridging wire 217 and the bridging trace 2211 can be arranged on the same layer as the scan line. The bridging trace 2211 and the first bridging wire 217 can also be arranged on the same layer as the data line. That is, while preparing the scan line or data line, a first bridging line 217 and a bridging trace portion 2211 are formed in the non-display area 2111 to cross the first coil 221, which is arranged with multiple turns around the display area 2110, and the main trace portion 2210 on both sides of the bridging display control line 213. It is connected to the tail end of the first coil 221 through a via structure on the gate insulating layer and to the main trace portion 2210 located on both sides of the display control line 213 through a conductive via portion 2212. It is understood that the via structure on the gate insulating layer and the conductive via portion 2212 can be prepared before preparing the data line.

[0064] In another example, the first bridging line 217 and the bridging trace 2211 can also be disposed on the same layer as the pixel electrode 2140. That is, by disposing of the first bridging line 217 and the bridging trace 2211 on the same layer as the pixel electrode 2140, the first bridging line 217 and the bridging trace 2211 can be fabricated simultaneously with the pixel electrode 2140, which can improve manufacturing efficiency and save manufacturing costs. It should be noted that the first bridging line 217 can also be a separately disposed metal trace, which can be disposed on a different layer from the scan line, data line and pixel electrode 2140. That is, as long as the first bridging line 217 can cross the first coil 221 disposed around the display area 2110 and connect to the tail end located in the inner circle. In addition, the bridging trace 2211 can also be disposed on a different layer from the first bridging line 217, as long as the bridging trace 2211 can connect to the main trace 2210 on both sides of the display control line 213. In other words, the bridging wiring section 2211 can be set on the same layer as the first bridging wiring section 217, or it can be set on a different layer. The specific design can be carried out according to different embodiments.

[0065] In some embodiments, see Figure 6As shown, the non-display area 2111 also includes a connection trace 218 disposed on the same layer as the first coil 221. One end of the connection trace 218 is electrically connected to the logic control board 230, and the other end is connected to the end of the first bridge wire 217 away from the tail end through a via structure (not shown in the figure). Since the connection trace 218 is disposed on the same layer as the first coil 221, the connection trace 218 is closer to the surface of the display substrate 210 than the first bridge wire 217. The number of via layers connecting the connection trace 218 and the logic control board 230 is less, which can simplify the connection method between the first coil 221 and the logic control board 230, reduce the number of vias, and thus reduce the manufacturing cost. In some embodiments, see Figure 2 As shown, the first coil 221 surrounds the display area 2110 and the driver chip 215, which can reduce the bridging area of ​​the display control line 213 emitted by the first coil 221 and the driver chip 215, making the first coil 221 more continuous, reducing the number of bridging traces 2211, and thus reducing manufacturing costs.

[0066] In other embodiments, see Figure 8 or Figure 9 As shown, the induction coil 220 may further include a first coil 221 and a second coil 222 located on different layers. The first end and the second end of the first coil 221 are respectively connected to the logic control board 230, and the first end and the second end of the second coil 222 are respectively connected to the first end and the second end of the first coil 221 through conductive via structures, so that both the second coil 222 and the first coil 221 are connected to the logic control board 230.

[0067] In some other embodiments, the orthographic projection of the first coil 221 on the display substrate 210 coincides with the orthographic projection of the second coil 222 on the display substrate 210. That is, this embodiment uses a dual-layer circuit with shared routing and winding, which reduces impedance while allowing the induction coil 220 to carry a larger induced current, resulting in higher energy transfer efficiency and reduced efficiency loss. It is worth mentioning that, see [link to relevant documentation] Figure 10 and Figure 11 As shown, the orthographic projection of the first coil 221 on the display substrate 210 can also be located between the orthographic projections of the adjacent second coil 222 on the display substrate 210. In this way, by interleaving the first coil 221 and the second coil 222, the shielding effect of the first coil 221 or the second coil 222 located on the bottom side on the second coil 222 or the first coil 221 located above it and the electromagnetic emission coil 120 can be reduced, ensuring that the second coil 222 or the first coil 221 located on the upper side can also generate an induced current with the electromagnetic emission coil 120, thus increasing the induced current generated by the induction coil 220. This is achieved through the interleaving of the first coil 221 and the second coil 222.

[0068] In other embodiments, the bridging trace 2211 can be disposed on the same layer as the second coil 222, so that the second coil 222 can be reused as the bridging trace 2211, saving the design of the aforementioned bridging trace 2211, increasing the current while saving manufacturing costs. It should be noted that the bridging trace 2211 can also be disposed on a different layer from the first coil 221 and the second coil 222, using other metal layers to connect the main traces 2210 on both sides of the display control line 213. It can be understood that if the display control line 213 and the second coil 222 are disposed on the same layer, the first coil 221 can also be reused as the bridging trace 2211 to connect the second coil 222 located on both sides of the display control line 213. That is, when there are traces affecting the first coil 221 or the second coil 222 in the direction of the induction coil 220, the second coil 222 or the first coil 221, which is arranged in a single layer, can be used as a bridging trace 2211 to bridge the broken first coil 221 and second coil 222, and is not limited to the display control line 213. The first coil 221 and the second coil 222 can serve as bridging traces 2211 for each other, ensuring that the first coil 221 and the second coil 222 form a connected circuit, and reducing production costs while ensuring the generation of induced current.

[0069] In other embodiments, the line width of the bridging trace 2211 is greater than the line width of the main trace 2210 to reduce the resistance difference between the second coil 222 at the bridging trace 2211 and the resistance of the double-layered first coil 221 and second coil 222, ensuring uniform resistance across the induction coil 220. For example, the line width of the bridging trace 2211 can be twice the line width of the main trace 2210 to ensure uniform resistance at any point on the induction coil 220 and stable induced current. The first coil 221 can be layered with the scan line, and the second coil 222 can be layered with the data line, allowing the first coil 221 and second coil 222 to be formed in the non-display area 2111 simultaneously with the scan line and data line, thereby reducing the production cost of the induction coil 220.

[0070] In other embodiments, see Figure 12 and Figure 13As shown, the identifier 200 may further include a first switch 241 and a second switch 242. The induction coil 220 includes a first coil 221 and a second coil 222 located on different layers. The first end of the first coil 221 and the logic control board 230 are connected to a first node A, and the second end of the first coil 221 and the logic control board 230 are connected to a second node B. The first end of the second coil 222 is connected to the first node A through the first switch 241, and the second end of the second coil 222 is connected to the second node B through the second switch 242. The first switch 241 and the second switch 242 are configured to turn on or off according to the target power required by the logic control board 230.

[0071] In other embodiments, the first switch 241 and the second switch 242 can be a first transistor and a second transistor, respectively. The first transistor and the second transistor are turned on or off by a signal indicating the target power required by the logic control board 230. That is, the control terminals of the first transistor and the second transistor are connected to the signal indicating the target power required by the logic control board 230. For example, if the target power required by the logic control board 230 is large, the first transistor and the second transistor are turned on under the action of the first driving signal, so that the second coil 222 and the first coil 221 are used simultaneously to generate an induced current with the electromagnetic emission coil 120, and the induced current of the first coil 221 and the second coil 222 is output through the second node B to transmit the induced current in the second node B to the logic control board 230 to supply power to the logic control board 230. By utilizing the first coil 221 and the second coil 222 to generate an induced current simultaneously, the induction coil 220 can generate a larger induced current, so as to ensure that the logic control board 230 can work normally when the identifier 200 requires a large amount of power. If the target power required by the logic control board 230 is small, the first and second transistors can be disconnected under the action of the second drive signal, thereby disconnecting the second coil 222 from the first coil 221. Only the first coil 221 and the electromagnetic transmitting coil 120 are used to generate an induced current. This induced current is transmitted to the logic control board 230 through the second node B to power the logic control board 230. By using only the first coil 221 to generate the induced current, it can be ensured that the logic control board 230 can operate normally under low current conditions.

[0072] In other embodiments, see Figure 13 As shown, a compensation module 250 may also be provided in the non-display area 2111. The compensation module 250 may include a compensation coil 251. The size of the compensation coil 251 is smaller than the size of the induction coil 220, so as to reduce the amount of non-display area 2111 occupied by the compensation coil 251, and ensure that the induction coil 220 has sufficient area for setting.

[0073] In other embodiments, see Figure 12 and Figure 13 As shown, the compensation coil 251 is configured to cooperate with the external start coil 130 to generate a drive signal. The drive signal is transmitted via a drive line to the control terminals of the first transistor and the second transistor. The first transistor is configured to connect the first end of the second coil 222 to the first node A under the drive signal, and the second transistor is configured to connect the second end of the second coil 222 to the second node B under the drive signal. Thus, the drive signal generated by the compensation module 250 produces a first drive signal or a second drive signal for the first and second transistors, causing them to turn on or off. By independently driving the first and second transistors with the compensation module 250, the on / off state of the first and second transistors is not affected by other signals, allowing for independent control of both transistors, and enabling rapid response from both.

[0074] In other embodiments, see Figure 13 As shown, the compensation module 250 may further include a first sustaining capacitor 252 and a third switch 253. The first end of the first sustaining capacitor 252, the first end of the compensation coil 251, and the first end of the third switch 253 are all connected to a third node C, which is grounded. The second end of the first sustaining capacitor 252, the second end of the compensation coil 251, the control terminal of the first transistor, and the control terminal of the second transistor are all connected to a fourth node D. The control terminals of the first and second transistors are configured to receive drive signals. The control terminal of the third switch 253 is configured to receive a short-circuit signal transmitted by the logic control board 230 when the logic control board 230 reaches the target power level, thereby connecting the first and second ends of the first sustaining capacitor 252 to ground the first sustaining capacitor 252. This removes the voltage at the control terminals of the first and second transistors, causing the first and second transistors to turn off. Only the induced current generated by the first coil 221 and the electromagnetic emission coil 120 powers the logic control board 230, adapting to situations where the target power required by the logic control board 230 is low.

[0075] In other embodiments, see Figure 13As shown, the third switch 253 can be a third transistor. When the third transistor receives a short-circuit signal from the logic control board 230, it turns on, connecting the first and second terminals of the first sustaining capacitor 252 and grounding them. This removes the voltage on the first sustaining capacitor 252 and the control terminals of the first switch 241 and the second switch 242, disconnecting the second coil 222 from the first coil 221. The first coil 221 then generates an induced current with the electromagnetic emission coil 120. It is understood that the control terminals of the first and second transistors can be connected to the fourth node D via compensation traces to transmit drive signals to the control terminals of the first and second transistors.

[0076] In other embodiments, see Figure 13 As shown, the compensation module 250 also includes a first rectifier tube 254, and the second end of the compensation coil 251 is connected to the fourth node D through the first rectifier tube 254. The first rectifier tube 254 converts the AC current generated by the compensation coil 251 into DC current, enabling the first and second transistors to conduct smoothly, ensuring that the first coil 221 and the second coil 222 can conduct under high charge conditions. It should be understood that the compensation coil 251 can generate an AC drive signal with the external start-up coil 130. After rectification by the first rectifier tube 254, the AC drive signal is converted into a DC drive signal. The DC drive signal charges the first sustaining capacitor 252. During the charging process of the first sustaining capacitor 252, the drive signal is transmitted to the control terminals of the first and second transistors through the compensation traces to control the first and second transistors to conduct, thereby connecting the second coil 222 to the first coil 221. The first coil 221 and the second coil 222 simultaneously generate induced current with the electromagnetic emission coil 120, providing a large induced current for the logic control board 230. When the logic control board 230 reaches the target power, a short-circuit signal is input to the third transistor to turn it on. The first and second terminals of the first holding capacitor 252 are connected and grounded, thereby removing the voltage at the control terminals of the first and second transistors. The first coil 221 is used to continuously supply power to the logic control board 230.

[0077] In some embodiments, see also Figure 14As shown, the display control line 213 in the non-display area 2111 is multiplexed as an induction coil 220. The identifier 200 may also include a switching unit, which may be located in the non-display area 2111 of the substrate 211 to reduce the impact of the switching unit on the display effect of the display area 2110. The switching unit may be configured to disconnect the display control line 213 from its corresponding display signal line 212 when a charging start signal is received, and to connect multiple display control lines 213 to form an induction coil 220. The induction coil 220 formed by multiple display control lines 213 can cooperate with the electromagnetic emission coil 120 to generate an induced current in the induction coil 220 under the action of electromagnetic induction, and supply power to the logic control board 230 and the energy storage device 260 through the induction coil 220.

[0078] In some embodiments, the switching unit may also be configured to disconnect the connection between multiple display control lines 213 in the induction coil 220 when the energy storage device 260 reaches the target charge, and connect the display control lines 213 to the corresponding display signal lines 212. When the logic control board 230 receives the display screen information, it provides a display signal to the display signal line 212 through the display control line 213 under the power provided by the energy storage device 260. In other words, this embodiment reuses the display control line 213 in the non-display area 2111 as an induction coil 220. The induction coil 220, in conjunction with the electromagnetic emission coil 120, generates an induced current to power the logic control board 230 and the energy storage device 260. Compared to the scheme of designing a battery in the display substrate 210, the battery can reduce the internal space occupied by the display substrate 210, thereby thinning the display substrate 210 and effectively reducing the manufacturing cost and volume of the display substrate 210. Compared to the scheme of setting the induction coil 220 in the logic control board 230, the design size of the logic control board 230 can be reduced, and the manufacturing cost of the logic control board 230 can be reduced. In addition, compared to the scheme of setting the induction coil 220 in the non-display area 2111 of the substrate 211, the space occupied by the induction coil 220 in the non-display area 2111 is reduced, so as to realize a narrow bezel display substrate 210.

[0079] In some embodiments, see also Figure 15 and Figure 16 As shown, the switching unit may include an interconnected start-up module 291 and a drive module (not shown in the figure). The drive module, under the action of the start-up module 291, can control the display control line 213 to disconnect or connect with its corresponding display signal line 212, and control the connection or disconnection between multiple display control lines 213 in the induction coil 220. In some embodiments, see also... Figure 16As shown, the startup module 291 may include a startup coil 2910. The startup coil 2910 is small in size to reduce its footprint on the display substrate 210, which is beneficial for achieving a narrow bezel. The startup coil 2910 may be smaller than the induction coil 220, and it can be configured to cooperate with the external startup coil 130 to generate a drive signal. It should be understood that because the startup coil 2910 is smaller than the induction coil 220, it occupies less space in the non-display area 2111, ensuring that the display control line 213 can be effectively positioned in the non-display area 2111, thereby ensuring that the startup coil 2910 can cooperate with the external startup coil 130 to generate a drive signal.

[0080] In some embodiments, see also Figure 15 As shown, the driving module may include a first switch group 292 and a second switch group 293. The first switch group 292 can be configured to connect multiple display control lines 213 to form an induction coil 220 under the drive of a driving signal. The formed induction coil 220 can generate an induced current with the electromagnetic emission coil 120 to supply power to the energy storage device 260. The second switch group 293 can be configured to disconnect the display control lines 213 from their corresponding display signal lines 212 under the drive of a driving signal, ensuring that the display control lines 213 are fully reused as induction traces to generate an induced current with the electromagnetic emission coil 120 to supply power to the energy storage device 260. That is, the induced current on the display control lines 213 flows entirely into the energy storage device 260 and does not flow into the display area 2110, ensuring the power supply effect of the induction coil 220.

[0081] In some embodiments, see also Figure 16 As shown, the startup module 291 also includes a second sustaining capacitor 2911 and a third switch group 2912. The first terminal of the second sustaining capacitor 2911, the first terminal of the startup coil 2910, and the first terminal of the third switch group 2912 are all connected to the fifth node E, which is grounded. The second terminal of the second sustaining capacitor 2911, the second terminal of the startup coil 2910, the control terminal of the first switch group 292, the control terminal of the second switch group 293, and the second terminal of the third switch group 2912 are all connected to the sixth node F. The control terminals of the first switch group 292 and the second switch group 293 are configured to receive drive signals. The control terminal of the third switch group 2912 is configured to receive a short-circuit signal from the logic control board 230 when the energy storage device 260 reaches the target charge level, thereby connecting the first and second terminals of the sustaining capacitor to de-voltage the control terminals of the first switch group 292 and the second switch group 293.

[0082] In some embodiments, when the energy storage device 260 is charged to the target amount, the logic control board 230 can control the third switch group 2912 to turn on, so that the first and second ends of the second holding capacitor 2911 are short-circuited. Since the first end of the second holding capacitor 2911 is grounded, after the second holding capacitor 2911 is closed, the control terminals of the first switch group 292 and the second switch group 293 can be grounded, reducing the voltage of the first switch group 292 and the control terminals of the second switch group 293. This causes the first switch group 292 to open and the second switch group 293 to close. The display control line 213 is connected to the display signal line 212 in the display area 2110 so that the display signal can be transmitted to the display signal line 212, causing the display area 2110 to refresh the screen.

[0083] In some embodiments, see also Figure 15 As shown, the first switch group 292, the second switch group 293, and the third switch group 2912 can all be transistors. For example, the first switch group 292 is the fourth transistor 2920, the second switch group 293 is the fifth transistor 2930, and the third switch group 2912 is the sixth transistor 29120. The fourth transistor 2920 is a normally closed transistor, meaning it is in the off state when there is no signal input, preventing current from flowing. The fifth transistor 2930 is a normally open transistor, meaning it is in the on state when there is no signal input. In other words, the first switch group 292 is turned on by a driving signal and turned off when there is no driving signal; the second switch group 293 is turned off by a driving signal and turned on when there is no driving signal.

[0084] In some embodiments, see also Figure 15 As shown, the startup module 291 may also include a second rectifier tube 2913. The second end of the startup coil 2910 is connected to the sixth node F through the second rectifier tube 2913, so that the AC current generated by the startup coil 2910 and the external startup coil 130 is rectified into DC current to charge the second holding capacitor 2911, thereby releasing drive signals to the first switch group 292 and the second switch group 293 to turn on the first switch group 292 and turn off the second switch group 293, so that the display control line 213 is multiplexed as an induction coil 220 to supply power to the energy storage device 260 in the logic control board 230.

[0085] For example, the start-up coil 2910 and the external start-up coil 130 cooperate to generate an AC induced current. The AC current drive signal is converted into a DC current drive signal by the second rectifier tube 2913. At this time, the third switch group 2912 connected in parallel with the second sustaining capacitor 2911 is disconnected, so that the generated DC induced current can charge the second sustaining capacitor 2911 and transmit the drive signal to the control terminals of the first switch group 292 and the second switch group 293, so that the first switch group 292 is turned on and the second switch group 293 is turned off. The display control line 213 and its corresponding display signal line 212 are disconnected, and multiple display control lines 213 are connected to form an induction coil 220, which cooperates with the electromagnetic emission coil 120 to generate an induced current to supply power to the energy storage device 260. When the energy storage device 260 reaches the target power level, the logic control board 230 releases a short-circuit signal to the control terminal of the third switch group 2912 to turn on the third switch group 2912. The first and second terminals of the second holding capacitor 2911 are short-circuited to remove the voltage at the control terminals of the first switch group 292 and the second switch group 293, causing the first switch group 292 to turn off and the second switch group 293 to turn on. This disconnects the connection between the multiple display control lines 213 in the induction coil 220 and connects the display control lines 213 to their corresponding display signal lines 212. When the logic control board 230 receives the display screen information, it can provide a display signal to the display signal line 212 through the display control line 213 under the power provided by the energy storage device 260 to refresh the screen.

[0086] In some embodiments, see also Figure 16 As shown, the driving module may further include a switch trace 294, one end of which is connected to the sixth node F. The switch trace 294 is configured to transmit a drive signal. The switch trace 294 is also connected to the control terminals of the first switch group 292 and the second switch group 293, for transmitting the drive signal to the control terminals of the first switch group 292 and the second switch group 293, thereby turning on the first switch group 292 and turning off the second switch group 293. In some embodiments, the switch trace 294 may be located on the side of the display control line 213 away from the display area 2110, i.e., on the outside of the display control line 213, to reduce interference between the switch trace 294 and the display control line 213, reduce the overlapping area of ​​the switch trace 294 and the display control line 213, and ensure the neatness of the wiring in the non-display area 2111. In some embodiments, see [link to relevant documentation]. Figure 14As shown, the non-display area 2111 has a symmetrically arranged first area 2111a and second area 2111b, which are located on opposite sides of the display area 2110 in the first direction X. Both the first area 2111a and the second area 2111b have N display control lines 213 arranged at intervals along the second direction Y. The second direction Y intersects with the first direction X.

[0087] In some embodiments, see also Figure 14 As shown, the first switch group 292 includes N fourth transistors 2920. The nth display control line 213 located in the first region 2111a is connected to the first terminal of the nth fourth transistor 2920, and the nth display control line 213 located in the second region 2111b is connected to the second terminal of the nth fourth transistor 2920. The control terminal of each fourth transistor 2920 is connected to the switch trace 294. The control terminal of the fourth transistor 2920 is used to receive a drive signal to connect the first and second terminals of the fourth transistor 2920, thereby connecting the display control line 213 in the first region 2111a and the display control line 213 in the second region 2111b, so that the display control line 213 is multiplexed as an induction coil 220 to supply power to the energy storage device 260. Where N≥1, n≥1, and N≥n.

[0088] For example, the first direction X intersects the second direction Y perpendicularly. Both the first region 2111a and the second region 2111b include three display control lines 213. The display control lines 213 in both regions 2111a and 2111b are arranged at intervals from the inside to the outside of the substrate 211, and are respectively the first display control line 213, the second display control line 213, and the third display control line 213. In this configuration, the first display control line 213 in the first region 2111a is connected to the first terminal of the first fourth transistor 2920, and the first display control line 213 in the second region 2111b is connected to the second terminal of the first fourth transistor 2920. The control terminal of the first fourth transistor 2920 is connected to the switch trace 294. Under the action of the drive signal on the switch trace 294, the fourth transistor 2920 is turned on, so that the first display control line 213 in the first region 2111a is connected to the second display control line 213 in the second region 2111b. Similarly, using the second and third fourth transistors 2920 and the driving signal, the second display control line 213 in the first zone 2111a is connected to the second display control line 213 in the second zone 2111b, and the third display control line 213 in the first zone 2111a is connected to the third display control line 213 in the second zone 2111b, to form a three-turn induction coil 220 in the non-display area 2111. It should be noted that each display control line 213 in the first zone 2111a and each display control line 213 in the second zone 2111b can correspond to multiple display signal lines 212, and the display signal lines 212 corresponding to the display control lines 213 in the first zone 2111a are different from those corresponding to the display control lines 213 in the second zone 2111b, so as to transmit display signals to different display signal lines 212. The number of display signal lines 212 corresponding to each display control line 213 in the first zone 2111a and each display control line 213 in the second zone 2111b can be the same or different, depending on the specific design of different embodiments. By having each display control line 213 correspond to multiple display signal lines 212, the number of display control lines 213 can be reduced, thus lowering production costs. Furthermore, each display control line 213 is connected to the display signal line 212 via a second switch group 293. The second switch group 293 can be located in a non-display area 2111, thus not occupying too much space in the display area 2110, increasing the aperture ratio of the display area 2110, and ensuring the display effect of the display area 2110.

[0089] In some embodiments, a connecting trace 218 may be provided between the nth display control line 213 located in the first region 2111a and the nth display control line 213 located in the second region 2111b. One end of the connecting trace 218 is connected to the nth display control line 213 in the first region 2111a or the second region 2111b, and the other end is connected to the first or second end of the fourth transistor 2920.

[0090] In other embodiments, the nth display control line 213 located in the first region 2111a can be connected to the (n+1)th or (n+2)th display control line 213 located in the second region 2111b via the fourth transistor 2920.

[0091] In some embodiments, see also Figure 14 As shown, one end of the driver chip 215 is connected to the logic control board 230 to acquire display signals, and the other end is connected to each display control line 213 in the first area 2111a and the second area 2111b respectively to transmit display signals to the display control line 213, and then transmit display signals to the display signal line 212 in the display area 2110.

[0092] In some embodiments, see also Figure 18 As shown, the driving module may further include a fourth switch group 295. The fourth switch group 295 may include N seventh transistors 2950. The nth display control line 213 located in the first region 2111a is connected to the first terminal of the nth seventh transistor 2950, ​​and the second terminal of the nth seventh transistor 2950 is connected to the driving chip 215. The control terminals of each seventh transistor 2950 are connected to the switch trace 294 to receive driving signals. The seventh transistor 2950 may be normally open transistors, so that when a driving signal is input to the control terminal of the seventh transistor 2950, ​​the first and second terminals of the seventh transistor 2950 are disconnected, thereby cutting off the connection between the display control line 213 and the driving chip 215 in the first region 2111a. This allows the induced current generated on the induction coil 220 to be transmitted along the winding path of the induction coil 220, reducing the induced current flowing into the driving chip 215 and ensuring the power supply effect to the energy storage device 260.

[0093] In some embodiments, see also Figure 18As shown, the driving module may further include a fifth switch group 296. The fifth switch group 296 may include N eighth transistors 2960. The nth display control line 213 located in the second region 2111b is connected to the first terminal of the nth eighth transistor 2960, and the second terminal of the nth eighth transistor 2960 is connected to the driving chip 215. The control terminals of each eighth transistor 2960 are connected to the switch trace 294 to receive driving signals. The eighth transistor 2960 may be normally open transistors, so that when a driving signal is input to the control terminal of the eighth transistor 2960, the first and second terminals of the eighth transistor 2960 are disconnected, thereby cutting off the connection between the display control line 213 in the second region 2111b and the driving chip 215. This reduces the induced current generated on the induction coil 220 flowing into the driving chip 215, ensuring the power supply effect to the energy storage device 260.

[0094] For example, see Figure 17 and Figure 18 As shown, the fourth switch group 295 includes three seventh transistors 2950, ​​and the fifth switch group 296 includes three eighth transistors 2960. The first display control line 213 located in the first region 2111a is connected to the first terminal of the first seventh transistor 2950, ​​the second terminal of the first seventh transistor 2950 is connected to the driver chip 215, and the control terminal of the seventh transistor 2950 is connected to the switch trace 294. The drive signal on the switch trace 294 controls the seventh transistor 2950 to disconnect, thereby disconnecting the first display control line 213 in the first region 2111a from the driver chip 215. The first display control line 213 located in the second zone 2111b is connected to the first terminal of the first eighth transistor 2960. The second terminal of the first eighth transistor 2960 is connected to the driver chip 215. The control terminal of the eighth transistor 2960 is connected to the switch trace 294. The drive signal on the switch trace 294 controls the eighth transistor 2960 to disconnect, thereby disconnecting the first display control line 213 in the second zone 2111b from the driver chip 215. Similarly, the second and third display control lines 213 in the first zone 2111a are also disconnected from the driver chip 215, as are the second and third display control lines 213 in the second zone 2111b, so that the display control line 213 is only used to form the induction coil 220, and the induced current only supplies power to the energy storage device 260.

[0095] In some embodiments, see also Figure 17As shown, the driving module may further include a sixth switch group 297. The sixth switch group 297 may be located on the display control line 213 of one of the first region 2111a and the second region 2111b. The sixth switch group 297 may include N ninth transistors 2970. The nth display control line 213 is connected to the first terminal of the nth ninth transistor 2970, and the (n+1)th display control line 213 is connected to the second terminal of the nth ninth transistor 2970. The control terminal of each ninth transistor 2970 is connected to the switch trace 294 to receive the drive signal on the switch trace 294. The ninth transistor 2970 may be a normally off transistor. Under the action of the drive signal, the first and second terminals of the ninth transistor 2970 can be connected, thereby connecting two adjacent display control lines 213. Where N≥2, n≥1, and N≥n. It should be noted that the ninth transistor 2970 is located at the end of the seventh or eighth transistor 2960 that is away from the driver chip 215, so as to ensure that the induced current on the adjacent display control line 213 can be transmitted to the next display control line 213.

[0096] In some embodiments, see also Figure 18 As shown, the driving module may also include a connection unit 298. The connection unit 298 may include N-1 connection lines, which are arranged sequentially in the first direction X of the display area 2110. Each connection line may include a first connection line 2980 and a tenth transistor 2981 and an eleventh transistor 2982 disposed at opposite ends of the first connection line 2980. The first terminal of the tenth transistor 2981 in the nth connection line is connected to the nth display control line 213 in the first region 2111a. The second terminal of the tenth transistor 2981 in the nth connection line is connected to one end of the first connection line 2980 in the nth connection line. The control terminal of the tenth transistor 2981 in the nth connection line is connected to the switch trace 294 to receive the drive signal on the switch trace 294. The first terminal of the eleventh transistor 2982 in the nth connection line is connected to the nth display control line 213 in the second region 2111b. The second terminal of the eleventh transistor 2982 in the nth connection line is connected to the other end of the first connection line 2980 in the nth connection line. The control terminal of the eleventh transistor 2982 in the nth connection line is connected to the switch trace 294 to receive the drive signal on the switch trace 294. Where N≥2, n≥1, and N≥n.

[0097] In some embodiments, see also Figure 14 and Figure 17As shown, the Nth display control line 213 located in the second zone 2111b is connected to one end of the energy storage device 260, the first display control line 213 located in the first zone 2111a is connected to the first end of the first ninth transistor 2970, and the second end of the first ninth transistor 2970 is connected to the other end of the energy storage device 260 of the logic control board 230.

[0098] For example, see Figure 14 , Figure 17 and Figure 18 As shown, a sixth switch group 297 is provided in the first region 2111a, which includes three ninth transistors 2970. A first display control line 213, a second display control line 213, and a third display control line 213 are respectively provided from the inside to the outside of the substrate 211. The third display control line 213 in the second region 2111b is connected to the energy storage device 260. In the first region 2111a, a third ninth transistor 2970 is provided between the third and second display control lines 213. The first terminal of the third ninth transistor 2970 is connected to the third display control line 213, the second terminal of the third ninth transistor 2970 is connected to the second display control line 213, and the control terminal of the third ninth transistor 2970 is connected to the switch trace 294 to receive a drive signal to turn on the third and second display control lines 213. Similarly, a second ninth transistor 2970 is provided between the second display control line 213 and the first display control line 213. The second ninth transistor 2970 receives a drive signal to turn on the second display control line 213 and the first display control line 213. The first terminal of the first ninth transistor 2970 is connected to the first display control line 213, and the second terminal of the first ninth transistor 2970 is connected to the energy storage device 260. The first ninth transistor 2970 receives a drive signal to connect the first display control line 213 to the energy storage device 260. Power is supplied to the energy storage device 260 through the third display control line 213 in the second region 2111b and the first display control line 213 in the first region 2111a.

[0099] The connection unit 298 includes a first connection line and a second connection line. The second connection line is located on the side of the first connection line closer to the driver chip 215. Both the first and second connection lines may include a first connection line 2980 and a tenth transistor 2981 and an eleventh transistor 2982 located at opposite ends of the first connection line 2980. The first end of the tenth transistor 2981 in the first connection line is connected to the first display control line 213 in the first area 2111a, and the second end of the tenth transistor 2981 in the first connection line is connected to one end of the first connection line 2980 in the first connection line. The control terminal of the tenth transistor 2981 in the first connection line is connected to the switch trace 294 to receive the drive signal on the switch trace 294. The first terminal of the eleventh transistor 2982 in the first connection line is connected to the first display control line 213 in the second zone 2111b. The second terminal of the eleventh transistor 2982 in the first connection line is connected to the other end of the first connection line 2980 in the first connection line. The control terminal of the eleventh transistor 2982 in the first connection line is connected to the switch trace 294 to receive the drive signal on the switch trace 294. That is, the first display control line 213 in the first zone 2111a is connected to the first display control line 213 in the second zone 2111b using the first connection line. Similarly, the second display control line 213 in the first zone 2111a is connected to the second display control line 213 in the second zone 2111b using the second connection line. See also... Figure 16 , Figure 17 and Figure 18 As shown, this application, through the aforementioned fourth transistor 2920, fifth transistor 2930, seventh transistors 2950 to eleventh transistors 2982, and first connection line 2980, enables the display control line 213 in the first region 2111a and the display control line 213 in the second region 2111b to form a closed induction coil 220. The display control line 213 in the non-display area 2111 is multiplexed as the induction coil 220, and the induction coil 220, in conjunction with the electromagnetic emission coil 120, generates an induced current, thereby supplying power to the energy storage device 260. By multiplexing the display control line 213 as the induction coil 220, the occupied area of ​​the non-display area 2111 can be reduced, thus achieving a narrow bezel display substrate 210.

[0100] In some embodiments, see also Figure 17As shown, the drive module may further include N-1 twelfth transistors 299, the first terminal of the nth twelfth transistor 299 is connected to the second terminal of the nth ninth transistor 2970, the second terminal of the nth twelfth transistor 299 is connected to the second terminal of the (n+1)th ninth transistor 2970, and the control terminal of the nth twelfth transistor 299 is configured to receive a drive signal to disconnect the connection between adjacent ninth transistors 2970.

[0101] For example, see Figure 17 As shown, the drive module may further include two twelfth transistors 299. The first terminal of the second twelfth transistor 299 is connected to the second terminal of the second ninth transistor 2970, and the second terminal of the second twelfth transistor 299 is connected to the second terminal of the third ninth transistor 2970. The control terminal of the second twelfth transistor 299 is connected to the switch trace 294 to receive drive signals and disconnect the connection between adjacent ninth transistors 2970. This ensures that the induced current can flow along the winding direction of the induction coil 220, reducing reverse flow of the induced current and ensuring that the induced current in the induction coil 220 is in the same current direction, thereby ensuring stable power supply to the energy storage device 260. It should be noted that the second terminal of the ninth transistor 2970 can be connected to the adjacent display control line 213 via a wire.

[0102] In some embodiments, the start-up coil 2910 and the driver chip 215 can be respectively located on opposite sides of the display area 2110 to reduce interference between the start-up coil 2910 and the external start-up coil 130, ensuring the effective generation of the drive signal. It is understood that the induction coil 220 continuously supplies power to the energy storage device 260, and stops charging when the energy storage device 260 has sufficient power to meet refresh requirements. During the charging phase, the logic control board 230 receives screen signals via data traffic, Bluetooth, or WIFI and sends a short-circuit signal to the control terminal of the sixth transistor 29120. This connects the first and second terminals of the holding capacitor, grounding them together to remove the voltage on the fourth transistor 2920, fifth transistor 2930, seventh transistor 2950 to twelfth transistor 299. This disconnects the fourth transistor 2920, ninth transistor 2970, tenth transistor 2981, and eleventh transistor 2982, while turning on the fifth transistor 2930, seventh transistor 2950, ​​eighth transistor 2960, and twelfth transistor 299. This connects the display control line 213 to the display signal line 212 and the driver chip 215, and disconnects the display control line 213 in the first area 2111a and the display control line 213 in the second area 2111b. The current flow is as follows: Figure 19 and Figure 20As shown. After the display control line 213 is connected to the driver chip 215, the logic control board 230, powered by the energy storage device 260, transmits the display signal to the driver chip 215 via the flexible circuit board 280. The driver chip 215 then transmits the display signal to the display signal line 212 via the display control line 213, causing the electronic ink layer 216 to refresh the screen under the influence of the electric field. Furthermore, in this embodiment, the display control line 213 can also employ a double-layered first coil 221 and second coil 222 as described in the previous embodiment, to increase the induced current generated by the induction coil 220 and the electromagnetic emission coil 120. The specific structure can be found in the description of the structure of the induction coil 220 using a double-layered first coil 221 and second coil 222, which will not be elaborated further here. In other embodiments, see... Figure 21 As shown, the substrate 211 may have a first surface 2112 and a second surface 2113 opposite to each other.

[0103] In other embodiments, see Figure 21As shown, the induction coil 220 and logic control board 230, along with the driving layer 214, can be disposed on opposite sides of the substrate 211. Specifically, the induction coil 220 and logic control board 230 are disposed on the second surface 2113 of the substrate 211, and the driving layer 214 is disposed on the first surface 2112 of the substrate 211. The induction coil 220 can be formed into a spiral or arrayed coil on the second surface 2113 of the substrate 211 through coating, etching, exposure and development, and STM (Scanning Tunneling Microscopy) technology. The induction coil 220 can be made of conductive materials such as copper or silver. The logic control board 230 is mounted on a reserved area of ​​the second surface 2113 using a chip-on-board (COB) or similar bonding technology. By placing the driving layer 214, the induction coil 220, and the logic control board 230 on different sides of the substrate 211, the internal space occupied by the logic control board 230 can be reduced compared to a structure where the logic control board 230 is set separately. In addition, by cooperating with the electromagnetic emission coil 120 to supply power to the logic control board 230, the internal space occupied by the battery in the display substrate 210 can be reduced compared to a scheme where the battery is designed inside the display substrate 210, thereby further reducing the thickness of the display substrate 210 and effectively reducing the manufacturing cost of the display substrate 210. Furthermore, by forming the induction coil 220 and the driving layer 214 on different surfaces of the substrate 211, compared to the scheme of placing the induction coil 220 and the driving layer 214 on the same surface of the substrate 211, not only can the interference of the induction coil 220 on the driving signal of the driving layer 214 be reduced, but the area of ​​the non-display area 2111 where the induction coil 220 is placed can also be saved, narrowing the area of ​​the non-display area 2111 of the display substrate 210, thereby narrowing the bezel width of the display substrate 210. In addition, placing the induction coil 220 on the second surface 2113 of the substrate 211 makes the distance between the induction coil 220 and the electromagnetic emission coil 120 closer, resulting in less interference between them and a stronger induced current generated by the induction coil 220 and the electromagnetic emission coil 120.

[0104] In other embodiments, the second surface 2113 of the substrate 211 may have a first groove and a second groove. The induction coil 220 and the logic control board 230 are respectively disposed in the first groove and the second groove. By creating a groove structure on the second surface 2113 of the substrate 211, the thickness space occupied by the induction coil 220 and the logic control board 230 can be saved. Compared with the scheme of setting the logic control board 230 independently of the substrate 211, the thickness of the display substrate 210 is reduced. It should be noted that when the induction coil 220 and the logic control board 230 are disposed in the first groove and the second groove, their distance from the driving layer 214 on the first surface 2112 is closer, which will cause some interference to the signal of the driving layer 214. Therefore, when preparing the driving layer 214 on the first surface 2112, a shielding layer and an insulating layer are prepared on the substrate 211 beforehand. The shielding layer is located on the side of the insulating layer close to the substrate 211. The shielding layer is used to shield the signals of the induction coil 220 and the logic control board 230 to ensure the normal transmission of signals on the driving layer 214. In addition, an insulating encapsulant, such as epoxy resin, can be applied to the second surface 2113 to fill gaps and cover the surface, forming an integral structure. It is understood that, in addition to the above-mentioned thin-film wiring, chip-on-board (COB) bonding, and groove opening, the induction coil 220 and the logic control board 230 can also adopt conductive adhesive low-temperature curing bonding or low-stress mechanical snap-fit ​​structures. In some other embodiments, the induction coil 220 is attached to the second surface 2113 by silver paste or nano-silver conductive adhesive (curing temperature 80-120℃). The adhesive layer thickness (10-20μm) is controlled by screen printing or dispensing process, and mechanical fixation is achieved after low-temperature curing. The logic control board 230 is thermo-pressed to the pads of the second surface 2113 via anisotropic conductive adhesive (ACF) (thermo-pressing temperature 120-150℃, pressure 0.3-0.5MPa). The resin matrix of the ACF provides mechanical fixation, while the conductive particles achieve electrical conduction. Thus, using a low-temperature process can reduce the phenomenon of thermal stress cracking of the substrate 211 caused by high temperatures, thereby mitigating the glass brittleness of the substrate 211.

[0105] In other embodiments, the second surface 2113 is designed with micro-positioning posts, which can be fabricated by photolithography and etching. Positioning holes are pre-drilled at the edge of the induction coil 220 for secure fastening with silicone elastic clips. The logic control board 230 is integrated onto a ceramic substrate, which is adhered to the second surface 2113 via a thermally conductive silicone pad and fixed to the substrate 211 using screws or other fasteners. Thus, the detachable design facilitates maintenance and replacement through low-stress mechanical fasteners, and the elasticity of the silicone reduces the risk of glass breakage due to rigid contact. In other embodiments, see... Figure 21 and Figure 22 As shown, the induction coil 220 can be wrapped around the outside of the logic control board 230 and connected to the logic control board 230. The induction coil 220 can generate an induced current with the electromagnetic emission coil 120. The generated induced current charges the logic control board 230. When the logic control board 230 receives display screen information, it provides a drive signal to the driving layer 214 with the power provided by the induced current to control the voltage of the pixel electrode 2140, thereby controlling the position of the color particles to refresh the screen. It should be noted that the number of turns of the induction coil 220 around the logic control board 230 can be designed according to the energy required by the logic control board 230. The greater the energy required by the logic control board 230, the greater the number of turns of the induction coil 220; conversely, the smaller the number of turns of the induction coil 220. In other embodiments, a plurality of parallel-connected induction coils 220 may be disposed on the second surface 2113 of the substrate 211. These parallel-connected induction coils 220 may be disposed on one side of the logic control board 230, and each coil has a first end and a second end located on opposite sides. Both the first and second ends are connected to the logic control board 230 to supply power to it. It should be noted that the parallel-connected induction coils 220 can increase the generated induced current, thereby supplying more power to the logic control board 230 and providing sufficient power for screen refresh.

[0106] In other embodiments, see Figure 23As shown, the display substrate 210 may further include a connector 219. The connector 219 is disposed on the second surface 2113 of the substrate 211, on the same surface as the induction coil 220 and the logic control board 230, and is connected to the logic control board 230. A flexible circuit board 280 can be bent and disposed on one side of the substrate 211. One end of the flexible circuit board 280 is connected to the driver chip 215 in the driving layer 214, and the other end is connected to the logic control board 230 via the connector 219. When the logic control board 230 receives display screen information, it provides drive signals to the driver chip 215 sequentially through the connector 219 and the flexible circuit board 280 under the power supplied by the induction coil 220, thereby controlling the screen refresh in real time. It should be noted that the connector 219 has a first end and a second end. One end of the induction coil 220 is connected to the first end of the connector 219, and the second end of the connector 219 is connected to the other end of the induction coil 220. Thus, the induction coil 220 is connected to the logic control board 230 via connector 219 to supply power to the logic control board 230. It is understood that by connecting the induction coil 220 to the logic control board 230 via connector 219, the stability characteristics of connector 219 can be utilized to reduce signal interference and ensure stable power supply to the induction coil 220. In other embodiments, the fabrication process of the substrate 211 can involve first forming a driving layer 214 on the first surface 2112 of the substrate 211, then forming the induction coil 220 and the logic control board 230 on the second surface 2113 of the substrate 211. The flexible circuit board 280 is then connected to the driving layer 214 and the connector 219 by soldering to transmit the driving signals of the logic control board 230 to the driving layer 214.

[0107] In other embodiments, see also Figure 24 and Figure 25As shown, the substrate 211 has a through-hole extending through its thickness. The display substrate 210 may further include a first conductive adhesive 2100, which fills the through-hole. One end of the first conductive adhesive 2100 is connected to the driver chip 215 in the driver layer 214, and the other end is connected to the logic control board 230. When the logic control board 230 receives display screen information, it provides a drive signal to the driver chip 215 in the driver layer 214 through the first conductive adhesive 2100 under the power supplied by the induction coil 220. By utilizing the first conductive adhesive 2100 in the through-hole to conduct the logic control board 230 and the driver chip 215, the process design of the flexible circuit board 280 can be reduced, and the production cost of the substrate 211 can be lowered. In other embodiments, the first conductive adhesive 2100 may be conductive silver paste. By using the first conductive adhesive 2100 to connect the driver chip 215 and the logic control board 230, conductivity can be enhanced while reducing the conduction of signals and structural fixation required for traditional soldering. Understandably, the driver chip 215 has multiple conductive pins 281. At least one through-hole can be formed on the substrate 211, and a first conductive adhesive 2100 is injected into the through-hole. One end of the first conductive adhesive 2100 is connected to the conductive pin 281 of the driver chip 215, and the other end is connected to the logic control board 230. In this way, the conductive pins 281 of the driver chip 215 are connected to the logic control board 230 through the first conductive adhesive 2100.

[0108] In one example, the substrate 211 may have the same number of vias as the conductive pins 281, with adjacent vias spaced apart. The opposite ends of each first conductive adhesive strip 2100 are connected to the conductive pin 281 and the logic control board 230, respectively. By having one first conductive adhesive strip 2100 correspond to one conductive pin 281, mutual interference between adjacent first conductive adhesive strips 2100 can be reduced, ensuring signal transmission stability. Furthermore, the side of the first conductive adhesive strip 2100 furthest from the conductive pin 281 can be directly connected to the logic control board 230.

[0109] In another example, the substrate 211 may have one or fewer through holes than the number of conductive pins 281, and the through holes are provided with insulating elements. Multiple insulating gaps are created by the insulating elements, and the conductive pins 281 of different signals are introduced into different insulating gaps to reduce crosstalk between different signals and ensure signal transmission stability.

[0110] In other embodiments, see Figure 21As shown, since the induction coil 220 is arranged around the logic control board 230 and the connector 219, and the logic control board 230 needs to be powered by the induction coil 220, it needs to be formed into a closed structure. The induction coil 220 has multiple turns and is arranged around the logic control board 230, with the inner end of the induction coil 220 connected to the first end of the logic control board 230. The second surface 2113 of the substrate 211 is also provided with a second connecting line 2102, which is surrounded by the induction coil 220 and spaced apart from it. The second connecting line 2102 is connected to the second end of the logic control board 230. In some other embodiments, see... Figure 21 and Figure 22 As shown, the substrate 211 has two through holes 2114 extending from the first surface 2112 to the second surface 2113, and both through holes 2114 are filled with a second conductive adhesive 2101. The second conductive adhesive 2101 in one through hole 2114 is connected to the end of the second connecting line 2102 away from the logic control board 230, and the second conductive adhesive 2101 in the other through hole 2114 is connected to the outer end of the induction coil 220.

[0111] In some other embodiments, the first surface 2112 of the substrate 211 is further provided with a second bridging wire 2103. The second conductive adhesive 2101 in the two connecting holes 2114 is bridged by the second bridging wire 2103, that is, the second bridging wire 2103 connects the outer end of the induction coil 220 to the second connecting line 2102. It is understood that, see... Figure 22 and Figure 25As shown, since the second bridge wire 2103, the induction coil 220, and the second connecting wire 2102 are respectively located on different surfaces of the substrate 211, in order to show that the coil supplying power to the logic control board 230 is a loop structure, the second bridge wire 2103 on the first surface 2112 is represented by a dashed line on the second surface 2113. The dashed second bridge wire 2103 bridges the outer end of the induction coil 220 and the second connecting wire 2102, so that the induction coil 220, the second bridge wire 2103, and the second connecting wire 2102 form a closed loop structure. Thus, through the closed loop structure formed by the induction coil 220, the second bridge wire 2103, and the second connecting wire 2102, when the induction coil 220 cooperates with the electromagnetic emission coil 120 to generate an induced current, power is supplied to the logic control board 230 through the closed loop structure. It should be noted that the two connection holes 2114 are spaced apart from the through holes, meaning the position of the second bridging wire 2103 is spaced apart from the conductive pins 281 of the driver chip 215, to reduce the impact of the second bridging wire 2103 on the normal operation of the conductive pins 281. Furthermore, the second bridging wire 2103 can be located in the non-display area 2111 of the first surface 2112 to ensure normal display in the display area 2110. The second bridging wire 2103 can be disposed on the same layer as a conductive layer in the driver layer 214. For example, the second bridging wire 2103 can be disposed on the same layer as the scan lines and spaced apart, or it can be disposed on the same layer as the data lines and spaced apart. For example, by disposing of the second bridging wire 2103 on the same layer as the scan lines in the driver layer 214, since the second bridging wire 2103 is closer to the second surface 2113 of the substrate 211, the number of opening layers of its connection holes 2114 is reduced, which not only reduces the opening thickness but also reduces the amount of second conductive adhesive 2101 injected, thus reducing costs. In addition, this second bridging line 2103 can be formed at the same time as the scan line, reducing the manufacturing cost.

[0112] In other embodiments, the fabrication process of the substrate 211 may involve first forming a driving layer 214 on the first surface 2112 of the substrate 211, then forming an induction coil 220 and a logic control board 230 on the second surface 2113 of the substrate 211. Then, through-holes are formed in the non-display area 2111 of the substrate 211, and a first conductive adhesive 2100 is filled into the through-holes and connection holes 2114 to connect the driving layer 214 and the logic control board 230, thereby transmitting the driving signals of the logic control board 230 to the driving layer 214. In other embodiments, see... Figure 26As shown, the energy storage device 260 can be located on the same side of the substrate 211 as the induction coil 220 and the logic control board 230, that is, the energy storage device 260 is integrated on the second surface 2113 of the substrate 211. The induction coil 220 is arranged around the logic control board 230 and the energy storage device 260, with one end of the energy storage device 260 connected to the induction coil 220 and the other end connected to the second connection line 2102. The induction coil 220 is configured to cooperate with the electromagnetic emission coil 120 to charge the energy storage device 260. In other words, the induced current generated by the cooperation of the induction coil 220 and the electromagnetic emission coil 120 can both power the logic control board 230 and charge the energy storage device 260. By integrating the energy storage device 260 onto the second surface 2113 of the substrate 211, the logic control board 230 can provide a driving signal to the driver chip 215 under the action of the energy storage device 260 when there is no change in the magnetic flux of the electromagnetic transmitting coil 120, so that the screen can be refreshed in real time without being fixed to a specific position of the electromagnetic transmitting coil 120, thereby improving the application scenarios of the display substrate 210.

[0113] In other embodiments, the logic control board 230 may be disposed on the back side of the display substrate 210, so that the logic control board 230 and the display substrate 210 are arranged sequentially in the display direction, which can expand the display area of ​​the display side of the identifier 200, thereby improving the display screen. In some embodiments, please refer to... Figure 1 As shown, the identifier 200 may further include a housing 2000, which may have a receiving cavity 2001. The logic control board 230, the display substrate 210, and the electronic ink layer 216 may be disposed within the receiving cavity 2001. An external inductive power supply may be located on the side of the housing 2000 opposite to the display and corresponding to the display substrate 210, serving as the transmitter of the inductive current. In some embodiments, please refer to... Figure 1 As shown, the marking element 200 may also include a cover plate 2010. The cover plate 2010 is disposed on the upper surface of the housing 2000 to seal the receiving cavity 2001, thereby reducing the entry of impurities into the electronic ink layer 216 and the display substrate 210 and protecting the electronic ink layer 216 and the display substrate 210.

[0114] In the description of this specification, references to terms such as "some embodiments" and "exemplarily" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application. Therefore, all changes or modifications made in accordance with the claims and description of this application should fall within the scope of the patent coverage of this application.

Claims

1. An electronic identification system, characterized in that, include: A power supply accessory, the power supply accessory including a carrier and an electromagnetic transmitting coil disposed on the carrier; An identification component, comprising a display substrate and a logic control board, wherein an induction coil is provided on one of the logic control board and the display substrate, and the logic control board is connected to the induction coil and the display substrate; The marker is movable relative to the carrier. When the marker moves to a position where the induction coil is opposite to the electromagnetic emission coil, the induction coil can cooperate with the electromagnetic emission coil to supply power to the logic control board. The logic control board is configured to provide a display signal to the display substrate through the power supplied by the induction coil when receiving screen information.

2. The electronic identification system according to claim 1, characterized in that, The carrier is a display rack, which includes at least one display layer. The electromagnetic emission coil is laid on the entire display layer, and the identification element is movably installed on the display layer.

3. The electronic identification system according to claim 2, characterized in that, Each of the display layers is provided with a plurality of electromagnetic transmitting coils, which are laid out at least along the moving direction of the sign, wherein the spacing between adjacent electromagnetic transmitting coils is smaller than the size of the induction coil.

4. The electronic identification system according to claim 3, characterized in that, The electronic identification system also includes a position sensor and a controller. The position sensor is configured to acquire the location of the identification element, and the controller is configured to control the electromagnetic transmitting coil at the location of the identification element to be powered according to the position information acquired by the position sensor, so that the induction coil can cooperate with the electromagnetic transmitting coil to power the logic control board.

5. The electronic identification system according to claim 1, characterized in that, The carrier is a work uniform for users to wear, and the work uniform is provided with a sensing area, in which at least one electromagnetic emission coil is woven; The identification device is a work badge. When the user wears the work badge, the work badge moves closer to or further away from the sensing area as the user walks.

6. The electronic identification system according to claim 1, characterized in that, The identifier is provided with a plurality of induction coils arranged in an array in the column and row directions, with adjacent rows of induction coils spaced apart, and induction coils in the same row connected in parallel.

7. The electronic identification system according to claim 4, characterized in that, The identification component also includes an energy storage component, which is disposed on the logic control board and electrically connected to the induction coil. The current generated by the induction coil and the electromagnetic emission coil supplies power to the logic control board and then charges the energy storage component.

8. The electronic identification system according to claim 4, characterized in that, The controller is also configured to stop supplying power to the electromagnetic transmitting coil after the display substrate has completed the refresh display; the position sensor continuously detects the location of the marker.

9. The electronic identification system according to claim 1, characterized in that, The induction coil is integrated on the logic control board; or The induction coil is integrated on the back or front of the display substrate.

10. The electronic identification system according to claim 9, characterized in that, The display substrate includes a display area and a non-display area disposed around the display area. The induction coil is located in the non-display area and is disposed on the same layer as a metal layer in the display area and spaced apart.

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