Apparatus for manufacturing display apparatus and method of manufacturing display apparatus

Abstract

An apparatus for manufacturing a display apparatus and a method of manufacturing a display apparatus are disclosed. The apparatus for manufacturing the display apparatus includes: a chamber; a mask assembly disposed inside the chamber to face the display substrate; a holder portion disposed inside the chamber, the holder portion including a cooling channel through which a cooling material flows; and a deposition source disposed inside the chamber and configured to supply a deposition material such that the deposition material passes through the mask assembly and is deposited on the display substrate. At least one of the holder portion and the mask assembly is movable between a first position where the holder portion supports the display substrate and a second position where the holder portion is in contact with the mask assembly.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2024-0075675, filed on June 11, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to apparatus and methods, and more specifically, to an apparatus for manufacturing a display device and a method for manufacturing a display device. Background Technology

[0004] Today, mobile electronic devices such as tablet PCs and mobile phones are widely used. These electronic devices typically include a display device to support various functions, such as providing visual information like images to the user. Recently, with the miniaturization of components used to drive the display device, the proportion of electronic devices occupied by the display device has been gradually increasing, and structures that allow the display device to be bent or folded are being developed to provide a compact configuration of the display device. Summary of the Invention

[0005] One or more embodiments disclosed herein include effectively cooling the mask assembly during the deposition process. However, such technical objectives are merely illustrative, and this disclosure is not limited thereto. Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0006] According to one or more embodiments, an apparatus for manufacturing a display device includes: a chamber; a mask assembly disposed inside the chamber to face a display substrate; a holder portion inside the chamber, the holder portion including a cooling channel through which cooling material flows; and a deposition source disposed inside the chamber and configured to supply deposition material such that the deposition material passes through the mask assembly and is deposited on the display substrate. At least one of the holder portion and the mask assembly is movable between a first position where the holder portion supports the display substrate and a second position where the holder portion contacts the mask assembly.

[0007] The retainer portion may include: a retainer frame including a retainer opening; and a contact portion extending from the retainer frame toward the retainer opening to contact the display substrate.

[0008] The cooling channel can include a first channel disposed inside the holder frame to surround the holder opening. The cooling channel can further include a second channel extending from the first channel and having at least a portion disposed inside the contact portion.

[0009] The apparatus can further include a supply configured to supply the cooling material to the holder portion. The cooling channel can further include a third channel disposed inside the holder frame to supply the cooling material from the supply to the first channel. The cooling channel can further include a fourth channel disposed inside the holder frame such that the cooling material returns from the first channel to the supply.

[0010] The mask assembly can include a first mask portion, a second mask portion extending from the first mask portion toward the display substrate in a first direction, and a mask opening passing through the first mask portion and the second mask portion in the first direction. A width of the second mask portion can be less than a width of the first mask portion. The holder portion can be in contact with the first mask portion at the second position. The holder portion can be separated from the first mask portion at the first position. A thickness of the second mask portion can be greater than a thickness of the holder portion.

[0011] According to one or more embodiments, a method of manufacturing a display apparatus includes flowing a cooling material through a cooling channel disposed inside a holder portion, introducing a display substrate into a chamber, moving the holder portion between a first position in which the holder portion supports the display substrate and a second position in which the holder portion is in contact with a mask assembly, and a deposition source supplies a deposition material.

[0012] The holder portion can include a holder frame including a holder opening, and a contact portion extending from the holder frame toward the holder opening to be in contact with the display substrate.

[0013] The flowing of the cooling material through the cooling channel can include flowing the cooling material through a first channel disposed inside the holder frame such that the cooling material surrounds the holder opening.

[0014] The flowing of the cooling material through the cooling channel can further include flowing the cooling material through a second channel extending from the first channel and having at least a portion disposed inside the contact portion.

[0015] The method can further include the supply portion supplying the cooling material to the holder portion. The flow of the cooling material through the cooling channel can further include flowing the cooling material through a third channel disposed inside the holder frame such that the cooling material is supplied from the supply portion to the first channel. The flow of the cooling material through the cooling channel can further include flowing the cooling material through a fourth channel disposed inside the holder frame such that the cooling material is returned from the first channel to the supply portion.

[0016] The mask assembly can include a first mask portion, a second mask portion extending in a first direction from the first mask portion toward the display substrate, and a mask opening passing through the first mask portion and the second mask portion in the first direction. A width of the second mask portion can be less than a width of the first mask portion. The holder portion can be in contact with the first mask portion at the second position. The holder portion can be separated from the first mask portion at the first position.

[0017] A thickness of the second mask portion can be greater than a thickness of the holder portion.

[0018] These and / or other aspects will become apparent and more readily appreciated from the following detailed description, should be taken, in conjunction with the accompanying drawings and claims. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a cross-sectional view of a device for manufacturing a display device according to an embodiment.

[0021] Figure 2 is a schematic plan view of a holder portion according to an embodiment.

[0022] Figure 3 is a schematic cross-sectional view of a holder portion according to an embodiment.

[0023] Figure 4 is a schematic plan view of a mask assembly according to an embodiment.

[0024] Figure 5 is a schematic cross-sectional view of a mask assembly according to an embodiment.

[0025] Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10is a schematic cross-sectional view of a device during manufacturing of a display device according to an embodiment.

[0026] Figure 11 is a schematic plan view of a display device according to an embodiment.

[0027] Figure 12 is a schematic cross-sectional view of a display device according to an embodiment. DETAILED DESCRIPTION

[0028] Some embodiments are described below, with examples illustrated in the accompanying drawings. In this regard, the disclosed embodiments can have different forms and should not be construed as limited to the specific examples set forth herein. Accordingly, the example embodiments described below and illustrated in the drawings are presented by way of example only and are not intended to limit the scope of the present disclosure.

[0029] Since the present disclosure allows various changes and numerous embodiments, certain embodiments will be illustrated in the accompanying drawings and described in the written description below. The effects and features of the present disclosure will be clarified by referring to the embodiments described in detail below with reference to the accompanying drawings. However, the present disclosure is not limited to the following embodiments and can be implemented in various forms.

[0030] Hereinafter, embodiments will be described with reference to the accompanying drawings, in which like reference numerals refer to like elements throughout and repetitive description thereof will be omitted.

[0031] Although terms such as "first" and "second" can be used to describe various elements, the elements are not necessarily limited to the above terms. The above terms are used to distinguish one element from another element.

[0032] Unless the context clearly indicates otherwise, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well.

[0033] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout the present disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0034] It will be understood that the terms "includes" and / or "comprising," as used herein, specify the presence of stated features or elements, but do not preclude the addition of one or more other features or elements.

[0035] It will be further understood that when a layer, region, or element is referred to as being "on" another layer, region, or element, it can be directly or indirectly on the other layer, region, or element. That is, for example, a layer, region, or element can exist between the two layers, regions, or elements.

[0036] The sizes of the elements in the drawings can be exaggerated or reduced for the sake of convenience or illustration. As an example, the sizes of the elements in the drawings can be arbitrarily indicated for the sake of convenience, and thus the present disclosure is not necessarily limited thereto.

[0037] The x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can define different directions that are not perpendicular to each other.

[0038] The disclosed processes can generally be performed in a different order from that described. As an example, two processes described in succession can be performed substantially in parallel at the same time, or can be performed in reverse order.

[0039] Figure 1 A cross-sectional view of an apparatus 1 for manufacturing a display device according to an embodiment. The apparatus 1 can include a chamber 10, a holder part 20, a support 30, a mask assembly 40, a deposition source 50, a magnetic part 60, a visual part 70, a pressure regulator 80, and a supply part 90.

[0040] The chamber 10 can include a space. The display substrate DS and the mask assembly 40 can be in the space inside the chamber 10. In this case, a portion of the chamber 10 can be open. A gate valve 11 can be installed in the open portion of the chamber 10. In this case, the open portion of the chamber 10 can be opened or closed according to the operation of the gate valve 11.

[0041] The display substrate DS can include at least one of an organic layer, an inorganic layer, and a metal layer on a substrate 100 (see Figure 12 ) described below, and the display substrate DS can be processed to manufacture a display device. Alternatively, the display substrate DS can include the substrate 100 (see Figure 12 ) on which any one of the organic layer, the inorganic layer, and the metal layer has not yet been deposited.

[0042] The holder part 20 is disposed inside the chamber 10, and can support the display substrate DS. The holder part 20 is on the mask assembly 40. The holder part 20 can have a plate shape and can be fixed inside the chamber 10. In another embodiment, the holder part 20 can have a shuttle form on which the display substrate DS is located and can move linearly inside the chamber 10. In another embodiment, the holder part 20 can include an electrostatic chuck or a viscous chuck disposed in the chamber 10, and the chuck can be fixed or moved inside the chamber 10.

[0043] The support 30 can support the mask assembly 40. In this case, the support 30 can be inside the chamber 10. The support 30 can allow fine adjustment of the position of the mask assembly 40. In this case, the support 30 can include a driver, an alignment unit, etc., which can individually move the mask assembly 40 in different directions.

[0044] In another embodiment, the support 30 can have a shuttle form. In this case, the mask assembly 40 can be located on the support 30. The support 30 can be configured to transport the mask assembly 40. As an example, the support 30 can move to the outside of the chamber 10, where the mask assembly 40 is placed to be seated on the support 30, and then the support 30 can enter the chamber 10 from the outside of the chamber 10, thereby moving the mask assembly 40 into the chamber 10.

[0045] The mask assembly 40 can be disposed to face the display substrate DS inside the chamber 10. The deposition material M can pass through the mask openings OP40 of the mask assembly 40 and be deposited on the display substrate DS.

[0046] The deposition source 50 can face the mask assembly 40 and can supply the deposition material M in a form or state such that the deposition material M can pass through the mask assembly 40 and be deposited on the display substrate DS. In one example, the deposition source 50 can evaporate or sublimate the deposition material M by applying heat to the deposition material M. The deposition source 50 can be fixed inside the chamber 10, or the deposition source 50 can be linearly moved in at least one direction inside the chamber 10.

[0047] The magnetic force part 60 can be disposed inside the chamber 10 to face the display substrate DS and / or the mask assembly 40. In this case, the magnetic force part 60 can apply a magnetic force to the mask assembly 40 and press the mask assembly 40 toward or onto the surface of the display substrate DS.

[0048] The vision part 70 can be disposed in the chamber 10 to observe or capture the positions of the display substrate DS and the mask assembly 40. In this case, the vision part 70 can include a camera configured to capture images of the display substrate DS and the mask assembly 40. The positions or orientations of the display substrate DS and the mask assembly 40 can be determined based on the images captured by the vision part 70, and a transformation or deformation of the mask assembly 40 can be identified. In addition, the holder part 20 can be configured to finely adjust the position of the display substrate DS, or the support 30 can be configured to finely adjust the position of the mask assembly 40 based on the captured images. Details of a case in which the support 30 is configured to finely adjust the position of the mask assembly 40 and align the positions of the display substrate DS and the mask assembly 40 are mainly described below.

[0049] The pressure regulator 80 can be connected to the chamber 10 and configured to regulate the internal pressure of the chamber 10. As an example, the pressure regulator 80 can regulate or maintain the internal pressure of the chamber 10 to be equal to or similar to atmospheric pressure. As another example, the pressure regulator 80 can regulate or maintain the internal pressure of the chamber 10 to be equal to or similar to a vacuum state.

[0050] The pressure regulator 80 can include a connection pipe 81 and a pump 82. The connection pipe 81 can be connected to the chamber 10, and the pump 82 can be installed on the connection pipe 81. In this case, the pump 82 can be operated to introduce external air into the chamber 10 through the connection pipe 81, or to guide the gas inside the chamber 10 to the outside of the chamber 10 through the connection pipe 81.

[0051] The supply part 90 can supply the cooler to the holder part 20. The supply part 90 can include a storage 91, a supply passage 92, and a return passage 93. As an example, the cooler can be a coolant including cooling water or the like.

[0052] The storage 91 can store the cooler. The cooler can be received and stored inside the storage 91. Although Figure 1 Although an embodiment in which the storage 91 is outside the chamber 10 is illustrated, this is only an example, and the storage 91 can be inside the chamber 10. For ease of description, the case in which the storage 91 is outside the chamber 10 is mainly described below.

[0053] The supply passage 92 can connect the storage 91 to the holder part 20. One end of the supply passage 92 can be connected to the storage 91 outside the chamber 10, and the other end of the supply passage 92 can be connected to the holder part 20 inside the chamber 10. That is, the supply passage 92 can pass through the chamber 10. The supply passage 92 can provide a flow path through which the cooler stored in the storage 91 is supplied to the holder part 20.

[0054] The return passage 93 can connect the storage 91 to the holder part 20. One end of the return passage 93 can be connected to the storage 91 outside the chamber 10, and the other end of the return passage 93 can be connected to the holder part 20 inside the chamber 10. That is, the return passage 93 can pass through the chamber 10. The return passage 93 can provide a flow path through which the cooler flowing in the holder part 20 is returned to the storage 91.

[0055] The cooler can be circulated while sequentially flowing through the storage 91, the supply passage 92, the holder part 20, and the return passage 93. As an example, the storage 91 can have a separate pump to circulate the cooler.

[0056] Figure 2 is a schematic plan view of the holder part 20 according to an embodiment, and Figure 3is a schematic cross-sectional view of a holder portion 20 according to an embodiment. Specifically, Figure 3 is a cross-sectional view of the holder portion 20 taken along Figure 2 line III-III' of FIG. 3.

[0057] Referring to Figure 2 and Figure 3 , the holder portion 20 can include a holder frame 21, a contact portion 22, and a cooling passage 23.

[0058] The holder frame 21 can be formed by connecting a plurality of side portions, and can include a holder opening OP21 defined by the plurality of side portions. That is, the holder opening OP21 can be formed by being surrounded by the plurality of side structures, and formed to pass through the center of the holder frame 21 in a first direction (for example, +z-axis and / or -z-axis direction). In an embodiment, the holder frame 21 can be around the holder opening OP21.

[0059] In an embodiment, the holder frame 21 can be a quadrangular frame. However, the shape of the holder frame 21 is not limited thereto and can be other various polygonal shapes. For ease of description, the case where the holder frame 21 is a quadrangular frame will be mainly described below.

[0060] In the case where the holder frame 21 is a quadrangular frame, the plurality of side structures can include a first side structure extending in a second direction (for example, +x-axis and / or -x-axis direction) and a second side structure extending in a third direction (for example, +y-axis and / or -y-axis direction). In this case, the first direction (for example, +z-axis and / or -z-axis direction), the second direction (for example, +x-axis and / or -x-axis direction), and the third direction (for example, +y-axis and / or -y-axis direction) can be at an angle to each other, for example, perpendicular to each other. The first side structure can include a pair of linear side pieces parallel to and facing each other, and the second side structure can include a pair of linear side pieces parallel to and facing each other. The first side structure can be connected to the second side structure. In an embodiment, the first side structure can extend along a long side of the holder frame 21, and the second side structure can extend along a short side of the holder frame 21. However, embodiments according to the present disclosure are not limited thereto, and the first side structure can extend along a short side of the holder frame 21, and the second side structure can extend along a long side of the holder frame 21, or the lengths of the first side structure and the second side structure can be the same. For ease of description, the case where the first side structure is longer than the second side structure will be mainly described below.

[0061] The contact portion 22 can extend from the holder frame 21 into the holder opening OP21. The contact portion 22 can be integrally formed with the holder frame 21. The contact portion 22 can include a plurality of separate contact portions 22, and the plurality of contact portions 22 can be arranged along a periphery of the holder opening OP21. As an example, the plurality of contact portions 22 can be spaced apart at equal intervals along the periphery of the holder opening OP21. Each contact portion 22 can protrude in a length direction from the holder frame 21. As an example, each contact portion 22 can have a cylindrical shape or a hexahedral shape, the length direction of which enters the holder opening OP21. However, this is an example, and the shape of the contact portion 22 is not limited thereto.

[0062] The cooling passage 23 can be provided inside at least one of the holder frame 21 and the contact portion 22, and a cooling material can flow therethrough. The cooling passage 23 can be an empty passage through which the cooling material can flow. The cooling passage 23 can include a first passage 231, a second passage 232, a third passage 233, and a fourth passage 234.

[0063] The first passage 231 can be provided inside the holder frame 21 to surround the holder opening OP21. The first passage 231 can be provided in a closed loop shape or a closed circular shape. Although Figure 2 An example in which the first passage 231 has a quadrangular shape is illustrated, but this is only an example, and the shape of the first passage 231 is not limited thereto. As an example, the first passage 231 can have a closed curved shape or have a meandering shape.

[0064] The second passage 232 can extend from the first passage 231, and have at least a portion provided inside the contact portion 22. The number of separate second passages 232 can correspond to the number of separate contact portions 22. That is, in the case where a plurality of separate contact portions 22 are included, the second passage 232 can include a plurality of separate second contact passages 232. The second passage 232 and the first passage 231 can be connected to each other to form a closed loop shape or a closed circular shape. Although Figure 2 An example in which each second passage 232 has a quadrangular shape is illustrated, but this is only an example, and the shape of the second passage 232 is not limited thereto. As an example, each second passage 232 can have a closed curved shape or a meandering shape.

[0065] The third passage 233 can be provided inside the holder frame 21 so that a cooling material is supplied from the supply part 90 (see Figure 1 ) to the first passage 231. The third passage 233 can be connected to the first passage 231, and can allow the first passage 231 to communicate with the outside of the holder frame 21.

[0066] The fourth passage 234 can be provided inside the holder frame 21 so that the cooling material is returned from the first passage 231 to the supply part 90 (see Figure 1 ). The fourth passage 234 can be connected to the first passage 231, and can allow the first passage 231 to communicate with the outside of the holder frame 21.

[0067] In the illustrated embodiment, the cooling material can be introduced into the holder frame 21 through the third passage 233, can then flow through the holder frame 21 through the first passage 231, and can then be discharged to the outside of the holder frame 21 through the fourth passage 234. The cooling material can also flow through the inside of the contact part 22 through the second passage 232 connected to the first passage 231.

[0068] Figure 4 is a schematic plan view of a mask assembly 40 according to an embodiment, and Figure 5 is a schematic cross-sectional view of the mask assembly 40 according to an embodiment. Specifically, Figure 5 is a cross-sectional view of the mask assembly 40 taken along a line V-V’ of Figure 4 .

[0069] Referring to Figure 4 and Figure 5 , the mask assembly 40 can include a first mask part 41 and a second mask part 42.

[0070] The mask assembly 40 can be formed by connecting a plurality of side structures, and can include a mask opening OP40 defined by the plurality of side structures. That is, the mask opening OP40 can be surrounded by the plurality of side structures, and can pass through the center of the mask assembly 40. The mask opening OP40 can particularly pass through the first mask part 41 and the second mask part 42 in a first direction (for example, +z-axis and / or -z-axis direction).

[0071] In an embodiment, the mask assembly 40 can be a quadrangular frame. However, the shape of the mask assembly 40 is not limited thereto, and the mask assembly 40 can have other various polygonal shapes. For ease of description, the case where the mask assembly 40 is a quadrangular frame will be mainly described below.

[0072] In the case where the mask assembly 40 is a quadrangular frame, the plurality of side structures can include first side structures extending in a second direction (e.g., +x-axis and / or -x-axis direction) and second side structures extending in a third direction (e.g., +y-axis and / or -y-axis direction). The first side structures can include a pair of straight line segments parallel to and facing each other, and the second side structures can include a pair of straight line segments parallel to and facing each other. The first side structures can be connected to the second side structures. In an embodiment, the first side structures can extend along the short sides of the mask assembly 40, and the second side structures can extend along the long sides of the mask assembly 40. However, embodiments of the disclosure are not limited thereto, and the first side structures can extend along the long sides of the mask assembly 40, and the second side structures can extend along the short sides of the mask assembly 40, or the lengths of the first side structures and the second side structures can be the same. For ease of description, the case where the first side structures are shorter than the second side structures is mainly described below.

[0073] The first mask portion 41 and the second mask portion 42 can be integrally formed. The second mask portion 42 can extend from the first mask portion 41 toward the display substrate DS (see Figure 1 ) in a first direction (e.g., +z-axis direction). That is, the second mask portion 42 can protrude from the first mask portion 41. A width W2 of the second mask portion 42 can be smaller than a width W1 of the first mask portion 41. In this structure, a portion of the first mask portion 41 can not overlap the second mask portion 42. The first space ERA1 can be on the portion of the first mask portion 41 that does not overlap the second mask portion 42. In this case, a thickness of the first space ERA1 can be equal to a thickness D2 of the second mask portion 42.

[0074] Figures 6 to 10 is a schematic cross-sectional view of the apparatus 1 during manufacturing of a display apparatus according to an embodiment. Referring to Figures 6 to 10 , a method of using the apparatus 1 during manufacturing of a display apparatus can be disclosed. In Figures 6 to 10 , the same reference numerals as those of Figures 1 to 5 denote the same components, and redundant descriptions thereof can not be repeated below.

[0075] Referring to Figure 6 , the method of manufacturing a display apparatus can include: the supply portion 90 supplying a cooling material to the holder portion 20; the cooling material flowing through the cooling passage 23 (see Figure 2 ) provided inside the holder portion 20; and the display substrate DS being introduced into the chamber 10.

[0076] The cooling material flowing through the cooling passage 23 (see Figure 2 ) can include: the cooling material flowing through the third passage 233 (see Figure 2 ) such that the cooling material is supplied from the supply portion 90 to the first passage 231 (seeFigure 2 ); flowing the cooling material through the first passage 231 (see Figure 2 ), so that the cooling material surrounds the retainer opening OP21 (see Figure 2 ); flowing the cooling material through the second passage 232 (see Figure 2 ); and flowing the cooling material through the fourth passage 234 (see Figure 2 ) so that the cooling material returns to the supply portion 90 from the fourth passage 234 (see Figure 2 ).

[0077] The pressure regulator 80 can maintain the inside of the chamber 10 at a desired pressure, for example, a state equal to or similar to atmospheric pressure. The gate valve 11 can be operable to open the open portion of the chamber 10.

[0078] The display substrate DS can be loaded to the inside of the chamber 10 from the outside of the chamber 10 through the open portion of the chamber 10. The display substrate DS can be loaded into the chamber 10 in various ways. As an example, the display substrate DS can be loaded to the inside of the chamber 10 from the outside of the chamber 10 by a mechanical arm or the like disposed outside the chamber 10. In another embodiment, in the case where the retainer portion 20 has a shuttle form, the retainer portion 20 can be transported from the inside of the chamber 10 to the outside of the chamber 10, then the display substrate DS can be placed on the retainer portion 20 by a separate mechanical arm disposed outside the chamber 10, and the retainer portion 20 can be transported (and thereby loaded) to the inside of the chamber 10 from the outside of the chamber 10.

[0079] When inside the chamber 10, the display substrate DS can be placed on the retainer portion 20. The display substrate DS can be disposed on the contact portion 22 (see Figure 2 ) of the retainer portion 20. The contact portion 22 (see Figure 2 ) can be in contact with the display substrate DS. The display substrate DS can overlap the retainer opening OP21 (see Figure 2 ). At least a portion of the display substrate DS can be accommodated in the retainer opening OP21 (see Figure 2 ).

[0080] As described above, the mask assembly 40 can be inside the chamber 10. In another embodiment, in the same or similar manner as the loading of the display substrate DS, the mask assembly 40 can be loaded to the inside of the chamber 10 from the outside of the chamber 10.

[0081] Referring to Figure 6 and Figure 7 , the method of manufacturing a display device can include moving the retainer portion 20 between the first position POS1 and the second position POS2. As shown in Figure 6 , the position of the retainer portion 20 supporting the display substrate DS is indicated by the first position POS1, and as shown in Figure 7As shown in FIG. 1, the position at which the holder portion 20 contacts the mask assembly 40 is indicated by a second position POS2. That is, the holder portion 20 is movable between the first position POS1 and the second position POS2. In an embodiment, a contact portion 22 (see Figure 2 ) of the holder portion 20 can be positioned to contact the display substrate DS at the first position POS1.

[0082] At the first position POS1, the holder portion 20 can be separated from the mask assembly 40.

[0083] At the second position POS2, the holder portion 20 can contact a first mask portion 41 (see Figure 5 ). At the first position POS1, the holder portion 20 can be separated from the first mask portion 41 (see Figure 5 ). At the second position POS2, at least a portion of the holder portion 20 can be accommodated in a first space ERA1 (see Figure 5 ). In this case, a thickness D2 (see Figure 5 ) of the second mask portion 42 can be greater than a thickness D1 (see Figure 3 ) of the holder portion 20. That is, a thickness of the first space ERA1 can be greater than the thickness D1 (see Figure 3 ) of the holder portion 20. Accordingly, at the second position POS2, an upper surface of the holder portion 20 can not protrude from an upper surface of the mask assembly 40. In this configuration, at the second position POS2, since the holder portion 20 is separated from the display substrate DS, the display substrate DS can be in close proximity to or in contact with the mask assembly 40.

[0084] Referring to Figure 7 , as the holder portion 20 moves to the second position POS2, the magnetic force portion 60 can move toward the mask assembly 40. Accordingly, the mask assembly 40 can contact the display substrate DS, and the display substrate DS can contact the magnetic force portion 60.

[0085] In this case, the vision portion 70 can be configured to capture an image of or otherwise identify the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on the image captured by the vision portion 70. In this case, the apparatus 1 for manufacturing a display device can include a separate controller (not shown) to determine the positions of the display substrate DS and the mask assembly 40. When the positions of the display substrate DS and the mask assembly 40 have been determined, the support 30 can finely adjust the position of the mask assembly 40 with respect to the display substrate DS.

[0086] Referring to Figure 7, the method of manufacturing a display device can include: the deposition source 50 supplies the deposition material M. The deposition source 50 operates to supply the deposition material M toward the mask assembly 40, and the deposition material M passing through the mask opening OP40 can pass through the mask assembly 40 and be deposited on the display substrate DS. In this case, the pump 82 can maintain a desired pressure in the chamber 10, for example, in a state equal to or similar to a vacuum, by sucking gas from the inside of the chamber 10 and discharging the gas to the outside.

[0087] As described above, the deposition material M supplied from the deposition source 50 can pass through the mask assembly 40, be deposited on the display substrate DS, and thus form at least one of a plurality of layers of an organic layer, an inorganic layer, and a metal layer, which can be stacked in the display device 2 (see Figure 12 ) that can be described below, for example.

[0088] Referring to Figure 8 , the method of manufacturing a display device can include: transporting the display substrate DS on which deposition is completed to the outside. The magnetic force portion 60 can initially hold the display substrate DS on which deposition is completed. The display substrate DS can be transported out of the chamber 10 in various ways. As an example, the display substrate DS can be transported from the inside of the chamber 10 to the outside of the chamber 10 by a robot arm or the like disposed outside the chamber 10. During the process of transporting the display substrate DS to the outside, the holder portion 20 can be positioned at the first position POS1.

[0089] Referring to Figure 9 , the method of manufacturing a display device can include: allowing the holder portion 20 to be in contact with the mask assembly 40 before the display substrate DS is transported into the chamber 10 or when the display substrate DS is otherwise not inside the chamber 10.

[0090] Referring to Figure 10 , the method of manufacturing a display device can include: transporting a new display substrate DS into the chamber 10. Since the above process is described with reference to Figure 6 , a detailed description is omitted here.

[0091] Referring to Figures 1 to 10 , since the holder portion 20 including the cooling passage 23 can be in contact with the mask assembly 40 at any time, the mask assembly 40 can be effectively cooled. Accordingly, a phenomenon in which heat emitted from the deposition source 50 transforms or deforms the mask assembly 40 can be reduced. Accordingly, the durability and quality of the display device 2 (see Figure 11 ) manufactured using the apparatus 1 can be improved.

[0092] Figure 11 is a schematic plan view of a display device 2 according to an embodiment. Referring to Figure 11The display device 2 manufactured according to an embodiment can include a display area DA and a peripheral area PA outside the display area DA. The display device 2 can be configured to display an image through an array of a plurality of pixels PX two-dimensionally arranged in the display area DA.

[0093] The peripheral area PA is an area in which an image is not displayed, and can completely or partially surround the display area DA. A driver or the like configured to supply an electrical signal or power to a pixel circuit corresponding to the pixel PX, respectively, can be arranged in the peripheral area PA. A pad, which is an area to which an electronic element or a printed circuit board can be electrically connected to the display device 2, can be arranged in the peripheral area PA.

[0094] Hereinafter, an embodiment of the display device 2 including an organic light emitting diode (OLED) as a light emitting diode is mainly described, but the display device 2 according to an embodiment of the disclosure is not limited thereto. In another embodiment, the display device 2 can be a light emitting display device including an inorganic light emitting diode, i.e., an inorganic light emitting display device. The inorganic light emitting diode can include a PN junction diode including an inorganic semiconductor-based material. When a forward voltage is applied to the PN junction diode, holes and electrons are injected into an emission layer, and energy generated by recombination of the holes and the electrons is converted into light energy, and light of a preset color characteristic of the emission layer can be emitted. The inorganic light emitting diode can have a width in the range of several micrometers to several hundred micrometers. In an embodiment, the inorganic light emitting diode can be represented by a micro light emitting diode. In another embodiment, the display device 2 can be a quantum dot light emitting display device.

[0095] The display device 2 can be used as a display screen in various products including a television, a notebook computer, a monitor, a billboard, an Internet of Things (IoT) device, and a portable electronic device including a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic organizer, an electronic book, a portable multimedia player (PMP), a navigator, and an ultra-mobile personal computer (UMPC). In addition, the display device 2 according to an embodiment can be used in a wearable device including a smart watch, a watch phone, a glasses-type display, and a head-mounted display (HMD). In addition, in an embodiment, the display device 2 can be used as a display screen in an instrument panel of a car, a center instrument panel of a car, or a center information display (CID) arranged on an instrument panel, a rearview mirror display that can replace a side mirror of a car, and a display of an entertainment system for rear seat passengers arranged at the back of front seats in a car.

[0096] Figure 12 is a schematic cross-sectional view of the display device 2 according to an embodiment taken along a line XII-XII' of Figure 11 Figure 12 ​The display device 2 can include a stacked structure including the substrate 100, the pixel circuit layer PCL, the display element layer DEL, and the encapsulation layer 300. The display substrate DS (see Figure 1 ) can be a structure in which at least one of, for example, the pixel circuit layer PCL, the display element layer DEL, and the encapsulation layer 300 is stacked on the substrate 100 during a process in which the device 1 is used in manufacturing the display device 2.

[0097] The substrate 100 can have a multilayer structure including a base layer including a polymer resin and an inorganic layer. As an example, the substrate 100 can include a base layer including a polymer resin and an isolation layer including an inorganic insulating layer. As an example, the substrate 100 can include a first base layer 101, a first isolation layer 102, a second base layer 103, and a second isolation layer 104 stacked in this order. The first base layer 101 and the second base layer 103 can each include polyimide (PI), polyether sulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first isolation layer 102 and the second isolation layer 104 can each include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 can be flexible.

[0098] The pixel circuit layer PCL is provided on the substrate 100. Figure 12 An example in which the pixel circuit layer PCL includes a thin film transistor TFT and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116 under and / or over an element of the thin film transistor TFT is shown.

[0099] The buffer layer 111 can be configured to reduce or block penetration of foreign substances, moisture, or external air from below the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 111 can include an inorganic insulating material such as silicon nitride, silicon oxynitride, and silicon oxide, and include a single-layer structure or a multilayer structure including the above materials.

[0100] The thin film transistor TFT on the buffer layer 111 can include a semiconductor layer Act, and the semiconductor layer Act can include polysilicon. Alternatively, the semiconductor layer Act can include amorphous silicon, oxide semiconductor, or organic semiconductor. The semiconductor layer Act can include a channel region C, a drain region D, and a source region S arranged on two opposite sides of the channel region C, respectively. A gate electrode GE can overlap the channel region C.

[0101] The gate electrode GE can include a low-resistance metal material. The gate electrode GE can include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and have a single layer structure or a multi-layer structure including the above materials.

[0102] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE can include an inorganic insulating material including silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ). The zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or peroxide zinc (ZnO2).

[0103] The second gate insulating layer 113 can cover the gate electrode GE. Like the first gate insulating layer 112, the second gate insulating layer 113 can include an inorganic insulating material including silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ). The zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or peroxide zinc (ZnO2).

[0104] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the second gate insulating layer 113. The upper electrode Cst2 can overlap the gate electrode GE thereunder. In this case, the gate electrode GE and the upper electrode Cst2, which overlap each other and the second gate insulating layer 113 therebetween, can constitute the storage capacitor Cst. That is, the gate electrode GE can serve as a lower electrode Cst1 of the storage capacitor Cst.

[0105] In the illustrated embodiment, the storage capacitor Cst can overlap the thin film transistor TFT. In an embodiment, the storage capacitor Cst can be formed not to overlap the thin film transistor TFT.

[0106] The upper electrode Cst2 can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and include a single layer or a plurality of layers including the above materials.

[0107] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may contain silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiO) x N y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO) x Zinc oxide (ZnO) x The inorganic insulating layer 114 may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulation layer 114 may include a single layer or multiple layers comprising the above-mentioned inorganic insulating materials.

[0108] Drain electrode DE and source electrode SE may each be disposed on the interlayer insulating layer 114. Drain electrode DE and source electrode SE may be connected to drain region D and source region S respectively via contact holes passing through the insulating layer beneath them. Drain electrode DE and source electrode SE may each comprise a highly conductive material. Drain electrode DE and source electrode SE may each comprise a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and comprise a single layer or multiple layers comprising the above materials. In one embodiment, drain electrode DE and source electrode SE may each have a Ti / Al / Ti multilayer structure.

[0109] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may contain an organic insulating material, which may include general polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof.

[0110] A second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may contain the same material as the first planarization insulating layer 115, and may contain an organic insulating material, including general polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof.

[0111] The display element layer DEL can be disposed on the pixel circuit layer PCL having the above-described structure. The display element layer DEL can include an organic light emitting diode OLED as a display element (i.e., a light emitting element). The organic light emitting diode OLED can have a stack structure including a pixel electrode 210, an intermediate layer 220, and a common electrode 230. The organic light emitting diode OLED can be configured to emit, for example, red light, green light, or blue light, or to emit red light, green light, blue light, or white light. The organic light emitting diode OLED can be configured to emit light through an emission area. The emission area can define a pixel PX.

[0112] The pixel electrode 210 of the organic light emitting diode OLED can be electrically connected to the thin film transistor TFT. In particular, in the illustrated embodiment, the pixel electrode 210 can extend through a contact hole formed in the second planarization insulating layer 116 to a contact metal CM disposed on the first planarization insulating layer 115 and electrically connected to the source electrode SE through a contact hole formed in the first planarization insulating layer 115.

[0113] The pixel electrode 210 can include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 210 can include a reflective layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof. In another embodiment, the pixel electrode 210 can further include a layer on and / or under the reflective layer including ITO, IZO, ZnO, or In2O3.

[0114] The pixel defining layer 117 can be disposed on the pixel electrode 210 and can include an opening 117OP exposing a central portion of the pixel electrode 210. The pixel defining layer 117 can include an organic insulating material and / or an inorganic insulating material. The opening 117OP can define an emission area of light emitted from the organic light emitting diode OLED. As an example, a size (e.g., width) of the opening 117OP can correspond to a size (e.g., width) of the emission area. Accordingly, a size (e.g., width) of the pixel PX can depend on a size (e.g., width) of the opening 117OP of the pixel defining layer 117.

[0115] The intermediate layer 220 can include an emission layer 222 formed to correspond to the pixel electrode 210. The emission layer 222 can include a polymer organic material or a low molecular weight organic material that emits light having a preset color. Alternatively, the emission layer 222 can include an inorganic emission material or a quantum dot.

[0116] In an embodiment, the intermediate layer 220 can include a first functional layer 221 and a second functional layer 223 disposed under and on the emission layer 222, respectively. The first functional layer 221 can include, for example, a hole transport layer (HTL), or include an HTL and a hole injection layer (HIL). The second functional layer 223 is an element disposed on the emission layer 222, and can include an electron transport layer (ETL) and / or an electron injection layer (EIL). Like the common electrode 230 described below, the first functional layer 221 and / or the second functional layer 223 can be a common layer that completely covers the substrate 100.

[0117] The common electrode 230 can be disposed on the pixel electrode 210, and can overlap the pixel electrode 210. The common electrode 230 can include a conductive material having a low work function. As an example, the common electrode 230 can include a transparent layer or a semi-transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or an alloy thereof. Alternatively, the common electrode 230 can further include a layer on the transparent layer or the semi-transparent layer including ITO, IZO, ZnO, or In2O3. The common electrode 230 can be integrally formed to completely cover the substrate 100.

[0118] The encapsulation layer 300 can be disposed on and can cover the display element layer DEL. The encapsulation layer 300 can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 12 An embodiment is shown in which the encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 stacked in order.

[0119] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can include at least one inorganic material of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 can include a polymer-based material. The polymer-based material can include an acrylic resin, an epoxy resin, a polyimide, and a polyethylene. In an embodiment, the organic encapsulation layer 320 can include an acrylate. The organic encapsulation layer 320 can be formed by hardening a monomer or coating a polymer. The organic encapsulation layer 320 can be transparent.

[0120] Although not shown, a touch sensor layer can be disposed on the encapsulation layer 300. An optical functional layer can be disposed on the touch sensor layer. The touch sensor layer can obtain coordinate information corresponding to an external input (e.g., a touch event). The optical functional layer can be configured to reduce reflectance of light (e.g., external light) incident from the outside toward the display device and / or improve color purity of light emitted from the display device. In an embodiment, the optical functional layer can include a phase retarder and / or a polarizer. The phase retarder can include a film type phase retarder or a liquid crystal type phase retarder. The phase retarder can include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer can include a film type polarizer or a liquid crystal type polarizer. The film type polarizer can include a stretchable synthetic resin film, and the liquid crystal type polarizer can include liquid crystals arranged in a predetermined arrangement. Each of the phase retarder and the polarizer can further include a protective film.

[0121] An adhesive member can be disposed between the touch sensor layer and the optical functional layer. For the adhesive member, a general adhesive member known in the art can be used without limitation. The adhesive member can be a pressure sensitive adhesive (PSA).

[0122] According to embodiments, durability of the display device can be improved, and quality of the display device can be improved.

[0123] Effects provided according to embodiments of the disclosure are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those of ordinary skill in the art from the claims.

[0124] The embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: a chamber; a mask assembly disposed inside the chamber to face a display substrate; a holder portion disposed inside the chamber, the holder portion comprising a cooling channel through which a cooling material flows; and a deposition source disposed inside the chamber and configured to supply a deposition material such that the deposition material passes through the mask assembly and is deposited on the display substrate, wherein at least one of the holder portion and the mask assembly is movable between a first position in which the holder portion supports the display substrate and a second position in which the holder portion is in contact with the mask assembly.

2. The apparatus of claim 1, wherein the holder portion comprises: a holder frame around a holder opening; and a contact portion extending from the holder frame toward the holder opening, the contact portion positioned to be in contact with the display substrate at the first position.

3. The apparatus of claim 2, wherein the cooling channel comprises a first channel disposed inside the holder frame to surround the holder opening.

4. The apparatus of claim 3, wherein the cooling channel further comprises a second channel extending from the first channel and having at least a portion disposed inside the contact portion.

5. The apparatus of claim 3 or 4, further comprising a supply portion configured to supply the cooling material to the holder portion, wherein the cooling channel further comprises a third channel disposed inside the holder frame to supply the cooling material from the supply portion to the first channel.

6. The apparatus of claim 5, wherein the cooling channel further comprises a fourth channel disposed inside the holder frame such that the cooling material returns from the first channel to the supply portion.

7. The apparatus of claim 1, wherein the mask assembly comprises: a first mask portion; a second mask portion extending from the first mask portion toward the display substrate in a first direction; and a mask opening passing through the first mask portion and the second mask portion in the first direction, wherein a width of the second mask portion is less than a width of the first mask portion.

8. The apparatus of claim 7, wherein the holder portion is in contact with the first mask portion at the second position.

9. The apparatus of claim 7, wherein the holder portion is separated from the first mask portion at the first position.

10. The apparatus of claim 7, wherein a thickness of the second mask portion is greater than a thickness of the holder portion.

11. A method of manufacturing a display device, the method comprising: flowing a cooling material through a cooling channel disposed inside a holder portion; introducing a display substrate into a chamber; moving the holder portion between a first position in which the holder portion supports the display substrate and a second position in which the holder portion is in contact with a mask assembly; and supplying a deposition material by a deposition source. ​ ​ ​ 12. The method of claim 11, wherein the retainer portion comprises: a retainer frame around a retainer opening; and a contact portion extending from the retainer frame toward the retainer opening to contact the display substrate.

13. The method of claim 12, wherein the flow of the cooling material through the cooling channel comprises: flowing the cooling material through a first channel disposed inside the retainer frame such that the cooling material surrounds the retainer opening.

14. The method of claim 13, wherein the flow of the cooling material through the cooling channel further comprises: flowing the cooling material through a second channel extending from the first channel and having at least a portion disposed inside the contact portion.

15. The method of claim 13 or 14, further comprising: supplying the cooling material to the retainer portion through a supply portion, wherein the flowing of the cooling material through the cooling channel further comprises flowing the cooling material through a third channel disposed inside the retainer frame such that the cooling material is supplied from the supply portion to the first channel.

16. The method of claim 15, wherein the flow of the cooling material through the cooling channel further comprises: flowing the cooling material through a fourth channel disposed inside the retainer frame such that the cooling material returns from the first channel to the supply portion.

17. The method of claim 11, wherein the mask assembly comprises: a first mask portion; a second mask portion extending from the first mask portion toward the display substrate in a first direction; and a mask opening through the first mask portion and the second mask portion in the first direction, wherein a width of the second mask portion is less than a width of the first mask portion.

18. The method of claim 17, wherein the retainer portion is in contact with the first mask portion at the second position.

19. The method of claim 17, wherein the retainer portion is separated from the first mask portion at the first position.

20. The method of claim 17, wherein a thickness of the second mask portion is greater than a thickness of the retainer portion. ​

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