The invention discloses a method and a
system for managing and controlling
chip-level operation of an advanced packaging and
bonding process, and belongs to the technical field of
semiconductor advanced packaging and manufacturing, and the method comprises the following steps: endowing a
wafer and a glass substrate with unique electronic identifiers; binding the material information and the process parameters to form
station entering management and control; single
wafer exclusive process parameters are issued to the bonding
machine; the method comprises the following steps: collecting
bonding process data, performing hierarchical
processing based on a three-level abnormal response mechanism, and performing real-
time data closed-loop management and control on a
bonding process: performing three-dimensional
verification on a physical state, a
system state and
data integrity of a bonded
wafer to realize outbound total element
verification; and generating a core data
traceability packet after the
verification is qualified, and storing key nodes through a block chain platform to realize tampering-free evidence storage. According to the method, the problems of insufficient tracing precision and
exception handling lagging of traditional batch control can be solved, the quality stability and production efficiency of the bonding process are improved to a certain extent, and the method has better
engineering applicability.